Optical chip and heterogeneous integrated optical chip

Abstract

The invention provides an optical chip and a heterogeneous integrated optical chip. The optical chip comprises a first insulating layer, an active gain medium and a first optical waveguide, the first optical waveguide is arranged in the first insulating layer; a part of area of the first optical waveguide is patterned to form a first setting structure, and the first setting structure is configured to be matched with a second setting structure to form a first evanescent wave coupler; the second setting structure is formed by patterning a part of area of a second optical waveguide in the second chip; the active gain medium is arranged on one side of the first insulating layer; the active gain medium is configured to transmit a light source to the second chip through the first evanescent wave coupler. The first optical waveguide is processed into the first setting structure which is used for being matched with the second setting structure of the second optical waveguide in the second chip to form the first evanescent wave coupler, integration of the two chips is achieved, and the flexibility of chip integration is improved. Meanwhile, the implementation mode is simple, and the integration difficulty of the chip can be reduced.

Description

Technical Field

[0001] This application relates to the field of chips, and more specifically, to an optical chip and a heterogeneous integrated optical chip. Background Technology

[0002] In the fields of optoelectronics and photonics, active gain media refer to materials that can achieve optical signal gain through some means (usually optical or electrical pumping). These materials are crucial for the development of lasers, amplifiers, and optoelectronic conversion devices.

[0003] However, current active gain dielectric chips generally suffer from limited integration flexibility. These chips are often designed to be integrated only with specific types or brands of chips, greatly limiting the diversity and flexibility of chip integration. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide an optical chip and a heterogeneous integrated optical chip, which can provide flexibility and diversity in chip integration.

[0005] In a first aspect, embodiments of this application provide an optical chip, comprising: a first insulating layer, an active gain medium, and a first optical waveguide; the first optical waveguide is disposed within the first insulating layer; wherein a portion of the first optical waveguide is patterned to form a first predetermined structure, the first predetermined structure being configured to cooperate with a second predetermined structure to form a first evanescent wave coupler; the second predetermined structure is a portion of a second optical waveguide in a second chip patterned; the active gain medium is disposed on one side of the first insulating layer; the active gain medium is configured to transmit a light source to the second chip through the first evanescent wave coupler.

[0006] In the above implementation process, by processing a portion of the first optical waveguide into a first predetermined structure, which is then used to cooperate with a second predetermined structure of the second optical waveguide in the second chip to form a first evanescent wave coupler, light from the first optical chip can be transmitted to the second optical chip. This allows for the integration of the optical chip with various second chips, improving the flexibility of integrating the optical chip with other chips. Simultaneously, the implementation method is simple, reducing the integration difficulty between the optical chip and the second chip.

[0007] In one embodiment, another portion of the first optical waveguide is patterned to form a second evanescent wave coupler; the other portion of the first optical waveguide is a part of the region in the first optical waveguide other than the region where the first set structure is located; the light source of the active gain medium is configured to enter the first optical waveguide through the second evanescent wave coupler and be transmitted in the first optical waveguide.

[0008] In the above implementation process, by patterning the first optical waveguide, the first optical waveguide can form a second evanescent wave coupler on its own to transmit the light source in the active gain medium to the first optical waveguide. This can reduce the amount of optical waveguide required by the optical chip, thereby reducing the size of the optical chip and lowering its manufacturing cost.

[0009] In one embodiment, there are multiple first configuration structures; the multiple first configuration structures are configured to cooperate with multiple second configuration structures to form multiple first evanescent wave couplers.

[0010] In the above implementation process, multiple first setting structures are set, which can be used to cooperate with multiple second setting structures to realize the integration of the optical chip with multiple second chips, and / or realize multiple optical paths for the light source in the optical chip to be transmitted to the second chip, thereby increasing the application scenarios of the optical chip.

[0011] In one embodiment, the active gain medium is a laser or an optical amplifier.

[0012] In the above implementation process, the active gain medium can be set as a laser or an optical amplifier according to actual needs, thereby increasing the application scenarios of the optical chip.

