Electronic device

Abstract

An electronic device includes a substrate, and a first electronic component, a second electronic component, a first switch transistor and a common pad disposed on the substrate. The first switch transistor is coupled with the first electronic component and the second electronic component. The common electric pad is coupled with the first electronic element and the second electronic element through the first switch transistor. When the first switching transistor is turned on, the electrical properties from the first electronic component and the second electronic component can be measured from the common pad, respectively, and when the first switching transistor is turned off, the electrical properties from the first electronic component and the second electronic component cannot be measured from the common pad, respectively.

Description

Technical Field

[0001] This disclosure relates to an electronic device, and more particularly to an electronic device for performing electrical measurements. Background Technology

[0002] In electronic devices, due to the need for high-density placement, the area of ​​electronic device layout may become smaller and smaller. In order to test electronic devices, corresponding test pads are required. However, if electronic devices are occupied by a large number of test pads, it is not conducive to the layout of electronic devices and there is a need to improve it.

[0003] Therefore, it is necessary to provide a novel electronic device to improve the aforementioned problems. Summary of the Invention

[0004] This disclosure provides an electronic device comprising: a substrate; a first electronic component and a second electronic component disposed on the substrate; a first switching transistor disposed on the substrate and coupled to the first electronic component and the second electronic component; and a common electrical pad disposed on the substrate and coupled to the first electronic component and the second electronic component respectively through the first switching transistor, wherein when the first switching transistor is turned on, the electrical properties of the first electronic component and the second electronic component can be measured from the common electrical pad respectively, and when the first switching transistor is turned off, the electrical properties of the first electronic component and the second electronic component cannot be measured from the common electrical pad respectively.

[0005] This disclosure also provides an electronic device comprising: a substrate; a first electronic component and a second electronic component disposed on the substrate; a first switching transistor and a second switching transistor disposed on the substrate, wherein the first switching transistor is coupled to the first electronic component and the second switching transistor is coupled to the second electronic component; and a common electrical pad disposed on the substrate, coupled to the first electronic component via the first switching transistor and coupled to the second electronic component via the second switching transistor, wherein when the first switching transistor and the second switching transistor are respectively turned on, electrical properties from the first electronic component and the second electronic component can be measured from the common electrical pad respectively, and when the first switching transistor and the second switching transistor are respectively turned off, electrical properties from the first electronic component and the second electronic component cannot be measured from the common electrical pad respectively.

[0006] Other novel features of this disclosure will become clearer from the following detailed description and in conjunction with the accompanying drawings. Attached Figure Description

[0007] Figure 1 This is a circuit structure diagram and a circuit timing diagram of an electronic device according to an embodiment of the present disclosure.

[0008] Figure 2 This is another circuit structure schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0009] Figure 3 This is a circuit structure diagram and circuit timing diagram of an electronic device according to another embodiment of the present disclosure.

[0010] Figure 4 This is a schematic diagram of another circuit structure of an electronic device according to another embodiment of the present disclosure.

[0011] Figure 5 This is a circuit structure diagram and circuit timing diagram of an electronic device according to another embodiment of the present disclosure.

[0012] Figure 6 This is a schematic diagram of the circuit structure of an electronic device according to another embodiment of the present disclosure.

[0013] Figure 7 This is a circuit structure diagram and circuit timing diagram of an electronic device according to another embodiment of the present disclosure.

[0014] Figure 8 This is a schematic diagram of the circuit structure of an electronic device according to another embodiment of the present disclosure.

[0015] Figure 9 This is a circuit structure diagram and timing diagram of an electronic device according to another embodiment of the present disclosure.

[0016] Figure 10 The electronic device disclosed herein uses a measurement architecture for testing with a contact-type shared electric pad.

[0017] Figure 11 The electronic device disclosed herein uses a measurement architecture for non-contact shared electric pad testing.

[0018] The meanings of the reference numerals in the above figures are as follows:

[0019] Electronic device 1

[0020] Substrate 10

[0021] Electronic components D_1~D_N, D_A

[0022] Switching transistors TS_1~TS_N, TS_a

[0023] Shared electric pad 12

[0024] Switching signals SW_1~SW_N, SW_A

[0025] Input signals S_1~S_N, S'

[0026] First semiconductor element Tr

[0027] Second semiconductor element Tg

[0028] Third semiconductor element Tb

[0029] 20 test machines

[0030] Probe 21

[0031] Circuit Unit 22

[0032] Backlight module 31

[0033] Polarizing plate 32

[0034] LCD module 35

[0035] Optical sensor 36 Detailed Implementation

[0036] The following description provides various embodiments of this disclosure, which are intended to explain the technical content of this disclosure and are not intended to limit the scope of this disclosure. Features described in one embodiment may be adapted to other embodiments by appropriate modifications, substitutions, combinations, or separations.

[0037] It should be noted that in this specification, when a component is described as "comprising", "having", or "including" an element, it means that the component may include one or more elements, and the component may include other elements at the same time, and does not mean that the component has only one element, unless otherwise stated.

[0038] Furthermore, in this specification, ordinal numbers such as "first" or "second" are used only to distinguish multiple elements with the same name and do not imply an inherent hierarchy, rank, execution order, or manufacturing order among the elements, unless otherwise stated. The element numbers in the specification may differ from those in the claims. For example, a "second" element in the specification may be a "first" element in the claims.

[0039] In this specification, unless otherwise stated, "or" for feature A and "and / or" for feature B means the existence of only feature A, the existence of only feature B, or the existence of both feature A and feature B. "and" for feature A means the existence of both feature A and feature B.

[0040] Furthermore, in this specification, terms such as "top," "above," "bottom," "front," "back," or "middle," as well as terms such as "above," "on top," "on the surface," "below," "below," or "between," are used to describe the relative positions between multiple elements. The described relative positions can be interpreted as including their translation, rotation, or reflection.

