Laser welding device with adjustable welding position and welding method comprising laser welding device

Abstract

The invention relates to a laser welding device with an adjustable welding position and a method thereof. Comprises: a control unit; a fixing block coupled to the circuit board and having a plurality of fixing pins extending in one direction and a plurality of fixing holes into which the fixing pins are inserted; the image module is combined with the circuit substrate through the fixing block; a fixing block which is provided for fixing the image module on a substrate and in which a plurality of fixing holes into which fixing pins of the image module are inserted are formed; a solder part which is movably operated under the control of the control part, is used for welding a fixing hole part into which the fixing pin is inserted for a plurality of times at a preset time interval, is used for performing welding through a laser beam, and is provided with at least more than one nozzle part for accommodating a solder ball irradiated by the laser beam; the monitoring part is arranged on one side of the solder part and used for monitoring the distribution range of the solder balls input through irradiation of the laser beams; wherein the feeding position of the solder ball fed into the fixing pin and the fixing hole part by the solder part is adjusted according to the monitoring result of the monitoring part.

Description

Technical Field

[0001] The present invention relates to a laser welding apparatus with adjustable welding position and a welding method therein, and more specifically, to a laser welding apparatus with adjustable welding position provided by means of multiple welding processes, and a welding method therein. Background Technology

[0002] In recent years, the miniaturization and thinning of electronic devices have progressed rapidly. Furthermore, there is a demand for miniaturization and thinning of electronic components such as semiconductor devices assembled in these electronic devices. Simultaneously, as electronic components become increasingly dense, the number of connection terminals continues to increase.

[0003] As an electronic component assembly method that meets the above requirements, in recent years, methods such as flip chip mounting have been adopted, which use solder balls as external connection terminals on assembly substrates such as printed circuit boards for surface mounting. This mounting method involves mounting solder balls on electrodes provided on the electronic component substrate and then directly bonding the solder balls to the electrodes of the assembly substrate.

[0004] Therefore, when using a surface mount method with solder balls, the solder balls are typically positioned on electrodes provided on the electronic component substrate for mounting solder balls, and then heated and melted to bond them to the electrodes.

[0005] In recent years, to achieve high-precision and high-quality welding, a method has been adopted that uses a laser beam to heat and melt the weld ball by irradiating its surface. However, external impacts or vibrations may cause safety accidents such as damage to the joint.

[0006] [Existing Technical Documents] [Patent Documents] (Patent Document 0001) Korean Patent Publication No. 2013-0064392 (Patent Document 0002) Korean Patent Publication No. 2015-0028511 Summary of the Invention Technical issues The technical problem to be solved by the present invention is to provide a laser welding device with adjustable welding position and a welding method therein, in order to weld and fix the image module onto the circuit board, to enable the welding process by repeatedly adding solder to the welding position in a specific manner, so as to prevent the welding part from breaking under external impact and significantly improve the bonding reliability.

[0007] In addition, the present invention provides a laser welding apparatus with adjustable welding position and a welding method including the same, which improves the rigidity of the welding part and prevents the device from being damaged due to laser beam reflection by welding and fixing the image module to the circuit board and adjusting the welding relative to the welding position at a predetermined angle.

[0008] Solution to the problem To address the aforementioned technical problems, the laser welding apparatus with adjustable welding position according to the present invention includes: Control Department; A fixing block, which is combined with a circuit board and has a plurality of fixing pins extending in one direction and a plurality of fixing holes for inserting the fixing pins; The imaging module is connected to the circuit board via the fixing block; The laser generator, which produces the laser beam; A solder section, movable under the control of the control section, is used to perform multiple soldering operations on the fixing hole where the fixing pin is inserted at predetermined time intervals, and is provided with at least one nozzle section for receiving solder and ejecting molten solder; and A monitoring unit, which is arranged on one side of the solder section, is used to monitor the distribution range of the solder that has been injected by irradiation with the laser beam; The soldering position is adjusted based on the monitoring results of the monitoring unit, thereby allowing the soldering position to be adjusted.

[0009] In one embodiment of the present invention, the solder, It includes solder balls, which are melted and ejected by irradiating the solder balls with the laser beam.

[0010] In one embodiment of the present invention, the nozzle portion is configured as a sleeve heated by a laser, and the solder can be melted by the heat generated by the sleeve heated by the laser.

[0011] In one embodiment of the present invention, the solder ball may be a structure that is injected into the fixing pin and fixing hole at a predetermined time interval of at least 3 to 7 times.

[0012] In one embodiment of the present invention, the welding ball may be a structure in which welding is performed from the position where the outer peripheral surface of the fixing pin contacts or is closest to the inner peripheral surface of the fixing hole.

[0013] In one embodiment of the present invention, the solder section may include a structure that is inclined at a predetermined angle relative to the fixing pin and the fixing hole and ejects the solder ball.

[0014] In one embodiment of the present invention, the laser beam can be controlled to continuously irradiate the solder ball for a predetermined time after the solder ball has melted and been ejected.

[0015] In one embodiment of the present invention, the fixing holes of the fixing block may include three structures arranged radially at the same angle with respect to the center point of the fixing block.

[0016] In one embodiment of the present invention, one side of the solder section may include a structure having a gas supply section for providing inert gas to the ejected solder balls.

[0017] In one embodiment of the present invention, the welding balls supplied to the nozzle may include a structure in which the size of the welding balls is adjusted by the control unit according to the detected distribution range of the welding balls during the welding process.

