Semiconductor manufacturing apparatus and support mechanism

Abstract

A film pasting device (1) is provided with a stage (2) on which a semiconductor chip (W) is placed, a pressing roller (20) for pressing a photoresist film (6) to which the semiconductor chip (W) placed on the stage (2) is pasted, and an outer peripheral support member (5) provided on the outer peripheral side of the stage (2) and disposed so as to receive the pressing force brought by the pressing roller (20) when the photoresist film (6) is pressed by the pressing roller (20). And a support mechanism (50) that supports the outer peripheral support member (5) at at least three positions separated from each other and is capable of adjusting the heights of the at least three positions, respectively.

Description

TECHNICAL FIELD

[0001] The present application relates to a semiconductor manufacturing apparatus and a support mechanism. BACKGROUND

[0002] In the past, a film attaching apparatus has been known which includes a stage on which a semiconductor chip is placed, a pressing member which presses a film which is to be attached to the semiconductor chip placed on the stage, a buffer member which is provided on the outer periphery side of the stage and which is arranged so as to receive a pressing force from the pressing member when the pressing member presses the film (see Patent Document 1).

[0003] PRIOR ART DOCUMENTS PATENT DOCUMENTS Patent Document 1: Japanese Patent No. 4376250 SUMMARY PROBLEMS TO BE SOLVED BY THE INVENTION The above-described apparatus is configured so that the buffer member is raised and lowered by screwing of a pair of female and male screws. Therefore, in the above-described apparatus, in the case where a degree of inclination is generated on the upper surface of the buffer member, there is a concern that the degree of inclination cannot be eliminated. The presence or absence of the degree of inclination on the upper surface of the buffer member when the buffer member is raised and lowered by screwing of a pair of female and male screws greatly depends on the machining accuracy of the pair of female and male screws.

[0004] Therefore, it is desirable to provide a semiconductor manufacturing apparatus which can eliminate the degree of inclination on the upper surface of the outer periphery side support member such as a buffer member.

[0005] METHOD FOR SOLVING THE PROBLEMS The semiconductor manufacturing apparatus according to an embodiment of the present application includes a stage on which a semiconductor chip is placed, a pressing member which presses a film which is to be attached to the semiconductor chip placed on the stage, an outer periphery side support member which is provided on the outer periphery side of the stage and which is arranged so as to receive a pressing force from the pressing member when the pressing member presses the film, and a support mechanism which supports the outer periphery side support member at at least three positions which are separated from each other and which can adjust the heights of the at least three positions, respectively.

[0006] EFFECTS OF THE INVENTION The above-described semiconductor manufacturing apparatus can eliminate the degree of inclination on the upper surface of the outer periphery side support member. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1 A side view of a film attaching apparatus according to an embodiment of the present application.

[0008] Figure 2 A view for explaining a function of a control unit mounted on a film attaching apparatus.

[0009] Figure 3 A diagram illustrating the pushing pattern.

[0010] Figure 4 This is a side view of the film bonding device when the moving unit moves to the left.

[0011] Figure 5 This is a side view of the film bonding device when the moving unit moves to the right.

[0012] Figure 6 A diagram illustrating an example of a membrane being cut by a cutting unit.

[0013] Figure 7 A diagram illustrating an example of the structure of a hollow structure.

[0014] Figure 8 A diagram illustrating an example of the structure of a hollow structure.

[0015] Figure 9 A diagram illustrating an example of the configuration of a lifting support mechanism.

[0016] Figure 10 This is a right-side view of the outer peripheral support components and the lifting support mechanism.

[0017] Figure 11 The following diagram shows the outer peripheral support components and the lifting support mechanism.

[0018] Figure 12 This is a top view of the semiconductor chip and its peripheral support components mounted on the stage.

[0019] Figure 13 A diagram illustrating other configurations of the lifting support mechanism. Detailed Implementation

[0020] initial reference Figure 1 This describes an example of a film bonding apparatus 1 for a semiconductor manufacturing apparatus according to embodiments of the present disclosure. Figure 1 This is a schematic diagram of the membrane bonding device 1.

[0021] The film bonding apparatus 1 is used to bond a photoresist film 6 and other films to a semiconductor chip W. It includes a platform 2 that is circular when viewed from above, on which the semiconductor chip W can be placed. A predetermined interval is left above the platform 2 to accommodate a film supply section 3 and a winding section 4. A three-layer film F3 is supplied from the film supply section 3. In the example shown, in the three-layer film F3, a carrier film 7 is laminated on one surface of the photoresist film 6, which has thermal adhesion, and a reinforcing film 8 is laminated on the other surface. The three-layer film F3 is peeled off from the carrier film 7 by a clamping roller 9 to form a two-layer film F2. The two-layer film F2 is then pressed and bonded to the surface of the semiconductor chip W, and the reinforcing film 8 is peeled off from the two-layer film F2 by horizontal movement of a moving unit described later.

[0022] The platform 2 is constructed by a platform lifting mechanism (TLM) comprising sliding rods 10, a base plate 11, and a support portion 12, which allows it to be raised and lowered. Specifically, the upper ends of the four sliding rods 10, which are freely supported on a frame (not shown), are fixed by the base plate 11 and the support portion 12. Furthermore, the platform 2 is raised and lowered by the driving force of a drive source (not shown) such as a cylinder, which causes the sliding rods 10 to move. Additionally, one end of the platform 2 is open on the mounting surface, and the other ends form part of a suction passage for connecting to a suction source (not shown) such as a pump. In the example shown, the suction passage includes a groove 2G formed on the mounting surface (top) of the platform 2 (see reference). Figure 9 The semiconductor chip W is adsorbed onto the stage 2 by the suction action of the suction source through the multiple through holes formed in the groove 2G and the groove 2G.

