Organic light-emitting element

Abstract

An organic light-emitting element includes a substrate, a first electrode, a second electrode, a first organic light-emitting layer, and a second organic light-emitting layer. The first electrode and the second electrode are located on the substrate. The first organic light-emitting layer is located on the first electrode. The second organic light-emitting layer is located on the second electrode. The difference between the thickness of the second organic light-emitting layer and the thickness of the first organic light-emitting layer is greater than 500 angstroms and less than 1500 angstroms.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an organic light emitting element, and more particularly to an organic light emitting element including an organic light emitting diode (OLED) structure. BACKGROUND

[0002] Currently, a fine metal mask (FMM) is used for depositing the light emitting layer of the organic light emitting element, or a white light plus color film is used for the process. The pixel fineness or resolution made by the above process is poor. SUMMARY

[0003] In the present disclosure, an organic light emitting element includes a substrate, a first electrode, a second electrode, a first organic light emitting layer, and a second organic light emitting layer. The first electrode and the second electrode are on the substrate. The first organic light emitting layer is on the first electrode. The second organic light emitting layer is on the second electrode. The difference between the thickness of the second organic light emitting layer and the thickness of the first organic light emitting layer is greater than 500 angstroms to less than 1500 angstroms.

[0004] In the present disclosure, a method for manufacturing an organic light emitting element includes: providing a substrate; disposing a first electrode and a second electrode on the substrate; forming a first organic light emitting layer on the first electrode; and forming a second organic light emitting layer on the second electrode, such that the difference between the thickness of the second organic light emitting layer and the thickness of the first organic light emitting layer is greater than 500 angstroms to less than 1500 angstroms.

[0005] In some embodiments, the organic light emitting element further includes a third electrode and a third organic light emitting layer. The third electrode is on the substrate. The third organic light emitting layer is on the third electrode. The difference between the thickness of the second organic light emitting layer and the thickness of the third organic light emitting layer is greater than 800 angstroms to less than 1800 angstroms.

[0006] In some embodiments, the light emitting wavelength of the second organic light emitting layer is greater than the light emitting wavelength of the first organic light emitting layer, and the light emitting wavelength of the first organic light emitting layer is greater than the light emitting wavelength of the third organic light emitting layer.

[0007] In some embodiments, the thickness of the second organic light emitting layer is greater than the thickness of the first organic light emitting layer, and the thickness of the first organic light emitting layer is greater than the thickness of the third organic light emitting layer.

[0008] In some embodiments, the first organic light emitting layer includes a first hole transport layer, the second organic light emitting layer includes a second hole transport layer, the third organic light emitting layer includes a third hole transport layer, the thickness of the second hole transport layer is greater than the thickness of the first hole transport layer, and the thickness of the first hole transport layer is greater than the thickness of the third hole transport layer.

[0009] In some embodiments, the first organic light-emitting layer includes a first electron transport layer, the second organic light-emitting layer includes a second electron transport layer, and the third organic light-emitting layer includes a third electron transport layer, wherein the thickness of the second electron transport layer is greater than the thickness of the first electron transport layer and the thickness of the third electron transport layer.

[0010] In some embodiments, the first organic light-emitting layer includes a first hole transport layer, the second organic light-emitting layer includes a second hole transport layer, and the difference between the thickness of the second hole transport layer and the thickness of the first hole transport layer is greater than 300 angstroms and less than 1000 angstroms.

[0011] In some embodiments, the first organic light-emitting layer includes a first hole transport layer, the second organic light-emitting layer includes a second hole transport layer, and the elevation of the upper surface of the second hole transport layer is higher than the elevation of the upper surface of the first hole transport layer.

[0012] In some embodiments, the organic light-emitting element further includes a spacer structure located on the substrate and between the first organic light-emitting layer and the second organic light-emitting layer, wherein the vertical distance between the elevation of the upper surface of the second hole transport layer and the elevation of the upper surface of the spacer structure is less than the vertical distance between the elevation of the upper surface of the first hole transport layer and the elevation of the upper surface of the spacer structure.

[0013] In some embodiments, the organic light-emitting element further includes a spacer structure located on a substrate and partially covering the first electrode, wherein a first edge of the second hole transport layer and a second edge relative to the first edge are located on the spacer structure and at different elevations.

[0014] In some embodiments, the organic light-emitting element further includes a spacer structure located on a substrate and between a first organic light-emitting layer and a second organic light-emitting layer, wherein the first hole transport layer and the second hole transport layer partially cover the spacer structure, and the extension length of the second hole transport layer on the spacer structure is greater than the extension length of the first hole transport layer on the spacer structure.

[0015] In some embodiments, the organic light-emitting element further includes a third electrode and a third organic light-emitting layer. The third electrode is located on a substrate. The third organic light-emitting layer is located on the third electrode and includes a third hole transport layer, wherein the elevation of the upper surface of the second hole transport layer is higher than the elevation of the upper surface of the third hole transport layer.

[0016] In some embodiments, the difference between the thickness of the second organic light-emitting layer and the thickness of the first organic light-emitting layer is greater than 700 angstroms and less than 1500 angstroms.

[0017] In some embodiments, the difference between the thickness of the second organic light-emitting layer and the thickness of the first organic light-emitting layer is greater than 700 angstroms and less than 1000 angstroms.

[0018] In some embodiments, the first organic light-emitting layer includes an electron transport layer and a hole injection layer, the electron transport layer comprising an organic barrier material, and the hole injection layer comprising a transition metal oxide.

[0019] In some embodiments, the organic light-emitting element further includes a top electrode, an inorganic barrier layer, and a capping layer. The top electrode is located above the first organic light-emitting layer, the inorganic barrier layer covers the top electrode, and the capping layer is located on the inorganic barrier layer and separated from the top electrode through the inorganic barrier layer.

[0020] In some embodiments, the method of fabricating an organic light-emitting element further includes: forming a spacer structure on a substrate and partially covering a first electrode, wherein a first organic light-emitting layer and a second organic light-emitting layer partially cover the spacer structure; and forming a top electrode layer on the spacer structure, the first organic light-emitting layer, and the second organic light-emitting layer.

[0021] In some embodiments, forming a first organic light-emitting layer includes forming a first hole transport layer on a first electrode; and forming a second organic light-emitting layer includes forming a second hole transport layer on a second electrode, such that the difference between the thickness of the second hole transport layer and the thickness of the first hole transport layer is greater than 300 angstroms and less than 1000 angstroms.

[0022] In some embodiments, forming a first organic light-emitting layer includes: forming a first hole transport layer on a first electrode; and forming a first organic emission layer on the first hole transport layer; and forming a second organic light-emitting layer includes: forming a second hole transport layer on a second electrode; and forming a second organic emission layer on the second hole transport layer, such that the difference between the thickness of the second hole transport layer and the thickness of the first hole transport layer is greater than the difference between the thickness of the second organic emission layer and the thickness of the first organic emission layer. Attached Figure Description

[0023] Figure 1 This is a top view illustrating the intermediate products of an organic light-emitting element.

[0024] Figure 2 For example, along Figure 1 A cross-sectional view of line A-A' in the diagram.

[0025] Figure 2A For example Figure 2 A cross-sectional view of the organic light-emitting unit in the image.

[0026] Figure 2B For example Figure 2 A cross-sectional view of the organic light-emitting unit in the image.

[0027] Figure 2C For example Figure 2 A cross-sectional view of the organic light-emitting unit in the image.

[0028] Figures 3A to 3R The illustration depicts a method for fabricating an organic light-emitting element according to some embodiments.

