Heat dissipation structure and electronic equipment
By employing a heat dissipation structure with spaced liquid cooling plates and connecting pipes in electronic devices, the problem of insufficient heat dissipation contact area is solved, achieving more efficient heat dissipation and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN RSPOWER TECH CO LTD
- Filing Date
- 2026-01-28
- Publication Date
- 2026-04-10
AI Technical Summary
Existing heat dissipation structures cannot provide sufficient heat dissipation contact area within a limited volume, resulting in poor heat dissipation performance of electronic devices.
The system employs a first and a second liquid cooling plate that are spaced apart and arranged opposite to each other, connected by a pipe to a liquid flow channel. Heat-generating devices are placed on both sides of the liquid cooling plate to exchange heat using the cooling liquid. Combined with an anti-reverse device and a shell structure, it ensures stable heat dissipation.
The heat dissipation contact area has been increased, the thermal design layout has been optimized, the volume of the heat dissipation structure has been reduced, the heat dissipation effect has been improved, and the safe and stable operation of the equipment has been ensured.
Smart Images
Figure CN121843075A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic device. Background Technology
[0002] Currently, with the development of electronic devices, the number of heat-generating components included in these devices is increasing. These components may include transformers, inductors, and other similar devices. As these components are applied in different power environments, the heat generated per unit time is also increasing, resulting in a greater overall heat generation within the electronic device. With the increasing number of heat-generating components, heat dissipation structures often cannot provide sufficient heat dissipation contact area within the required volume. Therefore, how to increase the heat dissipation contact area of the heat dissipation structure has become a problem that needs to be considered. Summary of the Invention
[0003] This application provides a heat dissipation structure and electronic device, which can increase the heat dissipation contact area of the heat dissipation structure.
[0004] In a first aspect, a heat dissipation structure is provided, comprising a liquid-cooled plate assembly and connecting pipes. The liquid-cooled plate assembly includes a first liquid-cooled plate and a second liquid-cooled plate spaced apart and opposite to each other. Both the first and second liquid-cooled plates have liquid channels for providing a flow path for cooling liquid. The connecting pipes are connected to both the first and second liquid-cooled plates. A first heating element is disposed between the first and second liquid-cooled plates, and the first heating element is thermally connected to the first and / or second liquid-cooled plates. A second heating element is disposed on the side of the first liquid-cooled plate facing away from the second liquid-cooled plate and / or the side of the second liquid-cooled plate facing away from the first liquid-cooled plate, and the first and / or second liquid-cooled plates are thermally connected to the second heating element. The cooling liquid in the liquid channels of the first and second liquid-cooled plates exchanges heat with the first and second heating elements to remove the heat dissipated by the first and second heating elements.
[0005] In one possible implementation, the two ends of the connecting pipe are fixedly connected to the first liquid cooling plate and the second liquid cooling plate, respectively. The connecting pipe has a connecting flow channel for connecting the liquid flow channels of the first liquid cooling plate and the second liquid cooling plate.
[0006] In one possible implementation, the connecting flow channel includes a first flow channel and a second flow channel, and the liquid flow channel of the first liquid cooling plate includes a third flow channel and a fourth flow channel. The first flow channel connects the third flow channel with the liquid flow channel of the second liquid cooling plate, and the second flow channel connects the fourth flow channel with the liquid flow channel of the second liquid cooling plate. The first liquid cooling plate has an inlet and an outlet. The inlet is connected to the third flow channel, and the outlet is connected to the fourth flow channel. The third flow channel, the first flow channel, the liquid flow channel of the second liquid cooling plate, the second flow channel, and the fourth flow channel are sequentially connected between the inlet and the outlet. The inlet is for the cooling liquid to flow into, and the outlet is for the cooling liquid to flow out, such that the cooling liquid flowing in from the inlet flows sequentially through the third flow channel, the first flow channel, the liquid flow channel of the second liquid cooling plate, the second flow channel, and the fourth flow channel before flowing out from the outlet.
[0007] In one possible implementation, the heat dissipation structure further includes an anti-reverse device connected to the inlet and / or the outlet. The anti-reverse device is used to control the inlet to disconnect from the third flow channel and / or control the outlet to disconnect from the fourth flow channel when it detects that the flow direction of the cooling liquid in the inlet and / or the outlet is opposite to a preset flow direction.
[0008] In one possible implementation, the first heating device is fixedly connected to both the first liquid cooling plate and the second liquid cooling plate, such that the first heating device is fixedly disposed between the first liquid cooling plate and the second liquid cooling plate.
[0009] In one possible implementation, the heat dissipation structure further includes a housing structure connected to both the first liquid cooling plate and the second liquid cooling plate. The first heating device is disposed within the housing structure, such that it is fixedly positioned between the first and second liquid cooling plates. The housing structure has a filling port, and the heat dissipation structure also includes a thermally conductive medium having at least a fluid and a solid state. The filling port allows the fluid-state thermally conductive medium to flow into the housing structure. After the thermally conductive medium solidifies, it encapsulates the first heating device within the housing structure. The first liquid cooling plate and the second liquid cooling plate are thermally connected to the first heating device at least through the thermally conductive medium located within the housing structure.
[0010] In one possible implementation, there are multiple first heating elements, and the number of housing structures corresponds to the number of first heating elements. Specifically, the orientation of the filling port of at least one housing structure differs from the orientation of the filling ports of the other housing structures.
[0011] In one possible implementation, the heat generated by the second heating device per unit time is less than the heat generated by the first heating device per unit time.