[0041] Furthermore, terms used in the specification and claims, such as “above,” “over,” “on top,” “below,” or “under,” are intended to allow an element to contact not only directly but also indirectly.

[0042] Furthermore, terms used in the specification and claims, such as "connection," mean that an element can be directly connected to other elements as well as indirectly connected to other elements. On the other hand, terms such as "electrical connection" and "coupled" used in the specification and claims mean that an element can be directly electrically connected to other elements as well as indirectly connected to other elements.

[0043] In the specification and claims, the terms "about," "approximately," "substantially," and "generally" typically indicate a range where the difference between a value and a given value is within 10%, 5%, 3%, 2%, 1%, or 0.5% of the given value. The quantities given here are approximate, meaning that the terms "about," "approximately," "substantially," and "generally" are implied even without specific mention. Furthermore, the terms "range from the first value to the second value" and "range between the first value and the second value" indicate that the range includes the first value, the second value, and other values ​​in between.

[0044] In this disclosure, the thickness, length, and width can be measured using an optical microscope, while the thickness can be measured from a cross-sectional image in an electron microscope, but is not limited thereto. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first value equals the second value, it implies an error of approximately 10% between the two values; if the first direction is perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees; if the first direction is parallel to the second direction, the angle between the first and second directions may be between -10 and 10 degrees.

[0045] In this specification, unless otherwise stated, the terms used herein (including technical and scientific terms) have meanings commonly known to those skilled in the art. It should be noted that, unless otherwise stated in the embodiments of this disclosure, these terms (e.g., terms as defined in a general dictionary) should have the same meaning as those skilled in the art, the background of this disclosure, or the context of this specification, and should not be read in an idealized or overly formal manner.

[0046] Furthermore, the electronic devices disclosed herein may include, but are not limited to, display devices, backlight devices, antenna devices, sensing devices, or splicing devices. The electronic devices may be bendable or flexible. The display devices may be non-emissive or emissive. The antenna devices may be liquid crystal type or non-liquid crystal type antenna devices, and the sensing devices may be sensing devices for capacitance, light, heat, or ultrasound, but are not limited to these. Electronic components may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes or photodiodes. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, or quantum dot LEDs, but are not limited to these. Splicing devices may be, for example, display splicing devices or antenna splicing devices, but are not limited to these. It should be noted that the electronic devices may be any combination of the foregoing, but are not limited to these.

[0047] Please refer to Figure 1 The diagram shown is a circuit structure schematic and timing diagram of an electronic device according to an embodiment of the present disclosure, wherein, as Figure 1 As shown in the circuit structure, the electronic device 1 includes a substrate 10 and circuit units disposed on the substrate 10. For clarity, Figure 1The circuit structure shown primarily illustrates a circuit unit of electronic device 1, omitting schematics of other circuit units. This circuit unit includes an electronic component D_1, an electronic component D_2, a switching transistor TS_1, and a common electrical pad 12. Electronic components D_1 and D_2 are disposed on substrate 10. These electronic components (D_1, D_2) can include passive and / or active components, such as capacitors, resistors, inductors, diodes, transistors, ICs, other suitable components, and circuits including these components. Switching transistor TS_1 is disposed on substrate 10 and coupled to electronic components D_1 and D_2. More specifically, the control terminal of switching transistor TS_1 is connected to a switching signal SW_1, and the two terminals of switching transistor TS_1 are respectively coupled to electronic components D_1 and D_2. A common electrical pad 12 is disposed on the substrate 10 and coupled to electronic components D_1 and D_2 respectively via a switching transistor TS_1. More specifically, the common electrical pad 12 is coupled to electronic component D_1 and selectively coupled to electronic component D_2 according to the control of the switching transistor TS_1. Accordingly, since multiple electronic components (D_1, D_2) share a single switching transistor TS_1, and the output positions of electronic components (D_1, D_2) are spaced apart by the switching transistor TS_1, the output signal can be conveniently monitored using a single switching transistor TS_1 and a single common electrical pad 12, thereby optimizing the layout area and saving testing time.

[0048] With the circuit structure described above, when the switching transistor TS_1 is ON, the electrical properties of electronic components D_1 and D_2 can be measured from the common electrical pad 12. When the switching transistor TS_1 is OFF, the electrical properties of electronic components D_1 and D_2 cannot be measured from the common electrical pad 12. For example, please refer to [reference needed]. Figure 1 In the circuit timing, the switching transistor TS_1 is turned on or off by the switching signal SW_1. That is, this disclosure uses the switching signal SW_1 to control the state of the switching transistor TS_1 to ensure that the switching transistor TS_1 is activated during measurement and remains off at other times. In this embodiment, since the switching transistor TS_1 is an N-type transistor, when the switching signal SW_1 is at a low potential (e.g., representing logic 0), the switching transistor TS_1 is turned on (ON), and conversely, when the switching signal SW_1 is at a high potential (e.g., representing logic 1), the switching transistor TS_1 is turned off (OFF). However, this is only an example and not a limitation. It is conceivable that the switching transistor TS_1 can also be a P-type transistor or other suitable types of transistors. Therefore, as Figure 1As shown in the circuit timing diagram, during the period TP when the switching transistor TS_1 is turned on, the common electrical pad 12 is coupled to electronic components D_1 and D_2 respectively. During this period TP, an input signal S_1 can be applied to electronic component D_1 and an input signal S_2 can be applied to electronic component D_2. The input signals S_1 and S_2 do not overlap in time. Since the common electrical pad 12 is coupled to electronic components D_1 and D_2, when the input signal S_1 is applied to electronic component D_1, the output of electronic component D_1 can be obtained, and the electrical properties of electronic component D_1 can be measured from the common electrical pad 12. When the input signal S_2 is applied to electronic component D_2, the output of electronic component D_2 can be obtained, and the electrical properties of electronic component D_2 can be measured from the common electrical pad 12. When the switching transistor TS_1 is off, the common electrical pad 12 is not coupled to electronic component D_2, and no input signals (S_1, S_2) are applied to the electronic components (D_1, D_2). Therefore, no electrical conductivity from electronic components D_1 and D_2 can be measured from the common electrical pad 12. This circuit architecture provides an optimized measurement framework suitable for both contact-based and non-contact-based testing of the common electrical pad 12 (shown in...). Figure 6 It can be applied to various types of circuits.

