Embedded element circuit board and manufacturing method thereof

Abstract

The invention provides an embedded component circuit board and a manufacturing method thereof. The embedded component circuit board comprises two circuit substrates which are electrically connected with each other, a bonding layer arranged between the circuit substrates, an electronic component and a superconducting diamagnetic module. The bonding layer is provided with an accommodating slot, and the electronic element and the superconducting diamagnetic module are arranged on the inner side of the accommodating slot of the bonding layer. The electronic component is electrically connected to the at least one circuit substrate. The superconducting diamagnetic module comprises a first component and a second component. The first component is fixed on the electronic component, and the second component is fixed on one circuit substrate and arranged corresponding to the first component. The first component is located between the electronic component and the second component, and when the superconductive diamagnetic module is under the Meissner effect, the first component is suspended in the accommodating slot of the bonding layer. Therefore, when the circuit board is manufactured or used, the situation that the electronic elements embedded in the circuit board are damaged due to heating or stress can be reduced.

Description

TECHNICAL FIELD

[0001] The present invention relates to a circuit board, and more particularly to a circuit board with embedded components. BACKGROUND

[0002] Currently, electronic components are encapsulated on a circuit board by using thermosetting materials. The difference between the thermal expansion coefficients of the thermosetting materials and other materials in the circuit board easily causes warping problems in the circuit board process, which reduces the yield. The warping problem is more serious in large area circuit boards. In addition, in the prior art for manufacturing a circuit board with embedded components, multiple encapsulation steps are usually taken to form the circuit board. Therefore, the circuit board is severely warped, which damages important electronic components embedded in the circuit board. SUMMARY

[0003] Therefore, the present invention provides a circuit board with embedded components to improve the reliability of the circuit board.

[0004] At least one embodiment of the present invention also provides a method for manufacturing the circuit board with embedded components.

[0005] At least one embodiment of the present invention provides a circuit board with embedded components, which includes two circuit substrates electrically connected to each other, a bonding layer disposed between the circuit substrates, an electronic component, and a superconducting and diamagnetic module. The bonding layer has a receiving slot, and the electronic component and the superconducting and diamagnetic module are disposed inside the receiving slot of the bonding layer. The electronic component is electrically connected to at least one of the circuit substrates. The superconducting and diamagnetic module includes a first part and a second part. The first part is fixed to the electronic component, and the second part is fixed to one of the circuit substrates and corresponds to the first part. The first part is located between the electronic component and the second part, and when the superconducting and diamagnetic module is in the Meissner effect, the first part is suspended inside the receiving slot of the bonding layer.

[0006] In at least one embodiment of the present invention, the first part includes a magnetic material, and the first part is configured to generate a first magnetic field. The second part includes a superconductor material, and the second part is configured to repel the first magnetic field under the Meissner effect.

[0007] In at least one embodiment of the present invention, the second part includes a magnetic material, and the second part is configured to generate a first magnetic field. The first part includes a superconductor material, and the first part is configured to repel the first magnetic field under the Meissner effect.

[0008] In at least one embodiment of the present invention, the circuit substrates have a first distance therebetween, and when the first part is suspended inside the receiving slot, the first part and the second part have a second distance therebetween. The sum of the thickness of the electronic component and the second distance is less than the first distance.

[0009] In at least one embodiment of the present application, the superconducting magnetic shielding module further comprises a third component and a fourth component. The third component is fixed to the electronic component, and the electronic component is located between the first component and the third component. The fourth component is fixed to the other one of the circuit boards, and is disposed corresponding to the third component. The third component is located between the electronic component and the fourth component. When the superconducting magnetic shielding module is in the Meissner effect, the third component is suspended in the accommodating slot.

[0010] In at least one embodiment of the present application, one of the third component and the fourth component is configured to generate the second magnetic field, and the other one of the third component and the fourth component is configured to repel the second magnetic field under the Meissner effect.

[0011] In at least one embodiment of the present application, an embedded component circuit board is provided, comprising three circuit boards, two bonding layers, two electronic components, and two superconducting magnetic shielding modules. The bonding layers are respectively disposed between adjacent two of the circuit boards, and each of the bonding layers has an accommodating slot. The electronic components are respectively disposed inside the accommodating slots and electrically connected to at least one of the circuit boards. The superconducting magnetic shielding modules are respectively disposed inside the accommodating slots, and each of the superconducting magnetic shielding modules comprises two first components and two second components. The first components are fixed to one of the electronic components, and the second components are respectively fixed to adjacent two of the circuit boards and disposed corresponding to the first components. The first components are respectively located on opposite sides of one of the electronic components, and the electronic component and the first components are located between the second components. When the superconducting magnetic shielding module is in the Meissner state, the first components are suspended in one of the accommodating slots.

