Intelligent dehumidification device for switch cabinet and automatic deicing method

Abstract

The invention discloses an intelligent dehumidification device for a switch cabinet and an automatic deicing method, and relates to the technical field of switch cabinet dehumidification, the intelligent dehumidification device comprises a main machine shell, a ventilation assembly and a side wall integrated on the main machine shell and used for forming an air channel penetrating through the interior and the exterior of the shell; the semiconductor chilling plate is fixed in the host shell through a connecting piece; the condensation sheet is tightly connected with the cold end of the semiconductor refrigeration sheet through a heat-conducting medium; the water collecting tank is arranged under the condensing sheets, and an opening in the top of the water collecting tank is used for collecting condensed water; the ventilation assembly guides moist air in the switch cabinet to the surface of the condensation sheet, so that water vapor slides to the water collection tank after being condensed. The beneficial effects of the invention are that through a semiconductor refrigeration condensation technology, moisture in humid air in the cabinet can be efficiently condensed into water drops and directly discharged out of the cabinet, and the problems of condensation and insulation reduction caused by partial gas-water separation and moisture remaining in the cabinet in a traditional heating dehumidification mode are fundamentally solved.

Description

Technical Field

[0001] This invention relates to the field of switchgear dehumidification technology, and in particular to an intelligent dehumidification device and automatic de-icing method for switchgear. Background Technology

[0002] In the outdoor operating environment of substations, electrical equipment such as high-voltage switchgear, terminal boxes, and control cabinets are subjected to complex and variable climatic conditions for a long time. Due to the compact internal structure and poor air circulation of these cabinets, the internal temperature can easily drop below the dew point in hot and humid weather, resulting in condensation. Condensation can significantly reduce the insulation strength of the equipment, causing faults such as partial discharge and insulation flashover. In severe cases, it can lead to switch tripping or even equipment burnout, directly threatening the safe and stable operation of the power grid.

[0003] Currently, the industry commonly uses a combination of humidity controllers and heaters for dehumidification. This method temporarily increases the air temperature by heating a local area to reduce relative humidity. However, this method has significant limitations: First, heating only causes water molecules to migrate in a gaseous state and does not effectively remove moisture from the cabinet. Moisture easily recondenses after cooling on the cabinet walls or equipment surfaces, exacerbating internal humidity. Second, the installation of numerous heating devices increases system complexity and maintenance costs, making it difficult for on-site management personnel to remotely monitor and control the equipment's operating status. Furthermore, traditional methods are energy-intensive, have low dehumidification efficiency, and cannot meet the development needs of unmanned operation in smart substations. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is that the existing heating and dehumidification solutions can only cause water to undergo phase change and migration, but cannot substantially remove water vapor from the cabinet, resulting in water continuously circulating and accumulating inside the cabinet, and the risk of condensation always exists.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an intelligent dehumidification device for switch cabinets, comprising a main unit housing, A ventilation assembly, integrated into the side wall of the main unit housing, is used to form an air duct that runs through the inside and outside of the housing; The semiconductor cooling chip is fixed inside the main unit housing via connectors; The condenser plate is tightly connected to the cold end of the semiconductor refrigeration chip via a heat-conducting medium; A water collection tank is located directly below the condenser plate, with an opening at the top for collecting condensate. The ventilation component directs humid air inside the switch cabinet to the surface of the condenser plate, causing water vapor to condense and slide down into the water collection tank.

[0006] As a preferred embodiment of the intelligent dehumidification device for switchgear of the present invention, it further includes a cooling fan and a heat sink; The heat sink is connected to the hot end of the semiconductor cooling chip via a thermally conductive medium; The interior of the main unit housing is divided into a dehumidification chamber and a heat dissipation chamber that are isolated from each other by a partition. The hot end of the semiconductor cooling chip in the cooling fan is connected to the heat sink via a heat-conducting medium. The cooling fan is located between the dehumidification chamber and the heat dissipation chamber; it is used to transport the hot air flowing through the heat sink in the dehumidification chamber to the interior of the heat dissipation chamber.

[0007] As a preferred embodiment of the intelligent dehumidification device for switchgear of the present invention, wherein: the end of the condenser plate away from the semiconductor cooling plate is the condenser end, and the condenser end is configured with a wavy structure; The surface of the condenser end is coated with a hydrophilic coating.

