Main and backup optical fiber amplifier structure and preparation method

Abstract

The invention relates to the technical field of optical fiber amplifiers, and discloses a main and backup optical fiber amplifier structure and a preparation method.The amplifier structure comprises a shell, a beam splitter, a main optical fiber amplification light path and a backup optical fiber amplification light path, the shell comprises a bottom plate and a side wall, the main optical fiber amplification light path at least comprises a main optical fiber, and the backup optical fiber amplification light path at least comprises a backup optical fiber; the backup optical fiber amplification optical path at least comprises a backup optical fiber, the beam splitter is connected with the main optical fiber amplification optical path and the backup optical fiber amplification optical path, an annular groove is formed in the lower surface of the bottom plate, an annular partition plate is formed in the corresponding position of the annular groove in the upper surface of the bottom plate, and the main optical fiber is wound in the annular groove; the backup optical fiber is wound around the outer side of the annular partition plate, and the main optical fiber and the backup optical fiber are physically separated through the annular partition plate. According to the technical scheme provided by the invention, the redundancy and robustness of the main and backup optical fiber amplifiers can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of fiber amplifiers, in particular to a master-backup fiber amplifier structure and a preparation method. BACKGROUND

[0002] A fiber amplifier is an optical signal amplification device based on a rare earth ion doped optical fiber, which realizes gain of input signal light through energy transfer of pump light. Due to its compact structure, high efficiency and low noise, it has been widely used in laser communication, laser detection and other fields.

[0003] In related technologies, a fiber amplifier is often designed as a redundant backup structure, including a master fiber amplification light path and a backup fiber amplification light path which are independent of each other, so as to improve the overall reliability of the system by directly switching the link when a fault occurs. However, when the master fiber amplification light path is fused or burned due to excessive power, defects or external impact, the high-temperature state will be conducted to the backup fiber amplification light path at a relatively fast speed, resulting in damage to the backup fiber amplification light path and overall failure of the fiber amplifier, and the robustness of the master-backup design of the fiber amplifier is relatively low.

[0004] Therefore, how to improve the redundancy and robustness of the master-backup fiber amplifier has become a focus in the field of fiber amplifiers. SUMMARY

[0005] The present application provides a master-backup fiber amplifier structure and a preparation method, which completely isolates the master-backup fiber amplifier, improves the reliability of the backup design of the fiber amplifier, and thus improves the redundancy and robustness of the master-backup fiber amplifier.

[0006] The first aspect of the present application provides a master-backup fiber amplifier structure, which comprises a shell, a beam splitter, a master fiber amplification light path and a backup fiber amplification light path. The shell comprises a bottom plate and a side wall. The master fiber amplification light path comprises at least a master fiber. The backup fiber amplification light path comprises at least a backup fiber. The beam splitter is connected to the master fiber amplification light path and the backup fiber amplification light path, respectively. Wherein: a lower surface of the bottom plate is provided with an annular groove, and the annular groove forms an annular partition plate at a corresponding position of an upper surface of the bottom plate; the master fiber is coiled in the annular groove, the backup fiber is coiled outside the annular partition plate, and the master fiber and the backup fiber are physically separated by the annular partition plate.

[0007] In an embodiment, the side wall is provided with an input aperture and an output aperture; wherein: the input aperture is connected to the beam splitter through an input optical fiber; the output aperture is connected to the master fiber amplification light path through a first output optical fiber, and the output aperture is connected to the backup fiber amplification light path through a second output optical fiber.

[0008] In one embodiment, the annular partition is provided with a structure reserved hole position; wherein: the structure reserved hole position is used to guide the signal light to the main part of the fiber amplification light path located in the annular groove, and guide the signal light amplified through the main part of the fiber amplification light path to the first output fiber on the upper surface of the bottom plate.

[0009] In one embodiment, the main part of the fiber includes a main part of the connection fiber and a main part of the gain fiber, and the main part of the gain fiber includes a main part of the erbium-doped gain fiber and a main part of the erbium-ytterbium co-doped gain fiber, wherein: the main part of the fiber amplification light path further includes a main part of the single-mode pump laser, a main part of the wavelength division multiplexer, a first main part of the fiber isolator, a main part of the fiber combiner, a main part of the multimode pump group, and a second main part of the fiber isolator connected in sequence through the main part of the connection fiber; wherein, the main part of the erbium-doped gain fiber is arranged between the main part of the wavelength division multiplexer and the first main part of the fiber isolator, and the main part of the erbium-ytterbium co-doped gain fiber is arranged between the first main part of the fiber isolator and the main part of the fiber combiner.

[0010] In one embodiment, the lower surface of the bottom plate further includes a second groove; wherein: the main part of the single-mode pump laser and the main part of the multimode pump group are arranged on the upper surface of the bottom plate, and the main part of the wavelength division multiplexer, the first main part of the fiber isolator, the main part of the fiber combiner, and the second main part of the fiber isolator are arranged in the second groove.

[0011] In one embodiment, the backup fiber includes a backup connection fiber and a backup gain fiber, and the backup gain fiber includes a backup erbium-doped gain fiber and a backup erbium-ytterbium co-doped gain fiber, wherein: the backup fiber amplification light path further includes a backup single-mode pump laser, a backup wavelength division multiplexer, a first backup fiber isolator, a backup fiber combiner, a backup multimode pump group, and a second backup fiber isolator connected in sequence through the backup connection fiber; wherein, the backup erbium-doped gain fiber is arranged between the backup wavelength division multiplexer and the first backup fiber isolator, and the backup erbium-ytterbium co-doped gain fiber is arranged between the first backup fiber isolator and the backup fiber combiner.

[0012] In one embodiment, the backup single-mode pump laser, the backup wavelength division multiplexer, the first backup fiber isolator, the backup fiber combiner, the backup multimode pump group, and the second backup fiber isolator are all arranged on the upper surface of the bottom plate.

