Accelerated aging equipment

Abstract

The invention discloses accelerated aging equipment, which relates to the field of organic semiconductor materials, and constructs a semiconductor device accelerated aging test space with stable structure and controllable environment by integrating an optical platform bread board, a light source module, a supporting and fixing module, a control module and a composite heat dissipation system in a camera obscura body. Wherein the light source module can stably output a continuous simulation sunlight spectrum with adjustable light intensity and light color under the adjustment of the control module, so that accurate illumination accelerated aging of a device to be tested is realized; according to the composite heat dissipation system, the light source module and the supporting and fixing module are subjected to targeted heat dissipation, a heat dissipation circulation loop communicated with the supporting and fixing module is formed, heat accumulation under high light intensity modulation is effectively restrained, the temperature of a test area is kept stable and controllable, and therefore the high acceleration rate is guaranteed, and meanwhile the test efficiency is improved. The interference of thermal runaway on the test result is avoided, and the accuracy, repeatability and reliability of the service life test of the semiconductor device are integrally improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor material and device testing technology, and in particular to an accelerated aging device. Background Technology

[0002] Third-generation thin-film solar cells refer to a new type of photovoltaic technology that differs from traditional crystalline silicon cells and second-generation inorganic thin-film cells (such as CdTe and CIGS). They mainly include organic solar cells, perovskite solar cells, quantum dot solar cells, and their tandem structures. These devices, based on novel semiconductor materials, possess significant advantages such as strong material designability, low-temperature fabrication, flexibility, and high power generation per unit mass, overcoming the limitations of traditional silicon-based photovoltaics in terms of weight, form factor, and manufacturing energy consumption. In recent years, with the rapid development of new material systems, interface control, and device structures, the photoelectric conversion efficiency of third-generation thin-film solar cells has approached or even exceeded that of some traditional technologies, demonstrating broad application prospects in areas such as space energy, building-integrated photovoltaics, wearable electronics, and distributed energy. However, their long-term stability, large-scale fabrication, and adaptability to service environments still require further breakthroughs.

[0003] In practical applications, the performance degradation of third-generation thin-film solar cells is mainly caused by the coupled effects of multiple factors, including light, heat, and environmental atmosphere (such as oxygen and water vapor). Among these, light (especially ultraviolet light) can induce photochemical degradation of the active layer material, while the heat generated during device operation can damage the optimized morphology of the active layer. To evaluate and improve device lifetime, accelerated aging tests are required.

[0004] Existing aging test devices generally have the following problems: First, the spectrum of the light source used does not match the real solar spectrum well, affecting the accuracy of the test; second, they cannot provide sufficiently high light intensity to effectively shorten the test cycle; third, under high light intensity test conditions, the device and test equipment themselves will generate a lot of heat. If the heat dissipation is insufficient, it will lead to the temperature runaway of the test environment, making it impossible to distinguish between thermal degradation and photodegradation mechanisms, thus distorting the test data. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide an accelerated aging device that can provide ultra-high intensity light that is highly matched with the solar spectrum and has an efficient composite heat dissipation system to maintain a low temperature environment in the test sample area during accelerated testing while ensuring the stability of the light source. This prevents the spectrum from changing due to the temperature rise caused by long-term irradiation, thus ensuring the accuracy and reliability of the test data.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: An accelerated aging apparatus for performing lifetime testing on semiconductor devices, comprising: A dark box, the interior of which constitutes the test space; An optical platform breadboard is located at the bottom of the dark chamber, forming the bottom support of the accelerated aging device, and the upper surface of the optical platform breadboard is located within the test space; A light source module, disposed within the test space, is used to provide continuous-spectrum white light to the semiconductor device under test; An integrating sphere positioning slide rail system is disposed on the breadboard of the optical platform and extends below the light source module; A support and fixing module is disposed within the test space for fixing the semiconductor device under test; the support and fixing module is slidably disposed on the integrating sphere positioning slide rail system, and the integrating sphere positioning slide rail system is used to drive the semiconductor device under test fixed at the top center of the support and fixing module to align with the light source module; A control module, electrically connected to the light source module, is used to adjust the light intensity and color of the light emitted by the light source module; A composite heat dissipation system includes a light source heat dissipation section for dissipating heat from the light source module, and a support heat dissipation section for dissipating heat from the support and fixing module; the support heat dissipation section is hollow, and the two sides of the light source heat dissipation section are thermally conductive to the support heat dissipation section, and the support heat dissipation section is connected to the support and fixing module to form a heat dissipation circulation loop.

