Electroplating device and electroplating system

Abstract

The invention provides an electroplating device and an electroplating system.The electroplating device comprises an electroplating bath, a cathode-to-you mechanism and an anode conductive mechanism, the electroplating bath is used for containing workpieces and comprises a first side wall, a second side wall and a bottom wall, and the two opposite ends of the bottom wall are connected to the first side wall and the second side wall correspondingly; the cathode conductive mechanism comprises two opposite limiting pieces which are arranged in the electroplating bath and are arranged at intervals in the first direction, the anode conductive mechanism comprises a first anode assembly and a second anode assembly, the first anode assembly comprises a first metal bar and a first anode bar, and the first anode bar at least partially extends to the second side wall along the inner side wall of the electroplating bath; the second anode assembly comprises a second metal bar and a second anode bar, and the second anode bar at least partially extends to the first side wall along the inner side wall of the electroplating bath; and in the first direction, a second anode bar is arranged between any two adjacent first anode bars.

Description

Technical Field

[0001] This invention relates to the field of electroplating equipment technology, and more specifically to an electroplating apparatus and an electroplating system. Background Technology

[0002] In related technologies, when a workpiece is subjected to barrel plating, such as chromium plating, the workpiece is usually placed in a chromium plating bath containing a chromium plating solution. The chromium in the solution is electroplated onto the workpiece surface through an oxidation-reduction reaction after the positive and negative electrodes are energized, forming an electroplated film on the workpiece surface. However, during the electroplating operation in the chromium plating bath, the current magnitude varies at different points in the bath, that is, the conductivity is uneven at different points in the chromium plating bath. This can easily lead to different thicknesses of the electroplated film on different parts of the workpiece surface during the chromium plating process, resulting in poor film thickness consistency and consequently, poor consistency of the finished workpiece. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention provides an electroplating apparatus and an electroplating system to improve the uniformity of conductivity within the electroplating tank during the electroplating process and to improve the consistency of film thickness after electroplating of workpieces, thereby at least partially solving the aforementioned technical problems.

[0004] In a first aspect, the present invention provides an electroplating apparatus, comprising: an electroplating tank for accommodating a workpiece and including a first sidewall, a second sidewall, and a bottom wall extending along a first direction, wherein opposite ends of the bottom wall are respectively connected to the first sidewall and the second sidewall; a cathode conductive mechanism including two opposing limiting members disposed within the electroplating tank and spaced apart along the first direction, the two limiting members being used to clamp and drive the workpiece to rotate about the first direction; and an anode conductive mechanism including a first anode assembly and a second anode assembly, the first anode assembly including a first metal bar connected to the first sidewall and a plurality of first anode rods connected to the first metal bar and spaced apart along the first direction, the first anode rods extending at least partially along the inner sidewall of the electroplating tank to the second sidewall; the second anode assembly including a second metal bar connected to the second sidewall and a plurality of second anode rods connected to the second metal bar and spaced apart along the first direction, the second anode rods extending at least partially along the inner sidewall of the electroplating tank to the first sidewall; and a second anode rod being disposed between any two adjacent first anode rods in the first direction.

[0005] Optionally, in the first direction, the extension directions of the plurality of first anode rods are parallel to each other; and / or, in the first direction, the extension directions of the plurality of second anode rods are parallel to each other.

[0006] Optionally, in the first direction, the extension directions of the plurality of first anode rods are parallel to the extension directions of the plurality of second anode rods.

[0007] Optionally, the cathode conductive mechanism further includes: a first rotary conductive component, comprising a first drive motor, a first output shaft, and a first brush assembly, wherein the output end of the first drive motor is connected to the first output shaft, the other end of the first output shaft is connected to one of the limiting members, and the first output shaft is electrically connected to the first brush assembly; and a second rotary conductive component, comprising a second drive motor, a second output shaft, and a second brush assembly, wherein the output end of the second drive motor is connected to the second output shaft, the other end of the second output shaft is connected to another limiting member, and the second output shaft is electrically connected to the second brush assembly.

[0008] Optionally, the second rotating conductive component is disposed in the electroplating tank, and the second rotating conductive component is movable relative to the electroplating tank along the first direction to move closer to or further away from the first rotating conductive component.

[0009] Optionally, the bottom wall is constructed as an arc-shaped wall, and the first side wall, the arc-shaped wall, and the second side wall together form a U-shaped groove.

