Liquid cooling plate flow channel design method and device, storage medium and electronic equipment
By designing multiple reciprocating flow channels on the liquid cooling plate and performing topology optimization, the problems of uneven heat dissipation and narrow space in consumer electronics products are solved, achieving more efficient heat dissipation and temperature uniformity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2026-03-31
AI Technical Summary
Existing liquid cooling plate designs cannot effectively dissipate heat in consumer electronics, especially due to limited space and uneven heat generation leading to localized overheating and low heat dissipation efficiency.
The design incorporates heat exchange channels that travel between the heating zone and other zones multiple times, and optimizes the channel topology to improve channel distribution, thereby increasing the flow rate and temperature uniformity of the cold fluid.
It improves heat dissipation efficiency and temperature uniformity of the liquid cooling plate, thereby enhancing the heat dissipation effect of electronic products.
Smart Images
Figure CN121765879A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology, and more specifically, to a liquid cooling plate flow channel design method, a liquid cooling plate flow channel design device, a storage medium, and an electronic device. Background Technology
[0002] As people's demands for the performance of consumer electronics products continue to increase, heat dissipation has gradually become a key concern. Traditional heat dissipation technology involves designing flow channels on a liquid cooling plate, where the flow of fluid carries away the heat from the heat-generating areas of the electronic product.
[0003] Consumer electronics products are inherently limited by space constraints, thin heat exchange plates, and limited design space, which prevents existing liquid cooling plate designs from achieving effective heat dissipation. Furthermore, consumer electronics exhibit significant uneven heat generation; due to the different heat characteristics of different functional areas, some areas generate extremely high amounts of heat while others remain almost unheated. This limits effective heat transfer, resulting in low heat dissipation efficiency and making the products prone to localized overheating. Therefore, it is necessary to improve the heat dissipation devices used in consumer electronics to meet their specific cooling requirements. Summary of the Invention
[0004] This application provides a liquid cooling plate flow channel design method, a liquid cooling plate flow channel design device, a storage medium, and an electronic device. The target flow channel distribution designed by the method of this application embodiment can adapt to the heat dissipation requirements of electronic products and improve the temperature uniformity of the liquid cooling plate.
[0005] Firstly, this embodiment provides a liquid cooling plate flow channel design method, including:
[0006] The first flow channel distribution of the liquid cooling plate is obtained, wherein the heat exchange channels in the first flow channel distribution repeatedly travel back and forth between the heat-generating area of the electronic product and other areas different from the heat-generating area.
[0007] Based on the first flow channel distribution, determine the initial design domain of the flow channel topology optimization model;
[0008] Topology optimization is performed on the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate.
[0009] Optionally, determining the initial design domain of the flow channel topology optimization model based on the first flow channel distribution includes:
[0010] Obtain at least one sub-channel distribution in the first channel distribution, wherein the heat exchange channel in the sub-channel distribution completes one round trip between the heating zone and the other zones;
[0011] The first region corresponding to the sub-channel distribution is taken as the initial design domain.
[0012] Optionally, determining the initial design domain of the flow channel topology optimization model based on the first flow channel distribution includes:
[0013] Based on the performance results corresponding to the first flow channel distribution, determine all or part of the area of the first flow channel distribution as the initial design domain; wherein, the performance results are the results of the performance indicators indicated by the design requirements.
[0014] Optionally, determining, based on the performance results corresponding to the first flow channel distribution, to use all or part of the region of the first flow channel distribution as the initial design domain includes:
[0015] Obtain the performance results corresponding to at least one sub-channel distribution in the first channel distribution, wherein the heat exchange channel in the sub-channel distribution completes one round trip between the heating zone and the other zones;
[0016] If the performance results corresponding to the sub-channel distribution indicate that the performance of the sub-channel distribution does not meet the design requirements, then the first region corresponding to the sub-channel distribution is determined as the initial design domain.
[0017] Optionally, the initial design domain is a partial region of the first flow channel distribution, and the step of performing topology optimization on the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate includes:
[0018] Topology optimization is performed on the flow channel distribution corresponding to the initial design domain to obtain the second flow channel distribution;
[0019] The target flow channel distribution is obtained by splicing together the other flow channel distributions outside the specified area in the first flow channel distribution with the second flow channel distribution.
[0020] Optionally, determining the initial design domain of the flow channel topology optimization model based on the first flow channel distribution includes:
[0021] Obtain the second region corresponding to the location of the heat source in the first flow channel distribution;
[0022] The second region is used as the initial design domain.