[0012] In one possible implementation, the side of the first liquid cooling plate facing away from the second liquid cooling plate also has a first mounting portion for mounting the second heating device, and / or, the side of the second liquid cooling plate facing away from the first liquid cooling plate also has a second mounting portion for mounting the second heating device.
[0013] Secondly, an electronic device is also provided, comprising a first heating element, a second heating element, and a heat dissipation structure. The heat dissipation structure is used to dissipate heat from the first heating element and the second heating element. The heat dissipation structure includes a liquid-cooled plate assembly and connecting pipes. The liquid-cooled plate assembly includes a first liquid-cooled plate and a second liquid-cooled plate spaced apart and opposite to each other, each having a liquid flow channel for providing a flow path for cooling liquid. The connecting pipes are connected to both the first and second liquid-cooled plates. The first heating element is disposed between the first and second liquid-cooled plates, and the first heating element is thermally connected to the first and / or second liquid-cooled plates. The side of the first liquid-cooled plate facing away from the second liquid-cooled plate and / or the side of the second liquid-cooled plate facing away from the first liquid-cooled plate is used to dispose of the second heating element, and the first and / or second liquid-cooled plates are thermally connected to the second heating element. The cooling liquid in the liquid flow channels of the first and second liquid-cooled plates exchanges heat with the first and second heating elements to remove the heat dissipated by the first and second heating elements.
[0014] The heat dissipation structure and electronic device of this application, by configuring a first heat-generating device between the first liquid cooling plate and the second liquid cooling plate, and by configuring a second heat-generating device on the side of the first liquid cooling plate away from the second liquid cooling plate and / or the side of the second liquid cooling plate away from the first liquid cooling plate, can provide more heat dissipation contact area on both sides of the two spaced and oppositely arranged liquid cooling plates, optimize the thermal design layout space, and reduce the volume of the heat dissipation structure to a certain extent. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.
[0016] Figure 1 This is a schematic diagram of the heat dissipation structure in some embodiments of this application.
[0017] Figure 2 This is another schematic diagram of the heat dissipation structure in some embodiments of this application.
[0018] Figure 3 This is a schematic diagram of the anti-reverse device in some embodiments of this application.
[0019] Figure 4 This is a schematic diagram of an electronic device in some embodiments of this application.
[0020] Explanation of reference numerals in the attached drawings: 10, heat dissipation structure; 100, liquid cooling plate assembly; 110, first liquid cooling plate; 131, third flow channel; 132, fourth flow channel; 120, second liquid cooling plate; 141, fifth flow channel; 142, sixth flow channel; 111, water inlet; 112, water outlet; 200, connecting assembly; 210, first connector; 220, second connector; 300, connecting pipe; 330, connecting flow channel; 331, first flow channel; 332, second flow channel; 400, anti-reverse device; 500, shell structure; 20, first heating element; 30, second heating element; 1, electronic equipment. Detailed Implementation
[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0022] In the description of the embodiments of this application, it should be noted that the terms "inner" and "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this application and simplifying the description, and do not imply or indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0023] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0024] In the description of the embodiments of this application, it should be noted that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.
[0025] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or devices.
[0026] Please see Figure 1 , Figure 1 This is a schematic diagram of the heat dissipation structure in some embodiments of this application. For example... Figure 1 As shown, this application provides a heat dissipation structure 10, which includes a liquid cooling plate assembly 100 and a connecting pipe 300. The liquid cooling plate assembly 100 includes a first liquid cooling plate 110 and a second liquid cooling plate 120 arranged at intervals and opposite to each other. Both the first liquid cooling plate 110 and the second liquid cooling plate 120 have liquid flow channels for providing a flow path for the cooling liquid. The connecting pipe 300 is connected to both the first liquid cooling plate 110 and the second liquid cooling plate 120. The first liquid cooling plate 110 and the second liquid cooling plate 120 are used to house the first heating element 20, which is thermally connected to the first liquid cooling plate 110 and / or the second liquid cooling plate 120. The side of the first liquid cooling plate 110 away from the second liquid cooling plate 120 and / or the side of the second liquid cooling plate 120 away from the first liquid cooling plate 110 are used to house the second heating element 30, which is thermally connected to the first liquid cooling plate 110 and / or the second liquid cooling plate 120. The cooling liquid in the liquid channels of the first liquid cooling plate 110 and the second liquid cooling plate 120 exchanges heat with the first heating element 20 and the second heating element 30 to remove the heat emitted by the first heating element 20 and the second heating element 30.
[0027] Therefore, the heat dissipation structure 10 described above in this application, by configuring the first heat-generating device 20 between the first liquid cooling plate 110 and the second liquid cooling plate 120, and by configuring the second heat-generating device 30 on the side of the first liquid cooling plate 110 away from the second liquid cooling plate 120 and / or the side of the second liquid cooling plate 120 away from the first liquid cooling plate 110, can provide more heat dissipation contact area on both sides of the two spaced and oppositely arranged liquid cooling plates, optimize the thermal design layout space, and reduce the volume of the heat dissipation structure 10 to a certain extent.
[0028] Specifically, by configuring the liquid cooling plate assembly 100 to include a first liquid cooling plate 110 and a second liquid cooling plate 120 that are spaced apart and arranged opposite to each other, that is, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are stacked and arranged in parallel, the first heat-generating device 20 can be disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, which can increase the heat dissipation contact area of the first heat-generating device 20 and improve the utilization rate of heat dissipation space.
[0029] Please refer to the following: Figure 2 , Figure 2 This is another schematic diagram of the heat dissipation structure in some embodiments of this application. For example... Figure 1 , Figure 2 As shown, the two ends of the connecting pipe 300 are fixedly connected to the first liquid cooling plate 110 and the second liquid cooling plate 120, respectively. The connecting pipe 300 has a connecting flow channel 330, which is used to connect the liquid flow channels of the first liquid cooling plate 110 and the second liquid cooling plate 120.