[0008] As a preferred embodiment of the intelligent dehumidification device for switchgear of the present invention, it further includes a de-icing component; The de-icing assembly includes a serpentine pipe fixedly installed inside the heat dissipation chamber, a solenoid valve disposed at the open end of the serpentine pipe, and a circulation pump for driving the flow of liquid inside the serpentine pipe; The cooling fan directs the hot air flowing through the heat sink to the serpentine pipe, allowing the liquid inside the serpentine pipe to exchange heat with the hot air, thus storing heat.

[0009] As a preferred embodiment of the intelligent dehumidification device for switchgear of the present invention, the condenser plate is provided with a fluid channel inside, and the fluid channel is connected to a serpentine pipe to form a closed loop.

[0010] As a preferred embodiment of the intelligent dehumidification device for switchgear of the present invention, the liquid filled inside the serpentine pipe is propylene glycol-based antifreeze.

[0011] As a preferred embodiment of the intelligent dehumidification device for switchgear of the present invention, the condenser plate is made of pure copper and its surface in contact with the cold end of the semiconductor refrigeration plate is flat.

[0012] As a preferred embodiment of the intelligent dehumidification device for switchgear of the present invention, the hydrophilic coating is a silicon dioxide nano-coating.

[0013] The beneficial effects of the intelligent dehumidification device for switchgear of the present invention are as follows: Based on semiconductor refrigeration and condensation technology, this device can efficiently condense the moisture in the humid air inside the cabinet into water droplets and directly discharge them outside the cabinet, fundamentally solving the problem of condensation and insulation degradation caused by the traditional heating dehumidification method, which only separates air and water locally and leaves moisture still inside the cabinet, and significantly reducing the risk of faults such as discharge and flashover.

[0014] Another objective of this invention is to provide an automatic de-icing method, which aims to solve the problem of reduced dehumidification efficiency caused by icing of condenser plates.

[0015] To solve the above-mentioned technical problems, the present invention also provides the following technical solution: an automatic de-icing method, which includes an intelligent dehumidification device for switch cabinets; and, .

[0016] As a preferred embodiment of the automatic de-icing method of the present invention, wherein:

[0017] The automatic de-icing method of the present invention has the following advantages: the method accurately judges the icing state by real-time monitoring of the changes in the working current of the semiconductor cooling chip, and uses the system's own waste heat to achieve rapid de-icing, effectively solving the problems of low energy efficiency and slow response of traditional de-icing methods, significantly improving the operational stability and continuity of the dehumidification device in low-temperature environments, while reducing additional energy consumption and maintenance costs. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A three-dimensional structural diagram of an intelligent dehumidification device for switch cabinets is shown; Figure 2 A diagram showing the internal structure of the main unit housing is provided. Figure 3 A schematic diagram of the installation structure of the de-icing assembly and the condenser plate is shown. Detailed Implementation

[0020] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0021] The terminology used in this invention is that which is currently widely used in the art in consideration of the function of the invention; however, these terms may vary according to the intent of those skilled in the art, precedent, or new technology in the art. Furthermore, specific terms may be chosen by the applicant, and in such cases, their detailed meanings will be described in the detailed description of the invention. Therefore, the terms used in this specification should not be construed as simple names, but rather based on their meanings and the overall description of the invention.

[0022] Reference Figures 1-3This embodiment provides an intelligent dehumidification device for switch cabinets, including a main unit housing 1. The main unit housing 1 is injection molded from ABS engineering plastic, and its interior is clearly divided into a mutually sealed dehumidification chamber and a heat dissipation chamber by a partition.

[0023] Ventilation component 2, integrated into the side wall of the main unit housing 1, is used to form an air duct that runs through the inside and outside of the housing; ventilation component 2 includes an axial flow fan located in the dehumidification chamber, which drives the humid air in the switch cabinet to form a through air duct; and an air guide plate is also installed at the air outlet of the axial flow fan, which can guide the humid air to the location of the condenser plate.

[0024] The semiconductor cooling chip 3 is fixed inside the main unit housing 1 by a connector; the semiconductor cooling chip 3 is fixed to the partition by a spring clamping mechanism to ensure that its hot and cold ends are located in the dehumidification chamber and the heat dissipation chamber, respectively.

[0025] Specifically, in this embodiment, the semiconductor cooling chip 3 is a TEC1-12706.

[0026] The condenser 4 is tightly connected to the cold end of the semiconductor refrigeration chip 3 through a heat-conducting medium; the condenser 4 has an aluminum fin structure and is tightly attached to the cold end of the semiconductor refrigeration chip 3 through thermal grease.