[0013] The second aspect of the present application provides a preparation method of a master-backup optical fiber amplifier, the device comprising: providing a shell, a beam splitter, a set of master optical fiber amplifier materials and a set of backup optical fiber amplifier materials, wherein the shell comprises a bottom plate and a side wall; installing the beam splitter on the upper surface of the bottom plate, preparing a master optical fiber amplification optical path based on the master optical fiber amplifier materials, and preparing a backup optical fiber amplification optical path based on the backup optical fiber amplifier materials; opening an annular groove on the lower surface of the bottom plate, the annular groove forming an annular partition plate at the corresponding position of the upper surface of the bottom plate, and opening a structure reserved hole on the annular partition plate; connecting the first output end of the beam splitter with the backup optical fiber amplification optical path, and passing the second output end of the beam splitter through the structure reserved hole to connect with the master optical fiber amplification optical path.

[0014] The third aspect of the present application provides an optical communication system for realizing the master-backup optical fiber amplifier structure of the first aspect.

[0015] Based on the above idea, the technical scheme provided by the embodiment of the present application effectively prevents the high temperature generated when the master optical fiber fails from damaging the backup optical fiber, thereby improving the redundancy and robustness of the master-backup optical fiber amplifier. The shell is composed of a bottom plate and a side wall, and an annular groove is arranged on the lower surface of the bottom plate for coiling the master optical fiber, and the backup optical fiber is coiled outside the annular partition plate. This separation method not only reasonably utilizes the internal space without increasing the volume of the shell, but also ensures the effective separation of the master-backup optical paths, so that the safety and effectiveness of the backup optical fiber amplification circuit are ensured when the master optical fiber amplification optical path is damaged by high temperature, thereby improving the reliability of the backup design of the optical fiber amplifier. At the same time, the design of the annular groove and the annular partition plate does not affect the heat dissipation performance of the bottom plate, ensuring the timely heat dissipation of the master optical fiber and further reducing the risk of heat conduction when the master optical fiber fails, ensuring the stability of the entire optical fiber amplifier structure during long-term work, thereby improving the redundancy and robustness of the master-backup optical fiber amplifier.

[0016] As can be seen, the technical scheme provided by the present application can improve the reliability of the backup design of the optical fiber amplifier, thereby improving the redundancy and robustness of the master-backup optical fiber amplifier. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the specific embodiments of the present application or the technical schemes in the prior art, the drawings needed in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application, and those skilled in the art can also obtain other drawings based on these drawings without creating any creative labor.

[0018] Fig. 1(a) is a structure top view of a master-backup fiber amplifier structure according to an embodiment of the present application; Fig. 1(b) is a cross-sectional view of a master-backup fiber amplifier structure according to an embodiment of the present application; Figure 2 Fig. 2 is a through-hole position diagram of a master-backup fiber amplifier structure according to an embodiment of the present application; Figure 3 Fig. 3 is a through-hole connection diagram of a master-backup fiber amplifier structure according to another embodiment of the present application; Figure 4 Fig. 4 is a second recess position diagram of a master-backup fiber amplifier structure according to an embodiment of the present application; Figure 5 Fig. 5 is a component position diagram of a master-backup fiber amplifier structure according to an embodiment of the present application; Figure 6 Fig. 6 is a step diagram of a master-backup fiber amplifier preparation method according to an embodiment of the present application.

[0019] Explanation of Reference Signs 10 - housing, 11 - beam splitter, 12 - master fiber amplification light path, 13 - backup fiber amplification light path, 101 - bottom plate, 102 - side wall, 103 - annular recess, 104 - annular partition, 120 - master fiber, 130 - backup fiber, 24 - input hole position, 25 - output hole position, 241 - input fiber, 251 - first output fiber, 252 - second output fiber, 300 - structure reserved hole position, 401 - second recess, 501 - first region, 502 - second region, 503 - third region, 504 - fourth region. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0021] In addition, the descriptions in the present application involving "first", "second", and the like are only for the purpose of description and cannot be understood as indicating or implying the relative importance of the indicated technical features or implying the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the embodiments of the present application, unless otherwise stated, the meaning of "multiple" is two or more. In addition, the use of "based on" or "according to" means openness and inclusiveness, because the process, step, calculation or other action "based on" or "according to" one or more stated conditions or values can be based on additional conditions or values beyond the stated values in practice.

[0022] With the continuous development of the optical communication industry, the reliability requirements for optoelectronic devices in communication systems are increasing. Fiber amplifier is an optical signal amplification device based on rare earth ion doped fiber, which is usually used as the core component of optical signal amplification and relay in optical communication systems, and realizes the gain of input signal light through the energy transfer of pump light. Generally speaking, an effective method to improve the reliability of single-point devices is to use redundant backup design. Therefore, in high-reliability application scenarios such as long-distance communication trunk lines, etc., the fiber amplifier is often designed as a redundant backup system to improve the overall reliability of the system.

[0023] In the related art, the fiber amplifier with a redundant backup structure usually includes two independent amplification light paths, i.e., a main fiber amplification light path and a backup fiber amplification light path. The two light paths are usually closely integrated in the same housing or module in terms of physical layout to pursue the miniaturization and good heat dissipation performance of the module. When the main fiber amplification light path fails, it can be directly switched to the backup fiber amplification light path to continue working to improve the overall reliability of the system. However, this kind of main-backup integrated mode has certain safety hazards. Specifically, when the main amplifier causes internal fiber fusing or burning due to overload, defects or accidents, the high-temperature molten core will rapidly conduct along the fiber. Since the main and backup fibers are closely adjacent in space, the high-temperature damage can easily spread to and damage the backup fiber through heat conduction, radiation or even open fire, and real redundancy protection cannot be achieved.

