Plastic package power module with double-sided water cooling and full CLIP connection

Abstract

The invention discloses a plastic package power module with double-sided water cooling and full CLIP connection. The plastic package power module comprises an upper bridge module assembly, a lower bridge module assembly, a plastic package body and a double-sided heat dissipation assembly. The upper bridge module assembly comprises a first DBC board, a plurality of upper bridge chips connected in parallel, a first connecting copper bar and a first signal copper bar, the first connecting copper bar is of an integrally-formed structure, all the upper bridge chips are connected in parallel through a first chip pin, a second chip pin and a copper layer pin which are vertically arranged, traditional lead bonding is replaced, and the upper bridge chips are connected in parallel through the first chip pin, the second chip pin and the copper layer pin. And high-current transmission and mechanical support of low parasitic inductance are realized. The first signal copper bar is located between the two rows of upper bridge chips, driving signals are synchronously transmitted to all the chips through the auxiliary copper bars, switch synchronism is ensured, and the parasitic inductance and synchronism defects of lead bonding are eliminated. The double-face heat dissipation assembly is attached to the upper module and the lower module, through the design of the branch flow channels and the main flow channels in the flow channel grooves, the retention path of cooling liquid is prolonged, the flow is evenly distributed, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of power module technology, and in particular to a plastic-encapsulated power module with double-sided water cooling and full CLIP connection. Background Technology

[0002] Power modules are key components integrating power electronics technology, mainly composed of control circuits and power drive circuits, and are commonly used in motor control, lighting control, battery management systems, and other fields. As power electronics technology develops towards higher power density, higher frequency, and smaller size, more stringent requirements are placed on the performance of core power modules. Traditional plastic-encapsulated power modules typically employ a single-sided heat dissipation structure, meaning heat conduction relies solely on a heat sink at the bottom of the module. This limited heat dissipation area is insufficient to meet the heat dissipation demands of high-power applications. Furthermore, the electrical connections between the internal chips often rely on a hybrid connection method using wire bonding and copper busbars. On one hand, metal wires enable precise connections between the chip electrodes and external terminals; on the other hand, the copper busbar handles high-current transmission. For example, in common bridge modules, multiple parallel bridge chips are typically connected to different pins of the same copper busbar via wire bonding, and the copper busbar then aggregates the current to AC or signal terminals. However, this hybrid connection method has significant drawbacks. The metal wires are relatively long, often bridging the chip and the copper busbar, and the large loop area when multiple wires are arranged in parallel leads to a significant increase in parasitic inductance and capacitance. In addition, it is difficult to guarantee the consistency of wire bonding length, and the contact resistance between the wires and the copper busbars varies, which will cause inconsistent delays in the transmission of drive signals to each chip. This delay difference will lead to asynchronous switching actions of the chips, especially for power modules with multiple chips connected in parallel. Summary of the Invention

[0003] In view of this, the present invention provides a plastic-encapsulated power module with double-sided water cooling and full CLIP connection to solve the above-mentioned technical problems.

