Wafer rotating mechanism for wafer cleaning
By designing a wafer transfer mechanism, the wafer rotation is driven by a turntable assembly and the self-rotation and revolution of the clamping assembly, solving the problem of cleaning dead zones in traditional cleaning technology and achieving uniform cleaning and high-quality cleaning effect on the wafer surface.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-12
- Publication Date
- 2026-04-14
AI Technical Summary
In traditional wafer cleaning and etching techniques, uneven contact between the solution and the wafer leads to dead zones in cleaning or etching, especially in areas with insufficient treatment at wafer edges and complex structures.
Design a wafer transfer mechanism including a base, a turntable assembly, a clamping assembly, a cleaning assembly, and a driving assembly. The turntable assembly drives the wafer to rotate synchronously. Combined with the rotation and revolution of the clamping assembly, it ensures that the cleaning fluid evenly covers the wafer surface and uses centrifugal force to throw out residual liquid, avoiding cleaning dead corners.
It achieves uniform cleaning of the wafer surface, significantly improves cleaning quality and yield, reduces the risk of liquid residue and water stain formation, and ensures surface cleanliness.
Smart Images
Figure CN121865894A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of wafer cleaning technology, and in particular to a wafer transfer mechanism for wafer cleaning. Background Technology
[0002] In the semiconductor chip manufacturing industry, the wafer serves as the core carrier, and its surface cleanliness directly determines the precision of subsequent key processes such as photolithography, coating, and etching, as well as the yield of the final chip. Wafer cleaning, as one of the core steps in the semiconductor manufacturing process, is mainly used to remove particulate contaminants, metal ions, organic impurities, and etching residues remaining on the wafer surface from dicing, grinding, polishing, and previous processes. Simultaneously, it must avoid causing physical damage or chemical corrosion to the wafer surface. Therefore, extremely high requirements are placed on the uniformity, thoroughness, and versatility of the cleaning process.
[0003] Traditional wafer cleaning and etching techniques typically involve loading wafers into baskets and placing them in cleaning or etching tanks, where they are processed through solution immersion or spraying. Immersion processes involve injecting a pre-concentrated cleaning or etching solution into the cleaning tank, completely submerging the wafer in the solution. The chemical action of the solution removes contaminants or etches specific areas. Spray processes, on the other hand, use fixed-direction spray pipes within the cleaning tank, employing high-pressure spray nozzles to direct the cleaning or etching solution onto the wafer surface. The combined effect of chemical action and fluid impact achieves the cleaning or etching effect.
[0004] These two methods rely on static or dynamic rinsing of the solution to remove contaminants from the wafer surface or to complete the etching process. However, because the basket is fixed in the tank, the contact between the solution and the wafer is often uneven, especially at the edges and complex structural areas of the wafer, which can easily create dead zones for cleaning or etching, resulting in insufficient treatment. Summary of the Invention
[0005] Therefore, it is necessary to provide a wafer transfer mechanism for wafer cleaning to address the insufficient processing capabilities of current wafer cleaning and etching technologies.
[0006] The above objectives are achieved through the following technical solutions: A wafer transfer mechanism for wafer cleaning includes: Base; A turntable assembly for carrying a wafer, wherein the base provides support for the turntable assembly; A clamping assembly, wherein the clamping assembly is configured in multiple groups, and the multiple groups of clamping assemblies are arranged circumferentially around the central axis of the wafer for clamping the wafer; A cleaning assembly for cleaning wafers; The drive component, during the wafer cleaning process, can drive the turntable assembly to rotate the wafer synchronously.
[0007] Furthermore, it also includes multiple sets of power components. During the synchronous rotation of the wafer driven by the turntable assembly, each set of power components can provide power to one set of clamping components, enabling the clamping components to drive the wafer to rotate around its own axis.
[0008] Furthermore, the turntable assembly includes two sets of first turntables and two sets of second turntables. The two sets of first turntables are spaced apart along the axial direction of the wafer, and the two sets of second turntables are spaced apart along the axial direction of the wafer. The base is provided with two sets of rotating shafts that can rotate around their own axial direction. The two sets of rotating shafts are spaced apart along the axial direction of the wafer. Each set of rotating shafts is coaxially connected to one set of first turntables and one set of second turntables. The first turntables are fixedly connected to the rotating shafts, and the second turntables are rotatably connected to the rotating shafts. The second turntables are coaxially and detachably disposed inside the first turntables.
