Display device

Abstract

The display device comprises a display panel. The display panel includes a display area including a plurality of pixels and a non-display area including a panel pad group. The panel pad group includes a plurality of panel pads arranged in the first direction and each connected to at least one of the pixels. The panel pad group further includes additional pad portions arranged in a longitudinal direction of each of the plurality of panel pads and spaced apart from the panel pads. The additional pad portion includes a first additional pad and a second additional pad sequentially spaced apart from each other in a longitudinal direction of the panel pad.

Description

Technical Field

[0001] The embodiments relate to a display device, an electronic device including the display device, and a method of manufacturing the display device. Background Technology

[0002] Flat panel displays are key components in modern electronic devices, characterized by their slim profile and lower power consumption compared to traditional CRT monitors. Common types include liquid crystal displays (LCDs), which use liquid crystals and backlighting to produce images, and organic light-emitting diode (OLED) displays, known for their superior contrast and ability to produce true blacks because each pixel emits its own light. Another variant, LED displays, are essentially LCDs with LED backlighting, offering brighter displays and better color accuracy. Furthermore, new technologies like quantum dot LED (QLED) displays enhance the viewing experience by using quantum dots to increase brightness and color gamut. These flat panel displays are used in a wide range of applications, from smartphones and tablets to large-screen televisions, due to their versatility and efficiency.

[0003] The display device may include a display panel configured to generate images, the display panel being controlled by a main circuit board and connected to the main circuit board via a connection circuit board. The connection circuit board can exchange electrical signals between the display panel and the main circuit board.

[0004] The pads provided on the connection circuit board and the pads provided on the display panel can be coupled together. However, coupling the pads on the connection circuit board to the pads on the display panel can be challenging, especially due to the increasing resolution of display devices, which requires more precise alignment. This problem arises as the size and pitch of the pads on these boards decrease. Consequently, it may be difficult to precisely align the connection circuit board with the display panel. Misalignment can lead to invalid or faulty electrical connections between these components. Summary of the Invention

[0005] Embodiments of this disclosure may provide a display device in which pads provided in a connection circuit board and pads provided in a display panel are precisely coupled to each other to enable high-resolution images, an electronic device including the display device, and a method of manufacturing the display device, wherein improved electrical connection reliability is provided.

[0006] According to an embodiment, the display device includes a display panel. The display panel includes a display area having pixels and a non-display area including a panel pad group. The panel pad group includes a plurality of panel pads arranged in a first direction and each connected to at least one of the pixels for receiving one or more signals. The panel pad group further includes additional pad portions arranged longitudinally and spaced apart from each of the plurality of panel pads, and the additional pad portions include a first additional pad and a second additional pad sequentially spaced apart from each other in the longitudinal direction of the panel pads.

[0007] In this embodiment, the first additional pad and the second additional pad may overlap with an extension line that passes through the center of the panel pad in the lateral direction and extends in the longitudinal direction of the panel pad.

[0008] In this embodiment, the first additional pad and the second additional pad can be arranged in parallel to each other.

[0009] In this embodiment, the panel pads and the additional pads can be arranged parallel to each other.

[0010] In this embodiment, the second additional pad can be arranged to be closer to the display area in the longitudinal direction of the panel pad than the first additional pad.

[0011] In this embodiment, at least two of the multiple panel pads may be tilted and not parallel to each other.

[0012] In this embodiment, the width of the end of the panel pad group closest to the display area can be greater than the width of the other end of the panel pad group closest to the edge of the display panel.

[0013] In this embodiment, the width of the panel pad assembly in the first direction can gradually decrease as it moves away from the display area.

[0014] In this embodiment, the centers of the panel pads, the first additional pad, and the second additional pad can all be located on a straight line.

[0015] In this embodiment, the display device may further include a connection circuit board containing a connection pad group, the connection pad group including a plurality of connection pads arranged on the connection circuit board in a first direction, and the connection circuit board can transmit signals to the panel pad group.

[0016] In this embodiment, each of the plurality of connection pads can be arranged to overlap with at least one area of ​​each of the corresponding panel pads, the first additional pad, and the second additional pad.

[0017] In this embodiment, the multiple connecting pads of the connecting pad group can correspond to and be electrically connected to the multiple panel pads of the panel pad group.

[0018] In this embodiment, the connecting circuit board can be provided as a plurality of connecting circuit boards arranged in a first direction.

[0019] In this embodiment, panel pad groups can be provided as multiple panel pad groups arranged to correspond to multiple connecting circuit boards, and the multiple panel pad groups can each correspond to and be electrically connected to multiple connecting circuit boards.

[0020] In this embodiment, the display device may further include a third additional pad disposed between the first additional pad and the second additional pad.

[0021] According to another embodiment, a method of manufacturing a display device includes: forming a display panel including a display area having pixels and a non-display area including a panel pad group including a plurality of panel pads arranged in a first direction and additional pad portions spaced apart from the panel pads on a straight line extending longitudinally along each of the plurality of panel pads; forming a connection circuit board including a connection pad group including a plurality of connection pads arranged in the first direction; and connecting the display panel to the connection circuit board such that one of the connection pads overlaps with one of the panel pads and the additional pad portions.

[0022] In this embodiment, the additional pad portion may include a first additional pad and a second additional pad that are sequentially spaced apart on a straight line extending longitudinally along the panel pad, and connecting the display panel to the connection circuit board may include making each of the plurality of connection pads overlap and connect with at least one of the corresponding panel pad, the first additional pad, and the second additional pad.

[0023] In this embodiment, the method may further include: checking the alignment of the panel pad group and the connection pad group before connecting the display panel to the connection circuit board.

[0024] In this embodiment, checking the alignment of the panel pad group and the connection pad group may include: generating a first virtual line connecting the center of the first additional pad and the center of the second additional pad; and then measuring the difference between the first virtual line and the second virtual line connecting the center of the connection pad.

[0025] According to another embodiment, the electronic device includes a controller, a power module, a display panel, and a scan driver. The controller is configured to generate a scan input signal. The power module is configured to generate a scan input voltage. The display panel includes a display area having pixel circuitry and a non-display area surrounding the display area. The scan driver is disposed in the non-display area and is configured to receive the scan input signal and the scan input voltage and output the scan signal to the pixel circuitry. The non-display area includes a panel pad group. The panel pad group includes a plurality of panel pads arranged in a first direction and each connected to at least one of the pixel circuitry. The panel pad group further includes additional pad portions arranged longitudinally and spaced apart from each of the plurality of panel pads. The additional pad portions include a first additional pad and a second additional pad sequentially spaced apart longitudinally from the panel pads. Attached Figure Description

[0026] The above and other aspects and features of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0027] Figure 1 This is a schematic plan view of a display device according to an embodiment of the present disclosure;

[0028] Figure 2 It is a schematic diagram along Figure 1 A cross-sectional view of an example section taken by line I-I';

[0029] Figure 3 It is a schematic diagram along Figure 1 Another example of a cross-sectional view of the section intercepted by line I-I';

[0030] Figure 4 It is a schematic diagram. Figure 1 A plan view of part A of the display device in a separated state;

[0031] Figure 5 It is a schematic diagram in Figure 1 A plan view of the display device in part A;

[0032] Figure 6 It is a schematic diagram along Figure 1 A cross-sectional view of the section intercepted by line II-II';

[0033] Figure 7 It is a schematic diagram along Figure 1 A cross-sectional view of the section intercepted by line III-III';

[0034] Figure 8 This is a plan view schematically illustrating a portion of a display device according to an embodiment of the present disclosure;

[0035] Figure 9 This is a plan view schematically illustrating a portion of a display device according to an embodiment of the present disclosure;

[0036] Figure 10 This is a plan view schematically illustrating a portion of a display device according to an embodiment of the present disclosure;

[0037] Figures 11 to 14 This is a plan view illustrating some operations of a method for manufacturing a display device according to an embodiment of the present disclosure; and

[0038] Figure 15 This is a block diagram of an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0039] Reference will now be made in detail to embodiments illustrated in the accompanying drawings, in which the same reference numerals refer to the same elements throughout. In this respect, present embodiments may take different forms and should not be construed as limited to the description set forth herein. Accordingly, embodiments are described below only by reference to the accompanying drawings to illustrate aspects. As used herein, the term “and / or” includes any and all combinations of one or more of the items listed herein. Expressions such as “at least one of”, when following a list of elements, modify the entire list of elements without modifying individual elements within that list.

[0040] Because this disclosure allows for various modifications and numerous embodiments, specific embodiments will be illustrated and described in detail in the accompanying drawings. The features of this disclosure and its implementation methods should become clear from the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various forms.

[0041] In the following embodiments, terms such as "first," "second," etc., are used only to distinguish one component from another, and these components should not be limited by these terms.

[0042] In the following embodiments, singular expressions also include plural meanings, provided they do not contradict the context.

[0043] In the following embodiments, the terms “comprising,” “including,” and “having,” as used herein, indicate the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components.

