Heat exchange part, heat exchange module and electronic equipment

Abstract

The embodiment of the invention discloses a heat exchange piece, a heat exchange module and electronic equipment, the heat exchange piece comprises a first cover plate, a second cover plate and a middle layer which are arranged in a stacked mode, a runner groove is formed in the middle layer, and the runner groove is arranged in the thickness direction of the middle layer in a penetrating mode; the middle layer comprises a liquid cooling layer and bonding layers arranged on the two sides of the liquid cooling layer, the liquid cooling layer and the bonding layers on the two sides jointly form the side wall of the flow channel groove, and the first cover plate and the second cover plate are connected with the liquid cooling layer in a sealed mode through the bonding layers. And the first cover plate, the second cover plate and the middle layer define a flow channel at the flow channel groove. Therefore, the bonding sealing of the first cover plate, the second cover plate and the liquid cooling layer can be realized by utilizing the bonding layer, the sealing process can be simplified, and the processing difficulty of the heat exchange piece is also reduced.

Description

Technical Field

[0001] This invention relates to the field of heat transfer technology, and more specifically, to a heat exchanger, a heat exchange module, and an electronic device. Background Technology

[0002] As electronic devices become increasingly integrated, heat dissipation has become a key factor limiting their performance improvement. Liquid cooling plates, as a highly efficient heat dissipation component, are widely used in various high-power-density electronic devices.

[0003] For current liquid cooling plate structures, the flow channel layer and the sealing layer are usually sealed by hot pressing. However, during the hot pressing sealing process, due to the complexity and diversity of the flow channels within the flow channel layer, it is often necessary to design positioning molds to position the flow channel layer and the sealing layer, which makes the processing technology of the liquid cooling plate quite complex. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide a novel heat exchanger, heat exchange module and electronic device.

[0005] According to one aspect of the present invention, a heat exchanger is provided.

[0006] The heat exchanger includes:

[0007] A first cover plate, a second cover plate, and an intermediate layer are stacked together. A flow channel groove is formed on the intermediate layer and extends through the thickness of the intermediate layer. The intermediate layer includes a liquid cooling layer and adhesive layers disposed on both sides of the liquid cooling layer. The liquid cooling layer and the adhesive layers on both sides together form the sidewall of the flow channel groove. The first cover plate and the second cover plate are respectively sealed to the liquid cooling layer through the adhesive layers, so that the first cover plate, the second cover plate, and the intermediate layer form a flow channel at the flow channel groove.

[0008] Optionally, the adhesive layer includes at least one layer of adhesive, and the first side of the liquid cooling layer is bonded to the first cover plate through the adhesive layer, and the second side of the liquid cooling layer is bonded to the second cover plate through the adhesive layer.

[0009] Optionally, the adhesive is applied by dispensing or screen printing to form the adhesive layer.

[0010] Optionally, the adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite film, hot melt adhesive, or thermosetting adhesive.

[0011] Optionally, the first cover plate includes at least one of a polymer material layer and a metal layer, and / or the second cover plate includes at least one of a polymer material layer and a metal layer.

[0012] Optionally, the liquid cooling layer includes at least one of a polymer material layer and a metal layer.

[0013] Optionally, the thickness of the adhesive layer ranges from 0.025mm to 0.05mm.

[0014] Optionally, along the thickness direction of the heat exchanger, the first cover plate, the first adhesive layer, the liquid cooling layer, the second adhesive layer, and the second cover plate are sequentially stacked. The first cover plate is sealed to the first side of the liquid cooling layer through the first adhesive layer, and the second cover plate is sealed to the second side of the liquid cooling layer through the second adhesive layer.

[0015] Optionally, the thickness ratio of the first cover plate to the first adhesive layer is in the range of 0.6-2, and / or the thickness ratio of the second cover plate to the second adhesive layer is in the range of 0.6-2.

[0016] Optionally, along the thickness direction of the heat exchanger, the edge of the adhesive layer is flush with the edge of the liquid cooling layer.

[0017] Optionally, the adhesive layer has a guide portion on the side near the flow channel groove, the guide portion being used to guide the flow of the working fluid within the flow channel.

[0018] Optionally, the first cover plate is a single-layer structure or a multi-layer structure;

[0019] And / or, the second cover plate is a single-layer structure or a multi-layer structure.

