Computer internal radiator with double-layer radiating structure

Abstract

The invention discloses a computer internal radiator with a double-layer heat dissipation structure, and relates to the technical field of computers, the computer internal radiator comprises a radiator main body, the radiator main body is composed of a group of radiators in mirror symmetry, the radiator main body comprises uniformly distributed heat dissipation fins, the top ends of the heat dissipation fins are provided with a first liquid cooling heat exchange plate, and the first liquid cooling heat exchange plate is provided with a second liquid cooling heat exchange plate; the cooling fins can transfer the temperature in the computer, air cooling can be conducted on the interior of the computer through an air cooling structure formed by the cooling fins and the fan, heat can be conducted through the cooling fins after installation, cooling of the interior of the computer is achieved, and after the cooling liquid is injected into the first liquid cooling heat exchange plate, the cooling effect of the computer is improved. The cooling liquid can be conveyed into the second liquid cooling heat exchange plate along the conveying pipe, so that through the arrangement of the first liquid cooling heat exchange plate and the second liquid cooling heat exchange plate, liquid cooling heat exchange cooling can be achieved through the cooling liquid circulating in the first liquid cooling heat exchange plate and the second liquid cooling heat exchange plate, and through double cooperation of air cooling and liquid cooling, the cooling efficiency of the interior of the computer is improved.

Description

Technical Field

[0001] This invention relates to the field of computer technology, specifically to a computer internal heat sink with a double-layer heat dissipation structure. Background Technology

[0002] The core function of a computer's internal heatsink is to dissipate the heat generated by core components such as the CPU and graphics card during operation, maintaining the hardware temperature within a safe range and preventing overheating that could lead to performance degradation, system crashes, hardware damage, or even a shortened lifespan. Prolonged high-temperature environments can accelerate the aging of electronic components, such as the degradation of CPU transistor performance and desoldering of graphics card memory. In severe cases, it may even directly burn out the hardware. Heatsinks continuously dissipate heat to reduce the long-term operating temperature of the hardware and extend its lifespan.

[0003] Existing computer cooling systems have the following shortcomings: First, single air cooling is inefficient and cannot meet the cooling requirements of high-performance computers. Second, while single liquid cooling is highly efficient, the system is complex and costly. Third, in existing combined air and liquid cooling systems, the two cooling methods are independent and the cold source cannot be shared, resulting in high energy consumption and system complexity. Therefore, a computer cooling device that can achieve efficient synergy between air and liquid cooling and share the cold source is needed. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a computer internal heat sink with a double-layer heat dissipation structure.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a computer internal heat sink with a double-layer heat dissipation structure, comprising a heat sink body, the heat sink body being composed of a set of mirror-symmetrical heat sinks, the heat sink body including uniformly distributed heat dissipation fins, a first liquid-cooled heat exchange plate being disposed at the top of the heat dissipation fins, a second liquid-cooled heat exchange plate being disposed at the end of the heat dissipation fins away from the first liquid-cooled heat exchange plate, and the second liquid-cooled heat exchange plate being symmetrically distributed with respect to the first liquid-cooled heat exchange plate, a communication port being disposed on the same side of the second liquid-cooled heat exchange plate and the first liquid-cooled heat exchange plate, and heat exchange tubes being disposed on both sides of the bottom end of the first liquid-cooled heat exchange plate, and the heat exchange tubes being uniformly distributed at the bottom end of the first liquid-cooled heat exchange plate.

[0006] As described above, one end of the heat exchange tube is provided with a connecting pipe, and the two ends of the connecting pipe are respectively fixedly connected to the first liquid-cooled heat exchange plate and the second liquid-cooled heat exchange plate.

[0007] As mentioned above, the first liquid-cooled heat exchange plate and the second liquid-cooled heat exchange plate are provided with a delivery pipe at the end away from the communication port.

[0008] As described above, the first liquid-cooled heat exchange plate and the second liquid-cooled heat exchange plate are provided with needle-shaped heat dissipation columns to enhance the heat exchange effect, and the needle-shaped heat dissipation columns are evenly distributed inside the first liquid-cooled heat exchange plate and the second liquid-cooled heat exchange plate.

[0009] As described above, one end of the conveying pipe is provided with a fixedly connected auxiliary mechanism. The auxiliary mechanism includes an auxiliary frame disposed at one end of the conveying pipe, and a rotating shaft connected by a bearing is disposed inside the auxiliary frame.