[0009] Furthermore, the clamping assembly includes a clamping shaft, two sets of movable bushings, two sets of movable blocks, and a rubber sleeve. The clamping shaft is disposed between the two sets of second turntables and extends along the axial direction of the wafer. The two sets of movable bushings are respectively disposed at both ends of the clamping shaft and are coaxially rotatably connected to the clamping shaft. The two sets of movable blocks are respectively disposed at both ends of the clamping shaft, and the movable blocks are coaxially slidably connected to the movable bushings. The movable blocks are all slidably connected to the first turntable and the second turntable. The rubber sleeve is coaxially disposed on the outside of the clamping shaft, and multiple sets of clamping grooves for clamping the wafer are formed on the rubber sleeve. The multiple sets of clamping grooves are spaced apart along the axial direction of the clamping shaft.
[0010] Furthermore, a tension spring is provided inside the moving block. One end of the tension spring is fixedly connected to the moving block, and the other end is fixedly connected to the moving bushing. The elastic force of the tension spring causes the clamping shaft to have a tendency to slide radially toward the center of the wafer.
[0011] Furthermore, the first turntable has a first sliding groove that slides in conjunction with the moving block. The first sliding groove is provided in multiple sets, and the multiple sets of the first sliding groove are arranged circumferentially around the central axis of the first turntable. The second turntable has a second sliding groove that slides in conjunction with the moving block. The second sliding groove is provided in multiple sets, and the multiple sets of the second sliding groove are arranged circumferentially around the central axis of the second turntable. The second sliding groove extends radially toward the center of the second turntable, and the first sliding groove extends radially along the first turntable, forming an angle with the extension direction of the second sliding groove.
[0012] Furthermore, the power assembly includes a connecting plate, a small motor, a small gear, and a large gear. The connecting plate is coaxially fixed on the outside of the movable bushing. The small motor is fixedly connected to the connecting plate, and the output end of the small motor is fixedly connected to the small gear. The large gear is coaxially fixed on the outside of the clamping shaft and meshes with the small gear.
[0013] Furthermore, the cleaning components are configured in two groups, with the two groups of cleaning components spaced apart along the radial direction of the wafer.
[0014] Furthermore, the cleaning assembly includes a pneumatic unit and a spraying unit. The spraying unit is used to spray cleaning fluid onto the wafer surface, and the pneumatic unit is used to change the spraying angle of the spraying unit.
[0015] Furthermore, the spraying unit includes a connecting rod and a liquid storage tube. The connecting rod extends along the axial direction of the wafer and is fixedly connected to the base. The liquid storage tube is coaxially disposed inside the connecting rod and can slide relative to the connecting rod. A liquid storage cavity extending along its own axial direction is formed inside the liquid storage tube. A radially extending liquid inlet pipe is fixedly disposed on the liquid storage tube for conveying cleaning fluid to the liquid storage cavity. A plurality of axially extending through slots are formed on the connecting rod, and the plurality of through slots are spaced apart along the axial direction of the connecting rod. A spray pipe communicating with the liquid storage cavity is disposed in each through slot, and the spray pipe is fixedly connected to the liquid storage tube. The spray pipe has a flexible hose structure, and the spray pipe can deform when the pneumatic unit drives the liquid storage tube to slide along its own axial direction.
