Double-layer hollow JP cabinet heat dissipation method and system, terminal and medium

Abstract

The invention relates to a double-layer hollow JP cabinet heat dissipation method and system, a terminal and a medium, and relates to the technical field of power distribution equipment, and the method comprises the steps: obtaining the cabinet body temperature of a JP cabinet in real time, and the cabinet body temperature comprises the outer cabinet body temperature and the inner cabinet body temperature; under the condition that the temperature of the inner cabinet body reaches a first temperature threshold value and is smaller than a second temperature threshold value, air in the cabinet is conveyed to a cabinet body interlayer through an air inlet fan arranged at the bottom of the JP cabinet, the cabinet body interlayer is a crack layer formed between the inner cabinet body and the outer cabinet body, and a liquid cooling radiator is arranged in the cabinet body interlayer; an air outlet fan arranged on the top interlayer is synchronously started, and air flow in the interlayer of the cabinet body is conveyed to external air; and under the condition that the temperature of the inner cabinet body reaches a second temperature threshold value, the liquid cooling radiator is controlled to work so as to cool the air flow in the interlayer in the cabinet. The JP cabinet has the effect of improving the heat dissipation efficiency of the JP cabinet.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of power distribution equipment, in particular to a double-layer hollow JP cabinet heat dissipation method, system, terminal and medium. BACKGROUND

[0002] The JP cabinet is a cabinet structure used for installing power equipment, communication equipment or control units, and is widely used in power distribution systems, industrial control systems and related outdoor application scenarios. During the operation of the JP cabinet, the electronic components in the cabinet will generate heat under continuous working conditions, and in high-temperature weather, the surface of the JP cabinet will accumulate heat. If the heat is not dissipated in time, the temperature in the cabinet will rise, thereby affecting the operation stability and service life of the equipment.

[0003] In the prior art, the JP cabinet usually adopts a single-layer cabinet structure, that is, the cabinet body only includes a metal shell. In this type of structure, the heat generated inside the cabinet body is mainly dissipated outward through the surface conduction of the cabinet body and the natural convection of air. The overall heat dissipation capacity is limited. In order to improve the heat dissipation effect, some existing JP cabinets are provided with ventilation holes or louver structures at the bottom or side of the cabinet body, so that the air in the cabinet can enter from the bottom and be discharged from the top or side under the action of gravity, temperature difference or external airflow, thereby forming an air flow path. However, this type of ventilation mainly relies on natural convection or environmental airflow to drive, which is a passive ventilation method. Its heat dissipation effect is easily affected by factors such as external environment temperature, wind speed and installation position. In high-temperature or closed installation environment, in order to ensure the stable operation of the equipment in the cabinet, a large-power active refrigeration device such as an air conditioner is usually required. However, although this type of active heat dissipation method can improve the cooling efficiency, it will significantly increase the power consumption.

[0004] In the related technology described above, when the ambient temperature is high or the air flow condition is poor, the passive ventilation method has low heat dissipation efficiency. If a large-power refrigeration device such as an air conditioner is used for cooling, it will increase the power consumption. SUMMARY

[0005] In order to improve the heat dissipation efficiency of the JP cabinet, the application provides a double-layer hollow JP cabinet heat dissipation method, system, terminal and medium.

[0006] In the first aspect, the application provides a double-layer hollow JP cabinet heat dissipation method, which adopts the following technical scheme: A double-layer hollow JP cabinet heat dissipation method, comprising: real-time acquisition of the cabinet body temperature of the JP cabinet, the cabinet body temperature including the outer cabinet body temperature and the inner cabinet body temperature; In the case that the inner cabinet temperature reaches the first temperature threshold and is less than the second temperature threshold, the air in the cabinet is transported towards the cabinet interlayer by the air inlet fan arranged at the bottom of the JP cabinet, the cabinet interlayer refers to the interlayer formed between the inner cabinet and the outer cabinet, and the liquid cooling radiator is arranged in the cabinet interlayer; The air outlet fan arranged in the top interlayer is started synchronously to transport the air flow in the cabinet interlayer to the external air; In the case that the inner cabinet temperature reaches the second temperature threshold, the liquid cooling radiator is controlled to work to cool the air flow in the cabinet interlayer.

[0007] By adopting the above technical scheme, the cabinet interlayer formed by the inner cabinet and the outer cabinet is arranged in the JP cabinet, and the air flow in the cabinet is guided to the cabinet interlayer for transportation, so that the flowing air flow continuously cools the inner cabinet, thereby reducing the temperature in the cabinet; in the high-temperature working condition, the liquid cooling radiator in the cabinet interlayer further cools and processes the air flow, so that the heat dissipation capacity of the inner cabinet is enhanced, and compared with the existing single-layer cabinet structure, the overall heat dissipation efficiency of the JP cabinet is improved. Further, compared with the cooling by using large-power refrigeration equipment such as air conditioner, the power consumed by the JP cabinet in the heat dissipation process is less.

[0008] Optionally, the side plate for mounting electronic components in the JP cabinet is defined as a mounting back plate, a plurality of grid air inlets are arranged in the mounting back plate, and an air inlet gap is formed between the electronic components and the grid air inlets; the method further comprises: obtaining a temperature difference between the temperature of the outer cabinet and the temperature of the inner cabinet; determining whether the temperature difference is greater than a preset high temperature difference; If yes, the first target air speed of the air inlet fan and the second target air speed of the air outlet fan are determined according to the temperature difference, wherein the first target air speed is less than the second target air speed; The air inlet fan is adjusted according to the first target air speed, and the air outlet fan is adjusted according to the second target air speed, so that part of the air in the JP cabinet enters the cabinet interlayer through the air inlet gap.

[0009] By adopting the above technical scheme, the grid air inlets are arranged on the mounting back plate to form the air inlet gap, and the air speed of the air inlet fan and the air outlet fan is differentially controlled based on the temperature difference between the temperature of the outer cabinet and the temperature of the inner cabinet, so that the air speed of the air outlet fan is greater than the air speed of the air inlet fan, thereby forming negative pressure to induce the air flow in the cabinet interlayer, so that part of the air in the JP cabinet passes through the electronic components and then is introduced into the cabinet interlayer through the air inlet gap, so as to cool the electronic components and the inner cabinet.

[0010] Optionally, the cabinet interlayer is provided with several partition strips at intervals and a contraction device for changing the gap between adjacent partition strips, forming a conveying channel for air transport between adjacent partition strips; the method further includes: Obtain the first temperature distribution of the mounting backplane and the second temperature distribution of the electronic components; Determine whether there are component areas with temperatures higher than the preset operating temperature based on the second temperature distribution. If so, then determine whether there is a target high-temperature region corresponding to the component area based on the first temperature distribution; If it exists, then obtain the target grille vent and local conveying channel area corresponding to the target high temperature area; The shrinkage device controls the shrinkage of the local partition area, thereby shrinking the local conveying channel area. If the temperature difference is greater than the preset high temperature difference, increase the target air speed of the exhaust fan and increase the power of the liquid cooler. When the temperature difference is less than the preset low temperature difference, increase the target wind speed of the intake fan and decrease the target wind speed of the exhaust fan. If not, the electrical components will be cooled according to the preset heat dissipation method.

