Heat exchange plate, heat exchange module and electronic equipment
By increasing the width of the support section and narrowing the flow channel in the bending area of the heat exchange plate, the problem of high resistance during bending is solved, resulting in smoother bending and a longer service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2026-03-31
AI Technical Summary
The existing heat exchange plate has a large flow channel width in the bending area, which increases the resistance when bending and affects the bending performance.
The width of the support is increased in the bending zone, and the width of the widened part gradually decreases in its extension direction to form a gradual transition zone. At the same time, the heat exchange channel in the bending zone becomes narrower.
It improves the structural stability of the bending zone, reduces fluid resistance during bending, increases fluid flow velocity, prevents bulging in the bending zone, and extends service life.
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Figure CN121772152A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat exchange technology, and more specifically, to a heat exchange plate, a heat exchange module, and electronic equipment. Background Technology
[0002] In related technologies, heat exchange plates are typically designed with bending zones corresponding to the bending areas to accommodate the bent parts of electronic devices. However, existing heat exchange plates have relatively large flow channel widths in the bending zones, which causes the bending zones of the heat exchange plates to bulge inwards during bending, increasing the resistance during bending and thus affecting bending performance. Summary of the Invention
[0003] This application provides a new technical solution for heat exchange plates, which can at least solve the problem of poor bending performance of existing heat exchange plates.
[0004] This application also provides a new technical solution for a heat exchange module.
[0005] This application also provides a new technical solution for an electronic device.
[0006] According to a first aspect of this application, a heat exchange plate is provided, comprising: a body having a cavity and a support portion therein, the support portion dividing the cavity into heat exchange channels; the body including a heat exchange zone and a bending zone, the support portion extending to the heat exchange zone and the bending zone, wherein the width of the support portion at least partially distributed in the bending zone is greater than the width of the support portion distributed in the heat exchange zone.
[0007] Optionally, the body includes multiple heat exchange zones, and the bending zone is arranged between two of the heat exchange zones.
[0008] Optionally, the body includes multiple bending zones.
[0009] Optionally, in the bending area, the portion of the support portion whose width increases relatively is a widened portion, the widened portion having opposing first and second sides in its width direction, at least one segment of the first side and at least one segment of the second side being parallel to each other.
[0010] Optionally, along the extending direction of the support portion itself, the width of the widened portion gradually decreases from the middle of the widened portion to both ends of the widened portion.
[0011] Optionally, the width of the heat exchange channels on both sides of the widened portion is W1, and the width of the heat exchange channels on both sides of the remaining portion of the support portion is W2, where 1 / 3*W2≤W1≤1 / 2*W2.
[0012] Optionally, the length of the widened portion is less than or equal to 20 mm along the extending direction of the support itself.
[0013] Optionally, in the heat exchange zone, the width of the support portion ranges from 0.5 mm to 2.5 mm.
[0014] Optionally, in the bending area, the width of the support portion ranges from 0.5 mm to 3.5 mm.
[0015] Optionally, in the heat exchange zone, the ratio of the width of the support to the width of the heat exchange channel ranges from 1 / 5 to 1 / 3.
[0016] Optionally, in the bending region, the ratio of the width of the support to the width of the heat exchange channel ranges from 2 / 1 to 4.5 / 1.
[0017] Optionally, in the thickness direction of the body, the height of the heat exchange channel in the bend zone is less than the height of the heat exchange channel in the heat exchange zone.
[0018] According to a second aspect of this application, a heat exchange module is provided, comprising the heat exchange plate described in any of the preceding claims.
[0019] According to a third aspect of this application, an electronic device is provided, characterized in that it includes the above-mentioned heat exchange module, the electronic device having a bent structure, and the bent area of the heat exchange plate corresponding to the position of the bent structure.
