Semiconductor manufacturing apparatus and film cutting mechanism

Abstract

A film pasting device (1) is provided with a stage (2) on which a semiconductor chip (W) is placed, and a cutting unit (19) which cuts a photoresist film (6) pasted to the semiconductor chip (W) placed on the stage (2) by laser light (LS). The cutting unit (19) includes a laser light source (61) and a beam expander (63) that enlarges or reduces the beam diameter of the laser light (LS) emitted by the laser light source (61).

Description

Technical Field

[0001] This invention relates to semiconductor manufacturing apparatus and film cutting mechanism. Background Technology

[0002] Previously, it was known to have a stage for placing a silicon chip (semiconductor chip) and a means for cutting the film attached to the semiconductor chip placed on the stage along the outer periphery of the semiconductor chip (see Patent Document 1).

[0003] Existing technical documents Patent documents Patent Document 1: Specification of Japanese Patent No. 4728534 Summary of the Invention The problem that the invention aims to solve The aforementioned device is configured to irradiate the membrane with a laser to cut it. Therefore, the quality of the cut end face of the membrane is affected by the size of the laser spot diameter. Moreover, there is a concern that the quality of the cut end face of the membrane may be reduced if the spot diameter is inappropriate.

[0004] Therefore, there is a need to provide a semiconductor manufacturing apparatus that can improve the quality of the cut end face of the film.

[0005] Methods for solving problems The semiconductor manufacturing apparatus according to the embodiments of the present invention includes a stage on which a semiconductor chip is placed, and a film cutting mechanism for cutting a film attached to the semiconductor chip placed on the stage using a laser. The film cutting mechanism includes a laser source and a beam expander for amplifying or reducing the beam diameter of the laser emitted by the laser source.

[0006] The effects of the invention The aforementioned semiconductor manufacturing apparatus can improve the quality of the cut end face of the film. Attached Figure Description

[0007] Figure 1 This is a side view of a film bonding apparatus according to an embodiment of this disclosure.

[0008] Figure 2 A diagram illustrating the function of the control unit mounted on the membrane bonding device.

[0009] Figure 3 A diagram illustrating the pushing pattern.

[0010] Figure 4 This is a side view of the film bonding device when the moving unit moves to the left.

[0011] Figure 5 This is a side view of the film bonding device when the moving unit moves to the right.

[0012] Figure 6 A diagram illustrating an example of a membrane being cut by a cutting unit.

[0013] Figure 7 A diagram illustrating an example of the structure of a hollow structure.

[0014] Figure 8 A diagram illustrating an example of the structure of a hollow structure.

[0015] Figure 9 A diagram illustrating an example of the configuration of a lifting support mechanism.

[0016] Figure 10 This is a right-side view of the outer peripheral support components and the lifting support mechanism.

[0017] Figure 11 The following diagram shows the outer peripheral support components and the lifting support mechanism.

[0018] Figure 12 A top view of the semiconductor chip and its peripheral support components mounted on the platform.

[0019] Figure 13 This is a three-dimensional view of the cut-off unit.

[0020] Figure 14 The top view, rear view, and right side view of the cut-off unit.

[0021] Figure 15 A diagram illustrating an example of the configuration of a laser unit.

[0022] Figure 16 This is a cross-sectional view of the laser unit.

[0023] Figure 17 A diagram illustrating an example of the configuration of an upper discharge system.

[0024] Figure 18 A diagram illustrating an example of the configuration of a lower discharge system.

[0025] Figure 19 This is a cross-sectional view of the drainage system. Detailed Implementation

[0026] initial reference Figure 1 This describes an example of a film bonding apparatus 1 for a semiconductor manufacturing apparatus according to embodiments of the present disclosure. Figure 1 This is a schematic diagram of the membrane bonding device 1.

[0027] The film bonding apparatus 1 is used to bond a photoresist film 6 and other films to a semiconductor chip W. It includes a platform 2 that is circular when viewed from above, on which the semiconductor chip W can be placed. A predetermined interval is left above the platform 2 to accommodate a film supply section 3 and a winding section 4. A three-layer film F3 is supplied from the film supply section 3. In the example shown, in the three-layer film F3, a carrier film 7 is laminated on one surface of the photoresist film 6, which has thermal adhesion, and a reinforcing film 8 is laminated on the other surface. The three-layer film F3 is peeled off from the carrier film 7 by a clamping roller 9 to form a two-layer film F2. The two-layer film F2 is then pressed and bonded to the surface of the semiconductor chip W, and the reinforcing film 8 is peeled off from the two-layer film F2 by horizontal movement of a moving unit described later.

[0028] The platform 2 is constructed by a platform lifting mechanism (TLM) comprising sliding rods 10, a base plate 11, and a support portion 12, which allows it to be raised and lowered. Specifically, the upper ends of the four sliding rods 10, which are freely supported on a frame (not shown), are fixed by the base plate 11 and the support portion 12. Furthermore, the platform 2 is raised and lowered by the driving force of a drive source (not shown) such as a cylinder, which causes the sliding rods 10 to move. Additionally, one end of the platform 2 is open on the mounting surface, and the other ends form part of a suction passage for connecting to a suction source (not shown) such as a pump. In the example shown, the suction passage includes a groove 2G formed on the mounting surface (top) of the platform 2 (see reference). Figure 9 The semiconductor chip W is adsorbed onto the stage 2 by the suction action of the suction source through the multiple through holes formed in the groove 2G and the groove 2G.

[0029] On one side of platform 2, in a direction parallel to the rotation axis of clamping roller 9. Figure 1 As shown, a sliding shaft 15 extending horizontally (perpendicular to the rotation axis of the clamping roller 9) is configured. This sliding shaft 15 supports moving units including a first moving unit 16, a second moving unit 17, and a third moving unit 18, allowing them to slide freely. Furthermore, the moving units are configured to move horizontally using the driving force of a drive source (not shown) such as a cylinder. Additionally, above the stage 2, a cutting unit 19, which serves as a film cutting mechanism for cutting the photoresist film 6 to which the semiconductor chip W is attached using a laser, is provided so that it can move horizontally. Moreover, instead of a device emitting a laser for cutting the film, the cutting unit 19 may be equipped with a scraper for cutting the film.

[0030] The third moving unit 18 has a pressing roller 20 that pushes a photoresist film 6 offset towards the surface side of the semiconductor chip W on the stage 2. The pressing roller 20 is an example of a pressing member, and at least the roller surface portion of the pressing roller 20 is formed of an elastic material such as rubber. The film bonding device 1 enables the moving unit (see reference 1) located at one end (right end) of the sliding shaft 15 to... Figure 1 )like Figure 4 As shown, moving the sliding shaft 15 to the other end (left end) allows the double film F2 to be offset on the surface of the semiconductor chip W on the stage 2. Furthermore, the film bonding device 1 can press the double film F2 onto the surface of the semiconductor chip W using the push roller 20 for bonding.

[0031] The push roller 20 can be configured to adjust its pushing force according to the pushing area of ​​the semiconductor chip W (the contact area between the push roller 20 and the semiconductor chip W) via the pushing force adjustment mechanism 21. In the example shown, the pushing force adjustment mechanism 21 includes a pushing cylinder 22 with a piston rod 22a. The front end of the piston rod 22a is connected to a support member (not shown) that freely supports the push roller 20 for rotation. The pushing cylinder 22 is an example of a pushing drive source. By supplying a fluid supply source such as a pump, a fluid amount corresponding to the pushing area of ​​the semiconductor chip W is supplied, thereby finely adjusting the entry and exit movement of the piston rod 22a.

