Heat exchange plate, heat exchange module and electronic equipment

Abstract

The invention provides a heat exchange plate, a heat exchange module and electronic equipment, the heat exchange plate comprises a plate body, the plate body comprises a first area and a second area, and the first area is configured to correspond to a heating area of an electronic product; the plate body is provided with a plurality of heat exchange flow channels, each heat exchange flow channel extends to the first area, and the heat exchange flow channels are not communicated with one another; and at least one part of each heat exchange runner extends to the second area.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic products, and more specifically, to a heat exchange plate, a heat exchange module, and an electronic device. Background Technology

[0002] Existing heat exchange plates for electronic products achieve heat exchange by creating a circulation path between the high-temperature and low-temperature zones of the electronic product and circulating the heat exchange fluid. However, the problem with existing heat exchange plates is that the heat exchange fluid only flows through the high-temperature zone and the low-temperature zone once each in one cycle. This limits the effective transfer of heat, resulting in low heat exchange efficiency and making the electronic product prone to localized overheating. Summary of the Invention

[0003] This application provides a new technical solution for heat exchange plates, which can at least solve the problem of low heat exchange efficiency of existing heat exchange plates.

[0004] This application also provides a new technical solution for a heat exchange module.

[0005] This application also provides a new technical solution for an electronic device.

[0006] According to a first aspect of this application, a heat exchange plate is provided, comprising: a plate body, the plate body including a first region and a second region, the first region being configured to correspond to a heat-generating area of ​​an electronic product; the plate body having a plurality of heat exchange channels, each heat exchange channel extending to the first region and not communicating with each other; each heat exchange channel having at least a portion extending to the second region.

[0007] Optionally, the plate body includes a plurality of first regions, each of which extends with different heat exchange channels.

[0008] Optionally, the plate body includes a plurality of second regions, and each of the heat exchange channels extends to a different second region.

[0009] Optionally, the heat exchange channel itself has at least two sets of sub-channels connected in series; each set of sub-channels has a first channel segment and a second channel segment; the first channel segment is located in the first region, the second channel segment is located in the second region, and the second channel segments of two adjacent sets of sub-channels are connected to each other to form a series connection between the sub-channels.

[0010] Optionally, the plate body includes a plurality of first regions, and each first region extends a plurality of the sub-channels.

[0011] Optionally, the plate body includes a plurality of second regions, and the sub-channels extend to different second regions.

[0012] Optionally, the first flow channel segment of each group of sub-flow channels bends and extends in its respective first region.

[0013] Optionally, the first region includes multiple hot zones, with the first flow channel segment of each group of sub-flow channels located in different hot zones; and / or, the second region includes multiple cold zones, with the second flow channel segment of each group of sub-flow channels located in different cold zones.

[0014] Optionally, the flow area of ​​the first flow channel section is smaller than the flow area of ​​the second flow channel section.

[0015] Optionally, the distribution density of the heat exchange channels in the first region is greater than the distribution density of the heat exchange channels in the second region.

[0016] Optionally, the plate body is provided with a liquid inlet, which includes a plurality of first liquid inlets and a plurality of second liquid inlets. The first liquid inlets and the second liquid inlets are used to connect a micro pump, and each heat exchange channel corresponds to a set of liquid inlets.

[0017] Optionally, the plate body is provided with liquid inlets, including a first liquid inlet and a second liquid inlet, and each heat exchange channel corresponds to a set of liquid inlets; the plate body is provided with at least one transition channel, and the first end of the transition channel and the first liquid inlet, and the second end of the transition channel and the second liquid inlet are both used to connect to the micro pump.

[0018] Optionally, the first region is divided into a first sub-region with the same number of heat exchange channels, each heat exchange channel extending into a different first sub-region; and / or, the second region is divided into a second sub-region with the same number of heat exchange channels, each heat exchange channel extending into a different second sub-region.

[0019] According to a second aspect of this application, a heat exchange module is provided, comprising: a heat exchange plate as described in any of the preceding claims; a micropump, wherein each heat exchange channel corresponds to at least one micropump, and the micropump is connected to the heat exchange channel to form a circulation path.

[0020] According to a third aspect of this application, an electronic device is provided, including the heat exchange module described above.

