Circuit board and optimization method and device thereof

Abstract

The invention discloses a circuit board and an optimization method and device thereof, and belongs to the technical field of circuit board design, and the circuit board optimization method comprises the steps: determining a voltage parameter of the circuit board based on the test temperature of the circuit board under the condition that the circuit board supplies power to a load; performing first-class optimization on the circuit board based on the voltage parameters; determining performance parameters of the circuit board, and performing second-class optimization on the circuit board based on the performance parameters; and cyclically adjusting the test temperature and / or the power of the load, and carrying out first-class optimization and second-class optimization on the circuit board for multiple times until the circuit board meets the requirements. According to the circuit board optimization method provided by the invention, the test temperature of the position where the circuit board is located and the power of the load are cyclically adjusted, and the first type of optimization and the second type of optimization are carried out for multiple times, so that the circuit board can meet various test temperatures and cope with loads with different powers, and the use scene of the circuit board is expanded; and the stability of the output voltage of the circuit board is improved.

Description

Technical Field

[0001] This application relates to the field of circuit board design technology, and in particular to a circuit board and its optimization method and apparatus. Background Technology

[0002] After the corresponding switching power supply circuit is designed on the circuit board, stability testing of the switching power supply circuit is required. Current stability testing methods only test in a single environment and cannot cover multiple usage scenarios, resulting in the output voltage of the circuit board not remaining stable under different usage environments. Summary of the Invention

[0003] A circuit board and its optimization method and apparatus are provided to solve the aforementioned technical problems.

[0004] To achieve the above objectives, in a first aspect, a circuit board optimization method is provided, comprising: When power is supplied to the load through the circuit board, the voltage parameters of the circuit board are determined based on the test temperature at which the circuit board is located; The circuit board is optimized in the first type based on the voltage parameters; The performance parameters of the circuit board are determined, and a second type of optimization is performed on the circuit board based on the performance parameters; The test temperature and / or the power of the load are cyclically adjusted, and the circuit board is subjected to multiple first-type optimizations and second-type optimizations until the circuit board meets the requirements.

[0005] In conjunction with the first aspect, the cyclical adjustment of the test temperature and / or the power of the load, performing multiple optimizations of the first type and the second type on the circuit board, includes: Under the same test temperature, the circuit board is subjected to the first type of optimization and the second type of optimization by changing the power of the load; and / or, under the same load power, the circuit board is subjected to the first type of optimization and the second type of optimization by changing the test temperature.

[0006] In conjunction with the first aspect, the voltage parameters include output voltage and voltage ripple, and the method for performing a first type of optimization on the circuit board based on the voltage parameters includes: Determine the output voltage and voltage ripple of the circuit board during the process of supplying power to the load; If the voltage ripple exceeds a preset ripple threshold, the inductor component in the circuit board is adjusted.

[0007] In conjunction with the first aspect, the voltage parameters include output voltage and voltage noise, and the method for performing a first type of optimization on the circuit board based on the voltage parameters includes: Determine the output voltage and voltage noise of the circuit board during the process of supplying power to the load; If the voltage noise exceeds a preset noise threshold, the inductor components in the circuit board are adjusted.

[0008] In conjunction with the first aspect, the performance parameters include gain margin, and the method for performing a second type of optimization on the circuit board based on the performance parameters includes: Determine the gain margin of the circuit board during the process of supplying power from the circuit board to the load; When the gain margin is greater than a preset gain threshold, the capacitor components and / or resistor components in the circuit board are adjusted.

[0009] In conjunction with the first aspect, the performance parameters include phase margin, and the method for performing a second type of optimization on the circuit board based on the performance parameters includes: Determine the phase margin of the circuit board during the process of supplying power from the circuit board to the load; If the phase margin is greater than a preset phase threshold, the capacitor and / or resistor components in the circuit board are adjusted.

[0010] In conjunction with the first aspect, the performance parameter also includes the crossover frequency, and the method for performing a second type of optimization on the circuit board based on the performance parameter further includes: Determine the crossover frequency of the circuit board during the process of the circuit board supplying power to the load; If the crossover frequency is greater than a preset frequency threshold, the capacitor components and / or resistor components in the circuit board are adjusted.

[0011] In conjunction with the first aspect, the method further includes: Under constant test temperature and load power, the circuit board is subjected to a stress test to perform the first type of optimization and the second type of optimization on the circuit board. The stress test includes a continuous working test of more than 12 hours.