[0004] A double-sided water-cooled, fully CLIP-connected encapsulated power module includes multiple power module assemblies, multiple encapsulated bodies disposed on the power module assemblies, and two double-sided heat dissipation assemblies disposed on the power module assemblies. Each power module assembly includes a lower bridge assembly, an upper bridge assembly, multiple molybdenum blocks connecting the lower bridge assembly and the upper bridge assembly, multiple signal terminals disposed on the lower bridge assembly and the upper bridge assembly, an AC copper busbar disposed on the lower bridge assembly, a positive copper busbar disposed on the upper bridge assembly, a negative copper busbar disposed on the lower bridge assembly, and an insulating pad disposed between the positive and negative copper busbars.The system includes an upper bridge module assembly, a lower bridge module assembly, a molding compound disposed on the upper bridge module assembly and the lower bridge module assembly, and two double-sided heat dissipation assemblies disposed on the upper bridge module assembly and the lower bridge module assembly, respectively. The upper bridge module assembly includes a first DBC board, multiple upper bridge chips disposed on the first DBC board, a first connection copper busbar disposed on the upper bridge chips, a first signal copper busbar disposed on the upper bridge chips, a positive terminal disposed on the first DBC board, a first AC terminal disposed on the first DBC board, and a first signal terminal disposed on the first DBC board. The first DBC board includes a first ceramic insulating layer, a first lower copper layer disposed on the first ceramic insulating layer, a first upper copper layer disposed on the first ceramic insulating layer, and a channel disposed on the first upper copper layer. The channel divides the first upper copper layer into a chip area, an AC area, and a signal area. Multiple upper bridge chips are arranged in a straight line on the chip area in two rows. The first connection copper busbar includes a main connection board, multiple first connection copper busbars disposed on the main connection board, and a first signal copper busbar. The system includes chip pins, multiple second chip pins disposed on the main connection board, and multiple copper layer pins disposed on the main connection board. The first chip pins and the copper layer pins are respectively disposed at both ends of the main connection board. The second chip pins are located on the end face of the main connection board facing the upper bridge chip. The first chip pins are connected to one row of the upper bridge chips, and the second chip pins are connected to another row of the upper bridge chips. The copper layer pins are connected to the AC area. The first chip pins, second chip pins, and copper layer pins form an L-shaped structure and are vertically disposed on the main connection board. The main connection board has a cutout notch in the area between the first chip pin and the second chip pin. The first signal copper busbar includes a main copper busbar and multiple secondary copper busbars disposed on both sides of the main copper busbar. The first signal copper busbar is located between two rows of upper bridge chips. One end of each secondary copper busbar is connected to the main copper busbar, and the other end is connected to the upper bridge chip. Each secondary copper busbar corresponds to one upper bridge chip. The secondary copper busbar has an L-shaped structure and is vertically disposed on the main copper busbar. One end of the main copper busbar is connected to the signal area. The structure of the lower bridge assembly is the same as that of the upper bridge assembly.

[0005] Furthermore, one end of the positive terminal is connected to the chip area, and the other end is connected to the positive terminal of an external power supply; one end of the first AC terminal is connected to the AC area, and the other end is connected to an external load.

[0006] Furthermore, the first connecting copper busbar and the first signal copper busbar are integrally formed.

[0007] Furthermore, the downbridge module assembly includes a second DBC board, a plurality of downbridge chips disposed on the second DBC board, a second connection copper busbar disposed on the downbridge chip, a second signal copper busbar disposed on the downbridge chip, a negative terminal disposed on the second DBC board, a second AC terminal disposed on the second DBC board, and a second signal terminal disposed on the second DBC board, wherein the negative terminal is connected to the negative terminal of the power supply.

[0008] Furthermore, the lower bridge assembly and the upper bridge assembly are spaced apart from each other and face each other, and the lower bridge assembly and the upper bridge assembly are arranged symmetrically.

[0009] Furthermore, the encapsulation is formed by curing a sealing material that covers the lower bridge assembly and the upper bridge assembly.

[0010] Furthermore, the double-sided heat dissipation assembly includes a heat dissipation substrate, a flow channel groove disposed on the heat dissipation substrate, and a plurality of partitions disposed in the flow channel groove. The partitions divide the flow channel groove into a plurality of branch channels and two main channels respectively disposed at both ends of the branch channels.

[0011] Furthermore, the distribution channel is composed of multiple interconnected L-shaped unit channels connected in series. The coolant inlet and outlet are located at the two main channels, and the two main channels are connected to the two ends of the distribution channel.

[0012] Compared with existing technologies, the double-sided water-cooled and fully CLIP-connected molded power module provided by this invention uses a fully CLIP copper busbar, replacing traditional wire bonding with an integrally molded first connection copper busbar and first signal copper busbar. The first connection copper busbar connects multiple chips via the first chip pins and the second chip pins. The first signal copper busbar is located between two rows of chips. One end of the secondary copper busbar is connected to the main copper busbar, and the other end is connected to the upper bridge chip. Each secondary copper busbar corresponds to one upper bridge chip, and multiple upper bridge chips are connected in parallel, enabling near-synchronous transmission of drive signals to all chips, ensuring synchronous turn-on and turn-off of the chips, and further improving the overall current carrying capacity and reliability of the module. By symmetrically arranging the lower bridge component and the upper bridge component facing each other, and setting the double-sided heat dissipation components on both sides, double-sided water cooling of the power module is achieved. The design of the internal flow channels and the main flow channels of the heat dissipation component, through the continuous bending and direction change of the flow channels, generates strong vortices, effectively destroying the laminar boundary layer of the pipe wall and significantly enhancing the convective heat transfer coefficient. Attached Figure Description

[0013] Figure 1This is a schematic diagram of a plastic-encapsulated power module with double-sided water cooling and full CLIP connection, provided by the present invention.

[0014] Figure 2 for Figure 1 An exploded view of a double-sided water-cooled and fully CLIP-connected encapsulated power module.

