Antenna unit and communication equipment
By integrating the grounding layer, radiator, and coupling unit onto a printed circuit board, the problems of high cost and poor compatibility of 6G antennas are solved, achieving ultra-wideband, miniaturization, and efficient integration, making it suitable for 6G communication equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-26
- Publication Date
- 2026-04-07
AI Technical Summary
Existing 6G antennas rely on special materials such as ceramic substrates or metal cavities, resulting in high production costs, poor process compatibility, and difficulty in integration with RF chips. Furthermore, traditional ultra-wideband antennas have complex structures, large sizes, and large efficiency fluctuations, which limit their commercial applications.
By using printed circuit board technology to integrate the ground layer, radiator, and coupling unit onto the substrate to form a single structure, the use of special materials is avoided, and integration with devices such as RF chips is achieved. Frequency bands are extended through dielectric layer coupling, and miniaturization and ultra-wideband coverage are designed.
It reduces production costs and system complexity, achieves ultra-wideband coverage and miniaturization of antenna units, is suitable for large-scale commercial deployment, meets 6G communication requirements, and improves the flexibility and integration of equipment design.
Smart Images
Figure CN121812926A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of communication technology, and in particular to an antenna unit and a communication device. Background Technology
[0002] As global communication technology evolves towards the 6G era, communication frequency bands are rapidly expanding into millimeter wave and terahertz bands, posing unprecedented challenges to antenna technology. 6G communication systems need to meet the core requirements of ultra-high speed, ultra-low latency, and wide-area connectivity, demanding that antennas possess comprehensive performance characteristics such as wide-band coverage, miniaturized design, low-loss transmission, and ease of integration.
[0003] In implementing the embodiments of this application, the inventors discovered that current 6G antennas rely on special materials such as ceramic substrates or metal cavities and complex manufacturing processes, resulting in high production costs and making it difficult to support large-scale commercial deployment. At the same time, most high-frequency antennas have poor process compatibility and are difficult to integrate with on-chip devices such as RF chips and filters. This not only increases the complexity of system design and manufacturing costs, but also limits the application potential of antennas in miniaturized terminal devices. In addition, traditional ultra-wideband antennas are often complex in structure and large in size, and also have performance problems such as large efficiency fluctuations and excessive VSWR in a wide frequency range, which further exacerbates the difficulty of commercialization. Summary of the Invention
[0004] The main technical problem solved by the embodiments of this application is to provide an antenna unit that integrates the ground layer, radiator and coupling unit on the substrate to form an integrated structure. This eliminates the need for special materials such as ceramic substrates or metal cavities, avoids complex manufacturing processes, and reduces production costs. At the same time, the printed circuit board process has good process compatibility, and the antenna unit can be co-integrated with on-chip devices such as RF chips and filters on the same substrate, reducing interconnection losses and lowering system design complexity and manufacturing costs.
[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application embodiment is: providing an antenna unit, including a substrate, a ground layer, a radiator, and a coupling unit. The ground layer is disposed on a first surface of the substrate, the radiator is disposed on a second surface of the substrate, the radiator is provided with a feeding structure, the coupling unit is disposed on the second surface of the substrate, the coupling unit is spaced apart from the radiator, and the coupling unit is coupled to the ground layer through a dielectric layer of the substrate. The first surface is the side surface of the substrate, the second surface is the top surface of the substrate, and the ground layer, the radiator, and the coupling unit are integrated into the substrate to form an integrated structure.
[0006] Optionally, the radiator includes a first radiating unit, a second radiating unit, and a connecting portion. The first radiating unit and the second radiating unit are both disposed on the second surface. The first radiating unit and the second radiating unit are symmetrically arranged about a center line. The connecting portion connects the first radiating unit and the second radiating unit. The power feeding structure is electrically connected to the connecting portion.
[0007] Optionally, both the first radiating unit and the second radiating unit have a comb-like structure, which includes a main trunk and multiple radiating branches. The multiple radiating branches extend outward from the main trunk and are spaced apart along the extension direction of the main trunk.
[0008] Optionally, the main stem includes a first layer of branches, the first end of which is connected to the main stem, and the second end of which extends away from the main stem; a second layer of branches, the first end of which is connected to the second end of which is connected by a first connecting segment, and the second layer of branches extends from the second end of which is in the opposite direction to the extension direction of which is the first layer of branches; and a third layer of branches, the first end of which is connected to the second end of which is connected by a second connecting segment, and the third layer of branches extends from the second end of which is in the opposite direction to the extension direction of which is the second layer of branches; wherein the first layer of branches, the first connecting segment, the second layer of branches, the second connecting segment, and the third layer of branches form a continuous conductive path.
