Wire damper manufacturing method capable of controlling deformation degree and hot press molding device

Abstract

The invention discloses a wire damper manufacturing method capable of controlling the deformation degree and a hot press forming device. The wire damper manufacturing method capable of controlling the deformation degree comprises the steps that warp and wire combinations are arranged at intervals; interweaving the weft yarns in the warp yarns and combining the warp yarns with the wires to weave a base material; soaking the base material in the resin solution; drying the base material; the base material is placed between a pressing die of a hot press forming device and a forming die of the hot press forming device; the upper wire damper forming part and the lower wire damper forming part are jointly hot-pressed on the base material to form a wire damper; the stress balance part forming convex block and the stress balance part forming groove are jointly hot-pressed on the base material to form a stress balance part; and separating the wire damper from the base material and keeping the stress balance part on the base material. Therefore, the stress balance part can control the degree of shrinkage force borne by the wire damper forming block, and the purpose of controlling the deformation degree of the wire damper is achieved.

Description

Technical Field

[0001] This invention relates to a method for manufacturing elastic wires and a hot pressing forming apparatus, and more particularly to a method for manufacturing elastic wires and a hot pressing forming apparatus for controlling the degree of deformation. Background Technology

[0002] A typical moving-coil loudspeaker produces sound by utilizing the principle that the reaction force of a fixed magnetic field causes another magnetic field to move in the opposite direction (i.e., opposite poles attract, like poles repel). More specifically, the alternating current from the power amplifier is transmitted to the voice coil via wires to change the polarity of the magnetic field, causing the voice coil to generate a reaction force relative to the fixed magnetic field created by the magnet. A positive pulse causes the diaphragm to move outward relative to the magnet, while a negative pulse causes the diaphragm to move inward relative to the magnet. As the voice coil pushes the diaphragm in this reciprocating motion, the diaphragm pushes air, changing the air pressure and creating sound waves. A spider is used to hold the voice coil in the correct position within the gap in the magnet's core, ensuring that the voice coil reciprocates along its axis when under force. A suspension is placed between the diaphragm and the outer frame to support the diaphragm.

[0003] Existing methods for manufacturing conductive wave springs include the following steps: combining multiple warp yarns, multiple weft yarns, and multiple conductive wires to weave a substrate; immersing the substrate in a resin solution; drying the substrate; heating and pressing a conductive wave spring forming block on the substrate to form a conductive wave spring; and separating the conductive wave spring from the substrate.

[0004] However, since the shrinkage force of the conductive elastic forming block is distributed across the entire substrate when heated and pressurized, the degree of shrinkage force borne by the conductive elastic forming block cannot be controlled, resulting in the deformation degree of the conductive elastic being uncontrollable.

[0005] Furthermore, existing wire bobbin manufacturing methods are automated and continuous, and the substrate has a certain degree of elasticity. Therefore, during the heating and pressurizing process, each flat wire bobbin forming block wrinkles into a wavy shape. This wrinkling force pulls each subsequent wire bobbin forming block forward a short distance, causing the positions of subsequent unformed wire bobbin forming blocks to slightly deviate from their original preset positions. As a result, the thermoforming device forms the wire bobbin at these slightly deviated positions, rather than forming it precisely at the original positions, leading to a larger spacing between subsequently formed wire bobbins than intended. Since substrate between adjacent wire bobbins will form waste, the aforementioned problem generates more waste than originally anticipated, resulting in significant waste.

[0006] Furthermore, when the two-wire elastic forming blocks are continuously formed into two-wire elastic waves, the yarns between these elastic forming blocks will be pulled and broken by two wrinkling forces at the same time, further causing the substrate to be torn. Summary of the Invention

[0007] The main objective of this invention is to provide a method for manufacturing conductive wave springs and a hot pressing forming apparatus for controlling the degree of deformation, which can control the degree of wrinkling force borne by the conductive wave spring forming block, thereby achieving the purpose of controlling the degree of deformation of the conductive wave spring.

[0008] Another objective of this invention is to provide a method for manufacturing a conductive wave spring and a hot pressing forming apparatus for controlling the degree of deformation, which can ensure that the position of the conductive wave spring forming block remains unchanged.

[0009] Another objective of this invention is to provide a method for manufacturing a conductive wave with controlled deformation and a hot pressing forming apparatus, so that the substrate will not be torn.

