Temperature detection device and induction cooker

Abstract

The invention provides a temperature detection device and an induction cooker, the temperature detection device comprises a guide installation structure, the guide installation structure comprises a guide pipe and an installation seat, and the installation seat is located at one end of the guide pipe; the temperature sensor penetrates through the guide pipe and comprises a rod part and a detection part, the detection part is located at one end of the rod part, and the detection part is located outside the guide pipe; the spring is arranged on the outer side of the guide pipe in a sleeving mode, one end of the spring abuts against the mounting base, and the other end of the spring abuts against the detection part. According to the temperature detection device, the temperature sensor is guided through the guide pipe, the inclination possibility of the temperature sensor is reduced, the contact area of the temperature sensor and the panel is increased, and the temperature measurement accuracy of the temperature detection device is improved.

Description

Technical Field

[0001] This invention relates to the field of induction cooker technology, and more specifically, to a temperature detection device and an induction cooker. Background Technology

[0002] like Figure 1 As shown, a temperature detection device 10' needs to be installed at the center of the coil of the induction cooker. The temperature rise at the center of the coil is relatively high, so a solution of spring 14' and ceramic thermistor 13' is often used. The ceramic head detected by the thermistor 13' can float up and down under the action of spring 14', thus closely fitting the panel and achieving a good temperature measurement effect.

[0003] However, because the spring 14' is spiral-shaped, it is easily pulled by the wire of the thermistor 13', causing the spring 14' to be skewed. Or, if the panel is not covered vertically, the spring 14' will be skewed, which in turn causes the ceramic head to be skewed, reducing the contact area between the ceramic head and the panel, resulting in inaccurate temperature measurement. Summary of the Invention

[0004] The present invention aims to at least solve the technical problem that the temperature detection device of the induction cooker is prone to tilting, resulting in low temperature measurement accuracy in the prior art.

[0005] Therefore, a first aspect of the present invention provides a temperature detection device.

[0006] A second aspect of the present invention provides an induction cooker.

[0007] A first aspect of the present invention provides a temperature detection device, comprising: a guide mounting structure including a guide tube and a mounting base, the mounting base being located at one end of the guide tube; a temperature sensor passing through the guide tube, the temperature sensor including a rod and a detection part, the detection part being located at one end of the rod and outside the guide tube; and a spring sleeved on the outside of the guide tube, one end of the spring abutting against the mounting base and the other end of the spring abutting against the detection part.

[0008] The temperature detection device provided by this invention includes a guide mounting structure, a temperature sensor, and a spring. The guide mounting structure includes a guide tube and a mounting base disposed at one end of the guide tube. The temperature sensor includes a rod and a detection part disposed at one end of the rod. The rod passes through the guide tube, and the detection part is located on the side of the guide tube away from the mounting base. The spring is sleeved on the outside of the guide tube, with one end of the spring abutting against the detection part and the other end abutting against the mounting base. That is, the temperature sensor is guided by the guide tube, reducing the possibility of temperature sensor misalignment, increasing the contact area between the temperature sensor and the panel, and improving the accuracy of temperature measurement by the temperature detection device.

[0009] In some technical solutions, the guide tube and the mounting base can optionally be separate structures, with the thermal conductivity of the guide tube being greater than that of the mounting base; the guide tube is inserted into the mounting base, and the guide tube and the mounting base are interference-fitted.

[0010] In this technical solution, the guide tube and the mounting base are separate structures. That is, the guide tube and the mounting base are assembled together, with the guide tube inserted into the mounting base. The guide tube and the mounting base are interference-fitted, thereby improving the connection strength between the guide tube and the mounting base, reducing the possibility of separation between the guide tube and the mounting base, and this arrangement can reduce the number of assembly parts and reduce the installation difficulty of the temperature detection device.

[0011] Furthermore, the thermal conductivity of the guide tube is greater than that of the mounting base. This means that the guide tube can conduct heat quickly, thereby reducing heat accumulation inside the guide tube. Meanwhile, the mounting base reduces the heat dissipation of the guide tube, thus keeping the heat dissipation capacity of the guide tube within a reasonable range. This reduces the impact of the guide tube's rapid heat conduction on the temperature sensor, thereby improving the accuracy of temperature measurement by the temperature detection device.

[0012] In some technical solutions, optionally, the thermal conductivity of the guide tube is greater than or equal to 150 watts per meter Kelvin and less than or equal to 220 watts per meter Kelvin; the thermal conductivity of the mounting base is less than or equal to 8 watts per meter Kelvin.

[0013] In this technical solution, the thermal conductivity of the guide tube is greater than or equal to 150 watts per meter Kelvin and less than or equal to 220 watts per meter Kelvin. The guide tube with a thermal conductivity between 150 watts per meter Kelvin and 220 watts per meter Kelvin can quickly dissipate the heat accumulated inside, thereby improving the temperature consistency between the inside and outside of the guide tube. Reducing heat accumulation can improve the accuracy of temperature measurement by the temperature sensor.

