High-BIN-rate warehousing method and system for wafer particles

Abstract

The invention discloses a high-BIN-rate warehousing method and system for wafer particles, and the method comprises the steps: obtaining sorted mother batch square pieces and data of the mother batch square pieces, and splitting the mother batch square pieces into a plurality of child batch square pieces based on a preset specific particle number standard; the batch numbers of the multiple sub-batch square pieces are received, and corresponding film turning actions are executed on the sub-batch square pieces with different batch numbers according to a preset specific particle number standard; and respectively marking shipment information and line printing labels on the sub-batch square sheets executing different film turning actions, opening flow branches for the sub-batch square sheets with the grain number smaller than a preset specific particle number standard, and reworking. By means of the online sorting mode, related square piece real objects can be all screened out, a large amount of manpower is saved, the grain loss in the film pouring process is reduced, a large amount of materials related to film pouring such as blue films, labels and acetone are also saved in the process, the actions such as material finding and film pouring are omitted, the period is shortened, and the production efficiency is improved. And the grain pollution risk caused by reworking and film pouring of the storehouse is reduced.

Description

Technical Field

[0001] This invention relates to the field of LED chip manufacturing, specifically to a method and system for warehousing wafer chips with high binning ratio. Background Technology

[0002] In the LED chip manufacturing industry, after wafers undergo electrical and visual inspections, the chips are sorted into different grades according to specified electrical and visual conditions. Chips of the same grade with fewer chips on the wafer are usually referred to as "partially BIN" chips. Through a sorting process, chips of the same grade are picked onto the same blue film, usually called "square wafers." BIN wafers typically have a fixed arrangement shape and diameter, as well as a maximum number of chips per BIN wafer. If the number of chips in the sorted BIN wafer reaches the maximum number of chips per BIN wafer, it is usually called a full BIN square wafer. Due to different customer needs, the sorting process often requires switching product models (different models cannot be sorted together onto the same blue film). This can lead to situations where partially BIN chips or some normal BIN chips cannot form a full BIN square wafer (the maximum number of chips per BIN wafer). However, since some customers do not accept wafers with a particle count lower than a certain number (such BIN wafers are usually called "small BIN wafers"), it is usually necessary to rework all such wafers from the warehouse, re-sort them, and re-sort the grains of the same BIN grade onto the same blue film.

[0003] However, because customers do not accept small BIN wafers (BIN wafers with fewer than a certain number of particles), all of them need to be reworked from the warehouse and re-sorted. This process requires finding all the relevant wafers, wasting a lot of manpower. After sorting, flip-chip products need to be laminated (after sorting, the electrode face of the chip is facing up; lamination ensures the light-emitting face of the chip is facing up). After lamination, the wafers are recounted, shipping labels are printed, and then the wafers are put back into the warehouse for shipment. If small BIN wafers (BIN wafers with fewer than a certain number of particles) are to be reworked from the warehouse, all of them need to be laminated back to the position of the electrode face facing up. During the lamination process, damage may occur, wasting a lot of blue film, labels, acetone, and other materials. At the same time, reworking all small BIN wafers (BIN wafers with fewer than a certain number of particles) from the warehouse, finding materials, lamination, and other actions are too time-consuming and have an excessively long cycle, increasing the risk of chip contamination and delayed delivery. Summary of the Invention

[0004] Based on this, the purpose of this invention is to provide a high BIN rate wafer chip warehousing method and system, which aims to solve the current problems of wasted manpower and large amounts of materials due to the failure of the wafer chip count to meet customer requirements, as well as the long rework time and untimely delivery.

[0005] To achieve the above objectives, this invention proposes a method for storing wafer particles with high binning rates, characterized in that the method includes: Obtain the sorted master batch flakes and the master batch flake data, and split the master batch flakes into several sub-batch flakes based on a preset specific particle number standard; Receive the batch numbers of several sub-batch tablets, and perform corresponding flipping operations on the sub-batch tablets of different batch numbers according to a preset specific particle number standard; The shipment information and labels are marked for sub-batch wafers that perform different flipping actions. For sub-batch wafers with a number of crystal particles less than a preset specific particle number standard, a process branch is opened for rework.