[0044] In the following embodiments, when a unit, region, or component is referred to as being "on" another unit, region, or component, it may be directly or indirectly on that other unit, region, or component; that is, one or more intermediary units, regions, or components may exist therebetween.

[0045] In the following embodiments, when a component is referred to as being “connected to” or “coupled to” another component, the component may be directly connected to or in direct contact with the other component, or an intermediary component may be present therein, unless otherwise expressly defined in the context.

[0046] For ease of description, the sizes of the components in the accompanying drawings may be exaggerated or reduced. For example, because the dimensions and / or thicknesses of each component illustrated in the drawings may be shown for ease of description, this disclosure is not necessarily limited to the dimensions and / or thicknesses illustrated in the drawings.

[0047] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and when describing embodiments of the present disclosure with reference to the accompanying drawings, the same or corresponding parts will be given the same reference numerals and repeated descriptions thereof will be omitted.

[0048] Figure 1 This is a schematic plan view of a display device according to an embodiment of the present disclosure. Figure 2 It is a schematic diagram along Figure 1 An example cross-sectional view of the section intercepted by line I-I', and Figure 3 It is a schematic diagram along Figure 1 Another example of a cross-sectional view of the section cut by line I-I'.

[0049] refer to Figure 1 The display device 1 may include a display panel DP. Alternatively, in an alternative embodiment, the display device 1 may further include a connection circuit board FB, or include both the connection circuit board FB and the main circuit board MB. The display panel DP, the connection circuit board FB, and the main circuit board MB may be electrically connected to each other.

[0050] The display panel DP may include a display area DA and a non-display area NDA. The display area DA is the portion that displays the image, and the non-display area NDA surrounding the display area DA may be the portion where circuitry and / or signal lines are arranged for generating and / or transmitting various signals to be applied to the display area DA.

[0051] Configured to route from the first signal SL1 (see Figure 4 Multiple pixels PX that receive signals can be arranged in the display area DA of the display panel DP. In this embodiment, each of the pixels PX can receive an electrical signal to emit light, thereby forming an image. The pixels PX can be arranged in a matrix, spaced apart from each other in a first direction DR1 and a second direction DR2. The second direction DR2 can be perpendicular to the first direction DR1. The display panel DP can display various images by controlling the pixels PX. However, Figure 1 The illustration is merely an example, and some components of pixel PX can be arranged to overlap each other on a plane and are not limited to any one embodiment.

[0052] Each of the pixels PX may include a display element and a driving element. The display element may include various embodiments. For example, the display element may include at least one of a liquid crystal capacitor, an organic light-emitting element, an electrophoretic element, and an electrowetting element. However, this is merely an example, and the display element may include various embodiments, and is not limited to any one embodiment, as long as the display element can realize an image according to electrical signals.

[0053] The driving elements control the driving of the display elements of each pixel PX individually. The driving elements may include thin-film transistors. According to embodiments of this disclosure, the display panel DP can be driven by an active method in which each pixel PX can be independently controlled.

[0054] Signal lines, such as scan lines, data lines, drive voltage lines, common voltage lines, and / or initialization voltage lines, can be arranged in the display area DA. Each pixel PX can be connected to the scan lines, data lines, drive voltage lines, common voltage lines, and / or initialization voltage lines to receive scan signals, data voltages, drive voltages, common voltages, and / or initialization voltages from these signal lines. Pixel PX may include display elements such as light-emitting diodes. Additionally, touch electrodes can be arranged in the display area DA of the display panel DP to detect touches from the user's finger, etc.

[0055] The schematic diagram illustrates a cross-section of a portion of the display area DA of a display panel DP according to an example. Figure 2 The display panel DP may include a pixel layer PXL capable of providing visible light to the user. The type of pixels PX included in the pixel layer PXL may vary, and in this embodiment, an example in which the pixels PX are organic light-emitting elements will be described.

[0056] The display panel DP will be described in detail below. The display panel DP may include a pixel layer PXL disposed on a substrate BSL. In an alternative embodiment, the display panel DP may further include an encapsulation layer TFE and an optical functional layer 110.

[0057] The substrate BSL can be formed using a variety of materials. As specific examples, the substrate BSL can be formed from glass, metal, or other organic materials.

[0058] In an alternative embodiment, the substrate BSL can be formed of a flexible material. For example, the substrate BSL can be formed to be easily bent, folded, or rolled.

[0059] Additionally, for example, the substrate BSL may comprise ultrathin glass or metal or plastic materials, and, for example, when using plastic materials, may comprise polyimide (PI). As another specific example, the substrate BSL may comprise at least one of polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polycarbonate, cellulose triacetate, and cellulose acetate propionate.

[0060] The pixel layer PXL can be formed on the substrate BSL and can include a first electrode 151, a second electrode 152 and an intermediate layer 153. Specifically, the first electrode 151 can be formed on the substrate BSL, the second electrode 152 can be formed above the first electrode 151, and the intermediate layer 153 can be formed between the first electrode 151 and the second electrode 152.

[0061] A buffer layer may be further formed above the first electrode 151 and the substrate BSL. The buffer layer may provide a flat surface on the substrate BSL and may block moisture or gas from penetrating through the substrate BSL. For example, the buffer layer may be disposed between the first electrode 151 and the substrate BSL to prevent moisture or gas from penetrating into the first electrode 151 through the substrate BSL.

[0062] The first electrode 151 can act as an anode and the second electrode 152 can act as a cathode, and vice versa. When the first electrode 151 acts as an anode, it can be provided as a material with a high work function, such as ITO, IZO, ZnO, or In2O3. Furthermore, depending on the purpose and design conditions, the first electrode 151 can further include a reflective film formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Yb, or Ca.

[0063] When the second electrode 152 acts as a cathode, the second electrode 152 can be formed of a metal such as Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, etc. Alternatively, the second electrode 152 can include ITO, IZO, ZnO, In2O3, etc., to achieve light transmission.

[0064] Intermediate layer 153 includes at least an organic light-emitting layer. Additionally, besides the organic light-emitting layer, intermediate layer 153 may optionally include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. When a voltage is applied to the first electrode 151 and the second electrode 152, visible light is generated in intermediate layer 153 (particularly in the organic light-emitting layer of intermediate layer 153).

[0065] The encapsulation layer TFE can be disposed on the pixel layer PXL to protect the pixel PX. The encapsulation layer TFE can protect the pixel layer PXL from external impacts and can reduce or prevent the penetration of external foreign objects, moisture, etc.

[0066] The encapsulation layer TFE can be formed in one of several types. In an alternative embodiment, the encapsulation layer TFE can be made of a transparent glass material containing SiO2 as the main component. In another alternative embodiment, the encapsulation layer TFE can be formed of a light-transmitting plastic material. In yet another alternative embodiment, the encapsulation layer TFE can be formed using an inorganic or organic film. Furthermore, as another alternative embodiment, the encapsulation layer TFE can be formed by stacking one or more organic films and one or more inorganic films, and optionally, the organic and inorganic films can be stacked alternately.

[0067] The display panel DP can provide an image in an upward direction (i.e., towards the top of the third-party DR3, i.e., towards the optical functional layer 110). The optical functional layer 110 may include a base material and optical functional particles.

[0068] The display panel DP may include thin-film transistors configured to transmit signals for driving pixels PX to pixels PX. (Refer to...) Figure 3 This will be described in detail.

[0069] Figure 3 It is a diagram. Figure 2 The image shows an example of the modification. (See reference.) Figure 3 The display panel DP may include a substrate BSL', a pixel layer PXL', thin film transistors and an encapsulation layer TFE'.

[0070] The thin-film transistor may include an active layer 133', a gate electrode 135', a source electrode 137', and a drain electrode 138'. This will be described in detail. A buffer layer 120' may be formed on a substrate BSL'. The buffer layer 120' prevents the penetration of impurity elements through the substrate BSL' and provides a flat surface on the substrate BSL', and can be formed from various materials capable of performing these functions. The buffer layer 120' is an optional component and can therefore be omitted.

[0071] The active layer 133' can be arranged in a specific pattern on the buffer layer 120'. The active layer 133' can be formed of an inorganic semiconductor material such as silicon, in an alternative embodiment it can be formed of an organic semiconductor material, and in another alternative embodiment it can contain an oxide semiconductor material.

[0072] The gate insulating film 136' can be formed on the active layer 133'. The gate insulating film 136' can be formed from various insulating materials and can be formed by using, for example, oxides or nitrides.

[0073] Gate electrode 135' may be formed on gate insulating film 136' to correspond to a specific region of active layer 133'. Gate electrode 135' may be formed of a material with high conductivity. For example, gate electrode 135' may contain Au, Ag, Cu, Ni, Pt, Pd, Al, or Mo, and may include alloys such as Al:Nd or Mo:W. However, this is merely an example and this embodiment is not limited thereto, and gate electrode 135' may be formed of a variety of other materials.