[0021] According to the heat exchange plate of this application, by setting multiple heat exchange channels in the first and second regions of the plate body, the heat exchange fluid in the heat exchange plate can flow through the first region multiple times in a single cycle time. This allows the heat exchange fluid to absorb heat in the first region multiple times in a single cycle time and transfer the heat to the second region. This avoids heat exchange fluid saturation, ensures efficient heat exchange, improves the heat exchange efficiency of the heat exchange plate, and effectively prevents the problem of local overheating of electronic products, ensuring the temperature uniformity of electronic products.

[0022] Other features and advantages of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present application and, together with their description, serve to explain the principles of the present application.

[0024] Figure 1 This is a schematic diagram of the structure of a heat exchange plate according to an embodiment provided in this application;

[0025] Figure 2 This is a schematic diagram of the sub-channel structure of a heat exchange plate according to an embodiment provided in this application;

[0026] Figure 3 This is a partial structural schematic diagram of a heat exchange plate according to an embodiment provided in this application.

[0027] Figure Labels

[0028] 100. Heat exchange plate;

[0029] 10. First Zone; 11. Hot Zone;

[0030] 20. Second Zone; 21. Cold Zone;

[0031] 30. Heat exchange channel; 31. Sub-channel; 31a. First channel section; 31b. Second channel section;

[0032] 40. First liquid inlet; 50. Second liquid inlet; 60. Transition channel. Detailed Implementation

[0033] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0034] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0035] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0036] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0037] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0038] The heat exchange plate 100 according to an embodiment of this application will now be described in detail with reference to the accompanying drawings.

[0039] like Figure 1 and Figure 3 As shown, the heat exchange plate 100 according to an embodiment of this application includes a plate body.

[0040] Specifically, the plate includes a first region 10 and a second region 20. The first region 10 is configured to correspond to the heat-generating area of ​​the electronic product. The plate is provided with multiple heat exchange channels 30, each heat exchange channel 30 extending to the first region 10, and the heat exchange channels 30 are not connected to each other. Each heat exchange channel 30 extends at least partly to the second region 20.

[0041] In other words, such as Figure 1 and Figure 3 As shown, the heat exchange plate 100 according to an embodiment of this application is mainly used for heat exchange of electronic products. The heat exchange plate 100 mainly includes a plate body, which may include a first region 10 and a second region 20. The area of ​​the second region 20 may be larger than the area of ​​the first region 10. The plate body is provided with heat exchange channels 30. A portion of the heat exchange channels 30 can extend within the first region 10 of the plate body, and another portion of the heat exchange channels 30 can extend within the second region 20 of the plate body, thereby forming a passage for the flow of heat exchange fluid. The first region 10 of the plate body is adapted to the heat-generating area of ​​the electronic product (e.g., the area where the processor of the electronic product is located), so that the first region 10 of the plate body can cooperate with the heat-generating area of ​​the electronic product, thereby transferring the heat of the heat-generating area to the second region 20 through the heat exchange fluid flowing in the heat exchange channels 30.

[0042] like Figure 1 and Figure 2 As shown in this embodiment, the plate is provided with multiple non-interconnected heat exchange channels 30. During a single cycle, the heat exchange liquid in the multiple heat exchange channels 30 can flow through the first region 10 and the second region 20 at least once. That is, the heat exchange liquid in the heat exchange plate 100 can flow through the first region 10 multiple times during a single cycle (at least the number of times it flows through is the same as the number of heat exchange channels 30), thereby absorbing heat in the first region 10 multiple times and transferring the heat to the second region 20. This can effectively prevent the heat exchange liquid from reaching a heat exchange saturation state, thereby ensuring that the heat exchange liquid can continuously and efficiently exchange heat within a better temperature range.

[0043] Therefore, according to the heat exchange plate 100 provided in this embodiment, by setting multiple heat exchange channels 30 in the first region 10 and the second region 20 of the plate body, the heat exchange fluid in the heat exchange plate 100 can flow through the first region 10 multiple times in a single cycle time, so that the heat exchange fluid can absorb heat in the first region 10 multiple times in a single cycle time and transfer the heat to the second region 20. This avoids heat exchange fluid saturation, ensures efficient heat exchange, improves the heat exchange efficiency of the heat exchange plate 100, and effectively prevents the problem of local overheating of electronic products, ensuring the temperature uniformity of electronic products.