[0032] A rectangular annular outer peripheral support member 5 is provided on the outer periphery of the platform 2. The outer peripheral support member 5 is also called a buffer member, and the push roller 20 has an upper surface 5a that acts as an abutting surface when pushing the photoresist film 6. Furthermore, the outer peripheral support member 5 is supported freely in raising and lowering by a lifting support mechanism 25 including a rotary motor 35, and the height of each of the four corners of the outer peripheral support member 5 can be adjusted individually. In the example shown, the height of the outer peripheral support member 5 is adjusted by computer control, and therefore it is also called a digital buffer. Furthermore, a portion of an exhaust passage 13 is formed between the platform 2 and the outer peripheral support member 5, with one end open to the mounting surface and the other ends connected to an exhaust device 14 such as an exhaust fan or exhaust pump. In the example shown, the exhaust passage 13 is a passage for discharging smoke and other contaminants generated during film cutting by the laser cutting unit 19, and includes an annular gap 13G between the platform 2 and the outer peripheral support member 5 (see reference). Figure 9 The pipe 13D (refer to) connected to the side of the outer peripheral support member 5 and the outer peripheral support member 5. Figure 9 That is, in the example shown, the exhaust device 14 and the exhaust passage 13 (pipe 13D and gap 13G) constitute a lower exhaust system EXD (air knife) of a discharge system EX for removing unwanted substances such as foreign matter generated during membrane cutting using the cutting unit 19. The foreign matter generated during membrane cutting using the cutting unit 19 includes smoke generated by heating the membrane using a laser. With this configuration, the air flowing through the exhaust passage 13 can instantly cool the cut surface of the membrane cut by the cutting unit 19, thereby achieving a clean cut surface of the membrane without burrs or other defects.

[0033] Next, refer to Figure 2 This explains the function of the membrane bonding device 1. Figure 2 This is a block diagram illustrating the function of the control unit 40 mounted on the film bonding apparatus 1. Specifically, the film bonding apparatus 1 has a control unit 40 that controls functions related to film bonding. In the example shown, the control unit 40 is a microcomputer comprising a CPU and memory. The control unit 40 is connected to a rotary motor 35, a pressing cylinder 22, and an input unit 41. The input unit 41 can be, for example, a keyboard, a mouse, or a fingertip control unit. Furthermore, the control unit 40 has a height level storage unit 42 that stores multiple height levels of the peripheral support member 5 predetermined according to the shape or size of the semiconductor chip W, and a pressing pattern storage unit 43 that stores multiple pressing patterns predetermined according to the shape or size of the semiconductor chip W.

[0034] In the example shown, the control unit 40 initially determines whether a height level switching command is input from the input unit 41. Furthermore, if a height level switching command is input from the input unit 41, the control unit 40 determines a predetermined height level corresponding to the switching command from a plurality of height levels stored in the height level storage unit 42. Then, the control unit 40 drives the rotary motor 35 at the predetermined height level it has determined.

[0035] Furthermore, the control unit 40 determines whether a push pattern switching command is input from the input unit 41. If a push pattern switching command is input from the input unit 41, the control unit 40 determines a predetermined push pattern corresponding to the switching command from among a plurality of push patterns stored in the push pattern storage unit 43. Then, the control unit 40 drives the push cylinder 22 in accordance with the predetermined push pattern it has determined.

[0036] In this way, in the film bonding apparatus 1, if a height level switching command corresponding to the shape of the semiconductor chip W is input to the control unit 40, the predetermined height level corresponding to the switching command is determined, and the rotary motor 35, which serves as the drive source for the lifting support mechanism 25, is driven. As a result, the outer peripheral support member 5 is raised and lowered, and the outer peripheral support member 5 is positioned at its predetermined height level.

[0037] Furthermore, in the film bonding apparatus 1, if a pressing pattern switching command corresponding to the shape of the semiconductor chip W is input to the control unit 40, the predetermined pressing pattern corresponding to the switching command is determined. In the example shown, Figure 3 As shown, the corresponding pressing pattern P1 of the circular semiconductor chip W is determined when viewed from above.

[0038] Next, the membrane bonding process will be explained. Initially, the membrane bonding device 1 is as follows: Figure 4As shown, the moving units (first moving unit 16, second moving unit 17, and third moving unit 18) located at one end (right end) of the sliding shaft 15 move together with the other end (left end) of the sliding shaft 15 and move to the other end. In this operation, while the double-layer film F2 supplied from the film supply unit 3 shifts at the surface of the semiconductor chip W on the stage 2, the double-layer film F2 is pushed onto the surface of the semiconductor chip W by the push roller 20 of the third moving unit 18, forming a pattern P1 (see reference) Figure 3 The film is adhered by pressing. During the pressing of the two-layer film F2, the pressing roller 20 rotates on the upper surface 5a of the outer peripheral support member 5, which is in a position where its height can be adjusted. Furthermore, a coating such as Teflon or Toshical is applied to the upper surface 5a of the outer peripheral support member 5 in a manner that facilitates peeling off the adhered film.

[0039] Next, the membrane bonding device 1 as follows Figure 5 As shown, by retracting the second moving unit 17 and the third moving unit 18 to their original positions, the reinforcing film 8 is peeled off from the second layer film F2 on the semiconductor chip W. As a result, only the photoresist film 6 remains on the surface of the semiconductor chip W. Then, the film bonding device 1 moves the cutting unit 19 horizontally along the outer periphery of the semiconductor chip W while irradiating it with a laser, thereby cutting the photoresist film 6 (see reference). Figure 6 The remaining film on the surface of the semiconductor chip W in the photoresist film 6, except for the portion that is adhered to, is peeled off by the first moving unit 16, which acts as a removal head, and wound onto the winding section 4. As a result, the film bonding apparatus 1 is able to obtain a semiconductor chip W to which the photoresist film 6 is adhered.

[0040] In the example shown, the photoresist film 6 adhered to the surface of the semiconductor chip W is then subjected to exposure, removal, and other processes. Figure 7 As shown, a pre-cured wall portion 81 is formed. Next, a height level switching command corresponding to the semiconductor chip W with wall portion 81 is input to the control unit 40, and the peripheral support member 5 is adjusted to a predetermined height level. Furthermore, a pressing pattern switching command corresponding to the semiconductor chip W with wall portion 81 is input to the control unit 40, and a predetermined pressing pattern is determined. Next, the film bonding process described above is performed again on the semiconductor chip W with wall portion 81, and a semiconductor chip W with other photoresist films 6 bonded to wall portion 81 is obtained. Then, exposure and removal processes are performed on the photoresist film 6 bonded to wall portion 81, forming a [structure / structure] on the semiconductor chip W. Figure 8 A hollow structure 80, as shown, comprising a wall portion 81 and a roof portion 82.

[0041] In addition, in the example shown, the height level and pressing pattern of the first and second membrane bonding processes are different from each other, they can be the same, or only one of them can be different.

[0042] Furthermore, the film bonding apparatus 1 is configured such that the pressing roller 20 abuts against the upper surface 5a of the peripheral support member 5, whose height level can be adjusted, when the photoresist film 6 is pressed. Therefore, the film bonding apparatus 1 can suppress excessive pressing of the photoresist film 6 by the pressing roller 20, and can bond multiple layers of the thin film photoresist film 6, including the soft material, in a manner that minimizes mechanical pressure on the lower layers. In particular, when bonding the photoresist film 6 to the wall portion 81 of the hollow structure 80, the film bonding apparatus 1 can suitably absorb the surface irregularities (surface pattern) of the semiconductor chip W, thus minimizing mechanical pressure on the semiconductor chip W. Furthermore, when bonding the photoresist film 6 to the roof portion 82 of the hollow structure 80, the film bonding apparatus 1 can suitably absorb the surface irregularities (surface pattern) of the pre-cured wall portion 81, thus minimizing mechanical pressure on the semiconductor chip W and the wall portion 81.

[0043] Furthermore, the film bonding apparatus 1 is configured such that the outer peripheral support member 5 can be horizontally positioned at a predetermined height by means of a lifting support mechanism 25 including a rotary motor 35, which allows the outer peripheral support member 5 to be raised and lowered. Therefore, the film bonding apparatus 1 can stably bond films to semiconductor chips W of various shapes. As a result, the film bonding apparatus 1 can form hollow structures 80 with excellent thickness accuracy (e.g., approximately 50 μm) on the semiconductor chip W with good yield. In particular, the film bonding apparatus 1 can form good hollow structures 80 on approximately the entire surface of the semiconductor chip W. Furthermore, if the film bonding apparatus 1 performs multilayer bonding of three or more layers of photoresist film 6, it can further form hollow structures 80 with high film thickness (e.g., approximately 100 μm).

[0044] Furthermore, the film bonding apparatus 1 is configured such that the pushing force of the pressing roller 20 can be adjusted according to the pressing area of ​​the semiconductor chip W by means of a pressing force adjustment mechanism 21 including a pressing cylinder 22, etc. Therefore, the film bonding apparatus 1 can stably bond films to semiconductor chips W with more diverse shapes.

