Heat dissipation structure and electronic equipment

Abstract

The invention provides a heat dissipation structure and electronic equipment. The heat dissipation structure comprises a liquid cooling plate assembly and an anti-reverse device. The liquid cooling plate assembly is provided with a liquid runner, the liquid runner is used for providing a flowing path for cooling liquid, the liquid cooling plate assembly is further provided with a water inlet and a water outlet, the water inlet is used for inflow of the cooling liquid, the water outlet is used for outflow of the cooling liquid, and the liquid cooling plate assembly is used for being in heat conduction connection with a first heating device. The cooling liquid in the liquid flow channel exchanges heat with the first heating device so as to take away heat emitted by the first heating device. The anti-reverse device is connected with the water inlet and / or the water outlet, and the anti-reverse device is used for controlling the water inlet and / or the water outlet to be disconnected from the liquid flow channel when the flow direction of the cooling liquid in the water inlet and / or the water outlet is opposite to a preset flow direction or the flow speed of the cooling liquid in the water inlet and / or the water outlet is smaller than a preset threshold value. Safe and stable operation of the heat dissipation structure can be ensured.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic device. Background Technology

[0002] Currently, with the development of electronic devices, the number of heat-generating components included in these devices is increasing. These components may include transformers, inductors, and other similar devices. As these components are applied in different power environments, the heat generated per unit time is also increasing, resulting in a greater overall heat generation within the electronic device. Since these high-heat-generating components are typically located at the front end of the cooling fluid flow path, if the coolant flow direction is reversed, these components may be located at the end of the flow path. Alternatively, if the coolant flow rate is low, the safe and stable operation of the heat dissipation structure cannot be guaranteed, potentially even damaging the electronic device. Therefore, ensuring the safe and stable operation of the heat dissipation structure has become a crucial issue that needs to be addressed. Summary of the Invention

[0003] This application provides a heat dissipation structure and electronic device that can ensure the safe and stable operation of the heat dissipation structure.

[0004] Firstly, a heat dissipation structure is provided, comprising a liquid-cooled plate assembly and an anti-reverse device. The liquid-cooled plate assembly has a liquid flow channel for providing a flow path for cooling liquid. The liquid-cooled plate assembly also has an inlet and an outlet. The inlet is for the cooling liquid to flow into the liquid, and the outlet is for the cooling liquid to flow out of the liquid. The liquid-cooled plate assembly is thermally connected to a first heating device. The cooling liquid in the liquid flow channel exchanges heat with the first heating device to remove the heat dissipated by the first heating device. The anti-reverse device is connected to the inlet and / or the outlet. The anti-reverse device is used to disconnect the inlet and / or the outlet from the liquid flow channel when the flow direction of the cooling liquid in the inlet and / or the outlet is opposite to a preset flow direction, or when the flow rate of the cooling liquid in the inlet and / or the outlet is less than a preset threshold.

[0005] In one possible implementation, the liquid cooling plate assembly includes a first liquid cooling plate and a second liquid cooling plate that are spaced apart and arranged opposite to each other. Both the first liquid cooling plate and the second liquid cooling plate have liquid flow channels, and a first heating device is disposed between the first liquid cooling plate and the second liquid cooling plate.

[0006] In one possible implementation, the liquid cooling plate assembly further includes a connecting pipe, the two ends of which are fixedly connected to the first liquid cooling plate and the second liquid cooling plate, respectively. The connecting pipe has a connecting flow channel for connecting the liquid flow channels of the first liquid cooling plate and the second liquid cooling plate.

[0007] In one possible implementation, the anti-reverse device is connected to the water inlet, and the anti-reverse device is used to control the water inlet to disconnect from the liquid flow channel when the flow direction of the cooling liquid in the water inlet is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the water inlet is less than a preset threshold.

[0008] In one possible implementation, the anti-reverse device includes a regulating valve connected to the water inlet. The regulating valve is used to disconnect the connection between the water inlet and the liquid flow channel when the flow direction of the cooling liquid in the water inlet is opposite to a preset flow direction, or when the flow rate of the cooling liquid in the water inlet is less than a preset threshold.

[0009] In one possible implementation, the anti-reverse device further includes a controller and a flow meter. The flow meter is connected to the inlet, and the controller is connected to both the regulating valve and the flow meter. The flow meter is used to obtain the flow rate of the cooling liquid in the inlet. The controller is used to determine the flow direction and velocity of the cooling liquid based on the flow rate obtained by the flow meter. When the flow direction of the cooling liquid in the inlet is opposite to a preset flow direction, or when the flow rate of the cooling liquid in the inlet is less than a preset threshold, the controller controls the regulating valve to disconnect, thereby breaking the connection between the inlet and the liquid flow channel.

[0010] In one possible implementation, the controller is further configured to continuously acquire the heat generated by the first heating device per unit time, and when the heat generated by the first heating device per unit time is less than a preset heat, control and adjust the flow rate of the cooling liquid in the inlet acquired by the flow meter.

[0011] In one possible implementation, the heat dissipation structure further includes a housing structure connected to both the first liquid cooling plate and the second liquid cooling plate. The first heating device is disposed within the housing structure, such that it is fixedly positioned between the first and second liquid cooling plates. The housing structure has a filling port, and the heat dissipation structure also includes a thermally conductive medium having at least a fluid and a solid state. The filling port allows the fluid-state thermally conductive medium to flow into the housing structure. After the thermally conductive medium solidifies, it encapsulates the first heating device within the housing structure. The first liquid cooling plate and the second liquid cooling plate are thermally connected to the first heating device at least through the thermally conductive medium located within the housing structure.