[0012] In at least one embodiment of the present application, the second components of the superconducting magnetic shielding modules are respectively disposed on opposite sides of the same circuit board.

[0013] The present application also provides a manufacturing method of an embedded component circuit board, comprising providing a first electronic component; disposing a first magnetic material on the first electronic component; providing a first circuit board; disposing a first superconductor material on a first surface of the first circuit board; providing a first bonding layer; removing a portion of the first bonding layer to form a first accommodating slot in the first bonding layer; after disposing the first superconductor material on the first surface of the first circuit board, disposing the first electronic component provided with the first magnetic material on the first superconductor material, wherein the first magnetic material faces the first superconductor material; after disposing the first electronic component on the first superconductor material, laminating the first circuit board, the first bonding layer provided with the first accommodating slot, and a second circuit board. The first electronic component is located inside the first accommodating slot of the first bonding layer.

[0014] In at least one embodiment of the present application, the manufacturing method of the embedded component circuit board further comprises: providing a second electronic component; disposing a second magnetic material on the second electronic component; disposing a second superconductor material on the second surface of the first circuit substrate, wherein the second surface is opposite to the first surface; providing a second bonding layer; removing a portion of the second bonding layer to form a second accommodating slot in the second bonding layer; after disposing the second superconductor material on the second surface of the first circuit substrate, disposing the second electronic component with the second magnetic material on the second superconductor material, so that the second magnetic material faces the second superconductor material; and after disposing the second electronic component on the second superconductor material, bonding the first circuit substrate, the second bonding layer with the second accommodating slot, and the third circuit substrate, wherein the second electronic component is inside the second accommodating slot of the second bonding layer.

[0015] Based on the above, at least one embodiment of the present application forms an accommodating slot in the bonding layer of the embedded component circuit board, and a superconducting magnetic module is disposed in the accommodating slot. The first component and the second component in the superconducting magnetic module have magnetic and diamagnetic properties, respectively, so that the electronic component can be suspended in the accommodating slot. Since the electronic component does not directly contact the circuit substrate and the bonding layer, when the circuit substrate and the bonding layer are thermally expanded to generate thermal stress or subjected to external force to generate mechanical stress, the electronic component will not be directly affected. In this way, the damage of the electronic component embedded in the circuit board due to heat or force during manufacturing or use of the circuit board can be reduced, thereby improving the reliability and process yield of the embedded component circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0016] The aspects of the application will be understood more readily by reference to the following detailed description and accompanying drawings. It is to be noted, however, that the various features of the application can not be drawn to scale in the drawings. In fact, the dimensions of the various features can be arbitrarily increased or decreased for the sake of discussion.

[0017] Figure 1 A cross-sectional view of an embedded component circuit board according to at least one embodiment of the present application is shown.

[0018] Figure 2 A cross-sectional view of an embedded component circuit board according to another embodiment of the present application is shown.

[0019] Figure 3 A cross-sectional view of an embedded component circuit board according to another embodiment of the present application is shown.

[0020] Figures 4A to 4E A cross-sectional view of a manufacturing method of an embedded component circuit board according to at least one embodiment of the present application is shown. DETAILED DESCRIPTION

[0021] The present application will be described in detail with the following examples. Note that the following describes the present application only by way of example and is not intended to exhaustively disclose all embodiments or limit the specific embodiments of the present application. For example, the description "a first feature is formed on a second feature" includes various embodiments in which the first feature is in direct contact with the second feature, and in which an additional feature is formed between the first feature and the second feature so that the two features are not in direct contact. In addition, the same reference numerals are used, wherever possible, to denote the same or similar components throughout the figures and the specification.

