Auxiliary equipment for improving photoetching alignment precision of semiconductor chip

Abstract

The invention discloses semiconductor chip photoetching alignment precision improvement auxiliary equipment, and relates to the technical field of overlay measurement equipment, the semiconductor chip photoetching alignment precision improvement auxiliary equipment comprises an overlay measurement equipment body, a self-checking mechanism is arranged in the overlay measurement equipment body, and a wiping mechanism is arranged in the overlay measurement equipment body. The self-checking mechanism can carry out self-checking on the adsorption state of the vacuum adsorption structure every day, the wiping mechanism can wipe a lens of an optical system, the self-checking mechanism comprises a mechanical arm body, and the mechanical arm body is installed in the alignment measurement equipment body. The second electromagnetic valve can be controlled to be opened and the first electromagnetic valve can be controlled to be closed, so that clean water in the lower half part of the storage box can be pumped out to clean the cleaning liquid in the cotton-shaped object of the wiping plate, and the lens surfaces of the coarse alignment mechanism and the fine alignment mechanism can be wiped once again; and redundant clean water and cleaning liquid can enter the recycling box through a guide plate and a rectangular opening to be stored.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of overlay measurement equipment, in particular to a kind of semiconductor chip photoetching alignment precision promotion auxiliary equipment. BACKGROUND

[0002] Overlay measurement equipment is the core auxiliary equipment for accurately detecting wafer interlayer overlay error in semiconductor manufacturing, which captures pattern offset data with nanometer-level measurement capability, is indispensable in photoetching alignment precision promotion, provides real-time error compensation for photoetching machine through "measurement-correction-feedback" closed loop, effectively suppresses process deviation, and stabilizes overlay precision at sub-nanometer level, which is the key support to guarantee advanced process chip yield and performance.

[0003] At present, the existing overlay measurement equipment needs to wipe the lens of its optical system every day and needs to check the vacuum adsorption state of the mechanical hand, which needs to be operated by employees, which is relatively inconvenient.

[0004] And we will find that the existing overlay measurement equipment is difficult to avoid the above problems when in use, and even if it can be solved, it needs to be solved by external tools, so it cannot achieve the desired effect, therefore, we propose a kind of semiconductor chip photoetching alignment precision promotion auxiliary equipment. SUMMARY

[0005] The present application aims to provide a kind of semiconductor chip photoetching alignment precision promotion auxiliary equipment to solve the problems proposed in the above background.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a kind of semiconductor chip photoetching alignment precision promotion auxiliary equipment, including overlay measurement equipment body, the inside of the overlay measurement equipment body is provided with self-checking mechanism, the inside of the overlay measurement equipment body is provided with wiping mechanism; The self-checking mechanism can self-check the adsorption state of the vacuum adsorption structure every day; The wiping mechanism can wipe the lens of the optical system.

[0007] Preferably, the self-checking mechanism comprises a mechanical arm body, the mechanical arm body is mounted in the inside of the overlay measurement device body, the inner wall of the mechanical arm body is rotationally connected with a circular cylinder, the outer surface of the circular cylinder is fixedly connected with a rectangular box and a first transmission gear respectively, the first transmission gear is arranged in the inside of the mechanical arm body, the rectangular box is arranged outside the mechanical arm body, the inner wall of the mechanical arm body is fixedly connected with a stepping motor, the output end of the stepping motor is fixedly connected with a second transmission gear, the teeth of the second transmission gear are engaged with the teeth of the first transmission gear, the inner wall of the overlay measurement device body is fixedly connected with a rectangular frame, the inner wall of the rectangular frame is fixedly connected with two groups of mounting plates, the number of each group of mounting plates is two, the bottom surfaces of the two mounting plates are fixedly connected with two trigger buttons, each trigger button is electrically connected with the overlay measurement device body through a wire, and the inside of the rectangular frame is provided with a wiping plate.

