Method, device and equipment for determining material filling height of pipeline laying cable

Abstract

The invention relates to a method and device for determining the material filling height of a pipeline laying cable, computer equipment, a computer readable storage medium and a computer program product. The method comprises the following steps: constructing an equivalent thermal circuit model of a pipeline laying cable; the pipeline laying cable is filled with a heat conduction material, and the equivalent thermal circuit model is provided with an equivalent thermal circuit model thermal resistor; performing thermal resistance parameter analysis on the equivalent thermal circuit model to obtain a plurality of thermal resistance parameters of the thermal resistance of the equivalent thermal circuit model; constructing a target function based on the equivalent thermal circuit model and the plurality of thermal resistance parameters; and solving the target function by taking the minimization of the total laying cost of the pipeline laying cable as the target, and determining the filling height of the heat conduction material required by the pipeline laying cable to reach the maximum current-carrying capacity under the condition that the working temperature is smaller than the working temperature threshold value and the minimum current-carrying capacity is met. By adopting the method, the optimal improvement scheme of the current-carrying capacity of the cable can be quickly evaluated under the condition of incomplete filling.

Description

Technical Field

[0001] This application relates to the field of computer technology, and in particular to a method, apparatus, computer equipment, computer-readable storage medium, and computer program product for determining the material filling height of a cable laid in a conduit. Background Technology

[0002] With the rapid increase in urban load, power cables are widely used due to their superior characteristics such as high-capacity transmission and strong stability. To address the challenges of cables crossing underground rivers and areas with dense underground pipe networks, duct laying is generally the primary method for power cable installation in practical engineering. Furthermore, to prevent rodent-borne accidents and foreign object blockages, both ends of the ducts are sealed with cement. However, this creates a confined air space within the duct, reducing the cable's heat exchange efficiency, severely limiting its current-carrying capacity, wasting power transmission resources, and potentially leading to serious accidents such as fires, significantly impacting the power transmission network. Therefore, effectively improving cable heat exchange efficiency is an urgent problem to be solved.

[0003] In existing solutions, high thermal conductivity materials with excellent thermal conductivity, fire resistance, and ease of maintenance can be filled inside the pipe to improve cable heat exchange efficiency, and then the improvement in cable current-carrying capacity can be evaluated. However, existing solutions mostly rely on finite element simulation for evaluation, the accuracy of which is significantly affected by mesh generation and the calculation time is long, making it impossible to quickly evaluate the optimal solution for improving cable current-carrying capacity. In addition, existing solutions generally evaluate cable current-carrying capacity based on the assumption that the pipe is completely filled with high thermal conductivity material. Under the condition of complete filling, the current-carrying capacity of the cable in some sections of the pipe may exceed that of other sections, but this will lead to an increase in the engineering cost of high thermal conductivity materials.

[0004] Therefore, existing solutions are limited by the assumption of fully filling with high thermal conductivity materials and are computationally time-consuming, resulting in increased costs and low evaluation efficiency. There is an urgent need for a method that can balance cost and cable current carrying capacity and quickly evaluate the best solution to improve cable current carrying capacity. Summary of the Invention

[0005] Therefore, it is necessary to provide a method, apparatus, computer equipment, computer-readable storage medium, and computer program product for determining the material filling height of duct-laid cables that can balance cost and cable current-carrying capacity and quickly evaluate the optimal solution for improving cable current-carrying capacity, in order to address the above-mentioned technical problems.

[0006] In a first aspect, this application provides a method for determining the material filling height of cables laid in conduits, including:

[0007] Construct an equivalent thermal path model for the cable laid in the duct; the cable laid in the duct is filled with thermally conductive material, and the equivalent thermal path model is equipped with an equivalent thermal path model thermal resistance.

[0008] The thermal resistance parameters of the equivalent thermal circuit model are analyzed to obtain multiple thermal resistance parameters of the equivalent thermal circuit model.

[0009] Based on the equivalent thermal path model and multiple thermal resistance parameters, an objective function is constructed.

[0010] With the goal of minimizing the total laying cost of cables in ducts, the objective function is solved to determine the required filling height of the thermally conductive material to achieve the maximum current carrying capacity of cables in ducts, provided that the operating temperature is below the operating temperature threshold and the minimum current carrying capacity is met.

[0011] In one embodiment, constructing an equivalent thermal path model for the cable laid in a conduit includes:

[0012] Set the equivalent thermal path model parameters and equivalent thermal path model thermal resistance; the equivalent thermal path model parameters include: cable parameters, pipe parameters and thermophysical parameters of the cable laid in the pipe, and the filling height of the thermally conductive material; the cable parameters include the cable diameter; the equivalent thermal path model thermal resistance includes: the equivalent heat transfer thermal resistance between the cable surface and the inner wall of the pipe, the first equivalent thermal resistance of the area covered by the thermally conductive material, and the second equivalent thermal resistance of the area covered by the air inside the pipe;

[0013] For scenarios where the filling height is less than the cable diameter, the first equivalent thermal circuit model is constructed based on the parameters of the equivalent thermal circuit model and the thermal resistance of the equivalent thermal circuit model, taking the parallel result of the first equivalent thermal resistance and the second equivalent thermal resistance as the equivalent heat transfer thermal resistance.

[0014] For scenarios where the filling height is greater than or equal to the cable diameter, a second equivalent thermal circuit model is constructed based on the parameters of the equivalent thermal circuit model and the thermal resistance of the equivalent thermal circuit model, taking the first equivalent thermal resistance as the equivalent heat transfer thermal resistance.

[0015] In one embodiment, the thermal resistance of the equivalent thermal path model is divided into: equivalent heat transfer thermal resistance and multiple general thermal resistances; the thermal resistance parameters include: the equivalent heat transfer thermal resistance parameter of the equivalent heat transfer thermal resistance, and the general thermal resistance parameters of each of the multiple general thermal resistances.

[0016] The equivalent thermal circuit model is analyzed to obtain multiple thermal resistance parameters, including:

[0017] The general thermal resistance parameters of multiple general thermal resistances in the equivalent thermal circuit model are determined by using the cylindrical wall structure thermal resistance calculation method.

[0018] When the equivalent thermal path model is the first equivalent thermal path model, the shape factor method is used to determine the first heat flow from the thermally conductive material covered area to the inner wall of the pipe and the second heat flow from the air covered area to the inner wall of the pipe in the equivalent thermal path model. Based on the first heat flow and the second heat flow, the equivalent heat transfer resistance parameter is determined.

[0019] When the equivalent thermal circuit model is the second equivalent thermal circuit model, the shape factor method is used to determine the first heat flow from the thermally conductive material covering area to the inner wall of the pipe in the equivalent thermal circuit model. Based on the first heat flow, the equivalent heat transfer resistance parameters are determined.