[0027] The water collection tank 5 is located directly below the condenser plate 4, and its top opening is used to collect condensate. The main body of the water collection tank 5 has a funnel-shaped structure, which facilitates the rapid collection of condensate. A cylindrical water tank with a top opening is provided below the bottom outlet of the water collection tank 5 for temporarily storing the collected condensate. An overflow pipe and a drain pipe are provided on the side wall of the water tank, wherein the inlet of the overflow pipe is higher than the inlet of the drain pipe in the vertical direction.

[0028] A liquid level sensor is installed inside the overflow pipe. When the liquid level in the water tank rises to the height of the overflow pipe inlet, it indicates that the water tank is about to be full. At this time, the liquid level sensor detects that liquid has entered and sends a signal to the control system of the device. After receiving the signal, the control system immediately issues a command to automatically open the solenoid valve on the drain pipe to quickly discharge the condensate temporarily stored in the water tank to the outside of the switch cabinet. After the drainage is completed, the control system can set a delay to close the solenoid valve, thereby completing a complete automatic drainage cycle.

[0029] Among them, the ventilation component 2 guides the humid air inside the switch cabinet to the surface of the condenser 4, so that the water vapor condenses and slides down into the water collection tank 5. When the intelligent dehumidification device for the switch cabinet in this embodiment is working, the axial flow fan located in the dehumidification chamber is first started to draw in the humid air in the switch cabinet and form an air duct that runs through the inside and outside of the shell. Guided by the air guide plate, the humid air is evenly blown onto the surface of the condenser fin 4. At the same time, the semiconductor cooling chip 3 is powered on and its cold end is rapidly cooled by the aluminum finned condenser fin 4, so that the temperature of the flowing humid air drops below the dew point, and water vapor condenses into water droplets on the surface of the condenser fin. The water droplets slide down the fins under the action of gravity and are collected by the funnel-shaped water collection tank 5 directly below, and temporarily stored in the water tank at the bottom of it. When the liquid level in the water tank rises to the height of the overflow pipe inlet, the liquid level sensor triggers a signal, and the control system then opens the solenoid valve on the drain pipe to automatically discharge the condensate outside the cabinet, completing a complete dehumidification and drainage cycle.

[0030] In summary, this device achieves continuous adsorption, condensation, and automatic discharge of moisture inside the switchgear, effectively keeping the cabinet dry and improving the reliability of equipment operation.

[0031] Reference Figures 1-3 As an optional embodiment, it includes a cooling fan 6 and a heat sink 7; which are specifically designed to solve the problem of heat accumulation generated at the hot end of the semiconductor cooling chip 3, thereby ensuring the continuous condensation effect of the cooling end and the long-term operational stability of the equipment.

[0032] The heat sink 7 is connected to the hot end of the semiconductor cooling chip 3 through a thermally conductive medium. The heat sink 7 has an aluminum fin structure and is tightly connected to the hot end of the semiconductor cooling chip 3 through high-performance thermally conductive silicone grease, which is responsible for efficiently absorbing and dissipating the heat generated by the chip.

[0033] Specifically, the heat sink 7 is fixed inside the main unit housing 1 by bolts.

[0034] The interior of the main unit casing 1 is divided into a dehumidification chamber 11 and a heat dissipation chamber 12, which are isolated from each other, by a partition; the cooling fan 6 is installed on this partition, and its position is directly opposite the heat sink 7.

[0035] The hot end of the cooling fan 6 and the semiconductor cooling chip 3 is connected to the heat sink 7 through a heat-conducting medium; the cooling fan 6 is located between the dehumidification chamber 11 and the heat dissipation chamber 12; it is used to transport the hot air flowing through the heat sink 7 in the dehumidification chamber 11 to the interior of the heat dissipation chamber 12.

[0036] It should be noted that during the operation of the semiconductor cooling chip 3, the heat generated at its hot end is continuously conducted to the heat sink 7, causing the temperature of the heat sink 7 to gradually rise. In order to control the temperature rise, the cooling fan 6 is started and forms a directional airflow. This airflow flows through the gaps between the fins of the heat sink 7, and carries away the heat accumulated on its surface in a convection manner, and delivers the formed hot air to the interior of the heat dissipation chamber 12. Finally, the hot air is discharged outside the main unit casing through the ventilation holes provided on the side wall of the heat dissipation chamber, thereby realizing the effective external discharge of system heat.

[0037] Furthermore, the end of the condenser plate 4 furthest from the semiconductor refrigeration plate 3 is the condenser end 41, and the condenser end 41 is configured with a wavy structure; the surface of the condenser end 41 is coated with a hydrophilic coating.