[0020] According to the heat exchange plate of this application, by widening the support portion of the bending zone, the stability of the bending zone structure can be ensured, and at least part of the heat exchange channel in the bending zone is narrowed, thereby reducing the volume of liquid in the corresponding area, thus reducing the fluid resistance to be overcome during bending and making the bending zone smoother. At the same time, the narrowed heat exchange channel can accelerate the flow rate of liquid in this area, thereby reducing the squeezing pressure of the heat exchange fluid on the bending zone, preventing the bending zone from bulging towards the bending side, thus making the bending zone smoother, effectively improving the bending performance, and effectively extending the service life of the heat exchange plate.
[0021] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description
[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.
[0023] Figure 1 This is a schematic diagram of the structure of a heat exchange plate according to an embodiment provided in this application;
[0024] Figure 2This is a schematic diagram of the structure of a heat exchange plate according to another embodiment provided in this application.
[0025] Figure Labels
[0026] 100. Heat exchange plate;
[0027] 10. Heat exchange zone; 20. Bend zone;
[0028] 30. Support section; 31. Widened section;
[0029] 40. Heat exchange channel. Detailed Implementation
[0030] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present application.
[0031] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.
[0032] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.
[0033] In all the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.
[0034] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.
[0035] The heat exchange plate 100 according to an embodiment of this application will now be described in detail with reference to the accompanying drawings.
[0036] like Figure 1 and Figure 2 As shown, the heat exchange plate 100 according to an embodiment of this application includes a body.
[0037] Specifically, the body has a cavity and a support 30, the support 30 dividing the cavity into heat exchange channels 40; the body includes a heat exchange zone 10 and a bending zone 20, the support 30 extends to the heat exchange zone 10 and the bending zone 20, and the width of the support 30 distributed in at least part of the bending zone 20 is greater than the width of the support 30 distributed in the heat exchange zone 10.
[0038] In other words, such as Figure 1 and Figure 2 As shown, the heat exchange plate 100 according to the embodiment of this application is mainly used in electronic devices. The heat exchange plate 100 includes a body, which is divided into a heat exchange zone 10 and a bendable bending zone 20. The body has cavities distributed in the heat exchange zone 10 and the bending zone 20. The cavity is provided with a support portion 30 extending to the heat exchange zone 10 and the bending zone 20. The support portion 30 can divide the cavity into heat exchange channels 40 suitable for the flow of heat exchange fluid. The body is also provided with a first liquid passage hole and a second liquid passage hole communicating with the heat exchange channel 40.
[0039] In this embodiment, the width of at least a portion of the support portion 30 located in the bending zone 20 is greater than the width of the support portion 30 located in the heat exchange zone 10, that is, a part or all of the support portion 30 located in the bending zone 20 is widened.
[0040] The widened support portion 30 helps maintain the shape of the bending zone 20, ensuring structural stability during bending. On the other hand, it narrows at least part of the heat exchange channel 40 located in the bending zone 20. This change directly reduces the volume of liquid in the region, thereby reducing the fluid resistance that needs to be overcome during bending.
[0041] At the same time, the narrowing of the heat exchange channel 40 promotes the increase of liquid flow rate. The increase in flow rate helps to reduce the fluid pressure in the local area, thereby reducing the squeezing pressure of the heat exchange liquid on the bending zone 20 and effectively preventing the bending zone 20 from bulging to one side during the bending process, thus ensuring the smooth progress of the bending process.
[0042] Therefore, according to the embodiments of this application, the heat exchange plate 100, by widening the support portion 30 of the bending region 20, can ensure the stability of the bending region 20 structure and narrow at least part of the heat exchange channel 40 located in the bending region 20, thereby reducing the volume of liquid in the corresponding area, thereby reducing the fluid resistance to be overcome during bending and making the bending region 20 bend more smoothly; at the same time, the narrowed heat exchange channel 40 can accelerate the flow rate of liquid in this area, thereby reducing the squeezing force of the heat exchange liquid on the bending region 20, preventing the bending region 20 from bulging towards the bending side, thereby making the bending region 20 bend more smoothly, effectively improving the bending performance, and effectively extending the service life of the heat exchange plate 100.
[0043] In some examples of this application, the entire body or the bending region 20 is made of a flexible material, such as a polymer.
