Processing technology for improving utilization rate of ultrathin flexible glass raw material

Abstract

The invention discloses a processing technology for improving the utilization rate of an ultrathin flexible glass raw material, which is applied to the field of glass processing and sequentially comprises the following steps: cleaning a raw sheet, coating acid-resistant ink on double surfaces for protection, etching a falling sheet, removing ink on a monomer product, cleaning after deplating, strengthening, cleaning after strengthening, performing surface treatment after strengthening and cleaning a finished product. In order to solve the problems that in the prior art, a compensation area needs to be reserved due to cutting, and the size of the compensation area is enlarged along with increase of cutting shape complexity, the etching cutting and edge processing integrated technology is adopted, cutting of the compensation area is omitted, monomer typesetting is tighter, and the utilization rate of original sheets is remarkably improved; the method is suitable for large-scale production scenes of ultrathin flexible glass required in the fields of display panels, flexible electronic devices, cover plate glass and the like.

Description

Technical Field

[0001] This invention relates to the field of glass processing, and in particular to a processing technology for improving the utilization rate of ultra-thin flexible glass raw materials. Background Technology

[0002] Currently, in the mainstream ultra-thin flexible glass processing field, the process adopts the "overall cutting-individual processing" mode. It mainly uses laser cutting to divide large glass sheets into multiple glass units of target size, and then uses mixed acid solutions such as hydrofluoric acid and sulfuric acid to treat the edge effect of the units. Its core cutting processes are mostly laser cutting, blade cutting, and CNC cutting.

[0003] Chinese patent CN112008505B discloses a method for cutting and edge treatment of ultra-thin flexible glass. The method involves directly applying a material strength treatment to the cut ultra-thin glass and polishing the glass edges to improve the edge strength, thereby greatly improving the edge effect and cutting quality.

[0004] However, the existing "overall cutting - individual processing" process requires reserving compensation areas for laser, cutting wheel, and CNC cutting. The more complex the cutting shape, the larger the compensation area and the more wasted area. The core problem is that the cutting process and edge processing are treated as independent processes and are not integrated and optimized, making it difficult to improve product utilization. Summary of the Invention

[0005] The core of this invention lies in using wet etching to cut products, simultaneously processing the product's edge effects. This eliminates the need for reserving compensation areas in traditional cutting processes, further improving the utilization rate of raw materials and solving the problem of low material utilization caused by the "overall cutting - individual processing" process in existing technologies.

[0006] To solve the above problems, the present invention adopts the following technical solution.

[0007] A processing technology for improving the utilization rate of ultra-thin flexible glass raw materials includes the following steps: S1. Clean the original film: The original film is subjected to a series of processes including ultrasonic cleaning in a tank, spraying in a tank, rinsing with pure water, and hot air drying to obtain qualified original films with no dust, glass residue, watermarks, or dirt on the surface. S2. Double-sided coating with acid-resistant ink for protection: Place the qualified original film into the screen printing equipment or photopolymer coating equipment, import the product drawing into the equipment program, adjust the process parameters, grab the target position, the pattern spacing is 1.5-2.5mm, and start screen printing or exposing the required pattern on the original film. After completing one side, flip the product, grab the target position again, and screen print or expose the required pattern on both sides of the original film. S3, Etching and Film Drop: The qualified raw material coated with acid-resistant ink is placed into the flat etching line. The qualified raw material is conveyed by rollers and enters the etching chamber to start reacting with the etching acid. After the reaction, the single product is obtained and conveyed to the unloading port by rollers for the next process. S4. Remove ink from the individual product: After inserting the individual product into the rack, place it into the tank-type ink removal machine to remove the acid-resistant ink from both sides of the individual product. S5. Cleaning after plating removal: The monomer products that have passed step S4 are sequentially subjected to tank ultrasonic cleaning, tank spraying, pure water rinsing and hot air drying to obtain monomer products with no watermarks or dirt and no ink residue on the surface. S6, Enhancement: After the individual products are inserted into the rack, they are placed in a strengthening furnace and immersed in molten salt for chemical ion exchange treatment to complete the surface strengthening treatment of the products. S7. Post-reinforcement cleaning: The individual products after step S6 are sequentially subjected to ultrasonic cleaning in a tank, spraying in a tank, rinsing with pure water, and hot air drying to obtain reinforced products with clean surfaces, no potassium salts, and no watermark residue. S8. Surface treatment after reinforcement: After reinforcing the product insert, place it into the etching tank and immerse it in the etching acid solution; S9. Finished product cleaning: The individual products that have passed step S8 are sequentially subjected to ultrasonic cleaning in a tank, spraying in a tank, rinsing with pure water, and drying with hot air to obtain a final product with a clean surface, free of watermarks, dirt, and foreign matter.

