PCB processing equipment and PCB processing method

Abstract

The invention discloses PCB (Printed Circuit Board) processing equipment and a PCB processing method. The PCB processing equipment comprises a vibration presser foot; the vibration presser foot is used for driving a machining area of the PCB to vibrate in the first direction at the set amplitude and frequency in the machining process, so that periodic contact and separation are formed between the machining tool rotating at the high speed and the PCB, and machining of the PCB is achieved. The processing area comprises an area which is on the PCB and abuts against the vibration presser foot and an area in a surrounding preset range. In the embodiment of the invention, the vibration presser foot is arranged on the PCB processing equipment, and the processing area of the PCB is driven to vibrate along the first direction at the set amplitude and frequency, so that the processing precision is also improved. Compared with a traditional scheme, the vibration device is additionally arranged on the main shaft or the workbench to improve the machining precision, the vibration presser foot serves as an independent and relatively simple component, the manufacturing cost and the maintenance cost of the vibration presser foot are greatly reduced, and therefore the cost of PCB machining equipment is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB processing equipment, and particularly relates to a PCB processing equipment and a PCB processing method. BACKGROUND

[0002] With the rapid development of aerospace, medical, automobile and electronic industries, the number of layers of printed circuit boards (PCB boards) is increasing, the diameter of micro-holes is becoming smaller and smaller, and the quality requirements of micro-holes are becoming higher and higher. In the processing of PCB boards, the materials involved in micro-hole processing are mainly carbon fiber composite materials and other difficult-to-machine materials. These materials have poor machinability, and the aspect ratio of micro-holes is generally large, resulting in large drilling force, high drilling temperature and short service life of drill bits during drilling, and further leading to the decline of the processing precision of PCB boards.

[0003] In the prior art, in order to improve the processing precision of PCB boards, a vibration device is usually added to the main shaft or the workbench to improve the processing precision of PCB boards. However, this way leads to high cost of PCB processing equipment. SUMMARY

[0004] Based on this, the embodiments of the present application provide a PCB processing equipment and a PCB processing method to solve the technical problem that the prior art PCB processing equipment adds a vibration device to the main shaft or the workbench to improve the processing precision of PCB boards, resulting in high cost.

[0005] To solve the above problems, the technical solutions adopted by the present application are as follows: In a first aspect, the embodiments of the present application provide a PCB processing equipment, comprising a vibrating presser foot; The vibrating presser foot is used to drive the processing area of the PCB board to vibrate in a first direction with a set amplitude and frequency during processing, so that the high-speed rotating processing tool and the PCB board form periodic contact and separation, thereby achieving processing of the PCB board, wherein the processing area includes the area on the PCB board that is in mutual abutment with the vibrating presser foot and the area within a predetermined range around it.

[0006] Optionally, the vibrating presser foot comprises an ultrasonic vibrating presser foot, which comprises an ultrasonic vibrating device and a presser foot assembly for pressing the PCB board; The output end of the ultrasonic vibrating device is detachably connected to one end of the presser foot assembly, and is used to drive the area on the PCB board that is in mutual abutment with the presser foot assembly and the area within a predetermined range around it to vibrate in the first direction with a set amplitude and frequency during processing, so that the high-speed rotating processing tool and the PCB board form periodic contact and separation, thereby achieving processing of the PCB board.

[0007] Optionally, a spindle machining assembly is further included and arranged integrally with the ultrasonic vibration foot, the spindle machining assembly being used to drive the machining tool to rotate at high speed; the frequency range of the ultrasonic vibration device is 20KHz-40KHz; the ultrasonic vibration device includes an ultrasonic transducer, a horn and a tool head; The output end of the ultrasonic transducer is connected with one end of the horn. The other end of the horn is connected with one end of the tool head. The other end of the tool head is detachably connected with one end of the foot assembly.

[0008] Optionally, the ultrasonic transducer includes a stud, a front end cover, an insulating sleeve, an electrode sheet, a piezoelectric ceramic, a rear end cover and a first screw. The front end cover is detachably connected with the rear end cover. The first screw is arranged in a receiving cavity formed by the rear end cover and the front end cover, and the front end cover is connected with the horn through the stud. The insulating sleeve is sleeved on the first screw. The piezoelectric ceramic and the electrode sheet are sequentially sleeved on the first screw with the insulating sleeve sleeved thereon, and located in the receiving cavity.

[0009] Optionally, the foot assembly includes a chip suction cover and a pressure foot. The center position of the pressure foot is provided with an opening for the machining tool to pass through. The other end of the tool head is detachably connected with one end of the chip suction cover. The other end of the chip suction cover is detachably connected with one end of the pressure foot.

[0010] Optionally, the ultrasonic vibration device further includes a foot guide shaft and a linear bearing. One end of the foot guide shaft is detachably connected with the other end of the tool head, and the other end is detachably connected with the chip suction cover. The foot guide shaft slides in the linear bearing along the first direction.

[0011] Optionally, the ultrasonic vibration device further includes an adapter sleeve, a flange and a lifting assembly used to control the lifting of the foot assembly. The flange is fixedly sleeved on the lower end of the ultrasonic transducer. One end of the lifting assembly is detachably connected with one end of the adapter sleeve. The adapter sleeve is sleeved on the ultrasonic transducer, and the other end of the adapter sleeve is fixedly connected with the flange.

[0012] Optionally, the lifting assembly comprises a cylinder, a cylinder rod and a floating joint. One end of the cylinder is connected with one end of the cylinder rod. The other end of the cylinder rod is connected with one end of the floating joint. The other end of the floating joint is detachably connected with one end of the adapter sleeve.

[0013] Optionally, the main shaft machining assembly further comprises a main shaft and a main shaft fixing assembly. The cylinder is fixedly installed on the main shaft fixing assembly. One side of the main shaft fixing assembly is detachably connected with the main shaft. The output end of the main shaft is detachably connected with one end of the machining tool. The presser foot assembly is located at the lower end of the main shaft, and the central axis of the presser foot assembly coincides with the central axis of the main shaft, and the inner diameter of the presser foot assembly is greater than the outer diameter of the lower end of the main shaft.

[0014] Optionally, the ultrasonic vibration device comprises two and is symmetrically arranged on both sides of the main shaft.

[0015] Optionally, the main shaft fixing assembly comprises a main shaft clamp rear seat, a main shaft clamp front cover and a cylinder installation support. The lower end of the main shaft is fixed between the main shaft clamp rear seat and the main shaft clamp front cover. One end of the cylinder installation support is fixedly connected with the main shaft clamp rear seat, and the other end is detachably connected with the cylinder.

[0016] Optionally, the PCB machining device further comprises a gantry system, a bed body, a workbench, a platform, a first movement assembly, a second movement assembly and a third movement assembly. The channel is formed between the gantry system and the bed body. The other side of the main shaft fixing assembly is connected with one end of the first movement assembly, the other end of the first movement assembly is connected with one end of the second movement assembly, and the other end of the second movement assembly is connected with the gantry system. One end of the third movement assembly is connected with the bed body, and the other end is connected with the platform, and the platform is connected with the workbench. The first movement assembly can drive the main shaft fixing assembly to move in the first direction, so that the main shaft fixing assembly drives the main shaft to move in the first direction. The second movement assembly can drive the first movement assembly to move in the second direction, so as to drive the main shaft to move in the second direction. The third movement assembly is configured to drive the platform to move in a third direction to move the workbench into or out of the channel. The first direction, the second direction and the third direction are perpendicular to each other.

[0017] In a second aspect, an embodiment of the present application provides a PCB processing method applied to the PCB processing device of the first aspect, and the method comprises the following steps. Obtaining processing parameters of a PCB board. According to the processing parameters, determining an amplitude and a frequency corresponding to the processing of the PCB board. According to the amplitude and the frequency, controlling a vibration presser to drive a processing area of the PCB board to vibrate in a first direction, so that the processing tool rotates at a high speed and forms periodic contact and separation with the PCB board, thereby realizing the processing of the PCB board, wherein the processing area includes an area on the PCB board abutting against the vibration presser and an area within a preset range around the area.

