Combined type air-liquid double-circulation uniform-temperature radiator

Abstract

The invention discloses a combined type air-liquid double-circulation uniform-temperature radiator which comprises a uniform-temperature base, a liquid cooling plate, a mounting bottom plate, radiating fins, a fan and at least one group of heat pipes, a liquid cooling flow channel cavity is formed in the top of the liquid cooling plate, and an accommodating cavity for accommodating the radiating fins is formed in the hollow part of an inner cavity of the liquid cooling plate; a mounting hole for mounting a fan is formed in the front surface of the liquid cooling plate, a groove matched with a heat pipe in boundary dimension is milled in the liquid cooling plate, a liquid cooling inlet is formed in the left side of the front surface of the liquid cooling plate, and a liquid cooling outlet is formed in the right side of the front surface of the liquid cooling plate; the radiator has at least three switchable working modes, can realize independent work or cooperative work of an air cooling heat dissipation mode and a liquid cooling heat dissipation mode so as to adapt to the heat dissipation requirements of various working loads from standby to full load of electronic equipment, exceeds the limit heat dissipation capability of a single scheme, and improves the reliability and the heat dissipation capability of the radiator.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic equipment heat dissipation technology, in particular to a composite air-liquid double-circulation uniform-temperature radiator. BACKGROUND

[0002] In the field of high-performance computing, data service center servers, aviation power supply equipment and communication equipment, the power density of electronic chips continues to rise, and the heat is huge and concentrated. The traditional single heat dissipation scheme is difficult to meet the harsh heat dissipation requirements, and effectively and efficiently dissipating heat has become the key to ensuring the stable performance of electronic equipment and prolonging the service life.

[0003] The existing single heat dissipation scheme includes pure air cooling, pure liquid cooling and heat pipe heat dissipation technology. The pure air cooling is cooled by a fan and a heat dissipation fin, and when the heat flux is too large, the wind noise increases, and local high temperature points are easily generated at the center of the heat source, resulting in the reduction or damage of components due to overheating. The pure liquid cooling has high cost, and for multiple dispersed heat sources on the installation surface, the uniformity control is still a challenge. The heat pipe heat dissipation technology uses the high-efficiency heat conduction performance of the heat pipe for heat dissipation. The traditional heat pipe and the base are combined by mechanical pressing or filling with heat-conducting silicone grease, which has a large contact thermal resistance and affects the heat conduction efficiency, resulting in uneven overall temperature rise. Therefore, a composite air-liquid double-circulation uniform-temperature radiator is proposed. SUMMARY

[0004] The purpose of the present application is to provide a composite air-liquid double-circulation uniform-temperature radiator to solve the problem of the traditional single heat dissipation scheme being difficult to meet the harsh heat dissipation requirements in the background art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a composite air-liquid double-circulation uniform-temperature radiator, comprising a uniform-temperature base, a liquid cooling plate, a mounting bottom plate, a heat dissipation fin, a fan and at least one group of heat pipes. The uniform-temperature base is detachably connected above the liquid cooling plate, and the mounting bottom plate is detachably connected below the liquid cooling plate. The top of the liquid cooling plate is provided with a liquid cooling flow channel cavity, and the hollow part of the inner cavity of the liquid cooling plate forms a containing chamber for accommodating the heat dissipation fin. The bottom of the heat dissipation fin is tightly attached to the top surface of the mounting bottom plate, and the front surface of the liquid cooling plate is provided with a mounting hole for mounting the fan, and the hole cavity of the mounting hole is in communication with the containing chamber. The liquid cooling plate is provided with a groove matching the outer dimensions of the heat pipe. The front left side of the liquid cooling plate is provided with a liquid cooling inlet in communication with the liquid cooling flow channel cavity, and the front right side of the liquid cooling plate is provided with a liquid cooling outlet in communication with the liquid cooling flow channel cavity.

[0006] Further, the outer wall of the heat pipe body is coated with silver-copper solder, and the heat pipe is welded to the bottom of the uniform-temperature base by brazing to form a uniform-temperature body with the uniform-temperature base.

[0007] Furthermore, the inner or lower surface of the temperature-equalizing base is machined with channels for embedding heat pipes.

[0008] Furthermore, both the mounting base and the temperature-equalizing base are made of aluminum alloy CNC machined.

[0009] Furthermore, the liquid cooling channel cavity has a U-shaped top view.