[0006] According to one aspect of the above technical solution, in the step of obtaining the sorted master batch flakes and the master batch flake data, and splitting the master batch flakes into several sub-batch flakes based on a preset specific particle number standard: Obtain the sorted master batch wafers, sort the master batch wafers, and upload at least the number of grains, wafer BIN grade, and product model of the sorted wafers. Based on customer requirements, a specific particle count standard is preset. The master batch of wafers is split into smaller batches according to the specific particle count standard, the number of wafer chips, the wafer chip BIN grade, and the product model. Wafers with a wafer chip count not less than the specific particle count standard are divided into the first sub-batch, and wafers with a wafer chip count less than the specific particle count standard are divided into the second sub-batch. The batch numbers of the first and second sub-batch are automatically generated by combining the master batch number with a letter suffix coding rule.

[0007] According to one aspect of the above technical solution, in the step of receiving the batch numbers of several sub-batch tablets and performing corresponding flipping actions on the sub-batch tablets of different batch numbers according to a preset specific particle count standard: The batch numbers of the first and second sub-batch wafers, as well as the corresponding casting control commands for the first and second sub-batch wafers, are transmitted to the casting equipment. After receiving the batch numbers and casting control commands, the casting equipment performs the corresponding casting actions on the first and second sub-batch wafers respectively.

[0008] According to one aspect of the above technical solution, the molding control command is: The split sub-batch wafers are fed into the laminating machine, which identifies the batch numbers of the first and second sub-batch wafers. The first sub-batch wafers are flipped so that the crystalline electrode face is facing up and the light-emitting face is facing up. The second sub-batch wafers are unloaded and automatically transferred to the NG material box.

[0009] According to one aspect of the above technical solution, in the step of marking shipping information and printing labels on sub-batch wafers that perform different film-turning actions, and opening process branches for sub-batch wafers with a grain count less than a preset specific grain count standard for rework: After the first batch of sheets is flipped, it is transferred to the lower film equipment and a label control signal is transmitted to the lower film equipment. The blue film of the first batch of sheets is peeled off from the iron and attached to the release paper. The batch number, product model, BIN grade and particle count of the first batch of sheets are checked. If the inspection is correct, the shipping information is output and the shipping label is printed. If the inspection fails, it is returned to the NG box. Print rework labels containing rework identification, parent batch number information, and child batch number information for the second sub-batch of wafers, and output rework information to create a process branch for the second sub-batch of wafers.

[0010] According to one aspect of the above technical solution, after opening a process branch, the second batch of square wafers is transported to a preset rework station, and the square wafer data file of the second batch of square wafers is converted into a round wafer data file. The round wafer data file contains grain position, electrical parameters, appearance grade information, and is adapted to the data reading format of the sorting equipment. Based on the converted wafer data file, the rework station re-sorts the second batch of wafers, picking out the same BIN grade dies onto the same blue film to form full BIN wafers with a particle count not less than a specific particle count standard, and then performs the warehousing process.

[0011] This invention also proposes a high-bin-rate wafer particle storage system, which is used to implement the above-mentioned high-bin-rate wafer particle storage method. The system includes: The splitting module is used to acquire the sorted master batch of squares and the data of the master batch of squares, and to split the master batch of squares into several sub-batch squares based on a preset specific particle number standard. The film-flipping module is used to receive the batch numbers of several sub-batch tablets and perform corresponding film-flipping actions on sub-batch tablets of different batch numbers according to a preset specific particle count standard. The rework module is used to mark the shipment information and print labels for sub-batch wafers that have performed different film-turning actions. It also creates process branches for sub-batch wafers with a number of crystal particles less than a preset specific particle number standard for rework.

[0012] The present invention also proposes a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the high BIN rate wafer chip warehousing method described above.