[0014] The thermal conductivity of the mounting base is less than or equal to 8 watts per meter Kelvin. A mounting base with a thermal conductivity of less than or equal to 8 watts per meter Kelvin can reduce the heat conduction of the guide tube to other components, thereby reducing the heat dissipation of the guide tube and making the temperature of the guide tube closer to the ambient temperature of the environment in which the guide tube is located. This reduces the impact on the temperature sensor and improves the accuracy of the temperature sensor's temperature measurement.

[0015] In some technical solutions, the guide tube may be made of aluminum alloy, and the mounting base may be made of plastic or fiberglass.

[0016] In this technical solution, the guide tube is made of aluminum alloy, which combines heat dissipation performance and strength, and is easy to process, thereby reducing the production cost of the temperature detection device.

[0017] The mounting base is made of plastic or fiberglass, which combines thermal insulation and strength, and is easy to process, thereby reducing the production cost of the temperature detection device.

[0018] In some technical solutions, optionally, the guide tube and the mounting base are an integral structure; the end face area of ​​the end of the guide tube connected to the mounting base is smaller than the end face area of ​​the guide tube away from the mounting base.

[0019] In this technical solution, the guide tube and the mounting base are an integrated structure. Furthermore, the end face area of ​​the end of the guide tube connected to the mounting base is smaller than the end face area of ​​the guide tube away from the mounting base. In other words, by reducing the connection area between the guide tube and the mounting base, the heat conduction efficiency between the guide tube and the mounting base is reduced. The guide tube can achieve rapid heat conduction, thereby reducing the heat accumulation inside the guide tube. Meanwhile, less heat is transferred from the guide tube to the mounting base, thus keeping the heat dissipation capacity of the guide tube within a reasonable range. This reduces the impact of the guide tube's excessively rapid heat conduction on the temperature sensor, thereby improving the accuracy of temperature measurement by the temperature detection device.

[0020] In some technical solutions, optionally, a cutout is provided at the end of the guide tube that connects to the mounting base.

[0021] In this technical solution, a hollowed-out section is provided at one end of the guide tube that connects to the mounting base. The hollowed-out section reduces the connection area between the guide tube and the mounting base, thereby reducing the heat conduction efficiency between the guide tube and the mounting base.

[0022] Furthermore, the hollowed-out section also helps to reduce heat accumulation inside the guide tube, thereby improving the accuracy of temperature measurement by the temperature sensor.

[0023] In some technical solutions, the guide mounting structure may optionally be provided with a clearance opening for the connection line of the temperature sensor to pass through, and the clearance opening extends through the guide mounting structure along the extension direction of the temperature sensor.

[0024] In this technical solution, the guide installation structure is provided with an avoidance opening. The avoidance opening extends through the guide installation structure along the extension direction of the temperature sensor, so that the connection wire of the temperature sensor can be installed in the guide tube through the avoidance opening, thereby reducing the installation difficulty of the temperature detection device and improving the production efficiency of the temperature detection device.

[0025] In some technical solutions, the mounting base may optionally include: a mounting tube, a guide tube disposed on the mounting tube; and a mounting plate located on the outside of the mounting tube; wherein the spring abuts against the end face of the mounting tube.

[0026] In this technical solution, the mounting base includes a mounting tube and a mounting plate. The guide tube is set on the mounting tube, and the mounting plate is set on the outside of the mounting tube. Thus, the temperature detection device can be installed and fixed through the mounting plate, reducing the installation difficulty of the temperature detection device.

[0027] In some technical solutions, optionally, the outer side of the mounting plate has a limiting groove for fixing the temperature detection device.

[0028] In this technical solution, the outer side of the mounting plate has a limiting groove, which can be fixed and limited with the bracket of the induction cooker, thereby reducing the installation difficulty of the temperature detection device.

[0029] According to a second aspect of the present invention, an induction cooker is provided, comprising: a support; a coil disposed on the support, the coil being capable of simultaneous infrared heating and electromagnetic heating; a panel disposed on one side of the support; and a temperature detection device as provided in the first aspect embodiment, disposed on the support and passing through the center of the coil, the detection part abutting against the panel.

[0030] The induction cooker proposed in this invention includes the temperature detection device provided in the first aspect embodiment, and therefore has all the beneficial effects of the temperature detection device provided in the first aspect embodiment, which will not be described in detail here.

[0031] Additional aspects and advantages of the invention will become apparent in the following description or may be learned by practice of the invention. Attached Figure Description

[0032] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0033] Figure 1 A schematic diagram of the structure of a temperature detection device in the related technology is shown;

[0034] Figure 2 One of the structural schematic diagrams of a temperature detection device according to some embodiments of the present invention is shown;

[0035] Figure 3 One of the exploded views of a temperature detection device according to some embodiments of the present invention is shown;

[0036] Figure 4 Cross-sectional views of temperature detection devices according to some embodiments of the present invention are shown;

[0037] Figure 5 As shown Figure 4 A partial enlarged view of temperature detection device A shown;

[0038] Figure 6A schematic diagram of the mounting base in a temperature detection device according to some embodiments of the present invention is shown;

[0039] Figure 7 A second exploded view of a temperature detection device according to some embodiments of the present invention is shown;

[0040] Figure 8 The third exploded view of a temperature detection device according to some embodiments of the present invention is shown;