[0024] Therefore, the present application one or more embodiments, provide a kind of main-backup fiber amplifier structure, preparation method, can solve the above problems, by the space insulation of main fiber amplification light path and backup fiber amplification light path, when main fiber amplification light path high-temperature damage, ensure the safety and effectiveness of backup fiber amplification circuit, to improve the redundancy and robustness of main-backup fiber amplifier.

[0025] Referring to FIG. 1(a) and FIG. 1(b), one embodiment of the present application provides a master-backup fiber amplifier structure, which comprises a housing 10, a beam splitter 11, a master fiber amplifier light path 12 and a backup fiber amplifier light path 13. The housing 10 comprises a bottom plate 101 and a side wall 102. The master fiber amplifier light path 12 comprises at least a master fiber 120. The backup fiber amplifier light path 13 comprises at least a backup fiber 130. The beam splitter 11 is connected to the master fiber amplifier light path 12 and the backup fiber amplifier light path 13 respectively. FIG. 1(a) is a top view of the master-backup fiber amplifier structure, and FIG. 1(b) is a side sectional view of the master-backup fiber amplifier structure. Wherein: The bottom plate 101 is provided with an annular groove 103 on the lower surface. The annular groove 103 forms an annular partition 104 on the corresponding position of the upper surface of the bottom plate 101. The master fiber 120 is coiled in the annular groove 103, and the backup fiber 130 is coiled outside the annular partition 104. The master fiber 120 and the backup fiber 130 are physically separated by the annular partition 104.

[0026] Specifically, the housing 10 is an outer shell for accommodating and fixing the components of the fiber amplifier, which is composed of the bottom plate 101 and the side wall 102. The side wall 102 is vertically arranged on the upper surface of the bottom plate 101, thereby playing a protective and supporting role. The beam splitter 11 is used to distribute the input signal light to the master fiber amplifier light path 12 and the backup fiber amplifier light path 13. The annular groove 103 is an annular recessed area designed on the lower surface of the bottom plate 101 of the housing 10, which is used to accommodate the coiling of the master fiber 120. Due to the existence of the annular groove 103, the annular convex structure, i.e. the annular partition 104, is formed on the corresponding position of the upper surface of the bottom plate 101, thereby separating the master fiber 120 and the backup fiber 130 and avoiding direct contact and mutual influence between them.

[0027] Generally, a cover plate is prepared above the housing 10, so that a cavity is formed between the cover plate and the housing 10. In the traditional technology, the master fiber amplifier light path 12 and the backup fiber amplifier light path 13 are both arranged inside the housing 10, and the backup fiber amplifier light path 13 is switched when the master fiber amplifier light path 12 fails. However, the backup fiber 130 is easily damaged by heat conduction such as high temperature failure. Therefore, the master fiber 120 is placed on the lower surface of the bottom plate 101, and the backup fiber 130 is placed on the upper surface of the bottom plate 101, so as to be physically isolated by the bottom plate 101, thereby avoiding the redundant work when the master fiber amplifier light path 12 fails (such as the master fiber 120 fuse or burn out).

[0028] In the embodiment, the main backup fiber amplification light path is isolated without affecting the backup fiber amplification light path 13, ensuring that the backup fiber amplification light path 13 can normally increase the volume of the main backup fiber amplifier structure. Among them, the main fiber 120 is spirally placed inside the annular groove 103, the backup fiber 130 is spirally placed outside the annular partition plate 104, and the main fiber 120 and the backup fiber 130 are separated by the annular partition plate 104. It can effectively prevent the high temperature generated when the main fiber 120 fails from damaging the backup fiber 130, thereby improving the reliability and redundancy of the main backup fiber amplifier structure. Moreover, this design reasonably utilizes the space inside the shell 10 without increasing the volume of the shell 10, effectively separates the main backup light path, and at the same time, the design of the annular groove 103 and the annular partition plate 104 does not affect the heat dissipation performance of the bottom of the shell 10. Effectively reducing the heat conduction of the backup fiber 130 caused by the high temperature generated when the main fiber 120 fails, ensuring the stability of the main backup fiber amplifier structure during long-term work, and at the same time improving the integration of the main backup fiber amplification light path 13.

[0029] In the embodiment, the main backup fiber amplification light path is isolated without affecting the bottom plate 101 heat dissipation surface. Among them, the lower surface of the bottom plate 101 is set as a heat dissipation surface, that is, a heat-conducting pad is installed on the lower surface of the bottom plate 101 or uniform heat-conducting silicone grease is applied, and the bottom plate 101 is fixed on the heat dissipation cold plate to realize the timely heat dissipation of the main fiber 120, ensure the stability of the main backup fiber amplifier structure, and physically isolate the main backup fiber amplification light path 13 through the annular groove 103. Further reduce the heat conduction and combustion conduction of the optical fiber during the fusing or burning process, effectively prevent the high temperature generated when the main fiber 120 fails from damaging the backup fiber 130, thereby ensuring the reliability and stability of the backup fiber amplification light path.

[0030] Based on the above idea, the technical scheme provided by the embodiment of the application effectively prevents the backup optical fiber from being damaged by high temperature generated when the main optical fiber fails, thereby improving the redundancy and robustness of the main-backup optical fiber amplifier. The shell is composed of a bottom plate and a side wall, the bottom plate has a lower surface provided with an annular groove for coiling the main optical fiber, and the backup optical fiber is coiled outside the annular partition plate. This separation method not only reasonably utilizes the internal space without increasing the volume of the shell, but also ensures effective separation of the main-backup optical paths, so that the safety and effectiveness of the backup optical fiber amplification circuit are ensured when the main optical fiber amplification optical path is damaged by high temperature, thereby improving the reliability of the backup design of the optical fiber amplifier. At the same time, the design of the annular groove and the annular partition plate does not affect the heat dissipation performance of the bottom plate, ensuring the timely heat dissipation of the main optical fiber and further reducing the risk of heat conduction when the main optical fiber fails, ensuring the stability of the entire optical fiber amplifier structure during long-term work, thereby improving the redundancy and robustness of the main-backup optical fiber amplifier.

