Base, vibration monitor, main shaft jig, auxiliary shaft jig and vibration test system

Abstract

The invention discloses a base, a vibration monitor, a main shaft jig, an auxiliary shaft jig and a vibration testing system. The base comprises a base body and a sensing assembly. The base body comprises a bottom located in the main shaft direction of the base body. The sensing assembly comprises a sensing circuit board and a sensing chip, the sensing circuit board is assembled at one end of the bottom, and the sensing chip is assembled at one end, back to the bottom, of the sensing circuit board; the sensing chip is provided with a first main shaft projection area in the main shaft direction, and the base is provided with an auxiliary shaft projection area in the auxiliary shaft direction; at least at the part corresponding to the projection area of the first main shaft, the bottom is fit with the assembly surface between the sensing circuit board; at least at the positions corresponding to the first main shaft projection area and the auxiliary shaft projection area, the bottom is arranged to be solid and compact in structure. According to the invention, the overall triaxial frequency response of the vibration monitor can be balanced, the auxiliary shaft frequency response performance (for example, 6k-7k) can be improved, and finally the overall use reliability of the vibration monitor can be improved.

Description

Technical Field

[0001] This invention relates to the field of vibration monitoring technology, specifically to a base, a vibration monitor, a main spindle fixture, an auxiliary spindle fixture, and a vibration testing system. Background Technology

[0002] Traditional single-axis vibration sensors can only capture vibration signals in a single direction, while in actual working conditions, vibration often presents a three-dimensional wave pattern with X / Y / Z three-dimensional coupling. Therefore, triaxial vibration sensors, by simultaneously acquiring vibration data from three orthogonal axes, can comprehensively reflect the true vibration state of equipment, and are especially suitable for fault diagnosis of complex mechanical systems such as motors and gearboxes.

[0003] Frequency response (hereinafter referred to as frequency response) is a very important indicator for evaluating the performance of a vibration sensor. Monitors with higher frequency responses are better able to reflect the actual vibration of the tested equipment. The consistency of the frequency response of a triaxial vibration sensor directly affects the phase and amplitude accuracy of the vibration signal. If the frequency responses of each axis are unbalanced (e.g., the high-frequency decay of the X-axis is faster than that of the Y / Z axes), it will lead to distortion during multi-axis signal synthesis, thus affecting fault feature extraction.

[0004] Currently, most triaxial vibration sensors on the market have the following problems: Firstly, the frequency response of the main spindle (i.e., the z-axis) is inconsistent with that of the auxiliary spindle (i.e., the x-axis and y-axis), resulting in unbalanced performance.

[0005] Secondly, the auxiliary shaft has a low frequency response, only reaching 1.5k to 2k, which limits its applications and reduces its reliability. Summary of the Invention

[0006] The main objective of this invention is to provide a base, a vibration monitor, a main spindle fixture, an auxiliary spindle fixture, and a vibration testing system, which aims to solve the problem of reduced reliability caused by the uneven frequency response of traditional triaxial vibration sensors.

[0007] To achieve the above objectives, the present invention provides a base for use in a vibration monitor, the base comprising: The base includes a bottom located along its main axis; and, A sensing assembly includes a sensing circuit board and a sensing chip, wherein the sensing circuit board is mounted at one end of the bottom and the sensing chip is mounted at the end of the sensing circuit board opposite to the bottom. The sensing chip has a first main axis projection area in the main axis direction, and the base has an auxiliary axis projection area in the auxiliary axis direction. At least at the location corresponding to the first spindle projection area, the mounting surfaces between the bottom and the sensing circuit board are adapted to fit together; At least at the locations corresponding to the first main axis projection area and the auxiliary axis projection area, the bottom is set to be solid and structurally dense.

[0008] Optionally, the sensing circuit board has a second spindle projection area in the spindle direction; At least at the location corresponding to the projection area of ​​the second spindle, the mounting surfaces between the bottom and the sensing circuit board are adapted to fit together; At least at the locations corresponding to the second main axis projection area and the auxiliary axis projection area, the bottom is set to be solid and structurally dense.

[0009] Optionally, at least at the location corresponding to the projection area of ​​the first spindle, the mounting surface between the bottom and the sensing circuit board is a smooth surface.

[0010] Optionally, the bottom has a main axis for facing the vibration center of the vibration device under test along the main axis direction; The first spindle projection area covers the spindle axis; or... The first spindle projection area is offset from the spindle axis and is located close to the spindle axis.

[0011] Optionally, the bottom has a main axis for facing the vibration center of the vibration device under test along the main axis direction, and the bottom is provided with a first connecting structure at the main axis, the first connecting structure being used to connect with a first docking structure provided by the vibration device under test that extends along the vibration transmission direction of its vibration center; The first spindle projection area is offset from the first connecting structure and is located close to the first connecting structure.

[0012] Optionally, the bottom has a main axis for facing the vibration center of the vibration device under test along the main axis direction, the bottom is provided with a second connecting structure, the sensing circuit board is provided with a second mating structure, the second connecting structure is connected to the second mating structure to fix the sensing circuit board to the end face of the bottom; The second connection structure is offset to the side of the spindle axis and disposed away from the spindle axis; and / or, The second docking structure is offset to the side of the sensor chip.

[0013] Optionally, the base has an auxiliary axis for facing the vibration center of the vibration device under test along the auxiliary axis direction; the auxiliary axis projection area includes a first auxiliary axis projection partition of the sensing chip in the auxiliary axis direction; The auxiliary shaft axis is formed at the bottom, and the projection area of ​​the auxiliary shaft is staggered from the projection area of ​​the first auxiliary shaft; or... The base also includes a side portion located in the direction of the auxiliary shaft, the axis of the auxiliary shaft being formed at the side portion, wherein the side portion forms an abutment portion at least at the location of the axis of the auxiliary shaft, the abutment portion being adapted and fitted to the corresponding side surface of the sensing chip, or the abutment portion being adapted and fitted to the corresponding side surface of the sensing circuit board.

[0014] In addition, to achieve the above objectives, the present invention also provides a vibration monitor, including the base as described above.

[0015] In addition, to achieve the above objectives, the present invention also provides a spindle fixture for fixing the vibration monitor as described above to the vibration device to be tested along the spindle direction, wherein the bottom end facing away from the sensing component is provided with a first connection structure. One end of the spindle fixture is provided with a first mating structure that mates with the first connecting structure, and after the two are mated, the spindle fixture fits snugly against the bottom. The other end of the spindle fixture is provided with a second mating structure for mating with the first mating structure of the vibration device to be tested, and after the two are mated, the spindle fixture and the vibration device to be tested are adapted to fit together. Specifically, at least at the location corresponding to the first spindle projection area, the spindle fixture is configured to be solid and have a dense structure.

[0016] Optionally, the sensing circuit board has a second spindle projection area in the spindle direction, and at least at the location corresponding to the second spindle projection area, the spindle fixture is configured to be solid and dense.