[0018] Optionally, after the step of obtaining the processing parameters of the PCB board, the method further comprises the following steps. Controlling a main shaft to move to a preset position above the PCB board, and controlling the main shaft to rotate at a high speed at a preset rotating speed, so that the processing tool arranged on the main shaft rotates at a high speed.

[0019] Optionally, the vibration presser comprises an ultrasonic vibration presser, and the ultrasonic vibration presser comprises an ultrasonic vibration device and a presser assembly. According to the amplitude and the frequency, controlling an ultrasonic wave generator to output corresponding output power and output frequency. According to the output power and the output frequency, controlling the ultrasonic vibration device to drive an area on the PCB board abutting against the presser assembly and an area within a preset range around the area to vibrate in the first direction.

[0020] In one scheme of the embodiment of the present application, the PCB processing equipment comprises a vibrating foot; the vibrating foot is used to drive the processing area of the PCB to vibrate in the first direction with a set amplitude and frequency during the processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, so as to realize the processing of the PCB, wherein the processing area comprises the area on the PCB which is in mutual abutment with the vibrating foot and the area within the preset range around the area. In the embodiment, the vibrating foot is arranged on the PCB processing equipment, and the processing area of the PCB is driven to vibrate in the first direction with a set amplitude and frequency, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, and the processing precision is improved. Compared with the traditional scheme, the vibrating device is added on the main shaft or the workbench to improve the processing precision, the vibrating foot is an independent and relatively simple component, and the manufacturing cost and the maintenance cost are greatly reduced, so that the cost of the PCB processing equipment is effectively reduced, and the economic benefit is improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0022] Figure 1 is a schematic diagram of the PCB processing equipment in one embodiment of the present application; Figure 2 is a partial schematic diagram of the PCB processing equipment in one embodiment of the present application; Figure 3 is a processing partial schematic diagram of the PCB processing equipment in one embodiment of the present application; Figure 4 is a schematic diagram of the ultrasonic vibration device in one embodiment of the present application; Figure 5 is an installation schematic diagram of the ultrasonic vibration device in one embodiment of the present application; Figure 6 is another installation schematic diagram of the ultrasonic vibration device in one embodiment of the present application; Figure 7 is an installation schematic diagram of the adapter sleeve in one embodiment of the present application; Figure 8 is a flowchart of the PCB processing method in one embodiment of the present application; Figure 9 is another flowchart of the PCB processing method in one embodiment of the present application.

[0023] In the drawings, the reference signs are as follows: 1. main shaft; 2. vibrating foot; 21. ultrasonic vibration device; 211, ultrasonic transducer; 2111, stud; 2112, front end cover; 2113, insulating sleeve; 2114, electrode sheet; 2115, piezoelectric ceramic; 2116, rear end cover; 2117, first screw; 212, amplitude transformer; 213, tool head; 22. foot assembly; 221, dust cover; 222, pressure foot; 23. foot guide shaft; 24, linear bearing; 25, adapter sleeve; 26, flange; 27, lifting assembly; 271, cylinder barrel; 272, cylinder rod; 273, floating joint; 28, second screw; 3, workbench; 4, platform; 5, beam base; 51, first base; 52, second base; 6, beam; 7, bed; 8, first motion assembly; 9, second motion assembly; 10, third motion assembly; 11, main shaft fixing assembly; 111, main shaft clamping rear seat; 112, main shaft clamping front cover; 113, cylinder barrel mounting bracket; 12, machining tool; 13, PCB board. DETAILED DESCRIPTION

[0024] In order to make the technical problems solved by the present application, the technical solutions and beneficial effects more clear and obvious, the present application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not used to limit the present application.

[0025] In the description of the present application, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only used for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0026] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] It should be noted that the processing object PCB board claimed in the present application can not be limited to the PCB board itself, and structures similar to the PCB board, such as IC carrier board and glass substrate, are also within the scope of protection claimed in the present application. In order to avoid redundancy, the following will mainly be illustrated by taking the PCB board as an example.

[0028] The first aspect of the present application provides a PCB processing equipment, please refer to Figure 1 、 Figure 2 and Figure 3 The PCB processing equipment includes a vibrating foot 2, which is used to drive the processing area of the PCB board 13 to vibrate in the first direction with a set amplitude and frequency during processing, so that the high-speed rotating processing tool 12 and the PCB board 13 form periodic contact and separation, so as to realize the processing of the PCB board 13, wherein the processing area includes the area on the PCB board 13 which is in mutual abutment with the vibrating foot 2 and the area within the preset range around it.

[0029] In an embodiment, by setting the vibrating foot 2 on the PCB processing equipment, and driving the processing area of the PCB board 13 to vibrate in the first direction with a set amplitude and frequency, the periodic contact and separation between the high-speed rotating processing tool 12 and the PCB board 13 is also achieved, and the processing precision is improved. Compared with the traditional scheme, the vibration device is added on the main shaft or the workbench to improve the processing precision, and the vibrating foot 2 is an independent and relatively simple component, so the manufacturing cost and maintenance cost are greatly reduced, thus effectively reducing the cost of the PCB processing equipment and improving the economic benefit. In actual application scenarios, the amplitude range of the vibrating foot 2 can be 1µm~20µm, and the preset frequency range can be 100Hz~80KHz, wherein the processing tool 12 can be connected to the output end of the main shaft 1, and the speed range of the main shaft 1 can be between 50000rpm and 300000rpm, preferably, the speed of the main shaft 1 can be 100000rpm, 150000rpm, 200000rpm or 250000rpm. Here, it does not constitute a limitation, so that the main shaft 1 can drive the processing tool 12 to rotate at high speed when rotating at high speed.

[0030] As an example, when the PCB board 13 is processed by the PCB processing equipment, the vibration presser foot 2 presses the processing area of the PCB board 13 to make the high-speed rotating processing tool 12 closely contact with the PCB board 13. The vibration presser foot 2 makes the processing area of the PCB board 13 produce periodic vibration along the first direction by high-frequency vibration, and this pulse non-continuous drilling process makes the processing area of the PCB board 13 periodically contact and separate with the processing tool 12 during the vibration process, so that the displacement of the high-speed rotating processing tool 12 in each vibration period changes slightly, which promotes the contact point between the processing tool 12 and the PCB board 13 to be fine-tuned in each period. Therefore, when the processing tool 12 has errors due to deviation or inaccurate positioning, these errors can be automatically corrected in the next vibration period, effectively reducing the deviation of the processing tool 12, improving the accurate positioning ability of processing, and thus improving the processing precision and efficiency.

[0031] For example, in the vibration drilling process, when the drill bit encounters deviation during drilling, the vibration action makes the drill bit temporarily exit and reposition, thereby automatically eliminating the deviation and ensuring that the drill bit can accurately drill into the target position again, thereby improving the positioning accuracy of drilling and making the vibration drilling exhibit higher precision and efficiency than ordinary drilling in the processing of the PCB board 13. Especially when processing difficult-to-process materials such as high-aspect-ratio PCB boards, multi-layer PCB boards, and high-density interconnection PCB boards, great advantages are exhibited.

[0032] In addition, the good chip breaking performance generated by vibration makes the chip removal more smooth during processing, reduces the scratching of the chip on the hole surface, further reduces the surface roughness of the PCB board 13 and the surface quality of the hole wall, and improves the processing quality of the PCB board 13. And because of the intermittent action between the processing tool 12 and the PCB board 13, the friction is greatly reduced, so that the processing tool 12 is always in a stable and normal wear stage, the cutting temperature is very low, the drill bit performance is stable, the wear speed is slow, and the service life of the processing tool 12 is prolonged.

[0033] The processing area includes the area of the PCB board 13 that is in mutual abutment with the vibration presser foot 2 and the area within the predetermined range around it. Taking a PCB board 13 with a size of 200mmx200mm as an example, when the vibration presser foot 2 is applied to the center area of the PCB board 13, the processing area includes the center part directly contacted by the vibration presser foot 2 and the predetermined extended range around it, for example, the center 50mmx50mm area of the PCB board 13 and the additional 10mm wide annular area around the center area. It should be noted that the above discussion of the processing area is only an example and does not constitute a limitation.

