ALD deposition method and ALD deposition system for passivation film

Abstract

The invention discloses an ALD deposition method and an ALD deposition system for a passive film, and the ALD deposition method for the passive film comprises the following steps: S1, chip loading and transmission, S2, preheating, S3, TMA pulse, S4, O3 pulse, S5, loop iteration and film thickness control, and S6, chip taking. S7, raw material gas protection: when a gas pipeline and a gas supply port of the plasma deposition furnace are tightened, sealing is performed through a leakage-proof system, leaked gas is adsorbed into a waste gas recovery box to be stored, and raw material supply is stopped during leakage; and S8, purging maintenance is carried out. The anti-leakage system is arranged to seal the gas pipeline and the gas supply port of the plasma deposition furnace, and meanwhile, leaked gas is recycled, so that the harm of leakage is eliminated, and the safety is improved.

Description

Technical Field

[0001] This invention belongs to the field of solar cell deposition technology, specifically relating to an ALD deposition method and ALD deposition system for passivation films. Background Technology

[0002] In the film preparation process of solar cells, the use of atomic layer deposition (ALD) equipment for film deposition can achieve two core technological breakthroughs by leveraging its atomic-level precise control over film thickness, composition, and interface characteristics: First, it effectively improves the photoelectric conversion efficiency of solar cells, breaking through the performance bottleneck of traditional preparation processes; second, it significantly enhances the long-term operational stability and reliability of the cells under complex conditions such as high temperature, high humidity, and strong ultraviolet radiation, greatly extending the service life of the cells.

[0003] However, it is prone to the following problems during the deposition of the film:

[0004] 1. A sudden and serious leak occurred in the vacuum system, which caused the gas pipeline to burst at the gas supply port of the plasma deposition furnace, resulting in a leak of the supplied gas. The supplied gas contained dangerous gases such as TMA and methane. Once leaked, it was easy to cause fire and explosion upon contact with air.

[0005] 2. During plasma deposition, the stable and clean delivery of feedstock gases such as TMA, methane, and ozone is a crucial prerequisite for ensuring the quality of the deposited thin film. However, existing pipelines used to transport these feedstock gases are prone to internal wall problems (especially new pipelines or those after maintenance). For example, the inner wall of new pipelines is easily contaminated with moisture, oxide layers, dust, debris, and other pollutants during manufacturing, storage, and transportation. After maintenance, the inner wall of the pipeline is easily contaminated by environmental impurities during disassembly and reassembly, and metal debris residues generated during maintenance may also adhere to the pipeline's inner wall. In particular, TMA reacts and decomposes, forming non-volatile solid residues, leading to pipeline blockage, a continuous decrease in transport efficiency, and potentially the generation of particulate contaminants that can enter the reaction chamber of the plasma deposition furnace with the gas flow, resulting in increased defects in the deposited thin film.

[0006] Therefore, in order to address the above-mentioned technical problems, it is necessary to provide an ALD deposition method and an ALD deposition system for passivation films. Summary of the Invention

[0007] The purpose of this invention is to provide an ALD deposition method and ALD deposition system for passivation films, which can solve the above-mentioned technical problems.

[0008] To achieve the above objectives, a specific embodiment of the present invention provides the following technical solution:

[0009] The ALD deposition method for passivation films includes the following steps:

[0010] S1. Wafer loading and transfer: The silicon wafer is fed into the loading chamber of the plasma deposition furnace reaction chamber using a conveying device. After the loading chamber is closed, the vacuum is evacuated to the required process range.

[0011] S2. Preheating: The silicon wafer is transferred to the preheating chamber of the plasma deposition furnace, preheated, and then enters the process chamber to be heated to the process temperature and stabilized for 30-80 minutes.

[0012] The process temperature is 150-250℃;

[0013] S3, TMA pulse: After introducing TMA into the reaction chamber in a pulsed manner, stop the TMA supply and purge with high-purity nitrogen or argon for 5-20 seconds.

[0014] The pulse duration is 0.1-1s;

[0015] S4, O3 pulse: After introducing O3 into the reaction chamber in a pulsed manner, the carrier gas is purged again for 5-20 seconds;

[0016] The pulse duration is 0.1-1s;

[0017] S5. Iteration and film thickness control: Repeat steps S3 and S4 until the film thickness meets the target.

[0018] S6. Wafer Removal: After deposition is completed, the process chamber stops heating and is cooled to a safe temperature under N2 atmosphere. The robotic arm then removes the silicon wafer.

[0019] S7. Raw material gas protection: When the gas pipeline and the gas supply port of the plasma deposition furnace are to be opened, the leak prevention system will seal the gas and absorb the leaked gas into the waste gas recovery box for storage. The raw material supply will be stopped at the same time as the leak.

[0020] S8. Purging and maintenance: Regularly purge the TMA supply pipe, silane supply pipe and ozone supply pipe through the leak prevention system, while simultaneously conveying cleaning balls to assist in cleaning internal impurities. The purging time is set to 50-90 seconds.