[0023] Optionally, determining the initial design domain of the flow channel topology optimization model based on the first flow channel distribution includes:
[0024] Obtain a third region in the first flow channel distribution, wherein the third region is the region in the first flow channel distribution excluding the bend flow channel region;
[0025] The third region is used as the initial design domain.
[0026] Optionally, the number of round trips in the heat exchange channel is determined by the following steps:
[0027] Obtain the thickness of the heat exchange channel and the dimensions of the heating zone;
[0028] The width of the heat exchange channel is determined based on its thickness.
[0029] The number of round trips of the heat exchange channel is determined based on the width of the heat exchange channel and the size of the heating zone.
[0030] Optionally, determining the width of the heat exchange channel based on its thickness includes:
[0031] Obtain the mapping relationship between channel thickness and channel width;
[0032] The width of the heat exchange channel is determined based on the thickness of the heat exchange channel and the mapping relationship.
[0033] Optionally, the step of performing topology optimization on the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate includes:
[0034] Obtain an objective function, which includes any one of a heat transfer objective function, a flow objective function, and a coupling objective function. The coupling objective function is the objective function obtained by coupling the heat transfer objective function and the flow objective function. The heat transfer objective function is determined based on at least one of the ambient temperature and the heat generation coefficient of the heat source corresponding to the liquid cooling plate. The flow objective function is determined based on at least one of the first fluid flow velocity corresponding to each grid in the flow channel distribution and the fluid domain proportion corresponding to each grid. The first fluid flow velocity includes horizontal velocity and vertical velocity.
[0035] Based on the value of the objective function, topology optimization is performed on the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate.
[0036] Secondly, this embodiment provides a liquid-cooled plate flow channel design device, including:
[0037] The acquisition module is used to acquire the first flow channel distribution of the liquid cooling plate, wherein the heat exchange channels in the first flow channel distribution repeatedly travel back and forth between the heating zone of the liquid cooling plate and other zones different from the heating zone;
[0038] The first determining module is used to determine the initial design domain of the flow channel topology optimization model based on the first flow channel distribution.
[0039] The second determining module is used to perform topology optimization on the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate.
[0040] Thirdly, this embodiment provides a storage medium having a computer program stored thereon, which, when executed by a processor, implements the method as described in any one of the first aspects of this application.
[0041] Fourthly, this embodiment provides an electronic device, including a memory and a processor, wherein the memory is used to store computer instructions, and the processor is used to invoke the computer instructions from the memory to perform the method as described in any one of the first aspects of this application.
[0042] This application first designs heat exchange channels that repeatedly travel between the heat-generating area and other areas of the electronic product to increase the amount of cold fluid passing through the heat-generating area, thereby improving heat dissipation efficiency. Furthermore, based on the channel distribution corresponding to the aforementioned heat exchange channels that repeatedly travel between the heat-generating area and other areas, an initial design domain is determined, and the channel distribution is further optimized in topology. This further improves heat dissipation efficiency while also enhancing the temperature uniformity of the liquid cooling plate.
[0043] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description
[0044] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.
[0045] Figure 1 A schematic diagram of a heat exchange channel that travels back and forth between the heating zone and other zones multiple times, as provided in an embodiment of this application, is shown.
[0046] Figure 2 A schematic flowchart of the liquid cooling plate flow channel design method provided in the embodiments of this application is shown.
[0047] Figure 3 A schematic diagram of the sub-channel distribution provided in an embodiment of this application is shown.
[0048] Figure 4 A schematic diagram of the first flow channel distribution provided in an embodiment of this application is shown.
[0049] Figure 5 A schematic block diagram of the liquid cooling plate flow channel design device provided in an embodiment of this application is shown.
[0050] Figure 6 A schematic block diagram of an electronic device provided in an embodiment of this application is shown. Detailed Implementation
[0051] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present application.
[0052] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.
[0053] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.
[0054] In all the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.
[0055] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
[0056] As people's demands for the performance of consumer electronics products continue to increase, heat dissipation has gradually become a key concern. Traditional heat dissipation technology involves designing flow channels on a liquid cooling plate, where the flow of fluid carries away the heat from the heat-generating areas of the electronic product (i.e., the area within a defined range of the product's heat source).
[0057] However, consumer electronics are limited by space constraints, thin heat exchange plates, and limited design space, which prevents existing liquid cooling plate designs from achieving effective heat dissipation. Furthermore, consumer electronics exhibit significant uneven heat generation; due to different heat dissipation characteristics in different functional areas, some areas generate extremely high heat while others remain almost unheated. This limits effective heat transfer, resulting in low heat dissipation efficiency and making the products prone to localized overheating. Therefore, it is necessary to improve the heat dissipation devices used in consumer electronics to meet their specific heat dissipation requirements.