[0074] An interlayer insulating film 139' can be formed to cover the gate electrode 135'. A source electrode 137' and a drain electrode 138' can be formed on the interlayer insulating film 139'. The source electrode 137' and the drain electrode 138' can be formed to contact specific regions of the active layer 133'.

[0075] A passivation layer 140' can be formed to cover the source electrode 137' and the drain electrode 138'. A separate insulating film can be formed on the passivation layer 140' to planarize the thin-film transistor.

[0076] Although not in Figure 3 As shown in the diagram, the display panel DP may further include one or more thin-film transistors that can be electrically connected to the pixel layer PXL', and may further include one or more capacitors that can be electrically connected to the pixel layer PXL' or the one or more thin-film transistors.

[0077] The first electrode 151' may be formed on the passivation layer 140'. The first electrode 151' may be electrically connected to one of the source electrode 137' and the drain electrode 138'. For example, the first electrode 151' may be electrically connected to the drain electrode 138'.

[0078] A pixel-defining film 160' can be formed on the first electrode 151' to expose a specific area of ​​the first electrode 151'.

[0079] An intermediate layer 153' may be formed on the first electrode 151'. The intermediate layer 153' may include an organic light-emitting layer. In an alternative embodiment, in addition to the organic light-emitting layer, the intermediate layer 153' may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0080] The second electrode 152' can be formed on the intermediate layer 153'.

[0081] The encapsulation layer TFE' can be placed on the pixel layer PXL' to protect the pixel PX.

[0082] In an alternative embodiment, the display panel DP may further include an optical functional layer 110'. The optical functional layer 110' may include layers for filtering, polarizing, enhancing, or reducing glare.

[0083] The non-display area NDA can be adjacent to the display area DA. The non-display area NDA can be arranged on at least one side of the display area DA on the display panel DP. For example, the non-display area NDA can surround the display area DA. Figure 1 In the diagram, the boundary between the display area DA and the non-display area NDA is indicated by a dashed line. However, this is merely an example, and the non-display area NDA can have various shapes as long as it is adjacent to the display area DA, and is not limited to any one embodiment.

[0084] Additionally, the non-display area NDA can be an area coupled to one end of the connecting circuit board FB. For example... Figure 4 As shown, multiple panel pads PP for electrical connection to the connection board FB can be arranged in the non-display area NDA. The display panel DP can be electrically coupled to external components such as the connection board FB and the main board MB via the non-display area NDA.

[0085] A driving unit (e.g., driving circuitry) configured to generate and / or process various signals for driving the display panel DP can be located in the non-display area NDA. The driving unit may include a data driving unit (e.g., a data driver) configured to apply data signals to data lines, a gate driving unit (e.g., a gate driver or scan driver) configured to apply gate signals to scan lines, and a signal control unit (e.g., a timing controller) configured to control the data driving unit and the gate driving unit. Based on the scan signal generated by the gate driving unit, data signals, etc., can be applied to pixels PX in a specific timing sequence.

[0086] The connection circuit board FB can be placed in the non-display area NDA of the display panel DP to connect the main circuit board MB to the display panel DP. The connection circuit board FB can be placed on one side of the display panel DP in the second direction DR2.

[0087] Multiple connection circuit boards (FBs) may be provided and arranged spaced apart from each other in the non-display area NDA along the first direction DR1. However, this is an example, and the connection circuit boards (FBs) may be provided as a single component and are not limited to any one embodiment.

[0088] The connecting circuit board FB can be flexible. Accordingly, the connecting circuit board FB connected to the display panel DP can be bent so that other components connected to the connecting circuit board FB (such as the main circuit board MB) are arranged on the rear surface of the display panel DP.

[0089] Multiple connection pads FP can be arranged on a connection board FB for electrical connection to the display panel DP. The connection board FB can be connected to the panel pad PP located in the non-display area NDA of the display panel DP to overlap with the panel pad PP, and thus be electrically connected to the display panel DP via the panel pad PP. The connection board FB can be arranged to correspond to the non-display area NDA to transmit various electrical signals to the display area DA via the panel pad PP.

[0090] The main circuit board MB can be connected to the connecting circuit board FB, and can be connected to the opposite end of the connecting circuit board FB that is connected to the display panel DP.

[0091] The main circuit board (MB) can provide image data, control signals, power supply voltage, etc., to the display panel (DP). The main circuit board (MB) is a wiring board distinct from the connecting circuit board (FB), and can include both active and passive components. The main circuit board (MB) can be flexible or rigid, and is not limited to any particular embodiment.

[0092] The processor and / or memory can be arranged in the main circuit board MB. For example, in the case where the display device 1 is used in a mobile communication terminal, the processor may include a central processing unit, a graphics processing unit, and / or an application processor including a modem, etc. The connecting circuit board FB can be bent so that the main circuit board MB can be located on the rear surface of the display panel DP on the third-direction DR3.

[0093] Figure 4 It is a schematic diagram. Figure 1 A plan view of part A of the display device in a separated state, and Figure 5 It is a schematic diagram in Figure 1 A plan view of the display device in part A.

[0094] Panel pad assembly (PPG) can be placed in the non-display area (NDA) of the display panel (DP). Figure 4 The diagram illustrates a panel pad group (PPG), but multiple panel pad groups (PPGs) can be arranged in the non-display area (NDA). Each of the multiple panel pad groups (PPGs) can correspond to a connection pad group (FPG). Multiple panel pad groups (PPGs) can be arranged to correspond to multiple connection boards (FBs), and the multiple panel pad groups (PPGs) can each correspond to and be electrically connected to the multiple connection boards (FBs).

[0095] The panel pad group PPG may include a plurality of panel pads PP arranged on the first direction DR1, a plurality of first additional pads AP1 arranged on the first direction DR1, and a plurality of second additional pads AP2 arranged on the first direction DR1.

[0096] The panel pad group PPG has a width in the first direction DR1, and the width of the panel pad group PPG can vary depending on the region. In an embodiment, the end of the panel pad group PPG closer to the display area DA has a wider width than the other end of the panel pad group PPG closer to the edge of the display panel DP. Additionally, for example, the width of the panel pad group PPG can gradually decrease as it moves away from the display area DA.

[0097] A panel pad group (PPG) may include multiple panel pads (PPs) arranged to receive one or more signals to be transmitted to a display area (DA). The panel pads (PPs) may be arranged in the non-display area (NDA) on a first direction (DR1) and may be spaced apart from each other. Each of the multiple panel pads (PPs) may be connected to at least one of the pixels (PX).

[0098] Panel pads (PP) may extend between the edge of the display panel (DP) and the display area (DA). In an embodiment, at least two of the plurality of panel pads (PP) are not arranged parallel to each other, but are inclined. For example, some of the panel pads (PP) may have different inclinations relative to the second direction (DR2).

[0099] Regarding the spacing between a panel pad PP and its nearest neighboring panel pad PP, the spacing on the edge side of the display panel DP can be narrower than the spacing on the display area DA side. That is, the spacing can gradually decrease as it moves away from the display area DA. Furthermore, the spacing between a panel pad PP and its nearest neighboring panel pad PP should be at least a distance that prevents short circuits between adjacent panel pads PP. For example, panel pads PP can be spaced apart from each other and placed as close to each other as possible to minimize the possibility of short circuits.

[0100] Panel pads (PP) can have various shapes. Panel pads (PP) can have shapes such as quadrilaterals (specifically, trapezoids or parallelograms (e.g., rectangles)).

[0101] For example, panel pads (PP) can have the same shape. As another example, panel pads (PP) can have the same length but different angles of inclination. As yet another example, panel pads (PP) can have the same length but different widths.

[0102] Panel pads PP can be electrically connected to connection pads FP on the connection board FB to receive signals. Panel pads PP can transmit signals received from the connection board FB to pixels PX via first signal wiring SL1. That is, multiple first signal wirings SL1 can extend from the display area DA to connect to multiple panel pads PP respectively. Panel pads PP can electrically connect the connection board FB to the display panel DP.

[0103] When the display device 1 has a high resolution, the size and pitch of the panel pads PP and FP decrease, making it difficult to precisely adjust and bond the panel pads PP and FP. This problem can be solved by arranging additional pad portions AP along the extension line of the length of the panel pads PP.

[0104] The additional pad portion AP can be placed in the portion of the non-display area NDA located between the panel pad PP and the display area DA. The additional pad portion AP can be placed on the first direction DR1 where the panel pad PP is placed.

[0105] The additional pad portion AP can be arranged along the longitudinal direction of the panel pad PP and can be spaced apart from the panel pad PP. For example, the additional pad portion AP can extend in the same direction as the corresponding panel pad PP. The panel pad PP and the additional pad portion AP can be formed parallel to each other.

[0106] Some of the panel pads PP have different tilt angles, and therefore, it may not be easy to precisely attach the panel pads PP to the connection pads FP. Instead of simply aligning and then attaching the panel pads PP to the connection pads FP, measuring the first virtual line VL1 (see [link to connection pad]) that connects the centers of the additional pad portions AP is more efficient. Figure 14 The second virtual line VL2 (see) connects to the center of the width of the connection pad FP. Figure 14 The difference ΔD between them (see) Figure 14 This makes it easier to determine the alignment of panel pads PP and connection pads FP.