[0022] Spatially relative terms, such as "under", "below", "lower", "over", "upper" and the like, are used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientations depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0023] Further, when describing numerical or numerical range values with "about" or "approximately" the term is intended to encompass numbers within a reasonable range given the nature of the value, and taking into account natural variations that would be understood by one of ordinary skill in the art to be inherent in the manufacturing process. A numerical range encompasses a reasonable range of values around the described value, for example + / - 10% of the described value, based on known manufacturing tolerances that are associated with the characteristics of the manufacturing feature. For example, a material layer having a thickness of "about 5 nanometers" can encompass a range of sizes from 4.25 nanometers to 5.75 nanometers, given a manufacturing tolerance of + / - 15% for depositing the material layer, as would be known by one of ordinary skill in the art. Further, the present application can repeat the use of reference numerals and / or letters in various examples. This repetition of reference numerals and / or letters is for the purpose of simplicity and clarity and does not necessarily indicate a relationship between the various embodiments and / or configurations discussed.

[0024] The present application provides an embedded component circuit board 100. Please refer to Figure 1The embedded element circuit board 100 includes a circuit substrate 110 and a circuit substrate 120, a bonding layer 140, an electronic element 160, and a superconducting magnetic shielding module 180. The circuit substrate 110 includes an insulating layer 112 and a circuit layer 114 on one side of the insulating layer 112, and the circuit substrate 120 includes an insulating layer 122 and a circuit layer 124a and a circuit layer 124b on opposite sides of the insulating layer 122. The circuit substrate 110 is disposed on the circuit substrate 120, and the insulating layer 112 of the circuit substrate 110 is disposed facing the circuit layer 124a of the circuit substrate 120. The circuit substrate 110 and the circuit substrate 120 are electrically connected to each other, and in detail, the circuit layer 114 of the circuit substrate 110 is electrically connected to the circuit layer 124a of the circuit substrate 120 through a plurality of conductive holes 105.

[0025] The bonding layer 140 is disposed between the circuit substrate 110 and the circuit substrate 120, and the bonding layer 140 has a receiving groove 145. In the present embodiment, the receiving groove 145 can communicate the insulating layer 112 of the circuit substrate 110 and the insulating layer 122 of the circuit substrate 120, but the present application is not limited thereto. In other embodiments, the receiving groove 145 can also be a recess with an opening facing the circuit substrate 120. In other words, there is a portion of the bonding layer 140 between the bottom surface of the recess and the insulating layer 112 of the circuit substrate 110. The material of the bonding layer 140 can include, for example, polyimide (PI).

[0026] The electronic element 160 is disposed inside the receiving groove 145 of the bonding layer 140 and is electrically connected to the circuit substrate 120. The electronic element 160 can be an active element such as a transistor, or a passive element such as a capacitor and an inductor.

[0027] The superconducting magnetic shielding module 180 is disposed inside the receiving groove 145 of the bonding layer 140, and the superconducting magnetic shielding module 180 includes a first component 182 and a second component 184. The first component 182 is fixed to the electronic element 160, and the second component 184 is fixed to the circuit substrate 120 and corresponds to the first component 182, with the first component 182 located between the electronic element 160 and the second component 184. In detail, the first component 182 of the superconducting magnetic shielding module 180 is disposed and fixed on the surface 160a of the electronic element 160, and the second component 184 of the superconducting magnetic shielding module 180 is disposed and fixed on the surface 120f of the circuit substrate 120, with the first component 182 and the second component 184 overlapping each other on the normal line N1 of the surface 120f.

[0028] Although not shown in the figures, the electronic component 160 can be electrically connected to the circuit substrate 120 by, for example, wire bonding. In addition, in some embodiments, the electronic component 160 can be electrically connected to the circuit substrate 110 and the circuit substrate 120 by electromagnetic induction or electric field coupling. In the case of electromagnetic induction, the first component 182 and the second component 184 of the superconducting diamagnetic module 180 are respectively provided with corresponding induction coils (not shown). When a primary coil in the first component 182 (or the second component 184) is supplied with a varying current (e.g., alternating current), the first component 182 (or the second component 184) generates a varying magnetic field, which is coupled to a secondary coil in the second component 184 (or the first component 182), thereby generating an induced current in the secondary coil. In the case of electric field coupling, a micro electric field coupling structure (not shown), such as a micro capacitor structure, can be provided in a specific region inside the accommodation slot 145 to transmit signals or energy, thereby electrically connecting the electronic component 160 to the circuit substrate 110.