[0018] In one embodiment of the present invention, a beam adjustment unit for adjusting the position of the laser beam illumination may be further included, the beam adjustment unit including: A beam focusing section for adjusting the focal position of the laser beam; and A laser irradiation unit for acquiring the irradiation position and alignment status information of the laser beam after it has been adjusted by the beam focusing unit, and for irradiating the laser beam onto the workpiece.

[0019] In one embodiment of the present invention, the solder section may further include at least one beam conversion device for adjusting the output area of ​​the laser beam.

[0020] In one embodiment of the present invention, the laser beam emitted by the solder section is a laser beam containing multiple wavelengths, each wavelength of which can be transmitted to a different or the same type of workpiece to perform bonding.

[0021] In one embodiment of the present invention, the transmission of the laser may include optical fiber laser transmission to the head via an optical fiber.

[0022] In one embodiment of the present invention, the core of the optical fiber may include a structure formed in a circular or polygonal shape, thereby enabling the laser irradiation position to be aligned.

[0023] In one embodiment of the present invention, the fixing block may be pre-joined and conveyed by a conveying unit, thereby enabling the laser irradiation position to be aligned with the solder ejection position.

[0024] In one embodiment of the present invention, the solder unit may further include a camera unit for image processing of the workpiece, i.e., the soldering position and the solder distribution range.

[0025] In one embodiment of the present invention, the laser can be a structure that outputs light in a flat-top form, thereby enabling the laser irradiation position to be aligned.

[0026] Furthermore, the laser welding apparatus with adjustable welding position according to the present invention includes: Control Department; The imaging module is integrated with the circuit board; The first fixing block is formed on one side of the image module and extends in a lateral direction, and is provided with multiple fixing pins; The second fixing block is provided for fixing the image module to the substrate and is in contact with the first fixing block surface of the image module and has a plurality of insertion holes for the fixing pin to be inserted. The laser generator produces a laser beam; A solder section, movable under the control of the control section, is used to perform multiple soldering operations on the insertion hole where the fixing pin is inserted at predetermined time intervals, and is provided with at least one nozzle section for receiving solder and ejecting molten solder; and A monitoring unit, which is arranged on one side of the solder section, is used to monitor the distribution range of the solder balls being injected by irradiation with the laser beam; The placement position of the solder ball, which is inserted from the solder section into the fixing pin and fixing hole, is adjusted according to the monitoring results of the monitoring section.

[0027] Furthermore, the laser welding apparatus with adjustable welding position according to the present invention includes: Control Department; The imaging module is combined with a circuit board having an insertion hole and is provided with a plurality of retaining pins extending to one side to be inserted into the insertion hole; The laser generator produces a laser beam; A solder section, movable under the control of the control section, is used to perform multiple soldering operations on the insertion hole where the fixing pin is inserted at predetermined time intervals, and is provided with at least one nozzle section for receiving solder and ejecting molten solder; and A monitoring unit, which is arranged on one side of the solder section, is used to monitor the distribution range of the solder balls being injected by irradiation with the laser beam; The placement position of the solder ball, which is inserted from the solder section into the fixing pin and fixing hole, is adjusted according to the monitoring results of the monitoring section.

[0028] On the other hand, the present invention also provides a welding method using the above-mentioned laser welding apparatus with adjustable welding position, comprising: The steps for arranging the image module that carries the circuit board; The fixing step involves placing the fixing pin of the image module into the insertion hole of the fixing block; The monitoring steps include identifying the x, y, and z coordinates of the center point of the fixing pin and monitoring the position of the center point of the fixing pin within the insertion hole; The alignment adjustment step is performed on the nozzle of the solder section that provides the solder balls based on the monitoring results; In order to perform multiple welding operations on the insertion hole where the fixing pin is inserted, the welding balls are continuously or intermittently supplied to the nozzle at predetermined time intervals; and The ejection step involves irradiating the solder ball with a laser beam to melt it and then ejecting the solder ball into the fixing pin and insertion hole.

[0029] In one embodiment of the present invention, during the solder ball ejection step, the laser beam can be maintained to continuously irradiate for a predetermined time after the solder ball is ejected.

[0030] In one embodiment of the present invention, the solder ball ejection step may include: The first welding process involves placing the welding ball into the position where the outer peripheral surface of the fixing pin contacts or is closest to the inner peripheral surface of the fixing hole. A second welding process that is initiated in a configuration that at least partially overlaps with the first welding location; and The welding process involves spraying the welding ball onto at least a portion of the overlapping area in at least one third welding operation.

[0031] In one embodiment of the present invention, after the second welding process, a process of adjusting the solder portion at a predetermined angle based on the Xθ, Yθ, and Zθ coordinates of the three-dimensional shape of the overlapping portion may be included.

[0032] In one embodiment of the present invention, the step of supplying the welding balls to the nozzle may further include a step of selectively adjusting and setting the size of the supplied welding balls based on the welding ball distribution range detected during the welding process.

[0033] In one embodiment of the present invention, during the second and third welding processes, the overlapping portion may include a post-heating process that is maintained for a preset time during the laser beam irradiation process.

[0034] In one embodiment of the present invention, the step of supplying the welding ball to the nozzle can be performed in the range of at least 2 to 7 times.

[0035] In one embodiment of the present invention, after the solder ball ejection step, a process may be included in which the solder portion is arranged at a predetermined angle (θ) relative to the fixing pin and the fixing hole and the Xθ, Yθ, Zθ coordinates of the center point of the fixing pin are identified.

[0036] In one embodiment of the present invention, during the step of supplying the solder ball to the nozzle section, an inert gas discharged from a gas supply section formed on one side of the solder section is provided to the ejected solder ball.