[0010] As described above, the surface of the rotating shaft is provided with impact vanes, the impact vanes are fixedly connected to the rotating shaft, and the impact vanes are inclined at 30-60 degrees. One end of the rotating shaft passes through the auxiliary frame and is connected to a rotating disk, and a sealing ring is provided at the end of the auxiliary frame near the rotating shaft. Auxiliary fan blades are evenly distributed around the rotating disk.

[0011] As described above, both ends of the first liquid-cooled heat exchange plate are provided with circulation mechanisms for coolant circulation. The circulation mechanism includes circulation housings provided at both ends of the first liquid-cooled heat exchange plate, and the circulation housings are fixedly connected to both ends of the first liquid-cooled heat exchange plate.

[0012] As described above, the interior of the circulation housing is provided with a rotating rod connected by a bearing, and the surface of the rotating rod is provided with a rotatably connected arc-shaped guide ring. A circulation pipe is provided on one side of the circulation housing, and the end of the circulation pipe away from the circulation housing is connected through the first liquid-cooled heat exchange plate.

[0013] Compared with existing technologies, this computer internal heat sink with a double-layer heat dissipation structure has the following advantages:

[0014] I. In use, this invention combines heat dissipation fins with heat exchange tubes, and sets a first liquid-cooled heat exchange plate and a second liquid-cooled heat exchange plate at both ends of the heat dissipation fins. Through the dual cooperation of air cooling and liquid cooling, a double-layer heat dissipation structure (referring to the two-layer liquid cooling structure formed by the first liquid-cooled heat exchange plate and the second liquid-cooled heat exchange plate) is achieved, which can improve the cooling efficiency of the computer's internal components. Moreover, the cold source used for air cooling and liquid cooling is shared, so that the coolant can dissipate heat from the heat dissipation fins and also cool the first liquid-cooled heat exchange plate and the second liquid-cooled heat exchange plate.

[0015] Second, when the present invention is used, after the coolant is added into the first liquid-cooled heat exchange plate along the connecting port, it can move along the delivery pipe. The coolant can impact the impact vanes, so that the impact vanes can rotate on the surface of the rotating shaft, thereby assisting the fan blades to rotate and thus assisting the fan blades to blow out natural wind. Then, it can dissipate heat from the heat dissipation fins and accelerate the heat dissipation.

[0016] Third, when using this invention, after the coolant is added through the connecting port, it can flow inside the first liquid-cooled heat exchange plate. At the same time, the arc-shaped guide ring can rotate inside the circulation shell. During the rotation, a local low-pressure zone is formed, which allows the coolant to be drawn into the circulation shell. Furthermore, the coolant can be guided through the circulation pipe provided on one side of the circulation shell. This allows the coolant to be cooled inside the circulation pipe while exchanging heat and cooling the inside of the first liquid-cooled heat exchange plate. Subsequently, it can be reintroduced into the first liquid-cooled heat exchange plate, thereby improving the circulation efficiency of the coolant.

[0017] Other advantages, objectives and features of the invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination or study, or may be learned from the practice of the invention. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a three-dimensional structural diagram of the heat exchange tube of the present invention;

[0020] Figure 3 This is a three-dimensional structural diagram of the auxiliary frame of the present invention;

[0021] Figure 4 This is a three-dimensional cross-sectional view of the first liquid-cooled heat exchange plate of the present invention;

[0022] Figure 5 This is a three-dimensional structural diagram of the auxiliary frame of the present invention;

[0023] Figure 6 This is a three-dimensional cross-sectional view of the auxiliary frame of the present invention;

[0024] Figure 7 This is a three-dimensional cross-sectional view of the recirculating shell of the present invention;

[0025] Figure 8 This is a schematic diagram of the cross-sectional structure of the heat exchange plate of the present invention.

