Metallized ink and preparation method thereof
By using metallized inks containing copper laser sensitizers, and utilizing laser irradiation and electrochemical copper plating technology, the stability and bonding strength problems caused by the oxidation of nano copper powder were solved, achieving high adhesion strength and stable conductive pathways.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-08
- Publication Date
- 2026-04-07
AI Technical Summary
In existing conductive inks, nano-copper powder is easily oxidized, resulting in poor stability and conductivity, and poor bonding strength between the conductive pathway and the substrate.
Metallized inks using copper-containing laser sensitizers as the main raw material decompose the copper-containing laser sensitizers in the ink at high temperatures through laser irradiation to form elemental copper particles, which are then fixed to the substrate surface using an adhesive. Subsequently, electrochemical copper plating is performed to form conductive pathways.
It improves the adhesion strength and stability between the conductive path and the substrate, extends the service life of electronic devices, and maintains excellent conductivity.
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Abstract
Description
Technical Field
[0001] This invention belongs to the field of selective metallization materials technology, specifically relating to a metallized ink and its preparation method. Background Technology
[0002] With the rapid development of the modern printed electronics industry, conductive ink, as an important printing material, is widely used in electronic tags, organic displays, transistor arrays, photovoltaic cells, flexible electronic devices, and other fields. As conductive ink development technology improves, its market application scope continues to expand. In the fields of electronic tags and crystalline silicon solar cells, conductive ink can form conductive lines on insulating substrates through direct printing processes, which are simple, inexpensive, and produce minimal environmental pollution.
[0003] In the field of conductive inks, silver-based conductive inks currently have the highest market share, but using silver as a raw material results in high production costs. Nano-metal conductive inks, due to their combination of nanomaterial properties, are increasingly widely used in the industry. Nano-copper is the second most widely used raw material after nano-silver, but because nano-copper powder is easily oxidized and has poor stability, the stability and conductivity of conductive inks are not good. Moreover, currently, directly printing inks containing nano-copper powder onto the surface of materials to form conductive pathways results in poor bonding strength between the conductive pathways and the substrate. Summary of the Invention
[0004] To address the aforementioned shortcomings in the prior art, this invention provides a metallized ink and its preparation method. The conductive pathways prepared using this ink exhibit strong adhesive strength and high peel strength, which can improve the service life of electronic devices. Furthermore, the ink possesses strong stability, effectively solving the problem of poor stability in prior art inks.
[0005] To achieve the above objectives, the technical solution adopted by the present invention to solve its technical problem is as follows:
[0006] A selective metallization ink comprises the following components in parts by weight: 30-60 parts of copper-containing laser sensitizer, 5-24 parts of thickener, 3-15 parts of binder, 20-30 parts of dispersant, and 3-15 parts of light absorber.
[0007] Furthermore, the particle size of the copper-containing laser sensitizer is 10-300 nm.
[0008] Furthermore, the copper-containing laser sensitizer includes at least one of basic copper phosphate, basic copper carbonate, copper acetylacetonate, copper oxalate, and copper oxide.
[0009] Furthermore, the thickener includes one of polydimethylsiloxane, polyurea, and polytetrafluoroethylene.
[0010] Furthermore, the adhesives include polyvinyl alcohol, urea-formaldehyde resin, phenolic resin, cellulose acetate, cellulose nitrate, chloroprene rubber, nitrile rubber, polyacrylate, natural latex, and low-melting-point glass powder.
[0011] Furthermore, the light absorber includes at least one of graphite, carbon black, carbon nanotubes, and graphene.
[0012] Furthermore, the dispersant includes one of sodium oleate, carboxylates, sulfates, sulfonates, quaternary ammonium salts, ethylene glycol, sodium polycarboxylate, acrylates, and polyurethanes.
[0013] Furthermore, the solvent for the metallic ink includes at least one of water, ethanol, methanol, acetone, tetrahydrofuran, dichloromethane, and cyclohexane.
[0014] Furthermore, the viscosity of the metallic ink is 0.5-30 Pa·s.
[0015] The preparation method of the above-mentioned metallic ink includes the following steps: mixing the above-mentioned raw materials, then adding solvent to them and mixing well.