[0021] The ALD deposition system includes an ALD deposition main housing, a plasma deposition furnace, a gas supply port, a TMA supply pipe, a silane supply pipe, and an ozone supply pipe. It also includes a leak prevention system, a purging system, a fire suppression system, and multiple cleaning balls. The leak prevention system includes a sealing mechanism and a reinforced adsorption mechanism. The sealing mechanism is sealed between the TMA, silane, and ozone supply pipes and the gas supply port. The reinforced adsorption mechanism is located on one end face of a mounting base inside the ALD deposition main housing. The purging system includes a purging mechanism and a recycling mechanism. The purging mechanism is connected to the TMA, silane, and ozone supply pipes, and is also connected to the recycling mechanism. The purging mechanism uses a blower to deliver nitrogen gas to purge impurities from the interior of the TMA, silane, and ozone supply pipes, which are then stored in the recycling mechanism. The fire suppression system is installed on the inner wall of the ALD deposition main shell and multiple end faces of the TMA supply pipe, silane supply pipe, and ozone supply pipe. The fire suppression system includes a fire suppression box, a first fire suppression nozzle, and a second fire suppression nozzle. The fire suppression box is located on multiple end faces of the ALD deposition main shell, and the first and second fire suppression nozzles are respectively installed on the multiple end faces of the fire suppression box. Multiple cleaning balls are stored in a cleaning ball storage box. Multiple cleaning brushes are fixedly connected to the outer end face of each cleaning ball. One end face of the cleaning ball storage box is connected to the TMA supply pipe, silane supply pipe, and ozone supply pipe respectively through a cleaning ball delivery pipe. The cleaning balls are fitted to the inner walls of the TMA supply pipe, silane supply pipe, and ozone supply pipe.

[0022] In one or more embodiments of the present invention, the leak prevention system includes a waste gas recovery main pipe and a waste gas recovery box. The sealing mechanism includes a sealing cover, a sealing ring, and a first waste gas recovery pipe. The sealing cover is sleeved between the TMA supply pipe, the silane supply pipe, and the ozone supply pipe and the gas supply port. The TMA supply pipe, the silane supply pipe, and the ozone supply pipe are sealed to one end face of the gas supply port by the sealing ring. One side of the first waste gas recovery pipe is connected to the waste gas recovery box, and the other side is connected to the sealing cover. The waste gas recovery box is connected to a second negative pressure machine. The second negative pressure machine includes an inlet and an outlet. The inlet is connected to the first waste gas recovery pipe, and the outlet is connected to the waste gas recovery box.

[0023] In one or more embodiments of the present invention, the enhanced adsorption mechanism includes a recovery pipe, one end face of which is connected to a second waste gas recovery pipe, the other end face of which is connected to an air inlet, and a plurality of recovery tanks are provided on the end face of the recovery pipe near the gas supply port.

[0024] In one or more embodiments of the present invention, the purging mechanism includes a blower, a nitrogen supply mechanism, and a plurality of purging branch pipes. The blower is fixed to the upper end face of the fixed base. One side of the blower is connected to the nitrogen supply mechanism. The blower includes a gas delivery pipe and a gas inlet pipe. The gas delivery pipe is connected to the plurality of purging branch pipes. The other end face of the plurality of purging branch pipes is respectively connected to a TMA supply pipe, a silane supply pipe, and an ozone supply pipe.

[0025] In one or more embodiments of the present invention, the recycling mechanism includes a waste recycling mechanism and a recycling cleaning mechanism, wherein the waste recycling mechanism is connected to a TMA supply pipe, a silane supply pipe and an ozone supply pipe, respectively, and the recycling cleaning mechanism is connected to the waste recycling mechanism.

[0026] In one or more embodiments of the present invention, the waste recycling mechanism includes a waste recycling bin, a recycling main pipe, and a first downslope plate. The waste recycling bin is located on one end face of the ALD deposition main shell. A conveying trough is provided on the upper end face of the waste recycling bin. The recycling main pipe is fixedly connected to the waste recycling bin on the upper side of the conveying trough. The recycling main pipe is connected to a TMA supply pipe, a silane supply pipe, and an ozone supply pipe in sequence through multiple conveying branch pipes. The first downslope plate is inclinedly arranged on the inner end face of the waste recycling bin, and multiple filter holes are provided on the first downslope plate.

[0027] In one or more embodiments of the present invention, the reuse cleaning mechanism is disposed on one side end face of the waste recycling mechanism, and a through groove is provided between the waste recycling mechanism and the reuse cleaning mechanism. The reuse cleaning mechanism includes a reuse cleaning tank, a dryer, a water tank, a water conveying pipe, a drying pipe, and multiple flipping components. The dryer and the water tank are respectively disposed on one side end face of the reuse cleaning tank. The inner wall end face of the reuse cleaning tank is respectively provided with a drying pipe and a water conveying pipe connected to the dryer and the water tank. Multiple nozzles are provided on one side end face of the water conveying pipe and the drying pipe. The second lower slope plate is inclinedly disposed on the inner wall end face of the reuse cleaning tank. Multiple second filter holes are provided on the second lower slope plate. Multiple flipping components are respectively disposed on multiple end faces of the reuse cleaning tank located on the upper side of the second lower slope plate. A wastewater tank is disposed at the bottom of the reuse cleaning tank located on the second lower slope plate.

[0028] In one or more embodiments of the present invention, the flipping assembly includes a drive motor and an agitator, the drive motor being connected to the agitator and the drive motor being fixedly connected to the inner wall end face of the reuse cleaning tank via a retaining ring.

[0029] In one or more embodiments of the present invention, a recycling ball mechanism is provided on one end face of the reuse cleaning mechanism. The recycling ball mechanism includes a recycling bin, a purging device, an automatic telescopic door, and a sealing plate. The purging device is located on the lower end face of the recycling bin and is provided with a conveying trough. A second through slot is provided on both the recycling bin and the reuse cleaning bin. An automatic telescopic door is provided on one side of the recycling bin located in the second through slot. A sealing slot is provided at the bottom of the recycling bin located in the second through slot. A sealing plate matching the sealing slot is fixedly connected to the bottom end face of the automatic telescopic door.