[0037] In one embodiment of the present invention, the process of providing the inert gas can be linked to the laser beam irradiation process used to melt the solder ball, and can be carried out simultaneously or alternately.

[0038] In one embodiment of the present invention, the post-heating process may include a correction alignment step of remelting the solder and setting offsets in the x-axis, y-axis, z-axis, x-axis Theta direction, y-axis Theta direction, and z-axis Theta direction according to the shrinkage of the solder, thereby compensating for the alignment between the circuit board and the image module.

[0039] Specific details of other embodiments are included in the detailed description and accompanying drawings.

[0040] Invention Effects According to the present invention, a laser welding apparatus with adjustable welding position and a welding method including the same, by repeatedly inserting welding balls into the welding position in a specific manner to enable the welding process, thereby preventing damage to the welding part and significantly improving the bonding reliability even under external impact when welding and fixing the image module onto the circuit board.

[0041] According to the present invention, a laser welding apparatus with adjustable welding position and a welding method therein, by welding and fixing an image module onto a circuit board and enabling the welding to be adjusted relative to the welding position at a predetermined angle, can improve the rigidity of the welding part and prevent damage to the apparatus due to laser beam reflection.

[0042] The effects of the present invention are not limited to those described above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims. Attached Figure Description

[0043] Figure 1 A schematic structural diagram of a laser welding apparatus with adjustable welding position according to an embodiment of the present invention is shown.

[0044] Figure 2 This is a schematic diagram illustrating the welding configuration of a laser welding apparatus according to an embodiment of the present invention.

[0045] Figure 3 and Figure 4 This is a schematic diagram illustrating the adjustment of the welding processing position according to an embodiment of the present invention.

[0046] Figure 5 and Figure 6 This is a schematic diagram illustrating the welding state of a laser welding apparatus according to an embodiment of the present invention.

[0047] Figures 7 to 9 A flowchart illustrating the welding process of a laser welding apparatus according to an embodiment of the present invention.

[0048] Figure 10 This is a schematic diagram illustrating the preheating and heating states performed by laser according to an embodiment of the present invention.

[0049] Figure 11 This is a schematic diagram illustrating the structure of an optical fiber used for transmitting laser light according to an embodiment of the present invention. Detailed Implementation

[0050] The following is a detailed description of an embodiment of the present invention with reference to the accompanying drawings. When assigning reference numerals to the constituent elements of the drawings, care should be taken to assign the same numerals to the same constituent elements, even if they are shown in different drawings. Furthermore, in describing embodiments of the present invention, detailed descriptions of related well-known structural diagrams are omitted if it is believed that a detailed explanation of their functions would hinder the understanding of the embodiments of the present invention.

[0051] When describing the constituent elements of embodiments of the present invention, terms such as 1, 2, A, B, (a), and (b) may be used. These terms are only used to distinguish the constituent element from other constituent elements and do not limit the nature, order, or sequence of the constituent elements. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms defined in general dictionaries should also be interpreted as having the same meaning as in the relevant technical context, and should not be interpreted as having an ideal or overly formal meaning unless expressly specified herein.

[0052] According to embodiments of the present invention, a welding apparatus and method with adjustable welding position can perform laser processing processes such as bonding, welding, and soldering on an image module on a circuit board. The laser welding apparatus and method of the present invention will be described below using a welding example. That is, the laser processing apparatus can be used as a welding apparatus, performing only the welding process. Hereinafter, in this case, the laser processing apparatus will be described as a welding apparatus.

[0053] Furthermore, the welding device with adjustable welding position according to the embodiments of the present invention is applicable not only to various processes such as welding, brazing, bonding, and joining, but also to various materials such as polymers, metals, dielectrics, semiconductors, and glass applied in each process.

[0054] As mentioned above, in the welding structure of traditional imaging modules, there are problems with the reliability of the joint, such as damage to the joint due to impacts or external vibrations caused by the external environment.

[0055] Therefore, as described below, in order to weld and fix the image module onto the circuit board, the present invention enables the welding process by repeatedly feeding solder to the welding position of the workpiece in a specific manner, thereby preventing damage to the welded part even under external impact.

[0056] Figure 1 To illustrate a schematic structural diagram of a laser welding apparatus with adjustable welding position according to an embodiment of the present invention, Figure 2 To illustrate the welding configuration of the laser welding apparatus according to an embodiment of the present invention, Figure 3 and Figure 4 To illustrate the schematic diagram of the welding process position being adjusted according to an embodiment of the present invention, Figure 5 and Figure 6 This is a schematic diagram illustrating the welding state of a laser welding apparatus according to an embodiment of the present invention.

[0057] Referring to the above figures, the laser welding apparatus (100) according to the present invention includes: a control unit (10); a fixing block (200) which is coupled to a circuit board (not shown) and extends to one side to form a plurality of fixing pins (221), and has a plurality of insertion holes (211) for inserting the fixing pins (221); an image module (300) coupled to the circuit board through the fixing block (200); and a solder unit (110) which is movably operated under the control of the control unit (10) for soldering the insertion holes (211) into which the fixing pins (221) are inserted at predetermined time intervals. The part is welded multiple times and welded by a laser beam, and a nozzle part (111) is formed to receive the solder balls (S) irradiated by the laser beam; and a monitoring part (350) is provided on one side of the solder part (110) for monitoring the distribution range of the solder balls (S) injected by the laser beam irradiation, i.e. the solder bumps (2), and may also include a structure in which the injection position of the solder balls (S) injected from the solder part (110) to the fixing pin (221) and fixing hole (211) is adjusted according to the monitoring result of the monitoring part (350).