[0023] On one side of platform 2, in a direction parallel to the rotation axis of clamping roller 9. Figure 1 As shown, a sliding shaft 15 extending horizontally (perpendicular to the rotation axis of the clamping roller 9) is configured. This sliding shaft 15 supports moving units including a first moving unit 16, a second moving unit 17, and a third moving unit 18, allowing them to slide freely. Furthermore, the moving units are configured to move horizontally using the driving force of a drive source (not shown) such as a cylinder. Additionally, above the stage 2, a cutting unit 19, which serves as a film cutting mechanism for cutting the photoresist film 6 to which the semiconductor chip W is attached using a laser, is provided so that it can move horizontally. Moreover, instead of a device emitting a laser for cutting the film, the cutting unit 19 may be equipped with a scraper for cutting the film.

[0024] The third moving unit 18 has a pressing roller 20 that pushes a photoresist film 6 offset towards the surface side of the semiconductor chip W on the stage 2. The pressing roller 20 is an example of a pressing member, and at least the roller surface portion of the pressing roller 20 is formed of an elastic material such as rubber. The film bonding device 1 enables the moving unit (see reference 1) located at one end (right end) of the sliding shaft 15 to... Figure 1 )likeFigure 4 As shown, moving the sliding shaft 15 to the other end (left end) allows the double film F2 to be offset on the surface of the semiconductor chip W on the stage 2. Furthermore, the film bonding device 1 can press the double film F2 onto the surface of the semiconductor chip W using the push roller 20 for bonding.

[0025] The push roller 20 can be configured to adjust its pushing force according to the pushing area of ​​the semiconductor chip W (the contact area between the push roller 20 and the semiconductor chip W) via the pushing force adjustment mechanism 21. In the example shown, the pushing force adjustment mechanism 21 includes a pushing cylinder 22 with a piston rod 22a. The front end of the piston rod 22a is connected to a support member (not shown) that freely supports the push roller 20 for rotation. The pushing cylinder 22 is an example of a pushing drive source. By supplying a fluid supply source such as a pump, a fluid amount corresponding to the pushing area of ​​the semiconductor chip W is supplied, thereby finely adjusting the entry and exit movement of the piston rod 22a.

[0026] A rectangular annular outer peripheral support member 5 is provided on the outer periphery of the platform 2. The outer peripheral support member 5 is also called a buffer member, and the push roller 20 has an upper surface 5a that acts as an abutting surface when pressing the photoresist film 6. Furthermore, the outer peripheral support member 5 is supported freely in raising and lowering by a lifting support mechanism 25 including a rotary motor 35, and the height of each of the four corners of the outer peripheral support member 5 can be adjusted individually. In the example shown, the height of the outer peripheral support member 5 is adjusted by computer control, and therefore it is also called a digital buffer. Furthermore, a part of an exhaust passage is formed between the platform 2 and the outer peripheral support member 5, with one end open to the mounting surface and the other ends connected to an exhaust device (not shown) such as an exhaust fan. In the example shown, the exhaust passage is a passage for discharging smoke and other contaminants generated during film cutting by the laser cutting unit 19, and includes an annular gap 13G between the platform 2 and the outer peripheral support member 5 (see reference). Figure 9 ), and the pipe 13D connected to the side of the outer peripheral support member 5 (refer to Figure 9 That is, in the example shown, the exhaust device and exhaust passage constitute an air knife for removing unwanted substances generated during the cutting of the membrane using the cutting unit 19. With this configuration, the air flowing through the exhaust passage can instantly cool the cut surface of the membrane cut by the cutting unit 19, thereby achieving the effect of a clean cut surface of the membrane without flash or other defects.

[0027] Next, refer to Figure 2 This explains the function of the membrane bonding device 1. Figure 2This is a block diagram illustrating the function of the control unit 40 mounted on the film bonding apparatus 1. Specifically, the film bonding apparatus 1 has a control unit 40 that controls functions related to film bonding. The control unit 40 is connected to a rotary motor 35, a pressing cylinder 22, and an input unit 41. The input unit 41 can be, for example, a keyboard, a mouse, or a fingertip operation unit. Furthermore, the control unit 40 has a height level storage unit 42 that stores multiple height levels of the outer peripheral support member 5 predetermined according to the shape or size of the semiconductor chip W, and a pressing pattern storage unit 43 that stores multiple pressing patterns predetermined according to the shape or size of the semiconductor chip W.

[0028] In the example shown, the control unit 40 initially determines whether a height level switching command is input from the input unit 41. Furthermore, if a height level switching command is input from the input unit 41, the control unit 40 determines a predetermined height level corresponding to the switching command from a plurality of height levels stored in the height level storage unit 42. Then, the control unit 40 drives the rotary motor 35 at the predetermined height level it has determined.

[0029] Furthermore, the control unit 40 determines whether a push pattern switching command is input from the input unit 41. If a push pattern switching command is input from the input unit 41, the control unit 40 determines a predetermined push pattern corresponding to the switching command from among a plurality of push patterns stored in the push pattern storage unit 43. Then, the control unit 40 drives the push cylinder 22 in accordance with the predetermined push pattern it has determined.

[0030] In this way, in the film bonding apparatus 1, if a height level switching command corresponding to the shape of the semiconductor chip W is input to the control unit 40, the predetermined height level corresponding to the switching command is determined, and the rotary motor 35, which serves as the drive source for the lifting support mechanism 25, is driven. As a result, the outer peripheral support member 5 is raised and lowered, and the outer peripheral support member 5 is positioned at its predetermined height level.

[0031] Furthermore, in the film bonding apparatus 1, if a pressing pattern switching command corresponding to the shape of the semiconductor chip W is input to the control unit 40, the predetermined pressing pattern corresponding to the switching command is determined. In the example shown, Figure 3 As shown, the corresponding pressing pattern P1 of the circular semiconductor chip W is determined when viewed from above.