[0011] By adopting the above technical solution, adjustable partitions are set in the cabinet interlayer, and a shrinking device is used to shrink the local conveying channel corresponding to the target high-temperature area. This causes the airflow to form a state with a reduced cross-sectional area in the local conveying channel, thereby increasing the airflow velocity. The Venturi effect is used to enhance the heat exchange capacity of the airflow to the mounting back panel and the corresponding electronic component area. At the same time, the intake fan, exhaust fan and liquid cooling heat sink are coordinated and adjusted according to the temperature difference between the outer cabinet temperature and the inner cabinet temperature. This ensures that the high-temperature area can obtain a matching enhanced heat dissipation effect under different thermal conditions, thereby improving the local heat dissipation efficiency and temperature control capability of the double-layer hollow JP cabinet.

[0012] Optionally, the step of dissipating heat from electrical components according to a preset heat dissipation method includes: Determine the reverse dust removal direction of the intake fan based on the component area; Control the intake fan to work in reverse and in the opposite dust removal direction at the first power; Obtain air turbidity information in the component area; Based on the air turbidity information, determine whether the air turbidity in the component area is greater than the preset dust removal threshold. If so, control the intake fan to operate at the preset dust removal power; After a preset dust removal time, the intake fan is controlled to work in the forward direction and at a preset dust suction power. The exhaust fan is controlled to operate at the second power, so that some of the disturbed dust enters the cabinet interlayer through the target grille vent. The second power is greater than the preset dust collection power. Repeat the above five steps until the air turbidity is less than the preset dust removal threshold.

[0013] By adopting the above technical solution, the intake fan is controlled to work in reverse to agitate and remove dust from the component area. The dust removal power and duration are judged and controlled in a cycle based on air turbidity information, so that the dust attached to the surface of electronic components can be effectively loosened. At the same time, by controlling the exhaust fan to operate at a power greater than that of the suction fan, the agitated dust is guided into the cabinet interlayer through the target grille vent and discharged outside the cabinet, avoiding repeated dust deposition inside the cabinet. Thus, continuous cleaning of electronic components is achieved without affecting the normal heat dissipation structure, reducing the impact of dust on heat dissipation performance.

[0014] Optionally, determine whether the target high-temperature region still exists based on the first temperature distribution; If present, control the non-target grille vents (excluding the target grille vent) to open and close at a preset frequency. When the non-target grille vent is closed, control the exhaust fan to work in reverse. When the non-target grille vent is open, control the exhaust fan to operate in the forward direction.

[0015] By adopting the above technical solution, when the target high-temperature area still exists, by controlling the non-target grille vents to be closed and the exhaust fan to work in reverse, the intake fan and exhaust fan simultaneously deliver airflow into the cabinet interlayer, thereby forming an airflow convergence state in the cabinet interlayer. This allows the airflow in the interlayer to be output at high speed through the target grille vents, which intensifies the blowing and heat dissipation of the electronic component area corresponding to the target grille vents, thus improving the heat dissipation effect on the target high-temperature area.

[0016] Optionally, during the operation of the intake fan and the exhaust fan, the first temperature rise rate of the inner cabinet and the second temperature rise rate of the outer cabinet are periodically acquired. By comparing and analyzing the first and second rates of temperature change, the dominant direction of temperature transfer is obtained. Determine the target side of the liquid-cooled radiator based on the direction of heat transfer. The liquid-cooled radiator is moved within the cabinet interlayer according to the target side, so that the liquid cooling pipes of the liquid-cooled radiator are in contact with the target cabinet side.

[0017] By adopting the above technical solution, the temperature rise rate of the inner cabinet and the outer cabinet is compared and analyzed to determine the dominant direction of heat transfer. Based on this, the liquid cooling radiator is controlled to be attached to the target cabinet side in the cabinet interlayer, so that the liquid cooling radiator acts preferentially on the cabinet side where heat is concentrated, thereby improving the utilization efficiency of the liquid cooling radiator and enhancing the heat dissipation effect of the JP cabinet.

[0018] Optionally, the dominant temperature transfer direction is updated based on the real-time changes of the first and second temperature rise rates to obtain the predicted active transfer direction. Determine whether the contact side corresponding to the predicted active transmission direction is consistent with the target contact side of the current liquid cooler. If not, record the duration of the predicted active transmission direction; Determine whether the duration of the predicted active transmission direction is greater than the preset direction stabilization determination duration; If so, the liquid cooling radiator is switched from the current target contact side to the other cabinet side corresponding to the predicted active transmission direction; When the difference between the first temperature rise rate and the second temperature rise rate is less than the preset directional failure threshold, it is determined that there is no clear temperature-dominant transmission direction at present. In the absence of a clear dominant temperature transfer direction, the liquid-cooled radiator is controlled to detach from the cabinet and move to the middle position of the cabinet interlayer to enter a non-directional heat dissipation state.

[0019] By adopting the above technical solution, the temperature rise rate of the inner and outer cabinets is continuously updated to predict the dominant heat transfer direction. The liquid cooling radiator is switched only when the transfer direction remains stable for a preset time, thus avoiding frequent movement of the liquid cooling radiator due to temperature fluctuations. When the temperature rise rate difference between the inner and outer cabinets decreases and there is no clear dominant heat transfer direction, the liquid cooling radiator is detached from the cabinet and positioned in the middle of the cabinet interlayer for non-directional heat dissipation. This maintains a balanced heat dissipation effect when the heat transfer direction is unclear, thereby improving the heat dissipation efficiency of the liquid cooling radiator.

[0020] Secondly, this application provides a double-layer hollow JP cabinet heat dissipation system, which adopts the following technical solution: A double-layer hollow JP cabinet heat dissipation system includes: The acquisition module is used to acquire the cabinet temperature; A memory for storing the program of the heat dissipation method for the double-layer hollow JP cabinet; The processor and the program in the memory can be loaded and executed by the processor to implement the heat dissipation method of the double-layer hollow JP cabinet.

[0021] By adopting the above technical solution, a cabinet interlayer formed by an inner and outer cabinet is set in the JP cabinet, and the airflow inside the cabinet is guided into the cabinet interlayer for transportation, so that the flowing airflow continuously cools the inner cabinet, thereby reducing the temperature inside the cabinet. Under high-temperature conditions, the airflow is further cooled by a liquid-cooled radiator in the cabinet interlayer, which enhances the heat dissipation capacity of the inner cabinet. Compared with the existing single-layer cabinet structure, the overall heat dissipation efficiency of the JP cabinet is improved. Furthermore, compared with using high-power cooling equipment such as air conditioners for cooling, the power consumption of this application for cooling the JP cabinet is less. Thirdly, this application provides a smart terminal, which adopts the following technical solution: A smart terminal includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed as described in any one of the above methods.

[0022] Fourthly, this application provides a computer storage medium capable of storing corresponding programs, which facilitates improving the heat dissipation efficiency of the JP cabinet, and adopts the following technical solution: A computer-readable storage medium storing a computer program that can be loaded by a processor and executed any of the above-described methods for heat dissipation of a double-layer hollow JP cabinet.