[0041] Figure 9 This shows one of the structural schematic diagrams of the guide mounting structure in a temperature detection device according to some embodiments of the present invention;

[0042] Figure 10 A cross-sectional view of the guide mounting structure in a temperature detection device according to some embodiments of the present invention is shown;

[0043] Figure 11 This is a second schematic diagram of the guide mounting structure in a temperature detection device according to some embodiments of the present invention;

[0044] Figure 12 This shows one of the structural schematic diagrams of the temperature detection device and the bracket in cooperation with some embodiments of the present invention;

[0045] Figure 13 This shows one of the structural schematic diagrams of the temperature detection device and the bracket in cooperation with some embodiments of the present invention;

[0046] Figure 14 A schematic diagram of the structure of an induction cooker according to some embodiments of the present invention is shown;

[0047] Figure 15 A partial cross-sectional view of an induction cooker according to some embodiments of the present invention is shown;

[0048] Figure 16 The diagram shows the temperature and actual temperature curves of an induction cooker using the first guide mounting structure according to some embodiments of the present invention during the water boiling process.

[0049] Figure 17 The diagram shows the temperature and actual temperature curves of an induction cooker using the second guide installation structure according to some embodiments of the present invention during the oil boiling process.

[0050] Figure 18 The diagram shows the temperature and actual temperature curves of an induction cooker using the third guide installation structure according to some embodiments of the present invention during the water boiling process.

[0051] Figure 19 The diagram shows the temperature and actual temperature curves of an induction cooker using the fourth guide mounting structure according to some embodiments of the present invention during the water boiling process.

[0052] Figure label:

[0053] 10' temperature sensing device, 13' thermistor, 14' spring;

[0054] 1. Induction cooker; 10. Temperature detection device; 11. Guide mounting structure; 111. Guide tube; 112. Mounting base; 113. Hollowed-out part; 115. Circumvention opening; 116. Mounting tube; 117. Mounting piece; 118. Limiting groove; 12. Temperature sensor; 121. Rod; 122. Detector; 123. Connecting wire; 14. Spring; 20. Bracket; 201. Limiting protrusion; 21. Panel; 22. Coil; 23. Heat insulation layer; 24. Housing; 3. Cookware. Detailed Implementation

[0055] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments of the present invention and the features thereof can be combined with each other.

[0056] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0057] The following reference Figures 2 to 19 This describes a temperature detection device 10 and an induction cooker 1 provided according to some embodiments of the present invention.

[0058] like Figure 2 , Figure 3 , Figure 4 , Figure 7 and Figure 8 As shown, the first aspect of the present invention provides a temperature detection device 10 for use in an induction cooker 1. The temperature detection device 10 includes a guide mounting structure 11, a temperature sensor 12, and a spring 14.

[0059] The guide mounting structure 11 includes a guide tube 111 and a mounting base 112. The guide tube 111 is disposed at one end of the mounting base 112, and the mounting base 112 protrudes from the side of the guide tube 111. The temperature sensor 12 passes through the guide tube 111 and the mounting base 112. The temperature sensor 12 includes a rod 121 and a detection part 122. The detection part 122 is located on one side of the rod 121 and protrudes from the side of the rod 121. A spring 14 is sleeved on the outside of the guide tube 111, and one end of the spring 14 abuts against the detection part 122, while the other end of the spring 14 abuts against the mounting base 112.

[0060] The temperature detection device 10 provided by the present invention includes a guide mounting structure 11, a temperature sensor 12, and a spring 14. The guide mounting structure 11 includes a guide tube 111 and a mounting base 112 disposed at one end of the guide tube 111. The temperature sensor 12 includes a rod 121 and a detection part 122 disposed at one end of the rod 121. The rod 121 passes through the guide tube 111, and the detection part 122 is located on the side of the guide tube 111 away from the mounting base 112. The spring 14 is sleeved on the outside of the guide tube 111. One end of the spring 14 abuts against the detection part 122, and the other end abuts against the mounting base 112. That is, the temperature sensor 12 is guided by the guide tube 111, reducing the possibility of the temperature sensor 12 being misaligned, increasing the contact area between the temperature sensor 12 and the panel 21, and improving the accuracy of temperature measurement by the temperature detection device 10.

[0061] The spring 14 is located on the outside of the guide tube 111, thereby reducing the influence of the spring 14 on the temperature inside the guide tube 111 and improving the accuracy of the temperature detection device 10.

[0062] like Figure 2 , Figure 3 , Figure 4 , Figure 7 and Figure 8 As shown, in some embodiments, optionally, the side of the detector 122 facing away from the rod 121 is a plane. The detector 122 may be disc-shaped or polygonal disc-shaped. The rod 121 may be cylindrical or polygonal column-shaped.

[0063] like Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, in some embodiments, optionally, the guide tube 111 and the mounting base 112 are separate structures, the guide tube 111 and the mounting base 112 are assembled together, and the thermal conductivity of the guide tube 111 is greater than that of the mounting base 112.