[0026] In the diagram: 1. Radiator body; 101. Heat dissipation fins; 102. First liquid-cooled heat exchange plate; 103. Second liquid-cooled heat exchange plate; 104. Connecting port; 105. Heat exchange tube; 106. Connecting pipe; 107. Delivery pipe; 2. Needle-shaped heat dissipation column; 3. Auxiliary mechanism; 301. Auxiliary frame; 302. Rotating shaft; 303. Impact vane; 304. Rotating disk; 305. Auxiliary fan blade; 4. Circulation mechanism; 401. Circulation housing; 402. Rotating rod; 403. Arc-shaped guide ring; 404. Circulation pipe. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] like Figures 1-8 As shown, the present invention provides a technical solution: a computer internal heat sink with a double-layer heat dissipation structure, including a heat sink body 1, which is composed of a set of mirror-symmetrical heat sinks. The heat sink body 1 consists of two sets of mirror-symmetrically distributed heat sinks. The heat sink body 1 includes uniformly distributed heat dissipation fins 101. A first liquid-cooled heat exchange plate 102 is provided at the top of the heat dissipation fins 101, and a second liquid-cooled heat exchange plate 103 is provided at the end of the heat dissipation fins 101 away from the first liquid-cooled heat exchange plate 102. The second liquid-cooled heat exchange plate 103 and the first liquid-cooled heat exchange plate 102 are symmetrically separated. The second liquid-cooled heat exchange plate 103 and the first liquid-cooled heat exchange plate 102 are provided with a connecting port 104 on one side, and the two connecting ports 104 are fixedly connected to the second liquid-cooled heat exchange plate 103 and the first liquid-cooled heat exchange plate 102 respectively. Heat exchange tubes 105 are provided on both sides of the bottom end of the first liquid-cooled heat exchange plate 102, and the heat exchange tubes 105 are evenly distributed at the bottom end of the first liquid-cooled heat exchange plate 102. A connecting pipe 106 is provided at one end of the heat exchange tube 105, and the two ends of the connecting pipe 106 are fixedly connected to the first liquid-cooled heat exchange plate 102 and the second liquid-cooled heat exchange plate 103 respectively.

[0029] Through the connection pipe 106 and the heat exchange pipe 105, and the circulation of the internal coolant, the heat dissipation fins 101 can quickly dissipate heat after absorbing heat, thereby achieving heat dissipation inside the computer.

[0030] The heat dissipation structure, consisting of heat dissipation fins 101, heat exchange tubes 105, and connecting pipes 106, is distributed symmetrically at both ends of the first liquid-cooled heat exchange plate 102, which can improve the absorption of heat by the coolant in the cavity during the flow process and improve the internal circulation heat dissipation function of the computer.

[0031] like Figure 3 and Figure 4 As shown, a delivery pipe 107 is provided at the end of the first liquid-cooled heat exchange plate 102 and the second liquid-cooled heat exchange plate 103 away from the communication port 104. Needle-shaped heat dissipation columns 2 for enhancing heat exchange effect are provided inside the first liquid-cooled heat exchange plate 102 and the second liquid-cooled heat exchange plate 103, and the needle-shaped heat dissipation columns 2 are evenly distributed inside the first liquid-cooled heat exchange plate 102 and the second liquid-cooled heat exchange plate 103.

[0032] Furthermore, as a key efficiency-enhancing design, the substrates of the first liquid-cooled heat exchange plate 102 and the second liquid-cooled heat exchange plate 103 can be manufactured using vapor chamber technology. The vapor chamber is a vacuum cavity with a micro-sintered copper powder capillary structure on the inner wall. Pure water is injected as the working fluid. When heat is conducted from the heat dissipation fins 101 to the liquid-cooled heat exchange plate, the coolant in the cavity rapidly vaporizes in the low vacuum environment, absorbing and carrying away a large amount of heat energy. When the gaseous working fluid comes into contact with other low-temperature areas of the liquid-cooled heat exchange plate, it condenses into liquid and releases heat. The condensate flows back to the heat source through capillary pumping force, forming a highly efficient and automatically circulating two-phase heat transfer system. This structure makes the liquid-cooled heat exchange plate itself a superconducting homogeneous body with a thermal resistance of about 0.25℃ / W, ensuring that the temperature difference between any two points is less than 10℃ in an environment of 0℃~100℃, and it can be installed at any angle without being affected by gravity, fundamentally improving the temperature uniformity and thermal response speed of the heat dissipation module.

[0033] The combination of porous metal layer and heat exchanger technology constitutes one of the core innovations of this invention: the heat exchanger is responsible for rapidly distributing and conducting heat on a two-dimensional plane, while the porous metal layer on the inner wall is responsible for maximizing heat exchange on the liquid contact side. The two work together to achieve the ultimate heat dissipation performance of the radiator in a limited space.

