Liquid injection method of heat exchange plate, heat exchange module and electronic equipment
By employing multiple liquid injections and multi-stage degassing, the problem of gas discharge difficulties in traditional liquid injection technology has been solved, achieving uniform liquid distribution and efficient heat exchange within the heat exchange plate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2026-03-31
AI Technical Summary
Traditional liquid injection techniques make it difficult to expel gas from the flow channels of the heat exchange plate, affecting heat exchange efficiency.
Multiple liquid injection and multi-stage degassing methods are employed, including pressurized liquid injection, heating, water bath heating, and ultrasonic vibration, to ensure that the liquid is evenly distributed in the heat exchange channel and remove gas.
It significantly improves the reliability and heat exchange efficiency of the heat exchange plate and avoids the adverse effects of air bubbles on the heat exchange effect.
Smart Images
Figure CN121754920A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat exchanger liquid injection technology, and more specifically, to a heat exchanger liquid injection method, heat exchange module and electronic device. Background Technology
[0002] The main function of a heat exchanger is to absorb and transfer heat generated by the equipment using liquid circulation. Although existing heat exchangers are designed with fine internal channels to improve heat exchange efficiency, traditional liquid injection techniques make it difficult to expel gas from the channels, which seriously affects the heat exchange efficiency of the heat exchanger. Summary of the Invention
[0003] This application provides a new technical solution for liquid injection method of heat exchanger plate, which can at least solve the problem of low heat exchange efficiency caused by insufficient liquid injection process in existing heat exchanger plates.
[0004] This application also provides a new technical solution for a heat exchange module.
[0005] This application also provides a new technical solution for an electronic device.
[0006] According to a first aspect of this application, a liquid injection method is provided for a heat exchange plate in an electronic product. The heat exchange plate is provided with a heat exchange channel, and the heat exchange channel is provided with an injection port and an outlet port. The liquid injection method includes:
[0007] The first liquid injection is carried out from the injection port into the heat exchange channel to fill the heat exchange channel with liquid;
[0008] The heat exchange plates undergo primary degassing treatment.
[0009] A second liquid injection is performed from the injection port into the heat exchange channel;
[0010] At least one secondary degassing treatment should be performed on the heat exchange plate;
[0011] After each secondary degassing process, heat exchange fluid is added into the heat exchange channel through the injection port to fill the heat exchange channel with liquid.
[0012] Optionally, the primary degassing process involves heating the heat exchange plate.
[0013] Optionally, the primary degassing process involves heating the heat exchange plate using a heat preservation and baking method.
[0014] Optionally, the temperature of the primary degassing treatment is 60°C to 80°C, and the treatment time is 3 to 4 hours.
[0015] Optionally, the secondary degassing treatment involves water bath heating of the heat exchange plate, with the water bath temperature ranging from 50°C to 70°C and the heating time from 1 hour to 2 hours.
[0016] Optionally, the secondary degassing treatment involves ultrasonic vibration treatment of the heat exchange plate, with the ultrasonic vibration treatment frequency being 30kHz to 50kHz, the ultrasonic vibration treatment time being 30min to 60min, and the ultrasonic vibration treatment power being 100w to 300w.
[0017] Optionally, in the first liquid injection, the second liquid injection, and the heat exchange fluid injection, the volume of the injected liquid is greater than the volume of the heat exchange channel.
[0018] Optionally, the injection method further includes:
[0019] Before the heat exchange fluid is injected into the heat exchange channel, the heat exchange fluid is degassed.
[0020] Optionally, the liquid degassing process involves heating and / or depressurizing the heat exchange fluid to boiling.
[0021] Optionally, the injection method further includes:
[0022] Before performing the primary degassing process and the secondary degassing process, the sealing plug is used to seal and fix the inlet and outlet, so that the liquid is closed in the heat exchange channel;
[0023] Remove the sealing plug before the second liquid or heat exchange fluid is added.
[0024] Optionally, when performing the heat exchange fluid injection process, the injection flow rate of the heat exchange fluid is 2 ml / s to 3 ml / s.
[0025] Optionally, in the first liquid injection and / or the second liquid injection process, the liquid injected is a heat exchange fluid.
[0026] According to a second aspect of this application, a heat exchange module is provided, characterized in that it includes a heat exchange plate, wherein the heat exchange plate is a heat exchange plate obtained by liquid injection using any of the above-described liquid injection methods.