[0064] In this embodiment, the thermal conductivity of the guide tube 111 is greater than that of the mounting base 112. That is, the guide tube 111 can conduct heat quickly, thereby reducing the heat accumulation inside the guide tube 111. The mounting base 112 will reduce the heat dissipation of the guide tube 111, so that the heat dissipation capacity of the guide tube 111 is within a reasonable range, reducing the impact of the guide tube 111 on the temperature sensor 12 due to excessively rapid heat conduction, thereby improving the accuracy of temperature measurement of the temperature detection device 10.

[0065] Specifically, since the temperature sensor 12 of the temperature detection device 10 is in contact with the panel 21 of the induction cooker 1, the heat from the heating coil 22 or the pot 3 will radiate into the space where the temperature detection device 10 is located. Furthermore, the detection part 122 will also guide the temperature of the panel 21 to the rod part 121. Most of the rod part 121 is located inside the guide tube 111. Therefore, heat will accumulate inside the guide tube 111. If the heat pipe cannot quickly dissipate the heat, it will cause heat accumulation inside the guide tube 111, resulting in the temperature detected by the temperature sensor 12 being higher than the actual temperature.

[0066] Furthermore, if the guide tube 111 quickly dissipates heat to the location of the temperature detection device 10, the temperature detected by the temperature sensor 12 will be lower than the actual temperature.

[0067] Therefore, the thermal conductivity of the guide tube 111 is set to be greater than that of the mounting base 112. This means that the guide tube 111 can conduct heat quickly, thereby reducing the heat accumulation inside the guide tube 111. Meanwhile, the mounting base 112 will reduce the heat dissipation of the guide tube 111, thus keeping the heat dissipation capacity of the guide tube 111 within a reasonable range. This reduces the impact of the guide tube 111 on the temperature sensor 12 due to excessively rapid heat conduction, thereby improving the accuracy of temperature measurement by the temperature detection device 10.

[0068] like Figure 5 As shown, in some embodiments, optionally, the guide tube 111 is inserted into the mounting base 112, and the guide tube 111 and the mounting base 112 are interference-fitted.

[0069] In this embodiment, the guide tube 111 and the mounting base 112 are separate structures. That is, the guide tube 111 and the mounting base 112 are assembled together. The guide tube 111 is inserted into the mounting tube 116, and the guide tube 111 and the mounting tube 116 are interference-fitted, thereby improving the connection strength between the guide tube 111 and the mounting base 112, reducing the possibility of separation between the guide tube 111 and the mounting base 112, and this arrangement can reduce the number of assembly parts and reduce the installation difficulty of the temperature detection device 10.

[0070] In some embodiments, the thermal conductivity of the guide tube 111 may be greater than or equal to 150 watts per meter Kelvin (w / (m·k)) and less than or equal to 220 watts per meter Kelvin.

[0071] In this embodiment, the thermal conductivity of the guide tube 111 is greater than or equal to 150 watts per meter Kelvin and less than or equal to 220 watts per meter Kelvin. The guide tube 111 with a thermal conductivity between 150 watts per meter Kelvin and 220 watts per meter Kelvin can quickly dissipate the heat accumulated inside, thereby improving the temperature consistency inside and outside the guide tube 111. Reducing heat accumulation can improve the accuracy of temperature measurement by the temperature sensor 12.

[0072] The thermal conductivity of the guide tube 111 is greater than or equal to 180 watts per meter Kelvin and less than or equal to 200 watts per meter Kelvin. The thermal conductivity of the guide tube 111 can be 150 watts per meter Kelvin, 160 watts per meter Kelvin, 170 watts per meter Kelvin, 180 watts per meter Kelvin, 190 watts per meter Kelvin, 200 watts per meter Kelvin, 210 watts per meter Kelvin, or 220 watts per meter Kelvin.

[0073] In some embodiments, the thermal conductivity of the mounting base 112 may be less than or equal to 8 watts per meter Kelvin.

[0074] In this embodiment, the thermal conductivity of the mounting base 112 is less than or equal to 8 watts per meter Kelvin. The mounting base 112 with a thermal conductivity of less than or equal to 8 watts per meter Kelvin can reduce the ability of the guide tube 111 to conduct heat to other components, thereby reducing the heat dissipation of the guide tube 111 and making the temperature of the guide tube 111 closer to the ambient temperature of the environment in which the guide tube 111 is located. This reduces the impact on the temperature sensor 12 and improves the accuracy of temperature measurement by the temperature sensor 12.

[0075] Theoretically, the thermal conductivity of the mounting base 112 can be 0 watts per meter Kelvin. However, due to material limitations, the lower the thermal conductivity of the mounting base 112, the smaller its impact on the guide tube 111, and thus the smaller its impact on the temperature sensor 12. The thermal conductivity of the mounting base 112 can be 1 watt per meter Kelvin, 2 watts per meter Kelvin, 3 watts per meter Kelvin, 4 watts per meter Kelvin, 5 watts per meter Kelvin, 6 watts per meter Kelvin, 7 watts per meter Kelvin, or 8 watts per meter Kelvin.

[0076] Because the guide tube 111 needs to guide the thermistor, the gap between the guide tube 111 and the thermistor is designed to be relatively small, which can easily lead to heat accumulation and cause the thermistor to malfunction in temperature measurement. The guide tube 111, which guides the thermistor, needs to have good thermal conductivity so that the heat inside the guide tube 111 can be quickly transferred into the air to maintain the temperature stability of the measurement area.

