Parallel processing and relay exposure LDI laser direct imaging exposure method and system

Abstract

The invention discloses a parallel processing and relay exposure LDI laser direct imaging exposure method and system, and relates to the technical field of photoetching equipment and laser direct imaging exposure, and the method comprises the following steps: collecting layout graphic data, calibrating multiple exposure head coordinates, and generating exposure coordinate reference data according to a calibration result; performing adaptive slicing according to the exposure coordinate reference data, and generating a slice boundary relay overlapping band and a task queue; and distributing the slices to a plurality of exposure heads for parallel exposure according to the task queue, generating an exposure context snapshot in a relay overlapping band, and reading the context snapshot by a connecting rod head for continuous exposure. The method disclosed by the invention has better effects in the aspects of continuity of parallel exposure scheduling, controllability of cross-slice connection and coordinate consistency of multiple exposure heads.

Description

Technical Field

[0001] This invention relates to the field of lithography equipment and laser direct imaging exposure technology, specifically to an LDI laser direct imaging exposure method and system for parallel processing and relay exposure. Background Technology

[0002] Existing LDI equipment typically consists of a substrate carrier platform, an exposure head, an alignment and calibration mechanism, and a plate data processing unit. The positioning of the substrate after loading is completed by alignment marks and reference marks, and then the vector contour obtained by parsing the plate file is converted into an exposure trajectory and modulation sequence to complete the scanning exposure.

[0003] To increase production capacity, the industry has gradually introduced multi-exposure head parallel solutions, and combined them with platform dual-axis motion, partition scanning and local alignment, etc., in an attempt to shorten the overall exposure cycle while ensuring graphic consistency.

[0004] Existing technologies still present many engineering challenges in coordinating "multi-exposure head parallelism" and "cross-zone continuous exposure"; First, there are inherent setup and adjustment deviations and thermal drift among multiple exposure heads, and the mapping relationship between the local position data of the exposure head and the platform motion coordinates is complex. If only a single static calibration is relied upon, it is easy to cause the exposure start and end positions of different exposure heads in the same area of ​​the printing plate to be inconsistent.

[0005] Secondly, existing zoning strategies mostly use fixed grids or simple equal-area slices, which make it difficult to simultaneously take into account no-exposure boundaries, alignment, reference mark reservation, platform movement direction constraints, and local graphic density differences, resulting in unstable slice boundary selection and inconsistent rules for connecting adjacent slices.

[0006] Third, at the junction of adjacent slices, existing methods often rely on simple overlap + mechanical waiting or a serial connection method of stop-start, lacking a unified data structure that can clearly define the handover position, starting range and exposure progress. This makes it difficult to guarantee that the handover head can continue execution from a determined position within the overlapping zone based on the same context once a handover requirement occurs during parallel exposure, thus making it difficult to form a stable task queue scheduling and relay exposure process. Summary of the Invention

[0007] In view of the above-mentioned problems, the present invention is proposed.

[0008] Therefore, the technical problem solved by this invention is that existing multi-exposure head parallel LDI laser direct imaging exposure methods have problems such as difficulty in unifying coordinate mapping and assembly deviation between exposure heads, difficulty in balancing exposure-free boundaries and mark reservations in fixed slicing strategies leading to unstable slicing boundaries, lack of exposure context records at slicing boundaries that can be used for handover and continuation, resulting in unclear parallel exposure and relay connection processes, and how to achieve adaptive task slicing under a unified coordinate reference, construct relay overlap zones at slicing boundaries and generate handover point sets, and drive the handover head to complete continuous exposure through task queues and exposure context snapshots.

[0009] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a parallel processing and relay exposure method for LDI laser direct imaging exposure, including acquiring plate graphic data and calibrating the coordinates of multiple exposure heads, and generating exposure coordinate reference data based on the calibration results.

[0010] Adaptive slicing is performed based on exposure coordinate reference data, and a relay overlap zone and task queue are generated for the slice boundaries.

[0011] Slices are assigned to multiple exposure heads for parallel exposure according to the task queue. An exposure context snapshot is generated in the relay overlap zone, and the relay head reads the context snapshot to continue the exposure.

[0012] Adaptive slicing involves calculating slice boundary constraints and slice scale parameters using exposure coordinate reference data, dividing the area to be exposed into segments based on the slice boundary constraints and slice scale parameters, and outputting multiple slices.

[0013] The slice boundary relay overlap zone includes defining a region with defined width and direction constraints at the boundary between two adjacent slices, which is a processable area belonging to the preceding and following slices. The location where the crossover occurs and the starting range of the continuation are defined based on the processable area.

[0014] As a preferred embodiment of the LDI laser direct imaging exposure method with parallel processing and relay exposure described in this invention, the acquisition of the plate graphic data includes importing and parsing the plate file corresponding to the substrate to be exposed from the data interface to obtain the vector contour set of the exposure layer.

[0015] The alignment marks, reference marks, and no-exposure boundaries in the layout file are extracted as boundary data and associated with the vector contour set under the same coordinate unit.

[0016] Perform coordinate origin unification, coordinate axis direction unification, and resolution parameter binding on the vector contour set.

[0017] The calibration of the coordinates of the multi-exposure head includes establishing a coordinate system on the substrate carrier platform and placing a calibration substrate on the substrate carrier platform.

[0018] The coordinate system of the substrate carrier platform includes taking the zero-return position of the substrate carrier platform as the origin and taking the two motion axis directions of the substrate carrier platform as the coordinate axis directions.

[0019] The calibration substrate includes three sets of calibration marks.

[0020] The exposure head is controlled to scan and position the calibration marks sequentially, and the set of mark coordinates is output.

[0021] The set of nominal coordinates of the three sets of calibration marks on the calibration substrate in the coordinate system of the substrate bearing platform is taken as the set of target coordinates of the marking.

[0022] The calibration parameters of the exposure head are obtained by registering the set of marker coordinates with the set of marker target coordinates in the coordinate system of the substrate carrier platform.