[0017] Optionally, at least at the fitting point between the two, the surface area of ​​the spindle fixture is not less than the surface area of ​​the bottom; and / or, At least at the location corresponding to the first spindle projection area, the mating surface between the first mating end and the bottom is set as a smooth surface; and / or, The first docking structure extends along the vibration transmission direction of the vibration center of the vibration device under test, and the central axes of the first connecting structure, the first mating structure, the second mating structure and the first docking structure are collinear or parallel.

[0018] Optionally, the spindle fixture is made of the same or nearly the same material as the bottom.

[0019] In addition, to achieve the above objectives, the present invention also provides an auxiliary shaft fixture for fixing the vibration monitor as described above to the vibration device to be tested along the auxiliary shaft direction. One end of the auxiliary shaft fixture is used to fit and conform to the vibration device under test. The auxiliary shaft fixture is provided with an assembly hole, and the direction of the central axis of the assembly hole is perpendicular to the vibration transmission direction of the vibration center of the vibration device under test. The base is inserted through and fixed at the mounting hole, such that the auxiliary shaft direction of the vibration monitor is collinear or parallel to the vibration transmission direction. The base is adapted to fit the auxiliary shaft fixture, and at least at the location corresponding to the projection area of ​​the auxiliary shaft, the auxiliary shaft fixture is set to be solid and have a dense structure.

[0020] Optionally, the auxiliary shaft fixture includes: The mounting body is used to connect to the vibration device under test and is adapted to fit the vibration device under test; and, The assembly body includes a first assembly part and a second assembly part that are connected and fixed to the mounting body. The second assembly part is detachably connected to the first assembly part and together encloses and defines the assembly hole after connection.

[0021] Optionally, the first assembly part is integrally formed with the mounting body; or, The assembly body is rotatably mounted on the mounting body around an axis extending along the main shaft direction, and after being rotated into position, the first assembly part is connected, fixed, and fitted to the mounting body.

[0022] Optionally, the side surface of the bottom along the auxiliary shaft direction is adapted to fit and conform to the auxiliary shaft fixture; or, The base also includes a side portion located in the direction of the auxiliary shaft, the side portion being adapted to fit and adhere to the auxiliary shaft fixture, the side portion forming at least a portion of an abutment at the fitting point, the abutment portion being adapted to fit and adhere to the corresponding side surface of the sensing chip, or the abutment portion being adapted to fit and adhere to the corresponding side surface of the sensing circuit board.

[0023] Optionally, the first assembly part protrudes from one end of the mounting body opposite to the vibration device to be tested; The base is inserted through and fixed at the mounting hole, and the bottom surface facing away from the sensing circuit board, the edge of the mounting hole at the first mounting part, and the center of the mounting body are respectively aligned along the vibration transmission direction.

[0024] Optionally, the auxiliary shaft fixture is made of the same or nearly the same material as the base.

[0025] In addition, to achieve the above objectives, the present invention also provides a vibration testing system, including a device for testing vibration; The vibration device to be tested is configured in conjunction with the vibration monitor shown above; or... The vibration testing system also includes the main spindle fixture as described above, and / or the auxiliary spindle fixture as described above.

[0026] In the technical solution provided by this invention, after the sensing component is assembled in place at the base, the base is connected to the remaining middle cylinder and top cap in the vibration monitor, which allows the sensing component to be housed inside the vibration monitor, achieving good storage and protection for the sensing component. Based on this, the sensing chip has a clear main axis direction and two auxiliary axis directions.

[0027] When the vibration monitor is assembled onto the vibration device under test along the main axis, that is, when the main axis of the vibration monitor is basically consistent with the vibration transmission direction of the vibration center of the vibration device under test, the vibration wave will be transmitted along the vibration transmission direction, passing through the part of the bottom corresponding to the first main axis projection area and the part of the sensing circuit board corresponding to the first main axis projection area, and finally to the sensing chip.

[0028] When the vibration monitor is assembled onto the vibration device under test along the auxiliary shaft direction, that is, when the auxiliary shaft direction of the vibration monitor is basically consistent with the vibration transmission direction of the vibration center of the vibration device under test, the vibration wave will be transmitted along the vibration transmission direction, passing through the part of the base (i.e., the bottom and / or the sensing circuit board) corresponding to the auxiliary shaft projection area, and finally to the sensing chip.

[0029] In the two transmission paths mentioned above, the bottom and the sensing circuit board serve as the transmission medium. Since the mounting surfaces between the bottom and the sensing circuit board fit together and the bottom structure is dense and solid, it is sufficient to ensure that the vibration wave will hardly be refracted or reflected during the transmission process along the main axis and the auxiliary axis, which helps to balance the frequency response performance of the main axis and the auxiliary axis.

[0030] This invention helps to balance the overall three-axis frequency response of the vibration monitor and improve the auxiliary axis frequency response performance (e.g., up to 6k-7k), ultimately helping to improve the overall reliability of the vibration monitor. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0032] Figure 1 A perspective view of an embodiment of the vibration monitor provided by the present invention; Figure 2 for Figure 1Front view schematic diagram of the vibration monitor; Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure at point AA; Figure 4 A perspective view of the base provided by the present invention; Figure 5 for Figure 4 Top view of the central base; Figure 6 for Figure 4 Front view of the base; Figure 7 for Figure 6 A schematic diagram of the cross-sectional structure at point BB being assembled along the main axis. Figure 8 for Figure 6 A schematic diagram of the cross-sectional structure at the middle BB section when assembled along the auxiliary shaft direction; Figure 9 A three-dimensional schematic diagram of the spindle fixture provided by the present invention; Figure 10 for Figure 9 Front view of the central spindle fixture; Figure 11 for Figure 10 Schematic diagram of the cross-sectional structure at point CC; Figure 12 for Figure 9 Assembly diagram of the central spindle fixture applied to the vibration monitor; Figure 13 for Figure 12 Schematic diagram of the cross-sectional structure at point DD; Figure 14 A three-dimensional schematic diagram of the auxiliary shaft fixture provided by the present invention; Figure 15 for Figure 14 Front view of the auxiliary shaft fixture; Figure 16 for Figure 14 A schematic diagram of the assembly of the auxiliary shaft fixture after it is applied to the vibration monitor. Figure 17 for Figure 14 A schematic diagram of the cross-sectional structure at the EE section.

[0033] Explanation of icon numbers: 100 Base; 110 Seat body; 111 Bottom; 111a First connecting structure; 111b Second connecting structure; 112 Side; 121 Sensing circuit board; 121a Second mating structure; 122 Sensing chip; 200 Middle cylinder; 300 Top cap; 400 Spindle fixture; 410 First mating structure; 420 Second mating structure; 500 Auxiliary spindle fixture; 510 Mounting body; 520 Assembly body; 521 First assembly part; 522 Second assembly part; 530 Assembly hole; H1 First spindle projection area; H2 Second spindle projection area; J Auxiliary spindle projection area; J1 First auxiliary spindle projection partition; J2 Second auxiliary spindle projection partition; J3 Third auxiliary spindle projection partition; T1 Spindle axis; T2 Auxiliary spindle axis.

