Heat exchange part, heat exchange module and electronic equipment

Abstract

The embodiment of the invention discloses a heat exchange part, a heat exchange module and electronic equipment, the heat exchange part comprises a cover plate layer and a middle layer, and the cover plate layer comprises a first cover plate layer and a second cover plate layer; the middle layer is located between the first cover plate layer and the second cover plate layer; the first cover plate layer and the second cover plate layer respectively comprise a first layer, the middle layer comprises a second layer, and the melting point of the second layer is different from that of the first layer; one side, close to the second layer, of the first layer is provided with a first connecting area, one side, close to the first layer, of the second layer is provided with a second connecting area, and the second connecting area is welded to the first connecting area, so that the first cover plate layer, the second cover plate layer and the middle layer are in sealed connection. Therefore, the sealing performance and the connecting strength of the connecting area can be enhanced by utilizing the melting point difference of the material of the connecting area of the middle layer and the cover plate layer.

Description

Technical Field

[0001] This invention relates to the field of heat transfer technology, and more specifically, to a heat exchanger, a heat exchange module, and an electronic device. Background Technology

[0002] As electronic devices become increasingly integrated, heat dissipation has become a key factor limiting their performance improvement. Liquid cooling plates, as a highly efficient heat dissipation component, are widely used in various high-power-density electronic devices.

[0003] A liquid cooling plate typically consists of an upper cover plate, a lower cover plate, and a liquid cooling layer. The liquid cooling layer has flow channels, and the upper and lower cover plates seal the liquid cooling layer from both sides. However, due to the different materials of the two cover plates and the liquid cooling layer, the sealing effect is not ideal. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a novel heat exchanger, heat exchange module and electronic device.

[0005] According to one aspect of the present invention, a heat exchanger is provided.

[0006] The heat exchanger includes:

[0007] A cover plate layer, the cover plate layer comprising a first cover plate layer and a second cover plate layer;

[0008] An intermediate layer is located between the first cover layer and the second cover layer. A first flow channel groove is formed on the intermediate layer and is disposed through the thickness direction of the intermediate layer.

[0009] The first cover plate layer and the second cover plate layer each include a first layer, and the intermediate layer includes a second layer, wherein the second layer has a different melting point than the first layer;

[0010] The first layer has a first connection area on the side near the second layer, and the second layer has a second connection area on the side near the first layer. The second connection area is welded to the first connection area so that the first cover layer, the second cover layer and the intermediate layer form a sealed connection, and the first cover layer, the second cover layer and the intermediate layer form a flow channel at the first flow channel groove.

[0011] Optionally, along the thickness direction of the heat exchanger, the second connection area is positioned opposite to the first connection area.

[0012] Optionally, the first layer is a metal layer or a polymer material layer; and / or, the second layer is a metal layer or a polymer material layer.

[0013] Optionally, the first connection area is provided with a connection groove and / or a connection protrusion, and the second connection area is sealed to the first connection area.

[0014] Optionally, the melting point of the second layer is lower than that of the first layer.

[0015] Optionally, a linear connection groove is provided on the first connection area, and the second connection area is embedded in the linear connection groove to form a circumferential seal.

[0016] Optionally, the first connecting area has multiple grooves, and the second connecting area is embedded in the grooves to form a circumferential seal.

[0017] Optionally, an annular connecting groove is provided on the first connecting area, and the second connecting area is embedded in the annular connecting groove to form a seal.

[0018] Optionally, the ratio of the depth of any one of the linear connecting groove, the recess, and the annular connecting groove to the thickness of the cover plate layer ranges from 1:4 to 3:4.

[0019] Optionally, the depth of any one of the linear connecting groove, the recess, and the annular connecting groove is in a ratio of 1:2 to the thickness of the cover layer.

[0020] Optionally, the cover plate layer has a through hole, and on the transverse plane of the cover plate layer, the first connecting area is arranged around the through hole, and there is a gap between the first connecting area and the through hole.

