Quality detection method and quality detection device for optical module production

Abstract

The invention relates to the field of optical module production, and discloses a quality detection method and a quality detection device for optical module production, and the method comprises the steps: detecting the heat conduction efficiency of each heat conduction heat pipe from a coil pipe structure to a first section and a second section of the heat conduction heat pipe, and taking the heat conduction efficiency as first heat conduction efficiency; bending the area corresponding to the first shell side wall of the first shell raw material plate and the heat conduction heat pipes to be perpendicular to the area corresponding to the bottom plate to obtain a first shell, and detecting the heat conduction efficiency of each heat conduction heat pipe from the coil pipe structure to the first section and the second section of the heat conduction heat pipe as the second heat conduction efficiency corresponding to each heat conduction heat pipe; and according to the first heat conduction efficiency and the second heat conduction efficiency corresponding to the two heat conduction heat pipes respectively, the heat conduction efficiency score value of the first shell is determined, and the first shell with different heat conduction efficiency score value ranges is used for producing optical modules with different transmission rate levels. According to the invention, high-efficiency quality detection can be carried out on the optical module shell adopting the heat pipe, and the production efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of optical module manufacturing technology, and more specifically, to a quality inspection method and a quality inspection device for optical module manufacturing. Background Technology

[0002] As a core component for photoelectric signal conversion, the heat dissipation performance of optical modules directly affects the reliability of data transmission. With the development of communication technology towards higher speeds and higher densities, the power consumption of optical modules is increasing exponentially, posing a severe challenge to heat dissipation solutions. While the metal casing heat dissipation technology currently widely used in the industry is popular due to its simple structure and controllable cost, it has revealed several performance bottlenecks in actual operation.

[0003] From a thermal conductivity perspective, the thermal conductivity of metal casings is insufficient to meet the demands of high-power-density applications. Taking 400G / 800G optical modules as an example, the heat flux density of their DSP chips exceeds 200W / cm², far surpassing that of traditional metal materials (such as aluminum alloys, whose thermal conductivity is approximately...). Copper Approx. The critical heat dissipation threshold. Regarding structural adaptability, the miniaturization trend of optical modules (such as the continuous reduction in SFP and QSFP package sizes) has compressed the effective heat dissipation area of ​​the metal casing. Furthermore, limited by modular design, it is difficult to enhance heat dissipation by adding structures such as fins or grooves. Therefore, some optical modules currently use heat pipes for heat dissipation. The thermal conductivity of heat pipes is significantly higher than that of traditional metal materials, greatly improving the heat dissipation efficiency of optical modules. However, when heat pipes are currently installed on the optical module casing, it is difficult to perform efficient quality inspection of the casing. Summary of the Invention

[0004] The purpose of this application is to provide a quality inspection method and device for optical module production, which solves the technical problem of difficulty in efficiently inspecting the housing of optical modules using heat pipes, and achieves the technical effect of efficiently inspecting the housing of optical modules using heat pipes.

[0005] This application provides a quality inspection method for optical module production. The method includes: on a first housing material plate, welding the coil structures of two heat-conducting heat pipes to the corresponding areas of a base plate; welding the first and second segments of the two heat-conducting heat pipes to the corresponding areas of two first housing sidewalls; detecting the thermal conductivity of each heat-conducting heat pipe from the coil structure to the first and second segments of the heat-conducting heat pipe, as a first thermal conductivity; wherein, two first housing sidewalls are respectively provided on both sides of the area corresponding to the base plate of the first housing material plate, and the first and second segments of each heat-conducting heat pipe are respectively located at both ends of the coil structure; bending the area corresponding to the first housing sidewall and the heat-conducting heat pipe of the first housing material plate together to be perpendicular to the area corresponding to the base plate to obtain a first housing; detecting the thermal conductivity of each heat-conducting heat pipe from the coil structure to the first and second segments of the heat-conducting heat pipe, as a second thermal conductivity for each heat-conducting heat pipe; determining the thermal conductivity score value of the first housing based on the first and second thermal conductivity efficiencies corresponding to the two heat-conducting heat pipes respectively; and using first housings with different thermal conductivity score value ranges for producing optical modules with different transmission rate levels.

[0006] In one possible implementation, the thermal conductivity score of the first shell is determined based on the first and second thermal conductivity efficiencies corresponding to the two heat pipes, respectively. This includes: determining the minimum thermal conductivity among the first and second thermal conductivity efficiencies corresponding to the two heat pipes; normalizing the minimum thermal conductivity based on a standard thermal conductivity to obtain a normalized minimum thermal conductivity; determining the difference between the first and second thermal conductivity efficiencies corresponding to the two heat pipes, and determining the maximum value among these differences as the maximum thermal conductivity difference; determining the ratio of the maximum thermal conductivity difference to a preset thermal conductivity difference as the thermal conductivity stability factor of the first shell; and calculating the thermal conductivity score using the following formula: ;in, This indicates the thermal conductivity rating. This represents the normalized minimum thermal conductivity. Indicates the thermal conductivity stability factor. Indicates the first weight. This indicates the second weight.

[0007] In another possible implementation, the thermal conductivity score of the first shell is determined based on the first and second thermal conductivity efficiencies corresponding to the two heat pipes, respectively. This further includes: determining the minimum thermal conductivity among the first and second thermal conductivity efficiencies corresponding to the two heat pipes; normalizing the minimum thermal conductivity based on a standard thermal conductivity to obtain a normalized minimum thermal conductivity; determining the difference between the first and second thermal conductivity efficiencies corresponding to the two heat pipes, and determining the maximum value among these differences as the maximum thermal conductivity difference; determining the ratio of the maximum thermal conductivity difference to a preset thermal conductivity difference as a thermal stability factor; and calculating the thermal conductivity score using the following formula: ;in, This indicates the thermal conductivity rating. This represents the normalized minimum thermal conductivity. Represents the natural constant. Indicates the thermal conductivity stability factor. This represents the sensitivity coefficient.