[0029] It is worth mentioning that, since the superconducting diamagnetic module 180 includes a diamagnetic component and a magnetic component, the diamagnetic component generates a magnetic moment opposite to the direction of an applied magnetic field (i.e., the magnetic field generated by the magnetic component), thereby repelling the applied magnetic field. When the repulsive force between the diamagnetic component and the magnetic component balances the gravitational force of the diamagnetic component, the diamagnetic component can be levitated. In the present embodiment, the first component 182 of the superconducting diamagnetic module 180 can be the magnetic component, and the second component 184 can be the diamagnetic component. Therefore, when the superconducting diamagnetic module 180 is in the Meissner effect, the first component 182 is levitated in the accommodation slot 145 of the bonding layer 140.

[0030] For example, the first component 182 of the present embodiment includes a magnetic material, such as a permanent magnet material, e.g., an Al-Ni-Co permanent magnet alloy, an Fe-Cr-Co permanent magnet alloy, a permanent ferrite magnet, or a rare earth permanent magnet material, or an electromagnet, and is configured to generate a first magnetic field. On the other hand, the second component 184 includes a superconductor material, such as a first-type superconductor or a second-type superconductor, and is configured to repel the first magnetic field generated by the first component 182 under the Meissner effect.

[0031] The first type of superconductor enters a superconducting state when the temperature is below a critical temperature and the magnetic field is below a first critical magnetic field. The second type of superconductor enters a superconducting state when the temperature is below a critical temperature and the magnetic field is below a first critical magnetic field. The second type of superconductor in this state is similar to the first type of superconductor in that both are levitated due to the Meissner effect. It is particularly noted that the second type of superconductor enters a mixed state when the temperature is below a critical temperature and the magnetic field is between the first critical magnetic field and a second critical magnetic field. The second type of superconductor in this state is levitated due to a pinning effect. The pinning effect pins the magnetic field lines of a magnetic material to defects within the superconductor to stabilize the position of the magnetic field lines within the superconductor and prevent movement of the magnetic field lines. This provides a stable levitation force between the first component 182 and the second component 184. This helps to resist displacement due to mechanical vibrations and helps to maintain a stable levitation of the electronic component 160.

[0032] It is noted that the second component 184 can use a suitable superconductor material depending on the particular operating environment. For example, if the operating environment is below zero degrees Celsius, the first type of superconductor or the second type of superconductor can be used as the superconductor material of the second component 184. In addition, liquid nitrogen or liquid helium can be placed in the receiving slots 145 to achieve the operating temperature for the first type of superconductor or the second type of superconductor to levitate.

[0033] However, the materials of the first component 182 and the second component 184 are not limited to the present embodiment. In other embodiments, the second component 184 can include a magnetic material and generate a first magnetic field, and the first component 182 can include a superconductor material and repel the first magnetic field generated by the second component 184 under the Meissner effect.

[0034] In addition, although the bonding layer 140 in the present embodiment includes only one receiving slot 145 and each receiving slot 145 is provided with only one electronic component 160 and one superconductor diamagnetic module 180, the present application is not limited thereto. In other embodiments, the bonding layer 140 can include any number of receiving slots 145, such as two, and the number of electronic components 160 and the number of superconductor diamagnetic modules 180 provided inside each receiving slot 145 can each be more than one, such as two.

[0035] As Figure 1As shown, the circuit substrate 110 and the circuit substrate 120 have a spacing dl therebetween, and the first component 182 and the second component 184 of the superconducting magnetoresistance module 180 have a spacing d2 therebetween when the first component 182 is suspended inside the accommodating slot 145 of the bonding layer 140. In particular, the thickness tl of the electronic component 160 and the spacing d2 are combined to be less than the spacing dl, so that the surface 160b of the electronic component 160 does not directly contact the circuit substrate 110 when the first component 182 is suspended inside the accommodating slot 145 of the bonding layer 140.

[0036] In addition, although not shown in Figure 1 the circuit board 100 can further include at least one solder mask. The solder mask can be disposed on the circuit layer 114 of the circuit substrate 110 and the circuit layer 124b of the circuit substrate 120, and expose a portion of the circuit layer 114 and the circuit layer 124b.

[0037] Referring to Figure 2 In another embodiment, a circuit board 200 is similar to the circuit board 100. In detail, the circuit board 200 includes a circuit substrate 210 and a circuit substrate 220, a bonding layer 240, an electronic component 260, and a superconducting magnetoresistance module 280. The circuit substrate 210 includes an insulating layer 212 and a circuit layer 214 disposed on one side of the insulating layer 212, and the circuit substrate 220 includes an insulating layer 222 and circuit layers 224a and 224b disposed on opposite sides of the insulating layer 222. The circuit substrate 210 is disposed on the circuit substrate 220, and the insulating layer 212 of the circuit substrate 210 faces the circuit layer 224a of the circuit substrate 220. The circuit substrate 210 and the circuit substrate 220 are electrically connected to each other, and in detail, the circuit layer 214 of the circuit substrate 210 is electrically connected to the circuit layer 224a of the circuit substrate 220 through a plurality of conductive holes 205.