[0023] As a preferred embodiment of the LDI laser direct imaging exposure method with parallel processing and relay exposure described in this invention, the generation of exposure coordinate reference data includes establishing a set of coordinate mapping parameters from the local position data of the exposure head to the coordinate system of the substrate support platform, based on the calibration parameters of the exposure head.

[0024] After the substrate to be exposed is loaded onto the substrate carrier platform, the exposure head is controlled to scan and position the actual graphic positions corresponding to the alignment marks and reference marks extracted from the plate file.

[0025] Output the set of measurement coordinates of alignment marks and reference marks in the coordinate system of the substrate carrier platform. Then, perform registration and solution with the coordinate data of the corresponding marks in the layout file to obtain the set of layout registration parameters from the layout file coordinate data to the coordinate system of the substrate carrier platform.

[0026] The set of page registration parameters includes translation parameters, rotation parameters, and scale parameters.

[0027] The set of coordinate mapping parameters, the set of page registration parameters, the set of vector contours of the exposure layer, and the boundary data are used as the exposure coordinate reference data.

[0028] As a preferred embodiment of the LDI laser direct imaging exposure method with parallel processing and relay exposure described in this invention, the calculation of slice boundary constraints and slice scale parameters includes converting the vector contour set and boundary data of the exposure layer into the coordinate system of the substrate carrier platform through the coordinate mapping parameter set and the plate registration parameter set in the exposure coordinate reference data.

[0029] Grid statistical cells are established within the area to be exposed. Local statistics are performed on the set of vector contours covered by each grid statistical cell to obtain the graphic density parameter and geometric complexity parameter.

[0030] The slice scale parameters are calculated based on the graphic density parameters and geometric complexity parameters. The prohibited crossing area is generated based on the no-exposure boundary in the boundary data. The reserved area is generated in the coordinate system of the substrate support platform based on the measurement coordinate set of the alignment mark and the reference mark.

[0031] The prohibited crossing area and the reserved area are combined with the two motion axes of the substrate support platform to generate a set of allowed extension directions, which serve as boundary constraints.

[0032] The process of partitioning the area to be exposed includes using the slice scale parameter as the partitioning granularity input and the slice boundary constraint as the boundary generation constraint input. Multiple slice boundaries are generated and multiple slices are output in the coordinate system of the substrate support platform. Each slice is bound with a slice identifier and a subset index of the vector contour covered by the slice.

[0033] For each slice boundary, an intersection judgment is performed with the prohibited crossing area and the reserved area. When an intersection occurs, the slice boundary is iteratively corrected and the vector contour subset index is updated under the constraint of the allowed extension direction set.

[0034] The resolution parameter is bound and converted into a scan step size parameter. The multiple slices after iterative correction are generated into task unit records according to the slice identifier and written into the task queue.

[0035] The task unit record includes slice identifier, slice boundary, index of the vector contour subset covered by the slice, and scan step parameters.

[0036] As a preferred embodiment of the LDI laser direct imaging exposure method with parallel processing and relay exposure described in this invention, the delineation of the region includes extracting the common slice boundary of two adjacent slices and generating a set of boundary line segments in the coordinate system of the substrate support platform.

[0037] The overlap band width and orientation constraint parameters are determined based on the slice scale parameters and slice boundary constraints.

[0038] By expanding the boundary segment set on both sides along the normal direction using the overlap band width parameter, the relay overlap band of the slice boundary is obtained.

[0039] The allowed scan entry direction and allowed crossover direction are defined within the slice boundary relay overlap zone by directional constraint parameters.

[0040] Register the overlapping zone of the slice boundary as an overlapping zone identifier and associate it with the previous slice identifier and the subsequent slice identifier respectively.

[0041] The limited starting range includes generating a set of handover points based on the task unit records in the task queue within the overlapping zone of the slice boundary, establishing a mapping relationship between the set of handover points and the set of boundary line segments, and setting trigger constraints.

[0042] The triggering constraints include freezing the crossing boundary at the corresponding position in the crossing point set when the crossing is triggered.

[0043] Write the crossover point index corresponding to the frozen position into the task queue.

[0044] As a preferred embodiment of the LDI laser direct imaging exposure method with parallel processing and relay exposure described in this invention, the parallel exposure of multiple exposure heads includes: reading the slice identifier, slice boundary, vector contour subset index covered by the slice, and scanning step parameters, and combining the coordinate mapping parameter set and the layout registration parameter set to convert the slice boundary and the vector contour subset index covered by the slice to the local position data aperture of each exposure head, thereby generating exposure execution data corresponding to each exposure head.

[0045] For each task unit, an exposure head identifier is recorded in the task queue, and during parallel exposure, an overlap band identifier is used as a condition for mutual exclusion.

[0046] The assigned exposure head is controlled to perform exposure on the vector contour subset index covered by the slice within the slice boundary according to the scan step parameter.

[0047] When the exposure process enters the adjacent overlapping zone, the slice boundary relay overlapping zone is identified, and the index of the currently freezeable overlapping point is determined based on the set of overlapping points.

[0048] When the handover is triggered, the handover boundary is frozen at the handover point index position, an exposure context snapshot is generated and written to the task queue.

[0049] The exposure context snapshot includes slice identifier, overlap band identifier, intersection point index, coordinate mapping parameter set, layout registration parameter set, and exposure progress field.

[0050] As a preferred embodiment of the parallel processing and relay exposure method for LDI laser direct imaging exposure described in this invention, the step of reading the context snapshot for relay exposure includes controlling the relay head to read the exposure context snapshot from the task queue and parsing it to obtain the slice identifier, overlap band identifier, relay point index, and exposure progress field.

[0051] Based on the exposure context snapshot, load the coordinate mapping parameter set and the layout registration parameter set. The receiver retrieves the task unit record corresponding to the slice identifier in the task queue and reads the slice boundary, the vector contour subset index covered by the slice, and the scan step parameter from the task unit record.

[0052] Based on the coordinate mapping parameter set, the index of the slice boundary and the vector contour subset covered by the slice is converted to the local position data caliber of the connecting head.

