Organopolysiloxane, organopolysiloxane-containing resin composition and cured product thereof, organopolysiloxane for near-infrared waveguide, organopolysiloxane-containing resin composition for near-infrared waveguide, cured product for near-

Abstract

The present invention provides: an organopolysiloxane for a near-infrared light waveguide, the organopolysiloxane having an organic group containing a polymerizable alkenyl group and a siloxane unit (D unit) represented by SiO2 / 2, the ratio of aromatic groups in the total of all groups bonded to silicon atoms being 20 mol% or less; or a cured product which contains a crosslinked structure derived from an organic group containing a polymerizable alkenyl group and a siloxane unit (D unit) represented by SiO2 / 2, and which has a refractive index at a wavelength of 1300 nm of 1.400-1.500 (inclusive) is provided.

Description

Technical Field

[0001] This invention relates to organopolysiloxanes, organopolysiloxane compositions and their cured forms, organopolysiloxanes for near-infrared waveguides, cured forms for near-infrared waveguides, and methods for manufacturing near-infrared waveguides, near-infrared light transmission components, and near-infrared waveguides. Background Technology

[0002] In recent years, with the increasing speed and capacity of information and communication, optical interconnect technology, which uses optical cabling to replace electrical cabling, has attracted attention.

[0003] Previously, electrical wiring was used for transmitting electrical signals in inter-device, intra-device, and inter-chip data transfers. However, with the increasing capacity of information and the demand for higher transmission speeds, the use of electrical wiring for transmitting electrical signals has reached its limit due to issues with wiring density and increased power consumption. Optical interconnect technology is being developed and promoted as a replacement for electrical wiring.

[0004] In optical interconnect technology, data transmission between devices and circuits utilizes optical cabling. Advantages of optical cabling include low power consumption, high-density cabling, and high-speed communication. As data communication capacity increases in optical interconnect technology, the development of optical waveguides, which connect single-mode optical fibers and silicon photonic circuits, is progressing. Among these, optical waveguides using photoresist materials and requiring no reactive dry etching process are attracting attention due to their high productivity.

[0005] Especially in data center installations requiring high-speed transmission, optical waveguides capable of connecting to near-infrared single-mode quartz optical fibers are needed. From the perspective of efficiently forming micro-waveguides, it is desirable to form optical waveguides through the curing of resin compositions.

[0006] Like optical fibers, optical waveguides connected to optical fibers have a core at the center and a cladding covering it, allowing light to propagate efficiently while undergoing total internal reflection. Therefore, the core constituting the waveguide must have a higher refractive index than the cladding, and the refractive index difference between the core and the cladding must be appropriate.

[0007] For example, Patent Document 1 discloses an organopolysiloxane having an aromatic hydrocarbon group as a material for use as a light transmission component.

[0008] Existing technical documents

[0009] Patent documents

[0010] Patent Document 1: Japanese Patent Application Publication No. 2005-163009 Summary of the Invention

[0011] The problem that the invention aims to solve

[0012] In optical waveguides, it is necessary to suppress transmission loss when light propagates. This loss represents the degree to which the optical signal attenuates with distance along the communication path. Furthermore, since the optical waveguide is connected to the optical fiber, suppressing the optical loss during the connection, i.e., connection loss, also becomes important.

[0013] In the aforementioned patent document 1, although the refractive index difference between the core and the cladding can be adjusted by adjusting the molar ratio of aromatic hydrocarbon groups in the organopolysiloxane, there is still room for improvement in transmission loss.

[0014] Furthermore, previous reports on optical waveguide materials, such as those in Patent Document 1, primarily focused on increasing the refractive index difference between the core and cladding. However, the connection loss when connected to optical fibers has not been studied.

[0015] To address the aforementioned problems, the present invention aims to provide an optical waveguide that possesses the properties typically required for optical waveguides and whose connection loss is significantly suppressed.

[0016] Solution for solving the problem

[0017] The inventors conducted in-depth research to solve this problem. They discovered that connection loss increases due to the roughness of the optical waveguide end face, meaning the state of the optical waveguide end face has a significant impact on connection loss. Furthermore, they found that cured products made from organopolysiloxanes with specific structures and their compositions can solve the aforementioned problem, thus completing this invention.

[0018] That is, the present invention provides the following content.

[0019] (1) An organopolysiloxane, represented by the following general formula [1].

[0020] (R) 1 R 2 R 3 SiO 1 / 2 ) M1 (R) 4 R 5 R 6 SiO 1 / 2 ) M2

[0021] (R) 7 R 8 SiO 2 / 2 ) D1 (R) 9 R 6 SiO 2 / 2 ) D2

[0022] (R) 10 SiO 3 / 2 ) T1 (R) 6SiO 3 / 2 ) T2 (SiO) 4 / 2 ) Q

[0023] (O) 1 / 2 R 11 ) Y1 (O) 1 / 2 R 6 ) Y2 ...[1]

[0024] In the above formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms.

[0025] R 1 ~R 3 R 7 R 8 R 10 and R 11 It does not contain polymeric alkenyl groups.

[0026] R 6 It is an organic group containing one or more polymeric alkenyl groups, which may optionally be the same as or different from each other.

[0027] 0≤M1, 0≤Q, 0≤Y1, 0≤Y2

[0028] 0 <D1+D2、

[0029] 0 <M2+D2+T2、

[0030] M1+M2+D1+D2+T1+T2+Q=1,

[0031] Of all the groups bonded to silicon atoms, the proportion of aromatic groups is less than 20 mol%.

[0032] (2) The organopolysiloxane according to item (1) above, wherein, in formula [1], 0.1 <D1+D2。

[0033] (3) The organopolysiloxane according to item (1) or (2) above, wherein, in formula [1], 0 <D1。

[0034] (4) The organopolysiloxane according to any one of the above items (1) to (3), wherein, in the formula [1], 0.02≤Y1≤0.25.

[0035] (5) An organopolysiloxane according to any one of the above items (1) to (4), wherein, in the formula [1], R 7 ~R 9 It does not contain aromatic groups.

[0036] (6) An organopolysiloxane according to any one of the above items (1) to (5), wherein, in the formula [1], R 1 ~R 11 It does not contain aromatic groups.

[0037] (7) An organopolysiloxane according to any one of the above items (1) to (6), wherein, in the formula [1], the R 6 A molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5].

[0038] [Chemical Formula 1]

[0039]

[0040] (In the above formula, X is a divalent organic group, optionally containing a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom that is the end of X and directly bonded to silicon is a carbon atom. When X is bonded to an oxygen atom that is directly bonded to silicon, the atom that is the end of X and directly bonded to the oxygen atom is a carbon atom. * indicates a bonded bond.)

[0041] (8) An organopolysiloxane according to any one of the above items (1) to (7), wherein, in the formula [1], the R 6 It is acryloyloxypropyl and / or methacryloyloxypropyl.

[0042] (9) An organopolysiloxane according to any one of items (1) to (8) above, wherein, in the general formula [1], R 7 R 8 Each is an alkyl group having 1 to 20 carbon atoms.

[0043] (10) A resin composition containing an organopolysiloxane comprising an organopolysiloxane according to any one of items (1) to (9) above and a polymerization initiator.

[0044] (11) A cured product formed by curing a resin composition containing an organosiloxane according to item (10) above.

[0045] (12) A near-infrared waveguide made using a resin composition containing organosiloxanes according to item (10) above.

[0046] (13) A near-infrared waveguide having a core and a cladding portion, wherein the core and the cladding portion are made using a resin composition containing an organosiloxane according to item (10) above.

[0047] (14) A near-infrared light transmission component having at least the near-infrared light waveguide described in item (12) above.

[0048] (15) A near-infrared light transmission component having at least the near-infrared light waveguide described in item (13) above.

[0049] (16) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0050] Step (i-1): A first curable polymer composition is coated on the surface of a substrate to form a first polymer layer;

[0051] Step (i-2) involves irradiating at least one selected region of the first polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and

[0052] In step (i-3), the non-exposed areas of the partially exposed layer are removed using a solvent to form a patterned core.

[0053] The first curable polymer composition is a resin composition containing an organopolysiloxane according to item (10) above.

[0054] (17) The near-infrared waveguide manufacturing method according to item (16) above further comprises:

[0055] Step (i-4): Coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and

[0056] In step (i-5), the second polymer layer is cured to form the upper cladding layer.

[0057] (18) The method for manufacturing a near-infrared waveguide according to item (17) above, wherein the second curable polymer composition is a resin composition containing an organopolysiloxane according to item (10) above.

[0058] (19) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0059] Step (ii-1): A third curable polymer composition is coated on the surface of the substrate to form a third polymer layer;

[0060] Step (ii-2): Irradiate at least one selected region in the third polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region.

[0061] In step (ii-3), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core;

[0062] Step (ii-4): Coating the substrate surface and the core with a fourth curable polymer composition to form a fourth polymer layer; and

[0063] In step (ii-5), the fourth polymer layer is cured to form the upper coating.

[0064] At least one of the third curable polymer composition and the fourth curable polymer composition is a resin composition containing an organopolysiloxane according to item (10) above.

[0065] (20) The method for manufacturing a near-infrared waveguide according to item (19) above, wherein the third curable polymer composition and the fourth curable polymer composition are both resin compositions containing organic polysiloxanes according to item (10) above.

[0066] (21) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0067] Step (iii-1): A fifth curable polymer composition is coated on the surface of the substrate to form a fifth polymer layer;

[0068] Step (iii-2) involves curing the fifth polymer layer to form the lower cladding layer;

[0069] Step (iii-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer;

[0070] Step (iii-4) involves irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and

[0071] In step (iii-5), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core.

[0072] At least one of the fifth curable polymer composition and the sixth curable polymer composition is a resin composition containing an organopolysiloxane according to item (10) above.

[0073] (22) The method for manufacturing a near-infrared waveguide according to item (21) above, wherein the fifth curable polymer composition and the sixth curable polymer composition are both resin compositions containing organopolysiloxanes according to item (10) above.

[0074] (23) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0075] Step (iv-1): A fifth curable polymer composition is coated on the substrate surface to form a fifth polymer layer;

[0076] Step (iv-2) involves curing the fifth polymer layer to form the lower cladding layer;

[0077] Step (iv-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer;

[0078] Step (iv-4) involves irradiating at least one selected region in the sixth polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region.

[0079] Step (iv-5) involves removing the non-exposed areas of the partially exposed layer using a solvent to form a patterned core;

[0080] Step (iv-6): Coating the lower cladding and the core with a seventh curable polymer composition to form a seventh polymer layer; and

[0081] In step (iv-7), the seventh polymer layer is cured to form the upper cladding layer.

[0082] At least one of the fifth, sixth, and seventh curable polymer compositions is a resin composition containing an organopolysiloxane according to item (10) above.

[0083] (24) The method for manufacturing a near-infrared waveguide according to item (23) above, wherein the fifth curable polymer composition, the sixth curable polymer composition and the seventh curable polymer composition are all resin compositions containing organic polysiloxanes according to item (10) above.

[0084] (25) A cured material comprising a cross-linked structure derived from an organic group containing a polymeric alkenyl group, and formed from SiO2. 2 / 2 The siloxane unit (D unit) represents the cured material, which has a refractive index of 1.400 or higher and 1.500 or lower at a wavelength of 1300 nm.

[0085] (26) The cured material according to item (25) above has a refractive index of 1.400 or more and 1.500 or less at a wavelength of 589 nm.

[0086] (27) The cured product according to item (25) or (26) above, wherein the cured product is formed by curing an organopolysiloxane represented by the following general formula [1].

[0087] (R) 1 R 2 R 3 SiO 1 / 2 ) M1 (R) 4 R 5 R 6 SiO 1 / 2 ) M2

[0088] (R) 7 R 8 SiO 2 / 2 ) D1 (R) 9 R 6 SiO 2 / 2 ) D2

[0089] (R) 10 SiO 3 / 2 ) T1 (R) 6 SiO 3 / 2 ) T2 (SiO) 4 / 2 ) Q

[0090] (O) 1 / 2 R 11 ) Y1 (O) 1 / 2 R 6 ) Y2 ...[1]

[0091] In the above formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms.

[0092] R 1 ~R 3 R 7 R 8 R 10 and R 11 It does not contain polymeric alkenyl groups.

[0093] R6 It is an organic group containing one or more polymeric alkenyl groups, which may optionally be the same as or different from each other.

[0094] 0≤M1, 0≤Q, 0≤Y1, 0≤Y2

[0095] 0 <D1+D2、

[0096] 0 <M2+D2+T2、

[0097] M1+M2+D1+D2+T1+T2+Q=1,

[0098] Of all the groups bonded to silicon atoms, the proportion of aromatic groups is less than 20 mol%.

[0099] (28) The cured product according to item (27) above, wherein, in formula [1], 0.1 <D1+D2。

[0100] (29) The cured product according to item (27) or (28) above, wherein, in the formula [1], 0 <D1。

[0101] (30) The cured product according to any one of the above items (27) to (29), wherein, in the formula [1], 0.02≤Y1≤0.25.

[0102] (31) The cured product according to any one of the above items (27) to (30), wherein, in the formula [1], R 1 ~R 11 It does not contain aromatic groups.

[0103] (32) The cured product according to any one of the above items (27) to (31), wherein, in the formula [1], R 6 A molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5].

[0104] [Chemical Formula 2]

[0105]

[0106] (In the above formula, X is a divalent organic group, optionally containing a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom that is the end of X and directly bonded to silicon is a carbon atom. When X is bonded to an oxygen atom that is directly bonded to silicon, the atom that is the end of X and directly bonded to the oxygen atom is a carbon atom. * indicates a bonded bond.)

[0107] (33) A cured product according to any one of the above items (27) to (32), wherein, in the formula [1], R6 It is acryloyloxypropyl and / or methacryloyloxypropyl.

[0108] (34) A cured product according to any one of the above items (27) to (33), wherein, in the general formula [1], R 7 R 8 Each is an alkyl group having 1 to 20 carbon atoms.

[0109] (35) A near-infrared waveguide comprising a cured material according to any one of items (25) to (34) above.

[0110] (36) A near-infrared waveguide having a core and a cladding portion, wherein the core and the cladding portion comprise a cured material according to any one of items (25) to (34) above.

[0111] (37) A near-infrared light transmission component having at least the near-infrared light waveguide described in item (35) above.

[0112] (38) A near-infrared light transmission component having at least the near-infrared light waveguide described in item (36) above.

[0113] (39) An organopolysiloxane for near-infrared optical waveguides, which has the following characteristics:

[0114] Organic groups containing polymeric alkenyl groups, and

[0115] From SiO 2 / 2 The siloxane unit (D unit) is represented.

[0116] Of all the groups bonded to silicon atoms, aromatic groups account for less than 20 mol%.

[0117] (40) The near-infrared waveguide organopolysiloxane according to the above item (39) is represented by the following general formula [1].

[0118] (R) 1 R 2 R 3 SiO 1 / 2 ) M1 (R) 4 R 5 R 6 SiO 1 / 2 ) M2

[0119] (R) 7 R 8 SiO 2 / 2 ) D1 (R) 9 R6 SiO 2 / 2 ) D2

[0120] (R) 10 SiO 3 / 2 ) T1 (R) 6 SiO 3 / 2 ) T2 (SiO) 4 / 2 ) Q

[0121] (O) 1 / 2 R 11 ) Y1 (O) 1 / 2 R 6 ) Y2 ...[1]

[0122] In formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups composed of organic groups, reactive functional groups, and hydrogen atoms.

[0123] R 1 ~R 3 R 7 R 8 R 10 and R 11 It does not contain polymeric alkenyl groups.

[0124] R 6 It is one or more organic groups containing a polymerizable alkenyl group, and in the case of multiple groups, they may optionally be the same as or different from each other.

[0125] R 1 ~R 11 In the total, the proportion of aromatic groups is less than 20 mol%.

[0126] 0≤M1, 0≤Q, 0≤Y1, 0≤Y2

[0127] 0 <D1+D2、

[0128] 0 <M2+D2+T2、

[0129] M1+M2+D1+D2+T1+T2+Q=1].

[0130] (41) The near-infrared waveguide organopolysiloxane according to the above item (40), wherein, in the formula [1], 0.1 <D1+D2。

[0131] (42) The organopolysiloxane for near-infrared waveguides according to item (40) or (41) above, wherein, in formula [1], 0 <D1。

[0132] (43) The near-infrared waveguide organopolysiloxane according to any one of the above items (40) to (42), wherein, in the formula [1], 0.02≤Y1≤0.25.

[0133] (44) An organopolysiloxane for near-infrared waveguides according to any one of the above items (40) to (43), wherein, in the formula [1], R 7 ~R 9 It does not contain aromatic groups.

[0134] (45) An organopolysiloxane for near-infrared waveguides according to any one of the above items (40) to (44), wherein, in the formula [1], the R 6 A molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5].

[0135] [Chemical Formula 3]

[0136]

[0137] (In the above formula, X is a divalent organic group, optionally containing a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom that is the end of X and directly bonded to silicon is a carbon atom. When X is bonded to an oxygen atom that is directly bonded to silicon, the atom that is the end of X and directly bonded to the oxygen atom is a carbon atom. * indicates a bonded bond.)

[0138] (46) An organopolysiloxane for near-infrared waveguides according to any one of the above items (40) to (45), wherein, in the formula [1], the R 6 It is acryloyloxypropyl and / or methacryloyloxypropyl.

[0139] (47) An organopolysiloxane for near-infrared waveguides according to any one of the above items (40) to (46), wherein R in the formula [1] 1 ~R 11 It does not contain aromatic groups.