[0038] The bonding layer 240 is disposed between the circuit substrate 210 and the circuit substrate 220, and the bonding layer 240 has an accommodating slot 245. The electronic component 260 is disposed inside the accommodating slot 245 of the bonding layer 240, and is electrically connected to the circuit substrate 220. The superconducting magnetoresistance module 280 is disposed inside the accommodating slot 245 of the bonding layer 240, and includes a first component 282 and a second component 284. The first component 282 is fixed to the electronic component 260, and the second component 284 is fixed to the circuit substrate 220, and is disposed corresponding to the first component 282, wherein the first component 282 is located between the electronic component 260 and the second component 284.

[0039] The difference between the embedded component circuit board 200 and the embedded component circuit board 100 is that the superconducting diamagnetic module 280 of the embedded component circuit board 200 further includes a third component 286 and a fourth component 288. The third component 286 is fixed to the electronic component 260, and the electronic component 260 is located between the first component 282 and the third component 286. On the other hand, the fourth component 288 is fixed to the circuit board 210 and is disposed corresponding to the third component 286. The third component 286 is located between the electronic component 260 and the fourth component 288. When the superconducting diamagnetic module 280 is under the Meissner effect, both the first component 282 and the third component 286 are suspended within the receiving slot 245.

[0040] In detail, the first component 282 is disposed and fixed to the surface 260a of the electronic component 260, while the third component 286 is disposed and fixed to the surface 260b of the electronic component 260. On the other hand, the second component 284 of the superconducting diamagnetic module 280 is disposed and fixed to the surface 220f of the circuit board 220, while the fourth component 288 is disposed and fixed to the surface 210f of the circuit board 210. The third component 286 and the fourth component 288 overlap each other on the normal N2 of the surface 210f.

[0041] One of the third component 286 and the fourth component 288 is configured to generate a second magnetic field, and the other of the third component 286 and the fourth component 288 is configured to repel this second magnetic field under the Meissner effect. For example, in Figure 2 In one embodiment, the third component 286 comprises a magnetic material and is configured to generate a second magnetic field. On the other hand, the fourth component 288 comprises a superconducting material and is configured to repel the second magnetic field generated by the third component 286 under the Meissner effect.

[0042] Please refer to Figure 3 In another embodiment illustrated, the embedded component circuit board 300 includes a circuit board 310, circuit boards 320 and 330, bonding layers 340 and 350, electronic components 360 and 370, and superconducting antimagnetic modules 380 and 390. The circuit board 310 includes an insulating layer 312 and a circuit layer 314 located on one side of the insulating layer 312. The circuit board 320 includes an insulating layer 322 and circuit layers 324a and 324b located on opposite sides of the insulating layer 322. The circuit board 330 includes an insulating layer 332 and a circuit layer 334 located on one side of the insulating layer 332.

[0043] Circuit board 310, circuit board 320 and circuit board 330 are stacked on top of each other and are electrically connected to each other. In detail, circuit board 320 is located between circuit board 320 and circuit board 330, and the circuit layers 324a and 324b of circuit board 320 are electrically connected to the circuit layers 314 of circuit board 310 and 334 of circuit board 330 through a plurality of conductive holes 305, respectively.

[0044] Bonding layers 340 and 350 are respectively disposed between two adjacent circuit boards, that is, bonding layer 340 is disposed between circuit board 310 and circuit board 320, and bonding layer 350 is disposed between circuit board 320 and circuit board 330. Bonding layer 340 has a receiving slot 345, and bonding layer 350 has a receiving slot 355. Electronic components 360 and 370 are respectively disposed inside the receiving slots 345 and 355 of bonding layer 340 and bonding layer 350, and are electrically connected to circuit board 320.