[0053] The translation, rotation, and scale parameters of the conversion results are corrected based on the set of page registration parameters.

[0054] The relay head determines the processable range of the overlapping zone at the slice boundary based on the overlapping zone marker, and determines the starting position of the subsequent exposure within the processable range based on the crossover point index.

[0055] Determine the starting scan line number or starting path segment number based on the exposure progress field.

[0056] Starting from the initial position, the relay head performs continuous exposure by scanning the incomplete portion corresponding to the vector contour subset index covered by the slice according to the scanning step parameters.

[0057] Another objective of this invention is to provide a parallel processing and relay exposure LDI laser direct imaging exposure system. This system can construct exposure coordinate reference data and perform adaptive slicing based on this data, generate a relay overlap zone and task queue for slice boundaries, and generate an exposure context snapshot within the relay overlap zone to drive the relay head to continue exposure. This solves the problems of unclear slice boundary connection rules, lack of unified data constraints on the handover position and the start range of the relay in current multi-exposure head parallel LDI exposure, and unclear input-output relationship between parallel scheduling and relay exposure.

[0058] As a preferred embodiment of the LDI laser direct imaging exposure system with parallel processing and relay exposure described in this invention, it includes: a layout graphic acquisition and multi-exposure head coordinate calibration module, an adaptive slicing and relay overlap zone task queue generation module driven by exposure coordinate reference, and a multi-exposure head parallel exposure and exposure context snapshot relay module for task queue scheduling.

[0059] The layout graphic acquisition and multi-exposure head coordinate calibration module is used to acquire layout graphic data and calibrate the coordinates of the multi-exposure heads, and generate exposure coordinate reference data based on the calibration results.

[0060] The exposure coordinate reference-driven adaptive slicing and relay overlap zone task queue generation module is used to perform adaptive slicing based on the exposure coordinate reference data and generate slice boundary relay overlap zones and task queues.

[0061] The multi-exposure head parallel exposure and exposure context snapshot relay module of the task queue scheduling is used to allocate slices to multi-exposure head parallel exposure according to the task queue, generate exposure context snapshots in the relay overlap zone, and the relay head reads the context snapshot to continue the exposure.

[0062] Another object of the present invention is to provide an LDI laser direct imaging exposure device for parallel processing and relay exposure, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the LDI laser direct imaging exposure method for parallel processing and relay exposure.

[0063] Another object of the present invention is to provide a parallel processing and relay exposure LDI laser direct imaging exposure storage medium, on which a computer program is stored, wherein the computer program, when executed by a processor, implements the steps of the parallel processing and relay exposure LDI laser direct imaging exposure method.

[0064] The beneficial effects of this invention are as follows: The parallel processing and relay exposure LDI laser direct imaging exposure method provided by this invention acquires plate graphic data and generates exposure coordinate reference data by calibrating the coordinates of multiple exposure heads. This achieves a unified mapping between plate file coordinate data, substrate carrier platform coordinate system, and local position data of the exposure heads, enabling multiple exposure heads to perform exposure trajectory conversion under the same coordinate aperture. This data is then used for subsequent slicing and scheduling input, ultimately improving the consistency of exposure start and end positions and reducing the impact of inter-head assembly and adjustment deviations. By calculating slicing scale parameters and slicing boundary constraints based on the exposure coordinate reference data and generating a task queue, adaptive partitioning of the area to be exposed and structured organization of task unit records are achieved, enabling slicing boundaries to be... This invention is simultaneously constrained by no-exposure boundaries, reserved areas, and allowed extension directions. Then, slice identifiers, slice boundaries, vector contour subset indices, and scan step parameters are written into the task queue as input for parallel exposure, ultimately improving the executability of the partitioning strategy and the traceability of task scheduling. By generating slice boundary relay overlap zones at adjacent slice boundaries, creating a set of intersection points within the overlap zone, freezing the intersection point indices, and generating an exposure context snapshot, the computable limitation of the intersection location and the starting range of subsequent exposures is achieved. This allows the relay head to read the slice identifier, overlap zone identifier, intersection point index, and exposure progress field based on the exposure context snapshot and continue exposure according to the task queue, thus supporting parallel and continuous relay exposure for multiple exposure heads. This invention achieves better results in terms of the continuity of parallel exposure scheduling, the controllability of cross-slice connections, and the consistency of multi-exposure head coordinates. Attached Figure Description

[0065] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0066] Figure 1This is an overall flowchart of an LDI laser direct imaging exposure method with parallel processing and relay exposure provided in Embodiment 1 of the present invention. Detailed Implementation

[0067] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0068] Example 1, referring to Figure 1 As an embodiment of the present invention, a method for parallel processing and relay exposure of LDI laser direct imaging exposure is provided, comprising: S1: Collect layout graphic data and calibrate the coordinates of the multi-exposure head, and generate exposure coordinate reference data based on the calibration results.

[0069] Import the layout file corresponding to the substrate to be exposed from the data interface and parse it to obtain the vector contour set of the exposure layer.

[0070] The alignment marks, reference marks, and no-exposure boundaries in the layout file are extracted as boundary data and associated with the vector contour set under the same coordinate unit.

[0071] Perform coordinate origin unification, coordinate axis direction unification, and resolution parameter binding on the vector contour set.

[0072] The calibration of the coordinates of the multi-exposure head includes establishing a coordinate system on the substrate carrier platform and placing a calibration substrate on the substrate carrier platform.

[0073] The coordinate system of the substrate carrier platform includes taking the zero-return position of the substrate carrier platform as the origin and taking the two motion axis directions of the substrate carrier platform as the coordinate axis directions.

[0074] The calibration substrate includes three sets of calibration marks.

[0075] The exposure head is controlled to scan and position the calibration marks sequentially, and outputs a set of mark coordinates. The nominal coordinates of the three sets of calibration marks on the calibration substrate in the coordinate system of the substrate support platform are used as the target coordinates of the marks.

[0076] The calibration parameters of the exposure head are obtained by registering the set of marker coordinates with the set of marker target coordinates in the coordinate system of the substrate carrier platform.

