DIP through hole reflow soldering device and method for electric appliance box double-sided pin circuit board

Through innovative design of the reversing device and transmission components, the problems of clamping damage and loosening during circuit board flipping are solved, achieving stable and fast circuit board flipping and adapting to circuit boards of different sizes.

CN121842989APending Publication Date: 2026-04-10JIANGSU BOVO AUTOMOTIVE ELECTRONICS SYST CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-17
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

In the existing technology, the chuck is prone to damage when holding smaller circuit boards, and the circuit board may loosen or fall out during the flipping process, making it difficult to adapt to circuit boards of different sizes.

Method used

Employing a reversing device and a conveying assembly, the circuit board is clamped and held by the mutual squeezing of the mounting plate and the conveying assembly. Combined with dual-axis motor drive and synchronous belt transmission, the circuit board can be stably flipped and moved, adapting to circuit boards of different sizes.

Benefits of technology

It enables rapid and stable flipping of circuit boards, adapts to circuit boards of different sizes, avoids clamping damage and loosening, and improves the reliability of the flipping process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a DIP through hole reflow soldering device and method for a double-sided pin circuit board of an electric appliance box, and relates to the technical field of reflow soldering, the DIP through hole reflow soldering device comprises a shell of a soldering machine, a reversing device is installed in the middle of the shell, and circuit board conveying devices are installed on the two sides of the reversing device respectively; conveyor belts are installed on the two sides of the inner wall of the shell respectively, a plurality of sets of first manipulators used for grabbing DIP elements and a plurality of sets of second manipulators used for smearing solder paste are installed on the top of the shell, and a heater and a cooler are installed in the shell. By clamping the two sides of the circuit board, the circuit board can be quickly overturned, and meanwhile, the overturning stability of the clamping line is guaranteed.
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Description

Technical Field

[0001] This invention relates to the technical field of reflow soldering, and more particularly to a reflow soldering apparatus and method for DIP through-hole circuit boards of electrical boxes with double-sided pins. Background Technology

[0002] Through-hole reflow soldering is an advanced hybrid technology for electronic assembly. It involves pre-applying solder paste into through-holes on a PCB, inserting the leads of conventional through-hole components, and finally feeding them together with surface-mount components into a reflow oven for overall heating. Once the solder paste melts, it vertically fills the entire through-hole using capillary action, forming a three-dimensional solder joint that penetrates the board thickness after cooling.

[0003] Patent CN119142780B proposes a double-sided processing equipment and method for circuit boards with a 180-degree automatic flipping mechanism. The equipment includes a base, a height switching mechanism, a conveying mechanism, and an automatic flipping mechanism disposed on the base. The automatic flipping mechanism is disposed on the substrate and rises and falls synchronously with the substrate. It includes two guide rails disposed along the conveying direction of the conveying line, a sliding component located on the guide rails, a drive motor and a transmission mechanism for driving the sliding component to move, and at least two grippers. During the process of driving the sliding component to move, the drive motor simultaneously drives the grippers to flip 180 degrees.

[0004] This patent uses claws to flip the circuit board, so the clamping area of ​​the claws on the circuit board is small. Therefore, when clamping a large circuit board, it is easy to damage the circuit board. Therefore, this flipping method is suitable for smaller circuit boards. At the same time, since the claws clamp the circuit board through grooves, the groove openings are large, which can cause the circuit board to loosen during the flipping process. Therefore, if the flipping speed is too fast, the circuit board may be thrown out. Summary of the Invention

[0005] The purpose of this invention is to provide a DIP through-hole reflow soldering device and method for electrical box double-sided pin circuit boards in order to solve the above-mentioned problems.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a housing of a welding machine, a reversing device installed in the middle of the housing, circuit board conveying devices installed on both sides of the reversing device, conveyor belts installed on both sides of the inner wall of the housing, multiple sets of first robotic arms for gripping DIP components and second robotic arms for applying solder paste installed on the top of the housing, and a heater and a cooler installed inside the housing.

[0007] The reversing device includes a rotating shaft rotatably connected to the outer casing. One end of the rotating shaft is connected to the output shaft of a first motor. The first motor has a self-locking function. First gears are fixedly installed at both ends of the outer wall of the rotating shaft. Mounting discs are meshed at the lower ends of the two first gears. The outer wall of the mounting discs has tooth grooves that cooperate with the first gears. Lifting components are installed on both sides of the lower end of the mounting discs. Two sets of conveying components are installed between the two mounting discs. Driving components for driving the conveying components are installed on both sides and the lower end of the outer casing.