[0012] Secondly, this application provides a circuit board optimization device, comprising: A parameter acquisition module is configured to determine the voltage parameters of the circuit board based on the test temperature at which the circuit board is located when power is supplied to the load through the circuit board. A first optimization module is configured to perform a first type of optimization on the circuit board based on the voltage parameters; The second optimization module is configured to determine the performance parameters of the circuit board and perform a second type of optimization on the circuit board based on the performance parameters. A processor module configured to cyclically adjust the test temperature and / or the power of the load, performing multiple first-type and second-type optimizations on the circuit board.

[0013] Thirdly, this application provides a circuit board, comprising: A DC power supply chip, which is used to connect to an external DC input power supply; The peripheral circuit is connected to the DC power supply chip, and the peripheral circuit includes capacitors, resistors and inductors; During testing, the circuit board is configured to adjust the inductor, capacitor, and / or resistor in the peripheral circuit using the circuit board optimization method as described in any one of the first aspects.

[0014] One of the above technical solutions has the following advantages or beneficial effects: Compared with existing technologies, this application provides a circuit board optimization method, which includes: determining the voltage parameters of the circuit board based on the test temperature of the circuit board when powering a load through the circuit board; performing a first type of optimization on the circuit board based on the voltage parameters; determining the performance parameters of the circuit board and performing a second type of optimization on the circuit board based on the performance parameters; cyclically adjusting the test temperature and / or the power of the load, and performing multiple first and second type optimizations on the circuit board until the circuit board meets the requirements. The circuit board optimization method provided in this application, by cyclically adjusting the test temperature of the circuit board and the power of the load and performing multiple first and second type optimizations, enables the circuit board to meet various test temperatures and cope with loads of different power, expanding the application scenarios of the circuit board and improving the stability of the circuit board's output voltage. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram illustrating the steps of a circuit board optimization method according to an exemplary embodiment of this disclosure; Figure 2 This is a flowchart illustrating an exemplary embodiment of the circuit board optimization method of this disclosure; Figure 3 A schematic diagram illustrating the steps of a first type of optimization method provided in an exemplary first embodiment of this disclosure; Figure 4 A schematic diagram illustrating the steps of the first type of optimization method provided in the exemplary second embodiment of this disclosure; Figure 5 A schematic diagram illustrating the steps of the second type of optimization method provided in the exemplary first embodiment of this disclosure; Figure 6 A schematic diagram illustrating the steps of a second type of optimization method provided in an exemplary second embodiment of this disclosure; Figure 7 A schematic diagram illustrating the steps of the second type of optimization method provided in the exemplary third embodiment of this disclosure; Figure 8 A circuit connection diagram of a circuit board provided in an exemplary embodiment of this disclosure; Figure 9 A schematic diagram of a circuit board optimization apparatus provided as an exemplary embodiment of this disclosure. Detailed Implementation

[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0018] Furthermore, descriptions involving "first," "second," etc., in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0019] With the development of technology, higher requirements have been placed on the stability of various switching power supply circuits on circuit boards. Among them, DC-DC power supplies are the most common. When the power supply is not stable, the output voltage value will be uncertain, and internal and external interference will directly affect the output voltage, causing it to deviate from the set value. When the deviation is too large, it will directly affect the subsequent circuits. As the foundation of hardware design, the stability of the power supply's output voltage will directly affect the stability of the entire circuit board.

[0020] like Figure 1 and Figure 2 As shown in the figure, this application proposes a circuit board optimization method, including: S1: When power is supplied to the load through the circuit board, the voltage parameters of the circuit board are determined based on the test temperature of the circuit board.

[0021] Specifically, circuit boards typically contain various switching circuits, rectifier and filter circuits, and voltage regulation control circuits. These circuits convert the DC voltage from the external battery and then supply it to the chips, sensors, and actuators on the circuit board. After the hardware design of the circuit board is completed, the various components are first soldered onto the circuit board according to the design drawings; then the circuit board is placed in a temperature-controlled chamber; then, an external power supply is connected to the input terminal of the circuit board, a load is connected to the output terminal, and a corresponding voltage acquisition device (i.e.,...) is connected to the output terminal. Figure 2 (Set the test prerequisites in the settings); finally, adjust the test temperature of the constant temperature chamber and collect the voltage parameters at the output terminal of the circuit board at different temperatures (i.e., Figure 2 (Parameter testing in the process).

[0022] S2: Perform first-type optimization on the circuit board based on voltage parameters.