[0010] Optionally, a first opening is formed between the first sidewall and the second sidewall. The electroplating apparatus further includes a sealing plate connected to the first sidewall or the second sidewall. The sealing plate can shield or avoid the first opening to seal or open the electroplating tank.

[0011] Optionally, the electroplating apparatus further includes a first draining mechanism, which includes: a second opening disposed on the first sidewall and extending through the thickness direction of the first sidewall; and a first drain pipe located outside the electroplating tank, one end of which is connected to the second opening.

[0012] Optionally, the electroplating apparatus further includes a second draining mechanism, which includes: a third opening disposed on the bottom wall and extending through the thickness of the bottom wall; and a valve body connected to the third opening.

[0013] Secondly, the present invention provides an electroplating system, the electroplating system comprising a central control device, a heating device, a cooling device, a filtering device, and an electroplating device as described in any of the above optional embodiments, wherein the central control device is connected to the heating device, the cooling device, the filtering device, and the electroplating device respectively.

[0014] Through the above technical solution, namely the electroplating apparatus provided by the present invention, when electroplating a workpiece, the workpiece can be placed in the electroplating tank and located between the first side wall, the second side wall, and the bottom wall. The electroplating tank serves to accommodate the workpiece and can contain a solution containing the metal to be plated (e.g., chromium plating additive). Two limiting members arranged at intervals along the first direction can limit the workpiece after it is placed in the electroplating tank, reducing or preventing the workpiece from shaking within the tank. After the two limiting members clamp the workpiece, the workpiece can be negatively charged by the cathode conductive mechanism. At this time, the anode conductive mechanism can perform the electroplating operation by positively charging the first anode assembly and the second anode assembly respectively. The anode conductive mechanism, the cathode conductive mechanism, and the solution containing the metal to be plated in the electroplating tank together form a galvanic cell to carry out the oxidation-reduction reaction during the electroplating process. To improve the uniformity and consistency of the coating thickness on the workpiece surface, the first metal bar can make multiple first anode rods positively charged, and the multiple first anode rods along the first direction... Extending along the inner wall of the electroplating tank, that is, extending from the first side wall and the bottom wall and at least partially extending to the second side wall; the second metal bar can make multiple second anode rods positively charged, and the multiple second anode rods also extend along the inner wall of the electroplating tank, that is, extending from the second side wall and the bottom wall and at least partially extending to the first side wall, and in the first direction, a second anode rod is provided between any two adjacent first anode rods, that is, the first anode rods and the second anode rods are staggered. In this arrangement, when the cathode conductive mechanism clamps and drives the workpiece to rotate around the first direction, the solution containing the metal to be plated will continuously form the metal to be plated on the surface of the workpiece to form a metal coating under the action of the galvanic cell. That is, the staggered arrangement of the first anode rods and the second anode rods can electroplat the workpiece more uniformly along the circumference of the workpiece. In the above electroplating method, the current magnitude in various parts of the electroplating tank can tend to be uniform, and the conductivity in various parts of the electroplating tank can also be more uniform. In this way, the thickness of the electroplated film on the surface of the workpiece can also tend to be uniform after electroplating, and the consistency of the finished workpiece can be improved.

[0015] The beneficial effects of other alternative solutions of the present invention will be elaborated in the following detailed embodiments. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1This is a schematic diagram of the overall structure of the electroplating apparatus provided in an exemplary embodiment of the present invention; Figure 2 for Figure 1 A magnified view of a portion of position A in the middle; Figure 3 for Figure 1 A magnified view of a portion of position B in the middle; Figure 4 This is a second-view structural schematic diagram of the electroplating apparatus provided in an exemplary embodiment of the present invention; Figure 5 for Figure 4 A magnified view of the area at position C in the middle; Figure 6 This is a top view of the electroplating apparatus provided in an exemplary embodiment of the present invention; Figure 7 for Figure 6 A magnified view of the area at position D in the middle; Figure 8 for Figure 6 A magnified view of the area at position E in the middle; Figure 9 This is a bottom view of the electroplating apparatus provided in an exemplary embodiment of the present invention; Figure 10 for Figure 9 A magnified view of the middle F position; Figure 11 This is a third-view structural schematic diagram of the electroplating apparatus provided in an exemplary embodiment of the present invention; Figure 12 for Figure 11 A magnified view of the area at position G in the middle; Figure 13 This is a schematic diagram of the electroplating system provided in an exemplary embodiment of the present invention.