[0007] As a further improvement to the above technical solution, the light source module is disposed on the support and fixing module, and the light source module includes: A multi-color temperature LED array light panel; An optical lens is positioned in the light-emitting direction of the LED light panel to focus the light onto the semiconductor device under test.

[0008] As a further improvement to the above technical solution, the LED light panel includes multiple monochrome LED beads, each monochrome LED bead has a rated power of 100W, the LED light panel can provide multiple color temperature adjustment levels, and the light intensity of each color temperature adjustment level is adjustable and the maximum light intensity can reach 50 standard sunlight (AM1.5G spectrum) light intensity.

[0009] As a further improvement to the above technical solution, the control module is an intelligent lighting control system built based on the DALI protocol, which includes: A user control terminal for inputting light intensity and color control commands; A single-channel DALI gateway module, which communicates via wired RS, is connected to the user control terminal to receive and parse the control commands. A DALI constant current dimming driver is connected to the DALI gateway module via a DALI bus; wherein the DALI constant current dimming driver provides constant current power to the dual-color LED light panel through a power line, and executes dimming and color adjustment commands from the single-channel DALI gateway module through a control line.

[0010] As a further improvement to the above technical solution, the support and fixing module includes: A sample base is linearly slidably disposed on the integrating sphere positioning slide rail system, and a groove is provided on its top for accommodating the semiconductor device under test; Two first support brackets are located on both sides of the sample base to fix the control module; Two second support brackets are symmetrically arranged between two first support brackets. The two second support brackets are used to clamp and fix the heat dissipation part of the light source, and the light source module is fixed on the heat dissipation part of the light source.

[0011] As a further improvement to the above technical solution, the sample base is provided with a first connecting hole and a second connecting hole inside. The heat dissipation part of the support body includes a first liquid cooling circulation loop and a second liquid cooling circulation loop. The interior of each of the two second support brackets is provided with a third connecting hole. Both ends of the third connecting hole are provided with quick-connect fittings for air pipes. The first liquid cooling circulation loop passes through the first connecting hole and is connected to the quick-connect fittings for air pipes at both ends of the third connecting hole of one of the second support brackets. The second liquid cooling circulation loop passes through the second connecting hole and is connected to the quick-connect fittings for air pipes at both ends of the third connecting hole of the other second support bracket.

[0012] As a further improvement to the above technical solution, the composite heat dissipation system includes a liquid supply pipeline and a liquid outlet pipeline, which are located on both sides of the sample base. The liquid supply pipeline is connected to the quick-connect fitting of the air pipe at the port of the two third connecting holes on the first side of the two second support brackets, and the liquid outlet pipeline is connected to the quick-connect fitting of the air pipe at the port of the two third connecting holes on the second side of the two second support brackets.

[0013] As a further improvement to the above technical solution, the sample base, the two first support brackets and the two second support brackets are respectively arranged, and the light source module is located above the sample base.

[0014] As a further improvement to the above technical solution, the integrating sphere positioning slide rail system includes: The slide rail is fixed to the optical platform by screws; The first slider moves linearly along the slide rail; the sample base is fixedly mounted on the first slider by screws. The second slider moves linearly along the slide rail; An integrating sphere is mounted on the second slider. The first slider and the second slider respectively drive the sample base and the integrating sphere to be aligned with the light source module. By adjusting the installation height of the first slider and the second slider on the slide rail, the height alignment between the semiconductor device under test fixed on the sample base and the integrating sphere can be achieved.

[0015] As a further improvement to the above technical solution, the heat dissipation part of the light source is an active air-cooled heat sink, which includes: An aluminum heat sink assembly with screw holes at the bottom for mounting and fixing; A fan is positioned above the aluminum heat sink fin assembly and is fixed to the air inlet end of the heat sink fin assembly; wherein, the LED light panel is fixed to the bottom of the aluminum heat sink fin assembly through the screw holes.