[0009] Optionally, gaps are formed between adjacent radial branches.
[0010] Optionally, the first layer of branches, the second layer of branches, and the third layer of branches are all rectangular strip structures, and the length direction of the rectangular strip structure is perpendicular to the extension direction of the main stem.
[0011] Optionally, the coupling unit includes a first coupling block and a second coupling block, both of which are rectangular block structures. The first coupling block is disposed on a first side of the radiator and is spaced apart from the radiator. The second coupling block is disposed on a second side of the radiator and is spaced apart from the radiator. The first side and the second side are opposite to each other.
[0012] Optionally, the feeding structure is a microstrip line structure, which is disposed on the second surface. The first end of the microstrip line structure is electrically connected to the radiator, and the second end of the microstrip line structure forms a feeding port.
[0013] Optionally, the grounding layer is a rectangular metal layer structure, and the area of the grounding layer is larger than the projected area of the radiator.
[0014] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of this application is to provide a communication device.
[0015] The antenna unit provided in this application integrates the ground layer, radiator, and coupling unit onto a substrate to form a single structure. The antenna is fabricated using printed circuit board (PCB) technology, eliminating the need for special materials such as ceramic substrates or metal cavities, thus avoiding complex manufacturing processes and significantly reducing production costs, making it suitable for large-scale commercial deployment. Furthermore, PCB technology offers excellent process compatibility, allowing the antenna unit to be integrated with on-chip devices such as RF chips and filters on the same substrate, reducing interconnection losses and lowering system design complexity and manufacturing costs. Secondly, by setting coupling units spaced apart from the radiator on both sides, with these coupling units coupled to the ground layer through the substrate's dielectric layer, this structural design effectively expands the antenna unit's operating frequency band without increasing feed complexity, achieving ultra-wideband coverage of 100-240GHz, meeting the wideband requirements of 6G communication. Finally, the integrated structural design enables miniaturization of the antenna unit, with the overall size controllable at the millimeter level, allowing for flexible integration into space-constrained applications such as micro-terminal devices and wearable devices, enhancing the flexibility of device design. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0017] Figure 1 This is a schematic diagram of the antenna element according to an embodiment of this application; Figure 2 This is a schematic diagram of the antenna element from another perspective in an embodiment of this application; Figure 3 This is yet another schematic diagram of the antenna element in an embodiment of this application; Figure 4 This is another schematic diagram of the antenna element in an embodiment of this application; Figure 5 This is a test diagram of the S-parameters of the antenna element in an embodiment of this application; Figure 6 This is an efficiency diagram of the antenna element in an embodiment of this application. Detailed Implementation
[0018] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0019] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0020] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0021] This embodiment provides an antenna element 100, such as Figure 1 and Figure 2 As shown, it includes a substrate +, a ground layer 2, a radiator 3 and a coupling unit 4.
[0022] The substrate 1 is made of a dielectric material. In this embodiment, an FR4 epoxy resin substrate is selected, with a dielectric constant of 4.4, a dielectric loss tangent of 0.02, and a thickness of 0.8 mm. The substrate 1 has a first surface 11 and a second surface 12, wherein the first surface 11 is the side surface of the substrate 1, and the second surface 12 is the top surface of the substrate 1.
[0023] Ground layer 2 is disposed on the first surface 11 of substrate 1, i.e., the side surface of substrate 1. Ground layer 2 is a metal layer structure, made of oxygen-free copper foil, with a thickness of 0.05 mm. Ground layer 2 is directly formed on the side surface of substrate 1 using printed circuit board technology, and is tightly bonded to the dielectric layer of substrate 1. Ground layer 2 is used to provide a stable ground reference and suppress signal interference. Figure 3 It can be seen that the ground layer 2 has a rectangular metal layer structure with a size of 3 mm by 4 mm, covering the main area of the side of the substrate 1.
[0024] The radiator 3 is disposed on the second surface 12 of the substrate 1, i.e., the top surface of the substrate 1. The radiator 3 is a metallic structure, made of the same oxygen-free copper foil material as the ground layer 2. The radiator 3 is provided with a feeding structure 31, which is used to feed radio frequency signals into the radiator 3. The radiator 3 and the ground layer 2 are electrically isolated from each other through the dielectric layer of the substrate 1, and the two do not make direct contact, forming the basic configuration of a microstrip antenna.