[0049] In addition, although Figure 1 The circuit unit shown has two electronic components (D_1, D_2), but this disclosure is not limited thereto. Please refer to [reference needed]. Figure 2 The diagram shown is another circuit structure schematic of an electronic device according to an embodiment of the present disclosure, wherein, in Figure 2 The circuit unit architecture of electronic device 1 is similar to Figure 1 However, it has N electronic components (D_1~D_N) and (N-1) switching transistors (TS_1~TS_N-1) (wherein, the electronic components (D_1) and (D_2) of the previous embodiment can be regarded as included in the N electronic components (D_1~D_N) of this embodiment, and the switching transistor (TS_1) of the previous embodiment can be regarded as included in the (N-1) switching transistors (TS_1~TS_N-1) of this embodiment), where N is an integer greater than or equal to 2 (N≧2). The control terminals of the (N-1) switching transistors (TS_1~TS_N-1) are respectively connected to the switching signal SW_1, and the switching transistor TS_i is coupled to the electronic components D_i and D_i+1, where i is an integer and i=1~(N-1). The common electrical pad 12 is coupled to the electronic components (D_1~D_N) through the switching transistors (TS_1~TS_N-1).

[0050] With the circuit architecture described above, when the switching transistors (TS_1~TS_N-1) are turned ON by the switching signal SW_1, input signals (S_1~SN) are applied to the electronic components (D_1~D_N) respectively. These input signals (S_1~SN) do not overlap in time. When the input signal S_i is applied to the electronic component D_i, the output of the electronic component D_i can be obtained. The electrical properties of the electronic component D_i can be measured from the common electrical pad 12, where i is an integer and i=1~N. Therefore, testing of the electronic components (D_1~D_N) can be achieved. However, when the switching transistors (TS_1~TS_N-1) are turned OFF by the switching signal SW_1, the common electrical pad 12 is not coupled to the electronic components (D_2~D_N), and no input signals (S_1~SN) are applied to the electronic components (D_1~D_N). Therefore, the electrical properties of the electronic components (D_1~D_N) cannot be measured from the common electrical pad 12. also, Figure 2 Other features of the circuit structure shown may be applied. Figure 1 The explanation is already provided, so it will not be repeated here.

[0051] Please refer to Figure 3 The diagram shown is a circuit structure schematic and timing diagram of an electronic device according to another embodiment of the present disclosure, wherein, as Figure 3 As shown in the circuit structure, the electronic device 1 includes a substrate 10 and circuit units disposed on the substrate 10. For clarity, Figure 3The circuit structure shown primarily illustrates a circuit unit of electronic device 1, omitting schematics of other circuit units. This circuit unit includes an electronic component D_1, an electronic component D_2, a switching transistor TS_1, a switching transistor TS_2, and a common electrical pad 12. Electronic components D_1 and D_2 are disposed on substrate 10. These electronic components (D_1, D_2) can include passive and / or active components, such as capacitors, resistors, inductors, diodes, transistors, ICs, other suitable components, and circuits including these components. Switching transistors TS_1 and TS_2 are disposed on substrate 10, with TS_1 coupled to electronic component D_1 and TS_2 coupled to electronic component D_2. The common electrical pad 12 is disposed on substrate 10, coupled to electronic component D_1 via switching transistor TS_1 and to electronic component D_2 via switching transistor TS_2. More specifically, the control terminal of switching transistor TS_1 is connected to a switching signal SW_1, and the two terminals of switching transistor TS_1 are respectively coupled to electronic component D_1 and common electrical pad 12. The control terminal of switching transistor TS_2 is connected to a switching signal SW_2, and the two terminals of switching transistor TS_2 are respectively coupled to electronic component D_2 and common electrical pad 12. Therefore, since the output positions of electronic components (D_1, D_2) are separated by switching transistors TS_1 and TS_2, the output signal can be easily monitored using a single common electrical pad 12, thereby optimizing the layout area and saving testing time.

[0052] With the circuit structure described above, when switching transistors TS_1 and TS_2 are turned on, the electrical properties of electronic components D_1 and D_2 can be measured from the common electrical pad 12. When switching transistors TS_1 and TS_2 are turned off, the electrical properties of electronic components D_1 and D_2 cannot be measured from the common electrical pad 12. For example, please refer to [reference needed]. Figure 3The circuit timing is such that the on / off state of switching transistors TS_1 and TS_2 is controlled by switching signals SW_1 and SW_2, respectively. That is, this disclosure uses switching signals SW_1 and SW_2 to control the states of switching transistors TS_1 and TS_2, respectively, to ensure that switching transistors TS_1 and TS_2 are activated during measurement and remain off at other times. In this embodiment, since switching transistors TS_1 and TS_2 are N-type transistors, when the switching signals (SW_1, SW_2) are low (e.g., representing logic 0), switching transistors TS_1 and TS_2 are turned on; conversely, when the switching signals (SW_1, SW_2) are high (e.g., representing logic 1), switching transistors TS_1 and TS_2 are turned off. However, this is merely an example and not a limitation; it is conceivable that switching transistors TS_1 and TS_2 could also be P-type transistors or other suitable types of transistors. Therefore, as... Figure 3 As shown in the circuit timing diagram, during the period TP when switching transistors TS_1 and TS_2 are turned on, the common electrical pad 12 is coupled to electronic components D_1 and D_2 respectively. During this period TP, an input signal S_1 can be applied to electronic component D_1 and an input signal S_2 can be applied to electronic component D_2. The input signals S_1 and S_2 do not overlap in time. Since the common electrical pad 12 is coupled to electronic components D_1 and D_2 respectively, when the input signal S_1 is applied to electronic component D_1, the output of electronic component D_1 can be obtained, and the electrical properties of electronic component D_1 can be measured from the common electrical pad 12. When the input signal S_2 is applied to electronic component D_2, the output of electronic component D_2 can be obtained, and the electrical properties of electronic component D_2 can be measured from the common electrical pad 12. When switching transistors TS_1 and TS_2 are off, the common electrical pad 12 is not coupled to electronic components D_1 and D_2, therefore, the electrical properties from electronic components D_1 and D_2 cannot be measured from the common electrical pad 12. This circuit architecture provides an optimized measurement framework suitable for both contact-based and non-contact-based testing of the common electrical pad 12 (shown in...). Figure 8 It can be applied to various types of circuits.

