Semiconductor process equipment equipped with heating devices

CN121674934BActive Publication Date: 2026-05-26CHUYUN TEK (SHANGHAI) CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CHUYUN TEK (SHANGHAI) CO LTD
Filing Date
2026-02-09
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In existing semiconductor processing equipment, there is a temperature gradient difference between the middle and edge areas of the base during the heating process, which leads to temperature non-uniformity. Furthermore, the heating element is prone to softening in high temperature and oxidizing gas environments, which may cause short circuit risks.

Method used

A central heating mechanism and an edge heating mechanism are set below the base. The edge heating mechanism includes several edge support structures and an edge heating body. The edge heating body is stably fixed by opening a slot on the outer wall of the edge support structure and using a fixing structure to prevent displacement and short circuit caused by softening, while optimizing heat utilization.

Benefits of technology

This improves the stability and heat utilization efficiency of the heating device, ensures temperature uniformity and heating effect in the wafer edge area, reduces the risk of short circuits, and enhances the reliability and service life of the equipment.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN121674934B_ABST
    Figure CN121674934B_ABST
Patent Text Reader

Abstract

This application provides a semiconductor process apparatus equipped with a heating device. The edge heating mechanism includes several edge support structures and a first edge heating body. Each edge support structure has a first slot. The first edge heating body is movably engaged within each first slot and fixed within the first slot by a fixing structure. The fixing structure shields the first slots to form a space defining the position of the first edge heating body, thus fixing the first edge heating body within the first slot and providing stable support. This prevents short circuits caused by displacement due to softening and subsequent electrical contact between the first edge heating bodies, thereby improving the stability of the edge heating mechanism. The fixing structure also shields a portion of the opening in the first slots, exposing more of the heating surface of the first edge heating mechanism, improving heat utilization efficiency and enhancing the heating effect of the first edge heating body on the wafer.
Need to check novelty before this filing date? Find Prior Art