[0012] In one possible implementation, there are multiple first heating elements, and the number of housing structures corresponds to the number of first heating elements. Specifically, the orientation of the filling port of at least one housing structure differs from the orientation of the filling ports of the other housing structures.

[0013] Secondly, an electronic device is also provided, comprising a first heat-generating device and a heat dissipation structure. The heat dissipation structure is at least used to dissipate heat from the first heat-generating device. The heat dissipation structure includes a liquid-cooled plate assembly and an anti-reverse device. The liquid-cooled plate assembly has a liquid flow channel for providing a flow path for cooling liquid. The liquid-cooled plate assembly also has an inlet and an outlet. The inlet is for the cooling liquid to flow into the device, and the outlet is for the cooling liquid to flow out. The liquid-cooled plate assembly is thermally connected to the first heat-generating device. The cooling liquid in the liquid flow channel exchanges heat with the first heat-generating device to remove the heat emitted by the first heat-generating device. The anti-reverse device is connected to the inlet and / or the outlet. The anti-reverse device is used to control the inlet and / or the outlet to disconnect from the liquid flow channel when the flow direction of the cooling liquid in the inlet and / or the outlet is opposite to a preset flow direction, or when the flow rate of the cooling liquid in the inlet and / or the outlet is less than a preset threshold.

[0014] The heat dissipation structure and electronic equipment of this application, by configuring an anti-reverse device, enable the cooling liquid to enter the liquid flow channel normally when the cooling liquid flows into the liquid flow channel of the liquid cooling plate assembly. If the flow direction of the cooling liquid in the inlet and / or outlet is the same as the preset flow direction, the cooling liquid can enter the liquid flow channel normally. If the flow direction of the cooling liquid in the inlet and / or outlet is opposite to the preset flow direction, the cooling liquid cannot effectively dissipate heat from the heat-generating device with a large amount of heat per unit time. Or, if the flow rate of the cooling liquid in the inlet and / or outlet is less than the preset threshold, the flow rate of the cooling liquid is too low, and it also cannot effectively dissipate heat from the heat-generating device with a large amount of heat per unit time. By controlling the inlet and / or outlet to disconnect from the liquid flow channel, the safe and stable operation of the heat dissipation structure can be ensured. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0016] Figure 1 This is a schematic diagram of the heat dissipation structure in some embodiments of this application.

[0017] Figure 2 This is a schematic diagram of the anti-reverse device in some embodiments of this application.

[0018] Figure 3 This is another schematic diagram of the heat dissipation structure in some embodiments of this application.

[0019] Figure 4 This is a schematic diagram of an electronic device in some embodiments of this application.

[0020] Explanation of reference numerals in the attached drawings: 10, heat dissipation structure; 100, liquid cooling plate assembly; 110, first liquid cooling plate; 120, second liquid cooling plate; 111, water inlet; 112, water outlet; 200, connecting assembly; 210, first connector; 220, second connector; 300, connecting pipe; 400, anti-reverse device; 410, regulating valve; 420, controller; 430, flow meter; 500, housing structure; 20, first heating element; 30, second heating element; 1, electronic equipment. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0022] In the description of the embodiments of this application, it should be noted that the terms "inner" and "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this application and simplifying the description, and do not imply or indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] In the description of the embodiments of this application, it should be noted that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0025] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or devices.

[0026] Please see Figure 1 , Figure 1 This is a schematic diagram of the heat dissipation structure in some embodiments of this application. For example... Figure 1As shown, this application provides a heat dissipation structure 10, which includes a liquid cooling plate assembly 100 and an anti-reverse device 400. The liquid cooling plate assembly 100 has a liquid flow channel for providing a flow path for the cooling liquid. The liquid cooling plate assembly 100 also has an inlet 111 and an outlet 112. The inlet 111 is for the cooling liquid to flow into, and the outlet 112 is for the cooling liquid to flow out. The liquid cooling plate assembly 100 is used for thermal conduction connection with a first heating device 20. The cooling liquid in the liquid flow channel exchanges heat with the first heating device 20 to remove the heat dissipated by the first heating device 20. The anti-reverse device 400 is connected to the inlet 111 and / or outlet 112. The anti-reverse device 400 is used to control the inlet 111 and / or outlet 112 to disconnect from the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 and / or outlet 112 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 and / or outlet 112 is less than a preset threshold.

[0027] Therefore, the heat dissipation structure 10 described above in this application, by configuring the anti-reverse device 400, enables the cooling liquid to enter the liquid flow channel normally when the cooling liquid flows into the liquid flow channel of the liquid cooling plate assembly 100. If the flow direction of the cooling liquid in the inlet 111 and / or outlet 112 is the same as the preset flow direction, the cooling liquid can enter the liquid flow channel normally. If the flow direction of the cooling liquid in the inlet 111 and / or outlet 112 is opposite to the preset flow direction, the cooling liquid cannot effectively dissipate heat from the heat-generating device with a large amount of heat per unit time. Or, if the flow rate of the cooling liquid in the inlet 111 and / or outlet 112 is less than the preset threshold, the flow rate of the cooling liquid is too low and it cannot effectively dissipate heat from the heat-generating device with a large amount of heat per unit time. By controlling the inlet 111 and / or outlet 112 to disconnect from the liquid flow channel, the safe and stable operation of the heat dissipation structure 10 can be ensured.