[0053] Furthermore, in Figure 3In the circuit structure, input signals S_1 and S_2 can be applied simultaneously to electronic components D_1 and D_2 respectively, and switching signals SW_1 and SW_2 are used to control switching transistors TS_1 and TS_2 to be turned on (ON) during non-overlapping periods. Accordingly, when switching transistor TS_1 is turned on by switching signal SW_1, the output of electronic component D_1 can be obtained, and the electrical properties of electronic component D_1 can be measured from the common electrical pad 12. When switching transistor TS_2 is turned on by switching signal SW_2, the output of electronic component D_2 can be obtained, and the electrical properties of electronic component D_2 can be measured from the common electrical pad 12. However, when switching transistors TS_1 and TS_2 are turned off (OFF) by switching signals SW_1 and SW_2 respectively, the common electrical pad 12 is not coupled to electronic components D_1 and D_2, therefore the electrical properties of electronic components D_1 and D_2 cannot be measured from the common electrical pad 12. Therefore, testing of electronic components (D_1, D_2) can be achieved.

[0054] In addition, although Figure 3 The circuit unit shown has two electronic components (D_1, D_2), but this disclosure is not limited thereto. Please refer to [reference needed]. Figure 4 The diagram shown is a schematic diagram of another circuit structure of an electronic device according to another embodiment of the present disclosure, wherein, in Figure 4 The circuit unit architecture of electronic device 1 is similar to Figure 1 However, it has N electronic components (D_1~D_N) and N switching transistors (TS_1~TS_N) (wherein, the electronic components (D_1) and (D_2) of the previous embodiment can be regarded as being included in the N electronic components (D_1~D_N) of this embodiment, and the switching transistors (TS_1, TS_2) of the previous embodiment can be regarded as being included in (N-1) switching transistors (TS_1~TS_N-1) of this embodiment), where N is an integer greater than or equal to 2 (N≧2), the control terminals of the N switching transistors (TS_1~TS_N) are respectively connected to N switching signals (SW_1~SW_N), one connection terminal of the switching transistor TS_i is coupled to the electronic component D_i, and the other connection terminal of the switching transistor TS_i is coupled to the common electrical pad 12, where i is an integer and i=1~N-1.

[0055] With the circuit architecture described above, when the switching transistors (TS_1~TS_N) are turned ON by the switching signals (SW_1~SW_N), input signals (S_1~SN) can be applied to the electronic components (D_1~D_N) respectively. These input signals (S_1~SN) do not overlap in time. When the input signal S_i is applied to the electronic component D_i, the output of the electronic component D_i can be obtained. The electrical properties of the electronic component D_i can be measured from the common electrical pad 12, where i is an integer and i=1~N. Therefore, testing of the electronic components (D_1~D_N) can be achieved. However, when the switching transistors (TS_1~TS_N) are turned OFF by the switching signals (SW_1~SW_N), the common electrical pad 12 is not coupled to the electronic components (D_1~D_N), and therefore the electrical properties of the electronic components (D_1~D_N) cannot be measured from the common electrical pad 12. Furthermore, Figure 4 Other features of the circuit structure shown may be applied. Figure 2 The explanation is already provided, so it will not be repeated here.

[0056] Furthermore, in Figure 4 In the circuit architecture, input signals (S_1~S_N) can be applied to electronic components (D_1~D_N) simultaneously and separately, and switching signals (SW_1~SW_N) can be used to control the switching transistors (TS_1~TS_N) to be turned on (ON) during non-overlapping periods. Accordingly, when the switching transistor TS_i is turned on (ON) by the switching signal SW_i, the output of electronic component D_i can be obtained, and the electrical properties of electronic component D_i can be measured from the common electrical pad 12, where i is an integer and i=1~N. However, when the switching transistors (TS_1~TS_N) are turned off (OFF) by the switching signals (SW_1~SW_N), the common electrical pad 12 is not coupled to electronic components (D_1~D_N), therefore the electrical properties of electronic components (D_1~D_N) cannot be measured from the common electrical pad 12. This allows for the testing of electronic components (D_1~D_N).