[0044] According to one embodiment of this application, the plate includes a plurality of first regions 10, each first region 10 extending with different heat exchange channels 30.

[0045] In other words, such as Figure 1 As shown, the plate can be provided with multiple first regions 10, which are matched with multiple heat-generating areas of the electronic product. Each first region 10 extends with different heat exchange channels 30, that is, each first region 10 extends with at least two heat exchange channels 30, so that the heat exchange liquid in the plate can absorb heat from different first regions 10 multiple times in a single cycle and transfer the heat to the second region 20.

[0046] In this embodiment, the heat exchange fluid in the multiple heat exchange channels 30 can absorb heat in multiple heat-generating areas of the electronic product, so that the electronic product does not need to be equipped with multiple heat exchange plates 100, and the heat exchange fluid in the heat exchange plates 100 can flow through each first area 10 multiple times in a single cycle time, which can ensure efficient heat exchange.

[0047] In some specific embodiments of this application, the plate includes a plurality of second regions 20, and each heat exchange channel 30 extends to a different second region 20.

[0048] Specifically, such as Figure 1 As shown, the plate can be provided with multiple second regions 20, and each heat exchange channel 30 can extend into one or more corresponding second regions 20, so that the heat exchange fluid in the plate can transfer the heat absorbed in the first region 10 multiple times to different second regions 20 in a single cycle, ensuring efficient heat exchange, effectively improving the heat exchange efficiency of the heat exchange plate 100, and effectively preventing the problem of local overheating of electronic products, thus ensuring the temperature uniformity of electronic products.

[0049] According to one embodiment of this application, the heat exchange channel 30 itself has at least two sets of sub-channels 31 connected in series; each set of sub-channels 31 has a first channel section 31a and a second channel section 31b; the first channel section 31a is located in a first region 10, the second channel section 31b is located in a second region 20, and the second channel sections 31b of two adjacent sets of sub-channels 31 are connected to each other to form a series connection between the sub-channels 31.

[0050] In other words, such as Figure 1 As shown, the heat exchange channel 30 includes multiple sets of sub-channels 31. The sub-channels 31 extend from the first region 10 to the second region 20. The portion of the sub-channel 31 located in the first region 10 constitutes the first flow channel segment 31a of the sub-channel 31, and the portion of the sub-channel 31 located in the second region 20 constitutes the second flow channel segment 31b of the sub-channel 31. Adjacent sets of sub-channels 31 can be interconnected through one end of their respective second flow channel segments 31b. The following explanation uses two sets of sub-channels 31 as an example. One end of the second flow channel segment 31b of the first set of sub-channels 31 is connected to one end of the second flow channel segment 31b of the second set of sub-channels 31, thereby realizing the series connection between the sub-channels 31.

[0051] In this embodiment, as Figure 1 As shown, two adjacent sets of sub-channels 31 are connected in series through their respective second channel sections 31b, so that the heat exchange fluid in a single heat exchange channel 30 flows through the first region 10 and the second region 20 multiple times in a single cycle time. This allows the heat exchange fluid in a single heat exchange channel 30 to absorb heat from the heat-generating area of ​​the electronic product multiple times in the first region 10 and transfer the heat to the second region 20. This avoids heat exchange fluid saturation, ensures efficient heat exchange, improves the heat exchange efficiency of the heat exchange plate 100, and effectively prevents the problem of local overheating of the electronic product, ensuring the temperature uniformity of the electronic product.

[0052] Furthermore, when the heat exchange fluid flows through multiple sub-channels 31, it only needs to travel back and forth between the first region 10 and the second region 20 multiple times without passing through non-target regions. This ensures that the heat exchange fluid can focus on efficient heat exchange between the first region 10 (the heat-generating area of ​​the electronic product) and the second region 20 (the low-heat area of ​​the electronic product), thereby effectively avoiding ineffective heat exchange that may occur when the heat exchange fluid flows through non-target regions.

[0053] In some specific embodiments of this application, the plate body includes a plurality of first regions 10, and each first region 10 extends a plurality of sub-channels 31.