[0010] To achieve the aforementioned objective, the present invention provides a method for manufacturing a conductive elastic wave that controls the degree of deformation, comprising the following steps:

[0011] (a) Multiple warp yarns and multiple conductors are arranged at intervals, the warp yarns and the conductors extending in a straight line along a first direction and parallel to each other, wherein each conductor assembly consists of multiple conductors and each conductor is a monofilament.

[0012] (b) Multiple weft yarns are interwoven along a second direction with the warp yarns and the conductors to weave a substrate, wherein the first direction is perpendicular to the second direction, and the substrate has a conductor elastic forming area and a force balancing forming area, the force balancing forming area being located around the conductor elastic forming area.

[0013] (c) Immerse the substrate in a resin solution.

[0014] (d) Dry the substrate to form a resin solid layer on the substrate.

[0015] (e) The substrate is placed between a pressing surface of a pressing mold of a thermoforming apparatus and a forming surface of a forming mold of the thermoforming apparatus; an upper wire bob forming portion of the pressing surface and a lower wire bob forming portion of the forming surface are heated and pressed together on the wire bob forming area to form a wire bob; and a force balancing portion forming protrusion located around the upper wire bob forming portion of the pressing surface and a force balancing portion forming groove located around the lower wire bob forming portion of the forming surface are heated and pressed together on the force balancing portion forming area to form a force balancing portion.

[0016] (f) The conductor spring is separated from the substrate, and the force-balanced part remains on the substrate.

[0017] In some embodiments, step (e) further includes: a block of the force-balancing part forming protrusion and a groove of the force-balancing part forming groove are heated and pressed together on the force-balancing part forming area to form an eave of the force-balancing part, wherein the block, the groove and the eave are all annular; wherein step (f) further includes: the eave is retained on the substrate.

[0018] In some embodiments, step (e) further includes: the two blocks of the force balancing portion forming protrusion and the two grooves of the force balancing portion forming groove are heated and pressed together on the force balancing portion forming block to form the two eaves of the force balancing portion, the blocks, the grooves and the eaves are all U-shaped or semi-circular, two connecting blocks are formed between the eaves, and the wire assembly extends through the connecting blocks; wherein, step (f) further includes: the eaves are retained on the substrate.

[0019] In some embodiments, step (e) further includes: the four blocks of the force balancing part forming protrusion and the four grooves of the force balancing part forming groove are heated and pressed together on the force balancing part forming block to form the four eaves of the force balancing part. The blocks, the grooves and the eaves are all L-shaped or arc-shaped. A connecting block is formed between two adjacent eaves, so that four connecting blocks are formed between the four eaves. The wire assembly extends through two of the connecting blocks. Step (f) further includes: the eaves are retained on the substrate.

[0020] To achieve the aforementioned objectives, the present invention provides a hot-press forming apparatus for controlling the degree of deformation of a conductive spring wave, comprising a pressing mold and a forming mold. The pressing mold includes a pressing surface, which includes an upper conductive spring wave forming portion and a force-balancing portion forming protrusion, the force-balancing portion forming protrusion being located around the upper conductive spring wave forming portion. The forming mold includes a forming surface, which includes a lower conductive spring wave forming portion and a force-balancing portion forming groove, the force-balancing portion forming groove being located around the lower conductive spring wave forming portion. The upper and lower conductive spring wave forming portions are heated and pressurized together on a conductive spring wave forming area of ​​a substrate to form a conductive spring wave. The force-balancing portion forming protrusion and the force-balancing portion forming groove are heated and pressurized together on a force-balancing portion forming area of ​​the substrate to form a force-balancing portion.

[0021] In some embodiments, the force balancing part forming protrusion includes a block that is annular, and the force balancing part forming groove includes a groove that is annular; wherein the block and the groove are heated and pressed together on the force balancing part forming area to form an eave of the force balancing part, and the eave is annular.

[0022] In some embodiments, the force-balancing portion forming protrusion includes two blocks, each block being U-shaped or semi-circular, and the force-balancing portion forming groove includes two grooves, each groove being U-shaped or semi-circular; wherein, the blocks and the grooves are heated and pressed together on the force-balancing portion forming area to form two eaves of the force-balancing portion, each eave being U-shaped or semi-circular, and two connecting blocks are formed between the eaves, the connecting blocks being used for multiple conductor combinations of the substrate to extend through.

