Gate valve, gate valve control mechanism, control method thereof, and semiconductor manufacturing apparatus

Abstract

The invention provides a technology for accelerating opening and closing of a gate valve and preventing generation of particles. The gate valve control mechanism (40) opens and closes the gate valve (41) by moving the valve body (46) in an L-shaped motion by a single stroke of the cylinder (50). The control unit (43) controls the voltage applied to the piezoelectric element valves (64-67) of the flow rate adjustment means (42) so that the amount of air in the cylinder (50) becomes smaller at the tip of the valve closing stroke of the cylinder (50).

Description

Technical Field

[0001] This invention relates to gate valves, gate valve control mechanisms, control methods thereof, and semiconductor manufacturing apparatus. Background Technology

[0002] In the manufacturing of wafers in a semiconductor manufacturing apparatus, various processes, such as wafer gas processing, are performed. In such wafer manufacturing, the wafer transported from the transport section is housed in the processing section, and the transport section and the processing section are hermetically disconnected. Among the techniques used to disconnect the connection between the transport section and the processing section, a gate valve is known that uses a combination of a cylinder and a cam mechanism to cause the valve body to move in an L-shape relative to the valve seat and separate (see Patent Documents 1 and 2).

[0003] Existing technical documents

[0004] Patent documents Patent Document 1: Japanese Patent Application Publication No. 2020-56498 Patent document 2: Japanese Patent Application Publication No. 2021-71186. Summary of the Invention

[0005] The problem that the invention aims to solve From the perspective of improving the productivity of semiconductor manufacturing, it is necessary to accelerate the opening and closing of gate valves. On the other hand, if the opening and closing of gate valves is accelerated, foreign matter, known as particles, may be introduced into the semiconductor manufacturing atmosphere when the gate valve is closed, reducing the yield of semiconductor products. Thus, in the existing technology, there is room for research from the perspective of accelerating the opening and closing of gate valves while preventing particle generation.

[0006] One aspect of the present invention aims to provide a technique for accelerating the opening and closing of gate valves and preventing particle generation.

[0007] Methods for solving problems To address the aforementioned issues, one aspect of the present invention provides a gate valve having a fluid cylinder that allows the valve body to engage and disengage relative to a valve seat, and configured such that the valve body moves in an L-shaped motion via a single stroke of the fluid cylinder, wherein the amount of fluid in the fluid cylinder is controlled such that the moving speed of the valve body is decelerated at least at the end of the L-shaped motion.

[0008] To address the aforementioned issues, one aspect of the gate valve control mechanism of the present invention includes: a gate valve having a fluid cylinder that allows a valve body to engage and disengage relative to a valve seat, and configured to move the valve body in an L-shaped motion via a single stroke of the fluid cylinder; a piezoelectric valve or polymer actuator that controls the amount of fluid in the fluid cylinder by opening or closing one or both of a supply flow path for fluid supplied to the fluid cylinder and a discharge flow path for fluid discharged from the fluid cylinder through the application of voltage; and a control unit that controls the voltage applied to the piezoelectric valve or the polymer actuator such that the amount of fluid in the fluid cylinder decreases at least at the end of the valve closing stroke of the fluid cylinder that engages the valve body with the valve seat.

[0009] To address the aforementioned issues, one aspect of the present invention provides a gate valve control method that controls the gate valve control mechanism by controlling the voltage applied to the piezoelectric element valve or the polymer actuator, such that the amount of fluid in the fluid cylinder decreases at least when the fluid cylinder reaches the end of its valve closing stroke.

[0010] To address the aforementioned issues, a semiconductor manufacturing apparatus according to one aspect of the present invention includes: a transport unit for transporting wafers for semiconductor products; a processing unit for processing the wafers transported from the transport unit; a gate valve for connecting or disconnecting the transport unit and the processing unit; and a processing control unit for controlling the operation of the transport unit, the processing unit, and the gate valve to perform the wafer processing. The gate valve has a fluid cylinder that allows a valve body to engage and disengage relative to a valve seat, and is configured such that the valve body moves in an L-shaped motion by a single stroke of the fluid cylinder. The amount of fluid in the fluid cylinder is controlled such that the moving speed of the valve body can be reduced at least at the end of the L-shaped motion.

[0011] Invention Effects According to one aspect of the present invention, a technique can be provided to accelerate the opening and closing of gate valves and prevent particle generation. Attached Figure Description

[0012] Figure 1 This is a schematic diagram illustrating the configuration of a semiconductor manufacturing apparatus according to one embodiment of the present invention.

[0013] Figure 2 This is a schematic front view showing the configuration of a gate valve control mechanism according to an embodiment of the present invention when the valve is open.

[0014] Figure 3 It is a schematic representation Figure 2 The side view of the gate valve configuration in the gate valve control mechanism shown is when the valve is open.

[0015] Figure 4This is a schematic diagram illustrating the configuration of a flow adjustment unit in one embodiment of the present invention.

[0016] Figure 5 It is a schematic representation Figure 2 The diagram shows a front view of the gate valve in the middle of its closed state.

[0017] Figure 6 It is a schematic representation Figure 5 The diagram shows a side view of the gate valve in the middle of its closed state.

[0018] Figure 7 It is a schematic representation Figure 2 The diagram shows a front view of the gate valve when it is closed.

[0019] Figure 8 It is a schematic representation Figure 2 The diagram shows a side view of the gate valve when it is closed.

[0020] Figure 9 This is a flowchart illustrating the control process of a gate valve according to one embodiment of the present invention.

[0021] Figure 10 This is a diagram schematically illustrating the movement distance and speed of the valve body during the valve closing stroke of a gate valve according to an embodiment of the present invention.

[0022] Figure 11 This is a schematic diagram illustrating the movement distance and speed of the valve body during the valve opening stroke of a gate valve according to an embodiment of the present invention.

[0023] Figure 12 This is a diagram schematically illustrating the relationship between the moving speed of the valve body and the amount of particles generated during the L-shaped motion when the valve is closed in one embodiment of the present invention.

[0024] Invention Embodiments [Semiconductor manufacturing equipment] Figure 1 This is a schematic diagram illustrating the configuration of the semiconductor manufacturing apparatus according to this embodiment. Figure 1 As shown, the semiconductor manufacturing apparatus 1 includes a transport section 10, a processing section 20, a housing section 30, and a gate valve control mechanism 40. The transport section 10, the processing section 20, and the housing section 30 are all chambers that can be airtightly sealed via the gate valve control mechanism 40.