[0016] The beneficial effects of this invention are as follows: By integrating an optical platform breadboard, a light source module, a support and fixing module, a control module, a composite heat dissipation system, and an integrating sphere positioning slide rail system within the dark chamber, a structurally stable and environmentally controllable accelerated aging test space for semiconductor devices is constructed. The light source module, under the adjustment of the control module, can stably output continuous-spectrum white light with adjustable intensity and color, achieving precise illumination acceleration of the device under test. The integrating sphere of the integrating sphere positioning slide rail system is used to collect the optical parameters (such as light intensity and spectrum) of the device under test. Its relative height to the test platform directly determines the sampling accuracy. By adjusting the heights of the two to be consistent, the sampling distance and angle for each test can be kept constant, avoiding test data fluctuations caused by height deviations and meeting the repeatability requirements of high-precision aging tests. The composite heat dissipation system provides targeted heat dissipation for the light source module and the support and fixing module, forming a heat dissipation circulation loop connected to the support and fixing module. This effectively suppresses heat accumulation under high light intensity suppression, keeping the temperature of the test area stable and controllable. Thus, while ensuring a high acceleration rate, it avoids interference from thermal runaway on the test results, thereby improving the overall accuracy, repeatability, and reliability of semiconductor device life testing. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an accelerated aging device according to an embodiment of the present invention; Figure 2 This is a partial structural side view of an accelerated aging device according to an embodiment of the present invention.

[0018] Figure 3This is a schematic diagram of the structure of an integrating sphere positioning slide rail system according to an embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the circulation structure of a support heat dissipation system according to an embodiment of the present invention.

[0020] Figure 5 This is a schematic diagram of the structure of a sample base according to an embodiment of the present invention.

[0021] Figure 6 This is a schematic diagram of the structure of the second support bracket according to an embodiment of the present invention.

[0022] Figure 7 This is a schematic diagram of the connection of the control module system according to an embodiment of the present invention.

[0023] The reference numerals in the figure are as follows: In the diagram: 1. Dark box; 2. Optical platform breadboard; 3. Light source module; 4. Support and fixing module; 41. Sample base; 410. Groove; 411. First connecting hole; 412. Second connecting hole; 42. First support bracket; 43. Second support bracket; 431. Third connecting hole; 432. Quick-connect pipe connector; 5. Control module; 6. Composite heat dissipation system; 61. Light source heat dissipation unit; 62. Support body heat dissipation unit; 621. First liquid cooling circulation loop; 622. Second liquid cooling circulation loop; 63. Liquid supply pipeline; 64. Liquid outlet pipeline; 7. Integrating sphere positioning slide rail system; 71. Slide rail; 72. First slider; 73. Second slider; 74. Integrating sphere. Detailed Implementation

[0024] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way.

[0025] Reference Figure 1 , Figure 2 , Figure 3 The present invention provides an accelerated aging apparatus for performing lifetime testing on semiconductor devices, comprising: A dark box 1, the interior of which constitutes the test space; An optical platform breadboard 2 is located at the bottom of the dark chamber 1, forming the bottom support of the accelerated aging device, and the upper surface of the optical platform breadboard 2 is located within the test space. A light source module 3 is disposed within the test space to provide continuous spectrum white light to the semiconductor device under test; An integrating sphere positioning slide rail system 7 is disposed on the optical platform breadboard 2 and extends below the light source module 3; A support and fixing module 4 is disposed in the test space for fixing the semiconductor device under test; the support and fixing module 4 is slidably disposed on the integrating sphere positioning slide rail system 7, and the integrating sphere positioning slide rail system 7 is used to drive the semiconductor device under test fixed at the top center of the support and fixing module 4 to align with the light source module 3; A control module 5 is electrically connected to the light source module 3 and is used to adjust the light intensity and color of the light emitted by the light source module 3. A composite heat dissipation system 6 includes a light source heat dissipation part 61 for dissipating heat from the light source module 3, and a support body heat dissipation part 62 for dissipating heat from the support fixing module 4; the support body heat dissipation part 62 is hollow, the two sides of the light source heat dissipation part 61 are thermally conductive to the support body heat dissipation part 62, and the support body heat dissipation part 62 is connected to the support fixing module 4 to form a heat dissipation circulation loop.