[0028] The anti-reverse flow device 400 can be connected to the inlet 111 and the outlet 112. The anti-reverse flow device 400 is used to disconnect the inlet 111 and the outlet 112 from the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 and the outlet 112 is opposite to a preset flow direction, or when the flow velocity of the cooling liquid in the inlet 111 and the outlet 112 is less than a preset threshold. The anti-reverse flow device 400 can also be connected to the inlet 111. The anti-reverse flow device 400 is used to disconnect the inlet 111 from the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to a preset flow direction, or when the flow velocity of the cooling liquid in the inlet 111 is less than a preset threshold. The anti-reverse device 400 can also be connected to the outlet 112. The anti-reverse device 400 is used to control the outlet 112 to disconnect from the liquid flow channel when the flow direction of the cooling liquid in the outlet 112 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the outlet 112 is less than the preset threshold.

[0029] Please see Figure 3 , Figure 3 This is another schematic diagram of the heat dissipation structure in some embodiments of this application. For example... Figure 3 As shown, the liquid cooling plate assembly 100 includes a first liquid cooling plate 110 and a second liquid cooling plate 120 that are spaced apart and arranged opposite to each other. Both the first liquid cooling plate 110 and the second liquid cooling plate 120 have liquid flow channels. A first heating device 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120.

[0030] Therefore, the heat dissipation structure 10 described above in this application, by configuring the liquid cooling plate assembly 100 including a first liquid cooling plate 110 and a second liquid cooling plate 120 spaced apart and arranged opposite to each other, that is, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are stacked and arranged in parallel, the first heat-generating device 20 can be disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, which can increase the heat dissipation contact area of ​​the first heat-generating device 20 and improve the utilization rate of heat dissipation space.

[0031] Among them, such as Figure 3 As shown, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the first connection state, the second heating device 30 may also be disposed on the side of the first liquid cooling plate 110 away from the second liquid cooling plate 120, and / or on the side of the second liquid cooling plate 120 away from the first liquid cooling plate 110.

[0032] like Figure 3 As shown, the liquid cooling plate assembly 100 also includes a connecting pipe 300, the two ends of which are fixedly connected to the first liquid cooling plate 110 and the second liquid cooling plate 120, respectively. The connecting pipe 300 has a connecting flow channel for connecting the liquid flow channels of the first liquid cooling plate 110 and the second liquid cooling plate 120.

[0033] Therefore, the heat dissipation structure 10 described above in this application, by providing connecting pipes and connecting channels thereon, can connect the liquid channels of the first liquid cooling plate 110 and the second liquid cooling plate 120, thereby forming a complete water system.

[0034] Among them, the connecting pipe 300 is a flexible hose, that is, the connecting pipe 300 is deformable.

[0035] Please refer to it again. Figure 1 .like Figure 1 As shown, the anti-reverse device 400 is connected to the inlet 111. The anti-reverse device 400 is used to control the inlet 111 to disconnect from the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than the preset threshold.

[0036] Therefore, the heat dissipation structure 10 described above in this application, by configuring the anti-reverse device 400 to connect with the water inlet 111 and controlling the water inlet 111 to disconnect from the liquid flow channel, can prevent the overheated cooling liquid in the liquid flow channel from being unable to flow out through the water outlet 112 when the cooling liquid is reversed or the flow rate of the cooling liquid is low, thereby further affecting the heat dissipation of the heat-generating device and further ensuring the safe and stable operation of the heat dissipation structure 10.

[0037] Please refer to the following: Figure 2 , Figure 2 This is a schematic diagram of an anti-reverse device in some embodiments of this application. For example... Figure 1 , Figure 2 , Figure 3 As shown, the anti-reverse device 400 includes a regulating valve 410, which is connected to the inlet 111. The regulating valve 410 is used to disconnect the connection between the inlet 111 and the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than the preset threshold.

[0038] Therefore, the heat dissipation structure 10 described above in this application, by setting the regulating valve 410, can not only disconnect the connection between the inlet 111 and the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, but also disconnect the connection between the inlet 111 and the liquid flow channel when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold.

[0039] The regulating valve 410 can be a lift-type or swing-type check valve. The check valve can be equipped with springs, slow-closing devices, etc., to automatically disconnect the connection between the inlet 111 and the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction. It can also automatically adjust the flow rate of the connection between the inlet 111 and the liquid flow channel according to the flow rate of the cooling liquid in the inlet 111. Furthermore, when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold, it can automatically disconnect the connection between the inlet 111 and the liquid flow channel according to the parameter settings of the spring and slow-closing device. The regulating valve 410 can also be a self-operated regulating valve 410, such as a flow regulating valve 410, which can automatically adjust the flow rate of the connection between the inlet 111 and the liquid flow channel according to the flow direction and flow rate of the cooling liquid in the inlet 111 to achieve the above functions.

[0040] like Figure 1 , Figure 2 , Figure 3As shown, the anti-reverse device 400 also includes a controller 420 and a flow meter 430. The flow meter 430 is connected to the inlet 111, and the controller 420 is connected to both the regulating valve 410 and the flow meter 430. The flow meter 430 is used to obtain the flow rate of the cooling liquid in the inlet 111. The controller 420 is used to determine the flow direction and velocity of the cooling liquid based on the flow rate obtained by the flow meter 430. When the flow direction of the cooling liquid in the inlet 111 is opposite to a preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold, the controller disconnects the regulating valve 410 to disconnect the connection between the inlet 111 and the liquid flow channel.

[0041] Therefore, the heat dissipation structure 10 described above in this application, by setting the controller 420 and the flow meter 430, can accurately determine the flow direction and flow rate of the cooling liquid in an electronically controlled manner, and control the disconnection of the regulating valve 410 when the preset conditions are met, thereby electronically disconnecting the connection between the water inlet 111 and the liquid flow channel.

[0042] When the anti-reverse device 400 also includes a controller 420, the regulating valve 410 can be an electrically controlled ball valve, such as an electric shut-off valve, a pneumatic shut-off valve, or a ball valve.