[0023] Specifically, the voltage parameters include the output voltage, as well as the voltage ripple and voltage noise of the output voltage. In some embodiments, the method for performing a first-type optimization of the circuit board based on the voltage parameters includes: like Figure 3 As shown, this application provides a first implementation of a first type of optimization method, including: S201: Determine the output voltage and voltage ripple of the circuit board during the process of supplying power to the load. Specifically, acquire the output voltage and voltage ripple of the circuit board during the power supply process by using voltage acquisition devices and voltage ripple acquisition devices installed at the output end of the circuit board. The voltage acquisition devices include any one of a multimeter, oscilloscope, data acquisition card, and benchtop high-precision digital source meter. The voltage ripple acquisition devices include any one of a high-precision digital multimeter, oscilloscope, benchtop high-precision digital source meter, and dedicated voltage ripple analyzer. The oscilloscope can not only measure the amplitude of the circuit board's output voltage but also capture the dynamic changes in the output voltage, supporting the observation of transient phenomena such as ripple, spikes, and drops. The data acquisition card can connect to a host computer (such as a computer) to achieve multi-channel, long-term, automated voltage acquisition and supports data storage and analysis. The benchtop high-precision digital source meter has high accuracy, capable of measuring output voltage at the μV level, and can not only measure output voltage and output current but also has load simulation capabilities.

[0024] It is worth noting that voltage ripple refers to the periodic or random small AC fluctuations superimposed on the output voltage, representing an unstable deviation in the output voltage. The magnitude of the voltage ripple reflects the stability of the output voltage. A larger peak-to-peak value indicates more pronounced output voltage fluctuations, potentially interfering with the normal operation of precision components in the circuit. Conversely, a smaller peak-to-peak value indicates higher output voltage stability. By connecting an oscilloscope, data acquisition card, or desktop high-precision digital source meter to the output of the circuit board, the superimposed voltage ripple, which determines the output voltage, can be observed independently by filtering out the DC component.

[0025] S202: When the voltage ripple is greater than the preset ripple threshold, adjust the inductor components in the circuit board.

[0026] Specifically, inductors are crucial energy storage components in circuit boards. If the inductor parameters don't match those of other components on the board, it will increase the output voltage ripple. After detecting the voltage ripple using a voltage monitoring device, the peak-to-peak value is determined and compared to a preset ripple threshold. If the peak-to-peak value is less than or equal to the preset threshold, no adjustment to the components on the board is needed. If the peak-to-peak value exceeds the preset threshold, adjusting the inductor parameters, such as appropriately increasing the inductance value, can reduce the ripple of the output current on the inductor side, thereby reducing the output voltage ripple. It's important to note that excessively high inductance can also reduce the power supply's dynamic response speed; therefore, a balance must be struck between voltage ripple and response speed.

[0027] It should be noted that the preset ripple threshold provided in this embodiment is proportional to the output voltage of the circuit board. For example, the preset ripple threshold can be 3%-5% of the circuit board's output voltage. That is, if the output voltage of the circuit board is 3.3V, the preset ripple threshold can be any value between 99mV and 165mV. The specific preset ripple threshold value can be selected according to the accuracy requirements of the circuit board in different usage scenarios, and this embodiment will not provide further examples.

[0028] like Figure 4 As shown, this application provides a second implementation of the first type of optimization method, including: S211: Determine the output voltage and voltage noise of the circuit board during the process of supplying power to the load. Specifically, acquire the output voltage and voltage noise of the circuit board during the process of supplying power to the load using a voltage acquisition device and a voltage noise acquisition device installed at the output end of the circuit board. The voltage acquisition device can be any one of a multimeter, oscilloscope, data acquisition card, or desktop high-precision digital source meter.

[0029] It is worth noting that voltage noise is a series of irregular, random, and minute voltage fluctuations superimposed on the output voltage of a circuit board. Unlike periodic voltage ripple, its fluctuations do not have a fixed frequency or amplitude pattern. Sources of voltage noise include thermal noise from resistors, shot noise / flicker noise from semiconductor devices, electromagnetic interference, ground loop noise, switching spike noise from switching power supplies, crosstalk between adjacent signal traces, and transient noise caused by sudden changes in load current.

[0030] Accordingly, voltage noise acquisition equipment includes any one or more of the following: high-bandwidth oscilloscopes, low-noise probes, high-precision spectrum analyzers, low-noise data acquisition cards, and dedicated power supply noise analyzers. High-bandwidth oscilloscopes offer bandwidths from hundreds of MHz to several GHz, capturing high-frequency noise spikes at the nanosecond level; they support AC coupling and high-gain settings (e.g., 10mV / div), amplifying minute noise signals. Low-noise probes capture low-frequency voltage noise, avoiding ground loop noise and attenuation distortion introduced by ordinary passive probes. High-precision spectrum analyzers focus on frequency domain noise analysis, accurately measuring noise amplitudes at different frequencies and distinguishing between different noise sources such as power supply ripple, electromagnetic interference, and thermal noise. Low-noise data acquisition cards, combined with a shielded enclosure, support long-term, multi-channel noise data acquisition; they can be used with computer software for data storage and subsequent time / frequency domain analysis. Dedicated power supply noise analyzers are tailored for voltage noise measurement on circuit boards, integrating low-noise preamplifiers, filters, and spectrum analysis functions, capable of measuring noise at the μV level.