[0020] According to another aspect of the present invention, a heat exchange module is provided, comprising a micropump and the heat exchange element described above.

[0021] Optionally, the heat exchanger has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet.

[0022] According to another aspect of the present invention, an electronic device is provided, including the heat exchanger or the heat exchange module described above.

[0023] One technical advantage of the embodiments disclosed herein is that:

[0024] The heat exchanger includes a first cover plate, a second cover plate, and an intermediate layer stacked together. A flow channel groove is formed in the intermediate layer, extending through the thickness of the intermediate layer. The intermediate layer includes a liquid cooling layer and adhesive layers disposed on both sides of the liquid cooling layer. The liquid cooling layer and the adhesive layers together form the sidewalls of the flow channel groove. The first cover plate and the second cover plate are respectively sealed to the liquid cooling layer through the adhesive layers, so that the first cover plate, the second cover plate, and the intermediate layer form a flow channel at the flow channel groove. In this way, the adhesive layers can be used to achieve a sealed connection between the first cover plate, the second cover plate, and the liquid cooling layer, simplifying the sealing process and reducing the processing difficulty of the heat exchanger.

[0025] Other features and advantages of the invention will become clear from the following detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. Attached Figure Description

[0026] The accompanying drawings, which form part of this specification, illustrate embodiments of the invention and, together with the specification, serve to explain the principles of the invention.

[0027] Figure 1 This is a schematic diagram of a heat exchanger according to an embodiment of the present disclosure.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. First cover plate; 2. Intermediate layer; 21. Flow channel; 22. Liquid cooling layer; 23. Adhesive layer; 3. Second cover plate. Detailed Implementation

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention.

[0031] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0032] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0033] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0035] This invention provides a heat exchange component that can be applied to heat exchange in electronic devices such as tablets, laptops, VR (Virtual Reality) products, AR (Augmented Reality) products, and watches.

[0036] like Figure 1 As shown, the heat exchanger provided in this embodiment of the invention includes:

[0037] A first cover plate 1, a second cover plate 3, and an intermediate layer 2 are stacked together. The intermediate layer 2 has a flow channel groove 21 that extends through the thickness of the intermediate layer 2. The intermediate layer 2 includes a liquid cooling layer 22 and adhesive layers 23 disposed on both sides of the liquid cooling layer 22. The liquid cooling layer 22 and the adhesive layers 23 on both sides together form the sidewall of the flow channel groove 21. The first cover plate 1 and the second cover plate 3 are respectively sealed to the liquid cooling layer 22 through the adhesive layers 23, so that the first cover plate 1, the second cover plate 3, and the intermediate layer 2 form a flow channel at the flow channel groove 21.

[0038] like Figure 1 As shown, the intermediate layer 2 is sandwiched between the first cover plate 1 and the second cover plate 3, so that the first cover plate 1 and the second cover plate 3 on both sides can provide support and protection for the intermediate layer 2. In this embodiment of the invention, a flow channel groove 21 is formed on the intermediate layer 2. The flow channel groove 21 extends along the thickness direction of the intermediate layer 2, so that the working fluid can flow smoothly in the flow channel 21 and make full contact with the liquid cooling layer 22, thereby achieving efficient heat conduction.

[0039] That is, the flow channel 21 is a through-slot on the intermediate layer 2, which simplifies the process of creating the flow channel 21. Depending on the actual design, the shape of the flow channel 21 may include, but is not limited to, straight, serpentine, and spiral shapes, to optimize the flow path of the working fluid and heat exchange efficiency. Corresponding connectors or interfaces can also be provided at the inlet and outlet of the flow channel to facilitate connection with external heat exchange systems such as water micropumps and radiators, forming a complete heat exchange cycle.

[0040] In this embodiment, the intermediate layer 2 includes a liquid cooling layer 22 and adhesive layers 23 on both sides. One side of the liquid cooling layer 22 has a first adhesive layer, and the opposite side has a second adhesive layer. The first adhesive layer, the liquid cooling layer 22, and the second adhesive layer together form the intermediate layer 2. During the processing of the flow channel 21, the first adhesive layer, the liquid cooling layer 22, and the second adhesive layer can be stacked to form the intermediate layer 2, and then the intermediate layer 2 can be cut to form the flow channel 21. This allows the first adhesive layer, the liquid cooling layer 22, and the second adhesive layer to jointly form the sidewall of the flow channel 21, facilitating the formation of the flow channel 21 while also enhancing the sealing of the sidewall of the flow channel 21. This ensures the sealing of the flow channel formed on the heat exchanger, thereby guaranteeing the heat exchange effect.