[0013] The present invention also proposes an electronic device, including a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the processor executes the computer program to implement the high BIN rate wafer chip warehousing method described above.

[0014] In summary, the high BIN rate wafer warehousing method proposed in this invention utilizes a calculator system to automatically separate normal wafers from small-BIN wafers based on wafer information. This is combined with a laminating machine for automatic physical separation. Furthermore, the calculator system and the ADT laminating machine work together to print shipping and re-separation labels, ensuring complete separation of normal and small-BIN wafers during lamination. Finally, the calculator system automatically converts wafer data files to wafer data files, fulfilling the requirement for online re-separation of wafers. This eliminates the need for rework from the warehouse and manual screening of all relevant wafers, saving significant manpower and reducing wafer loss during lamination. This process also conserves a large amount of materials related to lamination, such as blue film, labels, and acetone. Simultaneously, the online rework method eliminates the need for material retrieval and lamination, shortens the cycle time, reduces the risk of wafer contamination during warehouse rework, and improves the overall full-BIN rate of wafers entering the warehouse. This invention uses an online sorting method to screen out all relevant physical wafers, saving a lot of manpower and reducing grain loss during the casting process. This process also saves a lot of casting-related materials such as blue film, labels, and acetone, saves the actions of finding materials for casting, shortens the cycle, and reduces the risk of grain contamination from rework casting in the warehouse.

[0015] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] Figure 1 This is a flowchart of the high BIN rate wafer particle warehousing method in Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the high BIN rate wafer particle storage system in Embodiment 2 of the present invention; Figure 3 This is a structural block diagram of the electronic device in Embodiment 4 of the present invention. Detailed Implementation

[0017] To make the objectives, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Several embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of the present invention will be more thorough and complete.

[0018] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," "upper," "lower," and similar expressions used herein are for illustrative purposes only and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0019] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0020] Example 1 like Figure 1 The diagram shows a flowchart of a high-BIN-rate wafer particle storage method according to Embodiment 1 of the present invention. The high-BIN-rate wafer particle storage method includes the following steps S01-S03, wherein: S01. Obtain the sorted mother batch flakes and the mother batch flake data, and split the mother batch flakes into several sub-batch flakes based on a preset specific particle number standard. S02. Receive the batch numbers of several sub-batch tablets, and perform corresponding flipping operations on the sub-batch tablets of different batch numbers according to a preset specific particle number standard. S03. Mark the shipment information and print labels for the sub-batch wafers that have performed different flipping actions. Create a process branch for the sub-batch wafers with a number of crystal particles less than a preset specific particle number standard and rework them.

[0021] After the LED chips undergo a sorting process, a sorted batch of master wafers is obtained. The master wafers are then sorted further, and data such as the number of chips, BIN grade, and product model of the sorted master wafers are uploaded to the control and processing system.

[0022] Based on customer requirements, a specific particle count standard is established. Simultaneously, the master batch of wafers is divided into batches according to the specific particle count standard, the number of wafer particles, the wafer particle BIN grade, and the product model. Wafers with a wafer particle count not less than the specific particle count standard are classified into the first sub-batch, and wafers with a wafer particle count less than the specific particle count standard are classified into the second sub-batch. The batch numbers of the first and second sub-batch are automatically generated by using a coding rule that combines the master batch number with a letter suffix.

[0023] Specifically, if the parent batch number is NCP + time + specific numerical code, then the batch number of the sub-batch after splitting will be the parent batch number + "-A / B / C / D etc.", automatically sorted in alphabetical order, laying the foundation for subsequent workflow operations.

