Semiconductor chip packaging equipment

Abstract

The invention belongs to the technical field of semiconductor chip packaging, and particularly discloses semiconductor chip packaging equipment which comprises an equipment base, an equipment support is fixedly mounted at the top of the equipment base, a driving part is arranged on the outer wall of the equipment support, a mounting part is fixedly connected to the bottom of the driving part, and a glue tank is fixedly mounted at the top of the equipment base. A first glue pipe is fixedly mounted at the top of the glue tank, the first glue pipe is fixedly connected to the interior of the mounting part, and a spray head is fixedly mounted at the bottom of the mounting part; the positioning assembly is used for assisting in positioning and limiting the spraying range and connected with the equipment base, the installation piece and the spraying head. By arranging the positioning assembly, the semiconductor chip or the substrate can be positioned and fixed; the spraying range of the spraying head can be limited; and residual glue on the outer wall after spraying of the spraying head can be cleaned, and the situation that the residual glue hinders subsequent glue spraying or drips onto the equipment base, and cleaning needs to be conducted by workers is avoided.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor chip packaging technology, and specifically relates to a semiconductor chip packaging device. Background Technology

[0002] Semiconductor chip packaging is the process of assembling integrated circuits into a final chip product. It involves placing the bare integrated circuit dies produced by the foundry onto a substrate that serves as a support, bringing out the pins, and then fixing and packaging them into a whole.

[0003] In the coating process of semiconductor chip packaging, adhesive needs to be sprayed onto the semiconductor chip or substrate. However, existing technology is not conducive to precise positioning of the semiconductor chip or substrate, which may lead to errors, affecting the coverage area of ​​the adhesive spraying and thus the adhesion strength of the semiconductor chip and substrate after curing. At the same time, when the nozzle sprays adhesive onto the semiconductor chip or substrate, the tiny droplets sprayed from the nozzle may be sprayed outside the range of the semiconductor chip or substrate and adhere to the equipment, requiring frequent cleaning by operators. To address these issues, how to design a semiconductor chip packaging device has become a problem that we need to solve. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a semiconductor chip packaging device.

[0005] To achieve the above objectives, the present invention provides a semiconductor chip packaging device, including a device base, a device bracket fixedly mounted on the top of the device base, a driving component provided on the outer wall of the device bracket, a mounting component fixedly connected to the bottom of the driving component, an adhesive tank fixedly mounted on the top of the device base, a first adhesive tube fixedly mounted on the top of the adhesive tank, the first adhesive tube fixedly connected to the inside of the mounting component, and a nozzle fixedly mounted on the bottom of the mounting component. A positioning component, used to assist in positioning and limit the spray range, is connected to the equipment base, mounting component, and nozzle.

[0006] In the above technical solution, the positioning component further includes a connecting piece fixedly installed at the bottom of the mounting component, a sliding groove rod slidably connected inside the connecting piece, a semi-circular scraper fixedly connected to one end of the sliding groove rod, and the semi-circular scraper abutting against the outer wall of the nozzle.

[0007] In the above technical solution, a connecting rod is slidably connected inside the sliding groove rod, a sleeve is fixedly installed on the outer wall of the connecting rod, a connecting member is slidably connected inside the sleeve, and the connecting member is slidably connected to the outer wall of the connecting rod.

[0008] In the above technical solution, further, the end of the connector away from the sleeve passes through the connecting piece and is fixedly connected to a collection box, an inclined scraper is fixedly installed on the top of the collection box, the collection box is set at the bottom of the nozzle, and the inclined scraper abuts against the bottom of the nozzle.

[0009] In the above technical solution, a counterweight is fixedly connected to one end of the sleeve, a push rod is fixedly connected to the outer wall of the counterweight, and a rubber sheet is fixedly installed at the end of the push rod away from the counterweight.

[0010] In the above technical solution, further, sliders are symmetrically installed on the inner side of the counterweight, a connecting block is inserted into the inside of the counterweight, and inclined grooves are symmetrically opened on both sides of the connecting block, and the two sliders are slidably connected inside the two inclined grooves respectively.

[0011] In the above technical solution, the number of connecting blocks is further set to multiple, and a limiting box is fixedly connected between the multiple connecting blocks. The limiting box is fixedly connected to the outer wall of the connecting piece, and a limiting frame is fixedly connected inside the limiting box. A discharge groove is opened inside one of the connecting blocks, and the overall outline of the discharge groove is a "duckbill" shape.

[0012] In the above technical solution, the end of the discharge trough away from the limiting box is connected to a second glue tube, and the end of the second glue tube away from the discharge trough is fixedly connected to a collection box, which is fixedly installed on the outer wall of the equipment base.