[0013] Secondly, embodiments of this application also provide a heterogeneous integrated optical chip, comprising: an optical chip and a second chip in a first direction, or in any embodiment of the first aspect; the second chip comprising: a second insulating layer and a second optical waveguide; the second optical waveguide being disposed within the second insulating layer; wherein a portion of the second optical waveguide is patterned to form a second defined structure; one side of the first insulating layer having an active gain dielectric is bonded to a layer of the second insulating layer; wherein the first defined structure and the second defined structure in the optical chip, after being bonded to the optical chip and the second chip, form a first evanescent wave coupler; the first evanescent wave coupler is configured to transmit a light source in the first optical waveguide to the second chip.

[0014] In the above implementation process, by setting a first predetermined structure in the first optical waveguide of the optical chip and a second predetermined structure in the second optical waveguide of the second chip, when integrating the optical chip and the second chip, it is only necessary to set the first predetermined structure and the second predetermined structure to form a first evanescent wave coupler, which can realize optical transmission between the optical chip and the second chip. The structure of the second chip is no longer restricted, improving the flexibility of integrating the optical chip and the second chip. At the same time, the integration method is simple, reducing the integration difficulty between the optical chip and the second chip.

[0015] In one embodiment, the second chip further includes: an optical device and an optical port; the optical device and the optical port are disposed in the second insulating layer; wherein the light source of the optical device is configured to be transmitted through the optical port via the second light waveguide, and the optical port is configured to transmit the light source to the outside of the second chip.

[0016] In the above implementation process, by setting different optical devices in the second chip, the second chip can achieve different functions, increasing the versatility of the second chip. In addition, the heterogeneous integrated chip obtained by integrating the second chip can also achieve different functions, increasing the application scenarios of the heterogeneous integrated chip.

[0017] In one embodiment, another portion of the second optical waveguide is patterned to form a third evanescent wave coupler; the other portion of the second optical waveguide is a part of the region of the second optical waveguide other than the region where the second defined structure is located; wherein, the first evanescent wave coupler is configured to transmit a light source in the first optical waveguide to the second optical waveguide; the third evanescent wave coupler is configured to transmit the light source between the optical device and the second optical waveguide.

[0018] In the above implementation process, by patterning the second optical waveguide, it can automatically form a third evanescent wave coupler to achieve optical transmission between the optical device and the second optical waveguide. This reduces the amount of optical waveguide required by the second chip, shrinks the size of the second chip, and consequently reduces the size of the heterogeneous integrated chip. Simultaneously, it also reduces the manufacturing cost of the second chip.

[0019] In one embodiment, the second optical waveguide includes a plurality of second branch optical waveguides, and a portion of each second branch optical waveguide is patterned to form a second defined structure; the second chip includes a plurality of optical devices; each second defined structure is connected to one of the optical devices through a second branch optical waveguide to form an optical path; the ends of the plurality of optical paths away from the second defined structures are all connected to the same optical port; the plurality of optical chips are bonded to the second chip; wherein, a first defined structure of each optical chip and a corresponding second defined structure in the second chip form a first evanescent wave coupler; each first evanescent wave coupler is connected to a corresponding optical path and configured to transmit the light source to the corresponding optical path.

[0020] In the above implementation process, by patterning the second optical waveguide, it can automatically form a third evanescent wave coupler to achieve optical transmission between the optical device and the second optical waveguide. This reduces the amount of optical waveguide required by the second chip, shrinks the size of the second chip, and consequently reduces the size of the heterogeneous integrated chip. Simultaneously, it also reduces the manufacturing cost of the second chip.

[0021] In one embodiment, the second optical waveguide includes a plurality of second branch optical waveguides, and a portion of each second branch optical waveguide is patterned to form a second defined structure; the second chip includes a plurality of optical devices and a plurality of optical ports; each second defined structure is connected to one optical device and one optical port through a second branch optical waveguide to form an optical path; the first optical waveguide in the optical chip is divided into a plurality of first branch optical waveguides by a beam splitter; a portion of each first branch optical waveguide is patterned to form a first defined structure; the optical chip is bonded to the second chip; wherein each first defined structure of the optical chip and a corresponding second defined structure in the second chip form a first evanescent wave coupler; each first evanescent wave coupler is connected to a corresponding optical path and configured to transmit the light source to the corresponding optical path.

