PCB pressing device

Abstract

The invention discloses a PCB pressing device, and relates to the technical field of PCB pressing, the PCB pressing device comprises a supporting device, a temperature adjusting device, a forming device and a vacuum pump, the vacuum pump produces negative pressure in the supporting device, the supporting device is used as a main supporting carrier and is used for installing and fixing other devices and providing a forming space, temperature adjustment is carried out through the temperature adjusting device, and the forming device is used for forming the PCB. Firstly, the prepreg of the PCB is heated through the electric heating piece to be melted, negative pressure is generated in the forming space of the supporting device through the vacuum pump, the flowing performance is improved, line gaps are filled, bubbles are discharged, and interlayer bonding is carried out. The press machine uniformly applies pressure to the PCB through the pressing plate, and auxiliary exhaust is carried out; and cooling and shaping the PCB, and molding under a certain pressure. And fixed-point cooling is carried out on the laminated plate, so that in the cooling process, the melt is directionally cooled and shrunk, exhaust is assisted, and the cross-linking quality is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of PCB (Printed Circuit Board) pressing, and particularly relates to a PCB pressing device. BACKGROUND

[0002] The printed circuit board (PCB) is widely applied to modern electronic industrial systems as a core component of electronic equipment. The manufacturing quality of the PCB directly determines the performance and reliability of the electronic product. In the manufacturing process of a multilayer PCB, a pressing device is one of the key devices.

[0003] The multilayer PCB is generally formed by stacking a core plate, a copper foil and semi-solid material and then hot pressing. The raw materials of the PCB are stacked by hand, and are placed in a sealed chamber. Negative pressure is generated in the chamber. The semi-solid material is melted by hot pressing, and the core plate and the copper foil are infiltrated. Under the action of vacuum and pressure, the air between the plates is discharged, and the PCB is formed after solidification. However, as the PCB is developing towards high density and multiple layers, the conventional hot pressing process generally adopts uniform heating. After the hot pressing is completed, the PCB needs to be transferred to a separate cooling station for natural cooling or forced liquid cooling. During the transfer process, the solidification performance of the molten material is affected, thereby reducing the overall production quality.

[0004] In addition, as the viscosity of the molten material gradually increases during the solidification process, the bubbles are not completely escaped during uniform cooling, which affects the overall manufacturing quality. SUMMARY

[0005] The application aims to provide a PCB pressing device to solve the problem that the viscosity of the molten material affects the bubble escape quality during uniform cooling in the prior art.

[0006] To achieve the above-mentioned purpose, the application provides the following technical scheme. The pressing device comprises a supporting device, a temperature adjusting device, a forming device and a vacuum pump. The vacuum pump generates negative pressure in the supporting device. The temperature adjusting device comprises an electric heating element and a cooling pipe. The forming device comprises a press machine. The output end of the press machine is provided with a pressing plate. The press machine is connected with the supporting device. The electric heating element and the cooling pipe are connected with the pressing plate respectively. The other end of the cooling pipe is connected with a cold source. The pressing plate is used for directional cooling of the PCB.

[0007] The support device is used for mounting and fixing other devices and providing a molding space, and temperature adjustment is performed by the temperature adjusting device.

[0008] Further, the pressing plate is provided with a heating cavity and a cooling channel. The heating element is arranged in the heating cavity, the cooling pipe is in communication with the cooling channel, the cooling channel is in a planar spiral shape, the cooling channel inlet is located in the middle of the pressing plate, and the cooling channel outlet is located at the edge of the pressing plate.

[0009] The pressing plate is made of a heat-conducting material, and the heating element can be an electric heating wire.

[0010] Further, the pressing plate is provided with a pressing surface at the lower end. The support device comprises a bearing disc for bearing the PCB. The heating cavity is located above the cooling channel, and the pressing surface is located below the cooling channel.

[0011] The pressing surface at the bottom end is used to press the PCB, which is helpful for exhausting air.

[0012] Further, the bearing disc is provided with a clamping groove which is suitable in size for the PCB.

[0013] By setting the clamping groove, the multi-layer raw material stack of the PCB board is adapted for automatic positioning. The clamping groove can be four-corner positioning, and the remaining part is hollowed out to facilitate bubble guidance after vacuumization.

[0014] Further, the support device further comprises a housing; The housing is provided with a pressing cavity; The pressing machine is connected with the pressing cavity, and the vacuum pump is in pipeline communication with the pressing cavity.

[0015] The housing provides a working space through the pressing cavity, and a vacuum environment is created in the pressing cavity through an external vacuum pump, which facilitates the escape of bubbles during hot melt forming. The pressing machine is installed in the pressing cavity and outputs linear displacement to extrude and exhaust the bubbles in the melt.