[0030] Therefore, the heat dissipation structure 10 described above in this application, by providing connecting pipes and its connecting flow channel 330, can connect the liquid flow channels of the first liquid cooling plate 110 and the second liquid cooling plate 120, thereby forming a complete water circuit system.
[0031] like Figure 1 , Figure 2 As shown, the connecting channel 330 includes a first channel 331 and a second channel 332, and the liquid channel of the first liquid cooling plate 110 includes a third channel 131 and a fourth channel 132. The first channel 331 is used to connect the third channel 131 with the liquid channel of the second liquid cooling plate 120, and the second channel 332 is used to connect the fourth channel 132 with the liquid channel of the second liquid cooling plate 120. The first liquid cooling plate 110 has an inlet 111 and an outlet 112. The inlet 111 is connected to the third flow channel 131, and the outlet 112 is connected to the fourth flow channel 132. The third flow channel 131, the first flow channel 331, the liquid flow channel of the second liquid cooling plate 120, the second flow channel 332, and the fourth flow channel 132 are sequentially connected between the inlet 111 and the outlet 112. The inlet 111 is used for the inflow of cooling liquid, and the outlet 112 is used for the outflow of cooling liquid, so that the cooling liquid flowing in from the inlet 111 flows sequentially through the third flow channel 131, the first flow channel 331, the liquid flow channel of the second liquid cooling plate 120, the second flow channel 332, and the fourth flow channel 132, and then flows out from the outlet 112.
[0032] In some embodiments, the connecting channel 330 includes a first channel 331 and a second channel 332, the liquid channel of the first liquid cooling plate 110 includes a third channel 131 and a fourth channel 132, and the liquid channel of the second liquid cooling plate 120 includes a fifth channel 141 and a sixth channel 142. The first channel 331 is used to connect the third channel 131 and the fifth channel 141, and the second channel 332 is used to connect the fourth channel 132 and the sixth channel 142. The first liquid cooling plate 110 has a water inlet 111, and the second liquid cooling plate 120 has a water outlet 112. The water inlet 111 is connected to the third flow channel 131 and the fourth flow channel 132, and the water outlet 112 is connected to the fifth flow channel 141 and the sixth flow channel 142. The third flow channel 131, the first flow channel 131, and the fifth flow channel 141 are sequentially connected between the water inlet 111 and the water outlet 112, and the fourth flow channel 132, the second flow channel 332, and the sixth flow channel 142 are sequentially connected. A passage is formed between the inlet 111 and the outlet 112. The inlet 111 is used for the inflow of cooling liquid, and the outlet 112 is used for the outflow of cooling liquid. The cooling liquid flowing in from the inlet 111 flows through the third channel 131, the first channel 331, and the fifth channel 141 in sequence, and then flows out from the outlet 112. The cooling liquid flowing in from the inlet 111 flows through the fourth channel 132, the second channel 332, and the sixth channel 142 in sequence, and then flows out from the outlet 112.
[0033] Therefore, the heat dissipation structure 10 described above in this application, by configuring the connecting pipes and the internal flow channels of the two liquid cooling plates, can connect the independent internal flow channels of the connecting pipes and the two liquid cooling plates, reduce the number of external water inlets 111 and outlets 112, and simplify external operation.
[0034] The inlet 111 and outlet 112 are mainly connected by pipes. The internal flow channels can be directly made of aluminum extrusion channels or processed on aluminum extrusion channels. Through secondary processing of the internal water channels of the two liquid cooling plates, the internal flow channels of the two liquid cooling plates can be connected in series and parallel, making the internal flow channel design of the two liquid cooling plates more diverse.
[0035] Among them, the connecting pipe 300 is a flexible hose, that is, the connecting pipe 300 is deformable.
[0036] Please see Figure 3 , Figure 3 This is a schematic diagram of an anti-reverse device in some embodiments of this application. For example... Figure 3As shown, the heat dissipation structure 10 also includes an anti-reverse device 400, which is connected to the inlet 111 and / or the outlet 112. The anti-reverse device 400 is used to control the inlet 111 to disconnect from the third flow channel 131 and / or control the outlet 112 to disconnect from the fourth flow channel 132 when the flow direction of the cooling liquid in the inlet 111 and / or the outlet 112 is detected to be opposite to the preset flow direction.
[0037] Therefore, the heat dissipation structure 10 described above in this application, by configuring the anti-reverse device 400, enables the cooling liquid to enter the liquid flow channel normally when the cooling liquid flows into the liquid flow channel of the liquid cooling plate assembly 100. If the flow direction of the cooling liquid in the inlet 111 and / or outlet 112 is the same as the preset flow direction, the cooling liquid can enter the liquid flow channel normally. If the flow direction of the cooling liquid in the inlet 111 and / or outlet 112 is opposite to the preset flow direction, the cooling liquid cannot effectively dissipate heat from the heat-generating device with a large amount of heat generated per unit time. By controlling the disconnection of the inlet 111 from the third flow channel 131 and / or controlling the disconnection of the outlet 112 from the fourth flow channel 132, the safe and stable operation of the heat dissipation structure 10 can be ensured.
[0038] The first heating element 20 is fixedly connected to the first liquid cooling plate 110 and the second liquid cooling plate 120, so that the first heating element 20 is fixedly disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120.
[0039] Therefore, in the heat dissipation structure 10 described above in this application, the first heat-generating device 20 can be sandwiched between the first liquid cooling plate 110 and the second liquid cooling plate 120 to achieve a better heat dissipation effect.