[0030] Compared with the prior art, the ALD deposition method and ALD deposition system for passivation films of the present invention have the following advantages;

[0031] 1) Install a leak prevention system to seal the gas pipelines and the gas supply port of the plasma deposition furnace, and at the same time recover leaked gas to eliminate the hazards of leakage and improve safety.

[0032] 2) Install a cleaning system to regularly clean the pipelines transporting TMA, methane, and ozone, removing residual impurities from the pipelines, improving the purity of the raw materials, and increasing transport efficiency. This prevents impurities from affecting the deposition of thin films. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of an ALD deposition system in one embodiment of the present invention;

[0035] Figure 2 for Figure 1 A schematic diagram of the structure at point A;

[0036] Figure 3 A cross-sectional view of the ALD deposition system;

[0037] Figure 4 for Figure 3 A schematic diagram of the structure at point B;

[0038] Figure 5 This is a partial end-face sectional view of the cleaning system;

[0039] Figure 6 This is a cross-sectional view of the ball recovery mechanism;

[0040] Figure 7 A schematic diagram showing the operational status of the ball recovery mechanism;

[0041] Figure 8 This is a structural diagram for cleaning the ball.

[0042] Explanation of key figure labels:

[0043] 1-ALD deposition main shell, 2-TMA supply system, 201-TMA supply pipe, 3-Silane supply system, 301-Silane supply pipe, 4-Ozone supply system, 401-Ozone supply pipe, 5-Plasma deposition furnace, 501-Gas supply port, 6-Cleaning system, 601-Waste recycling mechanism, 6011-Waste recycling bin, 6012-Conveying trough, 6013-Recycling main pipe, 6014-First downslope plate, 602-Reuse cleaning mechanism, 6021-Reuse cleaning bin, 6022-Dryer, 6023-Second downslope plate, 6024-Wastewater tank, 6025-Water conveying pipe, 6026-Fixing ring, 6027-Drive motor, 6028-Agitator rod, 6029-Drying pipe, 603-Water tank, 604-Blower, 6041-Gas supply pipe, 605-Cleaning sphere storage Storage box, 606-Main conveyor pipe for cleaning balls, 607-First solenoid valve, 608-Ball recovery mechanism, 6081-Recovery box, 6082-Purge equipment, 6083-Conveying trough, 6084-Automatic telescopic gate, 6085-Sealing plate, 6086-Sealing groove, 609-Through groove, 610-Impurity storage box, 7-Leakage prevention system, 701-Waste gas recovery main pipe, 7011-First waste gas recovery pipe 7012-Second waste gas recovery pipe, 702-Waste gas recovery box, 703-Recovery pipe, 7031-Recovery tank, 704-Sealing cover, 705-Sealing ring, 8-Fire extinguishing system, 801-Fire extinguishing box, 802-First fire extinguishing nozzle, 803-Second fire extinguishing nozzle, 9-Delivery branch pipe, 10-Second solenoid valve, 11-Cleaning branch pipe, 12-Cleaning ball, 1201-Cleaning brush, 13-Fixed seat. Detailed Implementation

[0044] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0045] like Figure 1As shown, the ALD deposition method and system for passivation films in one embodiment of the present invention employs a leak-proof system to seal the gas pipelines and the gas supply port of the plasma deposition furnace, while simultaneously recovering waste gas to eliminate the hazards of leakage and improve safety. A cleaning system is also included to periodically clean the pipelines transporting TMA, methane, and ozone, removing residual impurities from the pipelines, improving the purity of the raw materials, and increasing transport efficiency. This prevents impurities from affecting the deposited thin film.

[0046] The ALD deposition method for passivation films includes the following steps:

[0047] S1. Wafer Loading and Transfer: A conveyor system is used to feed the silicon wafers into the loading chamber of the plasma deposition furnace's reaction chamber. After the loading chamber is closed, a vacuum is evacuated to the required process range to ensure no air remains inside the chamber. The required process range is 1-100 Pa.

[0048] S2. Preheating: The silicon wafer is transferred to the preheating chamber of the plasma deposition furnace. After preheating, it enters the process chamber and is heated to the process temperature and stabilized for 30-80 minutes. The preheating temperature is 100-300℃.

[0049] The process temperature is 150-250℃;

[0050] S3, TMA pulse: After introducing TMA into the reaction chamber in a pulsed manner, stop the TMA supply [it is necessary to ensure that the precursor reaches saturation adsorption on the substrate surface], and then purge with high-purity nitrogen or argon for 5-20 seconds.

[0051] The pulse duration is 0.1-1s;

[0052] S4, O3 pulse: After introducing O3 into the reaction chamber in a pulsed manner, the carrier gas is purged again for 5-20 seconds;

[0053] The pulse duration is 0.1-1s;

[0054] S5. Cyclic Iteration and Film Thickness Control: Repeat steps S3 and S4 until the film thickness reaches the target. That is, the number of cycles is linearly positively correlated with the film thickness [e.g., depositing a 20nm Al2O3 film requires approximately 70-200 cycles].

[0055] S6. Wafer Removal: After deposition is completed, the process chamber stops heating and is cooled to a safe temperature under N2 atmosphere. The robotic arm then removes the silicon wafer.

[0056] S7. Raw material gas protection: When the connection between the gas pipeline and the gas supply port 501 of the plasma deposition furnace 5 is broken, the leak prevention system 7 will seal the connection and absorb the leaked gas into the waste gas recovery box 702 for storage. It should be noted that the raw material supply must be stopped when the gas leaks.