[0043] When the flow rate of the cooling liquid in the inlet 111 obtained by the flow meter 430 is negative, it is determined that the flow direction of the cooling liquid is opposite to the preset direction.

[0044] The controller 420 can be a general-purpose processor such as a central processing unit (CPU), or a digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic devices, discrete gate logic devices, transistor logic devices, or microprocessors such as micro control units (MCUs).

[0045] The controller 420 is also used to continuously acquire the heat generated by the first heating device 20 within a unit time, and when the heat generated by the first heating device 20 within a unit time is less than the preset heat, it controls the flow meter 430 to acquire the flow rate of the cooling liquid in the inlet 111.

[0046] Therefore, the heat dissipation structure 10 described above in this application controls the flow meter 430 to obtain the flow rate of the cooling liquid in the inlet 111 when the working power is low, so that the state of the cooling liquid can be judged before the power is increased, ensuring the safe and stable operation of the product.

[0047] Specifically, the controller 420 can determine the operating power of the first heating device 20 by continuously acquiring the heat generated by the first heating device 20 per unit time. When the heat generated by the first heating device 20 per unit time is less than the preset heat, it can be determined that the operating power of the first heating device 20 is low. At this time, the controller adjusts the flow rate of the cooling liquid in the inlet 111 by controlling the flow meter 430, which makes it less likely to damage the heating device.

[0048] Furthermore, the controller 420 can continuously determine the amount of heat generated by the first heating device 20 per unit time by continuously acquiring the power value of the first heating device 20.

[0049] The controller 420 can also issue a fault signal when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold, so as to remind that the cooling liquid is reversed or the flow rate of the cooling liquid is too low.

[0050] The controller 420 can also be used to control the first heating device 20 to stop working when the flow direction of the cooling liquid in the inlet 111 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 is less than a preset threshold.

[0051] Furthermore, the controller 420 can be connected to the first heating device 20 to continuously acquire the heat generated by the first heating device 20 per unit time and control the first heating device 20 to stop working.

[0052] Please refer to it again. Figure 3 .like Figure 3 As shown, the heat dissipation structure 10 also includes a housing structure 500, which is connected to both the first liquid cooling plate 110 and the second liquid cooling plate 120. The first heating element 20 is disposed in the housing structure 500, such that the first heating element 20 is fixedly disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120. The housing structure 500 has a filling port, and the heat dissipation structure 10 also includes a heat-conducting medium, which has at least a fluid form and a solid form. The filling port is used to allow the fluid form of the heat-conducting medium to flow into the housing structure 500. After the heat-conducting medium solidifies, it encapsulates the first heating element 20 in the housing structure 500. The first liquid cooling plate 110 and the second liquid cooling plate 120 are thermally connected to the first heating element 20 at least through the heat-conducting medium located within the housing structure 500.

[0053] Therefore, the heat dissipation structure 10 described above in this application, by setting the shell structure 500, can not only fix the first heating device 20 in the corresponding position, but also conduct heat to the first heating device 20 through the encapsulated heat-conducting medium, so that the first liquid cooling plate 110 and the second liquid cooling plate 120 are thermally connected to the first heating device 20 at least through the heat-conducting medium located in the shell structure 500, which can further improve the heat dissipation effect.

[0054] The number of first heating elements 20 is multiple, and the number of housing structures 500 corresponds to the number of first heating elements 20. The orientation of the filling port of at least one housing structure 500 is different from the orientation of the filling ports of the other housing structures 500.

[0055] Therefore, the heat dissipation structure 10 described above in this application, since the liquid cooling plate assembly 100 includes two liquid cooling plates, can conduct the heat emitted by the multiple first heat-generating devices 20 to different positions of the two liquid cooling plates by configuring the orientation of the filling port of at least one housing structure 500 to be different from the orientation of the filling port of other housing structures 500, thereby further improving the heat dissipation effect.

[0056] Furthermore, there are two first heating elements 20, and the number of housing structures 500 corresponds to the number of first heating elements 20. One housing structure 500 has its filling port facing the first liquid cooling plate 110, and the other housing structure 500 has its filling port facing the second liquid cooling plate 120.

[0057] Furthermore, the number of first heating devices 20 is greater than two, except for the housing structure 500 whose potting opening faces the first liquid cooling plate 110 or the second liquid cooling plate 120, the potting openings of the other housing structures 500 face the width direction of the first liquid cooling plate 110 and the second liquid cooling plate 120.

[0058] In some embodiments, the heat dissipation structure 10 further includes a connecting component 200, which is used to fix the first liquid cooling plate 110 and the second liquid cooling plate 120 to a corresponding connection configuration. When the first heating device 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, or when the first heating device 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120, the first liquid cooling plate 110 and / or the second liquid cooling plate 120 are thermally conductively connected to the first heating device 20. The cooling liquid in the liquid channels of the first liquid cooling plate 110 and / or the second liquid cooling plate 120 exchanges heat with the first heating device 20 to remove the heat dissipated by the first heating device 20.

[0059] When the first heating element 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, the first liquid cooling plate 110 and / or the second liquid cooling plate 120 can be thermally connected to the first heating element 20. The cooling liquid in the liquid channels of the first liquid cooling plate 110 and / or the second liquid cooling plate 120 exchanges heat with the first heating element 20 to remove the heat emitted by the first heating element 20. When the first heating element 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120, the first liquid cooling plate 110 and / or the second liquid cooling plate 120 can be thermally connected to the first heating element 20. The cooling liquid in the liquid channels of the first liquid cooling plate 110 and / or the second liquid cooling plate 120 exchanges heat with the first heating element 20 to remove the heat emitted by the first heating element 20.