[0026] The main body of the accelerated aging equipment is a dark chamber 1, which contains a sealed testing space with dimensions of 600mm×600mm×700mm to isolate it from external light. It can hold 6 sets of equipment, and the large internal space ensures heat dissipation. An optical platform breadboard 2 is installed at the bottom of the chamber to provide a stable reference for the equipment.

[0027] The light source module 3 is suspended from the top of the test space via an active air-cooled heat sink. Its core consists of a light panel composed of multiple 100W multi-color-temperature LEDs and an optical lens below it. This light source can output continuous-spectrum white light and achieve at least two color temperature levels by adjusting the intensity ratio of the LED array. After being collimated and focused by the lens, the light is uniformly and vertically directed downwards onto the sample under test, with a maximum intensity reaching 50 times the intensity of standard sunlight (AM1.5G spectrum).

[0028] Furthermore, the light source module 3 is disposed on the support and fixing module 4, and the light source module 3 includes: A multi-color temperature LED array light panel; An optical lens is positioned in the light-emitting direction of the LED light panel to focus the light onto the semiconductor device under test.

[0029] Furthermore, the LED light panel includes multiple monochrome LED beads, each with a rated power of 100W. The dual-color LED light panel can provide multiple color temperature adjustment levels, such as 3000K warm white and 6500K cool white.

[0030] The light source module 3 can be replaced by either an ultraviolet light source (250 nm-400 nm) or a deep ultraviolet light source (180 nm-250 nm).

[0031] Furthermore, the control module 5 is an intelligent lighting control system built based on the DALI protocol, which includes: A user control terminal for inputting light intensity and color control commands; A single-channel DALI gateway module, which communicates via wired RS485, is connected to the user control terminal to receive and parse the control commands. A DALI constant current dimming driver is connected to the DALI gateway module via a DALI bus; wherein the DALI constant current dimming driver provides constant current power to the dual-color LED light panel through a power line, and executes dimming and color adjustment commands from the single-channel DALI gateway module through a control line.

[0032] Please see Figure 2 The support and fixing module 4 includes: A sample base 41 is linearly slidably disposed on the integrating sphere positioning slide rail system 7, and a groove 410 for accommodating the semiconductor device under test is provided on its top. Two first support brackets 42 are disposed on both sides of the sample base 41 for fixing the control module 5; Two second support brackets 43 are symmetrically arranged between two first support brackets 42. The two second support brackets 43 are used to clamp and fix the heat dissipation part 61 of the light source, and the light source module 3 is fixed on the heat dissipation part 61 of the light source.

[0033] The support and fixing module 4 is mounted on the optical platform breadboard 2. It includes a sample base and a support bracket. The sample base 41 has a 26mm × 26mm × 1mm groove 410 precisely machined on its upper surface for accurately positioning and fixing the organic solar cell sample with ITO glass as the substrate, suitable for fixing indium tin oxide conductive glass substrates. The controller of the control module 5 is mounted on the first support bracket 42, while the second support bracket 43 is used to clamp and fix the heat sink part 61 of the light source.

[0034] Please see Figure 2 , Figure 4 , Figure 5 , Figure 6The sample base 41 has a first connecting hole 411 and a second connecting hole 412 inside. The heat dissipation part 62 of the support body includes a first liquid cooling circulation loop 621 and a second liquid cooling circulation loop 622. The interior of each of the two second support brackets 43 has a third connecting hole 431. Both ends of the third connecting hole 431 are provided with quick-connect pipe connectors 432. The first liquid cooling circulation loop 621 passes through the first connecting hole 411 and is connected to the quick-connect pipe connectors 432 at both ends of the third connecting hole 431 of one of the second support brackets 43. The second liquid cooling circulation loop 622 passes through the second connecting hole 412 and is connected to the quick-connect pipe connectors 432 at both ends of the third connecting hole 431 of the other second support bracket 43.

[0035] like Figure 4 As shown, the composite heat dissipation system 6 includes a liquid supply pipe 63 and a liquid outlet pipe 64. The liquid supply pipe 63 and the liquid outlet pipe 64 are respectively located on both sides of the sample base 41. The liquid supply pipe is connected to the quick-connect fitting 432 of the air pipe at the port of the two third connecting holes 431 on the first side of the two second support brackets 43. The liquid outlet pipe is connected to the quick-connect fitting 432 of the air pipe at the port of the two third connecting holes 431 on the second side of the two second support brackets 43.