[0022] In the above implementation process, by setting the first optical waveguide in the optical chip to include a structure of multiple first branch optical waveguides, and each first branch optical waveguide is provided with a corresponding first setting structure, a first evanescent wave coupler can be formed by the first setting structure on the first branch optical waveguide cooperating with the corresponding second setting structure, thereby realizing the integration of one optical chip with multiple second chips. This can improve the flexibility and diversity of the heterogeneous integrated chip and increase the application scenarios of the heterogeneous integrated chip.

[0023] In one embodiment, the material of the first optical waveguide is silicon, or the material of the first optical waveguide is silicon and silicon nitride; the material of the second optical waveguide is silicon, or the material of the second optical waveguide is silicon and silicon nitride.

[0024] In the above implementation process, since silicon and silicon nitride have the advantages of high refractive index and low loss, by setting the materials of the first optical waveguide and the second optical waveguide as silicon or silicon nitride, the refractive index of the first optical waveguide and the second optical waveguide can be increased, and the loss of light transmission in the first optical waveguide and the second optical waveguide can be reduced.

[0025] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A schematic diagram of the optical chip provided in an embodiment of this application;

[0028] Figure 2 A schematic diagram of an active gain medium provided in an embodiment of this application;

[0029] Figure 3 Another schematic diagram of the structure of the active gain medium provided in the embodiments of this application;

[0030] Figure 4 A cross-sectional view of a heterogeneous integrated optical chip provided in an embodiment of this application;

[0031] Figure 5 A top view of a heterogeneous integrated optical chip provided in an embodiment of this application;

[0032] Figure 6 A schematic diagram of a heterogeneous integrated chip integrating multiple active gain media with a second chip, as provided in an embodiment of this application;

[0033] Figure 7 This is a schematic diagram of a heterogeneous integrated chip that integrates an optical chip with multiple second-branch optical waveguides, as provided in an embodiment of this application.

[0034] Figure description: 100-Optical chip, 110-First insulating layer, 120-Active gain medium, 130-First optical waveguide, 131-First branch optical waveguide, 140-First substrate, 150-Second evanescent wave coupler, 200-Second chip, 210-Second insulating layer, 220-Second optical waveguide, 230-Second substrate, 240-Optical device, 250-First evanescent wave coupler, 260-Optical port, 221-Second branch optical waveguide. Detailed Implementation

[0035] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0036] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] In traditional optoelectronic integration solutions, active gain dielectric chips need to be precisely matched with other optoelectronic components (such as lasers, modulators, detectors, etc.) to achieve effective optical signal processing. This matching involves complex optical design, material selection, and manufacturing processes to ensure that the optical modes, dimensions, thermal characteristics, etc., of the chips are compatible.

[0038] However, the inventors of this application have discovered through long-term research that current active gain dielectric chips can often only be integrated with chips of specific types or designs, resulting in poor flexibility and scalability in chip integration.

[0039] In view of this, this application proposes an optical chip that, by processing a portion of a first optical waveguide into a first predetermined structure, can cooperate with a second predetermined structure of a second optical waveguide in a second chip to form a first evanescent wave coupler, thereby transmitting light from the first optical chip to the second optical chip. This enables the integration of the optical chip with various second chips, improving the flexibility of integrating the optical chip with other chips. Simultaneously, the implementation method is simple, reducing the integration difficulty between the optical chip and the second chip.

[0040] like Figure 1 The diagram shown is a schematic of an optical chip 100 provided in an embodiment of this application, including: a first insulating layer 110, an active gain medium 120, and a first optical waveguide 130.

[0041] The first optical waveguide 130 is disposed within the first insulating layer 110; the active gain medium 120 is disposed on one side of the first insulating layer 110; the active gain medium 120 is configured to transmit light source to the second chip 200 through the first evanescent wave coupler 250.

[0042] Here, a portion of the first optical waveguide 130 is patterned to form a first set structure, which is configured to cooperate with a second set structure to form a first evanescent wave coupler 250; the second set structure is a portion of the second optical waveguide 220 in the second chip 200 that is patterned.