[0008] In another possible implementation, the method further includes: detecting the bending heat flux density at the bend between the corresponding regions of the first housing sidewall and the bottom plate for each heat pipe; obtaining the standard heat flux density of the heat pipe when it is not bent; determining the difference between the standard heat flux density and the bending heat flux density of each heat pipe as the bending heat flux attenuation density; determining the ratio of the bending heat flux attenuation density to the standard heat flux density as the bending attenuation factor for each heat pipe; and determining the product of the second thermal conductivity efficiency and the bending attenuation factor for each heat pipe to adjust the second thermal conductivity efficiency of each heat pipe.

[0009] In another possible implementation, the method further includes: determining the maximum bend attenuation factor among the bend attenuation factors corresponding to the multiple heat pipes; and determining the product of the second thermal conductivity and the maximum bend attenuation factor for each heat pipe to adjust the second thermal conductivity of each heat pipe.

[0010] In another possible implementation, the method further includes: multiplying the thermal stability factor of the first housing by the maximum bending attenuation factor, to adjust the thermal stability factor of the first housing.

[0011] This application embodiment also provides a quality inspection device, employing the quality inspection method for optical module production as described in any of the preceding claims. The quality inspection device includes a first inspection component, multiple second inspection components, and multiple connecting arms. Each second inspection component is rotatably connected to the first inspection component via a connecting arm. The first inspection component is equipped with a control component. The first inspection component is used to heat the coil structure of the heat-conducting heat pipe using a heat source of first power. The multiple second inspection components are used to detect the first temperature value at the end of the first segment of the heat-conducting heat pipe and the second temperature value at the end of the second segment of the heat-conducting heat pipe. The control component stores the first length of the first segment of the heat-conducting heat pipe, the second length of the second segment of the heat-conducting heat pipe, and the heat pipe cross-sectional area. Before and after bending the area corresponding to the first shell sidewall of the first shell raw material plate and the heat-conducting heat pipe together to be perpendicular to the area corresponding to the bottom plate, the control component is used to determine the product of the first power and the first length and divide it by the first temperature difference and the heat pipe cross-sectional area, and to determine the product of the first power and the second length and divide it by the second temperature difference and the heat pipe cross-sectional area, respectively, as the first thermal conductivity and the second thermal conductivity corresponding to the two heat-conducting heat pipes.

[0012] In another possible implementation, the second detection component is provided with a snap-fit ​​structure for snapping the second detection component onto the heat pipe.

[0013] In another possible implementation, a heat flow meter is also provided on the connecting arm. The heat flow meter and the heat pipe are correspondingly positioned at the bend. Before and after the area corresponding to the first shell sidewall of the first shell material plate and the heat pipe are bent together to be perpendicular to the area corresponding to the bottom plate, the heat flow meter is used to detect the bending heat flow density of each heat pipe at the bend between the area corresponding to the first shell sidewall and the bottom plate. The heat flow meter is a thin-film heat flow sensor, and the heat flow meter is provided with a snap-fit ​​structure for engaging with the outer sidewall of the heat pipe.

[0014] In another possible implementation, the control component is also used to determine the thermal conductivity score of the first housing based on the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes respectively; the control component is also provided with an indicator light for indicating different ranges of thermal conductivity score values ​​of the first housing.

[0015] The beneficial effects of the embodiments in this application compared with the prior art are: This application provides a quality inspection method for optical module production. The method includes: on a first housing material plate, welding the coil structures of two heat-conducting heat pipes to the corresponding areas of a base plate; welding the first and second segments of the two heat-conducting heat pipes to the corresponding areas of two first housing sidewalls; detecting the thermal conductivity of each heat-conducting heat pipe from the coil structure to the first and second segments of the heat-conducting heat pipe, as a first thermal conductivity; wherein, two first housing sidewalls are respectively provided on both sides of the area corresponding to the base plate of the first housing material plate, and the first and second segments of each heat-conducting heat pipe are respectively located at both ends of the coil structure; bending the area corresponding to the first housing sidewall and the heat-conducting heat pipe of the first housing material plate together to be perpendicular to the area corresponding to the base plate to obtain a first housing; detecting the thermal conductivity of each heat-conducting heat pipe from the coil structure to the first and second segments of the heat-conducting heat pipe, as a second thermal conductivity for each heat-conducting heat pipe; determining the thermal conductivity score value of the first housing based on the first and second thermal conductivity efficiencies corresponding to the two heat-conducting heat pipes respectively; and using first housings with different thermal conductivity score value ranges for producing optical modules with different transmission rate levels. In the method of this application embodiment, before and after bending the area corresponding to the side wall of the first housing of the first housing material plate and the heat pipe together to be perpendicular to the area corresponding to the bottom plate, the heat conduction efficiency score of the first housing is determined by the heat conduction efficiency of the heat pipe. Then, the first housings with different heat conduction efficiency score ranges are used to produce optical modules of different transmission rate levels, which improves the scientific nature of the overall quality inspection of the optical module housing and improves the overall evaluation accuracy of the heat dissipation effect assessment. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A flowchart illustrating the first quality inspection method for optical module production provided in this application embodiment; Figure 2 A schematic diagram of the structure of the first housing used in the first quality inspection method for optical module production provided in the embodiments of this application; Figure 3 A flowchart illustrating a second quality inspection method for optical module production provided in this application embodiment; Figure 4 This is a front view of the first quality inspection device provided in the embodiments of this application when used on the first housing; Figure 5A top view of the first quality inspection device provided in this application embodiment when used on the first housing; In the figure, 101 is the first raw material plate; 1 is the first shell; 11 is the bottom plate; 12 is the side wall of the first shell; 4 is the heat pipe; 41 is the coil structure; 5 is the quality detection device; 51 is the first detection component; 511 is the control component; 52 is the second detection component; 53 is the connecting arm; and 531 is the heat flow meter. Detailed Implementation

[0018] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0019] It should be noted that when a component or structure is referred to as being "fixed to" or "set on" another component or structure, it can be directly on or indirectly on the other component or structure. When a component or structure is referred to as being "connected to" another component or structure, it can be directly connected to or indirectly connected to the other component or structure.

[0020] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device, component, or structure referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0022] Currently, when heat pipes are installed on optical module housings, it is difficult to perform efficient quality inspection on the optical module housings that use heat pipes.