[0034] It should be understood that the periodic contact and separation described above is manifested in the process as the number of times of contact and separation between the machining tool 12 and the PCB 13, which is determined by the vibration frequency of the vibration foot 2, for example, a cycle of contact and separation is completed every 50 µs (1 s / 20000 times). The amplitude determines the pressure exerted by the machining tool 12 on the PCB 13 during each contact, and the greater the amplitude, the stronger the contact force.

[0035] In an embodiment, the vibration foot 2 comprises an ultrasonic vibration foot, the frequency range of which is above 20 KHz, further, the frequency range of the ultrasonic vibration foot can be configured in the range of 20 KHz-60 KHz, preferably, it can be configured as 20 KHz, 30 KHz or 40 KHz, etc.; the ultrasonic vibration foot comprises an ultrasonic vibration device 21 and a foot assembly 22 for pressing the PCB 13, further, the frequency range of the ultrasonic vibration device 21 can be configured in the range of 20 KHz-40 KHz; the output end of the ultrasonic vibration device 21 is detachably connected with one end of the foot assembly 22, for driving the area on the PCB 13 which is in mutual abutment with the foot assembly 22 and the area within a predetermined range around the area to vibrate in the first direction at a set amplitude and frequency during the process, so that the periodic contact and separation between the high-speed rotating machining tool 12 and the PCB 13 is formed, to realize the machining of the PCB 13.

[0036] In some embodiments, the ultrasonic vibration device 21 generates high-frequency vibration at a set amplitude and frequency, and transmits it to the foot assembly 22. The main function of the foot assembly 22 is to press the PCB 13 during the process, and to vibrate in the first direction synchronously under the driving of the ultrasonic vibration device 21. As an example, the output end of the ultrasonic vibration device 21 is fixed to one end of the foot assembly 22 in a detachable manner. This detachable connection design not only facilitates the maintenance and component replacement of the PCB processing equipment, but also can flexibly adjust the specifications or structure of the foot assembly 22 according to different processing requirements. When working, the ultrasonic vibration device 21 makes the foot assembly 22 vibrate in the first direction at a set amplitude and frequency. Since the foot assembly 22 is in close contact with the PCB 13, this vibration will be directly transmitted to the PCB 13, so that the PCB 13 in the machining area (for example, the area pressed by the foot assembly 22 and the area within a predetermined range around the area) produces synchronous vibration, thereby forming the periodic contact and separation between the high-speed rotating machining tool 12 and the PCB 13, and realizing the fine machining of the PCB 13.

[0037] For example, the size of the PCB 13 is 200mmx200mm, and the effective area of the foot assembly 22 is a 50mmx50mm area in the center of the PCB 13. The foot assembly 22 tightly presses this area, and the ultrasonic vibration device 21 drives the foot assembly 22 to reciprocate in the first direction with a set amplitude and frequency (for example, an amplitude of 10μm and a frequency of 20KHz). This vibration will make the center area of the PCB 13 pressed by the foot assembly 22 and the surrounding area of a preset 10mm wide annular area vibrate synchronously. During the vibration process, the center area and the surrounding area of the PCB 13 form periodic contact and separation with the high-speed rotating machining tool 12.

[0038] Further, the substrate processing device further comprises a spindle processing assembly integrated with the ultrasonic vibration foot, and the spindle processing assembly is used to drive the machining tool 12 to rotate at high speed, that is, the ultrasonic vibration spindle can be integrated on the spindle processing assembly, so that in the actual processing scene, the spindle processing assembly rotates at high speed to drive the machining tool 12 to process the PCB 13 while the ultrasonic vibration foot presses the PCB 13 to be processed.

[0039] Further, as shown in Figure 4 、 Figure 5 and Figure 6 , the frequency range of the ultrasonic vibration device 21 is 20KHz~40KHz; the ultrasonic vibration device 21 comprises an ultrasonic transducer 211, an amplitude transformer 212 and a tool head 213; the output end of the ultrasonic transducer 211 is connected with one end of the amplitude transformer 212; the other end of the amplitude transformer 212 is connected with one end of the tool head 213; the other end of the tool head 213 is detachably connected with one end of the foot assembly 22.

[0040] In some embodiments, the output end of the ultrasonic transducer 211 can be connected with one end of the amplitude transformer 212 through a threaded connection or a buckle device, so as to ensure that the ultrasonic vibration can be effectively transmitted to the amplitude transformer 212. The other end of the amplitude transformer 212 can be connected with one end of the tool head 213 through a thread, a bolt or a clamping groove, so as to ensure that the amplitude transformer 212 accurately transmits the amplified vibration energy to the tool head 213. The other end of the tool head 213 can be connected with one end of the foot assembly 22 through a thread, a pin or a quick release device, so that the ultrasonic vibration is smoothly transmitted from the tool head 213 to the foot assembly 22.

[0041] During operation, the ultrasonic transducer 211 converts the high-frequency electrical signal sent by the ultrasonic generator into high-frequency vibration. This vibration is amplified by the amplitude transformer 212 and transmitted to the tool head 213, and finally transmitted to the pressure foot assembly 22 through the tool head 213. During vibration, the pressure foot assembly 22 presses the PCB board 13, causing the processing area of ​​the PCB board 13 to vibrate synchronously along the first direction. Through the coordinated work of the ultrasonic transducer 211, the amplitude transformer 212, and the tool head 213, the transmission efficiency of vibration energy is improved.

[0042] It should be noted that the amplitude transformer 212 in this embodiment can be a single-stage amplitude transformer 212 or a multi-stage amplitude transformer 212. For example, an amplitude transformer 212 composed of a first-stage amplitude transformer 212 and a second-stage amplitude transformer 212 connected in series can be selected according to the processing requirements. Here, no limitation is made.

[0043] Furthermore, such as Figure 4 As shown, the ultrasonic transducer 211 includes a double-ended stud 2111, a front end cover 2112, a rear end cover 2116, an insulating sleeve 2113, an electrode plate 2114, a piezoelectric ceramic 2115, and a first screw 2117. The front end cover 2112 and the rear end cover 2116 are detachably connected. The first screw 2117 is disposed in the accommodating cavity formed by the rear end cover 2116 and the front end cover 2112. The front end cover 2112 and the amplitude transformer 212 are connected by the double-ended stud 2111. The insulating sleeve 2113 is disposed on the first screw 2117. The piezoelectric ceramic 2115 and the electrode plate 2114 are sequentially sleeved on the first screw 2117, which is sleeved with the insulating sleeve 2113, and are located in the accommodating cavity. The insulating sleeve 2113 is used to isolate the first screw 2117 from direct contact with the piezoelectric ceramic 2115 and the electrode plate 2114.

[0044] In some embodiments, the front cover 2112 and the rear cover 2116 are detachably connected together by threads or snap-fit ​​devices to form a receiving chamber, in which the first screw 2117 is disposed. One end of a double-ended stud 2111 is fixed to the front cover 2112, and the other end of the double-ended stud 2111 extends out of the front cover 2112 and is connected to one end of the amplitude transformer 212 by threads or a plug-in device. The piezoelectric ceramic 2115 and the electrode plate 2114 are sequentially sleeved on the first screw 2117 and located within the receiving chamber. To prevent direct contact between the first screw 2117 and the piezoelectric ceramic 2115 and the electrode plate 2114, an insulating sleeve 2113 is sleeved between the first screw 2117 and the piezoelectric ceramic 2115 and the electrode plate 2114 to reduce electrical interference and short circuits between the first screw 2117 and these components, thereby maintaining the stability and efficiency of the ultrasonic transducer 211. During operation, the high-frequency electrical signal sent by the ultrasonic generator applies an alternating voltage to the piezoelectric ceramic 2115 through the electrode plate 2114. Under the action of the electric field, the piezoelectric ceramic 2115 exhibits the piezoelectric effect, that is, its internal crystal structure undergoes mechanical deformation, generating high-frequency mechanical vibration. These vibrations are transmitted to the amplitude transformer 212 through the other end of the double-ended stud 2111. The amplitude transformer 212 further amplifies these high-frequency vibrations and transmits them to the tool head 213, ultimately driving the pressure foot assembly 22 to vibrate synchronously and apply it to the processing area of ​​the PCB board 13 or the workpiece.