[0043] Optionally, the first configuration structure can be one or more, and the optical chip 100 can be integrated with one or more second chips 200.

[0044] When the optical chip 100 is integrated with multiple second chips 200, the multiple second chips 200 can be the same or different. The second chip 200 can be selected according to the actual situation.

[0045] It should be understood that a portion of the first optical waveguide 130 is patterned to form a first predetermined structure, and a portion of the second optical waveguide 220 in the second chip 200 is patterned to form a second predetermined structure. These first and second predetermined structures are respectively used to form the first evanescent wave coupler 250. Therefore, when the optical chip 100 and the second chip 200 are integrated, the first and second predetermined structures are aligned so that they precisely form the first evanescent wave coupler 250. Light from the optical chip 100 can then be transmitted to the second chip 200 through this first evanescent wave coupler 250.

[0046] The second chip 200 here can be a passive photonic integrated circuit.

[0047] The active gain medium 120 mentioned above refers to an optical element, such as a laser or optical amplifier. The active gain medium 120 can be selected according to the actual situation.

[0048] In one embodiment, such as Figure 2 , Figure 3 As shown, the optical chip 100 can heterogeneously integrate the active gain medium 120 onto the passive photonic integrated circuit via die to wafer (i.e., a process of connecting a single die to a wafer using a specific technology) or bar to wafer (i.e., a similar process of transferring a complete barcode or bar to a wafer), and then process the active gain medium 120 into an active device or an array of multiple active devices.

[0049] In the above implementation process, by processing a portion of the first optical waveguide 130 into a first predetermined structure, which cooperates with the second predetermined structure of the second optical waveguide 220 in the second chip 200 to form a first evanescent wave coupler 250, the light in the first optical chip 100 can be transmitted to the second optical chip 100. This allows the optical chip 100 to be integrated with various second chips 200, improving the flexibility of integrating the optical chip 100 with other chips. At the same time, the implementation method is simple, reducing the integration difficulty of the optical chip 100 and the second chip 200.

[0050] In one possible implementation, another portion of the first optical waveguide 130 is patterned to form a second evanescent wave coupler 150.

[0051] Another part of the first optical waveguide 130 is a portion of the region outside the region where the first set structure is located.

[0052] The patterning process here refers to the technique of precisely processing optical waveguide materials using specific patterning techniques.

[0053] The light source of the aforementioned active gain medium 120 is configured to enter the first optical waveguide 130 through the second evanescent wave coupler 150 and transmit within the first optical waveguide 130.

[0054] In the above implementation process, by patterning the first optical waveguide 130, the first optical waveguide 130 can form the second evanescent wave coupler 150 on its own, so as to transmit the light source in the active gain medium 120 to the first optical waveguide 130. This can reduce the amount of optical waveguide required by the optical chip 100, thereby reducing the size of the optical chip 100 and lowering its manufacturing cost.

[0055] In one possible implementation, there are multiple first configuration structures; the multiple first configuration structures are configured to cooperate with multiple second configuration structures to form multiple first evanescent wave couplers 250.

[0056] The multiple first-defined structures here can be the same, different, or partially the same. The specific structure of the multiple first-defined structures can be selected according to the actual situation.

[0057] Each first setting structure can be paired with a second setting structure to form a first evanescent wave coupler 250.

[0058] It should be understood that the structures of the first and second configurations that cooperate with each other need to satisfy the requirement that they can cooperate to form the first evanescent wave coupler 250.

[0059] The aforementioned multiple second configuration structures can be different optical paths within a single second chip 200; they can also be structures on the second optical waveguides 220 of different second chips 200; or they can be partially different optical paths within a single second chip 200 and partially structures on the second optical waveguides 220 of different second chips 200. The placement of these multiple second configuration structures can be selected according to the actual situation.

[0060] In the above implementation process, multiple first setting structures are set, which can be used to cooperate with multiple second setting structures, thereby realizing the integration of optical chip 100 with multiple second chips 200, and / or realizing the transmission of light source in optical chip 100 to multiple optical paths in second chip 200, thereby increasing the application scenarios of optical chip 100.

[0061] In one possible implementation, the active gain medium 120 is a laser or an optical amplifier.