[0058] The laser welding apparatus (100) may include a laser generating unit (20), a beam conversion device (30), and a beam adjustment unit (50). The cross-sectional area of ​​the laser beam generated by the laser generating unit (20) can be adjusted when it passes through the beam conversion device (30). The adjusted beam cross-sectional area can then become the cross-sectional area of ​​the laser irradiating the welding position. The laser beam transmitted through the beam conversion device (30) can be transmitted to the head of the beam adjustment unit (50). Figure 10 :51), and by the head ( Figure 10 :51) After the transmitted laser melts the welding ball (S), it can be ejected from the nozzle at preset time intervals.

[0059] From the head ( Figure 10 :51) The transmitted laser can not only act on the solder ball (S) provided in the nozzle part (111), but also, depending on the choice of those skilled in the art, can be transmitted to the solder ball (S) that is pre-set to be no smaller than a predetermined size and arranged in the insertion hole.

[0060] According to another embodiment, the nozzle (111) can be configured as a sleeve. The laser emitted by the laser generator (20) can be transmitted to the head (…). Figure 10 :51) and irradiate the nozzle part (111) to heat it. After the solder is put into the nozzle part (111), the solder can be melted by the heat emitted by the heated nozzle part (111), thereby performing welding.

[0061] The beam adjustment unit (50) may include: a beam focusing unit (not shown) for adjusting the focal position of the laser beam; and a laser irradiation unit (not shown) for acquiring the irradiation position and alignment status information of the laser beam adjusted by the beam focusing unit and irradiating the laser beam. Additionally, if necessary, it may also include a heat distribution measuring unit (310: Pyrometer) for measuring the surface temperature or melting temperature of the welding point. The monitoring unit (350) may be, for example, a dynamic focusing module or a camera module, but is not limited thereto.

[0062] The control unit (10) can control the movement of the solder unit (110) and the laser irradiation, thereby performing the soldering process at the soldering position of the image module (300). The transfer unit (30) can transfer the image module (300) combined with the circuit board and position it at the soldering position, namely the fixing pin (221) and the insertion hole (211).

[0063] The laser welding device (100) can be adjusted to compensate the position of the center point of the nozzle (111) so as to align with the welding position from which the solder (S) molten by the laser beam is ejected.

[0064] The fixing block (200) can be configured to be combined with the circuit board, or the circuit board can be configured to be disposed on one side of the fixing block (200). According to one example of the invention, the fixing block (200) may include: a first fixing block (220) with a fixing pin (221) formed on one side of the image module (300) and protruding upward; and a second fixing block (210) that contacts the surface of the first fixing block (220) of the image module (300) and has an insertion hole (211) for inserting the fixing pin (221) in order to fix the image module (300) to the circuit board. According to the invention, the fixing pin (221) of the first fixing block (220) is formed to protrude a predetermined length from the uppermost end of the insertion hole (211), so that solder flows in and fills the space between the fixing pin (221) and the insertion hole (211) to further improve the mutual bonding force by soldering.

[0065] Specifically, according to the laser welding apparatus (100) of the present invention, before, during, or after the supplied solder (S) is ejected, the center point of the nozzle section (111) can be compensated by the image acquired by the monitoring unit (350), so that it moves to the welding position where the solder (S) is ejected. At this time, the solder (S) can be supplied to the nozzle section (111) of the solder section (110) in an intermittent or continuous manner according to a preset time interval.

[0066] The movement of the center point of the nozzle section (111) can be controlled by the control section (10). The control section (10) can determine the coordinates of the solder (S) ejection position, i.e., the x, y, and z coordinates, using the input from the monitoring section (350) and the measured detection values. These coordinates can be adjusted by having the laser beam via the beam conversion device (30) adjust the z-axis focus position by the dynamic focusing module (not shown), and by having the scanning head (not shown) adjust the x-axis and y-axis positions to align them with the welding position. In this invention, by adjusting the position coordinates (x, y, z) of the solder (S) ejected by the laser beam, the ideal welding position can be adjusted.

[0067] In some cases, the focal coordinates can be adjusted using a precision platform consisting of at least three axes, and may also include a tilting platform for adjusting the laser beam illumination angle. The tilting platform may include at least one of Xθ, Yθ, and Zθ.

[0068] According to the laser welding apparatus (100) of the present invention, solder (S) can be ejected to the welding position at preset time intervals, thereby achieving continuous welding. That is, as... Figure 3 and Figure 4As shown, the solder (S) molten by the laser beam can be sprayed intermittently or continuously at predetermined time intervals to the position coordinates (x, y, z) of the solder (S) ejection point, generally in the range of at least 2 to 7 times. For example, the laser welding apparatus (100) can sequentially spray the molten solder (S) to the welding position, i.e., the space between the fixing pin (211) and the insertion hole (211). At the welding position, the first weld (P1), the second weld (P2), the third weld (P3), and the nth weld (Pn) can be performed at the interface (B) where they at least partially overlap.

[0069] Preferably, the first welding (P1) of the solder (S) melted by the laser beam is preferably performed at the position where the outer peripheral surface of the retaining pin (211) and the inner peripheral surface of the insertion hole (211) are closest to each other. At this time, the welding position and the size of the solder (S) can be adjusted and ejected according to the size and shape of the solder bumps (2) formed by the overlapping of the solder (S) melted by the laser beam. In addition, according to the present invention, by continuously irradiating the continuously ejected solder (S) with the laser beam for a predetermined time, wettability can be improved, thereby enhancing or improving the bonding force.