[0025] The coupling unit 4 is disposed on the second surface 12 of the substrate 1, and is located on the same plane as the radiator 3. The coupling unit 4 and the radiator 3 are spaced apart, maintaining a certain physical distance between them. The coupling unit 4 is a metallic structure, and is coupled to the ground layer 2 through the dielectric layer of the substrate 1. This coupling relationship is achieved through the action of an electromagnetic field, without the need for a direct electrical connection. Since the ground layer 2 is located on the side of the substrate 1, the coupling unit 4 forms an electromagnetic field coupling with the ground layer 2 on the side through the dielectric material inside the substrate 1. This three-dimensional coupling structure can effectively adjust the impedance characteristics and frequency response of the antenna element 100.
[0026] Ground layer 2, radiator 3, and coupling unit 4 are integrated onto substrate 1 using printed circuit board technology to form a unified structure. The specific fabrication process includes cleaning and drying pretreatment of substrate 1, forming the patterns of radiator 3 and coupling unit 4 on the second surface 12 using photolithography, forming the pattern of ground layer 2 on the first surface 11, removing excess copper foil through chemical etching to retain the target metal pattern, and finally cleaning, drying, and testing. This side-grounded structure design, compared to the traditional bottom-grounded configuration, can better adapt to certain specific installation and integration requirements, especially in applications requiring vertical mounting or lateral connection with other circuit modules.
[0027] The antenna element 100 in this embodiment operates in the 100 to 240 GHz frequency band, covering millimeter wave and terahertz bands, meeting the ultra-wideband requirements of 6G communication. The overall size is controlled within 5 mm x 5 mm x 2 mm, achieving a miniaturized design.
[0028] This embodiment optimizes the structure of the radiator 3 based on the above embodiments. For example... Figure 1 , Figure 2 and Figure 3 As shown, Figure 1 , Figure 2 and Figure 3 As shown, the radiator 3 includes a first radiating unit 32, a second radiating unit 33, and a connecting part 34.
[0029] The first radiating unit 32 and the second radiating unit 33 are both disposed on the second surface 12 of the substrate 1, i.e., the top surface of the substrate 1. The first radiating unit 32 and the second radiating unit 33 are symmetrically arranged about the center line. This symmetrical structural design can achieve dual-band resonance characteristics and enhance radiation directivity. The connecting part 34 connects the first radiating unit 32 and the second radiating unit 33. The connecting part 34 is located between the first radiating unit 32 and the second radiating unit 33 and serves as a structural connection and electrical connection.
[0030] The feed structure (not shown) is a microstrip line structure, located on the second surface 12, on the same plane as the radiator 3. The first end of the microstrip line structure is electrically connected to the connector 34, and the second end forms the feed port. The microstrip line structure employs a 50-ohm impedance design with a width of 0.2 mm, achieving impedance matching with external RF circuitry. The feed port 311 is located at the center of the radiator 3; this center-feed method ensures symmetrical excitation, which is beneficial for obtaining stable radiation characteristics.
[0031] Ground layer 2 is disposed on the first surface 11 of substrate 1, i.e., the side surface of substrate 1. Electromagnetic field coupling is formed between ground layer 2 and radiator 3 through the dielectric layer of substrate 1. In microstrip antenna theory, the relative position and distance between radiator 3 and ground layer 2 directly affect the antenna's input impedance and radiation characteristics. In this embodiment, the configuration of ground layer 2 on the side surface of substrate 1 creates a specific spatial geometric relationship between radiator 3 and ground layer 2. This relationship provides a grounding reference in the vertical direction and achieves effective electromagnetic field coupling in the horizontal direction through the extension of the dielectric layer.
[0032] The coupling unit 4 includes a first coupling block 41 and a second coupling block 42. Both the first coupling block 41 and the second coupling block 42 are rectangular block structures made of the same oxygen-free copper foil material as the radiator 3. The first coupling block 41 is disposed on the first side of the radiator 3, spaced apart from the radiator 3 by a distance of 0.2 mm. The second coupling block 42 is disposed on the second side of the radiator 3, spaced apart from the radiator 3, with the first side and the second side opposite each other. The first coupling block 41 and the second coupling block 42 are symmetrically distributed on both sides of the radiator 3, extending the operating frequency band of the antenna unit 100 through electromagnetic field coupling. The size of each coupling block is 1.2 mm by 0.8 mm. The coupling unit 4 also forms a coupling relationship with the ground layer 2 disposed on the side through the dielectric layer of the substrate 1. This three-dimensional coupling structure can excite multiple resonant modes at different frequencies, achieving ultra-wideband characteristics.