[0029] Figure 4 For example, along Figure 1 A cross-sectional view of line A-A' in the diagram.

[0030] Figure 4A For example Figure 4 A cross-sectional view of the organic light-emitting unit in the image.

[0031] Figure 4B For example Figure 4 A cross-sectional view of the organic light-emitting unit in the image.

[0032] Figure 4C For example Figure 4 A cross-sectional view of the organic light-emitting unit in the image. Detailed Implementation

[0033] Figure 1 This is a top view illustrating an intermediate product of an organic light-emitting element 10. The organic light-emitting element 10 has a light-emitting layer 20 and a capping layer 40 located above the light-emitting layer 20. For the light-emitting layer 20, a spacer structure 30 may be designed to provide an array of recesses for accommodating an array of light-emitting pixels. In some embodiments, the spacer structure 30 may include bumps 310. In some embodiments, the spacer structure 30 may include a photosensitizing material.

[0034] Figure 2 For example, along Figure 1 A cross-sectional view of line A-A' in the diagram. Figure 2A For example Figure 2 A cross-sectional view of the organic light-emitting unit 101 in the image. Figure 2B For example Figure 2 A cross-sectional view of the organic light-emitting unit 102 in the image. Figure 2C For example Figure 2 A cross-sectional view of the organic light-emitting unit 103. In some embodiments, Figure 2 For example, along Figure 1 The diagram shows a cross-sectional view along line A-A', illustrating only the light-emitting area. The spacer structure 30 has several protrusions 310 to define the light-emitting pixel pattern. Recesses are located between two adjacent protrusions 310 and provide space to accommodate the light-emitting pixels. Those skilled in the art will understand from... Figure 2 , Figure 2A , Figure 2B and Figure 2C From the cross-sectional view, protrusion 310 is drawn as a broken section, but from... Figure 1 As can be seen from the top view, they can be connected to each other via other parts of the spacer structure 30.

[0035] likeFigure 2 As shown, in some embodiments, the organic light-emitting element 10 is, for example, a light-emitting element comprising an organic light-emitting diode (OLED) structure. In some embodiments, the organic light-emitting element 10 comprises a plurality of organic light-emitting units (or light-emitting pixels), such as at least organic light-emitting unit 101 (or first organic light-emitting unit), organic light-emitting unit 102 (or second organic light-emitting unit), and organic light-emitting unit 103 (or third organic light-emitting unit). In some embodiments, organic light-emitting units 101, 102, and 103 are located between bumps 310 and above substrate 100. Organic light-emitting units 101, 102, and 103 may emit light of the same wavelength or light of different wavelengths.

[0036] In some embodiments, the organic light-emitting element 10 includes a substrate 100, an electrode 215 (or a first electrode), an electrode 225 (or a second electrode), an electrode 235 (or a third electrode), an electrode 216 (or a top electrode or a common electrode), a light-emitting layer 20, a spacer structure 30, and a cover layer 40.

[0037] In some embodiments, substrate 100 may include a transistor array configured to correspond to light-emitting pixels in light-emitting layer 20. Substrate 100 may include a plurality of capacitors. In some embodiments, more than one transistor is configured to form a circuit with a capacitor and a light-emitting pixel. In some embodiments, substrate 100 may include glass.

[0038] In some embodiments, electrodes 215, 225, and 235 are located on substrate 100. In some embodiments, electrodes 215, 225, and 235 are anodes. In some embodiments, electrodes 215, 225, and 235 comprise metallic materials, such as Ag, Al, Mg, Au, AlCu alloys, AgMo alloys, etc. In some embodiments, electrodes 215, 225, and 235 comprise indium tin oxide (ITO), indium zinc oxide (IZO), or other suitable materials.

[0039] In some embodiments, the light-emitting layer 20 includes an organic light-emitting layer 260A (or a first organic light-emitting layer), an organic light-emitting layer 260B (or a second organic light-emitting layer), and an organic light-emitting layer 260C (or a third organic light-emitting layer). In some embodiments, the organic light-emitting layer 260A is located on the electrode 215, the organic light-emitting layer 260B is located on the electrode 225, and the organic light-emitting layer 260C is located on the electrode 235.

[0040] In some embodiments, the thicknesses T1 of organic light-emitting layer 260A, T2 of organic light-emitting layer 260B, and T3 of organic light-emitting layer 260C are all different from each other. The difference between the thickness T2 of organic light-emitting layer 260B and the thickness T1 of organic light-emitting layer 260A is greater than [amount missing]. Less than 1500 angstroms, greater than The thickness T2 of the organic light-emitting layer 260B is greater than 1500 angstroms, greater than 600 angstroms to less than 1300 angstroms, or greater than 700 angstroms to less than 1000 angstroms. The difference between the thickness T2 of the organic light-emitting layer 260B and the thickness T3 of the organic light-emitting layer 260C is greater than 800 angstroms to less than 1800 angstroms, greater than 900 angstroms to less than 1600 angstroms, or greater than 1000 angstroms to less than 1400 angstroms. In some embodiments, the thickness T2 of the organic light-emitting layer 260B is greater than the thickness T1 of the organic light-emitting layer 260A, and the thickness T1 of the organic light-emitting layer 260A is greater than the thickness T3 of the organic light-emitting layer 260C.

[0041] In some embodiments, when the difference between the thickness T2 of the organic light-emitting layer 260B and the thickness T1 of the organic light-emitting layer 260A is greater than 1500 angstroms, the organic light-emitting layer 260B protrudes more than the upper surface of the entire light-emitting layer 20. The encapsulation layer 420 above the organic light-emitting layer 260B may exert relatively large stress on a local area above the organic light-emitting layer 260B, making the electrode 216 above the organic light-emitting layer 260B prone to breakage due to the stress caused by the compression between the encapsulation layer 420 and the organic light-emitting layer 260B. In some embodiments, when the emission wavelength of the organic light-emitting layer 260B is greater than the emission wavelength of the organic light-emitting layer 260A and the difference between the thickness T2 of the organic light-emitting layer 260B and the thickness T1 of the organic light-emitting layer 260A is less than 500 angstroms, the thickness T2 of the organic light-emitting layer 260B or the thickness T1 of the organic light-emitting layer 260A may not provide a good microcavity structure, thus causing the luminous brightness or chromaticity of the organic light-emitting component to be lower than expected.

[0042] According to some embodiments disclosed herein, the difference between the thickness T2 of the organic light-emitting layer 260B and the thickness T1 of the organic light-emitting layer 260A is specifically designed to be greater than 500 angstroms and less than 1500 angstroms, greater than... The range of light intensity is from less than 1500 angstroms, greater than 600 angstroms to less than 1300 angstroms, or greater than 700 angstroms to less than 1000 angstroms, which allows the organic light-emitting element 10 to not only still have good brightness and minimal color shift in CIE 1931 coordinates, but also to effectively prevent the electrode 216 from being broken due to compressive stress, thereby improving the reliability of the component.

[0043] In some embodiments, the elevation of the upper surface of the organic light-emitting layer 260B is higher than the elevation of the upper surface of the organic light-emitting layer 260A. In some embodiments, the difference between the elevation of the upper surface of the organic light-emitting layer 260B and the elevation of the upper surface of the organic light-emitting layer 260A is greater than 500 angstroms and less than 1500 angstroms. The elevation ranges from less than 1500 angstroms, from greater than 600 angstroms to less than 1300 angstroms, or from greater than 700 angstroms to less than 1000 angstroms. In some embodiments, the elevation of the upper surface of the organic light-emitting layer 260A is higher than the elevation of the upper surface of the organic light-emitting layer 260C.