[0057] S8. Purging and maintenance: Periodically purge the internal pipelines of TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401 through the leak prevention system 7 to remove impurities and store them in the waste recycling mechanism 601. At the same time, multiple cleaning balls 12 are transported into the interior to assist in cleaning the internal impurities. The purging time is set to 50-90 seconds.

[0058] like Figure 1-8 As shown, the ALD deposition system includes an ALD deposition main housing 1, and a plasma deposition furnace 5 is installed inside the ALD deposition main housing 1. The plasma deposition furnace 5 includes a gas supply port 501, which is connected to a TMA supply pipe 201, a silane supply pipe 301, and an ozone supply pipe 401. The TMA, methane, and ozone required for the deposition film are supplied through the TMA supply system 2, the silane supply system 3, and the ozone supply system 4.

[0059] like Figure 3-4 As shown, the leak prevention system 7 includes a sealing mechanism and a reinforced adsorption mechanism. The sealing mechanism is sealed between the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401 and the gas supply port 501, providing a reinforced seal at the connection between the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401 and the gas supply port 501. Even if the connection between the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401 and the gas supply port 501 comes undone, there will be no leakage due to the sealing mechanism.

[0060] The leak prevention system 7 includes a waste gas recovery main pipe 701 and a waste gas recovery box 702. The sealing mechanism includes a sealing cover 704, a sealing ring 705, and a first waste gas recovery pipe 7011. The sealing cover 704 is sleeved between the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401 and the gas supply port 501, covering the connection between the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401 and the gas supply port 501. The sealing cover 704 also covers part of the end face of the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401. The TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401 are sealed to one end face of the gas supply port 501 by the sealing ring 705. The sealing cover 704 has a sealing hole that matches the TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401. The TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401 pass through the sealing hole and are connected to the gas supply port 501. A sealing ring 705 is provided at the place where the TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401 are in contact with the sealing hole to seal the contact point and prevent gas leakage.

[0061] Preferably, the sealing cover 704 is made of any one of nickel-based high-temperature alloy, titanium, or fiberglass composite material.

[0062] One side of the first waste gas recovery pipe 7011 is connected to the waste gas recovery box 702, and the other side is connected to the sealing cover 704. The waste gas recovery box 702 is connected to the second negative pressure unit, which includes an inlet and an outlet. The inlet of the second negative pressure unit is connected to the first waste gas recovery pipe 7011, and the outlet is connected to the waste gas recovery box 702. Specifically, when the connection between the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401 and the gas supply port 501 breaks and gas leaks, the gas will not diffuse to the outside under the action of the sealing cover 704. At the same time, the second negative pressure unit starts, and the leaked gas is quickly transported and stored in the waste gas recovery box 702 through the first waste gas recovery pipe 7011 and the waste gas recovery main pipe 701.

[0063] The enhanced adsorption mechanism is located on one side of the fixed seat 13 inside the ALD deposition main housing 1. In the event that some end faces of the TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401 develop cracks due to accidents, the enhanced adsorption mechanism can be used to adsorb the leaked TMA, methane and ozone, prevent them from continuing to spread and causing greater danger, and reduce losses.

[0064] The enhanced adsorption mechanism includes a recovery pipe 703. One end of the recovery pipe 703 is connected to a second waste gas recovery pipe 7012, and the other end of the second waste gas recovery pipe 7012 is connected to the inlet of a second negative pressure unit. The waste gas recovery main pipe 701 contains a first waste gas recovery pipe 7011 and a second waste gas recovery pipe 7012. Multiple recovery tanks 7031 are located on the end face of the recovery pipe 703 near the gas supply port 501. Specifically, if some end faces of the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401 develop cracks due to accidents, or if leaks occur at the connection between the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401 and the sealing ring 705 due to accidents, the second negative pressure unit can be activated to deliver negative pressure to the second waste gas recovery pipe 7012 and the recovery pipe 703. The leaked gas is then adsorbed through the multiple recovery tanks 7031 and transported to the waste gas recovery box 702 for storage.

[0065] like Figure 4-7 As shown, the cleaning system 6 includes a purging mechanism and a recycling mechanism. The purging mechanism is connected to the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401, respectively. The purging mechanism is connected to the recycling mechanism. The purging mechanism uses a blower 604 to deliver nitrogen gas to purge impurities inside the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401. The impurities are then stored in the recycling mechanism to improve the purity of the raw materials and increase the conveying efficiency.

[0066] The purging mechanism includes a blower 604, a nitrogen supply mechanism, and multiple purging branch pipes 11. A mounting base 13 is fixedly connected to one end face of the ALD deposition main housing 1 at the gas supply port 501. The blower 604 is fixed to the upper end face of the mounting base 13. The nitrogen supply mechanism is connected to one side of the blower 604. The blower 604 includes a gas delivery pipe 6041 and an inlet pipe. The gas delivery pipe 6041 connects to multiple purging branch pipes 11. The other end faces of the multiple purging branch pipes 11 are respectively connected to a TMA supply pipe 201, a silane supply pipe 301, and an ozone supply pipe 401. Nitrogen is supplied through the inlet pipe of the blower 604 connected to the nitrogen supply mechanism and transported through the gas delivery pipe 6041 to the interiors of the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401 to clean impurities, which are then purged to the waste recovery mechanism 601 for storage.

[0067] The other end faces of the TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401 are connected to the recovery main pipe 6013 through the conveying branch pipe 9, so that the purged impurities enter the waste recovery box 6011 for storage through the conveying branch pipe 9 and the recovery main pipe 6013.

[0068] It should be noted that if there are stubborn impurities on the inner wall of the pipe that cannot be removed by the purging mechanism, the TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401 can be disassembled and thoroughly cleaned chemically or replaced with new pipes.