[0057] Please refer to Figure 5 The diagram shown is a circuit structure schematic and timing diagram of an electronic device according to another embodiment of the present disclosure. This embodiment can be applied to electronic devices with a display panel, wherein, as... Figure 5 As shown in the circuit structure, the electronic device 1 includes a substrate 10 and circuit units disposed on the substrate 10. For clarity, Figure 5The circuit structure can be a schematic diagram of a circuit unit of the display electronic device 1, omitting schematic diagrams of other circuit units. In this embodiment, the circuit unit is, for example, a pixel unit. The circuit unit of the electronic device 1 includes an electronic component D_1, an electronic component D_2, an electronic component D_3, a switching transistor TS_1, a switching transistor TS_2, and a common electrical pad 12 disposed on the substrate 10. Electronic components D_1, D_2, and D_3 can each be a pixel circuit, for example, a red pixel circuit, a green pixel circuit, and a blue pixel circuit, respectively, but are not limited thereto. The control terminals of the switching transistors (TS_1, TS_2) are respectively connected to the switching signal SW_1. One connection terminal of the switching transistor TS_1 is coupled to electronic component D_1, and the other connection terminal of the switching transistor TS_1 is coupled to electronic component D_2 and the common electrical pad 12. One connection terminal of the switching transistor TS_2 is coupled to electronic component D_2 and the common electrical pad 12, and the other connection terminal of the switching transistor TS_2 is coupled to electronic component D_3. Furthermore, during the testing phase, since the individual pixels (e.g., red pixels, green pixels, and blue pixels) of the corresponding electronic components (D_1~D_3) (e.g., red pixel circuit, green pixel circuit, and blue pixel circuit, etc.) have not yet been installed on electronic device 1, therefore... Figure 5 The dashed lines represent the first semiconductor element Tr, the second semiconductor element Tg, and the third semiconductor element Tb that must be set after the test. These can be, for example, light-emitting diodes (LEDs), varactor diodes (VADs), sensing elements, or suitable semiconductor elements, but are not limited thereto. In some embodiments, the first semiconductor element Tr can be, for example, a red LED, the second semiconductor element Tg can be, for example, a green LED, and the third semiconductor element Tb can be, for example, a blue LED, but are not limited thereto. Accordingly, since electronic element D_1 (e.g., the red pixel circuit) and electronic element D_2 (e.g., the green pixel circuit) share a single switching transistor TS_1, and electronic element D_2 (e.g., the green pixel circuit) and electronic element D_3 (e.g., the blue pixel circuit 3) share a single switching transistor TS_2, two switching transistors (TS_1, TS_2) and a shared pad 12 can be used to monitor the three electronic elements (D_1~D_3), thereby optimizing the layout area.

[0058] Please refer to the circuit architecture described above. Figure 5In the circuit timing sequence, during the period TP when switching transistors TS_1 and TS_2 are turned on (ON) using the switching signal SW_1, input signals (S_1, S_2, S_3) can be applied to electronic components (D_1, D_2, D_3) respectively. The input signals (S_1, S_2, S_3) do not overlap in time. For example, the input signals (S_1, S_2, S_3) can be red pixel data signals, green pixel data signals, and blue pixel data signals, respectively, but are not limited to these. When the input signal S_1 is applied to electronic component D_1, the output I of electronic component D_1 can be obtained. R The electrical properties of electronic component D_1 can be measured from the common electrical pad 12. When an input signal S_2 is applied to electronic component D_2, the output I of electronic component D_2 can be obtained. G The electrical properties of electronic component D_2 can be measured from the common electrical pad 12. When an input signal S_3 is applied to electronic component D_3, the output I of electronic component D_3 can be obtained. B The electrical properties of electronic component D_3 can be measured from the common electrical pad 12. However, when switching transistors TS_1 and TS_2 are turned off by the switching signal SW_1, the common electrical pad 12 is not coupled to electronic components (D_1, D_3) and does not apply input signals (S_1, S_2, S_3) to electronic components (D_1, D_2, D_3). Therefore, the electrical properties of electronic components (D_1, D_2, D_3) cannot be measured from the common electrical pad 12. Furthermore, Figure 5 Other features of the circuit structure shown may be applied. Figures 1 to 4 The explanation is already provided, so it will not be repeated here.

[0059] Furthermore, although this embodiment is illustrated using a pixel unit having three electronic components (D_1, D_2, D_3) (e.g., red pixel circuit, green pixel circuit, blue pixel circuit, etc.), this disclosure is not limited thereto. For example, a pixel unit may have two electronic components (see reference). Figure 1 In one embodiment, the two electronic components can each be a pixel circuit, and the two electronic components can be pixel circuits of different colors, thereby achieving the goal of... Figure 1 The embodiments described herein are applied to electronic devices having a display panel. For example, a pixel unit may have three or more electronic components (see reference...). Figure 2 In one embodiment, three or more electronic components can each be a pixel circuit, and the three or more electronic components can be pixel circuits of different colors, thereby achieving the goal of... Figure 2 The embodiments are applied to electronic devices having a display panel.

[0060] Please refer to Figure 6 The diagram shown is a circuit structure schematic of an electronic device according to another embodiment of the present disclosure. This embodiment is similar to... Figure 5 One difference in the embodiment is that it also includes an electronic component D_A and a switching transistor TS_a. The electronic component (D_A) is disposed on the substrate 10 and coupled to the common electrical pad 12 via the switching transistor TS_a. More specifically, the control terminal of the switching transistor TS_a is connected to a switching signal SW_1, and the two terminals of the switching transistor TS_a are respectively coupled to the common electrical pad (12) and the electronic component D_A. The electronic component D_A can be, for example, a diode, a unidirectional conducting element, or other suitable electronic component. In this embodiment, the electronic component D_A is illustrated using a diode as an example, but is not limited thereto. Furthermore, by applying an input signal S_A to the electronic component D_A, the common electrical pad 12 can be used for contact or non-contact electrical measurement. In contact measurement, the input signal S_A is turned off, causing the diode to float, and the switching transistor TS_a is turned off, so the electronic component D_A does not function. Figure 6 The operation of the circuit structure can be the same as Figure 5 The electrical properties of electronic components (D_1~D_3) are measured by contacting the common electrical pad 12. In non-contact measurement, the input signal S_A can be a ground signal or a low-voltage signal to turn on the switching transistor TS_a. Electronic component D_A is a diode that allows current to flow to the ground terminal or the low-voltage terminal. Therefore, when the input signal S_1 (or S_2, S_3) is applied to electronic component D_1 (or D_2, D_3), the output I of electronic component D_1 (or D_2, D_3) is obtained. R (or I) G I B The current flows through electronic component D_A to the ground terminal or low voltage terminal, thus electronic component D_A can have a voltage difference Vd. This voltage difference Vd can be sensed non-contactly on the common electrical pad 12. Therefore, the electrical properties of electronic components (D_1~D_3) can be measured without contact with the common electrical pad 12. Furthermore, Figure 6 Other features of the circuit structure shown may be applied. Figures 1-5 The explanation is already provided, so it will not be repeated here.