[0054] Specifically, the plate can be provided with multiple first regions 10, which are matched with multiple heat-generating areas of the electronic product. Each first region 10 extends with multiple sets of sub-channels 31. The multiple sets of sub-channels 31 can be sub-channels 31 of the same heat exchange channel 30 or sub-channels 31 of different heat exchange channels 30, so that the heat exchange fluid in the plate can absorb heat from different first regions 10 multiple times in a single cycle and transfer the heat to the second region 20.

[0055] In this embodiment, the heat exchange fluid through one or more heat exchange channels 30 can absorb heat in multiple heat-generating areas of the electronic product, so that the electronic product does not need to be equipped with multiple heat exchange plates 100, and the heat exchange fluid in the heat exchange plate 100 can flow through each first area 10 multiple times in a single cycle time, which can ensure efficient heat exchange.

[0056] According to one embodiment of this application, the plate includes a plurality of second regions 20, and the sub-channels 31 extend to different second regions 20.

[0057] In other words, the plate can be provided with multiple first regions 10, and each set of sub-channels 31 can extend to different second regions 20, so that the heat exchange fluid in a heat exchange channel 30 can flow through different second regions 20. This allows the heat exchange fluid in the plate to transfer the heat absorbed in the first region 10 multiple times to different second regions 20 in a single cycle, ensuring efficient heat exchange. This can effectively improve the heat exchange efficiency of the heat exchange plate 100, and effectively prevent the problem of local overheating of electronic products, ensuring the temperature uniformity of electronic products.

[0058] In some specific embodiments of this application, the first flow channel segment 31a of each group of sub-flow channels 31 bends and extends in its respective first region 10.

[0059] Specifically, such as Figure 1 and Figure 2 As shown, the first flow channel section 31a of the multiple sets of sub-flow channels 31 each has one or more bends, so that the first flow channel section 31a can be fully distributed in its corresponding first region 10. This can ensure that the heat exchange fluid can fully exert its heat exchange efficiency, optimize the heat exchange area, significantly improve the temperature uniformity of the heating area of ​​electronic products, effectively prevent local overheating, and thus ensure the stable operation of electronic products.

[0060] According to one embodiment of this application, the first region 10 includes a plurality of hot zones 11, and the first flow channel segment 31a of each group of sub-flow channels 31 is located in a different hot zone 11; and / or, the second region 20 includes a plurality of cold zones 21, and the second flow channel segment 31b of each group of sub-flow channels 31 is located in a different cold zone 21.

[0061] In other words, such as Figure 1 As shown, in order to further improve the heat exchange efficiency of the heat exchange plate 100, the first region 10 of the plate can be divided into multiple hot zones 11 (i.e., the regions that absorb heat from the heat-generating areas), and the first flow channel section 31a of each group of sub-flow channels 31 can be extended to different hot zones 11. That is, each hot zone 11 is configured with only one first flow channel section 31a, so that the heat exchange fluid flowing through each first flow channel section 31a can dissipate heat from the heat-generating areas of the electronic products at different locations. This is beneficial to maintaining the temperature uniformity of the heat-generating areas of the electronic products and can effectively prevent local overheating, thereby ensuring the stable operation of the electronic products.

[0062] like Figure 1 As shown, to further improve the heat exchange efficiency of the heat exchange plate 100, the second region 20 of the plate can be divided into multiple cold zones 21 (i.e., areas that dissipate heat to low-heat areas and / or the outside), and the second flow channel section 31b of each set of sub-flow channels 31 extends to different cold zones 21. That is, each cold zone 21 is configured with only one set of second flow channel sections 31b of sub-flow channels 31. This allows the heat exchange fluid to efficiently disperse and transfer heat to different locations in the low-heat areas of the electronic product when flowing within the second flow channel section 31b, promoting rapid heat transfer and distribution. Simultaneously, it effectively prevents localized heat saturation in the second region 20, thereby improving the heat exchange efficiency of the heat exchange plate 100.

[0063] In some specific embodiments of this application, the flow area of ​​the first flow channel section 31a is smaller than the flow area of ​​the second flow channel section 31b.