[0031] S212: Adjust the inductor components on the circuit board when the voltage noise exceeds a preset noise threshold. Specifically, the inductor is an important component on the circuit board, possessing energy storage, filtering, current surge suppression, and impedance characteristics. The inductor's energy storage characteristic smooths current fluctuations. When the switch on the circuit board is turned on, the inductor stores energy; when the switch is turned off, the inductor releases energy. Therefore, the inductor can reduce the current ripple amplitude, thereby reducing voltage spike noise caused by current surges. Simultaneously, the combination of inductor and capacitor forms an LC low-pass filter circuit. The inductor presents high impedance to high-frequency noise, which can hinder the transmission of high-frequency noise signals to the output. Combined with the low impedance shunting of the capacitor, it filters out voltage noise corresponding to the switching frequency and harmonics. However, when the inductor's inductance value does not match the switching frequency of the switch, an excessively high inductance value will reduce the power supply's dynamic response, while an excessively low inductance value will result in insufficient filtering, thus causing voltage noise transmission. Furthermore, when the inductor's impedance is high, it can directly block voltage noise transmission, reducing the amplitude of voltage noise superimposed on the output voltage; if the inductor's impedance is low, the suppression effect is weakened. Therefore, different noise thresholds are set according to the type of voltage noise. When the voltage noise is determined to be greater than the preset noise threshold, the inductors in different positions on the circuit board are adjusted to match their inductance or impedance with the corresponding components on the circuit board, thereby reducing voltage noise and improving the quality of the circuit board's output voltage.

[0032] S3: Determine the performance parameters of the circuit board, and perform a second type of optimization on the circuit board based on the performance parameters.

[0033] Specifically, performance parameters include the gain margin (GM), phase margin (CF), and phase margin (PM) of the circuit board output loop.

[0034] like Figure 5 As shown, based on performance parameters, this application provides a first implementation method for a second type of optimization of the circuit board, including: S301: Determine the gain margin of the circuit board during the process of powering the load.

[0035] Specifically, the gain margin of the output loop is measured by connecting a loop analyzer or a combination of an oscilloscope, signal injector, and network analyzer to the output loop of the circuit board. Gain margin is a key indicator of the stability of the power supply loop in the circuit board. Together with phase margin, it ensures that the power supply does not oscillate under various environments. It mainly refers to the difference between the loop gain and 0 dB when the phase reaches -180° frequency.

[0036] It is worth noting that gain margin reflects the system's noise immunity and gain tolerance. When the gain margin is too small (e.g., <6dB), the system is prone to oscillation; when the gain margin is sufficient (e.g., >10dB), the system has a high tolerance to parameter changes and external interference, and is more stable. Typically, the gain margin of a circuit board needs to be greater than or equal to 6dB, and in some high-reliability scenarios, it needs to be greater than or equal to 10dB.

[0037] S302: When the gain margin exceeds a preset gain threshold, adjust the capacitor and / or resistor components on the circuit board. Specifically, capacitors and resistors are core components of the loop compensation network, and their parameters directly change the rate of attenuation of the loop gain, thus affecting the gain margin. Capacitors in the compensation network mainly provide poles or zeros to change the gain attenuation slope at different frequencies. The effect of capacitance changes on the gain margin varies depending on the function of the capacitor. If the capacitor is a low-frequency compensation capacitor (such as the main compensation capacitor), when the capacitance increases, the low-frequency pole frequency decreases, thus slowing down the attenuation rate of the loop gain in the mid-to-high frequency range, ultimately increasing the gain margin; when the capacitance decreases, the low-frequency pole frequency increases, thus accelerating the attenuation of the mid-to-high frequency gain, ultimately decreasing the gain margin. It is worth noting that excessively large capacitance of the low-frequency compensation capacitor can easily lead to a decrease in phase margin, causing low-frequency oscillations, while excessively small capacitance may result in values ​​below the safety threshold. If the capacitor is a high-frequency compensation capacitor (such as a vibration damping capacitor), when the capacitance value increases, the high-frequency zero frequency decreases, which leads to an increase in high-frequency gain and ultimately reduces the gain margin; while when the capacitance value decreases, the high-frequency gain attenuation intensifies, which ultimately increases the gain margin.

