Substrate transfer robot and method for controlling substrate transfer robot

Abstract

This substrate transfer robot (100) is provided with: a substrate holding hand (10) that holds a substrate (W); an inclination adjustment mechanism (30) that adjusts the inclination of the substrate holding hand (10); a detection unit that detects the substrate placement unit (103); and a control unit (50) that adjusts the relative inclination of the substrate mounting unit (103) and the substrate holding hand (10) by operating the inclination adjustment mechanism (30) on the basis of the detection result of the substrate mounting unit (103) by the detection unit.

Description

Technical Field

[0001] This disclosure relates to a substrate handling robot and a control method for the substrate handling robot. Background Technology

[0002] Previously, substrate handling robots were known. For example, Japanese Patent Application Publication No. 2022-43554 describes a robot for handling substrates. The robot described in Japanese Patent Application Publication No. 2022-43554 has a substrate detection unit that detects the presence or absence of substrates. The substrate detection unit is disposed on a robotic arm that holds the substrate. Before removing the substrate from the substrate storage device and handling it, the robot described in Japanese Patent Application Publication No. 2022-43554 checks the substrate's tilt relative to the robotic arm by using the substrate detection unit to inspect the substrate.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2022-43554

[0004] Here, although not described in the aforementioned Japanese Patent Application Publication No. 2022-43554, the substrate holding device, which serves as the substrate mounting section, sometimes exhibits different tilt angles relative to the substrate holding hand (i.e., the robotic arm) when the substrate is mounted versus when it is not mounted, due to the weight of the substrate. In this case, even if, as described in Japanese Patent Application Publication No. 2022-43554, the tilt angle of the substrate holding hand is adjusted based on the detected tilt angle by detecting the tilt angle of the substrate mounted on the substrate mounting section, the tilt angle of the substrate mounting section changes depending on the presence or absence of the substrate, making it impossible to properly adjust the tilt angle of the substrate holding hand relative to the substrate mounting section. Consequently, when performing a substrate loading operation relative to the substrate mounting section, a deviation occurs in the tilt angle between the loaded substrate and the substrate mounting section. Therefore, it is desirable to be able to properly adjust the tilt angle between the substrate mounting section and the substrate holding hand regardless of whether the substrate is mounted on the substrate mounting section. Summary of the Invention

[0005] This disclosure was made to solve the aforementioned problems. One object of this disclosure is to provide a substrate handling robot and a control method for the substrate handling robot that can appropriately adjust the tilt between the substrate holding part and the substrate holding hand, regardless of whether the substrate holding part has a substrate or not.

[0006] The substrate handling robot according to the first aspect of this disclosure includes: a substrate holding hand for holding a substrate to be placed on a substrate mounting portion; a tilt adjustment mechanism for adjusting the tilt of the substrate holding hand; a detection unit for detecting the substrate mounting portion; and a control unit for adjusting the relative tilt of the substrate mounting portion and the substrate holding hand by activating the tilt adjustment mechanism based on the detection result of the detection unit on the substrate mounting portion.

[0007] The substrate handling robot according to the first aspect of this disclosure includes a control unit as described above. Based on the detection results of the substrate mounting section by the detection unit, the control unit adjusts the relative tilt of the substrate mounting section and the substrate holding hand by activating a tilt adjustment mechanism. Therefore, regardless of whether a substrate is present, the relative tilt of the substrate mounting section and the substrate holding hand can be adjusted by activating the tilt adjustment mechanism based on the detection results of the substrate mounting section. As a result, the tilt between the substrate mounting section and the substrate holding hand can be appropriately adjusted regardless of whether a substrate is present.

[0008] The control method of the substrate handling robot according to the second aspect of this disclosure obtains the detection result obtained by detecting the substrate mounting part on which the substrate is mounted. Based on the detection result of the substrate mounting part, the relative tilt of the substrate mounting part and the substrate holding hand is adjusted by activating the tilt adjustment mechanism that adjusts the tilt of the substrate holding hand that holds the substrate on the substrate mounting part.

[0009] The control method for the substrate handling robot according to the second aspect of this disclosure, as described above, adjusts the relative tilt of the substrate handling section and the substrate holding hand by activating a tilt adjustment mechanism that adjusts the tilt of the substrate holding hand that holds the substrate placed on the substrate handling section, based on the detection results of the substrate mounting section. Therefore, regardless of whether a substrate is present, the relative tilt of the substrate handling section and the substrate holding hand can be adjusted by activating the tilt adjustment mechanism based on the detection results of the substrate handling section. As a result, a control method for a substrate handling robot is provided that can appropriately adjust the tilt between the substrate mounting section and the substrate holding hand, regardless of whether a substrate is present on the substrate handling section.

[0010] According to this disclosure, regardless of whether the substrate mounting portion has a substrate or not, the tilt angle between the substrate mounting portion and the substrate holding hand can be appropriately adjusted. Attached Figure Description

[0011] Figure 1 This is a perspective view showing the overall structure of the substrate handling robot according to the first embodiment.

[0012] Figure 2 This is a perspective view showing the tilting mechanism according to the first embodiment.

[0013] Figure 3 This is a cross-sectional view of the tilting mechanism along the vertical direction.

[0014] Figure 4 This is a perspective view used to illustrate the detection section in the substrate holder.

[0015] Figure 5This is a block diagram representing the control structure of a substrate handling robot.

[0016] Figure 6 This is a schematic diagram illustrating multiple position detection and holding components in the vertical direction.

[0017] Figure 7 This is a schematic diagram illustrating the detection of the retaining component from multiple approach directions.

[0018] Figure 8 This is a schematic diagram illustrating the detection of a substrate placed on a substrate mounting section.

[0019] Figure 9 This is a flowchart illustrating the control method of the substrate handling robot according to the first embodiment.

[0020] Figure 10 This is a perspective view showing the overall structure of the substrate handling robot according to the second embodiment.

[0021] Figure 11 This diagram illustrates the detection of the holding component based on captured images.

[0022] Figure 12 This diagram illustrates the detection of a substrate based on captured images.

[0023] Figure 13 This is a perspective view used to illustrate the substrate holding hand involved in the first modified example.

[0024] Figure 14 This is a perspective view used to illustrate the substrate holding hand involved in the second modified example. Detailed Implementation

[0025] [First Embodiment]

[0026] Hereinafter, a first embodiment of the present disclosure will be described based on the accompanying drawings.

[0027] Reference Figures 1-8 The structure of the substrate handling robot 100 according to the first embodiment will be described below. Hereinafter, the two mutually orthogonal directions in the horizontal plane will be designated as the X direction and the Y direction, respectively. In addition, the vertical direction orthogonal to the horizontal plane (XY plane) will be designated as the Z direction.

[0028] (Structure of the substrate handling robot)

[0029] like Figure 1As shown, a substrate handling robot 100 is disposed in a heat treatment apparatus 101. The substrate handling robot 100 performs substrate handling operations between a FOUP 102 (Front Opening Unified Pod) and a substrate mounting section 103 within the heat treatment apparatus 101. The handling operations performed by the substrate handling robot 100 include both moving the substrate W disposed on the FOUP 102 into the substrate mounting section 103 and moving the substrate W out of the substrate mounting section 103 relative to the FOUP 102. That is, the handling operations performed by the substrate handling robot 100 include placing the substrate W on the substrate mounting section 103 and picking up the substrate W placed on the substrate mounting section 103.

[0030] FOUP102 is a substrate storage container for holding multiple substrates W. A substrate mounting section 103 is disposed in a heat treatment apparatus 101 and holds multiple substrates W. In the heat treatment apparatus 101, the multiple substrates W placed in the substrate mounting section 103 are heat-treated. The substrate mounting section 103 has columnar holding members 103a that hold and arrange the multiple substrates W along a Z-direction, which is the vertical direction. Three holding members 103a are disposed in the substrate mounting section 103 extending along the Z-direction. By holding the peripheral portions of each of the multiple substrates W in each of the multiple claw portions disposed in the holding members 103a, the multiple substrates W are arranged in the substrate mounting section 103 with their main surfaces facing each other along the Z-direction. The substrate W is a semiconductor wafer having a circular plate shape. The substrate W is formed, for example, from silicon, germanium, or quartz glass.