[0015] Figure 3 for Figure 1 Another exploded view of the double-sided water-cooled and fully CLIP-connected encapsulated power module.

[0016] Figure 4 for Figure 1 A schematic diagram of the upper bridge module assembly of a double-sided water-cooled and fully CLIP-connected encapsulated power module.

[0017] Figure 5 for Figure 1 An exploded view of the upper bridge module components of a double-sided water-cooled and fully CLIP-connected encapsulated power module.

[0018] Figure 6 for Figure 1 A schematic diagram of the structure of the downbridge module component of a double-sided water-cooled and fully CLIP-connected encapsulated power module.

[0019] Figure 7 for Figure 1 A schematic diagram of the dual-sided heat dissipation components of a double-sided water-cooled and fully CLIP-connected encapsulated power module.

[0020] Figure 8 for Figure 1 A side view of the first DBC board of the double-sided water-cooled and fully CLIP-connected encapsulated power module. Detailed Implementation

[0021] The following provides a more detailed description of specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the scope of protection of the present invention.

[0022] like Figures 1 to 8The diagram shows a structural schematic of the double-sided water-cooled and fully clip-on encapsulated power module provided by the present invention. The double-sided water-cooled and fully clip-on encapsulated power module includes an upper bridge module assembly 10, a lower bridge module assembly 20, a encapsulated body 30 disposed on the upper bridge module assembly 10 and the lower bridge module assembly 20, and two double-sided heat dissipation assemblies 40 respectively disposed on the upper bridge module assembly 10 and the lower bridge module assembly 20. It is conceivable that the double-sided water-cooled and fully clip-on encapsulated power module also includes other functional modules, such as connection components and mounting components, etc., which are technologies known to those skilled in the art and will not be described in detail here.

[0023] The bridge module assembly 10 includes a first DBC board 11, a plurality of bridge chips 12 disposed on the first DBC board 11, a first connection copper busbar 13 disposed on the bridge chip 12, a first signal copper busbar 14 disposed on the bridge chip 12, a positive terminal 15 disposed on the first DBC board 11, a first AC terminal 16 disposed on the first DBC board 11, and a first signal terminal 17 disposed on the first DBC board 11.

[0024] The first DBC board 11 is a direct copper-clad ceramic substrate (DBC). A direct copper-clad ceramic substrate (DBC) is formed by eutectic sintering of a ceramic substrate and copper foil at high temperature. It is mainly used in power electronic modules and has excellent thermal conductivity and insulation properties. The first DBC board 11 is prior art and will not be described further here. The first DBC board 11 includes a first ceramic insulating layer 111, a first lower copper layer 112 disposed on the first ceramic insulating layer 111, a first upper copper layer 113 disposed on the first ceramic insulating layer 111, and a channel 114 disposed on the first upper copper layer 113.

[0025] The first ceramic insulating layer 111 is located between the first upper copper layer 113 and the first lower copper layer 112. The first upper copper layer 113 is located on the end face of the first ceramic insulating layer 111 facing the upper bridge assembly 12 and is used to house various electronic components and has corresponding channels 114 to divide the first upper copper layer 113 into different regions as conductive layers. The channels 114 divide the first upper copper layer 113 into a chip area 115, an AC area 116, and a signal area 117. The first lower copper layer 112 is located on the end face of the first ceramic insulating layer 111 facing away from the upper bridge assembly 12 and is used to house the double-sided heat dissipation assembly 40, thereby transferring heat downward from the upper bridge chip 12.

[0026] In this embodiment, eight bridge chips 12 are provided and connected in parallel. These bridge chips 12 are arranged in a straight line on the chip area 115 of the first DBC board 11 in two rows, with four chips arranged in each row. The bridge chips 12 are connected to the first upper copper layer 113 of the first DBC board 11 by soldering, such as reflow soldering or sintering. The bridge chips 12 themselves are existing technology, and their structure and working principle will not be described in detail here.

[0027] The first connecting copper busbar 13 includes a main connecting board 131, a plurality of first chip pins 132 disposed on the main connecting board 131, a plurality of second chip pins 133 disposed on the main connecting board 131, and a plurality of copper layer pins 134 disposed on the main connecting board 131.