[0023] Based on the above reasons, this application provides a quality inspection method for optical module production. The method includes: welding the coil structures of two heat-conducting heat pipes to corresponding areas of a base plate on a first housing raw material plate; welding the first and second sections of the two heat-conducting heat pipes to corresponding areas of two first housing sidewalls; and detecting the thermal conductivity of each heat-conducting heat pipe from the coil structure to the first and second sections of the heat-conducting heat pipe, which is taken as the first thermal conductivity. Two first housing sidewalls are respectively provided on both sides of the area corresponding to the base plate of the first housing raw material plate, and each heat-conducting heat pipe... The first and second segments are respectively located at both ends of the coil structure. The area corresponding to the first shell sidewall of the first shell raw material plate and the heat pipe are bent together to be perpendicular to the area corresponding to the bottom plate to obtain the first shell. The thermal conductivity of each heat pipe from the coil structure to the first and second segments of the heat pipe is detected and used as the second thermal conductivity of each heat pipe. Based on the first and second thermal conductivity of the two heat pipes, the thermal conductivity score of the first shell is determined. First shells with different thermal conductivity score ranges are used to produce optical modules of different transmission rate levels. In the method of this application embodiment, before and after bending the area corresponding to the first shell sidewall of the first shell raw material plate and the heat pipe together to be perpendicular to the area corresponding to the bottom plate, the thermal conductivity score of the first shell is determined by the thermal conductivity of the heat pipe. Then, the first shells with different thermal conductivity score ranges are used to produce optical modules of different transmission rate levels, which improves the scientific nature of the overall quality inspection of the optical module shell and improves the overall evaluation accuracy of the heat dissipation effect assessment.

[0024] In some scenarios, the quality inspection method for optical module production according to an embodiment of this application can be applied to the quality inspection of optical module housings that use heat pipes for heat dissipation, thereby improving the quality inspection efficiency of optical module housings.

[0025] The following describes in detail a quality inspection method for optical module production provided in this application embodiment, using specific examples.

[0026] Figure 1 A flowchart illustrating the first quality inspection method for optical module production provided in this application embodiment is shown below. Figure 1 As shown, the quality inspection method used for optical module production includes S110 to S130, and S110 to S130 will be explained in detail below.

[0027] S110. On the first shell material plate 101, the coil structures 41 of two heat-conducting heat pipes 4 are welded to the corresponding areas of the base plate 11. The first and second sections of the two heat-conducting heat pipes 4 are welded to the corresponding areas of the two first shell sidewalls 12. The thermal conductivity of each heat-conducting heat pipe 4 from the coil structure 41 to the first and second sections of the heat-conducting heat pipe 4 is measured and used as the first thermal conductivity. Two first shell sidewalls 12 are respectively provided on both sides of the area corresponding to the base plate 11 of the first shell material plate 101, and the first and second sections of each heat-conducting heat pipe 4 are respectively located at both ends of the coil structure 41.

[0028] Figure 2 A schematic diagram of the structure of the first housing used in the first quality inspection method for optical module production provided in the embodiments of this application is shown below. Figure 2 As shown, the quality inspection method for the production of this optical module can be used to control the quality of the first housing 1 on which the heat-conducting heat pipe 4 is welded on the first housing raw material plate 101. The two sides of the area corresponding to the bottom plate of the first housing raw material plate 101 can be respectively provided with the area corresponding to the side wall 12 of the first housing. The coil structure 41 of the heat-conducting heat pipe 4 can be welded to the area corresponding to the bottom plate of the first housing raw material plate 101. During welding, the coil structure 41 of the heat-conducting heat pipe 4 can be firmly welded and fixed to the pre-designed heat source contact point on the bottom plate. The coil structure 41 can provide a large heat contact area for the optoelectronic module of the optical module to achieve efficient heat dissipation of the optoelectronic module.

[0029] Meanwhile, the first section of the heat pipe 4 can be welded to a corresponding area of ​​the first housing sidewall 12, and the second section of the heat pipe 4 can be welded to another corresponding area of ​​the first housing sidewall 12.

[0030] like Figure 2 As shown, the first and second sections of each heat pipe 4 can be located at both ends of the coil structure 41. After these welding operations are completed, the thermal conductivity of each heat pipe 4 from the coil structure 41 to the first and second sections of the heat pipe 4 can be detected, and this can be used as the first thermal conductivity of the heat pipe 4.

[0031] S120. The area corresponding to the first shell sidewall 12 of the first shell material plate 101 and the heat pipe 4 are bent together to be perpendicular to the area corresponding to the bottom plate 11 to obtain the first shell 1. The heat conduction efficiency of each heat pipe 4 from the coil structure 41 to the first and second sections of the heat pipe 4 is detected and used as the second heat conduction efficiency corresponding to each heat pipe 4.

[0032] like Figure 2As shown in the upper and lower figures, during the production of the first shell 1, the area corresponding to the first shell sidewall 12 of the first shell raw material plate 101 and the heat pipe 4 can be bent together to be perpendicular to the area corresponding to the bottom plate 11, thereby obtaining the first shell 1. By bending, the original planar raw material plate can be transformed into the first shell 1 with a three-dimensional structure.

[0033] After bending is completed and the first shell 1 is formed, the bending operation will have a stress effect on the welding connection point and the structural state of the heat pipe itself. The heat pipe in the first shell after bending is tested again, that is, the heat conduction efficiency of each heat pipe 4 from the coil structure to the first and second sections of the heat pipe 4 can be tested again, which is used as the second heat conduction efficiency corresponding to the heat pipe 4.

[0034] S130. Based on the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes 4 respectively, determine the thermal conductivity score of the first housing 1. The first housing 1 with different thermal conductivity score ranges is used to produce optical modules with different transmission rate levels.

[0035] After obtaining the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes 4, the overall heat dissipation quality of the first housing 1 can be evaluated based on the two detected thermal conductivity values. Specifically, the calculation can be performed based on the first thermal conductivity and the second thermal conductivity values ​​corresponding to the two heat pipes 4 obtained in steps S110 and S120, and then the thermal conductivity score value characterizing the comprehensive thermal conductivity performance of the first housing can be determined based on these two sets of values.