[0031] The substrate handling robot 100 includes a substrate holding hand 10, a drive mechanism 20, and a control unit 50. The drive mechanism 20 includes a fork tooth holding part 21, a horizontal movement mechanism 22, a rotation mechanism 23, a mounting part 24, and a lifting mechanism 25. Furthermore, in the substrate handling robot 100 according to the first embodiment, a tilting mechanism 30 is disposed in the drive mechanism 20. The tilting mechanism 30 is an example of a tilt adjustment mechanism.

[0032] The substrate holder 10 has a plurality of fork-shaped blades 11, each with its end divided into two parts. The substrate holder 10 holds the substrate W using these fork-shaped blades 11. The blades 11 are arranged in the Z-direction, which is the vertical direction. For example, 2, 5, 6, 13, or N blades 11 are arranged. N is an integer greater than or equal to 2. Each blade 11 holds the substrate W one at a time. The substrate holder 10 is a passive mechanism that holds the substrate W by placing it on the upper Z-direction side of the plate-like blades 11 with their fork-shaped ends. The substrate holder 10 is moved by the action of the drive mechanism 20.

[0033] The base end of a plurality of fork tooth members 11 is connected to the fork tooth holding portion 21 on the side opposite to the end portion which is divided into two parts. The horizontal moving mechanism 22 has a support body 22a extending in the horizontal direction. The fork tooth holding portion 21 is mounted on the support body 22a of the horizontal moving mechanism 22 and moves in the horizontal direction relative to the support body 22a. The horizontal moving mechanism 22 moves the substrate holding hand 10 together with the fork tooth holding portion 21 in the horizontal direction. In addition, the horizontal moving mechanism 22 alternately performs the following actions: moving the plurality of fork tooth members 11 of the substrate holding hand 10 together in the horizontal direction, and moving the lowermost one of the plurality of fork tooth members 11 in the horizontal direction. The rotating mechanism 23 has a rotating shaft portion 23a extending in the Z direction. The support body 22a is mounted on the rotating shaft portion 23a. The rotating mechanism 23 rotates the substrate holding hand 10 together with the support body 22a and the fork tooth holding portion 21 in a rotational direction about the rotating shaft portion 23a in the Z direction. The rotating shaft 23a is rotated by the motor 23b, which will be described later.

[0034] The tilting mechanism 30 adjusts the tilt angle of the substrate holder 10. The tilting mechanism 30 is disposed between the support body 22a and the mounting portion 24. The tilting mechanism 30 tilts the substrate holder 10 by changing the tilt angle of the support body 22a, the fork tooth retaining portion 21, and the substrate holder 10 relative to the mounting portion 24. That is, the tilting mechanism 30 changes the tilt angle of the substrate holder 10 by changing the tilt angle of the support body 22a and the fork tooth retaining portion 21. Additionally, a rotating shaft portion 23a is mounted on the tilting mechanism 30. The lifting mechanism 25 has a support body 25a extending in the Z direction, and a mounting portion 24 is mounted on the support body 25a. The lifting mechanism 25 moves the mounting portion 24 in the Z direction. That is, the lifting mechanism 25 moves the substrate holder 10, the mounting portion 24, the tilting mechanism 30, the rotating mechanism 23, the horizontal movement mechanism 22, and the fork tooth retaining portion 21 together in the Z direction.

[0035] <Details of the tilting mechanism>

[0036] like Figure 2 As shown, the tilting mechanism 30 includes: a plate-shaped lower member 31 disposed on the lower side in the Z direction, with a mounting portion 24; and an upper member 32 disposed opposite to the lower member 31 in the Z direction, which is the vertical direction. The lower member 31 is mounted on the mounting portion 24. A support 22a is mounted on the upper member 32 via a rotation shaft portion 23a. The support 22a rotates about the rotation shaft portion 23a. In addition, the tilting mechanism 30 has three spherical sliding bearings 33, 34, and 35 disposed between the lower member 31 and the upper member 32 at different locations when viewed from the Z direction, which is the vertical direction.

[0037] The spherical sliding bearing 35 is positioned at the end of an imaginary centerline L extending from the base to the end at the center of the tilting mechanism 30 in the width direction, i.e., the X direction. Spherical sliding bearings 33 and 34 are respectively positioned at a position closer to the base end of the substrate transport robot 100 than the spherical sliding bearing 35. Furthermore, the spherical sliding bearings 33 and 34 are respectively configured to be linearly symmetrical about the imaginary centerline L when viewed from the Z direction. Additionally, the spherical sliding bearings 33 and 34 are positioned at the same height as the spherical sliding bearing 35.

[0038] like Figure 3 As shown, the spherical sliding bearing 35 has an inner ring 35a and an outer ring 35b. The spherical sliding bearing 35 is configured such that the outer ring 35b is mounted to the lower component 31 via an intermediate component 35c, and the inner ring 35a is mounted to the upper component 32 via bolts 35d. Furthermore, the tilting mechanism 30 has two height adjustment mechanisms 36 and 37, respectively, corresponding to two of the three spherical sliding bearings 33 and 34. However, no height adjustment mechanism is provided for the spherical sliding bearing 35.

[0039] The spherical sliding bearing 33 has an inner ring 33a and an outer ring 33b. The spherical sliding bearing 33 is configured such that the inner ring 33a is mounted on the lower component 31 via an intermediate component 33c and a height adjustment mechanism 36, and the outer ring 33b is mounted on the upper component 32. The height adjustment mechanism 36 has an external thread component 36a and an internal thread component 36b. The external thread component 36a engages with the internal thread component 36b and is rotated by a motor 36c (described later). The internal thread component 36b moves in the Z-direction due to the rotation of the external thread component 36a. Furthermore, the internal thread component 36b engages with the inner hole of the inner ring 33a and is mounted on the upper component 32 via the spherical sliding bearing 33. The height position of the upper component 32 is changed by moving the internal thread component 36b in the Z-direction.

[0040] The spherical sliding bearing 34 has the same structure as the spherical sliding bearing 33. That is, the spherical sliding bearing 34 has an inner ring 34a and an outer ring 34b. The spherical sliding bearing 34 is configured such that the inner ring 34a is mounted on the lower component 31 via the intermediate component 34c and the height position adjustment mechanism 37, and the outer ring 34b is mounted on the upper component 32. The height position adjustment mechanism 37 has the same structure as the height position adjustment mechanism 36. That is, the height position adjustment mechanism 37 has an external thread component 37a and an internal thread component 37b. The external thread component 37a engages with the internal thread component 37b and is rotated by the motor 37c described later. The internal thread component 37b moves in the Z direction due to the rotation of the external thread component 37a. In addition, the internal thread component 37b is fitted into the inner hole of the inner ring 34a and is mounted on the upper component 32 via the spherical sliding bearing 34. The height position of the upper component 32 is changed by moving the internal thread component 37b in the Z direction.

[0041] The height position of the upper component 32 is changed by at least one of the height position adjustment mechanisms 36 and 37, thereby changing the tilt angle of the upper component 32 relative to the lower component 31. By changing the tilt angle of the upper component 32 relative to the lower component 31, the tilt angle of the support 22a relative to the mounting portion 24 is changed, so that the substrate is tilted while the hand 10 is in a tilted position. In addition, when the upper component 32 is tilted by changing its height position, the upper component 32 tilts while the outer ring of the spherical sliding bearing 33, 34 or 35 slides on the surface of the inner ring, so the upper component 32 can be tilted without twisting it.