[0064] Specifically, in each group of sub-channels 31, the flow area (i.e., cross-sectional area) of the first flow channel section 31a and the second flow channel section 31b can be different. In this embodiment, the flow area of ​​the first flow channel section 31a is smaller than that of the second flow channel section 31b. The smaller flow area of ​​the first flow channel section 31a ensures that the heat exchange fluid can pass through the first region 10 quickly, effectively reducing the residence time of the heat exchange fluid in this region and effectively avoiding the thermal saturation phenomenon caused by prolonged contact with high temperature, thereby ensuring that the heat exchange process can be carried out continuously and efficiently. At the same time, the larger flow area of ​​the second flow channel section 31b ensures that the heat exchange fluid flows through the second region 20 more slowly, which is conducive to transferring heat to the low-heat area of ​​the electronic product. It can ensure that the temperature of the heat exchange fluid entering the first region 10 is not too high, thereby ensuring that the heat exchange fluid can continuously and efficiently absorb heat in the first region 10.

[0065] According to one embodiment of this application, the distribution density of heat exchange channels 30 in the first region 10 is greater than the distribution density of heat exchange channels 30 in the second region 20.

[0066] In other words, the distribution density of heat exchange channels 30 in the first region 10 and the second region 20 can be different. In this embodiment, the distribution density of heat exchange channels 30 in the first region 10 (i.e., the first channel segment 31a) is greater than the distribution density of heat exchange channels 30 in the second region 20 (i.e., the second channel segment 31b). That is, the heat exchange channels 30 are arranged relatively densely in the first region 10 and relatively sparsely in the second region 20. In other words, the area proportion of heat exchange channels 30 in the first region 10 is greater than the area proportion of heat exchange channels 30 in the second region 20.

[0067] In this embodiment, the dense heat exchange channels 30 in the first region 10 greatly increase the heat exchange area between the heat exchange fluid and the heat-generating area of ​​the electronic product, thereby accelerating the heat transfer process. This helps the heat exchange fluid to quickly absorb and carry away the heat generated in the heat-generating area, avoiding the occurrence of local overheating, significantly improving the temperature uniformity of the electronic product, and ensuring the stable operation of the electronic product.

[0068] In some specific embodiments of this application, the plate is provided with liquid inlets, which include a plurality of first liquid inlets 40 and a plurality of second liquid inlets 50. The first liquid inlets 40 and the second liquid inlets 50 are used to connect a micro pump, and each heat exchange channel 30 corresponds to a set of liquid inlets.

[0069] In other words, such as Figure 1 As shown, the plate is provided with liquid inlets, and each heat exchange channel 30 corresponds to a set of liquid inlets. Specifically, the liquid inlets include a first liquid inlet 40 and a second liquid inlet 50 that are connected to the heat exchange channel 30. In use, the first liquid inlet 40 can be connected to the outlet of the micro pump, and the second liquid inlet 50 can be connected to the inlet of the micro pump, thereby forming a circulation path for the heat exchange fluid. When the electronic product is working, the micro pump can drive the heat exchange fluid to circulate in the circulation path.

[0070] In this embodiment, a set of liquid inlets includes multiple first liquid inlets 40 and multiple second liquid inlets 50. Each first liquid inlet 40 and each second liquid inlet 50 can be connected to a micropump, enabling multiple micropumps to be connected in parallel in the circulation path. When one micropump fails, the other micropumps can still continue to work, thereby effectively improving the reliability of the heat exchange module. At the same time, the multiple micropumps can significantly reduce the pressure drop of the heat exchange fluid during circulation, ensuring a more uniform pressure distribution at various locations in the circulation path, thus guaranteeing the consistency of heat exchange effect and the temperature uniformity of electronic products.

[0071] According to one embodiment of this application, the plate body is provided with liquid inlets, including a first liquid inlet 40 and a second liquid inlet 50, and each heat exchange channel 30 corresponds to a set of liquid inlets; the plate body is provided with at least one transition channel 60, and the first end of the transition channel 60 and the first liquid inlet 40, and the second end of the transition channel 60 and the second liquid inlet 50 are both used to connect to the micro pump.

[0072] In other words, such as Figure 2 As shown, the plate is provided with a liquid inlet and a transition channel 60. Each heat exchange channel 30 corresponds to a set of liquid inlets and at least one transition channel 60. Specifically, the liquid inlets include a first liquid inlet 40 and a second liquid inlet 50 that are connected to the heat exchange channel 30.