[0045] Furthermore, the presser foot assembly 22 includes a chip suction cover 221 and a pressure foot 222; the pressure foot 222 has an opening at its center for the machining tool 12 to pass through; the other end of the tool head 213 is detachably connected to one end of the chip suction cover 221; the other end of the chip suction cover 221 is detachably connected to one end of the pressure foot 222.

[0046] In some embodiments, one end of the tool head 213 can be detachably connected to one end of the chip suction cover 221 via a connection method (e.g., threaded connection or locking device) to ensure that ultrasonic vibrations are effectively transmitted from the tool head 213 to the chip suction cover 221. The other end of the chip suction cover 221 is connected to one end of the pressure foot 222 via a similar detachable connection method, which will not be described in detail here. The pressure foot 222 has a central opening at its center, allowing the machining tool 12 to pass through and contact the PCB board 13 during operation.

[0047] During operation, when the ultrasonic transducer 211 transmits vibration to the tool head 213 via the amplitude transformer 212, the high-frequency vibration generated by the tool head 213 is transmitted to the chip suction hood 221, and further transmitted to the pressure foot 222 via the chip suction hood 221. Since the pressure foot 222 has an opening at its center for the machining tool 12 to pass through, the machining tool 12 can smoothly pass through the opening to process the PCB board 13. The pressure foot 222 vibrates synchronously along the first direction during processing along with the vibration of the tool head 213. This vibration allows the pressure foot 222 to apply pressure evenly to the processing area of ​​the PCB board 13, thereby ensuring periodic contact and separation between the machining tool 12 and the PCB board 13. Simultaneously, the vibration also guides the waste generated during processing into the chip suction hood 221, improving the overall processing quality and the working efficiency of the PCB processing equipment.

[0048] Furthermore, such as Figure 4 As shown, the ultrasonic vibration device 21 also includes a presser foot guide shaft 23 and a linear bearing 24; one end of the presser foot guide shaft 23 is detachably connected to the other end of the tool head 213, and the other end is detachably connected to the chip suction cover 221; the presser foot guide shaft 23 slides in the linear bearing 24 along a first direction.

[0049] In some embodiments, the presser foot guide shaft 23 and the tool head 213 can be fixed by a threaded connection. For example, one end of the presser foot guide shaft 23 is provided with an external thread, which mates with the internal thread of the tool head 213, and the connection is achieved by tightening. The other end of the presser foot guide shaft 23 is also connected to the chip suction cover 221 by a threaded connection. The other end of the presser foot guide shaft 23 can also be connected to one end of the chip suction cover 221 by a quick-release snap-fit ​​mechanism. The snap-fit ​​is locked during assembly and can be quickly unlocked during disassembly, thus facilitating maintenance and replacement. During operation, the high-frequency vibration generated by the ultrasonic transducer 211 is amplified by the amplitude transformer 212 and transmitted to the tool head 213. Finally, the tool head 213 drives the presser foot guide shaft 23 to make relative linear motion within the linear bearing 24, thereby realizing the reciprocating motion of the presser foot assembly 22 in the first direction, and thus driving the processing area of ​​the PCB board 13 to vibrate in the first direction. It should be noted that the above is only an example and does not constitute a limitation of the present invention.

[0050] Furthermore, such as Figure 6 and Figure 7 As shown, the ultrasonic vibration device 21 also includes an adapter sleeve 25, a flange 26, and a lifting assembly 27 for controlling the lifting and lowering of the pressure foot assembly 22; the flange 26 is fixedly sleeved on the lower end of the ultrasonic transducer 211; one end of the lifting assembly 27 is detachably connected to one end of the adapter sleeve 25; the adapter sleeve 25 is sleeved on the ultrasonic transducer 211, and the other end of the adapter sleeve 25 is fixed to the flange 26.

[0051] In some embodiments, the flange 26 can be fixedly fitted onto the lower end of the ultrasonic transducer 211, and one end of the adapter sleeve 25 can be detachably connected to one end of the lifting assembly 27, while the other end is tightly fixed to the flange 26. The connection between the adapter sleeve 25 and the flange 26 can be made using threads or a locking device. As an example, the mounting hole on the flange 26 can be designed as a through hole, and then a second screw 28 can be passed through the through hole and connected to the pre-set internal thread on the adapter sleeve 25; this is not a limitation.

[0052] It should be understood that, due to the relatively long axial dimension of the ultrasonic vibration device 21, the flange 26 is fixedly fitted onto the lower end of the ultrasonic transducer 211, and the adapter sleeve 25 is connected to the flange 26 fixedly installed on the ultrasonic transducer 211 by screws. This design can not only shorten the axial dimension of the adapter sleeve 25, but also reduce the material and processing costs of the adapter sleeve 25.

[0053] Furthermore, a lifting component 27 is added to the ultrasonic vibration device 21, which enables effective control of the position and height of the pressure foot component 22 when processing the PCB board 13, so as to adapt to the thickness and processing requirements of different workpieces, and ensure the accuracy of the pressure force and height control of the pressure foot component 22 on the PCB board 13 during the processing.

[0054] It should be noted that the flange 26 can also be designed on the amplitude transformer 212, as long as the ultrasonic transducer 211 and the adapter sleeve 25 can be installed and fixed, so that the specific position and height of the pressure foot assembly 22 can be controlled by the lifting assembly 27. Here, no limitation is made.

[0055] Furthermore, such as Figure 6 As shown, the lifting assembly 27 includes a cylinder 271, a cylinder rod 272, and a floating joint 273; one end of the cylinder 271 is connected to one end of the cylinder rod 272; the other end of the cylinder rod 272 is connected to one end of the floating joint 273; the other end of the floating joint 273 is detachably connected to one end of the adapter sleeve 25.

[0056] In some embodiments, the cylinder 271 is typically a cylindrical shell with a sealed cavity inside. As an example, one end of the cylinder rod 272 can be connected to a piston inside the cylinder 271. The piston can slide freely within the cylinder 271, thereby causing the cylinder rod 272 to extend and retract axially within the cylinder 271. The other end of the cylinder rod 272 is connected to one end of a floating joint 273, for example, via a threaded connection or a snap-fit ​​connection. The floating joint 273 is used to compensate for assembly errors or minor deviations during machining, allowing the cylinder rod 272 to be flexibly adjusted during its extension and retraction. The other end of the floating joint 273 is connected to one end of an adapter sleeve 25 via a threaded connection or a snap-fit ​​connection.

[0057] During operation, the piston is driven by hydraulic or pneumatic pressure within the cylinder 271, which in turn drives the extension and retraction of the cylinder rod 272. This controls the raising and lowering of the entire ultrasonic vibration device 21 and the pressure foot assembly 22. For example, when hydraulic or pneumatic pressure is applied to one side of the cylinder 271, the cylinder rod 272 is pushed outward or pulled inward, thereby moving the floating joint 273 and the adapter sleeve 25, and adjusting the height of the pressure foot assembly 22. Due to the flexible connection design of the floating joint 273, installation errors can be effectively compensated during the movement of the cylinder rod 272, ensuring that no additional stress or torsion is generated during the raising and lowering process, and guaranteeing smooth operation during processing.

[0058] Furthermore, such as Figure 6 As shown, the spindle machining assembly includes a spindle 1 and a spindle fixing assembly 11; a cylinder 271 is fixedly installed on the spindle fixing assembly 11; one side of the spindle fixing assembly 11 is detachably connected to the spindle 1; the output end of the spindle 1 is detachably connected to one end of the machining tool 12; the pressure foot assembly 22 is located at the lower end of the spindle 1, and the central axis of the pressure foot assembly 22 coincides with the central axis of the spindle 1, and the inner diameter of the pressure foot assembly 22 is larger than the outer diameter of the lower end of the spindle 1.