[0023] In some embodiments, the force-balancing part forming protrusion includes four blocks, each block being L-shaped or arc-shaped, and the force-balancing part forming groove includes four grooves, each groove being L-shaped or arc-shaped; wherein, the blocks and the grooves are heated and pressed together on the force-balancing part forming area to form the four eaves of the force-balancing part, each eave being L-shaped or arc-shaped, and a connecting block is formed between two adjacent eaves, so that four connecting blocks are formed between the four eaves, and two of the connecting blocks are used for multiple wire combinations of the substrate to extend through.

[0024] The advantage of this invention is that the force balancing part can partially or completely disperse the wrinkling force of the wire elastic forming block when it is heated and pressurized within the range of the wire elastic forming block, thereby achieving the following advantages:

[0025] Firstly, the force balance section can control the degree of shrinkage force borne by the conductor elastic wave forming block, thereby achieving the purpose of controlling the degree of deformation of the conductor elastic wave.

[0026] Secondly, the force balance section can ensure that the position of the wire bouncy forming block remains unchanged, so that the position of multiple subsequent wire bouncy forming blocks that have not yet been formed can remain unchanged, and the interval distance can also remain fixed, without any deviation problem, thus reducing the generation of waste.

[0027] Third, when the next conductor wave forming block forms the next conductor wave, the shrinkage force of the conductor wave forming block when it is heated and pressurized is effectively limited by the force balance part. Therefore, the warp yarns, conductor combinations and weft yarns between two adjacent force balance parts will not be torn, and the substrate will not be torn. Attached Figure Description

[0028] Figure 1 This is a flowchart of the method of the present invention;

[0029] Figure 2 This is a schematic diagram of steps S10 and S20 of the first embodiment of the method of the present invention;

[0030] Figure 3 This is a schematic diagram of steps S30 and S40 of the first embodiment of the method of the present invention;

[0031] Figure 4 This is a schematic diagram of step S50 of the first embodiment of the method of the present invention;

[0032] Figure 5 This is a perspective cross-sectional view of the first embodiment of the pressing mold of the present invention;

[0033] Figure 6 This is a perspective cross-sectional view of the first embodiment of the molding die of the present invention;

[0034] Figure 7 This is a schematic diagram of the first embodiment of the hot pressing forming apparatus of the present invention, in which a conductor elastic wave and a force-balanced part are formed by heating and pressing on a substrate.

[0035] Figure 8 This is a schematic diagram of step S60 of the first embodiment of the method of the present invention;

[0036] Figure 9 This is a schematic diagram of step S50 of the second embodiment of the method of the present invention;

[0037] Figure 10 This is a perspective cross-sectional view of a second embodiment of the pressing mold of the present invention;

[0038] Figure 11 This is a perspective cross-sectional view of a second embodiment of the molding die of the present invention;

[0039] Figure 12 This is a schematic diagram of a second embodiment of the hot pressing forming apparatus of the present invention, in which a conductor elastic wave and a force-balanced part are formed by heating and pressing on a substrate.

[0040] Figure 13 This is a schematic diagram of step S60 of the second embodiment of the method of the present invention;

[0041] Figure 14 This is a schematic diagram of step S50 of the third embodiment of the method of the present invention;

[0042] Figure 15 This is a perspective cross-sectional view of a third embodiment of the pressing mold of the present invention;

[0043] Figure 16 This is a perspective cross-sectional view of a third embodiment of the molding die of the present invention;

[0044] Figure 17This is a schematic diagram of the third embodiment of the hot pressing molding apparatus of the present invention, in which a conductor elastic wave and a force-balanced part are formed by heating and pressing on a substrate;

[0045] Figure 18 This is a schematic diagram of step S60 of the third embodiment of the method of the present invention;

[0046] Figure 19 This is a schematic diagram of steps S10 and S20 of the fourth embodiment of the method of the present invention;

[0047] Figure 20 This is a schematic diagram of steps S10 and S20 of the fifth embodiment of the method of the present invention.