[0073] When each heat exchange channel 30 corresponds to one transition channel 60, the outlet of the first micropump can be connected to the first end of the transition channel 60, the inlet of the first micropump can be connected to the first liquid inlet 40, the inlet of the second micropump can be connected to the second end of the transition channel 60, and the outlet of the second micropump can be connected to the second liquid inlet 50, thus forming a circulation path for the heat exchange fluid. When each heat exchange channel 30 corresponds to multiple transition channels 60, the ends of two transition channels 60 can also be connected to micropumps, allowing the circulation path to achieve a series connection of three or more micropumps.

[0074] In this embodiment, by cooperating the transition channel 60 with the first liquid inlet 40 and the second liquid inlet 50, multiple micro pumps can be connected in series, which effectively increases the flow rate of the heat exchange fluid in the circulation path, thereby significantly improving the heat exchange efficiency of the heat exchange plate 100.

[0075] In some specific embodiments of this application, the first region 10 is divided into a first sub-region with the same number of heat exchange channels 30, and each heat exchange channel 30 extends to a different first sub-region; and / or, the second region 20 is divided into a second sub-region with the same number of heat exchange channels 30, and each heat exchange channel 30 extends to a different second sub-region.

[0076] To further improve the heat exchange efficiency of the heat exchange plate 100, the first region 10 of the plate can be divided into multiple first sub-regions, and each heat exchange channel 30 can be extended to a different first sub-region. That is, only one heat exchange channel 30 is configured in the first sub-region. This allows the heat exchange fluid flowing through each heat exchange channel 30 to dissipate heat from the heat-generating area of ​​the electronic product at different locations, which helps to maintain the temperature uniformity of the heat-generating area of ​​the electronic product and can effectively prevent local overheating, thereby ensuring the stable operation of the electronic product.

[0077] To further improve the heat exchange efficiency of the heat exchange plate 100, the second region 20 of the plate can be divided into multiple second sub-regions, and each heat exchange channel 30 can extend to different cold zones 21. That is, each second sub-region is equipped with only one heat exchange channel 30. This allows the heat exchange fluid to efficiently disperse and transfer heat to different locations in the low-heat areas of the electronic product when flowing within the heat exchange channels 30, promoting rapid heat transfer and distribution. At the same time, it effectively prevents localized heat saturation in the second region 20, thereby improving the heat exchange efficiency of the heat exchange plate 100.

[0078] In summary, according to the heat exchange plate 100 provided in this embodiment, by setting multiple heat exchange channels 30 in the first region 10 and the second region 20 of the plate body, the heat exchange fluid in the heat exchange plate 100 can flow through the first region 10 multiple times in a single cycle time. This allows the heat exchange fluid to absorb heat in the first region 10 multiple times in a single cycle time and transfer the heat to the second region 20. This avoids heat exchange fluid saturation, ensures efficient heat exchange, improves the heat exchange efficiency of the heat exchange plate 100, and effectively prevents the problem of local overheating of electronic products, ensuring the temperature uniformity of electronic products.

[0079] This application also provides a heat exchange module, including the heat exchange plate 100 described in any of the above embodiments; a micropump, with at least one micropump corresponding to each heat exchange channel 30, and the micropumps communicating with the heat exchange channels 30 to form a circulation path. Since the heat exchange plate 100 according to the embodiments of this application has the above-mentioned technical effects, the heat exchange module according to the embodiments of this application also has corresponding technical effects, which will not be described again in this embodiment.

[0080] In some embodiments of this application, the micropump can be a piezoelectric micropump, with a length and width of about 7 mm and a thickness of about 1 mm, which is beneficial for installation on smaller electronic products.

[0081] Embodiments of this application also provide an electronic device, which is, for example, but not limited to, a wearable device, comprising the heat exchange module described in the above embodiments. Since the heat exchange plate 100 according to the embodiments of this application has the aforementioned technical effects, the electronic device according to the embodiments of this application also has corresponding technical effects, which will not be repeated in this embodiment.