[0028] The main connection board 131 is a rectangular copper plate, providing sufficient cross-sectional area to carry large currents. The first chip pin 132 and the copper layer pin 134 are respectively located at both ends of the main connection board 131, and the second chip pin 133 is located on the end face of the main connection board 131 facing the upper bridge chip 12. The first chip pin 132 is connected to one row of the upper bridge chips 12, the second chip pin 133 is connected to another row of the upper bridge chips 12, and the copper layer pin 134 is connected to the AC area 116. One end of the positive terminal 15 is connected to the chip area 115, and the other end is connected to the positive terminal of an external power supply. One end of the first AC terminal 16 is connected to the AC area 116, and the other end is connected to an external load. The first AC terminal 16 is used to output the AC power converted by the module to the load, thereby realizing the circuit connection of the lower bridge of the power module. Current flows into the module from the positive terminal of the external DC power supply through the positive terminal 15. The current passes through the chip area 115 of the first upper copper layer 113 as a conductive layer and flows to the bottom of the eight parallel upper bridge chips 12. When the upper bridge chip 12 is turned on, current flows in from the bottom of each chip and out from its top. The current flowing out from the top of one row of upper bridge chips 12 is collected by the first chip pin 132, and the current flowing out from the top of the other row of upper bridge chips 12 is collected by the second chip pin 133, converging at the main connection board 131. The total current collected at the main connection board 131 flows out to the AC area 116 through the copper layer pin 134. Finally, the current flows out of the module through the first AC terminal 16 soldered to the AC area 116, supplying the external load.

[0029] The first chip pin 132, the second chip pin 133, and the copper layer pin 134 are arranged in an L-shape and vertically on the main connection board 131. The L-shape provides the most direct and shortest path from the chip surface to the main connection board 131, which is much shorter than other circuitous paths such as long planar extensions. The parasitic inductance of a conductor is proportional to its loop area. This short and vertical connection method minimizes parasitic inductance. In addition, the vertically arranged pins and the main connection board 131 form a stable three-dimensional frame structure, making the entire first connecting copper busbar 13 more mechanically strong, less prone to deformation, and more resistant to vibration and impact.

[0030] The main connection board 131 has a notch 135 in the area between the first chip pin 132 and the second chip pin 133. This notch 135 saves material and reduces weight while maintaining structural strength. It also separates adjacent first chip pins 132 and second chip pins 133. Furthermore, after sealing with the molding compound 30, adjacent first chip pins 132 and second chip pins 133 are separated by the molding compound 30, significantly improving the overall dielectric strength and breakdown resistance. The first connecting copper busbar 13 is integrally molded, eliminating redundant connection points and fundamentally reducing contact resistance and parasitic inductance. Multiple vertical pins enable parallel connections with multiple chips inside the module, providing good current sharing and replacing traditional wire bonding. It also achieves the functions of high current collection, low inductance connection, and mechanical support.

[0031] The first signal copper busbar 14 includes a main copper busbar 141 and a plurality of secondary copper busbars 142 disposed on both sides of the main copper busbar 141.

[0032] The first signal copper busbar 14 is integrally formed and located between the two rows of upper bridge chips 12, so that the secondary copper busbars 142 on both sides can simultaneously connect to all the upper bridge chips 12. One end of the secondary copper busbar 142 is connected to the main copper busbar 141, and the other end is connected to the upper bridge chip 12. Each secondary copper busbar 142 corresponds to one upper bridge chip 12. The secondary copper busbar 142 has an L-shaped structure and is vertically arranged on the main copper busbar 141, thereby providing good support for the first signal copper busbar 14 and enabling multiple upper bridge chips 12 to be connected in parallel simultaneously. One end of the main copper busbar 141 is connected to the signal area 117, one end of the first signal terminal 17 is connected to the signal area 117, and the other end is connected to an external control circuit. The first signal copper busbar 14 is used to transmit drive signals to the upper bridge chips 12 to control the switching of the chips. The drive signal is transmitted from the first signal terminal 17, first reaches the signal area 117, and then enters the main copper bus 141. Since the first signal copper bus 14 is located between the two rows of the upper bridge chips 12, each of the secondary copper bus 142 can transmit the drive signal to the chip at the same time. This ensures that all eight upper bridge chips can be turned on and off almost synchronously, achieving excellent current sharing effect.