[0033] like Figure 5The S-parameter curves shown demonstrate that the antenna element 100 in this embodiment exhibits good impedance matching characteristics within the 100-240 GHz frequency band. Test data shows that the S11 parameter is -5.63 dB at 110 GHz, -17.10 dB at 140 GHz, -22.49 dB at 166.46 GHz, reaches its optimal value of -22.77 dB at 194.15 GHz, -22.53 dB at 220 GHz, and -8.10 dB at 240 GHz. Throughout the entire operating frequency band (140-220 GHz), the S11 parameter remains below -17 dB, indicating low signal reflection loss and good impedance matching.
[0034] like Figure 6 The efficiency curves shown demonstrate that the antenna element 100 of this embodiment maintains excellent transmission efficiency across a wide frequency range. The antenna efficiency is -0.80 dB at 120 GHz, -0.10 dB at 140 GHz, -0.24 dB at 160 GHz, -0.62 dB at 180 GHz, -0.05 dB at 200 GHz, and reaches -0.02 dB at 220 GHz, approaching the ideal zero-dB transmission efficiency. This indicates that the antenna element 100 of this embodiment can transmit signals efficiently across a wide frequency range with minimal signal loss, and the side-grounded configuration does not adversely affect the antenna efficiency.
[0035] This embodiment further optimizes the structural design of the first radiating unit 32 and the second radiating unit 33 based on the above embodiments. For example... Figure 2 , Figure 3 and Figure 4 As shown, both the first radiating unit 32 and the second radiating unit 33 have a comb-like structure. Taking the first radiating unit 31 as an example, the comb-like structure includes a main trunk 321 and multiple radiating branches 322.
[0036] The main stem 321 is a strip-shaped metal structure extending along the main radiation direction of the radiator 3 and disposed on the second surface 12 of the substrate 1. Multiple radiating branches 322 extend outward from the main stem 321, and the multiple radiating branches 322 are arranged at intervals along the extension direction of the main stem 321. Figure 2 As can be clearly seen, each radiating branch 322 is an independent metallic conductor structure with a C- or U-shaped configuration, connected to the main branch 321 through its apex. This comb-like structure design increases the current path length, enabling wide-band coverage while maintaining miniaturization.
[0037] like Figure 2As shown, the main stem includes a first layer of branches 3221, a second layer of branches 3222, a third layer of branches 3223, a first connecting segment 3224, and a second connecting segment 3225. The first layer of branches 3221 is a horizontal metal strip, with its first end connected to the main stem 321 and its second end extending away from the main stem 321, specifically extending horizontally to the left. The first layer of branches 3221 is located at the uppermost level of the entire radial branch structure 322.
[0038] The second-layer branch 3222 is a horizontal metal strip, the first end of which is connected to the second end of the first-layer branch 3221 via a first connecting segment 3224. The first connecting segment 3224 is a vertical metal strip, serving both a connection and a direction conversion function. The second-layer branch 3222 extends from the second end of the first-layer branch 3221 in a direction opposite to the extension direction of the first-layer branch 3221, specifically extending horizontally to the right towards the main trunk 321. The second-layer branch 3222 is located in the middle layer of the entire radial branch 322.
[0039] The third-layer branch 3223 is a horizontal metal strip, the first end of which is connected to the second end of the second-layer branch 3222 via a second connecting segment 3225. The second connecting segment 3225 is also a vertical metal strip, achieving a second directional change. The third-layer branch 3223 extends from the second end of the second-layer branch 3222 in a direction opposite to the direction of extension of the second-layer branch 3222, specifically extending horizontally to the left again, away from the main trunk 321. The third-layer branch 3223 is located at the lowest level of the entire radial branch 322.
[0040] Through the above structure, the first layer of branches 3221, the first connecting segment 3224, the second layer of branches 3222, the second connecting segment 3225, and the third layer of branches 3223 form a continuous conductive path. This multi-layered bending structure forms a configuration similar to a folded dipole, which can achieve a longer current path within a limited vertical space, thereby generating effective radiation at multiple resonant frequency points.
[0041] In the first radiating unit 32 on the left, two independent C-shaped radiating branches 322 are arranged from top to bottom along the extension direction of the main stem 321. A gap is formed between adjacent radiating branches 322 and the main stem 321, which is a blank area filled with air or substrate dielectric. The presence of these gaps allows for adjustment of the electromagnetic coupling strength between adjacent radiating branches, optimizing impedance matching characteristics. The size of the gap is typically in the range of 0.1 to 0.5 mm, adjusted according to specific frequency response requirements.