[0021] Optionally, the second connection area and the first connection area are connected by laser welding, ultrasonic welding, thermo-pressure welding, friction welding, brazing or diffusion welding.

[0022] According to another aspect of the present invention, a heat exchange module is provided, comprising a micropump and the heat exchange element.

[0023] Optionally, the heat exchanger has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet.

[0024] According to another aspect of the present invention, an electronic device is provided, including the heat exchanger or the heat exchange module described above.

[0025] One technical advantage of the embodiments disclosed herein is that:

[0026] The heat exchanger includes a cover plate layer and an intermediate layer. The cover plate layer includes a first cover plate layer and a second cover plate layer. The intermediate layer is located between the first cover plate layer and the second cover plate layer. A first flow channel groove is formed on the intermediate layer, and the first flow channel groove extends through the thickness direction of the intermediate layer. The first cover plate layer and the second cover plate layer each include a first layer, and the intermediate layer includes a second layer. The second layer has a different melting point than the first layer. The first layer has a first connecting area on the side near the second layer, and the second layer has a second connecting area on the side near the first layer. The second connecting area is welded to the first connecting area so that the first cover plate layer, the second cover plate layer, and the intermediate layer form a sealed connection. The first cover plate layer, the second cover plate layer, and the intermediate layer form a flow channel at the first flow channel groove.

[0027] In this way, the difference in melting points between the materials in the connection area between the intermediate layer and the cover plate layer can be utilized to enhance the sealing and connection strength of the connection area, thereby improving the reliability and stability of the connection and ensuring the stable operation of the heat exchanger. Furthermore, the design of the first and second connection areas avoids potential leakage problems in traditional connection methods, improving the sealing performance of the heat exchanger and ensuring the safe and stable operation of electronic equipment using this heat exchanger.

[0028] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0029] The accompanying drawings, which form part of this specification, illustrate embodiments of the invention and, together with the specification, serve to explain the principles of the invention.

[0030] Explanation of reference numerals in the attached figures:

[0031] Figure 1 This is a schematic diagram of a heat exchanger according to an embodiment of the present disclosure;

[0032] Figure 2 This is a schematic diagram of a first connection area according to an embodiment of the present disclosure;

[0033] Figure 3 This is a schematic diagram of another first connection area according to an embodiment of the present disclosure;

[0034] Figure 4 This is a schematic diagram of another first connection area according to an embodiment of the present disclosure;

[0035] Figure 5 This is a schematic diagram of another first connection area according to an embodiment of the present disclosure.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1. Cover plate layer; 111. First working medium inlet; 112. First working medium outlet; 2. Intermediate layer; 21. First flow channel groove; 3. Linear connection groove; 4. Groove; 5. Annular connection groove. Detailed Implementation

[0038] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0039] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0040] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0041] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0042] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0043] This invention provides a heat exchange component that can be applied to heat exchange in electronic devices such as tablets, laptops, VR (Virtual Reality) products, AR (Augmented Reality) products, and watches.

[0044] like Figure 1 As shown, the heat exchanger provided in this embodiment of the invention includes:

[0045] Cover layer 1, the cover layer 1 includes a first cover layer and a second cover layer;

[0046] Intermediate layer 2, located between the first cover layer and the second cover layer, wherein a first flow channel groove 21 is provided on the intermediate layer 2, and the first flow channel groove 21 is provided through the thickness direction of the intermediate layer 2.

[0047] The first cover plate layer and the second cover plate layer each include a first layer, and the intermediate layer 2 includes a second layer, the second layer having a different melting point than the first layer;

[0048] The first layer has a first connection area on the side near the second layer, and the second layer has a second connection area on the side near the first layer. The second connection area is welded to the first connection area so that the first cover plate layer, the second cover plate layer and the intermediate layer 2 form a sealed connection, and the first cover plate layer, the second cover plate layer and the intermediate layer 2 form a flow channel at the first flow channel groove 21.