[0062] The laser here is a device that can generate laser light, which can be used to provide a light source.

[0063] It should be understood that when the active gain medium 120 is a laser, the light source generated by the laser enters the first optical waveguide 130 of the first insulating layer 110 through the second evanescent wave coupler 150, and is transmitted in the first optical waveguide 130, and then enters the second optical chip 100 through the first evanescent wave coupler 250.

[0064] The aforementioned optical amplifier is a device that can amplify optical signals.

[0065] Understandably, when the active gain medium 120 is an optical amplifier, an external light source enters the first optical waveguide 130 of the optical chip 100 through the optical port 260 coupler, is transmitted through the first optical waveguide 130 to the second evanescent wave coupler 150, and then enters the optical amplifier for amplification through the second evanescent wave coupler 150. The amplified light then passes through the second evanescent wave coupler 150 back into the first optical waveguide 130, is transmitted within the first optical waveguide 130, and then enters the second chip 200 through the first evanescent wave coupler 250.

[0066] Alternatively, an external light source can enter the optical chip 100 from the first optical waveguide 130, be transmitted through the first optical waveguide 130 to the second evanescent wave coupler 150, and then enter the optical amplifier for amplification via the second evanescent wave coupler 150. The amplified light then passes through the second evanescent wave coupler 150 back into the first optical waveguide 130, is transmitted within the first optical waveguide 130, and then enters the second chip 200 via the first evanescent wave coupler 250.

[0067] In one embodiment, the optical chip 100 further includes a first substrate 140.

[0068] One side of the first insulating layer 110 is disposed on the first substrate 140, and the active gain medium 120 is disposed on the side of the first insulating layer 110 away from the first substrate 140.

[0069] Optionally, an optical chip 100 may include one or more optical amplifiers. The optical chip 100 with one or more optical amplifiers may be integrated with the second chip 200.

[0070] In the above implementation process, the active gain medium 120 can be set as a laser or an optical amplifier according to actual needs, thereby increasing the application scenarios of the optical chip 100.

[0071] like Figure 4 , Figure 5 The diagram shown is a schematic of a heterogeneous integrated optical chip 100 provided in an embodiment of this application, including: the optical chip 100 and the second chip 200 in the above embodiment. The second chip 200 includes: a second insulating layer 210 and a second optical waveguide 220.

[0072] The second optical waveguide 220 is disposed within the second insulating layer 210; one side of the first insulating layer 110, which contains the active gain medium 120, is bonded to one layer of the second insulating layer 210.

[0073] A portion of the second optical waveguide 220 is patterned to form a second configuration structure; the first configuration structure and the second configuration structure in the optical chip 100 form a first evanescent wave coupler 250 after the optical chip 100 and the second chip 200 are bonded together.

[0074] Optionally, the second optical waveguide 220 may include one or more branches, and the specific structure of the second optical waveguide 220 can be selected according to the actual situation.

[0075] It should be understood that when the second optical waveguide 220 includes multiple second branch optical waveguides 221, a portion of each second branch optical waveguide 221 is patterned to form a second defined structure. The second defined structures in each second branch optical waveguide 221 may be the same or different.

[0076] The first evanescent wave coupler 250 described above is configured to transmit the light source in the first optical waveguide 130 to the second chip 200.

[0077] The second chip 200 may include an active optical device 240 and / or a passive optical device 240. The second chip 200 may be configured to process optical signals.

[0078] Optionally, an optical chip 100 may be integrated with a second chip 200 having multiple second configuration structures, an optical chip 100 may be integrated with a second chip 200 having one second configuration structure, or multiple optical chips 100 may be integrated with a second chip 200 having multiple second configuration structures, etc. The integration method of the optical chip 100 and the second chip 200 can be selected according to the actual situation.

[0079] In the above implementation process, by setting a first predetermined structure in the first optical waveguide 130 of the optical chip 100 and a second predetermined structure in the second optical waveguide 220 of the second chip 200, when integrating the optical chip 100 and the second chip 200, it is only necessary to correspondingly set the first predetermined structure and the second predetermined structure to form a first evanescent wave coupler 250 to realize optical transmission between the optical chip 100 and the second chip 200. The structure of the second chip 200 is no longer restricted, improving the flexibility of integrating the optical chip 100 and the second chip 200. At the same time, the integration method is simple, reducing the integration difficulty of the optical chip 100 and the second chip 200.