[0077] However, since the guide tube 111 is connected to the mounting base 112, the heat of the guide tube 111 will be transferred to the mounting base 112. If the thermal conductivity of the mounting base 112 is very good, the heat of the guide tube 111 and the thermistor will be quickly dissipated, causing the thermistor to have abnormal temperature measurement, resulting in abnormal heating of the induction cooker 1. Therefore, the thermal conductivity of the mounting base 112 needs to be as small as possible.

[0078] In some embodiments, the guide tube 111 may be made of aluminum alloy.

[0079] In this embodiment, the guide tube 111 is made of aluminum alloy, which combines heat dissipation performance and strength, and is easy to process, thereby reducing the production cost of the temperature detection device 10.

[0080] Among them, aluminum alloys can be selected from the 6 series, such as 6061 aluminum alloy, 6063 aluminum alloy or 6082 aluminum alloy, etc.

[0081] In some embodiments, the mounting base 112 may be made of plastic or fiberglass.

[0082] In this embodiment, the mounting base 112 is made of plastic or fiberglass. Plastic or fiberglass combines heat insulation performance and strength, and is easy to process, thereby reducing the production cost of the temperature detection device 10.

[0083] The plastic can be an engineering plastic, such as epoxy resin, polyvinyl chloride, polyethylene, polypropylene, polystyrene, or polyphenylene sulfide (PPS).

[0084] like Figure 16 As shown, the first type of guide installation structure 11 is made entirely of plastic. The process of boiling water and the actual water temperature curve of the induction cooker 1 using the guide installation structure 11 made entirely of plastic can be compared, and it can be seen that there is a certain temperature difference between the two.

[0085] like Figure 17 As shown, the second type of guide mounting structure 11 is made of all-aluminum alloy, and the guide mounting structure 11 has not been treated to reduce the connection area. That is, the process of boiling oil and the actual temperature of water in the induction cooker 1 using the all-aluminum alloy guide mounting structure 11 are compared. It can be seen that there is a certain temperature difference between the two.

[0086] like Figure 18As shown, the third type of guide installation structure 11 consists of an aluminum alloy guide tube 111 and a plastic mounting base 112. The graph shows the process of boiling water and the actual water temperature curve of the induction cooker 1 using the aluminum alloy guide tube 111 and the plastic mounting base 112. A comparison reveals that the temperature difference between the two is extremely small and can be ignored. Of course, the temperature difference is also extremely small when boiling oil, which will not be discussed further here.

[0087] like Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, in some embodiments, optionally, the guide tube 111 and the mounting base 112 are an integral structure, and the end face area of ​​the end of the guide tube 111 connected to the mounting base 112 is smaller than the end face area of ​​the end of the guide tube 111 away from the mounting base 112.

[0088] In this embodiment, since the temperature sensor 12 of the temperature detection device 10 is in contact with the panel 21 of the induction cooker 1, the heat from the heating coil 22 or the pot 3 will radiate into the space where the temperature detection device 10 is located. Furthermore, the detection part 122 will also guide the temperature of the panel 21 to the rod part 121. Most of the rod part 121 is located inside the guide tube 111. Therefore, heat will accumulate inside the guide tube 111. If the heat pipe cannot quickly dissipate the heat, it will cause heat accumulation inside the guide tube 111, resulting in the temperature detected by the temperature sensor 12 being higher than the actual temperature.

[0089] The guide tube 111 and the mounting base 112 are an integral structure. The end face area of ​​the end of the guide tube 111 connected to the mounting base 112 is smaller than the end face area of ​​the end of the guide tube 111 away from the mounting base 112. That is, by reducing the connection area between the guide tube 111 and the mounting base 112, the heat conduction efficiency between the guide tube 111 and the mounting base 112 is reduced. The guide tube 111 can achieve rapid heat conduction, thereby reducing the heat accumulation in the guide tube 111. The amount of heat transferred from the guide tube 111 to the mounting base 112 is less, thus keeping the heat dissipation capacity of the guide tube 111 within a reasonable range. This reduces the impact of the guide tube 111 on the temperature sensor 12 due to excessively rapid heat conduction, thereby improving the accuracy of temperature measurement by the temperature detection device 10.

[0090] Because the guide tube 111 needs to guide the thermistor, the gap between the guide tube 111 and the thermistor is designed to be relatively small, which can easily lead to heat accumulation and cause the thermistor to malfunction in temperature measurement. The guide tube 111, which guides the thermistor, needs to have good thermal conductivity so that the heat inside the guide tube 111 can be quickly transferred into the air to maintain the temperature stability of the measurement area.

[0091] However, since the guide tube 111 is connected to the mounting base 112, the heat of the guide tube 111 will be transferred to the mounting base 112. If the mounting base 112 has good thermal conductivity, it will quickly conduct the heat of the guide tube 111 and the thermistor, causing the thermistor to have abnormal temperature measurement, resulting in abnormal heating of the induction cooker 1. Therefore, the thermal conductivity area between the guide tube 111 and the mounting base 112 needs to be as small as possible.