[0044] According to some embodiments disclosed herein, the difference between the elevation of the upper surface of the organic light-emitting layer 260B and the elevation of the upper surface of the organic light-emitting layer 260A is specifically designed to be greater than 500 angstroms and less than 1500 angstroms. The pressure ranges from less than 1500 angstroms, greater than 600 angstroms to less than 1300 angstroms, or greater than 700 angstroms to less than 1000 angstroms, so that the organic light-emitting layer 260B does not protrude excessively from the upper surface of the entire light-emitting layer 20. This reduces the stress on the local area above the organic light-emitting layer 260B caused by the encapsulation layer 420. Therefore, it can effectively prevent the electrode 216 above the organic light-emitting layer 260B from breaking due to the stress caused by the compression between the encapsulation layer 420 and the organic light-emitting layer 260B.

[0045] In some embodiments, organic light-emitting layers 260A, 260B, and 260C emit light of the same or different colors. In some embodiments, the emission wavelength of organic light-emitting layer 260B is greater than that of organic light-emitting layer 260A, and the emission wavelength of organic light-emitting layer 260A is greater than that of organic light-emitting layer 260C. In some embodiments, organic light-emitting layer 260A emits green light, organic light-emitting layer 260B emits red light, and organic light-emitting layer 260C emits blue light.

[0046] In some embodiments, the organic material layer of organic light-emitting layers 260A, 260B, and 260C comprises an organic material, which may be disposed in any one of the organic material layers of organic light-emitting layers 260A, 260B, and 260C, depending on the implementation. In some embodiments, the organic material has an absorption rate of greater than or equal to 50% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 60% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 70% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 80% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 90% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 95% for a specific wavelength. In some embodiments, the specific wavelength is not greater than 400 nm. In some embodiments, the specific wavelength is not greater than 350 nm. In some embodiments, the specific wavelength is not greater than 300 nm. In some embodiments, the specific wavelength is not greater than 250 nm. In some embodiments, the specific wavelength is not greater than 200 nm. In some embodiments, the specific wavelength is not greater than 150 nm. In some embodiments, the specific wavelength is not greater than 100 nm.

[0047] like Figure 2A As shown, in some embodiments, the organic light-emitting unit 101 includes an electrode 215 (or a first electrode), an organic light-emitting layer 260A, and an electrode 216 (or a top electrode or a common electrode). In some embodiments, the organic light-emitting layer 260A includes multiple organic material layers, such as a hole injection layer (HIL) 261, a hole transport layer (HTL) 262 (or a first hole transport layer), an electron blocking layer (EBL) 263, an organic emission layer (EM) 264A (or a first organic emission layer), an electron transport layer (ETL) 265 (or a first electron transport layer), and an electron injection layer (EIL) 266. In some embodiments, the electrode 216 is located above the organic light-emitting layer 260A.

[0048] like Figure 2BAs shown, in some embodiments, the organic light-emitting unit 102 includes an electrode 225 (or a second electrode), an organic light-emitting layer 260B, and an electrode 216 (or a top electrode or a common electrode). In some embodiments, the organic light-emitting layer 260B includes multiple organic material layers, such as a hole injection layer (HIL) 261, a hole transport layer (HTL) 262 (or a second hole transport layer), an electron blocking layer (EBL) 263, an organic emission layer (EM) 264B (or a second organic emission layer), a hole blocking layer (HBL) 267, an electron transport layer (ETL) 265 (or a second electron transport layer), and an electron injection layer (EIL) 266. In some embodiments, the electrode 216 is located above the organic light-emitting layer 260B.

[0049] like Figure 2C As shown, in some embodiments, the organic light-emitting unit 103 includes an electrode 235 (or a third electrode), an organic light-emitting layer 260C, and an electrode 216 (or a top electrode or a common electrode). In some embodiments, the organic light-emitting layer 260C includes multiple organic material layers, such as a hole injection layer (HIL) 261, a hole transport layer (HTL) 262 (or a third hole transport layer), an electron blocking layer (EBL) 263, an organic emission layer (EM) 264C (or a third organic emission layer), an electron transport layer (ETL) 265 (or a third electron transport layer), and an electron injection layer (EIL) 266. In some embodiments, the electrode 216 is located above the organic light-emitting layer 260C.

[0050] In some embodiments, the edge E11 and the edge E12 opposite to edge E11 of the hole transport layer 262 of the organic light-emitting layer 260A are located on the spacer structure 30 and at different elevations. Edge E11 is located at elevation H11, and edge E12 is located at elevation H12. In some embodiments, the edge E21 and the edge E22 opposite to edge E21 of the hole transport layer 262 of the organic light-emitting layer 260B are located on the spacer structure 30 and at different elevations. Edge E21 is located at elevation H21, and edge E22 is located at elevation H22. In some embodiments, the edge E31 and the edge E32 opposite to edge E31 of the hole transport layer 262 of the organic light-emitting layer 260C are located on the spacer structure 30 and at substantially the same elevation. Edge E31 is located at elevation H31, and edge E32 is located at elevation H32.

[0051] In some embodiments, the edge E11 of the hole transport layer 262 of the organic light-emitting layer 260A is closer to the organic light-emitting layer 260B than the edge E12, and the elevation H11 of the edge E11 is higher than the elevation H12 of the edge E12.

[0052] According to some embodiments disclosed herein, by configuring the elevation H11 of edge E11 to be higher than the elevation H12 of edge E12, the step difference between the organic light-emitting layer 260B and the bump 310, and between the bump 310 and the organic light-emitting layer 260A, can be reduced. This makes the extension of the organic light-emitting layer 260B to the overall upper surface of the organic light-emitting layer 260A through the bump 310 more gradual, thereby reducing the protrusion of the bump 310 and preventing the bump 310 from excessively protruding from the upper surface of the entire light-emitting layer 20. Therefore, the stress exerted by the encapsulation layer 420 on the local area above the bump 310 can be reduced, effectively preventing the electrode 216 above the bump 310 from breaking due to the stress caused by the compression between the encapsulation layer 420 and the bump 310.

[0053] In some embodiments, the hole transport layer 262 of organic light-emitting layer 260A, the hole transport layer 262 of organic light-emitting layer 260B, and the hole transport layer 262 of organic light-emitting layer 260C all partially cover the spacer structure 30. In some embodiments, the extension length L1 of the hole transport layer 262 of organic light-emitting layer 260B on the spacer structure 30 is greater than the extension length L1 of the hole transport layer 262 of organic light-emitting layer 260A on the spacer structure 30. In some embodiments, the extension length L3 of the hole transport layer 262 of organic light-emitting layer 260A on the spacer structure 30 is greater than the extension length L4 of the hole transport layer 262 of organic light-emitting layer 260C on the spacer structure 30.

[0054] In some embodiments, the thickness T22 of the hole transport layer 262 of the organic light-emitting layer 260B is greater than the thickness T12 of the hole transport layer 262 of the organic light-emitting layer 260A, and the thickness T12 of the hole transport layer 262 of the organic light-emitting layer 260A is greater than the thickness T32 of the hole transport layer 262 of the organic light-emitting layer 260C. In some embodiments, the difference between the thickness T22 of the hole transport layer 262 of the organic light-emitting layer 260B and the thickness T12 of the hole transport layer 262 of the organic light-emitting layer 260A is greater than 300 angstroms and less than 1000 angstroms, greater than 350 angstroms and less than 800 angstroms, or greater than 400 angstroms and less than 600 angstroms. In some embodiments, the difference between the thickness T22 of the hole transport layer 262 of the organic light-emitting layer 260B and the thickness T32 of the hole transport layer 262 of the organic light-emitting layer 260C is greater than 500 angstroms to less than 1500 angstroms, greater than 600 angstroms to less than 1300 angstroms, or greater than 700 angstroms to less than 1200 angstroms.