[0107] Furthermore, it is possible to drive the alignment of the panel pads PP and connection pads FP by feeding back measurements of alignment. For example, the system may include a camera for capturing images of the panel pads PP and connection pads FP, a processor for processing the captured images to determine virtual lines VL1 and VL2 and measuring the difference ΔD between the virtual lines VL1 and VL2, and an actuator for moving the display panel DP and / or connection board FB based on the measured difference ΔD to better align the panel pads PP and connection pads FP to create a stronger connection. As a result, the reliability of the display device 1 can be improved by more precisely adjusting the position of the display panel DP and connection board FB, and a high-resolution display device 1 can be produced.

[0108] The additional pad portion AP may include a first additional pad AP1 and a second additional pad AP2 arranged sequentially and spaced apart from each other in the longitudinal direction of the panel pad PP. The second additional pad AP2 may be arranged to be closer to the display area DA in the longitudinal direction of the panel pad PP than the first additional pad AP1.

[0109] Because multiple panel pads PP are arranged, multiple first additional pads AP1 and multiple second additional pads AP2 can be arranged along the extension lines of the corresponding panel pads PP. That is, like the panel pads PP, the first additional pads AP1 and the second additional pads AP2 can be arranged in the non-display area NDA on the first direction DR1.

[0110] Multiple first additional pads AP1 and multiple second additional pads AP2 may have a tilt angle corresponding to the degree to which the corresponding panel pads PP are tilted relative to the second direction DR2.

[0111] The first additional pad AP1 and the second additional pad AP2 can be formed parallel to each other. When the extension line is defined as passing through the center of the panel pad PP in the transverse direction based on the first direction DR1 and extending longitudinally along the panel pad PP, the first additional pad AP1 and the second additional pad AP2 can overlap with the extension line. The center of the panel pad PP, the center of the first additional pad AP1, and the center of the second additional pad AP2 can all be located on a straight line. For example, the panel pad PP, the first additional pad AP1, and the second additional pad AP2 can be arranged along the same direction such that they are aligned with each other.

[0112] The first additional pad AP1 and the second additional pad AP2 can have various shapes (e.g., quadrilateral (e.g., rhombus) or triangular shapes, etc.). The first additional pad AP1 and the second additional pad AP2 can have the same shape.

[0113] For example, the first additional pads AP1 can have the same shape as each other. As another example, the first additional pads AP1 can have the same length but different angles of inclination. As yet another example, the first additional pads AP1 can have the same length but different widths.

[0114] For example, the second additional pads AP2 can have the same shape as each other. As another example, the second additional pads AP2 can have the same length but different angles. As yet another example, the second additional pads AP2 can have the same length but different widths.

[0115] The first additional pad AP1 and the second additional pad AP2 can overlap and connect with the connection pad FP of the connecting circuit board FB. By measuring the distance difference ΔD in the first direction DR1 between the first virtual line VL1 connecting the center of the first additional pad AP1 and the center of the second additional pad AP2 and the second virtual line VL2 passing through the center of the width of the connecting pad FP in the longitudinal direction, it can be determined whether the panel pad PP and the connection pad FP are aligned or how much they are misaligned.

[0116] Additionally, a system configured to automatically align control pads PP and connection pads FP can be driven by feedback of alignment measurements.

[0117] The first additional pad AP1 and the second additional pad AP2 are easily identifiable as physical pads, and the reliability of alignment determination can be improved by using a first virtual line VL1 connecting the center of the first additional pad AP1 and the center of the second additional pad AP2. Accordingly, the defect rate of the display device 1 can be reduced, and a high-resolution display device 1 can be produced.

[0118] By connecting both the first additional pad AP1 and the second additional pad AP2 to the connection pad FP, a system that facilitates alignment is established. These additional pads AP1 and AP2 are spaced apart from and from the panel pad PP. This configuration enables the construction of a system that facilitates the alignment of the panel pad PP and the connection pad FP and measures the alignment of the panel pad PP and the connection pad FP more accurately for automatic alignment control.

[0119] By forming multiple additional pads instead of a single additional pad, the reliability of the virtual lines connecting the additional pads can be improved. A third additional pad can be included longitudinally between the panel pad PP and the display area DA. For example, the third additional pad can be positioned between the first additional pad AP1 and the second additional pad AP2.

[0120] If a third additional pad is included, alignment of pads PP and FP can be achieved in two ways. One method is to measure the difference between the second virtual line VL2 and the virtual line connecting the centers of the first additional pad AP1, the second additional pad AP2, and the third additional pad. Alternatively, alignment can be determined by measuring the difference between the second virtual line VL2 and the virtual line connecting the centers of the first additional pad AP1, the second additional pad AP2, and the third additional pad (excluding any centers that deviate significantly from the average or from a threshold amount).

[0121] The connection board (FB) may include a group of connection pads (FPG) located on one surface of the connection board (FB). Although Figure 4 The illustration shows a connection pad group FPG included in a connection board FB, but this disclosure is not limited thereto. For example, multiple connection pad group FPGs may be arranged in a connection board FB. That is, the connection board FB may include at least one connection pad group FPG.

[0122] The shape of the connection pad group FPG can correspond to the shape of the panel pad group PPG. The connection pad group FPG can have a width in the first direction DR1, and the width of the connection pad group FPG can vary depending on the area. For example, the width of the connection pad group FPG near the display panel DP can be greater than the width of the connection pad group FPG near the main board MB, and specifically, the width of the connection pad group FPG can gradually increase towards the edge of the connection board FB near the display panel DP.

[0123] The connection pad group (FPG) may include multiple connection pads (FP) arranged on the first direction DR1. The connection pads (FP) can act as channels for transmitting signals from the connection board (FB) to the display panel (DP).

[0124] Connector pad groups (FPGs) can correspond to panel pad groups (PPGs), and connector pads (FPs) can each correspond to panel pads (PPs). For example, a panel pad (PP) can be connected to a connector pad (FP) without overlapping or connecting with other connector pads (FPs).

[0125] As mentioned above, connection pads FP need to correspond to corresponding panel pads PP, so connection pads FP can be spaced apart from each other like panel pads PP. Connection pads FP can extend in the second direction DR2. At least two of the multiple connection pads FP can be arranged at an angle, rather than parallel to some of the other connection pads FP. For example, connection pads FP can have different angles of inclination relative to the second direction DR2.

[0126] Connection pads (FPs) can have various shapes. Connection pads (FPs) can have shapes such as quadrilaterals (specifically, trapezoids or parallelograms (e.g., rectangles)).

[0127] For example, connection pads (FPs) can have the same shape. As another example, connection pads (FPs) can have the same length but different angles. As yet another example, connection pads (FPs) can have the same length but different widths.

[0128] The connection pad FP can transmit various signals generated by the main circuit board (MB) from the connection board (FB) to the display panel (DP) via the panel pad PP. For example, a signal generated by the main circuit board (MB) can be transmitted to the connection board (FB) via the second signal wiring SL2, and then transmitted to the display panel (DP) via the connection pad FP and the panel pad PP. The connection pad FP can electrically connect the connection board (FB) to the panel pad PP.

[0129] The connection pads FP can also be connected to the additional pad portions AP. Specifically, the connection pads FP can overlap and connect with both the first additional pad AP1 and the second additional pad AP2. Each of the plurality of connection pads FP can be arranged to overlap with at least one area of ​​each of the corresponding panel pads PP, the first additional pad AP1, and the second additional pad AP2. The plurality of connection pads FP of the connection pad group FPG can each correspond to and be electrically connected to the plurality of panel pads PP of the panel pad group PPG.

[0130] In this embodiment, the connecting pad FP extends beyond the length of the panel pad PP to connect to the first additional pad AP1 and the second additional pad AP2, thereby more accurately measuring the difference ΔD between the first virtual line VL1 connecting the center of the first additional pad AP1 and the center of the second additional pad AP2 and the second virtual line VL2 connecting the center of the width of the connecting pad FP. In this embodiment, the length of the connecting pad FP is longer than the length of the corresponding panel pad PP, so it can extend long enough to allow it to connect to one or more of the additional pads AP1 and AP2.

[0131] Figure 5 The diagram illustrates that the width of the connection pad group FPG is slightly larger than the width of the panel pad group PPG, but the pitch between multiple connection pads FP belonging to the connection pad group FPG can be equal to the pitch between panel pads PP belonging to the panel pad group PPG. Therefore, the width of the connection pad group FPG can be equal to the width of the panel pad group PPG. Furthermore, the connection pad group FPG and the panel pad group PPG do not need to overlap precisely; they only need to overlap enough to ensure that the connection pads FP and panel pads PP are connected one-to-one. Therefore, the connection pad group FPG and the panel pad group PPG can be slightly misaligned in the upward, downward, leftward, or rightward directions to prevent short circuits between corresponding pads PP and FP.