[0025] The transport section 10 transports wafers 100 for semiconductor products from the receiving section 30 to the processing section 20, and between the processing sections 20. The transport section 10 has a transport stage 11 and guide rails 12 that guide the transport stage 11 to the receiving section 30 or the processing section 20. The processing section 20 processes the wafers 100 transported from the transport section. For example, the processing section 20 performs specific processes on the wafers 100, such as surface treatment using gas, as defined for each processing section 20. The receiving section 30 receives the unprocessed wafers 100 that have been moved to the processing section 20.

[0026] [Gate valve control mechanism] Figure 2 This is a schematic front view showing the configuration of a gate valve control mechanism according to an embodiment of the present invention when the valve is open. Additionally, Figure 3 It is shown schematically. Figure 2 The diagram shows a side view of the gate valve in the gate valve control mechanism when it is open. Furthermore, in this embodiment, the axial direction of the gate valve opening (slit 441) is designated as the X direction, the width direction of the gate valve (the direction of the long side of slit 441) is designated as the Y direction, and the height direction of the gate valve (the direction of the short side of slit 441) is designated as the Z direction. Figure 2 As shown, the gate valve control mechanism 40 includes a gate valve 41, a flow adjustment unit 42, and a control unit 43.

[0027] [gate] The gate valve 41 has a cylinder that engages and disengages the valve body relative to the valve seat, and is configured to move the valve body in an L-shaped motion via a single stroke of the cylinder. "L-shaped motion" refers to the action described in Patent Documents 1 and 2, where the valve body approaches and disengages from the valve seat in a direction along the valve seat's axis (e.g., along the axial direction or inclined relative to the axial direction) near the valve seat, and otherwise moves in a direction intersecting that axis. In other words, the "L-shaped motion" widely used in valves for semiconductor manufacturing devices mainly falls into two types: tilting and lifting relative to the axial direction (moving in both the X and Z directions); and single-stroke movement without separating vertical and horizontal actions via a cam mechanism or similar means. In this embodiment, "L-shaped motion" refers to both types of actions collectively, and may refer to one or both.

[0028] like Figure 2 as well as Figure 3 As shown, the gate valve 41 has a drive portion 45 for driving the valve body 46 and a body 44 integrally disposed on the upper part of the drive portion 45.

[0029] The body 44 is a generally rectangular frame with a slit 441. The slit 441 is an opening with a generally rectangular shape having the Y direction as the long side and the Z direction as the short side. In addition, the body 44 has another slit opposite to the slit 441.

[0030] The drive unit 45 includes a valve body 46, a valve stem 47, a spring 48, and a base plate 49. The valve body 46 is a rectangular plate-shaped member that abuts against the periphery (valve seat) of the slit 441 in the main body 44 to close the slit 441. A seal 461 is circumferentially provided on the outer edge of the surface of the valve body 46 opposite to the slit 441. The valve stem 47 is a generally rod-shaped member that supports the valve body 46 at its front end. The valve stem 47 is configured to move in the Z direction and also in the X direction. One end of the spring 48 is connected to the base end of the valve stem 47, and the other end is connected to the base plate 49. The base plate 49 supports the valve stem 47 in the Z direction via the spring 48.

[0031] Additionally, the drive unit 45 has a cylinder 50 for moving the valve body 46. The cylinders 50 are configured in pairs to clamp the valve stem 47 and the spring 48 from both sides. Each cylinder 50 has a cylinder barrel 501 and a piston rod 502 that can slide within it. Air passages from the flow adjustment unit 42 (described later) are connected to one end and the other end of the cylinder barrel 501, respectively. The piston rod 502 has a piston at its front end, and its base end is connected to the base plate 49.

[0032] Furthermore, the drive unit 45 includes a cam follower plate 51, cam rollers 511 and 512, cam grooves 471 and 472, and roller block 451. The cam follower plate 51 is a component extending along the Z direction, and its base end is supported by a base plate 49. The cam rollers 511 and 512 are generally cylindrical components protruding from the cam follower plate 51 toward the valve stem 47. The cam rollers 511 and 512 are arranged and fixed at two positions at the front end of the cam follower plate 51 in the Z direction. The cam grooves 471 and 472 are formed on a base material 473 fixed to both sides of the valve stem 47. The cam grooves 471 and 472 are located opposite to the cam rollers 511 and 512, respectively, with the cam roller 511 slidably engaged in the cam groove 471 and the cam roller 512 slidably engaged in the cam groove 472. The cam grooves 471 and 472 are grooves that appear as tracks when viewed from above. The long axis of the shape of the cam grooves 471 and 472 when viewed from above is inclined such that the closer they are to the body 44 in the Z direction, the further they are from the slit 441 in the X direction. The roller block 451 is a component that protrudes from the drive unit 45. The roller block 451 is positioned at the point where the valve body 46 overlaps with the slit 441 in the Z direction and abuts against the upper end of the base material 473.

[0033] Furthermore, the drive unit 45 has nozzles 452 and 453. Nozzle 452 is connected to a pipe that branches into two within the drive unit 45, and is connected to one end of each of the two cylinders 50 via this pipe. Similarly, nozzle 453 is also connected to a pipe that branches into two within the drive unit 45, and is connected to the other end of each of the two cylinders 50 via this pipe.

[0034] [Flow Adjustment Unit] The flow adjustment unit 42 has piezoelectric element valves that are opened and closed by the application of voltage in the air supply path and the air discharge path of the cylinder 50, thereby controlling the amount of air in the cylinder. Figure 4 This diagram schematically illustrates the configuration of the flow adjustment unit 42 in this embodiment. Figure 4 As shown, the flow adjustment unit 42 has a supply chamber 61 and connecting chambers 62 and 63.

[0035] Supply chamber 61 has a supply port 611 and connecting ports 612 and 613. Supply port 611 is connected to an air supply source. Supply chamber 61 is connected to connecting chamber 62 via connecting port 612 and to connecting chamber 63 via connecting port 613. A first piezoelectric element valve 64 capable of opening and closing connecting port 612 and a first piezoelectric element valve 65 capable of opening and closing connecting port 613 are disposed in supply chamber 61.

[0036] In addition to the connecting port 612, the connecting chamber 62 also has a vent 621 and an exhaust port 622. The vent 621 is connected via a pipe to a first chamber 503 on one end side of the cylinder barrel 501 of the cylinder 50. The first chamber 503 is the space in the cylinder 50 located on the end side closer to the piston. The exhaust port 622 is connected to the outside of the flow adjustment unit 42. A second piezoelectric element valve 66 capable of opening and closing the exhaust port 622 is disposed in the connecting chamber 62.