[0077] Furthermore, based on the calibration parameters of the exposure head, a set of coordinate mapping parameters is established from the local position data of the exposure head to the coordinate system of the substrate support platform.

[0078] A preferred approach for calculating the set of coordinate mapping parameters is as follows:

[0079] in, Indicates exposure head Local location data, This represents the coordinate vector in the coordinate system of the substrate support platform. Indicates exposure head The linear mapping parameters, Indicates exposure head The bias mapping parameters, This indicates the exposure head identifier.

[0080] After the substrate to be exposed is loaded onto the substrate carrier platform, the exposure head is controlled to scan and position the actual graphic positions corresponding to the alignment marks and reference marks extracted from the plate file.

[0081] Output the set of measurement coordinates of alignment marks and reference marks in the coordinate system of the substrate support platform.

[0082] The measurement coordinate set is registered with the corresponding marked coordinate data in the layout file to obtain the layout registration parameter set from the layout file coordinate data to the substrate carrier platform coordinate system.

[0083] One preferred scheme for the set of page registration parameters is:

[0084] in, This represents the point coordinate vector in the coordinate data of the layout file. Indicates the scale parameter. Indicates rotation parameters, Indicates the translation parameter. This represents the rotation matrix operator.

[0085] The set of page registration parameters includes translation parameters, rotation parameters, and scale parameters.

[0086] The set of coordinate mapping parameters, the set of page registration parameters, the set of vector contours of the exposure layer, and the boundary data are used as the exposure coordinate reference data.

[0087] S2: Perform adaptive slicing based on exposure coordinate reference data, and generate slice boundary relay overlap bands and task queues.

[0088] The slice boundary constraints and slice scale parameters are calculated using exposure coordinate reference data. Based on the slice boundary constraints and slice scale parameters, the area to be exposed is divided into sections, and multiple slices are output.

[0089] At the boundary between two adjacent slices, a processable region with defined width and direction constraints is delineated, belonging to the preceding and following slices. The location of the crossover and the starting range of the continuation are defined based on the processable region.

[0090] Furthermore, by using the set of coordinate mapping parameters and the set of registration parameters in the exposure coordinate reference data, the vector contour set and boundary data of the exposure layer are converted into the coordinate system of the substrate carrier platform.

[0091] Grid statistical cells are established within the area to be exposed. Local statistics are performed on the set of vector contours covered by each grid statistical cell to obtain the graphic density parameter and geometric complexity parameter.

[0092] Graphic density parameters include the number of vector segments and the total length of the vector segments.

[0093] Geometric complexity parameters include the number of inflection points and the number of times the minimum feature size occurs.

[0094] The slice scale parameter is calculated based on the graphic density parameter and the geometric complexity parameter.

[0095] A prohibited crossing area is generated based on the no-exposure boundary in the boundary data, and a reserved area is generated in the coordinate system of the substrate support platform based on the measurement coordinate set of the alignment mark and the reference mark.

[0096] The prohibited crossing area and the reserved area are combined with the two motion axes of the substrate support platform to generate a set of allowed extension directions, which serve as boundary constraints.

[0097] The process of partitioning the area to be exposed includes using the slice scale parameter as the partitioning granularity input and the slice boundary constraint as the boundary generation constraint input. Multiple slice boundaries are generated and multiple slices are output in the coordinate system of the substrate support platform. Each slice is bound with a slice identifier and a subset index of the vector contour covered by the slice.

[0098] Perform an intersection check on each slice boundary with the prohibited crossing area and the reserved area.

[0099] When an intersection occurs, the slice boundary is iteratively corrected and the vector contour subset index is updated within the allowed set of extension directions.

[0100] The resolution parameter is bound and converted into a scan step size parameter. The multiple slices after iterative correction are generated into task unit records according to the slice identifier and written into the task queue.

[0101] A preferred approach to converting resolution parameters into scan step size parameters is as follows:

[0102] in, This indicates the scan sampling density obtained by binding the resolution parameter. This represents the scan step distance parameter.

[0103] The task unit record includes slice identifier, slice boundary, index of the vector contour subset covered by the slice, and scan step parameters.

[0104] Furthermore, the common slice boundary of two adjacent slices is extracted and a set of boundary line segments is generated in the coordinate system of the substrate bearing platform.

[0105] Based on the slice scale parameters and slice boundary constraints, the overlap band width parameters and direction constraint parameters are determined. The overlap band width parameters are then used to expand the boundary line segment set on both sides along the normal direction to obtain the slice boundary relay overlap band.

[0106] The allowed scan entry direction and allowed crossover direction are defined within the slice boundary relay overlap zone by directional constraint parameters.

[0107] Register the overlapping zone of the slice boundary as an overlapping zone identifier and associate it with the previous slice identifier and the subsequent slice identifier respectively.

[0108] The defined starting range includes generating a set of handover points within the overlapping zone of the slice boundary based on the task unit records in the task queue.

[0109] A preferred method for generating the set of crossing points is:

[0110] in, Denotes the set of crossing points. This indicates the total number of baton passing points. Indicates the crossover point index. Indicates the boundary of a common slice. Slice With slices The corresponding slice boundary relay overlap zone, Slice identifiers representing adjacent slices, Indicates and Slice identifiers for different adjacent slices.

[0111] Establish a mapping relationship between the set of intersection points and the set of boundary segments, and set trigger constraints.

[0112] The triggering constraints include freezing the crossing boundary at the corresponding position in the crossing point set when the crossing is triggered.

[0113] Write the crossover point index corresponding to the frozen position into the task queue.

[0114] S3: Assign slices to multiple exposure heads for parallel exposure according to the task queue, generate an exposure context snapshot in the relay overlap zone, and the relay head reads the context snapshot to continue the exposure.

[0115] By reading the slice identifier, slice boundary, vector contour subset index covered by the slice, and scan step parameters, and combining the coordinate mapping parameter set and the layout registration parameter set, the slice boundary and vector contour subset index covered by the slice are converted to the local position data aperture of each exposure head, generating exposure execution data corresponding to each exposure head.