[0031] In an embodiment, referring to Figure 2 The side wall is provided with an input hole site and an output hole site; wherein: the input hole site 24 is connected with the beam splitter 11 through an input optical fiber 241, so as to connect the external input optical fiber 241 with the beam splitter 11 inside the shell 10, so as to introduce the signal light to be amplified into the optical fiber amplifier; the output hole site 25 is connected with the main optical fiber amplification optical path 12 through a first output optical fiber 251, and is connected with the backup optical fiber amplification optical path 13 through a second output optical fiber 252, so as to introduce the amplified signal light from the inside of the shell 10, forming a complete signal light input-output path. When the main optical fiber amplification optical path 12 works normally, the signal light is output after being amplified by the main optical fiber amplification optical path 12; when the main optical fiber amplification optical path 12 fails, the signal light is output after being amplified by the backup optical fiber amplification optical path 13, ensuring the redundancy and reliability of the backup design of the main-backup optical fiber amplifier.

[0032] The technical scheme provided by the embodiment realizes a complete input-output path of the signal light by arranging the input hole site and the output hole site on the side wall of the shell. Specifically, the input hole site and the output hole site are used to introduce and output the signal light, so as to ensure that the signal light can be output after being amplified in the optical fiber amplifier, and the first output optical fiber and the second output optical fiber are used to connect the main optical fiber amplification optical path and the backup optical fiber amplification optical path respectively, so as to realize the redundancy design, ensure that the backup optical fiber amplification optical path can be quickly switched when the main optical fiber amplification optical path fails, and improve the reliability and effectiveness of the backup design of the optical fiber amplifier, thereby improving the redundancy and robustness of the main-backup optical fiber amplifier. In addition, the input hole site and the output hole site are arranged on the side wall, so that the external connection of the optical fiber amplifier is simple and clear, and the installation and maintenance are convenient.

[0033] In an embodiment, referring toFigure 3 Since the annular partition plate 104 separates the main optical fiber and the backup optical fiber, but the signal light needs to enter the main optical fiber amplification light path 12 from the beam splitter 11, a structural reserved hole 300 is arranged on the annular partition plate 104, thereby providing the necessary transmission path for the signal light. Specifically, the structural reserved hole 300 is used to guide the signal light to the main optical fiber amplification light path 12 located in the annular groove, wherein the output optical fiber of the beam splitter 11 is connected to the main optical fiber amplification light path 12 through the structural reserved hole 300, and the amplified signal light passing through the main optical fiber amplification light path 12 is guided to the first output optical fiber 251 on the upper surface of the bottom plate, wherein the main optical fiber amplification light path 12 is connected to the first output optical fiber 251 connected to the output hole 25 through the structural reserved hole 300, and the backup optical fiber amplification light path 13 can be directly connected to the second output optical fiber 252 connected to the output hole 25. Through the arrangement of the structural reserved hole 300, the transmission of the signal light between different optical fibers is realized, and it is ensured that the signal light can smoothly enter the main optical fiber amplification light path for amplification, and the amplified signal light is guided out.

[0034] In the embodiment, the design of the structural reserved hole 300 can minimize the risk of heat conduction and heat damage while ensuring the transmission of the signal light. Generally, the main optical fiber transmits heat to the backup optical fiber through heat conduction, heat radiation and convection. By designing the structural reserved hole 300 to be small in size and only capable of accommodating the passing optical fiber, and ensuring that the structural reserved hole 300 has a certain thickness, so that the closely passing optical fiber itself almost fills the hole, forming a physical block, thereby greatly limiting the air convection and the passage of the flame, so that the damage is limited within the annular groove. In addition, the shell itself is made of high-thermal-capacity and high-melting-point materials (such as aluminum alloy, stainless steel), even if the hole near the shell is heated, the shell can absorb a large amount of heat to prevent heat conduction.

[0035] The technical solution provided by the embodiment ensures the transmission of the signal light after the main optical fiber and the backup optical fiber are separated by arranging the structural reserved hole on the annular partition plate. Specifically, the structural reserved hole not only provides the necessary path for the signal light to enter the main optical fiber amplification light path from the beam splitter, but also guides the amplified signal light to the first output optical fiber, while the backup optical fiber amplification light path can be directly connected to the second output optical fiber, ensuring smooth transmission of the signal light between different light paths. When the main optical fiber amplification light path is damaged at high temperature, the safety and effectiveness of the backup optical fiber amplification circuit for signal transmission are ensured, and by designing the structural reserved hole to be small in size and ensuring that it has a certain thickness, the risk of heat conduction and heat damage is greatly limited, further improving the redundancy and robustness of the main and backup optical fiber amplifiers.

[0036] In an embodiment, the main fiber includes a main connection fiber and a main gain fiber, the main gain fiber includes a main erbium-doped gain fiber and a main erbium-ytterbium co-doped gain fiber, the main fiber is the part most prone to failure in the main fiber amplification optical path in the main-backup fiber amplifier structure, and the main fiber is coiled in the annular groove to avoid damaging the backup fiber. The main fiber amplification optical path further includes a main single-mode pump laser, a main wavelength division multiplexer, a first main fiber isolator, a main fiber combiner, a main multi-mode pump group, and a second main fiber isolator connected in sequence through the main connection fiber, the main erbium-doped gain fiber is arranged between the main wavelength division multiplexer and the first main fiber isolator, and the main erbium-ytterbium co-doped gain fiber is arranged between the first main fiber isolator and the main fiber combiner.