[0016] Further, the pressing device further comprises a conveying device; The support device further comprises a sealing assembly; The pressing cavity is provided with openings on both sides; The sealing assembly comprises an opening and closing cylinder, and the output end of the opening and closing cylinder is provided with a sealing plate; The conveying device is used for conveying the bearing disc, the opening and closing cylinder is connected with the housing, and the sealing plate is matched with the openings on both sides of the pressing cavity.

[0017] By setting the conveying device, automatic feeding and discharging are performed, and the stacked PCB board raw materials are placed on the bearing disc and then conveyed into the pressing cavity. The sealing plate is moved by the opening and closing cylinder on both sides of the housing to block the openings on both sides of the pressing cavity, thereby forming a relatively sealed space in the pressing cavity. The vacuum pump is used to perform vacuumization treatment on the pressing cavity. After vacuumization, hot melting and pressing treatment are performed.

[0018] As an optimization, the conveying device comprises two conveyors, which are respectively located at the openings on both sides of the pressing cavity. By setting the conveyors on both sides of the pressing cavity, segmented conveying is performed to facilitate the sealing plate to block the openings on both sides of the pressing cavity and improve the quality of vacuum manufacturing.

[0019] As an optimization, the conveying device further comprises a conveying belt, and at least two electric rollers are arranged in the pressing cavity. The outer rings of the two electric rollers are in contact with the inner ring of the conveying belt. The conveyors on both sides are used for feeding and discharging, and the electric rollers arranged in the pressing cavity are used to output torque to drive the conveying belt to rotate and move the bearing disc conveyed by the conveyor on the feeding side to the lower side of the pressing plate. After pressing and cooling, the bearing disc is sent to the conveyor on the discharging side for automatic processing, thereby improving the pressing quality.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows: By providing targeted cooling to the pressing plate, the molten material undergoes directional cooling and shrinkage during the cooling process, and venting is assisted, thereby improving the crosslinking quality; by setting the cooling channels in a ring shape, with the inlet located in the middle of the pressing plate and the outlet located at the edge of the pressing plate, the molten material near the middle of the pressing plate cools first during the cooling process. During the cooling process, the molten material shrinks from the hot end to the cold end, and the air bubbles are squeezed, improving the quality of air bubble removal and ensuring interlayer adhesion performance; during the cooling and shaping process, the liquid in the cooling channel also absorbs some heat during the hot melting process. When the bonding is completed, during the cooling process, the added cooling medium pushes the high-temperature medium in the original cooling channel to flow to the outside, forming a temperature gradient of external heat and internal cold. This allows air bubbles to continuously escape to the outside during the cooling and shrinkage process, improving the quality of interlayer bonding and avoiding the increase in viscosity of the molten material caused by simultaneous cooling, which would affect the quality of air bubble escape. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram showing the vacuum pump and housing of the present invention. Figure 3 This is a schematic diagram of the pressing cavity structure of the present invention; Figure 4 This is a schematic diagram of the molding device structure of the present invention; Figure 5 This is a schematic diagram of the arrangement of the heating element of the present invention; Figure 6 This is a schematic diagram of the cooling channel distribution structure of the present invention.

[0022] In the diagram: 1. Support device; 11. Housing; 111. Pressing cavity; 12. Sealing assembly; 121. Sealing plate; 122. Opening and closing cylinder; 13. Bearing plate; 131. Slot; 2. Temperature control device; 21. Heating element; 22. Cooling pipe; 3. Forming device; 31. Press; 32. Pressing plate; 321. Heating cavity; 322. Cooling channel; 323. Pressing surface; 4. Conveying device; 41. Conveyor; 42. Conveyor belt; 43. Electric roller; 5. Vacuum pump. Detailed Implementation

[0023] Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Example: Figures 1-6 As shown, the present invention provides a PCB board lamination device technical solution.

[0025] The pressing device includes a support device 1, a temperature control device 2, a molding device 3, and a vacuum pump 5. The vacuum pump 5 creates negative pressure within the support device 1. Temperature control device 2 includes heating element 21 and cooling pipe 22; The molding device 3 includes a press 31, and the output end of the press 31 is provided with a pressing plate 32; The press 31 is connected to the support device 1, the heating element 21 and the cooling pipe 22 are respectively connected to the pressing plate 32, and the other end of the cooling pipe 22 is connected to the cold source. The pressing plate 32 is used to directionally cool the PCB board.