[0042] <Structure of the Inspection and Control Department>

[0043] like Figure 4As shown, in the first embodiment, the substrate handling robot 100 includes a detection unit 40. The detection unit 40 is disposed in the substrate holding hand 10 and is a photoelectric sensor including an irradiation unit 41 that irradiates a detection light LT and a light-receiving unit 42 that detects the detection light LT irradiated by the irradiation unit 41. The irradiation unit 41 has a light-emitting element such as a laser diode or an LED (Light-Emitting Diode). The light-receiving unit 42 has a light-receiving element such as a CCD (Charge Coupled Device) image sensor, a CMOS (Complementary Metal Oxide Semiconductor) image sensor, or a photodiode. The irradiation unit 41 and the light-receiving unit 42 of the detection unit 40 are respectively disposed in each of the two-part end portions of a fork-shaped tooth member 11 in the substrate holding hand 10. The detection unit 40 is a mapping sensor that detects the presence or absence of the substrate W by detecting whether a detection light LT, emitted from one end of a fork-shaped tooth member 11 in the substrate holder 10, which is divided into two parts, is blocked. For example, the detection unit 40 detects the substrate W's placement status in the FOUP 102 and each substrate mounting section 103 by detecting whether the detection light LT is blocked. The detection unit 40 is located on the lowermost fork member 11 among the plurality of fork members 11 arranged vertically in the substrate holder 10. Furthermore, in Figure 4 Only the lowermost of the plurality of forked members 11 in the substrate holder 10 is shown. In the first embodiment, the detection unit 40 detects the shape of the substrate mounting portion 103 by irradiating a detection light LT. Specifically, the detection unit 40 detects the substrate mounting portion 103 in a state where no substrate W is mounted. The detection unit 40 detects the columnar holding member 103a extending vertically in the substrate mounting portion 103. The detection unit 40 outputs a detection signal to the control unit 50 indicating whether the detection light LT is blocked.

[0044] like Figure 5As shown, the control unit 50 controls the actions of each part of the substrate handling robot 100. Specifically, the control unit 50 controls the handling action of the substrate handling robot 100 by controlling the horizontal movement mechanism 22, the rotation mechanism 23, the lifting mechanism 25, and the tilting mechanism 30. Specifically, motors 22b, 23b, 25b, 36c, and 37c, which serve as drive sources, are respectively arranged in the horizontal movement mechanism 22, the rotation mechanism 23, the lifting mechanism 25, the height position adjustment mechanism 36, and the height position adjustment mechanism 37. The control unit 50 controls the handling action of the substrate handling robot 100 on the substrate W by controlling the motors 22b, 23b, 25b, 36c, and 37c. Motors 22b, 23b, 25b, 36c, and 37c are servo motors. In addition, the control unit 50 receives detection signals from the detection unit 40.

[0045] The control unit 50 includes an arithmetic unit such as a CPU (Central Processing Unit), a memory such as RAM (Random Access Memory) and ROM (Read Only Memory), and a storage device such as a hard disk. The control unit 50 executes control processing via the arithmetic unit based on programs and parameters stored in the storage devices. Furthermore, the control unit 50 has a main CPU that controls the overall movement of the board handling robot 100 and a servo CPU that controls the current supplied to drive sources including motors 22b, 23b, 25b, 36c, and 37c.

[0046] The control unit 50 adjusts the tilt angle of the substrate holding hand 10 by actuating the tilting mechanism 30. For example, during the installation of the substrate handling robot 100 or during routine maintenance, the control unit 50 performs a tilt setting operation based on a detection signal from the detection unit 40, setting a set value for actuating the tilting mechanism 30. The control unit 50 adjusts the relative tilt angle between the substrate mounting unit 103 and the substrate holding hand 10 through the tilt setting operation.

[0047] <Tilt Angle Setting Action>

[0048] The control unit 50 performs a transport operation on the substrate W relative to the substrate mounting portion 103, including a loading operation and a unloading operation, based on a preset value set by the tilt setting operation and with the tilt mechanism 30 setting the tilt angle of the substrate holding hand 10 to a predetermined size. In the tilt setting operation, in the first embodiment, the control unit 50 adjusts the relative tilt angle between the substrate mounting portion 103 and the substrate holding hand 10 by activating the tilt mechanism 30, based on the detection result of the detection unit 40 on the substrate mounting portion 103. Specifically, the control unit 50 obtains the shape of the columnar holding member 103a of the substrate mounting portion 103 as detected by the detection unit 40. To eliminate the relative tilt angle between the substrate mounting portion 103 and the substrate holding hand 10, the control unit 50 adjusts the tilt angle of the fork tooth holding portion 21 relative to the mounting portion 24 by activating the tilt mechanism 30 based on the detection result of the detection unit 40, thereby adjusting the relative tilt angle between the substrate holding hand 10 and the substrate mounting portion 103. Based on the detection results from the detection unit 40, the control unit 50 adjusts the tilt of the upper component 32 relative to the lower component 31 using the height position adjustment mechanisms 36 and 37. Thus, the control unit 50 adjusts the tilt of the substrate holder 10 relative to the substrate mounting portion 103 to eliminate the relative tilt. For example, if the relative tilt of the substrate holder 10 relative to the substrate mounting portion 103 is above a predetermined threshold, the control unit 50 sets a setting value to activate the tilting mechanism 30 so that the tilt is less than the predetermined threshold.

[0049] like Figure 6 As shown, the control unit 50 sets the setting value of the tilting mechanism 30 during the loading operation of the substrate W in the tilt setting operation. During the tilt setting operation in the loading operation, the control unit 50 moves the substrate holding hand 10 towards the holding member 103a along the XY plane, and simultaneously obtains the moment when the detection light LT is blocked by the holding member 103a of the substrate holding part 103 based on the detection result from the detection unit 40 which detects the substrate mounting part 103 in a state where the substrate W is not mounted. Thus, the control unit 50 detects the position of the holding member 103a of the substrate mounting part 103 in the approach direction in which the substrate holding hand 10 approaches. Furthermore, in Figure 6 The example shown illustrates the case where the X-direction is set as the approximation direction. Furthermore, the detection unit 40 detects the columnar holding member 103a extending along the Z-direction, which is the vertical direction, at five different positions in the vertical direction. The control unit 50 obtains five detection results from the detection unit 40 detecting the columnar holding member 103a at five different positions in the Z-direction, which is the vertical direction.

[0050] In addition, such as Figure 7As shown, the control unit 50 causes the substrate holding hand 10 to approach from multiple different approach directions at each of five different positions in the vertical direction. That is, the control unit 50 changes the movement direction of the substrate holding hand 10 in the XY plane to multiple approach directions while approaching the holding member 103a, thereby obtaining detection results from the detection unit 40 in each of the multiple approach directions. The control unit 50 obtains the shape of the substrate mounting portion 103 based on the detection results from the detection unit 40 in each of the multiple approach directions. Specifically, the control unit 50 obtains the position of the holding member 103a in the XY plane by obtaining the detection results obtained by detecting the columnar holding member 103a using the detection unit 40 in each of the multiple approach directions. The control unit 50 obtains the three-dimensional shape of the holding member 103a by obtaining the position of the holding member 103a in the XY plane at each of the five different positions in the vertical direction based on the detection results of the detection unit 40. For example, the control unit 50 obtains the position of the holding member 103a on the XY plane at five positions in the vertical direction, thereby making the shape of the holding member 103a approximately a curve for calculation.

[0051] Thus, the control unit 50 obtains the relative tilt angle of the holding member 103a of the substrate mounting portion 103 relative to the substrate holding hand 10 based on the shape of the holding member 103a obtained from five detection results from the detection unit 40. Based on the obtained relative tilt angle of the substrate mounting portion 103 relative to the substrate holding hand 10, the control unit 50 obtains a setting value for the tilt adjustment amount of the tilting mechanism 30. For example, the control unit 50 sets the operation of the tilting mechanism 30 such that the surface of the substrate W in the substrate holding hand 10, i.e., the upper side of the fork tooth member 11 in the Z direction, becomes parallel to the mounting surface of the substrate W in the substrate mounting portion 103. That is, the control unit 50 operates the tilting mechanism 30 such that the substrate W held in the substrate holding hand 10 during the substrate W transport operation becomes parallel to the substrate W mounted in the substrate mounting portion 103. The setting value for the tilt adjustment amount of the tilting mechanism 30 can be changed depending on the vertical position of the holding member 103a, or it can be a constant value.

[0052] The setting value of the tilt mechanism 30, set by the tilt setting operation, is stored in the storage device by the control unit 50. For example, the control unit 50 stores the setting values ​​of the height position adjustment mechanisms 36 and 37 of the tilt mechanism 30 during the substrate W loading operation, based on the adjustment result of the tilt mechanism 30 in the tilt setting operation. When the control unit 50 detects that the substrate loading unit 103 has adjusted the relative tilt of the substrate loading unit 103 and the substrate holding hand 10 by activating the tilt mechanism 30 based on the detection result of the substrate loading unit 103 not having the substrate W loaded, the substrate W held in the substrate holding hand 10 is loaded into the substrate loading unit 103.