[0037] In addition to the connecting port 613, the connecting chamber 63 also has a vent 631 and an exhaust port 632. The vent 631 is connected via a pipe to a second chamber 504 on the other end side of the cylinder barrel 501 of the cylinder 50. The second chamber 504 is the space in the cylinder 50 located on the other end side of the piston. The exhaust port 632 is connected to the outside of the flow adjustment unit 42. A second piezoelectric element valve 67 capable of opening and closing the exhaust port 632 is disposed in the connecting chamber 63.

[0038] Thus, the flow adjustment unit 42 is configured to be able to freely open and close the exhaust flow path of air from the cylinder 50 via a piezoelectric element valve.

[0039] Furthermore, in this embodiment, the piezoelectric element valve has a laminated structure of a flexible substrate and a plate-shaped actuator made of piezoelectric ceramic. The piezoelectric element valve is configured such that one end is fixed and the other end has an opening such as a communication port closed. In addition, the flow adjustment unit 42 is configured to apply voltage independently to each piezoelectric element valve.

[0040] By applying voltage to the piezoelectric valve, the actuator contracts, causing the piezoelectric valve to bend and open its opening. If the voltage is stopped, the actuator returns to its original size, and the bending of the piezoelectric valve is eliminated. As a result, the piezoelectric valve fits snugly against the opening. From the viewpoint of improving the sealing performance when the valve is closed, a sealing member surrounding the opening can also be provided circumferentially on the portion of the piezoelectric valve opposite to the opening. Furthermore, from the viewpoint of improving the sealing performance when the valve is closed, a spring member (leaf spring, etc.) can be further configured in the flow adjustment unit 42, abutting against the other end of the piezoelectric valve from the side opposite to the opening in the thickness direction, applying force to the piezoelectric valve towards the opening.

[0041] [Control Department] The control unit 43 controls the energization of the first piezoelectric element valves 64 and 65 and the second piezoelectric element valves 66 and 67, so as to independently apply specific voltages to each of the first piezoelectric element valves 64 and 65 and the second piezoelectric element valves 66 and 67. Here, the stroke of the cylinder 50 that causes the valve body 46 to contact the valve seat (the outer edge of the slit 441) is defined as the valve closing stroke, and the stroke that causes the valve body 46 to separate from the valve seat is defined as the valve opening stroke. In this embodiment, the stroke in which the cylinder 50 retracts is the valve closing stroke, and the stroke in which the cylinder 50 extends is the valve opening stroke. The control unit 43 controls the voltage applied to the piezoelectric element valves so that at the end of the valve closing stroke, the amount of fluid in the cylinder 50 becomes less. The control unit 43 is, for example, an integrated circuit disposed in the gate valve 41 and capable of performing the above-described control.

[0042] [L-shaped movement of the gate valve] Reference Figure 2 , 3 Sections 5 to 8 will describe the L-shaped movement of the gate valve 41 in this embodiment.

[0043] When the valve is open ( Figure 2 , 3 > With air supplied to the first chamber 503 of cylinder 50 and air discharged from the second chamber 504, cylinder 50 extends, and piston rod 502 presses down on base plate 49 in the Z direction. Therefore, spring 48 supported by base plate 49 and cam follower plate 51 are also at their lowest positions in the Z direction. Consequently, valve stem 47 supported by spring 48 and valve body 46 supported by valve stem 47 are also at their lowest positions in the Z direction, and are positioned where they do not overlap with slit 441 in the Z direction. Therefore, slit 441 is in an open state (gate valve 41 is open). In this state, valve body 46 and valve stem 47 supporting valve body 46 are located in the X direction at a distance from the ends of the major axes of cam grooves 471 and 472 separated from the position where they are attached to slit 441.

[0044] <Transition in the Z direction during L-shaped motion ( Figure 5 , 6 > Figure 5 This is a schematic front view showing the configuration of gate valve 41 during the valve closure process. Figure 6 This is its side view. If air is discharged from the first chamber 503 of cylinder 50 and air is supplied to the second chamber 504, cylinder 50 contracts, and the base plate 49 rises in the Z direction. As the base plate 49 rises, the cam follower plate 51 and the spring 48 rise, and the valve stem 47 and the valve body 46 rise to a position where the valve body 46 overlaps with the slit 441 in the X direction. At this time, the upper end of the base plate 473, which rises along with the valve stem 47, abuts against the roller block 451. In this embodiment, this time (the end of the Z-direction movement in the L-shaped motion) is set as the end of the valve closing stroke of cylinder 50.

[0045] <Transition in the X direction during L-shaped motion ( Figure 7 , Figure 8 > Figure 7 This is a schematic front view showing the configuration of gate valve 41 when it is closed. Figure 8 This is its side view. If the cylinder 50 further retracts while the substrate 473 is in contact with the roller block 451 in the Z direction, the base plate 49 rises in the Z direction, and the cam follower plate 51 rises further, restricting the valve stem 47 from further movement (rising) in the Z direction. During the period when the valve stem 47 is restricted from further movement (rising) in the Z direction, the spring 48 retracts according to the rise of the base plate 49.

[0046] As the cam follower 51 rises in the Z-direction, the cam rollers 511 and 512 move along the long axis of the cam grooves 471 and 472. As described above, this restricts the rise of the valve stem 47 in the Z-direction, and the valve stem 47 can move in the X-direction. Therefore, by the movement of the cam rollers 511 and 512 in the cam grooves 471 and 472, the valve stem 47 moves towards the slit 441 side in the X-direction by the amount of inclination of the long axis of the cam grooves 471 and 472. As a result, the valve body 46 moves in the X-direction and comes into contact with the periphery (valve seat) of the slit 441. Thus, the slit 441 is closed by the valve body 46, and the gate valve 41 is closed. In this embodiment, this moment (the end of the X-direction movement in the L-shaped motion) is set as the end of the valve closing stroke of the cylinder 50.