[0140] (48) A resin composition containing an organopolysiloxane for near-infrared waveguides, comprising an organopolysiloxane for near-infrared waveguides according to any one of items (39) to (47) above and a polymerization initiator.

[0141] (49) A cured product for near-infrared waveguides, which is formed by curing a resin composition containing an organopolysiloxane for near-infrared waveguides according to item (48) above.

[0142] (50) A near-infrared waveguide made using a resin composition containing an organopolysiloxane for the near-infrared waveguide according to item (48) above.

[0143] (51) A near-infrared waveguide having a core and a cladding portion, wherein the core and the cladding portion are made using a resin composition containing an organopolysiloxane for the near-infrared waveguide according to item (48) above.

[0144] (52) A near-infrared light transmission component having at least the near-infrared light waveguide described in item (50) above.

[0145] (53) A near-infrared light transmission component having at least the near-infrared light waveguide described in item (51) above.

[0146] (54) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0147] Step (i-1): A first curable polymer composition is coated on the surface of a substrate to form a first polymer layer;

[0148] Step (i-2) involves irradiating at least one selected region of the first polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and

[0149] In step (i-3), the non-exposed areas of the partially exposed layer are removed using a solvent to form a patterned core.

[0150] The first curable polymer composition is a resin composition containing organic polysiloxane for near-infrared waveguides according to the above item (48).

[0151] (55) The near-infrared waveguide manufacturing method according to item (54) above further comprises:

[0152] Step (i-4): Coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and

[0153] In step (i-5), the second polymer layer is cured to form the upper cladding layer.

[0154] (56) The method for manufacturing a near-infrared waveguide according to item (55) above, wherein the second curable polymer composition is a resin composition containing an organopolysiloxane for a near-infrared waveguide according to item (48) above.

[0155] (57) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0156] Step (ii-1): A third curable polymer composition is coated on the surface of the substrate to form a third polymer layer;

[0157] Step (ii-2): Irradiate at least one selected region in the third polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region.

[0158] In step (ii-3), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core;

[0159] Step (ii-4): Coating the substrate surface and the core with a fourth curable polymer composition to form a fourth polymer layer; and

[0160] In step (ii-5), the fourth polymer layer is cured to form the upper coating.

[0161] At least one of the third curable polymer composition and the fourth curable polymer composition is a resin composition containing an organopolysiloxane for near-infrared waveguides according to item (48) above.

[0162] (58) The method for manufacturing a near-infrared waveguide according to item (57) above, wherein the third curable polymer composition and the fourth curable polymer composition are resin compositions containing organopolysiloxanes for near-infrared waveguides according to item (48) above.

[0163] (59) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0164] Step (iii-1): A fifth curable polymer composition is coated on the surface of the substrate to form a fifth polymer layer;

[0165] Step (iii-2) involves curing the fifth polymer layer to form the lower cladding layer;

[0166] Step (iii-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer;

[0167] Step (iii-4) involves irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and

[0168] In step (iii-5), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core.

[0169] At least one of the fifth curable polymer composition and the sixth curable polymer composition is a resin composition containing an organopolysiloxane for near-infrared waveguides according to the above item (48).

[0170] (60) The method for manufacturing a near-infrared waveguide according to item (59) above, wherein the fifth curable polymer composition and the sixth curable polymer composition are both resin compositions containing organopolysiloxanes for near-infrared waveguides according to item (48) above.

[0171] (61) A method for manufacturing a near-infrared optical waveguide, comprising, in sequence:

[0172] Step (iv-1): A fifth curable polymer composition is coated on the substrate surface to form a fifth polymer layer;

[0173] Step (iv-2) involves curing the fifth polymer layer to form the lower cladding layer;

[0174] Step (iv-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer;

[0175] Step (iv-4) involves irradiating at least one selected region in the sixth polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region.

[0176] Step (iv-5) involves removing the non-exposed areas of the partially exposed layer using a solvent to form a patterned core;

[0177] Step (iv-6): Coating the lower cladding and the core with a seventh curable polymer composition to form a seventh polymer layer; and

[0178] In step (iv-7), the seventh polymer layer is cured to form the upper cladding layer.

[0179] At least one of the fifth, sixth, and seventh curable polymer compositions is a resin composition containing an organopolysiloxane for near-infrared waveguides according to item (48) above.

[0180] (62) The method for manufacturing a near-infrared waveguide according to item (61) above, wherein the fifth curable polymer composition, the sixth curable polymer composition and the seventh curable polymer composition are all resin compositions containing organopolysiloxane for near-infrared waveguides according to item (48) above.

[0181] Invention Effects

[0182] According to the present invention, an optical waveguide with properties typically required for optical waveguides and significantly suppressed connection losses can be provided. More specifically, an optical waveguide with significantly suppressed connection losses, low transmission losses, and controlled refractive index difference between the core and cladding can be provided. Optical waveguides comprising cured products formed by curing the organopolysiloxanes and compositions thereof of the present invention are particularly suitable as near-infrared optical waveguides and near-infrared light transmission components. Attached Figure Description

[0183] Figure 1 This is a schematic cross-sectional view of an optical waveguide with a core formed on a substrate.

[0184] Figure 2 This is a schematic cross-sectional view of an optical waveguide with a core and an upper cladding formed on a substrate.

[0185] Figure 3 This is a schematic cross-sectional view of an optical waveguide with a lower cladding and a core formed on a substrate.

[0186] Figure 4 This is a schematic cross-sectional view of an optical waveguide having a lower cladding, a core, and an upper cladding formed on a substrate. Detailed Implementation

[0187] Hereinafter, embodiments of the present invention (hereinafter sometimes referred to as this embodiment) will be described in detail, but the following description is only an example of the embodiments and the present invention is not limited thereto.

[0188] [Organopolysiloxane]

[0189] The organopolysiloxane of the first embodiment of the present invention (hereinafter, sometimes referred to as the first embodiment) has an organic group comprising a polymerizable alkenyl group and is composed of SiO2. 2 / 2 The siloxane unit (D unit) is represented. In the organopolysiloxane of this embodiment, the proportion of aromatic groups in the total number of groups bonded to silicon atoms is 20 mol% or less.

[0190] For multimode applications, where the refractive index difference between the core and cladding is large, organopolysiloxanes with aromatic groups have been reported. However, the inventors have discovered that near-infrared waveguides using organopolysiloxanes with an aromatic group percentage of 20 mol% or less out of all groups bonded to silicon atoms exhibit low connection loss.

[0191] Although not bound by any specific theory, the influence of aromatic groups can be considered as follows.

[0192] That is, if the aromatic groups in the organopolysiloxane are less than 20 mol%, the interaction between the aromatic rings is weakened, and the cured product formed by the resin composition containing the organopolysiloxane is less likely to become brittle and less likely to crack. Therefore, it is believed that the end face of the waveguide is less likely to become rough when cutting. It is believed that by suppressing the roughness of the waveguide end face, light scattering is also suppressed, and connection loss is reduced.

[0193] In this embodiment, the proportion of aromatic groups in the total number of groups bonded to silicon atoms in the organopolysiloxane is set to 20 mol% or less. Therefore, the roughness of the optical waveguide end face obtained using this organopolysiloxane can be suppressed, thereby suppressing connection loss. In this embodiment, the proportion of aromatic groups in the total number of groups bonded to silicon atoms in the organopolysiloxane is preferably 15 mol% or less, more preferably 10 mol% or less, further preferably 5 mol% or less, and even more preferably 1 mol% or less.

[0194] As described above, the organopolysiloxane of this embodiment can take two forms: one with aromatic groups and the other without any aromatic groups. When the organopolysiloxane has aromatic groups, its lower limit is not limited as long as it does not impair the effects of the present invention; for example, it can be 0.01 mol% or 0.1 mol%. According to one aspect of the present invention, it is also preferred that the organopolysiloxane has no aromatic groups bonded to silicon atoms.

[0195] The content of aromatic groups can be determined by... 1 H-NMR, 29 Confirmed by Si-NMR. "Completely absent" means that the NMR spectrum does not contain any distinct peaks that can be clearly identified as aromatic groups.

[0196] In this specification, the "transmission loss" and "connection loss" of an optical waveguide are defined as follows.

[0197] The optical loss is determined by bringing the optical fiber close to one end of a straight optical waveguide to allow light to enter, and measuring the intensity of the outgoing light from the other end of the waveguide. The optical loss value (dB) is calculated as follows [6].

[0198] [Formula 1]

[0199]

[0200] [In Equation [6], P1 represents the incident light intensity, and P2 represents the emitted light intensity.]

[0201] Next, the slope of the graph approximating the waveguide length (cm) with the horizontal axis as the vertical axis and the attenuation (dB) is defined as the transmission loss (dB / cm), and the intercept is defined as the connection loss (dB).

[0202] The connection loss, derived from the linear approximation as the intercept, represents the optical loss that occurs when light travels from an optical fiber to an optical waveguide. The inventors have discovered that the physical shape (roughness) of the end face of the optical waveguide has a significant impact on the connection loss.

[0203] In this embodiment, since the organopolysiloxane contains polymerizable alkenyl groups in its structure, a cured product can be easily obtained using a polymerization initiator. In other words, it is suitable for forming a core using photolithography.

[0204] By adjusting the content of polymerizable alkenyl groups in the organopolysiloxane of this embodiment, the density of the obtained cured product can be controlled, thereby controlling the refractive index of the cured product at near-infrared wavelengths to be between 1.400 and 1.500.

[0205] Furthermore, through organopolysiloxanes having the properties of SiO 2 / 2 The siloxane unit (D unit) represents a reflow soldering resistant material that maintains the refractive index of the cured material at near-infrared wavelengths between 1.400 and 1.500, while also exhibiting low optical loss, especially transmission loss, and toughness. This allows for the suppression of end-face roughness during waveguide cutting and significantly reduces connection loss.

[0206] [Organopolysiloxane]

[0207] In this first embodiment, the organopolysiloxane is characterized by having a structure represented by the following formula [1].

[0208] (R) 1 R 2 R 3 SiO 1 / 2 ) M1 (R) 4 R 5 R 6 SiO 1 / 2 ) M2

[0209] (R) 7 R 8 SiO 2 / 2 ) D1 (R) 9R 6 SiO 2 / 2 ) D2

[0210] (R 10 SiO 3 / 2 ) T1 (R 6 SiO 3 / 2 ) T2 (SiO 4 / 2 ) Q

[0211] (O 1 / 2 R 11 ) Y1 (O 1 / 2 R 6 ) Y2 ……[1]

[0212] [In Formula [1], R 1 ~R 5 、R 7 ~R 11 are each independently one or more groups selected from the group consisting of an organic group, a reactive functional group, and a hydrogen atom.

[0213] R 1 ~R 3 、R 7 、R 8 、R 10 以及R 11 do not contain a polymerizable alkenyl group. R 6 is one or more organic groups containing a polymerizable alkenyl group, and when there are a plurality of them, they are optionally the same or different from each other. In the sum of R 1 ~R 11 , the proportion of the aromatic group is 20 mol% or less, 0 ≤ M1, 0 ≤ Q, 0 ≤ Y1, 0 ≤ Y2, 0 < D1 + D2, 0 < M2 + D2 + T2, and M1 + M2 + D1 + D2 + T1 + T2 + Q = 1].

[0214] In the general formula [1], M1 and M2 represent the proportion (in terms of moles) of the so-called M unit (SiO 1 / 2 ), which has one oxygen atom bonded to a silicon atom, when M1 + M2 + D1 + D2 + T1 + T2 + Q = 1 (hereinafter sometimes only referred to as the "M unit"). Similarly, D1 and D2 represent the proportion (in terms of moles) of the D unit (SiO 2 / 2 ), which has two oxygen atoms bonded to a silicon atom (hereinafter sometimes only referred to as the "D unit"), and T1 and T2 represent the proportion (in terms of moles) of the T unit (SiO 3 / 2), (hereinafter sometimes referred to simply as "T unit") ratio (in terms of mole), Q represents a Q unit in which four oxygen atoms are bonded to a silicon atom (SiO 4 / 2 ), (hereinafter sometimes referred to simply as "Q unit") ratio (in terms of mole). As described above, in the present first embodiment, in the organopolysiloxane represented by the general formula [1], the ratio of aromatic groups in the total of all groups bonded to silicon atoms is 20 mol% or less.

[0215] M2, D2, and T2 respectively represent the ratios of M units, D units, and T units in which an organic group having a polymerizable alkenyl, i.e., an organic group containing a polymerizable alkenyl, is bonded to a silicon atom. 6 ).

[0216] Y1 represents the relative ratio of a structure (O 1 / 2 R 11 ) that does not have a polymerizable alkenyl and has a group selected from the group consisting of an organic group, a reactive functional group, and a hydrogen atom when M1 + M2 + D1 + D2 + T1 + T2 + Q = 1, specifically, a structure having an alkoxy group or a silanol group. Y2 represents the relative ratio of a structure (O 1 / 2 R 6 ) having an organic group containing a polymerizable alkenyl.

[0217] 0 ≤ M1, 0 ≤ Q, 0 ≤ Y1, 0 ≤ Y2 means that M1, Q, Y1, and Y2 are each 0 or more and can also be 0, that is, it means that these structural units may be absent.

[0218] 0 < D1 + D2 means that the organopolysiloxane has a D unit, and 0 < M2 + D2 + T2 means that at least one of the M unit, D unit, and T unit having an organic group containing a polymerizable alkenyl is present.

[0219] In the present embodiment, the organopolysiloxane preferably has a branched structure. This means that at least one of the T unit and the Q unit is present.

[0220] <Coefficient M2 + D2 + T2>

[0221] As described above, in the organopolysiloxane of the present embodiment, 0 < M2 + D2 + T2. That is, the organopolysiloxane of the present embodiment contains a polymerizable alkenyl and can easily obtain a cured product using a composition containing a polymerization initiator described later. The value of M2 + D2 + T2 is preferably 0.10 ≤ M2 + D2 + T2, more preferably 0.12 ≤ M2 + D2 + T2, further preferably 0.15 ≤ M2 + D2 + T2, and even more preferably 0.20 ≤ M2 + D2 + T2. If within this range, it is sufficiently cured when preparing a cured product and has good compatibility with other components added to the resin composition containing the organopolysiloxane described later.

[0222] There is no particular upper limit to the value of M2+D2+T2, but it is preferably M2+D2+T2≤0.75, more preferably M2+D2+T2≤0.60, and even more preferably M2+D2+T2≤0.55. Within this range, the amount of polymerizable alkenyl groups contained in the organopolysiloxane is appropriate, and a cured product with a crosslinking density that does not cause brittleness can be obtained.

[0223] As described above, it is preferred that 0.10≤M2+D2+T2≤0.75, more preferably 0.12≤M2+D2+T2≤0.60, and even more preferably 0.15≤M2+D2+T2≤0.55.

[0224] <O 1 / 2 R 11 >

[0225] (O) 1 / 2 R 11 This is a structure that does not possess a polymerizable alkenyl group and has groups selected from the group consisting of organic groups, reactive functional groups, and hydrogen atoms, specifically alkoxy and / or silanol groups bonded to silicon. This structural unit allows control over the viscosity of organopolysiloxanes, thereby enabling adjustment to a viscosity suitable for molding. Silanol groups have a viscosity-increasing effect, while alkoxy groups have a viscosity-reducing effect.

[0226] If the proportion of alkoxy or silanol groups is low, the amount of highly mobile end groups is small, and the siloxane skeleton becomes a rigid cage structure, thus increasing viscosity. Conversely, if the proportion of alkoxy or silanol groups is high, the amount of highly mobile end groups is large, and the siloxane skeleton is a non-cage-like, flexible, random, or ladder-like structure, thus decreasing viscosity.

[0227] <Coefficient Y1>

[0228] Indicates (O) 1 / 2 R 11 The proportion Y1 of ) is 0 or a positive value. According to R 11 By definition, Y1 represents the total proportion of silanol groups and alkoxy groups in the organopolysiloxane. Regarding the range of the coefficient Y1, from the viewpoint of the synthesis of organopolysiloxanes (described later), the viscosity adjustment required for preparing resin compositions containing organopolysiloxanes, and the toughness of the cured product, it is generally 0 or more, preferably 0.02 or more, more preferably 0.025 or more, even more preferably 0.03 or more, and even more preferably 0.035 or more.

[0229] On the other hand, from the viewpoint of preserving stability and operability, the upper limit of the coefficient Y1 is usually 0.30 or less, preferably 0.25 or less, more preferably less than 0.25, further preferably 0.2 or less, even more preferably 0.20 or less, even more preferably 0.15 or less, and particularly preferably 0.10 or less.

[0230] As a preferred range, in formula [1], it is preferably 0.02≤Y1≤0.30, more preferably 0.02≤Y1≤0.25, even more preferably 0.025≤Y1<0.25, and even more preferably 0.03≤Y1≤0.20.

[0231] Y1 represents the relative value with respect to M1+M2+D1+D2+T1+T2+Q=1.

[0232] <Coefficient Y2>

[0233] Y2 is an organic group (O) in organopolysiloxanes containing a polymeric alkenyl group bonded to silicon via an oxygen atom. 1 / 2 R 6 The content ratio of Y2 is specified. Y2 is 0 or a positive value. Preferably, Y2 > 0.25, more preferably Y2 > 0.30, and even more preferably Y2 > 0.35. If Y2 > 0.25, the compatibility with other resins is improved. Organic groups containing polymerizable alkenyl groups are easily hydrolyzed and detached by water, thus the water absorption rate may sometimes be high. Therefore, it is preferable to use it in a method that is not easily affected by moisture.