[0032] Next, the membrane bonding process will be explained. Initially, the membrane bonding device 1 is as follows: Figure 4As shown, the moving units (first moving unit 16, second moving unit 17, and third moving unit 18) located at one end (right end) of the sliding shaft 15 move together with the other end (left end) of the sliding shaft 15 and move to the other end. In this operation, while the double-layer film F2 supplied from the film supply unit 3 shifts at the surface of the semiconductor chip W on the stage 2, the double-layer film F2 is pushed onto the surface of the semiconductor chip W by the push roller 20 of the third moving unit 18, forming a pattern P1 (see reference) Figure 3 The film is adhered by pressing. During the pressing of the two-layer film F2, the pressing roller 20 rotates on the upper surface 5a of the outer peripheral support member 5, which is in a position where its height can be adjusted. Furthermore, a coating such as Teflon or Toshical is applied to the upper surface 5a of the outer peripheral support member 5 in a manner that facilitates peeling off the adhered film.

[0033] Next, the membrane bonding device 1 as follows Figure 5 As shown, by retracting the second moving unit 17 and the third moving unit 18 to their original positions, the reinforcing film 8 is peeled off from the second layer film F2 on the semiconductor chip W. As a result, only the photoresist film 6 remains on the surface of the semiconductor chip W. Then, the film bonding device 1 moves the cutting unit 19 horizontally along the outer periphery of the semiconductor chip W while irradiating it with a laser, thereby cutting the photoresist film 6 (see reference). Figure 6 The remaining film on the surface of the semiconductor chip W in the photoresist film 6, except for the portion that is adhered to, is peeled off by the first moving unit 16, which acts as a removal head, and wound onto the winding section 4. As a result, the film bonding apparatus 1 is able to obtain a semiconductor chip W to which the photoresist film 6 is adhered.

[0034] In the example shown, the photoresist film 6 adhered to the surface of the semiconductor chip W is then subjected to exposure, removal, and other processes. Figure 7 As shown, a pre-cured wall portion 81 is formed. Next, a height level switching command corresponding to the semiconductor chip W with wall portion 81 is input to the control unit 40, and the peripheral support member 5 is adjusted to a predetermined height level. Furthermore, a pressing pattern switching command corresponding to the semiconductor chip W with wall portion 81 is input to the control unit 40, and a predetermined pressing pattern is determined. Next, the film bonding process described above is performed again on the semiconductor chip W with wall portion 81, and a semiconductor chip W with other photoresist films 6 bonded to wall portion 81 is obtained. Then, exposure and removal processes are performed on the photoresist film 6 bonded to wall portion 81, forming a [structure / structure] on the semiconductor chip W. Figure 8 A hollow structure 80, as shown, comprising a wall portion 81 and a roof portion 82.

[0035] In addition, in the example shown, the height level and pressing pattern of the first and second membrane bonding processes are different from each other, they can be the same, or only one of them can be different.

[0036] Furthermore, the film bonding apparatus 1 is configured such that the pressing roller 20 abuts against the upper surface 5a of the peripheral support member 5, whose height level can be adjusted, when the photoresist film 6 is pressed. Therefore, the film bonding apparatus 1 can suppress excessive pressing of the photoresist film 6 by the pressing roller 20, and can bond multiple layers of the thin film photoresist film 6, including the soft material, in a manner that minimizes mechanical pressure on the lower layers. In particular, when bonding the photoresist film 6 to the wall portion 81 of the hollow structure 80, the film bonding apparatus 1 can suitably absorb the surface irregularities (surface pattern) of the semiconductor chip W, thus minimizing mechanical pressure on the semiconductor chip W. Furthermore, when bonding the photoresist film 6 to the roof portion 82 of the hollow structure 80, the film bonding apparatus 1 can suitably absorb the surface irregularities (surface pattern) of the pre-cured wall portion 81, thus minimizing mechanical pressure on the semiconductor chip W and the wall portion 81.

[0037] Furthermore, the film bonding apparatus 1 is configured such that the outer peripheral support member 5 can be horizontally positioned at a predetermined height by means of a lifting support mechanism 25 including a rotary motor 35, which allows the outer peripheral support member 5 to be raised and lowered. Therefore, the film bonding apparatus 1 can stably bond films to semiconductor chips W of various shapes. As a result, the film bonding apparatus 1 can form hollow structures 80 with excellent thickness accuracy (e.g., approximately 50 μm) on the semiconductor chip W with good yield. In particular, the film bonding apparatus 1 can form good hollow structures 80 on approximately the entire surface of the semiconductor chip W. Furthermore, if the film bonding apparatus 1 performs multilayer bonding of three or more layers of photoresist film 6, it can further form hollow structures 80 with high film thickness (e.g., approximately 100 μm).

[0038] Furthermore, the film bonding apparatus 1 is configured such that the pushing force of the pressing roller 20 can be adjusted according to the pressing area of ​​the semiconductor chip W by means of a pressing force adjustment mechanism 21 including a pressing cylinder 22, etc. Therefore, the film bonding apparatus 1 can stably bond films to semiconductor chips W with more diverse shapes.

[0039] Furthermore, the film bonding apparatus 1 incorporates a height level storage unit 42 and a pressing pattern storage unit 43 within the control unit 40. Based on input information fed to the control unit 40, it can select the appropriate height level and pressing pattern based on the shape of the semiconductor chip W being used. Therefore, the film bonding apparatus 1 can stably bond films to semiconductor chips W of a wider variety of shapes.

[0040] Next, refer toFigures 9-11 This section describes an example of the configuration of a lifting support mechanism 25 that raises and lowers the outer peripheral support member 5. Figure 9 This diagram illustrates an example of the configuration of the lifting support mechanism 25. Specifically, Figure 9 The image above is a three-dimensional view of platform 2, outer peripheral support component 5, pipe 13D, lifting support mechanism 25, and platform lifting mechanism TLM. Figure 9 The image below is a perspective view of the outer peripheral support component 5 and the lifting support mechanism 25, equivalent to... Figure 9 The above diagram is the one excluding platform 2, pipe 13D, and the platform lifting mechanism TLM. Additionally, Figure 9 In the figure below, for clarity, the illustration of the side cover 5C, which is one of the constituent elements of the outer peripheral support member 5, is omitted.