[0092] In some embodiments, the thermal conductivity of the guide tube 111 and the mounting base 112 may be greater than or equal to 150 watts per meter Kelvin (w / (m·k)) and less than or equal to 220 watts per meter Kelvin.

[0093] In this embodiment, the thermal conductivity of the guide tube 111 and the mounting base 112 ranges from greater than or equal to 150 watts per meter Kelvin to less than or equal to 220 watts per meter Kelvin. The guide tube 111, with a thermal conductivity between 150 watts per meter Kelvin and 220 watts per meter Kelvin, can quickly dissipate the heat accumulated inside, thereby improving the temperature consistency inside and outside the guide tube 111. Reducing heat accumulation can improve the accuracy of temperature measurement by the temperature sensor 12.

[0094] The thermal conductivity of the guide tube 111 and the mounting base 112 is greater than or equal to 180 watts per meter Kelvin and less than or equal to 200 watts per meter Kelvin. The thermal conductivity of the guide tube 111 and the mounting base 112 can be 150 watts per meter Kelvin, 160 watts per meter Kelvin, 170 watts per meter Kelvin, 180 watts per meter Kelvin, 190 watts per meter Kelvin, 200 watts per meter Kelvin, 210 watts per meter Kelvin, or 220 watts per meter Kelvin.

[0095] In some embodiments, the guide mounting structure 11 may be made of aluminum alloy.

[0096] In this embodiment, the guide mounting structure 11 is made of aluminum alloy, which combines heat dissipation performance and strength, and is easy to process, thereby reducing the production cost of the temperature detection device 10.

[0097] Among them, aluminum alloys can be selected from the 6 series, such as 6061 aluminum alloy, 6063 aluminum alloy or 6082 aluminum alloy, etc.

[0098] like Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, in some embodiments, optionally, a cutout portion 113 is provided at one end of the guide tube 111 that is connected to the mounting base 112.

[0099] In this embodiment, a hollow portion 113 is provided at one end of the guide tube 111 connected to the mounting base 112. The hollow portion reduces the connection area between the guide tube 111 and the mounting base 112, thereby reducing the heat conduction efficiency between the guide tube 111 and the mounting base 112.

[0100] Furthermore, the hollowed-out portion 113 also helps to reduce the heat accumulation inside the guide tube 111, thereby improving the accuracy of temperature measurement by the temperature sensor 12.

[0101] That is, an opening is made at the end of the guide tube 111, so that only a portion of the guide tube 111 is connected to the mounting base 112. Alternatively, a groove is provided on the outer side of the guide tube 111, so that only the inner part of the guide tube 111 is connected to the mounting base 112. Or, a groove is provided on the inner side of the guide tube 111, so that only the inner part of the guide tube 111 is connected to the mounting base 112.

[0102] like Figure 16 As shown, the first type of guide installation structure 11 is made entirely of plastic. The process of boiling water and the actual water temperature curve of the induction cooker 1 using the guide installation structure 11 made entirely of plastic can be compared, and it can be seen that there is a certain temperature difference between the two.

[0103] like Figure 17 As shown, the second type of guide mounting structure 11 is made of all-aluminum alloy, and the guide mounting structure 11 has not been treated to reduce the connection area. That is, the process of boiling oil and the actual temperature of water in the induction cooker 1 using the all-aluminum alloy guide mounting structure 11 are compared. It can be seen that there is a certain temperature difference between the two.

[0104] like Figure 19 As shown, the fourth type of guide mounting structure 11 is made entirely of aluminum alloy, and the end of the guide tube 111 facing the mounting base 112 has a hollow part 113. A comparison of the water boiling process and the actual water temperature curve of the induction cooker 1 using the aluminum alloy guide mounting structure 11 shows that the temperature difference between the two is extremely small and can be ignored. Of course, the temperature difference is also extremely small when boiling oil, which will not be discussed further here.

[0105] like Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, in some embodiments, the guide mounting structure 11 is optionally provided with a clearance opening 115 for the passage of the connection line 123 of the temperature sensor 12.

[0106] In this embodiment, the guide mounting structure 11 is provided with an avoidance opening 115, so that the connecting wire 123 of the temperature sensor 12 can be installed in the guide tube 111 through the avoidance opening 115, thereby reducing the installation difficulty of the temperature detection device 10 and improving the production efficiency of the temperature detection device 10.

[0107] The clearance opening 115 extends through the side wall of the guide mounting structure 11 along the extension direction xy of the temperature sensor 12, and the temperature sensor 12 can enter the interior of the mounting tube 116 through the clearance opening 115.

[0108] The clearance opening 115 extends through the guide mounting structure 11 along its axial direction.

[0109] The guide tube 111 and the mounting base 112 can be an integral structure or a separate structure.

[0110] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, in some embodiments, optionally, the mounting base 112 includes a mounting tube 116 and a mounting piece 117, with a guide tube 111 disposed on the mounting tube 116 and the mounting piece 117 located on the outside of the mounting tube 116; wherein the spring 14 abuts against the end face of the mounting tube 116.