[0234] On the other hand, in environments affected by moisture, when Y2 is large, the solidified material is prone to becoming brittle due to moisture. Therefore, Y2 < 0.4 is preferred, Y2 < 0.3 is more preferred, and Y2 < 0.2 is even more preferred. In addition, Y2 of 0 is also preferred.

[0235] Y2 represents the relative value with respect to M1+M2+D1+D2+T1+T2+Q=1.

[0236] <Coefficient M1>

[0237] R without polymerizable alkenyl groups 6 The M unit is not a necessary component of the organopolysiloxane of this embodiment, but it may be included. That is, M1 > 0. By replacing either the alkoxy or silanol group of the organopolysiloxane with an M unit, the inter-stability of the organopolysiloxane can be improved, and its viscosity can be reduced to a lower viscosity. If there are too many M units, the amount of polymerizable alkenyl groups contained in the organopolysiloxane monomer will decrease, which can easily lead to poor curing. Therefore, M1 is usually ≤ 0.6, preferably M1 ≤ 0.55, more preferably M1 ≤ 0.5, and even more preferably M1 ≤ 0.4.

[0238] <coefficient D1+D2>

[0239] As described above, in the organopolysiloxane of the present embodiment, 0 < D1 + D2. That is, since the organopolysiloxane of the present embodiment has a D unit and a soft part is introduced, the cured product obtained from the organopolysiloxane of the present embodiment is not likely to generate cracks during cutting. In particular, for the near-infrared optical waveguide manufactured using the organopolysiloxane of the present embodiment, the end surface roughness generated during cutting becomes smaller and the connection loss becomes lower.

[0240] The value of D1 + D2 is preferably 0.1 < D1 + D2, more preferably 0.20 ≤ D1 + D2, further preferably 0.25 ≤ D1 + D2, and even more preferably 0.30 ≤ D1 + D2. If within this range, the obtained cured film has more excellent toughness and is less likely to generate cracks during cutting.

[0241] Regarding the upper limit of the value of D1 + D2, there is no particular limitation, but it is preferably D1 + D2 ≤ 0.80, more preferably D1 + D2 ≤ 0.75, and further preferably D1 + D2 ≤ 0.70. If within this range, the proportion of the flexible component contained in the organopolysiloxane is appropriate, and a cured product maintaining heat resistance can be obtained.

[0242] As described above, the value of D1 + D2 is preferably 0.1 < D1 + D2 ≤ 0.80, more preferably 0.20 ≤ D1 + D2 ≤ 0.80, further preferably 0.25 ≤ D1 + D2 ≤ 0.75, and even more preferably 0.30 ≤ D1 + D2 ≤ 0.70.

[0243] The D unit structure that does not have a polymerizable vinyl group and does not become a crosslinking point has a higher effect of imparting toughness. Therefore, within the range of the above D1 + D2 value, D2 = 0 is also possible. In addition, from the same perspective, it is also preferably 0 < D1, more preferably 0.1 < D1, further preferably 0.20 ≤ D1, even more preferably 0.25 ≤ D1, and particularly preferably 0.30 ≤ D1. There is no particular limitation on the upper limit of D1, but it is preferably D1 ≤ 0.80, more preferably D1 ≤ 0.75, and further preferably D1 ≤ 0.70.

[0244] <Coefficient T1>

[0245] In the organopolysiloxane of the present embodiment, the T unit that does not have a polymerizable vinyl group is not an essential constituent, but by containing this unit, the compatibility with other components added to the resin composition containing the organopolysiloxane can be improved. That is, T1 can be 0. When T1 > 0, it is preferably T1 ≥ 0.01, more preferably T1 ≥ 0.05, and further preferably T1 ≥ 0.1.

[0246] On the other hand, if the content ratio of the T unit without a polymerizable vinyl group is too high, poor curing is likely to occur due to the steric hindrance of the introduced organic group. Therefore, the content ratio T1 of the T unit without a polymerizable vinyl group is preferably T1 ≤ 0.5, more preferably T1 ≤ 0.4, and further preferably T1 ≤ 0.3.

[0247] <Coefficient Q>

[0248] In the organopolysiloxane of the present embodiment, the Q unit is not an essential constituent, but is the form in which silicon is most oxidized. By being included in the structure of the organopolysiloxane, the heat resistance of the cured product can be improved. The Q unit is also contained in quartz. By using the resin composition of the organopolysiloxane having a Q unit described later, a cured product having a refractive index close to that of the core material of a near-infrared single-mode quartz fiber can also be obtained. Q representing the content ratio of the Q unit can be 0 or can be 0 or more, that is, Q ≥ 0. The coefficient Q is preferably Q ≥ 0.04, more preferably Q ≥ 0.10, further preferably Q ≥ 0.15, and even more preferably Q ≥ 0.20.

[0249] On the other hand, when there are too many Q units, it will become solid or the viscosity will increase, and there is a tendency for the operability to decrease. Therefore, usually Q ≤ 0.65, preferably Q ≤ 0.6, more preferably Q ≤ 0.45, and further preferably Q ≤ 0.40.

[0250] As described above, each coefficient in the above formula [1] is preferably 0.10 ≤ M2 + D2 + T2 ≤ 0.75, 0.02 ≤ Y1 ≤ 0.25, Y2 < 0.4, M1 ≤ 0.6, 0.1 < D1 + D2 ≤ 0.80, T1 ≤ 0.5, Q ≤ 0.65; more preferably 0.10 ≤ M2 + D2 + T2 ≤ 0.75, 0.02 ≤ Y1 ≤ 0.25, Y2 < 0.4, M1 ≤ 0.6, 0.20 ≤ D1 + D2 ≤ 0.80, T1 ≤ 0.5, Q ≤ 0.65; further preferably 0.12 ≤ M2 + D2 + T2 ≤ 0.60, 0.025 ≤ Y1 ≤ 0.25, Y2 < 0.3, M1 ≤ 0.55, 0.25 ≤ D1 + D2 ≤ 0.75, T1 ≤ 0.4, Q ≤ 0.6; even more preferably 0.15 ≤ M2 + D2 + T2 ≤ 0.55, 0.03 ≤ Y1 ≤ 0.20, Y2 < 0.2, M1 ≤ 0.4, 0.30 ≤ D1 + D2 ≤ 0.70, T1 ≤ 0.3, Q ≤ 0.45.

[0251] <R 6 >

[0252] In the present embodiment, R 6This refers to an organic group containing a polymerizable alkenyl group. Specifically, groups having acryloyl, methacryloyl, vinyl, styrene, etc., can be listed. In this embodiment, the organopolysiloxane requires that the proportion of aromatic groups among all groups bonded to silicon atoms be less than 20 mol%, therefore R... 6 Preferably, it is a group having a polymerizable alkenyl group and no aromatic group. R 6 More preferably, a molecule has at least one functional group selected from the group represented by the following formulas [2] to [5].

[0253] [Chemical Formula 4]

[0254]

[0255] (In the above formula, * represents a bond).

[0256] A further preferred option is R 6 A molecule has at least one functional group selected from the group consisting of acryloyloxypropyl, acryloyloxyoctyl, methacryloyloxypropyl, and methacryloyloxyoctyl, wherein, particularly preferably, a molecule has acryloyloxypropyl and / or methacryloyloxypropyl.

[0257] In formulas [3] and [5] above, X is a divalent organic group, optionally comprising a branched structure and / or a cyclic structure. In addition to carbon and hydrogen, X optionally comprises at least one element selected from the group consisting of oxygen, nitrogen, phosphorus, sulfur, and halogens. When X is bonded to a silicon atom, the atom at the end of X and directly bonded to silicon is a carbon atom. When X is bonded to an oxygen atom directly bonded to silicon, the atom at the end of X and directly bonded to the oxygen atom is a carbon atom. For example, a divalent branched structure optionally comprising 1 to 20 carbon atoms, a hydrocarbon group with a non-aromatic cyclic structure, or a group derived from a polyalkylene glycol are preferably used as the group represented by X.

[0258] In this invention, the individual units constituting the M unit, D unit, and T unit do not necessarily have to be completely identical. For example, in the unit (R) of coefficient M1... 1 R 2 R 3 SiO 1 / 2 In, for example, it can also have a certain R. 1 For hydrogen atoms, a certain R 1 For different structures like methyl. This is for other R 2 ~R 10 X is also common to unit (O). 1 / 2 R 11 ), (O 1 / 2 R 6 R in ) 11 R6 They are also common to each other.

[0259] <R 1 ~R 5 R 7 ~R 11 >

[0260] R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups composed of organic groups, reactive functional groups, and hydrogen atoms.

[0261] In R 1 ~R 5 R 7 ~R 11 When the group is an organic group, it is preferably an organic group having 1 to 20 carbon atoms. Specifically, it is preferably an alkyl group such as methyl, ethyl, propyl, isopropyl, n-butyl, sec-butyl, tert-butyl, octyl, cyclohexyl; or a polyether group such as furanyl or polyalkylene glycol, and more preferably methyl.

[0262] For example, R located in the coefficient D1 part 7 R 8 Preferably, each is an alkyl group having 1 to 20 carbon atoms. This is achieved by making R, located in the coefficient D1 portion... 7 R 8 It is an alkyl group with 1 to 20 carbon atoms, the D unit is non-aromatic, and the steric hindrance is small. Therefore, it is easy to adjust the refractive index of the cured product to the desired range and improve the toughness of the cured product, thus suppressing the bonding loss.

[0263] In R 1 ~R 5 R 7 ~R 11 When the functional group is reactive, it is preferably a hydrogen atom, a hydroxyl group (such as an alcohol), a carboxyl group, an aldehyde group, or an epoxy group. In this scheme, R... 1 ~R 3 R 7 R 8 R 10 It does not contain polymerizable alkenyl groups as reactive functional groups. This is because, for example, in R... 1 ~R 3 In the case of organic groups containing polymeric alkenyl groups, it is impossible to distinguish between the coefficient M1 part and the coefficient M2 part, hence this stipulation.

[0264] On the other hand, even R located in the coefficient M2 part 4 R 5For organic groups containing polymeric alkenyl groups, this problem does not arise, and therefore this limitation does not apply. For the coefficients D1 and T1, for the same reason, in this scheme, R... 7 R 8 R 10 It is defined as not containing polymerizable alkenyl groups.

[0265] As described above, in the organopolysiloxane represented by formula [1] in this embodiment, the proportion of aromatic groups in the total number of groups bonded to silicon atoms is 20 mol% or less. That is, R is required. 1 ~R 11 In the total, the proportion of aromatic groups is 20 mol% or less. Here, aromatic groups refer to aromatic structures including benzene rings, aromatic polycyclic rings, aromatic heterocyclic rings, etc., optionally including substituent structures, alkylene structures, and salt structures, and where silicon atoms are optionally not directly bonded to the aromatic structures. In this embodiment, if the organopolysiloxane contains too many aromatic structures, the resulting cured product becomes brittle due to the rigidity of the aromatic structures. The R in the organopolysiloxane... 1 ~R 11 The proportion of aromatic groups in the total is preferably 15 mol% or less, more preferably 10 mol% or less, even more preferably 5 mol% or less, and even more preferably 1 mol% or less.

[0266] In this embodiment, the organopolysiloxane represented by formula [1], as described above, can take the form of having aromatic groups or not having aromatic groups at all. In the case where the organopolysiloxane has aromatic groups, in R... 1 ~R 11 The lower limit of the total is not limited as long as it does not impair the effect of the present invention; for example, it can be 0.01 mol% or 0.1 mol%. According to one aspect of the present invention, it is also preferred that the organopolysiloxane completely lacks aromatic groups bonded to silicon atoms, that is, the R in the organopolysiloxane... 1 ~R 11 It does not contain aromatic groups. The content of aromatic groups, as described above, can be determined by... 1 H-NMR, 29 Confirmed by Si-NMR.

[0267] In this embodiment, the organopolysiloxane is preferably randomly polymerized from M units (optional), D units, T units, and Q units (optional). For example, a form in which D units and T units do not exist repeatedly is preferred. By randomly polymerizing each unit, the resulting cured product can be easily endowed with toughness.

[0268] Typically, to achieve a sufficient refractive index difference between the core and cladding, organopolysiloxanes suitable for optical waveguides use organopolysiloxanes with aromatic groups directly on silicon atoms in the core. The organopolysiloxane of this embodiment, by having the specific structure described above, possesses the unique effect of being usable as both a core component and a cladding component, even if it does not have aromatic groups directly on silicon atoms.

[0269] The organopolysiloxane of this embodiment may have aromatic groups that are directly bonded to silicon atoms. However, as described above, in order to suppress connection losses when fabricating optical waveguides, the proportion of aromatic groups in the total number of groups bonded to silicon atoms needs to be 20 mol% or less. That is, even if the proportion of aromatic groups is this level, the organopolysiloxane of this embodiment can be used as a core component or a cladding component.

[0270] The organopolysiloxane of this embodiment may also have halogen groups such as fluorine, but it is preferable not to have them. By not having halogen substituents, the refractive index of the cured product obtained from the organopolysiloxane having the above-described specific structure can be stably controlled within the desired range.

[0271] The organopolysiloxanes described above are particularly suitable for near-infrared waveguide applications. Therefore, in another embodiment of the present invention, an organopolysiloxane for near-infrared waveguides is also provided. The various schemes and requirements of the organopolysiloxane for near-infrared waveguides are as described in the organopolysiloxane of the first embodiment.

[0272] Hereinafter, when referred to as "organopolysiloxane", it refers to both organopolysiloxane and organopolysiloxane for near-infrared waveguides.

[0273] <Manufacturing Methods of Organopolysiloxanes>

[0274] The method for manufacturing organopolysiloxanes in this embodiment is not particularly limited as long as it can produce an organopolysiloxane having an organic group containing a polymerizable alkenyl group and a D unit, and the proportion of aromatic groups in the total of all groups bonded to silicon atoms is 20 mol% or less. Among them, it is preferable to obtain an organopolysiloxane represented by the formula [1].

[0275] For example, it can be a method for simultaneously condensing one or more disiloxane compounds, disilazane compounds and their hydrolysates, alkoxysilane compounds or their hydrolysates, or partially hydrolyzed condensates; a method for condensing chlorosilane compounds or their hydrolysates or partially hydrolyzed condensates; a method for ring-opening polymerization of cyclic siloxane compounds; chain polymerization represented by anionic polymerization, or any other manufacturing method, or a combination of multiple manufacturing methods.

[0276] There are no particular limitations on the method of introducing polymeric alkenyl groups. It can be any method, such as condensing one or more alkoxysilane compounds, disiloxane compounds, disilazane compounds or their hydrolysates or partially hydrolyzed condensates with polymeric alkenyl groups, or converting reactive organic groups introduced into organopolysiloxanes into polymeric alkenyl groups through chemical methods. These methods can also be used in combination.

[0277] In this embodiment, examples are given of raw materials that can be used to manufacture organopolysiloxanes by hydrolysis and condensation.

[0278] (M-unit source)

[0279] Examples of M-unit sources include: trimethylsilanol, trimethylmethoxysilane, hexamethyldisiloxane, hexamethyldisilazane, dimethylsilanol, dimethylmethoxysilane, tetramethyldisiloxane, tetramethyldisilazane, dimethylvinylsilanol, dimethylvinylmethoxysilane, 1,3-divinyltetramethyldisiloxane, 1,3-divinyltetramethyldisilazane, dimethyl(meth)acryloyloxypropylsilanol, dimethyl(meth)acryloyloxypropylmethoxysilane, 1,3-di(meth)acryloyloxypropyltetramethyldisiloxane, dimethylglycidoxypropylmethoxysilane. 1,3-Bis(3-glycidoxypropyl)tetramethyldisiloxane, 3-(meth)acryloyloxypropyldimethylsilanol, 3-(meth)acryloyloxypropyldimethylmethoxysilane, 1,3-bis((meth)acryloyloxypropyl)-1,1,3,3-tetramethyldisiloxane, tetramethyldisiloxane, methoxytriphenylsilane, triphenylsilanol, 1,3-diphenyltetramethyldisiloxane, 1,3-diphenyltetramethyldisilazane, dimethylphenylsilanol, dimethylmethoxyphenylsilane, 1,4-bis(dimethylmethoxysilyl)benzene, 1,4-bis(dimethylethoxysilyl)benzene, etc. Among the listed compounds, for compounds containing silanol-related hydroxyl or alkoxy groups, compounds bonded with halogens can be used instead of the silanol-related hydroxyl or alkoxy groups, etc. It should be noted that, based on the above reasons, compounds without aromatic structures are preferred, and hexamethyldisiloxane is particularly preferred.

[0280] (D-cell source)

[0281] Examples of D-unit sources include: dimethyldisilanol, dimethyldimethoxysilane, diphenyldisilanol, diphenyldimethoxysilane, 3-(meth)acryloyloxypropyldimethoxymethylsilane, 3-glycidoxypropylmethyldimethoxysilane, methyldimethoxyphenylsilane, diethoxymethylphenylsilane, methylphenyldisilanol, 1,4-bis(methyldimethoxysilyl)benzene, 1,4-bis(methyldiethoxysilyl)benzene, and dimethoxy(methyl)(3,3,3-trifluoropropyl)silane. The groups of compounds with halogenated bonds, such as those listed above, that replace the silanol hydroxyl or alkoxy groups, and their polymers, can be used. It should be noted that, for the above reasons, compounds without aromatic structures are preferred, and dimethyldimethoxysilane is particularly preferred.