[0024] After obtaining the batch numbers of the first and second sub-batch wafers, the batch numbers, along with the corresponding casting control commands, are transmitted to the casting equipment. The split sub-batch wafers are then fed into the casting machine. Upon receiving the casting control command from the computer system, the casting equipment outputs a casting action "Y" for the first sub-batch wafers that meet customer requirements, flipping them so that the electrode face is facing upwards and the light-emitting face is facing upwards. For the second sub-batch wafers that do not meet the customer's required particle count standard, they are returned to the NG (Not Found) material box. This process saves a significant amount of manpower in distinguishing between normal square chips and small BIN square chips. Compared to traditional methods, online rework sorting eliminates the need for all chips to be reworked from the warehouse. Instead, all relevant square chips are manually selected, saving considerable manpower and reducing the number of lamination processes (one lamination before small BIN square chips are put into storage and one lamination during warehouse rework). This also reduces grain loss during the lamination process and saves a significant amount of materials related to lamination, such as blue film, labels, and acetone.

[0025] After the first batch of sheets is flipped, it is transferred to the lower film equipment, and a label control signal is transmitted to the lower film equipment. The blue film of the first batch of sheets is peeled off from the iron and attached to the release paper. The batch number, product model, BIN grade, and number of particles of the first batch of sheets are checked. If the inspection is correct, the "RK" shipping information is output to the ADT machine. The lower film is attached to the release paper, and the shipping label is printed. If the inspection fails, it is returned to the NG material box. The rework and resegmentation labels for the second sub-batch of squares are counted and printed, along with the rework and resegmentation labels for the parent batch number and the sub-batch batch number. The "CF" shipment information is output to the ADT machine. The "CF" shipment information is the rework information, which is used to distinguish and divert subsequent processes. At the same time, a process branch is opened for the second sub-batch of squares.

[0026] After the process branch is opened, the second batch of square wafers is transported to the preset rework station, and the square wafer data file of the second batch of square wafers is converted into a round wafer data file. The round wafer data file contains grain position, electrical parameters, appearance grade information, and is adapted to the data reading format of the sorting equipment. The rework station, based on the converted wafer data file, re-sorts the second batch of square wafers, picking out dies of the same BIN grade onto the same blue film to form full-BIN square wafers with a particle count not less than a specific standard, and then executes the warehousing process. It should be noted that after converting the square wafer data into a wafer data file, the square wafers can be re-sorted like wafers.

[0027] In summary, the high BIN rate wafer warehousing method proposed in this invention utilizes a calculator system to automatically separate normal wafers from small-BIN wafers based on wafer information. This is combined with a laminating machine for automatic physical separation. Furthermore, the calculator system and the ADT laminating machine work together to print shipping and re-separation labels, ensuring complete separation of normal and small-BIN wafers during lamination. Finally, the calculator system automatically converts wafer data files to wafer data files, fulfilling the requirement for online re-separation of wafers. This eliminates the need for rework from the warehouse and manual screening of all relevant wafers, saving significant manpower and reducing wafer loss during lamination. This process also conserves a large amount of materials related to lamination, such as blue film, labels, and acetone. Simultaneously, the online rework method eliminates the need for material retrieval and lamination, shortens the cycle time, reduces the risk of wafer contamination during warehouse rework, and improves the overall full-BIN rate of wafers entering the warehouse. This invention uses an online sorting method to screen out all relevant physical wafers, saving a lot of manpower and reducing grain loss during the casting process. This process also saves a lot of casting-related materials such as blue film, labels, and acetone, saves the actions of finding materials for casting, shortens the cycle, and reduces the risk of grain contamination from rework casting in the warehouse.

[0028] Example 2 Another aspect of this invention provides a high-BIN-rate wafer particle storage system; please refer to [link / reference needed]. Figure 2 The diagram shown is a structural schematic of the high BIN rate wafer particle storage system in Embodiment 2 of the present invention. The high BIN rate wafer particle storage system includes: The splitting module 11 is used to acquire the sorted mother batch slices and the mother batch slice data, and split the mother batch slices into several sub-batch slices based on a preset specific particle number standard. The film-flipping module 12 is used to receive the batch numbers of several sub-batch tablets and perform corresponding film-flipping actions on sub-batch tablets of different batch numbers according to a preset specific particle number standard. The rework module 13 is used to mark the shipment information and print labels for sub-batch wafers that have performed different film-turning actions, and to open process branches for sub-batch wafers with a number of crystal particles less than a preset specific particle number standard for rework.