[0033] The structure of the lower bridge assembly 20 is the same as that of the upper bridge assembly 10. Similarly, the lower bridge module assembly 20 includes a second DBC board 21, multiple lower bridge chips 22 disposed on the second DBC board 21, a second connecting copper busbar 23 disposed on the lower bridge chip 22, a second signal copper busbar 24 disposed on the lower bridge chip 22, a negative terminal 25 disposed on the second DBC board 21, a second AC terminal 26 disposed on the second DBC board 21, and a second signal terminal 27 disposed on the second DBC board 11. The specific structure will not be described in detail here. The difference between the lower bridge assembly 20 and the upper bridge assembly 10 is that the negative terminal 25 is connected to the negative terminal of the power supply. The lower bridge assembly 20 is used to allow current to flow from the load back to the power supply through the lower bridge assembly 20, thereby forming a DC circuit with the positive terminal 15 to power the module. The lower bridge assembly 20 and the upper bridge assembly 10 are spaced apart and face each other, and are symmetrically arranged so that the lower bridge assembly 20 and the upper bridge assembly 10 can dissipate heat from both sides, thereby doubling the contact area between the coolant and the module and improving the module's heat dissipation capacity. The second AC terminal 26 is soldered to the first AC terminal 16, connecting the upper and lower bridges of the power module.

[0034] The encapsulation body 30 is formed by coating the lower bridge assembly 20 and the upper bridge assembly 10 with a sealing material such as epoxy resin and then curing it, thereby sealing the gap between different power terminals and fixing their relative positions to achieve electrical isolation.

[0035] The double-sided heat dissipation assembly 40 includes a heat dissipation substrate 41, a flow channel groove 42 disposed on the heat dissipation substrate 41, and a plurality of partitions 43 disposed within the flow channel groove 42. The heat generated by the lower bridge assembly 20 and the upper bridge assembly 10 is transferred to the double-sided heat dissipation assembly 40 through the heat dissipation substrate 41, and heat exchange occurs under the action of the coolant in the flow channel groove 42 to achieve heat dissipation.

[0036] The baffle 43 divides the flow channel 42 into multiple branch channels 44 and two main channels 45 respectively located at both ends of the branch channels 44. In this embodiment, four branch channels 44 are provided, each composed of multiple interconnected L-shaped unit channels connected in series. This results in a multi-bend path for the branch channels 44. This serpentine layout significantly extends the residence path of the coolant within the branch channels 44, ensuring sufficient heat exchange between the coolant and the heat source. The continuous bends and changes in direction of the L-shaped unit channels themselves generate strong eddies when the coolant flows through these bends, effectively disrupting the laminar boundary layer on the pipe wall and significantly enhancing the convective heat transfer coefficient. After the flow channel 42 is sealed, the coolant inlet and outlet are located at the two main flow channels 45, respectively. The two main flow channels 45 are connected to both ends of the branch flow channels 44, allowing the ends of the multiple branch flow channels 44 to converge. The coolant first enters one main flow channel 45, then flows into the multiple branch flow channels 44, and after passing through the branch flow channels 44, converges again in another main flow channel 45 before finally flowing out from the outlet. This branching method ensures that the coolant can be evenly distributed to all areas of the heat dissipation substrate 41, while simultaneously cooling the entire heat-generating surface, resulting in more uniform heat dissipation.

[0037] Compared with existing technologies, the double-sided water-cooled and fully CLIP-connected molded power module provided by this invention uses a fully CLIP copper busbar, replacing traditional wire bonding with an integrally molded first connection copper busbar 13 and first signal copper busbar 14. The first connection copper busbar 13 connects multiple chips through a multi-pin configuration using the first chip pin 132 and the second chip pin 133. The first signal copper busbar 14 is located between two rows of chips. One end of the secondary copper busbar 142 is connected to the main copper busbar 141, and the other end is connected to the upper bridge chip 12. Each secondary copper busbar 142 corresponds to one upper bridge chip 12, and multiple upper bridge chips 12 are connected in parallel, enabling the drive signal to be transmitted to all chips almost synchronously, ensuring synchronous turn-on and turn-off of the chips, and further improving the overall current carrying capacity and reliability of the module. By using the lower bridge component 20 and the upper bridge component 10 arranged symmetrically facing each other, and setting the double-sided heat dissipation components 40 on both sides, double-sided water cooling of the power module is achieved. The design of the flow distribution channel 44 and the main flow channel 45 inside the heat dissipation component 40, through the continuous bending and direction change of the flow distribution channel 44, generates strong vortices, effectively destroying the laminar boundary layer of the pipe wall and significantly enhancing the convective heat transfer coefficient.

[0038] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions or improvements within the spirit of the present invention are covered within the scope of the claims of the present invention.