[0041] Figure 9 In this system, X1 represents one direction of the X-axis constituting the three-dimensional orthogonal coordinate system, and X2 represents the other direction of the X-axis. Similarly, Y1 represents one direction of the Y-axis constituting the three-dimensional orthogonal coordinate system, and Y2 represents the other direction of the Y-axis. Likewise, Z1 represents one direction of the Z-axis constituting the three-dimensional orthogonal coordinate system, and Z2 represents the other direction of the Z-axis. Figure 9 In the diagram, the X1 side of the outer peripheral support member 5 corresponds to the front side (front face) of the outer peripheral support member 5, and the X2 side corresponds to the rear side (back face) of the outer peripheral support member 5. Furthermore, the Y1 side of the outer peripheral support member 5 corresponds to the left side of the outer peripheral support member 5, and the Y2 side corresponds to the right side of the outer peripheral support member 5. Additionally, the Z1 side of the outer peripheral support member 5 corresponds to the upper side of the outer peripheral support member 5, and the Z2 side corresponds to the lower side of the outer peripheral support member 5. The same applies to other members in the diagram.

[0042] Figure 10 This is a right-side view of the outer peripheral support member 5 and the lifting support mechanism 25. Figure 10 In order to clarify, and Figure 9 The same applies to the following diagram, omitting the illustration of the side cover 5C. Figure 11 The following figure shows the outer peripheral support member 5 and the lifting support mechanism 25. Figure 11 For clarity, some of the components of the lifting support mechanism 25 (mounting plate 34 and rotating motor 35) and the side cover 5C are omitted from the illustration.

[0043] In the example shown in the figure, the outer peripheral support member 5 is as follows: Figure 9 As shown, it includes a base plate 5B, side covers 5C, a pedestal portion 5D, a top plate portion 5T, and an outer peripheral wall portion 5W. Additionally, Figure 10 and Figure 11For clarity, the base plate 5B features a cross-linking pattern, the pedestal portion 5D features a fine dot pattern, and the top plate portion 5T and the outer peripheral wall portion 5W feature a coarse dot pattern. The lifting support mechanism 25 is as follows... Figure 9 As shown in the figure below, it includes a lifting mechanism LM that raises and lowers the outer peripheral support member 5 and a support mechanism 50 that supports the outer peripheral support member 5.

[0044] Specifically, the lifting mechanism LM, such as Figure 9 As shown in the diagram below, it includes a mounting plate 34, a rotating motor 35, a conveyor belt 36, a drive pulley 37, a tension pulley 38, and a driven pulley 39. The driven pulley 39 includes a left front driven pulley 39LF, a right front driven pulley 39RF, and a left rear driven pulley 39LB. Figure 9 (Not visible in the image below) and the right rear driven pulley 39RB. The tension pulley 38 includes a left tension pulley 38L disposed between the drive pulley 37 and the left front driven pulley 39LF, and a right tension pulley 38R disposed between the drive pulley 37 and the right front driven pulley 39RF.

[0045] Support mechanism 50 includes left front support mechanism 50LF, right front support mechanism 50RF, and left rear support mechanism 50LB. Figure 9 (Not visible in the image below) and the right rear support mechanism 50RB. In the example shown, the left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB each have the same structure (same shape and same size). Specifically, support mechanism 50 is as follows: Figure 10 As shown, it is composed of nut 51, nut 52, bearing 53, and spacer 54.

[0046] The base plate 5B of the outer peripheral support member 5 is a member that supports the pedestal portion 5D, the top plate portion 5T, and the outer peripheral wall portion 5W across the support mechanism 50. In the example shown, the base plate 5B is fixed to the support portion 12 of the platform lifting mechanism TLM (see figure). Figure 1 The platform 5B can support the simultaneous lifting and lowering of part 12 via the TLM lifting mechanism. Specifically, the base plate 5B is as follows: Figure 11 As shown, the metal plate has a roughly rectangular shape when viewed from above, which includes four corners CN (first corner CN1 to fourth corner CN4) and a rectangular opening 5K.

[0047] The side cover 5C of the outer peripheral support member 5 is a portion constituting the side surface of the outer peripheral support member 5. In the example shown in the figure, the side cover 5C is as follows: Figure 9 As shown in the figure above, it is installed on the base plate 5B in a manner that covers the base plate 5B and the support mechanism 50.

[0048] The pedestal portion 5D of the outer peripheral support member 5 functions as a pedestal for the top plate portion 5T of the outer peripheral support member 5, and is supported by a support mechanism 50 fixed to the base plate 5B. In the example shown, the pedestal portion 5D is a metal plate with a circular opening for receiving the platform 2 and a roughly rectangular ring shape when viewed from above.

[0049] The top plate portion 5T of the outer peripheral support member 5 is the part fixed to the upper side of the pedestal portion 5D. In the example shown, the top plate portion 5T, like the pedestal portion 5D, is a metal plate with a circular opening for receiving the platform 2 and a roughly rectangular ring shape when viewed from above.

[0050] The outer peripheral wall portion 5W of the outer peripheral support member 5 is part of the exhaust passage 13. In the example shown, the outer peripheral wall portion 5W is a lidless box-shaped metal member with an octagonal bottom wall and octagonal cylindrical side walls when viewed from above. The octagonal cylindrical side walls are constructed to connect four pipes 13D. Furthermore, the octagonal cylindrical side walls are constructed such that their upper ends are fixed to the base portion 5D.

[0051] Thus, the outer peripheral support member 5 is configured such that it can be raised and lowered relative to the base plate 5B via the support mechanism 50, the pedestal portion 5D, the top plate portion 5T, and the outer peripheral wall portion 5W. Specifically, in the base plate 5B, Figure 10 As shown, a bearing 53 is fixed to a support mechanism 50. In the example shown, the bearing 53 is a ball bearing, with the inner wheel fixed to a nut 52 and the outer wheel fixed to a base plate 5B.

[0052] In addition, in the pedestal part 5D, Figure 10 As shown, the nut 51 of the support mechanism 50 is fixed by bolt BT. In the example shown, the nut 51 is a trapezoidal nut, which, together with the nut 52, is also a trapezoidal nut, constitutes the height adjustment mechanism HAM. The height adjustment mechanism HAM is configured such that when the nut 52 rotates around the rotation axis AX, the nut 51 moves upward (to the Z1 side), and when the nut 52 rotates around the rotation axis AX in the other direction, the nut 51 moves downward (to the Z2 side).