[0008] In practical applications, when flipping is required, the first motor starts, drives the rotating shaft to rotate, the rotating shaft drives the first gear to rotate, and the first gear drives the mounting plate to rotate. The mounting plate clamps the circuit board by the mutual squeezing of the two sets of transmission components. Thus, the mounting plate drives the clamped circuit board to flip through the two sets of transmission components. By clamping the circuit board on both sides, the circuit board can be quickly flipped, while ensuring the stability of the clamping wire during flipping.

[0009] Furthermore, the drive assembly includes a dual-axis motor, with two output shafts of the dual-axis motor respectively connected to rotating shafts. The rotating shafts are rotatably connected to the side wall inside the housing. A first pulley is fixedly installed at the end of the rotating shaft. A second pulley is connected to the first pulley via a first synchronous belt. A main shaft is fixedly installed at the position of the central axis of the second pulley. The main shaft is rotatably connected to the side wall inside the housing. A first sprocket is fixedly installed at the end of the main shaft near the mounting plate. A second sprocket is fixedly installed at one end of the transmission assembly via a fixing rod. The second sprockets are interconnected by a first chain. The central axis of the main shaft is offset from the central axis of the mounting plate, and the main shaft does not contact the mounting plate. The first sprocket meshes with one of the first chains.

[0010] In practical applications, when it is necessary to move the circuit board between two sets of conveying components, the two output shafts of the dual-axis motor drive the two rotating shafts to rotate respectively. The rotating shafts drive the first pulley to rotate, the first pulley drives the second pulley to rotate through the first synchronous belt, the second pulley drives the first sprocket to rotate through the main shaft, the first sprocket drives one of the first chains to rotate, and the first chain drives the conveying components to rotate, thereby moving the circuit board.

[0011] Furthermore, the conveying assembly includes a fixed rod and an outer cylinder. The fixed rod passes through the mounting plate and is rotatably connected to it. An inner cylinder is slidably disposed on the outer wall of the fixed rod. Multiple sets of return springs are evenly disposed between the two ends of the outer wall of the inner cylinder and the fixed rod. The inner cylinder and the fixed rod are not in direct contact with the outer cylinder. A silicone pad is attached to the outer wall of the outer cylinder. The inner cylinder and the fixed rod are fixed by locking bolts.

[0012] In practical applications, multiple sets of return springs are evenly arranged between the two ends of the inner wall of the outer cylinder and the fixing rod. When the outer cylinder clamps the circuit board, the circuit board can push the outer cylinder outward. Therefore, it can ensure the clamping force of the outer cylinder on the circuit board, and at the same time, it can adapt to circuit boards of different thicknesses. In addition, silicone pads are attached to the outer wall of the outer cylinder, which increases the friction between the outer cylinder and the circuit board.

[0013] Furthermore, the lifting assembly includes a rotating rod rotatably connected to both sides of the housing, and two sets of second gears are fixedly provided on the outer wall of the rotating rod for use with the mounting plate, wherein the tooth grooves do not penetrate the two end faces of the mounting plate;

[0014] In practical applications, since the tooth groove does not penetrate through both ends of the mounting plate, the teeth of the second gear are always inside the tooth groove, thus preventing the mounting plate from shifting during rotation.

[0015] Furthermore, the conveying device includes a threaded rod rotatably connected to the housing. One end of the threaded rod passes through the housing and is equipped with a handwheel. The outer wall of the threaded rod has two sets of threaded ends with opposite directions of rotation. The outer walls of the two sets of threaded ends are respectively threaded with mounting boxes. The outer wall of the mounting box is rotatably equipped with multiple sets of rotating wheels, which can also be driven by a synchronous motor. All rotating wheels on the same side are connected by the same second synchronous belt. A drive rod is slidably arranged in the middle of a set of rotating wheels on both sides. One end of the drive rod is connected to the output shaft of a third motor. The drive rod passes through the mounting box and is rotatably connected to the housing.

[0016] In practical applications, when the circuit board needs to be moved, the output shaft of the third motor drives the drive rod to rotate, the drive rod drives two of the rotating wheels to rotate, and the two rotating wheels drive two second synchronous belts to rotate, thereby driving the circuit board to move through the second synchronous belts;

[0017] Meanwhile, since a threaded rod is threadedly connected to the lower end of the mounting box, when the threaded rod is rotated synchronously, the threaded rod drives the two mounting boxes to move closer or further apart, so that the distance between the conveying devices can be adjusted according to the width of the circuit board.