[0082] In some embodiments of the application, the electronic device is a VR device. The first region 10 of the heat exchange plate 100 can be located in the heat-generating area of ​​the VR device (e.g., the area where the processor is located within the VR device), and the second region 20 of the heat exchange plate 100 can be located on the strap of the VR device. When the heat exchange module is running, the heat from the processor located within the VR device can be transferred to the strap through the circulating heat exchange fluid, and then transferred to the external environment through the strap.

[0083] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A heat exchange plate, characterized in that The plate body comprises a first region and a second region, the first region is configured to correspond to a heat generating area of an electronic product; The plate body is provided with a plurality of heat exchange channels, each of the heat exchange channels extends to the first region, and the heat exchange channels are not connected to each other; Each of the heat exchange channels extends to the second region. The plate body comprises a plurality of first regions, and each of the first regions extends a different heat exchange channel.

2. The heat exchange plate according to claim 1, characterized in that The plate body comprises a plurality of second regions, and each of the heat exchange channels extends to a different second region.

3. The heat exchange plate according to claim 1, characterized in that The heat exchange channel itself has at least two groups of serially connected sub-channels; 4. The heat exchange plate according to claim 1, characterized in that Each group of sub-channels has a first channel section and a second channel section; The first channel section is located in the first region, the second channel section is located in the second region, and the second channel sections of adjacent two groups of sub-channels are connected to each other to form the series connection between the sub-channels. The plate body comprises a plurality of first regions, and each of the first regions extends a plurality of groups of sub-channels.

5. The heat exchange plate according to claim 4, characterized in that The plate body comprises a plurality of second regions, and the sub-channels extend to different second regions.

6. The heat exchange plate according to claim 4, characterized in that The first channel section of each group of sub-channels is bent and extends in the corresponding first region.

7. The heat exchange plate according to claim 4, characterized in that The first region comprises a plurality of hot areas, and the first channel section of each group of sub-channels is located in a different hot area; and / or 8. The heat exchange plate according to claim 4, characterized in that The second region comprises a plurality of cold areas, and the second channel section of each group of sub-channels is located in a different cold area. The flow area of the first channel section is smaller than the flow area of the second channel section.

9. The heat exchange plate according to claim 4, characterized in that The distribution density of the heat exchange channels in the first region is greater than the distribution density of the heat exchange channels in the second region.

10. The heat exchange plate according to claim 1, characterized in that The plate body is provided with a liquid passage, the liquid passage comprises a plurality of first liquid passages and a plurality of second liquid passages, the first liquid passages and the second liquid passages are connected to communicate with a micro-pump, and each of the heat exchange channels corresponds to a group of liquid passages.

11. The heat exchange plate according to claim 1, characterized in that The plate body is provided with a liquid passage, the liquid passage comprises a first liquid passage and a second liquid passage, and each of the heat exchange channels corresponds to a group of liquid passages; 12. The heat exchange plate according to claim 1, characterized in that The plate body is provided with at least one transition channel, the first end of the transition channel and the first liquid passage, and the second end of the transition channel and the second liquid passage are connected to communicate with a micro-pump. The first region is divided into a same number of first sub-regions as the number of heat exchange channels, and each of the heat exchange channels extends to a different first sub-region; and / or 13. The heat exchange plate according to claim 1, characterized in that The second region is divided into a same number of second sub-regions as the number of heat exchange channels, and each of the heat exchange channels extends to a different second sub-region. The plate body comprises a first region and a second region, the first region is configured to correspond to a heat generating area of an electronic product; 14. A heat exchange module, characterized by The plate body is provided with a plurality of heat exchange channels, each of the heat exchange channels extends to the first region, and the heat exchange channels are not connected to each other; Each of the heat exchange channels extends to the second region. The plate body comprises a plurality of first regions, and each of the first regions extends a different heat exchange channel.