[0045] Furthermore, the film bonding apparatus 1 incorporates a height level storage unit 42 and a pressing pattern storage unit 43 within the control unit 40. Based on input information fed to the control unit 40, it can select the appropriate height level and pressing pattern based on the shape of the semiconductor chip W being used. Therefore, the film bonding apparatus 1 can stably bond films to semiconductor chips W of a wider variety of shapes.

[0046] Next, refer to Figures 9-11 This section describes an example of the configuration of a lifting support mechanism 25 that raises and lowers the outer peripheral support member 5. Figure 9 This diagram illustrates an example of the configuration of the lifting support mechanism 25. Specifically, Figure 9 The image above is a three-dimensional view of platform 2, outer peripheral support component 5, pipe 13D, lifting support mechanism 25, and platform lifting mechanism TLM. Figure 9 The image below is a perspective view of the outer peripheral support component 5 and the lifting support mechanism 25, equivalent to... Figure 9 The above diagram is the one excluding platform 2, pipe 13D, and the platform lifting mechanism TLM. Additionally, Figure 9 In the figure below, for clarity, the illustration of the side cover 5C, which is one of the constituent elements of the outer peripheral support member 5, is omitted.

[0047] Figure 9 In this system, X1 represents one direction of the X-axis constituting the three-dimensional orthogonal coordinate system, and X2 represents the other direction of the X-axis. Similarly, Y1 represents one direction of the Y-axis constituting the three-dimensional orthogonal coordinate system, and Y2 represents the other direction of the Y-axis. Likewise, Z1 represents one direction of the Z-axis constituting the three-dimensional orthogonal coordinate system, and Z2 represents the other direction of the Z-axis. Figure 9 In the diagram, the X1 side of the outer peripheral support member 5 corresponds to the front side (front face) of the outer peripheral support member 5, and the X2 side corresponds to the rear side (back face) of the outer peripheral support member 5. Furthermore, the Y1 side of the outer peripheral support member 5 corresponds to the left side of the outer peripheral support member 5, and the Y2 side corresponds to the right side of the outer peripheral support member 5. Additionally, the Z1 side of the outer peripheral support member 5 corresponds to the upper side of the outer peripheral support member 5, and the Z2 side corresponds to the lower side of the outer peripheral support member 5. The same applies to other members in the diagram.

[0048] Figure 10 This is a right-side view of the outer peripheral support member 5 and the lifting support mechanism 25. Figure 10 In order to clarify, and Figure 9 The same applies to the following diagram, omitting the illustration of the side cover 5C. Figure 11 The following figure shows the outer peripheral support member 5 and the lifting support mechanism 25. Figure 11 For clarity, some of the components of the lifting support mechanism 25 (mounting plate 34 and rotating motor 35) and the side cover 5C are omitted from the illustration.

[0049] In the example shown in the figure, the outer peripheral support member 5 is as follows: Figure 9 As shown, it includes a base plate 5B, side covers 5C, a pedestal portion 5D, a top plate portion 5T, and an outer peripheral wall portion 5W. Additionally, Figure 10 and Figure 11For clarity, the base plate 5B features a cross-linking pattern, the pedestal portion 5D features a fine dot pattern, and the top plate portion 5T and the outer peripheral wall portion 5W feature a coarse dot pattern. The lifting support mechanism 25 is as follows... Figure 9 As shown in the figure below, it includes a lifting mechanism LM that raises and lowers the outer peripheral support member 5 and a support mechanism 50 that supports the outer peripheral support member 5.

[0050] Specifically, the lifting mechanism LM, such as Figure 9 As shown in the diagram below, it includes a mounting plate 34, a rotating motor 35, a conveyor belt 36, a drive pulley 37, a tension pulley 38, and a driven pulley 39. The driven pulley 39 includes a left front driven pulley 39LF, a right front driven pulley 39RF, and a left rear driven pulley 39LB. Figure 9 (Not visible in the image below) and the right rear driven pulley 39RB. The tension pulley 38 includes a left tension pulley 38L disposed between the drive pulley 37 and the left front driven pulley 39LF, and a right tension pulley 38R disposed between the drive pulley 37 and the right front driven pulley 39RF.

[0051] Support mechanism 50 includes left front support mechanism 50LF, right front support mechanism 50RF, and left rear support mechanism 50LB. Figure 9 (Not visible in the image below) and the right rear support mechanism 50RB. In the example shown, the left front support mechanism 50LF, the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB each have the same structure (same shape and same size). Specifically, support mechanism 50 is as follows: Figure 10 As shown, it is composed of a nut 51, a nut 52, a bearing 53, and a spacer 54.

[0052] The base plate 5B of the outer peripheral support member 5 is a member that supports the pedestal portion 5D, the top plate portion 5T, and the outer peripheral wall portion 5W across the support mechanism 50. In the example shown, the base plate 5B is fixed to the support portion 12 of the platform lifting mechanism TLM (see figure). Figure 1 The platform 5B can support the simultaneous lifting and lowering of part 12 via the TLM lifting mechanism. Specifically, the base plate 5B is as follows: Figure 11 As shown, the metal plate has a roughly rectangular shape when viewed from above, which includes four corners CN (first corner CN1 to fourth corner CN4) and a rectangular opening 5K.

[0053] The side cover 5C of the outer peripheral support member 5 is a portion constituting the side surface of the outer peripheral support member 5. In the example shown in the figure, the side cover 5C is as follows: Figure 9 As shown in the figure above, it is installed on the base plate 5B in a manner that covers the base plate 5B and the support mechanism 50.

[0054] The pedestal portion 5D of the outer peripheral support member 5 functions as a pedestal for the top plate portion 5T of the outer peripheral support member 5, and is supported by a support mechanism 50 fixed to the base plate 5B. In the example shown, the pedestal portion 5D is a metal plate with a circular opening for receiving the platform 2 and a roughly rectangular ring shape when viewed from above.

[0055] The top plate portion 5T of the outer peripheral support member 5 is the part fixed to the upper side of the pedestal portion 5D. In the example shown, the top plate portion 5T, like the pedestal portion 5D, is a metal plate with a circular opening for receiving the platform 2 and a roughly rectangular ring shape when viewed from above.

[0056] The outer peripheral wall portion 5W of the outer peripheral support member 5 is part of the exhaust passage 13. In the example shown, the outer peripheral wall portion 5W is a box-shaped metal member without a lid, having an octagonal bottom wall and octagonal cylindrical side walls when viewed from above. The octagonal cylindrical side walls are constructed to connect four pipes 13D (pipe 13D1 to pipe 4 13D4). Furthermore, the octagonal cylindrical side walls are constructed such that their upper ends are fixed to the base portion 5D.

[0057] Thus, the outer peripheral support member 5 is configured such that it can be raised and lowered relative to the base plate 5B via the support mechanism 50, the pedestal portion 5D, the top plate portion 5T, and the outer peripheral wall portion 5W. Specifically, in the base plate 5B, Figure 10 As shown, a bearing 53 is fixed to a support mechanism 50. In the example shown, the bearing 53 is a ball bearing, with the inner wheel fixed to a nut 52 and the outer wheel fixed to a base plate 5B.

[0058] In addition, in the pedestal part 5D, Figure 10 As shown, the nut 51 of the support mechanism 50 is fixed by bolt BT. In the example shown, the nut 51 is a trapezoidal nut, which, together with the nut 52, which is also a trapezoidal nut, constitutes the height adjustment mechanism HAM. The height adjustment mechanism HAM is configured such that when the nut 52 rotates around the rotation axis AX, the nut 51 moves upward (to the Z1 side), and when the nut 52 rotates around the rotation axis AX in the other direction, the nut 51 moves downward (to the Z2 side).

[0059] In the example diagram, support organization 50 is... Figure 9 As shown in the figure below, it includes the left front support mechanism 50LF fixed to the first corner CN1 of the base plate 5B, the right front support mechanism 50RF fixed to the second corner CN2 of the base plate 5B, the right rear support mechanism 50RB fixed to the third corner CN3 of the base plate 5B, and the fourth corner CN4 of the base plate 5B. Figure 9 Since it is not visible in the image below, please refer to... Figure 11 The 50LB left rear support mechanism is fixed to the left rear side. Figure 9 (Not visible in the middle).