[0008] Furthermore, in step S3, the etching acid solution comprises the following components by mass percentage: 0.5%-10% hydrofluoric acid, 0.5%-20% sulfuric acid, 0.5%-5% nitric acid, 0.1%-5% phosphoric acid, 0.1%-3% hydrochloric acid, and the balance being pure water. The working temperature of the etching acid solution is 10℃-50℃, and the temperature fluctuation of the etching acid solution during operation is ≤1℃.

[0009] Furthermore, the tank-type ink remover stores ink remover solution, which includes 0.1%-10% sodium hydroxide solution and surfactant. The working temperature of the ink remover solution is 60℃-110℃, and the ink removal time in step S4 is 30s-2400s.

[0010] Furthermore, in step S6, the molten salt is pure potassium nitrate, the temperature of the strengthening treatment is 360℃-450℃, and the strengthening treatment time is 30min-240min.

[0011] Furthermore, in step S8, the etching acid solution comprises the following components by mass percentage: 0.1%-5% hydrofluoric acid, 0.5%-10% sulfuric acid, 0.5%-5% nitric acid, 0.1%-5% phosphoric acid, 0.1%-3% hydrochloric acid, and the balance being pure water. The working temperature of the etching acid solution is 10℃-50℃, and the temperature fluctuation of the etching acid solution during operation is ≤1℃.

[0012] Compared with the prior art, the advantages of this invention are: (1) This solution addresses the problem that existing processes require a compensation area to be reserved for cutting (laser, cutting wheel, CNC), and the size of the compensation area increases with the complexity of the cutting shape. By integrating etching cutting and edge processing, the cutting compensation area is eliminated, the individual layout is more compact, and the utilization rate of the original sheet is significantly improved. It is suitable for the large-scale production of ultra-thin flexible glass required in fields such as display panels, flexible electronic devices, and cover glass. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of the qualified original sheet after double-sided ink coating according to the present invention. Detailed Implementation

[0014] The technical solutions will now be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention.

[0015] First implementation method: Please see Figure 1 A processing technology for improving the utilization rate of ultra-thin flexible glass raw materials includes the following steps: S1. Clean the original film: The original film is subjected to a series of processes including ultrasonic cleaning in a tank, spraying in a tank, rinsing with pure water, and hot air drying to obtain qualified original films with no dust, glass residue, watermarks, or dirt on the surface. Specifically, in the tank-type ultrasonic cleaning, two ultrasonic cleaning processes can be performed using a cleaning agent tank (tank one and tank two). In cleaning agent tank one, 2.5% alkaline cleaning agent can be added, and in cleaning agent tank two, 1.5% alkaline cleaning agent can be added. The temperature of both cleaning agent tanks is 50-60℃, and the soaking time for both ultrasonic cleaning processes is 180 seconds. In the tank-type spray cleaning, pure water is sprayed for 180 seconds. In the pure water rinsing, the rinsing temperature is 50-60℃, the soaking time is 180 seconds, and the hot air drying temperature is 100-120℃, with a drying time of 180 seconds. Step S1 can prevent ink from falling off and pinholes from occurring in the next process due to insufficient cleanliness of the original sheet, which would result in uneven etching and bumps on the surface of the etched product. If the original sheet is clean, this step can be omitted.

[0016] S2. Double-sided coating with acid-resistant ink for protection: Place the qualified original film into the screen printing equipment or photopolymer coating equipment, import the product drawing into the equipment program, adjust the process parameters, grab the target position, and set the pattern spacing to 1.5-2.5mm. Start screen printing or exposing the required pattern on the original film. After completing one side, flip the product, grab the target position again, and screen print or expose the required pattern on both sides of the original film. The pattern positions on both sides should be consistent, with an error range of less than 3 micrometers. The purpose of step S2 is to protect the areas that do not need to be etched with acid-resistant ink and to form the appearance dimensions. The product size range is 10*10mm-240*400mm. The performance requirements of the acid-resistant ink are as follows: the ink should not peel off, deform or crack in an acidic environment of 10-50℃ for 30-60 minutes, and it can be removed with an alkaline ink remover.