[0282] (T-unit source)

[0283] Examples of T-unit sources include: trimethoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, propyltrimethoxysilane, hexyltrimethoxysilane, decyltrimethoxysilane, etc., modified with C1-C20 long-chain alkoxy groups; vinyltrimethoxysilane; phenyltrimethoxysilane; 3,3,3-trifluoropropyltrimethoxysilane; 3-(meth)acryloyloxypropyltrimethoxysilane; 8-(meth)acryloyloxyoctyltrimethoxysilane; 1,4-bis(trimethoxysilyl)benzene; p-styryltrimethoxysilane; 3-glycidoxypropyltrimethoxysilane; 8-glycidoxyoctyltrimethoxysilane; and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane. In addition to these methoxysilane compounds, alkoxysilane compounds such as ethoxysilanes, silanol compounds, chlorosilane compounds, hydrogenated silylsilane compounds, and their polymers can also be used. It should be noted that, for the reasons stated above, compounds without aromatic structures are preferred, and 3-methacryloyloxypropyltrimethoxysilane, 8-methacryloyloxyoctyltrimethoxysilane, 3-acryloyloxypropyltrimethoxysilane, and 8-acryloyloxyoctyltrimethoxysilane are particularly preferred.

[0284] (Q-cell source)

[0285] Examples of Q-unit sources include: tetrachlorosilane, tetramethoxysilane, tetraethoxysilane, tetraisopropoxysilane, tetrapropoxysilane, tetrabutoxysilane, tetrapentyloxysilane, tetraphenoxysilane, trimethoxymonoethoxysilane, dimethoxydiethoxysilane, triethoxymonomethoxysilane, trimethoxymonopropoxysilane, monomethoxytributoxysilane, monomethoxytripentyloxysilane, monomethoxytriphenoxysilane, dimethoxydipropoxysilane, tripropoxymonomethoxysilane, trimethoxymonobutoxysilane, dimethoxymonopropoxysilane, triethoxymonopropoxysilane, diethoxymonopropoxysilane, diethoxymonopropoxysilane, tributoxymonopropoxysilane, dimethoxymonopropoxysilane, dimethoxymonopropoxysilane, dimethoxymonoethoxysilane. The oligomers include alkoxysilanes such as alkylbutoxysilanes, diethoxymonomethoxymonobutoxysilanes, diethoxymonopropoxymonobutoxysilanes, diethoxymonomethoxymonoethoxysilanes, diethoxymonomethoxymonobutoxysilanes, diethoxymonoethoxymonobutoxysilanes, diethoxymonomethoxymonopropoxysilanes, and monomethoxymonoethoxymonopropoxymonobutoxysilanes, as well as aryloxysilanes; methyl silicate MS51, MS56, MS57, and MS60 manufactured by Mitsubishi Chemical Corporation are examples of tetramethoxysilane oligomers; ethyl silicate ES40 and ES48 manufactured by Tama Chemical Industries, Ltd. are examples of tetraethoxysilane oligomers. methyl silicate MS51 is particularly preferred.

[0286] The above-mentioned M, D, T, and Q unit sources can be used individually or in combination of two or more.

[0287] As catalysts for the hydrolysis and condensation of these silicon raw materials, acid catalysts, base catalysts, or inorganic salts can be used. In particular, acid catalysts are preferred.

[0288] Examples of acid catalysts include hydrochloric acid, sulfuric acid, trifluoroacetic acid, acetic acid, methacrylic acid, and acrylic acid. In particular, hydrochloric acid is preferred.

[0289] Examples of alkaline catalysts include: ammonia, hexamethyldisilazane, triethylamine, tetraethylammonium hydroxide, diazabicycloundecene, potassium hydroxide, sodium hydroxide, barium hydroxide, potassium carbonate, and sodium carbonate. Potassium hydroxide is particularly preferred.

[0290] Examples of inorganic salts include: sodium chloride, potassium chloride, magnesium chloride, calcium chloride, sodium bromide, potassium bromide, magnesium bromide, and calcium bromide. Sodium chloride is particularly preferred.

[0291] Examples of solvents used in hydrolysis and condensation include tetrahydrofuran, toluene, methanol, ethanol, isopropanol, hexane, and heptane. Tetrahydrofuran is particularly preferred. Depending on the solubility of the product, two or more solvents may be used, with a mixture of toluene and methanol, or a mixture of tetrahydrofuran and methanol, being particularly preferred.

[0292] The alkoxy or silanol groups remaining after hydrolysis and condensation can be replaced with organic acids or alcohols as needed. Examples of organic acids include acetic acid, acrylic acid, and methacrylic acid; examples of alcohols include methanol, ethanol, propanol, butanol, pentanol, hexanol, heptanol, and their structural isomers, as alcohols without polymerizable alkenyl groups; and 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate can be used as alcohols containing polymerizable alkenyl groups, with 2-hydroxyethyl acrylate and 2-hydroxyethyl methacrylate being preferred from a stability point of view.

[0293] When the organopolysiloxane has a rigid structure like a completely cage-like silsesquioxane, the cured product will harden and become brittle. Therefore, a non-cage-like structure is preferred. As long as it is not a completely cage-like silsesquioxane, for example, a random structure or a trapezoidal structure as an advanced structure can be included without impairing the effects of the present invention.

[0294] <Water>

[0295] The amount of water used for hydrolysis is preferably 0.5 equivalents or more, more preferably 0.8 equivalents or more, and even more preferably 1.1 equivalents or more, relative to the total amount of alkoxy groups contained in the MDTQ unit source. There are no particular limitations on the type of water used; it can be water contained in commercially available hydrochloric acid, or water purified by distillation or ion exchange resin.

[0296] [Resin compositions containing organopolysiloxanes]

[0297] The resin composition containing organopolysiloxane of this embodiment is used to form a near-infrared light waveguide. In addition to the organopolysiloxane described above, the composition may also contain monofunctional polymerizable alkenyl compounds, polyfunctional polymerizable alkenyl compounds and / or alkenyl polymers, etc., within a range that does not impair the properties of the cured product obtained from the composition.

[0298] Furthermore, in order to facilitate the polymerization and easy curing of organopolysiloxanes and polymerizable alkenyl compounds, a polymerization initiator may be included. Alternatively, the organopolysiloxane or the resin composition containing the organopolysiloxane may be cured by electron beam irradiation or the like without using a polymerization initiator. However, since curing requires a large amount of energy, in the preferred embodiment of this invention, the resin composition containing the organopolysiloxane contains at least a polymerization initiator in addition to the aforementioned organopolysiloxane.

[0299] The composition of this embodiment may contain, within a range that does not impair the properties of the cured product described later, chain transfer agents, antioxidants, ultraviolet absorbers, light stabilizers, leveling agents, rheology modifiers, silane coupling agents and other adhesive aids, dyes, defoamers, sensitizers and other components, solvents, etc.

[0300] This resin composition containing organopolysiloxane (curable composition) is particularly suitable for near-infrared waveguide applications. Therefore, in another embodiment of the present invention, a resin composition containing organopolysiloxane for near-infrared waveguides is also provided. The various schemes and elements of the resin composition containing organopolysiloxane for near-infrared waveguides are the same as those described in the above-described resin composition containing organopolysiloxane.

[0301] Hereinafter, when referred to as "a resin composition containing an organopolysiloxane", it refers to both a resin composition containing an organopolysiloxane and a resin composition containing an organopolysiloxane for near-infrared waveguides.

[0302] The following describes the components optionally included in the resin composition containing organopolysiloxane.

[0303] <Monofunctional polymeric alkenyl compounds>

[0304] Specific examples of monofunctional polymeric alkenyl compounds include carboxyl esters such as (meth)acrylic acid, 2-(meth)acryloyloxyethyl succinate, 2-(meth)acryloyloxyethyl maleate, 2-(meth)acryloyloxyethyl phthalate, and 2-(meth)acryloyloxyethyl hexahydrophthalate.

[0305] 2-Hydroxyethyl methacrylate, 2-Hydroxypropyl methacrylate, 2-Hydroxybutyl methacrylate, 4-Hydroxybutyl methacrylate, 6-Hydroxyhexyl methacrylate and other hydroxyl-containing methacrylates;

[0306] Methyl methacrylate, ethyl methacrylate, propyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, tert-butyl methacrylate, pentyl methacrylate, heptyl methacrylate, 2-ethylhexyl methacrylate, n-octyl methacrylate, isooctyl methacrylate, n-nonyl methacrylate, isononyl methacrylate, decyl methacrylate, lauryl methacrylate, tridecyl methacrylate, stearyl methacrylate, and other alkyl methacrylates.

[0307] Cyclohexyl methacrylate, dicyclopentenyl methacrylate, 2-dicyclopentenoxyethyl methacrylate, isobornyl methacrylate, dicyclopentenyl methacrylate, adamantane methacrylate, 4-tert-butylcyclohexyl methacrylate, and other methacrylates containing alicyclic structures;

[0308] (Meth)acrylates containing aromatic ring structures include phenyl methacrylate, benzyl methacrylate, phenoxyethyl methacrylate, diethylene glycol (meth)acrylate, phenoxy polyethylene glycol (meth)acrylate, nonylphenoxy polyethylene glycol (meth)acrylate, phenoxy polypropylene glycol (meth)acrylate, phenyl methacrylate, phenyl phenoxyethyl methacrylate, phenoxybenzyl methacrylate, phenyl benzyl methacrylate, naphthyl methacrylate, and (1-naphthyl)methyl methacrylate.

[0309] Tetrahydrofurfuryl (meth)acrylate, glycidyl (meth)acrylate, methacryloylmorpholine, and other (meth)acrylates containing heterocyclic structures;

[0310] (Meth)acrylate methoxyethyl ester, (meth)acrylate ethoxyethyl ester, (meth)acrylate butoxyethyl ester, and other (meth)acrylate alkoxy esters;

[0311] 3-(meth)acryloyloxypropyltrimethoxysilane, 3-(meth)acryloyloxypropyltriethoxysilane, 2-(meth)acryloyloxyethyl acid phosphate, trifluoroethyl (meth)acrylate and heptadecafluorodecyl (meth)acrylate, 2-(meth)acryloyloxyethyl isocyanate;

[0312] Styrene, α-methylstyrene, 2-vinylpyridine, 4-vinylpyridine, 1,1-diphenylethylene and their aromatic cyclic hydrogen-substituted derivatives, and other styrene derivatives;

[0313] Vinyl compounds such as vinyl acetate, vinyl octanoate, vinyl decanoate, vinyl hexanoate, acrylonitrile, and vinyl benzoate.

[0314] Since the refractive index of the cured material increases and it also becomes more brittle, it is preferable to use a material that does not contain aromatic structures.

[0315] <Multifunctional polymeric alkenyl compounds>

[0316] Specific examples of multifunctional polymerizable alkenyl compounds include: ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, and other alkylene glycol di(meth)acrylates;

[0317] Polyalkylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, polybutylene glycol di(meth)acrylate, and other polyalkylene glycol di(meth)acrylates;

[0318] Cyclohexanediethanol di(meth)acrylate, tricyclodecanediethanol di(meth)acrylate, ethoxylated hydrogenated bisphenol A di(meth)acrylate, propoxylated hydrogenated bisphenol A di(meth)acrylate, adamantanediol di(meth)acrylate, and other di(meth)acrylates containing alicyclic structures;

[0319] Difunctional (meth)acrylates such as polycarbonate diol di(meth)acrylate, polyester diol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, propoxylated bisphenol A di(meth)acrylate, 9,9-bis(4-acryloyloxyethoxyphenyl)fluorene, and polyurethane di(meth)acrylate.

[0320] Trifunctional (meth)acrylates include trimethylolpropane tri(meth)acrylate, ethoxylated isocyanurate tri(meth)acrylate, and ε-caprolactone-modified tri((meth)acryloyloxyethyl)isocyanurate.

[0321] Tetrafunctional (meth)acrylates such as bis(trimethylolpropane)tetra(meth)acrylate;

[0322] Pentafunctional (meth)acrylates such as dipentaerythritol penta(meth)acrylate;

[0323] Dipentaerythritol hexa(meth)acrylate and other hexafunctional (meth)acrylates and other multifunctional monomers;

[0324] 1,4-Divinylbenzene, 1,3-Divinylbenzene, etc.

[0325] Since the refractive index of the cured material increases and it also becomes more brittle, it is preferable to use a material that does not contain aromatic structures.

[0326] <Alkenyl Polymers>

[0327] Alkenyl polymers are polymers containing 50% by mass or more of alkenyl monomer units. In this specification, "unit" refers to a repeating unit constituting the polymer. Alkenyl polymers can be monofunctional or polyfunctional. Furthermore, since the refractive index of the cured product increases and it also becomes more brittle, it is preferable that it does not contain aromatic structures.

[0328] Alkenyl polymers can contain one or more alkenyl monomer units.

[0329] The polymerization method used to obtain the alkenyl polymer is not particularly limited. For example, polymerization can be carried out by known methods such as solution polymerization, suspension polymerization, emulsion polymerization, and bulk polymerization. In this invention, suspension polymerization is preferred from the perspective of controlling the polymerization reaction and the relative ease of separating the resulting polymer.

[0330] As an alkenyl polymer, products modified by introducing functional groups containing double bonds, such as (meth)acryloyl or vinyl groups, into the side chains can also be used. Examples of chemical modification methods include the reaction of carboxyl groups with glycidyl groups and the reaction of hydroxyl groups with isocyanate groups.

[0331] When using the reaction of carboxyl and glycidyl groups as a chemical modification method, for example, the following method can be listed: an alkenyl polymer containing alkenyl monomer units with carboxyl groups is produced, and then the resulting alkenyl polymer is reacted with a compound having glycidyl groups and double bonds, such as glycidyl (meth)acrylate.

[0332] In reactions between alkenyl polymers containing carboxyl-containing alkenyl monomer units and compounds having glycidyl groups and double bonds, a reaction catalyst is preferably used to shorten the reaction time. Examples of reaction catalysts include quaternary ammonium salts such as tetrabutylammonium bromide, quaternary phosphonium salts such as ethyltriphenylphosphonium bromide, and phosphine compounds such as triphenylphosphine. Quaternary ammonium salts are particularly preferred from the viewpoint that the resin composition containing organopolysiloxanes in this embodiment is less prone to coloring.

[0333] The weight-average molecular weight (Mw) of the alkenyl polymer is preferably 5,000 to 500,000, more preferably 10,000 to 200,000, and even more preferably 20,000 to 150,000. If the weight-average molecular weight is 5,000 or more, the strength of the cured product becomes good. If it is 500,000 or less, the viscosity of the resin composition containing organopolysiloxane in this embodiment is reduced, thus resulting in good workability.

[0334] <Polymerization initiator>

[0335] Examples of polymerization initiators include photopolymerization initiators, thermal polymerization initiators, and peroxides used in redox polymerization. The type of polymerization initiator can be appropriately selected based on the polymerization method.

[0336] (Photopolymerization initiator)

[0337] Photopolymerization initiators are free radical polymerization initiators used in photopolymerization. Specific examples of photopolymerization initiators include: benzophenone, 4-methylbenzophenone, 2,4,6-trimethylbenzophenone, methyl 2-benzoylbenzoate, 4-phenylbenzophenone, and other benzophenone-type compounds; anthraquinone-type compounds such as tert-butylanthraquinone and 2-ethylanthraquinone; 2-hydroxy-2-methyl-1-phenylpropane-1-one, oligomeric {2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone}, benzyl dimethyl... Alkyl ketal compounds such as 1-hydroxycyclohexylphenyl ketone, benzoin methyl ether, 2-methyl-[4-(methylthio)phenyl]-2-morpholino-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropanoyl)benzyl]phenyl}-2-methylpropane-1-one; thioxanthone compounds such as 2-benzyl-2-dimethylamino-4'-morpholinobutyrophenyl, diethylthioxanthone, and isopropylthioxanthone; 2,4,6-trimethylbenzyl... Acylphosphine oxides, such as bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; phenylglyoxal esters, such as methyl phenylglyoxalate; N-acetoxy-N-{4-acetoxyimino-4-[9-ethyl-6-(o-tolyl)-9H-carbazole-3-yl]but-2-yl}acetamide, N-acetyl... Oxime esters such as oxy-N-{3-(acetoxyimino)-3-[9-ethyl-6-(1-naphthoyl)-9H-carbazole-3-yl]-1-methylpropyl}acetamide, methyl 4-acetoxyimino-5-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-5-oxovalerate, and methyl 4-acetoxyimino-5-oxo-5-(4-(phenylthio)phenyl)valerate; and combinations thereof.

[0338] Among these, alkyl phenyl ketone compounds are preferred for suppressing coloration of the cured product, and 2-hydroxy-2-methyl-1-phenylpropane-1-one or 1-hydroxycyclohexylphenyl ketone are more preferred. Acylphosphine oxide compounds are preferred for facilitating thorough curing of the cured product to its interior, and 2,4,6-trimethylbenzoyl diphenylphosphine oxide is more preferred for suppressing coloration of the cured product. Furthermore, methyl bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and methyl 4-acetoxyimino-5-oxo-5-(4-(phenylthio)phenyl)valerate are more preferred, as they exhibit higher photosensitivity to longer wavelengths of light. 2-benzyl-2-dimethylamino-4'-morpholinylbutyrophenylene oxide is preferred for its high reactivity to light around 365 nm. These photopolymerization initiators can be used alone or in combination of two or more.

[0339] In this embodiment, when a cured product is obtained by photopolymerization of the above-mentioned curable resin composition containing organopolysiloxane (hereinafter sometimes simply referred to as "curable resin composition"), the wavelength of the light irradiating the curable resin composition is not particularly limited, but ultraviolet light with a wavelength of 200 to 500 nm is preferred. Specific examples of ultraviolet light sources include ultra-high pressure mercury lamps, high pressure mercury lamps, metal halide lamps, high-power metal halide lamps, UV-LED lamps, chemical lamps, and black light lamps.