[0018] Explanation of reference numerals in the attached figures: 1. Electroplating tank; 101. First opening; 110. First side wall; 120. Second side wall; 130. Bottom wall; 2. Cathode conductive mechanism; 201. Limiting member; 210. First rotating conductive assembly; 211. First drive motor; 212. First output shaft; 213. First brush assembly; 220. Second rotating conductive assembly; 222. Second output shaft; 223. Second brush assembly; 3. Anode conductive mechanism; 310. First anode assembly; 311. First metal busbar; 312. First anode rod; 320. Second anode assembly; 321. Second metal busbar; 322. Second anode rod; 4. Sealing plate; 5. First sewage discharge mechanism; 501. Second opening; 502. First sewage discharge pipe; 6. Second sewage discharge mechanism; 601. Third opening; 7. Central control unit; 8. Heating device; 9. Cooling device; 10. Filtering device. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] In related technologies, when a workpiece is subjected to barrel plating, such as chromium plating, the workpiece is usually placed in a chromium plating bath containing a chromium plating solution. The chromium in the solution is electroplated onto the workpiece surface through an oxidation-reduction reaction after the positive and negative electrodes are energized. Because the current varies in different parts of the bath, i.e., the conductivity is uneven, the thickness of the electroplated film on the workpiece surface is also different, resulting in poor film thickness consistency and consequently poor consistency of the finished workpiece.

[0021] In this invention, a coordinate system is established for the electroplating apparatus, with reference to... Figures 1 to 13 As shown, the direction pointed to by arrow X can represent the first direction.

[0022] In view of the above-mentioned technical problems, a first aspect of the present invention provides an electroplating apparatus, with reference to... Figures 1 to 13As shown, the electroplating apparatus includes an electroplating tank 1, a cathode conductive mechanism 2, and an anode conductive mechanism 3. The electroplating tank 1 is used to accommodate a workpiece and includes a first sidewall 110, a second sidewall 120, and a bottom wall 130 extending along a first direction. The opposite ends of the bottom wall 130 are respectively connected to the first sidewall 110 and the second sidewall 120. The cathode conductive mechanism 2 includes two opposing limiting members 201 disposed within the electroplating tank 1 and spaced apart along the first direction. The two limiting members 201 are used to clamp and drive the workpiece to rotate around the first direction. The anode conductive mechanism 3 includes a first anode assembly 310 and a second anode assembly 320. The first anode assembly 310 includes a first anode assembly 310 connected to the first anode assembly 320. The first metal bar 311 of the sidewall 110 and a plurality of first anode rods 312 connected to the first metal bar 311 and spaced apart along a first direction, the first anode rods 312 extending at least partially along the inner sidewall of the electroplating tank 1 to the second sidewall 120; the second anode assembly 320 includes a second metal bar 321 connected to the second sidewall 120 and a plurality of second anode rods 322 connected to the second metal bar 321 and spaced apart along a first direction, the second anode rods 322 extending at least partially along the inner sidewall of the electroplating tank 1 to the first sidewall 110; in the first direction, a second anode rod 322 is provided between any two adjacent first anode rods 312.

[0023] In the manner described above, i.e., the electroplating apparatus provided by the present invention, when performing electroplating operations on a workpiece, the workpiece can be placed in the electroplating tank 1, located between the first side wall 110, the second side wall 120, and the bottom wall 130. That is, the electroplating tank 1 serves to accommodate the workpiece, and can contain a solution containing the metal to be plated (e.g., a chromium plating additive). Two limiting members 201, spaced apart along the first direction, can limit the workpiece after it is placed in the electroplating tank 1, reducing or preventing the workpiece from shaking within the tank. After being clamped to the workpiece, the workpiece can be negatively charged by the cathode conductive mechanism 2. At this time, the anode conductive mechanism 3 can perform electroplating by positively charging the first anode assembly 310 and the second anode assembly 320 respectively. That is, the anode conductive mechanism 3, the cathode conductive mechanism 2, and the solution containing the metal to be plated in the electroplating tank 1 together form a galvanic cell to carry out the oxidation-reduction reaction during the electroplating process. In order to improve the uniformity and consistency of the coating thickness on the workpiece surface, the first metal busbar 311 can make multiple first anode rods 312 positively charged, and the multiple first anode rods 312 are along the electroplating tank 1. The inner wall extends, that is, it extends from the first side wall 110 and the bottom wall 130 and at least partially extends to the second side wall 120; the second metal busbar 321 can make the plurality of second anode rods 322 positively charged, and the plurality of second anode rods 322 also extend along the inner wall of the electroplating tank 1, that is, it extends from the second side wall 120 and the bottom wall 130 and at least partially extends to the first side wall 110, and in the first direction, a second anode rod 322 is provided between any two adjacent first anode rods 312, that is, the first anode rods 312 and the second anode rods 322 are staggered. In this arrangement, in the cathode conductive mechanism 2. When the workpiece is clamped and driven to rotate around the first direction, the solution containing the metal to be plated will continuously form the metal to be plated on the surface of the workpiece under the action of the galvanic cell to form a metal coating. That is, the staggered arrangement of the first anode rod 312 and the second anode rod 312 can electroplate the workpiece more evenly along the circumference of the workpiece. Under the above electroplating method, the current magnitude in all parts of the electroplating tank 1 can be made more uniform, and the conductivity in all parts of the electroplating tank 1 can be made more uniform. As a result, the thickness of the electroplated film on the surface of the workpiece can also be made more uniform after electroplating, and the consistency of the finished workpiece can be improved.