[0036] Furthermore, the outer diameter of the liquid supply line 63 and the liquid outlet line 64 is 10 mm.

[0037] like Figure 3 As shown, the integrating sphere positioning slide rail system 7 includes a slide rail 71, a first slider 72, a second slider 73, and an integrating sphere 74. The slide rail 71 is fixed to the optical platform 2 by screws; the first slider 72 moves linearly along the slide rail 71; the sample base 41 is fixedly mounted on the first slider 72 by screws; the second slider 73 moves linearly along the slide rail 71; and the integrating sphere 74 is disposed on the second slider 73. The first slider 72 and the second slider 73 respectively drive the sample base 41 and the integrating sphere 74 to be aligned with the light source module 3. By adjusting the mounting height of the first slider 72 and the second slider 73 on the slide rail, the height alignment between the semiconductor device under test fixed on the sample base 41 and the integrating sphere 74 can be achieved.

[0038] The composite heat dissipation system 6 is the key component of this invention. See also... Figure 2 The system consists of two parts that work together: The heat dissipation unit 61 is an active air-cooled heat sink, consisting of an aluminum heat sink fin assembly and a fan mounted on it. The LED light board is directly and tightly attached to the bottom of the heat sink fin assembly through screw holes. During operation, the fan generates forced airflow, quickly carrying away the heat generated by the LED and expelling it from the darkroom, ensuring stable operation of the light source under ultra-high power.

[0039] The heat dissipation section 62 of the support body is a liquid-cooled circulation loop integrated inside the support fixing module 4. The main body of the heat dissipation section 62 is a water pipe with an outer diameter of 10mm. See [link / reference needed]. Figure 4 The various sections of water pipe are connected together via tee joints, straight joints, and elbow joints. The water pipes are reliably connected to the sample base 41 and the second support bracket 43 using NPT tapered thread quick-connect fittings. For the internal structure of the sample base 41 and the second support bracket 43, please refer to [link to documentation]. Figure 5 , Figure 6 Cooling channels are machined inside the sample base 41 and the second support bracket 43, and NPT tapered thread holes are opened at the interface of the channels. This circuit is connected to an external circulating water purifier, and cooling water continuously flows through the sample base, efficiently removing the heat conducted from the sample, thereby ensuring that the sample stage is always maintained at a set low temperature.

[0040] Furthermore, the sample base 41, the two first support brackets 42 and the two second support brackets 43 are correspondingly arranged, and the light source module 3 is located above the sample base 41.

[0041] The light emitted by the LED light panel is focused by an optical lens onto the groove 410 on the sample base 41 to illuminate the semiconductor device under test located in the groove 410.

[0042] Furthermore, the heat dissipation unit 61 of the light source is an active air-cooled heat sink, which includes: An aluminum heat sink assembly with screw holes at the bottom for mounting and fixing; A fan is positioned above the aluminum heat sink fin assembly and is fixed to the air inlet end of the heat sink fin assembly; wherein, the LED light panel is fixed to the bottom of the aluminum heat sink fin assembly through the screw holes.

[0043] Control module 5 adopts an intelligent lighting control system based on the DALI protocol, referring to... Figure 7The system is divided into four layers: user control layer, control and drive layer, execution layer, and power supply layer. In the user control layer, users set target light intensity and color commands through a touch-sensitive user control terminal (such as a touch screen) that integrates controllable switches and an operating interface. The commands are then sent to the single-channel DALI gateway module in the control and drive layer for parsing. The parsed digital command signals are transmitted to the DALI constant current dimming driver via the DALI bus. After entering the execution layer, the DALI constant current dimming driver provides a constant operating current to the dual-color LED panel through a constant current power line. On the other hand, it accurately executes dimming and color adjustment commands through its internal dimming control circuit, achieving flexible, stable, and high-precision control of the output light parameters. The power for the entire control system is uniformly supplied by an external AC power supply (AC 220V) in the power supply layer. This power supply is connected to the single-channel DALI gateway module through the main power line, and then distributes power to the DALI constant current dimming driver through branch power lines, ensuring a stable power supply for each module and execution component.