[0034] The heat exchange performance can be improved by the needle-shaped heat dissipation columns 2 set inside the first liquid-cooled heat exchange plate 102 and the second liquid-cooled heat exchange plate 103, and the delivery pipe 107 is made of high temperature and corrosion resistant materials to ensure stable flow of coolant.

[0035] In use, the heat dissipation fins 101 are configured to cooperate with the heat exchange tubes 105. A first liquid-cooled heat exchange plate 102 and a second liquid-cooled heat exchange plate 103 are fixed to both ends of the heat dissipation fins 101, respectively. A connecting port 104 at one end of each liquid-cooled heat exchange plate 102 and second liquid-cooled heat exchange plate 103 is connected to a coolant filling pipe to allow coolant flow. The coolant is injected into the interior of the first liquid-cooled heat exchange plate 102 and second liquid-cooled heat exchange plate 103, respectively. Simultaneously, the heat dissipation fins 101, under the action of airflow, achieve air cooling of the computer's internal components. After installation, the heat dissipation fins 101 can conduct heat, achieving cooling of the computer's internal components. Furthermore, after the coolant is filled into the first liquid-cooled heat exchange plate 102... The coolant can be fed into the second liquid-cooled heat exchange plate 103 along the conveying pipe 107, so that the first liquid-cooled heat exchange plate 102 and the second liquid-cooled heat exchange plate 103 can achieve liquid cooling heat exchange and cooling through the internal flow of coolant. At the same time, the coolant can circulate through the heat exchange pipe 105 and the connecting pipe 106 that penetrate the heat dissipation fins 101, thereby achieving heat exchange and cooling of the heat dissipation fins 101, thus achieving liquid cooling. Through the dual combination of air cooling and liquid cooling, the cooling efficiency inside the computer is improved. Moreover, the cold source used for air cooling and liquid cooling is shared, so that the coolant can dissipate heat from the heat dissipation fins 101 and also cool the first liquid-cooled heat exchange plate 102 and the second liquid-cooled heat exchange plate 103.

[0036] like Figure 5 and Figure 6 As shown, an auxiliary mechanism 3 is fixedly connected to one end of the conveying pipe 107. The auxiliary mechanism 3 includes an auxiliary frame 301 set at one end of the conveying pipe 107. A rotating shaft 302 is set inside the auxiliary frame 301 through a bearing (the bearing connection adopts deep groove ball bearing or needle roller bearing to ensure the flexible rotation of the rotating parts). An impact vane 303 is set on the surface of the rotating shaft 302. The impact vane 303 is fixedly connected to the rotating shaft 302, and the impact vane 303 is inclined at 30-60 degrees. One end of the rotating shaft 302 passes through the auxiliary frame 301 and is connected to a rotating disk 304. A sealing ring is set at the end of the auxiliary frame 301 near the rotating shaft 302. Auxiliary fan blades 305 are evenly distributed around the rotating disk 304.

[0037] To ensure a balance between the flexible rotation of the rotating shaft 302 and the sealing performance, a mechanical seal ring 306 is provided at one end of the auxiliary frame 301 near the rotating shaft 302. The dynamic seal structure ensures that the coolant does not leak and does not affect the rotation of the rotating shaft 302. The rotating shaft 302 is connected to the auxiliary frame 301 through a deep groove ball bearing. The outer ring of the bearing is fixed to the auxiliary frame 301, and the inner ring is fixed to the rotating shaft 302 to ensure flexible rotation.

[0038] The impact vane 303 is tilted so that the coolant can rotate smoothly when it impacts it, avoiding dryness during impact and facilitating the rotation and heat dissipation of the fan blade 305.

[0039] like Figure 7 As shown, both ends of the first liquid-cooled heat exchange plate 102 are provided with circulation mechanisms 4 for coolant circulation. The circulation mechanism 4 includes circulation housings 401 provided at both ends of the first liquid-cooled heat exchange plate 102. The circulation housings 401 are fixedly connected at both ends of the first liquid-cooled heat exchange plate 102. Inside the circulation housings 401, there is a rotating rod 402 connected by a bearing. The surface of the rotating rod 402 is provided with an arc-shaped guide ring 403 that is rotatably connected.

[0040] When the arc-shaped guide ring 403 rotates, it can guide the coolant so that it can partially flow into the circulation housing 401, thereby achieving partial cooling of the coolant after entering the circulation housing 401.