[0018] After the conveying device is adjusted, the staff needs to open the side door of the outer shell, then push the outer cylinder to expose the locking bolt, and then use a tool to rotate the locking bolt, so that the inner cylinder slides along the fixed rod until it moves to the appropriate position. Then, by using a tool to rotate the locking bolt, the inner cylinder and the fixed rod are locked.

[0019] Furthermore, a method for reflow soldering DIP through-holes in a double-sided pin circuit board for an electrical box includes the following steps:

[0020] Step 1, Apply solder paste to surface A: Apply solder paste to all through holes on surface A that need to be soldered;

[0021] The second step is the mounting of components on side A and the insertion of DIP components: using a robotic arm, DIP components such as connectors and pins on side A are inserted into the through holes that have been coated with solder paste. At the same time, all surface mount components on side A are precisely placed on the solder paste using high melting point solder paste.

[0022] The third step is high-temperature heating: adjust the temperature according to the characteristics of the solder paste;

[0023] Step 4, Circuit Board Flipping: Use a flipping device to flip the circuit board.

[0024] Step 5, Apply solder paste to side B: Apply solder paste to all through holes on side B that need to be soldered;

[0025] Step 6, B-side component mounting and DIP component insertion: Using a robotic arm, DIP components such as connectors and pins on the B-side are inserted into the through holes that have been coated with solder paste. At the same time, all surface mount components on the A-side are precisely placed onto the solder paste using low melting point solder paste.

[0026] Step 7, high-temperature heating: Adjust the temperature according to the characteristics of the solder paste.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] When flipping is required, the first motor starts, drives the shaft to rotate, the shaft drives the first gear to rotate, the first gear drives the mounting plate to rotate, and the mounting plate clamps the circuit board by the mutual squeezing of the two sets of transmission components. Thus, the mounting plate flips the clamped circuit board by the two sets of transmission components. By clamping the circuit board on both sides, the circuit board can be flipped quickly, while ensuring the stability of the clamping wire during flipping.

[0029] Because a threaded rod is threaded to the lower end of the mounting box, when the threaded rod is rotated synchronously, the threaded rod causes the two mounting boxes to move closer or further apart, thereby adjusting the distance between the conveying devices according to the width of the circuit board. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall appearance of the present invention;

[0031] Figure 2 This is a schematic diagram of the overall interior of the outer shell proposed in this invention;

[0032] Figure 3 This is a schematic diagram showing the distribution of the conveying device and the reversing device proposed in this invention;

[0033] Figure 4 This is a schematic diagram of the driving component structure proposed in this invention;

[0034] Figure 5 This is a schematic diagram of the transmission component structure proposed in this invention;

[0035] Figure 6 This is a schematic diagram of the connection between the first chain and the first sprocket proposed in this invention;

[0036] Figure 7 This is a schematic diagram of the transmission device proposed in this invention.

[0037] In the diagram: 1. Outer shell; 2. Conveying device; 201. Mounting box; 202. Rotary wheel; 203. Second synchronous belt; 204. Threaded rod; 205. Drive rod; 3. Conveyor belt; 4. Second robotic arm; 5. First robotic arm; 6. Reversing device; 601. Rotating shaft; 602. First motor; 603. First gear; 604. Mounting plate; 6041. Gear groove; 605. Conveying assembly; 6051. Fixed rod; 6052. Return spring; 6053. Outer cylinder; 6054. Silicone pad; 6055. Inner cylinder; 606. Lifting assembly; 8. Drive assembly; 801. Dual-axis motor; 802. Rotating shaft; 803. First pulley; 804. First synchronous belt; 805. Second pulley; 806. Main shaft; 807. First sprocket; 808. First chain; 809. Second sprocket; 9. Heater; 10. Cooler. Detailed Implementation

[0038] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0039] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0040] Reference Figure 1-7 A reflow soldering apparatus and method for DIP through-hole circuit boards of an electrical box includes a housing 1 of a soldering machine, a reversing device 6 installed in the middle of the housing 1, circuit board conveying devices 2 installed on both sides of the reversing device 6, conveyor belts 3 installed on both sides of the inner wall of the housing 1, multiple sets of first robotic arms 5 for gripping DIP components and second robotic arms 4 for applying solder paste installed on the top of the housing 1, and a heater 9 and a cooler 10 installed inside the housing 1.