[0008] Preferably, the bottom surface of the rectangular box is provided with a plurality of same circular holes, the inner wall of the mechanical arm body is fixedly connected with an air pump, the input end of the air pump is fixedly and continuously connected with a suction pipe, the outer surface of the suction pipe is rotationally connected to the inner wall of the circular cylinder, the output end of the air pump is fixedly and continuously connected with an air outlet pipe, and one end of the air outlet pipe penetrates through the mechanical arm body and extends to the outside of the mechanical arm body.

[0009] Preferably, the inner wall of the overlay measurement device body is fixedly connected with a coarse alignment mechanism and a fine alignment mechanism, and the inside of the overlay measurement device body is clamped with a protective plate.

[0010] Preferably, the wiping mechanism comprises a storage box, one side surface of the storage box is fixedly connected to one side surface of the rectangular frame, the upper surface of the storage box is fixedly connected with a driving pump, the input end of the driving pump is fixedly and continuously connected with an input pipe, the outer surface of the input pipe is fixedly and continuously connected with an extension pipe, one end of the extension pipe and one end of the input pipe both penetrate through the storage box and extend to the inside of the storage box, the outer surface of the extension pipe is fixedly and continuously connected with a first electromagnetic valve, the outer surface of the input pipe is fixedly and continuously connected with a second electromagnetic valve, and the output end of the driving pump is fixedly and continuously connected with an output pipe.

[0011] Preferably, the inner wall of the rectangular frame is fixedly connected with a fixed plate, the outer surface of the output pipe is fixedly connected to the inner wall of the fixed plate, and the inner wall of the rectangular frame is fixedly connected with a scraper.

[0012] Preferably, one side surface of the rectangular frame is fixedly connected with a baffle, and the inner wall of the rectangular frame is fixedly connected with a guide plate.

[0013] Preferably, one side of the rectangular frame is fixedly connected with a recycling box, and one side of the recycling box and one side of the rectangular frame are both provided with a rectangular opening.

[0014] Preferably, one side of the recycling box is fixedly connected with a recycling pipe, and the recycling pipe is internally clamped with a clamping block.

[0015] Preferably, one side of the storage box is fixedly connected with two injection pipes, and each of the injection pipes is internally clamped with a plug block.

[0016] Compared with the prior art, the present application has the following advantages: 1、The present application sets up the air pump, when the negative pressure adsorption state of the equipment needs to be checked, the mechanical arm body is controlled to run, the rectangular box is driven to move above the wiping plate and contact with the upper surface of the wiping plate, at this time, the air pump is controlled to run, so that the inside of the rectangular box is in a negative pressure state, if the negative pressure state is in a normal condition, the mechanical arm body can drive the rectangular box and the wiping plate to move upward, and the rectangular box will pass through the two installation plates above, but the wiping plate cannot pass through the two installation plates, but will contact with the two trigger buttons fixed on the bottom surface of the two installation plates, after the trigger buttons are triggered, the trigger buttons will transmit an electric signal to the control system in the reticle measuring equipment body through the wires, and the control system in the reticle measuring equipment body will present the information that the state is good to the display screen, at this time, the working personnel can clearly observe that the negative pressure adsorption state of the equipment is in good information.