[0038] The end of the condenser plate 4 that is furthest from the semiconductor refrigeration plate 3 extends to form a condenser end 41. The condenser end 41 is constructed as a continuous wavy structure; this wavy design increases its contact area with the flowing air, thereby providing more condensation attachment points for water vapor and effectively improving the condensation efficiency per unit time.

[0039] Specifically, the condenser plate 4 is preferably made of copper; copper has excellent thermal conductivity, which can quickly transfer the cold energy generated by the cold end of the semiconductor cooling plate 3 to the entire condenser end 41, ensuring that its surface temperature is uniform and quickly reaches the dew point.

[0040] To further optimize the condensate drainage process, a uniform nano-scale hydrophilic coating is applied to the surface of the wavy condenser end 41. This coating can significantly reduce the water contact angle of the pure copper surface, allowing the condensed water droplets to quickly spread into a thin water film instead of isolated water droplets. Furthermore, by utilizing the gravity of the water film itself, it can slide down the wavy surface more smoothly and quickly, greatly improving the condensate drainage performance.

[0041] Reference Figures 1-3 This embodiment addresses the problem that the surface of the condenser 4 is prone to icing in low-temperature environments, which leads to a decrease in dehumidification efficiency. It provides an ice removal device for the icing phenomenon of the condenser 4. The ice removal component 8 includes a serpentine pipe 81 fixedly installed inside the heat dissipation chamber 12, a solenoid valve 82 disposed at the opening end of the serpentine pipe 81, and a circulation pump 83 for driving the flow of liquid inside the serpentine pipe 81.

[0042] Solenoid valves 82 are installed at both ends of the serpentine pipe 81 to open and close the flow path, and a circulating pump 83 is configured to drive the flow of the liquid working medium in the pipe; the serpentine pipe 81 is preferably made of copper pipe bent to take advantage of its excellent thermal conductivity.

[0043] The cooling fan 6 directs the hot air flowing through the heat sink 7 to the serpentine pipe 81, allowing the liquid inside the serpentine pipe 81 to exchange heat with the hot air and thus store heat.

[0044] Specifically, when the dehumidifier is working normally, the cooling fan 6 continuously guides the hot air flowing through the heat sink 7 to the serpentine pipe 81; the antifreeze working fluid in the pipe, such as an aqueous solution of ethylene glycol, exchanges heat efficiently with the hot air through the pipe wall, absorbing and storing the waste heat that would otherwise need to be discharged outside the cabinet, so that the liquid temperature is maintained between 40℃ and 60℃.

[0045] To further improve the heat exchange between the liquid inside the serpentine pipe 81 and the hot air, heat dissipation fins are provided on the outer wall of the serpentine pipe 81 to improve the heat exchange efficiency between the liquid inside the serpentine pipe 81 and the hot air.

[0046] Furthermore, the condenser plate 4 has a fluid channel inside, and the fluid channel is connected to the serpentine pipe 81 to form a closed loop.

[0047] To facilitate efficient heat transfer in conjunction with the de-icing assembly 8, the copper substrate of the condenser plate 4 is processed to form microchannels. The cross-section of these channels is rectangular, which significantly improves the heat exchange efficiency between the condenser plate and the internal flowing liquid by increasing the heat exchange area and promoting turbulence.

[0048] The inlet and outlet of the microchannel flow channel are connected to the serpentine pipe 81 via a standard interface located on the side of the condenser plate, forming a closed loop together; the loop is filled with propylene glycol antifreeze with a freezing point below -25°C as the heat transfer medium.

[0049] In de-icing mode, the circulation pump 83 starts, driving the heated working fluid to flow through this circuit; when the high-temperature working fluid flows through the microchannels inside the condenser plate 4, it efficiently transfers the waste heat it carries to the entire condenser plate substrate through the huge contact area, realizing rapid and uniform heating of the icing surface from the inside, thereby efficiently completing the de-icing.