[0061] Furthermore, although this embodiment adds electronic component D_A and switching transistor TS_a to... Figure 6 The embodiments described herein are illustrated using contact and non-contact measurement as examples, but this disclosure is not limited thereto. For example, electronic components D_A and switching transistor TS_a may also be added in a manner similar to that described in this embodiment. Figures 1-5 Any of the embodiments may provide contact and non-contact measurement in Figures 1-5 In the embodiments described above.

[0062] Please refer to Figure 7The diagram shown is a circuit structure schematic and timing diagram of an electronic device according to another embodiment of the present disclosure. This embodiment is to... Figure 3 , 4 The embodiments are applied to electronic devices having a display panel, wherein, as Figure 7 As shown in the circuit structure, the electronic device 1 includes a substrate 10 and circuit units disposed on the substrate 10. For clarity, Figure 7 The circuit structure shown is mainly a schematic diagram of one circuit unit of the electronic device 1, omitting schematic diagrams of other circuit units. In this embodiment, the circuit unit is, for example, a pixel unit. The circuit unit of the electronic device 1 includes an electronic component D_1, an electronic component D_2, an electronic component D_3, a switching transistor TS_1, a switching transistor TS_2, a switching transistor TS_3, and a common electrical pad 12, all disposed on the substrate 10. Electronic components D_1, D_2, and D_3 are each a pixel circuit, for example, they may be a red pixel circuit, a green pixel circuit, and a blue pixel circuit, respectively, and are not limited thereto. The control terminals of the switching transistors (TS_1, TS_2, TS_3) are respectively connected to the switching signals (SW_1, SW_2, SW_3). One terminal of switching transistor TS_1 is coupled to electronic component D_1, and the other terminal of switching transistor TS_1 is coupled to the common electrical pad 12. One terminal of switching transistor TS_2 is coupled to electronic component D_2, and the other terminal of switching transistor TS_2 is coupled to the common electrical pad 12. One terminal of switching transistor TS_3 is coupled to electronic component D_3, and the other terminal of switching transistor TS_3 is coupled to the common electrical pad 12. Furthermore, during the testing phase, since the individual pixels (e.g., red pixels, green pixels, and blue pixels) of the corresponding electronic components (D_1~D_3) (e.g., red pixel circuit, green pixel circuit, and blue pixel circuit, etc.) have not yet been set on the electronic device 1, therefore... Figure 7 The dashed lines represent the first semiconductor element Tr, the second semiconductor element Tg, and the third semiconductor element Tb that must be set after the test. These can be, for example, light-emitting diodes (LEDs), varactor diodes, sensing elements, or suitable semiconductor elements, but are not limited to these. In some embodiments, the first semiconductor element Tr can be, for example, a red LED, the second semiconductor element Tg can be, for example, a green LED, and the third semiconductor element Tb can be, for example, a blue LED, but are not limited to these. Accordingly, since the output positions of the electronic components (D_1~D_3) (e.g., red pixel circuits, green pixel circuits, and blue pixel circuits, etc.) are separated by switching transistors (TS_1, TS_2, TS_3), the output signal can be easily monitored using a single common pad 12, thereby optimizing the layout area and saving test time.

[0063] Please refer to the circuit architecture described above. Figure 7 In the circuit timing sequence, during the period TP when the switching signals (SW_1, SW_2, SW_3) control the switching transistors (TS_1, TS_2, TS_3) to be ON, input signals (S_1, S_2, S_3) can be applied to electronic components (D_1, D_2, D_3) respectively. The input signals (S_1, S_2, S_3) do not overlap in time. For example, the input signals (S_1, S_2, S_3) can be red pixel data signals, green pixel data signals, and blue pixel data signals, respectively, but are not limited to these. When input signal S_1 is applied to electronic component D_1, the output I of electronic component D_1 can be obtained. R The electrical properties of electronic component D_1 can be measured from the common electrical pad 12. When an input signal S_2 is applied to electronic component D_2, the output I of electronic component D_2 can be obtained. G The electrical properties of electronic component D_2 can be measured from the common electrical pad 12. When an input signal S_3 is applied to electronic component D_3, the output I of electronic component D_3 can be obtained. B The electrical properties of electronic component D_3 can be measured from the common electrical pad 12. However, when the switching transistors (TS_1, TS_2, TS_3) are controlled to be OFF by switching signals (SW_1, SW_2, SW_3), the common electrical pad 12 is not coupled to electronic components (D_1, D_2, D_3), therefore the electrical properties of electronic components (D_1, D_2, D_3) cannot be measured. Furthermore, Figure 7 Other features of the circuit structure shown may be applied. Figure 3 and Figure 4 The explanation is already provided, so it will not be repeated here.

[0064] Furthermore, in Figure 7In the circuit architecture, input signals (S_1, S_2, S_3) can be applied to electronic components (D_1, D_2, D_3) simultaneously, and switching signals (SW_1, SW_2, SW_3) are used to control the switching transistors (TS_1, TS_2, TS_3) to be turned on (ON) during non-overlapping periods. Accordingly, when the switching transistor TS_1 is turned on by the switching signal SW_1, the output of electronic component D_1 can be obtained, and the electrical properties of electronic component D_1 can be measured from the common electrical pad 12. When the switching transistor TS_2 is turned on by the switching signal SW_2, the output of electronic component D_2 can be obtained, and the electrical properties of electronic component D_2 can be measured from the common electrical pad 12. When the switching transistor TS_3 is turned on by the switching signal SW_3, the output of electronic component D_3 can be obtained, and the electrical properties of electronic component D_3 can be measured from the common electrical pad 12. When the switching transistors (TS_1, TS_2, TS_3) are turned off using switching signals (SW_1, SW_2, SW_3) respectively, the common electrical pad 12 is not coupled to the electronic components (D_1, D_2, D_3), therefore the electrical properties of the electronic components (D_1, D_2, D_3) cannot be measured from the common electrical pad 12. This allows for the testing of the electronic components (D_1, D_2, D_3).