[0042] The first layer of branches 3221, the second layer of branches 3222, and the third layer of branches 3223 are all rectangular strip structures, with the length direction of the rectangular strips perpendicular to the extension direction of the main stem 321. This vertical arrangement ensures that the current flow direction in each layer of branches is orthogonal to the current direction in the main stem 321, which is beneficial for forming multiple resonant frequency points. The width and length of each layer of branches are adjusted according to the desired resonant frequency. The first layer of branches 3221 is usually the longest, the second layer of branches 3222 is of medium length, and the third layer of branches 3223 is relatively short. This gradient change in length helps to achieve multi-band response.
[0043] The second radiating element 33 on the right has a structure that is completely symmetrical to the first radiating element 32. The number, shape, and size of its main trunk and radiating branches are the same as those on the left, and it is only mirror-symmetrical about the center line in spatial position. This symmetrical design ensures the symmetry and stability of the antenna element's radiation pattern.
[0044] Grounding layer 2 is disposed on the first surface 11 of substrate 1, i.e., the side surface of substrate 1. A three-dimensional electromagnetic field distribution is formed between the complex comb-like structure of radiator 3 and the side grounding layer 2. When a radio frequency signal is fed into radiator 3 through feeding structure 31, current flows from connection portion 34 into the main trunks 321 on the left and right sides respectively, and then branches from the main trunks 321 into each radiating branch 322. Inside each radiating branch 322, the current flows along the first branch 3221 to the far end, turns to the second branch 3222 via the first connection section 3224 and flows back, and then turns to the third branch 3223 via the second connection section 3225 and flows to the far end. This tortuous current path forms a time-varying electromagnetic field around the radiating branch 322, radiating electromagnetic waves into free space. At the same time, these electromagnetic fields interact with the side grounding layer 2 through the dielectric layer of substrate 1, forming a mirror current distribution. The side-grounding configuration allows the grounding layer 2 to provide an effective grounding reference surface for the radiator 3 in the vertical direction, while not forming a complete shield directly below the radiator 3. This structure is beneficial for the excitation of certain specific radiation modes.
[0045] like Figure 5 As shown in the radiation pattern, the antenna element in this embodiment achieves a maximum gain of 5.67 dB and is isotropic at 100 GHz, exhibiting a clear directional radiation pattern. The main lobe points towards the normal direction of substrate 1, the half-power beamwidth is approximately 60 degrees, and the sidelobe level is below -10 dB. This directional radiation characteristic allows the antenna element to concentrate energy in the target communication direction, reducing signal interference from the surrounding environment and improving the anti-interference capability of the communication link. The side-grounded structure has a specific impact on the radiation pattern, giving the antenna element good radiation performance in the direction perpendicular to the ground plane.
[0046] In this embodiment, the antenna element exhibits uniform current distribution across all frequency bands in its radiating portion. At 120 GHz, the maximum current density reaches 3683.76 amperes per meter. The current is primarily concentrated in the radiating stubs 322 and the connecting portion 34, without any localized over-concentration. Within each radiating stub 322, the current exhibits a certain gradient distribution across the first stub 3221, the second stub 3222, and the third stub 3223. Typically, the current density is higher at the bends of each stub layer and relatively lower in the middle section. This uniform current distribution ensures excellent heat dissipation, preventing performance degradation due to localized overheating and extending the antenna element's lifespan.
[0047] The current distribution pattern changes at different frequencies. At low frequencies, the current is mainly concentrated in the longer radiating stubs 322, especially the longer radiating stubs 3221 (first layer) and 3223 (third layer). At high frequencies, the current is more distributed in the shorter radiating stubs, or concentrated at the ends and bends of the stubs. This frequency-dependent current distribution pattern is the physical mechanism by which the antenna element achieves ultra-wideband characteristics. Radiation stubs of different sizes resonate at different frequency bands, and the combination of multiple radiation stubs covers an ultra-wideband of 100 to 240 GHz.
[0048] The overall dimensions of the antenna unit in this embodiment are 5 mm x 5 mm x 2 mm, with the radiator 3 having a total length of 2.5 mm and a total width of 1.8 mm, and the connecting portion 34 having a width of 0.2 mm. The first radiating unit 32 on the left side contains three independent radiating branches 322, and the second radiating unit 33 on the right side also contains three independent radiating branches 322. Through the above-described comb-like structure design and the configuration of multiple independent C-shaped radiating branches, combined with the special layout of the side grounding layer 2, this embodiment achieves ultra-wideband coverage of 100 to 240 GHz while maintaining compact physical dimensions and excellent electrical performance.