[0080] In one possible implementation, the second chip 200 also includes an optical device 240 and an optical port 260.

[0081] The optical device 240 and the optical port 260 are disposed in the second insulating layer 210.

[0082] The light source of the optical device 240 is configured to transmit to the optical port 260 through the second optical waveguide 220, and the optical port 260 is configured to transmit the light source to the outside of the second chip 200.

[0083] Optionally, the optical device 240 may include an active optical device 240, a passive optical device 240, or both. There may be one or more optical devices 240. The number and type of the optical devices 240 can be selected according to the actual situation.

[0084] The aforementioned optical device 240 is configured to process optical signals.

[0085] The optical port 260 here is an interface for transmitting optical signals, which is used to transmit optical signals to the outside of the chip.

[0086] Optionally, the optical port 260 in the second chip 200 may include one or more.

[0087] In the above implementation process, by setting different optical devices 240 in the second chip 200, the second chip 200 can achieve different functions, increasing the diversity of the second chip 200. In addition, the heterogeneous integrated chip obtained by integrating the second chip 200 can also achieve different functions, increasing the application scenarios of the heterogeneous integrated chip.

[0088] In one possible implementation, another portion of the second optical waveguide 220 is patterned to form a third evanescent wave coupler.

[0089] Another part of the second optical waveguide 220 is a portion of the region outside the region where the second set structure is located.

[0090] The first evanescent wave coupler 250 is configured to transmit the light source in the first optical waveguide 130 to the third evanescent wave coupler; the third evanescent wave coupler is configured to transmit the light source between the optical device 240 and the second optical waveguide 220.

[0091] It should be understood that the light source in the first optical waveguide 130 enters the second optical waveguide 220 through the first evanescent wave coupler 250 and is transmitted within the second optical waveguide 220. It is then transmitted to the optical device 240 through the third evanescent wave coupler. The optical signal processed by the optical device 240 then enters the second optical waveguide 220 through the third evanescent wave coupler and is transmitted within the second optical waveguide 220. Finally, the light is transmitted to the outside of the heterogeneous integrated chip through the optical port 260 connected to the second optical waveguide 220.

[0092] In the above implementation process, by patterning the second optical waveguide 220, it can automatically form a third evanescent wave coupler to achieve optical transmission between the optical device 240 and the second optical waveguide 220. This reduces the number of optical waveguides required by the second chip 200, shrinks the size of the second chip 200, and consequently reduces the size of the heterogeneous integrated chip. Simultaneously, it also reduces the manufacturing cost of the second chip 200.

[0093] In one possible implementation, such as Figure 6 As shown, the second chip 200 includes: multiple optical devices 240; each second setting structure is connected to an optical device 240 through a second branch optical waveguide 221 to form an optical path; the ends of the multiple optical paths away from the second setting structure are all connected to the same optical port 260; multiple optical chips 100 are bonded to the second chip 200.

[0094] In this configuration, the first setting structure of each optical chip 100 and the corresponding second setting structure in the second chip 200 form a first evanescent wave coupler 250; each first evanescent wave coupler 250 is connected to a corresponding optical path and configured to transmit a light source to the corresponding optical path.

[0095] Optionally, the multiple optical devices 240 in the second chip 200 can be the same optical device 240 or different optical devices 240. The type of optical devices 240 in the second chip 200 can be adjusted according to the actual situation.

[0096] It should be understood that when multiple optical chips 100 need to be integrated with the second chip 200, the second optical waveguide 220 in the second chip 200 can be configured to include a structure comprising multiple second branch optical waveguides 221, each of which has a second defined structure. A first evanescent wave coupler 250 is formed by the cooperation of the second defined structure on each second branch optical waveguide 221 with the first defined structure on a corresponding optical chip 100.

[0097] In this process, the light in each optical chip 100 is transmitted to the corresponding second branch optical waveguide 221 in the second chip 200 through the first evanescent wave coupler 250.