15. An electronic device, comprising: The plate body comprises a plurality of second regions, and each of the heat exchange channels extends to a different second region. The heat exchange channel itself has at least two groups of serially connected sub-channels; Each group of sub-channels has a first channel section and a second channel section; The first channel section is located in the first region, the second channel section is located in the second region, and the second channel sections of adjacent two groups of sub-channels are connected to each other to form the series connection between the sub-channels. The plate body comprises a plurality of first regions, and each of the first regions extends a plurality of groups of sub-channels. The plate body comprises a plurality of second regions, and the sub-channels extend to different second regions. The first channel section of each group of sub-channels is bent and extends in the corresponding first region. The first region comprises a plurality of hot areas, and the first channel section of each group of sub-channels is located in a different hot area; and / or The second region comprises a plurality of cold areas, and the second channel section of each group of sub-channels is located in a different cold area. The flow area of the first channel section is smaller than the flow area of the second channel section. The distribution density of the heat exchange channels in the first region is greater than the distribution density of the heat exchange channels in the second region. The plate body is provided with a liquid passage, the liquid passage comprises a plurality of first liquid passages and a plurality of second liquid passages, the first liquid passages and the second liquid passages are connected to communicate with a micro-pump, and each of the heat exchange channels corresponds to a group of liquid passages. The plate body is provided with a liquid passage, the liquid passage comprises a first liquid passage and a second liquid passage, and each of the heat exchange channels corresponds to a group of liquid passages; The plate body is provided with at least one transition channel, the first end of the transition channel and the first liquid passage, and the second end of the transition channel and the second liquid passage are connected to communicate with a micro-pump. The first region is divided into a same number of first sub-regions as the number of heat exchange channels, and each of the heat exchange channels extends to a different first sub-region; and / or The second region is divided into a same number of second sub-regions as the number of heat exchange channels, and each of the heat exchange channels extends to a different second sub-region. The plate body comprises a first region and a second region, the first region is configured to correspond to a heat generating area of an electronic product; The plate body is provided with a plurality of heat exchange channels, each of the heat exchange channels extends to the first region, and the heat exchange channels are not connected to each other; Each of the heat exchange channels extends to the second region. The plate body comprises a plurality of first regions, and each of the first regions extends a different heat exchange channel. The plate body comprises a plurality of second regions, and each of the heat exchange channels extends to a different second region. The heat exchange channel itself has at least two groups of serially connected sub-channels; Each group of sub-channels has a first channel section and a second channel section; The first channel section is located in the first region, the second channel section is located in the second region, and the second channel sections of adjacent two groups of sub-channels are connected to each other to form the series connection between the sub-channels. The plate body comprises a plurality of first regions, and each of the first regions extends a plurality of groups of sub-channels. The plate body comprises a plurality of second regions, and the sub-channels extend to different second regions. The first channel section of each group of sub-channels is bent and extends in the corresponding first region. The first region comprises a plurality of hot areas, and the first channel section of each group of sub-channels is located in a different hot area; and / or The second region comprises a plurality of cold areas, and the second channel section of each group of sub-channels is located in a different cold area. The flow area of the first channel section is smaller than the flow area of the second channel section. The distribution density of the heat exchange channels in the first region is greater than the distribution density of the heat exchange channels in the second region. The plate body is provided with a liquid passage, the liquid passage comprises a plurality of first liquid passages and a plurality of second liquid passages, the first liquid passages and the second liquid passages are connected to communicate with a micro-pump, and each of the heat exchange channels corresponds to a group of liquid passages. The plate body is provided with a liquid passage, the liquid passage comprises a first liquid passage and a second liquid passage, and each of the heat exchange channels corresponds to a group of liquid passages; The plate body is provided with at least one transition channel, the first end of the transition channel and the first liquid passage, and the second end of the transition channel and the second liquid passage are connected to communicate with a micro-pump. The first region is divided into a same number of first sub-regions as the number of heat exchange channels, and each of the heat exchange channels extends to a different first sub-region; and / or The second region is divided into a same number of second sub-regions as the number of heat exchange channels, and each of the heat exchange channels extends to a different second sub-region. The plate body comprises a first region and a second region, the first region is configured to correspond to a heat generating area of an electronic product; The plate body is provided with a plurality of heat exchange channels, each of the heat exchange channels extends to the first region, and the heat exchange channels are not connected to each other; Each of the heat exchange channels extends to the second region. The plate body comprises a plurality of first regions, and each of the first regions extends a different heat exchange channel. The plate body comprises a plurality of second regions, and each of the heat exchange channels extends to a different second region. The heat exchange channel itself has at least two groups of serially connected sub-channels; Each group of sub-channels has a first channel section and a second channel section; The first channel section is located in the first region, the second channel section is located in the second region, and the second channel sections of adjacent two groups of sub-channels are connected to each other

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