Claims

1. A plastic-encapsulated power module with double-sided water cooling and full CLIP connection, characterized in that: The dual-sided water-cooled and fully CLIP-connected molded power module includes an upper bridge module assembly, a lower bridge module assembly, a molded body disposed on the upper bridge module assembly and the lower bridge module assembly, and two dual-sided heat dissipation components disposed on the upper bridge module assembly and the lower bridge module assembly respectively. The upper bridge module assembly includes a first DBC board, multiple upper bridge chips disposed on the first DBC board, a first connection copper bus disposed on the upper bridge chip, a first signal copper bus disposed on the upper bridge chip, a positive terminal disposed on the first DBC board, and a first connection copper bus disposed on the lower bridge chip. The first DBC board includes a first AC terminal and a first signal terminal. The first DBC board comprises a first ceramic insulating layer, a first lower copper layer on the first ceramic insulating layer, a first upper copper layer on the first ceramic insulating layer, and a channel on the first upper copper layer. The channel divides the first upper copper layer into a chip area, an AC area, and a signal area. Multiple upper-bridge chips are arranged in a straight line on the chip area in two rows. The first connecting copper busbar includes a main connecting board, multiple first chip pins on the main connecting board, multiple second chip pins on the main connecting board, and multiple copper layer pins on the main connecting board. The first chip pins and the copper layer pins are respectively located at both ends of the main connecting board. The second chip pins are located on the end face of the main connecting board facing the upper-bridge chips. The first chip pins are connected to one row of upper-bridge chips, and the second chip pins are connected to another row of upper-bridge chips. The copper layer pins are connected to the AC area. The first chip pins, second chip pins, and copper layer pins form an L-shaped structure and are vertically arranged on the main connecting board. On the connection board, the main connection board has a cutout notch in the area between the first chip pin and the second chip pin. The first signal copper bus includes a main copper bus and multiple secondary copper busbars disposed on both sides of the main copper bus. The first signal copper bus is located between two rows of upper bridge chips. One end of each secondary copper busbar is connected to the main copper busbar, and the other end is connected to the upper bridge chip. Each secondary copper busbar corresponds to one upper bridge chip. The secondary copper busbar has an L-shaped structure and is vertically disposed on the main copper busbar. One end of the main copper busbar is connected to the signal area. The structure of the lower bridge assembly is the same as that of the upper bridge assembly.

2. The plastic-encapsulated power module with double-sided water cooling and full CLIP connection as described in claim 1, characterized in that: One end of the positive terminal is connected to the chip area, and the other end is connected to the positive terminal of an external power supply. One end of the first AC terminal is connected to the AC area, and the other end is connected to an external load.

3. The plastic-encapsulated power module with double-sided water cooling and full CLIP connection as described in claim 1, characterized in that: The first connecting copper busbar and the first signal copper busbar are integrally formed.

4. The plastic-encapsulated power module with double-sided water cooling and full CLIP connection as described in claim 1, characterized in that: The downbridge module assembly includes a second DBC board, multiple downbridge chips disposed on the second DBC board, a second connection copper busbar disposed on the downbridge chip, a second signal copper busbar disposed on the downbridge chip, a negative terminal disposed on the second DBC board, a second AC terminal disposed on the second DBC board, and a second signal terminal disposed on the second DBC board, wherein the negative terminal is connected to the negative terminal of the power supply.

5. The plastic-encapsulated power module with double-sided water cooling and full CLIP connection as described in claim 1, characterized in that: The lower bridge assembly and the upper bridge assembly are spaced apart from each other and face each other, and the lower bridge assembly and the upper bridge assembly are arranged symmetrically.

6. The plastic-encapsulated power module with double-sided water cooling and full CLIP connection as described in claim 1, characterized in that: The encapsulation is formed by curing a sealing material that covers the lower bridge assembly and the upper bridge assembly.

7. The plastic-encapsulated power module with double-sided water cooling and full CLIP connection as described in claim 1, characterized in that: The double-sided heat dissipation assembly includes a heat dissipation substrate, a flow channel groove disposed on the heat dissipation substrate, and a plurality of partitions disposed in the flow channel groove. The partitions divide the flow channel groove into a plurality of branch channels and two main channels respectively disposed at both ends of the branch channels.

8. The plastic-encapsulated power module with double-sided water cooling and full CLIP connection as described in claim 7, characterized in that: The distribution channel is composed of multiple interconnected L-shaped unit channels connected in series. The coolant inlet and outlet are located at the two main channels, and the two main channels are connected to the two ends of the distribution channel.

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