[0037] Exemplarily, when the main fiber amplification optical path is in normal operation, the output fiber of the beam splitter is connected to the main connection fiber in the annular groove through the structure reserved hole, and the main connection fiber is connected in sequence to the main single-mode pump laser, the main wavelength division multiplexer, the main erbium-doped gain fiber, the first main fiber isolator, the main erbium-ytterbium co-doped gain fiber, the main fiber combiner, the first main multi-mode pump and the second main multi-mode pump, and the second main fiber isolator. The combination of the main erbium-doped gain fiber (Er³⁺) and the main erbium-ytterbium co-doped gain fiber (Er³⁺ and Yb³⁺) can improve the gain efficiency, the main fiber isolator is arranged to prevent reverse light reflection, and the influence of light reflection on the main single-mode pump laser and the signal light quality is avoided. The pump light and the signal light are effectively integrated through the main wavelength division multiplexer and the main fiber combiner, and the efficient transmission and amplification of the optical signal in the main fiber amplification optical path are ensured. The main multi-mode pump group can provide higher pump power, and further improve the amplification effect of the signal light.

[0038] In the embodiment, please refer to Figure 4The bottom surface of the bottom plate further comprises a second groove 401, which is an independent groove and is located at a different region of the bottom surface of the bottom plate from the annular groove. The main single-mode pump laser and the main multi-mode pump group are arranged at the same region of the upper surface of the bottom plate, so as to separate the pump light source from other devices in the optical path and avoid the influence of heat generated by the pump laser on other optical path devices. The main WDM, the first main fiber isolator, the main fiber combiner, the second main fiber isolator and other devices are arranged in the second groove 401 of the bottom surface of the bottom plate, so as to improve the device integration and facilitate fiber connection and optical path integration. In actual application, the specific size of the second groove 401 can be determined based on the sizes of the main WDM, the first main fiber isolator, the main fiber combiner and the second main fiber isolator. Specifically, based on the independent sizes of the devices and the arrangement relationship of the devices in the second groove 401, the size range of the second groove 401 can be determined. In actual application, the size range can be flexibly set, as long as the second groove 401 can completely accommodate the four devices. In addition, the position of the second groove 401 on the bottom plate can also be flexibly set. In actual application, the four devices accommodated in the second groove 401 are located at a specific position of the analog optical link, and according to the specific position, the position of the second groove 401 on the bottom plate can be determined from the perspective of conveniently building the analog optical link. Specifically, the perspective of conveniently building the analog optical link can be to minimize the connection complexity between different devices and / or to minimize the connection complexity between the devices and the optical fibers. In this way, according to the overall connection structure of the analog optical link, the second groove 401 can be arranged at a suitable position of the bottom plate, so that the devices accommodated in the second groove 401 can be reasonably built in the analog optical link. In a specific application scenario, the main connection optical fiber realizes the optical fiber connection between the main single-mode pump laser and the main multi-mode pump group and other devices (i.e., the devices accommodated in the second groove 401) on the bottom surface of the bottom plate through the structural reserved hole site 300 located in the annular partition plate 104. Optionally, the structural reserved hole site 300 for connecting the main connection optical fiber can adopt the structural reserved hole site through which the first output optical fiber 251 penetrates, or a new hole site can be opened on the annular partition plate 104 as the structural reserved hole site for connecting the main connection optical fiber.

[0039] In the embodiment, the devices accommodated in the second groove 401 can be connected to the main connection optical fiber through the structural reserved hole 300 according to the connection relationship in the simulation optical link, or directly connected to the main connection optical fiber on the lower surface of the bottom plate. For example, in the main optical fiber amplification optical path, the output optical fiber of the beam splitter 11 is connected to the main connection optical fiber located in the annular groove through the structural reserved hole 300, and the main connection optical fiber serves as the connection optical fiber of each device, and the main connection optical fiber is connected to each other through the structural reserved hole 300 between the output optical fiber and the annular groove, between the annular groove and the main single-mode pump laser, between the main single-mode pump laser and the main wavelength division multiplexer, between the main erbium-doped gain optical fiber and the first main optical fiber isolator, between the main fiber combiner and the first main multi-mode pump, between the second main multi-mode pump and the second main optical fiber isolator; the main connection optical fiber is directly connected to each other on the lower surface of the bottom plate between the first main optical fiber isolator and the main erbium-ytterbium co-doped gain optical fiber, between the main erbium-ytterbium co-doped gain optical fiber and the main fiber combiner; the main connection optical fiber is directly connected to each other on the upper surface of the bottom plate between the first main multi-mode pump and the second main multi-mode pump. Finally, the second main optical fiber isolator is connected to the first output optical fiber 251 through the main connection optical fiber passing through the structural reserved hole 300.

[0040] The technical scheme provided by the embodiment only winds the main optical fiber in the main optical fiber amplification optical path in the annular groove and integrates other components, thereby improving the redundancy and integration of the main backup optical fiber amplifier. The main optical fiber includes a main connection optical fiber and a main gain optical fiber, and the main gain optical fiber includes a main erbium-doped gain optical fiber and a main erbium-ytterbium co-doped gain optical fiber, and the combination of the two can significantly improve the gain efficiency. The main optical fiber amplification optical path further sequentially connects a main single-mode pump laser, a main wavelength division multiplexer, an optical fiber isolator, an optical fiber combiner, and a multi-mode pump group, integrates pump light and signal light through the wavelength division multiplexer and the combiner, and ensures efficient transmission and amplification. At the same time, the optical fiber isolator is arranged to prevent reverse light reflection and protect the quality of the pump laser and the signal light. In addition, a second groove is designed on the lower surface of the bottom plate, the main single-mode pump laser and the multi-mode pump group are arranged on the upper surface of the bottom plate and separated from other optical path devices to reduce the influence of heat, and the wavelength division multiplexer, the optical fiber isolator, and the combiner are arranged in the second groove, thereby improving the integration of the devices, improving the redundancy and robustness of the main backup optical fiber amplifier, ensuring the reasonable layout of the optical path devices, and improving the working stability of the main backup optical fiber amplifier structure and the reliability of the optical path operation as a whole.