[0027] According to a third aspect of this application, an electronic device is provided, including the heat exchange module described above.
[0028] According to the liquid injection method of the heat exchange plate of this application, by injecting liquid into the heat exchange plate multiple times and degassing in multiple stages, the liquid is uniformly distributed in the heat exchange channel, and the gas in the heat exchange channel is effectively removed. This effectively avoids the presence of bubbles in the heat exchange channel and eliminates the adverse effects of bubbles on the heat exchange effect, thereby significantly improving the reliability and heat exchange efficiency of the heat exchange plate.
[0029] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description
[0030] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.
[0031] Figure 1 This is a flowchart of an injection method according to an embodiment provided in this application. Detailed Implementation
[0032] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present application.
[0033] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.
[0034] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.
[0035] In all the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.
[0036] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
[0037] An embodiment of this application provides a heat exchange plate, which is mainly used in electronic devices. The heat exchange plate has a heat exchange channel with a first liquid inlet and a second liquid inlet. The first liquid inlet is adapted to communicate with the liquid inlet of a micropump, and the second liquid inlet is adapted to connect with the liquid outlet of the micropump to form a circulation loop. The heat exchange channel also has an injection port and a discharge port, wherein the injection port is used to inject liquid into the heat exchange channel, and the discharge port is used to discharge gas and excess liquid from the heat exchange channel.
[0038] Specifically, the heat exchange plate is made of polymer material membranes stacked together. The connection between the polymer material membranes is by bonding or hot pressing, etc. The connection points will form unnecessary protrusions on the inside of the heat exchange channel. These protrusions will cause some tiny bubbles to be generated in the heat exchange channel when liquid is injected into the heat exchange plate.
[0039] Based on this, embodiments of this application also provide a liquid injection method, which allows liquid to be injected into the heat exchange plate in the above embodiments, such as... Figure 1As shown, the injection method includes: S100 to S500.
[0040] S100. The first liquid injection is carried out from the injection port into the heat exchange channel to fill the heat exchange channel with liquid.
[0041] Specifically, the first liquid injection is performed into the heat exchange channel through the injection port using either pressurized injection or vacuum injection methods. When using pressurized injection, increasing the pressure accelerates the liquid flow rate, thereby shortening the injection time and improving injection efficiency. Simultaneously, adjusting the pressure allows for precise control of the injection speed and flow rate, promoting uniform liquid distribution within the heat exchange channel and reducing the formation of air columns or bubbles. When using vacuum injection, the vacuum effectively removes air from the heat exchange channel, creating a negative pressure environment that allows the liquid to flow smoothly into the channel. This also reduces the formation of air columns or bubbles, ensuring uniform liquid distribution within the heat exchange channel.
[0042] S200, Perform primary degassing treatment on the heat exchange plate.
[0043] In detail, after the first liquid filling is completed, the heat exchange plate can be subjected to a primary degassing process. This primary degassing process can gather the gas inside the heat exchange plate together. For example, the air bubbles dispersed in the liquid in the heat exchange channel can be gathered at one or more points in the heat exchange channel to form an air column or to gather into larger air bubbles, which is beneficial for the subsequent discharge of the air column and air bubbles.
[0044] S300, A second liquid injection is carried out from the injection port into the heat exchange channel.
[0045] Specifically, after the first-stage degassing process is completed, a second liquid injection is carried out from the injection port into the heat exchange channel using a pressurized liquid injection method. During the second liquid injection process, the injected liquid can push the gas column and larger bubbles in the heat exchange channel out from the outlet, thereby allowing the liquid to fill the space where the gas column and bubbles were previously located.
[0046] S400, the heat exchange plate must undergo at least one secondary degassing treatment;
[0047] S500: After each secondary degassing process, heat exchange fluid is added to the heat exchange channel through the injection port to fill the heat exchange channel with liquid.
[0048] In other words, after the second liquid injection, the heat exchanger still contains some tiny air bubbles. Therefore, it can undergo primary or secondary degassing. Secondary degassing can collect the tiny air bubbles in the heat exchange channel and form larger bubbles. After each secondary degassing process, liquid is injected into the heat exchange channel through the injection port using a pressurized injection method. This allows the air bubbles collected during the secondary degassing process to be discharged through the outlet, ensuring that the liquid fills the entire heat exchange channel and thus guaranteeing the heat exchange efficiency of the heat exchanger.