[0013] Compared with the prior art, the present invention has the following beneficial effects: By setting up positioning components, semiconductor chips or substrates can be positioned and fixed, avoiding errors in the position of semiconductor chips or substrates on the equipment, which would affect the coverage area of ​​the adhesive. The spray range of the nozzle can be limited to prevent the spray range from exceeding the size of the semiconductor chip or substrate, which would cause the nozzle to spray excess glue onto the equipment, requiring staff to clean it up. The residual glue on the outer wall of the nozzle can be cleaned after spraying to prevent it from hindering subsequent glue spraying or dripping onto the equipment base. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure proposed in this invention; Figure 2 This is an enlarged view of a partial structure of the positioning component proposed in this invention; Figure 3 This is a partial structural cross-sectional view of the positioning component proposed in this invention; Figure 4 The present invention proposes Figure 3 Enlarged view of the A-section structure; Figure 5 The present invention proposes Figure 3 Enlarged view of the structure of part B.

[0015] In the diagram: 1. Equipment base; 2. Equipment bracket; 3. Drive component; 4. Mounting component; 5. Glue tank; 6. First glue tube; 7. Nozzle; 8. Connecting piece; 9. Slide bar; 10. Semi-circular scraper; 11. Connecting rod; 12. Sleeve; 13. Connector; 14. Collection box; 15. Inclined scraper; 16. Counterweight; 17. Push rod; 18. Rubber sheet; 19. Slider; 20. Inclined slide; 21. Connecting block; 22. Limiting box; 23. Limiting frame; 24. Discharge chute; 25. Second glue tube; 26. Collection box. Detailed Implementation

[0016] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] like Figures 1 to 2 The semiconductor chip packaging device shown includes a device base 1, a device bracket 2 fixedly mounted on the top of the device base 1, a drive component 3 provided on the outer wall of the device bracket 2, a mounting component 4 fixedly connected to the bottom of the drive component 3, an adhesive tank 5 fixedly mounted on the top of the device base 1, a first adhesive tube 6 fixedly mounted on the top of the adhesive tank 5, the first adhesive tube 6 fixedly connected inside the mounting component 4, and a nozzle 7 fixedly mounted on the bottom of the mounting component 4; and a positioning component, which is used to assist in positioning and limit the spraying range, and is connected to the device base 1, the mounting component 4 and the nozzle 7.