[0010] The beneficial effects of this invention are: 1. This invention has at least three switchable operating modes, enabling independent or collaborative operation of air cooling and liquid cooling modes to provide maximum heat dissipation capacity to meet the heat dissipation needs of electronic devices from standby to full load. Under load, it switches to a low-power air cooling mode, significantly improving the system's energy efficiency ratio and reducing daily noise. Under high load, it switches to a hybrid air cooling and liquid cooling mode, exceeding the limit of a single solution in terms of heat dissipation capacity, and improving the reliability and heat dissipation capacity of the heat sink.

[0011] 2. The heat pipe of this invention is metallurgically combined with the heat spreader base through brazing process to form an integrated high-efficiency heat conduction structure. Combined with heat dissipation fins, it can improve the overall heat dissipation capacity, cope with the heat dissipation challenge of high power density components, effectively reduce the contact thermal resistance of the heat source mounting surface, achieve temperature uniformity in the mounting surface area, avoid local overheating, and promote the widespread use of this composite air-liquid dual circulation heat spreader. Attached Figure Description

[0012] Fig. 1 This is an exploded view of the composite air-liquid dual-circulation uniform temperature radiator of the present invention; Fig. 2 This is a three-dimensional structural view of the composite air-liquid dual-circulation uniform temperature radiator of the present invention; Fig. 3 This is a cross-sectional view of the composite air-liquid dual-circulation uniform temperature radiator of the present invention.

[0013] In the diagram: 1. Heat spreader base; 2. Heat pipe; 3. Liquid cooling plate; 301. Receiving chamber; 302. Mounting hole; 4. Liquid cooling channel cavity; 5. Heat dissipation fins; 6. Mounting base plate; 7. Fan; 8. Liquid cooling inlet; 9. Liquid cooling outlet; 10. Silver-copper brazing filler metal. Detailed Implementation

[0014] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0015] Please see Figs. 1-3 This invention provides a technical solution: a composite air-liquid dual-circulation heat sink, comprising a heat sink base 1, a liquid cooling plate 3, a mounting base plate 6, heat dissipation fins 5, a fan 7, and at least one set of heat pipes 2. The heat sink base 1 is detachably connected to the top of the liquid cooling plate 3, and the mounting base plate 6 is detachably connected to the bottom of the liquid cooling plate 3. A liquid cooling flow channel cavity 4 is formed on the top of the liquid cooling plate 3, and the hollow portion of the inner cavity of the liquid cooling plate 3 forms a receiving chamber 301 for accommodating the heat dissipation fins 5. The bottom of the heat dissipation fins 5... The liquid cooling plate 3 is closely attached to the top surface of the mounting base plate 6, and the front side of the liquid cooling plate 3 has a mounting hole 302 for mounting the fan 7. The cavity of the mounting hole 302 is connected to the receiving chamber 301. A groove matching the outer dimensions of the heat pipe 2 is milled on the liquid cooling plate 3. A liquid cooling inlet 8 communicating with the liquid cooling channel cavity 4 is installed on the left side of the front side of the liquid cooling plate 3, and a liquid cooling outlet 9 communicating with the liquid cooling channel cavity 4 is installed on the right side of the front side of the liquid cooling plate 3. The liquid cooling channel cavity 4 has a U-shaped structure when viewed from above.

[0016] In this embodiment, the outer wall of the heat pipe 2 is coated with silver-copper brazing filler metal 10. The heat pipe 2 is brazed to the bottom of the heat spreader base 1 so that the heat pipe 2 and the heat spreader base 1 form a heat spreader. The inner or lower surface of the heat spreader base 1 is machined with channels for embedding the heat pipe 2. Both the mounting base plate 6 and the heat spreader base 1 are made of aluminum alloy CNC machined. The bottom surface of the heat spreader base 1 is finely ground to ensure good contact with the heat source.