[0041] In use, after the coolant is added into the first liquid-cooled heat exchange plate 102 along the connecting port 104, it can move along the delivery pipe 107. While moving within the delivery pipe 107, the coolant can be injected into the auxiliary frame 301. Inside the auxiliary frame 301, the surface of the rotating shaft 302 is evenly distributed with 4-8 impact vanes 303. Each impact vane 303 is set at an angle of 30-60 degrees relative to the rotating shaft 302, forming a turbine blade structure. When the coolant enters the auxiliary frame 301 along the delivery pipe 107 at a certain flow rate, the liquid impacts the tilted impact vanes 303, generating a tangential force that drives the rotating shaft 302 to rotate. The shaft 302 drives the rotating disk 304 to rotate, which in turn drives the auxiliary fan blades 305 to generate auxiliary airflow. To ensure sealing, a sealing ring is provided at one end of the auxiliary frame 301 near the rotating shaft 302 to prevent coolant leakage. This allows the impact vane 303 to rotate on the surface of the rotating shaft 302. After rotation, it can drive the connected rotating shaft 302 to rotate. When the rotating shaft 302 rotates, it can move the rotating disk 304 connected at one end. At the same time, when the rotating disk 304 rotates, it can drive the auxiliary fan blades 305 arranged around it to rotate, so that the auxiliary fan blades 305 can blow out natural wind, which can then dissipate heat from the heat dissipation fins 101 and accelerate heat dissipation.

[0042] like Figure 7 As shown, a circulation pipe 404 is provided on one side of the circulation housing 401, and the end of the circulation pipe 404 away from the circulation housing 401 is connected through to the first liquid-cooled heat exchange plate 102.

[0043] The heat dissipation fins 101 are symmetrically distributed at both ends of the circulation pipe 404, which can further improve the cooling function inside the computer.

[0044] The circulation pipe 404 is designed with a curved structure, which allows the coolant to circulate inside for a longer time. The internal and external temperature differences are used to cool the coolant, and the coolant is recycled back into the first liquid-cooled heat exchange plate 102 through the circulation pipe 404.

[0045] During use, after the coolant is added through the connecting port 104, it flows inside the first liquid-cooled heat exchange plate 102 and is simultaneously transported to the delivery pipe 107. Before flowing to the delivery pipe 107, the coolant comes into contact with the arc-shaped guide rings 403 on both sides, causing the arc-shaped guide rings 403 to rotate. The rotation of the arc-shaped guide rings 403 drives the rotating rod 402 to rotate inside the circulation shell 401. The arc-shaped guide rings 403 rotate under the action of the coolant flow, forming a local low-pressure area inside the circulation shell 401 during the rotation. The pressure difference guides some coolant into the circulation shell 401, and the coolant can be guided through the circulation pipe 404 on one side of the circulation shell 401. When the coolant exchanges heat and cools the inside of the first liquid-cooled heat exchange plate 102, it can be cooled inside the circulation pipe 404 and then reintroduced into the first liquid-cooled heat exchange plate 102, thereby improving the circulation efficiency of the coolant.

[0046] The coolant circulation path of the present invention is as follows: the coolant is injected into the first liquid-cooled heat exchange plate 102 through the connecting port 104. During the flow inside the first liquid-cooled heat exchange plate 102, it comes into contact with the needle-shaped heat dissipation column 2 for the first heat exchange. Part of the coolant flows through the heat exchange pipe 105 and the connecting pipe 106 between the heat dissipation fins 101 to cool the heat dissipation fins 101. Another part of the coolant flows to the second liquid-cooled heat exchange plate 103 through the conveying pipe 107. During the flow, it passes through the auxiliary mechanism 3, which drives the impact vane 303 to rotate. After the coolant comes into contact with the needle-shaped heat dissipation column 2 inside the second liquid-cooled heat exchange plate 103 for the second heat exchange, it returns through the conveying pipe 107. At the same time, the circulation mechanism 4 at both ends of the first liquid-cooled heat exchange plate 102 draws part of the heated coolant into the circulation shell 401, cools it through the circulation pipe 404, and then re-injects it into the first liquid-cooled heat exchange plate 102 to achieve local circulation cooling.