[0020] In one embodiment, an objective function is constructed based on an equivalent thermal path model and multiple thermal resistance parameters, including:

[0021] Based on the equivalent thermal circuit model and multiple thermal resistance parameters, a first function is constructed to calculate the operating temperature of cables laid in ducts, and a second function is constructed to calculate the total laying cost of cables laid in ducts.

[0022] For the second function, set the current carrying capacity constraint for the cable laid in the duct, and the physical size constraint for filling the inside of the cable with heat-conducting material.

[0023] In one embodiment, the equivalent thermal path model parameters include: cable parameters of the cable laid in the duct, duct parameters and thermophysical parameters, and the filling height of the thermally conductive material; the first function is constructed in the following manner:

[0024] Obtain the equivalent thermal circuit model parameters and the equivalent thermal circuit model thermal resistance;

[0025] Based on cable parameters, pipe parameters, thermophysical parameters, and multiple thermal resistance parameters of the equivalent thermal circuit model, a first function is constructed to calculate the operating temperature of cables laid in pipes.

[0026] In one embodiment, the equivalent thermal path model parameters include: cable parameters, pipe parameters, thermophysical parameters, and the filling height of the thermally conductive material; the second function is constructed in the following manner:

[0027] Obtain the equivalent thermal path model parameters, and based on the equivalent thermal path model parameters, determine the cable radius, cable length, filling height of the thermally conductive material, and filling cross-section; the filling cross-section is determined based on the cable length and filling height.

[0028] Obtain the cable cost calculation coefficient, and construct the cable cost calculation function based on the cable cost calculation coefficient, cable radius and cable length;

[0029] Obtain the cost calculation coefficient of the thermal conductive material, and construct the cost calculation function of the thermal conductive material based on the cost calculation coefficient of the thermal conductive material, the filling cross-section and the cable length;

[0030] The second function is obtained by combining the cost calculation function for the combined cable and the cost calculation function for the thermally conductive material.

[0031] Secondly, this application also provides a device for determining the material filling height of cables laid in ducts, comprising:

[0032] The equivalent thermal path model construction module is used to construct the equivalent thermal path model of the cable laid in the pipeline; the cable laid in the pipeline is filled with thermally conductive material, and the equivalent thermal path model is set with the equivalent thermal path model thermal resistance.

[0033] The thermal resistance parameter analysis module is used to analyze the thermal resistance parameters of the equivalent thermal circuit model and obtain multiple thermal resistance parameters of the equivalent thermal circuit model.

[0034] The objective function construction module is used to construct the objective function based on the equivalent thermal circuit model and multiple thermal resistance parameters;

[0035] The fill height optimization solution module is used to solve the objective function with the goal of minimizing the total laying cost of cable in ducts, and to determine the fill height of the thermally conductive material required to achieve the maximum current carrying capacity of the cable in the duct when the operating temperature is below the operating temperature threshold and the minimum current carrying capacity is met.

[0036] Thirdly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the above embodiments.

[0037] Fourthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the above embodiments.

[0038] Fifthly, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the above embodiments.

[0039] The aforementioned method, apparatus, computer equipment, computer-readable storage medium, and computer program product for determining the material filling height of duct-laid cables first construct an equivalent thermal circuit model of the duct-laid cable. The duct-laid cable is filled with thermally conductive material, and the equivalent thermal circuit model is configured with equivalent thermal resistance. Further, the thermal resistance parameters of the equivalent thermal circuit model are analyzed to obtain multiple thermal resistance parameters. Based on the equivalent thermal circuit model and these multiple thermal resistance parameters, an objective function is constructed. Finally, with the goal of minimizing the total laying cost of the duct-laid cable, the objective function is solved to determine the required filling height of the thermally conductive material to achieve the maximum current carrying capacity of the duct-laid cable when the operating temperature is below the operating temperature threshold and the minimum current carrying capacity is met. The entire process does not rely on finite element simulation but quickly evaluates the required filling height by solving the objective function. This allows the thermally conductive material to be filled into the duct-laid cable according to this filling height, minimizing the total laying cost of the duct-laid cable while meeting the minimum current carrying capacity, and achieving the maximum current carrying capacity under normal operating conditions when the operating temperature is below the operating temperature threshold. Therefore, the filling height determined based on the above process is the optimal solution for improving cable current-carrying capacity while balancing cost and cable current-carrying capacity. Thus, based on the above process, the optimal solution for improving cable current-carrying capacity can be quickly evaluated, taking into account both cost and cable current-carrying capacity. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is an application environment diagram of a method for determining the material filling height of cable laying in a conduit, as shown in one embodiment.

[0042] Figure 2 This is a flowchart illustrating a method for determining the material filling height of a cable laid in a conduit, as shown in one embodiment.

[0043] Figure 3 This is a flowchart illustrating the process of constructing an equivalent thermal path model for cable laying in a conduit, as shown in one embodiment.

[0044] Figure 4 This is a circuit diagram of the first equivalent thermal path model in one embodiment;

[0045] Figure 5 This is a circuit diagram of the second equivalent thermal path model in one embodiment;

[0046] Figure 6This is a flowchart illustrating the process of determining multiple thermal resistance parameters in one embodiment;

[0047] Figure 7 This is a schematic diagram illustrating a scenario where the filling height of the thermally conductive material is less than the cable diameter in one embodiment.

[0048] Figure 8 This is a schematic diagram illustrating a scenario where the filling height of the thermally conductive material is greater than or equal to the cable diameter in one embodiment.

[0049] Figure 9 A structural block diagram of a device for determining the material filling height of a cable laying conduit in one embodiment;

[0050] Figure 10 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0052] The method for determining the material filling height for cable laying in ducts provided in this application embodiment can be applied to, for example... Figure 1In the application environment shown, terminal 102 communicates with server 104 via a network. A data storage system can store the data that server 104 needs to process. The data storage system can be integrated onto server 104 or placed in the cloud or on another network server. Users can use terminal 102 to trigger an evaluation command for the optimal current-carrying capacity improvement scheme of duct-laid cables. Server 104 can respond to this command by constructing an equivalent thermal path model of the duct-laid cable, wherein the duct-laid cable is filled with thermally conductive material, and the equivalent thermal path model is set with equivalent thermal resistance. Furthermore, server 104 can perform thermal resistance parameter analysis on the equivalent thermal path model to obtain multiple thermal resistance parameters, and then construct an objective function based on the equivalent thermal path model and multiple thermal resistance parameters. Even further, server 104 can solve the objective function with the goal of minimizing the total laying cost of the duct-laid cable, determining the required filling height of the thermally conductive material to achieve the maximum current-carrying capacity of the duct-laid cable when the operating temperature is below the operating temperature threshold and the minimum current-carrying capacity is met. Finally, server 104 can feed back the determined filling height as the optimal solution for improving the cable's current-carrying capacity to terminal 102, so that users can refer to this filling height when filling the cable conduit with thermally conductive material. Terminal 102 can be, but is not limited to, various personal computers, laptops, smartphones, tablets, IoT devices, etc. Server 104 can be a standalone physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing cloud computing services.