[0060] Specifically, Figure 11 As shown, the left front support mechanism 50LF is configured to allow the nut 52 to rotate around the first rotation axis AX1, the right front support mechanism 50RF is configured to allow the nut 52 to rotate around the second rotation axis AX2, the right rear support mechanism 50RB is configured to allow the nut 52 to rotate around the third rotation axis AX3, and the left rear support mechanism 50LB is configured to allow the nut 52 to rotate around the fourth rotation axis AX4.

[0061] Furthermore, in the example diagram, the first rotation axis AX1 to the fourth rotation axis AX4 are respectively as shown in the diagram. Figure 11 As shown, the distances DS from the central axis CA passing through the center of stage 2 are all equal. Furthermore, the angles (central angles) between the line segments connecting the central axis CA and the respective line segments of the first rotation axis AX1 to the fourth rotation axis AX4 are all equal angles θ (90 degrees).

[0062] An operator adjusting the height of the outer peripheral support member 5 can, for example, manually rotate the nut 52 of the height adjustment mechanism HAM in each of the left front support mechanism 50LF, right front support mechanism 50RF, left rear support mechanism 50LB, and right rear support mechanism 50RB, thereby enabling individual adjustment. Figure 9 The heights of the four corners 5N (first corner 5N1 to fourth corner 5N4) of the top plate portion 5T of the outer peripheral support member 5 as shown in the figure above.

[0063] The lifting mechanism LM is configured to raise and lower the outer peripheral support member 5 using the height adjustment mechanism HAM of the support mechanism 50. Specifically, as described above, the lifting mechanism LM includes a mounting plate 34, a rotating motor 35, a conveyor belt 36, a drive pulley 37, a tension pulley 38, and a driven pulley 39. The driven pulley 39 includes a left front driven pulley 39LF, a right front driven pulley 39RF, a left rear driven pulley 39LB, and a right rear driven pulley 39RB. The left front driven pulley 39LF, right front driven pulley 39RF, left rear driven pulley 39LB, and right rear driven pulley 39RB have the same structure (same shape and same size). The tension pulley 38 includes a left tension pulley 38L disposed between the drive pulley 37 and the left front driven pulley 39LF, and a right tension pulley 38R disposed between the drive pulley 37 and the right front driven pulley 39RF. The left tension pulley 38L and the right tension pulley 38R have the same structure (same shape and same size).

[0064] In the example diagram, the mounting plate 34 of the lifting mechanism LM is a metal plate on which a rotary motor 35 is mounted, driving pulley 37 and tension pulley 38, and connected by bracket 34a (see reference). Figure 10The base plate 5B is fixed to the outer peripheral support member 5. The rotary motor 35, a drive unit for rotating the drive pulley 37, is mounted below the mounting plate 34. The conveyor belt 36 transmits the rotational force of the drive pulley 37 to the driven pulley 39. The drive pulley 37 is a member that rotates the driven pulley 39 via the conveyor belt 36. Tension pulleys 38 (left tension pulley 38L and right tension pulley 38R) are members for adjusting the expansion of the conveyor belt 36. The drive pulley 37, left tension pulley 38L, and right tension pulley 38R are mounted on the top of the mounting plate 34. The driven pulley 39 is a member for transmitting rotational force to the nut 52 of the support mechanism 50.

[0065] In the example shown, the driven pulleys 39 include a left front driven pulley 39LF fixed to a nut 52 of a left front support mechanism 50LF, a right front driven pulley 39RF fixed to a nut 52 of a right front support mechanism 50RF, a left rear driven pulley 39LB fixed to a nut 52 of a left rear support mechanism 50LB, and a right rear driven pulley 39RB fixed to a nut 52 of a right rear support mechanism 50RB. Specifically, the left rear driven pulley 39LB includes a fixing part and a rotating part that rotates relative to the fixing part. The fixing part clamps the spacer 54 and is fixed to the underside of the base plate 5B of the outer peripheral support member 5. The rotating part is fixed to the lower end of the nut 52 in a manner that rotates integrally with the rotating part. The same applies to the left front driven pulley 39LF, the right front driven pulley 39RF, and the right rear driven pulley 39RB.

[0066] With this configuration, the lifting mechanism LM rotates the drive pulley 37 by rotating the motor 35, thereby enabling the four driven pulleys 39 to rotate simultaneously in the same direction at the same rotational speed. That is, the lifting mechanism LM can cause the respective nuts 52 of the four support mechanisms to rotate simultaneously in the same direction at the same rotational speed. Therefore, the lifting mechanism LM can cause the four corner portions 5N (first corner portion 5N1 to fourth corner portion 5N4) of the top plate portion 5T of the outer peripheral support member 5 to rise and fall at the same speed.

[0067] Furthermore, the height adjustment using the first corner 5N1 of the left front support mechanism 50LF is typically performed with the nuts 52 of the other three support mechanisms 50 (excluding the left front support mechanism 50LF) not rotating. This is to prevent the heights of the other corners 5N from changing due to the height adjustment of the first corner 5N1. The height adjustments using the right front support mechanism 50RF, the left rear support mechanism 50LB, and the right rear support mechanism 50RB are performed in the same way. Therefore, in the example shown, the lifting mechanism LM is configured to disengage the conveyor belt 36 from the driven pulley 39. Specifically, the lifting mechanism LM is adjusted using the position adjusting bolt BT2 (see reference...). Figure 9(See the diagram below) to adjust the position of the tension pulley 38, specifically by slowing the expansion of the conveyor belt 36 so that the conveyor belt 36 can be removed from the driven pulley 39.

[0068] With this configuration, for example, when adjusting the height of the first corner 5N1 using the left front support mechanism 50LF, the operator can disengage the left front driven pulley 39LF, which is fixed to the conveyor belt 36 by the nut 52 of the left front support mechanism 50LF. Therefore, without rotating the nuts 52 of the other support mechanisms 50, the operator can rotate only the nut 52 of the left front support mechanism 50LF, adjusting the height of only the first corner 5N1 without changing the height of the other corners 5N. However, the driven pulley 39 can be configured to switch between a state where the nut 52 and the driven pulley 39 can rotate together (a state where they cannot rotate relative to each other) and a state where the nut 52 and the driven pulley 39 can rotate relative to each other. In this case, the operator can rotate the nut 52 of the remaining support mechanism 50 without disengaging the conveyor belt 36 from the driven pulley 39, without rotating the nuts 52 of the three support mechanisms 50.

[0069] With the configuration described above, the support mechanism 50, which includes four height adjustment mechanisms (HAMs), allows the operator to easily adjust the level of the upper part 5a of the outer peripheral support member 5. Furthermore, the rotation axis AX of the height adjustment mechanism (HAM) (nut 52) ​​of the support mechanism 50 functions as a support axis, thus simplifying the structure compared to configurations where a separate support axis is provided for the rotation axis of the height adjustment mechanism.

[0070] Furthermore, the nuts 51 and 52 constituting the height adjustment mechanism HAM have relatively small diameters (e.g., 12 mm), so they can be standard products (commercially available nuts and bolts). Therefore, this configuration has the effect of improving the height adjustment accuracy using the height adjustment mechanism HAM while suppressing the increase in manufacturing cost of the support mechanism 50.

[0071] In addition, in the above embodiments, the height adjustment mechanism HAM uses a combination of trapezoidal nuts and trapezoidal nuts, but other mechanisms such as ball nuts can be used.

[0072] Furthermore, with the configuration described above, the lifting mechanism LM, for example, has the effect of allowing the operator to raise or lower the outer peripheral support member 5 by utilizing the support mechanism 50 which includes four height adjustment mechanisms HAM.

[0073] Furthermore, in the above-described embodiments, the lifting mechanism LM is configured such that four height adjustment mechanisms HAM can be operated simultaneously using a single rotary motor 35, or it can be configured such that four height adjustment mechanisms HAM can be operated separately using four rotary motors. In this case, the conveyor belt 36, drive pulley 37, tension pulley 38, and driven pulley 39 can be omitted.

[0074] Furthermore, in the above embodiment, the lifting mechanism LM is configured to actuate the height adjustment mechanism HAM using the driven pulley 39, thereby enabling the outer peripheral support member 5 to be raised or lowered. Therefore, this configuration allows the operator to easily change the lifting resolution of the outer peripheral support member 5. This is because the lifting resolution can be changed by altering the number of teeth on the driven pulley 39.