[0017] S3, Etching and Film Drop: The qualified raw material coated with acid-resistant ink is placed into the flat etching line. The qualified raw material is conveyed by rollers and enters the etching chamber to start reacting with the etching acid. After the reaction, the single product is obtained and conveyed to the unloading port by rollers for the next process. The etching acid solution comprises the following components by mass percentage: 0.5%-10% hydrofluoric acid, 0.5%-20% sulfuric acid, 0.5%-5% nitric acid, 0.1%-5% phosphoric acid, 0.1%-3% hydrochloric acid, and the balance being pure water. The working temperature of the etching acid solution is 10℃-50℃, and the temperature fluctuation of the etching acid solution during operation is ≤1℃. Inside the etching chamber: nozzles are densely distributed above and below the chamber. The width of the chamber is 1.5 times the width of the original sheet. The nozzles are 100-200mm away from the original sheet. The spray is in a conical shape with a spray pressure of 0.1-5Mpa. The upper spray pressure must be greater than the lower spray pressure. In this step, the etching acid reacts with the unprotected area on the original sheet to obtain a protected area product, and the product edges have been treated.

[0018] S4. Remove ink from the individual product: After inserting the individual product into the rack, place it into the tank-type ink removal machine to remove the acid-resistant ink from both sides of the individual product. Specifically, the tank-type ink remover stores ink remover solution, which includes 0.1%-10% sodium hydroxide solution and surfactant. The working temperature of the ink remover solution is 60℃-110℃, and the ink removal time in step S4 is 30s-2400s.

[0019] S5. Cleaning after plating removal: The monomer products after step S4 are sequentially subjected to ultrasonic cleaning in a tank, spraying in a tank, rinsing with pure water and drying with hot air (the operation method, temperature, material and other parameters are the same as in step S1) to obtain monomer products with no watermarks or dirt and no ink residue on the surface. S6, Enhancement: After the individual products are inserted into the rack, they are placed in a strengthening furnace and immersed in molten salt for chemical ion exchange treatment to complete the surface strengthening treatment of the products. The molten salt is pure potassium nitrate. The strengthening treatment temperature is 360℃-450℃ and the strengthening treatment time is 30min-240min. Through chemical ion exchange, the surface structure of the product is effectively changed, and the product strength and impact resistance are improved.

[0020] S7. Post-reinforcement cleaning: The individual products after step S6 are sequentially subjected to tank ultrasonic cleaning, tank spraying, pure water rinsing and hot air drying (the operation method, temperature, material and other parameters are the same as in step S1) to obtain a reinforced product with a clean surface, no potassium salt and no watermark residue. S8. Surface treatment after reinforcement: After reinforcing the product insert, place it into the etching tank and immerse it in the etching acid solution; The etching acid solution comprises the following components by mass percentage: 0.1%-5% hydrofluoric acid, 0.5%-10% sulfuric acid, 0.5%-5% nitric acid, 0.1%-5% phosphoric acid, 0.1%-3% hydrochloric acid, and the remainder is pure water. The working temperature of the etching acid solution is 10℃-50℃, and the temperature fluctuation of the etching acid solution during operation is ≤1℃. Strengthening the surface of the product by immersing it in etching acid releases the internal stress of the monomers and increases the product's bending ability. S9. Finished product cleaning: The individual products that have passed step S8 are sequentially subjected to ultrasonic cleaning in a tank, spraying in a tank, rinsing with pure water, and hot air drying (the operation methods, temperatures, materials, and other parameters are the same as in step S1) to obtain a final product with a clean surface, free of watermarks, dirt, and foreign matter.

[0021] This application addresses the problem in existing processes where a compensation area needs to be reserved for cutting (laser, cutting wheel, CNC), and the size of the compensation area increases with the complexity of the cutting shape. By integrating etching cutting and edge processing, the cutting compensation area is eliminated, the individual layout is more compact, and the utilization rate of the original sheet is significantly improved. It is suitable for the large-scale production of ultra-thin flexible glass required in display panels, flexible electronic devices, cover glass and other fields.