[0058] The applicant's research revealed that existing flow channels only make one round trip between the heating zone and other zones (i.e., non-heating zones). In this way, fluid flows from the flow channel inlet into other zones via the pump, then into the heating zone, and returns from the heating zone to other zones, finally flowing back to the pump through the flow channel outlet. Alternatively, the fluid flows from the flow channel inlet into the heating zone, then into other zones, and returns from other zones to the heating zone, finally flowing back to the micropump through the flow channel outlet. These flow channel structures are simple and easy to manufacture. However, liquid cooling plates using these flow channel structures suffer from poor heat dissipation due to the limited fluid flow rate within the flow channels.
[0059] Based on this, the embodiments of this application first design a heat exchange channel that travels back and forth between the heat-generating area and other areas of the electronic product multiple times. Each time the channel travels back and forth between the heat-generating area and other areas, the fluid flow rate from other areas into the heat-generating area at the same time increases many times over. Because the amount of cold fluid entering the heat-generating area at the same time is greatly increased, the heat dissipation efficiency is greatly improved.
[0060] For ease of understanding, Figure 1 A simplified schematic diagram of the flow channel is shown. Figure 1 The entire area is schematically divided into heating zone A and other zones B by line l. The flow channel enclosed by the dashed box travels back and forth once between heating zone A and other zones B, and three times throughout the entire area. It should be noted that line l is only for illustration and does not exist in the actual flow channel distribution.
[0061] This application embodiment significantly improves heat dissipation efficiency by using a heat exchange channel that repeatedly travels between the heat-generating area and other areas of the electronic product. However, the multiple-travel channel contains several bends, and the flow resistance at these bends is significant, which affects heat dissipation efficiency to some extent. Therefore, this application embodiment, based on the multiple-travel design to obtain the first channel distribution, further optimizes the topology of the first channel distribution to further improve heat dissipation efficiency.
[0062] like Figure 2 As shown, the liquid cooling plate flow channel design method of this application embodiment may include steps S110 to S130.
[0063] Step S110: Obtain the first flow channel distribution of the liquid cooling plate. The heat exchange channels in the first flow channel distribution repeatedly travel between the heat-generating area of the electronic product and other areas different from the heat-generating area.
[0064] Step S120: Determine the initial design domain of the flow channel topology optimization model based on the first flow channel distribution.
[0065] Step S130: Perform topology optimization on the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate.
[0066] The first channel distribution characterizes the path of fluid flow. As an example, Figure 3 A partial schematic diagram of the first flow channel distribution is shown, in which the region C with a material density value of 1 is the fluid region and forms the flow channel.
[0067] In this embodiment, the entire region corresponding to the first flow channel distribution can be used as the initial design domain for topology optimization, or a portion of the region corresponding to the first flow channel distribution can be used as the initial design domain for topology optimization. Topology optimization can be performed on the entire region corresponding to the first flow channel distribution all at once, or on a portion of the region corresponding to the first flow channel distribution in multiple stages. Performing topology optimization on a portion of the region corresponding to the first flow channel distribution in multiple stages can, to some extent, reduce resource occupancy at the same time and improve optimization efficiency.
[0068] This application first designs heat exchange channels that repeatedly travel between the heat-generating area and other areas of the electronic product to increase the amount of cold fluid passing through the heat-generating area, thereby improving heat dissipation efficiency. Furthermore, based on the channel distribution corresponding to the aforementioned heat exchange channels that repeatedly travel between the heat-generating area and other areas, an initial design domain is determined, and the channel distribution is further optimized in topology. This further improves heat dissipation efficiency while also enhancing the temperature uniformity of the liquid cooling plate.
[0069] Optionally, step S120 may include steps S121 to S122.
[0070] Step S121: Obtain at least one sub-channel distribution in the first channel distribution, wherein the heat exchange channel in the sub-channel distribution completes one round trip between the heat-generating area and other areas of the electronic product.
[0071] Step S122: Take the first region corresponding to the sub-channel distribution as the initial design domain.
[0072] The first flow channel distribution includes multiple sub-flow channel distributions. The region corresponding to each sub-flow channel distribution can be used as an initial design domain. For example, the sub-flow channel distribution... Figure 2 The flow channel distribution corresponding to region C in the middle. In this embodiment, the target flow channel distribution can be obtained by performing topology optimization based on only the region corresponding to one of the sub-flow channel distributions, or by performing topology optimization based on the region corresponding to each of the partial sub-flow channel distributions of multiple sub-flow channel distributions, or by performing topology optimization based on the region corresponding to each of the entire sub-flow channel distributions of multiple sub-flow channel distributions.