[0047] <Movement from valve closed to valve open> If air is supplied to the first chamber 503 of cylinder 50 and air is discharged from the second chamber 504, cylinder 50 extends, and base plate 49 descends in the Z direction. Valve stem 47 exerts force upward in the Z direction via a contracting spring 48. Therefore, cam rollers 511, 512 slide in cam grooves 471, 472, resulting in valve body 46 separating from slit 441 in the X direction. If base plate 49 descends further in the Z direction as cylinder 50 extends, base plate 473 separates from roller block 451 in the Z direction. Thus, gate valve 41... Figure 7 , 8 The state shown has been restored. Figure 5 , 6 The state shown is further extended by cylinder 50, becoming Figure 2 , 3 The state shown is as follows. Thus, the gate valve 41 has a cylinder 50 that engages and disengages the valve body 46 relative to the valve seat. A single stroke of the cylinder 50 causes the valve body 46 to move in a reversible L-shaped motion. Furthermore, the valve stem 47 supports the valve body 46 via a cam follower plate 51, cam rollers 511 and 512, roller block 451, and cam grooves 471 and 472. When the valve is closed, it is linked to the stroke of the cylinder 50 in a sequence from the Z direction to the X direction; when the valve is open, it is linked to the stroke of the cylinder 50 in a sequence from the X direction to the Z direction.

[0048] [Control methods for gate valves] <Example of control when valve is closed> Figure 9 This is a flowchart illustrating the control process of the gate valve in this embodiment. Figure 9 An example of control is shown when the open gate valve 41 is closed.

[0049] In step S11, the control unit 43 receives a signal instructing the valve body 46 to be closed. This signal may be sent, for example, from another control unit controlling the semiconductor manufacturing apparatus 1.

[0050] In step S12, the control unit 43 determines the applied voltage value E1 to the piezoelectric element valve corresponding to the desired speed at which the valve body 46 moves in the Z direction. For example, the control unit 43 refers to a pre-stored mapping table to determine the piezoelectric element valve that achieves the moving speed of the valve body 46 corresponding to the process speed of semiconductor manufacturing and the applied voltage value at that time. This piezoelectric element valve is, for example, the first piezoelectric element valve 65, and the applied voltage value (voltage E1) is the voltage value that makes the first piezoelectric element valve 65 fully open.

[0051] In step S13, the control unit 43 applies a voltage to the piezoelectric element valve at the voltage value E1 determined in step S12. For example, the control unit 43 sends a signal to a power source (not shown) to apply a voltage E1 to the first piezoelectric element valve 65. As a result, the cylinder 50 retracts, and in the Z direction, the cam follower plate 51 approaches the roller block 451.

[0052] In step S14, the control unit 43 receives a signal that the valve closing stroke of the cylinder 50 has reached its end. This signal may be, for example, from a device (position detection sensor or contact switch, etc.) that detects the contact between the cam follower plate 51 and the roller block 451.

[0053] In step S15, the control unit 43 determines the applied voltage value E2 to the piezoelectric element valve corresponding to the desired speed at which the valve body 46 moves in the X direction. For example, the control unit 43 refers to a pre-stored mapping table to determine the piezoelectric element valve that achieves a movement speed of the valve body 46 that sufficiently suppresses the generation of particles caused by the valve body 46 adhering to the valve seat, and the applied voltage value at that time. The piezoelectric element valve is, for example, a first piezoelectric element valve 65 and a second piezoelectric element valve 67, and the applied voltage value (voltage E2) is the voltage value that makes the first piezoelectric element valve 65 fully open and the voltage value that makes the second piezoelectric element valve 67 open to a degree that decelerates it to the desired speed.

[0054] In step S16, the control unit 43 applies a voltage to the piezoelectric element valve at the voltage value E2 determined in step S15. For example, the control unit 43 sends a signal to a power source (not shown) to apply a voltage E2 (in this case, the same as voltage E1) to the first piezoelectric element valve 65 to make the first piezoelectric element valve 65 fully open, and sends a signal to the power source to apply a voltage E2 to the second piezoelectric element valve 67 to make the second piezoelectric element valve 67 open to the degree corresponding to the deceleration described above.

[0055] Through the control described above, the control unit 43 causes the valve body 46 to move rapidly in the Z direction of the L-shaped movement, and only moves the valve body 46 slowly in the X direction of the L-shaped movement. As a result, the generation of particles during the contact of the valve body 46 is prevented.

[0056] <Example of control when valve is open> The control of the gate valve 41 when it is open can be performed in the same way as the control when it is closed. For example, the control unit 43 receives a signal instructing the valve body 46 to open, and determines the piezoelectric element valve that achieves the movement speed of the valve body 46 corresponding to the process speed of semiconductor manufacturing, as well as the applied voltage value, by referring to a pre-stored mapping table. Furthermore, the control unit 43 sends a signal to the power supply to apply a voltage to the determined piezoelectric element valve at the determined voltage value. With such control, the gate valve 41 can be opened quickly according to the process speed of semiconductor manufacturing.

[0057] Alternatively, the control of the gate valve 41 when the valve is open can be the same as the control when the valve is closed, by changing the applied voltage value at the end of the stroke.

[0058] For example, the control unit 43 receives a signal that the valve opening stroke of the cylinder 50 has reached its end. This signal, for example, takes a position about 10 mm above the lowest point of the base plate 49 during the valve opening stroke as the end of the valve opening stroke, and detects that the base plate 49 has reached this position by a position detection sensor or a proximity switch. Furthermore, the control unit 43 determines the applied voltage value E3 to the piezoelectric element valve corresponding to the desired speed after the base plate 49 is moderately decelerated in the Z direction. For example, the control unit 43 determines that the first piezoelectric element valve 64 and the second piezoelectric element valve 66 are piezoelectric element valves, determines the voltage value to fully open the first piezoelectric element valve 64 and the voltage value to open the second piezoelectric element valve 66 to the opening degree corresponding to the aforementioned deceleration as the applied voltage value E3, and sends it to the power supply.

[0059] Through the control described above, the control unit 43 causes the valve body 46 to move rapidly during the L-shaped movement when the valve is opened, and only at the end of the valve opening stroke does the base plate 49 decelerate, which can effectively suppress the generation of impact at the end point of the base plate 49 when the valve is opened.

[0060] [The movement of the valve body] Figure 10 This diagram schematically illustrates the movement distance and speed of the valve body during the valve closing stroke of the gate valve in this embodiment. Figure 11 This diagram schematically illustrates the movement distance and speed of the valve body during the valve opening stroke of the gate valve according to this embodiment. In the diagram, solid lines represent an example of this embodiment, and dashed lines represent an example of a conventional form using a solenoid valve instead of the flow adjustment unit in this embodiment. Furthermore, in Figure 10 In the diagram, "1" represents the Z-direction movement in the L-shaped motion when the valve is closed, "2" represents the X-direction movement in the L-shaped motion when the valve is closed, and "3" indicates the end of the L-shaped motion when the valve is closed. Additionally, Figure 11In the diagram, "4" indicates the movement in the X direction during the L-shaped motion when the valve is opened, "5" indicates the movement in the Z direction during the L-shaped motion when the valve is opened, and "6" indicates the end of the L-shaped motion when the valve is opened.