[0023] In summary, this application includes at least one of the following beneficial technical effects: By setting up a cabinet mezzanine formed by an inner cabinet and an outer cabinet in the JP cabinet, and guiding the airflow inside the cabinet into the cabinet mezzanine for delivery, the flowing airflow continuously cools the inner cabinet, thereby reducing the temperature inside the cabinet. Under high-temperature conditions, the airflow is further cooled by a liquid-cooled radiator in the cabinet mezzanine, which enhances the heat dissipation capacity of the inner cabinet. Compared with the existing single-layer cabinet structure, the overall heat dissipation efficiency of the JP cabinet is improved. Furthermore, compared with using high-power cooling equipment such as air conditioners for cooling, this application consumes less electricity when cooling the JP cabinet. By setting up grille vents on the mounting back panel and forming an air intake gap, and by differentially controlling the air intake fan and exhaust fan speeds based on the temperature difference between the outer and inner cabinets, the exhaust fan speed is made greater than the intake fan speed. This creates a negative pressure induced airflow within the cabinet interlayer, causing some of the air inside the JP cabinet to pass through the electronic components and then be introduced into the cabinet interlayer through the air intake gap to cool the electronic components and the inner cabinet. By comparing and analyzing the temperature rise rates of the inner and outer cabinets, the dominant direction of heat transfer is determined. Based on this, the liquid cooling radiator is controlled to be placed closer to the target cabinet side within the cabinet interlayer, so that the liquid cooling radiator preferentially acts on the cabinet side where heat is concentrated, thereby improving the utilization efficiency of the liquid cooling radiator and enhancing the heat dissipation effect of the JP cabinet. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of a double-layer hollow fence-type JP cabinet in an embodiment of this application.

[0025] Figure 2 This is a schematic flowchart of a heat dissipation method for a double-layer hollow JP cabinet according to an embodiment of this application.

[0026] Figure 3 This is a flowchart illustrating a wind speed adjustment method in an embodiment of this application.

[0027] Figure 4 This is a flowchart illustrating a local heat dissipation method in an embodiment of this application.

[0028] Figure 5 This is a schematic diagram of the separator and shrinkage device in an embodiment of this application.

[0029] Figure 6 This is a schematic diagram of the process of heat dissipating electrical components according to a preset heat dissipation method in an embodiment of this application.

[0030] Figure 7 This is a schematic flowchart of a heat dissipation method using a grille vent in an embodiment of this application.

[0031] Figure 8 This is a schematic flowchart of a liquid cooling heat dissipation method according to an embodiment of this application.

[0032] Figure 9 This is a flowchart illustrating a side-switching method according to an embodiment of this application.

[0033] Explanation of reference numerals in the attached drawings: 1. Outer cabinet; 2. Inner cabinet; 21. Air inlet; 22. Mounting back panel; 23. Grille vent; 3. Cabinet mezzanine; 31. Air outlet; 4. Intake fan; 5. Exhaust fan; 6. Liquid cooling radiator; 61. Liquid cooling pipe; 7. Divider strip; 8. Shrink device; 81. Shrink block. Detailed Implementation

[0034] To make the purpose, technical solution, and advantages of this application clearer, the following description is provided in conjunction with the appendix. Figure 1 -Appendix Figure 9 The present application will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the application.

[0035] This application discloses a double-layer hollow fence-type JP cabinet. (Refer to...) Figure 1The double-layer hollow grid-type JP cabinet includes an outer cabinet 1 and an inner cabinet 2, which together form a double-layer hollow structure. The gap between the outer cabinet 1 and the inner cabinet 2 is defined as a cabinet mezzanine 3. The side panels, back panel, and top panel of the JP cabinet are all double-layered, i.e., they have cabinet mezzanines 3. The cabinet mezzanines 3 are interconnected. Each cabinet mezzanine 3 has an air inlet 21 near the bottom, connected to an intake fan 4 with its tail pointing upwards. The cabinet mezzanine 3 on the top panel has an air outlet 31 on its side, connected to an exhaust fan 5. The intake fan 4 draws air from inside the JP cabinet to the corresponding cabinet mezzanine 3, then along the mezzanine 3 to the top mezzanine, where the exhaust fan 5 draws the air out into the outside air. Liquid cooling radiators 6 are installed in the cabinet interlayer 3 formed by the cabinet side panel and the cabinet back panel. The liquid cooling pipes 61 of the liquid cooling radiators 6 are attached to the inner cabinet 2 in an arc shape.

[0036] This application discloses a heat dissipation method for a double-layer hollow JP cabinet. (Refer to...) Figure 2 The heat dissipation methods for double-layer hollow JP cabinets include: Step S101: Obtain the cabinet temperature of the JP cabinet in real time, including the outer cabinet temperature and the inner cabinet temperature.

[0037] Cabinet temperature refers to the set of temperature information that characterizes the overall thermal state of the JP cabinet, including the external cabinet temperature, which reflects the degree of influence of the environment on the outside of the cabinet, and the internal cabinet temperature, which reflects the degree of influence of the operation of the components inside the cabinet.

[0038] The external cabinet temperature refers to the temperature of the surface of the outer cabinet structure. It is used to reflect the heat exchange state between the JP cabinet and the external environment, and can also reflect the ambient temperature outside the cabinet.

[0039] The internal cabinet temperature refers to the temperature of the inner cabinet structure or its adjacent space, which reflects the thermal impact of the air inside the cabinet and the operation of components on the cabinet.

[0040] Step S102: When the temperature of the inner cabinet reaches the first temperature threshold and is less than the second temperature threshold, the air inside the cabinet is transported to the cabinet interlayer by the air intake fan set at the bottom of the JP cabinet. The cabinet interlayer refers to the gap layer formed between the inner cabinet and the outer cabinet, wherein a liquid cooling radiator is installed in the cabinet interlayer.

[0041] The first and second temperature thresholds are both preset constants that can be adjusted according to actual conditions. The second temperature threshold is greater than the first temperature threshold.

[0042] The intake fan is located at the bottom of the JP cabinet and is a fan assembly used to drive the gas inside the cabinet to generate a directional flow. Its output direction is towards the cabinet interlayer.

[0043] The cabinet mezzanine is a gap space formed between the inner and outer cabinets, used to contain the gas being transported inside the cabinet, and structurally isolated from the internal space of the cabinet.

[0044] The liquid-cooled radiator is a heat exchange device installed inside the cabinet's interlayer, used to cool the gas inside the interlayer when specific conditions are met.

[0045] After the intake fan starts operating, it creates an upward airflow within the cabinet, transporting the air near the bottom to the interlayer between the inner and outer cabinets. Once inside the interlayer, the air mixes with the existing air to form the interlayer airflow. During this process, the liquid-cooled radiator within the interlayer is inactive, existing only as a structural component; the operation of the intake fan is unaffected by the radiator's on / off status.

[0046] For example, when the ambient temperature is high during the day but the internal cabinet temperature has not yet reached the second temperature threshold, after the intake fan is started, the gas heated by the operation of electronic components inside the cabinet is continuously transported to the cabinet interlayer, so that a stable gas exchange relationship is formed between the internal space and the interlayer space.

[0047] Step S103: Simultaneously start the exhaust fan installed in the top mezzanine to deliver the airflow in the cabinet mezzanine to the outside air.

[0048] As the intake fan continuously delivers air from inside the cabinet to the cabinet's mezzanine, a start command is simultaneously sent to the exhaust fan located at the top of the mezzanine. Once activated, the exhaust fan creates an upward airflow within the mezzanine, causing the air to flow from bottom to top and be discharged into the outside air through the exhaust channel at the top of the mezzanine. During this process, the intake and exhaust fans are located on the lower and upper sides of the mezzanine, respectively, forming a vertically aligned spatial relationship and creating a continuous air delivery channel within the mezzanine.

[0049] For example, when the intake fan has already sent the gas inside the cabinet into the cabinet interlayer, the exhaust fan starts simultaneously, and the gas inside the interlayer is continuously transported along the height of the interlayer and discharged to the outside air through the top, thereby keeping the gas inside the interlayer in a state of dynamic renewal.