[0016] The beneficial effects of this invention are as follows:
[0017] 1. This invention uses a copper-containing laser sensitizer as the main raw material to prepare an ink. During use, the ink is coated onto the surface of a substrate, and then the ink is irradiated with a laser. The light absorber in the ink absorbs more heat from the laser, causing the internal temperature of the ink to rise rapidly. The copper-containing laser sensitizer in the ink undergoes a decomposition or reduction reaction under high temperature conditions, forming elemental copper particles. An adhesive firmly fixes the formed elemental copper particles to the substrate surface, obtaining an elemental copper seed layer. Then, electrochemical copper plating is performed on the substrate containing the seed layer, forming a continuous elemental copper conductive path on the seed layer, which can be used to prepare electrochemical components. When using materials with weak absorption of infrared fiber lasers, such as glass substrates, the area of the substrate surface not coated with ink has a very low laser absorption rate, which will not damage the properties of the substrate layer itself. When using materials with high absorption, such as silicon, a galvanometer laser flying scan method is used to scan only the printed pattern area; the area not covered by ink will not heat up, and the properties of the substrate will not change. Under the connection effect of the seed layer, the conductive path and the substrate have high adhesion strength, greatly improving the subsequent service life.
[0018] 2. The raw materials used in the metallic ink in this application are not elemental copper, but copper compounds and copper oxides with high stability. The ink in this application is only used to prepare an elemental copper seed layer, and copper is plated on the seed layer to form a copper circuit. Therefore, the stability of the metallic ink in this application will not affect the conductivity of the prepared circuit. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention; that is, the described embodiments are merely some embodiments of the invention, and not all embodiments.
[0020] Therefore, the following detailed description of the embodiments of the present invention is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0021] It should be noted that relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.
[0022] The features and performance of the present invention will be further described in detail below with reference to embodiments.
[0023] Example 1
[0024] A metallized ink comprises the following components in parts by weight: 37 parts of basic copper phosphate with a particle size of 20 nm, 30 parts of sodium polycarboxylate, 20 parts of polydimethylsiloxane, 10 parts of graphite, and 3 parts of low-melting-point glass powder.
[0025] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 10 Pa·s.
[0026] Example 2
[0027] A metallized ink comprises the following components in parts by weight: 35 parts of basic copper phosphate with a particle size of 80 nm, 25 parts of sodium oleate, 22 parts of polyurea, 13 parts of graphite, and 5 parts of low-melting-point glass powder.
[0028] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 12 Pa·s.
[0029] Example 3
[0030] A metallized ink comprises the following components in parts by weight: 33 parts of basic copper phosphate with a particle size of 150 nm, 21 parts of sodium sulfonate, 24 parts of polydimethylsiloxane, 15 parts of carbon black, and 7 parts of urea-formaldehyde resin.
[0031] The above-mentioned ink is prepared by adding the above-mentioned materials and ethanol into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 15 Pa·s.
[0032] Example 4
[0033] A metallized ink comprises the following components in parts by weight: 31 parts of basic copper phosphate with a particle size of 250 nm, 30 parts of sodium polycarboxylate, 20 parts of polytetrafluoroethylene, 10 parts of graphite, and 9 parts of low-melting-point glass powder.
[0034] The above-mentioned ink is prepared by adding the above-mentioned materials and ethanol into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 17 Pa·s.
[0035] Example 5
[0036] A metallized ink comprises the following components in parts by weight: 30 parts of basic copper phosphate with a particle size of 300 nm, 25 parts of sodium polycarboxylate, 24 parts of polydimethylsiloxane, 10 parts of graphene, and 11 parts of phenolic resin.
[0037] The preparation method of the above ink is as follows: the above materials and methanol are added to a ball mill for grinding, and then mixed evenly using a three-roll mill to obtain a metallic ink with a viscosity of 20 Pa·s.
[0038] Example 6
[0039] A metallized ink comprises the following components in parts by weight: 30 parts of basic copper carbonate with a particle size of 100 nm, 25 parts of sodium polycarboxylate, 24 parts of polydimethylsiloxane, 8 parts of graphite, and 13 parts of low-melting-point glass powder.
[0040] The preparation method of the above ink is as follows: the above materials and methanol are added to a ball mill for grinding, and then mixed evenly using a three-roll mill to obtain a metallic ink with a viscosity of 21 Pa·s.