[0044] like Figure 7 As shown, the working principle of this invention is as follows: After placing the organic solar cell sample to be tested into the groove of the base and fixing it, the dark chamber door is closed. The required ultra-high light intensity and spectrum are set through the control module 5. The light source module 3 and the composite heat dissipation system 6 are activated. During the test, the air-cooled light source heat dissipation part 61 ensures that the light source itself will not overheat, while the water-cooled support heat dissipation part 62 ensures that the Joule heat generated by the sample and the heat absorbed are removed in a timely and efficient manner, so that the sample temperature is precisely controlled within the preset range. With this device, reliable aging data of the device under ultra-high light intensity and low temperature rise conditions can be obtained in a short time, which greatly improves the research and development efficiency.

[0045] The beneficial effects of this invention are: 1. This invention, by employing a high-power LED light panel and optical lens, can provide simulated sunlight with high spectral matching and a light intensity of up to 50 suns, greatly shortening the aging test cycle and improving the accuracy of the test.

[0046] 2. This invention is compatible with both high-power ultraviolet and deep ultraviolet wavelengths (180-400 nm) LEDs and GaN lamp boards, and can provide high-throughput ultraviolet aging tests, which greatly shortens the ultraviolet aging test cycle and improves the research and development speed of anti-ultraviolet photovoltaic materials and structures.

[0047] 3. This invention innovatively employs a composite heat dissipation system consisting of air cooling and water cooling, which efficiently dissipates heat from the light source and the sample support respectively. This effectively solves the problem of heat accumulation under ultra-high light intensity testing, ensuring the stability and controllability of the sample area temperature during the testing process, and providing a possibility for distinguishing between photodegradation and thermal degradation mechanisms.

[0048] 4. This invention achieves digital and high-precision control of light intensity and spectrum through an intelligent control system based on the DALI protocol. It is easy to operate and has good repeatability.

[0049] 5. The water-cooling circuit of the support body of the present invention adopts NPT tapered thread and quick-connect connector, which is reliable in sealing and convenient in disassembly and maintenance; the overall structure is built on the optical platform breadboard, which has high stability and modular design facilitates expansion and customization.

[0050] 6. By setting up an integrating sphere positioning slide rail system, the height of the integrating sphere and the test platform can be flexibly adjusted and kept precisely aligned, effectively ensuring the uniformity of optical parameter sampling benchmarks, adapting to the testing needs of samples of different specifications, improving the repeatability of test data and the versatility of equipment, while simplifying the debugging process and improving testing efficiency.

[0051] 7. This invention has modular expansion capabilities and can be replicated and expanded into multiple test modules such as 2, 4, and 6 groups according to testing needs. Multiple modules are integrated in series through a shared water cooling system and slide rail system, eliminating the need for additional independent auxiliary systems. This significantly improves the efficiency of synchronous testing of batch samples, reduces equipment expansion costs, and adapts to the needs of large-scale testing scenarios.

[0052] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An accelerated aging device for life testing of photovoltaic devices, characterized in that, include: A dark box (1) whose interior forms the test space; An optical platform breadboard (2) is located at the bottom of the dark box (1) to form the bottom support of the accelerated aging device. The upper surface of the optical platform breadboard (2) is located within the test space. A light source module (3) is set in the test space to provide a continuous simulated solar spectrum to the semiconductor device under test; An integrating sphere positioning slide rail system (7) is disposed on the optical platform breadboard (2) and extends below the light source module (3); A support and fixing module (4) is set in the test space for fixing the semiconductor device under test; the support and fixing module (4) is slidably set on the integrating sphere positioning slide rail system (7), and the integrating sphere positioning slide rail system (7) is used to drive the semiconductor device under test fixed at the top center of the support and fixing module (4) to align with the light source module (3); A control module (5) is electrically connected to the light source module (3) and is used to adjust the light intensity and color of the light source module (3); A composite heat dissipation system (6) includes a light source heat dissipation part (61) for dissipating heat from the light source module (3) and a support heat dissipation part (62) for dissipating heat from the support fixing module (4); the support heat dissipation part (62) is hollow, the two sides of the light source heat dissipation part (61) are heat-conducting with the support heat dissipation part (62), and the support heat dissipation part (62) is connected to the support fixing module (4) to form a heat dissipation circulation loop.

2. The accelerated aging device according to claim 1, characterized in that, The light source module (3) is mounted on the support and fixing module (4), and the light source module (3) includes: An LED light panel; An optical lens is positioned in the light-emitting direction of the LED light panel to focus the light onto the photovoltaic device under test.