[0053] In the example diagram, support organization 50 is... Figure 9 As shown in the figure below, it includes the left front support mechanism 50LF fixed to the first corner CN1 of the base plate 5B, the right front support mechanism 50RF fixed to the second corner CN2 of the base plate 5B, the right rear support mechanism 50RB fixed to the third corner CN3 of the base plate 5B, and the fourth corner CN4 of the base plate 5B. Figure 9 Since it is not visible in the image below, please refer to... Figure 11 The 50LB left rear support mechanism is fixed to the left rear side. Figure 9 (Not visible in the middle).

[0054] Specifically, Figure 11As shown, the left front support mechanism 50LF is configured to allow the nut 52 to rotate around the first rotation axis AX1, the right front support mechanism 50RF is configured to allow the nut 52 to rotate around the second rotation axis AX2, the right rear support mechanism 50RB is configured to allow the nut 52 to rotate around the third rotation axis AX3, and the left rear support mechanism 50LB is configured to allow the nut 52 to rotate around the fourth rotation axis AX4.

[0055] Furthermore, in the example diagram, the first rotation axis AX1 to the fourth rotation axis AX4 are respectively as shown in the figure. Figure 11 As shown, the distances DS from the central axis CA passing through the center of stage 2 are all equal. Furthermore, the angles (central angles) between the line segments connecting the central axis CA and the respective line segments of the first rotation axis AX1 to the fourth rotation axis AX4 are all equal angles θ (90 degrees).

[0056] An operator adjusting the height of the outer peripheral support member 5 can, for example, manually rotate the nut 52 of the height adjustment mechanism HAM in each of the left front support mechanism 50LF, right front support mechanism 50RF, left rear support mechanism 50LB, and right rear support mechanism 50RB, thereby enabling individual adjustment. Figure 9 The heights of the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T of the outer peripheral support member 5 as shown in the figure above.

[0057] The lifting mechanism LM is configured to raise and lower the outer peripheral support member 5 using the height adjustment mechanism HAM of the support mechanism 50. Specifically, as described above, the lifting mechanism LM includes a mounting plate 34, a rotating motor 35, a conveyor belt 36, a drive pulley 37, a tension pulley 38, and a driven pulley 39. The driven pulley 39 includes a left front driven pulley 39LF, a right front driven pulley 39RF, a left rear driven pulley 39LB, and a right rear driven pulley 39RB. The left front driven pulley 39LF, right front driven pulley 39RF, left rear driven pulley 39LB, and right rear driven pulley 39RB have the same structure (same shape and same size). The tension pulley 38 includes a left tension pulley 38L disposed between the drive pulley 37 and the left front driven pulley 39LF, and a right tension pulley 38R disposed between the drive pulley 37 and the right front driven pulley 39RF. The left tension pulley 38L and the right tension pulley 38R have the same structure (same shape and same size).

[0058] In the example diagram, the mounting plate 34 of the lifting mechanism LM is a metal plate on which a rotary motor 35 is mounted, driving pulley 37 and tension pulley 38, and connected by bracket 34a. Figure 10(Refer to) The base plate 5B is fixed to the outer peripheral support member 5. The rotary motor 35 is a drive unit for rotating the drive pulley 37 and is mounted below the mounting plate 34. The conveyor belt 36 is a belt for transmitting the rotational force of the drive pulley 37 to the driven pulley 39. The drive pulley 37 is a member for rotating the driven pulley 39 via the conveyor belt 36. Tension pulleys 38 (left tension pulley 38L and right tension pulley 38R) are members for adjusting the expansion of the conveyor belt 36. The drive pulley 37, left tension pulley 38L and right tension pulley 38R are mounted on the top of the mounting plate 34. The driven pulley 39 is a member for transmitting rotational force to the nut 52 of the support mechanism 50.

[0059] In the example shown, the driven pulleys 39 include a left front driven pulley 39LF fixed to a nut 52 of a left front support mechanism 50LF, a right front driven pulley 39RF fixed to a nut 52 of a right front support mechanism 50RF, a left rear driven pulley 39LB fixed to a nut 52 of a left rear support mechanism 50LB, and a right rear driven pulley 39RB fixed to a nut 52 of a right rear support mechanism 50RB. Specifically, the left rear driven pulley 39LB includes a fixing part and a rotating part that rotates relative to the fixing part. The fixing part clamps the spacer 54 and is fixed to the underside of the base plate 5B of the outer peripheral support member 5. The rotating part is fixed to the lower end of the nut 52 in a manner that rotates integrally with the nut 52. The same applies to the left front driven pulley 39LF, the right front driven pulley 39RF, and the right rear driven pulley 39RB.

[0060] With this configuration, the lifting mechanism LM rotates the drive pulley 37 by rotating the motor 35, thereby enabling the four driven pulleys 39 to rotate simultaneously in the same direction at the same rotational speed. That is, the lifting mechanism LM can cause the respective nuts 52 of the four support mechanisms to rotate simultaneously in the same direction at the same rotational speed. Therefore, the lifting mechanism LM can cause the four corner portions 5N (first corner portion 5N1 to fourth corner portion 5N4) of the top plate portion 5T of the outer peripheral support member 5 to rise and fall at the same speed.

[0061] Furthermore, the height adjustment using the first corner 5N1 of the left front support mechanism 50LF is typically performed with the nuts 52 of the other three support mechanisms 50 (excluding the left front support mechanism 50LF) not rotating. This is to prevent the heights of the other corners 5N from changing due to the height adjustment of the first corner 5N1. The height adjustments using the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB are performed in the same way. Therefore, in the example shown, the lifting mechanism LM is configured to disengage the conveyor belt 36 from the driven pulley 39. Specifically, the lifting mechanism LM is adjusted using the position adjusting bolt BT2 (see reference...). Figure 9(See the diagram below) to adjust the position of the tension pulley 38, specifically by slowing the expansion of the conveyor belt 36 so that the conveyor belt 36 can be removed from the driven pulley 39.