[0061] In existing designs, the solenoid valve cannot adjust the opening and closing speed during L-shaped movement; therefore, the opening and closing speed is constant. Consequently, in existing designs, when the valve is closed, the valve body is always moved at the highest speed within the range that suppresses particle generation when the valve body is in contact with the valve seat. Similarly, in existing designs, when the valve is open, the valve body is always moved at the highest speed within the range that suppresses the impact of the collision between the working part (e.g., base plate 49) and the drive part 45 at the end of the piston rod's extension. Thus, in existing designs, the valve body moves at a constant speed determined at the end of the L-shaped movement.

[0062] In this embodiment, the valve body's moving speed is freely set within the range achievable by the cylinder operation, except for the end portion of the L-shaped movement (from the beginning to the end of the L-shaped movement). Therefore, in this embodiment, the valve body can move at a sufficiently high speed during the period from the beginning to the end of the L-shaped movement, compared to conventional forms, and the valve body's moving speed can be rapidly decelerated to a speed sufficient to suppress particle generation or sufficiently suppress impact only during the period from the beginning to the end of the L-shaped movement. Therefore, in this embodiment, compared to conventional forms, the time required for the L-shaped movement of the valve body can be significantly shortened during both valve closing and valve opening of the gate valve. Thus, in this embodiment, by increasing the speed outside the end portion of the L-shaped movement and decreasing the speed only near the end portion, both high speed of the overall L-shaped movement and prevention of particle generation are achieved.

[0063] Furthermore, in this embodiment, as described above, the L-shaped movement of the valve body is a movement in the Z direction and the X direction orthogonal to it (hereinafter also referred to as "complete L-shaped movement"). In this invention, the L-shaped movement can also be a movement in the Z direction and a direction inclined relative to the Z and X directions (hereinafter also referred to as "tilting and lifting"). However, since the L-shaped movement in this embodiment is a complete L-shaped movement, it can be made faster than the speed of the tilting and lifting L-shaped movement, and can further suppress the generation of particles.

[0064] Figure 12 This is a schematic diagram illustrating the relationship between the speed during L-shaped motion and the amount of particles generated when the valve is closed. In the diagram, the vertical axis represents the amount of particles generated. "N" indicates the permissible value for the amount of particles generated, such as the permissible amount of particles (threshold) when applied to a semiconductor manufacturing device like the one described above. The horizontal axis represents the speed at which the valve body moves towards the valve seat during L-shaped motion when the valve is closed.

[0065] Regarding the X-direction movement speed of the valve body when the valve is closed (the speed at which it moves towards the valve seat), the "full L-shaped movement" is faster than the "tilt-up / down movement". This is because the ease with which particles are generated when the valve body adheres to the valve seat differs between the "full L-shaped movement" and the "tilt-up / down movement".

[0066] In a fully L-shaped movement, when the valve body is in contact with the valve seat, the sealing parts, such as the O-ring, contact the sealing surface on the body side in an almost perpendicular direction. Therefore, sliding relative to the sealing surface of the sealing parts is effectively prevented. On the other hand, during tilting and lifting, the sealing parts slide relative to the sealing surface when the valve body is in contact. The impact caused by this contact during valve body contact and the resistance caused by sliding cause wear to the sealing parts, resulting in the formation of particles. In this "sliding," the two objects rub against each other. Therefore, in semiconductor manufacturing processes, these particles negatively impact the quality of products such as wafers, becoming one of the reasons for reduced yield of good products (and a basis for the generation of foreign matter that leads to defective products).

[0067] The magnitude of the impact and the sliding are roughly proportional to the speed just before the valve's closing stroke ends. Therefore, during the sliding tilting and lifting motion, the faster the movement speed towards the valve body, the greater the impact and sliding, and the easier it is for particles to be generated. In the fully L-shaped motion, which substantially suppresses sliding, the faster the movement speed towards the valve body, the greater the impact, but since there is no substantial sliding, particle generation is suppressed compared to the tilting and lifting motion. Therefore, between the speed NA reaching the permissible value N via tilting and lifting and the speed NB reaching the permissible value N via fully L-shaped motion, speed NB > speed NA. Thus, when comparing the permissible value for the same amount of particle generation, fully L-shaped motion can accelerate the valve body's movement speed compared to the tilting and lifting L-shaped motion.

[0068] [Main effects] Generally, speed control in cylinders (compressed air cylinders) involves meter-out control using speed controllers or similar devices. In this case, multi-stage speed control cannot be achieved through a single cylinder stroke. When a gate valve is opened and closed by a cylinder, the valve stem moves up and down, and at the extreme points of this movement, the valve body moves horizontally, sealing the valve body by contacting the sealing surface of the valve body with an O-ring. If the horizontal sealing action is performed at the same speed as the valve stem's up-and-down movement, the valve body and O-ring violently contact the sealing surface of the valve body. This generates microparticles, known as particles, from the sealing surface or the O-ring, and also causes impact or vibration upon contact. Furthermore, the increased load on the O-ring due to this violent contact contributes to a decrease in sealing performance or seal durability.

[0069] In this embodiment, when the L-shaped movement of the gate valve body is achieved by a single stroke of the cylinder, air is supplied to the cylinder via a flow adjustment unit, and the piezoelectric element valve of the flow adjustment unit is controlled by a control unit to decelerate the valve body at the end of the L-shaped movement when the valve is closed. The piezoelectric element valve can perform multi-stage control by linearly adjusting the air flow rate via an electrical signal. Therefore, the movement speed of the valve body and valve stem can be appropriately changed in both the vertical and horizontal directions during the L-shaped movement of the gate valve. This prevents adverse conditions caused by particles or impacts. Furthermore, the durability of the sealing components is improved. Therefore, the reliability of the gate valve in the semiconductor manufacturing apparatus is improved.

[0070] In this embodiment, more specifically, when the cylinder reaches the end of its valve closing stroke, the control unit controls the piezoelectric element valve of the flow adjustment unit to apply a voltage to the piezoelectric element valve corresponding to the airflow rate (opening degree of the piezoelectric element valve) that reduces the moving speed of the valve body to the desired speed. The control quantity for this control is appropriately set according to various conditions such as the type of gate valve, stroke, operating time, and operating speed. In actual use, it can be appropriately determined based on calculated or measured values ​​of the valve body's moving speed that substantially does not generate particles, impacts, or vibrations.