[0041] The reversing device 6 includes a rotating shaft 601 rotatably connected to the housing 1. One end of the rotating shaft 601 is connected to the output shaft of the first motor 602. The first motor 602 has a self-locking function. The two ends of the outer wall of the rotating shaft 601 are respectively fixedly provided with first gears 603. The lower ends of the two first gears 603 are meshed with mounting plates 604. The outer wall of the mounting plates 604 is provided with tooth grooves 6041 that cooperate with the first gears 603. The lower ends of the mounting plates 604 are respectively provided with lifting components 606. The middle of the two mounting plates 604 is provided with two sets of conveying components 605. The sides and lower end of the housing 1 are provided with driving components 8 for driving the conveying components 605.

[0042] In practical applications, when flipping is required, the first motor 602 starts, driving the rotating shaft 601 to rotate. The rotating shaft 601 drives the first gear 603 to rotate, and the first gear 603 drives the mounting plate 604 to rotate. The mounting plate 604 clamps the circuit board by the mutual squeezing of the two sets of conveying components 605. Thus, the mounting plate 604 drives the clamped circuit board to flip through the two sets of conveying components 605. By clamping the circuit board on both sides, the circuit board can be quickly flipped, while ensuring the stability of the clamping wire during flipping.

[0043] Furthermore, the drive assembly 8 includes a dual-axis motor 801. The two output shafts of the dual-axis motor 801 are respectively connected to a rotating shaft 802. The rotating shaft 802 is rotatably connected to the side wall inside the housing 1. A first pulley 803 is fixedly installed at the end of the rotating shaft 802. The first pulley 803 is connected to a second pulley 805 through a first synchronous belt 804. A main shaft 806 is fixedly installed at the position of the central shaft of the second pulley 805. The main shaft 806 is rotatably connected to the side wall inside the housing 1. A first sprocket 807 is fixedly installed at one end of the main shaft 806 near the mounting plate 604. A second sprocket 809 is fixedly installed at one end of the transmission assembly 605 through a fixing rod 6051. The second sprockets 809 are interconnected by a first chain 808. The central shaft of the main shaft 806 is offset from the central shaft of the mounting plate 604. The main shaft 806 does not contact the mounting plate 604. The first sprocket 807 meshes with one of the first chains 808.

[0044] In practical applications, when it is necessary to move the circuit board between the two sets of conveying components 605, the two output shafts of the dual-axis motor 801 drive the two rotating shafts 802 to rotate respectively. The rotating shafts 802 drive the first pulley 803 to rotate. The first pulley 803 drives the second pulley 805 to rotate through the first synchronous belt 804. The second pulley 805 drives the first sprocket 807 to rotate through the main shaft 806. The first sprocket 807 drives one of the first chains 808 to rotate. The first chain 808 drives the conveying component 605 to rotate, thereby moving the circuit board.

[0045] Furthermore, the conveying assembly 605 includes a fixed rod 6051 and an outer cylinder 6053. The fixed rod 6051 passes through the mounting plate 604 and is rotatably connected to it. An inner cylinder 6055 is slidably disposed on the outer wall of the fixed rod 6051. Multiple sets of return springs 6052 are evenly disposed between the two ends of the outer wall of the inner cylinder 6055 and the fixed rod 6051. Neither the inner cylinder 6055 nor the fixed rod 6051 is in direct contact with the outer cylinder 6053. A silicone pad 6054 is attached to the outer wall of the outer cylinder 6053. The inner cylinder 6055 and the fixed rod 6051 are fixed together by locking bolts.

[0046] In practical applications, multiple sets of return springs 6052 are evenly arranged between the two ends of the inner wall of the outer cylinder 6053 and the fixing rod 6051. When the outer cylinder 6053 clamps the circuit board, the circuit board can push the outer cylinder 6053 outward. Therefore, it can ensure the clamping force of the outer cylinder 6053 on the circuit board, and at the same time, it can adapt to circuit boards of different thicknesses. In addition, a silicone pad 6054 is attached to the outer wall of the outer cylinder 6053, which increases the friction between the outer cylinder 6053 and the circuit board.

[0047] Furthermore, the lifting component 606 includes a rotating rod that is rotatably connected to both sides of the housing 1. The outer wall of the rotating rod is fixedly provided with two sets of second gears that cooperate with the mounting plate 604. The tooth grooves 6041 do not penetrate the two end faces of the mounting plate 604.