[0062] With this configuration, for example, when adjusting the height of the first corner 5N1 using the left front support mechanism 50LF, the operator can disengage the left front driven pulley 39LF, which is fixed to the conveyor belt 36 by the nut 52 of the left front support mechanism 50LF. Therefore, without rotating the nuts 52 of the other support mechanisms 50, the operator can rotate only the nut 52 of the left front support mechanism 50LF, adjusting only the height of the first corner 5N1 without changing the height of the other corners 5N.

[0063] However, the driven pulley 39 can be configured to switch between a state where the nut 52 and the driven pulley 39 can rotate together (a state where they cannot rotate relative to each other) and a state where the nut 52 and the driven pulley 39 can rotate relative to each other. In this case, the operator can rotate the nut 52 of the remaining support mechanism 50 without disengaging the conveyor belt 36 from the driven pulley 39, without rotating the nuts 52 of the three support mechanisms 50.

[0064] With the configuration described above, the support mechanism 50, which includes four height adjustment mechanisms (HAMs), allows the operator to easily adjust the level of the upper part 5a of the outer peripheral support member 5. Furthermore, the rotation axis AX of the height adjustment mechanism (HAM) (nut 52) ​​of the support mechanism 50 functions as a support axis, thus simplifying the structure compared to configurations where a separate support axis is provided for the rotation axis of the height adjustment mechanism.

[0065] Furthermore, the nuts 51 and 52 constituting the height adjustment mechanism HAM have relatively small diameters (e.g., 12 mm), so they can be standard products (commercially available nuts and bolts). Therefore, this configuration has the effect of improving the height adjustment accuracy using the height adjustment mechanism HAM while suppressing the increase in manufacturing cost of the support mechanism 50.

[0066] In addition, in the above embodiments, the height adjustment mechanism HAM uses a combination of trapezoidal nuts and trapezoidal nuts, but other mechanisms such as ball nuts can be used.

[0067] Furthermore, with the configuration described above, the lifting mechanism LM, for example, has the effect of allowing the operator to raise or lower the outer peripheral support member 5 by utilizing the support mechanism 50 which includes four height adjustment mechanisms HAM.

[0068] Furthermore, in the above-described embodiments, the lifting mechanism LM is configured such that four height adjustment mechanisms HAM can be operated simultaneously using a single rotary motor 35, or it can be configured such that four height adjustment mechanisms HAM can be operated separately using four rotary motors. In this case, the conveyor belt 36, drive pulley 37, tension pulley 38, and driven pulley 39 can be omitted.

[0069] Furthermore, in the above embodiment, the lifting mechanism LM is configured to actuate the height adjustment mechanism HAM using the driven pulley 39, thereby enabling the outer peripheral support member 5 to be raised or lowered. Therefore, this configuration allows the operator to easily change the lifting accuracy of the outer peripheral support member 5. This is because the lifting accuracy can be changed by altering the number of teeth on the driven pulley 39.

[0070] Next, refer to Figure 12 This illustrates an example of the shape and size of the top plate portion 5T of the outer peripheral support member 5 in a top view. Figure 12 This is a top view of the semiconductor chip W mounted on platform 2 and the top plate 5T of the outer peripheral support member 5. Additionally, Figure 12 In the image, for clarity, a dotted pattern is applied to the surface of the semiconductor chip W. Furthermore, Figure 12 In the top view, the size of the push roller 20 is represented by dotted lines, and the contact area CZ (contact area) between the push roller 20, the semiconductor chip W, and the top plate 5T is covered with a cross-linking pattern. Furthermore, in the example shown, the push roller 20 is configured to be able to move along the X-axis while rotating.

[0071] In the example shown, the top plate portion 5T has a roughly rectangular shape when viewed from above, and its width W1 along the direction of the rotation axis (Y-axis) of the push roller 20 is smaller than the width W2 of the push roller 20. However, the width W1 of the top plate portion 5T can be larger than the width W2 of the push roller 20, or it can be the same as the width W2 of the push roller 20.

[0072] Regardless of the position of the push roller 20 in the X-axis direction, this configuration maintains a constant total contact area, consisting of the contact area between the semiconductor chip W and the push roller 20 (first contact area) and the contact area between the top plate portion 5T and the push roller 20 (second contact area). This means that if the pushing force of the push roller 20 is constant, the pushing force per unit contact area within the first contact area can be constant regardless of the position of the push roller 20 in the X-axis direction. Therefore, this configuration allows for the uniform adhesion of a photoresist film 6 or similar film to the semiconductor chip W mounted on the stage 2.

[0073] Furthermore, in the example shown, the top plate portion 5T is configured in a shape that is linearly symmetrical with respect to the dashed line L2 parallel to the X-axis passing through the central axis CA. This configuration, regardless of the position of the push roller 20 in the X-axis direction, achieves the effect of having the same size for a portion of the first contact area (first left-side contact area) located on one side (Y1 side, left side) of the second contact area and the remaining portion of the first contact area (first right-side contact area) located on the other side (Y2 side, right side) of the second contact area. This means that unevenness in the Y-axis direction caused by the pushing force from the push roller 20 can be suppressed. Therefore, this configuration enables the uniform adhesion of a photoresist film 6, etc., to the semiconductor chip W mounted on the stage 2.

[0074] Furthermore, the film bonding device 1 has a roughly rectangular shape when viewed from above the top plate portion 5T. Therefore, compared to the case where the top plate portion has a circular shape when viewed from above, it has the effect of achieving four-point support for the support mechanism 50 while reducing the size of the upper part 5a of the top plate portion 5T. However, the top plate portion 5T can be configured to have a shape other than a roughly rectangular shape when viewed from above (e.g., a circular, hexagonal, or octagonal shape).

