Heat exchange part, heat exchange module and electronic equipment

Abstract

The embodiment of the invention discloses a heat exchange piece, a heat exchange module and electronic equipment, the heat exchange piece comprises a substrate layer and a cover plate layer which are arranged in a stacked mode, a runner groove is formed in the side, close to the cover plate layer, of the substrate layer, the substrate layer comprises a liquid cooling layer and a bonding layer arranged on the liquid cooling layer, and the liquid cooling layer is arranged on the bonding layer. The liquid cooling layer and the bonding layer jointly form the side wall of the flow channel groove, and the cover plate layer is connected with the liquid cooling layer in a sealed mode through the bonding layer, so that the cover plate layer and the substrate layer define a flow channel at the position of the flow channel groove. Therefore, bonding sealing of the liquid cooling layer and the cover plate layer can be achieved through the bonding layer, the sealing technology can be simplified, and therefore the machining difficulty of the heat exchange piece is lowered.

Description

Technical Field

[0001] This invention relates to the field of heat transfer technology, and more specifically, to a heat exchanger, a heat exchange module, and an electronic device. Background Technology

[0002] As electronic devices become increasingly integrated, heat dissipation has become a key factor limiting their performance improvement. Liquid cooling plates, as a highly efficient heat dissipation component, are widely used in various high-power-density electronic devices.

[0003] For current liquid cooling plate structures, the flow channel layer and the sealing layer are usually sealed by hot pressing. However, during the hot pressing sealing process, due to the complexity and diversity of the flow channels within the flow channel layer, it is often necessary to design positioning molds to position the flow channel layer and the sealing layer, which makes the processing technology of the liquid cooling plate quite complex. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a novel heat exchanger, heat exchange module and electronic device.

[0005] According to one aspect of the present invention, a heat exchanger is provided.

[0006] The heat exchanger includes:

[0007] A substrate layer and a cover layer are stacked together. A flow channel groove is formed on the side of the substrate layer near the cover layer. The substrate layer includes a liquid cooling layer and an adhesive layer disposed on the liquid cooling layer. The liquid cooling layer and the adhesive layer together form the sidewall of the flow channel groove. The cover layer is sealed to the liquid cooling layer through the adhesive layer, so that the cover layer and the substrate layer form a flow channel at the flow channel groove.

[0008] Optionally, the depth of the flow channel ranges from 0.08 mm to 0.17 mm.

[0009] Optionally, along the thickness direction of the heat exchanger, the ratio of the size of the flow channel to the size of the substrate layer ranges from 1:6 to 5:6.

[0010] Optionally, the adhesive layer includes at least one adhesive layer, and the liquid cooling layer and the cover plate layer are bonded together through the adhesive layer.

[0011] Optionally, the adhesive is applied by dispensing or screen printing to form the adhesive layer.

[0012] Optionally, the adhesive includes POE, polyurethane, butyl rubber, pressure-sensitive adhesive, pressure-sensitive hot melt composite film, hot melt adhesive, or thermosetting adhesive.

[0013] Optionally, the cover plate layer includes at least one of a polymer material layer and a metal layer.

[0014] Optionally, the liquid cooling layer includes at least one of a polymer material layer and a metal layer.

[0015] Optionally, the thickness of the adhesive layer ranges from 0.025 mm to 0.05 mm.

[0016] Optionally, the thickness ratio of the cover layer to the adhesive layer ranges from 0.6 to 2.

[0017] Optionally, along the thickness direction of the heat exchanger, the edge of the adhesive layer is flush with the edge of the liquid cooling layer.

[0018] Optionally, the adhesive layer has a guide portion on the side near the flow channel groove, the guide portion being used to guide the flow of the working fluid within the flow channel.

[0019] Optionally, the cover plate layer can be a single-layer structure or a multi-layer structure.

[0020] According to another aspect of the present invention, a heat exchange module is provided, comprising a micropump and the heat exchange element described above.

[0021] Optionally, the heat exchanger has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet.

[0022] According to another aspect of the present invention, an electronic device is provided, including the heat exchanger or the heat exchange module described above.

[0023] One technical advantage of the embodiments disclosed herein is that:

[0024] The heat exchanger includes a substrate layer and a cover plate layer stacked together. A flow channel groove is formed on the side of the substrate layer near the cover plate layer. The substrate layer includes a liquid cooling layer and an adhesive layer disposed on the liquid cooling layer. The liquid cooling layer and the adhesive layer together form the sidewall of the flow channel groove. The cover plate layer is sealed to the liquid cooling layer through the adhesive layer, so that the cover plate layer and the substrate layer form a flow channel at the flow channel groove. In this way, the adhesive layer can be used to achieve a bonded seal between the liquid cooling layer and the cover plate layer, simplifying the sealing process and reducing the processing difficulty of the heat exchanger.