[0059] In some embodiments, the cylinder 271 is fixedly mounted on the spindle fixing assembly 11, ensuring that the fixed position of the cylinder 271 is stably engaged with the spindle fixing assembly 11. One side of the spindle fixing assembly 11 is connected to the spindle 1 via a detachable connection device, allowing the spindle 1 to be firmly engaged with the spindle fixing assembly 11 and enabling quick replacement or maintenance when needed. The output end of the spindle 1 is connected to one end of the machining tool 12, allowing the machining tool 12 to be firmly mounted on the spindle 1 and effectively transmitting rotational power during operation. The pressure foot assembly 22 is sleeved on the lower end of the spindle 1, and its inner diameter is designed to be larger than the outer diameter of the lower end of the spindle 1. This design ensures that the pressure foot assembly 22 can be easily sleeved on the lower end of the spindle 1 without interference, allowing the pressure foot assembly 22 to effectively cover and press the machining area of ​​the PCB board 13 without affecting the normal operation of the spindle 1.

[0060] It should be noted that the aforementioned spindle 1 may include a mechanical spindle or an electric spindle. As an example, a mechanical spindle may include a spindle body and a drive gear, with one end of the drive gear connected to one end of the spindle body and the other end connected to an external motor or transmission device to drive the rotation of the spindle body. An electric spindle may include a motor and a spindle body, with one end of the motor connected to one end of the spindle body so that the motor directly drives the rotation of the spindle body. Of course, the aforementioned spindle 1 may also include a pneumatic ultrasonic electric spindle or a hydraulic ultrasonic electric spindle; the specific type is not limited.

[0061] Furthermore, such as Figure 6 As shown, the ultrasonic vibration device 21 includes two devices, which are symmetrically arranged on both sides of the main shaft 1.

[0062] In some embodiments, the ultrasonic vibration device 21 may include two devices, symmetrically arranged on both sides of the main shaft 1. As an example, the output end of each ultrasonic vibration device 21 can be detachably connected to both ends of the pressure foot assembly 22. This connection method allows the two ultrasonic vibration devices 21 to simultaneously drive the pressure foot assembly 22 to vibrate uniformly at a set amplitude and frequency, effectively dispersing the vibration load, reducing mechanical imbalance, and enhancing the control accuracy and processing effect of the processing area of ​​the PCB board 13. It should be noted that the ultrasonic vibration device 21 in the embodiments of the present invention may also include one, three, four, or five, etc., which does not constitute a limitation of the present invention.

[0063] Furthermore, such as Figure 6 As shown, the spindle fixing assembly 11 includes a spindle clamp rear seat 111, a spindle clamp front cover 112, and a cylinder mounting bracket 113; the lower end of the spindle 1 is fixed between the spindle clamp rear seat 111 and the spindle clamp front cover 112; one end of the cylinder mounting bracket 113 is fixedly connected to the spindle clamp rear seat 111, and the other end is detachably connected to the cylinder 271.

[0064] In some embodiments, the lower end of the spindle 1 can be fixed between the spindle clamp rear seat 111 and the spindle clamp front cover 112. These two components are connected by screws or other fastening devices to form a robust clamping mechanism, ensuring the spindle 1 is securely fixed in the spindle 1 clamping assembly, thereby withstanding rotational forces and vibration loads during machining. One end of the cylinder mounting bracket 113 is fixedly connected to the spindle clamp rear seat 111, for example, by screws or rivets, ensuring a tight fit between the cylinder mounting bracket 113 and the spindle clamp rear seat 111, providing stable support for the cylinder 271. The other end of the cylinder mounting bracket 113 is detachably connected to the cylinder 271, for example, using a threaded connection or snap-fit ​​device. This design allows the cylinder 271 to be disassembled and replaced as needed, facilitating maintenance and adjustment.

[0065] Furthermore, such as Figure 1 As shown, the PCB processing equipment also includes a gantry system, a bed 7, a worktable 3, a platform 4, a first motion assembly 8, a second motion assembly 9, and a third motion assembly 10.

[0066] In some embodiments, the gantry system includes a beam base 5 and a beam 6 disposed on the beam base 5. Specifically, the beam base 5 includes a first base 51 and a second base 52 spaced apart. One end of the first base 51 and the second base 52 are connected to the beam 6 by fasteners or other means, thereby forming the gantry system. This connection method allows the PCB processing equipment to be quickly disassembled and reassembled when it needs to be moved or adjusted, improving the operating efficiency and flexibility of the PCB processing equipment. The beam 6 can also be made of a rigid material, such as marble, steel, or aluminum alloy, to ensure that it can withstand the weight of the spindle 1 and the load caused by its movement during processing, preventing deformation. The length and strength of the beam 6 can be customized according to the processing area and processing requirements, and are not limited here.

[0067] Furthermore, a channel is formed between the gantry system and the bed 7. As an example, one end of the first base 51 and the second base 52 can be connected to the crossbeam 6, and the other end can be connected to the bed 7, thereby forming a channel for the movement of the worktable 3 between the first base 51 and the second base 52.

[0068] Furthermore, the other side of the spindle fixing assembly 11 is connected to one end of the first motion assembly 8; the other end of the first motion assembly 8 is connected to one end of the second motion assembly 9, and the other end of the second motion assembly 9 is connected to the gantry system; the first motion assembly 8 can drive the spindle fixing assembly 11 to move along a first direction, so that the spindle fixing assembly 11 drives the spindle 1 to move along the first direction; the second motion assembly 9 can drive the first motion assembly 8 to move along a second direction, so that the spindle 1 moves along the second direction.

[0069] In some embodiments, the other side of the spindle fixing assembly 11 is connected to one end of the first motion assembly 8, ensuring that the first motion assembly 8 can drive the spindle fixing assembly 11 to move along a first direction, thereby driving the spindle 1 to move along the first direction. The other end of the first motion assembly 8 is connected to one end of the second motion assembly 9, and the other end of the second motion assembly 9 is connected to the crossbeam 6. In this way, while the first motion assembly 8 drives the spindle fixing assembly 11 to move along the first direction, the second motion assembly 9 can drive the first motion assembly 8 to move along a second direction, thereby driving the spindle 1 to move synchronously in the first and second directions, improving the flexibility of processing and meeting the requirements of different processing techniques.

[0070] In one embodiment, the first motion assembly 8 includes a first linear motor, a first rolling guide rail, a first slider, and a base plate. The first linear motor and the first rolling guide rail are fixed to the front side of the base plate. The first slider is disposed on the first rolling guide rail and connected to the first linear motor and one side of the spindle fixing assembly 11, while the spindle 1 is fixed to the other side of the spindle fixing assembly 11. During operation, by controlling the first linear motor, it drives the first slider to move smoothly along the first rolling guide rail in a first direction, thereby driving the spindle fixing assembly 11 to move in the first direction, for example, the Z-axis direction, thus driving the spindle 1 to move in the first direction. The first motion assembly 8 can use a high-precision and low-friction material (e.g., steel or aluminum alloy) to ensure that the first slider moves smoothly on the first guide rail and avoids affecting machining accuracy due to vibration or friction.

[0071] In one embodiment, the second motion component 9 includes a second linear motor, a second rolling guide rail, and a second slider. The second linear motor and the second rolling guide rail are mounted on the crossbeam 6, and the second slider is disposed on the second rolling guide rail and connected to the back of the base plate and the second linear motor. During operation, by controlling the second linear motor, it drives the second slider to move along the second rolling guide rail in a second direction, for example, the X-axis direction, thereby driving the first motion component 8 to move in the second direction, which in turn drives the spindle 1 on the spindle fixing component 11 to move in the second direction. This connection method allows the spindle 1 to move precisely in two directions, forming a complete two-dimensional motion plane, for example, the ZX plane, realizing comprehensive control of the spindle 1 and meeting the precision requirements of different PCB board 13 processing.

[0072] Furthermore, one end of the third motion component 10 is connected to the bed 7, and the other end is connected to the platform 4, which is connected to the worktable 3. The third motion component 10 can drive the platform 4 to move along a third direction, so that the platform 4 can move the worktable 3 into or out of the channel.