[0075] Next, refer to Figure 13 The following describes another example of a lifting support mechanism 25A, which is a lifting support mechanism 25 that raises and lowers the outer peripheral support member 5. Figure 13 This diagram illustrates an example of the configuration of the lifting support mechanism 25A. Specifically, Figure 13 A perspective view of platform 2, outer peripheral support component 5, and lifting support mechanism 25A.

[0076] The lifting support mechanism 25A is similar to the lifting support mechanism 25, including a lifting mechanism LMA for raising and lowering the outer peripheral support member 5 and a support mechanism 50A for providing four-point support to the outer peripheral support member 5.

[0077] The support mechanism 50A differs from the support mechanism 50, which includes a height adjustment mechanism HAM consisting of a linear bushing 51A and a linear shaft 52A, in that it includes a height adjustment mechanism HAM consisting of nuts 51 and 52. The linear bushing 51A is a roll-guided linear motion mechanism, configured such that the relative movement between the linear bushing 51A and the linear shaft 52A is locked via a locking control lever (not shown). In the example shown, the support mechanism 50A includes a left front support mechanism 50ALF for adjusting the height of the first corner 5N1, a right front support mechanism 50ARF for adjusting the height of the second corner 5N2, a right rear support mechanism 50ARB for adjusting the height of the third corner 5N3, and a left rear support mechanism 50ALB for adjusting the height of the fourth corner 5N4. Figure 13 (Not visible in the middle).

[0078] Through such support mechanism 50A, an operator adjusting the height of the outer peripheral support member 5 can, for example, manually move the linear bushing 51A of the height adjustment mechanism HAM in each of the left front support mechanism 50ALF, right front support mechanism 50ARF, left rear support mechanism 50ALB, and right rear support mechanism 50ARB up and down along the linear axis 52A, thereby adjusting the height of each of the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T of the outer peripheral support member 5. In the example shown, the height of the corner 5N is the height relative to the top of the base plate 5B.

[0079] The lifting mechanism LMA utilizes an electric slider ES, unlike the lifting mechanism LM which uses a rotary motor 35. In the example shown, the electric slider ES is configured to move the support arm BA along the X-axis using a stepper motor and a ball screw mechanism. In the base plate 5B of the outer peripheral support member 5, a connecting plate 5P is fixed, and a linear guide LG is fixed to the side of the connecting plate 5P at a predetermined inclination (e.g., a gradient of 1 / 20). Furthermore, a slider SD, which can slide along the linear guide LG, is fixed to the upper end of the support arm BA.

[0080] With this configuration, the lifting mechanism LMA moves the support arm BA in the direction indicated by arrow AR1 (rearward, X2 side) using the electric slider ES, thereby enabling the outer peripheral support member 5 containing the base plate 5B to move in the direction indicated by arrow AR2 (above, Z1 side). The same applies to moving the outer peripheral support member 5 containing the base plate 5B in the opposite direction (below, Z2 side).

[0081] That is, the lifting mechanism LMA moves the support arm BA along the X-axis by using the electric slider ES, thereby enabling the connecting plate 5P and the base plate 5B, which are fixed with the linear guide LG, to move along the Z-axis. Therefore, the lifting mechanism LMA can move the pedestal portion 5D, the outer peripheral wall portion 5W, and the top plate portion 5T, which are fixed to the base plate 5B, along the Z-axis via the support mechanism 50A. Thus, the lifting mechanism LMA can raise and lower the four corner portions 5N (first corner portion 5N1 to fourth corner portion 5N4) of the top plate portion 5T at the same speed.

[0082] With the above-described configuration, the film bonding device 1 equipped with the lifting support mechanism 25A has the same effect as the case equipped with the lifting support mechanism 25. Specifically, the film bonding device 1 equipped with the lifting support mechanism 25A has the effect that the operator can flexibly adjust the level of the upper surface 5a of the outer peripheral support member 5. Furthermore, the film bonding device 1 equipped with the lifting support mechanism 25A has the effect that the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T of the outer peripheral support member 5 can be raised and lowered at the same speed.

[0083] As described above, the semiconductor manufacturing apparatus (film bonding apparatus 1) according to the embodiments of this disclosure is as follows: Figure 1 As shown, the device includes: a platform 2 for placing a semiconductor chip W; a pressing member (pressing roller 20) for pressing the film (photoresist film 6) adhered to the semiconductor chip W placed on the platform 2; an outer peripheral support member 5 disposed on the outer periphery of the platform 2 and configured to be subjected to the pressing force brought by the pressing member (pressing roller 20) when the pressing member (pressing roller 20) presses the film (photoresist film 6); and a support mechanism 50 that supports the outer peripheral support member 5 and can adjust the height of each of the at least three positions that are separated from each other in plan view. Figure 1 In the example shown, the support mechanism 50 includes a left front support mechanism 50LF, a right front support mechanism 50RF, a left rear support mechanism 50LB, and a right rear support mechanism 50RB. Furthermore, each of the left front support mechanism 50LF, right front support mechanism 50RF, left rear support mechanism 50LB, and right rear support mechanism 50RB has a height adjustment mechanism HAM. Additionally, in the example shown, the semiconductor manufacturing apparatus is a film bonding device 1, which is an example of a laminate and can be a mounter for bonding a film to a ring. That is, the peripheral support member 5 supported by the support mechanism 50 can be mounted on the mounter as a member for placing the ring. The features shown below are similarly mounted on the mounter.

[0084] With this configuration, the semiconductor manufacturing apparatus has the effect of eliminating the tilt of the upper surface of the peripheral support member 5. Specifically, the semiconductor manufacturing apparatus has the effect of allowing the operator to adjust the levelness of the upper surface 5a of the peripheral support member 5.