[0018] like Figures 2 to 5As shown, the positioning assembly includes a connecting piece 8 fixedly mounted on the bottom of the mounting component 4. A sliding groove rod 9 is slidably connected inside the connecting piece 8. A semi-circular scraper 10 is fixedly connected to one end of the sliding groove rod 9, and the semi-circular scraper 10 abuts against the outer wall of the nozzle 7. A connecting rod 11 is slidably connected inside the sliding groove rod 9. A sleeve 12 is fixedly mounted on the outer wall of the connecting rod 11. A connecting member 13 is slidably connected inside the sleeve 12, and the connecting member 13 is slidably connected to the outer wall of the connecting rod 11. The end of the connecting member 13 away from the sleeve 12 passes through the connecting piece 8 and is fixedly connected to a collection box 14. An inclined scraper 15 is fixedly mounted on the top of the collection box 14. The collection box 14 is located at the bottom of the nozzle 7, and the inclined scraper 15 abuts against the bottom of the nozzle 7. A counterweight 16 is fixedly connected to one end of the sleeve 12. A push rod 17 is fixedly connected to the outer wall of the counterweight 16. A rubber sheet 18 is fixedly mounted on the end of the push rod 17 away from the counterweight 16. A slider 19 is symmetrically installed on the inner side of the counterweight 16. A connecting block 21 is inserted into the inside of the counterweight 16. Inclined grooves 20 are symmetrically opened on both sides of the connecting block 21. Two sliders 19 are slidably connected inside the two inclined grooves 20 respectively. The number of connecting blocks 21 is set to multiple. A limit box 22 is fixedly connected between multiple connecting blocks 21. An inclined groove 20 is opened on the outer wall of multiple connecting blocks 21 and a counterweight 16 is sleeved on it. The limit box 22 is fixedly connected to the outer wall of the connecting piece 8. A limit frame 23 is fixedly connected inside the limit box 22. A discharge groove 24 is opened inside one of the connecting blocks 21. The overall outline of the discharge groove 24 is a "duckbill" outline. The end of the discharge groove 24 away from the limit box 22 is connected to a second glue tube 25. The end of the second glue tube 25 away from the discharge groove 24 is fixedly connected to a collection box 26. The collection box 26 is fixedly installed on the outer wall of the equipment base 1. The positioning component assists workers in positioning and dispensing adhesive onto semiconductor chips or substrates, preventing errors in the position of the semiconductor chips or substrates on the equipment, which could affect the adhesive coverage area. It also prevents the area sprayed by nozzle 7 from exceeding the size of the semiconductor chip or substrate, thus avoiding excess adhesive being sprayed onto the equipment and requiring cleaning. Furthermore, it prevents adhesive residue from nozzle 7 from adhering to non-dispensing areas of the semiconductor chip or substrate, which could solidify onto the semiconductor chip or substrate during subsequent bonding and curing, affecting packaging quality and subsequent processing steps. Finally, it prevents adhesive residue from remaining on the outer wall of nozzle 7, which could obstruct subsequent adhesive spraying or drip onto the equipment base 1, requiring cleaning. It is important to note that the adhesives used for semiconductor chip packaging are epoxy resin adhesives, UV adhesives, and other adhesives requiring specific curing conditions; therefore, it is crucial to prevent the adhesive from solidifying before the semiconductor chip and substrate are properly bonded. Specifically, after the semiconductor chip or substrate moves to the bottom of the nozzle 7, the equipment activated by the operator controls the mounting component 4 to descend, causing the nozzle 7 and connecting piece 8 to descend together. The descent of the connecting piece 8 causes the connecting component 13 and the limiting box 22 to descend along with the nozzle 7. The connecting component 13 causes the collecting box 14 and the inclined scraper 15 to descend synchronously with the nozzle 7. The descent of the limiting box 22 causes the connecting block 21 to descend synchronously with the nozzle 7. The descent of the limiting box 22 causes the corresponding counterweight 16 to descend through the connecting block 21, the inclined slide 20, and the slider 19. The counterweight 16 is pressed relative to the top of the equipment base 1, causing the counterweight 16 to slide along the interior of the corresponding inclined slide 20. When the slider 19 slides to the end of the corresponding inclined slide 20, the mounting component 4 stops descending and begins to control the nozzle 7 to spray adhesive onto the semiconductor chip or substrate. During this process, the counterweight 16 causes the corresponding push rod 17 and rubber sheet 18 to slide along the corresponding... The slider 19 on the connecting block 21 slides, causing multiple push rods 17 and rubber sheet 18 to move toward the direction of the projection position of the nozzle 7 centerline on the equipment base 1. This causes the rubber sheet 18 to push the semiconductor chip or substrate on the equipment base 1 to align with the center of the nozzle 7, thereby achieving the effect of positioning and fixing the semiconductor chip or substrate. This prevents the semiconductor chip or substrate from being misaligned, resulting in insufficient coverage of the glue sprayed on it and the glue sprayed by the nozzle 7 sticking to the equipment base 1. During this process, the counterweight 16 will drive the connecting rod 11 and the connector 13 to move together through the sleeve 12. This causes the connecting rod 11 to slide along the inside of the slide bar 9 and push the slide bar 9 to slide up along the inside of the connecting piece 8. This causes the slide bar 9 to drive the semi-circular scraper 10 to rise along the outer wall of the nozzle 7. Meanwhile, the connector 13 will move horizontally along the inside of the connecting piece 8, causing the connector 13 to drive the collection box 14 and the tilting scraper 15 to detach from the bottom of the nozzle 7, stopping the obstruction of the bottom of the nozzle 7. Furthermore, when the nozzle 7 finishes spraying and the mounted component 4 stops spraying and rises to reset, the counterweight 16 loses the force of relative compression from the top of the equipment base 1. This causes the counterweight 16 to slide and reset along the inclined groove 20 using its own weight, moving the slider 19. During this process, the counterweight 16 drives the push rod 17 and rubber sheet 18 to stop limiting and fixing the semiconductor chip or substrate and reset. The counterweight 16 then drives the connecting rod 11 and connecting component 13 to reset via the sleeve 12. This causes the connecting rod 11 to slide and descend along the connecting piece 8, moving the groove rod 9, which in turn drives the semi-circular scraper... The blade 10 scrapes the outer wall of the nozzle 7 to prevent glue from adhering to the nozzle 7. This causes the connector 13 to move horizontally along the inside of the connecting piece 8, which in turn moves the collection box 14 and the inclined scraper 15 to the bottom of the nozzle 7. This blocks the bottom of the nozzle 7, allowing the inclined scraper 15 to scrape away the glue remaining at the bottom of the nozzle 7. The glue then slides down the inclined scraper 15 into the collection box 14, thus automatically cleaning the glue residue on the outer wall of the nozzle 7. This prevents glue from dripping onto the equipment base 1 and from adhering to the outer wall of the nozzle 7, which would affect subsequent glue spraying. Furthermore, during the process of the nozzle 7 spraying adhesive, the limiting box 22, together with the limiting frame 23, can limit the spraying range of the nozzle 7, so that the spraying range of the nozzle 7 matches the area that the semiconductor chip or substrate needs to be coated. This allows excess adhesive sprayed by the nozzle 7 to be collected between the limiting box 22 and the limiting frame 23. Subsequently, the collected adhesive will be discharged into the collection box 26 through the discharge chute 24 and the second adhesive pipe 25, preventing excessive adhesive overflow from the limiting box 22 and the limiting frame 23.