[0053] In addition, such as Figure 8 As shown, the control unit 50 sets the setting value of the tilting mechanism 30 during the removal operation of the substrate W in the tilt setting operation. During the tilt setting operation in the removal operation, the detection unit 40 detects the substrate W placed on the substrate mounting section 103. The control unit 50 moves the substrate holding hand 10 closer to the substrate W placed on the substrate mounting section 103 along the XY plane, and detects the relative tilt of the substrate W relative to the substrate holding hand 10 based on the detection result of the detection unit 40 on the substrate W. For example, after the control unit 50 moves the substrate holding hand 10 closer to the substrate W, it moves the substrate holding hand 10 in the vertical direction while the detection light LT is blocked by the substrate W. The control unit 50 detects the relative tilt of the substrate W in the rolling direction with the approach direction of the substrate holding hand 10 as the rotation axis by comparing the width of the area where the detected detection light LT is blocked in the vertical direction with the actual width of the substrate W in the vertical direction. Similar to the tilt detection in the holding member 103a of the substrate mounting section 103, the control unit 50 detects the tilt of the substrate W in multiple directions by bringing the substrate holding hand 10 close to the substrate W from multiple different approach directions. Furthermore, similar to the tilt detection in the holding member 103a of the substrate mounting section 103, the control unit 50 detects the tilt of the substrate W at each of five different positions in the vertical direction. In this way, the control unit 50 obtains the relative tilt of the substrate holding hand 10 with respect to the substrate W. Moreover, the control unit 50 sets the operation of the tilting mechanism 30 so that the surfaces of the substrate W placed in the substrate mounting section 103 and the substrate W held in the substrate holding hand 10 become parallel to each other during the removal operation. The setting value for the tilt adjustment amount of the tilting mechanism 30 during the removal operation can be changed according to the vertical position of the substrate mounting section 103, similar to the loading operation, or it can be a constant value.

[0054] Thus, by setting the tilt angle during the removal operation, the setting value of the tilting mechanism 30 during the removal operation is set by the control unit 50 and stored in the storage device. Based on the detection result of the detection unit 40 on the substrate W placed on the substrate mounting unit 103, the control unit 50 adjusts the relative tilt angle between the substrate mounting unit 103 and the substrate holding hand 10 by activating the tilting mechanism 30, and removes the substrate W from the substrate mounting unit 103.

[0055] (Control method for substrate handling robot)

[0056] Reference Figure 9 The control method of the substrate handling robot 100 in the first embodiment will be described based on the flowchart. The control processing of steps S1 to S5 is executed by the control unit 50.

[0057] First, in step S1, the tilt adjustment operation is started, and the detection result obtained by detecting the substrate mounting section 103 is obtained. Specifically, the tilt adjustment operation in the loading operation is started, and the detection result is obtained by detecting the columnar holding member 103a extending in the vertical direction in the substrate mounting section 103 in the state where the substrate W is not mounted at at least three different positions, that is, five positions in the vertical direction.

[0058] Next, in step S2, based on the detection results of the substrate mounting portion 103, the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10 is adjusted by activating the tilting mechanism 30. Specifically, the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10 is adjusted based on the detection results obtained by detecting the columnar holding member 103a of the substrate mounting portion 103 at five different positions in the vertical direction. That is, based on the detection results of the five positions obtained in step S1, the relative tilt of the substrate mounting portion 103 relative to the substrate holding hand 10 is obtained, and the setting value of the tilting mechanism 30 that eliminates the obtained tilt is stored as the setting value in the loading operation.

[0059] Next, in step S3, the tilt adjustment action in the removal operation is started, and the detection result obtained by the detection unit 40 detecting the substrate W placed on the substrate mounting unit 103 is obtained. Similar to step S1, the detection result obtained by detecting the substrate W at at least three different positions, that is, five positions, in the vertical direction is obtained.

[0060] Next, in step S4, based on the detection results of the substrate W, the relative tilt of the substrate mounting portion 103 on which the substrate W is mounted and the substrate holding hand 10 is adjusted by activating the tilting mechanism 30. Similar to step S2, based on the five detection results obtained in step S3, the relative tilt of the substrate mounting portion 103 on which the substrate W is mounted and the substrate holding hand 10 is obtained, and the setting value of the tilting mechanism 30 that eliminates the obtained tilt is stored as the setting value in the removal operation.

[0061] Then, in step S5, while the relative tilt of the substrate mounting portion 103 relative to the substrate holding hand 10 is adjusted by activating the tilting mechanism 30 using a set value, a substrate W transport operation including a loading operation and a unloading operation is performed.

[0062] [Effects of the first embodiment]

[0063] The substrate handling robot 100 includes a control unit 50. Based on the detection results of the substrate mounting section 103 by the detection unit 40, the control unit 50 adjusts the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 by activating the tilting mechanism 30, which serves as a tilt adjustment mechanism. Therefore, regardless of whether the substrate W is present, the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 can be adjusted by activating the tilting mechanism 30 based on the detection results of the substrate mounting section 103. As a result, the tilt between the substrate mounting section 103 and the substrate holding hand 10, which holds the substrate W, can be appropriately adjusted regardless of whether the substrate mounting section 103 has the substrate W present.

[0064] The detection unit 40 detects the substrate mounting section 103 in a state where the substrate W is not mounted. The control unit 50, based on the detection result of the substrate mounting section 103 in a state where the substrate W is not mounted, adjusts the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 by activating the tilt mechanism 30, which is a tilt adjustment mechanism, and then moves the substrate W held in the substrate holding hand 103 into the substrate mounting section 103. Therefore, by activating the tilt mechanism 30 to adjust the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 based on the detection result obtained from detecting the substrate mounting section 103 before mounting the substrate W, the tilt between the substrate mounting section 103 and the substrate holding hand 10 can be appropriately adjusted when moving the substrate W relative to the substrate mounting section 103.

[0065] The detection unit 40 detects the substrate W placed on the substrate mounting section 103. The control unit 50, based on the detection result of the detection unit 40 on the substrate W placed on the substrate mounting section 103, adjusts the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 by activating the tilt mechanism 30, which is a tilt adjustment mechanism, and then removes the substrate W from the substrate mounting section 103. Here, when the substrate W is placed on the substrate mounting section 103, physical interference may occur due to the substrate W, making detection by the detection unit 40 sometimes difficult. In contrast, in the first embodiment, the detection unit 40 detects the substrate W placed on the substrate mounting section 103. Therefore, based on the detection result obtained from detecting the substrate W, the tilt between the substrate mounting section 103 and the substrate holding hand 10 during the removal of the substrate W can be appropriately adjusted. As a result, in both the removal action of moving the substrate W out of the substrate mounting portion 103 and the insertion action of moving the substrate W into the substrate mounting portion 103, the tilt angle between the substrate mounting portion 103 and the substrate holding hand 10 can be appropriately adjusted.

[0066] The detection unit 40 detects the shape of the substrate mounting portion 103. Based on the shape of the substrate mounting portion 103 detected by the detection unit 40, the control unit 50 adjusts the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10 by activating the tilt mechanism 30, which is a tilt adjustment mechanism. Therefore, by detecting the shape of the substrate mounting portion 103, the relative tilt of the substrate mounting portion 103 relative to the substrate holding hand 10 can be easily detected. As a result, the tilt between the substrate mounting portion 103 and the substrate holding hand 10 for mounting the substrate W can be easily and appropriately adjusted.

[0067] The detection unit 40 is disposed on the substrate holding hand 10 and detects the shape of the substrate mounting portion 103 by irradiating it with a detection light LT. Therefore, the shape of the substrate mounting portion 103 can be detected by the detection unit 40, which has a relatively simple structure and is irradiated with the detection light LT, thus suppressing the complexity of the device structure. Furthermore, as in the first embodiment, the shape of the substrate mounting portion 103 is detected using a general-purpose detection unit 40 that detects the presence or absence of the substrate W by irradiating the detection light LT. This further reduces the complexity of the device structure compared to a separate configuration of the detection unit 40 for detecting the presence or absence of the substrate W.