[0073] In some embodiments, one end of the third motion component 10 is connected to the bed 7, and the other end is connected to the platform 4. For example, the third motion component 10 can be connected to the bed 7 and the platform 4 respectively by threaded connection, pin connection, key connection or quick-locking device, so that the third motion component 10 can be easily disassembled or adjusted when needed, facilitating maintenance or replacement of parts. The main function of the third motion component 10 is to drive the platform 4 to move in a third direction, thereby driving the worktable 3 to move in a third direction, thereby realizing the movement of the PCB board 13 fixed on the worktable 3 in a third direction, for example, in the Y-axis direction, so that the PCB board 13 can flexibly move in or out of the channel formed between the crossbeam base 5 and the crossbeam 6.

[0074] For example, when processing a large PCB board 13, the third motion component 10 can move along a third direction to move the PCB board 13 from outside the PCB processing equipment into the working area, or move it out of the working area after processing. This makes the operation of the PCB processing equipment more flexible, especially in batch production or complex board processing, and can significantly improve production efficiency. It should be noted that the worktable 3 can be designed as a plane with adjustable height to adapt to the processing needs of PCB boards 13 of different thicknesses. For example, this can be achieved by adjusting the height between the platform 4 and the worktable 3. Here, the present invention does not limit this.

[0075] In one embodiment, the third motion component 10 includes a third linear motor, a third rolling guide rail, and a third slider. The third linear motor and the third rolling guide rail are mounted on the bed 7, and the third slider is disposed on the third rolling guide rail and connected to the platform 4 and the third linear motor. During operation, by controlling the third linear motor, it drives the third slider to move along the third rolling guide rail in a third direction, thereby driving the platform 4 to move upward in a third direction, which in turn drives the worktable 3 to move in a third direction. This allows for flexible entry and exit from the channel, forming a complete three-dimensional motion plane, such as the ZXY plane, which meets the processing accuracy requirements of different PCB boards 13.

[0076] In summary, the first motion component 8 and the second motion component 9 drive the spindle 1 to perform precision machining in the first and second directions, respectively. After machining, the third motion component 10 drives the moving platform 4 to move in the third direction, thereby moving the PCB board 13 out of the working area along the third direction. This allows operators to easily unload and reload the PCB board 13. The entire process improves the working efficiency and operational convenience of the PCB processing equipment.

[0077] Furthermore, the first, second, and third directions are mutually perpendicular. Specifically, this perpendicularity ensures that the first motion component 8, the second motion component 9, and the third motion component 10 do not interfere with each other when working independently in their respective directions, thus achieving precise and stable motion control. For example, when the first motion component 8 drives the spindle 1 to move in the first direction, the second motion component 9 can simultaneously adjust its processing position in the second direction, while the third motion component 10 can flexibly adjust the movement of the platform 4 in the third direction. Through this design, the PCB processing equipment can be precisely positioned and operated in three-dimensional space, thereby achieving complex processing tasks.

[0078] In one embodiment, the processing types of the PCB board 13 include drilling, routing, milling, or cutting. During the processing of the PCB board 13, common processing types include drilling, routing, milling, and cutting, depending on different requirements and design specifications. Specifically: Drilling is a processing method that creates holes in a PCB board.

[0079] In one implementation, when drilling a hole in the PCB board 13 using the machining tool 12, the machining area of ​​the PCB board 13 is driven to vibrate at a high frequency in a first direction (e.g., a direction perpendicular to the surface of the PCB board 13) with a set amplitude and frequency. This vibration causes periodic contact and separation between the machining tool 12 and the machining area of ​​the PCB board 13, effectively reducing cutting force, reducing cutting heat, and promoting timely chip removal. Furthermore, ultrasonic vibration helps remove burrs and residues generated during drilling, improving the quality of the drilling.

[0080] A roulette wheel is a processing method that removes excess material from a PCB board 13 to form a specific shape or structure.

[0081] In one implementation, when the PCB board 13 is milled using the machining tool 12, the machining area of ​​the PCB board 13 is driven to vibrate at a high frequency in a first direction with a set amplitude and frequency, so that the machining tool 12 can accurately remove excess material from the PCB board 13 along a preset trajectory. In this process, ultrasonic vibration not only significantly reduces cutting resistance and thermal impact, but also promotes smooth chip removal.

[0082] Milling is a surface treatment and precision machining method for PCB boards.

[0083] As one implementation, when milling the PCB board 13 with the machining tool 12, the machining area of ​​the PCB board 13 is driven to vibrate at a high frequency in the first direction with a set amplitude and frequency, making the cutting process more precise and delicate. This reduces the damage to the PCB board 13 caused by cutting heat and mechanical stress, and ensures the smoothness and accuracy of the machining edge.

[0084] Cutting is a processing method for forming a PCB board 13 into the desired shape and structure.

[0085] In one implementation, when the PCB board 13 is cut by the cutting tool 12, the processing area of ​​the PCB board 13 is driven to vibrate at a high frequency in a first direction with a set amplitude and frequency. This causes a high-frequency impact between the cutting tool 12 and the PCB board 13, thereby achieving precise and efficient cutting. This cutting method not only reduces damage to the PCB board 13 substrate and ensures the smoothness and flatness of the processed edges, but also greatly improves processing accuracy and production efficiency.

[0086] In one embodiment, the PCB board 13 includes a high aspect ratio PCB board, a multilayer PCB board, or a high-density interconnect (HDI) PCB board. Specifically, a high aspect ratio PCB board refers to a PCB board with a relatively large thickness, for example, a PCB board with a thickness of 1.0 mm to 10.0 mm. A multilayer PCB board refers to a circuit board composed of multiple PCB boards stacked together, with each layer having an independent circuit pattern and connection structure, for example, a PCB board with 4 to 20 layers and a thickness of 1.5 mm to 10.0 mm; a high-density interconnect (HDI) PCB board refers to a PCB board with a high wiring density.

[0087] The second aspect provides a PCB processing method applicable to the PCB processing equipment described in the first aspect embodiment above. The PCB processing equipment includes a control system and a vibrating pressure foot 2, as shown below. Figure 8 As shown, the PCB manufacturing method includes: S10. Obtain the processing parameters of PCB board 13; In this embodiment, the processing parameters of PCB board 13 include PCB board parameters and processing type parameters. Specifically, the PCB board parameters include PCB board type and PCB board inherent parameters. Among them, the PCB board type includes high aspect ratio PCB board, multilayer PCB board or high density interconnect (HDI) PCB board; the PCB board parameters include high aspect ratio PCB board parameters, multilayer PCB board parameters or high density interconnect PCB board parameters.

[0088] As an example, high aspect ratio PCB board parameters include: Thickness: For example, 1.0mm to 10.0mm; Aperture: for example, 0.2mm to 1.0mm; Aspect ratio: for example, 5:1 to 10:1 or higher; Material type: For example, FR-4 material.

[0089] Parameters for multilayer PCBs include: Number of floors: For example, 4 to 20 floors or more; Total thickness: for example, 1.5mm to 10.0mm; Material type: For example, FR-4 material.

[0090] High-density interconnect PCB board parameters include: Thickness: for example, 0.5mm to 3.0mm; Aperture: for example, 0.1mm to 0.3mm; Line width and spacing: for example, 50µm to 150µm.

[0091] Material type: For example, low dielectric constant materials.

[0092] Machining type parameters include drilling parameters, milling parameters, milling parameters, or cutting parameters.

[0093] Specifically, drilling parameters include: drilling depth, spindle speed, and feed rate.

[0094] The parameters of the router include: cutting width, router cutter diameter, cutting speed, router cutter speed, and feed rate.

[0095] Milling parameters include: depth of cut, cutter diameter, spindle speed, and feed rate.

[0096] Cutting parameters include: cutting depth, cutting speed, and cutting accuracy.