[0041] In one embodiment, the backup optical fiber includes a backup connection optical fiber and a backup gain optical fiber, and the backup gain optical fiber includes a backup erbium-doped gain optical fiber and a backup erbium-ytterbium co-doped gain optical fiber, and wherein: The backup fiber amplification optical path further comprises a backup single-mode pump laser, a backup wavelength division multiplexer, a first backup fiber isolator, a backup fiber combiner, a backup multi-mode pump group, and a second backup fiber isolator connected in sequence through the backup connection optical fiber; wherein the backup erbium-doped gain fiber is arranged between the backup wavelength division multiplexer and the first backup fiber isolator, and the backup erbium-ytterbium co-doped gain fiber is arranged between the first backup fiber isolator and the backup fiber combiner, and the backup multi-mode pump group comprises a first backup multi-mode pump and a second backup multi-mode pump.

[0042] Exemplarily, the output optical fiber of the beam splitter is connected to the backup connection optical fiber located in the annular groove through the structural reserved hole position, and the backup connection optical fiber is connected in sequence to the backup single-mode pump laser, the backup wavelength division multiplexer, the backup erbium-doped gain fiber, the first backup fiber isolator, the backup erbium-ytterbium co-doped gain fiber, the backup fiber combiner, the first backup multi-mode pump and the second backup multi-mode pump, and the second backup fiber isolator. The combination of the backup erbium-doped gain fiber (Er³⁺) and the backup erbium-ytterbium co-doped gain fiber (Er³⁺ and Yb³⁺) can improve the gain efficiency, and the reverse light reflection is prevented by arranging the main fiber isolator, thereby avoiding the influence of light reflection on the backup single-mode pump laser and the signal light quality. The pump light and the signal light are effectively integrated through the backup wavelength division multiplexer and the backup main fiber combiner, thereby ensuring the efficient transmission and amplification of the optical signal in the backup fiber amplification optical path. The backup multi-mode pump group can provide higher pump power, thereby further improving the amplification effect of the signal light.

[0043] In the embodiment, the backup single-mode pump laser, the backup wavelength division multiplexer, the first backup fiber isolator, the backup fiber combiner, the backup multi-mode pump group, and the second backup fiber isolator are all arranged on the upper surface of the bottom plate. By placing all the devices of the backup fiber amplification optical path on the upper surface of the bottom plate, the connection between the optical fibers and the integration of the optical path are facilitated, the main and backup isolation is performed through the bottom plate and the annular groove, the heat conduction of the backup optical fiber caused by the failure of the lower surface of the bottom plate is avoided, the failure risk caused by unreasonable device layout is reduced, thereby ensuring the efficient transmission and amplification of the signal light in the backup fiber amplification optical path of the backup optical path. Moreover, placing all the devices of the backup fiber amplification optical path on the upper surface of the bottom plate can further improve the integration of the main and backup fiber amplifier structure.

[0044] Exemplarily, the backup single-mode pump laser and the backup multi-mode pump group can be arranged in the same region on the upper surface of the bottom plate, and the backup wavelength division multiplexer, the first backup fiber isolator, the backup fiber combiner and the second backup fiber isolator can be arranged in another region on the upper surface of the floor. Thus, the pump light source is separated from other devices in the optical path, and the heat generated by the backup single-mode pump laser and the backup multi-mode pump group does not affect the normal operation of other components. Through the reasonable layout of the backup fiber amplification optical path, the mutual interference between devices is reduced, the stability and reliability of the backup fiber amplification optical path are improved, and it is ensured that the backup fiber amplification optical path can quickly take over the work when the main fiber amplification optical path fails.

[0045] In one embodiment, referring to Figure 5 In one main-backup fiber amplifier structure, the main single-mode pump laser, the first main multi-mode pump and the second main multi-mode pump are arranged in the same region on the upper surface of the bottom plate, i.e., the first region 501, and the main wavelength division multiplexer, the first main fiber isolator, the main fiber combiner and the second main fiber isolator are arranged in the same region on the lower surface of the bottom plate, i.e., the second region 502. The backup single-mode pump laser, the first backup multi-mode pump and the second backup multi-mode pump are arranged in another region on the upper surface of the bottom plate, i.e., the third region 503, and the backup wavelength division multiplexer, the first backup fiber isolator, the backup fiber combiner and the second backup fiber isolator are arranged in another region on the upper surface of the bottom plate, i.e., the fourth region 504. The components in the first region 501 and the second region 502 are connected by optical fibers through the structure reserved hole 300.

[0046] The technical solution provided by the embodiment further integrates and optimizes the design of each component of the backup fiber amplification optical path. Among them, all devices of the backup optical path are arranged on the upper surface of the bottom plate, and the main-backup isolation is realized through the bottom plate and the annular groove, so as to avoid the influence of heat conduction on the backup fiber when the main optical path fails, and improve the integration and reliability of the system. Moreover, the backup single-mode pump laser and the multi-mode pump group are arranged in the same region on the upper surface of the bottom plate, and the wavelength division multiplexer, the fiber isolator and the combiner are arranged in another region. The fiber burning probability of the pump light source itself is small, and the pump light source is separated from other optical path devices. While ensuring high integration of the optical path, the mutual interference between devices is further reduced.

[0047] In one embodiment of the present application, a method for amplifying an optical signal is provided. The method is used for amplifying an optical signal by using the main-backup optical fiber amplifier structure. The method specifically includes: obtaining a signal light to be processed, guiding the signal light to a beam splitter, and determining a hardware state of a main optical fiber amplifier light path; when the hardware state represents a normal state, the beam splitter guides the signal light to the main optical fiber amplifier light path for amplification to obtain a target output signal; and when the hardware state represents a fault state, the beam splitter guides the signal light to a backup optical fiber amplifier light path for amplification to obtain the target output signal.