[0048] Explanation of reference numerals in the attached figures

[0049] 10: Warp yarn

[0050] 20, 20A, 20B: Conductor Combinations

[0051] 21: Conductor

[0052] 30: Weft yarn

[0053] 40: Substrate

[0054] 41: Conductor bouncy forming block

[0055] 42: Force balance section forming block

[0056] 43,43A: Connecting blocks

[0057] 50: Resin tank

[0058] 51: Resin solution

[0059] 60: Drying device

[0060] 61: Upper baking plate

[0061] 62: Lower baking plate

[0062] 70, 70A, 70B: Hot pressing forming device

[0063] 71, 71A, 71B: Pressing molds

[0064] 711: Pressed Surface

[0065] 7111: Upper guide wire elastic wave forming part

[0066] 7112, 7112A, 7112B: Forming protrusions for force balance section

[0067] 71121, 71121A, 71121B: Blocks

[0068] 72, 72A, 72B: Molding molds

[0069] 721: Molded Surface

[0070] 7211: Lower guide wire elastic wave forming part

[0071] 7212, 7212A, 7212B: Forming grooves for force balance parts

[0072] 72121, 72121A, 72121B: Groove

[0073] 80: Cutting device

[0074] 81: Upper cutting tool

[0075] 82: Lowering the cutting tool

[0076] 100: Wire bounce

[0077] 200, 200A, 200B: Force balance section

[0078] 201, 201A, 201B: Eaves

[0079] S10~S60: Steps Detailed Implementation

[0080] The embodiments of the present invention will be described in more detail below with reference to the accompanying drawings and component symbols, so that those skilled in the art can implement them after studying this specification.

[0081] Figure 1 This is a flowchart of the method of the present invention. Figure 2 This is a schematic diagram of steps S10 and S20 of the first embodiment of the method of the present invention. Figure 3 This is a schematic diagram of steps S30 and S40 of the first embodiment of the method of the present invention. Figure 4 This is a schematic diagram of step S50 of the first embodiment of the method of the present invention. Figure 5 This is a perspective cross-sectional view of the first embodiment of the pressing mold 71 of the present invention. Figure 6 This is a perspective cross-sectional view of the first embodiment of the molding die 72 of the present invention. Figure 7 This is a schematic diagram of the first embodiment of the hot pressing molding apparatus 70 of the present invention, in which a conductor elastic wave 100 and a force balancing part 200 are formed by heating and pressing on a substrate 40. Figure 8 This is a schematic diagram of step S60 of the first embodiment of the method of the present invention. The present invention provides a method for manufacturing a conductive elastic wave that controls the degree of deformation, comprising the following steps:

[0082] Step S10, as follows Figure 1 and Figure 2As shown, multiple warp yarns 10 and multiple conductor combinations 20 are spaced apart, extending in a straight line along a first direction and parallel to each other. Each conductor combination 20 consists of multiple conductors 21, each conductor 21 being a monofilament, and these conductors 21 are spaced apart from each other. Preferably, the warp yarns 10 are bamboo fiber, cotton fiber, silk fiber, hemp fiber, wool fiber, polyester fiber, acrylic fiber, polyvinyl naphthenic fiber, rayon fiber, rubber fiber, nylon fiber, elastic fiber, acetate fiber, or a combination thereof.

[0083] Step S20, as follows Figure 1 and Figure 2 As shown, multiple weft yarns 30 are interwoven along a second direction with the warp yarns 10 and the conductor assembly 20 to weave a substrate 40. The first direction is perpendicular to the second direction. Figure 1 , Figure 3 and Figure 4 As shown, the substrate 40 has a conductor elastic forming block 41 and a force-balancing forming block 42, with the force-balancing forming block 42 located around the conductor elastic forming block 41. Preferably, the weft yarns 30 are bamboo fiber, cotton fiber, silk fiber, hemp fiber, wool fiber, polyester fiber, acrylic fiber, polyethylene naphthenic fiber, rayon fiber, rubber fiber, nylon fiber, elastic fiber, acetate fiber, or a combination thereof.

[0084] Step S30, as follows Figure 1 and Figure 3 As shown, the substrate 40 is immersed in a resin solution 51 within a resin tank 50, causing the warp yarns 10, the conductors 21, and the weft yarns 30 to absorb and adhere to the resin. The resin contains solids such as alcohol and water, with a content of more than 50% of the liquid resin. The resin components are selected from one or a combination of phenolic resin, epoxy resin, polyester resin, rubber, and silicone, or other resin materials with similar properties.