[0132] refer to Figure 5 Because the panel pads PP of the display panel DP and the connection pads FP of the connection circuit board FB overlap and contact each other, the display panel DP and the connection circuit board FB can be electrically connected to each other. Here, the method of connecting the panel pads PP to the connection pads FP will be described in detail.

[0133] Figure 6 It is a schematic diagram along Figure 1 A cross-sectional view of the section intercepted by line II-II', and Figure 7 It is a schematic diagram along Figure 1 A cross-sectional view of the section cut by line III-III'.

[0134] Multiple panel pads PP arranged in the non-display area NDA of the display panel DP can overlap with connection pads FP arranged on one surface of the connection circuit board FB, thereby electrically connecting the connection circuit board FB to the display panel DP.

[0135] For example, refer to Figure 6 The widths of the panel pads PP and the connecting pads FP are equal, and because the widths of the panel pads PP and the connecting pads FP correspond to each other, the panel pads PP can be individually connected to the connecting pads FP. However, in alternative embodiments, the widths of the panel pads PP and the connecting pads FP can be different and do not need to correspond directly to each other. Therefore, the side surfaces of the panel pads PP and the side surfaces of the connecting pads FP may not completely overlap.

[0136] The panel pads PP and connection pads FP can be of appropriate width to have structural stability, depending on the degree to which the panel pads PP and connection pads FP overlap and connect to each other, and the degree to which the panel pads PP and connection pads FP connect to each other to fully support the connection circuit board FB.

[0137] refer to Figure 7 The display panel DP may include a display area DA located in the middle of the display panel DP and non-display areas NDA located on both sides of the display area DA.

[0138] The non-display area NDA can be electrically connected to the connection circuit board FB in at least one area. In addition to the panel pad PP, the connection pad FP can also overlap and connect with the first additional pad AP1 and the second additional pad AP2, and the overlap of the connection pad FP with the first additional pad AP1 and the second additional pad AP2 facilitates determining the alignment of the panel pad PP and the connection pad FP. Accordingly, the reliability and electrical connection between the connection circuit board FB and the display panel DP can be improved. In an embodiment, the connection pad FP extends slightly beyond the corresponding second additional pad AP2 in the second direction DR2 in the non-display area NDA, but does not extend into the display area DA.

[0139] The display panel DP may include a substrate BSL, a pixel layer PXL, and a packaging layer TFE stacked on the third-direction DR3 in the cross-sectional view.

[0140] The substrate BSL can be a base layer on which the pixel layer PXL is formed. The substrate BSL can be a single layer or can include multiple insulating layers. The substrate BSL can include at least one of glass substrate, plastic substrate, film, and stack of multiple organic films and / or multiple inorganic films, but is not limited to any one embodiment.

[0141] The substrate BSL may include driving elements and signal lines for the pixel PX as described above. Accordingly, the substrate BSL may have a stacked structure of multiple conductive layers, multiple organic films, and / or multiple inorganic films.

[0142] The pixel layer PXL can be disposed on the substrate BSL. The pixel layer PXL can be electrically connected to the driving elements and signal lines of the substrate BSL. The pixel layer PXL includes the display elements in the pixel PX as described above. For example, if the display panel DP is an organic light-emitting display panel, the pixel layer PXL can include an organic light-emitting layer. The display area DA can correspond to the area where the pixel layer PXL is disposed.

[0143] The encapsulation layer TFE can be disposed on the pixel layer PXL to cover the pixel layer PXL. The encapsulation layer TFE can protect the pixel layer PXL. The encapsulation layer TFE can also cover the side surfaces of the pixel layer PXL. In addition, depending on the type of display panel DP, the encapsulation layer TFE can be omitted or replaced by another display substrate.

[0144] The connection circuit board FB can be placed in the non-display area NDA of the display panel DP to connect the main circuit board MB to the display panel DP. The connection circuit board FB can be placed on one side of the display panel DP in the second direction DR2.

[0145] For example, multiple connection circuit boards FB can be provided and arranged on the first direction DR1. As another example, the connection circuit board FB can be provided as a single component, and is not limited to any one embodiment.

[0146] Figure 8 This is a plan view schematically illustrating a portion of a display device according to an embodiment of the present disclosure. Figure 9 This is a plan view schematically illustrating a portion of a display device according to an embodiment of the present disclosure, and Figure 10 This is a plan view schematically illustrating a portion of a display device according to an embodiment of the present disclosure.

[0147] The panel pad portion (PD) may include a panel pad (PP), a first additional pad (AP1), and a second additional pad (AP2). The first additional pad (AP1) and the second additional pad (AP2) may be arranged sequentially, spaced apart from each other along a longitudinal extension of the panel pad (PP). For example, the panel pad (PP), the first additional pad (AP1), and the second additional pad (AP2) may be aligned along the extension.

[0148] A first spacing distance DT1 may be present between the panel pad PP and the first additional pad AP1. For example, the first spacing distance DT1 between the panel pad PP and the first additional pad AP1 can range from 5 micrometers (μm) to 20 μm. In a specific embodiment, the first spacing distance DT1 is exactly or approximately 10 μm.

[0149] A second spacing distance DT2 may be present between the first additional pad AP1 and the second additional pad AP2. Because the difference ΔD is determined between a first virtual line VL1 connecting the centers of the first additional pad AP1 and the second additional pad AP2, and a second virtual line VL2 connecting the centers of the widths of the connecting pad FP, the second spacing distance DT2 may need to have a sufficient value. In embodiments, the second spacing distance DT2 is greater than the first spacing distance DT1. For example, the range of the second spacing distance DT2 between the first additional pad AP1 and the second additional pad AP2 can be from 40 μm to 200 μm. In a specific embodiment, the second spacing distance DT2 is exactly or approximately 100 μm.

[0150] The length AT1 of the first additional pad AP1 can be long enough to allow the key to recognize its presence. For example, the length AT1 of the first additional pad AP1 can range from 20 μm to 80 μm. As a specific embodiment, the length AT1 of the first additional pad AP1 can be exactly or approximately 50 μm.

[0151] Similar to the length AT1 of the first additional pad AP1, the length AT2 of the second additional pad AP2 can be long enough to allow the key to recognize the presence of the second additional pad AP2. For example, the length AT2 of the second additional pad AP2 can range from 20 μm to 80 μm. As a specific embodiment, the length AT2 of the second additional pad AP2 can be exactly or approximately 50 μm. In an alternative embodiment, the length AT2 of the second additional pad AP2 and the length AT1 of the first additional pad AP1 are equal to each other.

[0152] Because the connecting pad FP needs to completely overlap with the panel pad PP, the first additional pad AP1, and the second additional pad AP2, the length FT of the connecting pad FP can be at least greater than the length PT of the panel pad PP. Specifically, the length FT of the connecting pad FP can be greater than the sum of the length PT of the panel pad PP, the first spacing distance DT1, the length AT1 of the first additional pad AP1, and the second spacing distance DT2. For example, the length of the panel pad portion PD and the length FT of the connecting pad FP can be equal to each other.

[0153] The width of the additional pad portion AP can be sufficiently large to determine the first virtual line VL1 connecting the centers of the additional pad portion AP as scanning proceeds in the first direction DR1. For example, the width of the panel pad PP can be equal to the width of the additional pad portion AP.

[0154] The width of the connection pad FP can also be sufficiently large to determine the second virtual line VL2 that centers the width of the connection pad FP as the scan proceeds in the first direction DR1. For example, the width of the connection pad FP can be equal to the width of the additional pad portion AP. As another example, the width of the connection pad FP can be smaller than the width of the additional pad portion AP.

[0155] The connection pads FP, additional pads AP1 and AP2, and panel pads PP can be made of various materials. For example, the connection pads FP can be made of a material that includes nickel on a copper substrate, the panel pads PP can be made of a material that includes Ti on a copper substrate, and the additional pads AP1 and AP2 can be made of a metallic material with high contrast to improve recognition.

[0156] The connection pad FP can at least partially overlap and connect with each of the corresponding panel pad PP, the first additional pad AP1, and the second additional pad AP2. The connection pad FP only needs to contact the panel pad PP, the first additional pad AP1, and the second additional pad AP2, and very precise alignment is not required.

[0157] In other words, Figure 10 In this arrangement, the panel pad portion (PD) and the connection pad (FP) slightly overlap to the right, maintaining a small gap. This arrangement ensures that the connection pad (FP) does not overlap with other panel pad portions (PD), thus avoiding short circuits by maintaining a safe minimum distance. Furthermore, the connection pad (FP) can be attached to the panel pad portion (PD) even if it is not perfectly aligned and is slightly offset in any direction such as up, down, left, or right.

[0158] In other words, a connection pad FP needs to contact only one panel pad PP, one first additional pad AP1, and one second additional pad AP2, and cannot contact another panel pad PP, another first additional pad AP1, and another second additional pad AP2. Accordingly, the electrical reliability of the display device 1 can be improved, and short circuits can be prevented.