[0045] Superconducting diamagnetic modules 380 and 390 are respectively disposed inside the receiving slot 345 of the bonding layer 340 and the receiving slot 355 of the bonding layer 350, and each superconducting diamagnetic module includes two first components and two second components. Specifically, the superconducting diamagnetic module 380 includes first components 382a and 382b and second components 384a and 384b, with the first components 382a and 382b fixed to the electronic component 360, and the second components 384a and 384b fixed to the circuit board 310 and circuit board 320, respectively. The second components 384a and 384b are provided corresponding to the first components 382a and 382b, and the first components 382a and 382b are located on opposite sides of the electronic component 360, and the electronic component 360, the first components 382a and 382b are located between the second components 384a and 384b. When the superconducting antimagnetic module 380 is in Meissner state, the first components 382a and 382b are suspended in the receiving slot 345.

[0046] On the other hand, the superconducting diamagnetic module 390 includes first components 392a and 392b and second components 394a and 394b. The first components 392a and 392b are fixed to the electronic component 370, while the second components 394a and 394b are fixed to the circuit board 320 and the circuit board 330, respectively. The second components 394a and 394b are arranged corresponding to the first components 392a and 392b. The first components 392a and 392b are located on opposite sides of the electronic component 370, and the electronic component 370, the first components 392a and 392b are located between the second components 394a and 394b. When the superconducting diamagnetic module 390 is in Meissner mode, the first components 392a and 392b are suspended in the receiving slot 355.

[0047] This invention provides a method for manufacturing an embedded component circuit board. Taking an embedded component circuit board 300 as an example, this manufacturing method may include the following: Figures 4A to 4E The steps are shown below. First, circuit board 320 is provided. Please refer to the following: Figure 4A and Figure 4B The method of providing a circuit board 320 includes: first providing an initial circuit board 320', which can be a general copper foil laminate (CCL), and the copper foil laminate can be a rigid board or a flexible board. The initial circuit board 320' includes an insulating layer 322 and two metal layers 424 disposed on opposite sides of the insulating layer 322. Next, the metal layers 424 can be patterned by, for example, photolithography and etching, so that the metal layers 424 are respectively formed Figure 3 Line layers 324a and 324b are shown.

[0048] Please refer to Figure 4B A superconductor material (not shown) is deposited on the surface 320f of the circuit board 320 by means such as printing, coating, or bonding to form Figure 3 The second component 384a. On the other hand, this step also includes: depositing another superconducting material (not shown) on the surface 320s of the circuit board 320 by means of, for example, printing, coating, or bonding, to form... Figure 3 The second component 394a is shown.

[0049] Notably, although not shown in the figures, the manufacturing method of the embedded component circuit board 300 according to at least one embodiment of the present invention further includes: providing electronic component 360 and electronic component 370. Then, magnetic materials (not shown) can be respectively disposed on electronic component 360 and electronic component 370 by means such as coating or lamination to form... Figure 3 The first components 382a and 382b and the first components 392a and 392b are shown.

[0050] Please refer to Figure 4C After a superconducting material is disposed on the surface 320f of the circuit board 320 and a second component 384a is formed, an electronic component 360 with a magnetic material is disposed on the superconducting material, wherein the magnetic material faces the superconducting material. That is, the electronic component 360 is disposed on the second component 384a, and a first component 382a on the electronic component 360 faces the second component 384a. On the other hand, this step also includes: disposing an electronic component 370 with a magnetic material on the superconducting material, wherein the magnetic material faces the superconducting material. That is, the electronic component 370 is disposed on the second component 394a, and a first component 392a on the electronic component 370 faces the second component 394a.

[0051] Please refer to Figure 4D A bonding layer 340 is provided. Next, a portion of the bonding layer 340 is removed by, for example, laser grooving or etching, to form a receiving groove 345 in the bonding layer 340. Alternatively, this step may also include: providing a bonding layer 350, and removing a portion of the bonding layer 350 by, for example, laser grooving, to form a receiving groove 355 in the bonding layer 350.

[0052] After the electronic component 360 is disposed on the superconducting material (i.e., disposed on the second component 384a), the circuit board 320, the bonding layer 340 with the receiving slot 345, and the circuit board 310' can be bonded together by, for example, thermoforming. Furthermore, this step may also include: after the electronic component 370 is disposed on the superconducting material (i.e., disposed on the second component 394a), the circuit board 320, the bonding layer 350 with the receiving slot 355, and the circuit board 330' can be bonded together by, for example, thermoforming. The circuit board 310' includes an insulating layer 312 and a metal layer 414, while the circuit board 330' includes an insulating layer 332 and a metal layer 434. The electronic component 360 is located inside the receiving slot 345 of the bonding layer 340, and the electronic component 370 is located inside the receiving slot 355 of the bonding layer 350.