[0340] After photopolymerization of the curable resin composition, post-curing can be further performed. Post-curing reduces the amount of unreacted polymeric alkenes remaining in the cured product, thereby further improving the strength of the cured product. Examples of post-curing conditions include temperatures of 50°C to 200°C for tens of seconds to 60 minutes, or temperatures of 80°C to 150°C for tens of seconds to 60 minutes.

[0341] (Thermal polymerization initiator)

[0342] Thermal polymerization initiators are free radical polymerization initiators used for thermal polymerization. Examples of thermal polymerization initiators include organic peroxides and azo compounds.

[0343] Specific examples of organic peroxides include: ketone peroxides such as methyl ethyl ketone peroxide; ketal peroxides such as 1,1-di(tert-hexylperoxide)-3,3,5-trimethylcyclohexane, 1,1-di(tert-hexylperoxide)cyclohexane, and 1,1-di(tert-butylperoxide)cyclohexane; hydroperoxides such as 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, and p-menthane hydroperoxide; and diisopropylphenyl peroxide. Dialkyl peroxides such as di-tert-butyl peroxide; dilauroyl peroxide, dibenzoyl peroxide, and other dialkyl peroxides; dicarbonates such as di(4-tert-butylcyclohexyl) peroxide and di(2-ethylhexyl) peroxide; and peroxide esters such as tert-butyl peroxide-2-ethylhexanoate, tert-hexyl peroxide-isopropyl monocarbonate, tert-butyl peroxide-benzoate, and 1,1,3,3-tetramethylbutyl peroxide-2-ethylhexanoate.

[0344] Specific examples of azo compounds include: 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 2,2'-azobis(2,4-dimethylpentanitrile), 1,1'-azobis-1-cyclohexanecarboxylonitrile, dimethyl 2,2'-azobisisobutyrate, 4,4'-azobis-4-cyanopentanoic acid, and 2,2'-azobis-(2-amidinylpropane) dihydrochloride, etc.

[0345] These thermal polymerization initiators can be used alone or in combination of two or more. Organic peroxides are preferred as thermal polymerization initiators because they minimize the generation of bubbles in the cured product. Considering the balance between the curing time and pot life of the curable resin composition, the 10-hour half-life temperature of the organic peroxide is preferably 35–80°C, more preferably 40–75°C, and even more preferably 45–70°C. If the 10-hour half-life temperature is 35°C or higher, the curable resin composition is less prone to gelation at room temperature, resulting in a good pot life. On the other hand, if the 10-hour half-life temperature is below 80°C, the curing time of the curable resin composition can be shortened.

[0346] Examples of such organic peroxides include 1,1,3,3-tetramethylbutyl peroxide-2-ethylhexanoate, tert-butyl peroxide-2-ethylhexanoate, and di(4-tert-butylcyclohexyl) peroxide dicarbonate. Commercially available products of 1,1,3,3-tetramethylbutyl peroxide-2-ethylhexanoate include PEROCTA O (trade name, manufactured by Nippon Oil Co., Ltd., 10-hour half-life temperature: 65.3°C). Commercially available products of tert-butyl peroxide-2-ethylhexanoate include PERBUTYL O (trade name, manufactured by Nippon Oil Co., Ltd., 10-hour half-life temperature: 72.1°C). Commercially available products of di(4-tert-butylcyclohexyl) peroxide dicarbonate include PEROYL TCP (trade name, manufactured by Nippon Oil Co., Ltd., 10-hour half-life temperature: 40.8°C).

[0347] When curing a curable resin composition by thermal polymerization to obtain a cured product, there are no particular limitations on the curing conditions. However, from the viewpoint of easily obtaining a resin for optical components with suppressed coloration, the curing temperature is preferably 40 to 200°C, more preferably 60 to 150°C. The curing time (heating time) varies depending on the curing temperature, and is preferably 1 to 120 minutes, more preferably 1 to 60 minutes.

[0348] Preferably, post-curing is performed after the curable resin composition has been thermally polymerized. Examples of post-curing conditions include a temperature of 50°C to 200°C for tens of seconds to 60 minutes, or a temperature of 80°C to 150°C for tens of seconds to 60 minutes.

[0349] (Redox polymerization)

[0350] Redox polymerization typically uses redox-based polymerization initiators. Redox-based polymerization initiators are polymerization initiators that combine a peroxide with a reducing agent. Examples of peroxides used in redox polymerization include benzoyl peroxide and hydrogen peroxide. These peroxides can be used alone or in combination with two or more. An example of a combination of the above-mentioned peroxides as redox polymerization initiators with a reducing agent is described below.

[0351] (1) Combination of benzoyl peroxide (peroxide) with aromatic tertiary amines (reducing agents) such as N,N-dimethylaniline, N,N-dimethyl-p-toluidine, and N,N-bis(2-hydroxypropyl)-p-toluidine.

[0352] (2) Combination of hydroperoxide (peroxide) and metal soap (reducing agent).

[0353] (3) Combination of hydroperoxide (peroxide) and thiourea (reducing agent).

[0354] When a cured resin composition is cured by redox polymerization to obtain a cured product, curing can be performed at a temperature of 5–40°C by using a redox polymerization initiator. From the viewpoint of reducing the amount of unreacted (meth)acryloyl groups remaining in the obtained optical component resin and further improving the strength of the optical component resin, a curing temperature of 15–40°C is preferred.

[0355] From the viewpoint that the curable resin composition is not prone to gelation and can be handled stably, it is preferable to carry out the curing method in the following order: dissolve the reducing agent in the curable resin composition in advance, and add the peroxide thereto.

[0356] When curing a curable resin composition, it is preferable to cure the composition in a sealed state to suppress curing obstacles caused by oxygen. Examples of sealing methods include embedding the curable resin composition within glass or a PET film.

[0357] <Chain transfer agent>

[0358] When the curing reaction of a curable resin composition is carried out in air, active free radicals are captured as peroxide free radicals due to oxygen, and polymerization is hindered. However, by adding a chain transfer agent that imparts hydrogen, the polymerization hindrance caused by oxygen can be suppressed.

[0359] Examples of chain transfer agents include: methyl mercaptoacetate, methyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, 3-methoxybutyl 3-mercaptopropionate, n-octyl 3-mercaptopropionate, stearyl 3-mercaptopropionate, 1,4-bis(3-mercaptopropionyloxy)butane, 1,4-bis(3-mercaptobutyryloxy)butane, trimethylolethane tris(3-mercaptopropionate), trimethylolethane tris(3-mercaptobutyryloxy), trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetras(3-mercaptopropionate), pentaerythritol tetras(3-mercaptobutyryloxy), dipentaerythritol hexa(3-mercaptopropionate), dipentaerythritol hexa(3-mercaptobutyryloxy), tri[2-(3-mercaptopropionyloxy)ethyl [Isocyanurate, tris[2-(3-mercaptobutyryloxy)ethyl]isocyanurate and other mercaptocarboxylic acid esters; ethanethiol, 2-methylpropane-2-thiol, n-dodecanethiol, 2,3,3,4,4,5-hexamethylhexane-2-thiol (tert-dodecanethiol), ethane-1,2-dithiol, propane-1,3-dithiol, benzylthiol and other alkylthiols; thiophenol, 3-methylthiophenol, 4-methylthiophenol, naphthiophenol, pyridine-2-thiophenol, benzimidazole-2-thiophenol, benzothiazole-2-thiophenol and other aromatic thiophenols; 2-mercaptoethanol, 4-mercapto-1-butanol and other mercaptools; 3-(trimethoxysilyl)propane-1-thiol, 3-(triethoxysilyl)propane-1-thiol and other silane-containing thiols and other thiol compounds.] From the viewpoint of the reactivity and storage stability of the curable composition, secondary thiol compounds are preferred.

[0360] When a chain transfer agent is added, it can be used alone or in combination with two or more. Regarding the amount added, relative to 100 parts by mass of the total polymerizable component, it is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, and even more preferably 0.5 to 10 parts by mass. It should be noted that when two or more chain transfer agents are used in combination, the total amount of chain transfer agent is within the above range.

[0361] Solvent

[0362] The curable resin composition of this embodiment may contain a solvent for the purpose of diluting the organopolysiloxane and other contents. The type of solvent is not particularly limited as long as it does not impair the required physical properties of the cured organopolysiloxane and the curable resin composition. Aromatic hydrocarbons with good solubility (e.g., toluene, xylene, ethyl benzoate, ethylbenzene, benzyl alcohol), ketones (e.g., acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclohexanone, diacetone alcohol), and esters (e.g., methyl acetate, ethyl acetate, butyl acetate, sec-butyl acetate, methoxybutyl acetate, amyl acetate, n-propyl acetate, ethyl lactate, methyl lactate, butyl lactate) can be used. Esters, propylene glycol monomethyl ether acetate, γ-butyrolactone), ethers (e.g., isopropyl ether, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, ethylene glycol monobutyl ether, 1,4-dioxane, methyl tert-butyl ether, tetrahydrofuran), alcohols (e.g., methanol, ethanol, n-propanol, isopropanol, butanol, sec-butanol, tert-butanol, n-pentanol), halogen solvents (e.g., dichloromethane, trichloroethylene, tetrachloroethylene, bromopropane, chloroform), others (e.g., dimethyl sulfoxide, N,N-dimethylformamide, water), etc., may also be used, and two or more solvents may be used.

[0363] The content of the solvent in the curable resin composition is not particularly limited as long as it does not impair the required physical properties of the cured product. However, if it is desirable to suppress volatile components to a small amount and reduce viscosity, it is preferably greater than 0% by mass and less than 25% by mass relative to the total curable resin. Furthermore, if it is desirable to obtain a cured film, it is preferably 75% by mass or more and less than 100% by mass relative to the total organopolysiloxane or curable resin composition.

[0364] (Antioxidants)

[0365] Preferably, the curable resin composition further contains an antioxidant. By including an antioxidant in the curable resin composition, coloring caused by heat, such as heating during soldering of the cured product or heat generated by the device, can be suppressed.

[0366] Specific examples of antioxidants include: 2,6-di-tert-butylphenol, 2,6-di-tert-butyl-p-cresol, octadecyl 3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate, tetra[methylene-3-(3',5'-di-tert-butyl-4'-hydroxyphenyl)propionate]methane, triethylene glycol bis[3-(3-tert-butyl-5-methyl-4-hydroxyphenyl)propionate], and 1,6-hexanediol bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], etc., which are phenolic antioxidants. Antioxidants include: phosphorus-based antioxidants such as triphenyl phosphite, triisodecyl phosphite, tri(tetrazyl) phosphite, tri(2,4-di-tert-butylphenyl) phosphite, and tetrakis(C12-15 alkyl)-4,4'-isopropylidene diphenyl diphosphite; and sulfur-based antioxidants such as dilauryl 3,3'-thiodipropionate, di(tetrazyl) 3,3'-thiodipropionate, dimyristyl 3,3'-thiodipropionate, distearate, and pentaerythritol tetra(β-lauryl thiopropionate). These antioxidants can be used alone or in combination with two or more.

[0367] (Other ingredients)

[0368] The curable resin composition of this embodiment may also include other components such as fillers, curing control agents, and viscosity modifiers. These components may be appropriately included within a range that does not affect the heat resistance and refractive index of the cured product of the organopolysiloxane-containing curable resin composition of this embodiment.

[0369] The resin composition (curable composition) containing organopolysiloxane of this embodiment is particularly suitable for near-infrared waveguide applications. Therefore, in another embodiment of the present invention, an organopolysiloxane composition for near-infrared waveguides is also provided. The various schemes and requirements of the organopolysiloxane composition for near-infrared waveguides are as described above for the organopolysiloxane composition.

[0370] In this specification, when referred to as "organopolysiloxane composition", it refers to both the organopolysiloxane composition and the organopolysiloxane composition for near-infrared waveguides.

[0371] <The solidified product of the first scheme>

[0372] In the first aspect of the present invention (hereinafter, sometimes referred to as the first aspect), a cured product is provided, which is obtained by curing the resin composition containing organic polysiloxane of the first embodiment described above by heat and light.

[0373] The curing conditions for the resin composition containing organopolysiloxane in this embodiment are not particularly limited, and curing can be carried out under conditions commonly used in the curing of organosilicon resins, depending on the type of polymerization initiator, etc.

[0374] <The solidified product of the second option>

[0375] In a second aspect of the present invention (hereinafter, sometimes referred to as this second aspect), a cured product is provided, comprising a cross-linked structure derived from an organic group containing a polymeric alkenyl group, and formed from SiO2. 2 / 2 The siloxane unit (D unit) is represented, and its refractive index at a wavelength of 1300 nm is greater than 1.400 and less than 1.500.

[0376] For multimode applications, near-infrared waveguides with a large refractive index difference between the core and cladding have been reported, including near-infrared waveguides containing organopolysiloxane curing materials with aromatic groups and a refractive index greater than 1.5 in the near-infrared wavelength region. However, the inventors have discovered that when the refractive index of the cured material, formed by curing a resin composition containing a specific organopolysiloxane, is controlled to be between 1.400 and 1.500 in the near-infrared wavelength region, the connection loss of the near-infrared waveguide decreases. It should be noted that in this second embodiment, the "transmission loss" and "connection loss" of the waveguide also refer to the definitions above.

[0377] Although not bound by a specific theory, the effect of the refractive index of the solidified material used as a near-infrared waveguide can be considered as follows.

[0378] That is, when the refractive index of the cured product obtained by curing a composition containing organopolysiloxane is 1.400 to 1.500 in the near-infrared wavelength region, the cured product contains fewer rigid structures derived from aromatic structures, etc., and is tough and less prone to cracking. It is believed that the end face of the optical waveguide containing this cured product is less likely to become rough during cutting. It is believed that by suppressing the roughness of the waveguide end face, light scattering is also suppressed, and connection loss is reduced.

[0379] The cured material in this second embodiment has a refractive index of 1.400–1.500 in the near-infrared wavelength region. Therefore, the cured material contains fewer rigid structures derived from aromatic structures, etc. Light scattering is suppressed by suppressing the roughness of the optical waveguide end face containing the cured material, thereby suppressing connection loss. In addition, the refractive index difference between the optical waveguide with the core containing the cured material and the core of the near-infrared single-mode silica fiber is reduced, and interface reflection is suppressed, which also helps to reduce connection loss.

[0380] In single-mode optical waveguide applications, the refractive index difference between the core and cladding of the waveguide needs to be approximately 0.01 to 0.02. In this application, the refractive index of the cladding is required to be approximately 1.4 to 1.5 relative to the core, which has a refractive index of 1.4 to 1.5. Therefore, the cured material of this second embodiment is also suitable as a cladding material for a core with a refractive index of 1.4 to 1.5 in single-mode optical waveguide applications.

[0381] In this second embodiment, the refractive index of the cured material is 1.400 to 1.500 at 589 nm and 1300 nm, preferably 1.420 to 1.490, and more preferably 1.430 to 1.480.

[0382] The cured product of this second embodiment is preferably obtained by curing the organopolysiloxane-containing resin composition of the first embodiment described above. The organopolysiloxane, the method for manufacturing the organopolysiloxane, the resin composition (curable resin composition) containing organopolysiloxane including monofunctional polymerizable alkenyl compounds, polyfunctional polymerizable alkenyl compounds, and / or alkenyl polymers, and other components, and the curing conditions of the composition are listed above. Preferred cases and preferred combinations also apply to this second embodiment.

[0383] <Properties of cured products>

[0384] The cured products of the first and second embodiments (hereinafter, sometimes referred to as the "two embodiments") contain organic groups having polymerizable alkenyl groups and are composed of SiO2. 2 / 2 A cured product formed by curing an organopolysiloxane resin composition containing an organopolysiloxane, wherein the indicated siloxane unit (D unit) and the proportion of aromatic groups in all groups bonded to silicon atoms is 20 mol% or less, as described above, has the following characteristics.

[0385] Heat resistance

[0386] A cured product with high reflow soldering resistance can be obtained, preferably with a 5% weight loss temperature of 330°C or higher, more preferably 333°C or higher, and even more preferably 340°C or higher. High reflow soldering resistance also prevents increased optical transmission loss due to high-temperature solder reflow when mounted on electronic components, etc. The weight loss temperature is determined according to the method described in the examples below.

[0387] Refractive index

[0388] When used as the core material and / or cladding material of a near-infrared waveguide, when the refractive index of the cured material is in the range of 1.400–1.500, preferably 1.420–1.490, and more preferably 1.430–1.480 at 589 nm and 1300 nm, the cured material contains a low content of rigid aromatic groups. The toughness derived from the D-units contained in the cured material is utilized, which can suppress end-face roughness during waveguide cutting, resulting in less light scattering at the end face and lower connection loss. Furthermore, when the refractive index of the near-infrared waveguide core material is within the above range, the refractive index difference with that of the single-mode silica fiber core becomes smaller, suppressing interface reflection and thus contributing to reduced connection loss.

[0389] [Near-infrared optical waveguides and near-infrared light transmission components]

[0390] In another embodiment of the present invention, a near-infrared light waveguide comprising the two schemes described above is provided, and a near-infrared light transmission member having at least the near-infrared light waveguide is provided.

[0391] The near-infrared waveguide of the present invention comprises at least a core and / or cladding formed from two types of cured materials, and may also comprise a substrate. To further suppress end-face roughness during cutting, it is preferable that both the core and cladding are formed from the cured materials of the two types. In addition to the near-infrared waveguide, the near-infrared light transmission component of this embodiment may also include reflectors, connectors, and other connection components for optical fibers, silicon photonics optical circuits, etc.

[0392] The cured products of the two methods described above can be applied to both cladding materials forming the cladding layer of an optical waveguide and core materials forming the core layer. Specifically, the refractive index of the core material forming the core layer needs to be higher than that of the cladding material constituting the cladding layer.