[0068] The detection unit 40 detects columnar holding members 103a extending in the vertical direction within a substrate mounting section 103, which has columnar holding members 103a arranged in the vertical direction to hold multiple substrates W. The control unit 50 adjusts the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 based on the detection results obtained by the detection unit 40 of the columnar holding members 103a. Therefore, by detecting the columnar holding members 103a extending in the vertical direction, the tilt of the substrate mounting section 103 relative to the vertical direction can be easily detected. Thus, based on the detection results of the holding members 103a, by adjusting the relative tilt of the substrate mounting section 103 and the substrate holding hand 10, the tilt between the substrate mounting section 103 and the substrate holding hand 10 for holding the substrates W can be easily and appropriately adjusted.

[0069] The detection unit 40 detects the columnar holding member 103a extending in the vertical direction at at least three different positions in the vertical direction. The control unit 50 adjusts the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10 based on at least three, or five, detection results obtained from the detection unit 40 detecting the columnar holding member 103a at at least three different positions in the vertical direction. Therefore, even if the tilt of the holding member 103a extending in the vertical direction varies depending on its position in the vertical direction, the holding member 103a can be detected at at least three positions in the vertical direction in a manner corresponding to the difference in tilt of the holding member 103a extending in the vertical direction. Thus, the relative tilt between the substrate mounting portion 103 and the substrate holding hand 10 can be adjusted in a manner corresponding to the difference in tilt of the holding member 103a. As a result, the tilt between the substrate mounting portion 103 and the substrate holding hand 10 for mounting the substrate W can be further appropriately adjusted.

[0070] The tilt mechanism 30, serving as a tilt adjustment mechanism, includes: a lower component 31; an upper component 32, disposed opposite to the lower component 31 in the vertical direction; three spherical sliding bearings 33, 34, and 35, disposed between the lower component 31 and the upper component 32 at different locations when viewed from the vertical direction; and two height position adjustment mechanisms 36 and 37, respectively corresponding to two of the three spherical sliding bearings 33, 34, and 35. Based on the detection results from the detection unit 40, the control unit 50 adjusts the tilt of the upper component 32 relative to the lower component 31 using the height position adjustment mechanisms 36 and 37, thereby adjusting the relative tilt of the substrate mounting unit 103 and the substrate holding hand 10. Therefore, by using three spherical sliding bearings 33, 34 and 35 and two height position adjustment mechanisms 36 and 37, the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10 can be adjusted without twisting the lower part 31 and the upper part 32 relative to each other. Thus, the tilt between the substrate mounting portion 103 and the substrate holding hand 10 of the substrate W can be adjusted more appropriately.

[0071] The substrate holder 10 includes a plurality of fork-tooth members 11 that hold the substrate W respectively. The substrate handling robot 100 includes a fork-tooth holding section 21 connected to the plurality of fork-tooth members 11. Based on the detection results of the detection unit 40, the control unit 50 adjusts the tilt angle of the fork-tooth holding section 21 by activating the tilt mechanism 30, which is a tilt adjustment mechanism, thereby adjusting the relative tilt angle between the substrate mounting section 103 and the substrate holder 10. Therefore, by using the tilt mechanism 30 to adjust the tilt angle of the fork-tooth holding section 21 connected to the plurality of fork-tooth members 11, the tilt angles of the plurality of fork-tooth members 11 can be adjusted simultaneously. As a result, compared with adjusting the tilt angles of the plurality of fork-tooth members 11 individually, the complexity of the device structure can be suppressed.

[0072] The detection unit 40 detects the substrate mounting section 103 disposed in the heat treatment apparatus 101 for heat treatment of the substrate W. Here, the substrate mounting section 103 disposed in the heat treatment apparatus 101 may sometimes deform due to heat treatment of the substrate W. In this case, the tilt angle between the substrate mounting section 103 and the substrate holding hand 10 will deviate. Therefore, by using the detection unit 40 to detect the substrate mounting section 103 disposed in the heat treatment apparatus 101, the tilt angle between the substrate mounting section 103 and the substrate holding hand 10 for holding the substrate W can be effectively and appropriately adjusted.

[0073] (The effect of the control method for the substrate handling robot)

[0074] In the first embodiment, as described above, a control unit 50 is provided. Based on the detection results of the substrate mounting section 103 by the detection unit 40, the control unit 50 adjusts the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 by activating the tilting mechanism 30, which serves as a tilt adjustment mechanism. Therefore, regardless of whether the substrate W is present, the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 can be adjusted by activating the tilting mechanism 30 based on the detection results of the substrate mounting section 103. As a result, a control method for a substrate handling robot 100 can be provided that can appropriately adjust the tilt between the substrate mounting section 103 and the substrate holding hand 10, regardless of whether the substrate W is present or not.

[0075] In the control method of the substrate handling robot 100, detection results are obtained for a substrate mounting section 103 having columnar holding members 103a arranged along the vertical direction to hold multiple substrates W. These detection results are obtained by detecting the columnar holding members 103a extending along the vertical direction at at least three different positions in the vertical direction. Based on these at least three detection results, the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 is adjusted. Therefore, even when the tilt of the holding members 103a extending along the vertical direction varies depending on their position in the vertical direction, the holding members 103a can be detected in a manner corresponding to the difference in tilt of the holding members 103a extending along the vertical direction by detecting them at at least three positions in the vertical direction. Thus, the relative tilt between the substrate mounting section 103 and the substrate holding hand 10 can be adjusted in a manner corresponding to the difference in tilt of the holding members 103a. As a result, a control method for a substrate handling robot 100 is provided that can further and appropriately adjust the tilt between the substrate mounting portion 103 and the substrate holding hand 10.

[0076] [Second Embodiment]

[0077] Next, refer to Figures 10 to 12 The structure of the substrate handling robot 200 according to the second embodiment will be described. In the second embodiment, unlike the substrate handling robot 100 of the first embodiment which is equipped with a detection unit 40 as a photoelectric sensor, the substrate handling robot 200 is configured with an imaging unit 240 as the detection unit for detecting the substrate mounting unit 103. The same reference numerals are used for structures identical to those in the first embodiment, and descriptions are omitted.

[0078] like Figure 10As shown, the substrate handling robot 200 according to the second embodiment, like the substrate handling robot 100 of the first embodiment, performs substrate W handling operations between the FOUP 102 and the substrate mounting section 103 in the heat treatment apparatus 101. The substrate handling robot 200 includes a substrate holding hand 10, a drive mechanism 20, a tilting mechanism 30, an imaging unit 240, and a control unit 250. The imaging unit 240 is an example of a detection unit and an imaging unit.

[0079] The imaging unit 240 is disposed on the fork tooth holding portion 21 of the substrate holding hand 10, which is connected to the fork tooth member 11. The imaging unit 240 is disposed, for example, above the fork tooth holding portion 21, in such a way that multiple fork tooth members 11 are included in the imaging range. The imaging unit 240 has an imaging element such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor, and images the substrate mounting portion 103. The imaging unit 240 outputs the signal acquired by the imaging element to the control unit 250.

[0080] The control unit 250 controls the actions of each part of the substrate handling robot 200 in the same way as the control unit 50 in the first embodiment. The hardware structure of the control unit 250 is the same as that of the control unit 50 in the first embodiment. The control unit 250, like the control unit 560 in the first embodiment, adjusts the relative tilt of the substrate mounting part 103 and the substrate holding hand 10 by tilt setting operation.