[0026] Support device 1 serves as the main support carrier, used for installing and fixing other devices and providing molding space. Temperature is regulated by temperature control device 2. First, the semi-cured sheet of the PCB board is heated by heating element 21 to melt it. Vacuum pump 5 creates negative pressure in the molding space of support device 1 to improve flow performance, fill the gaps between lines, and remove air bubbles for interlayer bonding. Press 31 applies uniform pressure to the PCB board through pressing plate 32 for auxiliary degassing. Then, the medium from the cold source is sent to pressing plate 32 through cooling pipe 22 to cool and shape the PCB board under certain pressure to prevent warping. By providing targeted cooling to pressing plate 32, the molten material is directionally cooled and shrinked during the cooling process, and degassing is assisted, improving the crosslinking quality.

[0027] Furthermore, the pressing plate 32 is provided with a heating cavity 321 and a cooling channel 322 respectively; The heating element 21 is placed inside the heating chamber 321. The cooling pipe 22 and the cooling channel 322 are connected. The cooling channel 322 is in the shape of a planar spiral. The inlet of the cooling channel 322 is located in the middle of the pressing plate 32, and the outlet of the cooling channel 322 is located at the edge of the pressing plate 32.

[0028] The pressing plate 32 is used to install the heating element 21 through the heating chamber 321. The pressing plate 32 is made of thermally conductive material, and the heating element 21 can be a heating wire. The semi-cured sheet in the PCB board below is melted by electric heating, so that the molten material fills the circuit. Under the action of negative pressure, the air bubbles in the molten material are removed. The cooling channel 322 is arranged in a ring, with the inlet located in the middle of the pressing plate 32 and the outlet located at the edge of the pressing plate 32. During the cooling process, the molten material near the middle of the pressing plate 32 cools first. During the cooling process, the molten material shrinks. During the shrinkage process, the molten material shrinks from the hot end to the cold end and squeezes the air bubbles, improving the quality of air bubble removal and ensuring the interlayer adhesion performance.

[0029] Furthermore, the lower end of the pressing plate 32 is provided with a pressing surface 323; The support device 1 includes a support plate 13, which is used to support the PCB board; The heating chamber 321 is located on the upper side of the cooling channel 322, and the pressing surface 323 is located on the lower side of the cooling channel 322.

[0030] The PCB board is pressed by the pressing surface 323 at the bottom, which helps to expel air. The bearing plate 13 serves as the main support for the PCB board. During the pressing process, the board is first hot-melted and then cooled and shaped. During the hot-melting process, the liquid in the cooling channel 322 also absorbs some heat. When the bonding is completed, the added cooling medium pushes the high-temperature medium in the original cooling channel 322 to flow to the outside, forming a temperature gradient of external heat and internal cold. This allows air bubbles to continuously escape to the outside during the cooling and shrinkage process, improving the interlayer bonding quality and avoiding the increase in viscosity of the melt caused by simultaneous cooling, which would affect the quality of air bubble escape.

[0031] Furthermore, the carrier plate 13 is provided with a card slot 131, which is adapted to the size of the PCB board.

[0032] By setting the card slot 131, it can adapt to the stacking of multiple layers of raw materials on the PCB board and thus perform automatic positioning. The card slot 131 can be positioned at four corners, and the rest can be hollowed out to facilitate bubble guidance after vacuum is created.

[0033] Furthermore, the support device 1 also includes a housing 11; The housing 11 is provided with a pressing cavity 111; The press 31 is connected to the pressing chamber 111, and the vacuum pump 5 is connected to the pressing chamber 111 via a pipeline.

[0034] The housing 11 provides a working space through the pressing chamber 111. An external vacuum pump 5 creates a vacuum environment in the pressing chamber 111 to facilitate the escape of bubbles during the hot melt forming process. The press 31 is installed in the pressing chamber 111 and outputs linear displacement to squeeze and exhaust the bubbles in the melt.

[0035] Furthermore, the pressing device also includes a conveying device 4; The support device 1 also includes a sealing assembly 12; The pressing cavity 111 has openings on both sides; The sealing assembly 12 includes an opening and closing cylinder 122, and a sealing plate 121 is provided at the output end of the opening and closing cylinder 122; The conveying device 4 is used to convey the bearing plate 13, the opening and closing cylinder 122 is connected to the housing 11, and the specifications of the sealing plate 121 are adapted to the openings on both sides of the pressing cavity 111.

[0036] By setting up the conveying device 4, automatic loading and unloading is carried out. The stacked PCB board raw materials are placed on the carrier tray 13 and first conveyed into the pressing cavity 111. The opening and closing cylinders 122 on both sides of the housing 11 drive the sealing plate 121 to move, thereby sealing the openings on both sides of the pressing cavity 111, forming a relatively sealed space inside the pressing cavity 111. The pressing cavity 111 is evacuated by the vacuum pump 5. After evacuation, heat melting and pressing are carried out.