[0016] The beneficial effects of this invention are: This invention provides a wafer cleaning mechanism, comprising: a base, a turntable assembly, a clamping assembly, a cleaning assembly, and a driving assembly. The turntable assembly, serving as a support structure for multiple wafers, is mounted on the base, allowing the wafers to be mounted vertically and spaced parallel to each other in the horizontal direction. Multiple clamping assemblies are arranged circumferentially around the central axis of the wafers to stably clamp their outer edges, ensuring secure clamping without surface damage. After the clamping assemblies have clamped the wafers, the cleaning assembly begins spraying cleaning fluid onto the wafer surface. Simultaneously, the driving assembly activates and drives the turntable assembly to rotate at a low speed, causing the wafers to rotate synchronously at a low speed, achieving a low-speed revolution motion. This ensures the cleaning fluid evenly covers all areas of the wafer surface, effectively eliminating cleaning dead zones and improving the uniformity of wafer cleaning. After cleaning, the drive unit drives the turntable assembly to rotate at high speed, using centrifugal force to quickly throw off the cleaning fluid remaining on the wafer surface, effectively reducing liquid residue and significantly reducing the risk of water stains or particle re-adhesion after water evaporation, ensuring the cleanliness of the wafer surface and significantly improving cleaning quality and yield. Attached Figure Description
[0017] Figure 1 This is an isometric schematic diagram of a wafer cleaning transfer mechanism provided in an embodiment of the present invention; Figure 2 for Figure 1 Side view; Figure 3 for Figure 2 Cross-sectional view along section AA; Figure 4 for Figure 3 A magnified view of part B in the diagram; Figure 5 for Figure 1 A schematic diagram of the structure of the turntable assembly and the clamping assembly; Figure 6 for Figure 5 A magnified view of part of C; Figure 7 for Figure 5 Side view; Figure 8 for Figure 7 Cross-sectional view along section DD; Figure 9 for Figure 8 A magnified view of part of E in the diagram; Figure 10 for Figure 5 A schematic diagram of the structure of the first and second turntables.
[0018] in: 101. Base; 102. Wafer; 111. Large motor; 112. First gear; 200. Turntable assembly; 201. First turntable; 202. Second turntable; 211. First plate; 212. Second plate; 213. Third plate; 214. Fourth plate; 221. First slide rail; 222. Second slide rail; 223. Pressure block; 224. Rotating shaft; 300. Clamping assembly; 301. Moving block; 302. Moving bushing; 303. Tension spring; 304. Clamping shaft; 305. Rubber sleeve; 306. Clamping groove; 311. Connecting plate; 312. Small motor; 313. Small gear; 314. Large gear; 400. Cleaning assembly; 401. Connecting rod; 402. Through groove; 411. Liquid storage pipe; 412. Liquid storage chamber; 413. Liquid inlet pipe; 414. Liquid spray pipe; 421. Cylinder. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
[0020] The component designations used in this document, such as "first" and "second," are merely for distinguishing the described objects and do not have any sequential or technical meaning. The terms "connection" and "linkage" used in this invention, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.
[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0022] The following reference Figures 1 to 10 This invention describes a wafer cleaning transfer mechanism provided in an embodiment of the invention. The wafer cleaning transfer mechanism includes a base 101, a turntable assembly 200, and a clamping assembly 300. The base 101 serves as the mounting base for other components, including the turntable assembly 200, which can be directly or indirectly mounted on the base 101, forming a relatively integrated whole. The turntable assembly 200 carries multiple sets of wafers 102, which are mounted vertically and distributed parallel to each other in the horizontal direction. Multiple clamping assemblies 300 are configured, circumferentially arranged around the central axis of the wafers 102, stably clamping the outer edges of the wafers 102, ensuring secure clamping without surface damage. Simultaneously, the turntable assembly 200 also serves as a support structure for the clamping assemblies 300, ensuring that the multiple clamping assemblies 300 can move synchronously to stably clamp the wafers 102.
[0023] Furthermore, the wafer cleaning mechanism also includes a cleaning assembly 400 and a drive assembly. Specifically, after the clamping assembly 300 completes clamping of the wafer 102, the cleaning assembly 400 begins spraying cleaning fluid onto the surface of the wafer 102 for cleaning. Simultaneously, the drive assembly starts and drives the turntable assembly 200 to rotate at a low speed, causing the wafer 102 to rotate synchronously at a low speed, achieving a low-speed revolution motion. This ensures that the cleaning fluid evenly covers all areas of the wafer 102 surface, effectively eliminating cleaning dead zones and improving the uniformity of cleaning the wafer 102.