[0041] The liquid cooling layer 22 can be made of metal, polymer, or a combination of metal and polymer materials, which can meet different application requirements.

[0042] The first and second adhesive layers are located on both sides of the liquid cooling layer 22, respectively. These layers can be made of adhesives or thin film materials with good sealing and thermal conductivity. On one hand, the adhesive layer 23 firmly connects the cover plate to the liquid cooling layer 22, thus forming an integral structure for the heat exchanger. On the other hand, the adhesive layers 23 on both sides also ensure the sealing of the flow channel 21, preventing poor heat exchange performance due to working fluid leakage.

[0043] During the production and assembly process, the first cover plate 1 and the second cover plate 3 are respectively sealed to the liquid cooling layer 22 through their respective adhesive layers 23, forming a closed flow channel at the flow channel groove 21. Working fluid flows within the flow channel, thus enabling the heat exchange function of the heat exchanger. In this way, the adhesive layers can be used to achieve the bonding and sealing between the first cover plate 1, the second cover plate 3, and the liquid cooling layer 22, simplifying the sealing process and reducing the processing difficulty of the heat exchanger. Specifically, special treatments, such as surface roughening, can be applied to the surfaces of the first cover plate 1 and the second cover plate 3 that contact the adhesive layer 23 to strengthen the bonding strength between them.

[0044] In addition, heat dissipation fins can be provided on the first cover plate 1 and / or the second cover plate 3 to increase the heat exchange area and promote air convection, thereby further improving the heat exchange effect of the heat exchanger. Alternatively, a more efficient working fluid (such as a low-viscosity, high-thermal-conductivity liquid) or a phase change material can be used to further improve the heat exchange effect of the heat exchanger.

[0045] The heat exchanger provided in this embodiment can be widely used in heat exchange for electronic devices such as tablets, laptops, smart glasses, smartwatches, and smart head-mounted displays. It can effectively reduce the operating temperature of electronic devices and improve their operational stability and service life. It is thin, lightweight, has high heat exchange efficiency, and is easy to process and install, thus possessing promising market application prospects.

[0046] Optionally, the adhesive layer 23 includes at least one layer of adhesive, and the first side of the liquid cooling layer 22 is bonded to the first cover plate 1 through the adhesive layer 23, and the second side of the liquid cooling layer 22 is bonded to the second cover plate 3 through the adhesive layer 23.

[0047] Specifically, depending on the actual design requirements, the adhesive layer 23 may include one, two, or even multiple layers of adhesive to achieve different bonding effects. The adhesive layer 23 may include the same type of adhesive, or it may include different types of adhesive to meet different application requirements.

[0048] In this embodiment, the two sides of the liquid cooling layer 22 are bonded to the cover plate through adhesive layers 23, forming an integral structure of the heat exchange component. Furthermore, the adhesive layers 23 on both sides also ensure the sealing of the flow channel 21, preventing poor heat exchange performance due to working fluid leakage.

[0049] Optionally, the adhesive is applied by dispensing or screen printing to form the adhesive layer 23.

[0050] In this embodiment, the amount and distribution of the adhesive in the dispensing and screen printing processes can be precisely controlled, ensuring that the adhesive layer 23 has a uniform thickness on both sides of the liquid cooling layer 22 and only covers the areas to be bonded. This helps reduce unnecessary material waste and improves the bonding strength and sealing performance. Furthermore, the shape and spacing of the adhesive application can be adjusted as needed to accommodate liquid cooling layers 22 and cover plates of different shapes and sizes. This helps optimize the structure of the adhesive layer 23, increases the contact area and adhesion of the bonding interface, and thus enhances the overall bonding performance and sealing effect of the heat exchanger.

[0051] Optionally, the adhesive includes polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite film, hot melt adhesive, or thermosetting adhesive.