[0049] Specifically, depending on the actual design requirements, the second layer can be a metal layer to meet the strength requirements of the intermediate layer 2; alternatively, the second layer can be a polymer material layer to meet the lightweight requirements of the intermediate layer 2; or the second layer can be either a metal layer or a polymer material layer, with the intermediate layer 2 also including the other of the two, which can improve the overall performance of the intermediate layer 2. Furthermore, depending on the actual design, the intermediate layer 2 can also include other material layers to form a multi-layer structure.

[0050] Similarly, depending on the actual design requirements, the first layer can be a metal layer to meet the strength requirements of the cover layer 1; or the first layer can be a polymer material layer to meet the lightweight requirements of the cover layer 1; or the first layer can be either a metal layer or a polymer material layer, and the cover layer 1 can also include the other of the two, which can improve the overall performance of the cover layer 1. Furthermore, depending on the actual design, the cover layer 1 can also include other material layers to form a multi-layer structure.

[0051] In this embodiment of the invention, the second layer has a different melting point than the first layer; that is, the two opposing layers, the intermediate layer 2 and the cover layer 1, have different melting points. For example, the second layer and the first layer can be made of different types of materials, such as any two of metallic materials, inorganic non-metallic materials, and polymeric materials, which can cause a difference in melting points between the second and first layers. Alternatively, the second layer and the first layer can be made of the same type of but different materials, such as different metallic materials, different inorganic non-metallic materials, or different polymeric materials, which can also cause a difference in melting points between the second and first layers, thereby allowing the connection area between the intermediate layer 2 and the cover layers 1 on both sides to be made of different materials.

[0052] The following explanation uses two different types of materials as examples: the second layer is a metal layer and the first layer is a polymer material layer. Inorganic non-metallic materials or other materials can also be used.

[0053] In one embodiment, when the second layer is a metal layer and the first layer is a polymer material layer, a second connection region is formed on both sides of the metal layer, and a first connection region is formed on the polymer material layer, so that the second layer and the first layer are materials with different melting points.

[0054] In another embodiment, when the second layer is a metal layer, the first layer is a first type of polymer material layer, and the intermediate layer 2 also includes a second type of polymer material layer, second connection regions are formed on the metal layer and the polymer material layer of the intermediate layer 2, respectively, and a first connection region is formed on the polymer material layer, so that the connection region between the intermediate layer 2 and the cover layer 1 is made of materials with different melting points. The first type of polymer material layer and the second type of polymer material layer have different melting points.

[0055] In another embodiment, when the second layer is a polymer material layer and the first layer is a metal layer, a first connection region is formed on the metal layer, and second connection regions are formed on both sides of the polymer material layer, so that the second layer and the first layer are materials with different melting points.

[0056] For example: see Figure 1 The intermediate layer 2 can be configured to include a metal layer and a polymer material layer from top to bottom. The first cover layer on the upper side of the intermediate layer 2 can include a metal layer and a polymer material layer from top to bottom. The second cover layer on the lower side of the intermediate layer 2 can include a metal layer and a polymer material layer from top to bottom, so that the connection area between the intermediate layer 2 and the cover layers 1 on both sides can be made of different types of materials.

[0057] In addition, the use of different materials in the connection area between the middle layer 2 and the cover layers 1 on both sides can also enhance the flexibility and deformation capability of the heat exchange component, making it easier to meet the usage requirements of bendable electronic devices.

[0058] In summary, the connection area between the intermediate layer 2 and the cover layer 1 is made of materials with different melting points. That is, the first connection area and the second connection area have different melting points. During the welding process between the first and second connection areas, the difference in melting points between the materials in the connection area of ​​the intermediate layer 2 and the cover layer 1 can be utilized to enhance the sealing and connection strength of the connection area. This improves the reliability and stability of the sealed connection between the intermediate layer 2 and the cover layer 1, thereby ensuring the stable operation of the heat exchanger. Furthermore, the two connection areas also avoid problems such as liquid and gas leakage that may occur in traditional connection methods, improving the sealing performance of the heat exchanger and ensuring the safe and stable operation of electronic equipment using this heat exchanger.