[0053] It is worth noting that, in various embodiments of the present invention, there is no absolute order among the steps of depositing magnetic material on electronic component 360, depositing superconducting material on surface 320f of circuit substrate 320, and removing a portion of bonding layer 340. The order of these steps can be adjusted according to the actual process. For example, in some embodiments, magnetic material can be deposited on electronic component 360 first, and then superconducting material can be deposited on surface 320f of circuit substrate 320. In other embodiments, superconducting material can be deposited on surface 320f of circuit substrate 320 first, and then magnetic material can be deposited on electronic component 360.

[0054] Please refer to this as well. Figure 4D and Figure 4E After bonding the circuit substrate 320, bonding layer 340 and bonding layer 350, and circuit substrate 310' and circuit substrate 330', the metal layer 414 of the circuit substrate 310' and the metal layer 434 of the circuit substrate 330' can be patterned by photolithography and etching, respectively, to form the following: Figure 3 The circuit layers 314 and 334 are shown. In addition, after forming circuit layers 314 and 334, multiple conductive vias 305 (marked as shown) can be formed in bonding layers 340 and 350 by mechanical polishing, mechanical drilling, and electroplating. Figure 3 (), to electrically connect circuit boards 310, 320, and 330. At this point, a general structure has been formed as follows: Figure 3 The illustrated embedded component circuit board 300.

[0055] In summary, a receiving slot is formed within the bonding layer of the embedded component circuit board, and a superconducting antimagnetic module is placed within the receiving slot. The magnetic and antimagnetic properties of the first and second components of the superconducting antimagnetic module allow the electronic component to levitate within the receiving slot. Since there is no direct contact between the electronic component and the circuit board or bonding layer, thermal stress caused by thermal expansion of the circuit board and bonding layer, or mechanical stress caused by external forces, will not directly affect the electronic component. This reduces the likelihood of damage to the embedded electronic component due to heat or force during manufacturing or use, thereby improving the reliability and process yield of the embedded component circuit board.

[0056] In addition, since the electronic components are suspended within the receiving slots, the gas (e.g., air) flow between the receiving slots and the electronic components can increase the rate at which heat generated by the electronic components is transferred to the external environment via thermal convection, thereby improving the heat dissipation efficiency of the circuit board with embedded electronic components. In this way, the heat energy accumulated on the electronic components can be reduced, preventing the electronic components from malfunctioning due to temperature rise, and thus extending the lifespan of the electronic components.

[0057] On the other hand, since one of the components (the first component or the second component) of the superconducting diamagnetic module can be a superconductor, and based on the characteristic of zero resistance of a superconductor in the superconducting state, the electrical transmission loss between the superconducting diamagnetic module and the circuit board is reduced, which helps to increase the electrical efficiency of the embedded component circuit board.

[0058] Although the embodiments of the present invention have been disclosed above, they are not intended to limit the embodiments of the present invention. Any person skilled in the art can make some modifications and refinements without departing from the spirit and scope of the embodiments of the present invention. Therefore, the protection scope of the embodiments of the present invention shall be determined by the appended claims.

[0059] [Symbol Explanation]

[0060] 100, 200, 300: Embedded component circuit board

[0061] 105, 205, 305: Conductive vias

[0062] 110, 120, 210, 220, 310, 320, 330, 310', 330': Circuit board

[0063] 112,122,212,222,312,322,332: Insulation layer

[0064] 114,124a,124b,214,224a,224b,314,324a,324b,334: Line layer

[0065] 140, 240, 340, 350: Bonding layer

[0066] 145,245,345,355: Accommodation slots

[0067] 160, 260, 360, 370: Electronic components

[0068] 120f, 160a, 160b, 260a, 260b, 210f, 220f, 320f, 320s: Surface

[0069] 180, 280, 380, 390: Superconducting diamagnetic modules

[0070] 182, 282, 382a, 382b, 392a, 392b: First component

[0071] 184,284,384a,384b,394a,394b: Second component

[0072] 286: Third Component

[0073] 288: Fourth Component

[0074] 320': Initial circuit board

[0075] 414, 424, 434: Metal layer

[0076] d1, d2: Spacing

[0077] N1, N2: Normal lines

[0078] t1: Thickness.

