Digital packaging and analyzing method of structure-circuit-functional device integrated model

Abstract

The invention provides a digital packaging and analyzing method for a structure-circuit-functional device integrated model, and relates to the field of additive manufacturing digital design. According to the method, basic semantic information including names, types and functions is added to an STL model of each component; the geometric data of each part under the local coordinate system is associated with structured JSON metadata containing semantics, pins and connection information; geometric data and metadata are packaged to generate a single. Scid format file, the file is analyzed, a geometry is rendered and reconstructed according to model type differentiation in a three-dimensional environment, metadata information is completely extracted and displayed in a log mode, and a two-dimensional connection relation matrix between devices is automatically constructed and visualized according to a pin connection relation. The method provides a complete and accurate data basis for subsequent integrated collaborative design, automatic process identification and path planning for multiple processes (such as an FDM printing structure, a silver paste jet printing circuit and a mechanical arm embedded device).

Description

Technical Field

[0001] This invention relates to the field of digital design in additive manufacturing, and in particular to a digital packaging and analysis method for an integrated model of structure-circuit-functional devices. Background Technology

[0002] With the deep integration of electronic information technology and advanced manufacturing technology, integration, lightweighting, and multifunctionality have become the core directions for the development of high-end equipment. (Structure) circuit Integrated design and manufacturing technology for functional devices aims to deeply integrate the supporting structure, electrical circuits, and functional electronic devices at both the physical and functional levels. This is achieved through processes such as multi-material additive manufacturing, which allows for one-time fabrication, significantly improving system integration, reliability, and reducing weight. Such integrated components typically contain heterogeneous materials (e.g., structural plastics, conductive silver paste) and heterogeneous entities (e.g., supporting structures, circuits, functional devices), and their design and manufacturing processes span multiple fields, including mechanical structure design, electronic circuit design, and manufacturing process planning.

[0003] However, at present, multiple separate software tools and file formats are usually used to process information from different fields. Geometric, electrical, and process information are stored in a scattered manner, and the relationship between them is difficult to establish and maintain, and is easily lost during data conversion and transmission. The general geometric format lacks description of the model's function, type, and internal connection relationship, and cannot support intelligent subsequent processing. Integrated printing for additive manufacturing often involves the coordination of multiple processes, and the existing model format cannot automatically associate parts with specific processes, which is not conducive to achieving automated and intelligent slicing and path planning. Summary of the Invention

[0004] Purpose of the invention: The purpose of this invention is to solve the structural problems in the prior art. circuit The integrated model of functional devices suffers from the shortcomings of information separation, semantic loss, and unfavorable to subsequent automated design and manufacturing. To address these shortcomings, a digital encapsulation and parsing method for the integrated structure-circuit-functional device model is proposed. This method aims to establish a strong correlation between geometric information and non-geometric information (function, connection, process) to form a self-contained, parsable, lightweight file format, providing a seamless data flow for the digital chain from integrated design to multi-process collaborative manufacturing.

[0005] To achieve the above-mentioned technical objectives, the technical solution adopted by the present invention is as follows: A digital packaging and analysis method for an integrated structure-circuit-functional device model, comprising the following steps: S1: After importing the STL model of the component, interactively add its name, type (structure / device / wire) and functional description; S2: For the "device" type, by selecting a specific rectangular surface of its OBB bounding box, the precise pin coordinates are automatically calculated in the local coordinate system according to preset rules (along the long side / short side), and the electrical connection relationship between the pins is defined; S3: Transform the STL geometric data of the components to their local coordinate system to ensure the orientation independence of the geometric representation. Simultaneously, organize all added semantics, pin information, and connection details into structured metadata according to a predefined JSON pattern. S4: Employs ZIP compression encapsulation technology to package binary format local coordinate STL geometric data with text format JSON metadata, generating a single integrated file with the suffix .scid (Structural Circuit Integration Design), achieving integrated lossless encapsulation of geometric and non-geometric information; S5: Reads and decompresses the .scid file, separates and parses the binary geometric data stream and JSON metadata text stream in parallel; S6: Reconstruct the 3D model based on the parsed geometric data, and perform differentiated color rendering for different types of models (structures, devices, wires) according to the "model type" field in the metadata to achieve intuitive visualization of semantic information; S7: Extract the pin connection relationships of all device models, automatically construct and visualize a two-dimensional symmetrical connection matrix. The matrix elements "1" and "0" represent whether there is a direct electrical connection between devices, thus clearly presenting the system electrical topology.