[0041] Example 7
[0042] A metallized ink comprises the following components in parts by weight: 35 parts of basic copper carbonate with a particle size of 200 nm, 20 parts of ethylene glycol, 24 parts of polytetrafluoroethylene, 6 parts of graphite, and 15 parts of low-melting-point glass powder.
[0043] The above-mentioned ink is prepared by adding the above-mentioned materials and acetone into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 25 Pa·s.
[0044] Example 8
[0045] A metallized ink comprises the following components in parts by weight: 40 parts of basic copper carbonate with a particle size of 200 nm, 30 parts of sodium polycarboxylate, 17 parts of polydimethylsiloxane, 3 parts of carbon black, and 10 parts of natural latex.
[0046] The above-mentioned ink is prepared by adding the above-mentioned materials and tetrahydrofuran into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 12 Pa·s.
[0047] Example 9
[0048] A metallized ink comprises the following components in parts by weight: 40 parts of basic copper carbonate with a particle size of 300 nm, 25 parts of sodium polycarboxylate, 15 parts of polydimethylsiloxane, 5 parts of carbon nanotubes, and 15 parts of nitrile rubber.
[0049] The above-mentioned ink is prepared by adding the above-mentioned materials and tetrahydrofuran into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 15 Pa·s.
[0050] Example 10
[0051] A metallized ink comprises the following components in parts by weight: 40 parts of basic copper carbonate with a particle size of 300 nm, 30 parts of polyurethane, 13 parts of polydimethylsiloxane, 7 parts of graphite, and 10 parts of low-melting-point glass powder.
[0052] The above-mentioned ink is prepared by adding the above-mentioned materials and cyclohexane into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 18 Pa·s.
[0053] Example 11
[0054] A metallized ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with a particle size of 50 nm, 30 parts of urea-formaldehyde resin, 11 parts of polydimethylsiloxane, 9 parts of carbon black, and 10 parts of low-melting-point glass powder.
[0055] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 16 Pa·s.
[0056] Example 12
[0057] A metallized ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with a particle size of 120 nm, 30 parts of sodium polycarboxylate, 9 parts of polydimethylsiloxane, 11 parts of graphite, and 10 parts of low-melting-point glass powder.
[0058] The preparation method is as follows: the above materials and water are added to a ball mill for grinding, and then mixed evenly using a three-roll mill to obtain a metallic ink with a viscosity of 16 Pa·s.
[0059] Example 13
[0060] A metallized ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with a particle size of 180 nm, 25 parts of sodium polycarboxylate, 7 parts of polydimethylsiloxane, 13 parts of carbon black, and 10 parts of low-melting-point glass powder.
[0061] The above-mentioned ink is prepared by adding the above-mentioned materials and ethanol into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 17 Pa·s.
[0062] Example 14
[0063] A metallized ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with a particle size of 240 nm, 30 parts of sodium polycarboxylate, 5 parts of polyurea, 15 parts of graphite, and 10 parts of chloroprene rubber.
[0064] The above-mentioned ink is prepared by adding the above-mentioned materials and methanol into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 16 Pa·s.
[0065] Example 15
[0066] A metallized ink comprises the following components in parts by weight: 50 parts of copper acetylacetonate with a particle size of 280 nm, 20 parts of sodium polycarboxylate, 17 parts of polydimethylsiloxane, 10 parts of graphite, and 3 parts of low-melting-point glass powder.
[0067] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 8 Pa·s.
[0068] Example 16
[0069] A metallized ink comprises the following components in parts by weight: 50 parts of copper oxalate with a particle size of 70 nm, 20 parts of sodium polycarboxylate, 15 parts of polydimethylsiloxane, 10 parts of graphite, and 5 parts of nitrocellulose.
[0070] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 25 Pa·s.
[0071] Example 17
[0072] A metallized ink comprises the following components in parts by weight: 40 parts of copper oxalate with a particle size of 130 nm, 25 parts of sodium polycarboxylate, 13 parts of polydimethylsiloxane, 15 parts of graphite, and 7 parts of low-melting-point glass powder.
[0073] The above-mentioned ink is prepared by adding the above-mentioned materials and ethanol into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 12 Pa·s.