[0038] In this embodiment, resistors are used in the compensation network to set the zero-point frequency or adjust the gain reference. The effect of resistance changes on the gain margin differs depending on the function of the resistor. If the resistor is a compensation resistor, increasing the resistance decreases the zero-point frequency, increases the mid-frequency gain, and ultimately reduces the gain margin; conversely, decreasing the resistance increases the zero-point frequency, accelerates the mid-frequency gain decay, and ultimately increases the gain margin. If the resistor is a feedback voltage divider resistor, the voltage division ratio often determines the loop's DC gain. If a change in the voltage divider ratio leads to an increase in DC gain, the overall loop gain shifts upward, ultimately reducing the gain margin; conversely, a decrease in the voltage division ratio increases the gain margin.

[0039] It's important to note that the core criterion for gain margin is the difference between the loop gain amplitude and 0dB at a phase of -180°. Typically, this difference should be no less than 10dB, and for more demanding applications like mobile phones, it should be no less than 6dB. Therefore, the preset gain threshold can be selected within the range of 6dB to 10dB. However, a larger gain margin is not always better: exceeding 25dB causes the loop gain to decay too quickly, leading to a slower dynamic response. Therefore, the difference between the loop gain amplitude and 0dB is used to adjust the capacitance and resistance values ​​in the loop to ultimately achieve the ideal gain margin.

[0040] like Figure 6 As shown, based on performance parameters, this application provides a second implementation method for second-type optimization of the circuit board, including: S311: Determine the phase margin of the circuit board during the process of supplying power to the load.

[0041] Specifically, the phase margin of the output loop is measured by connecting a loop analyzer or a combination of an oscilloscope, signal injector, and network analyzer to the output loop of the circuit board. Phase margin is one of the key parameters in the power supply loop of a circuit board; it refers to the phase difference of the loop gain at a crossover frequency of -180°. Phase margin directly affects the dynamic response and noise immunity of the power supply system.

[0042] It is worth noting that phase margin directly reflects the system's oscillation suppression capability and dynamic response characteristics. When the phase margin is too small (e.g., <30°), the power supply is prone to voltage oscillation, overshoot, or even instability when the load changes abruptly; when the phase margin is too large (e.g., >70°), the oscillation risk is low, but the system's dynamic response becomes slower, and the voltage recovery time is long when the load changes. Generally, the optimal selection range for the phase margin of a circuit board is 45°~60°, which can balance stability and fast dynamic response.

[0043] S312: When the phase margin is greater than the preset phase threshold, adjust the capacitor and / or resistor components in the circuit board.

[0044] Specifically, capacitors in compensation networks are mainly used to generate poles (phase lag) or zeros (phase lead), and the effects of different types of capacitors vary significantly. If the capacitor is a low-frequency compensation capacitor, increasing the capacitance value lowers the pole frequency, slows down phase lag in the mid-to-high frequency range, and ultimately increases the phase margin; conversely, decreasing the capacitance value raises the pole frequency, exacerbates phase lag in the mid-to-high frequency range, and ultimately decreases the phase margin. If the capacitor is a high-frequency damping capacitor, increasing the capacitance value lowers the high-frequency pole frequency, causes rapid phase lag in the high-frequency range, and ultimately significantly reduces the phase margin; conversely, decreasing the capacitance value slows down high-frequency phase decay, ultimately improving the phase margin. It should be noted that excessively large capacitance values ​​will reduce loop bandwidth and decrease dynamic response speed, while excessively small capacitance values ​​can easily cause system oscillations.

[0045] In this embodiment, the resistor is mainly used to adjust the zero-point frequency and change the lead range of the phase curve, with its impact on the phase margin concentrated in the mid-frequency range. Furthermore, the effect of adjusting the resistance value of resistors with different functions on the phase margin varies. If the resistor is a compensation resistor, when the resistance value increases, the zero-point frequency decreases, and the phase lead effect in the mid-frequency range appears earlier, ultimately increasing the phase margin; when the resistance value decreases, the zero-point frequency increases, and the phase lead in the mid-frequency range is insufficient, ultimately decreasing the phase margin. If the resistor is a feedback voltage divider resistor, the resistance ratio only changes the DC gain and has no direct effect on the shape of the phase curve, therefore it will not directly change the phase margin; however, if the voltage divider ratio is too large, resulting in excessively high DC gain, it will cause the crossover frequency to shift to the right (entering the high-frequency phase attenuation region), indirectly leading to a decrease in the phase margin.

[0046] It is worth noting that the phase margin is typically 50°, but can reach 70° on some high-precision devices. Therefore, the preset phase threshold can be selected within the range of 40° to 60°. However, a larger phase margin is not always better; exceeding 70° results in excessive loop phase lead, leading to a slower dynamic response. Therefore, by adjusting the capacitance and resistance values ​​in the loop, the gain margin can ultimately reach the ideal value.