[0085] Step S40, as follows Figure 1 and Figure 3 As shown, the substrate 40 is moved between an upper baking plate 61 and a lower baking plate 62 of a drying device 60. The substrate 40 is dried by the drying temperature of the upper baking plate 61 and the lower baking plate 62, so that the moisture and volatile substances in the resin on the substrate 40 are removed, thereby drying the substrate 40. At the same time, the resin penetrates into the substrate 40 and adheres to the warp yarns 10, the conductors 21 and the weft yarns 30 to form a resin solid layer (not shown). The resin solid layer covers the surface of the warp yarns 10, the conductors 21 and the weft yarns 30, thereby giving the substrate 40 appropriate hardness, elasticity and toughness.

[0086] Step S50, as follows Figure 1 and Figures 4 to 7 As shown, the substrate 40 is placed between a pressing surface 711 of a pressing mold 71 of a thermoforming apparatus 70 and a forming surface 721 of a forming mold 72 of a thermoforming apparatus 70; an upper wire elastic forming portion 7111 of the pressing surface 711 and a lower wire elastic forming portion 7211 of the forming surface 721 are heated and pressed together on the wire elastic forming block 41 to form a wire elastic 100; and the upper wire located on the pressing surface 711... A piece 71121 of a force-balancing forming protrusion 7112 surrounding the elastic forming part 7111 and a groove 72121 of a force-balancing forming groove 7212 surrounding the lower conductor elastic forming part 7211 on the forming surface 721 are heated and pressurized on the force-balancing forming block 42 to form an eave 201 of a force-balancing part 200. The piece 71121, the groove 72121, and the eave 201 are all annular. As a result, the force-balancing part 200 can evenly distribute the wrinkling force during heating and pressing within the range of the conductor elastic forming block 41, so that the conductor elastic forming block 41 can evenly bear the wrinkling force, ensuring that the shape of the conductor elastic 100 is intact and will not deform.

[0087] Step S60, as follows Figure 1 and Figure 8 As shown, the substrate 40 is moved between an upper cutter 81 and a lower cutter 82 of a cutting device 80. The upper cutter 81 and the lower cutter 82 cut the wire spring 100 from the substrate 40, so that the wire spring 100 is separated from the substrate 40, and the eaves 201 remain on the substrate 40.

[0088] Figure 9 This is a schematic diagram of step S50 of the second embodiment of the method of the present invention. Figure 10 This is a perspective cross-sectional view of a second embodiment of the pressing mold 71A of the present invention. Figure 11 This is a perspective cross-sectional view of a second embodiment of the molding die 72A of the present invention. Figure 12 This is a schematic diagram of a second embodiment of the hot pressing forming apparatus 70A of the present invention, in which a conductor elastic wave 100 and a force balancing part 200A are formed by heating and pressing on a substrate 40. Figure 13 This is a schematic diagram of step S60 of the second embodiment of the method of the present invention. Figures 9 to 13As shown, the difference between the second embodiment and the first embodiment is as follows: First, step S50 further includes: the two blocks 71121A of the force balancing part forming protrusion 7112A and the two grooves 72121A of the force balancing part forming groove 7212A are heated and pressed together on the force balancing part forming block 42 to form the two eaves 201A of the force balancing part 200. The blocks 71121A, the grooves 72121A and the eaves 201A are all U-shaped. Two connecting blocks 43 are formed between the eaves 201A. The wire assembly 20 extends through the connecting blocks 43. Second, step S60 further includes: the eaves 201A are retained on the substrate 40. Thus, the eaves 201A can disperse most of the shrinkage force during heating and pressurization within the range of the wire elastic forming blocks 41, and a small portion of the shrinkage force is dispersed to other blocks of the substrate through the connecting blocks 43. This results in the wire elastic forming blocks 41 being subjected to weaker shrinkage forces closer to the connecting blocks 43, while the remaining parts of the wire elastic forming blocks 41 are subjected to stronger shrinkage forces. Consequently, the deformation degree of the wire elastic 100 closer to the connecting blocks 43 is greater than the deformation degree of the remaining parts of the wire elastic 100.

[0089] In some embodiments, the U-shaped block 71121A can be modified into a semi-circular block, the U-shaped groove 72121A can be modified into a semi-circular groove, and the U-shaped eaves 201A can be modified into a semi-circular eaves, which can also achieve the same effect.