[0116] For each task unit, an exposure head identifier is recorded in the task queue, and during parallel exposure, an overlap band identifier is used as a condition for mutual exclusion.

[0117] The assigned exposure head is controlled to perform exposure on the vector contour subset index covered by the slice within the slice boundary according to the scan step parameter.

[0118] When the exposure process enters the adjacent overlapping zone, the slice boundary relay overlapping zone is identified, and the index of the currently freezeable overlapping point is determined based on the set of overlapping points.

[0119] When the handover is triggered, the handover boundary is frozen at the handover point index position, an exposure context snapshot is generated and written to the task queue.

[0120] The exposure context snapshot includes slice identifier, overlap band identifier, intersection point index, coordinate mapping parameter set, layout registration parameter set, and exposure progress field.

[0121] A preferred approach to exposing contextual snapshots is:

[0122] in, Indicates the exposure context snapshot, Indicates slice identifier, Indicates overlapping band markings. This field represents the exposure progress. Represents the set of coordinate mapping parameters. This represents the set of page registration parameters.

[0123] Furthermore, the control relay head reads the exposure context snapshot from the task queue and parses it to obtain the slice identifier, overlap band identifier, handover point index, and exposure progress field.

[0124] Load the set of coordinate mapping parameters and the set of page registration parameters based on the exposure context snapshot.

[0125] The relay head retrieves the task unit record corresponding to the slice identifier in the task queue, and reads the slice boundary, the vector contour subset index covered by the slice, and the scan step parameter from the task unit record.

[0126] Based on the coordinate mapping parameter set, the index of the slice boundary and the vector contour subset covered by the slice is converted to the local position data caliber of the connecting head.

[0127] The translation, rotation, and scale parameters of the conversion results are corrected based on the set of page registration parameters.

[0128] The relay head determines the processable range of the overlapping zone at the slice boundary based on the overlapping zone marker, and determines the starting position of the subsequent exposure within the processable range based on the crossover point index.

[0129] Determine the starting scan line number or starting path segment number based on the exposure progress field.

[0130] Starting from the initial position, the relay head performs continuous exposure by scanning the incomplete portion corresponding to the vector contour subset index covered by the slice according to the scanning step parameters.

[0131] Example 2 is an embodiment of the present invention, which provides a parallel processing and relay exposure method for LDI laser direct imaging exposure. In order to verify the beneficial effects of the present invention, scientific demonstration is carried out through economic benefit calculation and simulation experiments.

[0132] First, a dual-exposure head LDI lithography equipment was selected as the verification platform. The equipment includes a substrate support platform, two exposure heads, and a control unit for data import and task scheduling.

[0133] Three typical substrate types were selected for the test: HDI-200×250, HDI-300×400, and ABF-510×510. The number of vector segments, the number of inflection points, and the frequency of occurrence of the minimum feature size increased in each type, and were used to cover exposure loads ranging from medium to high complexity.

[0134] First, the layout file corresponding to the substrate to be exposed is imported from the data interface and parsed to obtain the vector contour set of the exposure layer. At the same time, the alignment mark, reference mark and exposure-free boundary are extracted to form boundary data, and an index association is established with the vector contour set under the same coordinate unit.

[0135] Subsequently, the coordinate origin, coordinate axis direction, and resolution parameter binding were performed on the vector contour set. Specifically, HDI samples were bound to 5.0µm / pixel, and ABF samples were bound to 4.0µm / pixel.

[0136] To perform multi-exposure head coordinate calibration, a substrate carrier platform coordinate system is established on the substrate carrier platform. The zero position of the platform is taken as the origin of the coordinate system, and the two motion axes are taken as the coordinate axes. A calibration substrate is placed on the platform.

[0137] Three sets of calibration marks are set on the calibration substrate, and the set of nominal coordinates of the three sets of calibration marks in the coordinate system of the substrate bearing platform is used as the set of target coordinates for the marking.

[0138] Two exposure heads are controlled to sequentially scan and position the calibration marks, outputting a set of mark coordinates. These coordinates are then registered with the target coordinates to obtain the calibration parameters for each exposure head. This establishes a set of coordinate mapping parameters from the local position data of the exposure heads to the coordinate system of the substrate carrier platform. Subsequently, the substrate to be exposed is loaded, and the exposure heads are controlled to scan and position the actual graphic positions corresponding to the alignment marks and reference marks in the layout file. This yields a set of measurement coordinates, which are then registered with the coordinate data in the layout file to obtain a set of layout registration parameters. Finally, the coordinate mapping parameter set, the layout registration parameter set, the vector contour set, and the boundary data are combined to form the exposure coordinate reference data.

[0139] Based on the exposure coordinate reference data, the vector contour set and boundary data are converted to the coordinate system of the substrate carrier platform. Grid statistical units are established in the area to be exposed. Local statistics are performed on each grid unit to obtain the pattern density parameter and geometric complexity parameter, and the slice scale parameter is calculated accordingly.

[0140] Simultaneously, a prohibited crossing area is generated from the no-exposure boundary, a reserved area is generated from the coordinates measured by the reference mark, and a set of allowable extension directions is formed by combining the two motion axes of the platform, thus constituting the slice boundary constraint.

[0141] Subsequently, multiple slice boundaries are generated under boundary constraints, and multiple slices are output. Each slice is bound with a slice identifier and a vector contour subset index.

[0142] If the slice boundary intersects with a prohibited or reserved area, boundary iteration correction is triggered and the vector contour subset index is updated synchronously.

[0143] The resolution parameter is converted into a scan step distance parameter, and the slice identifier, slice boundary, vector contour subset index, and scan step distance parameter are written into the task queue to form a task unit record.

[0144] For adjacent slices, extract the common slice boundary to generate a set of boundary line segments. Based on the slice scale parameters and slice boundary constraints, determine the overlap band width parameters and direction constraint parameters. Expand outward along both sides of the normal direction to obtain the slice boundary relay overlap band, and register the overlap band identifier to associate it with the identifier of the previous slice and the identifier of the next slice.

