Tool clamp structure suitable for mother-son ring wafer

Abstract

The invention relates to the technical field of wafer inspection and production, and discloses a work fixture structure suitable for a child-mother ring wafer, and the structure comprises a boss which is disposed on the front surface of a fixture main body, is internally provided with a porous structure, and is used for fixing a child-mother ring through vacuum adsorption; and the sealing structure is arranged on the reverse side of the clamp body, is matched with the ceramic platform of the AOI and NG dotting equipment and is used for connecting the clamp with the ceramic platform in a sealing manner. According to the invention, a fixing clamp with the same appearance as 8-inch and 12-inch Wafer Frames is designed, a boss and a boss air hole are designed and manufactured, primary position positioning is carried out on a child-mother ring wafer on the boss of the clamp, a vacuum hole structure is manufactured on the boss of the clamp, and flatness control can be carried out through vacuum adsorption after the clamp is placed on a production machine table. Full-automatic wafer front AOI detection and full-automatic bad flat NG after AOI can be achieved through the tool, and the follow-up wafer picking production efficiency and the product reliability are improved.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection and production technology, and specifically to a tooling fixture structure applicable to mother-daughter ring wafers. Background Technology

[0002] In the field of wafer picking and processing technology, to meet the requirements for storage and transportation after wafer dicing, wafers are typically secured using mother-daughter rings after dicing. However, the standard fixtures used in conventional wafer production are 8-inch or 12-inch wafer frames, which are incompatible with the mother-daughter rings. Custom fixtures are required for semi-automatic operations. To address the requirements of positioning accuracy, consistency, and production efficiency in the mother-daughter ring fixture after wafer dicing, and to solve the problems of large manual operation errors, low product yield, and poor adaptability in traditional semi-automatic methods, adapting the mother-daughter ring fixture fixture structure to achieve the required alignment accuracy and versatility directly determines the production efficiency and yield of wafer picking and inspection.

[0003] As chips become increasingly miniaturized and demanding, the wafer picking and inspection process requires precise positioning of the mother and daughter ring wafers within the fixture, with tolerances controlled within the 0.01~0.1mm range. Traditional manual positioning or simple fixtures struggle to meet these precision requirements, significantly reducing production yield and introducing reliability risks. Furthermore, traditional fixtures suffer from poor adaptability; a single fixture can only be used for a single product model, leading to cumbersome operation, low efficiency, and inconsistent manual fixture installation. Additionally, due to differences in molding processes, packaging methods, and substrate characteristics, traditional fixtures cannot meet the product's requirements for high-temperature resistance, pressure stability, and anti-stick properties.

[0004] To achieve both versatility and alignment accuracy in the mother-daughter ring wafer design, a universal tooling fixture is used for positioning and clamping, improving reliability and production efficiency. This invention addresses the versatility and alignment accuracy requirements of subsequent manufacturing processes for the mother-daughter ring wafer, designing a positioning and fixing structure. By using tooling to achieve both versatility and alignment accuracy, this invention provides a tooling fixture structure that improves the versatility and alignment accuracy of the mother-daughter ring wafer. Summary of the Invention

[0005] To address the aforementioned technical shortcomings, the present invention aims to provide a tooling fixture structure suitable for mother-daughter ring wafers. This structure enhances the versatility of the fixture through its positioning and fixing design, ensures the flatness of the mother-daughter ring wafers through positioning and fixture fixing, and achieves tooling versatility by reducing the need for tooling changes during production, thereby improving production efficiency.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: The present invention provides a tooling fixture structure suitable for mother-daughter ring wafers, comprising: The beneficial effects of this invention are as follows: 1. This invention differs from existing tooling technology structures by designing a bottom sealing structure to achieve sealed contact between the fixture and the ceramic platform of AOI equipment and NG dotting equipment, effectively creating a universal tooling fixture.

[0007] 2. The structural material of this invention uses antistatic materials, which can effectively control the precision protection of the chip and greatly improve the reliability of the product.

[0008] 3. The tooling mechanism prepared by the present invention can be used with ceramic discs of various types of AOI and NG dotting equipment, can achieve multi-equipment compatibility, can reduce the number of tooling changes in production, and improve production efficiency. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Fig. 1 This is a front view of a tooling fixture structure applicable to mother-daughter ring wafers provided in an embodiment of the present invention.

[0011] Fig. 2 This is a reverse structural diagram of a tooling fixture structure applicable to mother-daughter ring wafers provided in an embodiment of the present invention.

[0012] Fig. 3 This is a schematic diagram of the structure of the mother and daughter rings and the clamps placed on the work platform according to an embodiment of the present invention.