[0069] The recycling and reuse mechanism includes a waste recycling mechanism 601 and a reuse cleaning mechanism 602. The waste recycling mechanism 601 is connected to the TMA supply pipe 201, the silane supply pipe 301 and the ozone supply pipe 401, respectively. The reuse cleaning mechanism 602 is connected to the waste recycling mechanism 601.

[0070] like Figure 5 As shown, the waste recycling mechanism 601 includes a waste recycling bin 6011, a recycling main pipe 6013, and a first downslope plate 6014. The waste recycling bin 6011 is located on one side end face of the ALD deposition main shell 1. A conveying groove 6012 is opened on the upper end face of the waste recycling bin 6011. The recycling main pipe 6013 is fixedly connected to the waste recycling bin 6011 on the upper side of the conveying groove 6012. The recycling main pipe 6013 is connected to the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401 in sequence through multiple conveying branch pipes 9. The waste recycling bin 6011, the recycling main pipe 6013, the conveying branch pipes 9 are connected to the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401.

[0071] The inner end face of the waste recycling bin 6011 is inclined with a first downward slope plate 6014, and multiple filter holes are opened on the first downward slope plate 6014. Impurities entering the waste recycling bin 6011 can enter the waste recycling bin 6011 through the recycling main pipe 6013 and be stored under the first downward slope plate 6014. The waste recycling bin 6011 is located under the first downward slope plate 6014 and has an impurity storage box 610. The impurity storage box 610 is detachably connected to the waste recycling bin 6011 and is used to store fallen impurities, which are convenient for removal and cleaning of the stored impurities later.

[0072] Each of the multiple delivery branch pipes 9 is equipped with a second solenoid valve 10 at the end face where it connects to the TMA supply pipe 201, the silane supply pipe 301, and the ozone supply pipe 401, facilitating the opening and closing of the pipes to transport the medium as needed. A fourth solenoid valve is installed between the first waste gas recovery pipe 7011 and the sealing cover 704, and a fifth solenoid valve is installed between the second waste gas recovery pipe 7012 and the recovery pipe 703, for controlling the opening and closing of the pipes.

[0073] Multiple cleaning balls 12 are stored in a cleaning ball storage box 605. One end face of the cleaning ball storage box 605 is connected to multiple cleaning branch pipes 11 through a cleaning ball delivery pipe. A second blower is installed inside the cleaning ball storage box 605 to blow the cleaning balls 12 into the interior of the multiple cleaning branch pipes 11, and then into the TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401 for cleaning.

[0074] A third solenoid valve is installed between the cleaning ball delivery pipe and the TMA supply pipe 201, the silane supply pipe 301 and the ozone supply pipe 401 to control the opening and closing of the cleaning ball delivery pipe to deliver the cleaning ball 12.

[0075] When the cleaning ball 12 needs to be delivered to the TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401 for cleaning, the third solenoid valve is opened, and the cleaning ball 12 enters the TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401 in sequence from the cleaning ball storage box 605, the cleaning ball delivery pipe and multiple cleaning branch pipes 11, and performs moving cleaning under the action of airflow.

[0076] Furthermore, such as Figure 8 As shown, the cleaning ball 12 is fitted to the inner walls of the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401. Multiple cleaning brushes 1201 are fixedly connected to the outer end face of the cleaning ball 12. The outer ends of the multiple cleaning brushes 1201 can conform to the inner walls of the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401, but under the action of airflow, the cleaning ball 12 can be moved along the inner wall of the pipe without stopping. By gently scraping the inner pipe during its movement, the multiple cleaning brushes 1201 can remove and clean impurities adhering to the inner wall of the pipe, removing impurities that are difficult to blow away, thus achieving enhanced cleaning and maintaining the cleanliness of the inside of the pipe.

[0077] The cleaning ball 12 and the cleaning brush 1201 are preferably made of soft Teflon or polyester. The cleaning brush 1201 is made of a soft material and will not scratch the inner wall of the pipe.

[0078] The reuse cleaning mechanism 602 is set on one end face of the waste recycling mechanism 601. A through groove 609 is provided between the waste recycling mechanism 601 and the reuse cleaning mechanism 602. One side of the first lower slope plate 6014 is inclined and fixed to the waste recycling box 6011 located below the through groove 609. The cleaning ball 12 that is easy to enter slides down through the first lower slope plate 6014 into the through groove 609 and is stored inside the reuse cleaning box 6021.

[0079] It is worth noting that a second automatic telescopic door is provided on the upper end face of the waste recycling bin 6011 located in the through groove 609. The second automatic telescopic door can open or close the through groove 609. When the cleaning ball 12 entering the waste recycling bin 6011 slides down through the through groove 609 into the reuse cleaning bin 6021 for storage, and the reuse cleaning bin 6021 begins to clean the cleaning ball 12, the second automatic telescopic door controls the second multi-stage telescopic plate to descend and close the passage of the through groove 609, thus sealing it.

[0080] The reuse cleaning mechanism 602 includes a reuse cleaning tank 6021, a dryer 6022, a water tank 603, a water delivery pipe 6025, a drying pipe 6029, and multiple tilting components. The dryer 6022 and the water tank 603 are respectively located on one side of the reuse cleaning tank 6021. The inner wall of the reuse cleaning tank 6021 is provided with multiple drying pipes 6029 and water delivery pipes 6025 connected to the dryer 6022 and the water tank 603, respectively. Multiple nozzles are provided on one side of both the water delivery pipes 6025 and the drying pipes 6029. Water is delivered from the water tank 603 and enters the multiple nozzles through the water delivery pipes 6025 to spray and clean the multiple cleaning balls 12 stored in the reuse cleaning tank 6021. The dryer 6022 delivers hot air into the multiple drying pipes 6029 and sprays hot air through the multiple nozzles to heat and dry the cleaning balls 12 after cleaning, which facilitates the recycling of the cleaning balls 12.