[0098] In one embodiment, the second chip 200 further includes a second substrate 230.

[0099] One side of the second insulating layer 210 is disposed on the second substrate 230, and the optical chip 100 is integrated on the side of the second insulating layer 210 away from the second substrate 230.

[0100] In the above implementation process, by setting the second optical waveguide 220 in the second chip 200 to include a structure comprising multiple second branch optical waveguides 221, and each second branch optical waveguide 221 having a corresponding second setting structure, a first evanescent wave coupler 250 can be formed by the cooperation of the second setting structure on the second branch optical waveguide 221 with the corresponding first setting structure, thereby realizing the integration of multiple optical chips 100 with a second chip 200, which can improve the flexibility and diversity of the heterogeneous integrated chip and increase the application scenarios of the heterogeneous integrated chip.

[0101] In one possible implementation, such as Figure 7 As shown, the second chip 200 includes multiple optical devices 240 and multiple optical ports 260; each second configuration structure is connected to an optical device 240 and an optical port 260 through a second branch optical waveguide 221 to form an optical path; the first optical waveguide 130 in the optical chip 100 is divided into multiple first branch optical waveguides 131 under the action of a beam splitter; a portion of each first branch optical waveguide 131 is patterned to form a first configuration structure; the optical chip 100 is bonded to the second chip 200.

[0102] In this configuration, each first setting structure of the optical chip 100 and a corresponding second setting structure in the second chip 200 form a first evanescent wave coupler 250; each first evanescent wave coupler 250 is connected to a corresponding optical path and configured to transmit a light source to the corresponding optical path.

[0103] It should be understood that when the optical chip 100 needs to be integrated with multiple second chips 200, a beam splitter can be set in the optical chip 100 to divide the first optical waveguide 130 into multiple first branch optical waveguides 131. Each first branch optical waveguide 131 is provided with a first setting structure. By cooperating the first setting structure on each first branch optical waveguide 131 with the second setting structure on a corresponding second chip 200, a first evanescent wave coupler 250 is formed.

[0104] The light in each of the first branch optical waveguides 131 is transmitted through the first evanescent wave coupler 250 to the second branch optical waveguide 221 of the corresponding second chip 200.

[0105] In the above implementation process, by setting the first optical waveguide 130 in the optical chip 100 to include a structure of multiple first branch optical waveguides 131, and each first branch optical waveguide 131 is provided with a corresponding first setting structure, a first evanescent wave coupler 250 can be formed by the cooperation of the first setting structure on the first branch optical waveguide 131 with the corresponding second setting structure, thereby realizing the integration of one optical chip 100 with multiple second chips 200, which can improve the flexibility and diversity of the heterogeneous integrated chip and increase the application scenarios of the heterogeneous integrated chip.

[0106] In one possible implementation, the first optical waveguide 130 is made of silicon, or of silicon and silicon nitride. For example, the first optical waveguide 130 may consist of a single layer of silicon. As another example, the first optical waveguide 130 may also consist of a single layer of silicon and a single layer of silicon nitride. The specific materials and structure of the first optical waveguide 130 can be selected according to the actual situation.

[0107] In one embodiment, the second optical waveguide 220 is made of silicon, or of silicon and silicon nitride. For example, the second optical waveguide 220 may be composed of a single layer of silicon. As another example, the second optical waveguide 220 may also be composed of a single layer of silicon and a single layer of silicon nitride. The specific materials and structure of the second optical waveguide 220 can be selected according to actual conditions.

[0108] In the above implementation process, since silicon and silicon nitride have the advantages of high refractive index and low loss, by setting the materials of the first optical waveguide 130 and the second optical waveguide 220 as silicon or silicon nitride, the refractive index of the first optical waveguide 130 and the second optical waveguide 220 can be increased and the loss of light transmission in the first optical waveguide 130 and the second optical waveguide 220 can be reduced.