[0053] In one exemplary embodiment, such as Figure 2 As shown, a method for determining the material filling height of cables laid in ducts is provided, which can be applied to... Figure 1 Taking server 104 as an example, the explanation includes the following steps 202 to 208. Wherein:

[0054] Step 202: Construct an equivalent thermal path model for the cable laid in the duct; the cable laid in the duct is filled with thermally conductive material, and the equivalent thermal path model is set with equivalent thermal path model thermal resistance.

[0055] Specifically, cable laying in conduits refers to inserting cables into pre-laid dedicated conduits and then burying them underground, within building walls / floors, or along structures such as bridges and tunnels. The core purpose is to provide physical protection for the cables through the conduits. Thermally conductive materials specifically refer to high thermal conductivity materials with excellent thermal conductivity, outstanding fire resistance, and ease of maintenance. Filling conduit-laid cables with these materials can improve the cable's heat exchange efficiency. An equivalent thermal circuit model is a method of analogizing heat transfer using circuit analogies; for example, temperature is analogous to voltage, heat flow to current, and thermal resistance to resistance. The thermal resistance in an equivalent thermal circuit model primarily integrates the dispersed and complex heat transfer obstacles along the cable's heat dissipation path into one or a group of "thermal resistances." This quantifies the total resistance encountered by heat during its transfer from the cable to the surrounding environment, and its core function is to simplify thermal circuit analysis.

[0056] It should be noted that, in order to reduce the economic cost increase and resource waste caused by filling with thermally conductive material, the embodiments of this application use an incomplete filling method to fill the cable in the pipeline with thermally conductive material, rather than complete filling. Because the axial heat dissipation environment of the cable is stable and the temperature difference is negligible, the embodiments of this application can simplify the equivalent thermal path model to a model that only considers radial heat transfer when modeling the cable in the pipeline.

[0057] Optionally, the server can set parameters such as cable parameters, pipe parameters, thermophysical parameters, and filling height of thermally conductive material for the cable laid in the pipeline, based on the Fourier heat transfer principle, to construct a radial thermal path analytical model corresponding to the cable laid in the pipeline, and obtain an equivalent thermal path model of the cable laid in the pipeline.

[0058] Specifically, different heat transfer paths are formed due to varying filling heights of the thermally conductive material. To accurately describe this phenomenon, the server can distinguish between two typical operating conditions—"partial cable immersion" and "complete cable immersion"—based on the comparison between the filling height and the cable diameter during modeling. "Partial cable immersion" specifically refers to a situation where the filling height of the thermally conductive material inside the pipe is less than the cable diameter; "complete cable immersion" specifically refers to a situation where the filling height of the thermally conductive material inside the pipe is greater than or equal to the cable diameter.

[0059] Step 204: Analyze the thermal resistance parameters of the equivalent thermal circuit model to obtain multiple thermal resistance parameters of the equivalent thermal circuit model.

[0060] Optionally, the server can analyze the thermal resistance parameters of the equivalent thermal circuit model in two ways. One is to use the cylindrical wall structure thermal resistance calculation method to determine a portion of the thermal resistance parameters in the equivalent thermal circuit model. The other is to use the shape factor method to analyze the thermal resistance parameters of the models obtained under two typical working conditions: "partial cable immersion" and "complete cable immersion," respectively, to obtain another portion of the thermal resistance parameters. Based on this, multiple thermal resistance parameters of the equivalent thermal circuit model can be obtained. The physical basis of the cylindrical wall structure thermal resistance calculation method is Fourier's law of heat conduction. This method can be used to calculate the thermal resistance of each layer of concentric cylindrical material (such as cable insulation, filling medium, pipes, soil, etc.) in a cable system. The shape factor method is a commonly used method for calculating thermal resistance when eccentric circular structures appear in cable laying scenarios.

[0061] Step 206: Construct the objective function based on the equivalent thermal path model and multiple thermal resistance parameters.

[0062] Optionally, the server can construct a first function for calculating the operating temperature of the cable laid in the duct, and a second function for calculating the total laying cost of the cable, based on an equivalent thermal circuit model and multiple thermal resistance parameters. For the second function, constraints on the current-carrying capacity of the cable and the physical dimensions of the thermally conductive material filling the cable can be set. Based on this, the first function and the second function with configured current-carrying capacity and physical dimensions constraints can be combined to obtain the objective function.

[0063] Step 208: With the goal of minimizing the total laying cost of the cable in the duct, solve the objective function to determine the filling height of the thermally conductive material required to achieve the maximum current carrying capacity of the cable in the duct when the operating temperature is below the operating temperature threshold and the minimum current carrying capacity is met.

[0064] The total laying cost of cables in ducts can include: the cable cost and the cost of thermally conductive materials. The cable cost includes the cost of the cable itself and the cost of laying the cable; the cost of thermally conductive materials includes the cost of the thermally conductive material itself and the cost of laying the thermally conductive material. Operating temperature below the operating temperature threshold ensures that the cable in the duct is in normal working condition. Meeting the minimum current carrying capacity means that the current carrying capacity of the cable in the duct is greater than or equal to the minimum current carrying capacity.

[0065] Optionally, for the first function in the objective function used to calculate the operating temperature of the cable laid in the duct, and the second function used to calculate the total laying cost of the cable laid in the duct, the server can use the gradient descent method to solve the objective function with the goal of minimizing the total laying cost, and determine the filling height of the thermally conductive material required for the cable laid in the duct to reach the maximum current carrying capacity when the operating temperature is less than the operating temperature threshold and the minimum current carrying capacity is met.

[0066] The method for determining the material filling height of the aforementioned duct-laid cable first constructs an equivalent thermal path model of the duct-laid cable, which is filled with thermally conductive material. The equivalent thermal path model is then configured with equivalent thermal resistance. Further, the thermal resistance parameters of the equivalent thermal path model are analyzed to obtain multiple thermal resistance parameters. Based on the equivalent thermal path model and these parameters, an objective function is constructed. Finally, with the goal of minimizing the total laying cost of the duct-laid cable, the objective function is solved to determine the required filling height of the thermally conductive material to achieve the maximum current carrying capacity while the operating temperature is below the operating temperature threshold and the minimum current carrying capacity is met. This entire process does not rely on finite element simulation; instead, it quickly assesses the required filling height by solving the objective function. This allows for the filling of the duct-laid cable with thermally conductive material at this height, minimizing the total laying cost and meeting the minimum current carrying capacity, while achieving the maximum current carrying capacity under normal operating conditions below the operating temperature threshold. Therefore, the filling height determined based on the above process is the optimal solution for improving cable current-carrying capacity while balancing cost and cable current-carrying capacity. Thus, based on the above process, the optimal solution for improving cable current-carrying capacity can be quickly evaluated, taking into account both cost and cable current-carrying capacity.