[0024] After cleaning, the drive unit drives the turntable assembly 200 to rotate at high speed, using centrifugal force to quickly throw out the cleaning liquid remaining on the surface of wafer 102, effectively reducing liquid residue and significantly reducing the risk of water stains or particle re-adhesion after water evaporation, ensuring the cleanliness of the wafer 102 surface and significantly improving cleaning quality and yield.
[0025] In one embodiment, the wafer cleaning mechanism further includes multiple sets of power components. Specifically, during the synchronous rotation and cleaning process of the wafers 102 driven by the turntable assembly 200, each set of power components provides power to one set of clamping assemblies 300, causing the clamping assemblies 300 to drive multiple sets of wafers 102 to rotate synchronously around their own axes. This allows the wafers 102 to change their cleaning position during cleaning by rotating, continuously changing the contact position between their surface and the cleaning fluid. This ensures that the cleaning fluid evenly covers the entire surface of the wafers 102, effectively reducing cleaning dead zones caused by obstruction or uneven flow field. Simultaneously, during the spin-drying of the cleaning fluid, it also enhances the uniformity of centrifugal force, accelerating and thoroughly removing cleaning fluid residue from the surface of the wafers 102, further avoiding the problem of cleaning fluid residue.
[0026] In one embodiment, the turntable assembly 200 includes two sets of first turntables 201 and two sets of second turntables 202. The two sets of first turntables 201 are spaced apart along the axial direction of the wafer 102, and the two sets of second turntables 202 are also spaced apart along the axial direction of the wafer 102. The base 101 is provided with two sets of rotating shafts 224 capable of rotating about their own axial direction, and these two sets of rotating shafts 224 are spaced apart along the axial direction of the wafer 102. Each set of rotating shafts 224 is coaxially connected to one set of first turntables 201 and one set of second turntables 202. The first turntables 201 are coaxially and fixedly connected to the rotating shafts 224, and the second turntables 202 are coaxially and rotatably connected to the rotating shafts 224, with the second turntables 202 coaxially disposed inside the first turntables 201. A pressure block 223 is fixedly provided on the second turntables 202, and the second turntables 202 are detachably connected to the first turntables 201 via the pressure block 223. Specifically, the first turntable 201 includes a first plate 211 and a second plate 212, which are detachably joined together in the vertical direction to form the overall structure of the first turntable 201. The second turntable 202 includes a third plate 213 and a fourth plate 214, which are detachably joined together in the vertical direction to form the overall structure of the second turntable 202.
[0027] Furthermore, the clamping assembly 300 includes a clamping shaft 304, two sets of movable bushings 302, two sets of movable blocks 301, and a rubber sleeve 305. The clamping shaft 304 is disposed between the two sets of second turntables 202 and extends along the axial direction of the wafer 102. The two sets of movable bushings 302 are respectively disposed at both ends of the clamping shaft 304 and are coaxially rotatably connected to the clamping shaft 304. The two sets of movable blocks 301 are respectively disposed at both ends of the clamping shaft 304, and the movable blocks 301 are coaxially slidably connected to the movable bushings 302. The first turntable 201 has multiple sets of first sliding grooves 221, through which the movable blocks 301 are slidably connected to the first turntable 201; while the second turntable 202 has multiple sets of second sliding grooves 222, through which the movable blocks 301 are slidably connected to the second turntable 202. Furthermore, multiple sets of the first slide groove 221 and the second slide groove 222 are provided. Multiple sets of the first slide groove 221 are circumferentially arranged around the central axis of the first turntable 201, and multiple sets of the second slide groove 222 are circumferentially arranged around the central axis of the second turntable 202. The second slide groove 222 extends radially towards the center of the second turntable 202, and the first slide groove 221 extends radially along the first turntable 201, forming a certain angle with the extension direction of the second slide groove 222. This allows the first turntable 201 and the second turntable 202 to constitute an iris adjustment mechanism. In addition, a rubber sleeve 305 is coaxially sleeved on the outside of the clamping shaft 304, and its surface has multiple clamping grooves 306 for clamping the wafer 102. These clamping grooves 306 are spaced apart axially along the clamping shaft 304.