[0048] In another embodiment, when the hardware state represents the normal state, the beam splitter splits the signal light to obtain a first signal light and a second signal light; the first signal light is guided to the main optical fiber amplifier light path for amplification to obtain a first output signal light, and the first signal light is guided to the backup optical fiber amplifier light path for amplification to obtain a second output signal light; and the first output signal light and the second output signal light are taken as the target output signal. When the hardware state represents the fault state, the beam splitter guides the signal light to the backup optical fiber amplifier light path for amplification to obtain the target output signal.

[0049] The technical solution provided by the above embodiment provides a method for amplifying an optical signal applied to a main-backup optical fiber amplifier structure, which ensures stable amplification output of the optical signal in a fault condition. Specifically, by using the beam splitter and the hardware state determination of the main optical fiber amplifier light path, the flexible switching of the optical signal amplification path is realized. When the main optical fiber amplifier light path is normal, the single amplification or double amplification mode can be selected to output the target signal. When the main optical fiber amplifier light path fails, the optical signal can be quickly switched to the backup optical fiber amplifier light path for amplification, which effectively ensures the continuity and reliability of the optical signal amplification operation, avoids the interruption of the optical signal amplification due to the failure of the main optical fiber amplifier light path, and improves the flexibility of the optical signal amplification while ensuring the stability and practicability of the overall optical signal amplification process.

[0050] For more details, please refer to Figure 6 The second aspect of the present application further provides a method for preparing a main-backup optical fiber amplifier. The method is used for preparing the main-backup optical fiber amplifier structure of the first aspect. The method specifically includes the following steps: S1: providing a housing, a beam splitter, a set of main optical fiber amplifier materials, and a set of backup optical fiber amplifier materials. The housing includes a bottom plate and a side wall.

[0051] Specifically, the main fiber amplifier material includes a first main amplification module, a first main fiber isolator, a second main amplification module and a second main fiber isolator, and is used to build a main fiber amplification optical path; the backup fiber amplifier material includes a first backup amplification module, a first backup fiber isolator, a second backup amplification module and a second backup fiber isolator, and is used to build a backup fiber amplification optical path. The first main amplification module and the first backup amplification module each include a single-mode pump laser, a wavelength division multiplexer and an erbium-doped gain fiber; the second main amplification module and the second backup amplification module each include an erbium-ytterbium co-doped gain fiber, a fiber combiner and two multimode pumps.

[0052] S3: mounting the beam splitter on the upper surface of the bottom plate, preparing a main fiber amplification optical path based on the main fiber amplifier material, and preparing a backup fiber amplification optical path based on the backup fiber amplifier material; S5: forming a ring-shaped groove on the lower surface of the bottom plate, the ring-shaped groove forming a ring-shaped partition plate at a corresponding position on the upper surface of the bottom plate, and forming a structure reserved hole on the ring-shaped partition plate; S7: connecting the first output end of the beam splitter with the backup fiber amplification optical path, and passing the second output end of the beam splitter through the structure reserved hole to be connected with the main fiber amplification optical path.

[0053] In one embodiment, based on the step S3, the preparation of the main fiber amplification optical path based on the main fiber amplifier material and the preparation of the backup fiber amplification optical path based on the backup fiber amplifier material includes: on the lower surface of the bottom plate, performing optical path fusion on the main fiber amplifier material to form the main fiber amplification optical path, and winding and placing the main fiber amplification optical path in the ring-shaped groove; on the upper surface of the bottom plate, performing optical path fusion on the backup fiber amplifier material to form the backup fiber amplification optical path, and winding and placing the backup fiber amplification optical path outside the ring-shaped partition plate.

[0054] In one embodiment, after the step S7, the method further includes: forming an input hole and an output hole on the side wall, and inputting signal light into the beam splitter through the input hole; drawing a first output optical fiber at the end of the main fiber amplification optical path, and drawing a second output optical fiber at the end of the backup fiber amplification optical path; passing the first output optical fiber through the structure reserved hole to the upper surface of the bottom plate, and outputting the amplified signal light through the output hole by the first output optical fiber and the second output optical fiber.

[0055] In one embodiment, after step S7, the method further comprises: The fiber end faces of the main and backup fiber amplifier paths are cut to an 8° angle, and seed light is input at the input end of the beam splitter, and the amplification modules in the main and backup fiber amplifier paths are functionally tested.

[0056] The third aspect of the present application further provides an optical communication system, which applies the main and backup fiber amplifier structure of the first aspect.

[0057] The system illustrated in the above embodiments can be implemented by a computer chip or entity, or by a product with certain functions. A typical implementation device is a computer. Specifically, the computer can be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0058] It should be noted that the terms "comprising", "containing" or any other variant thereof are intended to cover a non-exclusive inclusion, such that a process, method, article or apparatus that comprises a list of elements does not only include those elements, but can also include other elements not expressly listed or inherent to such process, method, article or apparatus. Without more limitations, an element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, article or apparatus that includes the element.

[0059] It should be noted that in the present application, unless otherwise explicitly specified and limited, the first feature is "on", "above" or "over" the second feature, which can be direct contact between the first feature and the second feature, or indirect contact between the first feature and the second feature through an intermediate medium. Moreover, the first feature "on", "above" and "over" the second feature can be directly above or obliquely below the second feature, or only means that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "underneath" the second feature can be directly below or obliquely below the second feature, or only means that the horizontal height of the first feature is less than that of the second feature.

[0060] It is to be noted that a device is referred to as being "fixed" or "disposed" on another device, which can be directly on the other device or can have a mediating device therebetween. A device is considered to be "connected" to another device, which can be directly connected to the other device or can have a mediating device therebetween. The terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar terms used herein are for the purpose of illustration only and do not indicate the only orientation of the embodiments.

[0061] Each of the embodiments in the present specification is described in a progressive manner, and the same or similar parts among the embodiments can be referred to each other. Each of the embodiments focuses on the difference from other embodiments, and the related parts can be referred to the part of the description of other embodiments. The embodiments provided in the present application are used to illustrate the implementation of the present application, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the present specification. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments.