[0067] In one embodiment, such as Figure 3 As shown, constructing an equivalent thermal path model for cables laid in conduits mainly includes the following steps:

[0068] Step 302: Set the parameters of the equivalent thermal circuit model and the thermal resistance of the equivalent thermal circuit model.

[0069] The equivalent thermal path model parameters include: cable parameters, pipe parameters, thermophysical parameters, and the filling height of the thermally conductive material. Cable parameters include cable diameter. The equivalent thermal path model thermal resistance includes: the equivalent heat transfer resistance between the cable surface and the inner wall of the pipe, the first equivalent thermal resistance of the area covered by the thermally conductive material, and the second equivalent thermal resistance of the area covered by air inside the pipe.

[0070] Optionally, the server can set the equivalent thermal path model parameters and the equivalent thermal path model thermal resistance based on the cable structure, pipe structure, and radial heat transfer conditions of the cable laid in the pipe, so as to accurately describe the equivalent radial thermal path analytical model of the cable laid in the pipe during operation.

[0071] For scenarios where the filling height is less than the cable diameter, step 304 is executed. With the parallel result of the first equivalent thermal resistance and the second equivalent thermal resistance as the equivalent heat transfer thermal resistance, the first equivalent thermal circuit model is constructed based on the parameters of the equivalent thermal circuit model and the thermal resistance of the equivalent thermal circuit model.

[0072] Specifically, in scenarios where the filling height of the thermally conductive material inside the conduit for cable laying is less than the cable diameter, some of the heat generated by the cable can be transferred to the inner wall of the conduit through the area covered by the thermally conductive material, while the other part of the heat is transferred to the inner wall of the conduit through the area covered by air. Based on this, the equivalent heat transfer resistance between the cable surface and the inner wall of the conduit is represented in the model as a parallel combination of the first equivalent thermal resistance and the second equivalent thermal resistance.

[0073] For example, when the parallel result of the first equivalent thermal resistance and the second equivalent thermal resistance is used as the equivalent heat transfer thermal resistance, based on the equivalent thermal path model parameters and the equivalent thermal path model thermal resistance, such as Figure 4 The diagram shows a schematic of the first equivalent thermal circuit model. The parameters of the equivalent thermal circuit model include: the heat source Q inside the cable, and the conductor temperature. Temperature on the outside of the insulation layer Metal sheath temperature Cable surface temperature Pipeline inner wall temperature Pipeline outer wall temperature Deep soil temperature The equivalent thermal circuit model thermal resistance includes: insulation layer thermal resistance. Buffer layer thermal resistance outer sheath thermal resistance The first equivalent thermal resistance of the area covered by the heat-conducting material inside the pipe The second equivalent thermal resistance of the air-covered area inside the pipe Equivalent heat transfer resistance between the cable surface and the inner wall of the pipe Pipeline thermal resistance External soil thermal resistance .

[0074] For scenarios where the filling height is greater than or equal to the cable diameter, in step 306, with the first equivalent thermal resistance as the equivalent heat transfer thermal resistance, a second equivalent thermal circuit model is constructed based on the parameters of the equivalent thermal circuit model and the thermal resistance of the equivalent thermal circuit model.

[0075] Specifically, in scenarios where the filling height of the heat-conducting material inside the pipe is greater than or equal to the diameter of the cable, all the heat generated by the cable is transferred from the area covered by the heat-conducting material inside the pipe to the inner wall of the pipe. Based on this, the first equivalent thermal resistance of the area covered by the heat-conducting material can be used to replace the equivalent heat transfer thermal resistance between the cable surface and the inner wall of the pipe.

[0076] For example, when the first equivalent thermal resistance is used as the equivalent heat transfer thermal resistance, based on the equivalent thermal path model parameters and the equivalent thermal path model thermal resistance, such as Figure 5 The diagram shows a schematic of the constructed second equivalent thermal circuit model. The parameters of the equivalent thermal circuit model include: the heat source Q inside the cable, and the conductor temperature. Temperature on the outside of the insulation layer Metal sheath temperature Cable surface temperature Pipeline inner wall temperature Pipe outer wall temperature θ d2 The deep soil temperature θ0. The equivalent thermal circuit model thermal resistance includes: insulation layer thermal resistance. Buffer layer thermal resistance outer sheath thermal resistance The first equivalent thermal resistance of the area covered by the heat-conducting material inside the pipe Equivalent heat transfer resistance between the cable surface and the inner wall of the pipe Pipeline thermal resistance External soil thermal resistance .

[0077] In this embodiment, the model can be modeled according to the relationship between the filling height of the thermally conductive material and the diameter of the cable, distinguishing between two typical working conditions: "partial immersion of the cable" and "complete immersion of the cable". This allows the equivalent thermal circuit model to accurately reflect the radial heat transfer inside the cable laid in the pipeline. Based on the equivalent thermal circuit model, the optimal solution for improving the cable's current carrying capacity can be quickly evaluated, taking into account both cost and cable current carrying capacity.

[0078] In an exemplary embodiment, the thermal resistance of the equivalent thermal circuit model is divided into: equivalent heat transfer thermal resistance and multiple general thermal resistances; the thermal resistance parameters include: the equivalent heat transfer thermal resistance parameter of the equivalent heat transfer thermal resistance, and the general thermal resistance parameters of each of the multiple general thermal resistances. Based on this, the server can perform thermal resistance parameter analysis on the equivalent thermal circuit model in two ways to obtain multiple thermal resistance parameters of the equivalent thermal circuit model. For example... Figure 6 The diagram illustrates a process for determining multiple thermal resistance parameters, which mainly includes the following steps:

[0079] Step 602: Using the cylindrical wall structure thermal resistance calculation method, determine the general thermal resistance parameters of each of the multiple general thermal resistances in the equivalent thermal circuit model.

[0080] Among them, several common thermal resistors include: insulating layer thermal resistance Buffer layer thermal resistance outer sheath thermal resistance Pipeline thermal resistance External soil thermal resistance .