[0070] The process of repeatedly spraying welding balls (S) onto the aforementioned welding positions will be described in more detail below with reference to the accompanying drawings.

[0071] On the other hand, in the laser welding apparatus (100) according to the present invention, solder (S) can be sequentially moved and supplied to the nozzle section (111) by an external conveying device (not shown) by gravity or by conveying an auxiliary gas. In this case, the solder (S) can also be supplied to the nozzle section (111) at an appropriate speed by conveying an auxiliary gas. The solder (S) is generally spherical, made of a metal alloy, and can be melted by laser irradiation or the like. The solder (S) can be used to attach electronic components or electrical components to a substrate (not shown). The solder can be composed of one of polymers, glass, metals, or mixed materials.

[0072] The following will refer to Figures 7 to 9 The welding process using the laser welding device (100) with adjustable welding position described above will be explained.

[0073] The laser welding method of the present invention using a laser welding apparatus (100) includes: a process of preparing a circuit board (S10) and arranging an image module (300) on which the circuit board is disposed; a fixing step (S20) of achieving a connection by inserting the fixing pin (221) of the second fixing block (220) of the image module (300) into the insertion hole (211) of the first fixing block (210); identifying the x, y, z coordinates of the center point of the fixing pin (221) of the second fixing block (220) and monitoring the position of the center point of the fixing pin (221) in the insertion hole (211); and, based on the monitoring results... The steps include: an adjustment step (S30) for aligning the nozzle (111) of the solder section (110) for supplying solder (S); a step (S50) for supplying solder (S) to the nozzle (111) at predetermined time intervals in order to perform multiple welding operations on the insertion hole (211) of the first fixing block (210) to which the fixing pin (221) of the second fixing block (220) is inserted; and a welding step (S60) for melting the solder (S) by irradiating it with a laser beam and spraying the solder (S) onto the fixing pin (221) and the insertion hole (211) to perform welding.

[0074] Specifically, refer to Figure 8 and Figure 9 To explain, firstly, in order to integrate the image module (300) into the circuit board, it is processed and transferred to the corresponding part (S100). At this time, the image module (300) can be integrated with the circuit board in the state where a fixing block (200) is formed, or the circuit board can be provided in an integral form that is placed on the image module (300).

[0075] Subsequently, the image module (300) is arranged such that the fixing pin (221) of the second fixing block (220) is inserted into the insertion hole (211) of the first fixing block (210) (S200). At this time, the insertion holes (211) of the first fixing block (210) are formed in three radial arrangements on the first fixing block (210), and the three fixing pins (221) formed on the second fixing block (220) are respectively inserted into the insertion holes (211), thereby achieving stable fixation.

[0076] Next, in order to confirm the accurate welding position of the fixing pin (221) of the second fixing block (220) in the insertion hole (211) of the first fixing block (210), the x, y, z coordinates of the center point of the fixing pin (221) are identified, and the position of the center point of the fixing pin (221) in the insertion hole (211) is monitored (S300).

[0077] The welding position can be determined based on the distance between the center point of the fixing pin (221) inserted into the insertion hole (211) of the first fixing block (210) and the center point of the insertion hole (211) on the plane. That is, the position where the inner peripheral surface of the insertion hole (211) of the first fixing block (210) and the outer peripheral surface of the fixing pin (221) are closest to each other is preferentially set as the welding position, while the part that at least partially overlaps can be set as an additional welding position.

[0078] Afterwards, with the insertion hole (211) and the fixing pin (221) inserted, the nozzle section (111) of the solder section (110) can be aligned according to the coordinate values ​​(S400). After the processing point is initially set according to the coordinate values, solder (S) can be continuously supplied to the nozzle section (111) of the solder section (110).

[0079] Preferably, such as Figure 9 As shown, after the coordinate values ​​are set, a first weld (P1) (S500-1) is performed, followed by a second weld (P2) (S500-2) that at least partially overlaps with the first weld (P1), and then a third weld (P3) (S500-3) is performed, including the overlapping interface (B) of the first weld (P1) and the second weld (P2). The number of welds (n) is not particularly limited as long as the fixing pin (221) can be stably fixed within the insertion hole (211) without moving. For example, it can be performed in the range of 2 to 7 times. In addition, before and after the first weld (P1), before and after the second weld (P2), and before and after the third weld (P3), the process of detecting the three-dimensional coordinates (x, y, z) based on the area, size, shape, etc. of the processing point can be performed respectively (S500-4, S500-5, S500-6).

[0080] At this time, based on the shape of the solder bumps (2) formed when the solder (S) is ejected, the solder section (110) can be tilted at a predetermined angle (θ) for the fixing pin (221) and the fixing hole (211), and the Xθ, Yθ, Zθ coordinates of the center point of the fixing pin (221) are identified and adjusted (S600). The solder (S) can be supplied intermittently or continuously at predetermined time intervals, and the size of the solder (S) is adjusted according to the shape and size of the solder bumps (2) formed by welding at the processing point before being supplied, thereby realizing an effective welding process (S700, S800).

[0081] Finally, after the second welding (P2), in order to improve the wettability and processing efficiency of the overlapping part, a post-heating process (S900) can be performed to maintain the laser beam irradiation process for a preset time.