[0050] Step S104: When the temperature of the inner cabinet reaches the second temperature threshold, control the liquid cooling radiator to work in order to cool the airflow in the inner layer of the cabinet.

[0051] The second temperature threshold is a preset temperature limit used to characterize the temperature of the inner cabinet entering the high-temperature operating range, and it is higher than the first temperature threshold.

[0052] In one feasible embodiment, when the temperature of the inner cabinet reaches a second temperature threshold, a start command is sent to the liquid-cooled radiator located in the cabinet interlayer, causing the liquid-cooled radiator to enter the working state. After the liquid-cooled radiator starts working, the liquid cooling pipes form a heat exchange relationship with the gas flowing in the cabinet interlayer, so that the gas in the interlayer passes through the heat exchange area of ​​the liquid cooling pipes as it flows along a predetermined transport path. During this process, the intake fan and exhaust fan remain running, ensuring continuous gas flow in the cabinet interlayer, thereby replacing the temperature of the hot airflow in the JP cabinet.

[0053] This application provides a wind speed adjustment method, referring to... Figure 3 The method includes: Step S201: Obtain the temperature difference between the outer cabinet temperature and the inner cabinet temperature.

[0054] The temperature difference is obtained by subtracting the temperature of the outer cabinet from the temperature of the inner cabinet, which is used to represent the degree of difference between the thermal states of the inner and outer parts of the cabinet.

[0055] The side panel in the JP cabinet used for mounting electronic components is defined as mounting back panel 22, referencing... Figure 1 The mounting backplate 22 array has several grille vents 23, and an air intake gap is formed between the electronic components and the grille vents 23.

[0056] Step S202: Determine whether the temperature difference is greater than the preset high temperature difference value.

[0057] The preset high temperature difference value is a constant that can be adjusted according to actual conditions. When the temperature difference value is greater than the preset high temperature difference value, it indicates that the temperature of the outer cabinet is significantly higher than that of the inner cabinet, and the JP cabinet is in an external heat-dominated operating condition, where high external temperatures (such as midday sun exposure) are continuously transferring heat from the outer cabinet to the inner cabinet.

[0058] Step S203: If yes, then determine the first target wind speed of the intake fan and the second target wind speed of the exhaust fan based on the temperature difference, wherein the first target wind speed is less than the second target wind speed.

[0059] The first target wind speed refers to the target operating wind speed set for the intake fan, which limits the output level of the intake fan under current operating conditions. This can be obtained by looking up a preset temperature difference-wind speed table, thus determining the first target wind speed corresponding to the temperature difference.

[0060] The second target wind speed refers to the target operating wind speed set for the exhaust fan, which is used to limit the output level of the exhaust fan under the current operating conditions. This can be obtained by looking up a preset temperature difference-wind speed reference table, thus obtaining the second target wind speed corresponding to the temperature difference.

[0061] The generated first target wind speed is used to adjust the operating status of the intake fan, and the generated second target wind speed is used to adjust the operating status of the exhaust fan. Together, they constitute the wind speed configuration result under the current operating conditions.

[0062] Step S204: Adjust the intake fan according to the first target wind speed and adjust the exhaust fan according to the second target wind speed so that some air in the JP cabinet enters the cabinet interlayer through the air intake gap.

[0063] The air inlet gap refers to the space formed between the electronic components and the grille vents on the mounting side panel, which is used to allow air inside the cabinet to pass through and enter the cabinet's interlayer.

[0064] Based on the target wind speed parameters, the operating status of the fan is set or changed so that the fan operates at the corresponding target wind speed.

[0065] Partial air refers to a portion of the gas inside the cabinet, as opposed to the complete replacement of the entire air.

[0066] In one feasible embodiment, when the intake fan operates at a first target wind speed and the exhaust fan operates at a second target wind speed, and the second target wind speed is greater than the first target wind speed, a gas extraction state dominated by the exhaust fan is formed in the cabinet interlayer, so that a pressure difference is formed between the cabinet interlayer and the cabinet interior space.

[0067] Under this pressure difference, air inside the cabinet enters the cabinet interlayer through the grille vents on the mounting back panel. Since the electronic components are fixed to the side of the mounting back panel opposite the grille vents by the support pillars, and an air intake gap is formed between the electronic components and the grille vents, the air entering the cabinet interlayer flows along the area where the electronic components are located before entering the cabinet interlayer, forming directional convection heat dissipation for the electronic components, thereby reducing the local operating temperature of the electronic components.

[0068] This application provides a local heat dissipation method, referring to... Figure 4 The method includes: Step S301: Obtain the first temperature distribution of the mounting backplane and the second temperature distribution of the electronic components.

[0069] Reference Figure 5The cabinet's interlayer contains several partition strips 7 and a shrinkage device 8 for adjusting the gap between adjacent partition strips 7. Adjacent partition strips 7 form a flow channel for air transport. The partition strips 7 are initially vertically positioned, with one partition strip 7 between adjacent liquid cooling pipes 61. This allows air to contact the liquid cooling pipes 61 as it flows along the flow channel formed by the adjacent partition strips, thus achieving a cooling function. The shrinkage device 8 includes several shrinkage blocks 81 arranged along the length of the partition strips 7. Shrinkage blocks 81 at the same height on adjacent partition strips 7 can move closer to or further away from each other. When local shrinkage of the partition strip 7 is required, the shrinkage blocks 81 corresponding to the local shrinkage area are controlled to move closer to each other, thereby achieving localized shrinkage of the partition strip 7.

[0070] The first temperature distribution refers to the multi-point temperature information acquired along the plane of the mounting backplate, used to reflect the degree of heat accumulation in different areas of the mounting backplate. This first temperature distribution can be obtained through an array of temperature sensors mounted on the mounting backplate.

[0071] The second temperature distribution refers to the temperature information obtained for different electronic components, used to characterize the actual operating temperature rise of each electronic component. The second temperature distribution can be obtained through an infrared temperature sensor.

[0072] Step S302: Determine whether there is a component area with a temperature higher than the preset operating temperature based on the second temperature distribution.

[0073] The preset operating temperature is a preset constant, which refers to the highest temperature threshold allowed for the normal operation of electronic components. It is used to determine whether electronic components are in an overheating risk state.

[0074] The component area refers to a local area on the mounting backplane consisting of one or more spatially adjacent electronic components.

[0075] In one feasible embodiment, each temperature value in the second temperature distribution is compared with its corresponding preset operating temperature; if the temperature value corresponding to any electronic component is greater than its corresponding preset operating temperature, then a component area with abnormal temperature is determined. In another feasible embodiment, if the temperatures of multiple adjacent electronic components simultaneously exceed the preset operating temperature, they can be merged and determined as the same high-temperature component area.

[0076] Step S303: If yes, then determine whether there is a target high-temperature region corresponding to the component region based on the first temperature distribution.

[0077] On the other hand, if there is no component area with a temperature higher than the preset operating temperature, no processing is performed.

[0078] The target high-temperature area refers to a local area located on one side of the mounting backplate that corresponds to the high-temperature component area in terms of spatial location, where the temperature at the corresponding location in the first temperature distribution is higher than that of the surrounding area.

[0079] By mapping and comparing the position of the component area on the mounting backplane with the temperature information in the first temperature distribution, it is determined whether there is an area with abnormally high temperature at the corresponding position on the mounting backplane, thereby determining whether a target high-temperature area corresponding to the component area has been formed.