[0017] 2、The utility model discloses a drive pump is set, when the negative pressure state is good, the mechanical arm body will draw out the wiping board from the inside of the rectangular frame, then control the step motor operation, the step motor operation can pass through first transmission gear and transmit power to second transmission gear, therefore can drive the rotation of the circular cylinder, further can drive the rectangular box and wiping board to rotate one hundred and eighty degrees, make the cotton of wiping board bottom surface rotate one hundred and eighty degrees to the position of the upper position, subsequently the mechanical arm body will drive the rectangular box and wiping board to move to the upper half of the rectangular frame again, and finally will move to the below of output pipe, subsequently drive pump and first electromagnetic valve operation, drive pump can draw out the cleaning fluid stored in the upper half of storage box through input pipe and extension pipe, finally spray on the cotton of wiping board, when the cotton is full of cleaning fluid, can control the mechanical arm body and draw out wiping board, in the process of drawing out, can utilize the scraping plate and scrape the cleaning fluid adsorbed in the cotton of wiping board, subsequently can control the mechanical arm body and wipe the lens surface of rough alignment mechanism and fine alignment mechanism with wiping board contact, when wiping work is finished, can control wiping board and return to the below of output pipe again, at this moment, can control second electromagnetic valve and open, first electromagnetic valve closes, can draw out the clean water in the lower half of storage box, and clean the cleaning fluid in the cotton of wiping board, subsequently wipe the lens surface of rough alignment mechanism and fine alignment mechanism again, and the extra clean water and cleaning fluid can enter the inside storage of recycling box through guide plate and rectangular mouth. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the whole structure schematic diagram of the utility model; Figure 2 It is the left view structure schematic diagram of rough alignment mechanism of the utility model; Figure 3 It is the left view structure schematic diagram of fine alignment mechanism of the utility model; Figure 4 It is the utility model Figure 3 The partial close -up drawing of A in the utility model; Figure 5 It is the partial close -up drawing of B in the utility model; Figure 3 Figure 6 It is the left view structure schematic diagram of scraping plate of the utility model.

[0019] In the drawing: ​1, Overlay measurement device body; 2, Wiping mechanism; 201, Rectangular frame; 202, Storage box; 203, Drive pump; 204, Output pipe; 205, First electromagnetic valve; 206, Extension pipe; 207, Input pipe; 208, Second electromagnetic valve; 209, Fixed plate; 210, Scraper; 3, Self-checking mechanism; 301, Rectangular box; 302, Circular cylinder; 303, Second transmission gear; 304, Stepping motor; 305, First transmission gear; 306, Mounting plate; 307, Trigger button; 308, Wiping plate; 4, Guard plate; 5, Fine alignment mechanism; 6, Rough alignment mechanism; 8, Circular hole; 9, Mechanical arm body; 10, Gas outlet pipe; 11, Air pump; 12, Air suction pipe; 13, Recovery box; 14, Recovery pipe; 15, Clamping block; 16, Blocking block; 17, Injection pipe; 18, Rectangular port; 19, Guide plate; 20, Baffle. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0021] Embodiment 1: Please refer to Figures 1-6 The present application provides a technical solution: a kind of semiconductor chip photoetching alignment precision promotion auxiliary equipment, including overlay measurement device body 1, self-checking mechanism 3 is provided in the inside of overlay measurement device body 1, wiping mechanism 2 is provided in the inside of overlay measurement device body 1; Self-checking mechanism 3 can check the adsorption state of vacuum adsorption structure every day; Wiping mechanism 2 can wipe the lens of optical system.

[0022] The self-checking mechanism 3 comprises a mechanical arm body 9 which is installed inside the overlay measurement device body 1, the inner wall of the mechanical arm body 9 is rotationally connected with a circular cylinder 302, the outer surface of the circular cylinder 302 is fixedly connected with a rectangular box 301 and a first transmission gear 305 respectively, the first transmission gear 305 is arranged inside the mechanical arm body 9, the rectangular box 301 is arranged outside the mechanical arm body 9, the inner wall of the mechanical arm body 9 is fixedly connected with a stepping motor 304, the output end of the stepping motor 304 is fixedly connected with a second transmission gear 303, the teeth of the second transmission gear 303 are engaged with the teeth of the first transmission gear 305, the inner wall of the overlay measurement device body 1 is fixedly connected with a rectangular frame 201, the inner wall of the rectangular frame 201 is fixedly connected with two groups of mounting plates 306, the number of each group of mounting plates 306 is two, the bottom surfaces of the two mounting plates 306 are fixedly connected with two trigger buttons 307, each trigger button 307 is electrically connected with the overlay measurement device body 1 through a wire, the inside of the rectangular frame 201 is provided with a wiping plate 308, the bottom surface of the wiping plate 308 is in contact with the upper surfaces of the other two mounting plates 306; The bottom surface of the rectangular box 301 is provided with a plurality of same circular holes 8, the inner wall of the mechanical arm body 9 is fixedly connected with an air pump 11, the input end of the air pump 11 is fixedly communicated with a suction pipe 12, the outer surface of the suction pipe 12 is rotationally connected with the inner wall of the circular cylinder 302, the output end of the air pump 11 is fixedly communicated with an air outlet pipe 10, one end of the air outlet pipe 10 penetrates through the mechanical arm body 9 and extends to the outside of the mechanical arm body 9, by arranging the air pump 11, the air pump 11 can exhaust the gas in the rectangular box 301 through the suction pipe 12, so that a negative pressure state is formed in the rectangular box 301, and the gas is finally exhausted outward through the air outlet pipe 10; The inner wall of the overlay measurement device body 1 is fixedly connected with a coarse alignment mechanism 6, the inner wall of the overlay measurement device body 1 is fixedly connected with a fine alignment mechanism 5, the inside of the overlay measurement device body 1 is clamped with a protective plate 4, by arranging the coarse alignment mechanism 6 and the fine alignment mechanism 5, the alignment effect can be achieved.