[0044] According to one embodiment of this application, the body includes a plurality of heat exchange zones 10, and a bending zone 20 is arranged between two heat exchange zones 10.
[0045] Specifically, such as Figure 1 and Figure 2As shown, the body has multiple heat exchange zones 10, which can be distributed along the length of the plate. A bending zone 20 is provided between at least two heat exchange zones 10, so that at least two heat exchange zones 10 can be folded relative to each other. This allows the heat exchange plate 100 to be flexibly adapted to equipment that requires folding, effectively improving the applicability of the heat exchange plate 100.
[0046] In some specific embodiments of this application, the body includes multiple bending regions 20.
[0047] In other words, the body has multiple bending areas 20, and the bending areas 20 are located in the following ways, including but not limited to the following situations.
[0048] Case 1: Multiple bending zones 20 are provided on multiple sides of the heat exchange zone 10 so that the heat exchange plate 100 can be used in equipment with multiple bending structures;
[0049] Scenario 2: Multiple bending zones 20 are set between two different heat exchange zones 10 so that the heat exchange plate 100 can be used in equipment with multiple fold structures.
[0050] According to one embodiment of this application, in the bending region 20, the portion of the support portion 30 with a relatively increased width is a widened portion 31. The widened portion 31 has opposing first and second sides in its width direction, and at least one segment of the first side and at least one segment of the second side are parallel to each other.
[0051] In other words, such as Figure 1 and Figure 2 As shown, the portion of the support portion 30 distributed in the bending area 20 with a relatively increased width is the widened portion 31. At least a portion of the widened portion 31 has a consistent width, for example, the width of the middle portion of the widened portion 31 is consistent, such that the middle portion of the widened portion 31 is parallel to each other on the first and second sides in its width direction. This portion can correspond to the center position of the bend (e.g., the pivot axis of an electronic device).
[0052] In this embodiment, the parallel design allows for a more uniform distribution of stress when the part is subjected to bending force, reducing stress concentration and thus enhancing the stability of the structure. At the same time, it ensures that the heat exchange fluid exerts a relatively uniform pressure on the bending area 20 in this part, which can further prevent the bending area 20 from bulging towards the bending side.
[0053] In some specific embodiments of this application, along the extending direction of the support portion 30 itself, the width of the widened portion 31 gradually decreases from the middle of the widened portion 31 to both ends of the widened portion 31.
[0054] Specifically, such as Figure 2As shown, the widened portion 31 not only has a portion with a uniform width, but also has a distribution with a gradually decreasing width. Specifically, in the extending direction of the support portion 30, the widened portion 31 has a first end and a second end that are disposed opposite to each other. The width between the first end of the widened portion 31 and the middle portion gradually decreases from the first end of the middle portion of the widened portion 31 to the first end of the widened portion 31. The width between the second end of the widened portion 31 and the middle portion gradually decreases from the second end of the middle portion of the widened portion 31 to the second end of the widened portion 31.
[0055] In this embodiment, the reduction in width actually creates a gradual transition zone in the extension direction of the support 30 by the widened portion 31, which helps to more effectively disperse stress during the bending process of the bending zone 20 and can enhance the overall strength of the support 30; at the same time, it can ensure that the width of the heat exchange channel 40 changes gently, which is conducive to the fluid maintaining a relatively stable flow state when flowing through the bending zone 20.
[0056] According to one embodiment of this application, the width of the heat exchange channels 40 on both sides of the widened portion 31 is W1, and the width of the heat exchange channels 40 on both sides of the remaining portion of the support portion 30 is W2, where 1 / 3*W2≤W1≤1 / 2*W2.
[0057] In other words, the width W1 of the heat exchange channels 40 on both sides of the widened portion 31 should not be too large or too small relative to the width W2 of the heat exchange channels 40 on both sides of the remaining portion of the support portion 30. When W1 is too small, although the volume of liquid in the corresponding area can be further reduced and the bulging of the bend area 20 towards the bend side can be further prevented, it may lead to excessive flow resistance, affecting the heat exchange performance of the heat exchange plate 100. When W1 is too large, although excessive flow resistance can be avoided, the reduction in the volume of liquid in the corresponding area is relatively small. In this embodiment, when 1 / 3*W2≤W1≤1 / 2*W2, the problem of a sharp increase in flow resistance caused by an excessively small W1 can be avoided, while ensuring the smoothness of the bend area 20 when it bends.