[0049] Therefore, according to the liquid injection method of this application, by injecting liquid into the heat exchange plate multiple times and degassing in multiple stages, the liquid is evenly distributed in the heat exchange channel, and the gas in the heat exchange channel is effectively removed. This effectively avoids the presence of bubbles in the heat exchange channel and eliminates the adverse effects of bubbles on the heat exchange effect, thereby significantly improving the reliability and heat exchange efficiency of the heat exchange plate.
[0050] In some embodiments of this application, the primary degassing process involves heating the heat exchange plate.
[0051] In other words, one method to achieve primary degassing is to heat the heat exchange plate using a heating device. During heating, the heat exchange plate is placed vertically. As the heat is applied, the bubbles in the heat exchange channel expand, increasing their buoyancy and causing them to move upwards and converge. Simultaneously, the heating of the liquid reduces the solubility of the gas within it, further promoting the release and upward movement of the bubbles. This allows the bubbles to be effectively collected at the top of the heat exchange channel, thus completing the primary degassing process.
[0052] In this embodiment, the heat exchange plate is subjected to primary degassing by heating. This method is applicable to batch degassing operations and can effectively improve the degassing efficiency.
[0053] According to one embodiment of this application, the primary degassing process involves heating the heat exchange plate using a heat preservation and baking method.
[0054] This embodiment uses a heat preservation and baking method to perform primary degassing treatment on the heat exchange plate, which can ensure that the temperature of the heat exchange plate is uniform during the heating process. Through uniform heat transfer, the problems of local overheating or uneven heating can be reduced, the degassing process is optimized, the degassing rate is improved, and thus the number of subsequent degassing times can be effectively reduced.
[0055] In some embodiments of this application, the temperature of the primary degassing treatment is 60°C to 80°C, and the treatment time is 3 to 4 hours. Within this range, air inside the heat exchange plate can be effectively discharged. When the heat exchange plate is formed from a polymer material membrane, within this range, air in the polymer material membrane and in the adhesive at the joints of the heat exchange plate can be effectively discharged, while ensuring that the heat exchange plate does not deform.
[0056] Optionally, during the primary degassing process, the heating temperature can be controlled between 60°C and 80°C, such as 60°C, 65°C, 70°C, 75°C, and 80°C, while the heating time can be set to 3 hours to 4 hours, such as 3 hours, 3.5 hours, and 4 hours.
[0057] According to one embodiment of this application, the secondary degassing process involves heating the heat exchange plate in a water bath at a temperature of 50°C to 70°C for 1 hour to 2 hours.
[0058] In other words, to prevent external gases from entering the heat exchange channel through the polymer membrane during heating, this embodiment employs a water bath heating method for secondary degassing of the heat exchange plate. Since the heat exchange plate is completely submerged in water, this not only prevents the penetration of external gases but also ensures the uniformity of heating. This uniform heating environment helps to gather tiny bubbles and dissolved gases within the heat exchange plate, thereby optimizing the degassing process and improving degassing efficiency. This effectively reduces the number of subsequent degassing operations required, while also improving the liquid injection efficiency and quality of the heat exchange plate.
[0059] During secondary degassing, the water bath heating temperature can be controlled between 50℃ and 80℃, for example, 50℃, 55℃, 60℃, 65℃, 70℃, 75℃, and 80℃, while the heating time can be set to 1 hour to 2 hours, for example, 1 hour, 1.5 hours, and 2 hours. Under these conditions, it is beneficial to collect the tiny bubbles and dissolved gases within the heat exchange plate while ensuring that the heat exchange plate does not deform.
[0060] In some embodiments of this application, the secondary degassing process involves ultrasonic vibration treatment of the heat exchange plate, with the ultrasonic vibration treatment frequency being 30kHz to 50kHz, the ultrasonic vibration treatment time being 30min to 60min, and the ultrasonic vibration treatment power being 100W to 300W.
[0061] In other words, another method to achieve degassing is to treat the heat exchange plate with ultrasonic vibration, which can prevent external gas from entering the heat exchange channel and remove tiny air bubbles inside the heat exchange plate, making it easier for the bubbles to be expelled during subsequent liquid injection.