[0075] Next, refer to Figure 12 This illustrates an example of the shape and size of the top plate portion 5T of the outer peripheral support member 5 in a top view. Figure 12 This is a top view of the semiconductor chip W mounted on platform 2 and the top plate 5T of the outer peripheral support member 5. Additionally, Figure 12 In the image, for clarity, a dotted pattern is applied to the surface of the semiconductor chip W. Furthermore, Figure 12 In the top view, the size of the push roller 20 is represented by dotted lines, and the contact area CZ (contact area) between the push roller 20, the semiconductor chip W, and the top plate 5T is covered with a cross-linking pattern. Furthermore, in the example shown, the push roller 20 is configured to be movable along the X-axis while rotating.

[0076] In the example shown, the top plate portion 5T has a roughly rectangular shape when viewed from above, and its width W1 along the direction of the rotation axis (Y-axis) of the push roller 20 is smaller than the width W2 of the push roller 20. However, the width W1 of the top plate portion 5T can be larger than the width W2 of the push roller 20, or it can be the same as the width W2 of the push roller 20.

[0077] Regardless of the position of the push roller 20 in the X-axis direction, this configuration has the effect of maintaining a constant total contact area, which is the sum of the contact area between the semiconductor chip W and the push roller 20 (first contact area) and the contact area between the top plate portion 5T and the push roller 20 (second contact area). This means that if the pushing force of the push roller 20 is constant, then regardless of the position of the push roller 20 in the X-axis direction, the pushing force per unit contact area within the first contact area can be constant. Therefore, this configuration can uniformly adhere a photoresist film 6 or the like to the semiconductor chip W mounted on the stage 2.

[0078] Furthermore, in the example shown, the top plate portion 5T is configured in a shape that is linearly symmetrical with respect to the dashed line L2 parallel to the X-axis passing through the central axis CA. This configuration, regardless of the position of the push roller 20 in the X-axis direction, achieves the effect of having the same size for a portion of the first contact area (first left-side contact area) located on one side (Y1 side, left side) of the second contact area and the remaining portion of the first contact area (first right-side contact area) located on the other side (Y2 side, right side) of the second contact area. This means that unevenness in the Y-axis direction caused by the pushing force from the push roller 20 can be suppressed. Therefore, this configuration enables the uniform adhesion of a photoresist film 6, etc., to the semiconductor chip W mounted on the stage 2.

[0079] Furthermore, the film bonding device 1 has a roughly rectangular shape when viewed from above the top plate portion 5T. Therefore, compared to the case where the top plate portion has a circular shape when viewed from above, it has the effect of achieving four-point support for the support mechanism 50 while reducing the size of the upper part 5a of the top plate portion 5T. However, the top plate portion 5T can be configured to have a shape other than a roughly rectangular shape when viewed from above (e.g., a circular, hexagonal, or octagonal shape).

[0080] Next, refer to Figure 13 and Figure 14 This section describes the details of the cutting unit 19. Figure 13 This is a perspective view showing an example of the configuration of the cutting unit 19 arranged above the platform 2 and the outer peripheral support member 5. Specifically, Figure 13 The left image is a perspective view of platform 2, outer peripheral support component 5, cutting unit 19, lifting support mechanism 25, and platform lifting mechanism TLM, viewed from a right-side upper angle. Figure 13 The right figure is a perspective view of the platform 2, the outer peripheral support member 5, the cutting unit 19, the lifting support mechanism 25, and the platform lifting mechanism TLM, viewed from the upper left. Figure 14 for Figure 13 The three-view view (top view, rear view, and right side view) of the cut-off unit 19. Additionally, Figure 13 and Figure 14 In order to clarify, the flat components of the support plate 19B, etc., are decorated with dotted patterns.

[0081] Specifically, the cutting unit 19 is composed of a support plate 19B, a first linear motion device 19X, a second linear motion device 19Y, and a laser unit 19L.

[0082] Support plate 19B is a component that supports the various components constituting the cutting unit 19. In the example shown, support plate 19B is a flat plate-shaped component formed of metal, including a first support plate 19B1, a second support plate 19B2, and a third support plate 19B3. The first support plate 19B1 is a component that supports the entire cutting unit 19 and is configured to extend parallel to the XZ plane. The second support plate 19B2 is a component on which the first linear actuator 19X is mounted, and extends parallel to the XY plane. Figure 14 As shown in the rear view, it is mounted on the left side (Y1 side) of the first support plate 19B1 via the first bracket BR1. The third support plate 19B3 is a component on which the second linear actuator 19Y is mounted, extending parallel to the XY plane, and Figure 14 As shown in the rear view, the first guide block 19XG is installed on the movable part of the first direct drive device 19X.

[0083] The first linear actuator 19X is a device for moving a movable part along the X-axis. In the example shown, the first linear actuator 19X is an electric linear actuator, comprising a first guide block 19XG as the movable part and a first guide rail 19XR as the fixed part. The second linear actuator 19Y is a device for moving a movable part along the Y-axis. In the example shown, the second linear actuator 19Y is an electric linear actuator, comprising a second guide block 19YG as the movable part and a second guide rail 19YR as the fixed part. The second guide rail 19YR is as follows... Figure 14 As shown in the right-side view, it is fixed to the third support plate 19B3 by the second bracket BR2. The first direct-acting device 19X and the second direct-acting device 19Y are configured to operate according to commands from the control unit 40.

[0084] The laser unit 19L is a device for outputting laser light to the membrane. In the example shown, the laser unit 19L is configured such that it can move parallel to the X-axis via the first linear motion device 19X, and can move parallel to the Y-axis via the second linear motion device 19Y. That is, the laser unit 19L is configured to be able to move parallel to the XY plane above the stage 2 and the outer peripheral support member 5.

[0085] Here, refer to Figure 15 and Figure 16 This section details the laser unit 19L. Figure 15 A perspective view showing an example of the configuration of the laser unit 19L. Figure 16 To include Figure 15 The image shows the cross-section of laser unit 19L in an imaginary plane parallel to the YZ plane of optical axis OA, as viewed from the X1 side.

[0086] Laser unit 19L Figure 15 and Figure 16As shown, it comprises a support plate 60, a laser source 61, a cooling fan 62, a beam expander 63, a cover 64, a direct motion device 65, a condenser lens 66, a lens column 67, a lens cover 68, and an upper exhaust system EXU.

[0087] The support plate 60 is a component that supports the various components constituting the laser unit 19L. In the example shown, the support plate 60 is a flat plate component made of metal, including a first support plate 60A, a second support plate 60B, a third support plate 60C, and a fourth support plate 60D. The first support plate 60A is a component that supports the laser source 61 and is configured to extend parallel to the YZ plane. The second support plate 60B is a component that mounts a cooling fan 62, extends parallel to the XZ plane, and is mounted perpendicular to the first support plate 60A. The third support plate 60C is a component that mounts a direct-acting device 65, clamps the laser source 61, extends parallel to the XZ plane opposite the cooling fan 62 mounted on the second support plate 60B, and is mounted perpendicular to the first support plate 60A. The fourth support plate 60D is a component on which the upper discharge system EXU is mounted. It is fixed to the movable part 65M of the direct drive device 65 by connecting parts such as bolts, and is configured to extend parallel to the XY plane.

[0088] Laser source 61 is a device that emits laser LS. In the example shown, laser source 61 is configured to emit laser LS (carbon dioxide laser) downward along an optical axis OA extending upward along the Z-axis. Furthermore, laser source 61 is configured to operate according to commands from control unit 40. Additionally, laser LS can be a fiber laser, YAG laser, or ultraviolet laser, or any laser other than carbon dioxide laser. Furthermore, laser source 61 can be configured to change the orientation of laser LS. That is, laser source 61 can be configured to scan the photoresist film 6 using laser LS. Furthermore, laser source 61 can be configured to adjust the intensity of laser LS according to commands from control unit 40.

[0089] The cooling fan 62 is a device for cooling the laser source 61. In the example shown, the cooling fan 62 is an electric fan configured to operate according to instructions from the control unit 40.

[0090] The beam expander 63 is an optical device that amplifies or reduces the beam diameter of the laser LS emitted by the laser source 61. In the example shown, the beam expander 63 is configured to amplify the beam diameter of the laser LS emitted by the laser source 61, such that the amplified laser LS is incident on the focusing lens 66.

[0091] Cover 64 is a component that covers the bundle expander 63. In the example shown, cover 64 is an L-shaped metal plate that is connected to the third support plate 60C by connecting components such as bolts.