[0023] The specific implementation of the embodiment is that when it is necessary to check the negative pressure adsorption state of the device, the control structure in the overlay measurement device body 1 controls the mechanical arm body 9 to operate, drives the rectangular box 301 to move to the upper side of the wiping plate 308 and contact the upper surface of the wiping plate 308, at this time, the air pump 11 can be controlled to operate, under the action of the air suction pipe 12, the inside of the rectangular box 301 can be in a negative pressure state, if the negative pressure state is in a normal condition, the mechanical arm body 9 can drive the rectangular box 301 and the wiping plate 308 to move upwards, and the rectangular box 301 can pass through the two installation plates 306 above, but the wiping plate 308 cannot pass through the two installation plates 306 and will contact the two trigger buttons 307 fixed on the bottom surfaces of the two installation plates 306, after the trigger buttons 307 are triggered, the trigger buttons 307 can transmit an electrical signal to the control system in the overlay measurement device body 1 through the wires, and the control system in the overlay measurement device body 1 can present the information that the state is good on the display screen, at this time, the working personnel can clearly observe that the device negative pressure adsorption state is in a good condition, otherwise, if the air pump 11 operates abnormally or the rectangular box 301 is not sealed well, the wiping plate 308 cannot contact the trigger buttons 307, at this time, it means that the negative pressure is abnormal.

[0024] Embodiment 2: see Figures 1-6 The present application provides a technical solution: a kind of semiconductor chip photoetching alignment precision promotion auxiliary equipment, the present application is directed to the technical problems mentioned in the background art for corresponding improvement.

[0025] As a further limitation of the wiping mechanism 2 of the present application, the wiping mechanism 2 includes a storage box 202, one side of the storage box 202 is fixedly connected to one side of the rectangular frame 201, the upper surface of the storage box 202 is fixedly connected with a drive pump 203, the input end of the drive pump 203 is fixedly communicated with an input pipe 207, the outer surface of the input pipe 207 is fixedly communicated with an extension pipe 206, one end of the extension pipe 206 and one end of the input pipe 207 both penetrate the storage box 202 and extend into the inside of the storage box 202, the outer surface of the extension pipe 206 is fixedly communicated with a first electromagnetic valve 205, the outer surface of the input pipe 207 is fixedly communicated with a second electromagnetic valve 208, the output end of the drive pump 203 is fixedly communicated with an output pipe 204, one end of the output pipe 204 penetrates the rectangular frame 201 and extends into the inside of the rectangular frame 201.