[0050] When the dehumidifier is operating normally, the cooling fan 6 continuously blows hot air flowing through the heat sink 7 onto the serpentine pipe 81 located in the heat dissipation chamber 12. The antifreeze working fluid circulating in the pipe, such as an ethylene glycol aqueous solution, continuously exchanges heat with the hot air through the pipe wall, absorbing and storing the waste heat generated by the hot end of the semiconductor cooling chip, keeping the liquid temperature within the usable range of 40-60℃, and reserving the necessary thermal energy for subsequent de-icing. At this time, the solenoid valve 82 is in the closed state, effectively blocking the flow of the working fluid between the fluid channel inside the condenser 4 and the serpentine pipe 81. By isolating, not only is the loss of cold energy caused by liquid circulation prevented, but also the interference of residual heat in the serpentine pipe on the condenser 4 is avoided, thereby ensuring that the condenser 4 always maintains a high-efficiency condensation surface temperature under non-de-icing conditions, and ensuring the continuous condensation efficiency of the device.

[0051] During operation, the control unit monitors the operating current of the thermoelectric cooler 3 in real time. When a continuous abnormal drop in the operating current is detected, the control unit determines that an ice layer has formed on the surface of the condenser 4, hindering heat exchange. Subsequently, the system automatically enters the de-icing mode: the power supply to the thermoelectric cooler 3 is cut off to stop cooling, and the solenoid valves 82 at both ends of the serpentine pipe 81 are opened to open the liquid circulation loop. The circulation pump 83 is started to drive the pre-stored hot liquid in the serpentine pipe 81 to flow into the microchannel flow channel inside the condenser 4 through the connecting pipe. The high-temperature liquid flows in the closed circulation loop, and through the huge heat exchange area of ​​the microchannel, the waste heat it carries is efficiently and evenly transferred to the frozen condenser substrate, causing its temperature to rise rapidly from the inside, and the ice layer melts and peels off from the inside out.

[0052] The control unit continuously monitors the temperature of the condenser plate 4; when the temperature is detected to return to the preset safety threshold, the de-icing is determined to be complete; the system then sequentially shuts down the circulation pump 83 and the solenoid valve 82; to ensure that the residual liquid on the surface of the condenser plate is completely evaporated and the system is stable, the control unit will delay for 30-60 seconds, and then restart the semiconductor cooling chip 3 and the ventilation assembly 2, and the device will automatically resume normal dehumidification operation.

[0053] In summary, the de-icing component, based on waste heat recovery and intelligent judgment mechanisms, can automatically activate internal heat circulation when the risk of icing is detected, thereby effectively alleviating the problem of icing of the condenser fins and helping to improve the operational stability of the dehumidifier under low-temperature conditions.

[0054] Reference Figure 1 This embodiment provides an automatic de-icing method, including detecting the operating current of the thermoelectric cooler, and determining that the condenser is in an icing state when the operating current shows a continuous abnormal drop; a preset current sensor is used to continuously monitor the operating current of the thermoelectric cooler; the control unit is usually based on an MCU, which is responsible for processing current signals, executing judgment logic, and directing all actuators to act.

[0055] Furthermore, the power supply to the thermoelectric cooler is cut off, while the solenoid valves located at both ends of the serpentine pipe are opened; once icing is confirmed, the control unit immediately cuts off the power supply to the thermoelectric cooler, stopping its cooling function. Simultaneously, the two solenoid valves located at the inlet and outlet of the serpentine pipe are opened to allow liquid circulation.

[0056] Start the circulation pump to drive the heated liquid stored in the serpentine pipe to flow. The liquid flows through the pipe into the precisely designed microchannels inside the condenser fins, forming a complete closed loop.

[0057] When the high-temperature liquid flows through the microchannels inside the condenser plate, it efficiently transfers the waste heat it carries to the condenser plate substrate through the huge contact area. This direct internal heating method enables the ice layer to melt quickly and evenly, avoiding thermal stress or local overheating problems that may be caused by external heating methods. The heat transfer process can continue until the system detects a signal that the ice melting is complete. The control unit continuously monitors the readings of the temperature sensor installed on the condenser plate; when the temperature of the condenser plate rises back to the preset safety threshold of 8°C, it indicates that the ice layer has completely melted and the de-icing target has been achieved; the control unit then shuts off the circulation pump and then closes the two solenoid valves, thereby interrupting the liquid circulation and putting the system back into a thermal isolation state.

[0058] To ensure that the liquid remaining on the surface of the condenser completely evaporates and the system stabilizes, the control unit will delay for 60 seconds before restarting the thermoelectric cooler and ventilation components, and the dehumidifier will return to normal operating mode; at this point, a complete automatic de-icing cycle ends.