[0022] The above description is merely a preferred embodiment of the present invention; it encompasses all the protection scope of the present invention. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in the present invention, based on the technical solutions and improved concepts of the present invention, should be covered within the protection scope of the present invention.

Claims

1. A processing technology for improving the utilization rate of ultra-thin flexible glass raw materials, characterized in that: Includes the following steps: S1. Clean the original film: The original film is subjected to a series of processes including ultrasonic cleaning in a tank, spraying in a tank, rinsing with pure water, and hot air drying to obtain qualified original films with no dust, glass residue, watermarks, or dirt on the surface. S2. Double-sided coating with acid-resistant ink for protection: Place the qualified original film into the screen printing equipment or photopolymer coating equipment, import the product drawing into the equipment program, adjust the process parameters, grab the target position, the pattern spacing is 1.5-2.5mm, and start screen printing or exposing the required pattern on the original film. After completing one side, flip the product, grab the target position again, and screen print or expose the required pattern on both sides of the original film. S3, Etching and Film Drop: The qualified raw material coated with acid-resistant ink is placed into the flat etching line. The qualified raw material is conveyed by rollers and enters the etching chamber to start reacting with the etching acid. After the reaction, the single product is obtained and conveyed to the unloading port by rollers for the next process. S4. Remove ink from the individual product: After inserting the individual product into the rack, place it into the tank-type ink removal machine to remove the acid-resistant ink from both sides of the individual product. S5. Cleaning after plating removal: The monomer products that have passed step S4 are sequentially subjected to tank ultrasonic cleaning, tank spraying, pure water rinsing and hot air drying to obtain monomer products with no watermarks or dirt and no ink residue on the surface. S6, Enhancement: After the individual products are inserted into the rack, they are placed in a strengthening furnace and immersed in molten salt for chemical ion exchange treatment to complete the surface strengthening treatment of the products. S7. Post-reinforcement cleaning: The individual products after step S6 are sequentially subjected to ultrasonic cleaning in a tank, spraying in a tank, rinsing with pure water, and hot air drying to obtain reinforced products with clean surfaces, no potassium salts, and no watermark residue. S8. Surface treatment after reinforcement: After reinforcing the product insert, place it into the etching tank and immerse it in the etching acid solution; S9. Finished product cleaning: The individual products that have passed step S8 are sequentially subjected to ultrasonic cleaning in a tank, spraying in a tank, rinsing with pure water, and drying with hot air to obtain a final product with a clean surface, free of watermarks, dirt, and foreign matter.

2. The processing technology for improving the utilization rate of ultra-thin flexible glass raw materials according to claim 1, characterized in that: In step S3, the etching acid solution comprises the following components by mass percentage: 0.5%-10% hydrofluoric acid, 0.5%-20% sulfuric acid, 0.5%-5% nitric acid, 0.1%-5% phosphoric acid, 0.1%-3% hydrochloric acid, and the balance being pure water. The working temperature of the etching acid solution is 10℃-50℃, and the temperature fluctuation of the etching acid solution during operation is ≤1℃.

3. The processing technology for improving the utilization rate of ultra-thin flexible glass raw materials according to claim 1, characterized in that: The tank-type ink removal machine stores ink removal liquid, which includes 0.1%-10% sodium hydroxide solution and surfactant. The working temperature of the ink removal liquid is 60℃-110℃, and the ink removal time in step S4 is 30s-2400s.

4. The processing technology for improving the utilization rate of ultra-thin flexible glass raw materials according to claim 1, characterized in that: In step S6, the molten salt is pure potassium nitrate, the temperature of the strengthening treatment is 360℃-450℃, and the time of the strengthening treatment is 30min-240min.

5. The processing technology for improving the utilization rate of ultra-thin flexible glass raw materials according to claim 1, characterized in that: In step S8, the etching acid solution comprises the following components by mass percentage: 0.1%-5% hydrofluoric acid, 0.5%-10% sulfuric acid, 0.5%-5% nitric acid, 0.1%-5% phosphoric acid, 0.1%-3% hydrochloric acid, and the balance being pure water. The working temperature of the etching acid solution is 10℃-50℃, and the temperature fluctuation of the etching acid solution during operation is ≤1℃.

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