[0082] The post-heating process may also include a correction alignment step for compensating for the alignment of the circuit board and the image module. By remelting the solder through the post-heating process and setting the offsets in the x-axis, y-axis, z-axis, x-axis Theta direction, y-axis Theta direction, and z-axis Theta direction according to the amount of solder shrinkage, the alignment of the circuit board and the image module can be compensated.

[0083] Furthermore, as described above, in addition to multiple welding operations, a preheating process for improving wettability may be further included. This preheating process may be performed at one or more times before and after the first welding operation (P1), before and after the second welding operation (P2), and before and after the nth welding operation (Pn). For example, after the solder (S) is sprayed onto the welding position side through the first welding operation (P1), and before performing the second welding operation (P2) to the nth welding operation (Pn), the relatively low temperature at the welding position may reduce the spreadability of the solder bumps (2), leading to welding defects such as cold soldering, cracking, and poor bonding. Here, "spreadability" refers to the degree to which the solder bumps (2) are positioned and distributed at the welding position to achieve greater contact area. Therefore, to prevent reduced spreadability due to the welding position maintaining a lower temperature relative to the solder bumps, a preheating process may be further performed.

[0084] The preheating process is as follows: Figure 10 As shown, in addition to additional laser irradiation via the laser generator (20), the welding can also be performed by adjusting the height of the head (51) to deviate from the laser focus, creating a gap between the laser focus and the welding position. As shown in the attached figure illustrating the preheating and heating states that can be performed by laser, the head (51) can selectively adjust the focal length (F; focusing) and defocusing distance (DF; defocusing) relative to the welding position.

[0085] When the welding position is located at the focal length (F), the metal welding position may melt or be damaged by heat due to the concentrated laser output. Therefore, when the laser is concentrated at the focal length (F), the solder bump (2) can be irradiated to melt it.

[0086] Furthermore, when the welding position is located at the defocus distance (DF), the laser output is dispersed and the laser irradiation area is increased, so the welding position can be located at the defocus distance (DF) when heating a larger area. Therefore, when the laser is concentrated at the defocus distance (DF), wettability can be improved by minimizing the temperature difference between the solder bump (2) and the welding position, thereby increasing the contact area.

[0087] The welding position located at the aforementioned defocus distance (DF) can be preheated. The solder bump (2) can be located within the area of ​​the preheated portion. More precisely, the periphery of the joining portion, including the solder bump (2), i.e., the part to be joined, can be a preheated portion (not shown).

[0088] Figure 11 This is a schematic diagram illustrating the structure of an optical fiber (610) for transmitting laser light according to an embodiment of the present invention.

[0089] Reference Figure 11 According to the multi-laser welding apparatus (100) of the present invention, a fiber laser (FL) or diode laser can be transmitted to the head (230) via an optical fiber. The optical fiber (610) can be composed of a core (611) for transmitting the laser beam and cladding layers (612, 613, 614, 615, 616). Specifically, the core (611) is a structure that can transmit laser light through total internal reflection or the like, while the cladding layers (612, 613, 614, 615, 616) are structures that do not expose the core (611) and have shock-resistant functions, and may include more than one. For example, the multiple cladding layers (612, 613, 614, 615, 616) may include materials such as polyvinyl chloride for shock absorption, aramid yarn for improving durability, polyimide, and silicone.

[0090] Furthermore, the core (611) located within the covering layers (612, 613, 614, 615, 616) can have various shapes. The core can have various shapes such as rectangular, polygonal, and circular, and the size and quality of the laser will vary depending on the size and shape of the core.

[0091] Further, the apparatus or method according to embodiments of the present invention may include the following configuration. The detection described below may include a first detection (pre-inspection) and a second detection (post-inspection) performed by the detection unit. The first detection (pre-inspection) refers to detecting the alignment state and welding position before welding; the second detection (post-inspection) refers to detecting one or more of the following defects in the solder section (110) after welding: open circuit, short circuit, cracks and voids, excessive solder, contamination with bridging, insufficient solder, cold solder, poor wetting, overheating, corrosion, erosion, component position misalignment, component gaps, and no solder. As described below, objects whose second detection results do not meet the quality standards can be classified with objects that meet the quality standards, and rework can be performed on objects that do not meet the quality standards.

[0092] First, the laser supplied by the laser supply device can be a laser with a wavelength that has a high laser absorption rate depending on the solder material. Alternatively, it can be a solid-state laser such as a fiber laser or a diode laser. The laser beam generated by the laser generator can be transmitted to the laser welding head via optical fiber without the need for a separate optical mirror, thereby achieving a stable laser supply and enabling precise operation during laser-irradiated welding.

[0093] Second, the laser processing apparatus may include a pick-and-place soldering head or a jet soldering head containing a laser soldering nozzle. The laser soldering head may include a laser beam focusing optical head, a solder (S) supply device, and the nozzle. Here, "laser soldering head" refers to a head, which can be configured as a single head, a dual head (containing two heads), or a head assembly containing three or more heads. Incorporating two or more laser soldering heads can improve the production efficiency of the apparatus.

[0094] Third, it can include a vision inspection module / unit or a vision inspection step. By including this vision inspection module or step, position detection, alignment status detection, and welding position detection of the camera module to be welded can be performed (Pre-Inspection), and welding quality inspection can be performed as needed (Post-Inspection). Therefore, a vision inspection module composed of low-magnification and high-magnification lenses can be installed, or a motorized variable zoom lens (1X~×18: the maximum magnification can be further increased according to the zoom lens design) can be installed, thereby achieving automatic inspection from low to high magnification and from large to small ranges. Pre-Inspection and Post-Inspection can be completed by a single vision inspection module, but to improve production efficiency, independent vision inspection modules can also be set up separately (for example, one for pre-Inspection and one for post-Inspection).