[0393] The refractive index of the cured product can be controlled by changing the proportion of the organopolysiloxane constituent units contained in the organopolysiloxane or the resin composition containing the organopolysiloxane. For example, by increasing the value of M2+D2+T2 in the above formula [1], i.e., increasing the proportion of polymerizable alkenyl groups, the density of the obtained cured product can be increased, thereby increasing the refractive index. Conversely, by decreasing the value of M2+D2+T2, i.e., decreasing the proportion of polymerizable alkenyl groups, the density of the obtained cured product can be decreased, thereby decreasing the refractive index.

[0394] In addition, the refractive index of the cured product can also be controlled by changing the component ratio of the organic polysiloxane resin composition.

[0395] Furthermore, by adjusting the content (volume %) of polymeric alkenyl compounds and / or alkenyl polymers contained in the organopolysiloxane resin composition, the refractive index can be controlled by controlling the crosslinking density of the cured product, as described above. Moreover, increasing the content (volume %) of aromatic groups in the cured product can increase the refractive index, while increasing the fluorine content (volume %) can decrease the refractive index. Furthermore, combining these methods can also control the refractive index of the cured product.

[0396] For near-infrared single-mode optical signals, the refractive index difference between the core material and the cladding material is preferably 0.01 to 0.05, more preferably 0.01 to 0.04, and even more preferably 0.01 to 0.03.

[0397] When connecting to near-infrared single-mode silica fiber in a device, if the difference in refractive index between the core material of the silica fiber and the core material of the optical waveguide is small, there will be less interfacial reflection of light at the connection point, and the connection loss may be further reduced. Typically, the refractive index of the core material of near-infrared single-mode silica fiber is 1.4–1.5 at near-infrared wavelengths. If the refractive index of the core material of the optical waveguide is 1.400–1.500 at 589 nm and 1.400–1.500 at 1300 nm, more preferably 1.430–1.490 at 589 nm and 1.420–1.480 at 1300 nm, and even more preferably 1.435–1.480 at 589 nm and 1.425–1.470 at 1300 nm, the difference in refractive index between the two materials becomes smaller, and the connection loss may be further reduced.

[0398] The manufacturing method of the near-infrared waveguide in this embodiment is not particularly limited. For example, the waveguide can be formed by curing the above-mentioned organopolysiloxane or resin composition containing organopolysiloxane through exposure (photocuring) or heating (thermal curing).

[0399] As a representative example, optical waveguides can be formed using photolithography with photomasks, followed by etching and development processes. When fabricating optical waveguides via photolithography, a composition containing at least an organopolysiloxane and a photopolymerization initiator is preferred; compositions further containing solvents, chain transfer agents, etc., can be used as needed. Alternatively, they can be fabricated using methods such as nanoimprinting.

[0400] The optical waveguide formation method described above using photolithography can fabricate optical waveguides with small linewidths and spacings, and is particularly preferred.

[0401] The substrates for near-infrared waveguides can be silicon wafers, silicon wafers with oxide films, polyimide resins, epoxy resins, PEEK resins, liquid crystal polymers, glass, glass epoxy boards, etc.

[0402] When using photolithography, the core of an optical waveguide can be fabricated on a substrate by a coating process involving coating a resin composition containing an organopolysiloxane onto the substrate, an exposure process via a photomask, and a cleaning process involving cleaning the unexposed composition with a solvent. Furthermore, an upper cladding layer can be fabricated by coating the core fabricated on the substrate with an organopolysiloxane or a resin composition containing an organopolysiloxane and allowing it to cure.

[0403] Before fabricating the core, the lower cladding can be pre-fabricated by coating a substrate with an organopolysiloxane or a resin composition containing an organopolysiloxane and allowing it to cure. Alternatively, the waveguide can be fabricated on the substrate along with the core and cladding, and then the waveguide can be peeled off from the substrate.

[0404] In this embodiment, the transmission loss and connection loss of the optical waveguide can be measured by, for example, the methods described in the embodiments below. The transmission loss is preferably 0.4 dB / cm or less, more preferably 0.35 dB / cm or less, and even more preferably 0.32 dB / cm or less. The connection loss is preferably 1.35 dB or less, more preferably 1.30 dB or less, and even more preferably 1.20 dB / cm or less.

[0405] In another embodiment of the present invention, a method for manufacturing a near-infrared optical waveguide is provided (sometimes referred to as the manufacturing method herein).

[0406] The first aspect of this manufacturing method comprises, in sequence, the following steps: step (i-1), coating a first curable polymer composition onto a substrate surface to form a first polymer layer; step (i-2), irradiating at least one selected region of the first polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and step (i-3), removing the non-exposed region of the partially exposed layer with a solvent to form a patterned core.

[0407] The first curable polymer composition is the above-mentioned resin composition containing organopolysiloxane or a resin composition containing organopolysiloxane for near-infrared waveguides.

[0408] In the first embodiment described above, it is preferable to further include: step (i-4), coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and step (i-5), curing the second polymer layer to form an upper cladding layer.

[0409] The second curable polymer composition is not particularly limited as long as it has curability, but it is preferably the above-mentioned resin composition containing organopolysiloxane.

[0410] The second aspect of this manufacturing method comprises, in sequence: step (ii-1), coating a third curable polymer composition onto the surface of a substrate to form a third polymer layer; step (ii-2), irradiating at least one selected region of the third polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; step (ii-3), removing the non-exposed region of the partially exposed layer with a solvent to form a patterned core; step (ii-4), coating the substrate surface and the core with a fourth curable polymer composition to form a fourth polymer layer; and step (ii-5), curing the fourth polymer layer to form an upper cladding layer.

[0411] At least one of the third curable polymer and the fourth curable polymer compositions is the above-mentioned resin composition containing organopolysiloxane.

[0412] As described above, as long as at least one of the third and fourth curable polymer compositions is the aforementioned resin composition containing organopolysiloxane, the other curable polymer composition is not particularly limited as long as it is a curable composition. In this embodiment, it is preferable that both the third and fourth curable polymer compositions are the aforementioned resin compositions containing organopolysiloxane.

[0413] The third aspect of this manufacturing method comprises, in sequence: step (iii-1), coating a fifth curable polymer composition onto a substrate surface to form a fifth polymer layer; step (iii-2), curing the fifth polymer layer to form a lower cladding layer; step (iii-3), coating a sixth curable polymer composition onto the lower cladding layer to form a sixth polymer layer; step (iii-4), irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and step (iii-5), removing the non-exposed region of the partially exposed layer with a solvent to form a patterned core.

[0414] At least one of the fifth curable polymer composition and the sixth curable polymer composition is the above-mentioned resin composition containing organopolysiloxane.

[0415] As described above, as long as at least one of the fifth curable polymer composition and the sixth curable polymer composition is the above-mentioned resin composition containing organopolysiloxane, the other curable polymer composition is not particularly limited as long as it is a curable composition.

[0416] In this embodiment, it is preferred that both the fifth curable polymer composition and the sixth curable polymer composition are the aforementioned resin compositions containing organopolysiloxanes.

[0417] The fourth aspect of this manufacturing method comprises, in sequence: step (iv-1), coating a fifth curable polymer composition onto a substrate surface to form a fifth polymer layer; step (iv-2), curing the fifth polymer layer to form a lower cladding layer; step (iv-3), coating a sixth curable polymer composition onto the lower cladding layer to form a sixth polymer layer; step (iv-4), irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; step (iv-5), removing the non-exposed region of the partially exposed layer with a solvent to form a patterned core; step (iv-6), coating the lower cladding layer and the core with a seventh curable polymer composition to form a seventh polymer layer; and step (iv-7), curing the seventh polymer layer to form an upper cladding layer.

[0418] At least one of the fifth, sixth, and seventh curable polymer compositions is a resin composition containing an organopolysiloxane as described above.

[0419] In this embodiment, it is preferred that the fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition are all of the above-mentioned resin compositions containing organopolysiloxanes.

[0420] As the substrate used in this manufacturing method, the aforementioned substrate, which serves as the substrate for near-infrared waveguides, can be used. The surface of the substrate is preferably pretreated with ozone, plasma, or corona treatment to remove surface deposits, prevent rejection of the curable polymer composition to be coated, and improve adhesion. Furthermore, similarly, before forming the core and the upper cladding, the surfaces to be formed of the core and the upper cladding are preferably pretreated with ozone, plasma, or corona treatment.

[0421] The first to seventh curable polymer compositions are as described above. In each embodiment, at least a portion of them is required to be the above-mentioned resin composition containing organopolysiloxane, but the other curable polymer compositions may be any other polymer compositions forming the core, lower cladding, or upper cladding.

[0422] Other polymer compositions are not limited, and examples include: curable silicone compositions other than the above-described resin compositions containing organopolysiloxanes; curable polyolefin compositions; curable polyamide compositions; curable epoxy resin compositions; curable amino resin compositions; curable polyurethane compositions; curable polyimide compositions; curable polyester compositions; and curable acrylic resin compositions.

[0423] Curable polymer compositions can be applied to a substrate using any common method, such as spin coating, die coating, gravure coating, dip coating, spraying, brushing, or screen printing. Typically, curable polymer compositions can be applied by spin coating. The desired polymer layer thickness can be achieved by adjusting the spin speed and spin time, as well as the solids content and viscosity of the curable polymer composition.

[0424] When the curable polymer composition contains a solvent, the manufacturing method may further include a step of removing at least a portion of the solvent from the formed polymer layer. The solvent can be removed by heating the polymer layer at a temperature of 50°C to 200°C for tens of seconds to 60 minutes, or at a temperature of 80°C to 150°C for tens of seconds to 60 minutes. Alternatively, the solvent can be removed under reduced pressure, or it can be removed under reduced pressure followed by heating to remove the solvent.

[0425] The polymer layer can be cured by various means according to the curing mechanism of the curable polymer composition. Examples of such means include heating, exposure (irradiation with active energy lines such as radiation or ultraviolet light), and exposure to steam. The conditions can be appropriately selected. For example, a high-pressure mercury lamp light source can be used for curing. The atmosphere during exposure can be air or an inert atmosphere. Exposure under an inert atmosphere can reduce the formation of an uncured layer on the polymer layer surface.

[0426] The polymer layer used to form the core is configured to be irradiated with active energy rays of wavelength 150–800 nm over at least one selected region, creating a partially exposed layer having at least one exposed region and at least one non-exposed region. Alternatively, the polymer layer used to form the cladding layer can also be irradiated with active energy rays of wavelength 150–800 nm over at least one selected region, creating a partially exposed layer having at least one exposed region and at least one non-exposed region.

[0427] After the polymer layer has cured, it can be further heated or exposed again. These treatments can sometimes promote curing and improve the adhesion between the polymer layer and the substrate, as well as the adhesion between the polymer layers. Examples of the above-mentioned heat treatment conditions include, for example, temperatures of 50°C to 200°C for tens of seconds to 60 minutes, or temperatures of 80°C to 150°C for tens of seconds to 60 minutes.

[0428] In the core formation process, after the curable polymer composition has cured, a so-called developing process is performed to remove the unexposed areas using a solvent. There are no restrictions on the solvent or developing method used; any solvent can be used as long as it can dissolve the curable polymer composition, and the unexposed portions of the curable polymer composition can be dissolved by any method such as immersion or spraying. In the cladding formation process, after the curable polymer composition has cured, a so-called developing process can also be performed to remove the unexposed areas using a solvent. There are no restrictions on the solvent or developing method used; any solvent can be used as long as it can dissolve the curable polymer composition, and the unexposed portions of the curable polymer composition can be dissolved by any method such as immersion or spraying. Furthermore, in the core, upper, and lower cladding formation processes, the same process as the aforementioned developing process can be used to remove the uncured layer on the surface of the polymer layer. After removing the unexposed areas with a solvent, it is preferable to remove the solvent by air drying or heating.

[0429] Typically, the lower and upper cladding layers have a thickness of approximately 1–100 μm, and the core has a thickness of 1–50 μm. The refractive index of the core is preferably higher than that of the cladding layers, enabling light to be transmitted in the desired propagation mode according to the core's size and refractive index.

[0430] This manufacturing method can be extended to high-productivity manufacturing methods. Multiple optical waveguides can also be fabricated simultaneously on a single substrate. Furthermore, this method can also utilize conventional wafer fabrication techniques (e.g., coating, exposure, development, curing) and apparatus.

[0431] The optical waveguides manufactured according to this method have superior microfabrication, heat resistance, and low transmission loss at near-infrared wavelengths compared to optical waveguides containing other known materials, and can reduce connection loss caused by reflection at the fiber / waveguide interface.

[0432] Example

[0433] The present invention will now be described in detail with reference to the embodiments, but the present invention is not limited thereto.

[0434] [Evaluation Method]

[0435] (1) 1 Methods for determining H-NMR

[0436] • Device: Bruker NEO 400 (manufactured by Bruker Japan Co., Ltd.), BBFO probe (5mm in diameter).

[0437] • Measurement conditions: Pulse repetition time / 5 seconds, number of scans / 16 times, measurement mode / single pulse, measurement temperature / 25℃, flip angle / 30°, rotation / 20Hz, measurement temperature 25℃.

[0438] • Sample preparation: Weigh 60 mg of the organopolysiloxane of the analyte, add 12 mg of N,N-dimethylformamide as an internal standard. Further dissolve the sample by adding deuterated chloroform to bring the total mass to 1 g, and then add the solution to an NMR sample tube.

[0439] • Calculation of functional group content: The functional group content is estimated based on the ratio of the signal intensity of each component to the signal intensity of the internal standard N,N-dimethylformamide and the weighing value.

[0440] (2) 29 Si-NMR determination method

[0441] • Sample preparation: Tris(2,4-pentanedione)chromium III was added to deuterated chloroform to make it 0.5% by mass, resulting in 29 Solvent for Si-NMR determination. Weigh 1.5 g of the organopolysiloxane of the analyte and add 2.5 ml of the above solvent. 29 The sample is dissolved in a solvent and added to the NMR sample tube for Si-NMR determination.

[0442] (2)-1: The organopolysiloxanes a, c, d, h, i described later 29 Si-NMR measurements

[0443] • Device: JNM-ECS400 manufactured by Nippon Electronics Co., Ltd., tunable probe (10mm diameter): no Si or AT10 probe.

[0444] • Measurement conditions: Pulse repetition time / 16 seconds, number of scans / 1024 times, measurement mode / non-gated decoupled pulse method (NNE), flip angle / 90°, rotation / none, measurement temperature / 25℃.

[0445] (2)-2: The organopolysiloxanes b, e~g described later 29 Si-NMR measurements

[0446] ·Device: Made by Bruker Japan Co., Ltd., AVANCE NEO 600, BBO Cryo Probe (diameter 5mm).

[0447] • Measurement conditions: Pulse repetition time / 16 seconds, number of scans / 1024 times, measurement mode / reverse gating decoupling measurement, flip angle / 90°, rotation / none, measurement temperature / 25℃.

[0448] <Calculation of structural units>

[0449] The signal intensity of each unit cell in silicon was measured, based on the above... 1 The structural ratio of silicon units was calculated by combining the ratio of signal intensity measured by H-NMR with the ratio of functional group content.

[0450] (3) Determination of the refractive index of the cured material

[0451] (3)-1: Refractive index determination at 589 nm wavelength

[0452] • Using an Abbe precision refractometer KPR2000 manufactured by Shimadzu Corporation, at a temperature of 23°C, the refractive index of the cured material prepared by the method described below was measured at a wavelength of 589 nm (visible light region) using a mixture of diiodomethane, monobromonaphthalene and liquid paraffin as an intermediate liquid.

[0453] (3)-2: Refractive index determination at 1300 nm wavelength

[0454] • The refractive index of the thin film cured on the substrate by the method described below was measured at a wavelength of 1300 nm (near-infrared region) using a Metricon 2010 / M prism coupler (manufactured by Puneum Corporation).

[0455] (4) Thermogravimetric temperature of the cured material

[0456] The measurements were performed using a Hitachi High Technology Corporation NEXTA STA200 differential thermogravimetric analyzer (TG-DSC) under air conditions with a temperature increase of 10°C / min.

[0457] (5) Fabrication of optical waveguides

[0458] Optical waveguides are fabricated by sequentially forming a lower cladding layer, a core, and an upper cladding layer on a silicon substrate using photolithography. Detailed steps will be described later.

[0459] (6) Methods for measuring the transmission loss and connection loss of waveguides

[0460] After creating a scratch on the silicon substrate side of the waveguide, it was cut by hand to expose the end face, and single-mode fibers were connected at both ends. The incident single-mode fiber was connected to a temperature-controlled fiber output high-power LD stabilization source (LDS1005) manufactured by PreciseGauges via a matching oil with a refractive index of 1.51 at 589 nm wavelength. The output single-mode fiber was connected to a power meter (MT9810B) manufactured by Anritsu via a matching oil with a refractive index of 1.51 at 589 nm wavelength, and the loss was measured. The loss was measured at two or more points on waveguide samples with different optical path lengths. The slope of the approximate straight line plotted by optical path length versus loss was taken as the transmission loss (dB / cm), and the intercept was taken as the connection loss (dB).

[0461] [Synthetic methods of organopolysiloxanes]

[0462] [Synthetic Example 1] Synthesis method of organopolysiloxane a

[0463] Using 10.00 g of 3-methacryloyloxypropyltrimethoxysilane KBM5032 (manufactured by Shin-Etsu Chemical Industry Co., Ltd.) and 101.80 g of dimethyldimethoxysilane KBM22 (manufactured by Shin-Etsu Chemical Industry Co., Ltd.) as organopolysiloxane raw materials, and 155.90 g of toluene and 155.90 g of methanol as solvents, and a mixture of 104.33 g of 1N hydrochloric acid and 104.33 g of methanol as catalysts and water, hydrolysis and condensation were carried out while maintaining a temperature of 15°C to 40°C. The reaction solution was then neutralized, washed with deionized water, and the solvent and water were removed. After filtration, 200 g of the target liquid organopolysiloxane a was obtained.