[0060] The cooling liquid can be water or other cooling liquids, and this application is not limited to this.

[0061] The first liquid cooling plate 110 and the second liquid cooling plate 120 can be processed by aluminum extrusion molding, and the water channel is integrally formed, which is more convenient and simpler than other water channel processing methods.

[0062] In some embodiments, the heat dissipation structure 10 has a first heat dissipation mode and a second heat dissipation mode, and the connection configuration of the first liquid cooling plate 110 and the second liquid cooling plate 120 includes a first connection configuration and a second connection configuration. Specifically, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the first connection configuration, the heat dissipation structure 10 is in the first heat dissipation mode; when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the second connection configuration, the heat dissipation structure 10 is in the second heat dissipation mode.

[0063] Therefore, the heat dissipation structure 10 described above in this application can provide different connection forms of the liquid cooling plate assembly 100 for different heat dissipation modes, thereby providing a larger heat dissipation area under the volume constraints of the electronic device 1, so as to achieve a better heat dissipation effect for the heat-generating device.

[0064] In some embodiments, the first liquid cooling plate 110 has a first connecting portion and a second connecting portion, and the second liquid cooling plate 120 has a third connecting portion and a fourth connecting portion. When the connecting assembly 200 is connected to the first connecting portion and the third connecting portion, the connecting assembly 200 fixes the first liquid cooling plate 110 and the second liquid cooling plate 120 in a first connection state, and the first heating element 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120. When the connecting assembly 200 is connected to the second connecting portion and the fourth connecting portion, the connecting assembly 200 fixes the first liquid cooling plate 110 and the second liquid cooling plate 120 in a second connection state, and the first heating element 20 is disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120.

[0065] Therefore, in this application, when the connecting component 200 is connected to different connecting parts, the liquid cooling plate assembly 100 is in the corresponding connection mode of the heat dissipation structure 10.

[0066] In some embodiments, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are in a first connection configuration, the first liquid cooling plate 110 and the second liquid cooling plate 120 are spaced apart and disposed opposite to each other, such that the first heating device 20 is disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120. When the first liquid cooling plate 110 and the second liquid cooling plate 120 are in a second connection configuration, the first liquid cooling plate 110 and the second liquid cooling plate 120 are adjacent and disposed parallel to each other, such that the first heating device 20 is disposed on one side of the first liquid cooling plate 110 or on one side of the second liquid cooling plate 120.

[0067] Therefore, in the heat dissipation structure 10 described in this application, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are spaced apart and arranged opposite each other, that is, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are stacked and arranged in parallel, the first heating device 20 can be disposed between the first liquid cooling plate 110 and the second liquid cooling plate 120, which can increase the heat dissipation contact area of ​​the first heating device 20 and improve the utilization rate of heat dissipation space. When the first liquid cooling plate 110 and the second liquid cooling plate 120 are adjacent and arranged in parallel, that is, when the first liquid cooling plate 110 and the second liquid cooling plate 120 are arranged side by side and in parallel, the first heating device 20 can be disposed on one side of the first liquid cooling plate 110 or one side of the second liquid cooling plate 120, which can provide better heat dissipation function according to the type of the first heating device 20, for example when the volume of the first heating device 20 is large.

[0068] When the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the first connection state, the second heating device 30 may also be disposed on the side of the first liquid cooling plate 110 away from the second liquid cooling plate 120, and / or on the side of the second liquid cooling plate 120 away from the first liquid cooling plate 110.

[0069] When the first liquid cooling plate 110 and the second liquid cooling plate 120 are in the second connection state, the first heating device 20 can also be disposed on one side of the first liquid cooling plate 110 and one side of the second liquid cooling plate 120. The first heating device 20 can also be disposed on the other side of the first liquid cooling plate 110 or the other side of the second liquid cooling plate 120.

[0070] Therefore, the heat dissipation structure 10 described above in this application allows for the placement of heat-generating devices on both sides of the two liquid cooling plates, greatly increasing the placement area of ​​the first heat-generating device 20.

[0071] In some embodiments, the connecting assembly 200 includes a first connector 210 and a second connector 220. The first connecting portion has a first connection port and a second connection port, the second connecting portion has a third connection port and a fourth connection port, the third connecting portion has a fifth connection port and a sixth connection port, and the fourth connecting portion has a seventh connection port and an eighth connection port. When the first connector 210 is connected to all four connection ports (first, second, fifth, and sixth), the first liquid cooling plate 110 and the second liquid cooling plate 120 are in a first connection state; when the connector is connected to all four connection ports (third, fourth, seventh, and eighth), the first liquid cooling plate 110 and the second liquid cooling plate 120 are in a second connection state.

[0072] Therefore, the heat dissipation structure 10 described above in this application can better fix the connection form of the liquid cooling plate assembly 100 through two connectors, resulting in better structural stability.

[0073] Among them, the first to eighth connection ports can be threaded connection ports, and the first connector 210 and the second connector 220 can be threadedly connected to the corresponding connection ports through threaded fasteners.