[0080] This step is used to distinguish between two situations: one is that the electronic components are overheating and have formed obvious heat accumulation on the back panel side, that is, the electronic components are generating heat on the side facing the mounting back panel; the other is that the electronic components are overheating but have not yet formed a significant high temperature distribution on the back panel side, that is, the electronic components are generating heat in the area not facing the mounting back panel.

[0081] In one feasible embodiment, based on the projection position of the electronic component area on the mounting backplane, a corresponding area range is selected in the first temperature distribution, and the peak temperature of the area is calculated; if the temperature is greater than a preset high temperature judgment threshold of the backplane, it is determined that there is a target high temperature area corresponding to the component area.

[0082] In another feasible embodiment, the temperature of the projected area can be compared with that of its surrounding adjacent areas. When the temperature difference exceeds a preset area temperature difference threshold, the area is further confirmed as the target high-temperature area.

[0083] Step S304: If it exists, obtain the target grille vent and local conveying channel area corresponding to the target high temperature area.

[0084] The target grille vent refers to the grille vent on the mounting back panel that corresponds to the target high-temperature area in space, and is used as the main channel for airflow to enter the cabinet interlayer.

[0085] The local conveying channel area refers to the area within the conveying channel located inside the cabinet interlayer and corresponding to the target high-temperature area, corresponding to a section of the dividing strip used to adjust the cross-sectional area of ​​the conveying channel.

[0086] Step S305: The local partition strip area is controlled to shrink by the shrinkage device, so that the local conveying channel area shrinks.

[0087] By controlling the adjacent shrinking blocks corresponding to the local partition strip area to move closer to each other, the local partition strip area shrinks. When the exhaust fan of the top mezzanine continuously draws air from the cabinet mezzanine, the gas velocity increases and the static pressure decreases as it passes through the local conveying channel area due to the reduction in the channel cross-sectional area, thus forming a negative pressure area near the grille vent in the target conveying channel.

[0088] In one feasible embodiment, after the local conveying channel area enters a contracted state, the airflow velocity inside it is higher than that in the uncontracted state under the same evacuation conditions. Based on the Venturi effect, the static pressure in the local conveying channel area decreases, creating a pressure gradient from inside the cabinet to the cabinet interlayer in the cabinet space located between the grille vent and the electronic components on the side of the mounting backplate. Under the action of this pressure gradient, the air inside the cabinet flows through the air inlet gap past the electronic components, is drawn through the grille vent into the cabinet interlayer, and is conveyed upward along the target conveying channel.

[0089] Step S306: If the temperature difference is greater than the preset high temperature difference, increase the target airflow speed of the exhaust fan and increase the power of the liquid cooling radiator.

[0090] The preset high temperature difference value is a preset constant, which can be adjusted according to the actual situation.

[0091] The fan speed increase of the exhaust fan can be obtained by looking up a table based on the preset temperature difference-fan speed table. The power increase of the liquid cooling radiator can be obtained by looking up a table based on the preset temperature difference-power table.

[0092] In one feasible embodiment, when the temperature difference exceeds a preset high-temperature difference value, it indicates that the outer cabinet is in a high-temperature environment, and the cabinet interlayer needs to bear the bidirectional heat load from both inside and outside the cabinet. In this case, increasing the target air velocity of the exhaust fan increases the overall flow rate of the gas within the cabinet interlayer, and coordinates with the contraction of the local transport channel area to maintain a high gas velocity in the local transport channel area. Simultaneously, increasing the operating power of the liquid-cooled radiator ensures that the gas flowing through the target transport channel completes heat transfer upon passing through the liquid-cooled radiator and continues to be transported to the outside of the cabinet. Furthermore, by increasing the target air velocity of the exhaust fan, the negative pressure state at the target grille vent can be increased. Under this negative pressure state, air from inside the cabinet continuously enters the cabinet interlayer through the target grille vent, flowing through the electronic components corresponding to the target high-temperature area during entry, thereby dissipating heat from the electronic components.

[0093] Step S307: When the temperature difference is less than the preset low temperature difference, increase the target wind speed of the intake fan and decrease the target wind speed of the exhaust fan.

[0094] The preset low temperature difference value is a preset constant, which can be adjusted according to the actual situation.

[0095] When the temperature difference between the outer and inner cabinets is less than the preset low-temperature difference, it indicates that the external ambient temperature is lower than the internal temperature. In this case, directly introducing cold outside air to cool the electronic components can easily cause condensation on their surfaces due to the large temperature difference, thus affecting their operational reliability. By increasing the target airflow of the intake fan and decreasing the target airflow of the exhaust fan, the airflow generated inside the cabinet's internal layers is directed from the target grille vents inwards, directly blowing onto the electronic components and dissipating heat on the side facing the mounting backplate.

[0096] Step S308: If not, then heat the electrical components according to the preset heat dissipation method.

[0097] When the second temperature distribution of electronic components indicates that there are no component areas with temperatures exceeding the preset operating temperature, it means that the heat-generating area of ​​the electronic components inside the cabinet is not facing the mounting back panel. In this case, if a localized accelerated airflow control method targeting the target grille vents and conveyor channels is still used, the heat dissipation effect will be unsatisfactory. Therefore, heat dissipation should be carried out on the electrical components according to the preset heat dissipation method. Specific steps can be found in [reference needed]. Figure 6 Example.

[0098] Reference Figure 6 The electrical components are cooled according to a preset heat dissipation method, including: Step S401: Determine the reverse dust removal direction of the intake fan based on the component area.

[0099] Reverse dust removal direction refers to the intake fan being controlled to output airflow in the opposite direction to its normal airflow direction, used to directionally blow air from the cabinet interlayer toward the area where electronic components are located. This direction is the direction in which the tail of the fan is directed toward the component area.

[0100] By obtaining the spatial positional relationship of the component area on the mounting backplate, the orientational relationship of the component area relative to the location of the intake fan is determined, and the dust removal airflow output direction of the intake fan is set in reverse accordingly, so that the reverse airflow can reach the component area along the predetermined path, thereby disturbing the dust attached to the surface of the component or in the surrounding space.

[0101] In one feasible embodiment, after identifying a component area with abnormal temperature or requiring dust removal, the control system first obtains the spatial coordinates of the component area on the mounting backplate and, combined with the installation position of the intake fan at the bottom of the JP cabinet, calculates the relative orientation of the component area with respect to the intake fan. Based on this relative orientation, the control system sets the reverse dust removal direction of the intake fan to: blowing air along a path opposite to the normal air intake direction towards the component area.

[0102] Step S402: Control the intake fan to work in reverse and operate at the first power in the opposite dust removal direction.

[0103] After acquiring the initial power, the intake fan's air inlet is deflected in the opposite dust removal direction. The intake fan's air inlet is a universal joint, which can be driven by a motor to change its direction.

[0104] The first power refers to the operating power set for the intake fan during the reverse dust removal operation. It can be adjusted according to actual needs and is used to disturb the dust on the surface of electronic components and in the surrounding space.

[0105] Step S403: Obtain air turbidity information in the component area.

[0106] Air turbidity information refers to parameters used to characterize the concentration of suspended particulate matter in the air, reflecting the level of pollutants such as dust and particles in the air. Air turbidity information can be obtained by detecting the intensity of light scattering or the degree of light transmission attenuation caused by suspended particles in the air.

[0107] The air turbidity information of the component area refers to the concentration parameter of suspended particulate matter obtained in the spatial range corresponding to the target component area, which is used to characterize the change in the degree of dust suspension in the air after reverse airflow disturbance.