[0006] To optimize the above technical solution, the specific measures also include: In S1 above, model information is added interactively. A visual interface based on PyVista and PyQt is developed for rendering and interactive operations. The model name is used to uniquely identify the component. The model type is a predefined enumeration value, including three types: "structure", "device", and "wire", which respectively represent the physical role of the model. The model function describes the specific role of the component in the system. For the "structure" type, the function description can be carrying and connecting; for the "wire" type, the function description can be transmission; and for the "device" type, the function description is its specific electronic function.

[0007] In S2 above, for the "device" type, selecting a specific rectangular face of its OBB bounding box is achieved by selecting the 3D coordinates of the four vertices of the rectangular face in a 3D interactive environment. Based on the selected four vertices... The side length is calculated based on the set number of pins N, spacing S, and generation direction D. The central axis of the rectangular surface is then calculated and determined. A series of three-dimensional coordinates of pin points are generated on the central axis. The specific calculation formula is as follows:

[0008]

[0009]

[0010] in and These are the two endpoints of the selected central axis. The vector of the central axis. The unit vector of the central axis, Let be the coordinates of the i-th pin in the global coordinate system.

[0011] For each generated pin, its electrical connection relationship is defined. Each connection relationship record contains three elements: local pin index (identifying which pin of this device), target device name (identifying which device to connect to), and target pin index (identifying which pin of the target device to connect to). These connection relationships together constitute the electrical connection topology network between devices.

[0012] In S3 above, the STL geometric data of the component is uniformly transformed to its local coordinate system. To ensure the pose independence of the geometric representation, the current global pose transformation matrix T of the component is calculated, and the global coordinates of the picked vertex are adjusted accordingly. Global coordinates of the calculated pin coordinates The local coordinates are calculated through homogeneous coordinate transformation. and :

[0013]

[0014] The final stored pin coordinates and face vertex coordinates are all transformed local coordinates. They share the same coordinate system with the original STL mesh data of the model, thus forming a pose-independent, self-contained complete part definition.

[0015] The above-mentioned S4 further includes the following steps: S4.1: For each component, obtain its STL mesh data representation in the local coordinate system, as well as structured description data containing all added information (basic semantics, pin local coordinates, face vertex local coordinates, connectivity).

[0016] S4.2: Organize and serialize the structured description data from step S4.1 into a metadata.json file according to a predefined JSON schema. This JSON schema explicitly defines the structure and data type of fields such as model name, type, function, pin information (quantity, spacing, coordinates, face vertices), and connection relationships.

[0017] S4.3: Using ZIP compression and encapsulation technology, create a new archive file. Save the STL geometric data in the local coordinate system as a binary stream in the archive as the model.stl file; add the metadata.json file generated in step S4.2 to the same archive. In this way, the complete information (geometry + semantics + connectivity) of a component is encapsulated in a single .scid file.

[0018] In S5 described above, the binary geometric data stream is fed into a dedicated STL parser, which decodes the data according to the STL format specification to reconstruct a 3D mesh model consisting of a vertex list and a triangle facet list. A corresponding data structure, denoted as a Mesh object, is then established in memory. The text metadata stream is fed into a JSON parser, which converts it into a key-value pair tree structure (such as a dictionary or object) in memory for easy program access. This structure contains all additional information, including the model name (model_name), type (model_type), function (model_function), pin information (pins), and connection relationships (connections).