[0059] The connection area formed by the first connection area and the second connection area is located on the outer periphery of the flow channel, so as to form a reliable seal for the flow channel and prevent leakage.

[0060] The first bonding region can be formed through processes such as etching, surface activation, and laser cutting. The second bonding region is usually located opposite the first bonding region, so that the component with the lower melting point can locally melt and form a strong bond with the component with the higher melting point during the welding process. It is necessary to control parameters such as temperature and pressure during the welding process to prevent deformation of the component with the lower melting point, which could lead to overall structural failure.

[0061] Specifically, the first connection area may include a connection groove, and the first connection area may also include a connection protrusion. The first connection area may also include a connection groove and a connection protrusion, with the second connection area embedded within the first connection area to form a seal. The first connection area may also be a rough structure formed by surface treatment, and the second connection area is welded to the first connection area so that the second connection area can form a tight bond with the rough structure.

[0062] The welding methods for the first connection area and the second connection area include, but are not limited to, laser welding, ultrasonic welding, hot-press welding, and friction welding. Welding the second connection area to the first connection area strengthens the bond between the intermediate layer 2 and the cover layer 1, making it less prone to detachment or breakage, and extending the service life and durability of the heat exchange module.

[0063] like Figure 1 As shown, in this embodiment, a first flow channel groove 21 is formed on the intermediate layer 2. The first flow channel groove 21 extends through the thickness direction of the intermediate layer 2, so that the working fluid can flow smoothly in the flow channel at the first flow channel groove 21, thereby achieving efficient heat conduction and simplifying the process of forming the first flow channel groove 21.

[0064] According to the actual design, the shape of the first flow channel 21 includes, but is not limited to, straight, serpentine, and spiral shapes, to optimize the flow path of the working fluid and heat exchange efficiency. Corresponding connectors or interfaces can also be provided at the inlet and outlet of the flow channel to facilitate connection with external heat exchange systems such as micropumps and radiators, forming a complete heat exchange cycle.

[0065] Optionally, along the thickness direction of the heat exchanger, the second connection area is positioned opposite to the first connection area, which facilitates a sealed connection between the second connection area and the first connection area.

[0066] Optionally, the first layer is a metal layer or a polymer material layer; and / or, the second layer is a metal layer or a polymer material layer.

[0067] Specifically, in one embodiment, the second layer can be a metal layer and the first layer can be a polymer material layer. A second connection area is formed on both sides of the metal layer of the intermediate layer 2, and a first connection area is formed on the polymer material layer. The second connection area and the first connection area are welded one by one. The polymer material layer of the first connection area can be partially melted and form a firm bond with the metal layer of the second connection area, thereby achieving a sealed connection between the intermediate layer 2 and the cover plate layers 1 on both sides.

[0068] The second layer is a metal layer, which can enhance the support of the intermediate layer 2 to the upper flow channel, thereby ensuring the structural strength of the heat exchanger.

[0069] In another embodiment, the first layer can be a metal layer and the second layer can be a polymer material layer. The polymer material layer in the second connecting region can be locally melted and form a strong bond with the metal layer in the first connecting region, thereby achieving a sealed connection between the intermediate layer 2 and the cover layer 1. In this case, the first flow channel 21 can be formed within the polymer material layer of the intermediate layer 2.

[0070] In another embodiment, the first layer and the second layer may also be made of different metal materials, or the first layer and the second layer may also be made of different polymer materials, both of which can utilize the difference in their melting points to achieve a reliable connection.

[0071] Optionally, there is a gap between the first flow channel 21 and the second connection area.