[0036] The determined thermal conductivity rating can be classified according to different preset numerical ranges. The first housing 4 with different thermal conductivity rating ranges can be used to produce optical modules with different transmission rate levels. The final result of the thermal conductivity rating comprehensively reflects the relationship between the initial performance before bending and the stable performance after bending. The magnitude of the difference in the rating directly reflects the manufacturing process's ability to maintain the heat pipe's heat dissipation performance.

[0037] The beneficial effect of the above implementation method is that, before and after bending the area corresponding to the side wall of the first housing of the first housing material plate and the heat pipe together to be perpendicular to the area corresponding to the bottom plate, the heat conduction efficiency score of the first housing is determined by the heat conduction efficiency of the heat pipe. Then, the first housings with different heat conduction efficiency score ranges are used to classify the production of optical modules with different transmission rate levels, which improves the scientific nature of the overall quality inspection of the optical module housing and improves the overall evaluation accuracy of the heat dissipation effect assessment.

[0038] The beneficial effect of the above implementation method is that after the area corresponding to the first shell sidewall of the first shell material plate and the heat pipe are bent together to be perpendicular to the area corresponding to the bottom plate, the heat conduction effect of the heat pipe is affected. This allows for the screening of heat pipes with poor heat dissipation after bending, thereby improving the accuracy of the evaluation of the heat dissipation effect of the optical module.

[0039] The beneficial effect of the above implementation method is that it can screen out the first shell with a large change in thermal conductivity before and after bending the area corresponding to the side wall of the first shell material plate and the heat pipe together to be perpendicular to the area corresponding to the bottom plate, thereby improving the accuracy of the evaluation of the thermal conductivity efficiency of the first shell.

[0040] In some implementations, in S130 above, the thermal conductivity score of the first shell 1 is determined based on the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes 4, including S131 to S132. S131 to S132 will be explained in detail below.

[0041] S131. Determine the minimum thermal conductivity efficiency between the first and second thermal conductivity efficiencies corresponding to the two heat pipes 4. Based on historical data of thermal conductivity efficiency, normalize the minimum thermal conductivity efficiency to obtain a normalized thermal conductivity efficiency difference. Determine the thermal conductivity efficiency difference between the first and second thermal conductivity efficiencies corresponding to the two heat pipes 4, and determine the maximum value among the thermal conductivity efficiency differences corresponding to the two heat pipes 4, as the maximum thermal conductivity efficiency difference. Determine the ratio of the maximum thermal conductivity efficiency difference to the preset thermal conductivity efficiency difference, as the thermal conductivity stability factor of the first shell 1.

[0042] When determining the thermal conductivity rating, the first thermal conductivity and the second thermal conductivity of each heat pipe 4 can be identified from the acquired data. Then, the minimum value is selected from the four efficiency values ​​as the minimum thermal conductivity. The minimum thermal conductivity represents the weakest link in the thermal conductivity of the first shell 1 before and after bending.

[0043] After obtaining the minimum thermal conductivity, the minimum thermal conductivity can be normalized based on the standard thermal conductivity. Specifically, the ratio of the thermal conductivity to the minimum thermal conductivity can be calculated to convert the minimum thermal conductivity into a dimensionless normalized minimum thermal conductivity, making the test data from different batches comparable.

[0044] Subsequently, the difference between the first and second thermal conductivity efficiencies of each heat pipe 4 can be calculated to obtain two thermal conductivity difference values. By comparing these two differences, the larger value can be selected as the maximum thermal conductivity difference value. The maximum thermal conductivity difference value reflects the fluctuation of the maximum thermal conductivity caused by the bending operation.

[0045] After obtaining the maximum thermal conductivity difference, the maximum thermal conductivity difference and the preset thermal conductivity difference can be correlated. Specifically, the ratio of the maximum thermal conductivity difference to the preset thermal conductivity difference can be calculated by division. The ratio is then used as the thermal conductivity stability factor of the first shell 1. The thermal conductivity stability factor can quantitatively express the heat dissipation stability of the shell structure during bending operations.

[0046] S132. Calculate the thermal conductivity score using the following formula:

[0047] in, This indicates the thermal conductivity rating. This represents the normalized minimum thermal conductivity. Indicates the thermal conductivity stability factor. Indicates the first weight. This indicates the second weight.

[0048] In this implementation, a first product of a first weight and the difference in normalized thermal conductivity can be determined, and a second product of a second weight and the difference between 1 and the thermal conductivity stability factor can be determined. The sum of the first product and the second product is determined as the thermal conductivity score of the first shell 1.

[0049] After obtaining the normalized thermal conductivity difference and the thermal conductivity stability factor, the product of the first weight and the normalized minimum thermal conductivity can be determined, and the result of multiplying the two can be taken as the first product. Then, the product of the second weight and the difference between 1 and the thermal conductivity stability factor can be determined, and the result of multiplying the two can be taken as the second product.

[0050] After obtaining the first product and the second product, the first product and the second product calculated above can be added together. The sum can be directly used as the thermal conductivity score to characterize the overall heat dissipation performance of the first housing 1. The thermal conductivity score provides the core basis for the subsequent graded production of optical modules.

[0051] For example, the first weight It can be 0.7, the second weight. It can be 0.3.

[0052] The beneficial effect of the above implementation method is that the thermal conductivity score is determined by comprehensively considering the difference between the normalized minimum thermal conductivity and the maximum thermal conductivity. This takes into account both the minimum thermal conductivity of the two heat pipes and the imbalance of their thermal conductivity, thus achieving a comprehensive evaluation of the thermal conductivity of the heat pipes and improving the accuracy of the evaluation of the thermal conductivity effect of the first shell of the optical module.

[0053] The beneficial effects of the above implementation method are that, based on the standard thermal conductivity, the minimum thermal conductivity is normalized, thus achieving an accurate assessment of the minimum thermal conductivity according to the standard thermal conductivity; and the ratio of the difference between the maximum thermal conductivity and the preset thermal conductivity difference is determined as the thermal conductivity stability factor of the first shell, avoiding the influence of thermal conductivity caused by the absolute value fluctuation of thermal conductivity, and improving the accuracy of the assessment of the thermal conductivity of the first shell.