[0034] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0035] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0036] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0037] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0038] Please see Figures 1 to 8 The present invention provides a base 100 and an applicable vibration monitor thereof.

[0039] The base 100 includes a base body 110 and a sensing component. The sensing component includes a sensing circuit board 121 and a sensing chip 122.

[0040] In addition to the base 100, the vibration monitor may also include a middle cylinder 200 and a top cap 300.

[0041] For ease of understanding, in the following embodiments, the base 100 and its internal components, as well as the vibration monitor and its internal components, are described using the example of having a unified main axis direction and auxiliary axis direction. The main axis direction corresponds to the direction indicated by the Z-axis of the sensor chip 122 after it is assembled. The auxiliary axis direction corresponds to the directions indicated by the X-axis and Y-axis of the sensor chip 122 after it is assembled.

[0042] Based on this, such as Figures 1 to 3 As shown, the base 100, the middle cylinder 200, and the top cap 300 can be arranged sequentially along the main axis. The base 100 and the middle cylinder 200, and the middle cylinder 200 and the top cap 300 can be selectively and detachably connected.

[0043] The interior of the middle cylinder 200 forms a receiving space. This receiving space can accommodate and assemble components such as batteries required for the operation of a vibration monitor.

[0044] The top cap 300 has an internal storage space. This space can accommodate and assemble components such as the main control circuit board and display / control module required for the operation of the vibration monitor. The display / control module may include, but is not limited to, indicator lights and trigger buttons, and can be specifically configured according to actual needs.

[0045] It should be noted that the specific configuration of the middle cylinder 200 and its internal components, and the top cap 300 and its internal components, will not significantly affect the triaxial frequency response performance of the vibration monitor. Therefore, as Figures 1 to 8 The structure described herein is presented in a simplified manner. Furthermore, the following description will primarily focus on the base 100 and its related applications.

[0046] In view of this, please refer to Figures 4 to 8 The base 110 includes a bottom 111 located in its main axis direction. The bottom 111 has a proximal end along the main axis direction near the middle tube 200 and a distal end along the main axis direction away from the middle tube 200.

[0047] The sensing circuit board 121 is mounted at one end of the bottom 111. Specifically, the sensing circuit board 121 is mounted near the bottom 111. The sensing chip 122 is mounted at the end of the sensing circuit board 121 facing away from the bottom 111. The sensing chip 122 and the sensing circuit board 121 are electrically connected according to existing technology. Furthermore, the sensing circuit board 121 may be equipped with various suitable electronic components for the sensing chip 122 according to actual needs, which will not be described in detail here.

[0048] Among them, such as Figure 7 As shown, the sensor chip 122 has a first main axis projection region H1 in the main axis direction. And as... Figure 8 As shown, the base 100 has an auxiliary axis projection area J along the auxiliary axis direction.

[0049] At least at the location corresponding to the first spindle projection area H1, the mounting surfaces between the bottom 111 and the sensing circuit board 121 are adapted and fitted together.

[0050] At least at the locations corresponding to the first main axis projection area H1 and the auxiliary axis projection area J, the bottom 111 is set to be solid and structurally dense.

[0051] In the technical solution provided by the present invention, after the sensing component is assembled in place at the base 100, the base 100 is connected to the remaining middle cylinder 200 and top cap 300 in the vibration monitor, so that the sensing component can be housed inside the vibration monitor, thereby achieving good storage and protection of the sensing component.

[0052] This invention helps to balance the overall three-axis frequency response of the vibration monitor and improve the auxiliary axis frequency response performance (e.g., up to 6k-7k), ultimately helping to improve the overall reliability of the vibration monitor.

[0053] It should be noted that, taking the bottom 111 as an example, the bottom 111 corresponds to the portion of the first principal axis projection area H1, specifically referring to all portions of the bottom 111 where the orthographic projection along the principal axis falls within the first principal axis projection area H1. Similarly, the bottom 111 corresponds to the portion of the auxiliary axis projection area J, specifically referring to all portions of the bottom 111 where the orthographic projection along the auxiliary axis falls within the auxiliary axis projection area J. The related descriptions in the following embodiments are similar and will not be explained one by one.

[0054] First, the vibration device to be tested involved in this invention has a vibration center. Vibration waves will propagate outward from the vibration center along the vibration transmission direction (as indicated by the arrows in the attached figure) (provided the transmission medium is suitable).

[0055] When monitoring triaxial frequency response performance, it is generally necessary to mount the vibration monitor directly or indirectly to the vibration device under test.

[0056] For monitoring the frequency response performance of the spindle, the vibration monitor should be mounted along the spindle direction to the vibration device being tested.

[0057] Specifically, a first connecting structure 111a can be provided at the base 100. For example, the first connecting structure 111a can be provided at the far end of the bottom 111. Correspondingly, a first docking structure is provided at the vibration device to be tested. The first connecting structure 111a and the first docking structure are detachably connected.

[0058] The first connecting structure 111a and the first mating structure can be installed together. In this case, the specific design of either structure is not limited; it can be, but is not limited to, combinations of threaded protrusions and threaded recesses, combinations of snap-fit ​​components and snap-fit ​​grooves (or snap-fit ​​holes), combinations of adhesive components, combinations of adsorption components, etc. For example... Figures 1 to 8 In the structure shown, the first connecting structure 111a can specifically be a screw-in protrusion, and the first mating structure can specifically be a screw-in recess.

[0059] By mounting the vibration monitor along the main axis to the vibration device under test, the main axis of the vibration monitor can be made to be basically consistent with the vibration transmission direction of the vibration center of the vibration device under test. At this point, regardless of the specific transmission path of the vibration wave, it will at least pass through the portion of the bottom 111 corresponding to the first main axis projection area H1 (entirely or partially), and through the portion of the sensing circuit board 121 corresponding to the first main axis projection area H1 (entirely or partially), before finally reaching the sensing chip 122. During this process, the vibration wave will also pass through the mounting points of the bottom 111 and the sensing circuit board 121.

[0060] In the aforementioned conduction path, the sensing circuit board 121 can generally be made solid and dense, so there is no need to make too many changes to the structure.

[0061] Regarding the base 110, this application requires at least a solid and dense structure for the bottom 111 (the part corresponding to the first main axis projection area H1). This is necessary to eliminate reflection and refraction of vibration waves when they pass through holes or cavities during transmission.

[0062] Regarding the connection between the bottom 111 and the sensing circuit board 121, by adapting and fitting the bottom 111 and the sensing circuit board 121 together, it helps to minimize the formation of air gaps (i.e., equivalent to the holes or cavities mentioned above) at the assembly point.