[0095] When Pre-Inspection and Post-Inspection are implemented by a single vision inspection module, the object that has undergone Pre-Inspection can return to its original position for Post-Inspection after being moved to the welding position and completed welding. When two vision inspection modules are set, one for Pre-Inspection and one for Post-Inspection, the object can be moved and inspected and welded in the order of Pre-Inspection, laser welding and Post-Inspection modules.

[0096] In addition, it may include infrared or three-dimensional inspection devices for real-time monitoring of welding quality and control of parameters, or for post-inspection of open circuits, short circuits, cracks and voids, excessive solder, contamination with bridging, under-welding, cold welding, poor wetting, overheating, corrosion, erosion, component misalignment, component gaps and unwelded areas in the welding area.

[0097] Fourth, it may also include a sorting device for classifying objects that do not meet the required welding quality standards after post-inspection.

[0098] Fifth, it may also include a repair device for fixing objects that do not meet the required soldering quality standards after post-inspection. This repair device can improve solder wettability by re-irradiating the solder with a laser to remelt the solder, or remove the solder and perform resoldering (rework). When removing the solder, it can be done automatically using mechanical tools such as pins, or automatically by remelting the solder with a laser and then extracting it.

[0099] Sixth, it may also include a cleaning device for removing dust and foreign matter in post-welding quality management, including a dust collection device. The cleaning device may include one or more of the following: dry air purging, CO2 snow cleaning, plasma cleaning, laser cleaning, and inert gas purging.

[0100] Seventh, depending on the type of substrate to be welded, a pre-welding section for pre-welding can be further included. Additionally, a laser welding head can be included to maximize welding quality and production efficiency.

[0101] Those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical concept or basic characteristics of the invention. Therefore, the above embodiments should be understood as exemplary rather than restrictive in all respects. The scope of the present invention should be defined by the following claims and should be interpreted to include all changes or modifications derived from the meaning and scope of the claims and their equivalents.

[0102] (Explanation of reference numerals in the attached image) 1: Conveying section 2: Solder bumps 10: Control Unit; 20: Laser Generator Unit 30: Beam conversion device; 50: Beam adjustment unit 100: Laser welding equipment; 110: Welding material section 111: Nozzle section 200: Fixing block 210: First fixing block; 211: Insertion hole 220: Second fixing block; 221: Fixing pin 300: Imaging module; 310: Heat distribution measurement unit 350: Monitoring section C: Nozzle centerline P1: First welding point P2: Second welding point P3: Third welding point; Pn: nth welding point S: Solder, solder ball; W: Optical fiber

Claims

1. A laser welding apparatus with adjustable welding position, comprising: Control Department; A fixing block, which is combined with a circuit board and has a plurality of fixing pins extending in one direction and a plurality of insertion holes for inserting the fixing pins; The imaging module is connected to the circuit board via the fixing block; The laser generator, which produces the laser beam; A solder section, movable under the control of the control section, is used to perform multiple soldering operations on the insertion hole where the fixing pin is inserted at predetermined time intervals, and is provided with at least one nozzle section for receiving solder and ejecting molten solder; and A monitoring unit, which is arranged on one side of the solder section, is used to monitor the distribution range of the solder that has been injected by irradiation with the laser beam; The position of the solder fed from the solder section to the fixing pin and fixing hole is adjusted according to the monitoring results of the monitoring section.

2. The laser welding apparatus according to claim 1, characterized in that, The solder comprises solder balls, which are melted and ejected by irradiating the solder balls with the laser beam.

3. The laser welding apparatus according to claim 1, characterized in that, The nozzle is configured as a sleeve heated by a laser, and the solder is melted by the heat generated by the sleeve heated by the laser.

4. The laser welding apparatus according to claim 2, characterized in that, The welding ball is applied to the fixing pin and fixing hole at a predetermined time interval of at least 2 to 7 times.

5. The laser welding apparatus according to claim 1, characterized in that, The solder is controlled to be applied and welded from the point where the outer peripheral surface of the fixing pin contacts or is closest to the inner peripheral surface of the fixing hole.

6. The laser welding apparatus according to claim 2, characterized in that, The solder section includes a structure that is inclined at a predetermined angle relative to the fixing pin and fixing hole and ejects the solder ball.

7. The laser welding apparatus according to claim 1, characterized in that, The laser beam is controlled to continuously irradiate the solder for a predetermined time after the solder melts and is ejected.

8. The laser welding apparatus according to claim 1, characterized in that, The fixing holes of the fixing block include a structure in which three or more holes are arranged.

9. The laser welding apparatus according to claim 2, characterized in that, One side of the solder section includes a structure for providing an inert gas supply section for supplying inert gas to the ejected solder balls.

10. The laser welding apparatus according to claim 2, characterized in that, The solder supplied to the nozzle includes a structure in which the size of the solder is adjusted by the control unit during the soldering process according to the detected distribution range of the solder.

11. The laser welding apparatus according to claim 1, characterized in that, It also includes a beam adjustment unit for adjusting the position of the laser beam, the beam adjustment unit comprising: A beam focusing section for adjusting the focal position of the laser beam; and A laser irradiation unit for acquiring the irradiation position and alignment status information of the laser beam after it has been adjusted by the beam focusing unit, and for irradiating the laser beam onto the workpiece.

12. The laser welding apparatus according to claim 1, characterized in that, The solder section also includes at least one beam conversion device for adjusting the output area of ​​the laser beam.