[0145] Within the overlapping zone, a set of intersection points is generated based on the task queue task unit records and scanning step parameters. The set of intersection points is mapped to the boundary line segment, and the trigger constraint is set so that when the intersection is triggered, the intersection boundary is frozen at the corresponding position of the set of intersection points.

[0146] The controller reads the task queue and assigns slices to two exposure heads for parallel execution: based on the coordinate mapping parameter set and the layout registration parameter set, the slice boundary and vector contour subset index are converted to the local position data aperture of each exposure head to generate exposure execution data, and the exposure head identifier is written into the task queue.

[0147] During parallel exposure, the overlap zone identifier is used as a mutual exclusion condition. When the exposure execution enters the overlap zone, the index of the overlap zone that can be frozen is determined based on the set of overlap points.

[0148] When a crossover is triggered, the crossover boundary is frozen and an exposure context snapshot is generated and written to the task queue. The context snapshot contains the slice identifier, overlap zone identifier, crossover point index, coordinate mapping parameter set, layout registration parameter set, and exposure progress field.

[0149] The relay head then reads the exposure context snapshot from the task queue, loads the corresponding parameters, determines the start position of the subsequent exposure within the overlap band according to the handover point index, determines the starting scan line number or the starting path segment number based on the exposure progress field, and continues to scan and expose the incomplete vector contour subset index.

[0150] The comparison object uses a fixed slice conventional process: the number of slices is small and the boundaries are not iteratively corrected. The slice intersections use fixed small overlaps and the inter-segment connection is completed in a stop-and-go manner. No exposure context snapshots and intersection point sets are generated.

[0151] After exposure, AOI was used to count the number of stitching-related defects, and verification line segments were selected at the stitching boundary to measure alignment error and linewidth fluctuation. At the same time, the total exposure time, number of stop events and number of re-exposures were recorded. The experimental data are shown in Table 1.

[0152]

[0153] The table reveals three chains of differences that correspond one-to-one with the invention steps: the stability of the coordinate reference data, the feasibility of slicing and boundary constraints, and the continuity of relay exposure within the overlapping zone.

[0154] First, during the coordinate unification stage, the exposure head calibration residual RMS and the plate registration residual RMS both showed a systematic decrease on the three types of substrates: taking HDI-200×250 as an example, the exposure head calibration residual decreased from 4.0µm to 2.3µm, and the plate registration residual decreased from 5.5µm to 3.1µm.

[0155] On ABF-510×510, the corresponding values ​​decreased from 4.8µm to 2.7µm and from 6.4µm to 3.6µm.

[0156] It should be noted that this is not simply about pursuing smaller values, but rather about ensuring that the chain of nominal coordinate set → measured coordinate set → registration solution → formation of coordinate mapping parameter set and plate registration parameter set → summarization into exposure coordinate reference data can be repeatedly executed and form a referenceable data object. Subsequent slicing and exposure execution data all use this object as input, thus making it easier to maintain the same coordinate caliber during cross-exposure head conversion and plate alignment.

[0157] Secondly, in the adaptive slicing stage, the number of slices and the boundary handling method reflect the fact that process constraints are explicitly encoded into the process.

[0158] The comparison object uses a fixed slice, and the number of slice boundary iteration corrections is 0, but the corresponding slice boundary no-exposure occurs 2, 3, and 5 times respectively; The number of iterations for correcting the slice boundaries in the present invention is 6, 7, and 9, respectively, and the number of manual processing operations is 0.

[0159] This data shows that boundary constraints are used as input for judgment and correction during the slice generation stage, thereby shifting conflict handling from a manual process to a repeatable iterative process.

[0160] Meanwhile, the overlap width parameter in the present invention is significantly higher than that of the comparative object. Specifically, the ABF is adjusted from 30µm to 90µm, and a corresponding relationship is formed with the number of crossover points. The ABF is 72 overlaps, indicating that the overlap is not only defined as a geometric region, but also discretized into a set of freezeable crossover point indices, so that the crossover position and the starting range of the continuation can be determined by indexing rather than subjective selection.

[0161] Finally, in the parallel exposure and relay connection stage, the number of handovers and the number of exposure context snapshots written in the present invention increase synchronously with the substrate complexity. Specifically, it is 6 times for HDI-200×250 and 9 times for ABF. And it shows a consistent trend with the number of stop events, total exposure time, and splicing boundary measurement indicators: the number of stop events decreases from 18, 26, and 44 to 2, 3, and 4, respectively, and the total exposure time decreases from 438, 676, and 1118s to 332, 505, and 835s, respectively.

[0162] More importantly, the process quantification indicators of the splicing boundary converged synchronously. Specifically, the splicing boundary alignment error decreased from 8.2, 9.5, and 12.8 µm to 2.9, 3.4, and 4.1 µm on the three types of substrates; the splicing boundary linewidth fluctuation decreased from 6.4, 7.1, and 9.0 µm to 2.1, 2.4, and 3.0 µm; and the number of splicing-related defects detected by AOI decreased from 37, 58, and 126 to 9, 14, and 32.

[0163] The differences directly correspond to the process design: the comparison objects rely on stopping and fixed small overlaps at the boundary, lacking context organization of the intersection point index + exposure progress field + parameter loading reference, resulting in the starting position of the boundary segment and progress recovery only relying on device status or human strategies. This invention freezes the handover boundary and generates an exposure context snapshot when the handover is triggered. This allows the successor head to reconstruct the starting position and starting scan progress of the subsequent exposure by using the slice identifier, overlap band identifier, handover point index and exposure progress field as input after reading the snapshot. The invention also constrains the parallel access of the same overlap band identifier by using the mutual exclusion occupancy condition of the task queue, thereby forming a closed-loop process of queue recording, snapshot and subsequent execution.

[0164] Finally, the number of re-exposures and output per unit time further reflect the impact of the closed-loop process on the production cycle time. Specifically, the output per unit time for HDI-200×250 increased from 6.7 boards per hour to 8.6 boards per hour, and for ABF it increased from 2.6 boards per hour to 3.5 boards per hour. Moreover, the number of re-exposures decreased on all three types of substrates.