[0063] In this context, "fitting and fitting" means that the two parts have essentially the same shape. Generally, at least at the location corresponding to the first spindle projection area H1, the mounting surface between the bottom 111 and the sensing circuit board 121 should be set as smooth as possible to maximize the tightness of the mounting surface and thus help to essentially eliminate the mounting gap formed at the mounting surface.

[0064] Of course, the specific smoothness of the smooth surface can be determined based on the main performance requirements of the vibration monitor, and there is no single limitation.

[0065] It is understandable that when the vibration monitor is assembled onto the vibration device under test along the main axis, the vibration monitor will form the main axis T1 that is directly opposite (i.e. passes through) the vibration center along the main axis.

[0066] To improve the spindle frequency response performance, it is also necessary to make the sensor chip 122 as close as possible to the spindle axis T1. If the specific orientation of the sensor chip 122 is taken as the main design guide, then the first main axis projection area H1 can be directly set to cover the main axis T1. That is, the sensor chip 122 is directly located on the main axis T1 of the base 100, so that the main axis T1 passes directly through the sensor chip 122, achieving the purpose of the sensor chip 122 being close enough to the vibration center.

[0067] Based on this, at least within the first spindle projection area H1, it is necessary to ensure that there are no holes or cavities, which will help to further optimize the spindle frequency response performance. Specifically, for example, the first connecting structure 111a and the first mating structure should preferably not be located within the first spindle projection area H1. Alternatively, the first connecting structure 111a and the first mating structure can be located on the periphery of the first spindle projection area H1, and as far away from the first spindle projection area H1 as possible.

[0068] Of course, if it is not possible to completely design based on the specific orientation of the sensor chip 122 as described above, then the first main axis projection area H1 can be offset from the main axis T1. However, the first main axis projection area H1 should be made as close as possible to the main axis T1.

[0069] In one specific embodiment, the first docking structure is positioned at the vibration center of the device under test. Therefore, for the base 100, the first connecting structure 111a must be located within the area covering the main shaft axis T1. In this case, the sensing chip 122 can be offset to the side of the first connecting structure 111a, and positioned as close as possible to it. This satisfies the aforementioned goal of ensuring the sensing chip 122 is sufficiently close to the main shaft axis T1.

[0070] Specifically, for example Figures 3 to 7As shown, the first connecting structure 111a is a threaded protrusion protruding from the far end of the bottom 111, and the first mating structure is a threaded recess recessed in the vibration device under test. When the threaded protrusion and the threaded recess are threaded together, a certain assembly gap will inevitably be formed between them, that is, a hole or cavity structure as described above will be formed. At this time, by fully offsetting the first spindle projection area H1 and the first connecting structure 111a, it can be effectively ensured that the part of the bottom 111 corresponding to the first spindle projection area H1 is solid and has a dense structure.

[0071] Furthermore, considering that assembly gaps can easily form at the assembly point between the sensing circuit board 121 and the bottom 111, a second connecting structure 111b can be provided on the bottom 111, and a corresponding second mating structure 121a can be provided on the sensing circuit board 121. By reasonably adjusting the specific structure and arrangement of the second connecting structure 111b and the second mating structure 121a, it can be ensured that when the second connecting structure 111b and the second mating structure 121a are connected and fixed, not only can the sensing circuit board 121 be fixed to the near end of the bottom 111, but also that the near-end surfaces of the sensing circuit board 121 and the bottom 111 are properly fitted and have virtually no assembly gaps.

[0072] There are various specific solutions for the second connecting structure 111b and the second mating structure 121a that meet the above requirements. These solutions can be, but are not limited to, combinations of screw-in protrusions and screw-in recesses, combinations of snap-fit ​​components and snap-fit ​​grooves (or snap-fit ​​holes), combinations of adhesive components, and combinations of adsorption components. For example... Figures 1 to 8 In the structure shown, the second connecting structure 111b and the second mating structure 121a can both be set as screw-in recesses, and then the two can be connected and fixed by means of external screw-in protrusions.

[0073] If the second connecting structure 111b and the second mating structure 121a are paired to form a connecting group, then this connecting group needs to be offset to the side of the spindle axis T1 and set as far away from the spindle axis T1 as possible. And / or, this connecting group needs to be offset to the side of the sensing chip 122 and set as far away from the sensing chip 122 as possible. In this way, when an assembly gap inevitably forms between the second connecting structure 111b and the second mating structure 121a, this assembly gap can be prevented from falling within the first spindle projection area H1.

[0074] The connection groups described above can be set to one or at least two. When set to at least two, each connection group must meet the offset requirements described above. Generally, under the premise of ensuring a stable connection and at least at the sensor chip 122 where a conductive medium forms a rigid contact, the fewer the number of connection groups, the better. The further the connection group is from the main spindle axis T1 and / or the sensor chip 122, the better.

[0075] Of course, taking the second docking structure 121a as an example, the second docking structure 121a is disposed at the sensing circuit board 121 and is generally a rigid structure. When a conductive medium is formed between the sensing chip 122 and the sensing circuit board 121, and the conductive medium rigidly abuts against both, then the second docking structure 121a can be biased to the side of the sensing chip 122 and set sufficiently far away from the sensing chip 122 as needed. However, when no conductive medium is formed between the sensing chip 122 and the sensing circuit board 121, or the conductive medium cannot rigidly abut against both, then the second docking structure 121a can be biased to the side of the sensing chip 122 and set sufficiently close to the sensing chip 122 as needed. In this case, the second docking structure 121a can constitute a part of the conductive medium rigidly abutting against the sensing chip 122.

[0076] Of course, to appropriately reduce the actual processing difficulty, in specific applications, if the sensing circuit board 121 has a second spindle projection area H2 in the spindle direction, then at least at the location corresponding to the second spindle projection area H2, the mounting surfaces between the bottom 111 and the sensing circuit board 121 are adapted and fitted. Furthermore, at least at the locations corresponding to the second spindle projection area H2 and the auxiliary spindle projection area J, the bottom 111 is set to be solid and structurally dense.

[0077] That is, the first spindle projection area H1 can be expanded to include the second spindle projection area H2. This allows the structural design and assembly scheme between the base 111 and the sensing circuit board 121 to be applicable to the assembly of different sensing chips 122 (e.g., when different sensing chips 122 have different assembly positions on the sensing circuit board 121), eliminating the need to match different processing and assembly schemes to the base 100 for each different sensing chip 122. Furthermore, it ensures that the portion of the base 111 corresponding to the auxiliary spindle projection area J is essentially included within the portion corresponding to the second spindle projection area H2, meaning that structural improvements to the base 100 aimed at optimizing spindle frequency response performance can be directly applied to achieving the goal of optimizing auxiliary spindle frequency response performance.

[0078] Based on one or more of the above embodiments, it can be understood that when, for example, the first connecting structure 111a and the first docking structure are matched, the vibration monitor can be directly assembled to the vibration device to be tested.