[0073] by Figure 4Taking the first flow channel distribution shown as an example, the first flow channel distribution includes three sub-flow channel distributions, corresponding to regions C1, C2, and C3, respectively. The target flow channel distribution can be obtained by performing topology optimization based on any one of regions C1, C2, and C3, or by performing topology optimization based on any two of regions C1, C2, and C3, or by performing topology optimization based on regions C1, C2, and C3 respectively.
[0074] The process of performing topology optimization based on the initial design domain corresponding to each sub-channel distribution can be completed in a parallel process or in a serial process.
[0075] In some embodiments, an importance level can be set for the sub-regions corresponding to the first flow channel distribution, and regions with higher importance levels can be preferentially selected as the initial design domain.
[0076] Considering that the area corresponding to the heat source location experiences severe heat generation, this area can be prioritized for optimization and selected as the initial design domain. Optionally, step S120 may include steps S123 to S124.
[0077] Step S123: Obtain the second region corresponding to the heat source location in the first flow channel distribution.
[0078] Step S124: The second region corresponding to the heat source location is taken as the initial design domain.
[0079] In this embodiment, the first flow channel distribution may include multiple second regions. Each second region can be used as an initial design domain. A heat source can be understood as any heat-generating electronic device in an electronic product. The second region can be a region within a defined range centered on the heat source location, or it can be the region where the heat source location is located.
[0080] For certain special areas that still cannot meet the design requirements after multiple optimizations, these special areas can be treated as secondary optimization targets, and the area in the first flow channel distribution area excluding these special areas can be used as the initial design domain. These special areas may include, for example, the bends in the flow channel. Optionally, step S120 may include steps S125 to S126.
[0081] Step S125: Obtain the third region in the first flow channel distribution, wherein the third region is the region in the first flow channel distribution excluding the bend flow channel region.
[0082] Step S126: Use the third region as the initial design domain.
[0083] In some embodiments, step S120 may further include step S210.
[0084] Step S210: Based on the performance results corresponding to the first flow channel distribution, determine whether all or part of the first flow channel distribution is used as the initial design domain; wherein, the performance results are the results of the performance indicators indicated by the design requirements.
[0085] In this embodiment, performance results corresponding to the first flow channel distribution can be obtained, such as one or more of heat transfer efficiency, flow rate, and pressure drop. The performance results are analyzed to determine whether the entire area of the first flow channel distribution should be used as the initial design domain. As an example, the first flow channel distribution can be input into simulation software for simulation to obtain its corresponding performance results. If the performance results indicate that the performance of all areas of the first flow channel distribution does not meet the design requirements, the entire area corresponding to the first flow channel distribution is used as the initial design domain. If the performance results indicate that the performance of some areas of the first flow channel distribution does not meet the design requirements, those areas are used as the initial design domain.
[0086] This embodiment determines whether to perform topology optimization on all regions based on the performance results corresponding to the flow channel distribution. If the performance results of some regions meet the design requirements, topology optimization is not performed, which can minimize the waste of computing resources.
[0087] Optionally, step S210 may include steps S211 to S212.
[0088] Step S211: Obtain the performance results corresponding to at least one sub-channel distribution in the first flow channel distribution, wherein the heat exchange channel in the sub-channel distribution completes one round trip between the heating zone and other zones.
[0089] Step S212: If the performance results corresponding to the sub-channel distribution do not meet the design requirements, the first region corresponding to the sub-channel distribution is determined as the initial design domain.
[0090] In this embodiment, the performance results corresponding to each sub-channel distribution can be detected separately. If the performance of the sub-channel distribution does not meet the design requirements, the first region corresponding to the sub-channel distribution can be used as the initial design domain for multiple topology optimizations.
[0091] When the initial design domain is a partial area of the first flow channel distribution, step S130 of this application embodiment may include steps S131 to S132.
[0092] Step S131: Perform topology optimization on the flow channel distribution corresponding to the initial design domain to obtain the second flow channel distribution.
[0093] Step S132: Combine the other flow channel distributions outside the aforementioned partial area in the first flow channel distribution with the second flow channel distribution to obtain the target flow channel distribution.
[0094] In this embodiment, before performing topology optimization on a portion of the first flow channel distribution, boundary conditions, such as the inlet and outlet of the flow channels, need to be set. This allows the second flow channel distribution obtained through topology optimization to be joined with other flow channel distributions outside the portion of the first flow channel distribution via these inlets and outlets, thus obtaining the target flow channel distribution. After parallel topology optimization, when multiple second flow channel distributions are obtained, each second flow channel distribution can be joined with other flow channel distributions outside the specified portion of the first flow channel distribution.