[0049] In this embodiment, the ground layer 2 is fabricated using the same printed circuit board process as the radiator 3 and coupling unit 4. It is formed in one step on the first surface 11 of the substrate 1 through photolithography and etching processes, without the need for additional assembly processes. This integrated manufacturing method not only reduces production costs but also improves manufacturing precision and product consistency, making it suitable for large-scale mass production.
[0050] This embodiment optimizes the structure of grounding layer 2 based on the above embodiments. For example... Figure 2 As shown, the ground layer 2 is a rectangular metal layer structure, disposed on the first surface 11 of the substrate 1, i.e., the side surface of the substrate 1. The area of the ground layer 2 is larger than the projected area of the radiator 3 in the direction of this side surface.
[0051] Specifically, the grounding layer 2 has dimensions of 3 mm by 4 mm, while the projected area of the radiator 3 in the direction perpendicular to the first surface 11 is approximately 2.5 mm by 1.8 mm. The area of the grounding layer 2 is approximately 2.67 times the projected area of the radiator 3. This design allows the grounding layer 2 to fully cover the projected area of the radiator 3 in that direction, with ample margin around it.
[0052] The distance between the edge of the grounding layer 2 and the projected edge of the radiator 3 remains substantially consistent in all directions, ranging from approximately 0.25 to 1.1 mm. This dimensional relationship ensures that the grounding layer 2 can provide a stable ground reference for the radiator 3 while suppressing the excitation and propagation of surface waves. Since the grounding layer 2 is disposed on the side of the substrate 1, the larger area of the grounding layer 2 can form an effective ground plane in the vertical direction, improving the radiation efficiency of the antenna element 100, reducing back radiation, and increasing the front-to-back ratio.
[0053] The side-grounded configuration also provides additional design flexibility. In practical applications, ground plane 2 can serve as an interface for connecting to other circuit modules, enabling lateral electrical connections and mechanical fixation. By providing appropriate connection pads or pins on ground plane 2, the antenna unit 100 can be directly mounted to the side or edge of the circuit board. This mounting method has significant advantages in certain space-constrained applications. For example, in ultra-thin wearable devices or multi-layered stacked communication modules, side-mounted antenna units 100 can more effectively utilize vertical space and improve system integration density.
[0054] In this embodiment, the ground layer 2 is fabricated using the same printed circuit board process as the radiator 3 and coupling unit 4. It is formed in one step on the first surface 11 of the substrate 1 through photolithography and etching processes, without the need for additional assembly processes. This integrated manufacturing method not only reduces production costs but also improves manufacturing precision and product consistency, making it suitable for large-scale mass production.
[0055] Through the progressive design of the above four embodiments, the antenna unit 100 provided in this application achieves comprehensive coverage from basic structure to complete optimized structure, which can meet the differentiated requirements of different application scenarios for cost, performance and integration.
[0056] The antenna unit 100 provided in this application integrates the ground layer 2, radiator 3, and coupling unit 4 onto a substrate 1 to form an integrated structure. The antenna is fabricated using printed circuit board (PCB) technology, eliminating the need for special materials such as ceramic substrates or metal cavities. This avoids complex manufacturing processes, reduces production costs, and makes it suitable for large-scale commercial deployment. Specifically, the substrate 1 is made of FR4 epoxy resin with a dielectric constant of 4.4, a dielectric loss tangent of 0.02, and a thickness of 0.8 mm. The ground layer 2, radiator 3, and coupling unit 4 are all formed on the substrate 1 in a single step using oxygen-free copper foil through photolithography and etching processes. Compared to traditional ceramic antennas or metal cavity antennas, production costs can be reduced by 30% to 50%. Furthermore, the PCB technology offers excellent process compatibility, allowing the antenna unit 100 to be co-integrated with on-chip devices such as RF chips and filters on the same substrate 1, reducing interconnection losses and lowering system design complexity and manufacturing costs. As shown in Embodiment 5, the radiator 3 is directly connected to the RF transceiver circuit via a feeding structure (not shown), with the interconnection length controlled within a few millimeters, effectively avoiding the signal attenuation and delay problems caused by long-distance interconnection in traditional discrete antenna schemes. Secondly, by setting coupling units 4 at intervals on both sides of the radiator 3, and coupling units 4 being coupled to the ground layer 2 through the dielectric layer of the substrate 1, this structural design effectively extends the operating frequency band of the antenna element 100 without increasing the feeding complexity, achieving ultra-wideband coverage. As shown in Embodiments 2 and 3, the coupling unit 4 includes a first coupling block 41 and a second coupling block 42, which are respectively disposed on the first and second sides of the radiator 3, with a spacing of 0.2 mm from the radiator 3. Each coupling block has a size of 1.2 mm by 0.8 mm. Figure 5 The S-parameter test results shown indicate that the operating frequency band can cover 100 to 240 GHz, and the S11 parameter is below -17 dB in the 140 to 220 GHz band, reaching an optimal value of -22.77 dB at 194.15 GHz, thus meeting the wideband requirements of 6G communication. Figure 4 The efficiency curves shown indicate that the antenna efficiency is -0.05 dB at 200 GHz and -0.02 dB at 220 GHz, approaching the ideal zero-dB transmission efficiency, with minimal signal transmission loss.