[0081] like Figure 11As shown, the control unit 250 generates an image P1 based on a signal from the imaging unit 240. In the second embodiment, the control unit 250 adjusts the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10 by actuating the tilting mechanism 30 based on the shape of the substrate mounting portion 103 in the image P1 obtained by the imaging unit 240. In the second embodiment, the imaging unit 240 captures an image of the substrate mounting portion 103 in a state where the substrate W is not mounted during a tilt adjustment operation that sets the tilting mechanism 30 to a set value during a loading operation. The control unit 250 detects the shape of the columnar holding member 103a in the image P1. For example, the control unit 250 detects the shape of the holding member 103a in the image P1 by pattern matching processing with a pre-set reference image. Similar to the detection by the use detection unit 40 in the first embodiment, the control unit 250 captures images of the holding member 103a from multiple directions in the XY plane at each of at least three positions in the vertical direction using the imaging unit 240. The control unit 250 obtains the relative tilt angle of the holding member 103a of the substrate mounting portion 103 relative to the substrate holding hand 10 by detecting the shape of the holding member 103a in each of the captured images P1 taken from multiple directions. Based on the obtained relative tilt angle of the holding member 103a, the control unit 250 adjusts the relative tilt angle between the substrate mounting portion 103 and the substrate holding hand 10, similar to the first embodiment, and sets the setting value of the tilting mechanism 30. Thus, in the second embodiment, the control unit 250 activates the tilting mechanism 30 based on the captured image P1 of the substrate mounting portion 103 in a state where the substrate W is not mounted, and moves the substrate W held in the substrate holding hand 10 into the substrate mounting portion 103 while the relative tilt angle between the substrate mounting portion 103 and the substrate holding hand 10 is adjusted by the tilt angle setting operation during the loading operation.

[0082] In addition, such as Figure 12As shown, during the tilt adjustment operation of the tilt mechanism 30 in the set value of the pick-up operation, the imaging unit 240 captures an image of the substrate W placed on the substrate mounting unit 103. During the tilt adjustment operation of the pick-up operation, the control unit 250 generates an image P2 of the substrate W. Then, similarly to the tilt adjustment operation of the pick-up operation, the control unit 250 detects the shape of the substrate W from the image P2. For example, similar to the holding member 103a of the substrate mounting unit 103, the control unit 250 detects the shape of the substrate W in the image P2 through pattern matching processing. Based on the shape of the substrate W detected in the image P2, the control unit 250 detects the relative tilt of the substrate W with respect to the substrate holding hand 10. Similar to the first embodiment, the control unit 250 activates the tilting mechanism 30 based on an image P2 captured by the imaging unit 240 of the substrate W placed on the substrate mounting unit 103, and adjusts the relative tilt of the substrate mounting unit 103 and the substrate holding hand 10 by a tilt setting operation during the removal operation, thereby removing the substrate W from the substrate mounting unit 103. Furthermore, the other structures of the substrate handling robot 200 according to the second embodiment are the same as those in the first embodiment.

[0083] [Effects of the second embodiment]

[0084] The substrate handling robot 200 includes an imaging unit 240 for imaging the substrate mounting section 103. The control unit 250 adjusts the relative tilt of the substrate mounting section 103 and the substrate holding hand 10 based on the shape of the substrate mounting section 103 in the image P1 obtained by the imaging unit 240. Therefore, based on the image P1 obtained by the imaging unit 240, the shape of the substrate mounting section 103 can be easily detected, and thus the relative tilt of the substrate mounting section 103 relative to the substrate holding hand 10 can be easily obtained. As a result, the tilt between the substrate mounting section 103 and the substrate holding hand 10 for mounting the substrate W can be easily and appropriately adjusted. Furthermore, other effects in the second embodiment are the same as in the first embodiment.

[0085] [Variation Example]

[0086] Furthermore, the embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. The scope of this disclosure is defined by the scope of the claims, rather than by the description of the embodiments described above, including all equivalents of the scope of the claims and all modifications (variations) within that scope.

[0087] For example, in the first and second embodiments described above, an example was shown where the relative tilt of the substrate mounting portion 103 and the substrate holding hand 10 disposed in the heat treatment apparatus 101 was adjusted by activating the tilt mechanism 30, which is a tilt adjustment mechanism. However, this disclosure is not limited to this. In this disclosure, the relative tilt of the FOUP, which is a substrate mounting portion, and the substrate holding hand can also be adjusted by activating the tilt adjustment mechanism. In addition, the relative tilt of the substrate mounting portion and the substrate holding hand disposed in a processing apparatus that performs etching, processing, etc., on the substrate other than heat treatment can also be adjusted. In addition, the relative tilt of the substrate holding hand relative to the substrate mounting portion such as the load locking portion that holds the substrate in the EFEM (Equipment Front End Module) or the substrate mounting portion of the alignment device used to adjust the orientation of the substrate can also be adjusted. That is, the relative tilt can also be adjusted by activating the tilt adjustment mechanism during transport operations between any two of the FOUP, the substrate mounting portion disposed in the processing apparatus, the substrate mounting portion such as the load locking portion, and the substrate mounting portion of the alignment device. Alternatively, the relative tilt can be adjusted by activating the tilt adjustment mechanism during the transport operation of any of the FOUPs that serve as substrate mounting portions, the substrate mounting portions disposed in the processing device, the substrate mounting portions of the load locking portion, and the substrate mounting portions of the alignment device.

[0088] Furthermore, in the first embodiment described above, an example was shown where a detection unit 40, which is irradiated with a detection light LT and disposed on a substrate holder 10 having a fork shape, detects a substrate holding section 103 in a state where no substrate W is placed, and also detects a substrate W placed on the substrate holding section 103. In the second embodiment described above, an example was shown where an imaging unit 240, which is a detection unit disposed on a fork tooth holding section 21 connected to the fork tooth member 11 of the substrate holder 10, captures images of a substrate holding section 103 in a state where no substrate W is placed, and also captures images of a substrate W placed on the substrate holding section 103. However, this disclosure is not limited to this. In this disclosure, the detection unit or imaging unit may also be disposed at a location other than the substrate holder or the fork tooth holding section connected to the substrate holder. For example, the imaging unit or detection unit may be disposed at a drive mechanism that moves the substrate holder, the base of a substrate handling robot, or a location separated from the substrate handling robot. Alternatively, the relative tilt of the substrate mounting section to the hand holding the substrate can be detected by using different detection units during tilt adjustment in the loading and unloading operations. For example, the substrate mounting section without a substrate can be photographed by an imaging unit, and the substrate mounted on the substrate mounting section can be detected by a detection unit such as a photoelectric sensor different from the imaging unit. Alternatively, a fixture that mimics a substrate can be used instead of the substrate for detection.

[0089] Furthermore, in the first embodiment described above, a detection unit 40 that outputs detection light LT was shown, and in the second embodiment, an example was shown where the shape of the substrate mounting portion 103 was detected by configuring an imaging unit 240, which serves as the detection unit. However, this disclosure is not limited to this. In this disclosure, the shape of the substrate mounting portion may not be detected by a detection unit. For example, the detection unit may be an electrostatic capacitance sensor or a distance sensor, and instead of detecting shape, appearance, or other features, it may detect the relative tilt of the substrate mounting portion relative to the substrate holding hand. Alternatively, the relative tilt of the substrate mounting portion relative to the substrate holding hand may be detected by configuring a marking member on the substrate mounting portion and detecting the marking member. Multiple detection units may also be configured. Furthermore, when a detection unit is configured on the substrate holding hand holding multiple substrates, detection units may be configured for each of the multiple fork members. In this case, for example, if there is only one tilt adjustment mechanism, the detection results of each of the multiple fork members may be averaged to activate the tilt adjustment mechanism. Alternatively, multiple tilt adjustment mechanisms may be configured in a manner corresponding to each of the multiple fork members. When multiple tilt adjustment mechanisms are configured in a manner corresponding to multiple fork tooth components, the corresponding tilt adjustment mechanism is controlled individually based on the detection results of each of the multiple fork tooth components.

[0090] Furthermore, in the first and second embodiments described above, an example was shown where the relative tilt of the substrate holding hand 10 with respect to the substrate holding portion 103 during the loading operation was adjusted by detecting the shape of the substrate holding portion 103 in a state where no substrate W is placed. However, this disclosure is not limited to this. In this disclosure, the shape of the substrate holding portion in a state where a substrate is placed can also be detected by the detection unit. In addition, in a substrate holding portion for holding multiple substrates, the shape of the substrate holding portion in a state where substrates are partially placed can be detected by the detection unit in the area where no substrates are placed. For example, when multiple substrates are sequentially transported from the top of the substrate holding portion in the vertical direction, the substrate holding portion in a state where substrates are partially placed can be detected by the detection unit in the portion of the substrate holding portion where no substrates are placed below. In addition, when multiple substrates are transported sequentially, the substrate holding portion can be detected by the detection unit during the substrate transport operation, not during the installation of the substrate transport robot or during periodic maintenance, thereby setting the setting value of the tilt adjustment mechanism in real time.