[0062] During secondary degassing, the frequency of ultrasonic vibration treatment can be controlled between 30kHz and 50kHz, for example, 30kHz, 35kHz, 40kHz, 45kHz, and 50kHz, while the treatment time can be controlled between 30min and 60min, for example, 30min, 40min, 50min, and 60min. Under these conditions, it is beneficial to collect tiny bubbles and dissolved gases within the heat exchange plate while ensuring effective degassing.
[0063] Furthermore, the power of ultrasonic vibration treatment can be controlled between 100W and 300W, for example, 100W, 200W and 300W.
[0064] According to one embodiment of this application, in the first liquid injection, the second liquid injection, and the heat exchange fluid injection, the volume of the injected liquid is greater than the volume of the heat exchange channel.
[0065] Specifically, when performing the first and second liquid injections and the heat exchange fluid injection, ensure that the volume of the liquid added exceeds the volume of the heat exchange channel. This ensures that the heat exchange channel is occupied by liquid, which is beneficial for venting the gas inside the heat exchange plate during the liquid injection process and can effectively reduce the number of liquid injections and degassing operations.
[0066] In some optional examples of this application, the heat exchange plate is connected to a micropump before liquid injection, and the micropump is connected to the heat exchange channel to form a circulation path. Ensuring that the volume of liquid injected exceeds the volume of the circulation path during the first and second liquid injections, as well as the heat exchange fluid injection, ensures that the circulation path is occupied by liquid, which facilitates the removal of gas during the injection process and effectively reduces the number of injection and degassing operations.
[0067] In some embodiments of this application, the liquid injection method further includes: performing liquid degassing treatment on the heat exchange liquid before injecting it into the heat exchange channel.
[0068] In other words, pre-treatment of the heat exchange fluid before it enters the heat exchange channel ensures that the injected heat exchange fluid is as pure as possible, free of any bubbles or dissolved gases, thereby avoiding the negative impact of gases on heat transfer efficiency during the heat exchange process.
[0069] According to one embodiment of this application, liquid degassing involves heating and / or depressurizing the heat exchange fluid to boiling.
[0070] In other words, methods for liquid degassing include, but are not limited to, the following:
[0071] Scenario 1: Heat the heat exchange fluid to boiling to expel the dissolved gases in the heat exchange fluid;
[0072] Scenario 2: While heating the heat exchange fluid, a vacuum is drawn in the environment of the heat exchange fluid to make the heat exchange fluid under negative pressure. This can lower the boiling point of the heat exchange fluid and effectively prevent gas from merging into the heat exchange fluid, thus effectively improving the degassing effect.
[0073] Scenario 3: Directly evacuate the environment of the heat exchange fluid, for example, to below 0.1 bar, so that the heat exchange fluid can boil at room temperature, thereby effectively preventing gas from merging into the heat exchange fluid and significantly improving the degassing effect.
[0074] In some embodiments of this application, the liquid injection method further includes: sealing the injection port and outlet with a sealing plug before performing primary degassing and secondary degassing, so that the liquid is closed in the heat exchange channel; and removing the sealing plug when performing the second liquid injection or heat exchange liquid injection.
[0075] In other words, before the primary degassing process, sealing the inlet and outlet with a sealing plug ensures the liquid is completely enclosed within the heat exchange channel, preventing leakage during degassing and preventing outside gas from entering the channel. When adding liquid for the second time, simply remove the sealing plug. Similarly, before the secondary degassing process, the same method can be used to seal the liquid with a sealing plug to prevent liquid loss during degassing and to prevent outside gas from entering the channel. After the final injection of heat exchange fluid, the sealing plug can be retained to maintain a sealed liquid environment within the heat exchange channel.
[0076] In some optional examples of this application, the sealing plug is made of polymer material, and when sealing the injection port and discharge port, the sealing plug can be fixed by means of thermal bonding, ultrasonic welding or other methods.
[0077] According to one embodiment of this application, during the heat exchange fluid filling process, the filling flow rate of the heat exchange fluid is 2 ml / s to 3 ml / s.
[0078] In this embodiment, the heat exchange fluid flow rate is maintained between 2 ml / s and 3 ml / s, for example, 2 ml / s, 2.5 ml / s and 3 ml / s. Within this range, the efficiency of the injection process can be ensured, avoiding the impact on product production efficiency due to insufficient flow rate, while also preventing the generation of bubbles due to excessive flow rate, thereby reducing the number of subsequent injections and degassing.
[0079] In some embodiments of this application, the liquid added in the first liquid addition and / or the second liquid addition process is a heat exchange fluid.