[0071] In this embodiment, the piezoelectric valve of the flow adjustment unit can arbitrarily open and close the exhaust flow path from the cylinder. Therefore, it is suitable for rapidly achieving deceleration of L-shaped motion.

[0072] Furthermore, in this embodiment, similar to the deceleration at the end of the valve closing stroke, deceleration can also be performed at the end of the valve opening stroke. Generally, mechanical components include a shock absorption structure such as an air damper at the end of the stroke. In this embodiment, deceleration at the end of the cylinder stroke sufficiently reduces the impact at the stroke's end. Therefore, in this embodiment, the aforementioned shock absorption structure such as an air damper is unnecessary. That is, in this embodiment, the gate valve can be configured without a shock absorption structure at the position corresponding to the end of the cylinder stroke. Therefore, this is advantageous from the viewpoint of gate valve miniaturization and structural simplification.

[0073] In this embodiment, the Z-direction movement of the valve body 46 is converted to the X-direction movement via a two-stage cam structure. As a result, the valve body 46 is fitted against the valve seat in a substantially non-tilted state relative to the valve seat. Therefore, the generation of particles or vibrations caused by deviations in the load on the seal 461 is suppressed, further improving the reliability of the gate valve.

[0074] In this embodiment, the fluid cylinder of the power source for the L-shaped motion is a pneumatic cylinder. Therefore, this is advantageous from the viewpoint of fluid supply and operation.

[0075] In the semiconductor manufacturing apparatus of this embodiment, the gate valve is used to control the connection and disconnection of each zone corresponding to the processing of semiconductor products, as described above. In this embodiment, since it is possible to prevent the generation of impacts or vibrations in the gate valve, there is no need for a structure to prevent impacts or vibrations from the gate valve in the semiconductor manufacturing apparatus. Therefore, the configuration of the semiconductor manufacturing apparatus is further simplified.

[0076] Furthermore, semiconductor manufacturing apparatuses typically include a control unit for appropriately implementing manufacturing processes. For example, a semiconductor manufacturing apparatus may include a processing control unit that controls the operation of a transport unit, a processing unit, and a gate valve to perform wafer processing. Such a control unit of a semiconductor manufacturing apparatus can also be used as a control unit in a gate valve control mechanism. In this case, the opening and closing speeds of the gate valve (the speed in the Z direction and the speed in the X direction during L-shaped motion) can be appropriately set according to the semiconductor manufacturing process. In this case, the control unit in the gate valve control mechanism can be omitted. Thus, in the embodiment of the present invention, the gate valve has a fluid cylinder that allows the valve body to engage and disengage relative to the valve seat as described above, and is configured such that the valve body moves in an L-shaped motion by a single stroke of the fluid cylinder. Furthermore, the amount of fluid in the fluid cylinder can be controlled to decelerate the valve body's movement speed at the end of the L-shaped motion. Therefore, by applying a gate valve equipped with the aforementioned flow adjustment unit to a semiconductor manufacturing apparatus as described above, the opening and closing of the valve body in the gate valve described in this embodiment can be realized in the semiconductor manufacturing apparatus.

[0077] In particular, at the take-off port of the semiconductor manufacturing apparatus, after the gate valve is opened and semiconductors such as wafers are removed, the gate valve is closed, and the gas in the chamber is vacuumed to maintain the cleanliness of the semiconductor manufacturing apparatus. In the gate valve control mechanism of this embodiment, the speed of the gate valve's opening and closing action can be accelerated. Therefore, compared with conventional gate valve control mechanisms, the gate valve control mechanism of this embodiment can advance the time from removing semiconductors such as wafers to placing new semiconductors such as wafers into the chamber. Therefore, this embodiment helps to improve the overall operating speed of the semiconductor manufacturing apparatus. Furthermore, in Figure 1 In such interconnected semiconductor manufacturing facilities, many semiconductor manufacturing devices are typically arranged side-by-side on the same floor and are in operation. Therefore, applying the gate valve control mechanism of this embodiment to the semiconductor manufacturing facility helps to further improve the yield of semiconductor manufacturing.

[0078] Furthermore, in the gate valve of this embodiment, the movement speed of the valve body can be controlled by the amount of fluid in the fluid cylinder not only at the end of the L-shaped movement but also at other times during the L-shaped movement. Therefore, by appropriately controlling the movement speed at any position other than the end of the L-shaped movement, various methods of wafer processing in a semiconductor manufacturing apparatus, such as the processing timing of each processing unit or the parallel processing of two or more processing units, can be realized. Moreover, the configuration of the semiconductor manufacturing apparatus can be configured to realize such multiple processes, for example, a transport unit capable of transporting wafers to two or more processing units, or a processing control unit having functions for implementing various processes such as parallel processing, etc., configurations with features different from those in the above-described embodiments. Therefore, by applying the gate valve of this embodiment to a semiconductor manufacturing apparatus, it is expected to contribute to realizing new methods of semiconductor manufacturing, or to improve the productivity of semiconductor products based on this new method.

[0079] [Variation Example] In this embodiment, the configurations of cam grooves 471 and 472 and cam rollers 511 and 512 can be interchanged. Alternatively, cam rollers can be configured on the valve stem 47 side, and cam grooves can be configured on the cam follower plate 51 side.

[0080] In addition, in this embodiment, a cylinder that uses a fluid other than air, such as a hydraulic cylinder, can be used instead of the pneumatic cylinder 50.

[0081] Furthermore, the flow adjustment unit 42 in this embodiment can be configured to open and close only the air supply path from the flow adjustment unit 42 to the cylinder 50 via a piezoelectric element valve, or it can be configured to open and close only the air exhaust path from the cylinder 50 to the flow adjustment unit 42 via a piezoelectric element valve. In this way, even if only one of the air supply path or the exhaust path can be opened and closed via a pressure element valve, the movement speed of the valve body 46 during the L-shaped motion described above can be adequately controlled. In the former case, the air exhaust path, or in the latter case, the air supply path, can either be always open or appropriately opened and closed via a valve other than the piezoelectric element valve.

[0082] Furthermore, the flow control unit can be configured such that, when supplying air to the cylinder, the opening of the exhaust flow path is controlled by further utilizing a piezoelectric element valve that opens and closes the exhaust flow path, thereby enabling more precise control of the amount of air supplied to the cylinder. Similarly, it can be configured such that, when discharging air from the cylinder, the opening of the supply flow path is controlled by further utilizing a piezoelectric element valve that opens and closes the supply flow path, thereby enabling more precise control of the amount of air discharged from the cylinder.