[0095] Of course, in some embodiments, the second flow channel distribution can also directly cover part of the area before topology optimization.
[0096] Since electronic products are typically thin, if the heat exchange channel is too wide, it is prone to collapse. If the heat exchange channel is too narrow, the resistance to fluid flow increases, leading to a greater pressure drop. Therefore, this embodiment of the application requires limiting the width of the heat exchange channel. Once the channel width is obtained, the maximum number of round trips for the heat exchange channel can be determined.
[0097] In this embodiment, the number of round trips of the heat exchange channels in the first channel distribution can be determined by steps S310 to S330.
[0098] Step S310: Obtain the thickness of the heat exchange channel and the size of the heating area of the electronic product.
[0099] Step S320: Determine the width of the heat exchange channel based on its thickness.
[0100] Step S330: Determine the number of round trips of the heat exchange channel based on the width of the heat exchange channel and the size of the heating zone.
[0101] In this embodiment, step S320 may include: obtaining the mapping relationship between the flow channel thickness and the flow channel width; and determining the width of the heat exchange flow channel based on the thickness and mapping relationship of the heat exchange flow channel.
[0102] The mapping relationship can be reflected by the one-to-one correspondence of the channel thickness and channel width in the data table, or by the specific ratio of the channel thickness and channel width, or by the form of a relational region. This embodiment does not make any specific limitations on this.
[0103] In this embodiment, the size of the heating zone can be the length of the heating zone in the reciprocating extension direction of the flow channel, such as... Figure 4The dimension in the ab direction. Step S330 may include determining the number of round trips of the heat exchange channel based on the width of the heat exchange channel, the size of the heating zone, and the width of the cross-section of the channel support column. Specifically, firstly, the channel width corresponding to each round trip is calculated, and then the length of the heating zone in the channel's round trip extension direction is divided according to the channel width corresponding to each round trip, thereby obtaining the maximum number of round trips.
[0104] In some embodiments, objective functions can be established based on design requirements to make the performance results of the topology-optimized channel distribution closer to the design requirements. Typically, design requirements include the heat transfer efficiency of the channel, fluid velocity, etc. This embodiment establishes new heat transfer objective functions and flow objective functions based on the design requirements of the channel's heat transfer efficiency and fluid velocity, respectively, to improve the accuracy of the objective function values.
[0105] For the heat transfer objective function, related technologies first use finite element method (FEM) to simulate the temperature field information corresponding to the flow channel distribution. This temperature field information includes the temperature at each grid point in the flow channel distribution. The temperature corresponding to this simulated physical field information is directly used to calculate the heat transfer objective function. However, in practical applications of liquid-cooled plate flow channels, the temperature of the liquid-cooled plate is also affected by the ambient temperature and the heat generation coefficient of the heat source. Therefore, the value of the heat transfer objective function calculated directly using the simulated temperature is obviously not accurate enough. Thus, in this embodiment, the heat transfer objective function is determined based on at least one of the ambient temperature and the heat generation coefficient of the heat source corresponding to the liquid-cooled plate, in order to improve the accuracy of the heat transfer objective function value.
[0106] For the flow objective function, related technologies also directly utilize finite element analysis to obtain the velocity field information corresponding to the flow channel distribution to calculate the flow objective function. This velocity field information includes the horizontal velocity at each grid in the flow channel distribution. However, in the simulation calculation of liquid-cooled plate flow channels, fluid velocity is a two-dimensional variable, including not only horizontal velocity but also vertical velocity. The value of the flow objective function calculated directly using the horizontal velocity is obviously not accurate enough. In addition, in the simulation calculation, each grid in the flow channel distribution is not necessarily entirely a solid region or a fluid region, but includes a portion of solid regions and a portion of fluid regions. Therefore, using the flow velocity calculated using the entire fluid region as the flow velocity corresponding to the grid that only includes a portion of the fluid region will also result in inaccurate calculation results. Therefore, in this embodiment, the flow objective function is determined based on at least one of the first fluid flow velocity corresponding to each grid in the flow channel distribution, which includes both horizontal and vertical velocities, and the fluid domain proportion corresponding to each grid, in order to improve the accuracy of the flow objective function value.
[0107] In this embodiment, step S130 may include steps S410 to S420.
[0108] Step S410: Obtain the objective function, which includes any one of the heat transfer objective function, the flow objective function, and the coupling objective function. The coupling objective function is the objective function obtained by coupling the heat transfer objective function and the flow objective function.