[0048] In practical applications, since the tooth groove 6041 does not penetrate both ends of the mounting plate 604, the teeth of the second gear are always inside the tooth groove 6041, thus preventing the mounting plate 604 from shifting during rotation.

[0049] Furthermore, the conveying device 2 includes a threaded rod 204 rotatably connected to the outer casing 1. One end of the threaded rod 204 passes through the outer casing 1 and is equipped with a handwheel. The outer wall of the threaded rod 204 has two sets of threaded ends with opposite directions. The outer walls of the two sets of threaded ends are respectively threaded to the mounting box 201. The outer wall of the mounting box 201 is rotatably equipped with multiple sets of rotating wheels 202, which can also be driven by a synchronous motor. All rotating wheels 202 on the same side are connected by the same second synchronous belt 203. A drive rod 205 is slidably arranged in the middle of a set of rotating wheels 202 on both sides. One end of the drive rod 205 is connected to the output shaft of a third motor. The drive rod 205 passes through the mounting box 201 and is rotatably connected to the outer casing 1.

[0050] In practical applications, when the circuit board needs to be moved, the output shaft of the third motor drives the drive rod 205 to rotate, the drive rod 205 drives two of the rotating wheels 202 to rotate, and the two rotating wheels 202 drive two second synchronous belts 203 to rotate, thereby driving the circuit board to move through the second synchronous belts 203.

[0051] Meanwhile, since a threaded rod 204 is threadedly connected to the lower end of the mounting box 201, when the threaded rod 204 is rotated synchronously, the threaded rod 204 drives the two mounting boxes 201 to move closer or further apart, so that the distance between the conveying devices 2 can be adjusted according to the width of the circuit board.

[0052] After the conveyor 2 is adjusted, the staff needs to open the side door of the outer shell 1, then push the outer cylinder 6053 to expose the locking bolt, and then use a tool to rotate the locking bolt, so that the inner cylinder 6055 slides along the fixing rod 6051 until it moves to the appropriate position. Then, by using a tool to rotate the locking bolt, the inner cylinder 6055 and the fixing rod 6051 are locked.

[0053] Furthermore, a method for reflow soldering DIP through-holes in a double-sided pin circuit board for an electrical box includes the following steps:

[0054] Step 1, Apply solder paste to surface A: Apply solder paste to all through holes on surface A that need to be soldered;

[0055] The second step is the mounting of components on side A and the insertion of DIP components: using a robotic arm, DIP components such as connectors and pins on side A are inserted into the through holes that have been coated with solder paste. At the same time, all surface mount components on side A are precisely placed on the solder paste using high melting point solder paste.

[0056] The third step is high-temperature heating: adjust the temperature according to the characteristics of the solder paste;

[0057] Step 4, Circuit Board Flipping: The circuit board is flipped using the flipping device 6;

[0058] Step 5, Apply solder paste to side B: Apply solder paste to all through holes on side B that need to be soldered;

[0059] Step 6, B-side component mounting and DIP component insertion: Using a robotic arm, DIP components such as connectors and pins on the B-side are inserted into the through holes that have been coated with solder paste. At the same time, all surface mount components on the A-side are precisely placed onto the solder paste using low melting point solder paste.

[0060] Step 7, high-temperature heating: Adjust the temperature according to the characteristics of the solder paste.

[0061] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A reflow soldering device for DIP through-hole circuit boards of electrical boxes, characterized in that, The assembly includes a housing (1) of a welding machine, a reversing device (6) installed in the middle of the housing (1), circuit board conveying devices (2) installed on both sides of the reversing device (6), conveyor belts (3) installed on both sides of the inner wall of the housing (1), and multiple sets of first robotic arms (5) for gripping DIP components and second robotic arms (4) for applying solder paste installed on the top of the housing (1). A heater (9) and a cooler (10) are installed inside the housing (1). The reversing device (6) includes a rotating shaft (601) rotatably connected to the outer casing (1). One end of the rotating shaft (601) is connected to the output shaft of the first motor (602). The first motor (602) has a self-locking function. The outer walls of the rotating shaft (601) are respectively fixedly provided with first gears (603). The lower ends of the two first gears (603) are meshed with mounting discs (604). The outer walls of the mounting discs (604) are provided with tooth grooves (6041) that cooperate with the first gears (603). The lower ends of the mounting discs (604) are respectively provided with lifting components (606). The middle of the two mounting discs (604) is provided with two sets of transmission components (605). The outer casing (1) is provided with driving components (8) for driving the transmission components (605).