[0024] It should be noted that in related technologies, the varying thickness of the electroplated film on different parts of the workpiece surface is usually due to the fact that the current flowing through the first anode rod 312 is greater near the first metal busbar 311 and smaller further away. This is because the first anode rod 312 itself is made of a conductive material. During conduction, the collisions between free electrons and atoms within the material form a lattice structure, resulting in resistance and inevitably causing current variations. Therefore, this can be referenced... Figures 1 to 8As shown, the present invention arranges the first anode rod 312 and the second anode rod 322 alternately, that is, the first metal busbar 311 is connected to the first sidewall 110, and multiple first anode rods 312 extend sequentially from the first sidewall 110 to the bottom wall 130 and the second sidewall 120. At this time, the end of the first anode rod 312 with a large current is connected to one end of the first metal busbar 311, and the end with a small current is away from the first metal busbar 311. In order to compensate for the problem of insufficient current at the end of the first anode rod 312 away from the first metal busbar 311, multiple second anode rods 322 are arranged in the opposite direction. That is, the second metal busbar 321 is connected to the second sidewall 120 opposite to the first sidewall 110, and multiple second anode rods 322 extend sequentially from the second sidewall 120 to the bottom wall 130 and the first sidewall 110. At this time, the end of the second anode rod 322 with a large current is connected to one end of the second metal busbar 321, and the end with a small current is away from the second metal busbar 321.

[0025] Reference Figures 1 to 8 As shown, the above method can be understood as follows: the first anode rod 312 and the second anode rod 322 both extend along the inner wall of the electroplating tank 1 and are arranged alternately. The end of the first anode rod 312 with a smaller current can be compensated by the end of the second anode rod 322 with a larger current. Conversely, the end of the second anode rod 322 with a smaller current can be compensated by the end of the first anode rod 312 with a larger current. This can improve the current magnitude of the anode conductive mechanism 3 in the electroplating tank 1 and the uniformity of the current during the electroplating process, so as to make the metal coating on the workpiece surface uniform after electroplating.

[0026] Furthermore, in the above embodiments, the specific structure of the limiting member 201 can be any suitable one. For example, the limiting member 201 can be a push rod structure that can hold the two ends of the workpiece, or a gripper structure that can hold the two ends of the workpiece. Moreover, the structure that can drive the workpiece to rotate after limiting the workpiece can be a drive motor or a hydraulic cylinder. The drive motor or hydraulic cylinder can drive the push rod or gripper to rotate. Specifically, the specific structure of the cathode conductive mechanism 2 will be described in detail below, and will not be elaborated on here.

[0027] It should be noted that the aforementioned cathode conductive mechanism 2 needs to meet the basic requirement of being able to conduct electricity. That is, during the electroplating process, the cathode conductive mechanism 2 must be able to make the workpiece itself negatively charged after clamping the workpiece so that normal electroplating operation can be performed. For example, the cathode conductive mechanism 2 may include structures such as contact charging fixtures.

[0028] The first metal busbar 311 and / or the second metal busbar 321 mentioned in the above embodiments can be any structure that has a conductive function and can make the first anode rod 312 and / or the second anode rod 322 positively charged. For example, the first metal busbar 311 and / or the second metal busbar 321 can be made of copper busbar.