[0109] The coupling objective function can be obtained by weighted summation of the heat transfer objective function and the flow objective function. The formula for the coupling objective function F can be:
[0110] F = a*A + b*B
[0111] Where A is the heat transfer objective function, a is the weight of the heat transfer objective function, B is the flow objective function, and b is the weight of the flow objective function.
[0112] Optionally, based on experience, specific weights can be pre-set for the heat transfer objective function and the flow objective function to obtain a coupled objective function.
[0113] Optionally, during the topology optimization iteration process, the weights can be updated based on the quality of the current objective function value after each iteration. For example, if the heat transfer objective function value has reached a good level in the current iteration, the weight of that heat transfer objective function can be reduced, while the weight of the flow objective function can be increased. This approach allows the algorithm to explore the solution space more flexibly, avoiding premature focus on a specific objective, thus helping to find a flow channel distribution that is closer to the design requirements.
[0114] Step S420: Based on the value of the objective function, perform topology optimization on the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate.
[0115] When the value of the first objective function does not meet the preset target, the flow channel distribution is updated in the next iteration. Then, the value of the second objective function corresponding to the updated flow channel distribution is calculated. When the value of the second objective function does not meet the preset target or the change in the value of the second objective function compared to the value of the objective function in the previous iteration is greater than a threshold, the next iteration is performed until the value of the objective function meets the preset target or the change in the value of the objective function compared to the value of the objective function in the previous iteration is less than a threshold. The flow channel distribution at this point is taken as the target flow channel distribution.
[0116] The objective function established by the method in the embodiments of this application has a more accurate objective function value when performing topology optimization, and can obtain a flow channel distribution that is closer to the design requirements.
[0117] In some embodiments, step S410 may include steps S411 to S412.
[0118] Step S411: Determine the temperature field information corresponding to the flow channel distribution based on at least one of the ambient temperature and the heat generation coefficient of the heat source. The temperature field information includes the temperature at each grid in the flow channel distribution.
[0119] In this embodiment, optionally, new temperature field information corresponding to the flow channel distribution can be determined based on at least one of the ambient temperature and the heat generation coefficient of the heat source. The new temperature field information replaces the temperature field information directly obtained through finite element simulation in the existing objective function, thereby determining the objective function.
[0120] Optionally, in step S412, the objective function is determined based on the maximum temperature, minimum temperature, and set grid temperature in the temperature field information obtained in step S411.
[0121] In some embodiments, step S410 may include steps S413 to S414.
[0122] Step S413: Obtain the ambient temperature, the heat generation coefficient of the heat source, and the temperature of the set grid in the flow channel distribution.
[0123] Step S414: Determine the objective function based on the product of the difference between the ambient temperature and the set grid temperature and the heat generation coefficient of the heat source.
[0124] In this embodiment, step S414 can use the product of the difference between the ambient temperature and the temperature of the set grid and the heat generation coefficient of the heat source as the temperature corresponding to each grid, and determine the objective function based on the temperature.
[0125] As an example, the formula for the heat transfer objective function A can be:
[0126]
[0127] Where Ta = theta*(TQ-T), theta is the heat generation coefficient of the heat source, TQ is the ambient temperature, and T is the temperature obtained by finite element calculation for each grid.
[0128] In some embodiments, step S410 may include steps S415 to S417.
[0129] Step S415: Determine the velocity field information corresponding to the flow channel distribution based on at least one of the first fluid flow velocity corresponding to each grid and the fluid domain proportion corresponding to each grid. The velocity field information includes the second fluid flow velocity of each grid in the flow channel distribution.
[0130] Step S416: Determine the third fluid flow velocity based on the second fluid flow velocity, wherein the third fluid flow velocity characterizes the fluid flow velocity corresponding to the flow channel distribution.
[0131] In this embodiment, the second fluid flow velocity is the fluid flow velocity corresponding to each grid in the channel distribution, and the third fluid flow velocity characterizes the global fluid flow velocity corresponding to the channel distribution. As an example, the third fluid flow velocity can be obtained by summing the second fluid flow velocities. As another example, the third fluid flow velocity can be obtained by integrating the second fluid flow velocities.
[0132] Step S417: Determine the objective function based on the preset maximum fluid flow velocity, the preset minimum fluid flow velocity, and the third fluid flow velocity.
[0133] In this embodiment, the maximum fluid flow velocity and the minimum fluid flow velocity can be preset based on experience, and used to determine the objective function in step S416.
[0134] In some embodiments, step S410 may include steps S418 to S419.
[0135] Step S418: Obtain the sum of the squares of the horizontal velocity and the squares of the vertical velocity corresponding to each grid.
[0136] Step S419: Determine the objective function based on the product of the sum of the squares of the horizontal and vertical velocities and the proportion of the fluid domain.