[0085] Furthermore, the semiconductor manufacturing apparatus (film bonding apparatus 1) may include a lifting mechanism LM for raising and lowering the outer peripheral support member 5. In the example shown, the lifting mechanism LM is as follows: Figure 10 and Figure 11 As shown, it is configured with a rotary motor 35, a conveyor belt 36, a drive pulley 37, a tension pulley 38, and a driven pulley 39. However, the lifting mechanism LM can be configured with other mechanical elements such as gears, chains, or wires. Furthermore, the lifting mechanism LM can be omitted. In this case, the operator can adjust the level of the upper surface 5a of the outer peripheral support member 5 using the height adjustment mechanism HAM in each of the left front support mechanism 50LF, right front support mechanism 50RF, left rear support mechanism 50LB, and right rear support mechanism 50RB. Furthermore, the operator can raise and lower the platform 2 so that the semiconductor chip W mounted on the platform 2 is aligned with the upper surface 5a of the outer peripheral support member 5.

[0086] In addition, the outer peripheral support component 5, asFigure 9 As shown, it can have a roughly rectangular shape when viewed from above, and be configured to surround the platform 2. In this case, the height adjustment mechanism HAM can be configured to allow individual adjustment of the height of each of the four corners of the outer peripheral support member 5.

[0087] With this configuration, the semiconductor manufacturing apparatus, for example, even when the peripheral support member 5 is supported at four points by the support mechanism 50, has the effect of eliminating the tilt of the upper part of the peripheral support member 5.

[0088] Furthermore, the lifting mechanism LM can be configured to allow the four corners of the outer peripheral support member 5 to rise and fall simultaneously. In the example shown, the lifting mechanism LM is configured to allow the height adjustment mechanisms HAM of the left front support mechanism 50LF, right front support mechanism 50RF, left rear support mechanism 50LB, and right rear support mechanism 50RB to rise and fall simultaneously.

[0089] With this configuration, the semiconductor manufacturing apparatus can raise and lower the peripheral support member 5 while eliminating the tilt of the upper surface of the peripheral support member 5. Specifically, the semiconductor manufacturing apparatus has the effect of maintaining the horizontality of the upper surface 5a of the peripheral support member 5, allowing the operator to raise and lower the peripheral support member 5.

[0090] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. The above embodiments can be adapted to various modifications and substitutions without departing from the scope of the present invention. Furthermore, the features described with reference to the above embodiments can be appropriately combined as long as they are not technically contradictory.

[0091] This application claims priority based on Japanese Patent Application No. 2023-141612, filed on August 31, 2023, the entire contents of which are incorporated herein by reference.

[0092] Symbol Explanation 1. Membrane bonding device 2 units 2G slot 3. Membrane Supply Section 4. Winding section 5. Outer peripheral support components 5a above 5B base plate 5C side cover 5D pedestal part 5K opening 5N corner 5N1 First corner 5N2, second corner 5N3 Third corner 5N4 4th corner 5P Connector Board 5T Top Plate Section 5W peripheral wall 6 Photoresist film 7. Carrier membrane 8. Reinforced membrane 9 clamping rollers 10 Sliding rod 11 base plate 12 Support Department 13 Exhaust passage 13D tube 13G gap 15 Sliding shaft 16 First moving unit 17. Second moving unit 18 Third moving unit 19 Cut-off Unit 20 push rollers 21. Pushing force adjustment mechanism 22 Pushing cylinder 22a Piston Rod 25, 25A Lifting Support Mechanism 34 mounting pieces 34a bracket 35 Rotary electric motor 36 Conveyor Belts 37 Drive pulley 38 Tension pulley 38L Left side tension pulley 38R Right side tension pulley 39 Driven pulley 39LB Left Rear Driven Pulley 39LF Left Front Driven Pulley 39RB Right Rear Driven Pulley 39RF Right Front Driven Pulley 40 Control Department 41 Input Section 42. Height and Horizontal Storage Section 43. Push Pattern Storage Unit 50, 50A Supporting Organizations 50LB, 50ALB Left Rear Side Support 50LF, 50ALF Left Anterior Support Mechanism 50RB, 50ARB Right Rear Support Mechanism 50RF, 50ARF right front support mechanism 51 Nut 51A Linear Bushing 52 Nuts 52A Linear Axis 53 bearings 54. Isolation materials 80 Hollow Structure 81 Wall section 82 Roof section AX Rotary Axis AX1 First Rotational Axis AX2 Second Rotational Axis AX3 Third Rotational Axis AX4 4th Rotation Axis BA support arm BT bolts BT2 Position Adjustment Bolt CA central axis CF Central Division CN corner CN1 First Corner CN2 2nd corner CN3 Third corner CN4 4th corner CZ range F2 double membrane ES Electric Slider F3 Tri-layer Film HAM Height Adjustment Mechanism LG Linear Boot LM, LMA lifting mechanism SD slider TLM platform lifting mechanism W Semiconductor Chip

Claims

1. A semiconductor manufacturing apparatus comprising: A platform containing semiconductor chips. A pressing member that presses the film attached to the semiconductor chip placed on the stage. An outer peripheral support member is disposed on the outer periphery of the platform and configured to receive the pushing force from the pushing member when the membrane is pressed by the pushing member. A support mechanism that supports the outer peripheral support member at at least three locations that are separated from each other, while allowing the height of each of the at least three locations to be adjusted individually.

2. The semiconductor manufacturing apparatus according to claim 1, It has a lifting mechanism that allows the outer peripheral support member to be raised and lowered.

3. The semiconductor manufacturing apparatus according to claim 2, The outer peripheral support member has a rectangular shape when viewed from above and is configured to surround the platform. The support mechanism has a highly adjustable mechanism. The height adjustment mechanism is configured to adjust the height of each of the four corners of the outer peripheral support member separately.

4. The semiconductor manufacturing apparatus according to claim 3, The lifting mechanism is configured such that the four corners of the outer peripheral support member can be raised and lowered simultaneously.

5. A support mechanism mounted on a semiconductor manufacturing apparatus, the semiconductor manufacturing apparatus comprising: A platform containing semiconductor chips. A pressing member that presses the film attached to the semiconductor chip placed on the stage, and An outer peripheral support member is disposed on the outer periphery of the platform and configured to receive the pushing force from the pushing member when the membrane is pressed by the pushing member. The support mechanism is configured to support the outer peripheral support member at at least three locations that are separated from each other, while the height of each of the at least three locations can be adjusted separately.

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