[0081] Optionally, the server can use the cylindrical wall structure thermal resistance calculation method based on the Fourier heat conduction principle, and combine the equivalent thermal circuit model parameters and the equivalent thermal circuit model thermal resistance of the equivalent thermal circuit model, and directly calculate the general thermal resistance parameters of each of the multiple general thermal resistances in the equivalent thermal circuit model according to formula (1).

[0082] (1)

[0083] In formula (1), The thermal conductivity of the cylindrical wall material is given. and These are the outer and inner diameters of the cylindrical wall structure, respectively. In calculating the thermal resistance of the insulation layer... Buffer layer thermal resistance outer sheath thermal resistance Pipeline thermal resistance External soil thermal resistance When calculating the thermal resistance parameter T, the corresponding λ values ​​for the insulation layer, buffer layer, outer sheath, pipe, and external soil can be substituted respectively. and .

[0084] Furthermore, considering that different filling heights of the thermally conductive material will lead to different heat transfer paths inside the cable laid in the pipeline, it is necessary to distinguish between two typical operating conditions: "partial cable immersion" and "complete cable immersion" for modeling. Correspondingly, it is necessary to distinguish and determine the equivalent heat transfer resistance between the cable surface and the inner wall of the pipeline under the two typical operating conditions. Specifically, it is necessary to determine the equivalent heat transfer resistance of the first equivalent thermal path model and the second equivalent thermal path model respectively.

[0085] When the equivalent thermal path model is the first equivalent thermal path model, step 604 is executed, and the shape factor method is used to determine the first heat flow from the thermally conductive material covering area to the inner wall of the pipe and the second heat flow from the air covering area to the inner wall of the pipe in the equivalent thermal path model. Based on the first heat flow and the second heat flow, the equivalent heat transfer resistance parameter is determined.

[0086] Specifically, such as Figure 7 As shown, a schematic diagram is provided for a scenario where the filling height of the thermally conductive material is less than the cable diameter. Figure 7 In R is the cable radius, R is the pipe radius, and h is the filling height of the heat-conducting material inside the pipe. It is the angle between the center of the pipe and the filling height, which changes as the filling height changes. This is the angle determined based on the cable center and the fill height, which varies with the fill height. Figure 7 In the scenario shown, the equivalent thermal path model is: Figure 4 The server can combine Fourier's heat transfer law and the heat flow conservation equation, and use the shape factor method according to formulas (2) to (5) to determine the first heat flow from the heat-conducting material covered area to the inner wall of the pipe in the equivalent thermal path model. and the second heat flow from the air-covered area inside the pipe to the inner wall of the pipe. Thus based on the first heat flow With the second heat flow The equivalent heat transfer resistance parameters between the cable surface and the inner wall of the pipe are calculated. Considering the irregularities of the area covered by the heat-conducting material and the area covered by the air inside the pipe, formulas (2) to (4) are as follows:

[0087] (2)

[0088] (3)

[0089] (4)

[0090] In formulas (2) to (4), Q is the total heat flow out of the cable surface (i.e., the heat source inside the cable), and the total heat flow Q = the first heat flow. Second heat flow Equivalent heat transfer thermal resistance The equivalent heat transfer thermal resistance parameter can also be expressed as T. m express. The surface temperature of the cable. This refers to the temperature of the inner wall of the pipe. The thermal conductivity of the thermally conductive material is... The value is the thermal conductivity of the air inside the pipe. This is the shape factor corresponding to the area covered by the thermally conductive material and the area covered by the air inside the pipe. S1 represents the total area between the cable surface and the inner wall of the pipe, and S2 represents the area covered by the thermally conductive material. This refers to the area of ​​the air-covered region within the pipe.

[0091] By rearranging formulas (2) to (4), the equivalent heat transfer resistance parameters are obtained. As shown in formula (5):

[0092] (5)

[0093] In formula (5), r is the cable radius, R is the pipe radius, and h is the filling height of the heat-conducting material inside the pipe. θ1 is Figure 7 The angle between the center of the pipe and the filling height is determined. yes Figure 7 The angle between the cable center and the filling height is determined. The thermal conductivity of the thermally conductive material is... The value is the thermal conductivity of the air inside the pipe.

[0094] When the equivalent thermal path model is the second equivalent thermal path model, step 606 is executed, and the shape factor method is used to determine the first heat flow from the thermally conductive material covering area to the inner wall of the pipe in the equivalent thermal path model. Based on the first heat flow, the equivalent heat transfer resistance parameter is determined.

[0095] Specifically, such as Figure 8 As shown, a schematic diagram is provided for a scenario where the filling height of the thermally conductive material is greater than or equal to the cable diameter. Figure 8 In this context, r represents the cable radius, R represents the pipe radius, and h represents the height of the heat-conducting material inside the pipe. θ is... Figure 8 The angle between the center of the pipe and the filling height varies with the filling height. Figure 8 In the scenario shown, the equivalent thermal path model is: Figure 5 In the second equivalent thermal path model shown, the heat flow transferred to the inner wall of the pipe through the air-covered area can be approximately ignored. Therefore, the server can determine the first heat flow from the heat-conducting material-covered area to the inner wall of the pipe in the equivalent thermal path model based on formulas (6) to (7) using the shape factor method. Thus based on the first heat flow The equivalent heat transfer resistance parameters are determined. Considering the irregularities of the thermally conductive material coverage area and the air coverage area inside the pipe, formulas (6) to (7) are as follows:

[0096] (6)

[0097] (7)

[0098] In formulas (6) to (7), Q is the total heat flow out of the cable surface (i.e., the heat source inside the cable), and the total heat flow Q = the first heat flow. By rearranging formulas (6) to (7), the equivalent heat transfer resistance parameter T is obtained. m As shown in formula (8):

[0099] (8)

[0100] In formula (8), θ is Figure 8 The angle between the center of the pipe and the filling height is determined.

[0101] In this embodiment, considering the irregularities of the thermally conductive material coverage area and the air coverage area inside the pipe, the shape factor method can be used to determine the equivalent thermal resistance parameters for the two typical operating conditions: "partial cable immersion" and "complete cable immersion".

[0102] In some embodiments, an objective function is constructed based on an equivalent thermal path model and multiple thermal resistance parameters, including:

[0103] Based on the equivalent thermal circuit model and multiple thermal resistance parameters, a first function is constructed to calculate the operating temperature of cables laid in ducts, and a second function is constructed to calculate the total laying cost of cables laid in ducts.

[0104] For the second function, set the current carrying capacity constraint for the cable laid in the duct, and the physical size constraint for filling the inside of the cable with heat-conducting material.