[0081] The second downslope plate 6023 is inclinedly disposed on the inner wall end face of the reuse cleaning tank 6021. Multiple second filter holes are provided on the second downslope plate 6023. The reuse cleaning tank 6021 is provided with a wastewater tank 6024 at the bottom of the second downslope plate 6023. The cleaned water can enter the wastewater tank 6024 through the second filter holes for storage.

[0082] Multiple flipping components are respectively set on multiple end faces of the reuse cleaning tank 6021 located on the upper side of the second lower slope plate 6023. They agitate the multiple cleaning balls 12 located on the upper side of the second lower slope plate 6023 that enter the reuse cleaning tank 6021, so that when the water conveying pipe 6025 is cleaned, the multiple end faces of the cleaning balls 12 are cleaned, and there will be no residual positions that are not cleaned.

[0083] The flipping assembly includes a drive motor 6027 and an agitator 6028. The drive motor 6027 is connected to the agitator 6028. The drive motor 6027 drives the agitator 6028 to rotate, thereby agitating the cleaning ball 12. The drive motor 6027 is fixedly connected to the inner wall of the reuse cleaning tank 6021 by a retaining ring 6026.

[0084] It is worth noting that the stirring rod 6028 includes a rotating shaft and multiple arc-shaped stirring plates. When the rotating shaft rotates, it can drive the multiple arc-shaped stirring plates to rotate, thereby stirring the multiple cleaning balls 12.

[0085] The other end of the cleaning ball storage box 605 is connected to the cleaning ball conveying main pipe 606. A first solenoid valve 607 is provided between the cleaning ball conveying main pipe 606 and the cleaning ball storage box 605 to control the opening and closing of the cleaning ball conveying main pipe 606. The other end of the cleaning ball conveying main pipe 606 is connected to the recycling ball mechanism 608, so that the cleaning balls 12 that have been cleaned inside the recycling ball mechanism 608 can be transported back to the cleaning ball storage box 605 for storage, so as to facilitate recycling and save costs.

[0086] Furthermore, a ball recovery mechanism 608 is provided on one side of the reuse cleaning mechanism 602. The ball recovery mechanism 608 includes a recycling box 6081, a purging device 6082, an automatic telescopic door 6084, and a sealing plate 6085. Both the recycling box 6081 and the reuse cleaning box 6021 are provided with a second through groove. One side of the second lower slope plate 6023 is fixedly connected to the lower side of the reuse cleaning box 6021 located in the second through groove, ensuring that the cleaning ball 12 enters the interior of the reuse cleaning box 6021. After the automatic telescopic door 6084 opens the second through groove, the cleaning ball 12 slides down the second lower slope plate 6023 into the interior of the recycling box 6081 for storage.

[0087] The recycling bin 6081 is equipped with an automatic telescopic door 6084 on one side of the second through slot. The automatic telescopic door 6084 includes a multi-stage telescopic plate. When it is necessary to open the second through slot, the automatic telescopic door 6084 can be activated to control the multi-stage telescopic plate to open the second through slot. Then, the cleaning bin 6021 and the recycling bin 6081 are in a connected state. At this time, the cleaning balls 12 that have been cleaned inside the cleaning bin 6021 can slide down through the second downslope plate 6023 into the recycling bin 6081 for storage.

[0088] Furthermore, a sealing groove 6086 is provided at the bottom of the second through groove in the recycling bin 6081, and a sealing plate 6085 matching the sealing groove 6086 is fixedly connected to the bottom end face of the automatic telescopic door 6084. When the automatic telescopic door 6084 controls the multi-stage telescopic plate to descend to abut against the bottom of the recycling bin 6081 in the second through groove to close it, the sealing plate 6085 connected to the bottom of the multi-stage telescopic plate is inserted into the sealing groove 6086 to reinforce the seal of the second through groove. This prevents water from the inside of the reuse cleaning bin 6021 from entering the inside of the recycling bin 6081.

[0089] The purging device 6082 is located on the lower end face of the recycling bin 6081. The purging device 6082 is equipped with a conveying trough 6083. When the cleaning balls 12 that have been cleaned need to be conveyed into the cleaning ball storage bin 605 for storage, the first solenoid valve 607 can be opened, and the purging device 6082 will start to convey airflow through the conveying trough 6083 to blow multiple cleaning balls 12 into the cleaning ball conveying main pipe 606 and into the cleaning ball storage bin 605 for storage.

[0090] The fire extinguishing system 8 is installed on the inner wall of the ALD deposition main shell 1 and multiple end faces of the TMA supply pipe 201, silane supply pipe 301 and ozone supply pipe 401. When a fire occurs due to a dangerous gas leak, it can be extinguished in time and the harm can be reduced.

[0091] Furthermore, the fire extinguishing system 8 includes a fire extinguishing box 801, a first fire extinguishing nozzle 802, and a second fire extinguishing nozzle 803. The fire extinguishing box 801 is located on multiple end faces of the ALD deposition main shell 1. The multiple end faces of the fire extinguishing box 801 are respectively equipped with the first fire extinguishing nozzle 802 and the second fire extinguishing nozzle 803. This allows the fire extinguishing box 801 to deliver the extinguishing medium, which is then sprayed through the multiple first fire extinguishing nozzles 802 and the second fire extinguishing nozzles 803 to extinguish the fire and reduce the damage. The extinguishing medium is preferably dry powder or carbon dioxide.