[0025] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0026] The accompanying drawings, which form part of this specification, illustrate embodiments of the invention and, together with the specification, serve to explain the principles of the invention.

[0027] Figure 1 This is a schematic diagram of a heat exchanger according to an embodiment of the present disclosure.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. Cover plate layer; 2. Substrate layer; 21. Flow channel; 22. Liquid cooling layer; 23. Adhesive layer. Detailed Implementation

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0031] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0032] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0033] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0035] This invention provides a heat exchange component that can be applied to heat exchange in electronic devices such as tablets, laptops, VR (Virtual Reality) products, AR (Augmented Reality) products, and watches.

[0036] like Figure 1 As shown, the heat exchanger provided in this embodiment of the invention includes:

[0037] A substrate layer 2 and a cover layer 1 are stacked together. A flow channel groove 21 is formed on the side of the substrate layer 2 near the cover layer 1. The substrate layer 2 includes a liquid cooling layer 22 and an adhesive layer 23 disposed on the liquid cooling layer 22. The liquid cooling layer 22 and the adhesive layer 23 together form the sidewall of the flow channel groove 21. The cover layer 1 is sealed to the liquid cooling layer 22 through the adhesive layer 23, so that the cover layer 1 and the substrate layer 2 form a flow channel at the flow channel groove 21.

[0038] like Figure 1 As shown, in this embodiment of the invention, a flow channel groove 21 is formed on the side of the substrate layer 2 near the cover plate layer 1. That is, the flow channel groove 21 is a groove on the substrate layer 2, which allows the working fluid to flow smoothly in the flow channel 21 and fully contact the liquid cooling layer 22, thereby achieving efficient heat conduction. Moreover, since the flow channel groove 21 is a groove on the substrate layer 2, the substrate layer 2 itself can also form a one-sided seal for the flow channel 21, thereby reducing the assembly difficulty of the heat exchanger and improving the assembly efficiency.

[0039] According to the actual design, the shape of the flow channel 21 includes, but is not limited to, straight, serpentine, and spiral shapes, to optimize the flow path of the working fluid and heat exchange efficiency. Corresponding connectors or interfaces can also be provided at the inlet and outlet of the flow channel to facilitate connection with external heat exchange systems such as water micropumps and radiators, forming a complete heat exchange cycle.

[0040] In this embodiment, the substrate layer 2 includes a liquid cooling layer 22 and an adhesive layer 23. During the processing of the flow channel 21, the adhesive layer 23 and the liquid cooling layer 22 can be stacked to form the substrate layer 2 first, and then the substrate layer 2 can be cut to form the flow channel 21. This allows the adhesive layer 23 and the liquid cooling layer 22 to jointly form the sidewall of the flow channel 21, which facilitates the formation of the flow channel 21 and also enhances the sealing of the sidewall of the flow channel 21, thereby ensuring the sealing of the flow channel formed on the heat exchanger and thus ensuring the heat exchange effect.

[0041] The liquid cooling layer 22 can be made of metal, polymer, or a combination of metal and polymer materials, which can meet different application requirements.

[0042] In this embodiment, the adhesive layer 23 is located between the liquid cooling layer 22 and the cover plate layer 1. The adhesive layer 23 is used to seal and connect the liquid cooling layer 22 and the cover plate layer 1. The adhesive layer 23 can be made of an adhesive or thin film material with good sealing and thermal conductivity. On the one hand, the adhesive layer 23 can firmly connect the cover plate layer 1 and the liquid cooling layer 22, thereby forming an integral structure of the heat exchanger; on the other hand, the adhesive layer 23 can also ensure the sealing of the flow channel 21 and prevent poor heat exchange effect caused by working fluid leakage.

[0043] During the production and assembly process, the cover plate layer 1 forms a sealed connection with the liquid cooling layer 22 through the adhesive layer 23, thereby creating a closed flow channel between the cover plate layer 1 and the base plate layer 2 at the flow channel groove 21. Working fluid flows within the flow channel, enabling the heat exchange function of the heat exchange component. In this way, the adhesive layer 23 can be used to achieve a bonded seal between the liquid cooling layer 22 and the cover plate layer 1, simplifying the sealing process and reducing the processing difficulty of the heat exchange component. Special treatments, such as surface roughening, can be applied to the surfaces where the cover plate layer 1 and the adhesive layer 23 contact to enhance the bonding strength between them.