[0019] In S6, based on PyVista and PyQt, the parsed Mesh objects are used to generate interactive geometric models in a 3D scene. The system reads the type (model_type) object from the metadata associated with the geometry and assigns differentiated display attributes to different types of models according to predefined semantic-visual mapping rules. Specifically, if the type is "structure," its rendering color is set to "gray"; if the type is "device," its rendering color is set to "blue"; and if the type is "wire," its rendering color is set to "yellow." On the graphical user interface, the system displays key metadata such as the model's name and function as text labels in the log area, further enhancing the readability of semantic information.

[0020] In S7 above, all loaded model objects with model_type "device" are traversed, and their connection lists are extracted from the metadata of each device. Assuming there are N pins in the current scene, the system creates an N×N two-dimensional matrix AdjMatrix and initializes all elements to 0. The connection lists of all devices are traversed, and for each connection record, if the target pin it points to exists in the current scene, the matrix is ​​assigned the following values:

[0021]

[0022] Where i is the row / column index of the current pin in the matrix, and j is the row / column index of the target pin in the matrix, thus constructing a symmetric adjacency matrix, which is visualized as a two-dimensional matrix in the log area of ​​the graphical user interface.

[0023] Furthermore, the present invention also proposes an electronic device comprising: a processor and a memory storing computer program instructions; wherein the processor, when executing the computer program instructions, implements the above-described method for digital packaging and parsing of an integrated structure-circuit-functional device model.

[0024] Furthermore, the present invention also proposes a computer-readable storage medium storing at least one executable instruction, which, when executed on an electronic device, causes the electronic device to perform the aforementioned digital packaging and parsing method for an integrated structure-circuit-functional device model.

[0025] Compared with the prior art, the present invention has at least the following beneficial effects: (1) The technical problem to be solved by this invention is to provide a digital encapsulation and parsing method for an integrated structure-circuit-functional device model, which addresses the current situation of information separation, semantic loss, and difficulty in supporting integrated design and manufacturing of heterogeneous models. First, through interactive operation, semantic information such as name, type, function, and precise pin connection relationship is added to the STL geometric model of each component; second, through ZIP compression encapsulation technology, binary geometric data in the local coordinate system and structured JSON metadata are mixed and encapsulated into a single, lightweight .scid file; finally, through parsing this file, not only can the three-dimensional geometry be reconstructed and rendered according to semantic differences, but the global electrical connection matrix between devices can also be automatically extracted and visualized, thereby completing the full-link support from information enhancement, standardized encapsulation to intelligent parsing application.

[0026] (2) This invention innovatively proposes the design concept of "geometry-semantics-process" integrated binding and transmission of information. By establishing precise association between non-geometric attributes and geometric features, adopting efficient hybrid encapsulation format, and realizing attitude-independent local coordinate expression, it effectively solves the core shortcomings of traditional multi-file mode, such as information silos, loss of association, lack of semantics, and difficulty in directly driving multi-process collaborative manufacturing. It provides a solid, complete, and resolvable data foundation for the integrated design of structure, circuit and device and automated process planning in the context of additive manufacturing. Attached Figure Description

[0027] Figure 1 This is a flowchart of the present invention.

[0028] Figure 2 To add schematic diagrams for information on the "device" model.

[0029] Figure 3 A visual illustration of parsing and rendering .scid files.

[0030] Figure 4 This is a diagram illustrating the display of metadata in the log area. Detailed Implementation

[0031] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the invention. However, it will be apparent to those skilled in the art that the invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid obscuring the invention.

[0032] This embodiment discloses a digital packaging and analysis method for an integrated structure-circuit-functional device model, the steps of which are as follows: S1: After importing the STL model of the component, interactively add its name, type (structure / device / wire) and functional description; A visual interface was developed using PyVista and PyQt for rendering and interactive operations. The model name is used to uniquely identify the component. The model type is a predefined enumeration value, including three types: "structure", "device", and "wire", which respectively represent the physical role of the model. The model function describes the specific role of the component in the system. For the "structure" type, the function description can be carrying and connecting; for the "wire" type, the function description can be transmission; and for the "device" type, the function description is its specific electronic function.