[0054] The beneficial effect of the above implementation method is that by evaluating the minimum values ​​of the first and second thermal conductivity efficiencies corresponding to the two heat pipes before and after bending, the thermal conductivity efficiency is comprehensively evaluated, thereby improving the thermal conductivity efficiency.

[0055] In some implementations, S130 above determines the thermal conductivity score of the first housing 1 based on the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes 4, and also includes S133 to S134. S133 to S134 will be explained in detail below.

[0056] S133. Determine the minimum thermal conductivity efficiency between the first and second thermal conductivity efficiencies corresponding to the two heat pipes 4. Based on historical thermal conductivity data, normalize the minimum thermal conductivity efficiency to obtain a normalized thermal conductivity efficiency difference. Determine the thermal conductivity efficiency difference between the first and second thermal conductivity efficiencies corresponding to the two heat pipes 4, and determine the maximum value among the thermal conductivity efficiency differences corresponding to the two heat pipes 4, as the maximum thermal conductivity efficiency difference. Determine the ratio of the maximum thermal conductivity efficiency difference to the preset thermal conductivity efficiency difference, as the thermal conductivity stability factor.

[0057] In the quality inspection method for the production of this optical module, the normalized thermal conductivity difference and thermal conductivity stability factor can also be determined using the method in S131 above.

[0058] S134. Calculate the thermal conductivity score using the following formula: ;in, This indicates the thermal conductivity rating. This represents the normalized minimum thermal conductivity. Represents the natural constant. Indicates the thermal conductivity stability factor. This represents the sensitivity coefficient.

[0059] In this implementation, the value of the product of the natural constant as the base and the sensitivity coefficient and the thermal conductivity stability factor as the power can be determined as the stability coefficient, and the product of the normalized thermal conductivity difference and the stability coefficient can be determined as the thermal conductivity score.

[0060] For example, sensitivity coefficient It can be between 0.3 and 0.6.

[0061] After obtaining the normalized thermal conductivity difference and the thermal conductivity stability factor, the natural constant can be used as the base, and the sensitivity coefficient and the thermal conductivity stability factor can be multiplied together as the exponent for power operation. The result can be defined as the stability coefficient, which reflects the performance retention capability of the heat dissipation structure under process stress.

[0062] For example, when calculating the stability coefficient, the stability factor can be nonlinearly transformed using an exponential function.

[0063] After obtaining the stability coefficient, the normalized minimum thermal conductivity obtained above can be multiplied by the stability coefficient. The product can be directly used as the thermal conductivity score of the first shell 1. The thermal conductivity score comprehensively reflects the basic level and stability of heat dissipation performance.

[0064] The beneficial effect of the above implementation method is that the thermal conductivity score is determined by comprehensively considering the difference between the normalized minimum thermal conductivity and the maximum thermal conductivity. This takes into account both the minimum thermal conductivity of the two heat pipes and the imbalance of their thermal conductivity, thus achieving a comprehensive evaluation of the thermal conductivity of the heat pipes and improving the accuracy of the evaluation of the thermal conductivity effect of the first shell of the optical module.

[0065] The beneficial effect of the above implementation method is that by determining the value of the product of the natural constant as the base and the sensitivity coefficient and the thermal conductivity stability factor as the power, the stability coefficient can be adjusted to the normalized minimum thermal conductivity efficiency, thereby improving the accuracy of the evaluation of the thermal conductivity effect of the first shell of the optical module.

[0066] Figure 3 A flowchart illustrating the second quality inspection method for optical module production provided in this application embodiment is shown below. Figure 3 As shown, the above method also includes S210 to S220, which will be described in detail below.

[0067] S210. Detect the bending heat flux density at the bend between the corresponding areas of the first housing sidewall 12 and the bottom plate 11 for each heat pipe 4. Obtain the standard heat flux density of the heat pipe 4 when it is not bent. Determine the difference between the standard heat flux density and the bending heat flux density for each heat pipe 4 as the bending heat flux attenuation density. Determine the ratio of the bending heat flux attenuation density to the standard heat flux density as the bending attenuation factor for each heat pipe 4.

[0068] The quality inspection method for the production of this optical module can further refine the evaluation of the thermal performance impact of the heat pipe 4 at the bend. After the bending process of the first housing raw material plate 101, the heat flow status of each heat pipe 4 at the bend between the corresponding area of ​​the first housing side wall 12 and the corresponding area of ​​the bottom plate 11 can be detected. Specifically, the bending heat flow density of each heat pipe 4 at the bend between the corresponding areas of the first housing side wall 12 and the bottom plate 11 can be detected.

[0069] In the unbent state, the standard heat flux density of the heat pipe 4 can be obtained in advance as a reference value. The standard heat flux density can be measured and recorded in the flat material state, representing the ideal heat transfer performance of the heat pipe 4.

[0070] For example, standard heat flux density can be calibrated in a laboratory environment to ensure measurement consistency.

[0071] By calculating the difference between the standard heat flux density and the bending heat flux density of each heat pipe 4, the amount of difference between the standard heat flux density and the bending heat flux density of each heat pipe 4 can be determined. The result of subtracting the bending heat flux density from the standard heat flux density is defined as the bending heat flux attenuation density, which can reflect the magnitude of heat transfer loss caused by bending.

[0072] After obtaining the bend heat flux attenuation density, the ratio of the bend heat flux attenuation density to the standard heat flux density can be determined as the bend attenuation factor for each heat pipe 4. Based on the ratio calculation, the bend heat flux attenuation density can be divided by the standard heat flux density to obtain the bend attenuation factor. The bend attenuation factor ranges from 0 to 1, and the larger the value of the bend attenuation factor, the more severe the bend effect of the heat pipe 4.

[0073] S220. Determine the product of the second thermal conductivity efficiency and the bending attenuation factor corresponding to each heat pipe 4, so as to adjust the second thermal conductivity efficiency of each heat pipe 4.