[0028] Specifically, when installing wafer 102, firstly, the clamping block 223 is removed, then the first plate 211 and the third plate 213 are removed, and then the clamping shaft 304, which slides with the first plate 211 and the third plate 213, and its connected components are removed as a whole. Then, wafers 102 are placed in sequence, ensuring that each set of wafers 102 accurately corresponds to a clamping slot 306 and is located in its predetermined position. After all wafers 102 have been placed, the clamping shaft 304 and its connected components, the first plate 211, and the third plate 213 are reinstalled and put back into place in sequence.
[0029] In one embodiment, a tension spring 303 is provided inside the movable block 301. One end of the tension spring 303 is fixedly connected to the movable block 301, and the other end is fixedly connected to the movable bushing 302. The elastic force of the tension spring 303 causes the clamping shaft 304 to tend to slide radially toward the center of the wafer 102, thereby initially achieving the pre-clamping of the rubber sleeve 305 on the outer edge of the wafer 102 to ensure the clamping effect.
[0030] Furthermore, the drive assembly includes a large motor 111 and multiple sets of meshing first gears 112. The large motor 111 is fixedly connected to the base 101, and its output end is fixedly connected to a set of first gears 112. The set of first gears 112 at the end is fixedly connected to a rotating shaft 224 near one end of the large motor 111. Therefore, after the large motor 111 is started, the rotating shaft 224 is driven to rotate through the first gears 112, thereby driving the first turntable 201 to rotate. Since the pressure block 223 is not installed at this time, the first turntable 201 and the second turntable 202 rotate relative to each other. The first turntable 201 is provided with a first groove 221, and the second turntable 202 is provided with a second groove 222, and the extending directions of the first groove 221 and the second groove 222 are arranged at an angle. When the first turntable 201 and the second turntable 202 rotate relative to each other, the first slide groove 221 and the second slide groove 222 guide the moving block 301 to slide towards the rotating shaft 224, causing multiple sets of clamping shafts 304 to synchronously retract towards the center of the wafer 102 along their own radial direction, thereby achieving the adjustment effect of the iris adjustment mechanism. This allows it to adaptively fit wafers 102 of different diameters, ensuring that the rubber sleeve 305 always fits tightly against the edge of the wafer 102 to guarantee the clamping effect.
[0031] Understandably, as the clamping shaft 304 gradually approaches the wafer 102, its outer rubber sleeve 305 first contacts the edge of the wafer 102. Due to the good elasticity of the rubber sleeve 305, it undergoes localized compression deformation upon contacting and clamping the wafer 102, with the deformation direction pointing inwards towards the clamping shaft 304. At this time, the elastic restoring force generated by the deformation of the rubber sleeve 305 points radially towards the center of the wafer 102 along the clamping shaft 304. This allows multiple sets of rubber sleeves 305 to jointly apply uniform clamping pressure to the outer edge of the wafer 102, further enhancing the reliability and safety of the clamping and preventing slippage or displacement.
[0032] After clamping and positioning are completed, the pressure block 223 is reinstalled to rigidly lock the first turntable 201 and the second turntable 202, preventing the clamping from loosening or failing due to relative movement during the cleaning process. At this time, the large motor 111 is started to run at low speed, so that the first turntable 201 and the second turntable 202 rotate synchronously at low speed, thereby driving the wafer 102 to rotate synchronously at low speed, realizing low-speed revolution motion, so that the cleaning fluid evenly covers all areas of the wafer 102 surface, effectively eliminating cleaning dead corners and improving the uniformity of cleaning the wafer 102.
[0033] In one embodiment, the power assembly includes a connecting disk 311, a small motor 312, a pinion 313, and a large gear 314. The connecting disk 311 is coaxially fixed to the outside of the movable bushing 302. The small motor 312 is fixedly connected to the connecting disk 311, and its output end is fixedly connected to the pinion 313. The large gear 314 is coaxially fixed to the outside of the clamping shaft 304 and meshes with the pinion 313. Specifically, when the wafer 102 is undergoing revolution cleaning, the small motor 312 is started, which drives the pinion 313 to rotate. Through meshing, the small motor 312 drives the large gear 314 to rotate, thereby causing the clamping shaft 304 to rotate around its own axis. Since the wafer 102 is clamped in the clamping groove 306 of the rubber sleeve 305, the rotation of the clamping shaft 304 is directly transmitted to the wafer 102's rotation. This causes the wafer 102 to change its cleaning position during cleaning by rotating, continuously changing the contact position between its surface and the cleaning solution. This ensures that the cleaning solution evenly covers the entire surface of the wafer 102, effectively reducing cleaning dead zones caused by obstruction or uneven flow field.