[0040] The heat dissipation structure 10 also includes a housing structure 500, which is connected to both the first liquid cooling plate 110 and the second liquid cooling plate 120. A first heating element 20 is disposed within the housing structure 500, thus fixing the first heating element 20 between the first liquid cooling plate 110 and the second liquid cooling plate 120. The housing structure 500 has a filling port, and the heat dissipation structure 10 also includes a heat-conducting medium, which has at least a fluid form and a solid form. The filling port allows the fluid form of the heat-conducting medium to flow into the housing structure 500. After the heat-conducting medium solidifies, it encapsulates the first heating element 20 within the housing structure 500. The first liquid cooling plate 110 and the second liquid cooling plate 120 are thermally connected to the first heating element 20 at least through the heat-conducting medium located within the housing structure 500.
[0041] Therefore, the heat dissipation structure 10 described above in this application, by setting the shell structure 500, can not only fix the first heating device 20 in the corresponding position, but also conduct heat to the first heating device 20 through the encapsulated heat-conducting medium, so that the first liquid cooling plate 110 and the second liquid cooling plate 120 are thermally connected to the first heating device 20 at least through the heat-conducting medium located in the shell structure 500, which can further improve the heat dissipation effect.
[0042] The number of first heating elements 20 is multiple, and the number of housing structures 500 corresponds to the number of first heating elements 20. The orientation of the filling port of at least one housing structure 500 is different from the orientation of the filling ports of the other housing structures 500.
[0043] Therefore, the heat dissipation structure 10 described above in this application, since the liquid cooling plate assembly 100 includes two liquid cooling plates, can conduct the heat emitted by the multiple first heat-generating devices 20 to different positions of the two liquid cooling plates by configuring the orientation of the filling port of at least one housing structure 500 to be different from the orientation of the filling port of other housing structures 500, thereby further improving the heat dissipation effect.
[0044] The second heating device 30 generates less heat per unit time than the first heating device 20 generates heat per unit time.
[0045] Therefore, the heat dissipation structure 10 described above in this application can place the first heating device 20 with high heat loss between the two liquid cooling plates, increase the thermal contact area between the first heating device 20 and the liquid cooling plates, improve the heat dissipation effect, effectively control the internal temperature difference of the first heating device 20, make the internal temperature field of the first heating device 20 more uniform, reduce the heat loss of the first heating device 20 to a certain extent, improve the working efficiency of the first heating device 20, and can place the second heating device 30 with lower heat loss outside the two liquid cooling plates, making full use of the heat dissipation contact area of the two liquid cooling plates.
[0046] Furthermore, the side of the first liquid cooling plate 110 facing away from the second liquid cooling plate 120 also has a first mounting portion for mounting the second heating device 30, and / or, the side of the second liquid cooling plate 120 facing away from the first liquid cooling plate 110 also has a second mounting portion for mounting the second heating device 30.
[0047] Therefore, the heat dissipation structure 10 described above in this application can provide multiple positions for mounting the second heat-generating device 30 through the first mounting portion and / or the second mounting portion.
[0048] In some embodiments, the anti-reverse device 400 is connected to the inlet 111. The anti-reverse device 400 is used to control the inlet 111 to disconnect from the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold.
[0049] Therefore, the heat dissipation structure 10 described above in this application, by configuring the anti-reverse device 400 to connect with the water inlet 111 and controlling the water inlet 111 to disconnect from the liquid flow channel, can prevent the overheated cooling liquid in the liquid flow channel from being unable to flow out through the water outlet 112 when the cooling liquid is reversed or the flow rate of the cooling liquid is low, thereby further affecting the heat dissipation of the heat-generating device and further ensuring the safe and stable operation of the heat dissipation structure 10.
[0050] In some embodiments, the anti-reverse device 400 includes a regulating valve connected to the inlet 111. The regulating valve is used to disconnect the communication passage between the inlet 111 and the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold.
[0051] Therefore, the heat dissipation structure 10 described above in this application, by setting an adjustment valve, can not only disconnect the connection between the inlet 111 and the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, but also disconnect the connection between the inlet 111 and the liquid flow channel when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold.
[0052] The regulating valve can be a lift-type or swing-type check valve. The check valve can be equipped with springs, slow-closing devices, etc., to automatically disconnect the connection between the inlet 111 and the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction. It can also automatically adjust the flow rate of the connection between the inlet 111 and the liquid flow channel according to the flow rate of the cooling liquid in the inlet 111. Furthermore, when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold, it can automatically disconnect the connection between the inlet 111 and the liquid flow channel according to the parameter settings of the spring and slow-closing device. The regulating valve can also be a self-operated regulating valve, such as a flow control valve, which can automatically adjust the flow rate of the connection between the inlet 111 and the liquid flow channel according to the flow direction and flow rate of the cooling liquid in the inlet 111 to achieve the above functions.
[0053] In some embodiments, the anti-reverse device 400 further includes a controller and a flow meter. The flow meter is connected to the inlet 111, and the controller is connected to both the regulating valve and the flow meter. The flow meter is used to obtain the flow rate of the cooling liquid in the inlet 111. The controller is used to determine the flow direction and flow rate of the cooling liquid based on the flow rate obtained by the flow meter. When the flow direction of the cooling liquid in the inlet 111 is opposite to a preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold, the controller controls the regulating valve to disconnect, thereby breaking the connection between the inlet 111 and the liquid flow channel.