[0074] After obtaining the bending attenuation factor, the product of the second thermal conductivity and the bending attenuation factor for each heat pipe 4 can be further determined, thereby adjusting the second thermal conductivity. The second thermal conductivity comprehensively reflects the true thermal conductivity after bending.

[0075] The beneficial effect of the above implementation method is that it determines the difference between the standard heat flux density and the bending heat flux density of each heat pipe as the bending heat flux attenuation density, and evaluates the influence of the bending attenuation factor corresponding to the bending heat flux attenuation density on the heat conduction effect of the bending part of the heat pipe, thereby improving the accuracy of the heat conduction effect evaluation of the heat pipe.

[0076] In some implementations, the above method also includes S230 to S240, which will be described in detail below.

[0077] S230. Determine the minimum bending attenuation factor among the bending attenuation factors corresponding to the multiple heat pipes 4.

[0078] The quality inspection method for this optical module production can be further optimized to correct the second thermal conductivity. Specifically, after obtaining the bending attenuation factor corresponding to each heat pipe 4, the bending attenuation factor values ​​of the two heat pipes 4 can be compared. The larger bending attenuation factor value can be selected and defined as the maximum bending attenuation factor. The maximum bending attenuation factor represents the most severe performance degradation in all heat pipe bending areas on the first housing 1.

[0079] S240. Determine the product of the second thermal conductivity and the minimum bending attenuation factor for each heat pipe 4, so as to adjust the second thermal conductivity of each heat pipe 4.

[0080] After obtaining the maximum bending attenuation factor, this maximum value can be used to uniformly correct all heat pipe data. Specifically, the second thermal conductivity efficiency can be multiplied by the maximum bending attenuation factor, and the product result is the adjusted second thermal conductivity efficiency value. The second thermal conductivity efficiency value includes the attenuation effect under the most unfavorable bending conditions.

[0081] For example, if the bending attenuation factor of a certain heat pipe 4 is 0.3 and that of another heat pipe is 0.5, then 0.5 will be taken as the maximum bending attenuation factor, and the second thermal conductivity of both heat pipes will be adjusted by multiplying by 0.5.

[0082] The beneficial effect of the above implementation method is that by adjusting the second thermal conductivity based on the maximum bending attenuation factor among the two thermally conductive heat pipes, the accuracy of the assessment of the thermal conductivity of the thermally conductive heat pipe after bending is further improved.

[0083] In some implementations, the above method further includes: the product of the thermal conductivity stability factor of the first housing 1 and the maximum bending attenuation factor, so as to adjust the thermal conductivity stability factor of the first housing 1.

[0084] In this implementation, the product of the thermal conductivity stability factor and the maximum bending attenuation factor of the first shell 1 can be further determined, so as to adjust the thermal conductivity stability factor of the first shell 1 according to the maximum bending attenuation factor, and then adjust the thermal conductivity efficiency score value in combination with the maximum bending attenuation factor.

[0085] The beneficial effect of the above implementation method is that by adjusting the thermal conductivity stability factor of the first shell according to the maximum bending attenuation factor, the accuracy of evaluating the thermal conductivity effect of the first shell is further improved.

[0086] Figure 4This is a front view schematic diagram of the first quality inspection device provided in the embodiments of this application when used on the first housing. Figure 5 A top view of the first quality inspection device provided in this application embodiment when used on the first housing is shown below. Figure 4 and Figure 5 As shown in the embodiment of this application, a quality inspection device is also provided, which adopts the quality inspection method for optical module production as described in any of the above claims. The quality inspection device 5 includes a first inspection component 51, a plurality of second inspection components 52 and a plurality of connecting arms 53. Each second inspection component 52 is rotatably connected to the first inspection component 51 through a connecting arm 53. The first inspection component 51 is provided with a control component 511.

[0087] Structurally, the first detection component 51 of this quality inspection device 5 is set in the center as the core device, and multiple second detection components 52 are rotatably connected by connecting arms 53, so that each second detection component 52 is rotatably mounted on the first detection component 51 through one connecting arm 53, so as to adapt to different shapes and structures for quality inspection of the optical module housing.

[0088] like Figure 4 and Figure 5 As shown, the upper region of the first detection component 51 is provided with a control component 511, which integrates a data processing function module to facilitate quality detection and calculation of the optical module housing.

[0089] In some implementations, the first detection component 51 is used to heat the coil structure 41 of the heat pipe 4 with a heat source of first power, and multiple second detection components 52 are used to detect the first temperature value at the end of the first segment of the heat pipe 4 and the second temperature value at the end of the second segment of the heat pipe 4.

[0090] In the testing process, the first testing component 51 can heat the coil structure 41 to achieve quality testing of the heat pipe 4. Specifically, the heating unit of the first testing component 51 can heat the coil structure 41 of the heat pipe 4 with a first power.

[0091] During the testing process, multiple second testing components 52 perform temperature monitoring respectively. Each second testing component 52 includes a temperature sensor, which can accurately detect the first temperature value of the first end region of the heat pipe 4 and the second temperature value of the second end region.

[0092] For example, when detecting the first temperature value of the first end region of the heat pipe 4 and the second temperature value of the second end region, the detection can begin within a preset time period after the first detection component 51 starts heating the coil structure 41, in order to improve the accuracy of the thermal conductivity detection. The preset time period can be from 1 second to 3 seconds.

[0093] In some implementations, the control component 511 stores the first length of the first segment of the heat pipe 4, the second length of the second segment of the heat pipe 4, and the heat pipe cross-sectional area of ​​the heat pipe 4. Before and after bending the area corresponding to the first shell sidewall 12 of the first shell material plate 101 and the heat pipe 4 together to be perpendicular to the area corresponding to the bottom plate 11, the control component 511 is used to determine the product of the first power and the first length and divide it by the first temperature difference and the heat pipe cross-sectional area, and to determine the product of the first power and the second length and divide it by the second temperature difference and the heat pipe cross-sectional area, respectively, as the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes 4.

[0094] The control component 511 can pre-store data including the first length of the first segment of the heat pipe 4, the second length of the second segment, and the cross-sectional area of ​​the heat pipe 4. These basic parameters can be used in subsequent calculations and analyses.