[0026] The inner wall of the rectangular frame 201 is fixedly connected with a fixed plate 209, the outer surface of the output pipe 204 is fixedly connected to the inner wall of the fixed plate 209, the inner wall of the rectangular frame 201 is fixedly connected with a scraper 210, by being provided with the fixed plate 209, the fixed plate 209 can be fixed with the output pipe 204, and the existence of the scraper 210 can scrape off a large part of the water or cleaning liquid adsorbed in the inside of the wiping plate 308; One side of the rectangular frame 201 is fixedly connected with a baffle 20, and the inner wall of the rectangular frame 201 is fixedly connected with a guide plate 19. The baffle 20 can prevent water and cleaning liquid from flowing into the interior of the equipment, and the guide plate 19 can guide water and cleaning liquid into the interior of the recycling box 13. One side of the rectangular frame 201 is fixedly connected with a recycling box 13, and one side of the recycling box 13 and one side of the rectangular frame 201 are both provided with a rectangular opening 18. The recycling box 13 can collect the scraped-off waste water and cleaning liquid. One side of the recycling box 13 is fixedly connected with a recycling pipe 14, and the recycling pipe 14 is internally connected with a clamping block 15. The clamping block 15 can be pulled out to discharge the waste water and cleaning liquid in the recycling box 13 through the recycling pipe 14. One side of the storage box 202 is fixedly connected with two injection pipes 17, and each injection pipe 17 is internally connected with a blocking block 16. The blocking block 16 can be pulled out to inject cleaning liquid and clean water into the upper and lower parts of the storage box 202 through the injection pipes 17.

[0027] The specific implementation of the embodiment is that when the negative pressure adsorption function is in good condition, the mechanical arm body 9 will pull the wiping plate 308 out of the inside of the rectangular frame 201, then control the stepper motor 304 to run, the stepper motor 304 running can transmit power to the second transmission gear 303 through the first transmission gear 305, so as to drive the circular cylinder 302 to rotate, further drive the rectangular box 301 and the wiping plate 308 to rotate one hundred and eighty degrees, so that the cotton-like object on the bottom surface of the wiping plate 308 rotates one hundred and eighty degrees to the upward position, then the mechanical arm body 9 will drive the rectangular box 301 and the wiping plate 308 to move to the upper half of the rectangular frame 201 again, and finally move to the below of the output pipe 204, then drive the pump 203 and the first electromagnetic valve 205 to run, the driving pump 203 can pull out the cleaning liquid stored in the upper half of the storage box 202 through the input pipe 207 and the extension pipe 206, and finally spray on the cotton-like object of the wiping plate 308, when the cotton-like object is full of cleaning liquid, the mechanical arm body 9 can be controlled to pull out the wiping plate 308, in the process of pulling out, the scraping plate 210 can be used to scrape off most of the cleaning liquid adsorbed in the inside of the cotton-like object of the wiping plate 308, then the mechanical arm body 9 can be controlled to make the wiping plate 308 contact with the lens surface of the coarse alignment mechanism 6 and the fine alignment mechanism 5 to wipe, when the wiping work is completed, the wiping plate 308 can be controlled to return to the below of the output pipe 204 again, at this time, the second electromagnetic valve 208 can be controlled to open, and the first electromagnetic valve 205 can be controlled to close, so as to pull out the clean water in the lower half of the storage box 202, and clean the cleaning liquid in the cotton-like object of the wiping plate 308, then wipe the lens surface of the coarse alignment mechanism 6 and the fine alignment mechanism 5 again, and the excess clean water and cleaning liquid can be stored in the inside of the recycling box 13 through the guide plate 19 and the rectangular port 18.