[0090] Figure 14 This is a schematic diagram of step S50 of the third embodiment of the method of the present invention. Figure 15 This is a perspective cross-sectional view of the third embodiment of the pressing mold 71B of the present invention. Figure 16 This is a perspective cross-sectional view of the third embodiment of the molding die 72B of the present invention. Figure 17 This is a schematic diagram of the third embodiment of the hot pressing molding apparatus 70B of the present invention, in which the conductor elastic wave 100 and the force balancing part 200B are formed by heating and pressing on the substrate 40. Figure 18 This is a schematic diagram of step S60 of the third embodiment of the method of the present invention. Figures 14 to 18As shown, the difference between the third embodiment and the first embodiment is as follows: First, step S50 further includes: the four blocks 71121B of the force balancing part forming protrusion 7112B and the four grooves 72121B of the force balancing part forming groove 7212B are heated and pressed together on the force balancing part forming block 42 to form the four eaves 201B of the force balancing part 200B. The blocks 71121B, the grooves 72121B and the eaves 201B are all L-shaped. A connecting block 43A is formed between two adjacent eaves 201B, so that four connecting blocks 43A are formed between the four eaves 201B. The conductor assembly 20 extends through two of the connecting blocks 43A. Second, step S60 further includes: the eaves 201B are retained on the substrate 40. Thus, the eaves 201B can disperse most of the shrinkage force during heating and pressurization within the range of the wire elastic forming blocks 41, and a small portion of the shrinkage force is dispersed to other blocks of the substrate 40 through the connecting blocks 43A. This results in the wire elastic forming blocks 41 being subjected to weaker shrinkage forces closer to the connecting blocks 43A, while the remaining parts of the wire elastic forming blocks 41 are subjected to stronger shrinkage forces. Consequently, the deformation degree of the wire elastic 100 near the connecting blocks 43A is greater than the deformation degree of the remaining parts of the wire elastic 100.

[0091] In some embodiments, the L-shaped block 71121B can be modified into an arc-shaped block, the L-shaped groove 72121B can be modified into an arc-shaped groove, and the L-shaped eaves 201B can be modified into an arc-shaped eaves, which can also achieve the same effect.

[0092] Figure 19 This is a schematic diagram of steps S10 and S20 of the fourth embodiment of the method of the present invention. Figure 19 As shown, the difference between the fourth embodiment and the previous embodiment is that the conductors 21 are twisted together so that each conductor combination 20A forms a multifilament body with a circular cross-section.

[0093] Figure 20 This is a schematic diagram of steps S10 and S20 of the fifth embodiment of the method of the present invention. Figure 20 As shown, the difference between the fifth embodiment and the previous embodiments is that the conductors 21 are interwoven with each other, so that each conductor combination 20B forms a multifilament body with a flat cross-section.

[0094] In summary, the force balancing units 200, 200A, and 200B can partially or completely disperse the wrinkling force of the wire elastic forming block 41 when it is heated and pressurized within the range of the wire elastic forming block 41, thus achieving the following effects:

[0095] Firstly, the force balancing parts 200, 200A, and 200B can control the degree of wrinkling force borne by the conductor elastic wave forming block 41, thereby achieving the purpose of controlling the degree of deformation of the conductor elastic wave 100.

[0096] Secondly, the force balancing parts 200, 200A, and 200B can ensure that the position of the wire elastic forming block 41 remains unchanged, so that the position of the subsequent multiple wire elastic forming blocks 41 that have not yet been formed can remain unchanged, and the interval distance can also remain fixed, without any deviation problem, thus reducing the generation of waste.

[0097] Third, when the next conductor wave forming block 41 forms the next conductor wave 100, the wrinkling force of the conductor wave forming block 41 when it is heated and pressurized is effectively limited by the force balancing parts 200, 200A, and 200B. Therefore, the warp yarns 10, conductor combinations 20, and weft yarns 30 between adjacent two force balancing parts 200, 200A, and 200B will not be torn, and the substrate 40 will not be broken.

[0098] The above description is merely for explaining preferred embodiments of the present invention and is not intended to limit the present invention in any way. Therefore, any modifications or changes made to the present invention under the same inventive spirit should still be included within the scope of protection intended by the present invention.