[0074] In some embodiments, the connecting flow channel includes a first flow channel and a second flow channel, and the liquid flow channel of the first liquid cooling plate 110 includes a third flow channel and a fourth flow channel. The first flow channel is used to connect the third flow channel with the liquid flow channel of the second liquid cooling plate 120, and the second flow channel is used to connect the fourth flow channel with the liquid flow channel of the second liquid cooling plate 120. The first liquid cooling plate 110 has an inlet 111 and an outlet 112. The inlet 111 is connected to the third flow channel, and the outlet 112 is connected to the fourth flow channel. The third flow channel, the first flow channel, the liquid flow channel of the second liquid cooling plate 120, the second flow channel, and the fourth flow channel are sequentially connected between the inlet 111 and the outlet 112. The inlet 111 is used for the inflow of cooling liquid, and the outlet 112 is used for the outflow of cooling liquid, so that the cooling liquid flowing in from the inlet 111 flows sequentially through the third flow channel, the first flow channel, the liquid flow channel of the second liquid cooling plate 120, the second flow channel, and the fourth flow channel, and then flows out from the outlet 112.

[0075] In some embodiments, the connecting channels include a first channel and a second channel, the liquid channels of the first liquid cooling plate 110 include a third channel and a fourth channel, and the liquid channels of the second liquid cooling plate 120 include a fifth channel and a sixth channel. The first channel is used to connect the third channel and the fifth channel, and the second channel is used to connect the fourth channel and the sixth channel. The first liquid cooling plate 110 has a water inlet 111, and the second liquid cooling plate 120 has a water outlet 112. The water inlet 111 is connected to the third and fourth flow channels, and the water outlet 112 is connected to the fifth and sixth flow channels. The third, first, and fifth flow channels are sequentially connected between the water inlet 111 and the water outlet 112, and the fourth, second, and sixth flow channels are sequentially connected between the water inlet 111 and the water outlet 112. The water inlet 111 is used for the inflow of cooling liquid, and the water outlet 112 is used for the outflow of cooling liquid, so that the cooling liquid flowing in from the water inlet 111 flows sequentially through the third, first, and fifth flow channels and then flows out from the water outlet 112, and the cooling liquid flowing in from the water inlet 111 flows sequentially through the fourth, second, and sixth flow channels and then flows out from the water outlet 112.

[0076] Therefore, the heat dissipation structure 10 described above in this application, by configuring the connecting pipes and the internal flow channels of the two liquid cooling plates, can connect the independent internal flow channels of the connecting pipes and the two liquid cooling plates, reduce the number of external water inlets 111 and outlets 112, and simplify external operation.

[0077] The inlet 111 and outlet 112 are mainly connected by pipes. The internal flow channels can be directly made of aluminum extrusion channels or processed on aluminum extrusion channels. Through secondary processing of the internal water channels of the two liquid cooling plates, the internal flow channels of the two liquid cooling plates can be connected in series and parallel, making the internal flow channel design of the two liquid cooling plates more diverse.

[0078] In some embodiments, the heat generated by the heating device per unit time can be the heat loss of the heating device. That is, the unit time can be selected according to specific needs to obtain the heat loss of the heating device.

[0079] In some embodiments, the anti-reverse device 400 may be disposed between the liquid flow channel of the first liquid cooling plate 110 and the water inlet 111 to block the connection between the water inlet 111 and the liquid flow channel of the first liquid cooling plate 110 in a timely manner.

[0080] In some embodiments, the heat generated by the second heating device 30 per unit time is less than the heat generated by the first heating device 20 per unit time.

[0081] Therefore, the heat dissipation structure 10 described above in this application can place the first heating device 20 with high heat loss between the two liquid cooling plates, increase the thermal contact area between the first heating device 20 and the liquid cooling plates, improve the heat dissipation effect, effectively control the internal temperature difference of the first heating device 20, make the internal temperature field of the first heating device 20 more uniform, reduce the heat loss of the first heating device 20 to a certain extent, improve the working efficiency of the first heating device 20, and can place the second heating device 30 with lower heat loss outside the two liquid cooling plates, making full use of the heat dissipation contact area of ​​the two liquid cooling plates.

[0082] Furthermore, the side of the first liquid cooling plate 110 facing away from the second liquid cooling plate 120 also has a first mounting portion for mounting the second heating device 30, and / or, the side of the second liquid cooling plate 120 facing away from the first liquid cooling plate 110 also has a second mounting portion for mounting the second heating device 30.

[0083] Therefore, the heat dissipation structure 10 described above in this application can provide multiple positions for mounting the second heat-generating device 30 through the first mounting portion and / or the second mounting portion.

[0084] The housing structure 500 includes a connected outer shell and a side plate assembly. The outer shell is a cylindrical structure with openings at both ends. The side plate assembly is used to cover the two openings of the cylindrical structure. The outer shell and the side plate assembly are used to cooperate to form a receiving space to accommodate the first heating device 20. The outer shell has a filling port on its side peripheral wall.

[0085] Therefore, the heat dissipation structure 10 described above in this application forms a six-sided enclosure space through the outer shell and side plate assembly. There is only one enclosure space, which can be formed by only the outer shell and side plate assembly. Moreover, the enclosure space can be used for potting heat dissipation, which simplifies the structural design and can effectively save costs.

[0086] Furthermore, the space can be used to house multiple magnetic cores, which can be arranged side by side.

[0087] The portion of the outer casing with a filling port on its side wall is fixedly connected to the liquid cooling plate assembly 100, so that the liquid cooling plate assembly 100 and the heat transfer medium can come into contact and exchange heat through the filling port.

[0088] Therefore, the heat dissipation structure 10 described above in this application enables the liquid cooling plate assembly 100 to contact and exchange heat with the heat-conducting medium inside the housing structure 500 through the potting opening.

[0089] In some embodiments, the volume of the housing structure 500 is smaller than the volume of the receiving cavity, and the space outside the housing structure 500 within the receiving cavity is filled with a heat-conducting medium, and the heat-conducting medium outside the housing structure 500 and the heat-conducting medium inside the housing structure 500 are thermally connected through a potting port.