[0097] S20. Based on the processing parameters, determine the amplitude and frequency corresponding to the processed PCB board 13; In this embodiment, the amplitude range is 1µm to 20µm, and the frequency range is 2kHz to 40kHz. Preferably, the amplitude can be configured as 5µm, 10µm, 15µm, or 18µm, and the frequency can be configured as 5kHz, 10kHz, 20kHz, 30kHz, or 35kHz. The amplitude and frequency suitable for the PCB board 13 are determined based on the processing parameters of the PCB board 13 to optimize the processing effect and ensure processing quality. Specifically, the corresponding amplitude and frequency can be preset according to the processing parameters of the PCB board 13. Furthermore, the corresponding amplitude and frequency can be automatically retrieved by inputting the processing parameters of the PCB board 13. Alternatively, other methods can be used to determine the amplitude and frequency, which are not limited here.

[0098] As an example, a database of processing parameters for PCB board 13 can be pre-established, covering the aforementioned processing parameters of PCB board 13, the corresponding amplitude and frequency of PCB board 13, and the processing effect. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis. This parameter prediction model is used to predict the amplitude and frequency corresponding to the processing parameters of PCB board 13.

[0099] Specifically, when the user inputs the processing parameters of PCB board 13, the control system immediately initiates an automatic query and matching mechanism to quickly filter out similar or related cases from the historical database based on the input processing parameters of PCB board 13. Then, the system uses a parameter prediction model to intelligently analyze the amplitude and frequency settings in these cases, comprehensively considering multiple dimensions such as processing accuracy, processing quality, and tool wear, and finally recommends the optimal amplitude and frequency.

[0100] For example, a user needs to process a batch of PCB boards 13 with a thickness of 1.6mm, a hole diameter of 0.3mm, and a material type of FR-4. After inputting these parameters, the control system determines the corresponding amplitude and frequency through a pre-trained parameter prediction model; for example, the amplitude is set to 2.5µm and the frequency is set to 30kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0101] As another example, a table relating the processing parameters of PCB board 13 to amplitude and frequency can be pre-established. When the user inputs the processing parameters of PCB board 13, the control system determines the corresponding amplitude and frequency of PCB board 13 by querying the pre-established table. For example, a 1.0mm thick high aspect ratio PCB board corresponds to a frequency of 30kHz and an amplitude of 1.5µm. A 2.0mm thick high aspect ratio PCB board corresponds to a frequency of 28kHz and an amplitude of 2µm. It should be noted that the above is only an example; the specific processing parameters of PCB board 13, and the corresponding amplitude and frequency, can be pre-set according to actual conditions and are not limited here.

[0102] S30. Based on the amplitude and frequency, control the vibrating foot 2 to drive the processing area of ​​the PCB board 13 to vibrate along the first direction, so that the high-speed rotating processing tool 12 and the PCB board 13 form periodic contact and separation, so as to realize the processing of the PCB board 13. The processing area includes the area on the PCB board 13 that abuts against the vibrating foot 2 and the area within a preset range around it.

[0103] In this embodiment, the processing area is the area of ​​the PCB board 13 pressed by the vibrating foot 2 and the area within a preset range around it. Taking a PCB board 13 with a size of 200mm x 200mm as an example, when the vibrating foot 2 is applied to the central area of ​​the PCB board 13, the processing area includes the central part directly contacted by the vibrating foot 2 and the preset extended range around it, for example, the central 50mm x 50mm area of ​​the PCB board 13 and an additional 10mm wide annular area around the central area.

[0104] In some embodiments, the vibrating pressure foot 2 is controlled according to a set amplitude and frequency to drive the processing area of ​​the PCB board 13 to vibrate along a first direction. This vibration causes the PCB board 13 to form periodic contact and separation between the processing area and the processing tool 12. Specifically, the PCB board 13 contacts the high-speed rotating processing tool 12 for cutting in each vibration cycle, and then separates to prepare for the next contact. By adjusting the amplitude and frequency, the amplitude and frequency of the vibration can be precisely controlled, thereby optimizing the processing effect of the PCB board 13. The periodic contact and separation make the processing process more uniform, reduce the wear of the processing tool 12 on the PCB board 13, improve the processing accuracy and efficiency, and ensure the consistency and quality of the surface processing of the PCB board 13.

[0105] For example, when drilling a 100mm x 100mm PCB board 13, the processing area is the area of ​​the PCB board 13 pressed by the vibrating foot 2 and a 10mm radius around it. Based on a preset amplitude (e.g., 10µm) and frequency (e.g., 20kHz), the vibrating foot 2 is controlled to vibrate, causing the processing area of ​​the PCB board 13 to vibrate along a first direction at an amplitude of 10µm and a frequency of 20,000 times per second. Under these vibration conditions, the surface of the processing area of ​​the PCB board 13 experiences small but frequent up-and-down movements, forming periodic contact and separation. Specifically, when the drill bit contacts the PCB board 13, the vibration causes the drill bit to produce a small displacement on the PCB board 13 in each vibration cycle, resulting in alternating contact and separation between the drill bit and the PCB board 13. This periodic movement not only reduces the friction between the drill bit and the PCB board 13 but also reduces material deformation caused by heat, thereby improving the accuracy and smoothness of the drilling. It should be noted that the above is only an example and does not constitute a limitation.

[0106] In one embodiment, after step S10, that is, after obtaining the processing parameters of the PCB board 13, the following steps are included: S40. Control the spindle 1 to move to a preset position above the PCB board 13, and control the spindle 1 to rotate at high speed according to the preset speed, so as to drive the machining tool 12 set on the spindle 1 to rotate at high speed.

[0107] In this embodiment, after obtaining the processing parameters of the PCB board 13, the spindle 1 is further controlled to move to a preset position above the PCB board 13. This process aims to ensure accurate positioning of the spindle 1 so that the high-speed rotating cutting tool 12 can be aligned with the PCB board 13 at an appropriate distance and angle for effective processing. Next, controlling the spindle 1 to rotate at a preset speed ensures that the cutting tool 12 can effectively cut or drill. The speed setting depends on the obtained processing parameters; for example, different PCB types require different speeds. The drive system of the spindle 1 is adjusted according to the set speed to achieve a stable rotational speed. For example, when processing PCB boards with a high aspect ratio, the spindle 1 speed can be set to 50,000 revolutions per minute to reduce wear on the cutting tool 12 and ensure processing stability.

[0108] In one embodiment, such as Figure 9 As shown, the vibrating presser foot 2 includes an ultrasonic vibrating presser foot, which includes an ultrasonic vibration device 21 and a presser foot assembly 22. Specifically, in step S30, the vibrating presser foot 2 is controlled to drive the processing area of ​​the PCB board 13 to vibrate along a first direction based on the amplitude and frequency. This includes: S31. Based on the amplitude and the frequency, control the ultrasonic generator to output the corresponding output power and output frequency; S32. Based on the output power and output frequency, control the ultrasonic vibration device 21 to drive the area on the PCB board 13 that abuts against the pressure foot assembly 22 and the area within a preset range around it to vibrate along the first direction.

[0109] In this embodiment, the ultrasonic generator is controlled to adjust its output power and frequency according to the set amplitude (e.g., 10µm) and frequency (e.g., 20kHz) to ensure that the ultrasonic vibration device 21 generates ultrasonic vibrations that match the set amplitude and frequency. Next, the ultrasonic vibration device 21 receives the output signal from the ultrasonic generator, converts it into mechanical vibration, and drives the pressure foot assembly 22 to vibrate synchronously in the area of ​​the PCB board 13 it presses against, as well as in a preset range around that area. For example, the pressure foot assembly 22 vibrates along a first direction with a set amplitude (e.g., 10µm) within a set number of vibrations per second (e.g., 20,000 times). This causes periodic contact and separation between the processing area of ​​the PCB board 13 and the processing tool 12. Thus, when the processing tool 14 contacts the PCB board 13, the ultrasonic vibration not only reduces friction but also reduces material deformation caused by heat, thereby improving processing accuracy and smoothness. Overall, this control strategy significantly improves the efficiency and quality of PCB board 13 processing, achieving more precise processing results.