[0083] The gate valve in this embodiment also includes a slit valve and a gate valve. The shape of the valve body 46 and the opening (slit 441) in the gate valve when viewed from above may not be rectangular or circular, and is not limited to a specific shape.

[0084] In this embodiment, two cylinders are arranged on both sides of the valve stem, but the number of cylinders is not limited to this. For example, there may be only one cylinder.

[0085] In this embodiment, the sealing component may be, for example, an O-ring, but it may also be other sealing components other than an O-ring, such as a resin gasket.

[0086] The flow adjustment unit can be either a two-port valve or a three-port valve. Alternatively, in this embodiment, the polymer actuator described in Japanese Patent Application No. 2011-526327 can be used instead of the piezoelectric valve described above.

[0087] [Example of software implementation] The functions of the control unit 43 can be implemented by a program that enables the computer to function as the control unit 43. This program is used to enable the computer to function as each control module within the control unit 43. In this case, the control unit 43 includes a computer having at least one control device (e.g., a processor) and at least one storage device (e.g., a memory) as hardware for executing the aforementioned program. By executing the program using the control device and the storage device, the functions described in the above embodiments can be realized.

[0088] The above program can also be recorded on one or more non-temporary, computer-readable recording media. The control unit 43 may or may not have such a recording medium. In the latter case, the above program can also be supplied to the control unit 43 via any wired or wireless transmission medium.

[0089] Furthermore, some or all of the functions of the aforementioned control modules can also be implemented by logic circuits. For example, an integrated circuit forming the logic circuits that function as the aforementioned control modules is also included in the aforementioned control unit 43. In addition, the functions of the aforementioned control modules can also be implemented by a quantum computer, for example.

[0090] 〔Summarize〕 The first aspect of the present invention is a gate valve having a fluid cylinder that allows the valve body to engage and disengage relative to a valve seat, and is configured such that the valve body moves in an L-shaped motion by a single stroke of the fluid cylinder, wherein the amount of fluid in the fluid cylinder is controlled such that the moving speed of the valve body is decelerated at the end of the L-shaped motion. According to the first aspect, the opening and closing of the gate valve can be accelerated, and particle generation can be prevented.

[0091] A second aspect of the present invention is a gate valve control mechanism (40), comprising: a gate valve (41) having a fluid cylinder (cylinder 50) for engaging and disengaging a valve body (46) relative to a valve seat, and configured to move the valve body in an L-shaped motion by a single stroke of the fluid cylinder; a piezoelectric valve (64-67) or a polymer actuator that controls the amount of fluid in the fluid cylinder by opening and closing one or both of a supply flow path for fluid supplied to the fluid cylinder and a discharge flow path for fluid discharged from the fluid cylinder by applying a voltage; and a control unit (43) that controls the voltage applied to the piezoelectric valve or the polymer actuator such that the amount of fluid in the fluid cylinder is reduced at least at the end of the valve closing stroke of the fluid cylinder that engages the valve body with the valve seat. According to the second aspect, the opening and closing of the gate valve can be accelerated, and particle generation can be prevented.

[0092] Regarding the third aspect of the present invention, in the second aspect, the control unit controls the voltage applied to the piezoelectric element valve or polymer actuator, so that the amount of fluid in the fluid cylinder at the end of the valve opening stroke of the fluid cylinder that separates the valve body from the valve seat is also reduced. The third aspect is more effective from the viewpoint of reducing the vibration or impact of the gate valve when the valve opens, and from the viewpoint of miniaturization and simplification of the gate valve's structure.

[0093] Regarding the fourth aspect of the present invention, in the second or third aspect, the gate valve includes: a valve stem (47) that supports the valve body and is movable in the stroke direction and in the direction of approaching and separating from the valve seat, in conjunction with the stroke of the fluid cylinder; a linkage that links the valve stem with the stroke of the fluid cylinder; cam rollers (511, 512) that are supported by one of the valve stem and the linkage and engaged with the other; and cam grooves (471, 472) formed on the other side of the valve stem and the linkage for engaging the cam rollers and for sliding. Furthermore, the cam rollers and cam grooves are both disposed at two positions during the stroke of the fluid cylinder, and one of the cam rollers and cam grooves is inclinedly disposed such that it is further away from the valve seat the closer it is to the end of the valve closing stroke. The linkage, from the beginning to the end of the valve closing stroke, links the movement of the valve stem in the direction of the valve closing stroke of the fluid cylinder, and from the end to the end of the valve closing stroke, links the movement of the valve stem in a direction intersecting with the valve closing stroke of the fluid cylinder. The fourth approach is more effective from the perspective of preventing gate valve problems caused by contact between the valve body and the valve seat, and thus improving the reliability of the gate valve.

[0094] Regarding the fifth aspect of the invention, in any of the second to fourth aspects, the fluid cylinder is a pneumatic cylinder and the fluid is air. The fifth aspect is more efficient from the viewpoint of easily supplying fluid to the fluid cylinder and easily operating the fluid.

[0095] The sixth aspect of the present invention is a gate valve control method, which is a method for controlling a gate valve control mechanism of any one of the second to fifth aspects, wherein the voltage applied to the piezoelectric element valve or polymer actuator is controlled such that the amount of fluid in the fluid cylinder is reduced, at least when the fluid cylinder reaches the end of its valve closing stroke. According to the sixth aspect, similar to the second aspect, the opening and closing of the gate valve can be accelerated, and particle generation can be prevented.

[0096] Regarding the seventh aspect of the present invention, in the sixth aspect, when the fluid cylinder reaches the end of its valve closing stroke, a voltage corresponding to the amount of fluid in the fluid cylinder that reduces the moving speed of the valve body based on the fluid cylinder's valve closing stroke to a set speed is applied to the piezoelectric element valve or polymer actuator. The seventh aspect is more effective from the viewpoint of achieving the aforementioned effects corresponding to the actual operating conditions of the gate valve.

[0097] Regarding the eighth aspect of the present invention, in the sixth or seventh aspect, when the fluid cylinder reaches the end of its valve opening stroke, a voltage corresponding to the amount of fluid in the fluid cylinder that reduces the moving speed of the valve body based on the fluid cylinder's valve opening stroke to a set speed is applied to the piezoelectric element valve or polymer actuator. The eighth aspect is more effective from the viewpoint of reducing vibration or impact on the gate valve during valve opening, and from the viewpoint of miniaturization and simplification of the gate valve's structure.