[0047] Working principle: An internal heat sink is installed inside the computer, allowing the heat sink fins 101 to transfer heat from the computer's interior. The heat sink fins 101 and the fan form an air-cooling structure, achieving cooling of the computer's interior. After installation, the heat sink fins 101 can conduct heat, achieving cooling of the computer's interior. After coolant is added into the first liquid-cooled heat exchange plate 102, it can be transported along the delivery pipe 107 into the second liquid-cooled heat exchange plate 103. Through the arrangement of the first liquid-cooled heat exchange plate 102 and the second liquid-cooled heat exchange plate 103, liquid-cooled heat exchange and cooling can be achieved through the internal flow of coolant. Through the dual combination of air cooling and liquid cooling, the cooling efficiency of the computer's interior is improved.

[0048] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A computer internal heat sink with a double-layer heat dissipation structure, comprising a heat sink body (1), characterized in that: The radiator body (1) is composed of a set of mirror-symmetrical radiators. The radiator body (1) includes uniformly distributed heat dissipation fins (101). A first liquid-cooled heat exchange plate (102) is provided at the top of the heat dissipation fins (101). A second liquid-cooled heat exchange plate (103) is provided at the end of the heat dissipation fins (101) away from the first liquid-cooled heat exchange plate (102). The second liquid-cooled heat exchange plate (103) and the first liquid-cooled heat exchange plate (102) are symmetrically distributed. The second liquid-cooled heat exchange plate (103) and the first liquid-cooled heat exchange plate (102) are respectively provided with a communication port (104) on the same side. Heat exchange tubes (105) are provided on both sides of the bottom end of the first liquid-cooled heat exchange plate (102), and the heat exchange tubes (105) are evenly distributed at the bottom end of the first liquid-cooled heat exchange plate (102).

2. A computer internal heat sink with a double-layer heat dissipation structure according to claim 1, characterized in that: One end of the heat exchange tube (105) is provided with a connecting pipe (106), and the two ends of the connecting pipe (106) are fixedly connected to the first liquid-cooled heat exchange plate (102) and the second liquid-cooled heat exchange plate (103), respectively.

3. A computer internal heat sink with a double-layer heat dissipation structure according to claim 2, characterized in that: The first liquid-cooled heat exchange plate (102) and the second liquid-cooled heat exchange plate (103) are provided with a delivery pipe (107) at the end away from the communication port (104).

4. A computer internal heat sink with a double-layer heat dissipation structure according to claim 1, characterized in that: The first liquid-cooled heat exchange plate (102) and the second liquid-cooled heat exchange plate (103) are provided with needle-shaped heat dissipation columns (2) to enhance the heat exchange effect, and the needle-shaped heat dissipation columns (2) are evenly distributed inside the first liquid-cooled heat exchange plate (102) and the second liquid-cooled heat exchange plate (103).

5. A computer internal heat sink with a double-layer heat dissipation structure according to claim 3, characterized in that: One end of the conveying pipe (107) is provided with a fixedly connected auxiliary mechanism (3). The auxiliary mechanism (3) includes an auxiliary frame (301) provided at one end of the conveying pipe (107). The auxiliary frame (301) has a rotating shaft (302) connected by a bearing inside.

6. A computer internal heat sink with a double-layer heat dissipation structure according to claim 5, characterized in that: The surface of the rotating shaft (302) is provided with an impact vane (303), the impact vane (303) is fixedly connected to the rotating shaft (302), and the impact vane (303) is inclined at 30-60 degrees. One end of the rotating shaft (302) passes through the auxiliary frame (301) and is connected to a rotating disk (304). A sealing ring is provided at the end of the auxiliary frame (301) near the rotating shaft (302). Auxiliary fan blades (305) are evenly distributed around the rotating disk (304).

7. A computer internal heat sink with a double-layer heat dissipation structure according to claim 4, characterized in that: Both ends of the first liquid-cooled heat exchange plate (102) are provided with circulation mechanisms (4) for coolant circulation. The circulation mechanism (4) includes circulation housings (401) provided at both ends of the first liquid-cooled heat exchange plate (102), and the circulation housings (401) are fixedly connected at both ends of the first liquid-cooled heat exchange plate (102).

8. A computer internal heat sink with a double-layer heat dissipation structure according to claim 7, characterized in that: The circulation housing (401) is provided with a rotating rod (402) connected by a bearing inside. The surface of the rotating rod (402) is provided with an arc-shaped guide ring (403) that is rotatably connected. A circulation pipe (404) is provided on one side of the circulation housing (401). The end of the circulation pipe (404) away from the circulation housing (401) is connected through the first liquid-cooled heat exchange plate (102).

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