[0159] Figures 11 to 14 This is a plan view illustrating some operations of a method for manufacturing a display device according to an embodiment of the present disclosure. Hereinafter, a method for manufacturing a display device according to an embodiment of the present disclosure, as well as a method for aligning panel pad portions PD and connection pads FP, will be described.

[0160] Display device 1 can be manufactured by performing an operation to form a display panel DP, in which a panel pad group PPG is arranged, comprising a plurality of panel pads PP arranged in a first direction DR1 and additional pad portions AP spaced apart from the panel pads PP along a straight line extending longitudinally in each of the plurality of panel pads PP. The additional pad portions AP may include a first additional pad AP1 and a second additional pad AP2 arranged sequentially along a straight line extending longitudinally in the panel pads PP and spaced apart from each other longitudinally in the panel pads PP.

[0161] The display device 1 can be manufactured by further performing an operation to check the alignment of the panel pad group PPG and the connection pad group FPG after the operation of forming the display panel DP and the operation of forming the connection circuit board FB including the connection pad group FPG. The connection pad group FPG includes a plurality of connection pads FP arranged in a first direction DR1.

[0162] In detail, because the panel pads PP have different tilt angles, it is difficult to accurately align the panel pads PP and the connection pads FP when they are offset simultaneously in the first direction DR1 and the second direction DR2. However, this problem can be solved by arranging additional pad portions AP.

[0163] The operation of checking the alignment of the panel pad group PPG and the connection pad group FPG may include generating a first virtual line VL1 connecting the center of the first additional pad AP1 and the center of the second additional pad AP2, and then measuring the difference ΔD between the first virtual line VL1 and a second virtual line VL2, which is the center line of the connection pad FP. Specifically, the difference ΔD in distance between the first virtual line VL1 and the second virtual line VL2 in a first direction DR1 may be measured.

[0164] In detail, firstly, it can be like this Figure 11 The diagram shows the identification of the first additional pad AP1 and the second additional pad AP2. The key KEY can identify the presence of the first additional pad AP1 and the second additional pad AP2 located in the non-display area NDA, and then identify the positions of the first additional pad AP1 and the second additional pad AP2 as the scan proceeds.

[0165] As the scan progresses, it can be like... Figure 12 The diagram shows the center of the first additional pad AP1 and the center of the second additional pad AP2, and a first virtual line VL1 connecting the centers of the first additional pad AP1 and the second additional pad AP2 can be generated. The scan can be performed by a camera or a processor.

[0166] Additionally, a second virtual line VL2 can be generated by scanning to connect the center of the width of the connecting pad FP, and the difference ΔD between the first virtual line VL1 and the second virtual line VL2 can be measured (specifically, the difference ΔD between the distances of the first virtual line VL1 and the second virtual line VL2 in the first direction DR1).

[0167] By measuring the distance difference ΔD between the first virtual line VL1 and the second virtual line VL2, the alignment degree of the additional pad portion AP and the connecting pad FP can be determined. Because the additional pad portion AP is located on the longitudinal extension line of the panel pad PP, the alignment degree of the panel pad PP and the connecting pad FP can be determined.

[0168] Alternatively, a system configured to automatically adjust the alignment of panel pads PP and connection pads FP can be driven by feedback of alignment measurements. For example, the system may include actuators or robots that physically adjust the position of the pads or the position of the substrate on which the pads are mounted based on the measurements.

[0169] During the alignment inspection of panel pad groups (PPG) and connection pad groups (FPG), if the distance between the first virtual line VL1 and the second virtual line VL2 is greater than or equal to a preset distance, the alignment can be identified as defective or misaligned. The preset distance can be at least a distance that prevents short circuits between the closest panel pads (PP).

[0170] The display device 1 can be manufactured by further performing the operation of connecting the display panel DP to the connection circuit board FB such that the connection pad FP overlaps at least with a portion of the panel pad PP and the additional pad portion AP after checking the alignment operation of the panel pad group PPG and the connection pad group FPG.

[0171] The operation of connecting the display panel DP to the connection board FB may include ensuring that each of the plurality of connection pads FP at least partially overlaps and connects with each of the corresponding panel pad PP, the first additional pad AP1, and the second additional pad AP2. For example, the process of attaching the display panel DP to the connection board FB may include ensuring that each of the plurality of connection pads FP partially overlaps and connects with both the corresponding panel pad PP and the first additional pad AP1 and the second additional pad AP2.

[0172] In the display device 1 manufactured by the above operation, even when the panel pads PP have different tilt angles, the pads PP and FP can be aligned by an additional pad portion AP arranged along the extension line of the length of the panel pads PP, even when the connecting pads FP are connected to the center of the panel pads PP in the first direction DR1 and the second direction DR2, and then the connecting circuit board FB and the display panel DP can be electrically connected to each other.

[0173] By precisely adjusting the positions of the connection circuit board FB and the display panel DP, especially by precisely adjusting their alignment before joining the connection pad FP and the panel pad PP, a display device 1 with small pitch that supports high resolution can be manufactured.

[0174] In addition, even with a small pitch, a high-quality display device 1 in which the connecting circuit board FB and the display panel DP are electrically connected to each other can be produced, which can help reduce the defect rate.

[0175] Figure 15 This is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0176] The electronic device 1000 outputs various information through the display module 1400 within the operating system. When the processor 1100 executes an application stored in the memory 1200, the display module 1400 provides application information to the user through the display panel DP.

[0177] Processor 1100 receives external input via input module 1300 or sensor module 1610 and executes an application corresponding to the external input. For example, when a user selects the camera icon displayed on display panel DP, processor 1100 receives user input via input sensor 1610-2 and activates camera module 1710. Processor 1100 transmits image data corresponding to the captured image obtained by camera module 1710 to display module 1400. Display module 1400 can display the image corresponding to the captured image via display panel DP.

[0178] As another example, when personal information authentication is performed in the display module 1400, the fingerprint sensor 1610-1 obtains the input fingerprint information as input data. The processor 1100 compares the input data obtained by the fingerprint sensor 1610-1 with the authentication data stored in the memory 1200, and executes the application based on the comparison result. The display module 1400 can display the information obtained through the execution of the application logic via the display panel DP.

[0179] As another example, when a music stream icon displayed on display module 1400 is selected, processor 1100 obtains user input via input sensor 1610-2 and activates the music stream application stored in memory 1200. When a music execution command is entered in the music stream application, processor 1100 activates audio output module 1630 to provide the user with audio information corresponding to the music execution command.

[0180] The operation of the electronic device 1000 has been briefly described above. The construction of the electronic device 1000 will be described in detail below. Some of the components of the electronic device 1000 described below may be integrated into a single component and then provided, or one component of the electronic device 1000 may be divided into two or more components and then provided.

[0181] refer to Figure 15 Electronic device 1000 can communicate with external electronic device 1020 via a network (e.g., a short-range wireless communication network or a long-range wireless communication network). According to embodiments, electronic device 1000 may include a processor 1100, a memory 1200, an input module 1300, a display module 1400, a power module 1500, an internal module 1600, and an external module 1700. According to embodiments, at least one of the above-described components may be omitted from electronic device 1000, or one or more other components may be added to electronic device 1000. In embodiments, some of the components described above (e.g., sensor module 1610, antenna module 1620, or audio output module 1630) may be integrated into another component (e.g., display module 1400).

[0182] The processor 1100 can execute software to control at least one other component (e.g., hardware or software component) of the electronic device 1000 connected to the processor 1100, and can perform various operations of data processing or calculation. According to an embodiment, as at least part of data processing or calculation, the processor 1100 can store commands or data received from another component (e.g., input module 1300, sensor module 1610, or communication module 1730) in volatile memory 1210, process the commands or data stored in volatile memory 1210, and store the result data in non-volatile memory 1220.

[0183] Processor 1100 may include a main processor 1110 and an auxiliary processor 1120. Main processor 1110 may include one or more of a central processing unit (CPU) 1111 and an application processor (AP). Main processor 1110 may further include one or more of a graphics processing unit (GPU) 1112, a communication processor (CP), and an image signal processor (ISP). Main processor 1110 may further include a neural processing unit (NPU) 1113. The NPU is a processor specifically designed to process artificial intelligence models, which can be generated through machine learning. The artificial intelligence model may include multiple neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination thereof, but is not limited thereto. In addition to the hardware architecture, the artificial intelligence model may additionally or alternatively include a software architecture. At least two of the aforementioned processing units and processors may be implemented as a single integrated construct (e.g., a single chip) or may be implemented as separate components (e.g., multiple chips).

[0184] The auxiliary processor 1120 may include a controller 1120-1. The controller 1120-1 may include interface conversion circuitry and timing control circuitry. The controller 1120-1 receives image signals from the main processor 1110, converts the data format of the image signals to conform to the interface specifications of the display module 1400, and outputs the image data. The controller 1120-1 may output various control signals required to drive the display module 1400.