[0079] However, if the first connecting structure 111a and the first mating structure are not matched: for example, the first connecting structure 111a is a threaded protrusion and the first mating structure is a threaded recess, but their threaded diameters are different; or for example, the first connecting structure 111a is a threaded protrusion, but the first mating structure is a snap-fit ​​component, etc., then the vibration monitor and the vibration device under test can be indirectly assembled using the spindle fixture 400.

[0080] Therefore, the present invention also provides a spindle fixture 400. It should be noted that the spindle fixture 400 provided by the present invention can be applied to scenarios where the first connecting structure 111a and the first docking structure are not matched. Alternatively, it can be applied to scenarios where the first connecting structure 111a and the first docking structure are matched.

[0081] Specifically, such as Figures 9 to 13 As shown, one end of the spindle fixture 400 is provided with a first mating structure 410 that mates with the first connecting structure 111a. The first mating structure 410 and the first connecting structure 111a are matched. After the two are mated, the spindle fixture 400 fits snugly against the bottom 111.

[0082] The other end of the spindle fixture 400 is provided with a second mating structure 420 that mates with the first mating structure. The second mating structure 420 and the first mating structure are matched. After the two are mated, the spindle fixture 400 fits snugly and conforms to the vibration device to be tested.

[0083] It should be noted that the fitting and bonding scheme can refer to the fitting and bonding scheme of the bottom 111 and the sensor circuit board 121 mentioned above, so as to ensure that there is no assembly gap between the mounting surface of the spindle fixture 400 and the bottom 111. Of course, the same applies to the following text, and will not be elaborated on in detail.

[0084] Specifically, at least at the location corresponding to the first spindle projection area H1, the spindle fixture 400 is set to be solid and dense in structure.

[0085] It is understandable that, once assembled, the spindle fixture 400 and the bottom 111 together constitute the conductive medium. The bottom 111, as described above, is already solid and densely structured. Furthermore, the spindle fixture 400 and the bottom 111 are already fitted together. Therefore, by also making the corresponding parts of the spindle fixture 400 solid and densely structured, it can be effectively ensured that there are as few holes or cavities as possible along the conductive path for monitoring the spindle frequency response performance.

[0086] The spindle fixture 400 can be specifically configured with reference to the base 110 as described above.

[0087] For example, for the spindle fixture 400, the part corresponding to the first spindle projection area H1 can be enlarged to the part corresponding to the second spindle projection area H2, so that at least at the part corresponding to the second spindle projection area H2, the spindle fixture 400 is set to be solid and structurally dense.

[0088] Furthermore, at least at the location corresponding to the first spindle projection area H1, the mating surface between the spindle fixture 400 and the bottom 111, and / or the mating surface between the spindle fixture 400 and the vibration device under test, are set as smooth surfaces.

[0089] However, it needs to be emphasized that, such as Figure 13 As shown, at least at the fitting point between the two, the surface area of ​​the spindle fixture 400 is not less than the surface area of ​​the bottom 111. That is, the surface area of ​​the spindle fixture 400 should ideally completely cover the surface area of ​​the bottom 111. This allows for a wider vibration transmission path between the device under test and the base 100, facilitating the transmission of vibration waves along a straight path extending in the vibration transmission direction, up to the sensing chip 122.

[0090] Furthermore, when the first mating structure extends along the vibration transmission direction of the vibration center of the device under test, the central axis of the first connecting structure 111a, the central axis of the first mating structure 410, the central axis of the second mating structure 420, and the central axis of the first mating structure are as collinear or parallel as possible. That is, the assembly gaps between the first connecting structure 111a and the first mating structure 410, and between the second mating structure 420 and the first mating structure are concentrated along the main axis direction as much as possible. This reduces the space occupied by the inevitable assembly gaps in the transmission medium, thereby facilitating the transmission of vibration waves along a straight path to the sensing chip 122 as much as possible, as described above.

[0091] Furthermore, the spindle fixture 400 is made of the same or nearly the same material as the base 111. This minimizes the structural differences between the spindle fixture 400 and the base 100 when the spindle fixture 400 must be used to indirectly assemble the vibration device under test and the vibration monitor. This makes the spindle fixture 400, which is essentially a structural extension of the base 110, more conducive to the accurate transmission of vibration waves.

[0092] In the above embodiments, the base 110 and the spindle fixture 400 can both be made of SUS316, that is, austenitic stainless steel, which has sufficient structural strength and a dense structure, making it easy to process into a smooth surface.

[0093] Then as Figure 8 As shown, for monitoring the frequency response performance of the auxiliary shaft, the vibration monitor should be mounted along the direction of the auxiliary shaft to the vibration device under test.

[0094] This ensures that the direction of the auxiliary axis of the vibration monitor is basically consistent with the vibration transmission direction of the vibration center of the vibration device under test. At this time, the vibration wave will travel along the vibration transmission direction, passing through the part of the base 110 (i.e., the bottom 111 and / or the sensing circuit board 121) corresponding to the auxiliary axis projection area J, and finally to the sensing chip 122.

[0095] In the base 100, the seat 110 and the sensing circuit board 121 serve as the conductive medium. Similarly, the sensing circuit board 121 can generally be made entirely of solid material with a dense structure, thus requiring minimal modifications to its structure. Regarding the connection between the bottom 111 and the sensing circuit board 121, as described above, by adapting and fitting the bottom 111 and the sensing circuit board 121 together, it helps to minimize the formation of air gaps (i.e., the holes or cavities mentioned above) at the assembly point.

[0096] When the base 110 has a portion corresponding to the auxiliary axis projection area J, this portion also needs to be solid and structurally dense. This is to eliminate reflection and refraction of vibration waves when they pass through holes or cavities during transmission.

[0097] It should be noted that the auxiliary axes in the above and below embodiments include both the X-axis and the Y-axis. However, in the description of the scheme, the same auxiliary axis, namely the X-axis or the Y-axis, is generally referred to. There is virtually no situation where the X-axis and Y-axis are confused or mixed in description.

[0098] When the vibration monitor is assembled onto the vibration device to be tested along the auxiliary shaft direction, the vibration monitor will form an auxiliary shaft axis T2 that is directly opposite (i.e. passes through) the vibration center along the auxiliary shaft direction.

[0099] Specific combination Figure 8 It can be seen that when the specific location of the auxiliary axis on the base 100 is different, the corresponding projection area J of the auxiliary axis formed on the base 100 may be different.

[0100] For example, when the auxiliary shaft axis T2 is formed at the bottom 111, that is, when the vibration monitor and the vibration device under test are assembled in place, and the bottom 111 is directly facing the vibration center along the auxiliary shaft direction, the vibration wave emitted from the vibration center will be conducted from the bottom 111 through the sensing circuit board 121 to the sensing chip 122. At this time, the auxiliary shaft projection area J includes the third auxiliary shaft projection partition J3 formed by the bottom 111 along the auxiliary shaft direction. The bottom 111 is solid and structurally dense at least in the part corresponding to the third auxiliary shaft projection partition J3.