[0137] In this embodiment, in step S419, the product of the square of the horizontal velocity and the square of the vertical velocity with the fluid domain proportion can be used as the second fluid flow velocity corresponding to each grid. The objective function is determined based on this second fluid flow velocity.
[0138] As an example, the formula for the flow objective function B can be:
[0139]
[0140] Where Fa=∑(1-r)*(u2+v2), r is the proportion of solid volume in the mesh to the mesh volume, (1-r) is the proportion of fluid volume in the mesh to the mesh volume, i.e. fluid domain proportion, u is horizontal velocity, and v is vertical velocity.
[0141] This application also provides a liquid-cooled plate flow channel design device, such as... Figure 5 As shown, the device 100 may include an acquisition module 110, a first determination module 120, and a second determination module 130.
[0142] The acquisition module 110 is used to acquire the first flow channel distribution of the liquid cooling plate, wherein the heat exchange channels in the first flow channel distribution repeatedly travel back and forth between the heat-generating area of the electronic product and other areas different from the heat-generating area.
[0143] The first determining module 120 is used to determine the initial design domain of the flow channel topology optimization model based on the first flow channel distribution.
[0144] The second determining module 130 is used to perform topology optimization on the flow channel distribution corresponding to the initial design domain and determine the target flow channel distribution of the liquid cooling plate.
[0145] This application also provides a storage medium storing a computer program thereon, which, when executed by a processor, implements the method as described in any of the above method embodiments.
[0146] This application also provides an electronic device, such as... Figure 6 As shown, the electronic device 200 includes a memory 210 and a processor 220.
[0147] The memory 210 is used to store computer instructions, and the processor 220 is used to retrieve the computer instructions from the memory 210 to execute the method as described in any of the above method embodiments.
[0148] The various embodiments in this application are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the device and apparatus embodiments are basically similar to the method embodiments, so the descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.
[0149] The foregoing has described specific embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired results. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0150] This application may be a system, method, and / or computer program product. A computer program product may include a computer-readable storage medium having computer-readable program instructions loaded thereon for causing a processor to implement various aspects of this application.
[0151] Computer-readable storage media can be tangible devices capable of holding and storing instructions for use by an instruction execution device. Computer-readable storage media can be, for example—but not limited to—electrical storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or any suitable combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital multifunction disc (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or recessed protrusions storing instructions thereon, and any suitable combination thereof. The computer-readable storage media used herein are not to be construed as transient signals themselves, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media (e.g., light pulses through fiber optic cables), or electrical signals transmitted through wires.
[0152] The computer-readable program instructions described herein can be downloaded from computer-readable storage media to various computing / processing devices, or downloaded via a network, such as the Internet, local area network, wide area network, and / or wireless network, to an external computer or external storage device. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards them to the computer-readable storage media in the respective computing / processing device.
[0153] The computer program instructions used to perform the operations of this application may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, status setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages such as Smalltalk, C++, etc., and conventional procedural programming languages such as the "C" language or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or may be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, electronic circuitry, such as programmable logic circuitry, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), is personalized by utilizing the status information of the computer-readable program instructions. This electronic circuitry can execute the computer-readable program instructions to implement various aspects of this application.
[0154] Various aspects of this application are described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions.
[0155] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that, when executed by the processor of the computer or other programmable data processing apparatus, they create means for implementing the functions / actions specified in one or more blocks of the flowchart and / or block diagram. These computer-readable program instructions can also be stored in a computer-readable storage medium that causes a computer, programmable data processing apparatus, and / or other device to operate in a particular manner; thus, the computer-readable medium storing the instructions comprises an article of manufacture that includes instructions for implementing aspects of the functions / actions specified in one or more blocks of the flowchart and / or block diagram.
[0156] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to perform the functions / actions specified in one or more boxes of a flowchart and / or block diagram.
[0157] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of an instruction containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions. It will be well known to those skilled in the art that implementation in hardware, implementation in software, and implementation using a combination of software and hardware are equivalent.
[0158] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical applications, or technical improvements to the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein. The scope of this application is defined by the appended claims.
Claims
1. A liquid-cooled plate flow channel design method, characterized in that, The method comprises the following steps: obtaining a first flow channel distribution of a liquid cooling plate, the heat exchange flow channel in the first flow channel distribution repeatedly goes back and forth between a heat generation area of an electronic product and another area different from the heat generation area; determining an initial design domain of a flow channel topology optimization model according to the first flow channel distribution; topology optimizing the flow channel distribution corresponding to the initial design domain to determine a target flow channel distribution of the liquid cooling plate.
