Temperature-resistant insulating mica powder / polypropylene composite film and preparation method thereof
By introducing olefin polymerization catalytic active centers and ultra-high molecular weight polypropylene onto the surface of mica powder, a copolymer shell and viscosity gradient are formed, which solves the insulation and thermal stability problems of polypropylene films under electrothermal fields and improves the insulation and thermal stability of composite films.
Patent Information
- Application Number
- CN202610067468.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-19
- Publication Date
- 2026-04-07
AI Technical Summary
Existing polypropylene films are prone to molecular chain breakage under the combined action of electro-thermal fields, leading to insulation failure. Furthermore, inorganic particle doping can easily form agglomerates, reducing breakdown field strength and thermal stability.
By introducing olefin polymerization catalytic active centers on the surface of mica powder particles to form a propylene/α-olefin copolymer shell, and introducing ultra-high molecular weight polypropylene with molecular weights of 500,000-1.5 million and 2,000,000-4.5 million, a viscosity gradient is constructed to improve interfacial compatibility and molecular entanglement density.
It significantly improves the insulation and thermal stability of the composite film, with a transverse and longitudinal thermal shrinkage rate of 0.98-1.51% and a breakdown strength of 573.28-589.31kV/mm, making it suitable for capacitors, power batteries and high-voltage DC transmission systems.