[0052] In this embodiment, by designing the adhesive to be any one of polyolefin elastomer adhesive, polyurethane adhesive, butyl adhesive, pressure-sensitive adhesive, pressure-sensitive hot melt composite adhesive film, hot melt adhesive, and thermosetting adhesive, the bonding and sealing of the first cover plate 1 to the liquid cooling layer 22 and the second cover plate 3 to the liquid cooling layer 22 can be achieved, thereby simplifying the molding process of the heat exchange component and reducing the processing difficulty of the heat exchange component.

[0053] The preferred adhesive is a pressure-sensitive hot melt composite adhesive film. The pressure-sensitive hot melt composite adhesive film is used to bond the first cover plate 1 to the liquid cooling layer 22 and the second cover plate 3 to the liquid cooling layer 22. This can improve the reliability of the bonding and sealing, as well as its density, thereby improving the structural stability of the heat exchanger.

[0054] Optionally, the first cover plate 1 includes at least one of a polymer material layer and a metal layer, and / or the second cover plate 3 includes at least one of a polymer material layer and a metal layer.

[0055] In this embodiment, depending on actual design requirements, the first cover plate 1 can include a polymer material layer and / or a metal layer. For example, the first cover plate 1 can include a metal layer, which can improve the overall strength and thermal conductivity of the heat exchanger, thereby ensuring the stability of the electronic device with the heat exchanger in complex working environments and reducing the operating temperature of the electronic device; the first cover plate 1 can also include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger, thereby facilitating the carrying and use of the electronic device with the heat exchanger; the first cover plate 1 can also include both a polymer material layer and a metal layer, which can combine the characteristics of both to improve the overall performance of the heat exchanger.

[0056] Similarly, depending on actual design requirements, the second cover plate 3 can include a polymer material layer and / or a metal layer. For example, the second cover plate 3 can include a metal layer, which can improve the overall strength and thermal conductivity of the heat exchanger, thereby ensuring the stability of electronic devices with the heat exchanger in complex working environments and reducing the operating temperature of the electronic devices; the second cover plate 3 can also include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger, thereby facilitating the carrying and use of electronic devices with the heat exchanger; the second cover plate 3 can also include both a polymer material layer and a metal layer, which can combine the characteristics of both to improve the overall performance of the heat exchanger.

[0057] Optionally, the liquid cooling layer 22 includes at least one of a polymer material layer and a metal layer.

[0058] In this embodiment, depending on actual design requirements, the liquid cooling layer 22 can include a polymer material layer and / or a metal layer. For example, the liquid cooling layer 22 can include a metal layer, which can improve the strength and thermal conductivity of the liquid cooling layer 22, thereby improving the heat exchange efficiency of the heat exchanger, reducing the operating temperature of the electronic device with the heat exchanger, and also facilitating a reduction in the thickness of the liquid cooling layer 22; the liquid cooling layer 22 can also include a polymer material layer, which can meet the lightweight design requirements of the heat exchanger, thereby facilitating the portability and use of the electronic device with the heat exchanger; the liquid cooling layer 22 can also include both a polymer material layer and a metal layer, which can combine the characteristics of both to improve the overall performance of the heat exchanger.

[0059] For example, the liquid cooling layer 22 can be made of metal materials with high thermal conductivity and corrosion resistance, such as copper, aluminum or stainless steel alloys. The liquid cooling layer 22 can also be made of polymer materials such as PET (polyethylene terephthalate) and PBT (polybutylene terephthalate).

[0060] Optionally, the thickness of the adhesive layer 23 is in the range of 0.025mm-0.05mm.

[0061] In this embodiment, the thickness of the adhesive layer 23 can be precisely controlled between 0.025mm and 0.05mm during the dispensing or screen printing process. This allows the adhesive layer 23 to connect the liquid cooling layer 22 to the cover plates on both sides while also reducing the thickness of the adhesive layer 23. This reduces the overall thickness of the heat exchanger, thereby meeting the requirement for thinner and lighter electronic devices that use the heat exchanger.

[0062] When the heat exchanger needs to be relatively thin, the thickness of the adhesive layer 23 can be set to 0.025mm; when there is a high requirement for the connection strength of the heat exchanger, the thickness of the adhesive layer 23 can be set to 0.05mm.