[0029] Furthermore, the arrangement of second anode rods 322 between any two adjacent first anode rods 312 can be described in any appropriate way. For example, one, two, three or other numbers of second anode rods 322 can be provided between two first anode rods 312. However, in order to further improve the uniformity of the current in the electroplating tank 1, the number of second anode rods 322 between any two adjacent first anode rods 312 is preferably one. This can improve the uniformity of the current during the electroplating process in the electroplating tank 1 as a whole, and make the film thickness of the workpiece more uniform on all surfaces after electroplating.

[0030] Furthermore, in order to improve the conductivity of the first anode rod 312 and the second anode rod 322, those skilled in the art can select appropriate conductive materials for the first anode rod 312 and the second anode rod 322 according to the actual situation. For example, both the first anode rod 312 and the second anode rod 322 can be rolled lead-tin alloy rods with a tin content of 8%, which not only have excellent conductivity but also good acid corrosion resistance, which can greatly improve service life and reduce the workload of subsequent maintenance.

[0031] To further improve the uniformity of current within electroplating tank 1, reference Figures 1 to 13 As shown, in the first direction, the extension directions of the plurality of first anode rods 312 are parallel to each other; and / or, in the first direction, the extension directions of the plurality of second anode rods 322 are parallel to each other.

[0032] In the above manner, when the multiple first anode rods 312 are parallel to each other, the neatness of the arrangement of the multiple first anode rods 312 in the electroplating tank 1 can be further improved. Similarly, the second anode rods 322, under the above arrangement, the multiple parallel first anode rods 312 and / or multiple parallel second anode rods 322 can further increase the difference in current magnitude at various points in the electroplating tank 1, thereby improving the uniformity of the electroplated film at various points on the surface of the workpiece after electroplating in the electroplating tank 1.

[0033] Further, refer to Figures 1 to 13 As shown, in the first direction, the extension directions of the plurality of first anode rods 312 are parallel to the extension directions of the plurality of second anode rods 322.

[0034] In the above manner, where the extension directions of the multiple first anode rods 312 and the multiple second anode rods 322 are parallel to each other, the neatness of the arrangement of the multiple anode rods in the electroplating tank 1 can be further improved. This is the optimal solution in this embodiment. Under the above arrangement, the position of the first anode rod 312 with a small current can be reinforced by the position of the second anode rod 322 with a large current, and the position of the second anode rod 322 with a small current can be reinforced by the position of the first anode rod 312 with a large current. This allows the current at all points in the electroplating tank 1 to be increased, and improves the uniformity of the current during the electroplating process on the workpiece in the electroplating tank 1.

[0035] It should be noted that, in the first direction, a certain distance can be maintained between any adjacent first anode rods 312 and second anode rods 322, and a certain distance can also be maintained between the first anode rods 312 and second anode rods 322 and the workpiece during the electroplating process. For example, the distance between adjacent first anode rods 312 and second anode rods 322 can be 120mm. Even when the first anode rods 312 and second anode rods 322 are installed, the distance between the first anode rods 312 and second anode rods 322 in the first direction will not be too far to affect the uniformity of the electroplated film. The distance between each anode rod and the workpiece can be greater than 80mm. This will prevent the distance between the first anode rods 312 and second anode rods 322 and the workpiece from being too close, which would affect the uneven film thickness after electroplating, and also prevent the distance between the first anode rods 312 and second anode rods 322 and the workpiece from being too far, which would result in the inability to electroplat normally.

[0036] In some implementations, reference Figures 1 to 13 As shown, the cathode conductive mechanism 2 further includes a first rotating conductive component 210 and a second rotating conductive component 220. The first rotating conductive component 210 includes a first drive motor 211, a first output shaft 212, and a first brush assembly 213. The output end of the first drive motor 211 is connected to the first output shaft 212, and the other end of the first output shaft 212 is connected to one of the limiting members 201. The first output shaft 212 is electrically connected to the first brush assembly 213. The second rotating conductive component 220 includes a second drive motor (not shown in the figure), a second output shaft 222, and a second brush assembly 223. The output end of the second drive motor is connected to the second output shaft 222, and the other end of the second output shaft 222 is connected to another limiting member 201. The second output shaft 222 is electrically connected to the second brush assembly 223.