[0065] Furthermore, although this embodiment is illustrated using a pixel unit having three electronic components (D_1, D_2, D_3) (e.g., a red pixel circuit, a green pixel circuit, a blue pixel circuit, etc.), this disclosure is not limited thereto. For example, a pixel unit may have two electronic components, each of which may be a pixel circuit, and the two electronic components may be pixel circuits of different colors, thereby achieving... Figure 3 The embodiments are applied to electronic devices having a display panel. For example, a pixel unit may have three or more electronic components, each of which can be a pixel circuit, and these three or more electronic components can be pixel circuits of different colors, thereby achieving... Figure 4 The embodiments are applied to electronic devices having a display panel.

[0066] Please refer to Figure 8 The diagram shown is a circuit structure schematic of an electronic device according to another embodiment of the present disclosure. This embodiment is similar to... Figure 7One difference in this embodiment is the inclusion of an electronic component D_A and a switching transistor TS_a. The electronic component D_A is disposed on the substrate 10 and coupled to the common electrical pad 12 via the switching transistor TS_a. More specifically, the control terminal of the switching transistor TS_a is connected to a switching signal SW_A. One connection terminal of the switching transistor TS_a is coupled to the common electrical pad 12, and the other connection terminal of the switching transistor TS_a is coupled to one end of the electronic component D_A. The other end of the electronic component D_A can be grounded or provided with a low voltage. The electronic component D_A can be, for example, a diode, a unidirectional conductive element, or other suitable electronic component. In this embodiment, the electronic component D_A is illustrated using a diode as an example, but is not limited thereto. Furthermore, the arrangement of the electronic component D_A and the switching transistor TS_a allows the common electrical pad 12 to measure electrical properties in either contact or non-contact manner. During contact measurement, the switching signal SW_A is a shutdown signal, which turns off the switching transistor TS_a, rendering the electronic component D_A inactive. Figure 8 The operation of the circuit structure can be the same as Figure 7 The electrical properties of electronic components (D_1~D_3) are measured by contacting the common electrical pad 12. In non-contact measurement, the switching signal SW_A is used to turn on the switching transistor (TS_a). Electronic component D_A is, for example, a diode that allows current to flow to the ground or low-voltage side. When an input signal S_1 (or S_2, S_3) is applied to electronic component D_1 (or D_2, D_3), the output I of electronic component D_1 (or D_2, D_3) is obtained. R (or I) G I B The current flows through electronic component D_A to the ground terminal or low-voltage terminal, thus electronic component D_A can have a voltage difference Vd, which can be sensed non-contactly on the common electrical pad 12. Therefore, the electrical properties from electronic components (D_1~D_3) can be measured without contact with the common electrical pad 12. Furthermore, Figure 8 Other features of the circuit structure shown may be applied. Figure 7 The explanation is already provided, so it will not be repeated here.

[0067] Furthermore, although this embodiment adds electronic component D_A and switching transistor TS_a to... Figure 7 The embodiments described herein are illustrated using contact and non-contact measurement as examples, but this disclosure is not limited thereto. For example, electronic components D_A and switching transistor TS_a may also be added in a manner similar to that described in this embodiment. Figure 3 Implementation examples or Figure 4 Examples of this embodiment provide contact and non-contact testing in Figure 3 and Figure 4 In the embodiments described above.

[0068] Please refer to Figure 9 The diagram shown is a circuit structure schematic and timing diagram of an electronic device according to another embodiment of the present disclosure. This embodiment is similar to... Figure 8 One difference in the embodiments is that the electronic device 1 is provided with a first semiconductor element Tr, a second semiconductor element Tg, and a third semiconductor element Tb corresponding to electronic components (D_1, D_2, D_3) (e.g., red pixel circuit, green pixel circuit, blue pixel circuit, etc.). These components may be, for example, light-emitting diodes, varactor diodes, sensing elements, or suitable semiconductor elements, but are not limited thereto. In some embodiments, the first semiconductor element Tr may be, for example, a red light-emitting diode, the second semiconductor element Tg may be, for example, a green light-emitting diode, and the third semiconductor element Tb may be, for example, a blue light-emitting diode, but are not limited thereto. With this circuit structure, during testing, as shown in its timing diagram, switching signals (SW_1, SW_2, SW_3) are used to control the switching transistors (TS_1, TS_2, TS_3) to be ON, and switching signal SW_A is used to control the switching transistor TS_a to be OFF. No input signals are applied to the electronic components (D_1, D_2, D_3), but an input signal S' (e.g., but not limited to a current signal) is applied to the common electrical pad 12. At this time, since the switching transistors (TS_1, TS_2, TS_3) are ON and the switching transistor TS_a is OFF, the input signal S' can flow through the first semiconductor element Tr, the second semiconductor element Tg, and the third semiconductor element Tb, causing them to operate. This verifies the normal operation of the pixel and identifies potential problems caused by external driving circuits. Furthermore, Figure 9 Other features of the circuit structure shown are applicable to the description of the foregoing embodiments, and therefore will not be repeated here.