[0059] In summary, the de-icing method intelligently determines the icing state by monitoring the changes in the operating current of the semiconductor cooling chip in real time. When a continuous abnormal drop in current is detected, the system automatically switches to de-icing mode: cutting off the power supply to the cooling chip, opening the solenoid valve in the circulation loop and starting the circulation pump, driving the heated liquid stored in the serpentine pipe to flow into the internal flow channel of the condenser to form a closed loop, and using the recovered waste heat from the heat dissipation system to uniformly heat the condenser from the inside out, thereby melting the ice layer.

[0060] Importantly, the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. An intelligent dehumidification device for switchgear, characterized in that: Includes the main unit housing (1). Ventilation component (2), integrated into the side wall of the main housing (1), is used to form an air duct that runs through the inside and outside of the housing; The semiconductor cooling chip (3) is fixed inside the main unit housing (1) by a connector; The condenser plate (4) is tightly connected to the cold end of the semiconductor refrigeration plate (3) through a heat-conducting medium; A water collection tank (5) is located directly below the condenser plate (4), and its top opening is used to collect condensate. The ventilation component (2) directs the humid air inside the switch cabinet to the surface of the condenser plate (4), so that the water vapor condenses and slides down into the water collection tank (5).

2. The intelligent dehumidification device for switchgear as described in claim 1, characterized in that: It also includes a cooling fan (6) and a heat sink (7); The heat sink (7) is connected to the hot end of the semiconductor cooling chip (3) through a heat-conducting medium; The main unit housing (1) is divided into a dehumidification chamber (11) and a heat dissipation chamber (12) that are isolated from each other by a partition. The hot end of the cooling fan (6) and the semiconductor cooling chip (3) is connected to the heat sink (7) through a heat-conducting medium. The cooling fan (6) is located between the dehumidification chamber (11) and the heat dissipation chamber (12); it is used to transport the hot air flowing through the heat sink (7) in the dehumidification chamber (11) to the interior of the heat dissipation chamber (12).

3. The intelligent dehumidification device for switchgear as described in claim 1 or 2, characterized in that: The end of the condenser plate (4) away from the semiconductor cooling plate (3) is the condenser end (41), and the condenser end (41) is configured with a wavy structure; The surface of the condenser end (41) is coated with a hydrophilic coating.

4. The intelligent dehumidification device for switchgear as described in claim 2, characterized in that: It also includes a de-icing component (8); The de-icing assembly (8) includes a serpentine pipe (81) fixedly installed inside the heat dissipation chamber (12), a solenoid valve (82) disposed at the opening end of the serpentine pipe (81), and a circulation pump (83) for driving the flow of liquid inside the serpentine pipe (81); The cooling fan (6) directs the hot air flowing through the heat sink (7) to the serpentine pipe (81), so that the liquid in the serpentine pipe (81) exchanges heat with the hot air and stores heat.

5. The intelligent dehumidification device for switchgear as described in claim 4, characterized in that: The condenser plate (4) has a fluid channel inside, and the fluid channel is connected to the serpentine pipe (81) to form a closed loop.

6. The intelligent dehumidification device for switchgear as described in claim 4 or 5, characterized in that: The liquid inside the serpentine pipe (81) is propylene glycol-based antifreeze.

7. The intelligent dehumidification device for switchgear as described in claims 1, 2, 4 or 5, characterized in that: The condenser plate (4) is made of pure copper and has a flat surface that contacts the cold end of the semiconductor refrigeration plate (3).

8. The intelligent dehumidification device for switchgear as described in claim 3, characterized in that: The hydrophilic coating is a silicon dioxide nano-coating.

9. An automatic de-icing method, characterized in that: Includes the intelligent dehumidification device for switchgear as described in any one of claims 1 to 8; as well as, The operating current of the thermoelectric cooler is detected. When the operating current shows a continuous abnormal drop, it is determined that the condenser is in an icing state. Cut off the power supply to the thermoelectric cooler and simultaneously open the solenoid valves located at both ends of the serpentine pipe; Start the circulation pump to drive the heated liquid stored in the serpentine pipe into the fluid channel inside the condenser, forming a closed circulation loop; Through the continuous circulation of the liquid, the waste heat collected inside the serpentine pipe is transported to the condenser plate, thereby melting the ice layer on the surface of the condenser plate. When the temperature of the condenser plate returns to the preset safety threshold, the circulation pump and solenoid valve are turned off to complete the de-icing operation.

10. The automatic de-icing method as described in claim 9, characterized in that: The criteria for judging a sustained abnormal drop in operating current are: the operating current drops by more than 15% relative to the normal value, and the abnormal state lasts for 5-10 seconds; The preset safety threshold is a temperature value within the range of 5℃ to 8℃.

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