[0057] Finally, the integrated structural design enables the miniaturization of the antenna unit 100, with its overall size controllable at the millimeter level. This allows for flexible integration into space-constrained applications such as micro-terminal devices and wearable devices, enhancing the flexibility of device design. As shown in Embodiment 3, the overall size of the antenna unit 100 is 5 mm x 5 mm x 2 mm. The radiator 3 includes a first radiating element 32 and a second radiating element 33, which are connected by a connecting part 34 and symmetrically arranged about the center line. The total length of the radiator 3 is 2.5 mm, and the total width is 1.8 mm. Both the first radiating element 32 and the second radiating element 33 have a comb-like structure. The comb-like structure includes a main stem 321 and multiple radiating branches 322. The radiating branches 322 include a first layer of branches 3221, a second layer of branches 3222, and a third layer of branches 3223. Through the multi-layer bending structure, multiple resonant modes are realized in a limited space. At 100 GHz, the maximum gain reaches 5.67 dB isotropic, the main lobe direction points to the normal direction of the substrate 1, the half-power beamwidth is approximately 60 degrees, and the maximum current density reaches 3683.76 amperes per meter at 120 GHz. However, the current distribution is uniform, and no local overheating occurs, ensuring long-term stable operation. This compact physical size allows the antenna element 100 to be widely used in various 6G communication terminal devices such as smartphones, smartwatches, augmented reality glasses, and industrial sensors.
[0058] This embodiment provides a communication device, which includes an antenna unit 100 as described in any one of embodiments 1 to 4.
[0059] This embodiment provides a communication device, which includes an antenna unit 100 as described in any one of embodiments 1 to 4.
[0060] The communication device can be a 6G terminal device, an IoT terminal, a millimeter-wave communication device, a wearable device, or a miniature sensor, or any other electronic device that needs to communicate in the millimeter-wave and terahertz frequency bands. The antenna unit 100 integrated in the communication device is fabricated using printed circuit board technology and is integrated with other RF devices such as RF chips, filters, and power amplifiers inside the communication device on the same substrate or adjacent substrates to form a highly integrated communication module.
[0061] Taking a 6G terminal device as an example, the terminal device includes a processor, a memory, a radio frequency transceiver circuit, and the antenna unit 100 described in this application. The radio frequency signal generated by the radio frequency transceiver circuit is fed into the radiator 3 of the antenna unit 100 through the feed port 311. The radiator 3 converts the radio frequency signal into electromagnetic waves and radiates them into space, thus transmitting wireless signals. Conversely, when the antenna unit 100 receives electromagnetic wave signals in space, the radiator 3 converts the electromagnetic wave energy into radio frequency signals, which are then transmitted to the radio frequency transceiver circuit via a feed structure (not shown) for signal processing and demodulation. Finally, the processor completes the data processing.
[0062] Because the grounding layer 2 of the antenna element 100 is located on the side of the substrate 1, this structural configuration offers unique advantages in the system integration of communication equipment. The communication equipment can use a lateral connection method, mounting the antenna element 100 at the edge or side of the main circuit board, achieving electrical connection and mechanical fixation to the main circuit board through the grounding layer 2. This mounting method effectively saves surface space on the main circuit board, allowing the antenna element 100 to be arranged in the peripheral area of the equipment, satisfying the antenna's spatial radiation requirements without occupying valuable motherboard area. In a multi-antenna array configuration, the side-grounded antenna element 100 can be arranged along the edge of the equipment to form a linear array or a ring array, achieving beamforming and spatial diversity functions.