[0029] After the LED chips undergo a sorting process, a sorted batch of master wafers is obtained. The master wafers are then sorted further, and data such as the number of chips, BIN grade, and product model of the sorted master wafers are uploaded to the control and processing system.

[0030] Based on customer requirements, a specific particle count standard is established. Simultaneously, the master batch of wafers is divided into batches according to the specific particle count standard, the number of wafer particles, the wafer particle BIN grade, and the product model. Wafers with a wafer particle count not less than the specific particle count standard are classified into the first sub-batch, and wafers with a wafer particle count less than the specific particle count standard are classified into the second sub-batch. The batch numbers of the first and second sub-batch are automatically generated by using a coding rule that combines the master batch number with a letter suffix.

[0031] Specifically, if the parent batch number is NCP + time + specific numerical code, then the batch number of the sub-batch after splitting will be the parent batch number + "-A / B / C / D etc.", automatically sorted in alphabetical order, laying the foundation for subsequent workflow operations.

[0032] After obtaining the batch numbers of the first and second sub-batch wafers, the batch numbers, along with the corresponding casting control commands, are transmitted to the casting equipment. The split sub-batch wafers are then fed into the casting machine. Upon receiving the casting control command from the computer system, the casting equipment outputs a casting action "Y" for the first sub-batch wafers that meet customer requirements, flipping them so that the electrode face is facing upwards and the light-emitting face is facing upwards. For the second sub-batch wafers that do not meet the customer's required particle count standard, they are returned to the NG (Not Found) material box. This process saves a significant amount of manpower in distinguishing between normal square chips and small BIN square chips. Compared to traditional methods, online rework sorting eliminates the need for all chips to be reworked from the warehouse. Instead, all relevant square chips are manually selected, saving considerable manpower and reducing the number of lamination processes (one lamination before small BIN square chips are put into storage and one lamination during warehouse rework). This also reduces grain loss during the lamination process and saves a significant amount of materials related to lamination, such as blue film, labels, and acetone.

[0033] After the first batch of sheets is flipped, it is transferred to the lower film equipment, and a label control signal is transmitted to the lower film equipment. The blue film of the first batch of sheets is peeled off from the iron and attached to the release paper. The batch number, product model, BIN grade, and number of particles of the first batch of sheets are checked. If the inspection is correct, the "RK" shipping information is output to the ADT machine. The lower film is attached to the release paper, and the shipping label is printed. If the inspection fails, it is returned to the NG material box. The rework and resegmentation labels for the second sub-batch of squares are counted and printed, along with the rework and resegmentation labels for the parent batch number and the sub-batch batch number. The "CF" shipment information is output to the ADT machine. The "CF" shipment information is the rework information, which is used to distinguish and divert subsequent processes. At the same time, a process branch is opened for the second sub-batch of squares.

[0034] After the process branch is opened, the second batch of square wafers is transported to the preset rework station, and the square wafer data file of the second batch of square wafers is converted into a round wafer data file. The round wafer data file contains grain position, electrical parameters, appearance grade information, and is adapted to the data reading format of the sorting equipment. The rework station, based on the converted wafer data file, re-sorts the second batch of square wafers, picking out dies of the same BIN grade onto the same blue film to form full-BIN square wafers with a particle count not less than a specific standard, and then executes the warehousing process. It should be noted that after converting the square wafer data into a wafer data file, the square wafers can be re-sorted like wafers.