[0111] In this embodiment, the mounting base 112 includes a mounting tube 116 and a mounting piece 117. The guide tube 111 is disposed on the mounting tube 116, and the mounting piece 117 is disposed on the outside of the mounting tube 116. Thus, the temperature detection device 10 can be installed and fixed through the mounting piece 117, reducing the installation difficulty of the temperature detection device 10.

[0112] When the guide tube 111 and the mounting base 112 are separate structures, the guide tube 111 is inserted inside the mounting tube 116; when the guide tube 111 and the mounting base 112 are an integral structure, the guide tube 111 is located at the end of the mounting tube 116.

[0113] like Figure 2 , Figure 3 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, in some embodiments, optionally, the outer side of the mounting plate 117 has a limiting groove 118, which is used to fix the temperature detection device 10.

[0114] In this embodiment, the outer side of the mounting plate 117 has a limiting groove 118, which can be fixed and limited with the heat insulation layer 23 of the induction cooker 1, thereby reducing the installation difficulty of the temperature detection device 10.

[0115] The induction cooker 1 includes a support 20, which has a limiting protrusion 201 that matches the limiting groove 118 of the mounting plate 117. Figure 12 and Figure 13 As shown, during installation, the mounting base 112 can be rotated so that the limiting protrusion 201 is engaged in the limiting groove 118, thus completing the installation and fixation of the temperature detection device 10 and the bracket 20. Figure 12 and Figure 13 The arrow in the diagram indicates the rotation direction of the guide mounting structure 11.

[0116] In some embodiments, the temperature sensor 12 may optionally be a thermistor or a thermocouple, etc.

[0117] In some embodiments, the temperature sensor 12 is optionally ceramic-encapsulated, with at least a portion of the probe 122 being ceramic and at least a portion of the rod 121 being ceramic. A thermistor with a ceramic encapsulation slides within a guide tube 111, which is disposed in a mounting base 112. A spring 14 is disposed between the thermistor and the mounting base 112 to provide elastic force for the thermistor to slide up and down.

[0118] In some embodiments, the temperature detection device 10 may optionally include a temperature sensor 12, a spring 14, and a guide mounting structure 11. The guide mounting structure 11 includes a separate guide tube 111 and a mounting base 112. The thermistor has a ceramic package, the spring 14 provides elastic force for the temperature sensor 12, the guide tube 111 provides guidance for the temperature sensor 12, and the temperature sensor 12 can slide within the guide tube 111. The temperature sensor 12 is a thermistor.

[0119] like Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 7 and Figure 8As shown, the temperature detection device 10 includes a ceramic-encapsulated thermistor, a spring 14, and a guide mounting structure 11. The guide mounting structure 11 includes a guide tube 111 and a mounting base 112. The mounting base 112 is provided with a limiting groove 118. The mounting base 112 and the guide tube 111 can be fixed by interference fit between the guide tube 111 and the mounting base 112. The thermistor is fitted inside the guide tube 111 and can slide. One end of the spring 14 presses against the detection part 122 of the thermistor, and the other end presses against the mounting base 112, so that the thermistor can slide up and down relative to the mounting base 112.

[0120] The guide tube 111 is made of aluminum alloy or other materials with good thermal conductivity, and the mounting base 112 is made of high-temperature resistant engineering plastic or other materials with poor thermal conductivity.

[0121] like Figure 15 As shown, the aluminum alloy guide tube 111 not only serves as a guide, but also keeps the temperature of the thermistor and the temperature inside the guide tube 111 in a state of rapid equilibrium with the temperature measuring chamber where the temperature detection device 10 is located, so that the temperature of the cookware 3 and the temperature trend measured by the thermistor can be consistent. The plastic mounting base 112 not only fixes the aluminum alloy guide tube 111, but also keeps the temperature of the temperature measuring chamber where the temperature detection device 10 is located consistent with the temperature trend of the cookware 3.

[0122] like Figure 18 As shown, by using the above settings, the trend of the thermistor's test temperature can be kept consistent with the actual temperature, thereby improving the accuracy of temperature measurement.

[0123] like Figure 6 , Figure 12 and Figure 13 As shown, the mounting base 112 is provided with a limit protrusion. The mounting base 112 is placed on the bracket 20 of the induction cooker 1 and can only be rotated clockwise or counterclockwise. When it is rotated to the stop position and fixed to the bracket 20, the assembly is completed.

[0124] In practical engineering applications, considering production processes and costs, aluminum alloy is used as the material for the guide tube 111, which facilitates standardized production and procurement. Other materials with good thermal conductivity can also be used. The mounting base 112 is made of high-temperature resistant plastic to prevent the guide tube 111 from scalding the mounting base 112.

[0125] In some embodiments, the temperature detection device 10 may optionally include a temperature sensor 12, a spring 14, and a guide mounting structure 11. The guide mounting structure 11 includes an integral guide tube 111 and a mounting base 112. The thermistor has a ceramic package, the spring 14 provides elastic force for the temperature sensor 12, the guide tube 111 provides guidance for the temperature sensor 12, and the temperature sensor 12 can slide within the guide tube 111. The temperature sensor 12 is a thermistor.