[0072] In this embodiment, a gap is provided between the second connection area and the first flow channel 21, that is, a certain clearance distance is maintained between the second connection area and the first flow channel 21. On the one hand, the welding process of the first connection area and the second connection area can be avoided from interfering with the first flow channel 21, and the connection between the cover plate layer 1 and the intermediate layer 2 can be avoided from affecting the flow of the working fluid in the flow channel, so as to ensure the heat exchange effect of the heat exchanger.

[0073] On the other hand, the gap between the second connection area and the first flow channel 21 can also prevent the working fluid from eroding the welding area between the first connection area and the second connection area, thereby ensuring the reliability of the sealed connection between the two and extending the service life and durability of the heat exchange components.

[0074] The following explanation uses the example of the first working medium inlet 111 and the first working medium outlet 112 being located in the first cover plate layer.

[0075] Optionally, a through hole is provided on the first cover plate layer, and the first connecting area is arranged around the through hole on the transverse plane of the first cover plate layer, and there is a gap between the first connecting area and the through hole.

[0076] In this embodiment, the first cover plate layer has through holes along the vertical direction, i.e., the longitudinal direction. The through holes include a first working fluid inlet 111 and a first working fluid outlet 112. The first working fluid inlet 111 and the first working fluid outlet 112 are respectively connected to the flow channel in the heat exchanger, so that the working fluid can enter the flow channel from the first working fluid inlet 111 and exit the flow channel from the first working fluid outlet 112, thereby realizing the flow of the working fluid.

[0077] The first connection area can be located on the transverse plane of the first cover plate layer, and it surrounds the through hole. That is, the first connection area surrounds the periphery of the through hole, which can achieve the sealing between the intermediate layer 2 and the first cover plate layer by using the first connection area and the second connection area, while also reducing the risk of leakage, thereby improving the reliability of the heat exchange module.

[0078] Furthermore, on the transverse plane of the first cover plate layer, a gap is provided between the first connection area and the through hole, that is, a certain clearance distance is maintained between the first connection area and the through hole. On the one hand, the welding process of the first connection area and the second connection area can be avoided from interfering with the through hole, and the connection between the intermediate layer 2 and the first cover plate layer can be avoided from affecting the flow of the working fluid in the heat exchanger, so as to ensure the normal and reliable operation of the heat exchanger.

[0079] On the other hand, the gap between the first connection area and the through hole can also prevent the working fluid from eroding the welding area between the first connection area and the second connection area, thereby ensuring the reliability of the sealed connection between the two and extending the service life and durability of the heat exchanger.

[0080] Optionally, the width of the gap is greater than or equal to 0.1 times the diameter of the through hole.

[0081] In this embodiment, the width of the gap is not less than 0.1 times the diameter of the through hole, that is, the first connection area is located outside the area formed by 1.2 times the diameter of the through hole, so that a reliable clearance distance can be formed between the first connection area and the through hole, which can avoid the welding process of the first connection area and the second connection area from interfering with the through hole, and avoid the connection between the intermediate layer 2 and the first cover plate layer from affecting the flow of the working fluid in the heat exchanger, so as to ensure the normal and stable operation of the heat exchanger, and also facilitate the welding process of the first connection area and the second connection area, simplifying the processing difficulty of the heat exchanger.

[0082] Optionally, the width of the gap ranges from 0.1 to 0.25 times the diameter of the through hole.

[0083] In this embodiment, the width of the gap is set between 0.1 and 0.25 times the diameter of the through hole, that is, the first connecting area is located outside the area formed by 1.2 times the diameter of the through hole and inside the area formed by 1.5 times the diameter of the through hole. Setting the first connecting area within the annular area defined by the area outside the area formed by 1.2 times the diameter of the through hole and inside the area formed by 1.5 times the diameter of the through hole can avoid the through hole while also enhancing the reliability of the sealing connection between the intermediate layer 2 and the first cover plate layer, and reducing the risk of sealing failure.