[0037] In this manner, after the two limiting members 201 respectively limit and fix the opposite ends of the workpiece, the first drive motor 211 can drive the first output shaft 212 to rotate, and the second drive motor can drive the second output shaft 222 to rotate. Furthermore, the angular velocities of the first output shaft 212 and the second output shaft 222 can be kept consistent, thereby allowing the workpiece to rotate stably and preventing a speed difference between the first output shaft 212 and the second output shaft 222 from causing workpiece damage. During the rotation of the first output shaft 212 and the second output shaft 222... In this process, the first brush assembly 213 can continuously brush the outer side of the first output shaft 212, and the second brush assembly 223 can continuously brush the outer side of the second output shaft 222. During this process, the first output shaft 212 and the second output shaft 222 can become negatively charged through the brushing process of the first brush assembly 213 and the second brush assembly 223, respectively. The first output shaft 212 and the second output shaft 222 are also connected to two limiting members 201, respectively. When the workpiece is clamped, the workpiece itself will also become negatively charged, so that the electroplating operation can be performed normally.

[0038] It should be noted that the reference Figure 2 and Figure 3 As shown, the first brush assembly 213 and the second brush assembly 223 can each include at least two brushes, thereby avoiding the situation of open circuit due to poor contact of a single brush and improving the stability of the conductive process of the workpiece.

[0039] And reference Figure 2 , Figure 3 and Figure 5 As shown, the limiting member 201 mentioned in the above embodiment can be a boss structure that can press the opposite ends of the workpiece together. That is, when the workpiece is placed between two boss structures, the opposite ends of the workpiece can be pressed together by the top surfaces of the two boss structures, thereby limiting the workpiece.

[0040] It should be noted that the electroplating tank 1 and the specific electroplating process mentioned in the above embodiments can both perform barrel plating on the workpiece. That is, for workpieces with an arc-shaped outer wall, the electroplating device can perform barrel plating on the workpiece.

[0041] Furthermore, in order to enable electroplating operations on workpieces of different sizes, refer to Figures 1 to 13 As shown, the second rotating conductive component 220 can be integrally disposed in the electroplating tank 1. The second rotating conductive component 220 can move relative to the electroplating tank 1 along the first direction to approach or move away from the first rotating conductive component 210.

[0042] In this way, the second rotary conductive component 220 can adjust its position within the electroplating tank 1 to clamp and limit workpieces of different sizes. Specifically, when the second rotary conductive component 220 moves closer to the first rotary conductive component 210, the two limiting members 201 can clamp smaller workpieces; conversely, when the second rotary conductive component 220 moves away from the first rotary conductive component 210, the two limiting members 201 can clamp larger workpieces. See reference [link to relevant documentation]. Figure 3 and Figure 8 As shown, the second rotating conductive component 220 can be fixed by a structure such as a mounting bracket. When adjusting the position, the mounting bracket can be fixed at a specific position in the electroplating tank 1 to achieve position switching of the second rotating conductive component 220.

[0043] In some implementations, reference Figures 1 to 13 As shown, the bottom wall 130 is constructed as an arc-shaped groove, and the first side wall 110, the arc-shaped wall and the second side wall 120 together form a U-shaped groove.

[0044] In this way, the U-shaped groove can greatly increase the capacity of the electroplating tank 1, that is, it can hold more solution containing the metal to be plated, and it can also give the workpiece more space for electroplating operation. The U-shaped groove can also better adapt to the workpieces used for barrel plating, that is, the workpieces with an arc or cylindrical outer surface.

[0045] To prevent splashing of the plating solution during electroplating, refer to Figures 1 to 13 As shown, a first opening 101 is formed between the first sidewall 110 and the second sidewall 120. The electroplating apparatus also includes a sealing plate 4 connected to the first sidewall 110 or the second sidewall 120. The sealing plate 4 can cover or avoid the first opening 101 to seal or open the electroplating tank 1.

[0046] In the above manner, the sealing plate 4 can shield or avoid the first opening 101 of the electroplating tank 1. During the electroplating process of the workpiece, the sealing plate 4 can shield the first opening 101, thereby reducing or preventing the splashing of the solution in the electroplating tank 1. However, after or before electroplating, the sealing plate 4 can leave the first opening 101 unshielded, thereby facilitating the placement of the workpiece into or removal from the electroplating tank 1.

[0047] Specifically, the number of sealing plates 4 can be one or more. When there are multiple sealing plates 4, they can be arranged along the first direction and connected one by one to the first side wall 110 or the second side wall 120. Each sealing plate 4 can be independently controlled to open and close. Depending on the specific length of the workpiece, one or more of them can be selected to cover the first opening 101. For example, if the length of the workpiece is equivalent to the length of two sealing plates 4 in the first direction, then when the workpiece is placed in the electroplating tank 1, the corresponding two sealing plates 4 that are continuous and adjacent along the first direction can be closed to cover the first opening 101. When the length of the workpiece is equivalent to the length of three sealing plates 4, the corresponding three sealing plates 4 that are continuous and adjacent along the first direction can be closed to cover the first opening 101.