[0185] The auxiliary processor 1120 may further include a data conversion circuit 1120-2, a gamma correction circuit 1120-3, a rendering circuit 1120-4, etc. The data conversion circuit 1120-2 can receive image data from the controller 1120-1 and can compensate the image data so that the image is displayed with a desired brightness according to the characteristics of the electronic device 1000 or user settings, or can convert the image data to reduce power consumption or compensate for afterimages. The gamma correction circuit 1120-3 can convert image data or gamma reference voltage, etc., so that the image displayed on the electronic device 1000 has desired gamma characteristics. The rendering circuit 1120-4 can receive image data from the controller 1120-1 and can render the image data by taking into account the pixel layout of the display panel DP applied to the electronic device 1000. At least one of the data conversion circuit 1120-2, the gamma correction circuit 1120-3, and the rendering circuit 1120-4 can be integrated into another component (e.g., the main processor 1110 or the controller 1120-1). At least one of the data conversion circuit 1120-2, the gamma correction circuit 1120-3, and the rendering circuit 1120-4 can be integrated into the data driver DD, which will be described below.

[0186] The memory 1200 may store various data used by at least one component of the electronic device 1000 (e.g., processor 1100 or sensor module 1610), as well as input or output data regarding commands associated therewith. The memory 1200 may include at least one of volatile memory 1210 and non-volatile memory 1220.

[0187] The input module 1300 can receive commands or data from outside the electronic device 1000 (e.g., from a user or external electronic device 1020) for use by components of the electronic device 1000 (e.g., processor 1100, sensor module 1610, or audio output module 1630).

[0188] Input module 1300 may include a first input module 1310 into which commands or data are input from a user, and a second input module 1320 into which commands or data are input from an external electronic device 1020. The first input module 1310 may include a microphone, mouse, keyboard, buttons (e.g., keypads), or pen (e.g., a passive or active pen). The second input module 1320 may support a specified protocol enabling wired or wireless connectivity with the external electronic device 1020. According to embodiments, the second input module 1320 may include a High Definition Multimedia Interface (HDMI) unit, a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface. The second input module 1320 may include a connector for physical connection to the external electronic device 1020 (e.g., an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector)).

[0189] Display module 1400 provides information to the user visually. Display module 1400 may include a display panel DP, a scan driver GP, and a data driver DD. Display module 1400 may further include a window, a chassis, and a bracket for protecting the display panel DP.

[0190] refer to Figure 15 The description of the display panel DP, etc., refers to the above reference. Figures 1 to 14 The description includes the display panel DP, etc. Therefore, the redundant description of the display panel DP, etc., provided above can be omitted.

[0191] The display panel DP may further include a light-emitting driver. The light-emitting driver outputs a light-emitting control signal to the display panel DP in response to a control signal received from the controller 1120-1. The light-emitting driver may be implemented separately from the scan driver GP, or it may be integrated into the scan driver GP.

[0192] The scan driver GP receives control signals from the controller 1120-1 and outputs scan signals to the display panel DP in response to the control signals. For example, the control signals generated by the controller 1120-1 and transmitted to the scan driver GP can be scan input signals for controlling the scan driver GP. The scan input signals can be input signals applied to switching elements included in the stages of the scan driver GP.

[0193] The data driver DD receives a control signal from the controller 1120-1, converts image data into an analog voltage (e.g., a data voltage) in response to the control signal, and then outputs the data voltage to the display panel DP. For example, the control signal generated by the controller 1120-1 and transmitted to the data driver DD can be a data input signal for controlling the data driver DD.

[0194] The data driver DD can be integrated into another component (e.g., controller 1120-1). The functions of the interface conversion circuit and timing control circuit of the controller 1120-1 can be integrated into the data driver DD.

[0195] The controller 1120-1 can generate the clock signal required to drive the scan driver GP. Each stage of the scan driver GP can operate based on the clock signal corresponding to that stage.

[0196] The scan driver GP can generate a scan signal based on the scan input signal, clock signal, and scan input voltage. The scan signal can be transmitted to the pixel circuit, and the thin-film transistors included in the pixel circuit can be driven based on the scan signal. The scan signal can also be transmitted to the gate of the thin-film transistor included in the pixel circuit.

[0197] The display module 1400 may further include a light-emitting driver, a voltage generation circuit, etc. The voltage generation circuit can output various voltages required to drive the display panel DP.

[0198] The power module 1500 supplies power to the components of the electronic device 1000. The power module 1500 can generate the gate drive voltage (e.g., gate high voltage or gate low voltage) required to drive the scan driver GP.

[0199] For example, power module 1500 can refer to a power generation unit, power source, etc. For example, power module 1500 may include a battery to be charged with a power supply voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0200] For example, power module 1500 may include a power management integrated circuit (PMIC). The PMIC provides optimized power to each of the modules described above and the modules described below.

[0201] For example, the power module 1500 may include a wireless power transmission / reception component electrically connected to a battery. The wireless power transmission / reception component may include multiple coil-shaped antenna radiators.

[0202] The electronic device 1000 may further include an internal module 1600 and an external module 1700. The internal module 1600 may include a sensor module 1610, an antenna module 1620, and an audio output module 1630. The external module 1700 may include a camera module 1710, an optical module 1720, and a communication module 1730.

[0203] The sensor module 1610 can detect input from the user's body or from a pen included in the first input module 1310, and generate an electrical signal or data value corresponding to the input. The sensor module 1610 may include at least one of a fingerprint sensor 1610-1, an input sensor 1610-2, and a digitizer 1610-3.

[0204] The fingerprint sensor 1610-1 can generate data values ​​corresponding to a user's fingerprint. The fingerprint sensor 1610-1 may include an optical or capacitive fingerprint sensor.

[0205] The input sensor 1610-2 can generate data values ​​corresponding to the coordinate information of input from a user's body or a pen. The input sensor 1610-2 generates data values ​​based on the change in electrostatic capacitance caused by the input. The input sensor 1610-2 can detect input from a passive pen, or send data to or receive data from an active pen.

[0206] The input sensor 1610-2 can also measure biosignals such as blood pressure, water content, or body fat. For example, when a user touches the sensor layer or sensing panel with a part of their body and does not move for a specific period of time, the input sensor 1610-2 can detect biosignals based on changes in the electric field caused by that part of the user's body and output the information desired by the user to the display module 1400.

[0207] The digitizer 1610-3 can generate data values ​​corresponding to the coordinate information of the pen input. The digitizer 1610-3 generates data values ​​based on electromagnetic changes caused by the input. The digitizer 1610-3 can detect input from a passive pen, or send data to or receive data from an active pen.

[0208] At least one of the fingerprint sensor 1610-1, the input sensor 1610-2, and the digitizer 1610-3 can be implemented as a sensor layer formed on the display panel DP by a continuous process. The fingerprint sensor 1610-1, the input sensor 1610-2, and the digitizer 1610-3 can be arranged on the upper side of the display panel DP, and any one of the fingerprint sensor 1610-1, the input sensor 1610-2, and the digitizer 1610-3 (e.g., the digitizer 1610-3) can be arranged on the lower side of the display panel DP.

[0209] At least two of the fingerprint sensor 1610-1, input sensor 1610-2, and digitizer 1610-3 can be formed into a single sensing panel using the same process. When they are integrated into a single sensing panel, the sensing panel can be arranged between the display panel DP and a window arranged above the display panel DP. According to an embodiment, the sensing panel can be arranged on the window, and the position of the sensing panel is not particularly limited.

[0210] At least one of the fingerprint sensor 1610-1, the input sensor 1610-2, and the digitizer 1610-3 can be embedded in the display panel DP. That is, at least one of the fingerprint sensor 1610-1, the input sensor 1610-2, and the digitizer 1610-3 can be formed simultaneously by a process for forming elements (e.g., display elements (or light-emitting elements) or transistors) included in the display panel DP.

[0211] Additionally, sensor module 1610 can generate electrical signals or data values ​​corresponding to the internal or external states of electronic device 1000. Sensor module 1610 may further include, for example, a gesture sensor, gyroscope sensor, barometric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0212] Antenna module 1620 may include one or more antennas for transmitting or receiving signals or power to or from an external source. According to an embodiment, communication module 1730 may transmit or receive signals to or from external electronic device 1020 via an antenna suitable for a communication method. The antenna configuration of antenna module 1620 may be integrated into a component of display module 1400 (e.g., display panel DP) or input sensor 1610-2.

[0213] The audio output module 1630 is a device for outputting audio signals to the outside of the electronic device 1000, and may include, for example, a speaker for general purposes such as multimedia playback or recording playback, and a receiver specifically for call reception. According to embodiments, the receiver may be integrally formed with the speaker or formed separately from the speaker. The audio output mode of the audio output module 1630 may be integrated into the display module 1400.