[0055] In some embodiments, the elevation of the upper surface of the hole transport layer 262 of the organic light-emitting layer 260B is higher than the elevation of the upper surface of the hole transport layer 262 of the organic light-emitting layer 260A. In some embodiments, the elevation of the upper surface of the hole transport layer 262 of the organic light-emitting layer 260B is higher than the elevation of the upper surface of the hole transport layer 262 of the organic light-emitting layer 260C.

[0056] In some embodiments, the thickness T24 of organic emitting layer 264B is greater than the thickness T14 of organic emitting layer 264A, and the thickness T14 of organic emitting layer 264A is greater than the thickness T34 of organic emitting layer 264C. In some embodiments, the difference between the thickness T24 of organic emitting layer 264B and the thickness T14 of organic emitting layer 264A is greater than 50 angstroms and less than 400 angstroms, greater than 80 angstroms and less than 300 angstroms, or greater than 100 angstroms and less than 200 angstroms. In some embodiments, the difference between the thickness T24 of organic emitting layer 264B and the thickness T34 of organic emitting layer 264C is greater than 80 angstroms and less than 600 angstroms, greater than 100 angstroms and less than 500 angstroms, or greater than 150 angstroms and less than 300 angstroms.

[0057] In some embodiments, the thickness T25 of the electron transport layer 265 of the organic light-emitting layer 260B is greater than the thickness T15 of the electron transport layer 265 of the organic light-emitting layer 260A and the thickness T35 of the electron transport layer 265 of the organic light-emitting layer 260C. In some embodiments, the difference between the thickness T25 of the electron transport layer 265 of the organic light-emitting layer 260B and the thickness T15 of the electron transport layer 265 of the organic light-emitting layer 260A is greater than 50 Å and less than 300 Å, greater than 70 Å and less than 200 Å, or greater than 90 Å and less than 150 Å. In some embodiments, the difference between the thickness T25 of the electron transport layer 265 of the organic light-emitting layer 260B and the thickness T35 of the electron transport layer 265 of the organic light-emitting layer 260C is greater than 50 Å and less than 300 Å, greater than 70 Å and less than 200 Å, or greater than 90 Å and less than 150 Å.

[0058] In some embodiments, by adjusting the thickness of the hole transport layer 262, the thicknesses of the organic emitting layers 264A, 264B, and 264C, and the thickness of the electron transport layer 265, a predetermined thickness difference between the organic light-emitting layers 260A, 260B, and 260C can be achieved. This avoids the electrode 216 from breaking due to stress caused by the compression between the encapsulation layer 420 and the light-emitting layer 20. According to some embodiments disclosed herein, by primarily adjusting the thickness of the hole transport layer 262 to achieve the predetermined thickness difference between the organic light-emitting layers 260A, 260B, and 260C, the impact of the thicknesses of the organic light-emitting layers 260A, 260B, and 260C on the luminous efficacy of the organic light-emitting element 10 can be further reduced, thereby achieving the technical effect of avoiding electrode breakage while maintaining good luminous efficacy.

[0059] In some embodiments, electrode 216 is in contact with organic light-emitting layers 260A, 260B, and 260C. Electrode 216 may be as follows: Figure 2 The continuous film shown is located above the organic light-emitting layers 260A, 260B, and 260C and the bump 310. In some embodiments, the electrode 216 may be further located on the spacer structure 30. In some embodiments, the electrode 216 is a common electrode for all light-emitting pixels in the light-emitting layer 20. In some embodiments, the electrode 216 comprises a metallic material, such as Ag, Al, Mg, Au, AlCu alloy, AgMo alloy, etc. In some embodiments, the electrode 216 comprises ITO, IZO, or other suitable materials. In other words, the electrode 216 is a common electrode for several organic light-emitting units. In some embodiments, the electrode 216 is a common electrode for all organic light-emitting units in the organic light-emitting element 10.

[0060] In some embodiments, spacer structure 30 is located on substrate 100 and partially covers electrodes 215, 225, and 235. In some embodiments, spacer structure 30 is located between organic light-emitting layers 260A, 260B, and 260C. In some embodiments, spacer structure 30 may include bumps 310. In some embodiments, the pattern of spacer structure 30 is designed according to pixel arrangement. In some embodiments, spacer structure 30 serves as a pixel defined layer (PDL). In some embodiments, bumps 310 define pixel regions. In some embodiments, each bump 310 fills the gap between two adjacent electrodes 215, 225, and 235. Each electrode 215, 225, and 235 is partially covered by bump 310. In some embodiments, spacer structure 30 includes an organic insulating material. In some embodiments, spacer structure 30 includes a photosensitive material. In some embodiments, spacer structure 30 may further include quantum dots, which have excellent light absorption performance. In some embodiments, the spacer structure 30 may further comprise a carbon black material, such as carbon black nanoparticles, carbon black-containing conductive fibers, or the like. In some embodiments, the spacer structure 30 may further comprise a blackbody material having an absorption rate of 90%, 95%, 99%, 99.5%, or 99.9% or higher for visible light.

[0061] In some embodiments, the spacer structure 30 has an absorption rate of 50% or greater than or equal to 50% for a specific wavelength. In some embodiments, the spacer structure 30 has an absorption rate of 60% or greater than or equal to 60% for a specific wavelength. In some embodiments, the spacer structure 30 has an absorption rate of 70% or greater than or equal to 70% for a specific wavelength. In some embodiments, the spacer structure 30 has an absorption rate of 80% or greater than or equal to 80% for a specific wavelength. In some embodiments, the spacer structure 30 has an absorption rate of 90% or greater than or equal to 95% for a specific wavelength. In some embodiments, the specific wavelength is not greater than 400 nm. In some embodiments, the specific wavelength is not greater than 350 nm. In some embodiments, the specific wavelength is not greater than 300 nm. In some embodiments, the specific wavelength is not greater than 250 nm. In some embodiments, the specific wavelength is not greater than 200 nm. In some embodiments, the specific wavelength is not greater than 150 nm. In some embodiments, the specific wavelength is not greater than 100 nm.

[0062] In some embodiments, the vertical distance D1 between the elevation of the upper surface of the hole transport layer 262 of the organic light-emitting layer 260B and the elevation of the upper surface of the spacer structure 300 is less than the vertical distance D2 between the elevation of the upper surface of the hole transport layer 262 of the organic light-emitting layer 260A and the elevation of the upper surface of the spacer structure 300. In some embodiments, the vertical distance D2 between the elevation of the upper surface of the hole transport layer 262 of the organic light-emitting layer 260A and the elevation of the upper surface of the spacer structure 300 is less than the vertical distance D3 between the elevation of the upper surface of the hole transport layer 262 of the organic light-emitting layer 260C and the elevation of the upper surface of the spacer structure 300.

[0063] In some embodiments, the capping layer 40 includes a capping layer 410, an encapsulation layer 420, a filler layer 430, and a cover plate 440. In some embodiments, the capping layer 410 is disposed on the electrode 216 and is substantially conformal to the non-planar upper surface of the electrode 216. The capping layer 410 may comprise a dielectric material or an inorganic insulating material, such as silicon oxide. In some embodiments, the capping layer 410 may comprise a hole transport layer material for extracting light lost inside the organic light-emitting element to increase luminous efficiency. The capping layer 410 may also function as a light extraction layer.