[0063] Because the antenna element 100 operates in a frequency band covering 100 to 240 gigahertz, this communication device can support ultra-high-speed data transmission, with a theoretical peak rate of hundreds of gigabits per second, meeting the core requirements of 6G communication for ultra-high speed and ultra-low latency. The miniaturized design of the antenna element 100 allows for effective control of the overall size of the communication device, making it particularly suitable for wearable devices and micro IoT terminals with strict limitations on size and weight.
[0064] In the communication equipment, the antenna unit 100 and the RF chip are interconnected using short-distance microstrip lines or coplanar waveguides, with the interconnection length controlled within a few millimeters, effectively reducing transmission loss and signal delay. Since the grounding layer 2, radiator 3, and coupling unit 4 share the same substrate with the RF chip or are electrically interconnected via side connections, the entire communication module achieves high integration. Compared to traditional discrete antenna solutions, this reduces system complexity and manufacturing costs, while simultaneously improving product reliability and consistency.
[0065] The communication device of this embodiment can be widely used in various 6G communication application scenarios such as smartphones, tablets, smartwatches, augmented reality glasses, drones, smart home devices, industrial sensors, and vehicle networking terminals, providing a practical hardware solution for the commercial deployment of next-generation communication technologies. The above descriptions are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the content of this specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. An antenna element, characterized in that, include: substrate; A grounding layer is disposed on the first surface of the substrate; A radiator is disposed on the second surface of the substrate, and the radiator is provided with a power feeding structure; A coupling unit is disposed on the second surface of the substrate, the coupling unit is disposed at a distance from the radiator, and the coupling unit is coupled to the ground layer through the dielectric layer of the substrate; Wherein, the first surface is the side surface of the substrate, the second surface is the top surface of the substrate, and the ground layer, the radiator and the coupling unit are integrated into the substrate to form an integrated structure.
2. The antenna element according to claim 1, characterized in that, The radiator includes a first radiating unit, a second radiating unit, and a connecting part. The first radiating unit and the second radiating unit are both disposed on the second surface. The first radiating unit and the second radiating unit are symmetrically arranged about the center line. The connecting part connects the first radiating unit and the second radiating unit. The power feeding structure is electrically connected to the connecting part.
3. The antenna element according to claim 2, characterized in that, Both the first radiating unit and the second radiating unit have a comb-like structure. The comb-like structure includes a main trunk and multiple radiating branches. The multiple radiating branches extend outward from the main trunk and are spaced apart along the extension direction of the main trunk.
4. The antenna element according to claim 3, characterized in that, The key cadres include The first layer of branches, the first end of which is connected to the main stem, and the second end of which extends away from the main stem; The second layer of branches, the first end of the second layer of branches is connected to the second end of the first layer of branches through a first connecting segment, and the second layer of branches extends from the second end of the first layer of branches in a direction opposite to the extension direction of the first layer of branches; The third layer of branches, the first end of which is connected to the second end of the second layer of branches through a second connecting segment, and the third layer of branches extends from the second end of the second layer of branches in a direction opposite to the extension direction of the second layer of branches; The first layer of branches, the first connecting segment, the second layer of branches, the second connecting segment, and the third layer of branches form a continuous conductive path.
5. The antenna element according to claim 4, characterized in that, A gap is formed between adjacent radial branches.
6. The antenna element according to claim 5, characterized in that, The first layer of branches, the second layer of branches, and the third layer of branches are all rectangular strip structures, and the length direction of the rectangular strip structure is perpendicular to the extension direction of the main stem.
7. The antenna element according to any one of claims 1 to 6, characterized in that, The coupling unit includes a first coupling block and a second coupling block. Both the first coupling block and the second coupling block have a rectangular block structure. The first coupling block is disposed on a first side of the radiator and is spaced apart from the radiator. The second coupling block is disposed on a second side of the radiator and is spaced apart from the radiator. The first side and the second side are opposite to each other.
8. The antenna element according to claim 1, characterized in that, The power feeding structure is a microstrip line structure, which is disposed on the second surface. The first end of the microstrip line structure is electrically connected to the radiator, and the second end of the microstrip line structure forms a power feeding port.
9. The antenna element according to claim 1, characterized in that, The grounding layer has a rectangular metal layer structure, and the area of the grounding layer is larger than the projected area of the radiator.
10. A communication device, characterized in that, Includes the antenna element as described in any one of claims 1-9.