[0095] During quality inspection, when the raw material plate is in a flat state, the controller performs a product operation using the first power parameter and the first length parameter, then divides the product result by the product of the first temperature difference and the heat pipe cross-sectional area, and records the calculation result as the first thermal conductivity value.

[0096] During the bending and forming stage, the controller performs a product operation using the first power parameter and the second length parameter, and then divides the product value by the product of the second temperature difference and the heat pipe cross-sectional area. The result is recorded as the second thermal conductivity value.

[0097] The beneficial effect of the above implementation method is that each second detection component is rotatably connected to the first detection component through a connecting arm. The area corresponding to the first housing sidewall of the first housing material plate and the heat pipe are bent together to be perpendicular to the area corresponding to the bottom plate. Each second detection component can further evaluate the heat conduction efficiency of the heat pipe, which facilitates the evaluation of the heat conduction efficiency of the heat pipe and improves the efficiency of quality detection of the optical module housing.

[0098] The beneficial effect of the above implementation method is that the control component can automatically calculate the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes, which facilitates the improvement of the accuracy of detecting the thermal conductivity of the first shell.

[0099] In some implementations, the second detection component 52 is provided with a snap-fit ​​structure for snapping the second detection component 52 onto the heat pipe 4.

[0100] Structurally, a snap-fit ​​structure can be provided in the second detection component 52. The snap-fit ​​structure can include elastic claw components. The size and shape of the snap-fit ​​structure match the outer contour of the heat pipe 4. When the second detection component 52 needs to be installed, the snap-fit ​​structure can be aligned with the position of the heat pipe 4 and pressed to make the elastic claw automatically snap onto the outer surface of the heat pipe 4, thereby enabling the second detection component 52 to be quickly positioned and fixed.

[0101] The beneficial effect of the above implementation method is that by using a snap-fit ​​structure to connect the second detection component to the heat pipe, it is easy to snap the second detection component onto the heat pipe for thermal conductivity efficiency testing, thereby improving the convenience of thermal conductivity efficiency testing of the heat pipe.

[0102] In some implementations, the connecting arm 53 is also equipped with a heat flow meter 531, which is correspondingly positioned at the bend of the heat pipe 4. Before and after the area corresponding to the first housing sidewall 12 of the first housing material plate 101 and the heat pipe 4 are bent together to be perpendicular to the area corresponding to the bottom plate 11, the heat flow meter 531 is used to detect the bending heat flow density of each heat pipe 4 at the bend between the area corresponding to the first housing sidewall 12 and the bottom plate 11. The heat flow meter 531 is a thin-film heat flow sensor, and it has a snap-fit ​​structure for engaging with the outer wall of the heat pipe 4.

[0103] like Figure 4 and Figure 5 As shown, a heat flow measuring device can also be added to the connecting arm 53 of this quality detection device 5. Specifically, a heat flow meter 531 can be fixedly installed at a specific position of each connecting arm 53, with the detection surface of the heat flow meter 531 facing the bending area of ​​the heat-conducting heat pipe 4.

[0104] During the testing process, the sensing area of ​​the heat flow meter 531 can be positioned directly opposite the bend of the heat pipe 4 located between the corresponding area of ​​the first housing side wall 12 and the corresponding area of ​​the bottom plate 11, so that the heat flow meter 531 can perform quality testing on the bend of the heat pipe 4.

[0105] In terms of structure, the heat flow meter 531 can adopt a thin-film sensor structure. The thinness of the heat flow meter 531 does not affect the bending operation of the heat flow meter 531.

[0106] Structurally, a dedicated snap-fit ​​mechanism can be set on the outer shell of the heat flow meter 531. The snap-fit ​​structure has an elastic clamping function. When installation is required, the snap-fit ​​structure of the heat flow meter 531 can be directly snapped onto the outer surface of the heat pipe 4 to achieve quick fixation.

[0107] For example, the detection surface of the heat flux meter 531 can be kept in parallel contact with the surface of the heat pipe 4. The measurement function of the heat flux meter 531 is activated in two stages before and after bending the heat pipe 4, and the real-time heat flux density value at the bending point is recorded. Accurate bending heat flux density data can be obtained through continuous monitoring.

[0108] For example, the snap-fit ​​structure can be equipped with a U-shaped elastic clip, the inner diameter of which is slightly smaller than the diameter of the heat pipe 4, so as to achieve a tight fit through elasticity.

[0109] The beneficial effect of the above implementation method is that the heat flow meter facilitates the detection of the heat conduction effect at the bend of the heat pipe, thus improving the convenience of detecting the heat conduction effect of the heat pipe.

[0110] In some implementations, the control component 511 is also used to determine the thermal conductivity score of the first housing 1 based on the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes 4, respectively. The control component 511 is also provided with an indicator light for indicating different ranges of thermal conductivity score values ​​for the first housing 1.

[0111] In this implementation, the control component 511 can perform quality detection of the optical module through calculation. The control component 511 can perform calculations through the calculation module. Based on the first thermal conductivity data and the second thermal conductivity data of the two heat pipes 4, a comprehensive analysis and calculation is performed to finally calculate and generate the thermal conductivity score of the first housing 1. The thermal conductivity score is used to determine the overall heat dissipation performance level of the first housing 1 according to the above method.

[0112] A dedicated array of indicator lights can be set on the surface of the housing of the control component 511. These indicator lights use different colors, and each color corresponds to a specific range of thermal conductivity rating values. After the controller completes the calculation, it can automatically activate the indicator lights in the corresponding range according to the actual thermal conductivity rating values.

[0113] The beneficial effect of the above implementation method is that the control component can automatically calculate the thermal conductivity score value, and the control component is equipped with an indicator light that indicates the range of different thermal conductivity score values ​​of the first housing, thereby improving the automation level of quality inspection of the first housing.