[0091] Furthermore, in the first and second embodiments described above, examples were shown of obtaining detection results in each of the multiple approach directions by detecting the substrate mounting portion 103 and the substrate W from multiple approach directions based on the detection unit 40 or the imaging unit 240; however, this disclosure is not limited to this. In this disclosure, detection results from one direction can also be obtained. Furthermore, even when detection is performed from one direction by the detection unit, detection results from multiple directions can be obtained relative to each other by rotating the substrate mounting portion.

[0092] Furthermore, in the first and second embodiments described above, an example was shown where the holding member 103a with columnar holding member 103a was detected at five different positions in the vertical direction, but this disclosure is not limited to this. In this disclosure, the shape of the holding member can also be detected curvilinearly by detecting the columnar holding member at at least three different positions in the vertical direction. Alternatively, the tilt of the holding member can be detected linearly by detecting the holding member at two positions in the vertical direction. Furthermore, the tilt of two or more columnar holding members can also be detected. In this case, the average tilt of the multiple holding members can be obtained as the relative tilt of the substrate holding portion relative to the substrate holding hand. Similarly, when detecting the substrate placed on the substrate holding portion, there can be at least three positions or two positions. In addition, when detecting the substrate placed on the substrate holding portion, the relative tilt can also be obtained by detecting one substrate.

[0093] Furthermore, in the first and second embodiments described above, examples are shown where the fork-tooth member 11 in the substrate holding hands 10 and 210 is a passive hand with a two-pronged shape, but this disclosure is not limited to this. In this disclosure, it is also possible to... Figure 13 As shown in the first modified example, the substrate holder 310 is configured as a flat substrate holder without a forked shape. In this case, the detection unit or the imaging unit can be configured on the flat substrate holder, or it can be configured in a position other than the flat substrate holder. In addition, instead of a passive hand, a vacuum hand that adsorbs the substrate or an active hand with a chuck for fixing the substrate can be configured as the substrate holder.

[0094] Furthermore, in the first and second embodiments described above, an example was shown where the tilt mechanism 30, as a tilt adjustment mechanism, has three spherical sliding bearings 33, 34, and 35 and two height position adjustment mechanisms 36 and 37, but this disclosure is not limited to this. In this disclosure, a tilt adjustment mechanism without spherical sliding bearings may also be configured. Additionally, a height position adjustment mechanism may not be configured in the tilt adjustment mechanism. For example, the tilt adjustment mechanism can be adjusted by configuring a rotating mechanism. Furthermore, the drive source of the tilt adjustment mechanism may be an actuator based on a pneumatic or hydraulic cylinder, a piezoelectric element, a solenoid coil, or a linear motor, etc.

[0095] Furthermore, in the first and second embodiments described above, examples are shown where the substrate handling robots 100 and 200 include a horizontal movement mechanism 22 as the drive mechanism 20, and the substrate holding hand 10 is respectively equipped with multiple fork-tooth members 11 for holding the substrate W; however, this disclosure is not limited to this. In this disclosure, the substrate handling robot, as the drive mechanism for moving the substrate holding hand, may also have a robot arm with multiple joint axes. In this case, the robot arm may be horizontally multi-jointed or vertically multi-jointed. Additionally, the substrate handling robot may also have a drive mechanism with a parallel linkage structure. Furthermore, as... Figure 14 Like the substrate holding hand 410 involved in the second modified example shown, the substrate holding hand 410 can also hold a substrate. Figure 14 In the second variation shown, the substrate holding hand 410 is mounted on the robot arm 420, which serves as a drive mechanism. In this case, the tilting mechanism 30, which serves as a tilt adjustment mechanism, is disposed, for example, between the end portion of the robot arm 420 and the substrate holding hand 410. In this case, the detection unit or the imaging unit can be disposed on the substrate holding hand 410 or on the robot arm 420. Alternatively, multiple substrate holding hands that hold one substrate can be disposed. For example, one substrate holding hand that holds one substrate can be disposed on each of multiple robot arms.

[0096] Furthermore, in the first embodiment described above, an example was shown where the detection unit 40 was disposed at the lowermost fork tooth member 11 among a plurality of fork tooth members 11 arranged in a vertical direction. In the second embodiment described above, an example was shown where the imaging unit 240, serving as the detection unit, was disposed above the fork tooth holding unit 21 connected to the plurality of fork tooth members 11. However, this disclosure is not limited to these examples. In this disclosure, the detection unit can be disposed at the uppermost fork tooth member among a plurality of fork tooth members arranged in a vertical direction, or at the central fork tooth member. Alternatively, the detection unit can be disposed at each of the plurality of fork tooth members.

[0097] Furthermore, in the first and second embodiments described above, control units 50 and 250, which control the movements of various parts of the substrate handling robots 100 and 200, were shown to obtain the relative tilt angle between the substrate holding hand 10 and the substrate mounting part 103 based on signals from the detection unit 40 and the imaging unit 240, which serves as the detection unit. However, this disclosure is not limited to this. In this disclosure, the calculation processing for detecting the relative tilt angle between the substrate holding hand and the substrate mounting part based on the detection results of the detection unit can also be performed by a control device different from the control device controlling the movements of the substrate handling robot. Alternatively, the control unit of the substrate handling robot can be composed of a single CPU.

[0098] The functions of the elements disclosed in this specification can be performed using circuitry or processing circuitry including general-purpose processors, special-purpose processors, integrated circuits, ASICs (Application Specific Integrated Circuits), conventional circuits, and / or combinations thereof, configured or programmed to perform the disclosed functions. A processor is considered a processing circuit or circuit because it includes transistors and other circuitry. In this disclosure, a circuit, unit, or mechanism is hardware that performs the listed functions, or hardware programmed to perform the listed functions. The hardware can be the hardware disclosed in this specification, or other known hardware programmed or configured to perform the listed functions. In the case of a processor where the hardware is considered a type of circuit, the circuit, mechanism, or unit is a combination of hardware and software used in the structure of the hardware and / or processor.

[0099] [form]

[0100] Those skilled in the art will understand that the embodiments illustrated above are specific examples of the following forms.

[0101] (Form 1) A substrate handling robot, comprising:

[0102] The substrate holding hand holds the substrate to be placed on the substrate mounting section;

[0103] The tilt adjustment mechanism adjusts the tilt of the aforementioned substrate to maintain the tilt of the hand;

[0104] The detection unit detects the substrate mounting section; and

[0105] The control unit, based on the detection results of the detection unit on the substrate mounting part, adjusts the relative tilt of the substrate mounting part and the substrate by activating the tilt adjustment mechanism.

[0106] (Version 2) The substrate handling robot according to Version 1, wherein,

[0107] The aforementioned detection unit detects the substrate mounting unit in a state where the aforementioned substrate is not mounted.

[0108] Based on the detection results of the substrate mounting section when the substrate is not mounted, the control unit adjusts the relative tilt of the substrate mounting section and the substrate holding hand by activating the tilt adjustment mechanism, and then moves the substrate held in the substrate holding hand into the substrate mounting section.

[0109] (Form 3) The substrate handling robot according to Form 2, wherein,

[0110] The detection unit detects the substrate placed on the substrate mounting section.

[0111] Based on the detection results of the detection unit on the substrate placed on the substrate mounting section, the control unit adjusts the relative tilt of the substrate mounting section and the substrate by activating the tilt adjustment mechanism to maintain the relative tilt of the substrate mounting section to the substrate, and then removes the substrate from the substrate mounting section.

[0112] (Form 4) A substrate handling robot according to any one of Forms 1 to 3, wherein,

[0113] The aforementioned detection unit detects the shape of the aforementioned substrate mounting portion.

[0114] Based on the shape of the substrate mounting portion detected by the detection unit, the control unit adjusts the relative tilt of the substrate mounting portion and the substrate by activating the tilt adjustment mechanism.

[0115] (Form 5) The substrate handling robot according to Form 4, wherein,

[0116] The aforementioned detection unit is disposed on the aforementioned substrate holding hand, and detects the shape of the aforementioned substrate mounting portion by irradiating detection light.