[0092] When using, such as Figure 4 As shown, when the connection between the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401 and the gas supply port 501 breaks and gas leaks, the leaked gas enters the sealing cover 704 for storage. Simultaneously, the second negative pressure unit starts to adsorb the leaked gas inside the sealing cover 704 and transports it to the waste gas recovery box 702 for storage via the first waste gas recovery pipe 7011 and the waste gas recovery main pipe 701. If some end faces of the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401 develop cracks due to accidents, or if gas leaks occur due to accidents at the connection between the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401 and the sealing ring 705, the second negative pressure unit can be started to deliver negative pressure through multiple recovery tanks 7031 to adsorb the leaked gas and transport it to the waste gas recovery box 702 for storage.

[0093] When it is necessary to periodically clean the impurities inside the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401, the blower 604 is started to deliver nitrogen gas, which is then transported through the gas delivery pipe 6041 to the interior of the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401 to purge and clean the impurities. The impurities are then blown to the waste recycling mechanism 601 for storage. At the same time, the third solenoid valve is opened, and the cleaning ball 12 enters the interior of the TMA supply pipe 201, silane supply pipe 301, and ozone supply pipe 401 sequentially from the cleaning ball storage box 605, the cleaning ball delivery pipe, and multiple cleaning branch pipes 11. Under the action of airflow, it performs a moving, gentle, scraping-like enhanced cleaning to keep the inside of the pipes clean, and the cleaned cleaning ball 12 is stored in the waste recycling mechanism 601.

[0094] like Figure 5 As shown, after cleaning, the cleaning balls 12 enter the waste recycling mechanism 601 through multiple conveying branch pipes 9, fall onto the first lower slope plate 6014, slide down through the through groove 609, and enter the second lower slope plate 6023 of the reuse cleaning tank 6021 for storage. At this time, the reuse cleaning mechanism 602 starts to clean the dirty cleaning balls 12. At this time, the second automatic telescopic door and the automatic telescopic door 6084 are closed. The water conveying pipe 6025 delivers water through multiple nozzles into the inner wall of the reuse cleaning tank 6021 for cleaning. At the same time, the flipping component rotates intermittently to flip the accumulated cleaning balls 12 for enhanced surface cleaning. After the cleaning time is set to 5-8 minutes, the drying pipe 6029 starts to deliver hot air to dry the cleaning balls 12. The drying time is set to 30-50 minutes. During the drying process, the flipping component rotates intermittently to accelerate the drying of the cleaning balls 12.

[0095] After drying, the automatic telescopic gate 6084 opens the second through slot, and the cleaning balls 12 accumulated on the second downward slope plate 6023 slide into the recycling bin 6081 for storage. Later, the first solenoid valve 607 can be opened, and the blowing device 6082 starts to deliver airflow through the conveying trough 6083 to blow multiple cleaning balls 12 into the cleaning ball conveying main pipe 606 and into the cleaning ball storage bin 605 for storage, allowing for multiple cycles of recycling.

[0096] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0097] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An ALD deposition method for passivation films, characterized in that, Includes the following steps: S1. Wafer loading and transfer: The silicon wafer is fed into the loading chamber of the plasma deposition furnace reaction chamber using a conveying device. After the loading chamber is closed, the vacuum is evacuated to the required process range. S2. Preheating: The silicon wafer is transferred to the preheating chamber of the plasma deposition furnace, preheated, and then enters the process chamber to be heated to the process temperature and stabilized for 30-80 minutes. The process temperature is 150-250℃; S3, TMA pulse: After introducing TMA into the reaction chamber in a pulsed manner, stop the TMA supply and introduce nitrogen or argon gas for purging. The purging time is 5-20 seconds. The pulse duration is 0.1-1s; S4, O3 pulse: After introducing O3 into the reaction chamber in a pulsed manner, the carrier gas is purged again for 5-20 seconds; The pulse duration is 0.1-1s; S5. Iteration and film thickness control: Repeat steps S3 and S4 until the film thickness meets the target. S6. Wafer Removal: After deposition is completed, the process chamber stops heating and is cooled to a safe temperature under N2 atmosphere. The robotic arm then removes the silicon wafer. S7. Raw material gas protection: When the gas pipeline and the gas supply port of the plasma deposition furnace are to be opened, the leak prevention system will seal the gas and absorb the leaked gas into the waste gas recovery box for storage. The raw material supply will be stopped at the same time as the leak. S8. Purging and maintenance: Regularly purge the TMA supply pipe, silane supply pipe and ozone supply pipe through the leak prevention system, while simultaneously conveying cleaning balls to assist in cleaning internal impurities. The purging time is set to 50-90 seconds.