[0035] In summary, the high-BIN-rate wafer warehousing system proposed in this invention utilizes a calculator system to automatically batch and distinguish normal wafers from small-BIN wafers based on wafer information. This is combined with a laminating machine to automatically differentiate the physical wafers. Furthermore, the calculator system and the ADT laminating machine work together to print shipping and re-sorting labels, ensuring complete separation of normal and small-BIN wafers during lamination. Finally, the calculator system automatically converts wafer data files to wafer data files, fulfilling the requirement for online re-sorting of wafers without requiring all wafers to be reworked from the warehouse. This eliminates the need for manual screening of all relevant wafers, saving significant manpower and reducing wafer loss during lamination. This process also conserves a large amount of materials related to lamination, such as blue film, labels, and acetone. Simultaneously, the online rework method eliminates the need for material retrieval and lamination, shortens the cycle time, reduces the risk of wafer contamination during warehouse rework, and improves the overall full-BIN rate of wafers entering the warehouse. This invention uses an online sorting method to screen out all relevant physical wafers, saving a lot of manpower and reducing grain loss during the casting process. This process also saves a lot of casting-related materials such as blue film, labels, and acetone, saves the actions of finding materials for casting, shortens the cycle, and reduces the risk of grain contamination from rework casting in the warehouse.

[0036] Example 3 In another aspect, the present invention provides a computer-readable storage medium having stored thereon one or more computer programs that, when executed by a processor, implement the above-described method for storing high BIN rates of wafer particles.

[0037] Those skilled in the art will understand that the logic or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable storage medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable storage medium" can mean any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0038] More specific examples (a non-exhaustive list) of computer-readable storage media include: electrical connections (electronic devices) having one or more wires, portable computer disk drives (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Furthermore, computer-readable storage media can even be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in computer memory.

[0039] Example 4 Figure 3 This is a structural block diagram of an electronic device provided in Embodiment 4. The electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it implements the high BIN rate wafer chip warehousing method described in the above embodiments. Figure 3 The electronic device 30 shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of the present invention.

[0040] like Figure 3 As shown, the electronic device 30 can be manifested as a general-purpose computing device, such as a server device. The components of the electronic device 30 may include, but are not limited to: at least one processor 31, at least one memory 32, and a bus 33 connecting different system components (including memory 32 and processor 31).

[0041] Bus 33 includes a data bus, an address bus, and a control bus.

[0042] The memory 32 may include volatile memory, such as RAM 321 (random access memory), and / or cache memory 322, and may further include ROM 323 (read-only memory).

[0043] The memory 32 may also include a program tool 325 having a set (at least one) of program modules 324, including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0044] The processor 31 executes various functional applications and data processing by running computer programs stored in the memory 32, such as the high BIN rate warehousing method for seed wafer particles as described above.

[0045] Electronic device 30 can also communicate with one or more external devices 34 (e.g., keyboard, pointing device, etc.). This communication can be performed via I / O interface 35 (input / output interface). Furthermore, electronic device 30 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public network, such as the Internet) via network adapter 36. Figure 3 As shown, network adapter 36 communicates with other modules of the model-generated electronic device 30 via bus 33. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with the model-generated electronic device 30, including but not limited to: microcode, device drivers, redundant processors, disk drive arrays, RAID (disk array) systems, tape drives, and data backup storage systems.

[0046] It should be noted that although several units / modules or sub-units / modules of the electronic device have been mentioned in the detailed description above, this division is merely exemplary and not mandatory. In fact, according to embodiments of the present invention, the features and functions of two or more units / modules described above can be embodied in one unit / module. Conversely, the features and functions of one unit / module described above can be further divided and embodied by multiple units / modules.

[0047] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0048] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A method for warehousing wafer particles with high binning rate, characterized in that, The high BIN rate warehousing method for wafer particles includes: Obtain the sorted master batch flakes and the master batch flake data, and split the master batch flakes into several sub-batch flakes based on a preset specific particle number standard; Receive the batch numbers of several sub-batch tablets, and perform corresponding flipping operations on the sub-batch tablets of different batch numbers according to a preset specific particle number standard; The shipment information and labels are marked for sub-batch wafers that perform different flipping actions. For sub-batch wafers with a number of crystal particles less than a preset specific particle number standard, a process branch is opened for rework.