[0044] In addition, heat dissipation fins can be provided on the cover plate layer 1 to increase the heat exchange area and promote air convection, thereby further improving the heat exchange effect of the heat exchanger. Alternatively, a more efficient working fluid (such as a low-viscosity, high-thermal-conductivity liquid) or a phase change material can be used to further improve the heat exchange effect of the heat exchanger.

[0045] The heat exchanger provided in this embodiment can be widely used in heat exchange of electronic devices such as tablets, laptops, smart glasses, smartwatches, and smart head-mounted devices. It can effectively reduce the operating temperature of electronic devices and improve their operational stability and service life. It is thin, lightweight, has high heat exchange efficiency, and is easy to process and install, thus possessing promising market application prospects.

[0046] Optionally, the depth of the flow channel 21 ranges from 0.08 mm to 0.17 mm.

[0047] In this embodiment, by setting the depth of the flow channel groove 21 on the substrate layer 2 to be between 0.08 mm and 0.17 mm, the process of opening the flow channel groove 21 on the substrate layer 2 can be controlled. This allows the flow channel groove 21 to facilitate the flow of the working fluid to achieve heat exchange, while also ensuring the strength and sealing of the substrate layer 2 itself, thereby improving the structural reliability of the heat exchanger.

[0048] Optionally, along the thickness direction of the heat exchanger, the ratio of the size of the flow channel 21 to the size of the substrate layer 2 ranges from 1:6 to 5:6.

[0049] In this embodiment, by setting the ratio of the depth of the flow channel 21 to the thickness of the substrate layer 2 to be between 1:6 and 5:6, the process of opening the flow channel 21 on the substrate layer 2 can be controlled. This allows the flow channel 21 to be formed to facilitate the flow of the working fluid for heat exchange while ensuring the strength and sealing of the substrate layer 2 itself, thereby improving the structural reliability of the heat exchanger.

[0050] The preferred ratio of the depth of the flow channel 21 to the thickness of the substrate layer 2 is 1 / 5, which can achieve a better heat exchange effect while ensuring the sealing of the connection between the substrate layer 2 and the cover plate layer 1, thereby improving the structural reliability of the heat exchanger.

[0051] Optionally, the adhesive layer 23 includes at least one layer of adhesive, and the liquid cooling layer 22 and the cover plate layer 1 are bonded together through the adhesive layer 23.

[0052] Specifically, depending on the actual design requirements, the adhesive layer 23 may include one, two, or even multiple layers of adhesive to achieve different bonding effects. The adhesive layer 23 may include the same type of adhesive, or it may include different types of adhesive to meet different application requirements.

[0053] In this embodiment, the liquid cooling layer 22 is bonded to the cover plate layer 1 via the adhesive layer 23, forming an integral structure of the heat exchanger. Furthermore, the adhesive layer 23 ensures the sealing of the flow channel 21, preventing poor heat exchange performance due to working fluid leakage.

[0054] Optionally, the adhesive is applied by dispensing or screen printing to form the adhesive layer 23.

[0055] In this embodiment, the amount and distribution of the adhesive in the dispensing and screen printing processes can be precisely controlled, ensuring that the adhesive layer 23 has a uniform thickness on the liquid cooling layer 22 and only covers the area to be bonded. This helps reduce unnecessary material waste and improves the bonding strength and sealing performance. Furthermore, the shape and spacing of the adhesive application can be adjusted as needed to accommodate liquid cooling layers 22 and cover plates of different shapes and sizes. This helps optimize the structure of the adhesive layer 23, increases the contact area and adhesion of the bonding interface, and thus enhances the overall bonding performance and sealing effect of the heat exchanger.

[0056] Optionally, the adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite film, hot melt adhesive, or thermosetting adhesive.

[0057] In this embodiment, by designing the adhesive to be any one of polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, and thermosetting adhesive, the bonding and sealing of the liquid cooling layer 22 and the cover plate layer 1 can be achieved, thereby simplifying the molding process of the heat exchange component and reducing the processing difficulty of the heat exchange component.

[0058] The preferred adhesive is a pressure-sensitive hot melt composite adhesive film. The pressure-sensitive hot melt composite adhesive film is used to bond the liquid cooling layer 22 to the cover plate layer 1, which can improve the reliability of the bonding and sealing, as well as its density, thereby improving the structural stability of the heat exchanger.