[0033] S2: For the "device" type, by selecting a specific rectangular surface of its OBB bounding box, the precise pin coordinates are automatically calculated in the local coordinate system according to preset rules (along the long side / short side), and the electrical connection relationship between the pins is defined; Determining the specific rectangular face of the OBB bounding box for the "device" type model is achieved by selecting the 3D coordinates of the four vertices of the rectangular face within a 3D interactive environment. This is based on the selected four vertices. The side length is calculated based on the set number of pins N, spacing S, and generation direction D. The central axis of the rectangular surface is then calculated and determined. A series of three-dimensional coordinates of pin points are generated on the central axis. The specific calculation formula is as follows:

[0034]

[0035]

[0036] in and These are the two endpoints of the selected central axis. The vector of the central axis. The unit vector of the central axis, Let be the coordinates of the i-th pin in the global coordinate system.

[0037] For each generated pin, its electrical connection relationship is defined. Each connection relationship record contains three elements: local pin index (identifying which pin of this device), target device name (identifying which device to connect to), and target pin index (identifying which pin of the target device to connect to). These connection relationships together constitute the electrical connection topology network between devices.

[0038] S3: Transform the STL geometric data of the components to their local coordinate system to ensure the orientation independence of the geometric representation. Simultaneously, organize all added semantics, pin information, and connection details into structured metadata according to a predefined JSON pattern. By calculating the current global pose transformation matrix T of the component, the global coordinates of the picked vertex are... Global coordinates of the calculated pin coordinates The local coordinates are calculated through homogeneous coordinate transformation. and :

[0039]

[0040] The final stored pin coordinates and face vertex coordinates are all transformed local coordinates. They share the same coordinate system with the original STL mesh data of the model, thus forming a pose-independent, self-contained complete part definition.

[0041] S4: Employs ZIP compression encapsulation technology to package binary format local coordinate STL geometric data with text format JSON metadata, generating a single integrated file with the .scid extension, achieving integrated lossless encapsulation of geometric and non-geometric information; For each component, its STL mesh data is obtained in the local coordinate system, along with structured description data containing all added information (basic semantics, pin local coordinates, face vertex local coordinates, and connectivity). This structured description data is organized and serialized into a `metadata.json` file according to a predefined JSON schema. This JSON schema explicitly defines the structure and data types of fields such as model name, type, function, pin information (number, spacing, coordinates, face vertices), and connectivity. A new archive file is created using ZIP compression. The STL geometric data in the local coordinate system is saved as a binary stream in the `model.stl` file within the archive; the generated `metadata.json` file is added to the same archive. In this way, the complete information (geometry + semantics + connectivity) of a component is encapsulated in a single `.scid` file.

[0042] S5: Reads and decompresses the .scid file, separates and parses the binary geometric data stream and JSON metadata text stream in parallel; The binary geometric data stream is fed into a dedicated STL parser, which decodes the data according to the STL format specification, reconstructing a 3D mesh model composed of a vertex list and a triangle list, and establishing the corresponding data structure in memory, denoted as a Mesh object. The text metadata stream is fed into a JSON parser, which converts it into a key-value pair tree structure (such as a dictionary or object) in memory for easy program access. This structure contains all additional information such as model name (model_name), type (model_type), function (model_function), pin information (pins), and connection relationships (connections).