[0114] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A quality inspection method for optical module production, characterized in that, The method includes: On the first shell material plate, the coil structures of two heat-conducting heat pipes are welded to the corresponding areas of the bottom plate. The first and second sections of the two heat-conducting heat pipes are welded to the corresponding areas of the two first shell sidewalls. The heat conduction efficiency of each heat-conducting heat pipe from the coil structure to the first and second sections of the heat-conducting heat pipe is measured and used as the first heat conduction efficiency. The bottom plate of the first shell material plate has two first shell sidewalls on both sides, and the first and second sections of each heat-conducting heat pipe are respectively located at both ends of the coil structure. The area corresponding to the first shell sidewall of the first shell material plate and the heat pipe are bent together to be perpendicular to the area corresponding to the bottom plate to obtain the first shell. The heat conduction efficiency of each heat pipe from the coil structure to the first and second sections of the heat pipe is detected and used as the second heat conduction efficiency of each heat pipe. Based on the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes, the thermal conductivity score of the first housing is determined. The first housing with different thermal conductivity score ranges is used to produce optical modules with different transmission rate levels.

2. The method as described in claim 1, characterized in that, Based on the first and second thermal conductivity efficiencies corresponding to the two heat pipes, respectively, the thermal conductivity score of the first casing is determined, including: The minimum thermal conductivity efficiency is determined from the first and second thermal conductivity efficiencies corresponding to the two heat pipes, respectively. Based on the standard thermal conductivity efficiency, the minimum thermal conductivity efficiency is normalized to obtain the normalized minimum thermal conductivity efficiency. The difference between the first and second thermal conductivity efficiencies corresponding to the two heat pipes is determined, and the maximum value of the difference between the two thermal conductivity efficiencies is determined as the maximum thermal conductivity difference. The ratio of the maximum thermal conductivity difference to the preset thermal conductivity difference is determined as the thermal conductivity stability factor of the first shell. The thermal conductivity score is calculated using the following formula: ； in, This indicates the thermal conductivity rating. This represents the normalized minimum thermal conductivity. Indicates the thermal conductivity stability factor. Indicates the first weight. This indicates the second weight.

3. The method as described in claim 2, characterized in that, The thermal conductivity score of the first casing is determined based on the first and second thermal conductivity efficiencies corresponding to the two heat pipes, respectively, and also includes: Determine the minimum thermal conductivity efficiency between the first and second thermal conductivity efficiencies corresponding to the two heat pipes; normalize the minimum thermal conductivity efficiency based on the standard thermal conductivity efficiency to obtain the normalized minimum thermal conductivity efficiency; determine the difference between the first and second thermal conductivity efficiencies corresponding to the two heat pipes, and determine the maximum value among the differences between the two heat pipes as the maximum thermal conductivity difference; determine the ratio of the maximum thermal conductivity difference to the preset thermal conductivity difference as the thermal conductivity stability factor. The thermal conductivity score is calculated using the following formula: ； in, This indicates the thermal conductivity rating. This represents the normalized minimum thermal conductivity. Represents the natural constant. Indicates the thermal conductivity stability factor. This represents the sensitivity coefficient.

4. The method as described in claim 3, characterized in that, The method further includes: The bending heat flux density of each heat pipe at the bend between the corresponding area of ​​the first shell sidewall and the bottom plate is detected; the standard heat flux density of the heat pipe when it is not bent is obtained; the difference between the standard heat flux density and the bending heat flux density of each heat pipe is determined as the bending heat flux attenuation density; the ratio of the bending heat flux attenuation density to the standard heat flux density is determined as the bending attenuation factor for each heat pipe. The product of the second thermal conductivity efficiency and the bending attenuation factor for each heat pipe is determined to adjust the second thermal conductivity efficiency of each heat pipe.

5. The method as described in claim 4, characterized in that, The method further includes: Determine the maximum bend attenuation factor among the bend attenuation factors corresponding to multiple heat pipes; The product of the second thermal conductivity and the maximum bending attenuation factor for each heat pipe is determined to adjust the second thermal conductivity of each heat pipe.

6. The method as described in claim 5, characterized in that, The method further includes: The thermal stability factor of the first housing is adjusted by multiplying the thermal stability factor of the first housing by the maximum bending attenuation factor.

7. A quality inspection device, characterized in that, The quality inspection method for optical module production according to any one of claims 1 to 6, wherein the quality inspection device includes a first inspection component, a plurality of second inspection components and a plurality of connecting arms, each second inspection component is rotatably connected to the first inspection component through one connecting arm, and the first inspection component is provided with a control component; The first detection component is used to heat the coil structure of the heat pipe with a heat source of first power, and multiple second detection components are used to detect the first temperature value at the end of the first section of the heat pipe and the second temperature value at the end of the second section of the heat pipe. The control component stores the first length of the first segment of the heat pipe, the second length of the second segment of the heat pipe, and the heat pipe cross-sectional area of ​​the heat pipe. Before and after bending the area corresponding to the first shell sidewall of the first shell material plate and the heat pipe together to be perpendicular to the area corresponding to the bottom plate, the control component is used to determine the product of the first power and the first length and divide it by the first temperature difference and the heat pipe cross-sectional area, and to determine the product of the first power and the second length and divide it by the second temperature difference and the heat pipe cross-sectional area, respectively, as the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes.

8. The quality inspection device as described in claim 7, characterized in that, The second detection component is provided with a snap-fit ​​structure for snapping the second detection component onto the heat-conducting heat pipe.

9. The quality inspection device as described in claim 8, characterized in that, The connecting arm is also equipped with a heat flow meter, which is correspondingly positioned at the bend of the heat pipe. Before and after the area corresponding to the first shell sidewall of the first shell material plate and the heat pipe are bent together to be perpendicular to the area corresponding to the bottom plate, the heat flow meter is used to detect the bending heat flow density of each heat pipe at the bend between the area corresponding to the first shell sidewall and the bottom plate. The heat flow meter is a thin-film heat flow sensor, and the heat flow meter is equipped with a snap-fit ​​structure for engaging with the outer sidewall of the heat pipe.

10. The quality inspection device as described in claim 9, characterized in that, The control component is also used to determine the thermal conductivity score of the first housing based on the first thermal conductivity and the second thermal conductivity corresponding to the two heat pipes, respectively. The control unit is also equipped with indicator lights to indicate different ranges of thermal conductivity ratings for the first housing.

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