[0117] (Form 6) The substrate handling robot according to Form 4, wherein,

[0118] The aforementioned detection unit includes an imaging unit that can capture images of the aforementioned substrate mounting portion.

[0119] Based on the shape of the substrate mounting portion in the captured image obtained by the imaging unit, the control unit adjusts the relative tilt of the substrate mounting portion and the substrate to maintain hand position.

[0120] (Form 7) A substrate handling robot according to any one of Forms 1 to 6, wherein,

[0121] The aforementioned detection unit, for the substrate mounting portion having a columnar holding member that holds and arranges multiple substrates in a vertical direction, detects the columnar holding member extending in the vertical direction.

[0122] The control unit adjusts the relative tilt of the substrate mounting part and the substrate holding hand based on the detection results obtained by the detection unit from detecting the columnar holding member.

[0123] (Form 8) The substrate handling robot according to Form 7, wherein,

[0124] The aforementioned detection unit detects the columnar retaining member extending in the vertical direction at at least three different locations in the vertical direction.

[0125] The control unit adjusts the relative tilt of the substrate mounting part and the substrate holding hand based on at least three detection results obtained by the detection unit from at least three different positions in the vertical direction of the columnar holding member.

[0126] (Form 9) A substrate handling robot according to any one of Forms 1 to 8, wherein,

[0127] The aforementioned tilt adjustment mechanism includes:

[0128] Lower component;

[0129] The upper component is positioned opposite the lower component in the vertical direction;

[0130] Three spherical sliding bearings are disposed between the lower component and the upper component, and are positioned at different locations when viewed from above and below; and

[0131] Two height adjustment mechanisms are respectively provided corresponding to two of the three spherical sliding bearings mentioned above.

[0132] Based on the detection results of the detection unit, the control unit adjusts the tilt of the upper component relative to the lower component through the height position adjustment mechanism, thereby adjusting the relative tilt of the substrate mounting part and the substrate.

[0133] (Form 10) A substrate handling robot according to any one of Forms 1 to 9, wherein,

[0134] The aforementioned substrate holding hand includes a plurality of fork-tooth components that hold the aforementioned substrate respectively.

[0135] The aforementioned substrate holder also includes a fork tooth retaining portion connected to the aforementioned plurality of fork tooth components.

[0136] Based on the detection results of the detection unit, the control unit adjusts the tilt of the fork tooth holding part by activating the tilt adjustment mechanism, thereby adjusting the relative tilt of the substrate mounting part and the substrate holding hand.

[0137] (Form 11) A substrate handling robot according to any one of Forms 1 to 10, wherein,

[0138] The aforementioned detection unit detects the substrate mounting section of the heat treatment apparatus that performs heat treatment on the aforementioned substrate.

[0139] (Form 12) A control method for a substrate handling robot, wherein,

[0140] The test results are obtained by inspecting the substrate mounting portion on which the substrate is mounted.

[0141] Based on the detection results of the substrate mounting section, the relative tilt of the substrate mounting section and the substrate holding hand is adjusted by activating the tilt adjustment mechanism that adjusts the tilt of the substrate holding hand that holds the substrate to be mounted on the substrate mounting section.

[0142] (Form 13) The control method for the substrate handling robot according to Form 12, wherein,

[0143] The detection results are obtained by detecting the columnar holding member extending in the vertical direction at at least three mutually different positions in the vertical direction for the substrate mounting portion having a columnar holding member that holds a plurality of the aforementioned substrates arranged and held in the vertical direction.

[0144] The relative tilt of the substrate mounting portion and the substrate holding hand is adjusted based on at least three detection results obtained by detecting the columnar holding member at at least three different positions in the vertical direction.

Claims

1. A substrate handling robot, wherein, have: The substrate holding hand holds the substrate to be placed on the substrate mounting section; A tilt adjustment mechanism adjusts the substrate to maintain the tilt of the hand; The detection unit detects the substrate mounting unit; as well as The control unit, based on the detection result of the detection unit on the substrate mounting part, adjusts the relative tilt of the substrate mounting part and the substrate by activating the tilt adjustment mechanism.

2. The substrate handling robot according to claim 1, wherein, The detection unit detects substrate mounting units in a state where the substrate is not mounted. Based on the detection results of the substrate mounting section when the substrate is not mounted, the control unit adjusts the relative tilt of the substrate mounting section and the substrate holding hand by activating the tilt adjustment mechanism, and then moves the substrate held by the substrate holding hand into the substrate mounting section.

3. The substrate handling robot according to claim 2, wherein, The detection unit detects the state of the substrate placed on the substrate mounting unit. The control unit removes the substrate from the substrate mounting section by activating the tilt adjustment mechanism to adjust the relative tilt between the substrate mounting section and the substrate, based on the detection result of the detection unit on the state of the substrate placed on the substrate mounting section.

4. The substrate handling robot according to claim 1, wherein, The detection unit detects the shape of the substrate mounting portion. The control unit adjusts the relative tilt of the substrate mounting portion to the substrate by activating the tilt adjustment mechanism based on the shape of the substrate mounting portion detected by the detection unit.

5. The substrate handling robot according to claim 4, wherein, The detection unit is disposed on the substrate holding hand and detects the shape of the substrate mounting portion by irradiating detection light.

6. The substrate handling robot according to claim 4, wherein, The detection unit includes an imaging unit that can capture images of the substrate mounting portion. The control unit adjusts the relative tilt of the substrate mounting portion to the substrate based on the shape of the substrate mounting portion in the captured image obtained by the imaging unit.

7. The substrate handling robot according to claim 1, wherein, The detection unit detects the columnar holding member extending in the vertical direction in the substrate mounting section, which has a columnar holding member that holds a plurality of substrates arranged and held in a vertical direction. The control unit adjusts the relative tilt of the substrate mounting part and the substrate holding hand based on the detection results obtained by the detection unit from detecting the columnar holding member.

8. The substrate handling robot according to claim 7, wherein, The detection unit detects the columnar holding member extending in the vertical direction at at least three mutually different positions in the vertical direction. The control unit adjusts the relative tilt of the substrate mounting part and the substrate holding hand based on at least three detection results obtained by the detection unit detecting the columnar holding member at at least three different positions in the vertical direction.

9. The substrate handling robot according to claim 1, wherein, The tilt adjustment mechanism includes: Lower component; The upper component is configured to be opposite the lower component in the vertical direction; Three spherical sliding bearings are disposed between the lower component and the upper component, and are positioned at different locations when viewed from above and below; and Two height adjustment mechanisms are respectively provided corresponding to two of the three spherical sliding bearings. Based on the detection results of the detection unit, the control unit adjusts the tilt of the upper component relative to the lower component through the height position adjustment mechanism, thereby adjusting the relative tilt of the substrate mounting part and the substrate to maintain hand position.

10. The substrate handling robot according to claim 1, wherein, The substrate holding hand includes a plurality of fork-tooth components that hold the substrate respectively. The substrate holder also includes a fork tooth retaining portion connected to the plurality of fork tooth components. Based on the detection results of the detection unit, the control unit adjusts the tilt of the fork tooth holding part by activating the tilt adjustment mechanism, thereby adjusting the relative tilt of the substrate mounting part and the substrate holding hand.

11. The substrate handling robot according to claim 1, wherein, The detection unit detects the substrate mounting section of the heat treatment apparatus that performs heat treatment on the substrate.

12. A control method for a substrate handling robot, wherein, The test results are obtained by inspecting the substrate mounting portion on which the substrate is mounted. Based on the detection results of the substrate mounting section, the relative tilt of the substrate mounting section and the substrate holding hand is adjusted by activating the tilt adjustment mechanism that adjusts the tilt of the substrate holding hand that holds the substrate to be mounted on the substrate mounting section.

13. The control method for the substrate handling robot according to claim 12, wherein, The detection results are obtained by detecting the columnar holding member extending in the vertical direction at at least three mutually different positions in the vertical direction for a substrate mounting portion having a columnar holding member that holds a plurality of substrates arranged and held in the vertical direction. The relative tilt of the substrate mounting portion and the substrate holding hand is adjusted based on at least three detection results obtained by detecting the columnar holding member at at least three different positions in the vertical direction.

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