[0084] When the first working medium inlet 111 and the first working medium outlet 112 are located on the second cover plate layer, or when one of the first working medium inlet 111 and the first working medium outlet 112 is located on the first cover plate layer and the other of the first working medium inlet 111 and the first working medium outlet 112 is located on the second cover plate layer, a clearance gap must also be formed with the connection area. The specific situation is similar to the above situation and will not be described in detail here.

[0085] Optionally, the first connection area is provided with a connection groove and / or a connection protrusion, and the second connection area is sealed to the first connection area.

[0086] In this embodiment, the first connecting area may include a groove, or it may include a protrusion, or it may include both a groove and a protrusion, so that the second connecting area is embedded within the first connecting area to form a sealed connection. Depending on the actual sealing requirements, the number and distribution of the connecting grooves and / or connecting protrusions can be adjusted to enhance the sealing performance.

[0087] Optionally, the melting point of the second layer is lower than that of the first layer, so that during the welding process, the second connection area of ​​the second layer with a lower melting point can be partially melted and form a strong bond with the first connection area of ​​the first layer with a higher melting point.

[0088] Optionally, a linear connection groove 3 is provided on the first connection area, and the second connection area is embedded in the linear connection groove 3 to form a circumferential seal.

[0089] In this embodiment, a linear connecting groove 3 can be formed on the first connecting area, for example, through etching, cutting, or other processes. Welding the first connecting area to the second connecting area utilizes the difference in melting points between their materials, allowing the second connecting area to partially melt and embed itself into the linear connecting groove 3, forming a strong bond with the first connecting area. This achieves a sealed connection between the cover layer 1 and the intermediate layer 2, ensuring stable operation of the heat exchanger. The design of the linear connecting groove 3 must avoid through holes to prevent interference with the inflow and outflow of the working fluid.

[0090] The shape of the linear connecting groove 3, depending on design requirements, includes, but is not limited to, S-shaped, arc-shaped, spiral-shaped, intersecting, and racetrack-shaped. For example... Figure 2 A cross-shaped linear connecting groove 3 is shown. The arrangement of this linear connecting groove 3 allows the first connecting area and the second connecting area to form a complete circumferential seal, thereby further enhancing the reliability of the sealing connection between the cover plate layer 1 and the intermediate layer 2.

[0091] Optionally, the first connecting area is provided with a plurality of grooves 4, and the second connecting area is embedded in the grooves 4 to form a circumferential seal.

[0092] In this embodiment, a groove 4, or recess, can be formed on the first connecting area, for example, through etching, cutting, or other processes. Welding the first connecting area to the second connecting area utilizes the difference in melting points between the materials of the two connecting areas, allowing the second connecting area to partially melt and embed itself into the groove 4, thus forming a strong bond with the first connecting area. This achieves a sealed connection between the cover plate layer 1 and the intermediate layer 2, thereby ensuring the stable operation of the heat exchange component.

[0093] According to design requirements, the cross-sectional shape of groove 4 includes, but is not limited to, circular, elliptical, rectangular, and irregular shapes. For example... Figure 3 The diagram shows the distribution of grooves 4, with some grooves 4 arranged along the outer periphery of the working medium inlet and outlet in a first ring, and other grooves 4 arranged along the outer periphery of the working medium inlet and outlet in a second ring. The second ring is staggered from the first ring, so that the staggered arrangement of multiple grooves 4 can form a complete seal between the first connection area and the second connection area in the circumferential direction, thereby further enhancing the reliability of the sealing connection between the cover plate layer 1 and the intermediate layer 2.

[0094] In another embodiment, the number of grooves 4 can be increased to enhance the reliability of the circumferential sealing connection between the first connection area and the second connection area and reduce the risk of seal failure.

[0095] Optionally, an annular connecting groove 5 is provided on the first connecting area, and the second connecting area is embedded in the annular connecting groove 5 to form a seal.