[0064] In some embodiments, the encapsulation layer 420 is disposed on the capping layer 410 and is substantially conformally oriented to the non-planar upper surface of the capping layer 410. The encapsulation layer 420 may comprise an oxide, such as silicon oxide. In some embodiments, the encapsulation layer 420 is substantially conformally oriented to the non-planar upper surface of the capping layer 410 and has a plurality of recesses corresponding to the organic light-emitting layers 260A, 260B, and 260C. In some embodiments, the plurality of recesses of the encapsulation layer 420 are located at different elevations H1, H2, and H3. In some embodiments, elevation H2 is higher than elevation H1, and elevation H1 is higher than elevation H3. In some embodiments, the vertical distance between elevation H2 and elevation H1 is greater than 500 angstroms and less than 1500 angstroms. The elevation ranges from less than 1500 angstroms, from greater than 600 angstroms to less than 1300 angstroms, or from greater than 700 angstroms to less than 1000 angstroms. In some embodiments, the vertical distance between elevations H2 and H3 is greater than 800 angstroms to less than 1800 angstroms, greater than 900 angstroms to less than 1600 angstroms, or greater than 1000 angstroms to less than 1400 angstroms. The encapsulation layer 420 may comprise a polymeric organic material, such as an epoxy-based material.

[0065] In some embodiments, the filler layer 430 is disposed on the encapsulation layer 420, and the lower surface of the filler layer 430 is substantially conformal to the non-planar upper surface of the encapsulation layer 420. The filler layer 430 may also be referred to as a planarization layer. The filler layer 430 may contain a polymeric organic material, such as epoxy resin.

[0066] In some embodiments, a cover plate 440 is disposed on the flat upper surface of the filler layer 430. The cover plate 440 may also be referred to as a protective layer. The cover plate 440 may comprise a transparent rigid cover, such as a glass plate. The cover plate 440 is used to prevent the organic light-emitting element from coming into contact with external moisture, which could cause the element to fail and lose its ability to emit light.

[0067] In the field of organic light-emitting diode (OLED) technology, those skilled in the art generally believe that, based on microcavity simulation results, the optimal brightness performance is achieved when the thickness of each OLED layer is half the wavelength of the emitted light. For example, the thickness of the red OLED layer is designed to be 3125 angstroms (half of 625 nm), the green OLED layer to be 2600 angstroms (half of 520 nm), and the blue OLED layer to be 2350 angstroms (half of 470 nm). However, when the thickness of the red OLED layer is too large, i.e., it protrudes significantly from the upper surface of the entire OLED layer, the encapsulation layer 420 above the OLED layer may exert relatively large stress on a local area above the red OLED layer. This could cause the electrode 216 above the red OLED layer to break due to the stress caused by the compression between the encapsulation layer 420 and the red OLED layer.

[0068] According to some embodiments disclosed herein, the difference between the thickness T2 of the organic light-emitting layer 260B and the thickness T1 of the organic light-emitting layer 260A is specifically designed to be greater than 500 angstroms and less than 1500 angstroms. This ensures that the organic light-emitting element 10 not only still has good brightness and minimal color shift in CIE 1931 coordinates, but also effectively prevents the electrode 216 from being subjected to compressive stress and breaking, thereby improving the reliability of the component.

[0069] Furthermore, according to some embodiments disclosed herein, the difference in elevation between the upper surface of the organic light-emitting layer 260B and the upper surface of the organic light-emitting layer 260A is specifically designed to be greater than 500 angstroms and less than 1500 angstroms. The range is from less than 1500 angstroms, greater than 600 angstroms to less than 1300 angstroms, or greater than 700 angstroms to less than 1000 angstroms. In this way, the protrusion of the upper surface of the organic light-emitting layer 260B can be reduced, thereby effectively preventing the electrode 216 from being subjected to compressive stress and breaking, thus improving the reliability of the component.

[0070] Furthermore, according to some embodiments disclosed herein, the aforementioned difference in elevation or thickness is not limited to a numerical range that can be obtained within a finite range. Rather, it overcomes the inherent technical thinking in the art regarding the fixed design of the thickness of organic light-emitting layers of different emitting colors. Thus, it specifically designs the thickness or elevation relationship between organic light-emitting layers of different emitting colors to obtain unexpected technical effects such as optimal brightness, lowest color deviation, and good reliability and yield.

[0071] Figures 3A to 3R A method for manufacturing an organic light-emitting element 10 according to some embodiments is illustrated.

[0072] like Figure 3A As shown, in some embodiments, a substrate 100 is provided, on which a plurality of electrodes 215, 225, and 235 are disposed, forming a plurality of bumps 310 (or spacer structures 30), each bump 310 filling the gap between adjacent electrodes 215, 225, and 235. Next, in some embodiments, a hole injection layer (HIL) 261 is disposed on the surfaces of the bumps 310 and the electrodes 215, 225, and 235. In some embodiments, the hole injection layer (HIL) 261 is formed by evaporation.

[0073] like Figure 3B As shown, in some embodiments, a buffer layer 301 is provided on the bump 310, and the buffer layer 301 also covers the carrier injection layer 261 and electrodes 215, 225, and 235. The buffer layer 301 is used to prevent moisture from penetrating into the bump 310 and the hole injection layer (HIL) 261. Next, in some embodiments, a photosensitive layer 302 is provided on the buffer layer 301. In some embodiments, the buffer layer 301 and the photosensitive layer 302 are formed by coating.

[0074] like Figure 3C As shown, in some embodiments, the photosensitive layer 302 is patterned using a photolithography process to expose a portion of the buffer layer 301 through the groove 312. Then, in some embodiments, a portion of the buffer layer 301 is removed to expose the hole injection layer (HIL) 261 by having a groove 313. In some embodiments, the buffer layer 301 is removed using a wet etching process.

[0075] like Figure 3DAs shown, in some embodiments, a hole transport layer (HTL) 262 is formed on a hole injection layer (HIL) 261, an electron blocking layer (EBL) 263 is formed on the hole transport layer (HTL) 262, an organic emission layer (EM) 264A is formed on the electron blocking layer (EBL) 263, and then an electron transport layer (ETL) 265 is formed on the organic emission layer (EM) 264A. In some embodiments, the hole transport layer (HTL) 262, the electron blocking layer (EBL) 263, the organic emission layer (EM) 264A, and the electron transport layer (ETL) 265 are formed by evaporation.

[0076] like Figure 3E As shown, in some embodiments, the buffer layer 301, the photosensitive layer 302, and a portion of the hole transport layer (HTL) 262, electron blocking layer (EBL) 263, organic emission layer (EM) 264A, and electron transport layer (ETL) 265 above the photosensitive layer 302 are removed. In some embodiments, the buffer layer 301, the photosensitive layer 302, a portion of the hole transport layer (HTL) 262, a portion of the electron blocking layer (EBL) 263, a portion of the organic emission layer (EM) 264A, and a portion of the electron transport layer (ETL) 265 are removed through a wet etching process.

[0077] like Figure 3F As shown, in some embodiments, a buffer layer 303 is provided on the bump 310, and the buffer layer 303 also covers the carrier injection layer 261 and electrodes 215, 225 and 235. Next, in some embodiments, a photosensitive layer 304 is provided on the buffer layer 303.