[0063] Optionally, along the thickness direction of the heat exchanger, the first cover plate 1, the first adhesive layer, the liquid cooling layer 22, the second adhesive layer, and the second cover plate 3 are sequentially stacked. The first cover plate 1 is sealed to the first side of the liquid cooling layer 22 through the first adhesive layer, and the second cover plate 3 is sealed to the second side of the liquid cooling layer 22 through the second adhesive layer.

[0064] This allows for the formation of a five-layer stacked structure for the heat exchanger. The thickness of each layer can be adjusted according to actual design requirements to reduce the overall thickness of the heat exchanger, thereby meeting the need for thinner and lighter electronic devices using this heat exchanger.

[0065] The overall thickness of the heat exchanger is between 0.2mm and 0.4mm, the thickness of the first cover plate 1 is between 0.03mm and 0.05mm, the thickness of the second cover plate 3 is between 0.03mm and 0.05mm, the thickness of the first adhesive layer is between 0.025mm and 0.05mm, the thickness of the second adhesive layer is between 0.025mm and 0.05mm, and the thickness of the liquid cooling layer 22 is between 0.09mm and 0.2mm.

[0066] Optionally, the thickness ratio of the first cover plate 1 to the thickness of the first adhesive layer is in the range of 0.6-2, and / or the thickness ratio of the second cover plate 3 to the thickness of the second adhesive layer is in the range of 0.6-2.

[0067] In this embodiment, the thickness ratio of the first cover plate 1 to the first adhesive layer and the thickness ratio of the second cover plate 3 to the second adhesive layer can be adjusted according to the connection strength and size requirements of the heat exchanger. This can also avoid the problem of glue overflow caused by the adhesive layer 23 being too thick, thereby improving the reliability of the heat exchanger.

[0068] Optionally, along the thickness direction of the heat exchanger, the edge of the adhesive layer 23 is flush with the edge of the liquid cooling layer 22. For example... Figure 1 As shown, aligning the edges of the adhesive layer 23 and the liquid cooling layer 22 reduces the resistance to the flow of the working fluid in the flow channel, thereby ensuring the heat exchange effect of the heat exchanger.

[0069] Optionally, the adhesive layer 23 has a guide portion on the side near the flow channel 21, the guide portion being used to guide the flow of the working fluid within the flow channel.

[0070] In this embodiment, a guide portion, such as one or more rounded corners, can also be provided on the side of the adhesive layer 23 near the flow channel groove 21. This smooth transition can reduce the flow resistance of the working fluid in the flow channel, help reduce energy loss, reduce the pressure drop in the flow channel, and further improve the fluidity of the working fluid, thereby ensuring the heat exchange effect of the heat exchanger.

[0071] Optionally, the first cover plate 1 is a single-layer structure or a multi-layer structure;

[0072] And / or, the second cover plate 3 is a single-layer structure or a multi-layer structure.

[0073] In this embodiment, the first cover plate 1 may include a single layer or multiple layers of sealing layers. The first cover plate 1 forms an adhesive seal with the first side of the liquid cooling layer 22 through the adhesive layer 23. The first cover plate 1 also includes a sealing layer and a barrier layer. The barrier layer is disposed close to the flow channel groove 21. The first cover plate 1 forms an adhesive seal with the first side of the liquid cooling layer 22 through the adhesive layer 23. At the same time, the barrier layer can also block foreign objects such as water and dust.

[0074] Similarly, the second cover plate 3 can be provided with a single or multiple sealing layers. The second cover plate 3 forms an adhesive seal with the second side of the liquid cooling layer 22 through the adhesive layer 23. The second cover plate 3 also includes a sealing layer and a barrier layer. The barrier layer is located close to the flow channel groove 21. The second cover plate 3 forms an adhesive seal with the second side of the liquid cooling layer 22 through the adhesive layer 23. At the same time, the barrier layer can also block foreign objects such as water and dust.

[0075] This invention also provides a heat exchange module, including a micropump and the aforementioned heat exchange components. Corresponding connectors or interfaces can be provided at the inlet and outlet of the flow channel to facilitate connection with the micropump and form a complete heat exchange cycle.

[0076] Optionally, the heat exchanger has a first working fluid inlet and a first working fluid outlet, and the micropump has a second working fluid inlet and a second working fluid outlet. The first working fluid inlet and the first working fluid outlet are respectively connected to the flow channel, and the first working fluid inlet is connected to the second working fluid outlet, and the first working fluid outlet is connected to the second working fluid inlet. Thus, the working fluid can enter the flow channel through the second working fluid outlet and the first working fluid inlet, and return to the micropump from the flow channel through the first working fluid outlet and the second working fluid inlet, thereby achieving working fluid circulation.