Claims

1. An embedded component circuit board, characterized by, Comprising: two circuit substrates, and the circuit substrates are electrically connected to each other; a bonding layer disposed between the circuit substrates, the bonding layer having a receiving slot; an electronic component disposed inside the receiving slot of the bonding layer and electrically connected to at least one of the circuit substrates; a superconducting diamagnetic module disposed inside the receiving slot of the bonding layer, the superconducting diamagnetic module comprising: a first component fixed on the electronic component; a second component fixed on one of the circuit substrates and disposed corresponding to the first component, wherein the first component is located between the electronic component and the second component, and the first component is levitated inside the receiving slot of the bonding layer when the superconducting diamagnetic module is in the Meissner effect.

2. The embedded component circuit board of claim 1, wherein, The first component comprises a magnetic material, and the first component is configured to generate a first magnetic field, wherein the second component comprises a superconductor material, and the second component is configured to repel the first magnetic field under the Meissner effect.

3. The embedded component circuit board of claim 1, wherein, The second component comprises a magnetic material, and the second component is configured to generate a first magnetic field, wherein the first component comprises a superconductor material, and the first component is configured to repel the first magnetic field under the Meissner effect.

4. The embedded component circuit board of claim 1, wherein, The circuit substrates have a first spacing therebetween, and the first component and the second component have a second spacing therebetween when the first component is levitated inside the receiving slot, wherein the sum of the thickness of the electronic component and the second spacing is less than the first spacing.

5. The embedded component circuit board of claim 1, wherein, The superconducting diamagnetic module further comprises: a third component fixed on the electronic component, and the electronic component is located between the first component and the third component; and a fourth component fixed on the other one of the circuit substrates and disposed corresponding to the third component, wherein the third component is located between the electronic component and the fourth component; wherein the third component is levitated inside the receiving slot when the superconducting diamagnetic module is in the Meissner effect.

6. The embedded component circuit board of claim 5, wherein, One of the third component and the fourth component is configured to generate a second magnetic field, and the other one of the third component and the fourth component is configured to repel the second magnetic field under the Meissner effect.

7. An embedded component circuit board, characterized by, Comprising: three circuit substrates disposed in a stack with each other, and the circuit substrates are electrically connected to each other; two bonding layers respectively disposed between adjacent two of the circuit substrates, each of the bonding layers having a receiving slot; two electronic components respectively disposed inside the receiving slots and electrically connected to at least one of the circuit substrates; two superconducting diamagnetic modules respectively disposed inside the receiving slots, each of the superconducting diamagnetic modules comprising: two first components fixed on one of the electronic components; Two second components are respectively fixed on two adjacent ones of the circuit substrates and are arranged corresponding to the first component, wherein the first component is respectively located on opposite sides of one of the electronic components, and one of the electronic components and the first component are located between the second components, and the first component is suspended in one of the accommodation grooves when the superconducting diamagnetic module is in the Meissner state.

8. The embedded component circuit board of claim 7, wherein, The second components of the superconducting diamagnetic module are respectively arranged on opposite sides of the same circuit substrate.

9. A method of manufacturing a buried element circuit board, characterized by, Comprising: providing a first electronic component; arranging a first magnetic material on the first electronic component; providing a first circuit substrate; arranging a first superconductor material on a first surface of the first circuit substrate; providing a first bonding layer; removing a portion of the first bonding layer to form a first accommodation groove in the first bonding layer; after arranging the first superconductor material on the first surface of the first circuit substrate, arranging the first electronic component provided with the first magnetic material on the first superconductor material, wherein the first magnetic material faces the first superconductor material; after arranging the first electronic component on the first superconductor material, laminating the first circuit substrate, the first bonding layer with the first accommodation groove, and a second circuit substrate, wherein the first electronic component is located inside the first accommodation groove of the first bonding layer.

10. The method of claim 9, wherein, Further comprising: providing a second electronic component; arranging a second magnetic material on the second electronic component; arranging a second superconductor material on a second surface of the first circuit substrate, wherein the second surface and the first surface are respectively located on opposite sides of the first circuit substrate; providing a second bonding layer; removing a portion of the second bonding layer to form a second accommodation groove in the second bonding layer; after arranging the second superconductor material on the second surface of the first circuit substrate, arranging the second electronic component provided with the second magnetic material on the second superconductor material, so that the second magnetic material faces the second superconductor material; after arranging the second electronic component on the second superconductor material, laminating the first circuit substrate, the second bonding layer with the second accommodation groove, and a third circuit substrate, wherein the second electronic component is located inside the second accommodation groove of the second bonding layer.

Images