[0105] The equivalent thermal path model parameters include: cable parameters, pipe parameters, thermophysical parameters, and the filling height of the thermally conductive material for the duct-laid cable. Cable parameters include: current-carrying capacity I, load frequency f, cable radius r, and capacitance per unit length of insulation layer for the duct-laid cable. Voltage drop borne by the insulation layer , dielectric loss tangent of the insulating layer Pipeline parameters include: pipeline radius R, Figure 7 The angle between the center of the pipe and the filling height is determined by... , Figure 7 The angle between the cable center and the filling height is determined by... Length of thermally conductive material The cross-section filled with thermally conductive material The filling height h of the thermally conductive material. Thermophysical parameters include: the operating temperature of the cable laid in the conduit. Deep soil temperature The equivalent thermal circuit model's thermal resistance includes several thermal resistance parameters, such as the general thermal resistance parameters of the insulation layer. The general thermal resistance parameter T of the buffer layer b General thermal resistance parameters of outer sheath Equivalent heat transfer resistance parameters between the cable surface and the inner wall of the pipe. General thermal resistance parameters of pipes General thermal resistance parameters of external soil thermal resistance .

[0106] Optionally, the first function is constructed as follows: The equivalent thermal circuit model parameters and thermal resistance of the equivalent thermal circuit model are obtained, and then, based on multiple thermal resistance parameters including cable parameters, pipe parameters, thermophysical parameters, and the thermal resistance of the equivalent thermal circuit model, a first function is constructed to calculate the operating temperature of the cable laid in the pipe. The server can construct the first function based on formula (9):

[0107] (9)

[0108] Optionally, the second function is constructed as follows: The equivalent thermal path model parameters are obtained, and based on these parameters, the cable radius, cable length, filling height of the thermally conductive material, and filling cross-section are determined, where the filling cross-section is determined based on the cable length and filling height. Further, cable cost calculation coefficients are obtained, and based on these coefficients, the cable radius, and the cable length, a cable cost calculation function is constructed. Similarly, thermally conductive material cost calculation coefficients are obtained, and based on these coefficients, the filling cross-section, and the cable length, a thermally conductive material cost calculation function is constructed. Finally, the cable cost calculation function and the thermally conductive material cost calculation function are combined to obtain the second function.

[0109] The cable cost calculation function is used to calculate the cable cost of cables laid in ducts. Cable cost =Cable body cost +Cable laying cost The cable cost calculation factors include: price factors related to cable cross-section. Cable unit length laying cost coefficient Based on this, the server can construct a cable cost calculation function according to formulas (10) to (12):

[0110] (10)

[0111] (11)

[0112] (12)

[0113] The thermal conductivity material cost calculation function is used to calculate the cost of thermal conductivity materials for cables laid in ducts. Cost of thermal conductive materials =Cost of thermally conductive material + Cost of applying thermal conductive materials The cost calculation factors for thermally conductive materials include: the unit volume cost factor k of the thermally conductive material. m Unit volume laying cost coefficient of thermal conductive material Based on this, the server can construct a cost calculation function for thermally conductive materials according to formulas (13) to (16):

[0114] (13)

[0115] (14)

[0116] (15)

[0117] (16)

[0118] Furthermore, the server can combine the cable cost calculation function with the thermal conductive material cost calculation function to obtain a second function. , This indicates the total cost of laying cables in conduits.

[0119] Furthermore, for the second function, the server can set current-carrying constraints for the cables laid in the conduit: , To determine the minimum current carrying capacity, when the capacity P and line voltage U of a cable laid in a conduit are fixed, the minimum current carrying capacity is required. It is also a constant value. The current carrying capacity of cables laid in conduits. The expression for can be shown in formula (17):

[0120] (17)

[0121] The physical dimensional constraints for filling the interior of a cable conduit with a thermally conductive material are as follows: and , Let R be the minimum radius of the cable, R be the radius of the conduit, and h be the filling height of the thermally conductive material. Based on this, the server can achieve a total laying cost of cable installation via conduit. Minimize as the objective ( The objective function, comprising the first and second functions, is solved using the gradient descent method. The resulting cable radius *r* and fill height *h* satisfy the current-carrying capacity *P* required for cable laying in the duct, and also meet the physical constraints of the cable radius and duct radius. This represents an optimal solution for improving cable current-carrying capacity while balancing cost and cable current-carrying capacity. Therefore, based on the above process, the optimal solution for improving cable current-carrying capacity can be quickly evaluated, taking into account both cost and cable current-carrying capacity.

[0122] In this embodiment, by constructing an objective function, the problem of quickly evaluating the optimal solution to improve the cable's current-carrying capacity while balancing cost and cable current-carrying capacity can be transformed into an objective function optimization problem, which can determine the optimal filling height of the thermally conductive material inside the cable laid in the duct. Furthermore, if the thermally conductive material is filled based on the optimal filling height, the total laying cost of the cable in the duct can be minimized while meeting the minimum current-carrying capacity, and the maximum current-carrying capacity can be achieved under normal operating conditions where the operating temperature is below the operating temperature threshold.

[0123] In the above embodiments of the method for determining the material filling height of cable in duct laying, multiple equivalent thermal circuit models (first equivalent thermal circuit model and second thermal circuit model) are established in the scenario of incomplete filling of high thermal conductivity material for cable laying in duct laying through thermoelectric analogy. Then, a method for fast calculation of current carrying capacity in the scenario of incomplete filling of high thermal conductivity material is provided, and the expression of the obtained current carrying capacity is as shown in formula (17). Furthermore, the optimal filling height of thermal conductive material in duct laying cable can be obtained by taking into account both cost and cable current carrying capacity, with the goal of minimizing the total laying cost of cable laying in duct laying. By adopting the above embodiments, the problems of large influence of mesh division on the accuracy of finite element simulation and long calculation time in traditional technology can be solved. It can also maximize the utilization of thermal conductive material resources and power transmission resources, effectively reduce costs, and help improve the stability and safety of power grid operation. Based on the above embodiments, the optimal improvement scheme for cable current carrying capacity can be quickly evaluated by taking into account both cost and cable current carrying capacity.

[0124] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0125] Based on the same inventive concept, this application also provides an apparatus for implementing the method for determining the material filling height of cable in a duct as described above. The solution provided by this apparatus is similar to the solution described in the above method. Therefore, the specific limitations of one or more embodiments of the apparatus for determining the material filling height of cable in a duct provided below can be found in the limitations of the method for determining the material filling height of cable in a duct described above, and will not be repeated here.

[0126] In one exemplary embodiment, such as Figure 9 As shown, a device for determining the material filling height of cables laid in ducts is provided, comprising: an equivalent thermal circuit model construction module 902, a thermal resistance parameter analysis module 904, an objective function construction module 906, and a filling height optimization solution module 908, wherein:

[0127] The equivalent thermal path model construction module is used to construct the equivalent thermal path model of the cable laid in the pipeline; the cable laid in the pipeline is filled with thermally conductive material, and the equivalent thermal path model is set with the equivalent thermal path model thermal resistance.