[0108] Step S404: Based on the air turbidity information, determine whether the air turbidity in the component area is greater than the preset dust removal judgment threshold.

[0109] The preset dust removal judgment threshold is a preset constant, which can be adjusted according to the actual situation.

[0110] The preset dust removal threshold is a reference threshold for air turbidity used to determine whether dust removal is required in the component area. When the air turbidity corresponding to the air turbidity information is greater than the preset dust removal threshold, it indicates that there is a lot of dust in the component area, and this dust may affect the heat dissipation of electronic components, causing the electronic components to operate at temperatures higher than the preset operating temperature. Therefore, dust removal is required for the electronic components in the corresponding component area.

[0111] Step S405: If yes, control the intake fan to operate at the preset dust removal power.

[0112] On the other hand, if the air turbidity in the component area is not greater than the preset dust removal threshold, no operation will be performed.

[0113] The preset dust removal power is a preset constant, which controls the intake fan to work at this power to blow dust off the surface of electrical components for subsequent vacuuming operations.

[0114] Step S406: After a preset dust removal time, control the intake fan to work in the forward direction and operate at a preset dust suction power.

[0115] The preset dust removal time is a preset constant that can be adjusted according to the actual situation. The purpose of step S405 is to blow the dust on the surface of the electronic components into the air inside the cabinet. In this step, after the preset dust removal time, a lot of dust on the surface has been blown into the air inside the cabinet. Then, the intake fan is controlled to work in the forward direction at the preset dust suction power, thereby sucking the dust suspended in the air inside the cabinet into the cabinet interlayer, and then transporting it to the outside of the cabinet along the cabinet interlayer.

[0116] Step S407: Control the exhaust fan to operate at the second power, so that some of the disturbed dust enters the cabinet interlayer through the target grille vent, wherein the second power is greater than the preset dust collection power.

[0117] The purpose of setting the second power to be greater than the preset dust collection power is that when the exhaust fan operates at the second power and the intake fan operates at the preset dust removal power, a low-pressure zone can be formed in the cabinet interlayer, thereby improving the dust collection ability of suspended dust in the air inside the cabinet. On the other hand, after the low-pressure zone is formed in the cabinet interlayer, dust can enter the cabinet interlayer from the target grille vent, thereby improving the dust removal ability of dust in the air inside the cabinet and near the component area.

[0118] Step S408: Repeat the above five steps until the air turbidity is less than the preset dust removal threshold.

[0119] Repeat steps S402, S403, S404, S405, S406 and S407 to remove dust from the electronic components corresponding to the component area. When the air turbidity is less than the preset dust removal judgment threshold, it means that the dust on the electronic components corresponding to the component area has been basically removed.

[0120] This application provides a heat dissipation method through a grille vent, referring to... Figure 7 The method includes: Step S501: Determine whether the target high-temperature region still exists based on the first temperature distribution.

[0121] The method for determining whether the target high-temperature area exists can be found in step S303. The purpose of determining whether the target high-temperature area still exists in the first temperature distribution analysis is to verify whether dust removal of the electronic components corresponding to the component area effectively improves the heat dissipation of those components. If the target high-temperature area does not exist, it indicates that the high temperature phenomenon of the electronic components corresponding to the component area is due to dust covering the components, thus affecting heat dissipation. On the other hand, if the target high-temperature area still exists, it indicates that the high temperature of the electronic components corresponding to the component area is not caused by dust, therefore, it is necessary to strengthen the heat dissipation of the electronic components.

[0122] Step S502: If it exists, control the non-target grille vents (excluding the target grille vent) to open and close at a preset frequency.

[0123] The preset opening and closing frequency is a preset constant, which can be adjusted according to the actual situation.

[0124] Specifically, since the target grille vent corresponds to the target high-temperature area, it is kept constantly open to ensure effective heat dissipation. For the non-target grille vents (excluding the target vent), they are opened and closed at a preset frequency. Keeping the non-target grille vents fully open can cause airflow to be split among multiple vents, weakening the airflow intensity at the target grille vent and reducing heat dissipation efficiency.

[0125] Step S503: When the non-target grille vent is closed, control the exhaust fan to work in reverse.

[0126] When the non-target grille vent is closed and the target grille vent is open, the exhaust fan is reversed and the intake fan is forward-facing, so that the air detected in the cabinet is output from the target grille vent and blown towards the electronic components opposite the target grille vent to dissipate heat from those components.

[0127] Step S504: With the non-target grille vent open, control the exhaust fan to operate in the forward direction.

[0128] When non-target grille vents open and close periodically according to a preset frequency, if the exhaust fan is still running in reverse during the open period, it can easily affect the heat dissipation of the cabinet. Therefore, when the non-target grille vents are open, the exhaust fan should be controlled to operate in the forward direction, so that the air in the interlayer can be discharged in a timely manner along the predetermined exhaust path, thereby forming a stable airflow channel during the opening of the non-target grille vents.

[0129] This application provides a liquid cooling heat dissipation method, referring to... Figure 8 The method includes: Step S601: During the operation of the intake fan and the exhaust fan, periodically acquire the first temperature rise rate of the inner cabinet and the second temperature rise rate of the outer cabinet.

[0130] The first temperature rise change rate refers to the ratio of the change in the internal cabinet temperature within a preset sampling period to the corresponding time interval, which is used to characterize the dynamic trend of heat accumulation in the internal cabinet.

[0131] The second temperature rise change rate refers to the ratio of the change in cabinet temperature within a preset sampling period to the corresponding time interval, which is used to characterize the dynamic trend of heat accumulation in the outer cabinet.

[0132] Periodic acquisition refers to repeatedly collecting the temperature of the inner cabinet and the outer cabinet at preset time intervals, and calculating the corresponding temperature rise rate based on the continuous acquisition results.

[0133] The first rate of temperature rise of the inner cabinet is calculated based on the two adjacent temperature values ​​of the inner cabinet; the second rate of temperature rise of the outer cabinet is calculated based on the two adjacent temperature values ​​of the outer cabinet.

[0134] Step S602: Compare and analyze the first and second temperature rise rates to obtain the dominant temperature transfer direction.

[0135] The temperature-dominant transfer direction refers to the direction in which the rate of temperature change is primarily dominated by the heat change during the current operating cycle. It is used to characterize the heat transfer trend between the inner and outer cabinets.

[0136] In one feasible implementation, within the same sampling period, a first temperature rise rate of change and a second temperature rise rate of change are compared. When the first temperature rise rate of change is greater than the second temperature rise rate of change, it is determined that the current heat change is dominated by the inner cabinet side, and the dominant temperature transmission direction is from the inner cabinet side to the outer cabinet side; when the second temperature rise rate of change is greater than the first temperature rise rate of change, it is determined that the current heat change is dominated by the outer cabinet side, and the dominant temperature transmission direction is from the outer cabinet side to the inner cabinet side.

[0137] In another feasible implementation, the stability of the temperature-dominant transmission direction can be determined by combining the comparison results within multiple consecutive sampling periods, so as to avoid misjudgment of direction due to short-term fluctuations.

[0138] Step S603: Determine the target side of the liquid-cooled radiator based on the direction of heat transfer.

[0139] The target contact side refers to the object on which the liquid-cooled radiator is placed relative to the inner wall of the cabinet interlayer in order to improve heat exchange efficiency under the current dominant temperature transfer direction. It is used to indicate the cabinet side that the liquid-cooled pipes preferentially contact or approach.