[0028] Embodiment 3: Specifically, the semiconductor chip photolithography alignment precision improvement auxiliary equipment works: When it is necessary to check the negative pressure adsorption state of the device, the control structure in the overlay measurement device body 1 controls the mechanical arm body 9 to operate, drives the rectangular box 301 to move above the wiping plate 308 and contact the upper surface of the wiping plate 308, at this time, the air pump 11 can be controlled to operate, under the action of the air suction pipe 12, the inside of the rectangular box 301 can be in a negative pressure state, if the negative pressure state is in a normal condition, the mechanical arm body 9 can drive the rectangular box 301 and the wiping plate 308 to move upwards, and the rectangular box 301 will pass through the two installation plates 306 above, but the wiping plate 308 cannot pass through the two installation plates 306, but will contact the two trigger buttons 307 fixed on the bottom surface of the two installation plates 306, after the trigger buttons 307 are triggered, an electrical signal is transmitted to the control system in the overlay measurement device body 1 through the wire, and the control system in the overlay measurement device body 1 presents the information of good state to the display screen, at this time, the working personnel can clearly observe that the device negative pressure adsorption state is in good information, otherwise, if the air pump 11 operates abnormally or the rectangular box 301 is not sealed well, the wiping plate 308 cannot contact the trigger button 307, at this time, it means that the negative pressure is abnormal; When the negative pressure adsorption function is in a good state, the mechanical arm body 9 will pull the wiping plate 308 out of the inside of the rectangular frame 201, then control the step motor 304 to operate, the step motor 304 can transmit power to the second transmission gear 303 through the first transmission gear 305, so as to drive the circular cylinder 302 to rotate, further drive the rectangular box 301 and the wiping plate 308 to rotate one hundred and eighty degrees, so that the cotton-like object on the bottom surface of the wiping plate 308 rotates one hundred and eighty degrees to the upward position, then the mechanical arm body 9 will drive the rectangular box 301 and the wiping plate 308 to move to the upper half of the rectangular frame 201 again, and finally move to the lower side of the output pipe 204, then drive the pump 203 and the first electromagnetic valve 205 to operate, the driving pump 203 can pull out the cleaning liquid stored in the upper half of the storage box 202 through the input pipe 207 and the extension pipe 206, and finally spray it on the cotton-like object of the wiping plate 308, when the cotton-like object is full of cleaning liquid, the mechanical arm body 9 can be controlled to pull out the wiping plate 308, in the process of pulling out, the scraping plate 210 can be used to scrape off most of the cleaning liquid adsorbed in the inside of the cotton-like object of the wiping plate 308, then the mechanical arm body 9 can be controlled to make the wiping plate 308 contact the lens surface of the coarse alignment mechanism 6 and the fine alignment mechanism 5 to wipe, when the wiping work is completed, the wiping plate 308 can be controlled to return to the lower side of the output pipe 204 again, at this time, the second electromagnetic valve 208 can be controlled to open and the first electromagnetic valve 205 to close, so as to pull out the clean water in the lower half of the storage box 202, to clean the cleaning liquid in the cotton-like object of the wiping plate 308, then wipe the lens surface of the coarse alignment mechanism 6 and the fine alignment mechanism 5 again, the excess clean water and cleaning liquid will enter the inside of the recycling box 13 through the guide plate 19 and the rectangular port 18.

[0029] It has to be noted that, in the present document, the terms "first", "second", etc. merely serve to identify different entities or actions from each other, without necessarily requiring or implying any actual relationship or order between these entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0030] While embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, combinations, and variations of the embodiments can be undertaken without departing from the spirit and scope of the present application, which is defined by the appended claims and their equivalents.

Claims

1. An auxiliary device for improving the photolithography alignment accuracy of semiconductor chips, comprising an overlay measurement device body (1), characterized in that: The overlay measuring device body (1) is equipped with a self-inspection mechanism (3) and a wiping mechanism (2). The self-inspection mechanism (3) is able to perform a self-inspection of the adsorption state of the vacuum adsorption structure every day; The wiping mechanism (2) is capable of wiping the lens of the optical system.

2. The semiconductor chip photolithography alignment accuracy improvement auxiliary device according to claim 1, characterized in that: The self-inspection mechanism (3) includes a robotic arm body (9), which is installed inside the overlay measuring device body (1). A cylindrical cylinder (302) is rotatably connected to the inner wall of the robotic arm body (9). A rectangular box (301) and a first transmission gear (305) are fixedly connected to the outer surface of the cylindrical cylinder (302). The first transmission gear (305) is located inside the robotic arm body (9), and the rectangular box (301) is located outside the robotic arm body (9). A stepper motor (304) is fixedly connected to the inner wall of the robotic arm body (9). A second transmission gear (303) is fixedly connected to the output end of the stepper motor (304). The teeth of the moving gear (303) mesh with the teeth of the first transmission gear (305). A rectangular frame (201) is fixedly connected to the inner wall of the body (1) of the overlay measuring device. Two sets of mounting plates (306) are fixedly connected to the inner wall of the rectangular frame (201). Each set of mounting plates (306) consists of two plates. Two trigger buttons (307) are fixedly connected to the bottom surface of the two mounting plates (306). Each trigger button (307) is electrically connected to the body (1) of the overlay measuring device through a wire. A wiping plate (308) is provided inside the rectangular frame (201). The bottom surface of the wiping plate (308) is in contact with the upper surface of the other two mounting plates (306).