[0092] The linear actuator 65 is a device for moving the movable part along the Z-axis. In the example shown, the linear actuator 65 is an electric linear actuator configured to operate according to instructions from the control unit 40. Specifically, the linear actuator 65 is configured to include a fixed part 65F and a movable part 65M, such that the movable part 65M can move up and down relative to the fixed part 65F.

[0093] The focusing lens 66 is an optical component for focusing a laser LS. In the example shown, the focusing lens 66 focuses the laser LS emitted from the laser source 61 by the beam expander 63, which enlarges the beam diameter, and is configured to form a laser spot on the photoresist film 6.

[0094] Lens post 67 is a component used to cooperate with lens cover 68 to hold condenser lens 66. In the example shown, lens post 67 is fixed to top plate component 70 of upper discharge system EXU by adhesive. However, lens post 67 can be fixed to upper discharge system EXU by any other method, such as by connecting connecting parts.

[0095] Lens cap 68 is a component used in conjunction with lens post 67 to hold condenser lens 66. In the example shown, lens cap 68 has an opening for laser LS to pass through and is fixed to the upper side of lens post 67 by a connecting member (not shown).

[0096] The upper discharge system EXU is part of the discharge system EX, which removes unwanted substances such as foreign matter generated during the cutting of the film using the cutting unit 19. In the example shown, the upper discharge system EXU is fixed to the fourth support plate 60D via a connecting member (not shown). Therefore, the control unit 40 can move the upper discharge system EXU up and down by driving the linear actuator 65. Furthermore, since the upper discharge system EXU is fixed with a lens post 67, the control unit 40 can move the condenser lens 66, which is held by the lens post 67, along the optical axis OA. Therefore, the control unit 40 can drive the linear actuator 65 to adjust the distance between the photoresist film 6 and the condenser lens 66, ensuring that the distance matches the focal distance of the condenser lens 66.

[0097] Here, further reference Figure 17 This provides details about the upper discharge system EXU. Figure 17 A perspective view showing an example of the configuration of the upper discharge system EXU.

[0098] Upper discharge system EXU Figure 17As shown, it includes a top plate member 70, a first side plate member 71, and a bottom plate member 72 (see reference). Figure 16 It is composed of the second side plate component 73, the bend 74, and the straight pipe 75.

[0099] Top slab component 70 forms compartment CM (refer to) Figure 16 The top plate component 70 is a component of the roof. The compartment CM is a space that is confined so that foreign matter generated when the membrane is cut using the cutting unit 19 does not diffuse outside the compartment CM. In the example shown, the top plate component 70 is formed of a metal plate and has a shape that combines a semicircle and a rectangle when viewed from above.

[0100] The first side panel member 71 is a member that forms part of the side wall of the compartment CM. In the example shown, the first side panel member 71 is formed of a metal plate and is configured to bend like the curved portion of the semicircular portion surrounding the top panel member 70 and the short side portion of the rectangular portion.

[0101] Base plate component 72 (refer to) Figure 16 The bottom component 72 is the component that forms the inner bottom surface of the compartment CM. In the example shown, the bottom component 72 is formed of a metal plate and has the same shape and size as the top component 70 when viewed from above.

[0102] The second side panel member 73 is a member that cuts off the remaining portion of the side wall of the compartment CM. In the example shown, the second side panel member 73 is formed of a metal plate and is configured to connect with one of the long sides of the rectangular portion of the top panel member 70.

[0103] Furthermore, the top plate member 70 has a through hole 70H for the passage of the laser LS. Similarly, the bottom plate member 72 has a through hole 72H for the passage of the laser LS (see reference). Figure 16 Furthermore, a through hole 73H for discharging foreign objects is formed in the second side plate member 73 (see reference). Figure 16 In the example diagram, the diameter of the through hole 70H is smaller than the diameter of the through hole 72H, and smaller than the diameter of the through hole 73H. This is because it inhibits the outward discharge of foreign matter through the through hole 70H.

[0104] The bend 74 is part of an exhaust passage for discharging foreign objects. In the example shown, one end of the bend 74 is connected to the second side plate member 73, and the other end is connected to one end of the straight pipe 75. Specifically, the bend 74 is a 90-degree bend configured such that the opening on one end side (inlet side) faces to the left (Y1 side), and the opening on the other end side (outlet side) faces upward (Z1 side). Alternatively, the bend 74 can be an 80-degree bend or a 100-degree bend, or a bend with a bending angle other than 90 degrees.

[0105] The straight pipe 75 is another part of the exhaust passage for discharging foreign objects. In the example shown, one end of the straight pipe 75 is connected to the other end of the bend 74, and the other end is connected to one end of a flexible pipe (not shown). Additionally, the other end of the pipe is directly or indirectly connected to an exhaust device such as an exhaust fan. Alternatively, the straight pipe 75 can be replaced by a bend, or it can be omitted.

[0106] In the example shown, the upper exhaust system EXU is part of the laser unit 19L, configured to move along the X and Y axes together with the laser source 61, and to move relative to the laser source 61 along the Z axis via the linear motion device 65. However, the upper exhaust system EXU can be provided separately from the laser unit 19L. That is, the upper exhaust system EXU can be provided independently of the other components constituting the laser unit 19L (support plate 60, laser source 61, cooling fan 62, beam expander 63, cover 64, linear motion device 65, condenser lens 66, lens column 67, and lens cover 68), and can be configured to move along the X, Y, and Z axes respectively. In this case, the upper exhaust system EXU can be configured to move along the X and Y axes. That is, the upper exhaust system EXU can be configured not to move along the Z axis.

[0107] Next, refer to Figure 18 This provides details about the lower discharge system EXD. Figure 18 This diagram illustrates an example of the configuration of the lower discharge system EXD. Specifically, Figure 18 The image above is a top view of the semiconductor chip W mounted on the top of platform 2 and the photoresist film 6 adhered to the top 5a of the outer peripheral support member 5. Additionally, Figure 18 In the image above, for clarity, the photoresist film 6 is patterned with dots. Furthermore, Figure 18 The central and lower diagrams show cross-sectional views of platform 2, outer peripheral support member 5, photoresist film 6, and semiconductor chip W. Specifically, Figure 18 The central image will contain Figure 18 The diagram above shows the cross-section of platform 2, outer peripheral support member 5, photoresist film 6, and semiconductor chip W, viewed from the Y2 side, on an imaginary plane parallel to the XZ plane of line L3. Furthermore, Figure 18 The image below contains Figure 18 The diagram above shows the cross-section of platform 2, outer peripheral support member 5, photoresist film 6, and semiconductor chip W, viewed from the Y2 side, on an imaginary plane parallel to the XZ plane of line L4. Additionally, Figure 18 This indicates the state of the photoresist film 6 before it is cut by the cutting unit 19.

[0108] Specifically, the lower exhaust system EXD comprises an exhaust passage 13 and an exhaust device 14. Furthermore, before the photoresist film 6 is cut by the cutting unit 19, the exhaust passage 13 (pipe 13D and gap 13G) located under the cut-off portion CP of the photoresist film 6 is subjected to air discharge via the exhaust device 14, creating a negative pressure state. This is because the inlet (above the gap 13G) through the photoresist film 6 is blocked. Additionally, the cut-off portion CP of the photoresist film 6 is the portion cut by the cutting unit 19, i.e., the portion where the laser spot LS emitted by the laser unit 19L is positioned.

[0109] Next, refer to Figure 19 This describes the flow of smoke FM discharged to the membrane bonding device 1 through the discharge system EX. Figure 19 This is a cross-sectional view of the photoresist film 6, the semiconductor chip W, and the discharge system EX. Specifically, Figure 19 The image above is a cross-sectional view of the photoresist film 6 immediately after laser LS irradiation, i.e., before the photoresist film 6 is cut, containing […]. Figure 17 The cross section of the upper discharge system EXU is located on the imaginary plane parallel to the YZ plane of point line L5. Figure 19 The image below shows a cross-sectional view of the photoresist film 6 after a portion of the cut-off target area CP has been cut to form a through portion 6C. Figure 19 Corresponding to the above diagram. The through-section 6C is the portion connecting the space located on the upper side of the photoresist film 6 and the space located on the lower side of the photoresist film 6, which is formed by being cut by laser LS. Furthermore, Figure 19 In the diagram, the airflow within the exhaust system EX is indicated by a black arrow.