[0058] In some specific embodiments of this application, the length of the widened portion 31 along the extending direction of the support portion 30 itself is less than or equal to 20 mm. Within this range, the usage requirements of most foldable or bendable components of electronic products can be met, and the excessive length of the widened portion 31 can be avoided, which would lead to a deterioration in the heat exchange performance of the heat exchange plate 100.
[0059] Optionally, the length of the widened portion 31 along the extending direction of the support portion 30 itself can be 5mm, 10mm, 15mm, and 20mm, etc.
[0060] According to one embodiment of this application, in the heat exchange zone 10, the width of the support portion 30 ranges from 0.5 mm to 2.5 mm. For example, the width of the support portion 30 in the heat exchange zone 10 can be 0.5 mm, 1 mm, 1.5 mm, 2 mm, and 2.5 mm, etc. Within this range, the structural strength of the support portion 30 can be guaranteed, while also creating heat exchange channels 40 that are more conducive to heat exchange for electronic devices.
[0061] In some specific embodiments of this application, the width of the support portion 30 in the bending zone 20 ranges from 0.5 mm to 3.5 mm. For example, the width of the support portion 30 in the bending zone 20 can be 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, and 3.5 mm, etc. Within this range, the width of the heat exchange channel 40 in the corresponding area can be effectively reduced, thereby making the bending of the bending zone 20 smoother.
[0062] According to one embodiment of this application, in the heat exchange zone 10, the ratio of the width of the support portion 30 to the width of the heat exchange channel 40 ranges from 1 / 5 to 1 / 3. For example, the ratio of the width of the support portion 30 to the width of the heat exchange channel 40 in the heat exchange zone 10 can be 1 / 5, 1 / 4.5, 1 / 4, 1 / 3.5, and 1 / 3, etc.
[0063] In other words, in the heat exchange zone 10, when the ratio of the width of the support portion 30 to the width of the heat exchange channel 40 is less than 1 / 5, the support portion 30 is prone to insufficient strength. When the ratio is greater than 1 / 3, the heat exchange channel 40 is prone to being too sparse, thus affecting the heat exchange performance of the heat exchange plate 100. In this embodiment, the ratio of the width of the support portion 30 to the width of the heat exchange channel 40 is in the range of 1 / 5 to 1 / 3. Within this range, both insufficient strength of the support portion 30 and the heat exchange performance of the heat exchange plate 100 can be avoided.
[0064] In some specific embodiments of this application, in the bending zone 20, the ratio of the width of the support portion 30 to the width of the heat exchange channel 40 ranges from 2 / 1 to 4.5 / 1. For example, the ratio of the width of the support portion 30 to the width of the heat exchange channel 40 in the bending zone 20 can be 2 / 1, 2.5 / 1, 3 / 1, 3.5 / 1, 4 / 1, and 4.5 / 1. Within this range, the width of the heat exchange channel 40 in the corresponding area can be effectively reduced, thereby making the bending of the bending zone 20 smoother.
[0065] According to one embodiment of this application, in the thickness direction of the body, the height of the heat exchange channel 40 in the bending region 20 is less than the height of the heat exchange channel 40 in the heat exchange region 10.
[0066] In this embodiment, the height of the heat exchange channel 40 is in the same direction as the thickness of the body. The height of the heat exchange channel 40 in the bending zone 20 is less than the height of the heat exchange channel 40 in the heat exchange zone 10. This can further reduce the volume of liquid in the bending zone 20, thereby effectively reducing the fluid resistance that needs to be overcome when the bending zone 20 bends.