2. The reflow soldering device for DIP through-hole circuit boards of electrical boxes according to claim 1, characterized in that, The drive assembly (8) includes a dual-axis motor (801), whose two output shafts are respectively connected to a rotating shaft (802). The rotating shaft (802) is rotatably connected to the side wall inside the housing (1). A first pulley (803) is fixedly provided at the end of the rotating shaft (802). The first pulley (803) is connected to a second pulley (805) through a first synchronous belt (804). A main shaft (806) is fixedly installed at the position of the central axis of the second pulley (805). The main shaft (806) is connected to the inside of the housing (1). The side wall is rotatably connected. A first sprocket (807) is fixedly installed at one end of the main shaft (806) near the mounting plate (604). A second sprocket (809) is fixedly installed at one end of the transmission assembly (605) through a fixing rod (6051). The second sprockets (809) are connected to each other through a first chain (808). The central axis of the main shaft (806) is offset from the central axis of the mounting plate (604). The main shaft (806) does not contact the mounting plate (604). The first sprocket (807) meshes with one of the first chains (808).

3. The reflow soldering device for DIP through-hole circuit boards of electrical boxes according to claim 2, characterized in that, The conveying assembly (605) includes a fixed rod (6051) and an outer cylinder (6053). The fixed rod (6051) passes through the mounting plate (604) and is rotatably connected to it. An inner cylinder (6055) is slidably disposed on the outer wall of the fixed rod (6051). Multiple sets of return springs (6052) are evenly disposed between the two ends of the outer wall of the inner cylinder (6055) and the fixed rod (6051). The inner cylinder (6055) and the fixed rod (6051) are not in direct contact with the outer cylinder (6053). A silicone pad (6054) is attached to the outer wall of the outer cylinder (6053). The inner cylinder (6055) and the fixed rod (6051) are fixed by locking bolts.

4. The DIP through-hole reflow soldering device for a double-sided pin circuit board of an electrical box according to claim 1, characterized in that, The lifting assembly (606) includes a rotating rod that is rotatably connected to both sides of the outer shell (1). The outer wall of the rotating rod is fixedly provided with two sets of second gears that cooperate with the mounting plate (604). The tooth groove (6041) does not penetrate the two end faces of the mounting plate (604).

5. The DIP through-hole reflow soldering device for a double-sided pin circuit board of an electrical box according to claim 1, characterized in that, The conveying device (2) includes a threaded rod (204) rotatably connected to the outer shell (1). One end of the threaded rod (204) passes through the outer shell (1) and is equipped with a handwheel. The outer wall of the threaded rod (204) has two sets of threaded ends with opposite directions. The outer walls of the two sets of threaded ends are respectively threaded to a mounting box (201). The outer wall of the mounting box (201) is rotatably equipped with multiple sets of rotating wheels (202). All rotating wheels (202) on the same side are connected by the same second synchronous belt (203). A drive rod (205) is slidably arranged in the middle of a set of rotating wheels (202) on both sides. One end of the drive rod (205) is connected to the output shaft of the third motor. The drive rod (205) passes through the mounting box (201) and is rotatably connected to the outer shell (1).

6. The reflow soldering method for DIP through-holes of a double-sided pin circuit board for an electrical box according to claim 1, characterized in that, Includes the following steps: Step 1, Apply solder paste to surface A: Apply solder paste to all through holes on surface A that need to be soldered; The second step is component mounting and DIP component insertion on side A: using a robotic arm, the DIP components on side A are inserted into the through holes that have been coated with solder paste, and at the same time, all surface mount components on side A are precisely placed on the solder paste using high melting point solder paste. The third step is high-temperature heating: adjust the temperature according to the characteristics of the solder paste; Step 4, Circuit board flipping: The circuit board is flipped using a reversing device (6); Step 5, Apply solder paste to side B: Apply solder paste to all through holes on side B that need to be soldered; Step 6, B-side component mounting and DIP component insertion: Using a robotic arm, insert the DIP components on the B-side into the through holes that have been coated with solder paste, while simultaneously precisely placing all surface mount components on the A-side onto the solder paste using low melting point solder paste. Step 7, high-temperature heating: Adjust the temperature according to the characteristics of the solder paste.

Citation Information

Patent Citations

  • Circuit board double-sided processing equipment and method with 180-degree automatic flipping mechanism

    CN119142780B