Claims

1. A method for manufacturing a wire spring with a controlled degree of deformation, comprising the steps of: (a) combining and spacing a plurality of warp yarns and a plurality of conductive threads, the plurality of warp yarns and the plurality of conductive threads being linearly extended and parallel to each other along a first direction, wherein, each of the wire assemblies is composed of a plurality of wires, and each of the wires is a monofilament wire body; (b) interweaving a plurality of weft yarns with a plurality of warp yarns and a plurality of wire assemblies along a second direction to weave a base material, wherein the first direction is perpendicular to the second direction, and the base material has a wire spring forming area and a force balance portion forming area, the force balance portion forming area being located around the wire spring forming area; (c) immersing the base material in a resin solution; (d) drying the base material to form a resin solid layer on the base material; (e) placing the base material between a pressing surface of a pressing die of a hot press forming device and a forming surface of a forming die of the hot press forming device; the upper wire spring forming portion of the pressing surface and the lower wire spring forming portion of the forming surface jointly heat and press on the wire spring forming area to form a wire spring; and the force balance portion forming protrusions around the upper wire spring forming portion of the pressing surface and the force balance portion forming recesses around the lower wire spring forming portion of the forming surface jointly heat and press on the force balance portion forming area to form a force balance portion; and separating the wire spring from the base material, and the force balance portion remains on the base material.

2. The method of claim 1, wherein, Step (e) further comprises: the blocks of the force balance portion forming protrusions and the grooves of the force balance portion forming recesses jointly heat and press on the force balance portion forming area to form a roof of the force balance portion, the blocks, the grooves and the roof are annular; wherein step (f) further comprises: the roof remains on the base material.

3. The method of claim 1, wherein, Step (e) further comprises: two blocks of the force balance portion forming protrusions and two grooves of the force balance portion forming recesses jointly heat and press on the force balance portion forming area to form two roofs of the force balance portion, the two blocks, the two grooves and the two roofs are U-shaped or semi-circular, two connecting areas are formed between the two roofs, and the plurality of wire assemblies extend through the two connecting areas; wherein step (f) further comprises: the two roofs remain on the base material.

4. The method of claim 1, wherein, Step (e) further comprises: four blocks of the force balance portion forming protrusions and four grooves of the force balance portion forming recesses jointly heat and press on the force balance portion forming area to form four roofs of the force balance portion, the four blocks, the four grooves and the four roofs are L-shaped or arc-shaped, a connecting area is formed between two adjacent roofs, so that four connecting areas are formed between the four roofs, and the plurality of wire assemblies extend through two of the four connecting areas; wherein step (f) further comprises: the four roofs remain on the base material.

5. A hot press forming device for a wire spring with a controlled degree of deformation, comprising: a pressing die including a pressing surface, the pressing surface including an upper wire spring forming portion and force balance portion forming protrusions around the upper wire spring forming portion; and The forming die comprises a forming surface, the forming surface comprises a lower conductor spring forming part and a force balance part forming groove, the force balance part forming groove is located around the lower conductor spring forming part; Wherein, the upper conductor spring forming part and the lower conductor spring forming part jointly heat and pressurize on the conductor spring forming block of the base material to form a conductor spring; and Wherein, the force balance part forming block and the force balance part forming groove jointly heat and pressurize on the force balance part forming block of the base material to form a force balance part.

6. The hot press forming apparatus according to claim 5, wherein The force balance part forming block comprises a block body, the block body is annular, the force balance part forming groove comprises a groove part, the groove part is annular; wherein, the block body and the groove part jointly heat and pressurize on the force balance part forming block to form a roof of the force balance part, the roof is annular.

7. The hot press forming apparatus according to claim 5, wherein The force balance part forming block comprises two block bodies, each block body is U-shaped or semicircular, the force balance part forming groove comprises two groove parts, each groove part is U-shaped or semicircular; wherein, the two block bodies and the two groove parts jointly heat and pressurize on the force balance part forming block to form two roofs of the force balance part, each roof is U-shaped or semicircular, two connecting blocks are formed between the two roofs, the two connecting blocks are used for the plurality of conductor combinations of the base material to extend through.

8. The hot press forming apparatus according to claim 5, wherein The force balance part forming block comprises four block bodies, each block body is L-shaped or arc-shaped, the force balance part forming groove comprises four groove parts, each groove part is L-shaped or arc-shaped; wherein, the four block bodies and the four groove parts jointly heat and pressurize on the force balance part forming block to form four roofs of the force balance part, each roof is L-shaped or arc-shaped, a connecting block is formed between two adjacent roofs, so that four connecting blocks are formed between the four roofs, two of the four connecting blocks are used for the plurality of conductor combinations of the base material to extend through.

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