[0165] The above comparison shows that the difference in this embodiment does not come from reducing a single parameter or simply adding a header, but is supported by a data-driven process of coordinate reference data → adaptive slicing and boundary constraints → overlapping zone intersection point set → context snapshot → succession continuation. Its novelty and feasibility can be reflected by the unidirectional changes of multiple independent indicators in the table.

[0166] Example 3, an embodiment of the present invention, provides a parallel processing and relay exposure LDI laser direct imaging exposure system, including a layout pattern acquisition and multi-exposure head coordinate calibration module, an exposure coordinate reference driven adaptive slicing and relay overlap zone task queue generation module, and a multi-exposure head parallel exposure and exposure context snapshot relay module for task queue scheduling.

[0167] The layout graphic acquisition and multi-exposure head coordinate calibration module is used to acquire layout graphic data and calibrate the coordinates of the multi-exposure heads, and generate exposure coordinate reference data based on the calibration results.

[0168] The exposure coordinate reference-driven adaptive slicing and relay overlap zone task queue generation module is used to perform adaptive slicing based on exposure coordinate reference data and generate slice boundary relay overlap zones and task queues.

[0169] The multi-exposure head parallel exposure and exposure context snapshot relay module, which is used to allocate slices to multi-exposure heads for parallel exposure according to the task queue, generate exposure context snapshots in the relay overlap zone, and the relay head reads the context snapshot to continue the exposure.

[0170] This embodiment also provides a computer device, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, it implements the LDI laser direct imaging exposure method with parallel processing and relay exposure as proposed in the above embodiment.

[0171] This embodiment also provides a computer-readable storage medium storing a computer program thereon. When the computer program is executed by a processor, it implements the LDI laser direct imaging exposure method with parallel processing and relay exposure as proposed in the above embodiment.

[0172] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, essentially, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0173] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-including system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0174] More specific examples of computer-readable media (a non-exhaustive list) include: electrical connections (electronic devices) having one or more wires, portable computer disk drives (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Furthermore, computer-readable media can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in computer memory.

[0175] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0176] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A parallel processing and relay exposure method for LDI laser direct imaging exposure, characterized in that, include: Collect layout graphic data and calibrate the coordinates of the multi-exposure head; generate exposure coordinate reference data based on the calibration results. Adaptive slicing is performed based on exposure coordinate reference data, and a slice boundary relay overlap zone and task queue are generated. Slices are assigned to multiple exposure heads for parallel exposure according to the task queue. An exposure context snapshot is generated in the relay overlap zone, and the relay head reads the context snapshot to continue the exposure. Adaptive slicing involves calculating slice boundary constraints and slice scale parameters using exposure coordinate reference data, dividing the area to be exposed into segments based on the slice boundary constraints and slice scale parameters, and outputting multiple slices. The slice boundary relay overlap zone includes defining a region with defined width and direction constraints at the boundary between two adjacent slices, which is a processable area belonging to the preceding and following slices. The location where the crossover occurs and the starting range of the continuation are defined based on the processable area.

2. The LDI laser direct imaging exposure method with parallel processing and relay exposure as described in claim 1, characterized in that: The collected layout graphic data includes, Import the layout file corresponding to the substrate to be exposed from the data interface and parse it to obtain the vector contour set of the exposure layer; Extract the alignment marks, reference marks, and no-exposure boundaries from the layout file as boundary data and establish a relationship with the vector contour set under the same coordinate unit; Perform coordinate origin unification, coordinate axis direction unification, and resolution parameter binding on the vector contour set; The calibration of the coordinates of the multi-exposure head includes establishing a coordinate system of the substrate carrier platform on the substrate carrier platform and placing a calibration substrate on the substrate carrier platform; The coordinate system of the substrate carrier platform includes taking the zero position of the substrate carrier platform as the origin and taking the two motion axis directions of the substrate carrier platform as the coordinate axis directions. The calibration substrate includes three sets of calibration marks disposed on the calibration substrate; The exposure head is controlled to sequentially scan and position the calibration marks, and the set of mark coordinates is output. The set of nominal coordinates of the three sets of calibration marks on the calibration substrate in the coordinate system of the substrate bearing platform is taken as the set of target coordinates for the marking; The calibration parameters of the exposure head are obtained by registering the set of marker coordinates with the set of marker target coordinates in the coordinate system of the substrate carrier platform.

3. The LDI laser direct imaging exposure method with parallel processing and relay exposure as described in claim 1 or 2, characterized in that: The generated exposure coordinate reference data includes, Based on the calibration parameters of the exposure head, establish a set of coordinate mapping parameters from the local position data of the exposure head to the coordinate system of the substrate support platform; After loading the substrate to be exposed onto the substrate carrier platform, the exposure head is controlled to scan and position the actual graphic positions corresponding to the alignment marks and reference marks extracted from the layout file. Output the set of measurement coordinates of alignment marks and reference marks in the coordinate system of the substrate support platform; The measurement coordinate set is registered with the corresponding marked coordinate data in the layout file to obtain the layout registration parameter set from the layout file coordinate data to the coordinate system of the substrate carrier platform. The set of page registration parameters includes translation parameters, rotation parameters, and scale parameters; The set of coordinate mapping parameters, the set of page registration parameters, the set of vector contours of the exposure layer, and the boundary data are used as the exposure coordinate reference data.