[0054] Therefore, the heat dissipation structure 10 described above in this application, by setting a controller and a flow meter, can accurately determine the flow direction and flow rate of the cooling liquid in an electronically controlled manner, and control the disconnection of the regulating valve when the preset conditions are met, thereby electronically disconnecting the connection between the water inlet 111 and the liquid flow channel.
[0055] When the anti-reverse device 400 also includes a controller, the regulating valve can be an electrically controlled shut-off valve, a pneumatic shut-off valve, or an electrically controlled ball valve.
[0056] Specifically, when the flow velocity of the cooling liquid in the inlet 111 obtained by the flow meter is negative, it is determined that the flow direction of the cooling liquid is opposite to the preset direction.
[0057] The controller can be a general-purpose processor such as a central processing unit (CPU), or a digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic devices, discrete gate logic devices, transistor logic devices, or microprocessors such as micro control units (MCUs).
[0058] The controller is also used to continuously acquire the heat generated by the first heating device 20 per unit time, and when the heat generated by the first heating device 20 per unit time is less than the preset heat, control the flow meter to acquire the flow rate of the cooling liquid in the inlet 111.
[0059] Therefore, the heat dissipation structure 10 described above in this application controls the flow meter to obtain the flow rate of the cooling liquid in the inlet 111 to be greater than a preset threshold when the operating power is low, and can determine the state of the cooling liquid before the power is increased, so as to ensure the safe and stable operation of the product.
[0060] Specifically, by continuously acquiring the heat generated by the first heating device 20 per unit time, the controller can determine the operating power of the first heating device 20. When the heat generated by the first heating device 20 per unit time is less than the preset heat, it can be determined that the operating power of the first heating device 20 is low. At this time, the controller can control and adjust the flow rate of the cooling liquid in the inlet 111 to obtain the flow rate of the flow meter, which makes it less likely to damage the heating device.
[0061] Furthermore, the controller can continuously obtain the power value of the first heating device 20 to continuously determine the heat generated by the first heating device 20 per unit time.
[0062] The controller can also issue a fault signal when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold, so as to remind that the cooling liquid is reversed or the flow rate of the cooling liquid is too low.
[0063] The controller can also be used to control the first heating device 20 to stop working when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold.
[0064] Furthermore, the controller can be connected to the first heating device 20 to continuously acquire the heat generated by the first heating device 20 per unit time and control the first heating device 20 to stop working.
[0065] The number of first heating elements 20 is multiple, and the number of housing structures 500 corresponds to the number of first heating elements 20. The orientation of the filling port of at least one housing structure 500 is different from the orientation of the filling ports of the other housing structures 500.
[0066] Therefore, the heat dissipation structure 10 described above in this application, since the liquid cooling plate assembly 100 includes two liquid cooling plates, can conduct the heat emitted by the multiple first heat-generating devices 20 to different positions of the two liquid cooling plates by configuring the orientation of the filling port of at least one housing structure 500 to be different from the orientation of the filling port of other housing structures 500, thereby further improving the heat dissipation effect.
[0067] Furthermore, there are two first heating elements 20, and the number of housing structures 500 corresponds to the number of first heating elements 20. One housing structure 500 has its filling port facing the first liquid cooling plate 110, and the other housing structure 500 has its filling port facing the second liquid cooling plate 120.
[0068] Furthermore, the number of first heating devices 20 is greater than two, except for the housing structure 500 whose potting opening faces the first liquid cooling plate 110 or the second liquid cooling plate 120, the potting openings of the other housing structures 500 face the width direction of the first liquid cooling plate 110 and the second liquid cooling plate 120.
[0069] In some embodiments, the heat dissipation structure 10 further includes a connecting component 200, which is used to fix the first liquid cooling plate 110 and the second liquid cooling plate 120 to a corresponding connection configuration. When the first heating device 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, or when the first heating device 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120, the first liquid cooling plate 110 and / or the second liquid cooling plate 120 are thermally conductively connected to the first heating device 20. The cooling liquid in the liquid channels of the first liquid cooling plate 110 and / or the second liquid cooling plate 120 exchanges heat with the first heating device 20 to remove the heat dissipated by the first heating device 20.
[0070] When the first heating element 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, the first liquid cooling plate 110 and / or the second liquid cooling plate 120 can be thermally connected to the first heating element 20. The cooling liquid in the liquid channels of the first liquid cooling plate 110 and / or the second liquid cooling plate 120 exchanges heat with the first heating element 20 to remove the heat emitted by the first heating element 20. When the first heating element 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120, the first liquid cooling plate 110 and / or the second liquid cooling plate 120 can be thermally connected to the first heating element 20. The cooling liquid in the liquid channels of the first liquid cooling plate 110 and / or the second liquid cooling plate 120 exchanges heat with the first heating element 20 to remove the heat emitted by the first heating element 20.
[0071] The cooling liquid can be water or other cooling liquids, and this application is not limited to this.
[0072] The first liquid cooling plate 110 and the second liquid cooling plate 120 can be processed by aluminum extrusion molding, and the water channel is integrally formed, which is more convenient and simpler than other water channel processing methods.
[0073] In some embodiments, the heat dissipation structure 10 has a first heat dissipation mode and a second heat dissipation mode, and the connection configuration of the first liquid cooling plate 110 and the second liquid cooling plate 120 includes a first connection configuration and a second connection configuration. Specifically, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the first connection configuration, the heat dissipation structure 10 is in the first heat dissipation mode; when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the second connection configuration, the heat dissipation structure 10 is in the second heat dissipation mode.
[0074] Therefore, the heat dissipation structure 10 described above in this application can provide different connection forms of the liquid cooling plate assembly 100 for different heat dissipation modes, thereby providing a larger heat dissipation area under the volume constraints of the electronic device 1, so as to achieve a better heat dissipation effect for the heat-generating device.