13. The laser welding apparatus according to claim 1, characterized in that, The laser beam emitted by the solder section is a laser beam containing multiple wavelengths, and each wavelength is transmitted to a different or the same type of workpiece to perform bonding.

14. The laser welding apparatus according to claim 1, characterized in that, The laser beam is transmitted to the head via optical fiber, thereby aligning the laser irradiation position.

15. The laser welding apparatus according to claim 14, characterized in that, The core of the optical fiber includes a structure formed in a circular or polygonal shape, thereby aligning the laser irradiation position.

16. The laser welding apparatus according to claim 1, characterized in that, The fixing block is pre-joined and conveyed by the conveying unit, thereby aligning the laser irradiation position with the solder ejection position.

17. The laser welding apparatus according to claim 16, characterized in that, The solder section also includes a camera section for image processing of the soldering position.

18. The laser welding apparatus according to claim 1, characterized in that, The laser is emitted in a flat-top form, thereby aligning the laser irradiation position.

19. A laser welding apparatus with adjustable welding position, comprising: Control Department; An imaging module integrated with a circuit board; A first fixing block formed on one side of the imaging module and extending in one direction, and provided with multiple fixing pins; A second fixing block is provided for fixing the image module to the substrate, and is in contact with the first fixing block surface of the image module and has a plurality of insertion holes for the fixing pin to be inserted; A laser generator that produces a laser beam; A solder section, movable under the control of the control section, is used to perform multiple soldering operations on the insertion hole where the fixing pin is inserted at predetermined time intervals, and is provided with at least one nozzle section for receiving solder and ejecting molten solder; and A monitoring unit, which is arranged on one side of the solder section, is used to monitor the distribution range of the solder balls being injected by irradiation with the laser beam; The placement position of the solder ball, which is inserted from the solder section into the fixing pin and fixing hole, is adjusted according to the monitoring results of the monitoring section.

20. A laser welding apparatus with adjustable welding position, comprising: Control Department; An image module is combined with a circuit board having insertion holes and is provided with a plurality of fixing pins extending to one side to be inserted into the insertion holes. A laser generator that produces a laser beam; A solder section, movable under the control of the control section, is used to perform multiple soldering operations on the insertion hole where the fixing pin is inserted at predetermined time intervals, and is provided with at least one nozzle section for receiving solder and ejecting molten solder; and A monitoring unit, which is arranged on one side of the solder section, is used to monitor the distribution range of the solder balls being injected by irradiation with the laser beam; The placement position of the solder ball, which is inserted from the solder section into the fixing pin and fixing hole, is adjusted according to the monitoring results of the monitoring section.

21. A laser welding method with adjustable welding position, comprising: The steps for arranging the image module that carries the circuit board; The fixing step involves placing the fixing pin of the image module into the insertion hole of the fixing block; The monitoring steps include identifying the x, y, and z coordinates of the center point of the fixing pin and monitoring the position of the center point of the fixing pin within the insertion hole; The alignment adjustment step is performed on the nozzle of the solder section that provides solder based on the monitoring results; In order to perform multiple welding operations on the insertion hole where the fixing pin is inserted, the step of continuously or intermittently supplying the solder to the nozzle at predetermined time intervals. as well as The step of spraying the solder into the fixing pin and insertion hole by irradiating the solder with a laser beam to melt it.

22. The laser welding method according to claim 21, characterized in that, During the ejection step, the laser beam is maintained to continuously irradiate the solder for a predetermined time after the solder is ejected.

23. The laser welding method according to claim 21, characterized in that, The ejection step includes: The first welding process involves applying the solder to the outer peripheral surface of the fixing pin and the inner peripheral surface of the fixing hole, or to the position where they are closest to each other. A second welding process that is initiated in a configuration that at least partially overlaps with the first welding location; and A third welding process in which the solder is sprayed onto at least a portion of the overlapping area.

24. The laser welding method according to claim 23, characterized in that, After the second welding process, the process also includes adjusting the solder part at a predetermined angle based on the Xθ, Yθ, and Zθ coordinates of the three-dimensional shape of the overlapping part.

25. The laser welding method according to claim 21, characterized in that, The step of supplying solder to the nozzle section further includes a step of selectively adjusting and setting the size of the supplied solder based on the solder distribution range detected during the welding process.

26. The laser welding method according to claim 21, characterized in that, During the second or third welding process, the overlapping area includes a post-heating process that maintains the laser beam irradiation process for a preset time.

27. The laser welding method according to claim 21, characterized in that, The step of supplying solder to the nozzle is performed at least 2 to 7 times.

28. The laser welding method according to claim 21, characterized in that, Following the ejection step, the process further includes arranging the solder portion at a predetermined angle (θ) relative to the retaining pin and retaining hole, and identifying the center point X of the retaining pin. θ Y θ Z θ The process of coordinates.

29. The laser welding method according to claim 21, characterized in that, In the step of supplying solder to the nozzle section, an inert gas discharged from a gas supply section formed on one side of the solder section is provided to the ejected solder.

30. The laser welding method according to claim 29, characterized in that, The process of providing the inert gas is linked to the laser beam irradiation process used to melt the solder, and can be carried out simultaneously or alternately.

31. The optical axis alignment method according to claim 26, characterized in that, The post-heating process includes a correction alignment step that compensates for and corrects the alignment between the circuit board and the image module by remelting the solder and setting offsets in the x-axis, y-axis, z-axis, x-axis Theta, y-axis Theta, and z-axis Theta directions according to the shrinkage of the solder.

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