[0090] The shell structure 500 can be made of thermally conductive material, so that the first liquid cooling plate 110 and the second liquid cooling plate 120 can also be thermally connected to the first heating device 20 through the shell structure 500.

[0091] Furthermore, the first heating element 20 is a transformer, which includes a magnetic core and a first winding sleeved on the magnetic core. There are two potting openings, with each end of the first winding extending out of the outer casing through one of the two potting openings.

[0092] Therefore, the heat dissipation structure 10 described above in this application can also be used for the lead wires at both ends of the first winding to connect with other circuit structures.

[0093] Specifically, by using two filling ports for filling, the internal heat-conducting medium can be made more uniform, and the gaps between the magnetic core and the outer shell, and between the magnetic core and the core tube, can be completely covered and filled by the heat-conducting medium to improve the heat dissipation effect.

[0094] The magnetic core has a ring-shaped cross-section. The side plate assembly includes two side sealing plates, each of which includes a connected side shell and a core tube. Each side shell is used to cover one of the openings of the cylindrical structure, and when the two side shells cover the two openings of the cylindrical structure, the two core tubes extend into the magnetic core in an alternating manner.

[0095] Therefore, the heat dissipation structure 10 described above in this application can cover the two openings of the cylindrical structure by configuring the side shell, and can serve as the second winding of the first heating device 20 by configuring the two core tubes to extend into the magnetic core in an alternating manner.

[0096] The first winding can be the primary winding, and the second winding can be the secondary winding.

[0097] Furthermore, each side shell has a through-hole, each through-hole corresponding to the core tube of the other side shell, and each through-hole is used for the core tube of the other side shell to extend out.

[0098] Therefore, the heat dissipation structure 10 described above in this application can be configured with a through-hole so that the two core tubes extending from the through-hole can be connected to other circuit structures.

[0099] Furthermore, the housing structure 500 also includes two sealing elements, each of which is used to seal the gap between the corresponding through-hole and the core tube.

[0100] Therefore, the heat dissipation structure 10 described above in this application can block the gap between the corresponding through-hole and the core tube by configuring a sealing component, thereby preventing the heat transfer medium from flowing out of the through-hole.

[0101] In some embodiments, the thermally conductive medium can be potting compound or other media, as long as it can achieve the corresponding function.

[0102] In some embodiments, the housing can serve as the center tap of the transformer.

[0103] Furthermore, the outer shell can be manufactured using aluminum extrusion technology, and the side walls of the outer shell can be cut according to the number of internal magnetic cores to obtain the required length of side walls, resulting in high compatibility.

[0104] Furthermore, there are multiple first heating elements 20, and the number of housing structures 500 corresponds to the number of first heating elements 20. The orientation of the filling port of at least one housing structure 500 differs from the orientation of the filling ports of the other housing structures 500.

[0105] Therefore, the heat dissipation structure 10 described above in this application, since the liquid cooling plate assembly 100 includes two liquid cooling plates, can conduct the heat emitted by the multiple first heat-generating devices 20 to different positions of the two liquid cooling plates by configuring the orientation of the filling port of at least one housing structure 500 to be different from the orientation of the filling port of other housing structures 500, thereby further improving the heat dissipation effect.

[0106] Furthermore, there are two first heating elements 20, and the number of housing structures 500 corresponds to the number of first heating elements 20. One housing structure 500 has its filling port facing the first liquid cooling plate 110, and the other housing structure 500 has its filling port facing the second liquid cooling plate 120.

[0107] Furthermore, the number of first heating devices 20 is greater than two, except for the housing structure 500 whose potting opening faces the first liquid cooling plate 110 or the second liquid cooling plate 120, the potting openings of the other housing structures 500 face the width direction of the first liquid cooling plate 110 and the second liquid cooling plate 120.

[0108] The heat dissipation structure 10 of this application, through the above structure, can determine the flow direction of the cooling liquid when the power of the heat-generating device is low, ensuring the safe and stable operation of the heat dissipation structure 10. It can also ensure the safe and stable operation of the heat dissipation structure 10 by issuing a fault signal and controlling the heat-generating device to stop working when the flow rate of the cooling liquid drops to the point that the cooling liquid cannot effectively dissipate heat or even cannot pass through the anti-reverse device 400, while ensuring the heat dissipation effect of the heat-generating device.

[0109] Please see Figure 4 , Figure 4This is a schematic diagram of an electronic device in some embodiments of this application. For example... Figure 4 As shown, this application also provides an electronic device 1, which includes a first heat-generating device 20 and a heat dissipation structure 10 as described in any of the foregoing embodiments. The heat dissipation structure 10 is at least used to dissipate heat from the first heat-generating device 20.

[0110] Please refer to it again. Figure 1 .like Figure 1 As shown, the heat dissipation structure 10 includes a liquid cooling plate assembly 100 and an anti-reverse device 400. The liquid cooling plate assembly 100 has a liquid flow channel for providing a flow path for the cooling liquid. The liquid cooling plate assembly 100 also has an inlet 111 and an outlet 112. The inlet 111 is for the cooling liquid to flow into, and the outlet 112 is for the cooling liquid to flow out. The liquid cooling plate assembly 100 is used for thermal conduction connection with the first heating device 20. The cooling liquid in the liquid flow channel exchanges heat with the first heating device 20 to remove the heat dissipated by the first heating device 20. The anti-reverse device 400 is connected to the inlet 111 and / or outlet 112. The anti-reverse device 400 is used to control the inlet 111 and / or outlet 112 to disconnect from the liquid flow channel when the flow direction of the cooling liquid in the inlet 111 and / or outlet 112 is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet 111 and / or outlet 112 is less than a preset threshold.