[0110] Smoke FM is part of the foreign matter generated when the photoresist film 6 is heated by the laser LS emitted by the laser unit 19L. In the example shown, it includes upper smoke FM1 discharged outward through the upper discharge system EXU and lower smoke FM2 discharged outward through the lower discharge system EXD.

[0111] Before the formation of the through section 6C, the smoke FM is as follows Figure 19 As shown in the diagram above, the lower smoke FM2 may not be present. This is because there is no airflow into the exhaust passage 13 from the space located above the photoresist film 6. Therefore, most of the smoke FM (upper smoke FM1) is discharged outward through the upper exhaust system EXU.

[0112] On the other hand, after the formation of the through section 6C, the smoke FM is as follows: Figure 19As shown in the diagram below, it includes the lower smoke FM2. This is because there is an airflow from the space above the photoresist film 6 into the exhaust passage 13. Therefore, a portion of the smoke FM (upper smoke FM1) is discharged outward through the upper exhaust system EXU, and the other portion of the smoke FM (lower smoke FM2) is discharged outward through the lower exhaust system EXD.

[0113] In the example diagram, the exhaust system EX is configured such that the airflow rate discharged through the lower exhaust system EXD is greater than the airflow rate discharged through the upper exhaust system EXU. Therefore, the amount of lower smoke FM2 discharged through the lower exhaust system EXD is greater than the amount of upper smoke FM1 discharged through the upper exhaust system EXU.

[0114] As described above, the semiconductor manufacturing apparatus (film bonding apparatus 1) according to the embodiments of this disclosure is as follows: Figure 1 As shown, the system includes: a platform 2 for placing a semiconductor chip W; a pressing member (pressing roller 20) for pressing the film (photoresist film 6) adhered to the semiconductor chip W placed on the platform 2, which is disposed on the outer periphery of the platform 2; an outer peripheral support member 5 configured such that the pressing member (pressing roller 20) presses the film (photoresist film 6) and is subjected to the pressing force brought by the pressing member (pressing roller 20); and a support mechanism 50 that supports the outer peripheral support member 5 and can adjust the height of each of the at least three positions that are separated from each other in plan view. Figure 1 In the example shown, the support mechanism 50 includes a left front support mechanism 50LF, a right front support mechanism 50RF, a left rear support mechanism 50LB, and a right rear support mechanism 50RB. Furthermore, each of the left front support mechanism 50LF, right front support mechanism 50RF, left rear support mechanism 50LB, and right rear support mechanism 50RB has a height adjustment mechanism HAM. Additionally, in the example shown, the semiconductor manufacturing apparatus is a film bonding device 1, which is an example of a laminate and can be a mounter for bonding a film to a ring. That is, the peripheral support member 5 supported by the support mechanism 50 can be mounted on the mounter as a member for holding the ring. The features shown below are also similar. That is, the features shown below can be mounted on the mounter. Furthermore, the film can be a resin film or a polyimide film, etc., that has thermally adhesive or optically responsive properties.

[0115] With this configuration, the semiconductor manufacturing apparatus has the effect of eliminating the tilt of the upper surface of the peripheral support member 5. Specifically, the semiconductor manufacturing apparatus has the effect of allowing the operator to adjust the levelness of the upper surface 5a of the peripheral support member 5.

[0116] Furthermore, the semiconductor manufacturing apparatus (film bonding apparatus 1) may include a lifting mechanism LM for raising and lowering the outer peripheral support member 5. In the example shown, the lifting mechanism LM is as follows: Figure 10 and Figure 11 As shown, it is configured with a rotary motor 35, a conveyor belt 36, a drive pulley 37, a tension pulley 38, and a driven pulley 39. However, the lifting mechanism LM can be configured with other mechanical elements such as gears, chains, or wires. Furthermore, the lifting mechanism LM can be omitted. In this case, the operator can adjust the level of the upper surface 5a of the outer peripheral support member 5 using the height adjustment mechanism HAM in each of the left front support mechanism 50LF, right front support mechanism 50RF, left rear support mechanism 50LB, and right rear support mechanism 50RB. Furthermore, the operator can raise and lower the platform 2 so that the semiconductor chip W mounted on the platform 2 is aligned with the upper surface 5a of the outer peripheral support member 5.

[0117] In addition, the outer peripheral support component 5, as Figure 9 As shown, it can have a roughly rectangular shape when viewed from above, and be configured to surround the platform 2. In this case, the height adjustment mechanism HAM can be configured to allow individual adjustment of the height of each of the four corners of the outer peripheral support member 5.

[0118] With this configuration, the semiconductor manufacturing apparatus, for example, even when the peripheral support member 5 is supported at four points by the support mechanism 50, has the effect of eliminating the tilt of the upper part of the peripheral support member 5.

[0119] Furthermore, the lifting mechanism LM can be configured to allow the four corners of the outer peripheral support member 5 to rise and fall simultaneously. In the example shown, the lifting mechanism LM is configured to allow the height adjustment mechanisms HAM of the left front support mechanism 50LF, right front support mechanism 50RF, left rear support mechanism 50LB, and right rear support mechanism 50RB to rise and fall simultaneously.

[0120] With this configuration, the semiconductor manufacturing apparatus can raise and lower the peripheral support member 5 while eliminating the tilt of the upper surface of the peripheral support member 5. Specifically, the semiconductor manufacturing apparatus has the effect of maintaining the horizontality of the upper surface 5a of the peripheral support member 5, allowing the operator to raise and lower the peripheral support member 5.

[0121] Furthermore, one example of the film bonding device 1 of the semiconductor manufacturing apparatus according to the embodiments of this disclosure is as follows: Figure 1 As shown, the system includes a platform 2 for mounting a semiconductor chip W, and a cutting unit 19 for cutting the film (photoresist film 6) adhered to the semiconductor chip W mounted on the platform 2 using a laser. Furthermore, the cutting unit 19... Figure 15As shown, it can be configured to include a laser source 61 and a beam expander 63 that amplifies or reduces the beam diameter of the laser LS emitted by the laser source 61. Furthermore, the laser LS can be, for example, a carbon dioxide laser, a fiber laser, a YAG laser, or an ultraviolet laser. Moreover, the beam expander 63 can be a Galilean beam expander or a Keplerian beam expander. Furthermore, the beam expander 63 can be a fixed magnification beam expander or a variable magnification zoom expander.

[0122] With this configuration, the film bonding device 1 can reduce the size (spot diameter) of the laser LS spot formed on the surface of the film during film cutting. Therefore, this configuration improves the quality of the cut end face of the film. Furthermore, improving the quality of the cut end face includes suppressing the generation of flash and other defects, thus preventing deterioration of the cut end face quality. In addition, compared to a configuration with a large spot diameter, this configuration allows for film cutting with a smaller laser output.

[0123] In addition, the membrane bonding device 1, as Figure 1 and Figure 15 As shown, a discharge system EX can be provided that attracts and discharges foreign matter generated when the cutting unit 19 cuts the film (photoresist film 6). In this case, the cutting unit 19 is as follows: Figure 13 As shown, it can be configured to move parallel to the surface of platform 2. That is, the cutting unit 19 can be configured to move parallel to each other along the X and Y axes. Furthermore, the laser source 61... Figure 15 As shown, the optical axis OA, which is perpendicular to the top of stage 2, can be configured to emit laser light LS. Furthermore, the discharge system EX can include an upper discharge system EXU disposed on the upper side of the film (photoresist film 6). Moreover, the upper discharge system EXU can be configured to move integrally with the cutting unit 19.

[0124] With this configuration, the membrane bonding device 1 can make the positional relationship between the membrane, the laser LS, and the upper discharge system EXU the same when the membrane is cut while the cutting unit 19 is moving. Therefore, compared with a configuration where the positional relationship between the membrane, the laser, and the discharge system changes during membrane cutting, this configuration can stably remove the smoke FM generated during membrane cutting, suppress the diffusion of the laser LS utilizing the smoke FM, and thus has the effect of preventing the quality of the cut end face of the membrane from deteriorating.