[0078] like Figure 3G As shown, in some embodiments, the photosensitive layer 304 is patterned using a photolithography process to expose a portion of the buffer layer 303 through the groove 314. Then, in some embodiments, a portion of the buffer layer 303 is removed to expose the hole injection layer (HIL) 261 by having a groove 315. In some embodiments, the buffer layer 303 is removed using a wet etching process.

[0079] like Figure 3H As shown, in some embodiments, a hole transport layer (HTL) 262 is provided on a hole injection layer (HIL) 261, an electron blocking layer (EBL) 263 is provided on a hole transport layer (HTL) 262, an organic emission layer (EM) 264B is provided on an electron blocking layer (EBL) 263, a hole blocking layer (HBL) 267 is provided on an organic emission layer (EM) 264B, and then an electron transport layer (ETL) 265 is provided on a hole blocking layer (HBL) 267.

[0080] like Figure 3IAs shown, in some embodiments, the buffer layer 303, the photosensitive layer 304, and portions of the hole transport layer (HTL) 262, electron blocking layer (EBL) 263, organic emission layer (EM) 264B, hole blocking layer (HBL) 267, and electron transport layer (ETL) 265 above the photosensitive layer 304 are removed. In some embodiments, the buffer layer 301, the photosensitive layer 302, portions of the hole transport layer (HTL) 262, the electron blocking layer (EBL) 263, the organic emission layer (EM) 264B, the hole blocking layer (HBL) 267, and the electron transport layer (ETL) 265 are removed through a wet etching process.

[0081] like Figure 3J As shown, in some embodiments, a buffer layer 305 is provided on the bump 310, and the buffer layer 305 also covers the carrier injection layer 261 and electrodes 215, 225 and 235. Next, in some embodiments, a photosensitive layer 306 is provided on the buffer layer 305.

[0082] like Figure 3K As shown, in some embodiments, the photosensitive layer 306 is patterned using a photolithography process to expose a portion of the buffer layer 305 through the groove 316. Then, in some embodiments, a portion of the buffer layer 305 is removed to expose the hole injection layer (HIL) 261 by having a groove 317. In some embodiments, the buffer layer 305 is removed using a wet etching process.

[0083] like Figure 3L As shown, in some embodiments, a hole transport layer (HTL) 262 is provided on a hole injection layer (HIL) 261, an electron blocking layer (EBL) 263 is provided on the hole transport layer (HTL) 262, an organic emission layer (EM) 264C is provided on the electron blocking layer (EBL) 263, and then an electron transport layer (ETL) 265 is provided on the organic emission layer (EM) 264C.

[0084] like Figure 3MAs shown, in some embodiments, the buffer layer 305, the photosensitive layer 306, and a portion of the hole transport layer (HTL) 262, electron blocking layer (EBL) 263, organic emission layer (EM) 264C, and electron transport layer (ETL) 265 above the photosensitive layer 306 are removed. In some embodiments, the buffer layer 301, the photosensitive layer 302, a portion of the hole transport layer (HTL) 262, a portion of the electron blocking layer (EBL) 263, a portion of the organic emission layer (EM) 264B, and a portion of the electron transport layer (ETL) 265 are removed by a wet etching process. Next, in some embodiments, an electron injection layer (EIL) 266 is formed on the bump 310 and the electron transport layer (ETL) 265. Thus, organic light-emitting layers 260A, 260B, and 260C (or light-emitting layer 20) are formed, and the difference between the thickness T2 of organic light-emitting layer 260B and the thickness T1 of organic light-emitting layer 260A is greater than 500 angstroms and less than 1500 angstroms. The thickness is less than 1500 angstroms, greater than 600 angstroms to less than 1300 angstroms, or greater than 700 angstroms to less than 1000 angstroms. In some embodiments, organic light-emitting layers 260A, 260B, and 260C (or light-emitting layer 20) are formed, and the difference between the thickness T22 of the hole transport layer 262 of the organic light-emitting layer 260B and the thickness T12 of the hole transport layer 262 of the organic light-emitting layer 260A is greater than 300 angstroms to less than 1000 angstroms, greater than 350 angstroms to less than 800 angstroms, or greater than 400 angstroms to less than 600 angstroms. In some embodiments, organic light-emitting layers 260A, 260B, and 260C (or light-emitting layer 20) are formed, and the difference between the thickness T22 of the hole transport layer 262 of the organic light-emitting layer 260B and the thickness T12 of the hole transport layer 262 of the organic light-emitting layer 260A is greater than the difference between the thickness T24 of the organic emission layer 264B and the thickness T14 of the organic emission layer 264A.

[0085] like Figure 3N As shown, in some embodiments, electrodes 216 (or a top electrode layer) are disposed on organic light-emitting layers 260A, 260B, and 260C and spacer structure 30. This forms organic light-emitting units 101, 102, and 103.

[0086] like Figure 3O As shown, in some embodiments, a capping layer 410 is provided on electrode 216. In some embodiments, the capping layer 410 is formed by evaporation.

[0087] like Figure 3P As shown, in some embodiments, an encapsulation layer 420 is provided on the capping layer 410. In some embodiments, the capping layer 410 is formed by vapor deposition.

[0088] like Figure 3QAs shown, in some embodiments, a filler layer 430 is provided on the encapsulation layer 420. In some embodiments, the encapsulation layer 420 is formed by plasma-assisted chemical vapor deposition (PECVD).

[0089] like Figure 3R As shown, in some embodiments, a cover plate 440 is disposed on the filler layer 430. Thus, a cover layer 40 is formed, which includes a cover layer 410, an encapsulation layer 420, a filler layer 430, and a cover plate 440. Figure 3R As shown, this completes the process. Figure 2 , Figure 2A , Figure 2B and Figure 2C The organic light-emitting element 10 is shown.

[0090] Figure 4 Here is a cross-sectional view of an organic light-emitting element 10'. Figure 4A For example Figure 4 A cross-sectional view of the organic light-emitting unit 101 in the image. Figure 4B For example Figure 4 A cross-sectional view of the organic light-emitting unit 102 in the image. Figure 4C For example Figure 4 A cross-sectional view of the organic light-emitting unit 103. In some embodiments, Figure 4 For example, along Figure 1 The cross-sectional view of line A-A' is shown, and only the luminescent area is illustrated. Figure 4 Structure and Figure 2 The structures are similar, but the differences are as follows.

[0091] In some embodiments, the organic light-emitting element 10' further includes an inorganic barrier layer 270. In some embodiments, the inorganic barrier layer 270 covers the electrode 216. In some embodiments, the inorganic barrier layer 268 contacts the capping layer 410. In some embodiments, the capping layer 410 is located on the inorganic barrier layer 270 and is separated from the electrode 216 through the inorganic barrier layer 270. In some embodiments, the inorganic barrier layer 270 substantially completely covers the interface between the electrode 216 and the capping layer 410. In some embodiments, the inorganic barrier layer 270 comprises a transition metal oxide. In some embodiments, the inorganic barrier layer 270 comprises molybdenum oxide (MoO3). In some embodiments, the thickness of the inorganic barrier layer 270 is equal to or less than 50 angstroms. In some embodiments, the ratio of the thickness of the inorganic barrier layer 270 to the thickness of the electrode 216 is less than 0.15, 0.1, or 0.05. In some embodiments, the ratio of the thickness of the inorganic barrier layer 270 to the thickness of the capping layer 410 is less than 0.5, 0.3, or 0.15.