[0047] like Figure 7 As shown, based on performance parameters, this application provides a third implementation method for the second type of optimization of the circuit board, including: S321: Determine the crossover frequency of the circuit board during the process of supplying power to the load.

[0048] Specifically, the crossover frequency of the output loop is measured by connecting a loop analyzer or a combination of an oscilloscope, signal injector, and network analyzer to the output loop of the circuit board. Crossover frequency is one of the key parameters in the power supply loop of a circuit board; it belongs to the frequency domain and directly affects the dynamic response speed and stability of the power supply. A higher crossover frequency results in a wider loop bandwidth, faster response to load changes, and smaller voltage dips / overshoots, but reduces high-frequency noise suppression. Conversely, a lower crossover frequency results in stronger immunity to high-frequency interference, but slower dynamic response and longer voltage recovery time when the load changes. The crossover frequency should be matched to the power supply switching frequency, typically 10%-20% of the switching frequency, to avoid insufficient phase margin due to excessively rapid phase decay in the high-frequency band.

[0049] S322: Adjust the capacitor and / or resistor components in the circuit board when the crossover frequency is greater than a preset frequency threshold.

[0050] Specifically, capacitors are mainly used to set pole / zero frequencies and change the amplitude-frequency attenuation slope of the loop gain, affecting the crossover frequency across low, mid, and high frequency ranges. Furthermore, the capacitance value of capacitors with different functions has different effects on the crossover frequency. If the capacitor is a low-frequency compensation capacitor, increasing the capacitance value lowers the pole frequency and slows down the gain attenuation rate in the mid-to-high frequency range, ultimately shifting the crossover frequency to the right; decreasing the capacitance value raises the pole frequency and accelerates the gain attenuation rate in the mid-to-high frequency range, ultimately shifting the crossover frequency to the left. If the capacitor is a high-frequency damping capacitor, increasing the capacitance value lowers the high-frequency zero frequency and increases the high-frequency gain, causing the crossover frequency to shift to the right; decreasing the capacitance value intensifies the high-frequency gain attenuation, causing the crossover frequency to shift to the left.

[0051] It's worth noting that the crossover frequency is typically 1 / 10 of the switching frequency, but in some devices with high dynamic response requirements, it can approach 1 / 4 of the switching frequency. Therefore, the preset frequency threshold can be selected within the range of 1 / 10 to 1 / 5 of the switching frequency. However, a higher crossover frequency is not always better. Exceeding 1 / 4 of the switching frequency makes the loop susceptible to high-frequency noise interference, leading to a rapid decrease in phase margin. Therefore, by adjusting the capacitance and resistance values ​​in the loop, the ideal crossover frequency can ultimately be achieved.

[0052] S4: Cyclicly adjust the test temperature and / or load power, perform multiple Type I and Type II optimizations on the circuit board until the circuit board meets the requirements.

[0053] Specifically, to accurately test the circuit board's data under different conditions, a multi-round, multi-stage test was conducted using the controlled variable method. The variables included test temperature and load power. The selectable test temperature range was -40℃ to 85℃, and the load power included high-power loads (50% ≤ load utilization ≤ 100%) and low-power loads (0% ≤ load utilization < 50%). First, the test temperature of the circuit board was kept constant. By changing the power of the load connected to the circuit board, first-type optimization and second-type optimization were performed on the circuit board.

[0054] In the first stage of the first round of testing, the test temperature is adjusted to -40℃, the circuit board is connected to a high-power load, and the voltage parameters of the circuit board under the high-power load are obtained. Based on the voltage parameters, the components on the circuit board undergo the first type of optimization. After optimization, the performance parameters are obtained, and the circuit board undergoes the second type of optimization based on the performance parameters. Then, in the second stage of the first round of testing, without changing the test temperature, the circuit board is connected to a low-power load, and the voltage parameters of the circuit board under the low-power load are obtained. Based on the voltage parameters, the components on the circuit board undergo the first type of optimization. After optimization, the performance parameters are obtained, and the circuit board undergoes the second type of optimization based on the performance parameters. After optimization, in the third stage of the first round of testing, the test temperature is adjusted to 20℃, and the connection and optimization of the high-power and low-power loads are repeated. This process continues until the test temperature is adjusted to 85℃, and the connection and optimization of the high-power and low-power loads are repeated, thus completing the first round of testing.

[0055] After completing one round of testing, in order to improve the stability of the circuit board, a second or third round of testing can be carried out. By continuously adjusting the test temperature and load power and continuously performing first and second type optimizations on the circuit board, the output voltage of the circuit board can meet the requirements.

[0056] In some embodiments of this application, the circuit board can also be connected to the same load power, and the circuit board can be optimized in the first and second types by continuously changing the test temperature. The specific detailed steps and optimization processes have been described in detail in the above embodiments, and will not be repeated here.