[0140] After determining the dominant heat transfer direction, the target side for the liquid-cooled radiator is selected based on this direction. By associating the heat transfer direction with the cabinet structure, the liquid-cooled radiator is preferentially placed against the side with more significant heat changes, thereby improving the heat exchange coupling between the liquid cooling pipes and the high-heat side of the cabinet without changing the fan's operating state.

[0141] In one feasible implementation, when it is determined that the dominant temperature transfer direction is from the inner cabinet side to the outer cabinet side, the target contact side of the liquid cooling radiator is determined to be the inner cabinet side, so that the liquid cooling pipes preferentially contact the inner cabinet to enhance the heat absorption capacity inside the cabinet.

[0142] In another feasible implementation, while determining the dominant transmission direction of temperature, a direction confidence parameter can be introduced to limit the switching conditions of the contact side. However, this confidence parameter is only used to assist in the judgment and does not affect the basic determination rules of the contact side.

[0143] Step S604: Control the liquid cooling radiator to move within the cabinet interlayer according to the target contact side, so that the liquid cooling pipe of the liquid cooling radiator is in contact with the target cabinet side.

[0144] Controlling the movement of the liquid-cooled radiator within the cabinet interlayer refers to adjusting the position of the liquid-cooled pipes of the radiator within the cabinet interlayer based on a predetermined target contact side, so that it transitions from its current state to the target contact state.

[0145] In one feasible implementation, the liquid-cooled radiator is positioned via a drive mechanism disposed within the cabinet's interlayer. This drive mechanism can be an electric actuator, a lead screw assembly, or other equivalent linear drive structure, used to control the movement of the liquid-cooled radiator along the width of the interlayer.

[0146] When the target side is the inner cabinet side, the control drive mechanism outputs driving force towards the inner cabinet, causing the liquid cooling radiator to move towards the inner cabinet side until the liquid cooling pipe is in contact with the inner cabinet side wall; when the target side is the outer cabinet side, the control drive mechanism outputs driving force towards the outer cabinet side, causing the liquid cooling radiator to move towards the outer cabinet side until the liquid cooling pipe is in contact with the outer cabinet side wall.

[0147] This application provides a method for switching contact sides, referring to... Figure 9 The method includes: Step S701: Update the dominant temperature transmission direction based on the real-time changes of the first and second temperature rise rates to obtain the predicted active transmission direction.

[0148] Predicting the direction of active heat transfer refers to inferring the direction of heat transfer that is more likely to dominate in the subsequent time period based on the trend of the rate of change of temperature rise. It is used to characterize the leading trend of heat change, rather than the current instantaneous result.

[0149] In one feasible implementation, the control system records the change curves of a first temperature rise rate and a second temperature rise rate over multiple consecutive sampling periods. When the first temperature rise rate shows a continuous upward trend, and its increase gradually approaches or exceeds the second temperature rise rate, the dominant temperature transmission direction is updated to the predicted active transmission direction from the inner cabinet side to the outer cabinet side. When the second temperature rise rate shows a continuous upward trend, and its increase gradually approaches or exceeds the first temperature rise rate, the dominant temperature transmission direction is updated to the predicted active transmission direction from the outer cabinet side to the inner cabinet side.

[0150] In another feasible implementation, the changing trends of the first temperature rise rate and the second temperature rise rate can be weighted to reduce the impact of short-term fluctuations on the prediction results and make the predicted active transmission direction more stable.

[0151] Step S702: Determine whether the contact side corresponding to the predicted active transmission direction is consistent with the target contact side of the current liquid cooler.

[0152] The side to which the liquid-cooled radiator should be attached, as determined by the predicted active transmission direction and the preset direction-cabinet side mapping relationship, refers to the side of the cabinet to which the liquid-cooled radiator should be attached.

[0153] The target contact side of the liquid cooler refers to the liquid cooler contact side that has been determined and is being executed in the previous control cycle based on the dominant temperature transmission direction.

[0154] In one feasible implementation, the corresponding predicted contact side is determined based on the predicted active transmission direction. This predicted contact side is then compared with the target contact side of the current liquid cooler. If the predicted contact side is consistent with the current target contact side, it is determined that the current contact strategy still conforms to the future heat transfer trend, and the liquid cooling radiator maintains the current target contact side unchanged. If the predicted contact side is inconsistent with the current target contact side, it is determined that the current contact strategy may no longer be suitable for the subsequent heat transfer trend, and the process will proceed to the subsequent continuity determination process.

[0155] In one feasible embodiment, the consistency judgment is only used for state identification and does not directly trigger the movement of the liquid cooler or the switching of the contact side.

[0156] Step S703: If not, record the duration of the predicted active transmission direction.

[0157] On the other hand, if the predicted active transmission direction corresponds to the contact side that is the same as the target contact side of the current liquid cooler, no operation is performed.

[0158] When the result of step S702 is inconsistent, the control system starts a timer corresponding to the predicted active transmission direction. Within each sampling period, if the predicted active transmission direction remains unchanged and is still inconsistent with the side of the current target, the time length corresponding to that sampling period is added to the duration of the predicted active transmission direction.

[0159] If the predicted active transmission direction changes during subsequent sampling periods, or if the predicted active transmission direction re-aligns with the current target side, then the recorded value for that duration is cleared or reset.

[0160] Step S704: Determine whether the duration of the predicted active transmission direction is greater than the preset direction stabilization determination duration.

[0161] The preset directional stability determination time is a preset constant, which can be adjusted according to the actual situation.

[0162] If the duration is greater than the preset directional stabilization determination duration, it indicates that the predicted active transmission direction has entered the stable transmission stage, and the current contact side needs to be switched.

[0163] Step S705: If yes, then control the liquid cooling radiator to switch from the current target contact side to the other cabinet side corresponding to the predicted active transmission direction.

[0164] On the other hand, if the predicted duration of the active transmission direction is not greater than the preset directional stability determination duration, no operation is performed.

[0165] In one feasible embodiment, when the determination condition in step S704 is met, the control module sends a switching command to the drive component of the liquid cooler. First, it controls the liquid cooler to release the fixed state from the current target side, then moves the liquid cooler to another cabinet side, and controls the liquid cooling pipe to re-attach to the inner wall surface of that cabinet side, thereby completing the switching of the liquid cooler's side.

[0166] Step S706: When the difference between the first temperature rise rate and the second temperature rise rate is less than the preset directional failure threshold, it is determined that there is no clear temperature-dominant transmission direction at present.

[0167] The preset failure threshold is a preset constant that can be adjusted according to actual needs.

[0168] In one feasible embodiment, during real-time control, after determining the predicted active transmission direction, the control module synchronously calculates the difference between the first and second temperature rise rates and compares this difference with a preset direction failure threshold. When the difference is less than the threshold, even if the predicted active transmission direction changes, the side-to-side switching action is not triggered; instead, the system enters a state of no clear direction. For example, when the JP cabinet is operating at a low to medium load, the temperatures of both the inner and outer cabinets tend to stabilize, and the values ​​of the first and second temperature rise rates are close, with their difference consistently below the preset direction failure threshold. At this time, the system determines that the current heat is evenly distributed between the inner and outer cabinet sides, and there is no clear temperature-dominated transmission direction.

[0169] Step S707: In the absence of a clear dominant temperature transfer direction, control the liquid cooling radiator to detach from the cabinet and move it to the middle position of the cabinet interlayer to enter a non-directional heat dissipation state.