[0048] In some implementations, reference Figures 1 to 13 As shown, the electroplating apparatus also includes a first drain mechanism 5, which includes a second opening 501 and a first drain pipe 502. The second opening 501 is located on the first side wall 110 and extends through the thickness of the first side wall 110. The first drain pipe 502 is located outside the electroplating tank 1, and one end of the first drain pipe 502 is connected to the second opening 501.

[0049] Through the above method, the waste gas generated during the electroplating process can be collected and discharged by the cooperation of the second opening 501 and the first sewage pipe 502. Taking the chromium plating process as an example, chromium mist is easily generated in the electroplating tank 1 during the chromium plating process. The chromium mist can be discharged to the outside through the second opening 501 and the first sewage pipe 502, purified, and then discharged, which improves the environmental protection of the waste gas recovery of the electroplating device. That is, after the chromium mist is discharged to the outside through the second opening 501 and the first sewage pipe 502, the chromium mist can be purified by purification devices such as spray towers, and can be discharged into the atmosphere after meeting the emission standards.

[0050] Preferably, the second opening 501 can be located in the upper part of the first side wall 110, so as not to come into contact with the liquid in the electroplating tank 1, thereby preventing the liquid in the electroplating tank 1 from being discharged outwards.

[0051] In some implementations, reference Figures 1 to 13 As shown, the electroplating apparatus also includes a second drain mechanism 6, which includes a third opening 601 and a valve body (not shown in the figure). The third opening 601 is located on the bottom wall 130 and extends through the thickness direction of the bottom wall 130; the valve body is connected to the third opening 601.

[0052] In the above manner, the second sewage discharge mechanism 6 can realize the discharge of liquid in the electroplating tank 1 after the workpiece electroplating is completed. That is, after the workpiece electroplating is completed, the waste liquid in the electroplating tank 1 can be discharged outward from the third opening 601 by opening the valve body. The discharge of waste liquid through the third opening 601 can greatly improve the convenience of replacing the liquid in the electroplating tank 1, and can also greatly improve the efficiency of waste liquid discharge when the electroplating tank 1 needs to be cleaned and maintained regularly.

[0053] Specifically, in combination Figure 9 and Figure 10 As shown, multiple third openings 601 can be arranged at intervals on the bottom wall 130 of the electroplating tank 1, thereby allowing for faster discharge of waste liquid from the electroplating tank 1.

[0054] The valve body mentioned in the above embodiments can be any valve body capable of sealing or opening the third opening 601, such as a ball valve or a butterfly valve, or any suitable structure. This embodiment does not impose any restrictions on it.

[0055] A second aspect of the present invention provides an electroplating system, with reference to Figures 1 to 13 As shown, the electroplating system includes a central control device 7, a heating device 8, a cooling device 9, a filtering device 10, and the electroplating device mentioned in the above embodiments. The central control device 7 is connected to the heating device 8, the cooling device 9, the filtering device 10, and the electroplating device, and also has all the beneficial effects of the above embodiments.

[0056] Through the above methods, the electroplating system can realize the complete operation of the workpiece during the electroplating process. Specifically, the heating device 8 can precisely control the temperature of the electroplating solution in the electroplating tank 1. Specifically, the heating device 8 can be an air-source heating coil. The cooling device 9 can be an evaporator or similar structure. During the electroplating process, the electroplating solution in the electroplating tank 1 will continuously evaporate, and the water produced by the evaporator can flow back into the electroplating tank 1. This, in conjunction with the heating device 8, can stabilize the water level and concentration of the electroplating solution in the electroplating tank 1. The filtration device 10 can be a titanium filter element or similar structure, allowing the solution to pass through a titanium filter... The core can filter and purify the electroplating solution in the electroplating tank 1, thereby ensuring the purity of the electroplating solution in the electroplating tank 1 and preventing impurities from accumulating in the electroplating tank 1 and causing fluctuations in the electrochemical parameters (such as current efficiency and dispersion ability) of the electroplating solution. The central control device 7 in the above embodiment can be any suitable device that can monitor the heating device 8, cooling device 9, filtering device 10 and electroplating device. For example, the central control device 7 can be a computer that can realize remote control and monitoring, or an application that can be installed on a mobile device such as a mobile phone. This embodiment does not limit it in any way.