[0110] For example, drilling holes in a high aspect ratio PCB board with a thickness of 5.0mm: Assuming the determined amplitude is 10µm and the frequency is 20kHz, the corresponding ultrasonic generator output power is 30W and the output frequency is 20kHz. During drilling, ultrasonic vibration causes the processing area of ​​the PCB board 13 to periodically contact and separate from the drill bit with each revolution of the drill bit. For example, when the spindle speed 1 is 100,000rpm, the drilling speed is 20µm / revolution, the amplitude of the ultrasonic vibration device 21 is 10µm, and the frequency is 20kHz, the drill bit's feed rate is 33.33mm / s. This means that during the drilling process of 33.33mm, the drill bit will experience 20,000 ultrasonic vibrations. Therefore, during each vibration, the drill bit's feed displacement is 1.67µm. In this case, the drill bit's vibration amplitude is 10µm, and the vibration speed is much greater than the drill bit's feed rate. This micron-level ultrasonic vibration manifests as a high-speed impact of the drill bit on the PCB board 13 material. This tiny impact helps reduce drilling forces because the drill bit cuts only a very thin layer (e.g., 1.67µm) with each vibration. In addition, during ultrasonic vibration, the secondary cutting edge of the drill bit also continuously scrapes the hole wall due to high-frequency axial vibration, which is equivalent to secondary machining of the hole wall, thus significantly reducing the roughness of the hole wall.

[0111] The third aspect provides a PCB processing system, which includes at least one PCB processing device as described in the first aspect embodiment.

[0112] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A PCB processing apparatus characterized by comprising: The vibration presser is used to drive the processing area of the PCB to vibrate along the first direction with a set amplitude and frequency during the processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, thereby achieving the processing of the PCB. The vibration presser includes an ultrasonic vibration presser, which includes an ultrasonic vibration device and a presser assembly for pressing the PCB.

2. The PCB processing apparatus according to claim 1, wherein The output end of the ultrasonic vibration device is detachably connected with one end of the presser assembly, which is used to drive the area of the PCB that is in mutual abutment with the presser assembly and the surrounding preset range to vibrate along the first direction with a set amplitude and frequency during the processing, so that the high-speed rotating processing tool and the PCB form periodic contact and separation, thereby achieving the processing of the PCB. The ultrasonic vibration device includes an ultrasonic transducer, an amplitude transformer and a tool head.

3. The PCB processing apparatus according to claim 2, wherein The output end of the ultrasonic transducer is connected with one end of the amplitude transformer. The other end of the amplitude transformer is connected with one end of the tool head. The other end of the tool head is detachably connected with one end of the presser assembly. The ultrasonic transducer includes a stud, a front end cover, an insulating sleeve, an electrode sheet, a piezoelectric ceramic, a rear end cover and a first screw.

4. The PCB processing apparatus according to claim 3, wherein The front end cover is detachably connected with the rear end cover. The first screw is arranged in a receiving cavity formed by the rear end cover and the front end cover, and the front end cover is connected with the amplitude transformer through the stud. The insulating sleeve is sleeved on the first screw. The piezoelectric ceramic and the electrode sheet are sequentially sleeved on the first screw with the insulating sleeve, and located in the receiving cavity. The presser assembly includes a chip suction cover and a pressure foot.

5. The PCB processing apparatus according to claim 3, wherein The center of the pressure foot is provided with an opening for the processing tool to pass through. The other end of the tool head is detachably connected with one end of the chip suction cover. The other end of the chip suction cover is detachably connected with one end of the pressure foot. The ultrasonic vibration device further includes a presser guide shaft and a linear bearing.

6. The PCB processing apparatus according to claim 5, wherein One end of the presser guide shaft is detachably connected with the other end of the tool head, and the other end is detachably connected with the chip suction cover. The presser guide shaft slides along the first direction in the linear bearing. The ultrasonic vibration device further includes an adapter sleeve, a flange and a lifting assembly for controlling the lifting of the presser assembly.

7. The PCB processing apparatus according to claim 3, wherein The flange is fixedly sleeved on the lower end of the ultrasonic transducer. One end of the lifting assembly is detachably connected with one end of the adapter sleeve. The adapter sleeve is sleeved on the ultrasonic transducer, and the other end of the adapter sleeve is fixedly connected with the flange. The lifting assembly includes a cylinder, a cylinder rod and a floating joint.

8. The PCB processing apparatus according to claim 7, wherein ​ One end of the cylinder is connected with one end of the cylinder rod; The other end of the cylinder rod is connected with one end of the floating joint; The other end of the floating joint is detachably connected with one end of the adapter sleeve.

9. The PCB processing apparatus according to claim 8, wherein The main shaft machining assembly comprises a main shaft and a main shaft fixing assembly; The cylinder is fixedly installed on the main shaft fixing assembly; One side of the main shaft fixing assembly is detachably connected with the main shaft; The output end of the main shaft is detachably connected with one end of the machining tool; The presser foot assembly is located at the lower end of the main shaft, and the central axis of the presser foot assembly coincides with the central axis of the main shaft, and the inner diameter of the presser foot assembly is greater than the outer diameter of the lower end of the main shaft.

10. The PCB processing apparatus according to claim 9, wherein The ultrasonic vibration device comprises two, and is symmetrically arranged on both sides of the main shaft.

11. The PCB processing apparatus of claim 9, wherein, The main shaft fixing assembly comprises a main shaft clamp rear seat, a main shaft clamp front cover and a cylinder mounting bracket; The lower end of the main shaft is fixed between the main shaft clamp rear seat and the main shaft clamp front cover; One end of the cylinder mounting bracket is fixedly connected with the main shaft clamp rear seat, and the other end is detachably connected with the cylinder.

12. The PCB processing apparatus of claim 11, wherein, The PCB machining device further comprises a gantry system, a bed body, a workbench, a platform, a first movement assembly, a second movement assembly and a third movement assembly; The gantry system and the bed body form a channel therebetween; One side of the main shaft fixing assembly is connected with one end of the first movement assembly, the other end of the first movement assembly is connected with one end of the second movement assembly, and the other end of the second movement assembly is connected with the gantry system; One end of the third movement assembly is connected with the bed body, and the other end is connected with the platform, and the platform is connected with the workbench; The first movement assembly can drive the main shaft fixing assembly to move in the first direction, so that the main shaft fixing assembly drives the main shaft to move in the first direction; The second movement assembly can drive the first movement assembly to move in the second direction, so as to drive the main shaft to move in the second direction; The third movement assembly can drive the platform to move in the third direction, so as to realize that the platform drives the workbench to move into or out of the channel; The first direction, the second direction and the third direction are perpendicular to each other.

13. A method of processing a PCB, characterized by, The method is applied to the PCB machining device of any one of claims 1-12, and the method comprises: Obtaining the processing parameters of the PCB board; According to the processing parameters, the corresponding amplitude and frequency of processing the PCB board are determined; According to the amplitude and the frequency, the vibration presser foot drives the processing area of the PCB board to vibrate in the first direction, so that the high-speed rotating machining tool and the PCB board form periodic contact and separation, so as to realize the processing of the PCB board, wherein the processing area comprises the area on the PCB board which is in contact with the vibration presser foot and the area within the surrounding predetermined range.

14. The PCB processing method of claim 13, wherein, After obtaining the processing parameters of the PCB board, the method further comprises: Controlling the main shaft to move to a predetermined position above the PCB board, and controlling the main shaft to rotate at a predetermined high speed, so as to drive the machining tool arranged on the main shaft to rotate at a high speed.

15. The PCB processing method of claim 13, wherein, The vibration foot includes an ultrasonic vibration foot, the ultrasonic vibration foot includes an ultrasonic vibration device and a foot assembly, and the vibration foot drives the processing area of the PCB to vibrate in the first direction according to the amplitude and the frequency, including: According to the amplitude and the frequency, the ultrasonic wave generator outputs corresponding output power and output frequency; According to the output power and the output frequency, the ultrasonic vibration device drives the area on the PCB which is in mutual abutment with the foot assembly and the area within the preset range around the area to vibrate in the first direction.

Images