[0019] Working principle: During the adhesive coating step in semiconductor packaging, the semiconductor chip or substrate is first placed on the equipment base 1 (the semiconductor chip or substrate is selected according to the packaging process; if the adhesive needs to be sprayed onto the substrate, the substrate is placed on the equipment base 1; if the adhesive needs to be sprayed onto the semiconductor chip, the semiconductor chip is placed on the equipment base 1). The equipment control mounting component 4, activated by the operator, descends. The descent of the mounting component 4 causes the nozzle 7 and positioning component to descend together, positioning and fixing the semiconductor chip or substrate and stopping the obstruction of the bottom of the nozzle 7. The positioning component limits the spraying range of the nozzle 7, allowing the nozzle 7 to spray adhesive onto the semiconductor chip or substrate. After the nozzle 7 finishes spraying, the mounting component 4 causes the nozzle 7 and positioning component to reset, stopping the positioning and fixing of the semiconductor chip or substrate. The positioning component then cleans the adhesive residue on the outer wall of the nozzle 7. At this point, the positioning component completes one workflow and then stops working.

[0020] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A semiconductor chip packaging device, comprising a device base (1), characterized in that, The top of the equipment base (1) is fixedly installed with an equipment bracket (2), the outer wall of the equipment bracket (2) is provided with a drive component (3), the bottom of the drive component (3) is fixedly connected with an installation component (4), the top of the equipment base (1) is fixedly installed with a glue tank (5), the top of the glue tank (5) is fixedly installed with a first glue tube (6), the first glue tube (6) is fixedly connected to the inside of the installation component (4), and the bottom of the installation component (4) is fixedly installed with a nozzle (7). A positioning component is used to assist in positioning and limit the spray range. The positioning component is connected to the equipment base (1), the mounting component (4) and the nozzle (7).

2. The semiconductor chip packaging equipment according to claim 1, characterized in that, The positioning component includes a connecting piece (8) fixedly installed on the bottom of the mounting piece (4), a sliding groove rod (9) is slidably connected inside the connecting piece (8), and a semi-circular scraper (10) is fixedly connected to one end of the sliding groove rod (9), the semi-circular scraper (10) abutting against the outer wall of the nozzle (7).

3. The semiconductor chip packaging equipment according to claim 2, characterized in that, The sliding rod (9) is slidably connected to a connecting rod (11), and a sleeve (12) is fixedly installed on the outer wall of the connecting rod (11). A connector (13) is slidably connected to the inside of the sleeve (12), and the connector (13) is slidably connected to the outer wall of the connecting rod (11).

4. A semiconductor chip packaging device according to claim 3, characterized in that, The end of the connector (13) away from the sleeve (12) passes through the connecting piece (8) and is fixedly connected to the collection box (14). An inclined scraper (15) is fixedly installed on the top of the collection box (14). The collection box (14) is located at the bottom of the nozzle (7), and the inclined scraper (15) abuts against the bottom of the nozzle (7).

5. A semiconductor chip packaging device according to claim 3, characterized in that, One end of the sleeve (12) is fixedly connected to a counterweight (16), and a push rod (17) is fixedly connected to the outer wall of the counterweight (16). A rubber sheet (18) is fixedly installed on the end of the push rod (17) away from the counterweight (16).

6. A semiconductor chip packaging device according to claim 5, characterized in that, The counterweight (16) has sliders (19) symmetrically installed on its inner side. A connecting block (21) is inserted into the inside of the counterweight (16). Inclined grooves (20) are symmetrically opened on both sides of the connecting block (21). The two sliders (19) are slidably connected inside the two inclined grooves (20).

7. A semiconductor chip packaging device according to claim 6, characterized in that, The number of the connecting blocks (21) is set to multiple, and the multiple connecting blocks (21) are fixedly connected to the limit box (22). The limit box (22) is fixedly connected to the outer wall of the connecting piece (8). The limit frame (23) is fixedly connected inside the limit box (22). One of the connecting blocks (21) has a discharge groove (24) inside. The overall outline of the discharge groove (24) is a "duckbill" outline.

8. A semiconductor chip packaging device according to claim 7, characterized in that, The end of the discharge trough (24) away from the limit box (22) is connected to a second glue pipe (25), and the end of the second glue pipe (25) away from the discharge trough (24) is fixedly connected to a collection box (26). The collection box (26) is fixedly installed on the outer wall of the equipment base (1).

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