[0013] Explanation of reference numerals in the attached diagram: 1. Breast ring, 2. Boss, 3. Sealing ring, 4. Clamp, 5. Ceramic platform, 6. Base. Detailed Implementation

[0014] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0015] like Figs. 1-3 As shown, this embodiment provides a tooling fixture structure suitable for mother-daughter ring wafers, including: as follows Fig. 1As shown, the front structure of the fixture adopts a boss design. The boss 2 can perfectly match the female and male rings 1. After the female and male rings 1 are installed on the fixture, it can directly realize fully automatic production of various types of AOI and NG dotting equipment, which improves the production efficiency of the whole process. The fixture is made of anti-static material, which can effectively control the electrostatic protection of the chip and greatly improve the reliability of the product.

[0016] like Fig. 2 As shown, a main vacuum adsorption cavity is formed on the back of the fixture body through precision machining. The bearing contact surface of this cavity undergoes strict ultra-precision grinding to obtain extremely high flatness and surface smoothness. This is intended to achieve macroscopic large-area fit with the smooth surface of the ceramic platform, forming a preliminary airtight foundation and effectively dispersing adsorption stress. Around the periphery of the main vacuum cavity, a sealing cavity is made and filled with special rubber material to form a sealing ring 3. Specifically, the sealing cavity is used as a filling chamber for special functional rubber material. The injected and cured rubber body is integrated with the cavity structure to form an embedded, maintainable static sealing ring, thereby avoiding the grooves required for traditional sealing ring installation and the possible rolling and twisting problems.

[0017] Specifically, when the fixture is placed on the ceramic platform by its own weight, the sealing ring is compressed in a controllable manner in the vertical direction, undergoing elastic deformation. This immediately establishes the first reliable airtight boundary between the fixture and the platform. This pre-tightening force is sufficient to resist disturbances in the conventional processing environment before vacuum activation. When process units such as AOI (Automated Optical Inspection) equipment or NG (Not Good) marking equipment issue instructions, the central vacuum system is activated, and a negative pressure environment is formed in the main vacuum chamber. This negative pressure not only acts on the adsorption of the workpiece, but also generates an additional force through the pressure difference design between the sealing chamber and the vacuum chamber. This forces the bottom of the sealing ring to undergo further microscopic deformation towards the platform surface, thereby greatly enhancing the contact stress of the sealing interface. This "negative pressure self-tightening effect" achieves a dynamic enhancement of sealing capacity that is positively correlated with the system vacuum level, constituting the second and more core active sealing mechanism of the system.

[0018] like Fig. 3As shown in the schematic diagram, the mother-daughter ring 1 and the fixture are placed on the working platform. When the fixture is placed on the ceramic platform, the AOI and NG marking equipment can perfectly adsorb the fixture through the ceramic platform after opening the vacuum. The vacuum is transferred to the mother-daughter ring 1 through the honeycomb breathable structure inside the boss 2, so that the mother-daughter ring 1 can be flattened and fixed on the boss surface through vacuum adsorption, realizing the horizontality of the chip on the wafer surface, thereby adapting to the AOI and NG marking equipment for fully automatic production. The fixture of this invention works in conjunction with the ceramic vacuum platform with high flatness, high rigidity and internal micro-channels. When the AOI (Automatic Optical Inspection) equipment or NG (Defective Product) marking equipment and other process units issue instructions, the central vacuum system is started. Under the joint protection of the dual sealing mechanism, the system can instantly establish a complete, continuous and extremely stable high vacuum environment between the back of the fixture and the ceramic platform. This environment ensures that the adsorption force acts uniformly and leak-free on the entire bottom surface of the fixture, completely eliminating fixture drift, vibration, or positioning accuracy attenuation caused by local leakage. Ultimately, the system achieves "perfect adsorption" of precision fixtures, providing excellent positioning benchmarks and operational stability for upstream manufacturing and testing processes, significantly improving process capability and product yield. This invention can effectively control chip electrostatic protection while ensuring tooling versatility, greatly improving product reliability.

[0019] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A tooling fixture structure suitable for mother-daughter ring wafers, characterized in that, include: A boss is provided on the front of the fixture body. The boss has a porous structure inside, which is used to fix the mother and daughter rings by vacuum adsorption. A sealing structure is located on the outside of the vacuum cavity on the reverse side of the fixture body, adapted to the ceramic platform of AOI and NG dotting equipment, and is used to seal the connection between the fixture and the ceramic platform.

2. The tooling fixture structure as described in claim 1, characterized in that, The boss is compatible with 8-inch and 12-inch wafer frames.

3. The tooling fixture structure as described in claim 1, characterized in that, The porous structure includes uniformly distributed vacuum pores for transferring vacuum adsorption force to the surface of the mother and daughter rings.

4. The tooling fixture structure as described in claim 1, characterized in that, The sealing structure is made of antistatic material and is located on the reverse side of the fixture body in the area where it contacts the ceramic platform, in order to achieve a sealing effect between the fixture and the platform.

5. The tooling fixture structure as described in claim 1, characterized in that, The fixture body is made of anti-static material and is used for electrostatic protection of the control chip.

6. The tooling fixture structure as described in claim 1, characterized in that, The sealing structure is a sealing ring formed by filling the sealing cavity of the outer ring of the vacuum cavity with a special rubber material.

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