[0096] like Figure 4 As shown, in this embodiment, an annular connecting groove 5 is provided on the first connecting area around the working fluid inlet and outlet. On the one hand, the gap between the annular connecting groove 5 and the working fluid inlet and outlet can be used to avoid the entry and exit of the working fluid in the flow channel, so as to ensure the normal and stable operation of the heat exchanger. On the other hand, the annular connecting groove 5 around the working fluid inlet and outlet allows the first connecting area and the second connecting area to form a complete circumferential seal, thereby further enhancing the reliability of the sealing connection between the cover plate layer 1 and the intermediate layer 2.

[0097] Optionally, there may be multiple annular connecting grooves 5, which are arranged at intervals.

[0098] like Figure 5 As shown, in this embodiment, multiple annular connecting grooves 5 can be set to surround the working fluid inlet and outlet in the circumferential direction. The reliability of the circumferential seal between the first connecting area and the second connecting area can be further enhanced by the multiple annular connecting grooves 5. This can further enhance the sealing connection between the cover plate layer 1 and the intermediate layer 2, and also avoid the overall sealing failure of the heat exchange module caused by the failure of a single layer seal. In this way, the service life and durability of the heat exchange module can be extended.

[0099] Optionally, the ratio of the depth of any one of the linear connecting groove 3, the groove 4, and the annular connecting groove 5 to the thickness of the cover plate layer 1 ranges from 1:4 to 3:4.

[0100] In this embodiment, when the connecting groove is located on the first cover plate layer and the second cover plate layer, the ratio of the depth of the connecting groove to the thickness of the corresponding cover plate layer 1 is set to be between 1:4 and 3:4. That is, the minimum depth of the connecting groove is 1 / 4 of the thickness of the cover plate layer 1, and the maximum depth of the connecting groove is 3 / 4 of the thickness of the cover plate layer 1, which can ensure the reliability of the sealing connection between the cover plate layer 1 and the intermediate layer 2.

[0101] Optionally, the ratio of the depth of any one of the linear connecting groove 3, the groove 4, and the annular connecting groove 5 to the thickness of the cover plate layer 1 is 1:2.

[0102] In this embodiment, when the connecting groove is located on the first cover plate layer and the second cover plate layer, it is preferable that the ratio of the depth of the connecting groove to the thickness of the corresponding cover plate layer 1 is 1 / 2. This ensures that there is sufficient contact area between the second connecting area and the connecting groove, thereby ensuring a good sealing effect between the second connecting area and the first connecting area, and also simplifies the opening of the connecting groove.

[0103] Optionally, the second connection area and the first connection area are connected by laser welding, ultrasonic welding, thermocompression welding, friction welding, brazing, or diffusion welding. The welding connection between the metal layer and the polymer material layer makes the bond between the intermediate layer 2 and the cover plates 1 on both sides stronger, less prone to detachment or breakage, and extends the service life and durability of the heat exchanger.

[0104] Among them, ultrasonic welding and hot-press welding are preferred, which can simplify the sealing process between the middle layer 2 and the cover layers 1 on both sides, reduce the connection difficulty, and thus improve the processing efficiency of the heat exchange module.

[0105] This invention also provides a heat exchange module, including a micropump and the aforementioned heat exchange components.

[0106] Optionally, the heat exchanger has a first working fluid inlet 111 and a first working fluid outlet 112, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet 111 and the first working fluid outlet 112 are respectively connected to the flow channel, and the first working fluid inlet 111 is connected to the second working fluid outlet, and the first working fluid outlet 112 is connected to the second working fluid inlet.

[0107] In this embodiment, based on the positional relationship between the micropump and the heat exchanger, a first working fluid inlet 111 and a first working fluid outlet 112 can be formed on the first cover plate layer or the second cover plate layer. In this way, the working fluid can enter the flow channel through the second working fluid outlet and the first working fluid inlet 111, and then return to the micropump from the flow channel through the first working fluid outlet 112 and the second working fluid inlet, thereby achieving working fluid circulation.