[0464] [Synthetic Example 2] Synthetic method of organopolysiloxanes b and e

[0465] By changing the amounts of the organopolysiloxane raw materials to achieve the structural unit ratios recorded in Table 1, and otherwise synthesizing them in the same manner as in Synthesis Example 1, organopolysiloxanes b and e were obtained.

[0466] [Synthetic Example 3] Synthesis method of organopolysiloxane C

[0467] Referring to Japanese Patent Publication No. 2014-510159, organopolysiloxane c was obtained by using 3-methacryloyloxypropyltrimethoxysilane KBM503 manufactured by Shin-Etsu Chemical Industries, Ltd. and diphenylsilanediol manufactured by Tokyo Chemical Industries, Ltd. as raw materials for organopolysiloxane.

[0468] [Synthetic Example 4] Synthesis method of organopolysiloxane d

[0469] Using 3-methacryloyloxypropyltrimethoxysilane KBM503 manufactured by Shin-Etsu Chemical Industry Co., Ltd., diphenylsilanediol manufactured by Tokyo Chemical Industry Co., Ltd., and trimethoxy(3,3,3-trifluoropropyl)silane manufactured by Tokyo Chemical Industry Co., Ltd. as raw materials for organopolysiloxane, organopolysiloxane d was obtained in the same manner as in Synthesis Example 3.

[0470] [Synthetic Example 5] Synthetic method of organopolysiloxane f

[0471] Using 3-methacryloyloxypropylmethyldimethoxysilane KBM502 manufactured by Shin-Etsu Chemical Industry Co., Ltd. and trimethoxymethylsilane manufactured by Tokyo Chemical Industry Co., Ltd. as raw materials for organopolysiloxane, organopolysiloxane f was synthesized in the same manner as in Synthesis Example 1.

[0472] [Synthetic Example 6] Synthesis method of organopolysiloxane g

[0473] Using 3-methacryloyloxypropyltrimethoxysilane KBM503 (manufactured by Shin-Etsu Chemical Industry Co., Ltd.), dimethyldimethoxysilane KBM22 (manufactured by Shin-Etsu Chemical Industry Co., Ltd.), and dimethoxy(methyl)(3,3,3-trifluoropropyl)silane (manufactured by Tokyo Chemical Industry Co., Ltd.) as raw materials for organopolysiloxane, g of organopolysiloxane was synthesized in the same manner as in Synthesis Example 1.

[0474] [Synthetic Example 7] Synthetic method of organopolysiloxanes h and i

[0475] Using methylsilicate MS51 manufactured by Mitsubishi Chemical Corporation, 3-methacryloyloxypropyltrimethoxysilane KBM503 manufactured by Shin-Etsu Chemical Industry Co., Ltd., and hexamethyldisiloxane manufactured by NACALAI TESQUE Co., Ltd. as organopolysiloxane raw materials, the proportions of the structural units listed in Table 1 were changed. Otherwise, the same method as in Synthesis Example 1 was used to synthesize organopolysiloxanes h and i.

[0476] [Method for preparing cured products]

[0477] To prepare a composition, 2.0 parts by weight (in the case of organopolysiloxanes a, b, e to i) or 0.5 parts by weight (in the case of organopolysiloxanes c and d) of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenyl (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator are added relative to 100 parts by weight of organopolysiloxane and stirred to dissolve the photopolymerization initiator.

[0478] Furthermore, a composition was prepared by adding 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenyl (Omnirad 369) manufactured by iGMResins BV as a photopolymerization initiator and 10 parts by weight of pentaerythritol tetra(3-mercaptobutyrate) (PE1, manufactured by Resonac Co., Ltd.) as a chain transfer agent to 100 parts by weight of organopolysiloxane b.

[0479] In addition, compositions were prepared by adding 2.0 parts by weight of 2,4,6-trimethylbenzoyl diphenylphosphine oxide (manufactured by iGM Resins BV, Omnirad TPOH) instead of Omnirad 369 as a photopolymerization initiator relative to 100 parts by weight of organopolysiloxane b, and compositions were prepared by adding 2.0 parts by weight of bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (manufactured by iGM Resins BV, Omnirad 819) instead of Omnirad 369 as a photopolymerization initiator relative to 100 parts by weight of organopolysiloxane b.

[0480] The obtained composition was held between two glass plates using a 1 mm thick silicone spacer and exposed to a 365 nm LED (cumulative light intensity: 6000 mJ / cm²). 2 ), and a test piece with a thickness of about 1 mm was obtained.

[0481] The refractive index and 5% weight loss temperature at a wavelength of 589 nm were determined using this test piece.

[0482] [Method for fabricating thin film cured on substrate]

[0483] Relative to 100 parts by weight of organopolysiloxane, add 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinobutyrophenyl (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator (in the case of organopolysiloxanes a and b) or 0.5 parts by weight (in the case of organopolysiloxanes c and d), and 60 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent, and stir at room temperature.

[0484] As the above-mentioned composition containing organopolysiloxane b, a composition was also prepared by further adding 10 parts by weight of pentaerythritol tetra(3-mercaptobutyrate) (PE1, manufactured by Resonac Co., Ltd.) as a chain transfer agent.

[0485] As the above-mentioned composition containing organopolysiloxane b, compositions were also prepared by adding 2.0 parts by weight of 2,4,6-trimethylbenzoyl diphenylphosphine oxide (manufactured by iGM Resins BV, Omnirad TPO H) instead of Omnirad 369 as a photopolymerization initiator, compositions by adding 2.0 parts by weight of bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (manufactured by iGM Resins B.V., Omnirad 819) instead of Omnirad 369 as a photopolymerization initiator, or compositions by adding 2.0 parts by weight of methyl 4-acetoxyimino-5-oxo-5-(4-(phenylthio)phenyl)valerate (photopolymerization initiator-1) instead of Omnirad 369 as a photopolymerization initiator.

[0486] The obtained composition was spin-coated onto a glass substrate, and the solvent was removed by depressurization. It was then photocured (cumulative light intensity at 365 nm: 1000 mJ / cm²). 2 Then, it is heated in a heating furnace at 150°C for 3 hours, thereby creating a thin film curing material on the substrate.

[0487] [Preparation of Composition A for the Formation of Optical Waveguide Cores]

[0488] 100 parts by weight of organopolysiloxane a, 2 parts by weight of Omnirad 369, and 20 parts by weight of propylene glycol monomethyl ether acetate were placed in a container and stirred for 2 hours to obtain composition A for forming optical waveguide cores.

[0489] [Preparation of Composition H for Optical Waveguide Core Formation]

[0490] 100 parts by weight of organopolysiloxane H, 2 parts by weight of Omnirad 369, 10 parts by weight of PE1, and 20 parts by weight of propylene glycol monomethyl ether acetate were placed in a container and stirred for 2 hours to obtain composition H for forming optical waveguide cores.

[0491] [Preparation of Composition C for Optical Waveguide Core Formation]

[0492] Composition C was prepared in the same manner as composition A, except that organopolysiloxane C was used instead of organopolysiloxane A, and Omnirad 369 was set at 0.5 parts by mass.

[0493] [Preparation of Composition B for Optical Waveguide Cladding Formation]

[0494] Composition B is prepared in the same manner as composition A, except that organopolysiloxane b is used instead of organopolysiloxane a.

[0495] [Preparation of Composition D for Optical Waveguide Cladding]

[0496] Composition D was prepared in the same manner as composition A, except that organopolysiloxane d was used instead of organopolysiloxane a, and 0.5 parts by weight of Omnirad 369 was used.

[0497] [Preparation of Composition I for Optical Waveguide Cladding Formation]

[0498] Composition I is prepared in the same manner as composition A, except that organopolysiloxane i is used instead of organopolysiloxane a.

[0499] [Example 1]

[0500] [Fabrication of optical waveguides]

[0501] On an ozone-treated silicon wafer, composition B is spin-coated, the solvent is removed by depressurization, and then exposed using an exposure machine (intensity of 40 mW / cm² at a wavelength of 365 nm). 2 Cumulative light intensity 1000 mJ / cm 2 After heating at 130°C for 10 minutes, propylene glycol monomethyl ether acetate, followed by 2-propanol, was used to rinse away any insufficiently cured portions of the coating surface. The substrate was then heated at 130°C for 30 seconds in an oven to form a lower cladding layer approximately 10 μm thick on the silicon wafer substrate. Next, the surface of the silicon wafer substrate with the lower cladding layer was subjected to plasma treatment, and then composition A was spin-coated onto it. After removing the solvent by depressurization, the substrate was exposed using a mask (intensity of 500 mW / cm² at a wavelength of 365 nm). 2 Cumulative light intensity: 2000 mJ / cm 2 After heating at 130°C for 10 minutes, the composition was rinsed off the non-exposed areas using propylene glycol monomethyl ether acetate, followed by 2-propanol. The substrate was then heated at 130°C for 30 seconds in an oven, thereby forming a core on the lower cladding layer of the silicon wafer substrate. Next, the surface of the silicon wafer substrate with the lower cladding layer and core was subjected to plasma treatment. After spin-coating composition B, the solvent was removed by depressurization, and the substrate was exposed using an exposure machine (intensity of 40 mW / cm² at a wavelength of 365 nm). 2 Cumulative light intensity: 1000 mJ / cm 2 After heating at 130°C for 10 minutes, propylene glycol monomethyl ether acetate, followed by 2-propanol, is used to rinse away any insufficiently cured portions of the coating surface. The coating is then heated at 130°C for 30 seconds in an oven, and further heated at 150°C for 1 hour in an oven. This process forms an upper cladding layer on the lower cladding layer and the core of the silicon wafer substrate, resulting in the optical waveguide X.

[0502] [Comparative Examples 1 and 2]

[0503] Similar to the above embodiments, waveguide Y of Comparative Example 2 was obtained by using composition C to form the core and composition D to form the cladding, and waveguide Z of Comparative Example 1 was obtained by using composition H to form the core and composition I to form the cladding.

[0504] [Evaluation of the molecular structure ratio, cured products, and optical waveguides of organopolysiloxanes]

[0505] pass 1 H-NMR and 29 The molecular structure ratios of the organopolysiloxane before curing, calculated by Si-NMR, and the evaluation results of the cured products are shown in Table 1. Furthermore, the evaluation results of the optical waveguides of the examples and comparative examples are shown in Table 2.

[0506] [Table 1]

[0507]

[0508] [Table 2]

[0509]

[0510] [Example 2]

[0511] [Method for fabricating an optical waveguide with a core on a substrate 1]

[0512] Relative to the above-mentioned 100 parts by weight of organopolysiloxane a, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenyl (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator and 20 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was used as the first curable polymer composition. After spin-coating the first curable polymer composition onto a silicon wafer substrate with an ozone-treated surface, the solvent was removed by depressurization, and the substrate was exposed using a mask (intensity at 365 nm: 500 mW / cm²). 2 Cumulative light intensity: 2000 mJ / cm 2 After heating at 130°C for 10 minutes, propylene glycol monomethyl ether acetate was used, followed by rinsing off the non-exposed portion of the composition with 2-propanol. The mixture was then heated at 130°C for 30 seconds in a furnace, and further heated at 150°C for 1 hour in a furnace, thereby fabricating the core of the optical waveguide on a silicon wafer substrate.

[0513] Figure 1 This is a schematic cross-sectional view of the optical waveguide fabricated in Example 2.

[0514] [Example 3]

[0515] [Method for fabricating an optical waveguide with a core / top cladding on a substrate 2]

[0516] Relative to the above-mentioned 100 parts by weight of organopolysiloxane b, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenyl (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator and 20 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was used as the second curable polymer composition. The surface of the silicon wafer substrate with the optical waveguide core obtained in Example 2 was subjected to plasma treatment, and the second curable polymer composition was spin-coated. The solvent was removed by depressurization treatment, and the substrate was exposed using an exposure machine (intensity at wavelength 365 nm: 40 mW / cm). 2 Cumulative light intensity: 1000 mJ / cm 2 After heating at 130°C for 10 minutes, propylene glycol monomethyl ether acetate, followed by 2-propanol, is used to rinse the insufficiently cured parts of the coating surface. The coating is then heated at 130°C for 30 seconds in an oven, and further heated at 150°C for 1 hour in an oven, thereby fabricating an optical waveguide with a core and an upper cladding on a silicon wafer substrate.

[0517] Figure 2 This is a schematic cross-sectional view of the optical waveguide fabricated in Example 3.

[0518] [Example 4]

[0519] [Method 3 for fabricating an optical waveguide with a lower cladding / core on a substrate]

[0520] Relative to the above-mentioned 100 parts by weight of organopolysiloxane b, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenone (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator and 20 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was used as the fifth curable polymer composition. After spin-coating this fifth curable polymer composition onto an ozone-treated silicon wafer substrate, the solvent was removed by depressurization, and the substrate was exposed using an exposure machine (intensity at 365 nm: 40 mW / cm). 2 Cumulative light intensity: 1000 mJ / cm 2 After heating at 130°C for 10 minutes, propylene glycol monomethyl ether acetate, followed by 2-propanol, is used to rinse the insufficiently cured parts of the coating surface. The coating is then heated at 130°C for 30 seconds in an oven to form a lower cladding layer on a silicon wafer substrate, formed from the fifth curable polymer composition.

[0521] Relative to the above-mentioned 100 parts by weight of organopolysiloxane a, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenone (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator and 20 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was used as the sixth curable polymer composition. The surface of a silicon wafer substrate with the above-mentioned lower cladding layer was subjected to plasma treatment, and the sixth curable polymer composition was spin-coated. The solvent was removed by depressurization treatment, and the substrate was exposed using a mask (methyl ether strength: 500 mW / cm). 2 Cumulative light intensity: 2000 mJ / cm 2 After heating at 130°C for 10 minutes, the composition of the non-exposed portion is rinsed with propylene glycol monomethyl ether acetate followed by 2-propanol. The composition is then heated at 130°C for 30 seconds in a furnace and further heated at 150°C for 1 hour in a furnace, thereby fabricating an optical waveguide on a silicon wafer substrate having a lower cladding layer formed by a fifth curable polymer composition and a core formed by a sixth curable polymer composition.

[0522] Figure 3 This is a schematic cross-sectional view of the optical waveguide fabricated in Example 4.

[0523] [Example 5]

[0524] [4. Fabrication method of an optical waveguide having a lower cladding / core / upper cladding on a substrate]

[0525] Relative to the above-mentioned 100 parts by weight of organopolysiloxane b, 2.0 parts by weight of 2-benzyl-2-(dimethylamino)-4'-morpholinylbutyrophenyl (Omnirad 369, manufactured by iGM Resins BV) as a photopolymerization initiator and 20 parts by weight of propylene glycol monomethyl ether acetate as an organic solvent were added, and the mixture was stirred at room temperature. This composition was used as the seventh curable polymer composition. The surface of the silicon wafer substrate with the lower cladding and core obtained in Example 4 was subjected to plasma treatment, and the seventh curable polymer composition was spin-coated. The solvent was removed by depressurization treatment, and the substrate was exposed using an exposure machine (intensity at wavelength 365 nm: 40 mW / cm). 2 Cumulative light intensity: 1000 mJ / cm 2After heating at 130°C for 10 minutes, propylene glycol monomethyl ether acetate, followed by 2-propanol, is used to rinse the insufficiently cured parts of the coating surface. The coating is then heated at 130°C for 30 seconds in an oven, and further heated at 150°C for 1 hour in an oven, thereby fabricating an optical waveguide on a silicon wafer substrate having a lower cladding layer formed by a fifth curable polymer composition, a core composed of a sixth curable polymer composition, and an upper cladding layer formed by a seventh curable polymer composition.

[0526] Figure 4 This is a schematic cross-sectional view of the optical waveguide fabricated in Example 5.

[0527] As shown in Tables 1 and 2, when using organic groups containing polymerizable alkenyl groups and SiO2... 2 / 2 In waveguide X made of organopolysiloxanes a and b, where the total percentage of aromatic groups in the total number of groups bonded to silicon atoms (represented as siloxane units (D units)) is less than 20 mol%, the refractive indices of the core at wavelengths of 589 nm and 1300 nm are 1.476 and 1.463, respectively. When connected to single-mode silica fiber, the refractive index difference between the cores is small, and interface reflection is suppressed. Furthermore, the measured results show a low transmission loss of less than 0.4 dB / cm and a connection loss of less than 1.20 dB.

[0528] On the other hand, although organic groups containing polymeric alkenyl groups and SiO2 are used... 2 / 2 In waveguide Y made of organopolysiloxanes c and d (representing siloxane units (D units) but with the proportion of aromatic groups exceeding 20 mol% in the total number of groups bonded to silicon atoms), the refractive indices of the core at 589 nm and 1300 nm wavelengths are 1.558 and 1.538, respectively. When connected to a single-mode silica fiber, the large difference in refractive index between the cores indicates that interface reflection is not suppressed. Furthermore, the measurements show that although the transmission loss is below 0.4 dB / cm, the connection loss is above 1.30 dB.

[0529] When using organic groups containing polymerizable alkenyl groups, the proportion of aromatic groups is less than 20 mol%, but not composed of SiO2. 2 / 2 In waveguide Z made of organopolysiloxane h and i represented by siloxane units (D units), the transmission loss and connection loss increase, indicating that D units are necessary to reduce transmission loss and connection loss.