[0059] Optionally, the cover layer 1 includes at least one of a polymer material layer and a metal layer.

[0060] In this embodiment, depending on actual design requirements, the cover layer 1 can include a polymer material layer and / or a metal layer. For example, the cover layer 1 can include a metal layer, which can improve the overall strength and thermal conductivity of the heat exchanger, thereby ensuring the stability of the electronic device with the heat exchanger in complex working environments and reducing the operating temperature of the electronic device; the cover layer 1 can also include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger, thereby facilitating the carrying and use of the electronic device with the heat exchanger; the cover layer 1 can also include both a polymer material layer and a metal layer, which can combine the characteristics of both to improve the overall performance of the heat exchanger.

[0061] Optionally, the liquid cooling layer 22 includes at least one of a polymer material layer and a metal layer.

[0062] In this embodiment, depending on actual design requirements, the liquid cooling layer 22 can include a polymer material layer and / or a metal layer. For example, the liquid cooling layer 22 can include a metal layer, which can improve the strength and thermal conductivity of the liquid cooling layer 22, thereby improving the heat exchange efficiency of the heat exchanger, reducing the operating temperature of the electronic device with the heat exchanger, and also facilitating a reduction in the thickness of the liquid cooling layer 22; the liquid cooling layer 22 can also include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger, thereby facilitating the portability and use of the electronic device with the heat exchanger; the liquid cooling layer 22 can also include both a polymer material layer and a metal layer, which can combine the characteristics of both to improve the overall performance of the heat exchanger.

[0063] For example, the liquid cooling layer 22 can be made of metal materials with high thermal conductivity and corrosion resistance, such as copper, aluminum or stainless steel alloys. The liquid cooling layer 22 can also be made of polymer materials such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate).

[0064] Optionally, the thickness of the adhesive layer 23 ranges from 0.025 mm to 0.05 mm.

[0065] In this embodiment, the thickness of the adhesive layer 23 can be precisely controlled between 0.025mm and 0.05mm during the dispensing or screen printing process. This allows the adhesive layer 23 to connect the liquid cooling layer 22 to the cover plates on both sides while also reducing the thickness of the adhesive layer 23. This reduces the overall thickness of the heat exchanger, thereby meeting the requirement for thinner and lighter electronic devices that use the heat exchanger.

[0066] When the heat exchanger needs to be relatively thin, the thickness of the adhesive layer 23 can be set to 0.025mm; when there is a high requirement for the connection strength of the heat exchanger, the thickness of the adhesive layer 23 can be set to 0.05mm.

[0067] The overall thickness of the heat exchanger is between 0.2mm and 0.4mm, the thickness of the cover plate layer 1 is between 0.03mm and 0.05mm, the thickness of the adhesive layer 23 is between 0.025mm and 0.05mm, and the thickness of the liquid cooling layer 22 is between 0.145mm and 0.3mm.

[0068] Optionally, the thickness ratio of the cover layer 1 to the adhesive layer 23 ranges from 0.6 to 2.

[0069] The ratio of the thickness of the cover layer 1 to the adhesive layer 23 can be adjusted according to the connection strength and size requirements of the heat exchanger. This also avoids the problem of glue overflow caused by excessively thick adhesive layer 23, thereby improving the reliability of the heat exchanger.

[0070] Optionally, along the thickness direction of the heat exchanger, the edge of the adhesive layer 23 is flush with the edge of the liquid cooling layer 22. For example... Figure 1 As shown, aligning the edges of the adhesive layer 23 and the liquid cooling layer 22 reduces the resistance to the flow of the working fluid in the flow channel, thereby ensuring the heat exchange effect of the heat exchanger.

[0071] Optionally, the adhesive layer 23 has a guide portion on the side near the flow channel 21, the guide portion being used to guide the flow of the working fluid within the flow channel.

[0072] In this embodiment, a guide portion, such as one or more rounded corners, can also be provided on the side of the adhesive layer 23 near the flow channel groove 21. This smooth transition can reduce the flow resistance of the working fluid in the flow channel, help reduce energy loss, reduce the pressure drop in the flow channel, and further improve the fluidity of the working fluid, thereby ensuring the heat exchange effect of the heat exchanger.

[0073] Optionally, the cover plate layer 1 is a single-layer structure or a multi-layer structure.