[0074] Example 18
[0075] A metallized ink comprises the following components in parts by weight: 50 parts of copper oxalate with a particle size of 220 nm, 20 parts of sodium polycarboxylate, 11 parts of polytetrafluoroethylene, 10 parts of graphite, and 9 parts of low-melting-point glass powder.
[0076] The above-mentioned ink is prepared by adding the above-mentioned materials and ethanol into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 14 Pa·s.
[0077] Example 19
[0078] A metallized ink comprises the following components in parts by weight: 45 parts of copper oxalate with a particle size of 280 nm, 20 parts of sodium carboxylate, 9 parts of polydimethylsiloxane, 15 parts of graphite, and 11 parts of low-melting-point glass powder.
[0079] The above-mentioned ink is prepared by adding the above-mentioned materials and methanol into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 13 Pa·s.
[0080] Example 20
[0081] A metallized ink comprises the following components in parts by weight: 50 parts of copper oxalate with a particle size of 300 nm, 20 parts of sodium polycarboxylate, 7 parts of polydimethylsiloxane, 10 parts of carbon black, and 13 parts of low-melting-point glass powder.
[0082] The above-mentioned ink is prepared by adding the above-mentioned materials and acetone into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 18 Pa·s.
[0083] Example 21
[0084] A metallized ink comprises the following components in parts by weight: 50 parts of copper oxide with a particle size of 100 nm, 20 parts of sodium polycarboxylate, 5 parts of polydimethylsiloxane, 10 parts of graphite, and 15 parts of low-melting-point glass powder.
[0085] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 22 Pa·s.
[0086] Example 22
[0087] A metallized ink comprises the following components in parts by weight: 60 parts of copper oxide with a particle size of 150 nm, 20 parts of sodium polycarboxylate, 12 parts of polyurea, 5 parts of graphite, and 3 parts of low-melting-point glass powder.
[0088] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 9 Pa·s.
[0089] Example 23
[0090] A metallized ink comprises the following components in parts by weight: 40 parts of copper oxide with a particle size of 200 nm, 30 parts of sodium polycarboxylate, 15 parts of polydimethylsiloxane, 10 parts of carbon nanotubes, and 5 parts of low-melting-point glass powder.
[0091] The above-mentioned ink is prepared by adding the above-mentioned materials and methanol into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 9 Pa·s.
[0092] Example 24
[0093] A metallized ink comprises the following components in parts by weight: 60 parts of copper oxide with a particle size of 250 nm, 20 parts of sodium polycarboxylate, 8 parts of polydimethylsiloxane, 5 parts of graphite, and 7 parts of cellulose acetate.
[0094] The above-mentioned ink is prepared by adding the above-mentioned materials and ethanol into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 9 Pa·s.
[0095] Example 25
[0096] A metallized ink comprises the following components in parts by weight: 50 parts of copper oxide with a particle size of 300 nm, 20 parts of sodium polycarboxylate, 6 parts of polydimethylsiloxane, 5 parts of graphite, and 9 parts of low-melting-point glass powder.
[0097] The above-mentioned ink is prepared by adding the above-mentioned materials and ethanol into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 12 Pa·s.
[0098] Comparative Example 1
[0099] A metallized ink comprises the following components in parts by weight: 37 parts of basic copper phosphate with a particle size of 20 nm, 30 parts of sodium polycarboxylate, 20 parts of polydimethylsiloxane, and 10 parts of graphite.
[0100] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 10 Pa·s.
[0101] Comparative Example 2
[0102] A metallized ink comprises the following components in parts by weight: 30 parts of basic copper carbonate with a particle size of 100 nm, 25 parts of sodium polycarboxylate, 24 parts of polydimethylsiloxane, and 13 parts of low-melting-point glass powder.
[0103] The preparation method of the above ink is as follows: the above materials and methanol are added to a ball mill for grinding, and then mixed evenly using a three-roll mill to obtain a metallic ink with a viscosity of 21 Pa·s.
[0104] Comparative Example 3
[0105] A metallized ink comprises the following components in parts by weight: 40 parts of copper acetylacetonate with a particle size of 50 nm, 30 parts of urea-formaldehyde resin, and 11 parts of polydimethylsiloxane.
[0106] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 16 Pa·s.
[0107] Comparative Example 4
[0108] A metallized ink comprises the following components in parts by weight: 50 parts of copper oxalate with a particle size of 70 nm, 20 parts of sodium polycarboxylate, 15 parts of polydimethylsiloxane, and 10 parts of graphite.