2. An ALD deposition system, applied to the ALD deposition method for passivation films as described in claim 1, the ALD deposition system comprising an ALD deposition main housing, a plasma deposition furnace, a gas supply port, a TMA supply pipe, a silane supply pipe, and an ozone supply pipe, characterized in that, include: The leak prevention system includes a sealing mechanism and an enhanced adsorption mechanism. The sealing mechanism is sealed between the TMA supply pipe, the silane supply pipe, and the ozone supply pipe and the gas supply port. The enhanced adsorption mechanism is located on one end face of the fixing seat inside the ALD deposition main housing. The cleaning system includes a purging mechanism and a recycling mechanism. The purging mechanism is connected to a TMA supply pipe, a silane supply pipe and an ozone supply pipe, respectively. The purging mechanism is connected to the recycling mechanism. The purging mechanism uses a blower to deliver nitrogen gas to purge impurities inside the TMA supply pipe, the silane supply pipe and the ozone supply pipe and store them in the recycling mechanism. The fire extinguishing system is installed on the inner wall of the ALD deposition main shell, the TMA supply pipe, the silane supply pipe and the ozone supply pipe at multiple ends. The fire extinguishing system includes a fire extinguishing box, a first fire extinguishing nozzle and a second fire extinguishing nozzle. The fire extinguishing box is located on multiple ends of the ALD deposition main shell, and the first fire extinguishing nozzle and the second fire extinguishing nozzle are respectively installed on the multiple ends of the fire extinguishing box. Multiple cleaning balls are stored in a cleaning ball storage box. Multiple cleaning brushes are fixedly connected to the outer end face of the cleaning balls. One end face of the cleaning ball storage box is connected to the TMA supply pipe, silane supply pipe and ozone supply pipe respectively through the cleaning ball delivery pipe. The cleaning balls are matched with the inner walls of the TMA supply pipe, silane supply pipe and ozone supply pipe.

3. The ALD deposition system according to claim 2, characterized in that, The leak prevention system includes a main exhaust gas recovery pipe and an exhaust gas recovery box. The sealing mechanism includes a sealing cover, a sealing ring, and a first exhaust gas recovery pipe. The sealing cover is fitted between the TMA supply pipe, the silane supply pipe, and the ozone supply pipe and the gas supply port. The TMA supply pipe, the silane supply pipe, and the ozone supply pipe are sealed to one end face of the gas supply port by the sealing ring. One side of the first exhaust gas recovery pipe is connected to the exhaust gas recovery box, and the other side is connected to the sealing cover. The exhaust gas recovery box is connected to a second negative pressure unit. The second negative pressure unit includes an inlet and an outlet. The inlet is connected to the first exhaust gas recovery pipe, and the outlet is connected to the exhaust gas recovery box.

4. The ALD deposition system according to claim 3, characterized in that, The enhanced adsorption mechanism includes a recovery pipe, one end of which is connected to a second waste gas recovery pipe, and the other end of the second waste gas recovery pipe is connected to an air inlet. The end of the recovery pipe near the gas supply port is provided with multiple recovery tanks.

5. The ALD deposition system according to claim 2 or 4, characterized in that, The purging mechanism includes a blower, a nitrogen supply mechanism, and multiple purging branch pipes. The blower is fixed to the upper end face of the fixed base. One side of the blower is connected to the nitrogen supply mechanism. The blower includes a gas delivery pipe and a gas inlet pipe. The gas delivery pipe is connected to multiple purging branch pipes. The other end face of the multiple purging branch pipes is respectively connected to a TMA supply pipe, a silane supply pipe, and an ozone supply pipe.

6. The ALD deposition system according to claim 5, characterized in that, The recycling and reuse mechanism includes a waste recycling mechanism and a reuse cleaning mechanism. The waste recycling mechanism is connected to a TMA supply pipe, a silane supply pipe, and an ozone supply pipe, respectively. The reuse cleaning mechanism is connected to the waste recycling mechanism.

7. The ALD deposition system according to claim 6, characterized in that, The waste recycling mechanism includes a waste recycling bin, a recycling main pipe, and a first downslope plate. The waste recycling bin is located on one end face of the ALD deposition main shell. A conveying trough is opened on the upper end face of the waste recycling bin. The recycling main pipe is fixedly connected to the waste recycling bin on the upper side of the conveying trough. The recycling main pipe is connected to the TMA supply pipe, silane supply pipe, and ozone supply pipe in sequence through multiple conveying branch pipes. The first downslope plate is inclinedly arranged on the inner end face of the waste recycling bin, and multiple filter holes are opened on the first downslope plate.

8. The ALD deposition system according to claim 7, characterized in that, The reuse cleaning mechanism is located on one side of the waste recycling mechanism. A through groove is provided between the waste recycling mechanism and the reuse cleaning mechanism. The reuse cleaning mechanism includes a reuse cleaning tank, a dryer, a water tank, a water conveying pipe, a drying pipe, and multiple tilting components. The dryer and the water tank are respectively located on one side of the reuse cleaning tank. The inner wall of the reuse cleaning tank is respectively provided with a drying pipe and a water conveying pipe connected to the dryer and the water tank. Multiple nozzles are provided on one side of the water conveying pipe and the drying pipe. The second lower slope plate is inclinedly located on the inner wall of the reuse cleaning tank. Multiple second filter holes are provided on the second lower slope plate. Multiple tilting components are respectively located on multiple end faces of the reuse cleaning tank located on the upper side of the second lower slope plate. A wastewater tank is located at the bottom of the reuse cleaning tank on the second lower slope plate.

9. The ALD deposition system according to claim 8, characterized in that, The flipping assembly includes a drive motor and an agitator. The drive motor is connected to the agitator and is fixedly connected to the inner wall end face of the recycling cleaning tank by a fixing ring.

10. The ALD deposition system according to claim 9, characterized in that, The recycling cleaning mechanism has a recycling ball mechanism on one end face. The recycling ball mechanism includes a recycling box, a purging device, an automatic telescopic door, and a sealing plate. The purging device is located on the lower end face of the recycling box and has a conveying trough. Both the recycling box and the recycling cleaning box have a second through slot. The recycling box has an automatic telescopic door on one side of the second through slot. The recycling box has a sealing slot at the bottom of the second through slot. The bottom end face of the automatic telescopic door is fixedly connected to a sealing plate that matches the sealing slot.

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