[0057] In some embodiments of this application, after multiple rounds of testing are completed, or during the testing process of the circuit board, a stress test can also be performed on the circuit board. By maintaining the test temperature and continuously connecting the circuit board to a high-power load or low-power load for an extended period, a first type of optimization is performed on the circuit board based on the voltage parameters after the extended period of operation. After optimization, the circuit board is subjected to another extended period of operation, and the corresponding performance parameters are obtained. A second type of optimization is then performed on the circuit board based on these performance parameters. The duration of the stress test is greater than or equal to 12 hours. In some embodiments, the duration of the stress test may also be less than 12 hours. The specific duration can be selected according to various factors based on the actual test environment and scenario, and this application does not impose further limitations on this.

[0058] In summary, the circuit board optimization method provided in this application cyclically adjusts the test temperature and load power of the circuit board and performs multiple first-type and second-type optimizations, thereby enabling the circuit board to meet various test temperatures and cope with loads of different power, expanding the application scenarios of the circuit board and improving the stability of the circuit board's output voltage.

[0059] like Figure 8 As shown in the illustration, this application also provides a circuit board, including: a DC power chip U1, which is used to connect to an external DC input power supply; and peripheral circuitry connected to the DC power chip U1, comprising capacitors, resistors, and inductors. During testing, the circuit board can adjust the inductors, capacitors, and / or resistors in the peripheral circuitry using the circuit board optimization method provided in any of the above embodiments. Specifically, the peripheral circuitry is a loop circuit, comprising a first compensation capacitor C1, a second compensation capacitor C2, a third compensation capacitor C3, a fourth compensation capacitor C4, a first feedback resistor R1, a second feedback resistor R2, a compensation resistor R3, and an inductor L1. The DC power supply chip U1 includes a loop configuration pin Comp, a feedback pin FB, and a switching pin SW. The switching pin SW is connected to one end of an inductor L1, and the other end of the inductor L1 is configured as the voltage output terminal Vout. One end of the first feedback resistor R1 is connected to the feedback pin FB, and the other end of the first feedback resistor R1 is connected to the voltage output terminal Vout. One end of the second feedback resistor R2 is connected to the feedback pin FB, and the other end is grounded. One end of the compensation resistor R3 is connected to the loop configuration pin Comp through a third compensation capacitor C3, and the other end is grounded. The first compensation capacitor C1 is connected in parallel with the first feedback resistor R1. One end of C2 is connected to the voltage output terminal Vout, and the other end is grounded. The fourth compensation capacitor C4 is connected in parallel with the third compensation capacitor C3 and the compensation resistor R3.

[0060] It is worth noting that the power supply section plays a crucial role in the circuit board, with DC-DC power supplies being the most common. Figure 8As shown, the loop configuration pin Comp in a DC-DC power supply is configured through the third compensation capacitor C3, the fourth compensation capacitor C4, and the third compensation resistor R3. The stability of the output voltage Vout is affected by many factors, including the parameters of the DC power chip U1 itself, the first inductor L1, the first feedback resistor R1, the second feedback resistor R2, the loop compensation configuration, and the second compensation capacitor C2, as well as the load power of the board and the ambient temperature. Therefore, the stability of the output voltage of a DC-DC power supply needs to be verified and tested from multiple aspects to obtain accurate results.

[0061] In this embodiment of the application, during the testing of the circuit board, the inductor L1 is optimized and adjusted according to the voltage parameters, and any one or more of the first compensation capacitor C1, the second compensation capacitor C2, the third compensation capacitor C3, the fourth compensation capacitor C4, the first feedback resistor R1, the second feedback resistor R2, and the compensation resistor R3 are adjusted according to the performance parameters, so as to keep the output voltage of the circuit board stable.

[0062] It should be noted that high-temperature environments can affect the performance of components such as resistors and capacitors, as well as the internal losses and power consumption of the DC power supply chip U1, thus indirectly affecting stability. Similarly, low temperatures, like high temperatures, also affect the performance of components, thereby indirectly affecting the stability of the output voltage. Therefore, the output voltage stability verification test and optimization method proposed in this application has undergone multiple rounds of testing, covering various test environments, and is comprehensive, thus improving the accuracy of the results.

[0063] Understandably, by cyclically adjusting the test temperature and load power of the circuit board and optimizing the capacitors, resistors, and inductors in the peripheral circuit of the circuit board multiple times, the circuit board can cope with various temperatures and load power, thereby expanding the application scenarios of the circuit board and improving the stability of the circuit board's output voltage.