[0067] In summary, the heat exchange plate 100 according to the embodiments of this application, by widening the support portion 30 of the bending region 20, can ensure the stability of the bending region 20 structure and narrow at least a portion of the heat exchange channel 40 located in the bending region 20, thereby reducing the volume of liquid in the corresponding region, thereby reducing the fluid resistance to be overcome during bending and making the bending region 20 bend more smoothly; at the same time, the narrowed heat exchange channel 40 can accelerate the flow rate of liquid in this region, thereby reducing the squeezing force of the heat exchange liquid on the bending region 20, preventing the bending region 20 from bulging towards the bending side, thereby making the bending region 20 bend more smoothly, effectively improving the bending performance, and effectively extending the service life of the heat exchange plate 100.
[0068] This application also provides a heat exchange module, including the heat exchange plate 100 described in any of the above embodiments. Since the heat exchange plate 100 according to the embodiments of this application has the above-mentioned technical effects, the heat exchange module according to the embodiments of this application also has corresponding technical effects, which will not be repeated in this embodiment.
[0069] Embodiments of this application also provide an electronic device, including the heat exchange module described in the above embodiments. The electronic device has a bent structure (e.g., a foldable structure), and the bending region 20 of the heat exchange plate 100 corresponds to the position of the bent structure of the electronic device. Since the heat exchange plate 100 according to the embodiments of this application has the above-mentioned technical effects, the electronic device according to the embodiments of this application also has corresponding technical effects, which will not be described again in this embodiment.
[0070] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.
Claims
1. A heat exchange plate, characterized in that The heat exchange plate comprises: a body, the body is internally provided with a cavity and a support part, the support part separates the cavity into heat exchange flow channels; the body comprises a heat exchange area and a bending area, the support part extends to the heat exchange area and the bending area, and the width of the support part distributed in the bending area is greater than the width of the support part distributed in the heat exchange area.
2. The heat exchange plate according to claim 1, characterized in that The body comprises a plurality of heat exchange areas, and the bending area is arranged between two heat exchange areas.
3. The heat exchange plate according to claim 2, characterized in that The body comprises a plurality of bending areas.
4. The heat exchange plate according to claim 1, characterized in that In the bending area, the part of the support part with relatively increased width is a widened part, the widened part has opposite first and second side surfaces in the width direction of the widened part, and at least one section of the first side surface and at least one section of the second side surface are parallel to each other.
5. The heat exchange plate according to claim 4, characterized in that Along the extension direction of the support part itself, the width of the widened part gradually decreases from the middle of the widened part to both ends of the widened part.
6. The heat exchange plate according to claim 4, characterized in that The width of the heat exchange flow channel on both sides of the widened part is W1, and the width of the heat exchange flow channel on both sides of the remaining part of the support part is W2, 1 / 3*W2≤W1≤1 / 2*W2.
7. The heat exchange plate according to claim 4, characterized in that Along the extension direction of the support part itself, the length of the widened part is less than or equal to 20 mm.
8. The heat exchange plate according to claim 1, characterized in that In the heat exchange area, the width of the support part ranges from 0.5 mm to 2.5 mm.
9. The heat exchange plate according to claim 1, characterized in that In the bending area, the width of the support part ranges from 0.5 mm to 3.5 mm.
10. The heat exchange plate according to claim 1, characterized in that In the heat exchange area, the ratio of the width of the support part to the width of the heat exchange flow channel ranges from 1 / 5 to 1 / 3.
11. The heat exchange plate according to claim 1, characterized in that In the bending area, the ratio of the width of the support part to the width of the heat exchange flow channel ranges from 2 / 1 to 4.5 / 1.
12. The heat exchange plate according to claim 1, characterized in that In the thickness direction of the body, the height of the heat exchange flow channel in the bending area is less than the height of the heat exchange flow channel in the heat exchange area.
13. A heat exchange module, characterized by The heat exchange module comprises the heat exchange plate according to any one of claims 1 to 12.
14. An electronic device, comprising: The heat exchange module comprises the heat exchange plate according to claim 13, and the electronic device has a bending structure, and the bending area of the heat exchange plate is positionally corresponding to the bending structure.