[0108] This invention also provides an electronic device, including the heat exchanger or the heat exchange module described above. This electronic device can be a small electronic device, such as a tablet computer, laptop computer, smart glasses, smartwatch, or smart headband.

[0109] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0110] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A heat exchanging member, characterized by, The application relates to a heat exchange element. The heat exchange element comprises: a cover plate layer (1) comprising a first cover plate layer and a second cover plate layer; an intermediate layer (2) located between the first cover plate layer and the second cover plate layer, wherein a first flow channel groove (21) is formed in the intermediate layer (2) and extends through the thickness direction of the intermediate layer (2); the first cover plate layer and the second cover plate layer each comprise a first layer, and the intermediate layer (2) comprises a second layer, wherein the melting point of the second layer is different from that of the first layer; 2. The heat exchanging member according to claim 1, characterized by one side of the first layer close to the second layer is provided with a first connecting area, and one side of the second layer close to the first layer is provided with a second connecting area, wherein the second connecting area is welded with the first connecting area to form a sealed connection of the first cover plate layer, the second cover plate layer and the intermediate layer (2), and the first cover plate layer, the second cover plate layer and the intermediate layer (2) form a flow channel at the first flow channel groove (21).

3. The heat exchange member according to claim 2, characterized by The second connecting area is opposite to the first connecting area in the thickness direction of the heat exchange element.

4. The heat exchange member according to claim 1, characterized by The first layer is a metal layer or a high polymer material layer; and / or the second layer is a metal layer or a high polymer material layer.

5. The heat exchange member according to claim 4, characterized by The first connecting area is provided with a connecting groove and / or a connecting protrusion, and the second connecting area is sealed with the first connecting area.

6. The heat exchange member according to claim 5, characterized by The melting point of the second layer is lower than that of the first layer.

7. The heat exchange member according to claim 5, wherein The first connecting area is provided with a linear connecting groove (3), and the second connecting area is embedded in the linear connecting groove (3) and forms a circumferential seal.

8. The heat exchange member according to claim 5, wherein The first connecting area is provided with a plurality of grooves (4), and the second connecting area is embedded in the grooves (4) and forms a circumferential seal.

9. A heat exchange member according to any one of claims 6 to 8, characterised in that, The first connecting area is provided with an annular connecting groove (5), and the second connecting area is embedded in the annular connecting groove (5) and forms a seal.

10. The heat exchange member according to claim 9, characterized by The depth of any one of the linear connecting groove (3), the groove (4) and the annular connecting groove (5) to the thickness of the cover plate layer (1) is in the range of 1:4 to 3:

4.

11. The heat exchange member of claim 1, wherein The depth of any one of the linear connecting groove (3), the groove (4) and the annular connecting groove (5) to the thickness of the cover plate layer (1) is 1:

2.

12. The heat exchange member of claim 1, wherein A through hole is formed in the cover plate layer (1), and the first connecting area is arranged around the through hole in the transverse plane of the cover plate layer (1), and a gap is formed between the first connecting area and the through hole.

13. A heat exchange module, characterized by The second connecting area is connected with the first connecting area by laser welding, ultrasonic welding, hot pressure welding, friction welding, brazing or diffusion welding.

14. The heat exchange module of claim 13, wherein, The application also relates to a micro-pump and the heat exchange element. The heat exchange element is provided with a first working medium inlet (111) and a first working medium outlet (112), and the micro-pump is provided with a second working medium inlet and a second working medium outlet, wherein the first working medium inlet (111) and the first working medium outlet (112) are communicated with the flow channel, the first working medium inlet (111) is communicated with the second working medium outlet, and the first working medium outlet (112) is communicated with the second working medium inlet.

15. An electronic device, comprising: The heat exchange element according to any one of claims 1 to 12 or the heat exchange module according to any one of claims 13 to 14.

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