[0101] Alternatively, for example, the base 110 may also include a side portion 112 located in the direction of the auxiliary shaft, and the axis T2 of the auxiliary shaft is formed in the side portion 112. That is, when the vibration monitor and the vibration device under test are assembled in place, and the side portion 112 is directly facing the vibration center along the direction of the auxiliary shaft, the vibration wave emitted from the vibration center will be transmitted from the side portion 112 through the sensing circuit board 121 to the sensing chip 122.

[0102] At this point, in order to ensure that there is a conductive medium between the vibration center and the sensing chip 122: like Figure 8 As shown, in one specific embodiment, the side portion 112 forms an abutment portion at least at the location of the auxiliary shaft axis T2. The abutment portion is located at... Figure 8 In the G1 region shown, when the contact portion and the corresponding side surface of the sensor chip 122 are directly fitted and attached, the vibration wave emitted from the vibration center will be directly transmitted from the side portion 112 through the contact portion to the sensor chip 122. At this time, the auxiliary axis projection region J includes the first auxiliary axis projection partition J1 formed by the sensor chip 122 along the auxiliary axis direction. The bottom 111 (including the contact portion) is solid and structurally densely structured at least in the portion corresponding to the first auxiliary axis projection partition J1.

[0103] Or such as Figure 8 As shown, in another specific embodiment, the side portion 112 forms an abutment portion at least at the location of the auxiliary shaft axis T2. The abutment portion is located at... Figure 8 At the G2 region shown, when the contact portion and the corresponding side surface of the sensing circuit board 121 are directly fitted and attached, the vibration wave emitted from the vibration center will be conducted from the side portion 112 through the contact portion to the sensing circuit board 121, and finally reach the sensing chip 122. At this time, the auxiliary axis projection area J includes the second auxiliary axis projection partition J2 formed by the sensing circuit board 121 along the auxiliary axis direction. The bottom 111 (including the contact portion) is solid and structurally densely structured at least at the portion corresponding to the second auxiliary axis projection partition J2.

[0104] Similarly, the vibration monitor can be directly assembled to the vibration device under test along the auxiliary shaft direction. A matching detachable connection structure (similar to the first connection structure 111a and the first docking structure) can be pre-set between the two.

[0105] Alternatively, the vibration monitor can also be indirectly mounted to the vibrating device under test along the auxiliary shaft direction. In this case, for example... Figures 14 to 17 As shown, the present invention also provides an auxiliary shaft fixture 500. It should be noted that the auxiliary shaft fixture 500 provided by the present invention can be applied in scenarios where the vibration monitor and the vibration device under test can be directly assembled. Alternatively, it can also be applied in scenarios where the vibration monitor and the vibration device under test cannot be directly assembled.

[0106] Specifically, one end of the auxiliary shaft fixture 500 is fitted and aligned with the vibration device under test. The auxiliary shaft fixture 500 has a through-hole 530. The direction of the central axis of the through-hole 530 is perpendicular to the vibration transmission direction of the vibration center of the vibration device under test.

[0107] The base 110 is inserted and fixed at the mounting hole 530, and the auxiliary shaft direction of the vibration monitor is collinear or parallel to the vibration transmission direction. The base 110 is adapted to fit the auxiliary shaft fixture 500, and at least at the location corresponding to the auxiliary shaft projection area J, the auxiliary shaft fixture 500 is set to be solid and have a dense structure.

[0108] It is understood that once assembled, the auxiliary shaft of the vibration monitor is collinear or parallel to the vibration transmission direction, thus satisfying the purpose described above, whereby the auxiliary shaft axis T2 passes through the bottom 111 or the side 112. In this way, a transmission medium composed of the base 110 and the auxiliary shaft fixture 500 (and possibly also the sensing circuit board 121) can be formed between the vibration center and the sensing chip 122.

[0109] As mentioned above, the base 110 is solid and has a dense structure. The auxiliary shaft fixture 500 and the base 110 are fitted together. Therefore, by making the corresponding parts of the auxiliary shaft fixture 500 solid and dense as well, it can be effectively ensured that there are as few holes or cavities as possible along the transmission path for monitoring the frequency response performance of the auxiliary shaft.

[0110] Similarly, the auxiliary shaft fixture 500 can be specifically configured with reference to the base 110 as described above.

[0111] For example, regarding the auxiliary shaft fixture 500, the location corresponding to the auxiliary shaft projection area J can be specifically set at the location of the first auxiliary shaft projection partition J1, the second auxiliary shaft projection partition J2, or the third auxiliary shaft projection partition J3, depending on the actual situation. In the above locations, the auxiliary shaft fixture 500 is set to be solid and structurally dense.

[0112] Furthermore, at least at the location corresponding to the auxiliary shaft projection area J, the mating surfaces between the auxiliary shaft fixture 500 and the base 110 (bottom 111 or side 112), and / or the mating surfaces between the auxiliary shaft fixture 500 and the vibration device under test are set to smooth surfaces.

[0113] As described above, the auxiliary axes to be monitored include the X-axis and the Y-axis, meaning that monitoring needs to be switched between the X-axis and the Y-axis during the monitoring process. This necessitates that the vibration monitor and the auxiliary fixture, and / or the auxiliary fixture and the vibration device under test, and / or the auxiliary fixture itself have degrees of freedom for rotational adjustment around an axis extending in the direction of the main axis. This application protects all of the above situations together.

[0114] For example, the auxiliary shaft fixture 500 includes a mounting body 510 and an assembly body 520. The mounting body 510 is fitted to the vibration device under test and conforms to it. The assembly body 520 includes a first assembly part 521 and a second assembly part 522 that are connected and fixed to the mounting body 510. The second assembly part 522 is detachably connected to the first assembly part 521 and together they enclose and define an assembly hole 530 after connection.

[0115] The mounting body 510 can be adapted to the vibration device under test, for example, in terms of structure and installation method, to make the assembly between the mounting body 510 and the vibration device under test more tightly fitted. The mounting body 510 can be roughly disc-shaped to increase the contact area with the vibration device under test. Furthermore, the mounting body 510 can be roughly circular to make its shape more regular and easier to find the point or structural line for aligning with the vibration center of the vibration device under test.

[0116] The first assembly part 521 and the mounting body 510 can be integrally molded to ensure that the connection between the two is stable and their relative positions remain basically unchanged.

[0117] Alternatively, the first assembly part 521 and the mounting body 510 can be detachably or non-detachably connected after being separately formed, so that the molding method and the materials used to make the first assembly part 521 and the mounting body 510 are not restricted.

[0118] The mounting hole 530 is defined by the first mounting portion 521 and the second mounting portion 522. In one feasible embodiment, the mounting hole 530 is formed at the connection between the first mounting portion 521 and the second mounting portion 522. Based on this, the second mounting portion 522 has a secured state after being installed with the first mounting portion 521, and a released state in which it can at least partially move away from the first mounting portion 521. When the second mounting portion 522 is in the released state, the vibration monitor can be mounted onto the mounting hole 530 of the first mounting portion 521 along the auxiliary shaft direction. Then, by operating the second mounting portion 522 to the secured state, the vibration monitor can be secured between the first mounting portion 521 and the second mounting portion 522, facilitating subsequent vibration monitoring.