[0125] In addition, the cutting unit 19, as Figure 18As shown, the semiconductor chip W can be cut by cutting the portion CP of the film (photoresist film 6) to which it is attached, which is the part along the outer edge of the semiconductor chip W. In this case, the exhaust system EX can include a lower exhaust system EXD disposed on the underside of the film (photoresist film 6). Moreover, the lower exhaust system EXD can include an exhaust device 14 (see reference) connected to the exhaust passage 13 (pipe 13D and gap 13G) located under the cut portion CP of the film (photoresist film 6). Figure 1 ).

[0126] Specifically, an annular gap 13G can be formed between platform 2 and outer peripheral support member 5. Moreover, gap 13G can constitute the exhaust passage 13 of lower exhaust system EXD.

[0127] With this configuration, the membrane bonding apparatus 1 can create airflow from the space above the membrane to the space below the membrane when the membrane has the through portion 6C. Therefore, this configuration allows the cut end face of the membrane heated by the laser LS to be cooled by contacting air, thereby improving the quality of the cut end face. Furthermore, this configuration, for example, can introduce the smoke FM generated during membrane cutting into the space below the membrane. Compared to configurations without a lower exhaust system, this can suppress the diffusion of the laser LS utilizing the smoke FM, thereby preventing the quality of the cut end face from deteriorating.

[0128] In addition, the width of the gap 13G is as follows Figure 19 As shown in the figure above, the gap 13G can be configured to increase in stages from the direction of membrane separation (downward). Specifically, the width W3 of the portion close to the membrane can be smaller than the width W4 of the portion farther from the membrane.

[0129] With this configuration, the lower discharge system EXD can increase the airflow rate to the portion near the membrane within the gap 13G compared to the airflow rate to the portion farther from the membrane. Therefore, compared to configurations where the width of the gap 13G remains constant in the vertical direction, or where it decreases in the direction away from the membrane (downward), this configuration can more efficiently cool the cut end face of the membrane, thereby further improving the quality of the membrane's cut end face. Furthermore, in the illustrated example, the gap 13G is configured to increase in stages in the direction away from the membrane, or it can be configured to increase in an inverted conical shape in the direction away from the membrane.

[0130] Furthermore, the discharge system EX can be configured such that the flow rate of gas discharged through the lower discharge system EXD is greater than the flow rate of gas discharged through the upper discharge system EXU.

[0131] With this configuration, the film bonding device 1 is as follows: Figure 19 As shown in the figure below, the amount of lower smoke FM2 discharged outward through the lower exhaust system EXD is greater than the amount of upper smoke FM1 discharged outward through the upper exhaust system EXU. Therefore, the amount of upper smoke FM1 in the space above the membrane can be reduced, suppressing the diffusion of laser LS caused by the upper smoke FM1, and thus preventing the quality of the membrane's cut end face from deteriorating. Furthermore, this configuration prevents the membrane's cut end face from facing upward, thus preventing the upward-facing cut end face from hindering the subsequent cutting of the target portion CP caused by the laser LS. This is because the membrane's cut end face is introduced downward due to the air flowing below. Therefore, it further improves the quality of the cut end face of the membrane.

[0132] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above embodiments. The above embodiments can be adapted to various modifications and substitutions without departing from the scope of the present invention. Furthermore, the features described with reference to the above embodiments can be appropriately combined as long as they are not technically contradictory.

[0133] This application claims priority based on Japanese Patent Application No. 2023-141613, filed on August 31, 2023, the entire contents of which are incorporated herein by reference.

[0134] Symbol Explanation 1. Membrane bonding device 2 units 2G slot 3. Membrane Supply Section 4. Winding section 5. Outer peripheral support components 5a above 5B base plate 5C side cover 5D pedestal part 5K opening 5N corner 5N1 First corner 5N2, second corner 5N3 Third corner 5N4 4th corner 5P Connector Board 5T Top Plate Section 5W peripheral wall 6 Photoresist film 6C Through Section 7. Carrier membrane 8. Reinforced membrane 9 clamping rollers 10 Sliding rod 11 base plate 12 Support Department 13 Exhaust passage 13D tube 13D1 Tube 1 13D2, tube number 2 13D3, third tube 13D4, fourth tube 13G gap 14 Exhaust device 15 Sliding shaft 16 First moving unit 17. Second moving unit 18 Third moving unit 19 Cut-off Unit 19B Support Board 19B1 First Support Board 19B2 Second Support Board 19B3 Third Support Board 19L laser unit 19X First Direct-Acting Device 19XG Boot Block 1 19XR Rail 1 19Y Second Direct-Action Device 19YG Second Boot Block 19YR 2nd Rail 20 push rollers 21. Pushing force adjustment mechanism 22 Pushing cylinder 22a Piston Rod 25 Lifting Support Mechanism 34 mounting pieces 34a bracket 35 Rotary electric motor 36 Conveyor Belts 37 Drive pulley 38 Tension pulley 38L Left side tension pulley 38R Right side tension pulley 39 Driven pulley 39LB Left Rear Driven Pulley 39LF Left Front Driven Pulley 39RB Right Rear Driven Pulley 39RF Right Front Driven Pulley 40 Control Department 41 Input Section 42. Height and Horizontal Storage Section 43. Push Pattern Storage Unit 50 Supporting Organizations 50LB Left Rear Side Support 50LF left anterior support mechanism 50RB right rear support mechanism 50RF right front support mechanism 51 Nut 52 Nuts 53 bearings 54. Isolation materials 60 Support Board 60A 1st support board 60B Second Support Board 60C Third Support Board 60D 4th Support Board 61 Laser source 62 Cooling Fan 63-beam expander 64 covers 65. Direct-acting device 65F Fixing Part 65M movable part 66 Condensing Lens 67 Lens column 68 Lens Cover 70 Top slab components 70H Through Hole 71 First side plate member 72. Base Plate Components 72H Through Hole 73 Second side plate component 73H Through Hole 74 bends 75 straight pipe 80 Hollow Structure 81 Wall section 82 Roof section AX Rotary Axis AX1 First Rotational Axis AX2 Second Rotational Axis AX3 Third Rotational Axis AX4 4th Rotation Axis BR1 First Stent BR2 second support BT bolts BT2 Position Adjustment Bolt CA central axis CF Central Division CM compartment CN corner CN1 First Corner CN2 2nd corner CN3 Third corner CN4 4th corner CP cut-off target part CZ range F2 double membrane EX Discharge System EXD Lower Exhaust System EXU Upper Exhaust System F3 Tri-layer Film FM cigarettes FM1 upper smoke FM2 lower smoke HAM Height Adjustment Mechanism LM lifting mechanism LS laser OA optical axis TLM platform lifting mechanism W Semiconductor Chip

Claims

1. A semiconductor manufacturing apparatus comprising: A platform containing semiconductor chips, and A film cutting mechanism that uses a laser to cut the film attached to the semiconductor chip placed on the stage. The membrane cutting mechanism is configured to include a laser source and a beam expander that amplifies or reduces the beam diameter of the laser emitted by the laser source.

2. The semiconductor manufacturing apparatus according to claim 1, comprising: A discharge system that draws in and removes foreign matter generated when the membrane is cut by the membrane cutting mechanism. The membrane cutting mechanism is configured to move parallel to the surface of the stage. The discharge system includes an upper discharge system disposed on the upper side of the membrane. The upper discharge system is configured to move integrally with the membrane cutting mechanism.

3. The semiconductor manufacturing apparatus according to claim 2, The film cutting mechanism is configured to cut a portion that is part of the film to which the semiconductor chip is attached, specifically the portion along the outer edge of the semiconductor chip. The discharge system includes a lower discharge system disposed on the lower side of the membrane. The lower discharge system includes an exhaust device connected to an exhaust passage located below the cut-off portion of the membrane.

4. The semiconductor manufacturing apparatus according to claim 3, further comprising: A pressing member for pressing the film attached to the semiconductor chip placed on the stage; and An outer peripheral support member is disposed on the outer periphery of the platform and configured to receive the pushing force from the pushing member when the membrane is pressed by the pushing member. An annular gap is formed between the platform and the outer peripheral support member. The gap forms the exhaust passage of the lower exhaust system.

5. The semiconductor manufacturing apparatus according to claim 3, The flow rate of gas discharged through the lower discharge system is greater than the flow rate of gas discharged through the upper discharge system.

6. A film cutting mechanism, which uses a laser to cut the film attached to a semiconductor chip placed on a stage. It is configured to include a laser source and a beam expander that amplifies or reduces the beam diameter of the laser emitted by the laser source.

Images