[0170] In one feasible embodiment, when the difference between the first rate of temperature change and the second rate of temperature change remains less than a preset directional failure threshold, the control module outputs a non-directional heat dissipation command. In response to this command, the drive mechanism controls the liquid-cooled radiator to move along the cabinet interlayer, causing the liquid cooling pipe to gradually move away from the currently attached cabinet side and eventually stop at the middle position of the cabinet interlayer. At this position, the liquid cooling pipe absorbs heat from the air in the cabinet interlayer, avoiding localized heat accumulation caused by incorrect attachment.

[0171] Based on the same inventive concept, embodiments of this application provide a double-layer hollow JP cabinet heat dissipation system, including: The acquisition module is used to acquire the cabinet temperature; A memory for storing the program of the above-mentioned double-layer hollow JP cabinet heat dissipation method; The processor and the program in the memory can be loaded and executed by the processor to implement the above-mentioned heat dissipation method of the double-layer hollow JP cabinet.

[0172] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0173] This application provides a computer-readable storage medium storing a computer program that can be loaded by a processor and executed as a heat dissipation method for a double-layer hollow JP cabinet.

[0174] Computer storage media include, for example, USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, optical disks, and other media that can store program code.

[0175] Based on the same inventive concept, embodiments of this application provide a smart terminal, including a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed as a heat dissipation method for a double-layer hollow JP cabinet.

[0176] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0177] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Any feature disclosed in this specification (including the abstract and drawings) may be replaced by other equivalent or similar features unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is only one example of a series of equivalent or similar features.

Claims

1. A heat dissipation method for a double-layer hollow JP cabinet, characterized in that, include: The cabinet temperature of the JP cabinet is acquired in real time, including the external cabinet temperature and the internal cabinet temperature. When the temperature of the inner cabinet reaches the first temperature threshold but is less than the second temperature threshold, the air inside the cabinet is transported to the cabinet interlayer by the air intake fan located at the bottom of the JP cabinet. The cabinet interlayer refers to the gap layer formed between the inner cabinet and the outer cabinet, and a liquid cooling radiator is installed in the cabinet interlayer. The exhaust fan located in the top mezzanine is activated simultaneously to deliver the airflow in the cabinet mezzanine to the outside air; When the temperature inside the cabinet reaches the second temperature threshold, the liquid cooling radiator is activated to cool the airflow in the cabinet's internal compartment.

2. The heat dissipation method for a double-layer hollow JP cabinet according to claim 1, characterized in that, The side panel in the JP cabinet used for fixing electronic components is defined as the mounting back panel. The mounting back panel array has several grille vents, and an air intake gap is formed between the electronic components and the grille vents. The method also includes: Obtain the temperature difference between the outer cabinet temperature and the inner cabinet temperature; Determine if the temperature difference is greater than the preset high temperature difference value; If so, the first target wind speed of the intake fan and the second target wind speed of the exhaust fan are determined based on the temperature difference, wherein the first target wind speed is less than the second target wind speed. Adjust the intake fan according to the first target wind speed, and adjust the exhaust fan according to the second target wind speed, so that some of the air in the JP cabinet enters the cabinet interlayer through the air intake gap.

3. The heat dissipation method for a double-layer hollow JP cabinet according to claim 2, characterized in that, The cabinet interlayer is provided with several partition strips at intervals and a contraction device for changing the gap between adjacent partition strips in certain areas, forming a conveying channel for air transport between adjacent partition strips; the method further includes: Obtain the first temperature distribution of the mounting backplane and the second temperature distribution of the electronic components; Determine whether there are component areas with temperatures higher than the preset operating temperature based on the second temperature distribution. If so, then determine whether there is a target high-temperature region corresponding to the component area based on the first temperature distribution; If it exists, then obtain the target grille vent and local conveying channel area corresponding to the target high temperature area; The shrinkage device controls the shrinkage of the local partition area, thereby shrinking the local conveying channel area. If the temperature difference is greater than the preset high temperature difference, increase the target air speed of the exhaust fan and increase the power of the liquid cooler. When the temperature difference is less than the preset low temperature difference, increase the target wind speed of the intake fan and decrease the target wind speed of the exhaust fan. If not, the electrical components will be cooled according to the preset heat dissipation method.

4. The heat dissipation method for a double-layer hollow JP cabinet according to claim 3, characterized in that, The method of dissipating heat from electrical components according to a preset heat dissipation method includes: Determine the reverse dust removal direction of the intake fan based on the component area; Control the intake fan to work in reverse and in the opposite dust removal direction at the first power; Obtain air turbidity information in the component area; Based on the air turbidity information, determine whether the air turbidity in the component area is greater than the preset dust removal threshold. If so, control the intake fan to operate at the preset dust removal power; After a preset dust removal time, the intake fan is controlled to work in the forward direction and at a preset dust suction power. The exhaust fan is controlled to operate at the second power, so that some of the disturbed dust enters the cabinet interlayer through the target grille vent. The second power is greater than the preset dust collection power. Repeat the above five steps until the air turbidity is less than the preset dust removal threshold.

5. The heat dissipation method for a double-layer hollow JP cabinet according to claim 4, characterized in that, The method further includes: Determine whether the target high-temperature region still exists based on the first temperature distribution; If present, control the non-target grille vents (excluding the target grille vent) to open and close at a preset frequency. When the non-target grille vent is closed, control the exhaust fan to work in reverse. When the non-target grille vent is open, control the exhaust fan to operate in the forward direction.

6. The heat dissipation method for a double-layer hollow JP cabinet according to claim 1, characterized in that, The method further includes: During the operation of the intake fan and exhaust fan, the first temperature rise rate of the inner cabinet and the second temperature rise rate of the outer cabinet are periodically acquired. By comparing and analyzing the first and second rates of temperature change, the dominant direction of temperature transfer is obtained. Determine the target side of the liquid-cooled radiator based on the direction of heat transfer. The liquid-cooled radiator is moved within the cabinet interlayer according to the target side, so that the liquid cooling pipes of the liquid-cooled radiator are in contact with the target cabinet side.

7. The heat dissipation method for a double-layer hollow JP cabinet according to claim 6, characterized in that, The method further includes: The predicted active transmission direction is obtained by updating the temperature-dominant transmission direction based on the real-time changes of the first and second temperature rise rates. Determine whether the contact side corresponding to the predicted active transmission direction is consistent with the target contact side of the current liquid cooler. If not, record the duration of the predicted active transmission direction; Determine whether the duration of the predicted active transmission direction is greater than the preset direction stabilization determination duration; If so, the liquid cooling radiator is switched from the current target contact side to the other cabinet side corresponding to the predicted active transmission direction; When the difference between the first temperature rise rate and the second temperature rise rate is less than the preset directional failure threshold, it is determined that there is no clear temperature-dominant transmission direction at present. In the absence of a clear dominant temperature transfer direction, the liquid-cooled radiator is controlled to detach from the cabinet and move to the middle position of the cabinet interlayer to enter a non-directional heat dissipation state.

8. A double-layer hollow JP cabinet heat dissipation system, characterized in that, The system is used to perform the heat dissipation method for a double-layer hollow JP cabinet as described in any one of claims 1 to 7, including: The acquisition module is used to acquire the cabinet temperature; A memory for storing the program of the heat dissipation method for the double-layer hollow JP cabinet; The processor and the program in the memory can be loaded and executed by the processor to implement the heat dissipation method of the double-layer hollow JP cabinet.

9. A smart terminal, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer program is stored that can be loaded by a processor and execute the method as described in any one of claims 1 to 7.

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