[0069] Furthermore, although in this embodiment the first semiconductor element Tr, the second semiconductor element Tg, and the third semiconductor element Tb corresponding to the electronic components (D_1, D_2, D_3) (e.g., red pixel circuit, green pixel circuit, blue pixel circuit, etc.) are disposed on... Figure 8 The present disclosure illustrates the testing of an electronic device with pixels, but is not limited thereto. For example, a first semiconductor element Tr, a second semiconductor element Tg, and a third semiconductor element Tb may be disposed in... Figure 7 In embodiments similar to this embodiment, controlling the switching transistors (TS_1, TS_2, TS_3) can also achieve the effect of verifying whether the pixel is functioning correctly. For example, the first semiconductor element Tr, the second semiconductor element Tg, and the third semiconductor element Tb can be disposed in... Figure 6In similar embodiments, controlling the switching transistors (TS_1, TS_2) and TS_a in a manner similar to this embodiment can also achieve the effect of verifying whether the pixel is functioning correctly. For example, the first semiconductor element Tr, the second semiconductor element Tg, and the third semiconductor element Tb can be disposed in... Figure 5 In this embodiment, the switching transistors (TS_1, TS_2) are controlled in a manner similar to that described in this embodiment, which can also achieve the effect of verifying whether the pixel is operating normally. Furthermore, although the number of pixels corresponding to the pixel circuit in the aforementioned pixel unit is three, this disclosure is not limited to this; in other embodiments, the number of pixels corresponding to the pixel circuit may be two (for example, see reference...). Figure 1 , 3 (The embodiments) or may be three or more (e.g., refer to the embodiments) Figure 2 , 4 (Example).

[0070] Please refer to Figure 10 The diagram shows the measurement architecture for testing electronic devices using a contact-type shared electrical pad according to this disclosure. The electronic device 1 has a plurality of circuit units 22, each circuit unit 22 having a single shared electrical pad 12. During testing, the testing equipment 20 uses a plurality of probes 21 to contact the plurality of shared electrical pads 12 to perform electrical measurements of the electronic components as described in the embodiments above. The testing equipment 20 can collect and analyze the measured data to determine whether the electronic device 1 passes the test. Furthermore, please refer to... Figure 11 The diagram illustrates a measurement architecture for testing electronic devices using a non-contact shared electric pad according to the present disclosure. This measurement architecture is illustrated using an electronic device with a display panel as an example. The circuit unit 22 of the electronic device is placed on the backlight module 31 and polarizing plate 32 of the testing machine. For ease of explanation, only one circuit unit 22 is shown in the figure, which is not intended to limit the number of circuit units 22. During the testing of the above embodiments, the liquid crystal module 35 and the optical sensor 36 can be moved on the circuit unit 22 to be tested. Since the voltage difference Vd applied to the shared electric pad 12 causes the liquid crystal of the liquid crystal module 35 to be distorted, and since the voltage difference Vd can represent the electrical properties from the electronic components, the optical sensor 36 can sense, collect and analyze the data based on the change in optical characteristics caused by the liquid crystal distortion, and can determine whether the electronic device 1 passes the test.

[0071] As can be seen from the above description, the electronic device disclosed herein can perform contact or non-contact electrical measurements on multiple circuit units using a single shared electric pad, thus effectively optimizing the layout area, saving testing time, and facilitating the monitoring of output signals.

[0072] In one embodiment, this disclosure can determine whether a product falls within the scope of protection of this disclosure by at least the presence or absence of components, component configuration, mechanism observation and / or operation mode of the product in dispute, and is not limited thereto.

[0073] Features of the various embodiments disclosed herein may be arbitrarily combined and used as long as they do not violate the spirit of the invention or conflict with it.

[0074] The above embodiments are merely illustrative examples for ease of explanation. The scope of protection claimed in this disclosure should be determined by the claims, and not limited to the above embodiments.

Claims

1. An electronic device comprising: A substrate; A first electronic component and a second electronic component are disposed on the substrate; The first switching transistor is disposed on the substrate and coupled to the first electronic component and the second electronic component; as well as A common electrical pad is disposed on the substrate and coupled to the first electronic component and the second electronic component respectively through the first switching transistor. When the first switching transistor is turned on, the electrical properties of the first electronic component and the second electronic component can be measured from the common electrical pad. When the first switching transistor is turned off, the electrical properties of the first electronic component and the second electronic component cannot be measured from the common electrical pad.

2. The electronic device according to claim 1, characterized in that, The first electronic component and the second electronic component are each a pixel circuit.

3. The electronic device according to claim 1, characterized in that, The shared electrical pad measures electrical properties using either contact or non-contact methods.

4. The electronic device according to claim 1, characterized in that, It also includes a diode disposed on the substrate and coupled to the common pad via another switching transistor.

5. The electronic device according to claim 4, characterized in that, When the shared electrical pad is used for non-contact electrical measurement, the diode is grounded and the other switching transistor is turned on.

6. The electronic device according to claim 4, characterized in that, When the shared electrical pad is used for contact electrical measurement, the diode is floating and the other switching transistor is off.

7. The electronic device according to claim 1, characterized in that, When the first switching transistor is turned on, a first input signal is applied to the first electronic component and a second input signal is applied to the second electronic component, wherein the first input signal and the second input signal do not overlap in time.

8. The electronic device according to claim 2, characterized in that, It also includes semiconductor elements disposed on the substrate and corresponding to the pixel circuits, wherein the first switching transistor is controlled to be turned on and an input signal is applied to the common pad to cause the semiconductor elements to operate.

9. The electronic device according to claim 1, characterized in that, It includes N electronic components containing the first electronic component and the second electronic component, and (N-1) switching transistors containing the first switching transistor, where N is an integer greater than or equal to 2. The i-th switching transistor is coupled to the i-th electronic component and the (i+1)-th electronic component, where i is an integer and i=1~(N-1). The common pad is coupled to the N electronic components through the (N-1) switching transistors respectively.

10. An electronic device comprising: A substrate; A first electronic component and a second electronic component are disposed on the substrate; A first switching transistor and a second switching transistor are disposed on the substrate, wherein the first switching transistor is coupled to the first electronic component and the second switching transistor is coupled to the second electronic component; as well as A common electrical pad is disposed on the substrate, coupled to the first electronic component through the first switching transistor, and coupled to the second electronic component through the second switching transistor; When the first switching transistor and the second switching transistor are respectively turned on, the electrical properties of the first electronic component and the second electronic component can be measured from the common electrical pad. When the first switching transistor and the second switching transistor are respectively turned off, the electrical properties of the first electronic component and the second electronic component cannot be measured from the common electrical pad.

Images