[0109] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0110] In addition, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0111] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks. It should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0112] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0113] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An optical chip, characterized in that, include: The first insulating layer, the active gain dielectric, and the first optical waveguide; The first optical waveguide is disposed within the first insulating layer; wherein, a portion of the first optical waveguide is patterned to form a first defined structure, the first defined structure being configured to cooperate with a second defined structure to form a first evanescent wave coupler; the second defined structure is a portion of the second optical waveguide in the second chip that is patterned. The active gain medium is disposed on one side of the first insulating layer; The active gain medium is configured to transmit the light source to the second chip through the first evanescent wave coupler.

2. The optical chip according to claim 1, characterized in that, Another part of the first optical waveguide is patterned to form a second evanescent wave coupler; the other part of the first optical waveguide is a portion of the region outside the region where the first set structure is located in the first optical waveguide; The light source of the active gain medium is configured to enter the first optical waveguide through the second evanescent wave coupler and transmit within the first optical waveguide.

3. The optical chip according to claim 1, characterized in that, The first set structure can be multiple; Multiple first configuration structures are configured to cooperate with multiple second configuration structures to form multiple first evanescent wave couplers.

4. The optical chip according to any one of claims 1-3, characterized in that, The active gain medium is a laser or an optical amplifier.

5. A heterogeneous integrated optical chip, characterized in that, include: The optical chip and the second chip according to any one of claims 1-4; The second chip includes: a second insulating layer and a second optical waveguide; The second optical waveguide is disposed within the second insulating layer; wherein a portion of the second optical waveguide is patterned to form a second defined structure. The first insulating layer has an active gain dielectric on one side that is bonded to a layer of the second insulating layer; Wherein, the first setting structure and the second setting structure in the optical chip form a first evanescent wave coupler after the optical chip and the second chip are bonded together; The first evanescent wave coupler is configured to transmit light from the first optical waveguide to the second chip.

6. The heterogeneous integrated optical chip according to claim 5, characterized in that, The second chip also includes: optical devices and an optical port; The optical device and the optical port are disposed in the second insulating layer; The light source of the optical device is configured to be transmitted through the optical port via the second light waveguide, and the optical port is configured to transmit the light source to the outside of the second chip.

7. The heterogeneous integrated optical chip according to claim 6, characterized in that, Another part of the second optical waveguide is patterned to form a third evanescent wave coupler; the other part of the second optical waveguide is a portion of the region outside the region where the second set structure is located in the second optical waveguide; The first evanescent wave coupler is configured to transmit a light source in the first optical waveguide to the second optical waveguide; the third evanescent wave coupler is configured to transmit the light source between the optical device and the second optical waveguide.

8. The heterogeneous integrated optical chip according to claim 6, characterized in that, The second optical waveguide includes a plurality of second branch optical waveguides, and a portion of each second branch optical waveguide is patterned to form a second defined structure; the second chip includes a plurality of optical devices; Each of the second setting structures is connected to one of the optical devices through a second branch optical waveguide to form an optical path; the ends of multiple optical paths away from the second setting structure are all connected to the same optical port; Multiple optical chips are bonded to the second chip; In this configuration, the first configuration structure of each optical chip and a corresponding second configuration structure in the second chip form a first evanescent wave coupler. Each of the first evanescent wave couplers is connected to a corresponding optical path and configured to transmit the light source to the corresponding optical path.

9. The heterogeneous integrated optical chip according to claim 6, characterized in that, The second optical waveguide includes multiple second branch optical waveguides, and a portion of each second branch optical waveguide is patterned to form a second defined structure; the second chip includes multiple optical devices and multiple optical ports; Each of the second defined structures is connected to an optical device and an optical port through a second branch optical waveguide, forming an optical path; The first optical waveguide in the optical chip is divided into multiple first branch optical waveguides by the beam splitter; a portion of each first branch optical waveguide is patterned to form a first defined structure. The optical chip is bonded to the second chip; Wherein, each of the first set structures of the optical chip and a corresponding second set structure in the second chip form a first evanescent wave coupler; Each of the first evanescent wave couplers is connected to a corresponding optical path and configured to transmit the light source to the corresponding optical path.

10. The heterogeneous integrated optical chip according to claim 5, characterized in that, The material of the first optical waveguide is silicon, or the material of the first optical waveguide is silicon and silicon nitride; The material of the second optical waveguide is silicon, or the material of the second optical waveguide is silicon and silicon nitride.

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