[0034] In one embodiment, the cleaning components 400 are configured as two sets, which are arranged radially apart along the wafer 102 to improve cleaning efficiency and cleaning range.
[0035] In one embodiment, the cleaning assembly 400 includes a pneumatic unit and a spraying unit. The spraying unit sprays cleaning fluid onto the surface of the wafer 102, and the pneumatic unit changes the spraying angle of the spraying unit.
[0036] Furthermore, the spraying unit includes a connecting rod 401 and a liquid storage tube 411. The connecting rod 401 extends axially along the wafer 102 and is fixedly connected to the base 101. The liquid storage tube 411 is coaxially disposed inside the connecting rod 401, and the liquid storage tube 411 can slide relative to the connecting rod 401 along its own axial direction under the drive of the pneumatic unit. A liquid storage cavity 412 extending axially is formed inside the liquid storage tube 411, and a radially extending liquid inlet tube 413 is fixedly disposed on the liquid storage tube 411 for conveying cleaning fluid to the liquid storage cavity 412. A plurality of axially extending through slots 402 are formed on the connecting rod 401, and the plurality of through slots 402 are spaced apart along the axial direction of the connecting rod 401. Each through slot 402 is provided with a spray pipe 414 communicating with the liquid storage cavity 412, and the spray pipe 414 is fixedly connected to the liquid storage tube 411. In addition, the spray nozzle 414 has a flexible hose structure and good deformability.
[0037] Specifically, the pneumatic unit is configured as cylinder 421. Cylinder 421 is fixedly connected to base 101, and the output end of cylinder 421 is connected to liquid storage pipe 411. In the initial state, the nozzle of spray pipe 414 faces the left surface of wafer 102, i.e. Figure 3 In the left-right direction within the channel. When cleaning begins, cylinder 421 activates, driving the liquid storage pipe 411 to slide to the right along its own axis, causing all the spray pipes 414 to move synchronously. As the liquid storage pipe 411 continues to slide to the right, the spray pipes 414 gradually slide from the left end to the right end of the channel 402, i.e. Figure 4 In the left-right direction. When the spray pipe 414 slides to the right end of the through groove 402 and abuts against the connecting rod 401, with the continuous activation of the cylinder 421, the spray pipe 414 undergoes elastic deformation, and its nozzle gradually faces the right side surface of the wafer 102. Therefore, during the reciprocating motion of the liquid storage pipe 411, the spray pipe 414 sweeps across both sides of the wafer 102 in sequence, significantly improving the coverage of the cleaning fluid.
[0038] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0039] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.
Claims
1. A wafer transfer mechanism for wafer cleaning, characterized in that, include: Base; A turntable assembly for carrying a wafer, wherein the base provides support for the turntable assembly; A clamping assembly, wherein the clamping assembly is configured in multiple sets, and the multiple sets of clamping assemblies are arranged circumferentially around the central axis of the wafer for clamping the wafer; A cleaning assembly for cleaning wafers; The drive component, during the wafer cleaning process, can drive the turntable component to rotate the wafer synchronously.
2. The wafer transfer mechanism for wafer cleaning according to claim 1, characterized in that, It also includes multiple sets of power components. During the synchronous rotation of the wafer driven by the turntable assembly, each set of power components can provide power to one set of clamping components, so that the clamping components can drive the wafer to rotate around its own axis.