[0080] In other words, the liquid used for both the first and second liquid additions can be the heat exchange fluid. This ensures that the heat exchange fluid does not mix with other types of liquids throughout the entire addition process, thus avoiding potential adverse effects on heat exchange performance and reducing the number of liquid additions.
[0081] In summary, the liquid injection method of this application achieves uniform distribution of liquid in the heat exchange channel by injecting liquid multiple times and degassing in multiple stages, effectively removes gas in the heat exchange channel, effectively avoids the presence of air bubbles in the heat exchange channel, eliminates the adverse effects of air bubbles on the heat exchange effect, and thus significantly improves the reliability and heat exchange efficiency of the heat exchange plate.
[0082] This application also provides a heat exchange module, including a heat exchange plate and a micropump, wherein the heat exchange plate is a heat exchange plate obtained by liquid injection using the liquid injection method described in any of the above embodiments. Since the liquid injection method according to the embodiments of this application has the above-mentioned technical effects, the heat exchange module according to the embodiments of this application also has corresponding technical effects, which will not be repeated in this embodiment.
[0083] Embodiments of this application also provide an electronic device, including the heat exchange module described in the above embodiments. Since the liquid injection method according to the embodiments of this application has the above-described technical effects, the electronic device according to the embodiments of this application also has corresponding technical effects, which will not be repeated in this embodiment.
[0084] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.
Claims
1. A liquid injection method for a heat exchange plate of an electronic product, characterized by, The heat exchange plate is provided with a heat exchange channel, the heat exchange channel is provided with an injection port and a discharge port, and the liquid injection method comprises the following steps: First liquid injection is performed from the injection port into the heat exchange channel to fill the heat exchange channel with liquid; Primary degassing treatment is performed on the heat exchange plate; Second liquid injection is performed from the injection port into the heat exchange channel; Secondary degassing treatment is performed at least once on the heat exchange plate; After each secondary degassing treatment, heat exchange liquid is injected from the injection port into the heat exchange channel to fill the heat exchange channel with liquid.
2. The liquid injection method according to claim 1, wherein The primary degassing treatment is heating the heat exchange plate.
3. The liquid injection method according to claim 2, wherein The primary degassing treatment is heating the heat exchange plate by heat preservation baking.
4. The liquid injection method according to claim 2, wherein The temperature of the primary degassing treatment is 60-80℃, and the treatment time is 3-4h.
5. The liquid injection method according to claim 1, wherein The secondary degassing treatment is water bath heating of the heat exchange plate, the temperature of the water bath heating is 50-70℃, and the heating time is 1-2h.
6. The liquid casting method according to claim 1, wherein The secondary degassing treatment is ultrasonic vibration treatment of the heat exchange plate, the frequency of the ultrasonic vibration treatment is 30-50kHz, the time of the ultrasonic vibration treatment is 30-60min, and the power of the ultrasonic vibration treatment is 100-300w.
7. The liquid casting method according to claim 1, wherein In the first liquid injection, the second liquid injection, and the heat exchange liquid injection, the volume of the injected liquid is greater than the volume of the heat exchange channel.
8. The liquid casting method according to claim 1, wherein The liquid injection method further comprises: Before the heat exchange liquid is injected into the heat exchange channel, liquid degassing treatment is performed on the heat exchange liquid.
9. The liquid injection method according to claim 8, wherein The liquid degassing treatment is heating and / or reducing the pressure of the heat exchange liquid to boiling.
10. The liquid casting method according to claim 1, wherein The liquid injection method further comprises: Before the primary degassing treatment and the secondary degassing treatment are performed, a sealing plug is used to seal and fix the injection port and the discharge port, so that the liquid is sealed in the heat exchange channel; When the second liquid injection or the heat exchange liquid injection is performed, the sealing plug is removed.
11. The liquid casting method according to claim 1, wherein When the heat exchange liquid injection process is performed, the injection flow rate of the heat exchange liquid is 2-3ml / s.
12. The liquid casting method according to claim 1, wherein In the first liquid injection and / or the second liquid injection process, the injected liquid is heat exchange liquid.
13. A heat exchange module, characterized by The heat exchange module comprises the heat exchange plate obtained by the liquid injection method according to any one of claims 1-12.
14. An electronic device, comprising: The heat exchange module comprises the heat exchange plate obtained by the liquid injection method according to any one of claims 1-12.