[0092] In some embodiments, the electron transport layer 265 comprises an organic electron transport material and an organic barrier material. The organic electron transport material may be different from the organic barrier material. The organic barrier material may comprise a combination of lithium quinoline (Liq) and phenanthroline compounds. In some embodiments, the phenanthroline compounds comprise 4,7-diphenyl-1,10-phenanthroline (Bphen), 2,9-bis(naphthyl-2-yl)4,7-diphenyl-1,10-phenanthroline (NBphen), 1,3-bis(9-phenyl-1,10-phenanthroline-2-yl)benzene, 1,4-bis(2-phenyl-1,10-phenanthroline-4-yl)benzene (p-bPPhenB) and / or 1,3-bis(2-phenyl-1,10-phenanthroline-4-yl)benzene (m-bPPhenB), or any combination thereof. In some embodiments, the electron transport layer 265 partially contacts the electrode 216. In some embodiments, the hole injection layer 261, hole transport layer 262, electron blocking layer 263 and organic emission layer 264 are separated from the electrode 216 through the electron transport layer 265.

[0093] In some embodiments, organic light-emitting layers 260A, 260B, and 260C each further include an inorganic barrier layer 268. In some embodiments, the inorganic barrier layer 268 is located between electrodes 215, 225, and 235 and organic light-emitting layers 260A, 260B, and 260C. In some embodiments, the side surfaces of the inorganic barrier layer 268 contact bumps 310. In some embodiments, the inorganic barrier layer 268 substantially completely covers the interface between electrodes 215, 225, and 235 and organic light-emitting layers 260A, 260B, and 260C. In some embodiments, the inorganic barrier layer 268 comprises a transition metal oxide. In some embodiments, the inorganic barrier layer 268 comprises molybdenum oxide (MoO3). In some embodiments, the thickness of the inorganic barrier layer 268 is equal to or less than 50 angstroms. In some embodiments, the ratio of the thickness of the inorganic barrier layer 268 to the thickness of electrodes 215, 225, and 235 is less than 0.1, 0.06, or 0.03.

[0094] In some embodiments, the electron injection layer 266 comprises an electron injection material and an inorganic barrier material. The electron injection material may be different from the inorganic barrier material. In some embodiments, the electron injection layer 266 is located between the electron transport layer 265 and the electrode 216. The electron injection layer 266 may comprise lanthanide elements. In some embodiments, the electron injection layer 266 comprises ytterbium (Yb). In some embodiments, the electron injection layer 266 is or comprises a ytterbium metal layer.

[0095] In some embodiments, the inorganic barrier layer 268 and the hole injection layer 261 may together constitute the hole injection layer of the organic light-emitting layers 260A, 260B and 260C.

[0096] According to some embodiments of this disclosure, the inorganic barrier layer 270 can be used to block metal atoms in the electrode 216 from diffusing into the organic layer (e.g., capping layer 410), preventing a decrease in luminous efficiency, thereby improving the luminous brightness and color rendering index (RA) of the organic light-emitting element. Furthermore, according to some embodiments of this disclosure, the inorganic barrier layer 270 has a very thin thickness relative to the electrode 216 and capping layer 410, thus not significantly increasing the thickness of the organic light-emitting element, nor adversely increasing the light-emitting path.

[0097] According to some embodiments disclosed herein, the organic barrier material in the electron transport layer 265 can be used to block the diffusion of metal atoms in the electrode 216 into the organic light-emitting layers 260A, 260B and 260C (e.g., hole injection layer 261, hole transport layer 262, electron blocking layer 263 and organic emission layer 264), thereby preventing quenching and thus avoiding a decrease in luminous efficiency. This can further improve the luminous brightness of the organic light-emitting element and improve its color rendering index (RA).

[0098] According to some embodiments disclosed herein, the organic barrier material in the electron transport layer 265, combined with the inorganic barrier material in the electron injection layer 266, through the combination and complementarity of the different barrier properties of the organic and inorganic barrier materials, can further effectively block the diffusion of metal atoms in the electrode 216 into the organic light-emitting layers 260A, 260B, and 260C (e.g., hole injection layer 261, hole transport layer 262, electron blocking layer 263, and organic emission layer 264), thus preventing quenching and avoiding a decrease in luminous efficiency. This, in turn, can improve the luminous brightness of the organic light-emitting element and enhance its color rendering index (RA).

[0099] According to some embodiments of this disclosure, the inorganic barrier layer 268 can be used to block metal atoms in the electrode 215 from diffusing into the organic light-emitting layers 260A, 260B, and 260C (e.g., hole injection layer 261, hole transport layer 262, electron blocking layer 263, and organic emitting layer 264), preventing quenching and thus avoiding a decrease in luminous efficiency. This, in turn, can improve the luminous brightness and color rendering index (RA) of the organic light-emitting element. Furthermore, according to some embodiments of this disclosure, the inorganic barrier layer 268 has a very thin thickness relative to the electrodes 215, 225, and 235, so it does not significantly increase the thickness of the organic light-emitting element, nor does it adversely lengthen the light-emitting path.

[0100] According to some embodiments disclosed herein, the organic light-emitting element 10' includes inorganic barrier layers 268 and 270, an electron transport layer 265 comprising an organic barrier material, and an electron injection layer 266 comprising lanthanide elements. Therefore, through the above structural combination, the diffusion of metal atoms from electrodes 215, 225, 235, and 216 into the organic light-emitting layers 260A, 260B, and 260C (e.g., hole injection layer 261, hole transport layer 262, electron blocking layer 263, and organic emitting layer 264) can be effectively prevented, avoiding quenching and thus preventing a decrease in luminous efficiency, thereby improving the luminous brightness of the organic light-emitting element.

[0101] Furthermore, according to some embodiments disclosed herein, the electron injection layer 266 comprises Yb and the electron transport layer 265 comprises an organic barrier material consisting of a combination of lithium quinoline (Liq) and phenanthroline compounds (e.g., p-bPPhenB). Therefore, even if the electron transport layer 265 is only partially covered by the electron injection layer 266 and partially contacts the electrode 216, its excellent barrier capability can still effectively prevent metal atoms in the electrode 216 from diffusing into the organic light-emitting layers 260A, 260B, and 260C, thereby effectively improving the luminous brightness and color rendering index (RA) of the organic light-emitting element.

[0102] The foregoing outlines some features of the embodiments, thus enabling those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art should understand that this disclosure can be readily used as a basis for designing or modifying other processes and structures to achieve the same purpose and / or the same advantages as the embodiments described in this application. Those skilled in the art should also understand that this equivalent architecture does not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of this disclosure.