3. The wafer transfer mechanism for wafer cleaning according to claim 2, characterized in that, The turntable assembly includes two sets of first turntables and two sets of second turntables. The two sets of first turntables are spaced apart along the axial direction of the wafer, and the two sets of second turntables are spaced apart along the axial direction of the wafer. The base is provided with two sets of rotating shafts that can rotate around their own axial direction. The two sets of rotating shafts are spaced apart along the axial direction of the wafer. Each set of rotating shafts is coaxially connected to one set of first turntables and one set of second turntables. The first turntables are fixedly connected to the rotating shafts, and the second turntables are rotatably connected to the rotating shafts. The second turntables are coaxially and detachably disposed inside the first turntables.
4. The wafer transfer mechanism for wafer cleaning according to claim 3, characterized in that, The clamping assembly includes a clamping shaft, two sets of movable bushings, two sets of movable blocks, and a rubber sleeve. The clamping shaft is disposed between the two sets of second turntables and extends along the axial direction of the wafer. The two sets of movable bushings are respectively disposed at both ends of the clamping shaft and are rotatably connected to the clamping shaft coaxially. The two sets of movable blocks are respectively disposed at both ends of the clamping shaft, and are slidably connected to the movable bushings coaxially. The movable blocks are also slidably connected to the first turntable and the second turntable. The rubber sleeve is coaxially disposed on the outside of the clamping shaft, and has multiple sets of clamping grooves for clamping the wafer. The multiple sets of clamping grooves are spaced apart along the axial direction of the clamping shaft.
5. The wafer transfer mechanism for wafer cleaning according to claim 4, characterized in that, The movable block is equipped with a tension spring inside. One end of the tension spring is fixedly connected to the movable block, and the other end is fixedly connected to the movable bushing. The elastic force of the tension spring causes the clamping shaft to have a tendency to slide radially toward the center of the wafer.
6. The wafer transfer mechanism for wafer cleaning according to claim 4, characterized in that, The first turntable has a first sliding groove that slides with the moving block. The first sliding groove is provided in multiple sets, and the multiple sets of the first sliding groove are arranged circumferentially around the central axis of the first turntable. The second turntable has a second sliding groove that slides with the moving block. The second sliding groove is provided in multiple sets, and the multiple sets of the second sliding groove are arranged circumferentially around the central axis of the second turntable. The second sliding groove extends radially towards the center of the second turntable, and the first sliding groove extends radially along the first turntable, forming an angle with the extension direction of the second sliding groove.
7. The wafer transfer mechanism for wafer cleaning according to claim 4, characterized in that, The power assembly includes a connecting plate, a small motor, a small gear, and a large gear. The connecting plate is coaxially fixed on the outside of the movable bushing. The small motor is fixedly connected to the connecting plate, and the output end of the small motor is fixedly connected to the small gear. The large gear is coaxially fixed on the outside of the clamping shaft and meshes with the small gear.
8. The wafer transfer mechanism for wafer cleaning according to claim 1, characterized in that, The cleaning components are configured in two groups, and the two groups of cleaning components are arranged at a distance along the radial direction of the wafer.
9. The wafer transfer mechanism for wafer cleaning according to claim 1, characterized in that, The cleaning assembly includes a pneumatic unit and a spraying unit. The spraying unit is used to spray cleaning fluid onto the wafer surface, and the pneumatic unit is used to change the spraying angle of the spraying unit.
10. The wafer transfer mechanism for wafer cleaning according to claim 9, characterized in that, The spraying unit includes a connecting rod and a liquid storage tube. The connecting rod extends along the axial direction of the wafer and is fixedly connected to the base. The liquid storage tube is coaxially disposed inside the connecting rod and can slide relative to the connecting rod. The liquid storage tube has a liquid storage cavity extending along its own axial direction inside. A radially extending liquid inlet pipe is fixedly disposed on the liquid storage tube for conveying cleaning fluid to the liquid storage cavity. The connecting rod has multiple through slots extending along its axial direction, and the multiple through slots are spaced apart along the axial direction of the connecting rod. Each through slot is provided with a spray pipe communicating with the liquid storage cavity, and the spray pipe is fixedly connected to the liquid storage tube. The spray pipe has a flexible hose structure, and the spray pipe can deform when the pneumatic unit drives the liquid storage tube to slide along its own axial direction.