[0037] As an optimization, the conveying device 4 includes two conveyors 41, which are respectively located on both sides of the opening of the pressing cavity 111. By setting conveyors 41 on both sides of the pressing cavity 111 for segmented conveying, it is easier for the sealing plate 121 to seal the openings on both sides of the pressing cavity 111, thereby improving the quality of vacuum manufacturing.

[0038] As an optimization, the conveying device 4 also includes a conveyor belt 42. At least two electric rollers 43 are installed inside the pressing chamber 111, with the outer rings of the two electric rollers 43 contacting the inner ring of the conveyor belt 42. Conveyors 41 on both sides are used for loading and unloading. The electric rollers inside the pressing chamber 111 output torque to drive the conveyor belt 42 to rotate, moving the bearing plate 13 conveyed by the loading conveyor 41 to below the pressing plate 32. After pressing and cooling, it is then sent to the unloading conveyor 41 for automated processing, improving the pressing quality.

[0039] The working principle of this invention is as follows: By providing targeted cooling to the pressing plate 32, the molten material undergoes directional cooling and shrinkage during the cooling process, and air is vented, improving the cross-linking quality. The cooling channels 322 are arranged in a ring, with the inlet located in the middle of the pressing plate 32 and the outlet at the edge. This allows the molten material near the middle of the pressing plate 32 to cool first during the cooling process. During this cooling, the molten material shrinks from the hot end to the cold end, compressing air bubbles and improving bubble removal quality, thus ensuring interlayer adhesion. During cooling and shaping, the liquid in the cooling channels 322 also absorbs some heat during the hot-melt process. After bonding, when cooling is performed again, the added cooling medium pushes the high-temperature medium in the original cooling channels 322 to flow outwards, forming a temperature gradient of external heat and internal cold. This allows air bubbles to continuously escape outwards during the cooling and shrinkage process, improving the interlayer bonding quality and preventing the increased viscosity of the molten material caused by simultaneous cooling, which would affect the quality of bubble escape.

[0040] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A PCB board laminating device, characterized in that: The pressing device includes a support device (1), a temperature control device (2), a molding device (3), and a vacuum pump (5), wherein the vacuum pump (5) creates negative pressure within the support device (1); The temperature control device (2) includes an electric heating element (21) and a cooling pipe (22); The molding device (3) includes a press (31), and the output end of the press (31) is provided with a pressing plate (32). The press (31) is connected to the support device (1), the heating element (21) and the cooling pipe (22) are respectively connected to the pressing plate (32), the other end of the cooling pipe (22) is connected to the cold source, the pressing plate (32) is used to directionally cool the PCB board, and the pressing plate (32) is provided with a cooling channel (322), which is in the shape of a planar spiral.

2. The PCB board laminating device according to claim 1, characterized in that: The pressing plate (32) is provided with a heating cavity (321); The heating element (21) is placed inside the heating chamber (321). The cooling pipe (22) and the cooling channel (322) are connected. The inlet of the cooling channel (322) is located in the middle of the pressing plate (32), and the outlet of the cooling channel (322) is located at the edge of the pressing plate (32).

3. The PCB board laminating device according to claim 2, characterized in that: The lower end of the pressing plate (32) is provided with a pressing surface (323); The support device (1) includes a support plate (13) for supporting the PCB board; The heating chamber (321) is located on the upper side of the cooling channel (322), and the pressing surface (323) is located on the lower side of the cooling channel (322).

4. The PCB board laminating device according to claim 3, characterized in that: The carrier plate (13) is provided with a slot (131), and the slot (131) is adapted to the size of the PCB board.

5. A PCB board laminating device according to any one of claims 1 to 4, characterized in that: The support device (1) also includes a housing (11); The housing (11) is provided with a pressing cavity (111). The press (31) is connected to the pressing chamber (111), and the vacuum pump (5) is connected to the pressing chamber (111) via a pipeline.

6. The PCB board laminating device according to claim 5, characterized in that: The pressing device also includes a conveying device (4). The support device (1) also includes a sealing assembly (12); The pressing cavity (111) is provided with openings on both sides; The sealing assembly (12) includes an opening and closing cylinder (122), and the output end of the opening and closing cylinder (122) is provided with a sealing plate (121). The conveying device (4) is used to convey the bearing plate (13), the opening and closing cylinder (122) is connected to the housing (11), and the specifications of the sealing plate (121) are adapted to the openings on both sides of the pressing cavity (111).

7. A PCB board laminating device according to claim 6, characterized in that: The conveying device (4) includes two conveyors (41), which are located on both sides of the pressing cavity (111).

8. A PCB board laminating device according to claim 7, characterized in that: The conveying device (4) also includes a conveyor belt (42), and at least two electric rollers (43) are provided in the pressing cavity (111), with the outer rings of the two electric rollers (43) in contact with the inner rings of the conveyor belt (42).

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