[0075] In some embodiments, the first liquid cooling plate 110 has a first connecting portion and a second connecting portion, and the second liquid cooling plate 120 has a third connecting portion and a fourth connecting portion. When the connecting assembly 200 is connected to the first connecting portion and the third connecting portion, the connecting assembly 200 fixes the first liquid cooling plate 110 and the second liquid cooling plate 120 in a first connection state, and the first heating element 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120. When the connecting assembly 200 is connected to the second connecting portion and the fourth connecting portion, the connecting assembly 200 fixes the first liquid cooling plate 110 and the second liquid cooling plate 120 in a second connection state, and the first heating element 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120.
[0076] Therefore, in the above-mentioned heat dissipation structure 10 of this application, when the connecting component 200 is connected to different connecting parts, the liquid cooling plate assembly 100 is in the corresponding connection mode.
[0077] In some embodiments, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in a first connection configuration, the first liquid cooling plate 110 and the second liquid cooling plate 120 are spaced apart and disposed opposite to each other, such that the first heating device 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120. When the first liquid cooling plate 110 and the second liquid cooling plate 120 are in a second connection configuration, the first liquid cooling plate 110 and the second liquid cooling plate 120 are adjacent and disposed parallel to each other, such that the first heating device 20 is disposed on one side of the first liquid cooling plate 110 or on one side of the second liquid cooling plate 120.
[0078] Therefore, in the heat dissipation structure 10 described in this application, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are spaced apart and arranged opposite each other, that is, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are stacked and arranged in parallel, the first heating device 20 can be disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, which can increase the heat dissipation contact area of the first heating device 20 and improve the utilization rate of heat dissipation space. When the first liquid cooling plate 110 and the second liquid cooling plate 120 are adjacent and arranged in parallel, that is, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are arranged side by side and in parallel, the first heating device 20 can be disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120, which can provide better heat dissipation function according to the type of the first heating device 20, for example when the volume of the first heating device 20 is large.
[0079] When the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the first connection state, the second heating device 30 may also be disposed on the side of the first liquid cooling plate 110 away from the second liquid cooling plate 120, and / or on the side of the second liquid cooling plate 120 away from the first liquid cooling plate 110.
[0080] When the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the second connection state, the first heating device 20 can also be disposed on one side of the first liquid cooling plate 110 and one side of the second liquid cooling plate 120. The first heating device 20 can also be disposed on the other side of the first liquid cooling plate 110 or the other side of the second liquid cooling plate 120.
[0081] Therefore, the heat dissipation structure 10 described above in this application allows for the placement of heat-generating devices on both sides of the two liquid cooling plates, greatly increasing the placement area of the first heat-generating device 20.
[0082] In some embodiments, the connecting assembly 200 includes a first connector 210 and a second connector 220. The first connecting portion has a first connection port and a second connection port, the second connecting portion has a third connection port and a fourth connection port, the third connecting portion has a fifth connection port and a sixth connection port, and the fourth connecting portion has a seventh connection port and an eighth connection port. When the first connector 210 is connected to all four connection ports (first, second, fifth, and sixth), the first liquid cooling plate 110 and the second liquid cooling plate 120 are in a first connection state; when the connector is connected to all four connection ports (third, fourth, seventh, and eighth), the first liquid cooling plate 110 and the second liquid cooling plate 120 are in a second connection state.
[0083] Therefore, the heat dissipation structure 10 described above in this application can better fix the connection form of the liquid cooling plate assembly 100 through two connectors, resulting in better structural stability.
[0084] Among them, the first to eighth connection ports can be threaded connection ports, and the first connector 210 and the second connector 220 can be threadedly connected to the corresponding connection ports through threaded fasteners.
[0085] In some embodiments, the heat generated by the heating device per unit time can be the heat loss of the heating device. That is, the unit time can be selected according to specific needs to obtain the heat loss of the heating device.
[0086] In some embodiments, the anti-reverse device 400 may be disposed between the liquid flow channel of the first liquid cooling plate 110 and the water inlet 111 to block the connection between the water inlet 111 and the liquid flow channel of the first liquid cooling plate 110 in a timely manner.
[0087] The housing structure 500 includes a connected outer shell and a side plate assembly. The outer shell is a cylindrical structure with openings at both ends. The side plate assembly is used to cover the two openings of the cylindrical structure. The outer shell and the side plate assembly are used to cooperate to form a receiving space to accommodate the first heating device 20. The outer shell has a filling port on its side peripheral wall.
[0088] Therefore, the heat dissipation structure 10 described above in this application forms a six-sided enclosure space through the outer shell and side plate assembly. There is only one enclosure space, which can be formed by only the outer shell and side plate assembly. Moreover, the enclosure space can be used for potting heat dissipation, which simplifies the structural design and can effectively save costs.
[0089] Furthermore, the space can be used to house multiple magnetic cores, which can be arranged side by side.
[0090] The portion of the outer casing with a filling port on its side wall is fixedly connected to the liquid cooling plate assembly 100, so that the liquid cooling plate assembly 100 and the heat transfer medium can come into contact and exchange heat through the filling port.
[0091] Therefore, the heat dissipation structure 10 described above in this application enables the liquid cooling plate assembly 100 to contact and exchange heat with the heat-conducting medium inside the housing structure 500 through the potting opening.
[0092] In some embodiments, the volume of the housing structure 500 is smaller than the volume of the receiving cavity, and the space outside the housing structure 500 within the receiving cavity is filled with a heat-conducting medium, and the heat-conducting medium outside the housing structure 500 and the heat-conducting medium inside the housing structure 500 are thermally connected through a potting port.