[0043] S6: Reconstruct the 3D model based on the parsed geometric data, and perform differentiated color rendering for different types of models (structures, devices, wires) according to the "model type" field in the metadata to achieve intuitive visualization of semantic information; Based on PyVista and PyQt, the parsed Mesh objects are used to generate interactive geometric models in a 3D scene. The system reads the type (model_type) object from the metadata associated with the geometry and assigns differentiated display attributes to different types of models according to predefined semantic-visual mapping rules. Specifically, if the type is "structure," its rendering color is set to "gray"; if the type is "device," its rendering color is set to "blue"; and if the type is "wire," its rendering color is set to "yellow." On the graphical user interface, the system displays key metadata such as the model's name and function as text labels in the log area, further enhancing the readability of semantic information.

[0044] S7: Extract the pin connection relationships of all device models, automatically construct and visualize a two-dimensional symmetrical connection matrix. The matrix elements "1" and "0" represent whether there is a direct electrical connection between devices, thus clearly presenting the system electrical topology.

[0045] Iterate through all loaded model objects with `model_type` set to "device" and extract their connection lists from each device's metadata. Assuming there are N pins in the current scene, the system creates an N×N two-dimensional matrix `AdjMatrix` and initializes all elements to 0. Iterate through the connection lists of all devices. For each connection record, if the target pin it points to exists in the current scene, assign the following values ​​to the matrix:

[0046]

[0047] Where i is the row / column index of the current pin in the matrix, and j is the row / column index of the target pin in the matrix, thus constructing a symmetric adjacency matrix, which is visualized as a two-dimensional matrix in the log area of ​​the graphical user interface.

[0048] As described in the background section, the dispersed storage of geometric, electrical, and technological information in integrated structure-circuit-device models leads to data loss during conversion and transmission, and makes it difficult to support intelligent design. To address these issues, this invention provides a method for digital encapsulation and parsing of integrated structure-circuit-functional device models. Figure 1 As shown, Figure 1 This is a flowchart of the present invention.

[0049] Specifically: The present invention will be illustrated below using an integrated structure-circuit-device model as an example.

[0050] S1-S2: For an integrated structure-circuit model, first import the STL models of the structure, circuit, and device respectively, and add information to them by selecting different components. Predefined enumeration values, including three types: "Structure," "Device," and "Wire," represent the physical roles of the model. The model's function description describes the specific role of the component in the system. For the "Structure" type, the function description can be load-bearing and connection; for the "Wire" type, the function description can be transmission; and for the "Device" type, the function description is its specific electronic function. For the "Device" type model, select the pin rectangle surface through the interactive interface and set the number, spacing, and direction of the pins to automatically generate pin coordinates. Manually input the pin connection relationships according to the electrical schematic. In this example, the device function is "Power Supply," the pins are generated along the longer central axis, the number is 10, the spacing is 5mm, pins 1 and 2 are connected to pins 1 and 2 of device 2 respectively, and pins 3-10 are connected to pins 3-10 of device 5 respectively, as follows. Figure 2 As shown.