[0119] In a specific embodiment, the first assembly part 521 and the second assembly part 522 can be roughly shaped as a semi-circular structure, similar to a clamp. The fastening method between the first assembly part 521 and the second assembly part 522 is not limited, and can be, but is not limited to, combinations of threaded protrusions and threaded recesses, combinations of snap fasteners and slotted structures, etc., as described above.

[0120] It is understood that when the vibration monitor is assembled onto the auxiliary shaft fixture 500 along the auxiliary shaft direction, and the auxiliary shaft fixture 500 is also assembled into place at the vibration device under test, the auxiliary shaft axis T2 is formed. At this time, as mentioned above, it is necessary to position the sensor chip 122 as close as possible to the auxiliary shaft axis T2, or at least make it sufficiently close to the auxiliary shaft axis T2. For example, refer to... Figure 8 As shown, the auxiliary axis T2 can be formed within the first auxiliary axis projection partition J1, the second auxiliary axis projection partition J2, or the third auxiliary axis projection partition J3, etc.

[0121] Taking the case where the auxiliary shaft axis T2 is formed within the third auxiliary shaft projection partition J3 as an example, in a specific scheme, the first mounting part 521 protrudes from the end of the mounting body 510 opposite to the vibration device to be tested. The seat 110 passes through and is fixed at the mounting hole 530. The surface of the bottom 111 opposite to the sensing circuit board 121, the edge of the mounting hole 530 at the first mounting part 521, and the center of the mounting body 510 are sequentially aligned along the vibration transmission direction.

[0122] The mounting body 510 can be roughly disc-shaped. After the mounting body 510 is assembled onto the vibration device under test, the center of the mounting body 510 can be aligned with the vibration center. Then, one or at least two connection structures between the mounting body 510 and the vibration device under test are set as far apart as possible from the center / vibration center, for example, they are distributed around the outer periphery of the mounting body 510.

[0123] The first assembly part 521 is integrally or fixedly connected to the mounting body 510. Specifically, the first assembly part 521 is semi-circular. The edge of the opening of the assembly hole 530 is aligned as closely as possible with the center of the mounting body 510.

[0124] The second assembly part 522 can also be semi-circular. The specific installation position of the second assembly part 522 is not limited, as long as the vibration monitor can be fixed to the first assembly part 521 after switching to the fastening state.

[0125] When inserting the vibration monitor along the mounting hole 530, an assembly reference mark can be pre-set at the vibration monitor, and then the assembly reference mark can be aligned with the center of the mounting body 510 or the edge of the hole of the first mounting part 521.

[0126] The assembly reference marking is not limited; for example, it can correspond to a part within the first auxiliary axis projection partition J1, the second auxiliary axis projection partition J2, or the third auxiliary axis projection partition J3. Figure 17 In the structure shown, the assembly reference mark corresponds to a part within the third auxiliary axis projection partition J3, specifically at the far end surface of the bottom 111.

[0127] In practical applications, for example, the vibration monitor is first assembled in the auxiliary shaft fixture 500 with the auxiliary shaft as the X-axis, and the monitoring operation is performed. Then, the second assembly part 522 is adjusted to the released state, the vibration monitor is rotated to adjust its auxiliary shaft to the Y-axis, and then the vibration monitor is assembled in the auxiliary shaft fixture 500 again and the monitoring operation is performed.

[0128] Of course, in a feasible solution, the assembly body 520 can be rotatably mounted on the mounting body 510 around an axis extending along the main shaft direction, and after being rotated into place, the first assembly part 521 is connected, fixed and fitted to the mounting body 510.

[0129] Thus, after assembling the vibration monitor in the auxiliary shaft fixture 500 with the auxiliary shaft as the X-axis, tighten the first assembly part 521 and the mounting body 510, and perform the monitoring operation. There is no need to remove the vibration monitor or switch the second assembly part 522 to the released state. Simply rotate the assembly body 520 to align the auxiliary shaft with the Y-axis, then tighten the first assembly part 521 and the mounting body 510, and perform the monitoring operation. This allows for switching between different auxiliary shafts.

[0130] Furthermore, the auxiliary shaft fixture 500 is made of the same or nearly the same material as the base 110 (specifically corresponding to the bottom 111 and / or the side 112). This minimizes the structural differences between the auxiliary shaft fixture 500 and the base 110 when the auxiliary shaft fixture 500 must be used to indirectly assemble the vibration device under test and the vibration monitor. This makes the auxiliary shaft fixture 500 essentially a structural extension of the base 110, which is more conducive to the accurate transmission of vibration waves.

[0131] In the above embodiments, the base 110 and the auxiliary shaft fixture 500 can both be made of SUS316, that is, austenitic stainless steel, which has sufficient structural strength and a dense structure, making it easy to process into a smooth surface.

[0132] Of course, the present invention also provides a vibration testing system. The vibration system may selectively include one or more of the vibration device to be tested, the main shaft fixture 400, and the auxiliary shaft fixture 500 as described above.

[0133] For example, when the vibration device under test and the vibration monitor can be directly assembled, the vibration testing system may only include the vibration device under test.

[0134] For example, when the vibration test equipment and the vibration monitor cannot be directly assembled along the spindle direction, the vibration test system may include the vibration test equipment and the spindle fixture 400.

[0135] For example, when the vibration device under test and the vibration monitor cannot be directly assembled along the auxiliary shaft direction, the vibration testing system may include the vibration device under test and the auxiliary shaft fixture 500.

[0136] It should be noted that the detailed structure of the vibration test device, main spindle fixture 400, and / or auxiliary spindle fixture 500 selected in the vibration testing system can be referred to the embodiments of the vibration test device, main spindle fixture 400, and / or auxiliary spindle fixture 500 described above, and will not be repeated here. Since the vibration test system of this application uses the above-mentioned vibration test device, main spindle fixture 400, and / or auxiliary spindle fixture 500, the embodiments of the vibration test system of this application include all the technical solutions of all embodiments of the above-mentioned vibration test device, main spindle fixture 400, and / or auxiliary spindle fixture 500, and the achieved technical effects are also completely the same, and will not be repeated here. The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

[0137] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A base for use in a vibration monitor, characterized in that, The base includes: The base includes a bottom located along its main axis; and, A sensing assembly includes a sensing circuit board and a sensing chip, wherein the sensing circuit board is mounted at one end of the bottom and the sensing chip is mounted at the end of the sensing circuit board opposite to the bottom. The sensing chip has a first main axis projection area in the main axis direction, and the base has an auxiliary axis projection area in the auxiliary axis direction. At least at the location corresponding to the first spindle projection area, the mounting surfaces between the bottom and the sensing circuit board are adapted to fit together; At least at the locations corresponding to the first main axis projection area and the auxiliary axis projection area, the bottom is set to be solid and structurally dense.