[0093] The shell structure 500 can be made of thermally conductive material, so that the first liquid cooling plate 110 and the second liquid cooling plate 120 can also be thermally connected to the first heating device 20 through the shell structure 500.
[0094] Furthermore, the first heating element 20 is a transformer, which includes a magnetic core and a first winding sleeved on the magnetic core. There are two potting openings, with each end of the first winding extending out of the outer casing through one of the two potting openings.
[0095] Therefore, the heat dissipation structure 10 described above in this application can also be used for the lead wires at both ends of the first winding to connect with other circuit structures.
[0096] Specifically, by using two filling ports for filling, the internal heat-conducting medium can be made more uniform, and the gaps between the magnetic core and the outer shell, and between the magnetic core and the core tube, can be completely covered and filled by the heat-conducting medium to improve the heat dissipation effect.
[0097] The magnetic core has a ring-shaped cross-section. The side plate assembly includes two side sealing plates, each of which includes a connected side shell and a core tube. Each side shell is used to cover one of the openings of the cylindrical structure, and when the two side shells cover the two openings of the cylindrical structure, the two core tubes extend into the magnetic core in an alternating manner.
[0098] Therefore, the heat dissipation structure 10 described above in this application can cover the two openings of the cylindrical structure by configuring the side shell, and can serve as the second winding of the first heating device 20 by configuring the two core tubes to extend into the magnetic core in an alternating manner.
[0099] The first winding can be the primary winding, and the second winding can be the secondary winding.
[0100] Furthermore, each side shell has a through-hole, each through-hole corresponding to the core tube of the other side shell, and each through-hole is used for the core tube of the other side shell to extend out.
[0101] Therefore, the heat dissipation structure 10 described above in this application can be configured with a through-hole so that the two core tubes extending from the through-hole can be connected to other circuit structures.
[0102] Furthermore, the housing structure 500 also includes two sealing elements, each of which is used to seal the gap between the corresponding through-hole and the core tube.
[0103] Therefore, the heat dissipation structure 10 described above in this application can block the gap between the corresponding through-hole and the core tube by configuring a sealing component, thereby preventing the heat transfer medium from flowing out of the through-hole.
[0104] In some embodiments, the thermally conductive medium can be potting compound or other media, as long as it can achieve the corresponding function.
[0105] In some embodiments, the housing can serve as the center tap of the transformer.
[0106] Furthermore, the outer shell can be manufactured using aluminum extrusion technology, and the side walls of the outer shell can be cut according to the number of internal magnetic cores to obtain the required length of side walls, resulting in high compatibility.
[0107] Furthermore, there are multiple first heating elements 20, and the number of housing structures 500 corresponds to the number of first heating elements 20. The orientation of the filling port of at least one housing structure 500 differs from the orientation of the filling ports of the other housing structures 500.
[0108] Therefore, the heat dissipation structure 10 described above in this application, since the liquid cooling plate assembly 100 includes two liquid cooling plates, can conduct the heat emitted by the multiple first heat-generating devices 20 to different positions of the two liquid cooling plates by configuring the orientation of the filling port of at least one housing structure 500 to be different from the orientation of the filling port of other housing structures 500, thereby further improving the heat dissipation effect.
[0109] Furthermore, there are two first heating elements 20, and the number of housing structures 500 corresponds to the number of first heating elements 20. One housing structure 500 has its filling port facing the first liquid cooling plate 110, and the other housing structure 500 has its filling port facing the second liquid cooling plate 120.
[0110] Furthermore, the number of first heating devices 20 is greater than two, except for the housing structure 500 whose potting opening faces the first liquid cooling plate 110 or the second liquid cooling plate 120, the potting openings of the other housing structures 500 face the width direction of the first liquid cooling plate 110 and the second liquid cooling plate 120.
[0111] The heat dissipation structure 10 of this application, through the above structure, can provide more heat dissipation contact area on both sides of the two liquid cooling plates that are spaced apart and opposite to each other, optimize the thermal design layout space, and reduce the volume of the heat dissipation structure 10 to a certain extent.
[0112] Please see Figure 4 , Figure 4 This is a schematic diagram of an electronic device in some embodiments of this application. For example... Figure 4 As shown, this application also provides an electronic device 1, which includes a first heating element 20, a second heating element 30, and a heat dissipation structure 10 as described in any of the foregoing embodiments. The heat dissipation structure 10 is used to dissipate heat from the first heating element 20 and the second heating element 30.
[0113] Please refer to it again. Figure 1 .like Figure 1As shown, the heat dissipation structure 10 includes a liquid cooling plate assembly 100 and a connecting pipe 300. The liquid cooling plate assembly 100 includes a first liquid cooling plate 110 and a second liquid cooling plate 120 arranged at intervals and opposite to each other. Both the first liquid cooling plate 110 and the second liquid cooling plate 120 have liquid flow channels, which provide a flow path for the cooling liquid. The connecting pipe 300 is connected to both the first liquid cooling plate 110 and the second liquid cooling plate 120. The first liquid cooling plate 110 and the second liquid cooling plate 120 are used to house the first heating element 20, which is thermally connected to the first liquid cooling plate 110 and / or the second liquid cooling plate 120. The side of the first liquid cooling plate 110 away from the second liquid cooling plate 120 and / or the side of the second liquid cooling plate 120 away from the first liquid cooling plate 110 are used to house the second heating element 30, which is thermally connected to the first liquid cooling plate 110 and / or the second liquid cooling plate 120. The cooling liquid in the liquid channels of the first liquid cooling plate 110 and the second liquid cooling plate 120 exchanges heat with the first heating element 20 and the second heating element 30 to remove the heat emitted by the first heating element 20 and the second heating element 30.