[0051] S3-S4: Calculate the current global pose transformation matrix of the component, and calculate the local coordinates of the pin coordinates and face vertex coordinates through coordinate transformation. A new archive file is created using ZIP compression encapsulation technology. The STL geometric data in the local coordinate system is saved as a binary stream in the archive as the model.stl file; the generated metadata.json file is added to the same archive. In this way, the complete information (geometry + semantics + connectivity) of a component is encapsulated in a single .scid file. The .scid file format and content are as follows: [device_example.scid] (ZIP archive containing the following entries) ├── [File] model.stl (binary data, geometric information) └── [File] metadata.json (text data, metadata information) json { "model_name": "device5", / / String, unique identifier for the model "model_type": "device", / / Enumerated string: "structure", "device", "wire" "model_function": "Power supply", / / String, describing the function of the component "pins": { / / Object, exists only when model_type="device"} "count": 10, / / Integer, total number of pins "spacing": 5.0, / / Floating-point number, pin spacing (unit: mm) "locations": [ / / Array, list of local coordinates of pins] [138.4860997069525, 26.189944673052615, 501.6369034822488], ... ], "face_vertices_local": [ / / Array, local coordinates of the four vertices of the rectangular face containing the pins] [162.0735321044922, 37.99495315551758, 511.7000427246094], ... ] }, "connections": [ / / Array, list of electrical connections] { "local_pin_index": 0, / / Integer, pin index of this device "target_model_name": "device3", / / String, target device name "target_pin_index": 0 / / Integer, pin index of the target device }, ... ] } S5-S7: Parse and load the .scid file. By sending the binary geometric data stream into Pyvista's STL parser, the data is decoded according to the STL format specification, reconstructing a 3D mesh model composed of a vertex list and a triangle list, and establishing the corresponding data structure in memory, denoted as a Mesh object. Components of type "structure" are rendered in gray, components of type "device" in blue, and layouts of type "wire" in yellow. Figure 3 As shown; the text metadata stream is fed into a JSON parser, which converts it into an in-memory key-value tree structure (such as a dictionary or object), and displays it as text labels in the log area, such as... Figure 4As shown. The system iterates through all loaded model objects with `model_type` set to "device", extracting the connections list from each device's metadata. In this example, there are 48 pins. The system creates a 48×48 two-dimensional matrix and initializes all elements to 0. It iterates through the connections list of all devices. For each connection record, if the target pin it points to exists in the current scene, the corresponding value is set to 1, thus constructing a symmetric adjacency matrix, which is then visualized as a two-dimensional matrix in the log area of ​​the graphical user interface.

[0052] It is worth noting that the technical processes of the methods disclosed in the above embodiments can be implemented, in whole or in part, through software, hardware, firmware, or other arbitrary combinations. When implemented using software, the above embodiments can be implemented, in whole or in part, in the form of a computer program product. A computer program product includes one or more computer instructions or computer programs.

[0053] When computer instructions or computer programs are loaded or executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. Computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that includes one or more sets of available media. Available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., DVDs), or semiconductor media. Semiconductor media can be solid-state drives (SSDs).

[0054] The above are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of the present invention should be considered within the scope of protection of the present invention.

Claims

1. A method for digital packaging and analysis of an integrated structure-circuit-functional device model, characterized in that, Includes the following steps: S1: Import the STL model of the component, and add its name, type, and functional description; the type includes structure, device, and wire; S2: For device type, select its OBB bounding box predetermined rectangular surface, automatically calculate the precise pin coordinates in the local coordinate system according to preset rules, and define the electrical connection relationship between pins; S3: Transform the geometric data in the STL model to its local coordinate system; organize all added semantics, pins and connection information into structured metadata according to the predefined JSON pattern; S4: Employs ZIP compression encapsulation technology to package binary format local coordinate STL geometric data with text format JSON metadata, generating a single integrated file with the .scid extension; S5: Reads and decompresses the integrated file with the .scid extension, separates and parses the binary geometric data stream and JSON metadata text stream within it; S6: Reconstruct the 3D model based on the parsed binary geometric data stream, and perform differentiated color rendering for different types of models based on the model type field in the JSON metadata text stream; S7: Extract the pin connection relationships of all device models, automatically construct and visualize a two-dimensional symmetrical connection matrix. The matrix elements "1" and "0" represent whether there is a direct electrical connection between devices, respectively, presenting the system electrical topology.

2. The digital packaging and analysis method for the integrated structure-circuit-functional device model according to claim 1, characterized in that, Step S2 specifically includes: For each device type, the three-dimensional coordinates of the four vertices of its OBB bounding box rectangle are selected based on the three-dimensional interactive environment. Based on the four selected vertices The side length is calculated based on the set number of pins N, spacing S, and generation direction D. The central axis of the rectangular surface is then calculated and determined. A series of three-dimensional coordinates of pin points are generated on the central axis. The specific calculation formula is as follows: In the formula, and These are the two endpoints of the selected central axis; The vector of the central axis; The unit vector of the central axis; Let be the coordinates of the i-th pin in the global coordinate system; For each generated pin, its electrical connection relationship is defined. Each connection relationship record contains three elements: local pin index, target device name, and target pin index.