[0017] This composite air-liquid dual-circulation heat sink has the following operating modes: Pure air cooling mode: The heat sink fins 5 increase the contact area with the air, and the fan 7 uses forced convection to remove heat. The heat is efficiently conducted to the multiple heat sink fins 5 through brazed heat pipes, and one or more fans 7 are used to provide forced air cooling for the heat sink fins 5; Pure liquid cooling mode: In specific scenarios, such as when there is an extreme need for fan 7 noise, an external liquid cooling pump is connected to both the liquid cooling inlet 8 and the liquid cooling outlet 9. The fan 7 is turned off and only the liquid cooling pump is turned on, relying on liquid circulation to dissipate the heat to the distant radiator. The liquid cooling pump is not shown in the figure; Hybrid cooling mode: By activating the fan 7 and the liquid cooling pump, air cooling and liquid cooling work together to jointly bear the huge heat dissipation load and provide maximum heat dissipation capacity. In this mode, the condensation section of the heat pipe 2 simultaneously penetrates... The liquid cooling plate 3 and heat dissipation fins 5 allow heat to be transferred in parallel to both the air-cooled and liquid-cooled heat dissipation ends. The heat spreader base 1 and mounting plate 6 are used for the installation and fixation of the heat source. It should be noted that when this composite air-liquid dual-circulation heat spreader is working, the heat generated by the electronic components is efficiently transferred to the heat pipe 2 and the heat spreader base 1 through a brazing process, and the heat is quickly and evenly distributed. Subsequently, the working fluid inside the heat pipe 2 rapidly carries the heat to the heat dissipation fins 5, where it is carried away by the circulating coolant through the liquid cooling inlet / outlet 8 and liquid cooling outlet 9, or by the air blowing over the heat dissipation fins 5, achieving efficient and balanced heat dissipation. During operation, a temperature sensor installed near or inside the chip monitors the temperature in real time, selecting the heat dissipation mode as pure air cooling, pure liquid cooling, or a hybrid mode based on the chip's temperature rise.

[0018] In summary, this hybrid air-liquid dual-circulation vapor chamber heat sink boasts superior energy efficiency and noise control. Through mode switching, it utilizes a low-power air-cooling mode under low loads, avoiding the energy waste associated with continuous operation of liquid cooling systems, significantly improving the system's energy efficiency ratio, and reducing daily operating noise. Furthermore, the vapor chamber heat sink offers extremely high heat dissipation performance and redundant reliability. Under high loads, the hybrid air-cooling and liquid-cooling mode provides superior heat dissipation capabilities compared to a single solution. Simultaneously, if any heat dissipation path fails, the other path still provides basic heat dissipation assurance, enhancing system reliability. The brazing connection between heat pipe 2 and vapor chamber base 1 fundamentally eliminates contact thermal resistance, allowing heat to diffuse laterally with extremely high efficiency. This ensures a highly uniform temperature across the entire mounting surface, effectively preventing functional failures, performance degradation, or hardware damage caused by excessively high temperatures in a single chip or a specific area of ​​a chip. It is particularly suitable for heat dissipation of multi-chip or high-power-density chips.

[0019] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0020] The above embodiments only illustrate preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be understood that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. In the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can refer to a mechanical connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. Among these, there are various ways of detachable installation, such as by using a combination of plug-in and snap-fit, or by using bolt connections, etc.

[0021] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A composite air-liquid dual-circulation uniform temperature radiator, characterized in that: The device includes a heat spreader base, a liquid cooling plate, a mounting base, heat dissipation fins, a fan, and at least one set of heat pipes. The heat spreader base is detachably connected to the top of the liquid cooling plate, and the mounting base is detachably connected to the bottom of the liquid cooling plate. The top of the liquid cooling plate has a liquid cooling channel cavity, and the hollow part of the inner cavity of the liquid cooling plate forms a receiving chamber for the heat dissipation fins. The bottom of the heat dissipation fins is in close contact with the top surface of the mounting base, and the front of the liquid cooling plate has a mounting hole for the fan to be installed. The cavity of the mounting hole communicates with the receiving chamber. The liquid cooling plate has a groove milled out to match the outer dimensions of the heat pipe. A liquid cooling inlet communicating with the liquid cooling channel cavity is installed on the left side of the front of the liquid cooling plate, and a liquid cooling outlet communicating with the liquid cooling channel cavity is installed on the right side of the front of the liquid cooling plate.

2. The composite air-liquid dual-circulation uniform temperature radiator according to claim 1, characterized in that: The outer wall of the heat pipe is coated with silver-copper brazing filler metal, and the heat pipe is brazed to the bottom of the heat spreader base so that the heat pipe and the heat spreader base form a heat spreader.

3. The composite air-liquid dual-circulation uniform temperature radiator according to claim 1, characterized in that: The inner or lower surface of the temperature-equalizing base is machined with channels for embedding heat pipes.

4. The composite air-liquid dual-circulation uniform temperature radiator according to claim 1, characterized in that: Both the mounting base and the temperature-equalizing base are made of aluminum alloy CNC machined.

5. A composite air-liquid dual-circulation uniform temperature radiator according to claim 1, characterized in that: The liquid-cooled flow channel cavity has a U-shaped structure when viewed from above.

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