[0214] Camera module 1710 (e.g., camera device) can capture still or moving images. According to embodiments, camera module 1710 may include one or more lenses, image sensors, or ISPs. Camera module 1710 may further include an IR camera capable of measuring the presence or absence of a user, the user's position, the user's gaze, etc. For example, camera module 1710 can be used to capture images of the aforementioned pads; processor 1100 or 1120 can determine virtual lines VL1 and VL2, the distance between them, and whether they are aligned or need to be adjusted based on that distance. Electronic device 1000 may additionally include actuators (e.g., linear actuators), robotic arms, or motorized platforms that can be used to adjust the position of pads PP and / or FP, or the position of the substrate on which pads PP and / or FP are located, to ensure proper connection between panel pads PP and connecting pads FP, and between panel pads PP and additional pads AP1 / AP2.

[0215] The optical module 1720 can provide light. The optical module 1720 may include a light-emitting diode or a xenon lamp. The optical module 1720 can operate in conjunction with the camera module 1710 or independently.

[0216] Communication module 1730 can support the establishment of a wired or wireless communication channel between electronic device 1000 and external electronic device 1020 and perform communication through the established communication channel. Communication module 1730 may include any one or both of the following: a wireless communication module such as a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module; and a wired communication module such as a Local Area Network (LAN) communication module or a Power Line Communication module. Communication module 1730 can communicate with external electronic device 1020 via a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA) or via a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a Wide Area Network (WAN)). The various types of communication modules described above can be implemented as a single chip or as separate chips.

[0217] The input module 1300, sensor module 1610, and camera module 1710 can be used to cooperate with the processor 1100 to control the operation of the display module 1400.

[0218] The processor 1100 outputs commands or data to the display module 1400, audio output module 1630, camera module 1710, or optical module 1720 based on input data received from the input module 1300. For example, the processor 1100 may generate image data and output it to the display module 1400 in response to input data received via a mouse or active pen, or generate command data and output it to the camera module 1710 or optical module 1720 in response to input data. When no input data is received from the input module 1300 for a specific period of time, the processor 1100 may switch the operating mode of the electronic device 1000 to a low-power mode or sleep mode to reduce the power consumption of the electronic device 1000.

[0219] The processor 1100 outputs commands or data to the display module 1400, audio output module 1630, camera module 1710, or optical module 1720 based on sensing data received from the sensor module 1610. For example, the processor 1100 can compare authentication data applied from the fingerprint sensor 1610-1 with authentication data stored in the memory 1200, and then execute an application based on the comparison result. The processor 1100 can execute commands or output corresponding image data to the display module 1400 based on sensing data detected by the input sensor 1610-2 or the digitizer 1610-3. Where a temperature sensor is included in the sensor module 1610, the processor 1100 can receive temperature data about the measured temperature from the sensor module 1610, and perform brightness correction, etc., on the image data based on the temperature data.

[0220] The processor 1100 can receive measurement data from the camera module 1710 regarding the presence or absence of a user, the user's location, the user's gaze, etc. The processor 1100 can further perform brightness correction and other functions on the image data based on the measurement data. For example, the processor 1100, having determined the presence or absence of a user through input from the camera module 1710, can output image data whose brightness has been corrected by the data conversion circuit 1120-2 or the gamma correction circuit 1120-3 to the display module 1400.

[0221] Some of the aforementioned components can be connected to each other via communication schemes such as bus, general purpose input / output (GPIO), serial peripheral interface (SPI), mobile industrial processor interface (MIPI), or ultrapath interconnect (UPI) links to exchange signals (e.g., commands or data). Processor 1100 can communicate with display module 1400 via a pre-agreed interface and can use, for example, any of the aforementioned communication schemes, and is not limited to them.

[0222] Electronic device 1000 according to various embodiments disclosed herein may include various types of devices. Electronic device 1000 may include at least one of, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, and home appliances. Electronic device 1000 according to embodiments of this disclosure is not limited to the devices described above.

[0223] In this embodiment, the electronic device 1000 may include a controller 1120-1, a power supply module 1500, and a display module 1400. The display module 1400 may include a display panel DP and a scan driver GP. The controller 1120-1 can generate the scan input signal required to drive the scan driver GP. Under the control of the processor 1100 or the controller 1120-1, the power supply module 1500 can generate the scan input voltage required to drive the scan driver GP. For example, the scan input voltage may be a gate drive voltage.

[0224] The display panel DP can be divided into a display area DA in which pixel circuits are arranged and a non-display area NDA surrounding the display area DA. As described above, the area where the image is displayed can correspond to the display area DA, and the area outside the display area DA that does not display the image can correspond to the non-display area NDA.

[0225] The scan driver GP can be arranged in the non-display area NDA and can receive scan input signals from the controller 1120-1 and scan input voltages from the power supply module 1500. The scan driver GP can generate or output scan signals based on the scan input signals and / or scan input voltages. The scan signals can be transmitted from the scan driver GP to the pixel circuitry.

[0226] In an embodiment, the scan driver GP may include at least one capacitor. The at least one capacitor may include one electrode and another electrode. For example, the one electrode may be a signal line transmitting at least one of a scan input signal and a scan input voltage. For example, the one electrode may be at least a portion of the signal line transmitting at least one of the scan input signal and the scan input voltage. The signal line may be, for example, wiring through which the scan input voltage is transmitted.

[0227] For example, the other electrode may overlap with the first electrode. The other electrode may overlap with a signal line that transmits at least one of the scan input signal and the scan input voltage. For example, the other electrode may overlap with at least a portion of a signal line that transmits at least one of the scan input signal and the scan input voltage.

[0228] In an embodiment, the non-display area NDA may include a wiring arrangement area therein and a circuit arrangement area located between the display area DA and the wiring arrangement area, in which at least one transistor is arranged. For example, at least one capacitor may be arranged in the wiring arrangement area. At least one capacitor may be arranged in the circuit arrangement area.

[0229] In an embodiment, on a plan view, at least one capacitor may be spaced apart from at least one transistor in a first direction, and signal lines may extend in a second direction intersecting the first direction.

[0230] Additionally, the display module 1400 included in the electronic device 1000 may include the above-mentioned reference. Figures 1 to 14 The characteristics of the display panel DP described above will be readily understood by those skilled in the art. Figures 1 to 14 The provided description of the display panel DP can be applied to Figure 15 The display module 1400.

[0231] Each of the above embodiments can be implemented independently, but the structure of each embodiment can be combined and applied to other embodiments.

[0232] Although this disclosure has been described with reference to merely exemplary embodiments shown in the accompanying drawings, those skilled in the art will understand that various modifications and equivalent other embodiments are also possible thereunder.

[0233] The specific implementations shown and described herein are illustrative examples of embodiments and are not intended to limit the scope of the embodiments in any way.

[0234] According to embodiments of this disclosure, a display device, an electronic device including the display device, and a method of manufacturing the display device can be realized, wherein alignment measurement is facilitated by additionally connecting the additional pads of the display panel to the connecting pads of the connecting circuit board, electrical coupling is stably performed, and high-resolution images can be achieved.

Claims

1. A display device, comprising a display panel, the display panel comprising: The display area includes multiple pixels; The non-display area includes a panel pad group, which comprises multiple panel pads arranged in a first direction and each connected to at least one of the pixels for receiving one or more signals. The panel pad group further includes additional pad portions arranged longitudinally and spaced apart from each of the plurality of panel pads, and The additional pad portion includes a first additional pad and a second additional pad that are sequentially spaced apart from each other in the longitudinal direction of the panel pads.

2. The display device according to claim 1, wherein, The first additional pad and the second additional pad overlap with an extension line that passes through the center of the panel pad in the transverse direction and extends in the longitudinal direction of the panel pad.

3. The display device according to claim 1, wherein, The first additional pad and the second additional pad are arranged in parallel to each other.

4. The display device according to claim 1, wherein, The panel pads and the additional pads are arranged parallel to each other.

5. The display device according to claim 1, wherein, The second additional pad is arranged to be closer to the display area than the first additional pad in the longitudinal direction of the panel pad.

6. The display device according to claim 1, wherein, The width of the end of the panel pad group closest to the display area is greater than the width of the other end of the panel pad group closest to the edge of the display panel.

7. The display device according to claim 1, further comprising: A connection circuit board includes a set of connection pads, the set of connection pads comprising a plurality of connection pads arranged on the connection circuit board in the first direction. The connecting circuit board is configured to transmit the signal to the panel pad group.

8. The display device according to claim 7, wherein, Each of the plurality of connection pads is arranged to overlap with at least one area of ​​each of the corresponding panel pads, the first additional pad, and the second additional pad, and The plurality of connecting pads of the connecting pad group correspond to and are electrically connected to the plurality of panel pads of the panel pad group.

9. The display device according to claim 7, wherein, The connecting circuit board is provided as a plurality of connecting circuit boards arranged in the first direction. The panel pad groups are provided as multiple panel pad groups arranged corresponding to the plurality of connection circuit boards, and The plurality of panel pad groups correspond to and are electrically connected to the plurality of connecting circuit boards.

10. The display device according to any one of claims 1 to 9, further comprising: A third additional pad is disposed between the first additional pad and the second additional pad.

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