[0062] It is to be noted that the diagrams provided in the above embodiments only schematically illustrate the basic concept of the present application, and only the elements related to the present application are shown in the diagrams, not the number, shape and size of the elements in actual implementation. The shape, number and ratio of the elements in actual implementation can be randomly changed, and the layout pattern of the elements can be more complex.

[0063] The above only describes the embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0064] Although the embodiments of the present application are described in conjunction with the drawings, various modifications and changes can be made by those skilled in the art without departing from the spirit and scope of the present application, and such modifications and changes are included in the scope defined by the appended claims.

Claims

1. A primary / backup fiber optic amplifier structure, characterized in that, The system includes a housing, a beam splitter, a primary fiber amplification path, and a backup fiber amplification path. The housing includes a base plate and sidewalls. The primary fiber amplification path includes at least a primary fiber, and the backup fiber amplification path includes at least a backup fiber. The beam splitter is connected to both the primary fiber amplification path and the backup fiber amplification path. The lower surface of the base plate is provided with an annular groove, and the annular groove forms an annular partition at a corresponding position on the upper surface of the base plate; The primary optical fiber is coiled inside the annular groove, and the backup optical fiber is coiled outside the annular partition. The primary optical fiber and the backup optical fiber are physically separated by the annular partition.

2. The main backup fiber optic amplifier structure according to claim 1, characterized in that, The sidewall is provided with an input port and an output port; wherein: The input aperture is connected to the beam splitter via an input optical fiber; The output port is connected to the primary fiber amplification path via a first output fiber, and the output port is connected to the backup fiber amplification path via a second output fiber.

3. The main backup fiber optic amplifier structure according to claim 1, characterized in that, The annular partition is provided with pre-reserved structural holes; wherein: The pre-reserved holes in the structure are used to guide the signal light to the main fiber amplification optical path located in the annular groove, and to guide the signal light amplified by the main fiber amplification optical path to the first output optical fiber on the upper surface of the base plate.

4. The main backup fiber optic amplifier structure according to claim 1, characterized in that, The primary fiber includes a primary connecting fiber and a primary gain fiber, wherein the primary gain fiber includes a primary erbium-doped gain fiber and a primary erbium-ytterbium co-doped gain fiber, wherein: The primary fiber amplification optical path also includes a primary single-mode pump laser, a primary wavelength division multiplexer, a first primary fiber isolator, a primary fiber combiner, a primary multimode pump group, and a second primary fiber isolator, which are connected in sequence through the primary connecting fiber. The erbium-doped gain fiber is disposed between the primary wavelength division multiplexer and the first primary fiber isolator, and the erbium-ytterbium co-doped gain fiber is disposed between the first primary fiber isolator and the primary fiber combiner.

5. The main backup fiber optic amplifier structure according to claim 4, characterized in that, The lower surface of the base plate further includes a second groove, which is located in a different region from the annular groove on the lower surface of the base plate; wherein: The primary single-mode pump laser and the primary multimode pump group are disposed on the upper surface of the base plate, and the primary wavelength division multiplexer, the first primary fiber isolator, the primary fiber combiner, and the second primary fiber isolator are disposed in the second groove.

6. The main backup fiber optic amplifier structure according to claim 1, characterized in that, The backup optical fiber includes a backup connection optical fiber and a backup gain optical fiber, wherein the backup gain optical fiber includes a backup erbium-doped gain optical fiber and a backup erbium-ytterbium co-doped gain optical fiber, wherein: The backup fiber amplification optical path also includes a backup single-mode pump laser, a backup wavelength division multiplexer, a first backup fiber isolator, a backup fiber combiner, a backup multimode pump group, and a second backup fiber isolator, which are sequentially connected through the backup connecting fiber. The backup erbium-doped gain fiber is disposed between the backup wavelength division multiplexer and the first backup fiber isolator, and the backup erbium-ytterbium co-doped gain fiber is disposed between the first backup fiber isolator and the backup fiber combiner.

7. The main backup fiber optic amplifier structure according to claim 6, characterized in that, The backup single-mode pump laser, the backup wavelength division multiplexer, the first backup fiber isolator, the backup fiber combiner, the backup multimode pump group, and the second backup fiber isolator are all disposed on the upper surface of the base plate.

8. A method for fabricating a primary / backup fiber optic amplifier, characterized in that, The method includes: Provide a housing, a beam splitter, a set of primary fiber optic amplifier materials and a set of backup fiber optic amplifier materials, wherein the housing includes a base plate and side walls; The beam splitter is installed on the upper surface of the base plate, and the primary fiber amplifier optical path is prepared based on the primary fiber amplifier material, and the backup fiber amplifier optical path is prepared based on the backup fiber amplifier material. An annular groove is formed on the lower surface of the base plate, and the annular groove forms an annular partition at a corresponding position on the upper surface of the base plate. A pre-reserved structural hole is formed on the annular partition. Connect the first output end of the beam splitter to the backup fiber amplification optical path, and pass the second output end of the beam splitter through the reserved hole in the structure to connect it to the main fiber amplification optical path.

9. The method according to claim 8, characterized in that, The preparation of a primary fiber optic amplification path based on the primary fiber optic amplifier material, and the preparation of a backup fiber optic amplification path based on the backup fiber optic amplifier material, include: On the lower surface of the base plate, the primary fiber amplifier material is optically fused to form a primary fiber amplification optical path, and the primary fiber amplification optical path is coiled and placed in the annular groove. On the upper surface of the base plate, the backup fiber amplifier material is optically fused to form a backup fiber amplifier optical path, and the backup fiber amplifier optical path is coiled and placed on the outside of the annular partition.

10. An optical communication system, characterized in that, The system uses the main backup fiber amplifier structure as described in any one of claims 1 to 7.

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