[0057] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope of protection claimed by the present invention.

Claims

1. An electroplating apparatus, characterized in that, include: An electroplating tank (1) is used to accommodate a workpiece and includes a first sidewall (110), a second sidewall (120) and a bottom wall (130) extending in a first direction, wherein the opposite ends of the bottom wall (130) are respectively connected to the first sidewall (110) and the second sidewall (120). The cathode conductive mechanism (2) includes two opposing limiting members (201) disposed in the electroplating tank (1) and spaced apart along the first direction. The two limiting members (201) are used to clamp and drive the workpiece to rotate around the first direction. The anode conductive mechanism (3) includes a first anode assembly (310) and a second anode assembly (320). The first anode assembly (310) includes a first metal busbar (311) connected to the first sidewall (110) and a plurality of first anode rods (312) connected to the first metal busbar (311) and spaced apart along the first direction. The first anode rods (312) extend at least partially along the inner sidewall of the electroplating tank (1) to the second sidewall (120). The second anode assembly (320) includes a second metal busbar (321) connected to the second sidewall (120) and a plurality of second anode rods (322) connected to the second metal busbar (321) and spaced apart along the first direction. The second anode rods (322) extend at least partially along the inner sidewall of the electroplating tank (1) to the first sidewall (110). In the first direction, a second anode rod (322) is provided between any two adjacent first anode rods (312).

2. The electroplating apparatus according to claim 1, characterized in that, In the first direction, the extension directions of the plurality of first anode rods (312) are parallel to each other; and / or, In the first direction, the extension directions of the plurality of second anode rods (322) are parallel to each other.

3. The electroplating apparatus according to claim 2, characterized in that, In the first direction, the extension directions of the plurality of first anode rods (312) are parallel to the extension directions of the plurality of second anode rods (322).

4. The electroplating apparatus according to claim 1, characterized in that, The cathode conductive mechanism (2) further includes: The first rotating conductive component (210) includes a first drive motor (211), a first output shaft (212), and a first brush assembly (213). The output end of the first drive motor (211) is connected to the first output shaft (212), the other end of the first output shaft (212) is connected to one of the limiting members (201), and the first output shaft (212) is electrically connected to the first brush assembly (213). The second rotating conductive component (220) includes a second drive motor, a second output shaft (222) and a second brush assembly (223). The output end of the second drive motor is connected to the second output shaft (222), the other end of the second output shaft (222) is connected to another limiting member (201), and the second output shaft (222) is electrically connected to the second brush assembly (223).

5. The electroplating apparatus according to claim 4, characterized in that, The second rotating conductive component (220) is disposed in the electroplating tank (1). The second rotating conductive component (220) is capable of moving relative to the electroplating tank (1) along the first direction to approach or move away from the first rotating conductive component (210).

6. The electroplating apparatus according to claim 1, characterized in that, The bottom wall (130) is constructed as an arc-shaped wall, and the first side wall (110), the arc-shaped wall and the second side wall (120) together form a U-shaped groove.

7. The electroplating apparatus according to claim 6, characterized in that, A first opening (101) is formed between the first sidewall (110) and the second sidewall (120). The electroplating apparatus also includes a sealing plate (4) connected to the first sidewall (110) or the second sidewall (120). The sealing plate (4) can cover or avoid the first opening (101) to seal or open the electroplating tank (1).

8. The electroplating apparatus according to any one of claims 1-7, characterized in that, The electroplating apparatus further includes a first sewage discharge mechanism (5), which comprises: The second opening (501) is provided on the first sidewall (110) and extends through the thickness direction of the first sidewall (110); The first sewage pipe (502) is located outside the electroplating tank (1), and one end of the first sewage pipe (502) is connected to the second opening (501).

9. The electroplating apparatus according to any one of claims 1-7, characterized in that, The electroplating apparatus further includes a second sewage discharge mechanism (6), which comprises: The third opening (601) is provided on the bottom wall (130) and extends through the thickness direction of the bottom wall (130); The valve body is connected to the third opening (601).

10. An electroplating system, characterized in that, The electroplating system includes a central control device (7), a heating device (8), a cooling device (9), a filtering device (10), and an electroplating device as described in any one of claims 1-9. The central control device (7) is connected to the heating device (8), the cooling device (9), the filtering device (10), and the electroplating device, respectively.

Images