3. The semiconductor chip photolithography alignment accuracy improvement auxiliary device according to claim 2, characterized in that: The bottom surface of the rectangular box (301) has several identical circular holes (8). An air pump (11) is fixedly connected to the inner wall of the robotic arm body (9). The input end of the air pump (11) is fixedly connected to an air extraction pipe (12). The outer surface of the air extraction pipe (12) is rotatably connected to the inner wall of the circular cylinder (302). The output end of the air pump (11) is fixedly connected to an air outlet pipe (10). One end of the air outlet pipe (10) passes through the robotic arm body (9) and extends to the outside of the robotic arm body (9).

4. The semiconductor chip photolithography alignment accuracy improvement auxiliary device according to claim 2, characterized in that: The inner wall of the overlay measuring device body (1) is fixedly connected to a coarse alignment mechanism (6), the inner wall of the overlay measuring device body (1) is fixedly connected to a fine alignment mechanism (5), and a protective plate (4) is snapped into the inside of the overlay measuring device body (1).

5. The semiconductor chip photolithography alignment accuracy improvement auxiliary device according to claim 2, characterized in that: The wiping mechanism (2) includes a storage box (202), one side of which is fixedly connected to one side of a rectangular frame (201). A drive pump (203) is fixedly connected to the upper surface of the storage box (202). An input pipe (207) is fixedly connected to the input end of the drive pump (203). An extension pipe (206) is fixedly connected to the outer surface of the input pipe (207). One end of the extension pipe (206) and one end of the input pipe (207) both penetrate the storage box (202) and extend into the interior of the storage box (202). A first solenoid valve (205) is fixedly connected to the outer surface of the extension pipe (206). A second solenoid valve (208) is fixedly connected to the outer surface of the input pipe (207). An output pipe (204) is fixedly connected to the output end of the drive pump (203). One end of the output pipe (204) penetrates the rectangular frame (201) and extends into the interior of the rectangular frame (201).

6. The semiconductor chip photolithography alignment accuracy improvement auxiliary device according to claim 5, characterized in that: The inner wall of the rectangular frame (201) is fixedly connected to a fixing plate (209), the outer surface of the output pipe (204) is fixedly connected to the inner wall of the fixing plate (209), and the inner wall of the rectangular frame (201) is fixedly connected to a scraper (210).

7. The semiconductor chip photolithography alignment accuracy improvement auxiliary device according to claim 2, characterized in that: A baffle (20) is fixedly connected to one side of the rectangular frame (201), and a guide plate (19) is fixedly connected to the inner wall of the rectangular frame (201).

8. The semiconductor chip photolithography alignment accuracy improvement auxiliary device according to claim 2, characterized in that: A recycling bin (13) is fixedly connected to one side of the rectangular frame (201), and a rectangular opening (18) is provided on one side of the recycling bin (13) and one side of the rectangular frame (201).

9. The semiconductor chip photolithography alignment accuracy improvement auxiliary device according to claim 8, characterized in that: One side of the recycling bin (13) is fixedly connected to a recycling pipe (14), and a locking block (15) is snapped into the inside of the recycling pipe (14).

10. The semiconductor chip photolithography alignment accuracy improvement auxiliary device according to claim 5, characterized in that: Two injection tubes (17) are fixedly connected to one side of the storage box (202), and each injection tube (17) has a blocking block (16) inside.

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