[0103] Symbol Explanation

[0104] 10 Organic light-emitting elements

[0105] 20 Organic light-emitting layer

[0106] 30 Spacer Structure

[0107] 40 Covering layer

[0108] 100 substrates

[0109] 101 Organic Light Emitting Unit

[0110] 102 Organic Light Emitting Units

[0111] 103 Organic Light Emitting Units

[0112] 215 electrode

[0113] 216 electrode

[0114] 225 electrode

[0115] 235 electrode

[0116] 260A Organic Light Emitting Layer

[0117] 260B Organic Light Emitting Layer

[0118] 260C Organic Light Emitting Layer

[0119] 261 Hole Injection Layer

[0120] 262 Hole Transport Layer

[0121] 263 Electron blocking layer

[0122] 264A Organic Emitting Layer

[0123] 264B Organic Emitter Layer

[0124] 264C Organic Emitter Layer

[0125] 265 Electron Transport Layer

[0126] 266 Electron Injection Layer

[0127] 267 Cavity Barrier Layer

[0128] 268 Inorganic barrier layer

[0129] 240 Inorganic barrier layer

[0130] 310 bump

[0131] 301 Buffer Layer

[0132] 302 Photosensitive Layer

[0133] 303 Buffer Layer

[0134] 304 photosensitive layer

[0135] 312 Groove

[0136] 313 Groove

[0137] 314 Groove

[0138] 315 Groove

[0139] 316 Groove

[0140] 317 Groove

[0141] 410 cap layer

[0142] 420 encapsulation layer

[0143] 430 fill layer

[0144] 440 cover plate

[0145] A-A' line

[0146] D1 Vertical distance

[0147] D2 Vertical Distance

[0148] D3 Vertical Distance

[0149] E11 edge

[0150] E12 edge

[0151] E21 Edge

[0152] E22 edge

[0153] E31 Edge

[0154] E32 edge

[0155] H1 Elevation

[0156] H2 Elevation

[0157] H3 Elevation

[0158] H11 Elevation

[0159] H12 Elevation

[0160] H21 Elevation

[0161] H22 Elevation

[0162] H31 Elevation

[0163] H32 Elevation

[0164] L1 extension length

[0165] L2 extension length

[0166] L3 extension length

[0167] L4 extension length

[0168] T1 thickness

[0169] T2 thickness

[0170] T3 thickness

[0171] T12 thickness

[0172] T14 thickness

[0173] T15 thickness

[0174] T22 thickness

[0175] T24 thickness

[0176] T25 thickness

[0177] T32 thickness

[0178] T34 thickness

[0179] T35 thickness

Claims

1. An organic light emitting element comprising: a substrate; a first electrode and a second electrode on the substrate; a first organic light emitting layer on the first electrode; and a second organic light emitting layer on the second electrode; wherein a difference between a thickness of the second organic light emitting layer and a thickness of the first organic light emitting layer is greater than 500 angstroms to less than 1500 angstroms.

2. The organic light emitting element of claim 1, further comprising: a third electrode on the substrate; and a third organic light emitting layer on the third electrode; wherein a difference between the thickness of the second organic light emitting layer and a thickness of the third organic light emitting layer is greater than 800 angstroms to less than 1800 angstroms.

3. The organic light emitting element of claim 2, wherein a light emitting wavelength of the second organic light emitting layer is greater than a light emitting wavelength of the first organic light emitting layer, and the light emitting wavelength of the first organic light emitting layer is greater than a light emitting wavelength of the third organic light emitting layer.

4. The organic light emitting element of claim 2, wherein the thickness of the second organic light emitting layer is greater than the thickness of the first organic light emitting layer, and the thickness of the first organic light emitting layer is greater than the thickness of the third organic light emitting layer.

5. The organic light emitting element of claim 2, wherein the first organic light emitting layer comprises a first hole transport layer, the second organic light emitting layer comprises a second hole transport layer, the third organic light emitting layer comprises a third hole transport layer, a thickness of the second hole transport layer is greater than a thickness of the first hole transport layer, and the thickness of the first hole transport layer is greater than a thickness of the third hole transport layer.

6. The organic light emitting element of claim 2, wherein the first organic light emitting layer comprises a first electron transport layer, the second organic light emitting layer comprises a second electron transport layer, the third organic light emitting layer comprises a third electron transport layer, and a thickness of the second electron transport layer is greater than a thickness of the first electron transport layer and a thickness of the third electron transport layer.

7. The organic light emitting element of claim 1, wherein the first organic light emitting layer comprises a first hole transport layer, the second organic light emitting layer comprises a second hole transport layer, and a difference between a thickness of the second hole transport layer and a thickness of the first hole transport layer is greater than 300 angstroms to less than 1000 angstroms.

8. The organic light emitting element of claim 1, wherein the first organic light emitting layer comprises a first hole transport layer, the second organic light emitting layer comprises a second hole transport layer, and an elevation of an upper surface of the second hole transport layer is higher than an elevation of an upper surface of the first hole transport layer.

9. The organic light emitting element of claim 8, further comprising: a spacer structure on the substrate and between the first organic light emitting layer and the second organic light emitting layer, wherein a vertical distance between the elevation of the upper surface of the second hole transport layer and an elevation of an upper surface of the spacer structure is less than a vertical distance between the elevation of the upper surface of the first hole transport layer and the elevation of the upper surface of the spacer structure. ​ ​ 10. The organic light emitting device of claim 8, further comprising: a spacer structure on the substrate and partially covering the first electrode, wherein a first edge of the second hole transport layer and a second edge opposite the first edge are on the spacer structure and at different elevations.

11. The organic light emitting device of claim 8, further comprising: a spacer structure on the substrate and between the first organic light emitting layer and the second organic light emitting layer, wherein the first hole transport layer and the second hole transport layer partially cover the spacer structure, and the second hole transport layer extends further over the spacer structure than the first hole transport layer.

12. The organic light emitting device of claim 8, further comprising: a third electrode on the substrate; and a third organic light emitting layer on the third electrode and comprising a third hole transport layer, wherein the elevation of the upper surface of the second hole transport layer is higher than the elevation of an upper surface of the third hole transport layer.

13. The organic light emitting device of claim 1, wherein the difference between the thickness of the second organic light emitting layer and the thickness of the first organic light emitting layer is greater than 700 Angstroms to less than 1500 Angstroms.

14. The organic light emitting device of claim 13, wherein the difference between the thickness of the second organic light emitting layer and the thickness of the first organic light emitting layer is greater than 700 Angstroms to less than 1000 Angstroms.

15. The organic light emitting device of claim 1, wherein the first organic light emitting layer comprises an electron transport layer comprising an organic barrier material and a hole injection layer comprising an over-metal oxide.

16. The organic light emitting device of claim 15, further comprising: a top electrode over the first organic light emitting layer; an inorganic barrier layer covering the top electrode; and a cap layer on the inorganic barrier layer and separated from the top electrode by the inorganic barrier layer.

17. A method of making an organic light emitting device, comprising: providing a substrate; disposing a first electrode and a second electrode on the substrate; forming a first organic light emitting layer on the first electrode; and forming a second organic light emitting layer on the second electrode such that the difference between the thickness of the second organic light emitting layer and the thickness of the first organic light emitting layer is greater than 500 Angstroms to less than 1500 Angstroms.

18. The method of claim 17, further comprising: forming a spacer structure on the substrate and partially covering the first electrode, wherein the first organic light emitting layer and the second organic light emitting layer partially cover the spacer structure; and forming a top electrode layer on the spacer structure, the first organic light emitting layer, and the second organic light emitting layer.

19. The method of claim 17, wherein forming the first organic light emitting layer comprises: forming a first hole transport layer on the first electrode; and forming the second organic light emitting layer comprises: ​ ​ ​ ​ forming a second hole transport layer over the second electrode such that a difference between a thickness of the second hole transport layer and a thickness of the first hole transport layer is greater than 300 Angstroms to less than 1000 Angstroms.

20. The manufacturing method of claim 17, wherein forming the first organic emissive layer comprises: forming a first hole transport layer over the first electrode; and forming a first organic emissive layer over the first hole transport layer; and forming the second organic emissive layer comprises: forming a second hole transport layer over the second electrode; and forming a second organic emissive layer over the second hole transport layer such that a difference between a thickness of the second hole transport layer and a thickness of the first hole transport layer is greater than a difference between a thickness of the second organic emissive layer and a thickness of the first organic emissive layer.

Images