3. The digital packaging and analysis method for the integrated structure-circuit-functional device model according to claim 1, characterized in that, Step S3 specifically includes: The geometric data in the STL model of the component is uniformly transformed to its local coordinate system. To ensure the pose independence of the geometric representation, the current global pose transformation matrix T of the component is calculated, and the global coordinates of the picked vertices are then transformed. Global coordinates of the calculated pin coordinates The local coordinates are calculated through homogeneous coordinate transformation. and : The final stored pin coordinates and face vertex coordinates are all transformed local coordinates, which share the same coordinate system as the original STL mesh data of the model.

4. The digital packaging and analysis method for the integrated structure-circuit-functional device model according to claim 1, characterized in that, Step S4 specifically includes: For each component, obtain its STL mesh data representation in the local coordinate system, as well as the structured description data containing all added information; organize and serialize the structured description data into a metadata.json file according to a predefined JSON pattern; create a new archive file using ZIP compression encapsulation technology; save the STL geometric data in the local coordinate system as a binary stream in the archive as a model.stl file; add the generated metadata.json file to the same archive. The added information includes basic semantics, pin local coordinates, face vertex local coordinates, and connection relationships; The JSON schema defines the structure and data type of the model name, type, function, pin information, and connection relationship. The pin information includes the number, spacing, coordinates, and face vertices. The above method encapsulates the complete information of a component into a single .scid file.

5. The digital packaging and analysis method for the integrated structure-circuit-functional device model according to claim 1, characterized in that, Step S5 specifically includes: The binary geometric data stream is fed into a dedicated STL parser, which decodes the data according to the STL format specification to reconstruct a 3D mesh model consisting of a vertex list and a triangle facet list, and establishes the corresponding data structure in memory, denoted as a Mesh object. The text metadata stream is fed into a JSON parser, which converts it into a key-value pair tree structure in memory. The key-value pair tree structure contains the model name, type, function, pin information, and connection relationships.

6. The digital packaging and analysis method for the integrated structure-circuit-functional device model according to claim 1, characterized in that, Step S6 specifically includes: Based on Pyvista and PyQt, the parsed Mesh object is used to generate an interactive geometric model in a 3D scene. The type object in the metadata associated with the geometry is read, and different display attributes are assigned to different types of models according to predefined semantic-visual mapping rules.

7. The digital packaging and analysis method for the integrated structure-circuit-functional device model according to claim 6, characterized in that, The predefined semantic-visual mapping rules are as follows: If the type is structure, set its rendering color to the first color; if the type is device, set its rendering color to the second color; if the type is wire, set its rendering color to the third color. On the graphical user interface, the model's name and functional metadata are displayed as text labels in the log area.

8. The digital packaging and analysis method for the integrated structure-circuit-functional device model according to claim 1, characterized in that, Step S7 specifically includes: Iterate through all loaded model objects of type "device" and extract a list of their connection relationships from the metadata of each device. Suppose there are N pins in the current scene. The system creates an N×N two-dimensional matrix AdjMatrix and initializes all elements to 0. Iterates through the connection relationship list of all devices. For each connection record, if the target pin it points to exists in the current scene, the matrix is ​​assigned the following value: Where i is the row / column index of the current pin in the matrix, and j is the row / column index of the target pin in the matrix; thus a symmetric adjacency matrix is ​​constructed and visualized as a two-dimensional matrix in the log area of ​​the graphical user interface.

9. An electronic device, characterized in that, The device includes: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, it implements the digital packaging and parsing method of the integrated structure-circuit-functional device model as described in any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that, The storage medium stores at least one executable instruction, which, when executed on an electronic device, causes the electronic device to perform the digital packaging and parsing method of the integrated structure-circuit-functional device model as described in any one of claims 1 to 8.

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