4. The LDI laser direct imaging exposure method with parallel processing and relay exposure as described in claim 3, characterized in that: The calculation of slice boundary constraints and slice scale parameters includes, By using the set of coordinate mapping parameters and the set of registration parameters in the exposure coordinate reference data, the vector contour set and boundary data of the exposure layer are converted into the coordinate system of the substrate carrier platform. Establish grid statistical units within the area to be exposed, perform local statistics on the set of vector contours covered by each grid statistical unit, and obtain the graphic density parameter and geometric complexity parameter. Calculate the slice scale parameter based on the graphic density parameter and the geometric complexity parameter; A prohibited crossing area is generated based on the no-exposure boundary in the boundary data, and a reserved area is generated in the coordinate system of the substrate bearing platform based on the measurement coordinate set of the alignment mark and the reference mark. The prohibited crossing area and the reserved area are combined with the two motion axes of the substrate bearing platform to generate a set of allowed extension directions, which serve as boundary constraints. The process of partitioning the area to be exposed includes using the slice scale parameter as the partitioning granularity input and the slice boundary constraint as the boundary generation constraint input. Multiple slice boundaries are generated and multiple slices are output in the coordinate system of the substrate carrier platform. Each slice is bound with a slice identifier and a vector contour subset index of the slice coverage. Perform an intersection check between each slice boundary and the prohibited crossing area and the reserved area; When an intersection occurs, the slice boundary is iteratively corrected and the vector contour subset index is updated within the set of allowed extension directions. The resolution parameter is bound and converted into a scan step size parameter; The multiple iteratively corrected slices are generated into task unit records according to the slice identifiers and written into the task queue; The task unit record includes slice identifier, slice boundary, index of the vector contour subset covered by the slice, and scan step parameters.

5. The LDI laser direct imaging exposure method with parallel processing and relay exposure as described in claim 1, 2, or 4, characterized in that: The designated area includes, Extract the common slice boundary of two adjacent slices and generate a set of boundary line segments in the coordinate system of the substrate support platform; The overlap band width and orientation constraint parameters are determined based on the slice scale parameters and slice boundary constraints; By expanding the boundary segment set on both sides along the normal direction using the overlap band width parameter, the relay overlap band of the slice boundary is obtained. The allowable scan entry direction and allowable crossover direction within the slice boundary relay overlap zone are defined by the directional constraint parameters. Register the overlapping zone at the slice boundary as an overlapping zone identifier and associate it with the previous slice identifier and the subsequent slice identifier, respectively. The defined starting range includes generating a set of handover points within the relay overlap zone of the slice boundary based on the task unit records in the task queue; Establish a mapping relationship between the set of intersection points and the set of boundary segments, and set trigger constraints; Triggering constraints include freezing the crossing boundary at the corresponding position in the crossing point set when the crossing is triggered; Write the crossover point index corresponding to the frozen position into the task queue.

6. The LDI laser direct imaging exposure method with parallel processing and relay exposure as described in claim 5, characterized in that: The allocation to multiple exposure heads for parallel exposure includes, By reading the slice identifier, slice boundary, vector contour subset index covered by the slice, and scan step parameters, and combining the coordinate mapping parameter set and the layout registration parameter set, the slice boundary and the vector contour subset index covered by the slice are converted to the local position data aperture of each exposure head, and exposure execution data corresponding to each exposure head is generated. Record the exposure head identifier for each task unit in the task queue, and use the overlap band identifier as a mutual exclusion condition during parallel exposure. The assigned exposure head is controlled to perform exposure on the vector contour subset index covered by the slice within the slice boundary according to the scan step parameter; When the exposure execution enters the adjacent overlapping zone, the slice boundary relay overlapping zone corresponding to the overlapping zone identifier is determined according to the overlapping point set to determine the index of the currently freezeable overlapping point; When the handover is triggered, the handover boundary is frozen at the handover point index position, an exposure context snapshot is generated and written to the task queue; The exposure context snapshot includes slice identifier, overlap band identifier, intersection point index, coordinate mapping parameter set, layout registration parameter set, and exposure progress field.

7. The LDI laser direct imaging exposure method with parallel processing and relay exposure as described in claim 1, 2, 4 or 6, characterized in that: The read context snapshot sequential exposure includes, The control relay head reads the exposure context snapshot from the task queue and parses it to obtain the slice identifier, overlap band identifier, handover point index and exposure progress field; Load the coordinate mapping parameter set and the layout registration parameter set based on the exposure context snapshot; The relay head retrieves the task unit record corresponding to the slice identifier in the task queue, and reads the slice boundary, the vector contour subset index covered by the slice, and the scan step parameter from the task unit record; Based on the coordinate mapping parameter set, the slice boundary and the vector contour subset index covered by the slice are converted into the local position data caliber of the connecting head; The translation, rotation, and scaling parameters of the conversion results are corrected based on the set of page registration parameters. The relay head determines the processable range of the overlapping zone of the slice boundary based on the overlapping zone mark, and determines the starting position of the subsequent exposure within the processable range based on the crossing point index. Determine the starting scan line number or starting path segment number based on the exposure progress field; Starting from the initial position, the relay head performs continuous exposure by scanning the incomplete portion corresponding to the vector contour subset index covered by the slice according to the scanning step parameters.

8. A parallel processing and relay exposure LDI laser direct imaging exposure system, employing the parallel processing and relay exposure LDI laser direct imaging exposure method as described in any one of claims 1 to 7, characterized in that: It includes a layout graphic acquisition and multi-exposure head coordinate calibration module, an exposure coordinate reference-driven adaptive slicing and relay overlap task queue generation module, and a multi-exposure head parallel exposure and exposure context snapshot relay module for task queue scheduling. The layout graphic acquisition and multi-exposure head coordinate calibration module is used to acquire layout graphic data and calibrate the coordinates of the multi-exposure head, and generate exposure coordinate reference data based on the calibration results; The exposure coordinate reference-driven adaptive slicing and relay overlap zone task queue generation module is used to perform adaptive slicing based on the exposure coordinate reference data and generate slice boundary relay overlap zones and task queues. The multi-exposure head parallel exposure and exposure context snapshot relay module of the task queue scheduling is used to allocate slices to multi-exposure head parallel exposure according to the task queue, generate exposure context snapshots in the relay overlap zone, and the relay head reads the context snapshot to continue the exposure.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the LDI laser direct imaging exposure method of any one of claims 1 to 7, which involves parallel processing and relay exposure.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the LDI laser direct imaging exposure method of any one of claims 1 to 7, which involves parallel processing and relay exposure.

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