2. The base as described in claim 1, characterized in that, The sensing circuit board has a second spindle projection area in the spindle direction; At least at the location corresponding to the projection area of ​​the second spindle, the mounting surfaces between the bottom and the sensing circuit board are adapted to fit together; At least at the locations corresponding to the second main axis projection area and the auxiliary axis projection area, the bottom is set to be solid and structurally dense.

3. The base as described in claim 1, characterized in that, At least at the location corresponding to the first spindle projection area, the mounting surface between the bottom and the sensing circuit board is a smooth surface.

4. The base as described in claim 1, characterized in that, The bottom has a main axis for aligning with the vibration center of the vibration device under test along the main axis direction. The first spindle projection area covers the spindle axis; or... The first spindle projection area is offset from the spindle axis and is located close to the spindle axis.

5. The base as described in claim 1, characterized in that, The bottom has a main axis for facing the vibration center of the vibration device under test along the main axis direction. The bottom is provided with a first connecting structure at the main axis, which is used to connect with a first docking structure provided by the vibration device under test that extends along the vibration transmission direction of its vibration center. The first spindle projection area is offset from the first connecting structure and is located close to the first connecting structure.

6. The base as described in claim 1, characterized in that, The bottom has a main axis for aligning with the vibration center of the vibration device under test along the main axis direction. The bottom is provided with a second connecting structure, and the sensing circuit board is provided with a second docking structure. The second connecting structure is connected to the second docking structure to fix the sensing circuit board to the end face of the bottom. The second connection structure is offset to the side of the spindle axis and disposed away from the spindle axis; and / or, The second docking structure is offset to the side of the sensor chip.

7. The base as described in claim 1, characterized in that, The base has an auxiliary axis for facing the vibration center of the vibration device under test along the auxiliary axis direction; the auxiliary axis projection area includes a first auxiliary axis projection partition of the sensing chip in the auxiliary axis direction; The auxiliary shaft axis is formed at the bottom, and the projection area of ​​the auxiliary shaft is staggered from the projection area of ​​the first auxiliary shaft; or... The base also includes a side portion located in the direction of the auxiliary shaft, the axis of the auxiliary shaft being formed at the side portion, wherein the side portion forms an abutment portion at least at the location of the axis of the auxiliary shaft, the abutment portion being adapted and fitted to the corresponding side surface of the sensing chip, or the abutment portion being adapted and fitted to the corresponding side surface of the sensing circuit board.

8. A vibration monitor, characterized in that, Includes the base as described in any one of claims 1 to 7.

9. A spindle fixture, characterized in that, The vibration monitor as described in claim 8 is fixed to the vibration device to be tested along the main axis, and the bottom end facing away from the sensing component is provided with a first connection structure. One end of the spindle fixture is provided with a first mating structure that mates with the first connecting structure, and after the two are mated, the spindle fixture fits snugly against the bottom. The other end of the spindle fixture is provided with a second mating structure for mating with the first mating structure of the vibration device to be tested, and after the two are mated, the spindle fixture and the vibration device to be tested are adapted to fit together. Specifically, at least at the location corresponding to the first spindle projection area, the spindle fixture is configured to be solid and have a dense structure.

10. The spindle fixture as described in claim 9, characterized in that, The sensing circuit board has a second spindle projection area in the spindle direction, and at least at the location corresponding to the second spindle projection area, the spindle fixture is set to be solid and dense.

11. The spindle fixture as described in claim 9, characterized in that, At least at the fitting point between the two, the surface area of ​​the spindle fixture is not less than the surface area of ​​the bottom; and / or, At least at the location corresponding to the first spindle projection area, the mating surface between the first mating end and the bottom is set as a smooth surface; and / or, The first docking structure extends along the vibration transmission direction of the vibration center of the vibration device under test, and the central axes of the first connecting structure, the first mating structure, the second mating structure and the first docking structure are collinear or parallel.

12. The spindle fixture as described in claim 9, characterized in that, The main spindle fixture is made of the same or nearly the same material as the bottom.

13. An auxiliary shaft fixture, characterized in that, Used to fix the vibration monitor as described in claim 8 to the vibration device to be tested along the auxiliary shaft direction; One end of the auxiliary shaft fixture is used to fit and conform to the vibration device under test. The auxiliary shaft fixture is provided with an assembly hole, and the direction of the central axis of the assembly hole is perpendicular to the vibration transmission direction of the vibration center of the vibration device under test. The base is inserted through and fixed at the mounting hole, and the auxiliary shaft direction of the vibration monitor is collinear or parallel to the vibration transmission direction. The base is adapted to fit the auxiliary shaft fixture, and at least at the location corresponding to the projection area of ​​the auxiliary shaft, the auxiliary shaft fixture is set to be solid and have a dense structure.

14. The auxiliary shaft fixture as described in claim 13, characterized in that, The auxiliary shaft fixture includes: The mounting body is used to connect to the vibration device under test and is adapted to fit the vibration device under test; and, The assembly body includes a first assembly part and a second assembly part that are connected and fixed to the mounting body. The second assembly part is detachably connected to the first assembly part and together encloses and defines the assembly hole after connection.

15. The auxiliary shaft fixture as described in claim 14, characterized in that, The first assembly part is integrally formed with the mounting body; or... The assembly body is rotatably mounted on the mounting body around an axis extending along the main shaft direction, and after being rotated into position, the first assembly part is connected, fixed, and fitted to the mounting body.

16. The auxiliary shaft fixture as described in claim 13, characterized in that, The bottom side surface along the auxiliary shaft direction is adapted to fit and conform to the auxiliary shaft fixture; or... The base also includes a side portion located in the direction of the auxiliary shaft, the side portion being adapted to fit and adhere to the auxiliary shaft fixture, the side portion forming at least a portion of an abutment at the fitting point, the abutment portion being adapted to fit and adhere to the corresponding side surface of the sensing chip, or the abutment portion being adapted to fit and adhere to the corresponding side surface of the sensing circuit board.

17. The auxiliary shaft fixture as described in claim 14, characterized in that, The first assembly part protrudes from one end of the mounting body that is opposite to the vibration device to be tested. The base is inserted through and fixed at the mounting hole, and the bottom surface facing away from the sensing circuit board, the edge of the mounting hole at the first mounting part, and the center of the mounting body are respectively aligned along the vibration transmission direction.

18. The auxiliary shaft fixture as described in claim 13, characterized in that, The auxiliary shaft fixture is made of the same or nearly the same material as the base.

19. A vibration testing system, characterized in that, Including the equipment whose vibration is being tested; The vibration device to be tested is configured in conjunction with the vibration monitor as described in claim 8; or... The vibration testing system further includes a main shaft fixture as described in any one of claims 9 to 12, and / or an auxiliary shaft fixture as described in any one of claims 13 to 18.

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