3. The accelerated aging device according to claim 2, characterized in that, The LED light panel includes multiple monochrome LED beads, each with a rated power of 100W. The LED light panel can provide multiple color temperature adjustment levels, and the light intensity of each color temperature adjustment level is adjustable with a maximum intensity of 50 standard sunlight luminous intensity.

4. The accelerated aging device according to claim 2, characterized in that, The control module (5) is an intelligent lighting control system built based on the DALI protocol, which includes: A user control terminal for inputting light intensity and color control commands; A single-channel DALI gateway module, which communicates via wired RS485, is connected to the user control terminal to receive and parse the control commands. A DALI constant current dimming driver is connected to the DALI gateway module via a DALI bus; wherein the DALI constant current dimming driver provides constant current power to the dual-color LED light panel through a power line, and executes dimming and color adjustment commands from the single-channel DALI gateway module through a control line.

5. The accelerated aging device according to claim 1, characterized in that, The support and fixing module (4) includes: A sample base (41) is linearly slidably disposed on the integrating sphere positioning slide rail system (7), and a groove (410) is provided on its top for accommodating the semiconductor device under test. Two first support brackets (42) are located on both sides of the sample base (41) for fixing the control module (5). Two second support brackets (43) are symmetrically arranged between two first support brackets (42). The two second support brackets (43) are used to clamp and fix the heat dissipation part (61) of the light source. The light source module (3) is fixed on the heat dissipation part (61).

6. The accelerated aging device according to claim 5, characterized in that, The sample base (41) has a first connecting hole (411) and a second connecting hole (412) inside. The heat dissipation part (62) of the support body includes a first liquid cooling circulation loop (621) and a second liquid cooling circulation loop (622). The two second support brackets (43) each have a third connecting hole (431) inside. Both ends of the third connecting hole (431) are provided with quick-connect pipe connectors (432). The first liquid cooling circulation loop (621) passes through the first connecting hole (411) and is connected to the quick-connect pipe connectors (432) at both ends of the third connecting hole (431) of one of the second support brackets (43). The second liquid cooling circulation loop (622) passes through the second connecting hole (412) and is connected to the quick-connect pipe connectors (432) at both ends of the third connecting hole (431) of the other second support bracket (43).

7. The accelerated aging device according to claim 6, characterized in that, The composite heat dissipation system (6) includes a liquid supply pipe (63) and a liquid outlet pipe (64). The liquid supply pipe (63) and the liquid outlet pipe (64) are located on both sides of the sample base (41). The liquid supply pipe is connected to the quick-connect fitting (432) of the air pipe at the port of the two third connecting holes (431) on the first side of the two second support brackets (43). The liquid outlet pipe is connected to the quick-connect fitting (432) of the air pipe at the port of the two third connecting holes (431) on the second side of the two second support brackets (43).

8. The accelerated aging device according to claim 5, characterized in that, The sample base (41), two first support brackets (42) and two second support brackets (43) are respectively arranged, and the light source module (3) is located above the sample base (41).

9. The accelerated aging device according to claim 5, characterized in that, The integrating sphere positioning slide rail system (7) includes: The slide rail (71) is fixed to the optical platform (2) by screws; The first slider (72) moves linearly along the slide rail (71); the sample base (41) is fixedly mounted on the first slider (72) by screws. The second slider (73) moves linearly along the slide rail (71); An integrating sphere (74) is mounted on the second slider (73); The first slider (72) and the second slider (73) respectively drive the sample base (41) and the integrating sphere (74) to face the light source module (3). By adjusting the installation height of the first slider (72) and the second slider (73) on the slide rail, the height of the semiconductor device under test fixed on the sample base (41) and the integrating sphere (74) can be aligned.

10. The accelerated aging device according to claim 1, characterized in that, The heat dissipation unit (61) of the light source is an active air-cooled heat sink, which includes: An aluminum heat sink assembly with screw holes at the bottom for mounting and fixing; A fan is positioned above the aluminum heat sink fin assembly and is fixed to the air inlet end of the heat sink fin assembly; wherein, the LED light panel is fixed to the bottom of the aluminum heat sink fin assembly through the screw holes.

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