[0064] like Figure 9As shown in the illustration, this application also provides a circuit board optimization device, including: a parameter acquisition module configured to determine the voltage parameters of the circuit board based on the test temperature of the circuit board when power is supplied to a load through the circuit board; a first optimization module configured to perform a first type of optimization on the circuit board based on the voltage parameters; a second optimization module configured to determine the performance parameters of the circuit board and perform a second type of optimization on the circuit board based on the performance parameters; and a processor module configured to cyclically adjust the test temperature and / or the power of the load, performing multiple first and second type optimizations on the circuit board. Specifically, the circuit board optimization device provided in this application is used to implement the circuit board optimization method provided in the above embodiments. Therefore, the working process and beneficial effects of this circuit board optimization device have been described in detail in the above embodiments, and will not be repeated here.

[0065] The above description is merely an optional embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A circuit board optimization method, characterized in that, include: When power is supplied to the load through the circuit board, the voltage parameters of the circuit board are determined based on the test temperature at which the circuit board is located; The circuit board is optimized in the first type based on the voltage parameters; The performance parameters of the circuit board are determined, and a second type of optimization is performed on the circuit board based on the performance parameters; The test temperature and / or the power of the load are cyclically adjusted, and the circuit board is subjected to multiple first-type optimizations and second-type optimizations until the circuit board meets the requirements.

2. The circuit board optimization method according to claim 1, characterized in that, The cyclic adjustment of the test temperature and / or the load power, and the multiple optimizations of the first type and the second type on the circuit board, include: Under the same test temperature, the circuit board is subjected to the first type of optimization and the second type of optimization by changing the power of the load; and / or, under the same load power, the circuit board is subjected to the first type of optimization and the second type of optimization by changing the test temperature.

3. The circuit board optimization method according to claim 1, characterized in that, The voltage parameters include output voltage and voltage ripple, and the method for performing a first type of optimization on the circuit board based on the voltage parameters includes: Determine the output voltage and voltage ripple of the circuit board during the process of supplying power to the load; If the voltage ripple exceeds a preset ripple threshold, the inductor component in the circuit board is adjusted.

4. The circuit board optimization method according to claim 1, characterized in that, The voltage parameters include output voltage and voltage noise. The method for performing a first type of optimization on the circuit board based on these voltage parameters includes: Determine the output voltage and voltage noise of the circuit board during the process of supplying power to the load; If the voltage noise exceeds a preset noise threshold, the inductor components in the circuit board are adjusted.

5. The circuit board optimization method according to claim 1, characterized in that, The performance parameters include gain margin, and the method for performing a second type of optimization on the circuit board based on the performance parameters includes: Determine the gain margin of the circuit board during the process of supplying power from the circuit board to the load; When the gain margin is greater than a preset gain threshold, the capacitor components and / or resistor components in the circuit board are adjusted.

6. The circuit board optimization method according to any one of claims 1 to 5, characterized in that, The performance parameters include phase margin, and the method for performing a second type of optimization on the circuit board based on the performance parameters includes: Determine the phase margin of the circuit board during the process of supplying power from the circuit board to the load; If the phase margin is greater than a preset phase threshold, the capacitor and / or resistor components in the circuit board are adjusted.

7. The circuit board optimization method according to claim 6, characterized in that, The performance parameters also include the crossover frequency, and the method for performing a second type of optimization on the circuit board based on the performance parameters further includes: Determine the crossover frequency of the circuit board during the process of the circuit board supplying power to the load; If the crossover frequency is greater than a preset frequency threshold, the capacitor components and / or resistor components in the circuit board are adjusted.

8. The circuit board optimization method according to claim 7, characterized in that, The method further includes: Under constant test temperature and load power, the circuit board is subjected to a stress test to perform the first type of optimization and the second type of optimization on the circuit board. The stress test includes a continuous working test of more than 12 hours.

9. A circuit board optimization device, characterized in that, include: A parameter acquisition module is configured to determine the voltage parameters of the circuit board based on the test temperature at which the circuit board is located when power is supplied to the load through the circuit board. A first optimization module is configured to perform a first type of optimization on the circuit board based on the voltage parameters; The second optimization module is configured to determine the performance parameters of the circuit board and perform a second type of optimization on the circuit board based on the performance parameters. A processor module configured to cyclically adjust the test temperature and / or the power of the load, performing multiple first-type and second-type optimizations on the circuit board.

10. A circuit board, characterized in that, include: A DC power supply chip, which is used to connect to an external DC input power supply; The peripheral circuit is connected to the DC power supply chip, and the peripheral circuit includes capacitors, resistors and inductors; During testing, the circuit board is configured to adjust the inductor, capacitor, and / or resistor in the peripheral circuit using the circuit board optimization method as described in any one of claims 1 to 8.

Images