[0074] In this embodiment, the cover plate layer 1 may include a single layer or multiple layers of sealing layers. The cover plate layer 1 forms an adhesive seal with the liquid cooling layer 22 through the adhesive layer 23. The cover plate layer 1 also includes a sealing layer and a barrier layer. The barrier layer is disposed close to the flow channel groove 21. The cover plate layer 1 forms an adhesive seal with the liquid cooling layer 22 through the adhesive layer 23. At the same time, the barrier layer can also block foreign objects such as water and dust.

[0075] This invention also provides a heat exchange module, including a micropump and the aforementioned heat exchange components. Corresponding connectors or interfaces can be provided at the inlet and outlet of the flow channel to facilitate connection with the micropump and form a complete heat exchange cycle.

[0076] Optionally, the heat exchanger has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet. Thus, the working fluid can enter the flow channel through the second working fluid outlet and the first working fluid inlet, and return to the micropump from the flow channel through the first working fluid outlet and the second working fluid inlet, thereby achieving working fluid circulation.

[0077] This invention also provides an electronic device, including the aforementioned heat exchanger or heat exchange module. This electronic device can be a small electronic device, such as a tablet computer, laptop computer, smart glasses, smartwatch, or smart headband.

[0078] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0079] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A heat exchanging member, characterized by, The application relates to a heat exchange device, comprising: a substrate layer (2) and a cover layer (1) arranged in a stack, a flow channel groove (21) being arranged on a side of the substrate layer (2) close to the cover layer (1), the substrate layer (2) comprising a liquid cooling layer (22) and an adhesive layer (23) arranged on the liquid cooling layer (22), the liquid cooling layer (22) and the adhesive layer (23) jointly forming a side wall of the flow channel groove (21), and the cover layer (1) being sealedly connected with the liquid cooling layer (22) through the adhesive layer (23), so that the cover layer (1) and the substrate layer (2) enclose a flow channel at the flow channel groove (21). The depth of the flow channel groove (21) ranges from 0.08 mm to 0.17 mm.

2. The heat exchange member according to claim 1, characterized by The ratio of the size of the flow channel groove (21) to the size of the substrate layer (2) ranges from 1:6 to 5:6 along the thickness direction of the heat exchange device.

3. The heat exchange member according to claim 1, characterized by The adhesive layer (23) comprises at least one layer of adhesive, and the adhesive layer (23) is arranged between the liquid cooling layer (22) and the cover layer (1) to form an adhesive connection.

4. The heat exchange member according to claim 1, characterized by The adhesive layer (23) is formed by dispensing or screen printing.

5. The heat exchange member according to claim 4, characterized by The adhesive comprises polyolefin elastomer glue, polyurethane glue, butyl glue, pressure-sensitive glue, pressure-sensitive hot melt composite glue film, hot melt glue or thermosetting glue.

6. The heat exchange member according to claim 4, wherein The cover layer (1) comprises at least one of a polymer material layer and a metal layer.

7. The heat exchange member according to claim 1, wherein The liquid cooling layer (22) comprises at least one of a polymer material layer and a metal layer.

8. The heat exchange member according to claim 1, wherein The thickness of the adhesive layer (23) ranges from 0.025 mm to 0.05 mm.

9. The heat exchange member of claim 1, wherein The ratio of the thickness of the cover layer (1) to the thickness of the adhesive layer (23) ranges from 0.6 to 2.

10. The heat exchange member of claim 1, wherein The edge of the adhesive layer (23) is flush with the edge of the liquid cooling layer (22) along the thickness direction of the heat exchange device.

11. The heat exchange member of claim 1, wherein The adhesive layer (23) has a guide portion on a side close to the flow channel groove (21), and the guide portion is used for guiding the flow of a working medium in the flow channel.

12. The heat exchange member of claim 1, wherein The cover layer (1) has a single-layer structure or a multi-layer structure.

13. The heat exchange member of claim 1, wherein The application further relates to a heat exchange module, comprising a micro-pump and the heat exchange device according to any one of claims 1 to 13.

14. A heat exchange module, characterized by The heat exchange device has a first working medium inlet and a first working medium outlet, the micro-pump has a second working medium inlet and a second working medium outlet, the first working medium inlet and the first working medium outlet are respectively connected with the flow channel, and the first working medium inlet is connected with the second working medium outlet, and the first working medium outlet is connected with the second working medium inlet.

15. The heat exchange module of claim 14, wherein, The application further relates to a heat exchange module, comprising the heat exchange device according to any one of claims 1 to 13 or the heat exchange module according to any one of claims 14 to 15.

16. An electronic device, comprising: ​

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