[0111] For a more specific description of the heat dissipation structure 10, please refer to the relevant content of the heat dissipation structure 10 in any of the foregoing embodiments, which will not be repeated here.

[0112] In some embodiments, the electronic device 1 may further include a second heating device 30. The first heating device 20 may be an electronic device such as a transformer or inductor, and the second heating device 30 may be an electronic device such as a resistor, transistor, or diode.

[0113] In some embodiments, electronic device 1 may be a medium frequency power supply device, a radio frequency power supply device, or other power supply devices, such as a DC power supply device, an AC power supply device, etc.

[0114] The heat dissipation structure 10 and electronic device 1 of this application, through the above structure, can determine the flow direction of the cooling liquid when the power of the heat-generating device is low, ensuring the safe and stable operation of the heat dissipation structure 10. Furthermore, when the flow rate of the cooling liquid drops to the point where the cooling liquid cannot effectively dissipate heat, or even cannot pass through the anti-reverse device 400, a fault signal is issued and the heat-generating device is controlled to stop working, which also ensures the safe and stable operation of the heat dissipation structure 10 and guarantees the heat dissipation effect of the heat-generating device.

[0115] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Where there is no conflict, the embodiments and features in the embodiments of this application can be combined with each other. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation structure, characterized in that, include: A liquid-cooled plate assembly has a liquid flow channel for providing a flow path for cooling liquid. The liquid-cooled plate assembly also has an inlet and an outlet. The inlet is for the cooling liquid to flow into the liquid, and the outlet is for the cooling liquid to flow out of the liquid. The liquid-cooled plate assembly is used for thermal conduction connection with a first heating device. The cooling liquid in the liquid flow channel exchanges heat with the first heating device to remove the heat dissipated by the first heating device. An anti-reverse device is connected to the water inlet and / or the water outlet. The anti-reverse device is used to control the water inlet and / or the water outlet to disconnect from the liquid flow channel when the flow direction of the cooling liquid in the water inlet and / or the water outlet is opposite to a preset flow direction, or when the flow rate of the cooling liquid in the water inlet and / or the water outlet is less than a preset threshold.

2. The heat dissipation structure according to claim 1, characterized in that, The liquid cooling plate assembly includes a first liquid cooling plate and a second liquid cooling plate that are spaced apart and arranged opposite to each other. Both the first liquid cooling plate and the second liquid cooling plate have liquid flow channels. A first heating device is disposed between the first liquid cooling plate and the second liquid cooling plate.

3. The heat dissipation structure according to claim 2, characterized in that, The liquid cooling plate assembly also includes a connecting pipe, the two ends of which are fixedly connected to the first liquid cooling plate and the second liquid cooling plate, respectively. The connecting pipe has a connecting flow channel, which is used to connect the liquid flow channels of the first liquid cooling plate and the second liquid cooling plate.

4. The heat dissipation structure according to claim 1, characterized in that, The anti-reverse device is connected to the water inlet. The anti-reverse device is used to control the water inlet to disconnect from the liquid flow channel when the flow direction of the cooling liquid in the water inlet is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the water inlet is less than a preset threshold.

5. The heat dissipation structure according to claim 1, characterized in that, The anti-reverse device includes a regulating valve connected to the water inlet. The regulating valve is used to disconnect the connection between the water inlet and the liquid flow channel when the flow direction of the cooling liquid in the water inlet is opposite to a preset flow direction, or when the flow rate of the cooling liquid in the water inlet is less than a preset threshold.

6. The heat dissipation structure according to claim 5, characterized in that, The anti-reverse device also includes a controller and a flow meter. The flow meter is connected to the water inlet, and the controller is connected to both the regulating valve and the flow meter. The flow meter is used to obtain the flow rate of the cooling liquid in the inlet. The controller is used to determine the flow direction and flow rate of the cooling liquid based on the flow rate of the cooling liquid obtained by the flow meter. When the flow direction of the cooling liquid in the inlet is opposite to the preset flow direction, or when the flow rate of the cooling liquid in the inlet is less than a preset threshold, the controller controls the disconnection of the regulating valve to disconnect the connection between the inlet and the liquid flow channel.

7. The heat dissipation structure according to claim 6, characterized in that, The controller is also used to continuously acquire the heat generated by the first heating device per unit time, and when the heat generated by the first heating device per unit time is less than a preset heat, control and adjust the flow rate of the cooling liquid in the inlet to be acquired by the flow meter.

8. The heat dissipation structure according to claim 2, characterized in that, The heat dissipation structure also includes a shell structure, which is connected to both the first liquid cooling plate and the second liquid cooling plate. The first heat-generating device is disposed in the shell structure, such that the first heat-generating device is fixedly disposed between the first liquid cooling plate and the second liquid cooling plate. The shell structure has a filling port, and the heat dissipation structure further includes a heat-conducting medium. The heat-conducting medium has at least a fluid form and a solid form. The filling port is used to allow the fluid form of the heat-conducting medium to flow into the shell structure. After the heat-conducting medium solidifies, it fills the first heating device into the shell structure. The first liquid cooling plate and the second liquid cooling plate are thermally connected to the first heating device at least through the heat-conducting medium located within the shell structure.

9. The heat dissipation structure according to claim 8, characterized in that, There are multiple first heating elements, and the number of housing structures corresponds to the number of first heating elements; In this case, the orientation of the filling port of at least one shell structure is different from the orientation of the filling ports of the other shell structures.

10. An electronic device, characterized in that, include: First heating element; The heat dissipation structure as described in any one of claims 1-9 is at least used for dissipating heat from the first heat-generating device.

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