[0530] The cured organopolysiloxane of this embodiment has a small difference in refractive index compared to the quartz fiber core. When used as the core material of a near-infrared waveguide, interface reflection is suppressed when connected to a near-infrared single-mode quartz fiber. Furthermore, in the case of a near-infrared waveguide using this core material, the refractive index difference between the core and cladding is smaller, making the cured organopolysiloxane of this embodiment also useful as a cladding material for the near-infrared waveguide.

[0531] Furthermore, the cured organopolysiloxane of this embodiment exhibits toughness, and the optical waveguide constructed from this cured material is less prone to end-face cracking during cutting, resulting in low connection loss. Therefore, the organopolysiloxane of this embodiment is useful as a forming material for near-infrared optical waveguides. In addition, it was confirmed that adding a chain transfer agent improves curability and enhances the heat resistance of the cured material.

[0532] Furthermore, from the viewpoints of optical properties, heat resistance, and photolithography-based patterning, it is also expected to be used as an optical adhesive in the connection part between optical waveguides and optical fibers, which are connected to non-quartz optical fibers with a core material refractive index of about 1.4 to 1.5.

[0533] Explanation of reference numerals in the attached figures

[0534] 10: Substrate;

[0535] 20: Lower cladding;

[0536] 30: Upper cladding;

[0537] 40: Core.

Claims

1. An organopolysiloxane, represented by the following general formula [1], (R 1 R 2 R 3 SiO 1 / 2 ) M1 (R 4 R 5 R 6 SiO 1 / 2 ) M2 (R 7 R 8 SiO 2 / 2 ) + (R 9 R 6 SiO 2 / 2 ) D2 (R 10 SiO 3 / 2 ) T1 (R 6 SiO 3 / 2 ) T2 (SiO 4 / 2 ) Q (O 1 / 2 R 11 ) Y1 (O 1 / 2 R 6 ) Y2 …[1] In the aforementioned formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms. R 1 ~R 3 R 7 R 8 R 10 and R 11 Does not contain polymeric alkenyl groups. R 6 It is an organic group containing one or more polymeric alkenyl groups, which may optionally be the same as or different from each other. 0≤M1, 0≤Q, 0≤Y1, 0≤Y2 0 <D1+D2、 0 <M2+D2+T2、 M1+M2+D1+D2+T1+T2+Q=1, Of all the groups bonded to silicon atoms, aromatic groups account for less than 20 mol%.

2. The organopolysiloxane according to claim 1, wherein, In the above formula [1], 0.1 <D1+D2。 3. The organopolysiloxane according to claim 1, wherein, In the above formula [1], 0 <D1。 4. The organopolysiloxane according to claim 1, wherein, In the above formula [1], 0.02≤Y1≤0.

25.

5. The organopolysiloxane according to claim 1, wherein, In the above formula [1], R 7 ~R 9 It does not contain aromatic groups.

6. The organopolysiloxane according to claim 1, wherein, In the above formula [1], R 1 ~R 11 It does not contain aromatic groups.

7. The organopolysiloxane according to claim 1, wherein, In the above formula [1], the R 6 A molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5]. [Chemical Formula 1] ， In the formula, X is a divalent organic group, optionally containing a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom that is the end of X and directly bonded to silicon is a carbon atom. When X is bonded to an oxygen atom that is directly bonded to silicon, the atom that is the end of X and directly bonded to the oxygen atom is a carbon atom. * indicates a bonded bond.

8. The organopolysiloxane according to claim 1, wherein, In the above formula [1], the R 6 It is acryloyloxypropyl and / or methacryloyloxypropyl.

9. The organopolysiloxane according to claim 1, wherein, In the general formula [1], R 7 R 8 Each is an alkyl group having 1 to 20 carbon atoms.

10. A resin composition containing an organopolysiloxane, comprising the organopolysiloxane according to any one of claims 1 to 9 and a polymerization initiator.

11. A cured product formed by curing a resin composition containing an organosiloxane according to claim 10.

12. A near-infrared waveguide made using a resin composition containing an organosiloxane as described in claim 10.

13. A near-infrared optical waveguide, comprising a core and a cladding, wherein, Both the core and the cladding are made using a resin composition containing organosiloxanes according to claim 10.

14. A near-infrared light transmission component, comprising at least the near-infrared light waveguide according to claim 12.

15. A near-infrared light transmission component, comprising at least the near-infrared light waveguide according to claim 13.

16. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (i-1): A first curable polymer composition is coated on the surface of a substrate to form a first polymer layer; Step (i-2) involves irradiating at least one selected region of the first polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and In step (i-3), the non-exposed areas of the partially exposed layer are removed using a solvent to form a patterned core. The first curable polymer composition is a resin composition containing an organopolysiloxane according to claim 10.

17. The method for manufacturing a near-infrared optical waveguide according to claim 16, further comprising: Step (i-4): Coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and In step (i-5), the second polymer layer is cured to form the upper cladding layer.

18. The method for manufacturing a near-infrared optical waveguide according to claim 17, wherein, The second curable polymer composition is the resin composition containing organic polysiloxane according to claim 10.

19. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (ii-1): A third curable polymer composition is coated on the surface of the substrate to form a third polymer layer; Step (ii-2) involves irradiating at least one selected region in the third polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region. In step (ii-3), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core; Step (ii-4): The substrate surface and the core are coated with a fourth curable polymer composition to form a fourth polymer layer; as well as In step (ii-5), the fourth polymer layer is cured to form the upper coating. At least one of the third curable polymer composition and the fourth curable polymer composition is a resin composition containing an organopolysiloxane according to claim 10.

20. The method for manufacturing a near-infrared optical waveguide according to claim 19, wherein, Both the third curable polymer composition and the fourth curable polymer composition are resin compositions containing organic polysiloxanes according to claim 10.

21. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (iii-1): A fifth curable polymer composition is coated on the surface of the substrate to form a fifth polymer layer; Step (iii-2) involves curing the fifth polymer layer to form the lower cladding layer; Step (iii-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer; Step (iii-4) involves irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and In step (iii-5), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core. At least one of the fifth curable polymer composition and the sixth curable polymer composition is a resin composition containing an organopolysiloxane according to claim 10.

22. The method for manufacturing a near-infrared optical waveguide according to claim 21, wherein, Both the fifth curable polymer composition and the sixth curable polymer composition are resin compositions containing organic polysiloxanes according to claim 10.

23. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (iv-1): A fifth curable polymer composition is coated on the substrate surface to form a fifth polymer layer; Step (iv-2) involves curing the fifth polymer layer to form the lower cladding layer; Step (iv-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer; Step (iv-4) involves irradiating at least one selected region in the sixth polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region. Step (iv-5) involves removing the non-exposed areas of the partially exposed layer using a solvent to form a patterned core; Step (iv-6): The lower cladding and the core are coated with a seventh curable polymer composition to form a seventh polymer layer; as well as In step (iv-7), the seventh polymer layer is cured to form the upper cladding layer. At least one of the fifth, sixth, and seventh curable polymer compositions is a resin composition containing an organopolysiloxane according to claim 10.

24. The method for manufacturing a near-infrared optical waveguide according to claim 23, wherein, The fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition are all resin compositions containing organic polysiloxanes according to claim 10.

25. A cured product comprising a cross-linked structure derived from an organic group containing a polymeric alkenyl group, and formed from SiO₂. 2 / 2 The siloxane unit represented is the D unit. The solidified material has a refractive index of 1.400 or higher and 1.500 or lower at a wavelength of 1300 nm.

26. The cured material according to claim 25, wherein the refractive index at a wavelength of 589 nm is 1.400 or higher and 1.500 or lower.

27. The cured product according to claim 25, wherein, The cured product is formed by curing an organopolysiloxane represented by the following general formula [1]. (R 1 R 2 R 3 SiO 1 / 2 ) M1 (R 4 R 5 R 6 SiO 1 / 2 ) M2 (R 7 R 8 SiO 2 / 2 ) D1 (R 9 R 6 SiO 2 / 2 ) D2 (R 10 SiO 3 / 2 ) T1 (R 6 SiO 3 / 2 ) T2 (SiO 4 / 2 ) Q (O 1 / 2 R 11 ) Y1 (O 1 / 2 R 6 ) Y2 …[1] In the aforementioned formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups selected from organic groups, reactive functional groups, or hydrogen atoms. R 1 ~R 3 R 7 R 8 R 10 and R 11 Does not contain polymeric alkenyl groups. R 6 It is an organic group containing one or more polymeric alkenyl groups, which may optionally be the same as or different from each other. 0≤M1, 0≤Q, 0≤Y1, 0≤Y2 0 <D1+D2、 0 <M2+D2+T2、 M1+M2+D1+D2+T1+T2+Q=1, Of all the groups bonded to silicon atoms, aromatic groups account for less than 20 mol%.

28. The cured product according to claim 27, wherein, In the above formula [1], 0.1 <D1+D2。 29. The cured product according to claim 27, wherein, In the above formula [1], 0 <D1。 30. The cured product according to claim 27, wherein, In the above formula [1], 0.02≤Y1≤0.

25.

31. The cured product according to claim 27, wherein, In the above formula [1], R 1 ~R 11 It does not contain aromatic groups.

32. The cured product according to claim 27, wherein, In the above formula [1], the R 6 A molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5]. [Chemical Formula 2] ， In the formula, X is a divalent organic group, optionally containing a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom that is the end of X and directly bonded to silicon is a carbon atom. When X is bonded to an oxygen atom that is directly bonded to silicon, the atom that is the end of X and directly bonded to the oxygen atom is a carbon atom. * indicates a bonded bond.

33. The cured product according to claim 27, wherein, In the above formula [1], the R 6 It is acryloyloxypropyl and / or methacryloyloxypropyl.

34. The cured product according to claim 27, wherein, In the general formula [1], R 7 R 8 Each is an alkyl group having 1 to 20 carbon atoms.

35. A near-infrared waveguide comprising a cured material according to any one of claims 25 to 34.

36. A near-infrared optical waveguide, comprising a core and a cladding, wherein, Both the core and the cladding comprise a cured material according to any one of claims 25 to 34.

37. A near-infrared light transmission component, comprising at least the near-infrared light waveguide according to claim 35.

38. A near-infrared light transmission component, comprising at least the near-infrared light waveguide according to claim 36.

39. An organopolysiloxane for near-infrared optical waveguides, comprising: Organic groups containing polymeric alkenyl groups, and From SiO 2 / 2 The siloxane unit represented is the D unit. Of all the groups bonded to silicon atoms, aromatic groups account for less than 20 mol%.

40. The organopolysiloxane for near-infrared waveguides according to claim 39, which is represented by the following general formula [1], (R 1 R 2 R 3 SiO 1 / 2 ) M1 (R 4 R 5 R 6 SiO 1 / 2 ) M2 (R 7 R 8 SiO 2 / 2 ) D1 (R 9 R 6 SiO 2 / 2 ) D2 (R 10 SiO 3 / 2 ) T1 (R 6 SiO 3 / 2 ) T2 (SiO 4 / 2 ) Q (O 1 / 2 R 11 ) Y1 (O 1 / 2 R 6 ) Y2 [1] In formula [1], R 1 ~R 5 R 7 ~R 11 Each group is independently selected from one or more groups composed of organic groups, reactive functional groups, and hydrogen atoms. R 1 ~R 3 R 7 R 8 R 10 and R 11 Does not contain polymeric alkenyl groups. R 6 It is one or more organic groups containing a polymerizable alkenyl group, and in the case of multiple groups, they may optionally be the same as or different from each other. R 1 ~R 11 In the total, the proportion of aromatic groups is less than 20 mol%. 0≤M1, 0≤Q, 0≤Y1, 0≤Y2 0 <D1+D2、0<M2+D2+T2、 M1+M2+D1+D2+T1+T2+Q=1.

41. The organopolysiloxane for near-infrared optical waveguides according to claim 40, wherein, In the above formula [1], 0.1 <D1+D2。 42. The organopolysiloxane for near-infrared optical waveguides according to claim 40, wherein, In the above formula [1], 0 <D1。 43. The organopolysiloxane for near-infrared optical waveguides according to claim 40, wherein, In the above formula [1], 0.02≤Y1≤0.

25.

44. The organopolysiloxane for near-infrared optical waveguides according to claim 40, wherein, In the above formula [1], R 7 ~R 9 It does not contain aromatic groups.

45. The organopolysiloxane for near-infrared optical waveguides according to claim 40, wherein, In the above formula [1], the R 6 A molecule has one or more functional groups selected from the group represented by the following formulas [2] to [5]. [Chemical Formula 3] ， In the formula, X is a divalent organic group, optionally containing a branched structure and / or a cyclic structure. When X is bonded to a silicon atom, the atom that is the end of X and directly bonded to silicon is a carbon atom. When X is bonded to an oxygen atom that is directly bonded to silicon, the atom that is the end of X and directly bonded to the oxygen atom is a carbon atom. * indicates a bonded bond.

46. ​​The organopolysiloxane for near-infrared optical waveguides according to claim 40, wherein, In the above formula [1], the R 6 It is acryloyloxypropyl and / or methacryloyloxypropyl.

47. The organopolysiloxane for near-infrared waveguides according to claim 40, wherein, In the above formula [1], R 1 ~R 11 It does not contain aromatic groups.

48. A resin composition containing an organopolysiloxane for near-infrared waveguides, comprising the organopolysiloxane for near-infrared waveguides according to claim 39 or 40 and a polymerization initiator.

49. A cured product for near-infrared waveguides, which is formed by curing a resin composition containing an organopolysiloxane for near-infrared waveguides according to claim 48.

50. A near-infrared waveguide made using a resin composition containing an organopolysiloxane as described in claim 48 for near-infrared waveguides.

51. A near-infrared optical waveguide, comprising a core and a cladding, wherein, Both the core and the cladding are made using a resin composition containing an organopolysiloxane for near-infrared waveguides according to claim 48.

52. A near-infrared light transmission component, comprising at least the near-infrared light waveguide according to claim 50.

53. A near-infrared light transmission component, comprising at least the near-infrared light waveguide according to claim 51.

54. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (i-1): A first curable polymer composition is coated on the surface of a substrate to form a first polymer layer; Step (i-2) involves irradiating at least one selected region of the first polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and In step (i-3), the non-exposed areas of the partially exposed layer are removed using a solvent to form a patterned core. The first curable polymer composition is the resin composition containing organopolysiloxane for near-infrared waveguides according to claim 48.

55. The method for manufacturing a near-infrared optical waveguide according to claim 54, further comprising: Step (i-4): Coating the substrate surface and the core with a second curable polymer composition to form a second polymer layer; and In step (i-5), the second polymer layer is cured to form the upper cladding layer.

56. The method for manufacturing a near-infrared optical waveguide according to claim 55, wherein, The second curable polymer composition is the resin composition containing organic polysiloxane for near-infrared waveguides according to claim 48.

57. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (ii-1): A third curable polymer composition is coated on the surface of the substrate to form a third polymer layer; Step (ii-2) involves irradiating at least one selected region in the third polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region. In step (ii-3), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core; Step (ii-4): The substrate surface and the core are coated with a fourth curable polymer composition to form a fourth polymer layer; as well as In step (ii-5), the fourth polymer layer is cured to form the upper coating. At least one of the third curable polymer composition and the fourth curable polymer composition is a resin composition containing an organopolysiloxane for near-infrared waveguides according to claim 48.

58. The method for manufacturing a near-infrared optical waveguide according to claim 57, wherein, Both the third curable polymer composition and the fourth curable polymer composition are resin compositions containing organic polysiloxanes for near-infrared waveguides according to claim 48.

59. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (iii-1): A fifth curable polymer composition is coated on the surface of the substrate to form a fifth polymer layer; Step (iii-2) involves curing the fifth polymer layer to form the lower cladding layer; Step (iii-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer; Step (iii-4) involves irradiating at least one selected region of the sixth polymer layer with active energy rays of wavelength 150–800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region; and In step (iii-5), the non-exposed areas of the partially exposed layer are removed by solvent to form a patterned core. At least one of the fifth curable polymer composition and the sixth curable polymer composition is a resin composition containing an organopolysiloxane for near-infrared waveguides according to claim 48.

60. The method for manufacturing a near-infrared optical waveguide according to claim 59, wherein, Both the fifth curable polymer composition and the sixth curable polymer composition are resin compositions containing organic polysiloxanes for near-infrared waveguides according to claim 48.

61. A method for manufacturing a near-infrared optical waveguide, comprising, in sequence: Step (iv-1): A fifth curable polymer composition is coated on the substrate surface to form a fifth polymer layer; Step (iv-2) involves curing the fifth polymer layer to form the lower cladding layer; Step (iv-3): A sixth curable polymer composition is applied to the lower cladding layer to form a sixth polymer layer; Step (iv-4) involves irradiating at least one selected region in the sixth polymer layer with active energy rays of wavelength 150-800 nm to create a partially exposed layer having at least one exposed region and at least one non-exposed region. Step (iv-5) involves removing the non-exposed areas of the partially exposed layer using a solvent to form a patterned core; Step (iv-6): The lower cladding and the core are coated with a seventh curable polymer composition to form a seventh polymer layer; as well as In step (iv-7), the seventh polymer layer is cured to form the upper cladding layer. At least one of the fifth, sixth, and seventh curable polymer compositions is a resin composition containing an organopolysiloxane for near-infrared waveguides according to claim 48.

62. The method for manufacturing a near-infrared optical waveguide according to claim 61, wherein, The fifth curable polymer composition, the sixth curable polymer composition, and the seventh curable polymer composition are all resin compositions containing organic polysiloxanes for near-infrared waveguides according to claim 48.

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