[0098] A ninth aspect of the present invention is a semiconductor manufacturing apparatus comprising: a transport unit (10) for transporting wafers for semiconductor products; a processing unit (20) for processing the wafers transported from the transport unit; a gate valve for disconnecting the transport unit and the processing unit; and a processing control unit for controlling the operation of the transport unit, the processing unit, and the gate valve to perform wafer processing. The gate valve has a fluid cylinder that allows the valve body to engage and disengage relative to a valve seat, and is configured such that the valve body moves in an L-shaped motion by a single stroke of the fluid cylinder, and the amount of fluid in the fluid cylinder is controlled such that the moving speed of the valve body is decelerated at the end of the L-shaped motion. According to the ninth aspect, the opening and closing of the gate valve in the semiconductor manufacturing apparatus can be accelerated, and particle generation can be prevented, thereby further improving the reliability of the manufacturing apparatus in semiconductor manufacturing and the yield of semiconductor products.

[0099] Regarding the tenth aspect of the present invention, in the second to fifth aspects, a piezoelectric valve or a polymer actuator opens and closes the discharge flow path by applying voltage. The tenth aspect is more effective from the viewpoint of rapidly achieving deceleration of the valve body at the end of the stroke.

[0100] According to this embodiment, simplification and improved reliability of gate valves in semiconductor manufacturing can be expected. This embodiment, which achieves such effects, can, for example, contribute to achieving Goal 9 of the United Nations Sustainable Development Goal (SDGs), "Building a foundation for industrial and technological innovation."

[0101] This invention is not limited to the embodiments described above, and various modifications can be made within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included within the technical scope of this invention.

[0102] Explanation of reference numerals in the attached figures 1 Semiconductor manufacturing equipment 10. Conveying Department 11 Conveyor Table 12 guide rails 20 Processing Department 30 Containment Department 40 Gate valve control mechanism 41 Gate valve 42 Flow Adjustment Unit 43 Control Department 44 body 45 Drive Unit 46 Valve body 47 Valve stem 48 Springs 49 Base Plate 50 cylinders 51 Cam Follower Plate Supply Room 61 Connecting chambers 62 and 63 64, 65 First piezoelectric element valve 66, 67 Second piezoelectric element valve 100 wafers 441 Slit 451 Roller Block Nozzles 452 and 453 461 Sealing section 471, 472 Cam grooves 473 Substrate 501 cylinder barrel 502 Piston Rod Room 503, First Room Room 504, Second Room 511, 512 Cam Rollers 611 air intake 612, 613 Connecting Ports Vents 621 and 631 622, 632 exhaust ports

Claims

1. A gate valve having a fluid cylinder that brings a valve body into abutment with or separation from a valve seat, and configured to move the valve body in an L-shaped motion by a single stroke of the fluid cylinder, the amount of fluid in the fluid cylinder is controlled to be less at least at the end portion of the L-shaped motion to enable the speed of movement of the valve body to be decelerated.

2. A gate valve control mechanism comprising: a gate valve having a fluid cylinder that brings a valve body into abutment with or separation from a valve seat, and configured to move the valve body in an L-shaped motion by a single stroke of the fluid cylinder; a piezoelectric element valve or a polymer actuator that controls the amount of fluid in the fluid cylinder by opening and closing one or both of a supply flow path that supplies fluid to the fluid cylinder and a discharge flow path that discharges fluid from the fluid cylinder by application of voltage; a control section that controls the voltage applied to the piezoelectric element valve or the polymer actuator so that the amount of fluid in the fluid cylinder becomes less at least at the end portion of the valve closing stroke of the fluid cylinder in which the valve body is brought into abutment with the valve seat.

3. The gate valve control mechanism according to claim 2, wherein the control section controls the voltage applied to the piezoelectric element valve or the polymer actuator so that the amount of fluid in the fluid cylinder also becomes less at the end portion of the valve opening stroke of the fluid cylinder in which the valve body is separated from the valve seat.

4. The gate valve control mechanism according to claim 2, wherein the gate valve has: a valve stem that supports the valve body and is linked with the stroke of the fluid cylinder and is movable in the stroke direction and in a direction in which the valve seat is approached or separated; a linkage section that links the valve stem with the stroke of the fluid cylinder; a cam roller that is supported by one of the valve stem and the linkage section and is engaged with the other; and a cam groove that is formed in the other of the valve stem and the linkage section, in which the cam roller is engaged, and is slidable, the cam roller and the cam groove are each disposed at two positions in the stroke of the fluid cylinder, one of the cam roller and the cam groove is disposed obliquely so as to be farther from the valve seat as it approaches the end of the valve closing stroke, the linkage section links the movement of the valve stem in the valve closing stroke direction of the fluid cylinder from the start to the end portion of the valve closing stroke, and links the movement of the valve stem in a direction that intersects the valve closing stroke of the fluid cylinder from the end portion to the end of the valve closing stroke.

5. The gate valve control mechanism according to claim 2, wherein the fluid cylinder is an air cylinder, and the fluid is air.

6. A control method of a gate valve control mechanism that is a method of controlling the gate valve control mechanism according to any one of claims 2 to 5, the voltage applied to the piezoelectric element valve or the polymer actuator is controlled so that the amount of fluid in the fluid cylinder becomes less at least when the fluid cylinder reaches the end portion of its valve closing stroke.

7. The control method of a gate valve control mechanism according to claim 6, wherein When the fluid cylinder reaches the end portion of its valve closing stroke, a voltage corresponding to the amount of fluid in the fluid cylinder that will reduce the moving speed of the valve body based on the valve closing stroke of the fluid cylinder to a set speed is applied to the piezoelectric element valve or the polymer actuator.

8. The control method of the gate valve control mechanism according to claim 6, wherein When the fluid cylinder reaches the end portion of its valve opening stroke, a voltage corresponding to the amount of fluid in the fluid cylinder that will reduce the moving speed of the valve body based on the valve opening stroke of the fluid cylinder to a set speed is applied to the piezoelectric element valve or the polymer actuator.

9. A semiconductor manufacturing apparatus, wherein The semiconductor manufacturing apparatus includes a transport section that transports a wafer for a semiconductor product, a processing section that processes the wafer transported from the transport section, a gate valve that cuts off communication between the transport section and the processing section, and a processing control section that controls the operation of the transport section, the processing section, and the gate valve to perform processing of the wafer, The gate valve has a fluid cylinder that makes a valve body adhere to or separate from a valve seat, and is configured to move the valve body in an L-shaped motion by a single stroke of the fluid cylinder, and the amount of fluid in the fluid cylinder is controlled to be able to decelerate the moving speed of the valve body at least at the end portion of the L-shaped motion.

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