[0077] This invention also provides an electronic device, including the aforementioned heat exchanger or heat exchange module. This electronic device can be a small electronic device, such as a tablet computer, laptop computer, smart glasses, smartwatch, or smart headband.

[0078] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0079] While specific embodiments of the invention have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of the invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims

1. A heat exchanging member, characterized by, The application relates to a heat exchange element comprising: a first cover plate (1), a second cover plate (3) and an intermediate layer (2) which are stacked together, a flow channel groove (21) is formed in the intermediate layer (2), the flow channel groove (21) penetrates through the thickness direction of the intermediate layer (2), the intermediate layer (2) comprises a liquid cooling layer (22) and adhesive layers (23) arranged on both sides of the liquid cooling layer (22), the liquid cooling layer (22) and the adhesive layers (23) on both sides jointly form the side wall of the flow channel groove (21), the first cover plate (1) and the second cover plate (3) are sealedly connected with the liquid cooling layer (22) through the adhesive layers (23), so that the first cover plate (1), the second cover plate (3) and the intermediate layer (2) enclose a flow channel at the flow channel groove (21). The adhesive layer (23) comprises at least one adhesive, the first side of the liquid cooling layer (22) is adhesively connected with the first cover plate (1) through the adhesive layer (23), and the second side of the liquid cooling layer (22) is adhesively connected with the second cover plate (3) through the adhesive layer (23).

2. The heat exchanging member according to claim 1, characterized by The adhesive forms the adhesive layer (23) through dispensing or screen printing.

3. The heat exchange member according to claim 2, characterized by The adhesive comprises polyolefin elastomer glue, polyurethane glue, butyl glue, pressure-sensitive glue, pressure-sensitive hot melt composite glue film, hot melt glue or thermosetting glue.

4. The heat exchange member according to claim 2, wherein The first cover plate (1) comprises at least one of a polymer material layer and a metal layer, and / or the second cover plate (3) comprises at least one of a polymer material layer and a metal layer.

5. The heat exchange member according to claim 1, wherein The liquid cooling layer (22) comprises at least one of a polymer material layer and a metal layer.

6. The heat exchange member according to claim 1, wherein The thickness of the adhesive layer (23) ranges from 0.025 mm to 0.05 mm.

7. The heat exchange member of claim 1, wherein The first cover plate (1), a first adhesive layer, the liquid cooling layer (22), a second adhesive layer and the second cover plate (3) are sequentially stacked in the thickness direction of the heat exchange element, the first cover plate (1) is sealedly connected with the first side of the liquid cooling layer (22) through the first adhesive layer, and the second cover plate (3) is sealedly connected with the second side of the liquid cooling layer (22) through the second adhesive layer.

8. The heat exchange member of claim 1, wherein The thickness ratio of the first cover plate (1) to the first adhesive layer ranges from 0.6 to 2, and / or the thickness ratio of the second cover plate (3) to the second adhesive layer ranges from 0.6 to 2.

9. A heat exchange member according to claim 8, wherein The edge of the adhesive layer (23) is flush with the edge of the liquid cooling layer (22) in the thickness direction of the heat exchange element.

10. The heat exchange member of claim 1, wherein The side of the adhesive layer (23) close to the flow channel groove (21) has a guide part for guiding the flow of the working medium in the flow channel.

11. The heat exchange member of claim 1, wherein The first cover plate (1) is a single-layer structure or a multi-layer structure.

12. The heat exchange member of claim 1, wherein The second cover plate (3) is a single-layer structure or a multi-layer structure. The application further relates to a micro-pump and the heat exchange element.

13. A heat exchange module, characterized by ​ 14. The heat exchange module of claim 13, wherein, The heat exchange element has a first working medium inlet and a first working medium outlet, and the micro-pump has a second working medium inlet and a second working medium outlet, the first working medium inlet and the first working medium outlet are communicated with the flow channel respectively, and the first working medium inlet is communicated with the second working medium outlet, and the first working medium outlet is communicated with the second working medium inlet.

15. An electronic device, comprising: The heat exchange element or the heat exchange module.

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