[0109] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 25 Pa·s.
[0110] Comparative Example 5
[0111] A metallized ink comprises the following components in parts by weight: 50 parts of copper oxide with a particle size of 100 nm, 20 parts of sodium polycarboxylate, 5 parts of polydimethylsiloxane, and 15 parts of low-melting-point glass powder.
[0112] The above-mentioned ink is prepared by adding the above-mentioned materials and water into a ball mill for grinding, and mixing them evenly using a three-roll mill to obtain a metallic ink with a viscosity of 22 Pa·s.
[0113] Experimental Example
[0114] Laser sensitizers were printed onto the surface of a silicon wafer substrate using ink printing to obtain the desired pattern. Then, the substrate was activated by irradiation with an infrared laser source. The laser used was 1064nm wavelength, 10W power, 50kHz frequency, and 5s irradiation time. Finally, copper was electrolessly plated using a well-known electroless plating process to create a 15μm thick copper conductive path. The electroless plating effect was visually evaluated. The thickness of the copper layer was tested according to ASTM B568 (2009). The adhesion between the copper layer and the substrate was evaluated according to ASTM D3359. The peel strength of the electroless copper layer was tested according to IPC-TM-650 2.4.28. The conductivity of the plating layer was tested according to GB / T 351-2019 "Methods for Measurement of Resistivity of Metallic Materials". The test results are shown in Table 1.
[0115] Table 1: Experimental Results
[0116]
[0117]
[0118] The results show that this invention utilizes ink printing to print a composite ink containing a laser sensitizer and low-melting-point glass powder onto a silicon wafer. The printed ink pattern is then activated using a surface laser light source. Finally, the part is placed in a chemical copper plating solution to obtain a conductive metal pattern. The metal pattern prepared by this invention exhibits excellent conductivity, reaching 10⁻⁶. 7 The copper layer thickness reaches over 10 μm (S·m), the adhesion between the metal layer and the silicon material meets ASTM D3359 4B standard, and the peel strength of the coating is greater than 1.0 N / mm, exhibiting high adhesion and high conductivity. Compared with traditional photolithography, ink printing, screen printing, and micro-contact printing, this invention eliminates the need for a mask and combines the advantages of ink printing and laser selective metallization, offering good economic benefits, a simple operation process, and making it highly suitable for industrial production applications.
Claims
1. A metallized ink, characterized in that, It includes the following components in parts by weight: 30-60 parts copper laser sensitizer, 5-24 parts thickener, 3-15 parts binder, 20-30 parts dispersant and 3-15 parts light absorber.
2. The metallized ink as described in claim 1, characterized in that, The copper-containing laser sensitizer has a particle size of 10-300 nm.
3. The metallized ink as described in claim 1, characterized in that, The copper-containing laser sensitizer includes at least one of basic copper phosphate, basic copper carbonate, copper acetylacetonate, copper oxalate, and copper oxide.
4. The metallized ink as described in claim 1, characterized in that, The thickener includes one of polydimethylsiloxane, polyurea, and polytetrafluoroethylene.
5. The metallized ink as described in claim 1, characterized in that, The adhesive includes one of the following: polyvinyl alcohol, urea-formaldehyde resin, phenolic resin, cellulose acetate, cellulose nitrate, chloroprene rubber, nitrile rubber, polyacrylate, natural latex, and low-melting-point glass powder.
6. The metallized ink as described in claim 1, characterized in that, The light absorber includes one of graphite, carbon black, carbon nanotubes, and graphene.
7. The metallized ink as described in claim 1, characterized in that, The dispersant includes one of sodium oleate, carboxylates, sulfates, sulfonates, quaternary ammonium salts, ethylene glycol, sodium polycarboxylate, acrylates, and polyurethanes.
8. The metallized ink as described in claim 1, characterized in that, The solvent for the ink includes at least one of water, ethanol, methanol, acetone, tetrahydrofuran, dichloromethane, and cyclohexane.
9. The metallized ink as described in claim 1, characterized in that, The viscosity of the ink is 0.5-30 Pa·s.
10. The method for preparing the metallized ink according to any one of claims 1-9, characterized in that, The process includes the following steps: mix the above raw materials, then add solvent and mix well.