[0128] The thermal resistance parameter analysis module is used to analyze the thermal resistance parameters of the equivalent thermal circuit model and obtain multiple thermal resistance parameters of the equivalent thermal circuit model.

[0129] The objective function construction module is used to construct the objective function based on the equivalent thermal circuit model and multiple thermal resistance parameters;

[0130] The fill height optimization solution module is used to solve the objective function with the goal of minimizing the total laying cost of cable in ducts, and to determine the fill height of the thermally conductive material required to achieve the maximum current carrying capacity of the cable in the duct when the operating temperature is below the operating temperature threshold and the minimum current carrying capacity is met.

[0131] The aforementioned device for determining the material filling height of duct-laid cables first constructs an equivalent thermal path model of the duct-laid cable, which is filled with thermally conductive material. The equivalent thermal path model is then configured with equivalent thermal resistance. Further, the thermal resistance parameters of the equivalent thermal path model are analyzed to obtain multiple thermal resistance parameters. Based on the equivalent thermal path model and these parameters, an objective function is constructed. Finally, with the goal of minimizing the total laying cost of the duct-laid cable, the objective function is solved to determine the required filling height of the thermally conductive material to achieve the maximum current carrying capacity while the operating temperature is below the operating temperature threshold and the minimum current carrying capacity is met. The entire process does not rely on finite element simulation; instead, it quickly assesses the required filling height by solving the objective function. This allows the thermally conductive material to be filled into the duct-laid cable according to this height, minimizing the total laying cost and meeting the minimum current carrying capacity, while achieving the maximum current carrying capacity under normal operating conditions below the operating temperature threshold. Therefore, the filling height determined based on the above process is the optimal solution for improving cable current-carrying capacity while balancing cost and cable current-carrying capacity. Thus, based on the above process, the optimal solution for improving cable current-carrying capacity can be quickly evaluated, taking into account both cost and cable current-carrying capacity.

[0132] In one embodiment, the equivalent thermal circuit model construction module includes:

[0133] The parameter setting unit is used to set the equivalent thermal path model parameters and the equivalent thermal path model thermal resistance. The equivalent thermal path model parameters include: cable parameters, pipe parameters, and thermophysical parameters of the cable laid in the pipe, as well as the filling height of the thermally conductive material. The cable parameters include the cable diameter. The equivalent thermal path model thermal resistance includes: the equivalent heat transfer thermal resistance between the cable surface and the inner wall of the pipe, the first equivalent thermal resistance of the area covered by the thermally conductive material, and the second equivalent thermal resistance of the area covered by the air inside the pipe.

[0134] The first model building unit is used to construct the first equivalent thermal circuit model based on the parameters of the equivalent thermal circuit model and the thermal resistance of the equivalent thermal circuit model, when the parallel result of the first equivalent thermal resistance and the second equivalent thermal resistance is used as the equivalent heat transfer thermal resistance in the scenario where the filling height is less than the cable diameter.

[0135] The second model building unit is used to construct a second equivalent thermal circuit model for scenarios where the filling height is greater than or equal to the cable diameter, based on the parameters of the equivalent thermal circuit model and the thermal resistance of the equivalent thermal circuit model, while taking the first equivalent thermal resistance as the equivalent heat transfer thermal resistance.

[0136] In one embodiment, the thermal resistance of the equivalent thermal path model is divided into: equivalent heat transfer thermal resistance and multiple general thermal resistances; the thermal resistance parameters include: the equivalent heat transfer thermal resistance parameter of the equivalent heat transfer thermal resistance, and the general thermal resistance parameters of each of the multiple general thermal resistances. The thermal resistance parameter analysis module includes:

[0137] The general thermal resistance parameter determination unit is used to determine the general thermal resistance parameters of multiple general thermal resistances in the equivalent thermal circuit model by using the cylindrical wall structure thermal resistance calculation method.

[0138] The first heat transfer resistance parameter determination unit is used to determine the first heat flow from the thermally conductive material covering area to the inner wall of the pipe and the second heat flow from the air covering area to the inner wall of the pipe in the equivalent heat circuit model when the equivalent heat circuit model is the first equivalent heat circuit model, using the shape factor method. Based on the first heat flow and the second heat flow, the equivalent heat transfer resistance parameter is determined.

[0139] The second heat transfer resistance parameter determination unit is used to determine the first heat flow from the thermally conductive material coverage area to the inner wall of the pipe in the equivalent heat circuit model by using the shape factor method when the equivalent heat circuit model is the second equivalent heat circuit model. Based on the first heat flow, the equivalent heat transfer resistance parameter is determined.

[0140] In one embodiment, the objective function construction module includes:

[0141] The function construction unit is used to construct a first function for calculating the operating temperature of cables laid in ducts and a second function for calculating the total laying cost of cables laid in ducts, based on the equivalent thermal circuit model and multiple thermal resistance parameters.

[0142] The constraint configuration unit is used to set the current carrying capacity constraint for the cable laid in the duct and the physical dimension constraint for filling the cable with thermally conductive material in the duct for the second function.

[0143] In one embodiment, the equivalent thermal path model parameters include: cable parameters, pipe parameters, thermophysical parameters, and the filling height of the thermally conductive material. The function construction unit is specifically used for:

[0144] Obtain the equivalent thermal circuit model parameters and the equivalent thermal circuit model thermal resistance;

[0145] Based on cable parameters, pipe parameters, thermophysical parameters, and multiple thermal resistance parameters of the equivalent thermal circuit model, a first function is constructed to calculate the operating temperature of cables laid in pipes.

[0146] In one embodiment, the equivalent thermal path model parameters include: cable parameters, pipe parameters, thermophysical parameters, and the filling height of the thermally conductive material. The function construction unit is specifically used for:

[0147] Obtain the equivalent thermal path model parameters, and based on the equivalent thermal path model parameters, determine the cable radius, cable length, filling height of the thermally conductive material, and filling cross-section; the filling cross-section is determined based on the cable length and filling height.

[0148] Obtain the cable cost calculation coefficient, and construct the cable cost calculation function based on the cable cost calculation coefficient, cable radius and cable length;

[0149] Obtain the cost calculation coefficient of the thermal conductive material, and construct the cost calculation function of the thermal conductive material based on the cost calculation coefficient of the thermal conductive material, the filling cross-section and the cable length;

[0150] The second function is obtained by combining the cost calculation function for the combined cable and the cost calculation function for the thermally conductive material.

[0151] The modules in the aforementioned cable laying material filling height determination device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the computer device's memory as software, so that the processor can call and execute the corresponding operations of each module.