[0126] like Figure 9 and Figure 10 As shown, the guide tube 111 and the mounting base 112 are an integrated structure, and the material is selected as a material with a high conductivity, such as aluminum alloy. By reducing the area at the connection between the guide tube 111 and the mounting base 112, the heat conduction from the guide tube 111 to the mounting base 112 is reduced. For example, a hollow part 113 is provided at the connection position between the guide tube 111 and the mounting base 112, which retains the guide tube 111 while reducing the heat conduction between the guide tube 111 and the mounting base 112.

[0127] like Figure 7 , Figure 8 and Figure 11 As shown, the guide tube 111 and the mounting base 112 are provided with an avoidance opening 115. The avoidance opening 115 is a long notch, which allows the temperature sensor 12 and the connecting wire 123 of the temperature sensor 12 to slide directly in without having to pass through from top to bottom, thus reducing the difficulty of installation.

[0128] like Figure 14 and Figure 15 As shown, according to a second aspect of the present invention, an induction cooker 1 is provided, comprising: a support 20; a coil 22 disposed on the support 20, the coil 22 being capable of simultaneous infrared heating and electromagnetic heating; a panel 21 disposed on one side of the support 20; and a temperature detection device 10 as provided in the first aspect embodiment disposed on the support 20, the temperature detection device 10 passing through the center of the coil 22, the detection part 122 abutting against the panel 21.

[0129] The induction cooker 1 provided by the present invention includes the temperature detection device 10 as provided in the first aspect embodiment, and therefore has all the beneficial effects of the temperature detection device 10 as provided in the first aspect embodiment, which will not be described in detail here.

[0130] like Figure 14 and Figure 15 As shown, in some embodiments, the induction cooker 1 may optionally include a heat insulation layer 23, which is disposed on one side of the support 20, the coil 22 is disposed on one side of the heat insulation layer 23, the panel 21 is located on the side of the coil 22 away from the support 20, and a mounting hole is provided in the middle of the support 20 and the heat insulation layer 23, and the temperature detection device 10 is disposed in the mounting hole.

[0131] The mounting base 112 of the temperature detection device 10 and the bracket 20 are aligned to fix the temperature detection device 10 and the bracket 20.

[0132] Furthermore, the detection part 122 of the temperature sensor 12 and the side of the panel 21 facing the coil 22 are abutted together.

[0133] Coil 22 can achieve both infrared heating and electromagnetic heating.

[0134] Spring 14 provides elasticity to temperature sensor 12, so that temperature sensor 12 can better resist panel 21.

[0135] The induction cooker 1 also includes a housing 24, and the panel 21 is fixed to the housing 24.

[0136] The temperature detection device 10 can be fixed inside the bracket 20 by the housing 24 or other components.

[0137] In the description of this invention, the term "a plurality of" refers to two or more. Unless otherwise explicitly defined, the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. The terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0138] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0139] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A temperature detection device, characterized in that, include: A guide mounting structure, comprising a guide tube and a mounting base, wherein the mounting base is located at one end of the guide tube; A temperature sensor is inserted through the guide tube. The temperature sensor includes a rod and a detection part. The detection part is located at one end of the rod and outside the guide tube. A spring is sleeved on the outside of the guide tube, with one end of the spring abutting against the mounting base and the other end of the spring abutting against the detection part.

2. The temperature detection device according to claim 1, characterized in that, The guide tube and the mounting base are separate structures, and the thermal conductivity of the guide tube is greater than that of the mounting base. The guide tube is inserted into the mounting base, and the guide tube and the mounting base are interference-fitted.

3. The temperature detection device according to claim 2, characterized in that, The thermal conductivity of the guide tube is greater than or equal to 150 watts per meter Kelvin and less than or equal to 220 watts per meter Kelvin. The thermal conductivity of the mounting base is less than or equal to 8 watts per meter Kelvin.

4. The temperature detection device according to claim 2, characterized in that, The guide tube is made of aluminum alloy; The mounting base is made of plastic or fiberglass.

5. The temperature detection device according to claim 1, characterized in that, The guide tube and the mounting base are an integral structure; The end face area of ​​the guide tube connected to the mounting base is smaller than the end face area of ​​the guide tube away from the mounting base.

6. The temperature detection device according to claim 5, characterized in that, The guide tube has a hollowed-out section at one end where it connects to the mounting base.

7. The temperature detection device according to any one of claims 1 to 6, characterized in that, The guide mounting structure is provided with an avoidance opening for the connection line of the temperature sensor to pass through, and the avoidance opening extends through the guide mounting structure along the extension direction of the temperature sensor.

8. The temperature detection device according to any one of claims 1 to 6, characterized in that, The mounting base includes: The mounting tube, wherein the guide tube is disposed on the mounting tube; The mounting plate is located on the outside of the mounting tube; The spring and the end face of the mounting tube abut each other.

9. The temperature detection device according to claim 8, characterized in that, The mounting plate has a limiting groove on its outer side, which is used to fix the temperature detection device.

10. An induction cooker, characterized in that, include: support; A coil is mounted on the bracket, and the coil can simultaneously perform infrared heating and electromagnetic heating. A panel is disposed on one side of the bracket; The temperature detection device as described in any one of claims 1 to 9 is disposed on the bracket and passes through the center of the coil, with the detection part abutting against the panel.

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