2. The method for warehousing high-BIN-rate wafer particles according to claim 1, characterized in that, In the step of obtaining the sorted master batch flakes and the master batch flake data, and splitting the master batch flakes into several sub-batch flakes based on a preset specific particle count standard: Obtain the sorted master batch wafers, sort the master batch wafers, and upload at least the number of grains, wafer BIN grade, and product model of the sorted wafers. Based on customer requirements, a specific particle count standard is preset. The master batch of wafers is split into smaller batches according to the specific particle count standard, the number of wafer chips, the wafer chip BIN grade, and the product model. Wafers with a wafer chip count not less than the specific particle count standard are divided into the first sub-batch, and wafers with a wafer chip count less than the specific particle count standard are divided into the second sub-batch. The batch numbers of the first and second sub-batch are automatically generated by combining the master batch number with a letter suffix coding rule.

3. The method for warehousing high-BIN-rate wafer particles according to claim 1, characterized in that, In the step of receiving the batch numbers of several sub-batch tablets and performing corresponding flipping operations on the sub-batch tablets of different batch numbers according to a preset specific particle count standard: The batch numbers of the first and second sub-batch wafers, as well as the corresponding casting control commands for the first and second sub-batch wafers, are transmitted to the casting equipment. After receiving the batch numbers and casting control commands, the casting equipment performs the corresponding casting actions on the first and second sub-batch wafers respectively.

4. The method for warehousing high-BIN-rate wafer particles according to claim 3, characterized in that, The molding control command is: The split sub-batch wafers are fed into the laminating machine, which identifies the batch numbers of the first and second sub-batch wafers. The first sub-batch wafers are flipped so that the crystalline electrode face is facing up and the light-emitting face is facing up. The second sub-batch wafers are unloaded and automatically transferred to the NG material box.

5. The method for warehousing high-BIN-rate wafer particles according to claim 1, characterized in that, In the step of marking shipping information and printing labels on sub-batch wafers that perform different film-turning actions, and opening process branches for rework of sub-batch wafers with a grain count less than a preset specific grain count standard: After the first batch of sheets is flipped, it is transferred to the lower film equipment and a label control signal is transmitted to the lower film equipment. The blue film of the first batch of sheets is peeled off from the iron and attached to the release paper. The batch number, product model, BIN grade and particle count of the first batch of sheets are checked. If the inspection is correct, the shipping information is output and the shipping label is printed. If the inspection fails, it is returned to the NG box. Print rework labels containing rework identification, parent batch number information, and child batch number information for the second sub-batch of wafers, and output rework information to create a process branch for the second sub-batch of wafers.

6. The method for warehousing high-BIN-rate wafer particles according to claim 5, characterized in that, After the process branch is opened, the second batch of square wafers is transported to the preset rework station, and the square wafer data file of the second batch of square wafers is converted into a round wafer data file. The round wafer data file contains grain position, electrical parameters, appearance grade information, and is adapted to the data reading format of the sorting equipment. Based on the converted wafer data file, the rework station re-sorts the second batch of wafers, picking out the same BIN grade dies onto the same blue film to form full BIN wafers with a particle count not less than a specific particle count standard, and then performs the warehousing process.

7. A high-bin-rate wafer particle storage system, characterized in that, The high BIN rate wafer particle storage system is used to implement the high BIN rate wafer particle storage method according to any one of claims 1-6, the system comprising: The splitting module is used to acquire the sorted master batch of squares and the data of the master batch of squares, and to split the master batch of squares into several sub-batch squares based on a preset specific particle number standard. The film-flipping module is used to receive the batch numbers of several sub-batch tablets and perform corresponding film-flipping actions on sub-batch tablets of different batch numbers according to a preset specific particle count standard. The rework module is used to mark the shipment information and print labels for sub-batch wafers that have performed different film-turning actions. It also creates process branches for sub-batch wafers with a number of crystal particles less than a preset specific particle number standard for rework.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that, When executed by the processor, the program implements the high BIN rate wafer particle storage method as described in any one of claims 1-6.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes a computer program, it implements the high BIN rate wafer particle storage method as described in any one of claims 1-6.

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