[0152] In one exemplary embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 10As shown, the computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The database stores data for determining the material filling height of cables used in duct laying. The I / O interfaces are used for exchanging information between the processor and external devices. The communication interface is used for communicating with external terminals via a network connection. When the computer program is executed by the processor, it implements a method for determining the material filling height of cables used in duct laying.

[0153] Those skilled in the art will understand that Figure 10 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0154] In one exemplary embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above-described method embodiments.

[0155] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps in the above method embodiments.

[0156] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0157] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0158] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, database, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0159] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0160] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for determining the material filling height of cables laid in conduits, characterized in that, The method includes: An equivalent thermal path model of a cable laid in a pipeline is constructed; the cable laid in the pipeline is filled with a thermally conductive material, and the equivalent thermal path model is provided with an equivalent thermal path model thermal resistance. The equivalent thermal circuit model is analyzed to obtain multiple thermal resistance parameters of the equivalent thermal circuit model. Based on the equivalent thermal path model and the multiple thermal resistance parameters, an objective function is constructed; With the goal of minimizing the total laying cost of the cable in the duct, the objective function is solved to determine the filling height of the thermally conductive material required for the cable to reach its maximum current carrying capacity while the operating temperature is below the operating temperature threshold and the minimum current carrying capacity is met.

2. The method according to claim 1, characterized in that, The construction of the equivalent thermal path model for cable laying in ducts includes: The equivalent thermal path model parameters and equivalent thermal path model thermal resistance are set. The equivalent thermal path model parameters include: cable parameters, pipe parameters, and thermophysical parameters of the cable laid in the pipe, as well as the filling height of the thermally conductive material. The cable parameters include the cable diameter. The equivalent thermal path model thermal resistance includes: the equivalent heat transfer thermal resistance between the cable surface and the inner wall of the pipe, the first equivalent thermal resistance of the area covered by the thermally conductive material, and the second equivalent thermal resistance of the area covered by air inside the pipe. For scenarios where the filling height is less than the cable diameter, in the case of taking the parallel result of the first equivalent thermal resistance and the second equivalent thermal resistance as the equivalent heat transfer thermal resistance, a first equivalent thermal circuit model is constructed based on the equivalent thermal circuit model parameters and the equivalent thermal circuit model thermal resistance. For scenarios where the filling height is greater than or equal to the cable diameter, a second equivalent thermal circuit model is constructed based on the parameters of the equivalent thermal circuit model and the thermal resistance of the equivalent thermal circuit model, using the first equivalent thermal resistance as the equivalent heat transfer thermal resistance.

3. The method according to claim 2, characterized in that, The equivalent thermal path model thermal resistance is divided into: equivalent heat transfer thermal resistance and multiple general thermal resistances; the thermal resistance parameters include: the equivalent heat transfer thermal resistance parameters of the equivalent heat transfer thermal resistance, and the general thermal resistance parameters of each of the multiple general thermal resistances. The equivalent thermal circuit model is analyzed to obtain multiple thermal resistance parameters, including: The common thermal resistance parameters of each of the multiple common thermal resistances in the equivalent thermal circuit model are determined by using the cylindrical wall structure thermal resistance calculation method. When the equivalent thermal path model is the first equivalent thermal path model, the shape factor method is used to determine the first heat flow from the thermally conductive material covering area to the inner wall of the pipe and the second heat flow from the air covering area to the inner wall of the pipe in the equivalent thermal path model. Based on the first heat flow and the second heat flow, the equivalent heat transfer resistance parameter of the equivalent heat transfer resistance is determined. When the equivalent thermal path model is the second equivalent thermal path model, the shape factor method is used to determine the first heat flow from the thermally conductive material-covered area to the inner wall of the pipe in the equivalent thermal path model. Based on the first heat flow, the equivalent heat transfer resistance parameter of the equivalent heat transfer resistance is determined.

4. The method according to claim 1, characterized in that, The objective function constructed based on the equivalent thermal path model and multiple thermal resistance parameters includes: Based on the equivalent thermal circuit model and multiple thermal resistance parameters, a first function for calculating the operating temperature of the cable laid in the duct and a second function for calculating the total laying cost of the cable laid in the duct are constructed. For the second function, the current carrying capacity constraint of the cable laid in the pipeline and the physical size constraint of the thermally conductive material filled inside the cable laid in the pipeline are set.

5. The method according to claim 4, characterized in that, The equivalent thermal path model parameters include: the cable parameters, pipe parameters, and thermophysical parameters of the cable laid in the pipeline, as well as the filling height of the thermally conductive material; the first function is constructed in the following manner: Obtain the equivalent thermal circuit model parameters and the equivalent thermal circuit model thermal resistance of the equivalent thermal circuit model; Based on the cable parameters, the pipe parameters, the thermophysical parameters, and multiple thermal resistance parameters of the equivalent thermal circuit model, a first function is constructed for calculating the operating temperature of the cable laid in the pipe.

6. The method according to claim 4, characterized in that, The equivalent thermal path model parameters include: cable parameters, pipe parameters, thermophysical parameters of the cable laid in the pipeline, and the filling height of the thermally conductive material; the second function is constructed in the following manner: Obtain the equivalent thermal path model parameters of the equivalent thermal path model, and determine the cable radius, cable length, filling height and filling cross-section of the thermally conductive material based on the equivalent thermal path model parameters; the filling cross-section is determined based on the cable length and the filling height. Obtain the cable cost calculation coefficient, and construct the cable cost calculation function based on the cable cost calculation coefficient, the cable radius, and the cable length; Obtain the thermal conductive material cost calculation coefficient, and construct the thermal conductive material cost calculation function based on the thermal conductive material cost calculation coefficient, the filling cross-section and the cable length; The second function is obtained by combining the cable cost calculation function and the thermally conductive material cost calculation function.

7. A device for determining the material filling height of cables laid in ducts, characterized in that, The device includes: An equivalent thermal path model construction module is used to construct an equivalent thermal path model of a cable laid in a pipeline; the cable laid in the pipeline is filled with thermally conductive material, and the equivalent thermal path model is provided with an equivalent thermal path model thermal resistance. The thermal resistance parameter analysis module is used to analyze the thermal resistance parameters of the equivalent thermal circuit model to obtain multiple thermal resistance parameters of the equivalent thermal circuit model. The objective function construction module is used to construct an objective function based on the equivalent thermal path model and multiple thermal resistance parameters; The filling height optimization solution module is used to solve the objective function with the goal of minimizing the total laying cost of the cable in the duct, and to determine the filling height of the thermally conductive material required for the cable to reach the maximum current carrying capacity when the operating temperature is below the operating temperature threshold and the minimum current carrying capacity is met.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 6.

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