2. The method of claim 1, wherein, The step of determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises the following steps: obtaining at least one sub-flow channel distribution in the first flow channel distribution, the heat exchange flow channel in the sub-flow channel distribution completes one round trip between the heat generation area and the other area; respectively taking the first area corresponding to the sub-flow channel distribution as the initial design domain.
3. The method of claim 1, wherein, The step of determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises the following steps: determining to take all or part of the areas of the first flow channel distribution as the initial design domain according to the performance result corresponding to the first flow channel distribution; wherein the performance result is the result of the performance index indicated by the design requirement.
4. The method of claim 3, wherein, The step of determining to take all or part of the areas of the first flow channel distribution as the initial design domain according to the performance result corresponding to the first flow channel distribution comprises the following steps: obtaining the performance result corresponding to at least one sub-flow channel distribution in the first flow channel distribution, the heat exchange flow channel in the sub-flow channel distribution completes one round trip between the heat generation area and the other area; in the case that the performance result corresponding to the sub-flow channel distribution represents that the performance of the sub-flow channel distribution does not meet the design requirement, taking the first area corresponding to the sub-flow channel distribution as the initial design domain.
5. The method of claim 3, wherein, The initial design domain is part of the areas of the first flow channel distribution, and the step of topology optimizing the flow channel distribution corresponding to the initial design domain to determine the target flow channel distribution of the liquid cooling plate comprises the following steps: topology optimizing the flow channel distribution corresponding to the initial design domain to obtain a second flow channel distribution; splicing other flow channel distributions outside the part of the areas in the first flow channel distribution and the second flow channel distribution to obtain the target flow channel distribution.
6. The method of claim 1, wherein, The step of determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises the following steps: obtaining a second area corresponding to the position of the heat source in the first flow channel distribution; taking the second area as the initial design domain.
7. The method of claim 1, wherein, The step of determining the initial design domain of the flow channel topology optimization model according to the first flow channel distribution comprises the following steps: obtaining a third area in the first flow channel distribution, the third area is an area in the first flow channel distribution except the area of the bent flow channel; taking the third area as the initial design domain.
8. The method of claim 1, wherein, The number of round trips of the heat exchange flow channel is determined through the following steps: obtaining the thickness of the heat exchange flow channel and the size of the heat generation area; determining the width of the heat exchange flow channel according to the thickness of the heat exchange flow channel; determining the number of round trips of the heat exchange flow channel according to the width of the heat exchange flow channel and the size of the heat generation area.
9. The method of claim 1, wherein, The step of determining the width of the heat exchange flow channel according to the thickness of the heat exchange flow channel comprises the following steps: obtaining a mapping relationship between the thickness of the flow channel and the width of the flow channel; According to the thickness of the heat exchange channel and the mapping relationship, the width of the heat exchange channel is determined.
10. The method of claim 1, wherein, The topology optimization is performed on the flow channel distribution corresponding to the initial design domain to determine a target flow channel distribution of the liquid cooling plate. A target function is obtained, the target function including any one of a heat transfer target function, a flow target function, and a coupling target function, the coupling target function being a target function obtained by coupling the heat transfer target function and the flow target function, the heat transfer target function being determined based on at least one of an ambient temperature and a heat generation coefficient of a corresponding heat source of the liquid cooling plate, the flow target function being determined based on at least one of a first fluid flow velocity corresponding to each grid in the flow channel distribution and a proportion of a fluid domain corresponding to each grid, the first fluid flow velocity including a horizontal velocity and a vertical velocity. The topology optimization is performed on the flow channel distribution corresponding to the initial design domain according to a value of the target function to determine a target flow channel distribution of the liquid cooling plate.
11. A liquid cold plate flow channel design apparatus, comprising: The method comprises: The obtaining module is configured to obtain a first flow channel distribution of a liquid cooling plate, heat exchange channels in the first flow channel distribution repeatedly going back and forth between a heat generation area of the liquid cooling plate and an area other than the heat generation area. The first determining module is configured to determine an initial design domain of a flow channel topology optimization model according to the first flow channel distribution. The second determining module is configured to perform topology optimization on a flow channel distribution corresponding to the initial design domain to determine a target flow channel distribution of the liquid cooling plate.
12. A storage medium, characterized by A computer program is stored thereon, the computer program being executed by a processor to implement the method of any one of claims 1 to 10.
13. An electronic device, comprising: The memory is configured to store computer instructions, and the processor is configured to call the computer instructions from the memory to execute the method of any one of claims 1 to 10. The memory is configured to store computer instructions, and the processor is configured to call the computer instructions from the memory to execute the method of any one of claims 1 to 10.