[0114] For a more specific description of the heat dissipation structure 10, please refer to the relevant content of the heat dissipation structure 10 in any of the foregoing embodiments, which will not be repeated here.
[0115] In some embodiments, the first heating device 20 can be an electronic device such as a transformer or an inductor, and the second heating device 30 can be an electronic device such as a resistor, a transistor, or a diode.
[0116] In some embodiments, electronic device 1 may be a medium frequency power supply device, a radio frequency power supply device, or other power supply devices, such as a DC power supply device, an AC power supply device, etc.
[0117] The heat dissipation structure 10 and electronic device 1 of this application, through the above structure, can provide more heat dissipation contact area on both sides of the two liquid cooling plates that are spaced apart and opposite to each other, optimize the thermal design layout space, and reduce the volume of the heat dissipation structure 10 to a certain extent.
[0118] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A heat dissipation structure, characterized in that, include: A liquid cooling plate assembly includes a first liquid cooling plate and a second liquid cooling plate that are spaced apart and arranged opposite to each other. Both the first liquid cooling plate and the second liquid cooling plate have liquid flow channels, which are used to provide a flow path for cooling liquid. The connecting pipe is connected to both the first liquid cooling plate and the second liquid cooling plate; Wherein, a first heating element is disposed between the first liquid cooling plate and the second liquid cooling plate, and the first heating element is thermally connected to the first liquid cooling plate and / or the second liquid cooling plate; a second heating element is disposed on the side of the first liquid cooling plate away from the second liquid cooling plate and / or the side of the second liquid cooling plate away from the first liquid cooling plate, and the first liquid cooling plate and / or the second liquid cooling plate are thermally connected to the second heating element; the cooling liquid in the liquid flow channel of the first liquid cooling plate and the second liquid cooling plate exchanges heat with the first heating element and the second heating element to remove the heat emitted by the first heating element and the second heating element.
2. The heat dissipation structure according to claim 1, characterized in that, The two ends of the connecting pipe are respectively fixedly connected to the first liquid cooling plate and the second liquid cooling plate; The connecting pipe has a connecting flow channel, which is used to connect the liquid flow channels of the first liquid cooling plate and the second liquid cooling plate.
3. The heat dissipation structure according to claim 2, characterized in that, The connecting flow channel includes a first flow channel and a second flow channel. The liquid flow channel of the first liquid cooling plate includes a third flow channel and a fourth flow channel. The first flow channel is used to connect the third flow channel with the liquid flow channel of the second liquid cooling plate. The second flow channel is used to connect the fourth flow channel with the liquid flow channel of the second liquid cooling plate. The first liquid cooling plate has an inlet and an outlet. The inlet is connected to the third flow channel, and the outlet is connected to the fourth flow channel. The third flow channel, the first flow channel, the liquid flow channel of the second liquid cooling plate, the second flow channel, and the fourth flow channel are sequentially connected between the inlet and the outlet. The inlet is used for the cooling liquid to flow in, and the outlet is used for the cooling liquid to flow out, so that the cooling liquid flowing in from the inlet flows sequentially through the third flow channel, the first flow channel, the liquid flow channel of the second liquid cooling plate, the second flow channel, and the fourth flow channel before flowing out from the outlet.
4. The heat dissipation structure according to claim 3, characterized in that, The heat dissipation structure also includes an anti-reverse device, which is connected to the water inlet and / or the water outlet. The anti-reverse device is used to control the water inlet to disconnect from the third flow channel and / or control the water outlet to disconnect from the fourth flow channel when it detects that the flow direction of the cooling liquid in the water inlet and / or the water outlet is opposite to the preset flow direction.
5. The heat dissipation structure according to claim 1, characterized in that, The first heating element is fixedly connected to both the first liquid cooling plate and the second liquid cooling plate, such that the first heating element is fixedly disposed between the first liquid cooling plate and the second liquid cooling plate.
6. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure also includes a shell structure, which is connected to both the first liquid cooling plate and the second liquid cooling plate. The first heat-generating device is disposed in the shell structure, such that the first heat-generating device is fixedly disposed between the first liquid cooling plate and the second liquid cooling plate. The shell structure has a filling port, and the heat dissipation structure further includes a heat-conducting medium. The heat-conducting medium has at least a fluid form and a solid form. The filling port is used to allow the fluid form of the heat-conducting medium to flow into the shell structure. After the heat-conducting medium solidifies, it fills the first heating device into the shell structure. The first liquid cooling plate and the second liquid cooling plate are thermally connected to the first heating device at least through the heat-conducting medium located within the shell structure.
7. The heat dissipation structure according to claim 6, characterized in that, There are multiple first heating elements, and the number of housing structures corresponds to the number of first heating elements; In this case, the orientation of the filling port of at least one shell structure is different from the orientation of the filling ports of the other shell structures.
8. The heat dissipation structure according to claim 1, characterized in that, The heat generated by the second heating device per unit time is less than the heat generated by the first heating device per unit time.
9. The heat dissipation structure according to claim 1, characterized in that, The first liquid cooling plate has a first mounting portion on the side facing away from the second liquid cooling plate, the first mounting portion being used to mount the second heating device, and / or, the second liquid cooling plate has a second mounting portion on the side facing away from the first liquid cooling plate, the second mounting portion being used to mount the second heating device.
10. An electronic device, characterized in that, include: First heating element; Second heating element; The heat dissipation structure as described in any one of claims 1-9 is used to dissipate heat from the first heat-generating device and the second heat-generating device.